WO2023050858A1 - 热成像温度测量方法、装置及电子设备 - Google Patents

热成像温度测量方法、装置及电子设备 Download PDF

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WO2023050858A1
WO2023050858A1 PCT/CN2022/097419 CN2022097419W WO2023050858A1 WO 2023050858 A1 WO2023050858 A1 WO 2023050858A1 CN 2022097419 W CN2022097419 W CN 2022097419W WO 2023050858 A1 WO2023050858 A1 WO 2023050858A1
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information
pixel
target
thermal imaging
temperature
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PCT/CN2022/097419
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English (en)
French (fr)
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余瑾
陈松林
邓磊
唐杰
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杭州微影软件有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077—Imaging

Definitions

  • the present application relates to the technical field of data measurement, in particular to a thermal imaging temperature measurement method, device and electronic equipment.
  • the output of the temperature measuring device is only related to the radiation intensity of the object, but due to the scattering, phase difference, diffraction of impurities in the temperature measuring device and the interference of the surrounding environment, the temperature measuring device
  • the measured temperature is related to the imaging area of the object in the temperature measuring device, wherein the imaging area of the object in the temperature measuring device can be characterized by the size of the imaging size.
  • the temperature measured by the temperature measuring device can be compensated by means of imaging radius correction, thereby reducing the error of the temperature measured by the temperature measuring device.
  • imaging radius correction cannot effectively compensate for the attenuation caused by too small imaging size, and the accuracy of temperature measurement is low.
  • the purpose of the embodiments of the present application is to provide a thermal imaging temperature measurement method, device and electronic equipment, so as to improve the accuracy of temperature measurement when the imaging radius is too small.
  • the specific technical scheme is as follows:
  • the embodiment of the present application provides a thermal imaging temperature measurement method, which is applied to temperature measurement equipment, and the method includes: extracting the thermal imaging information of each pixel in the target imaging area from the thermal imaging of the object to be measured; wherein , the target imaging area is: the area where the imaging of the object to be measured is located; if the number of pixels in the target imaging area is less than the specified pixel number threshold, based on the proximity of the target pixels in the target imaging area The thermal imaging information of the pixel is compensated for the thermal imaging information of the target pixel to obtain the compensated thermal imaging information; based on the compensated thermal imaging information, the temperature information of the object to be measured is determined.
  • the embodiment of the present application provides a thermal imaging temperature measurement device, which is applied to temperature measurement equipment.
  • the device includes: a thermal imaging information extraction module, which is used to extract the The thermal imaging information of the pixel; wherein, the target imaging area is: the area where the imaging of the object to be measured is located; the thermal imaging information compensation module is used for if the number of pixels in the target imaging area is less than the specified pixel Quantity threshold, then based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, the thermal imaging information of the target pixel is compensated to obtain the compensated thermal imaging information; the temperature determination module is used for Based on the compensated thermal imaging information, temperature information of the object to be measured is determined.
  • an embodiment of the present application provides an electronic device, including a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory complete communication with each other through the communication bus; the memory is used to store the A program; a processor, configured to implement the method steps in any one of the first aspect when executing the program stored in the memory.
  • embodiments of the present application provide a computer-readable storage medium, in which a computer program is stored, and when the computer program is executed by a processor, the method steps in any one of the first aspect are implemented.
  • the thermal imaging information of each pixel in the target imaging area can be extracted from the thermal imaging of the object to be measured; wherein, the target imaging area is: where the imaging of the object to be measured is located area; if the number of pixels in the target imaging area is less than the specified pixel number threshold, based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, the thermal imaging information of the target pixel is compensated, and the compensated The thermal imaging information; based on the compensated thermal imaging information, determine the temperature information of the object to be measured.
  • Figure 1 is a schematic diagram of the measured temperature of a blackbody radiation source at 100°C and 150°C;
  • Figure 2 is a schematic diagram of radiation when the diameter of the Airy disk is greater than the diameter of one pixel;
  • Fig. 3 is a schematic diagram of radiation energy of a single pixel
  • FIG. 4 is a flow chart of a thermal imaging temperature measurement method provided in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of the target pixel and adjacent pixel provided by the embodiment of the present application.
  • FIG. 6 is another flow chart of the thermal imaging temperature measurement method provided by the embodiment of the present application.
  • FIG. 7 is a schematic diagram of a temperature compensation template provided by the embodiment of the present application.
  • Fig. 8 is an imaging diagram obtained by measuring the temperature of a point light source by a temperature measuring device
  • FIG. 9 is another flow chart of the thermal imaging temperature measurement method provided in the embodiment of the present application.
  • FIG. 10 is a schematic diagram of the effect of the thermal imaging temperature measurement method provided in the embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a thermal imaging temperature measuring device provided in an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the output of the temperature measuring device is only related to the radiation intensity of the object, but due to the scattering, phase difference, diffraction of impurities in the temperature measuring device and the interference of the surrounding environment, the temperature measuring device The measured temperature is related to the imaging area of the object in the temperature measuring device.
  • the temperature measured by the temperature measuring device will change, and when the temperature of the target to be measured is higher than the ambient temperature, the smaller the number of pixels occupied by the imaging will be. The less, the lower the temperature measured by the temperature measuring equipment.
  • the temperature measurement equipment measures the temperature of the blackbody radiation source at 100°C and 150°C respectively. Apertures with different aperture sizes are placed in front of the blackbody radiation source. Measure the temperature of black body radiation sources at 100°C and 150°C under the aperture of , and record the measured temperatures at different sizes. It can be found from Figure 1 that with the change of the aperture size of the diaphragm, the imaging image of the black body radiation source in the temperature measurement equipment becomes smaller and smaller, that is, the imaging area and imaging size become smaller and smaller, and the measured temperature of the temperature measurement equipment also decreases. becomes smaller and smaller, and the higher the temperature of the blackbody radiation source, the greater the attenuation.
  • the light will diffract when passing through the lens, forming a light and dark fringe diffraction pattern, the fringe spacing becomes larger with the decrease of the clear aperture of the lens, and about 84% of the energy is concentrated In the central bright spot, the remaining 16% of the energy is distributed on the bright rings at all levels.
  • the brightest spot in the center of the diffraction pattern is called the Airy disk.
  • the process of imaging through any optical instrument can be considered as converting countless tiny points on the object into Airy disks, and then superimposing them.
  • the minimum spot size, that is, the calculation formula of the Airy disk diameter is as follows:
  • ⁇ is the wavelength of the incident light of the optical instrument
  • f/# is the F number of the lens of the optical instrument.
  • the wavelength range of the incident light of the temperature measuring equipment is 8-14 ⁇ m, the wavelength of the incident light is taken as 11 ⁇ m, and the F number of the lens of the temperature measuring equipment is 1.0, according to the calculation formula of the Airy disk diameter, the temperature measuring equipment can be calculated
  • the diameter of the Airy disk is about:
  • FIG. 3 it is a schematic diagram of the radiation energy of a single pixel. It can be seen that when the output of a single pixel is used to represent the temperature of the temperature measurement object, the radiation energy received by each pixel in the temperature measurement device can be represented by for:
  • W obj is the actual radiation energy of the temperature measurement object
  • W base is based on the difference in the number of pixels occupied by the imaging of the temperature measurement equipment.
  • N When the number of pixels occupied by the temperature measurement object on the temperature measurement equipment is greater than N, W base It is the energy radiated by the temperature measurement object.
  • W base When the number of pixels occupied by the temperature measurement object on the temperature measurement device is less than N, W base is the energy radiated by the environment of the temperature measurement device. At this time, that is to say, a single image in the temperature measurement device The unit can only receive 84% of the radiant energy of the temperature measurement object.
  • an embodiment of the present application provides a thermal imaging temperature measurement method applied to a temperature measurement device.
  • the temperature measuring device provided in the embodiment of the present application may be an infrared temperature measuring device, and the thermal imaging temperature measurement method provided in the embodiment of the present application may be implemented by means of software, hardware or a combination of software and hardware.
  • a thermal imaging temperature measurement method provided in the embodiment of the present application may include the steps of:
  • the target imaging area is: the area where the imaging of the object to be measured is located;
  • the thermal imaging information of the target pixel is compensated , to obtain the compensated thermal imaging information
  • temperature information of the object to be measured is determined.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application can, when the number of pixels in the target imaging area is less than the specified pixel number threshold, based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, The thermal imaging information of the target pixel is compensated, so that the accuracy of the thermal imaging information of the target pixel can be improved, and the accuracy of temperature measurement can be improved when the imaging radius is too small.
  • a thermal imaging temperature measurement method provided in the embodiment of the present application is applied to temperature measurement equipment and may include the following steps:
  • the thermal image of the object to be measured can be obtained by measuring the temperature of the object to be measured.
  • the infrared temperature measurement device is used to measure the temperature of the object to be measured to obtain the thermal image of the object to be measured.
  • the infrared temperature measurement device uses the thermal infrared band ( 8 ⁇ m-14 ⁇ m) light to detect the thermal radiation emitted by the object to be measured, and convert the received thermal radiation into grayscale information, which is converted into a thermal image of the object to be measured after system processing.
  • each pixel has grayscale information, and the grayscale information of each pixel is related to the intensity of thermal radiation received by the pixel.
  • the grayscale information of each pixel in the thermal image can be converted into the temperature information measured by the pixel, for example, the grayscale information of each pixel can be converted into Celsius temperature value or Fahrenheit value.
  • the thermal imaging information to be extracted is temperature information
  • the grayscale information of each pixel in the target imaging area can be determined from the thermal imaging of the object to be measured, and then the grayscale information of each pixel in the target imaging area can be determined.
  • the grayscale information of the pixel is mapped to obtain the temperature information of the pixel.
  • the grayscale information is the radiation intensity of the temperature measurement object actually measured by the temperature measurement equipment, and the temperature information is the temperature in Celsius or Fahrenheit.
  • the mapping relationship between the grayscale information and the temperature information of each temperature measurement equipment is different. , therefore, after using the temperature measurement equipment to measure the temperature of the object to be measured, the grayscale information of each pixel in the target imaging area can be mapped to the temperature information measured by the pixel.
  • the gray value of each pixel in the thermal imaging can be mapped to temperature information, so as to further determine the temperature information of each pixel in the target imaging area, that is, First determine the temperature information of all pixels in the thermal imaging, and then determine the temperature information of each pixel belonging to the target imaging area from the temperature information of all pixels, as the thermal imaging information of each pixel in the target imaging area,
  • the target imaging area can also be determined from thermal imaging first, and then the mapping from grayscale information to temperature information is performed only for each pixel in the target imaging area.
  • the thermal imaging information of the target pixel is compensated, and the compensated thermal imaging information
  • the specified pixel number threshold can be determined according to the pixel size of the temperature measurement equipment, optical system parameters, combined with requirements and experience.
  • the temperature measurement device is an infrared temperature measurement device
  • the wavelength range of the incident wave of the infrared temperature measurement device is 8-14 ⁇ m
  • the lens F number of the temperature measurement device is 1.0
  • the Airy Spot diameter calculation formula calculate the Airy disk diameter of the temperature measurement equipment is about 26.84 ⁇ m
  • the target imaging area when each pixel is covered with at least three levels of Airy disk of the object to be measured, it is considered that the pixel can be
  • the number of pixels included in the target imaging area of the object to be measured may be determined.
  • the target imaging area may be segmented in a hard threshold manner, and then the number of pixels in the target imaging area is calculated.
  • a segmentation threshold is preset, and then the pixel whose grayscale information is greater than or equal to the segmentation threshold is determined as the pixel in the target imaging area, and the pixel whose grayscale information is smaller than the segmentation threshold is determined not to belong to the target imaging area
  • the target imaging area is determined from the thermal imaging, and then the number of pixels in the target imaging area is calculated.
  • the number of pixels contained in the target imaging area of the object to be measured it may be determined whether the number of pixels in the target imaging area is less than a specified threshold value of the number of pixels.
  • the number of pixels in the target imaging area is less than the threshold value of the number of pixels, it means that a single pixel in the temperature measurement device cannot completely receive the radiation energy of the object to be measured, and energy compensation is required, that is, based on the proximity of the target pixels in the target imaging area
  • the thermal imaging information of the pixel is compensated for the thermal imaging information of the target pixel to obtain the compensated thermal imaging information.
  • the target pixel can be any pixel in the target imaging area, or it can also be the central pixel in the target imaging area.
  • the central pixel in the target imaging area can be the The pixel corresponding to the geometric center of the target imaging area.
  • the adjacent pixels of the above-mentioned target pixel can be the pixels adjacent to the target pixel, or the pixels whose pixel distance from the target pixel is smaller than the preset pixel distance.
  • OK for example, the preset pixel spacing is 3.
  • FIG. 5 it is a schematic diagram of the target pixel and adjacent pixels provided by the embodiment of the present application, taking the preset pixel spacing as 3 as an example, the gray square in Figure 5 is the target pixel, and the target image The neighbors of a cell are other cells in the 5 ⁇ 5 matrix.
  • the radiant energy of the object to be measured is scattered in the pixels adjacent to the pixel. Therefore, the proximity of the target pixel in the target imaging area can be used
  • the thermal imaging information of the pixel is used to compensate the thermal imaging information of the target pixel. The specific energy compensation method will be described in detail in subsequent embodiments, and will not be repeated here.
  • the compensated thermal imaging information is obtained.
  • the error of the compensated thermal imaging information is smaller than that of the thermal imaging information without energy compensation.
  • the number of pixels in the target imaging area is not less than the threshold value of the number of pixels, it means that a single pixel in the temperature measurement device can completely receive the radiation energy of the object to be measured. At this time, energy compensation may not be performed.
  • the temperature information of the object to be measured can be determined based on the compensated thermal imaging information.
  • the compensated thermal imaging information can be mapped based on the pre-built mapping relationship between the grayscale information of the temperature measuring device and the temperature information to obtain the temperature information of the object to be measured. If the thermal imaging information is temperature information, the compensated thermal imaging information may be used as the temperature information of the object to be measured.
  • temperature compensation measures such as radiation attenuation correction can be continued on the compensated thermal imaging information.
  • temperature compensation measures for radiation attenuation correction will be described in detail in subsequent embodiments. This will not be repeated here.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application can, when the number of pixels in the target imaging area is less than the specified pixel number threshold, based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, The thermal imaging information of the target pixel is compensated, so that the accuracy of the thermal imaging information of the target pixel can be improved, and the temperature measurement accuracy can be improved when the imaging radius is too small.
  • the embodiment of the present application also provides a thermal imaging temperature measurement method. Based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, the target image The thermal imaging information of the element is compensated to obtain the compensated thermal imaging information, which may include steps S601-S602:
  • the target compensation parameter of each neighboring pixel of the target pixel is: the preset compensation parameter of the neighboring pixel for the target pixel
  • the compensation parameter of the neighboring pixel for the target pixel is: from the compensation template The found compensation parameters of the adjacent pixel for the target pixel.
  • the above-mentioned compensation module may be pre-built, and the compensation template is used to indicate the compensation parameters of any pixel adjacent to the pixel in the temperature measuring device.
  • FIG. 7 it is a schematic diagram of a temperature compensation template provided by the embodiment of the present application.
  • the central grid in the figure is the central pixel, and each value in the grid adjacent to the central pixel is the position Cell Compensation parameters for the central cell.
  • the compensation parameters in the above compensation template are: the ratio of the thermal imaging information of the adjacent pixels of the reference pixel to the thermal imaging information of the reference pixel when the temperature measurement equipment is measuring the point light source; the point light source is: the imaging occupies a The light source of the pixel; the reference pixel is: the pixel occupied by the imaging of the point light source.
  • the compensation template can be constructed in advance for the temperature measurement device in the following manner, including step a-step d:
  • Step a measure the temperature of the point light source
  • a diaphragm with a specific small aperture size can be placed in front of the black body radiation source, and a collimator can be used to simulate a point light source.
  • a collimator can be used to simulate a point light source.
  • the imaging of the point light source can occupy one pixel.
  • the temperature measuring device measures the temperature of the target light source.
  • FIG 8 it is an imaging diagram obtained by measuring the temperature of a point light source by a temperature measuring device.
  • the central bright spot in the figure is the reference pixel, and the reference pixel is the pixel occupied by the imaging of the point light source.
  • Step b determining the thermal imaging information of the reference pixel, and the thermal imaging information of the adjacent pixels of the reference pixel;
  • the adjacent pixels of the reference position can be determined according to the preset pixel distance threshold, and then the thermal imaging information of the reference pixel and the adjacent pixels of the reference pixel can be determined.
  • the thermal imaging information of the adjacent pixels of the reference pixel can reflect the intensity of radiation energy scattered by the point light source at the adjacent pixel.
  • Step c For each adjacent pixel of the reference pixel, calculate the ratio of the thermal imaging information of the adjacent pixel to the thermal imaging information of the reference pixel, as the compensation parameter of the adjacent pixel;
  • the thermal imaging information of the reference pixel is outTemp orgcenter
  • the thermal imaging information of any adjacent pixel (i, j) is outTemp(i, j)
  • the compensation parameters of the adjacent pixel (i, j) are:
  • Step d Based on the compensation parameters of each adjacent pixel of the reference pixel, a compensation template for the temperature measurement device is constructed.
  • the compensation template as shown in FIG. 7 can be constructed.
  • the weighted sum of the thermal imaging information of each adjacent pixel of the point pixel can be calculated as compensation information, and the information to be compensated is the radiation energy of the object to be measured In , the target pixel fails to receive the thermal imaging information corresponding to the radiation capability.
  • the sum of the thermal imaging information of the target pixel and the compensation information can be calculated as the compensated thermal imaging information.
  • outTemp2 center is the temperature after compensation
  • outTemp1 N is the temperature of the target pixel of the pixel and its adjacent pixels
  • P is the compensation template constructed.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application can improve the accuracy of temperature measurement when the imaging radius is too small. Further, through the preset compensation parameters of each adjacent pixel for the target pixel, it can be efficient and accurate Specifically, when the number of pixels in the target imaging area is less than the specified pixel number threshold, the thermal imaging information of the target pixels is compensated, thereby providing a basis for improving the accuracy of temperature measurement when the imaging radius is too small.
  • the embodiment of the present application also provides a thermal imaging temperature measurement method.
  • the above-mentioned determination of the temperature information of the object to be measured based on the compensated thermal imaging information may include:
  • radiation attenuation correction can be performed on the temperature measurement object, wherein the radiation attenuation correction is the correction of the measurement error caused by the radiation attenuation caused by the imaging area, that is, the correction of the measurement error caused by the radiation attenuation of the object to be measured
  • the correction of the measurement error of the temperature measurement equipment caused by the imaging area makes the thermal imaging information after attenuation correction closer to the real thermal imaging information of the object to be measured.
  • the number of pixels in the target imaging area can be used to represent the area of the target imaging area, the more the number of pixels in the target imaging area, the larger the area of the target imaging area, conversely, the fewer the number of pixels in the target imaging area, The smaller the area of the target imaging area.
  • the imaging area parameter corresponding to the number of pixels in the target imaging area can be determined, so that The imaging area with the same number of pixels has the same imaging area parameter, which eliminates the influence of irregular shapes.
  • the radiation attenuation correction is performed on the predetermined temperature of the object to be measured by using the number of pixels in the target imaging area, which may include:
  • the radiation attenuation correction may be performed on the predetermined temperature of the object to be measured by using the number of pixels in the target imaging area in the following manner, including:
  • Step 1 Determine the imaging area parameters corresponding to the number of pixels in the target imaging area
  • the imaging area parameter corresponding to the number of pixels in any imaging area above can be: the area coefficient of a regular geometric shape with the same area as the imaging area, such as the side length of a square, the radius and diameter of a circle, and the side length of an equilateral triangle wait.
  • determining the imaging area parameter corresponding to the number of pixels in the target imaging area may include at least one of the following implementations:
  • the imaging area parameter of the target imaging area is obtained according to the following formula
  • sumPixel_R is the number of pixels occupied by the target imaging area, and floor is the rounding operation.
  • the radius of a circle having the same area as the target imaging area is calculated as an imaging area parameter corresponding to the number of pixels in the target imaging area.
  • the imaging area parameter of the target imaging area is obtained according to the following formula
  • Step 2 Based on the target attenuation rate corresponding to the determined imaging area parameter, perform radiation attenuation correction on the compensated thermal imaging information to obtain attenuation-corrected thermal imaging information;
  • the attenuation rate corresponding to each imaging area parameter is determined based on the thermal imaging information measured by the temperature measuring equipment and the actual thermal imaging information of the calibration object under the condition that the imaging quantity of the calibration object corresponds to the imaging area parameter decay rate.
  • the thermal imaging information is grayscale information
  • the above attenuation rate may be the grayscale attenuation rate for the grayscale information
  • the thermal imaging information is temperature information
  • the above attenuation rate may be the temperature attenuation rate for the temperature information .
  • the corresponding relationship between the imaging area parameter and the attenuation rate can be determined in advance through calibration.
  • the imaging area parameters of the imaging area of the blackbody radiation source in the temperature measuring device under different sizes can be calculated first, and then the corresponding relationship between the imaging area parameters and the attenuation rate can be determined.
  • the above fitting is performed according to the collected imaging area parameters, and among the attenuation rates corresponding to different imaging area parameters, at least two sets of thermal imaging information measured by temperature measuring equipment are obtained for each imaging area parameter.
  • Table 1 shows:
  • T1, T2, T3 and T4 are blackbody radiation sources at different temperatures
  • other data in the table are the thermal imaging information obtained from the measurement of the blackbody radiation source by the temperature measuring equipment, which is illustrated by T11, as The temperature measurement equipment is in a normal temperature environment and under the condition of calibration distance
  • the imaging area parameter is Thermal imaging information obtained by measuring a blackbody radiation source at a temperature of T1.
  • the attenuation rate corresponding to the imaging area parameter can be fitted .
  • the thermal imaging information is grayscale information
  • the grayscale corresponding to the imaging area parameter can be fitted based on the imaging area parameter, the measured grayscale information and the actual grayscale information of the calibration object.
  • degree attenuation rate which is the attenuation rate corresponding to the imaging area parameter.
  • the thermal imaging information is temperature information
  • the temperature decay rate corresponding to the imaging area parameter can be fitted , which is the attenuation rate corresponding to the imaging area parameter.
  • the attenuation rates corresponding to different imaging area parameters may be further fitted by using the least square method, and the fitted attenuation rates may be used as the attenuation rates corresponding to different imaging area parameters.
  • the above attenuation rate can be the ratio of the actual thermal imaging information of the calibration object to the thermal imaging information measured by the temperature measuring equipment. At this time, the ratio of the compensated thermal imaging information to the target attenuation rate can be calculated as the attenuation-corrected thermal imaging information.
  • the attenuation-corrected thermal imaging information may be calculated using the following formula, including:
  • outTemp3 is the thermal imaging information after attenuation correction
  • outTemp2 is the thermal imaging information after compensation
  • K is the target attenuation rate corresponding to the imaging area parameter of the target imaging area.
  • the temperature information of the object to be measured can be determined based on the attenuation-corrected thermal imaging information.
  • the specific implementation method is similar to that of step S403. repeat.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application can improve the accuracy of temperature measurement when the imaging radius is too small. Further, the radiation attenuation correction can be performed on the thermal imaging information, so that the obtained attenuation-corrected thermal imaging The information is closer to the real thermal imaging information of the object to be measured, which can further improve the temperature measurement accuracy.
  • the embodiment of the present application also provides a thermal imaging temperature measurement method, which can also perform atmospheric attenuation on the thermal imaging information of each pixel after extracting the thermal imaging information of each pixel in the target imaging area from the thermal imaging of the object to be measured Correction, so that the thermal imaging information of each pixel is more accurate.
  • atmospheric attenuation correction may be performed on the thermal imaging information of each pixel in the target imaging area.
  • the temperature measuring equipment is an infrared temperature measuring equipment
  • the temperature measuring equipment is an infrared temperature measuring equipment
  • infrared radiation absorbing gases include: carbon dioxide, ozone, methane, carbon monoxide, nitrogen monoxide, ammonia, hydrogen sulfide and sulfur oxide, etc., because except for carbon dioxide, the content of other absorbing gases in the atmosphere is extremely small , usually its influence on infrared radiation can be ignored; the third is the attenuation caused by meteorological conditions (clouds, fog, haze, rain, snow).
  • the actual atmospheric transmittance is the product of various influencing factors, namely:
  • ⁇ a ( ⁇ ) is the spectral transmittance, that is, the atmospheric transmittance
  • ⁇ 1 ( ⁇ ) is the influence of water vapor
  • ⁇ 2 ( ⁇ ) is the influence of atmospheric gas
  • ⁇ 3 ( ⁇ ) is the influence of meteorological conditions
  • ⁇ ⁇ is the sum of the attenuation coefficients caused by the above-mentioned different factors when the wavelength of the incident wave of the temperature measuring equipment is ⁇
  • L is the distance through which the atmosphere passes
  • ⁇ s is the attenuation coefficient caused by atmospheric gases (except carbon dioxide) and aerosols
  • ⁇ r is the attenuation coefficient caused by meteorological conditions.
  • outTemp1 center is the corrected thermal imaging information degree
  • T r is the thermal imaging information of each pixel
  • T u is the ambient temperature
  • T a is the atmospheric temperature
  • ⁇ a is the atmospheric transmittance
  • ⁇ is the temperature of the object to be measured Emissivity
  • ⁇ a is the emissivity of the atmosphere
  • ⁇ is the absorptivity of the object to be measured
  • n is the equipment parameter corresponding to the temperature measuring equipment.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application can improve the accuracy of temperature measurement when the imaging radius is too small. Further, the thermal imaging of each pixel in the target imaging area can be extracted from the thermal imaging of the object to be measured. After the information is collected, the atmospheric attenuation correction is performed on the thermal imaging information of each pixel, so that the thermal imaging information of each pixel is more accurate.
  • FIG 10 it is a schematic diagram of the effect obtained after using the thermal imaging temperature measurement method provided in the embodiment of the present application.
  • the temperature measurement of objects at 150°C and 550°C is carried out using the thermal imaging temperature measurement method provided in the embodiment of the present application.
  • the results are shown in Figure 11, which can significantly improve the temperature measurement accuracy of the temperature measurement equipment.
  • the thermal imaging temperature measurement method provided by the embodiment of the present application can significantly improve this phenomenon.
  • the embodiment of the present application further improves a thermal imaging temperature measurement method, the thermal image information is grayscale information, including steps A1-A4:
  • A1 Extract the grayscale information of each pixel in the target imaging area from the thermal imaging of the object to be measured; where the target imaging area is: the area where the image of the object to be measured is located;
  • A2 If the number of pixels in the target imaging area is less than the specified pixel number threshold, based on the gray information of the adjacent pixels of the target pixel in the target imaging area, the gray information of the target pixel is compensated, and the compensated grayscale information;
  • the gray level information of the target pixel is compensated based on the gray level information of the adjacent pixels of the target pixel in the target imaging area, and the compensated gray level information can be obtained, which may include step 1 and step two:
  • Step 1 Using the target compensation parameters of each adjacent pixel of the target pixel in the target imaging area, calculate the weighted sum of the gray information of each adjacent pixel to obtain compensation information; wherein, the target pixel of each adjacent pixel of the target pixel
  • the compensation parameter is: the preset compensation parameter of the adjacent pixel for the target pixel;
  • the compensation parameter of each adjacent pixel of the target pixel for the target pixel is: the compensation parameter of the adjacent pixel for the target pixel found from the compensation template; wherein, the compensation template is used to indicate: temperature measuring equipment The compensation parameters of any cell in the adjacent cells for this cell.
  • the compensation parameter in the compensation template is: the ratio of the grayscale information of the adjacent pixels of the reference pixel to the grayscale information of the reference pixel under the measurement state of the point light source by the temperature measuring device;
  • the point light source is: A light source whose imaging occupies a pixel;
  • a reference pixel is: the pixel occupied by the imaging of a point light source.
  • Step 2 Calculate the sum of the grayscale information of the target pixel and the compensation information as the compensated grayscale information.
  • A3 Use the number of pixels in the target imaging area to perform radiation attenuation correction on the compensated gray information to obtain the attenuation corrected gray information; where the radiation attenuation correction is the measurement of the radiation attenuation caused by the imaging area error correction;
  • the imaging area parameter corresponding to the number of pixels in the target imaging area may be determined, and based on the target gray scale attenuation rate corresponding to the determined imaging area parameter, the compensated gray scale The information is corrected by radiation attenuation, and the gray level information after attenuation correction is obtained.
  • the grayscale attenuation rate corresponding to each imaging area parameter when the imaging quantity of the calibration object corresponds to the imaging area parameter, based on the grayscale information measured by the temperature measuring equipment and the actual grayscale information of the calibration object Determined grayscale decay rate.
  • the above-mentioned grayscale attenuation rate is the ratio of the actual grayscale information of the calibration object to the grayscale information measured by the temperature measuring device, and the ratio of the compensated grayscale information to the target grayscale attenuation rate can be calculated , as the attenuation-corrected grayscale information.
  • A4 Based on the mapping relationship between the grayscale information and temperature information of the pre-built temperature measuring equipment, the grayscale information after attenuation correction is mapped to obtain the temperature information of the object to be measured.
  • the attenuation-corrected grayscale information can be further mapped to the temperature of the object to be measured based on the pre-built mapping relationship between the grayscale information of the temperature measuring device and the temperature information Information, so as to complete the temperature measurement of the object to be measured.
  • the thermal imaging temperature measurement method since the number of pixels in the target imaging area is less than the specified threshold value of the number of pixels, it can be based on the grayscale information of the adjacent pixels of the target pixel in the target imaging area, The gray level information of the target pixel is compensated, and the radiation attenuation correction is further performed on the compensated gray level information, so that the temperature measurement accuracy can be effectively improved when the imaging radius is too small.
  • the embodiment of the present application further improves a thermal imaging temperature measurement method, the thermal image information is temperature information, including steps B1-B5:
  • B1 Determine the grayscale information of each pixel in the target imaging area from the thermal imaging of the object to be measured;
  • the temperature information of the target pixel is compensated based on the temperature information of the adjacent pixels of the target pixel in the target imaging area, and the compensated temperature information may include steps 1 and 2:
  • Step 1 Using the target compensation parameters of each adjacent pixel of the target pixel in the target imaging area, calculate the weighted sum of the temperature information of each adjacent pixel to obtain compensation information; wherein, the target compensation of each adjacent pixel of the target pixel
  • the parameters are: the preset compensation parameters of the adjacent pixel for the target pixel;
  • the compensation parameter of each adjacent pixel of the target pixel for the target pixel is: the compensation parameter of the adjacent pixel for the target pixel found from the compensation template; wherein, the compensation template is used to indicate: temperature measuring equipment The compensation parameters of any cell in the adjacent cells for this cell.
  • the compensation parameter in the compensation template is: the ratio of the temperature information of the adjacent pixels of the reference pixel to the temperature information of the reference pixel in the measurement state of the point light source by the temperature measuring device;
  • the point light source is: The light source of a pixel;
  • the base pixel is: the pixel occupied by the imaging of a point light source.
  • Step 2 Calculate the sum of the temperature information of the target pixel and the compensation information as the compensated temperature information.
  • B4 Use the number of pixels in the target imaging area to perform radiation attenuation correction on the compensated temperature information to obtain attenuation-corrected temperature information; where the radiation attenuation correction is the measurement error caused by the radiation attenuation caused by the imaging area amend;
  • the imaging area parameter corresponding to the number of pixels in the target imaging area may be determined, and based on the target temperature decay rate corresponding to the determined imaging area parameter, the compensated temperature information may be Radiation attenuation correction to obtain temperature information after attenuation correction.
  • the temperature attenuation rate corresponding to each imaging area parameter is determined based on the temperature information measured by the temperature measuring equipment and the actual temperature information of the calibration object under the condition that the imaging quantity of the calibration object corresponds to the imaging area parameter decay rate.
  • the above-mentioned attenuation rate is the ratio of the actual temperature information of the calibration object to the temperature information measured by the temperature measuring device, and the ratio of the compensated temperature information to the target temperature attenuation rate can be calculated as the attenuation-corrected temperature information.
  • the attenuation-corrected temperature information can be further mapped to the temperature information of the object to be measured based on the pre-built mapping relationship between the temperature information of the temperature measuring device and the temperature information, so that Complete the temperature measurement of the object to be measured.
  • the thermal imaging temperature measurement method provided in the embodiment of the present application, when the number of pixels in the target imaging area is less than the specified threshold value of the number of pixels, based on the temperature information of the adjacent pixels of the target pixel in the target imaging area, the The temperature information of the target pixel is compensated, and the radiation attenuation correction is further performed on the compensated temperature information, so that the temperature measurement accuracy can be effectively improved when the imaging radius is too small.
  • the embodiment of the present application also provides a thermal imaging temperature measurement device, which is applied to temperature measurement equipment, and the device includes:
  • the thermal imaging information extraction module 1101 is configured to extract the thermal imaging information of each pixel in the target imaging area from the thermal imaging of the object to be measured; wherein, the target imaging area is: the area where the imaging of the object to be measured is located;
  • the thermal imaging information compensation module 1102 is configured to: if the number of pixels in the target imaging area is less than a specified threshold value of the number of pixels, based on the thermal imaging information of the adjacent pixels of the target pixel in the target imaging area, the The thermal imaging information of the target pixel is compensated to obtain the compensated thermal imaging information;
  • a temperature determining module 1103, configured to determine temperature information of the object to be measured based on the compensated thermal imaging information.
  • the thermal imaging information compensation module includes:
  • the compensation information calculation sub-module is used to calculate the weighted sum of the thermal imaging information of each adjacent pixel by using the target compensation parameters of each adjacent pixel of the target pixel in the target imaging area to obtain compensation information; wherein, the The target compensation parameter of each adjacent pixel of the target pixel is: the preset compensation parameter of the adjacent pixel for the target pixel;
  • the thermal imaging information compensation sub-module is configured to calculate the sum of the thermal imaging information of the target pixel and the compensation information as the compensated thermal imaging information.
  • the compensation parameter of each neighboring pixel of the target pixel for the target pixel is: the compensation parameter of the neighboring pixel found from the compensation template for the target pixel;
  • the compensation template is used to indicate: the compensation parameters of any pixel adjacent to the pixel in the temperature measuring device.
  • the compensation parameters in the compensation template are: the difference between the thermal imaging information of the adjacent pixels of the reference pixel and the thermal imaging information of the reference pixel in the measurement state of the point light source by the temperature measuring device Ratio;
  • the point light source is: a light source whose imaging occupies one pixel;
  • the reference pixel is: a pixel occupied by the imaging of the point light source.
  • the adjacent pixels of the target pixel are: pixels whose pixel distance from the target pixel is smaller than a preset pixel distance.
  • the temperature determination module includes:
  • the temperature correction sub-module is used to use the number of pixels in the target imaging area to perform radiation attenuation correction on the compensated thermal imaging information to obtain attenuation-corrected thermal imaging information; wherein, the radiation attenuation correction is the Correction of measurement errors due to radiation attenuation caused by area;
  • the temperature determining submodule is configured to determine the temperature information of the object to be measured based on the attenuation-corrected thermal imaging information.
  • the temperature correction submodule includes:
  • a parameter determination unit configured to determine an imaging area parameter corresponding to the number of pixels in the target imaging area
  • a temperature correction unit configured to perform radiation attenuation correction on the compensated thermal imaging information based on the target attenuation rate corresponding to the determined imaging area parameter, to obtain attenuation-corrected thermal imaging information
  • the attenuation rate corresponding to each imaging area parameter under the condition that the imaging quantity of the calibration object corresponds to the imaging area parameter, based on the thermal imaging information measured by the temperature measuring device and the actual thermal imaging information of the calibration object Decay rate determined from imaging information.
  • the temperature correction submodule is specifically configured to calculate the side length of a square with the same area as the target imaging area based on the number of pixels in the target imaging area, as the The imaging area parameter corresponding to the number; or, based on the number of pixels in the target imaging area, calculate the radius of a circle with the same area as the target imaging area as the imaging area corresponding to the number of pixels in the target imaging area parameter.
  • the attenuation rate is a ratio of the actual thermal imaging information of the calibration object to the thermal imaging information measured by the temperature measuring device;
  • the temperature correction unit is specifically configured to calculate a ratio of the compensated thermal imaging information to the target attenuation rate as attenuation-corrected thermal imaging information.
  • the thermal imaging information is: grayscale information
  • the temperature determination module is specifically configured to map the compensated thermal imaging information based on the pre-built mapping relationship between grayscale information and temperature information of the temperature measuring device, to obtain the temperature of the object to be measured. temperature information.
  • the thermal imaging information is: temperature information;
  • the thermal imaging information extraction module is specifically used to determine the grayscale information of each pixel in the target imaging area from the thermal imaging of the object to be measured; for each pixel in the target imaging area, based on the pre-built The mapping relationship between the grayscale information of the temperature measuring equipment and the temperature information is mapped to the grayscale information of the pixel to obtain the temperature information of the pixel;
  • the temperature determining module is specifically configured to use the compensated thermal imaging information as the temperature information of the object to be measured.
  • the thermal imaging temperature measurement method can measure the target image based on the measured temperature of the adjacent pixels of the target pixel in the target imaging area when the number of pixels in the target imaging area is less than the specified threshold value of the number of pixels.
  • the measurement temperature of the pixel is compensated, so that the accuracy of the thermal imaging information of the target pixel can be improved, and the temperature measurement accuracy can be improved when the imaging radius is too small.
  • the embodiment of the present application also provides an electronic device, as shown in FIG. 12 , including a processor 1201, a communication interface 1202, a memory 1203, and a communication bus 1204. complete the mutual communication,
  • Memory 1203 for storing computer programs
  • the processor 1201 is configured to implement the steps of the above thermal imaging temperature measurement method when executing the program stored in the memory 1203 .
  • the communication bus mentioned above for the electronic device may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus or the like.
  • PCI Peripheral Component Interconnect
  • EISA Extended Industry Standard Architecture
  • the communication bus can be divided into an address bus, a data bus, a control bus, and the like. For ease of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or one type of bus.
  • the communication interface is used for communication between the electronic device and other devices.
  • the memory may include a random access memory (Random Access Memory, RAM), and may also include a non-volatile memory (Non-Volatile Memory, NVM), such as at least one disk memory.
  • RAM Random Access Memory
  • NVM non-Volatile Memory
  • the memory may also be at least one storage device located far away from the aforementioned processor.
  • the above-mentioned processor can be a general-purpose processor, including a central processing unit (Central Processing Unit, CPU), a network processor (Network Processor, NP), etc.; it can also be a digital signal processor (Digital Signal Processing, DSP), dedicated integrated Circuit (Application Specific Integrated Circuit, ASIC), Field-Programmable Gate Array (Field-Programmable Gate Array, FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
  • CPU Central Processing Unit
  • NP Network Processor
  • DSP Digital Signal Processing
  • ASIC Application Specific Integrated Circuit
  • FPGA Field-Programmable Gate Array
  • FPGA Field-Programmable Gate Array
  • a computer-readable storage medium is also provided, and a computer program is stored in the computer-readable storage medium, and when the computer program is executed by a processor, any of the above-mentioned thermal imaging temperature The steps of the measurement method.
  • a computer program product including instructions is also provided, which, when run on a computer, causes the computer to execute any one of the thermal imaging temperature measurement methods in the above embodiments.
  • all or part of them may be implemented by software, hardware, firmware or any combination thereof.
  • software When implemented using software, it may be implemented in whole or in part in the form of a computer program product.
  • the computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on the computer, the processes or functions according to the embodiments of the present application will be generated in whole or in part.
  • the computer can be a general purpose computer, a special purpose computer, a computer network, or other programmable devices.
  • the computer instructions may be stored in or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website, computer, server or data center Transmission to another website site, computer, server, or data center by wired (eg, coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (eg, infrared, wireless, microwave, etc.).
  • the computer-readable storage medium may be any available medium that can be accessed by a computer, or a data storage device such as a server or a data center integrated with one or more available media.
  • the available medium may be a magnetic medium (for example, a floppy disk, a hard disk, or a magnetic tape), an optical medium (for example, DVD), or a semiconductor medium (for example, a Solid State Disk (SSD)).
  • SSD Solid State Disk
  • each embodiment in this specification is described in a related manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments.
  • the description is relatively simple, and for relevant parts, please refer to part of the description of the method embodiments.

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Abstract

本申请实施例提供了热成像温度测量方法、装置及电子设备，应用于数据测量技术领域。该方法应用于测温设备，该方法包括：从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，目标成像区域为：待测对象的成像所在的区域；若目标成像区域内像元数量小于指定的像元数量阈值，则基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，得到补偿后的热成像信息；基于补偿后的热成像信息，确定待测对象的温度信息。通过本方案，可以在成像半径过小时，提高测温准确度。

Description

热成像温度测量方法、装置及电子设备
本申请要求于2021年9月29日提交中国专利局、申请号为202111153742.4发明名称为“热成像温度测量方法、装置及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及数据测量技术领域，特别是涉及热成像温度测量方法、装置及电子设备。
背景技术
理想情况下，使用测温设备对对象进行温度测量时，测温设备的输出只与对象的辐射强度有关，但由于测温设备中杂质的散射、相差、衍射以及周围环境干扰，导致测温设备所测温度与对象在测温设备中成像面积相关，其中对象在测温设备中的成像面积的大小可以用成像尺寸的大小表征。
相关技术中，可以通过成像半径修正的方式，对测温设备所测温度进行补偿，从而减小测温设备所测温度的误差。然而，当对象的成像尺寸达到测温设备中光学系统的极限时，将导致测温设备中单个像元不能完全接收对象所辐射的能量，使得测温设备所测温度发生严重衰减，仅通过成像半径修正，无法有效补偿由成像尺寸过小导致的衰减，测温准确度较低。
因此，如何在成像半径过小时，提高测温准确度，是亟需解决的技术问题。
发明内容
本申请实施例的目的在于提供热成像温度测量方法、装置及电子设备，以在成像半径过小时，提高测温准确度。具体技术方案如下：
第一方面，本申请实施例提高一种热成像温度测量方法，应用于测温设备，所述方法包括：从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
第二方面，本申请实施例提供一种热成像温度测量装置，应用于测温设备，所述装置包括：热成像信息提取模块，用于从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；热成像信息补偿模块，用于若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；温度确定模块，用于基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
第三方面，本申请实施例提供一种电子设备，包括处理器、通信接口、存储器和通信总线，其中，处理器，通信接口，存储器通过通信总线完成相互间的通信；存储器，用于 存放计算机程序；处理器，用于执行存储器上所存放的程序时，实现第一方面任一项的方法步骤。
第四方面，本申请实施例提供一种计算机可读存储介质，计算机可读存储介质内存储有计算机程序，计算机程序被处理器执行时实现第一方面任一项的方法步骤。
本申请实施例有益效果：
本申请实施例所提供的热成像温度测量方法中，可以从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，目标成像区域为：待测对象的成像所在的区域；若目标成像区域内像元数量小于指定的像元数量阈值，则基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，得到补偿后的热成像信息；基于补偿后的热成像信息，确定待测对象的温度信息。由于在成像半径过小时，测温设备中单个像元不能完全接收对象所辐射的能量，对象的所辐射的能量一部分被像元的邻近像元所接收，而本方案可以在目标成像区域内像元数量小于指定的像元数量阈值时，基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，从而可以提高目标像元的热成像信息的准确性，进而可以在成像半径过小时，提高测温准确度。
当然，实施本申请的任一产品或方法并不一定需要同时达到以上所述的所有优点。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的实施例。
图1为100℃、150℃的黑体辐射源的测量温度示意图；
图2为艾里斑直径大于一个像元直径时的辐射示意图；
图3为单个像元辐射能量示意图；
图4为本申请实施例所提供的热成像温度测量方法的流程图；
图5为本申请实施例提供的目标像元与邻近像元示意图；
图6为本申请实施例所提供的热成像温度测量方法的另一流程图；
图7为本申请实施例提供的一种温度补偿模板的示意图
图8为测温设备对点光源进行温度测量所得到的成像图；
图9为本申请实施例所提供的热成像温度测量方法的另一流程图；
图10为本申请实施例提供的热成像温度测量方法的效果示意图；
图11为本申请实施例所提供的热成像温度测量装置的结构示意图；
图12为本申请实施例所提供的电子设备的结构示意图。
具体实施方式
为使本申请的目的、技术方案、及优点更加清楚明白，以下参照附图并举实施例，对本申请进一步详细说明。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所 获得的所有其他实施例，都属于本申请保护的范围。
理想情况下，使用测温设备对对象进行温度测量时，测温设备的输出只与对象的辐射强度有关，但由于测温设备中杂质的散射、相差、衍射以及周围环境干扰，导致测温设备所测温度与对象在测温设备中成像面积相关。
当对象在测温设备上成像所占的像元个数不同时，测温设备所测量的温度会发生变化，且当待测目标温度高于周围环境温度时，成像所占像元个数越少，测温设备所测温度越低。
如图1所示，固定距离下，测温设备分别对着100℃、150℃的黑体辐射源进行测温，黑体辐射源前方放置不同孔径尺寸大小的光阑，测温设备分别在不同孔径尺寸的光阑下，对100℃、150℃的黑体辐射源进行测温，并记录不同尺寸下所测的温度。由图1可以发现，随着光阑的孔径尺寸的变化，黑体辐射源在测温设备的成像画面越来越小，即成像面积及成像尺寸越来越小，测温设备的所测温度也越来越小，且黑体辐射源温度越高，衰减越大。
由于光的波动性和透镜孔径的限制，光通过透镜就会发生衍射，形成明暗相间的条纹衍射图样，条纹间距随透镜的通光孔径的减少而变大，其中，约有84％的能量集中在中央亮斑，其余16％的能量分布在各级明环上。衍射图样的中心区域最大的亮斑，称为艾里斑。
一般来说，通过任何光学仪器成像的过程都可以认为是把物体上的无数微小的点转换为艾里斑，然后再把他们叠加起来。最小光斑大小，即艾里斑直径计算公式如下：
D＝2.44×λ×f/#
其中，λ为光学仪器入射光的波长，f/#为光学仪器的镜头F数。
示例性的，测温设备入射光的波长范围为8～14μm，取入射光的波长为11μm，测温设备的的镜头F数为1.0，根据艾里斑直径计算公式，可计算测温设备的艾里斑直径约为：
D≈2.44×11×1＝26.84μm
若测温设备的像元直径为17μm，由于测温设备的艾里斑直径大于一个像元直径，这也就意味着，测温对象上每一点的辐射能量被分散在多个像元，如图2所示，当使用单个像元的输出表征测温对象的真实温度时，测温对象的成像需要在测温设备上至少占满N＝5×5个像元，才能准确测量测温对象的温度。其中N需要根据测温设备的像元尺寸、光学系统参数来确定，因此，目前测温设备需要准确对测温对象进行测温时，测温对象必须满足一定的距离系数比，才能准确测温。
进一步的，如图3所示，为单个像元辐射能量示意图，可知，当用单个像元的输出表征测温对象的温度时，测温设备中每个像元所接收到的辐射能量可表示为：
W＝84％W obj+16％W base
其中，W obj为测温对象实际辐射能量，W base根据测温设备的成像所占像元个数的不同，当测温对象在测温设备上所占像元个数大于N时，W base为测温对象所辐射能量，当测温对 象在测温设备上所占像元个数小于N时，W base为测温设备环境辐射的能量，此时，也就说测温设备中单个像元仅能接收到测温对象84％的辐射能量。
而相关技术中，仅通过成像半径修正的方式，无法有效补偿由成像尺寸过小导致的衰减，测温准确度较低。
为了解决成像尺寸过小导致测温准确度较低的问题，本申请实施例提供一种应用于测温设备的热成像温度测量方法。
需要说明的是，本申请实施例所提供的测温设备可以为红外测温设备，本申请实施例提供的热成像温度测量方法可以通过软件、硬件或软硬件结合的方式实现。
其中，本申请实施例所提供的一种热成像温度测量方法，可以包括步骤：
从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；
若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；
基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
本申请实施例所提供的热成像温度测量方法，由于可以在目标成像区域内像元数量小于指定的像元数量阈值时，基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，从而可以提高目标像元的热成像信息的准确性，进而在成像半径过小时，提高了测温准确度。
下面结合说明书附图，对本申请实施例提供的热成像温度测量方法、装置及电子设备进行详细说明。
如图4所示，本申请实施例提供的一种热成像温度测量方法方法，应用于测温设备，可以包括如下步骤：
S401，从待测对象的热成像中提取目标成像区域内各像元的热成像信息；
其中，待测对象的热成像可以为对待测对象进行温度测量得到的，例如，利用红外测温设备对待测对象进行温度测量，得到待测对象的热成像，红外测温设备利用热红外波段(8μm-14μm)的光，来探测待测对象发出的热辐射，并把接收到的热辐射转化为灰度信息，经系统处理转变为待测对象的热图像。
热成像中每一像元具有灰度信息，每一像元的灰度信息与该像元所接收热辐射的强弱相关，所接收热辐射越强，该像元的灰度信息越大，因此，在一种实现方式中，可以将灰度信息作为各像元的热成像信息。
或者，在得到待测对象的热成像之后，可以将热成像中每一像元的灰度信息转换为该像元所测的温度信息，例如将每一像元的灰度信息转换为摄氏温度值或华氏温度值。
可选的，一种实现方式中，若所要提取的热成像信息为温度信息，则可以从待测对象的热成像中确定目标成像区域各像元的灰度信息，再针对目标成像区域内的每一像元，基于预先构建的测温设备的灰度信息与温度信息之间的映射关系，对该像元的灰度信息进行映射，得到该像元的温度信息。
其中，灰度信息是测温设备实际测量的测温对象的辐射强度，而温度信息则是摄氏温度或华氏温度，每一测温设备的灰度信息与温度信息之间的映射关系是不同的，因此，在利用测温设备对待测对象进行温度测量之后，可以将目标成像区域内的每一像元的灰度信息，映射为该象元测量得到的温度信息。
一种实现方式中，可以在得到热成像之后，将热成像中每一象元的灰度值均映射为温度信息，从而进一步的确定目标成像区域内各象元的温度信息，也就是说，先确定出热成像中所有像元的温度信息，再从所有像元的温度信息中，确定出属于目标成像区域的各像元的温度信息，作为目标成像区域内各像元的热成像信息，或者，也可以先从热成像中确定出目标成像区域，进而仅针对目标成像区域内的每一象元进行灰度信息到温度信息的映射。
S402，若目标成像区域内像元数量小于指定的像元数量阈值，则基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，得到补偿后的热成像信息；
其中，指定的像元数量阈值可以根据测温设备的像元尺寸、光学系统参数，结合需求和经验来确定。示例性的，当像元尺寸为17μm，测温设备为红外测温设备，红外测温设备的入射波的波长范围为8～14μm，测温设备的镜头F数为1.0，则可按照艾里斑直径计算公式，计算测温设备的艾里斑直径约为26.84μm，当目标成像区域内，每一像元周围至少覆盖有待测对象的三级艾里斑时，则认定该像元可以接收到待测对象完整的辐射能量，此时计算(26.84μm×3)/17，约等于5，则指定的像元数量阈值＝5×5＝25。
本步骤中，在对待测对象进行温度测量之后，可以确定待测对象的目标成像区域所包含像元的像元数量。可选的，可以采用硬阈值的方式分割出目标成像区域，进而计算目标成像区域内像元的像元数量。示例性的，预设一分割阈值，进而将灰度信息大于等于分割阈值的像元确定为目标成像区域内的像元，将灰度信息小于分割阈值的像元确定为不属于目标成像区域内的像元，从而从热成像中确定出目标成像区域，进而计算目标成像区域内像元的像元数量。
在确定出待测对象的目标成像区域所包含像元的像元数量之后，可以判断目标成像区域内像元数量是否小于指定的像元数量阈值。
若目标成像区域内像元数量小于像元数量阈值，则说明测温设备内单个像元无法完整接收到待测对象的辐射能量，需要进行能量补偿，即基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，得到补偿后的热成像信息。
其中，目标像元可以为目标成像区域内任意一像元，或者，也可以为目标成像区域内的中心像元，对于不规则形状的目标成像区域，该目标成像区域的中心像元可以为该目标成像区域的几何中心位置处对应的像元。
上述目标像元的邻近像元可以为与目标像元相邻的像元，或者与目标像元的像元间距小于预设像元间距的像元，该预设像元间距可以根据需求和经验确定，例如预设像元间距为3。
示例性的，如图5所示，为本申请实施例提供的目标像元与邻近像元示意图，以预设 像元间距为3为例，图5中灰色方块为目标像元，则目标像元的邻近像元为5×5矩阵内的其他像元。
由于测温设备内单个像元无法完整接收待测对象的辐射能量，则说明待测对象的辐射能量被散射在该像元附件的像元，因此，可以利用目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿。具体能量补偿方式将在后续实施例进行详细说明，在此不再赘述。
在对目标像元的热成像信息进行补偿之后，得到补偿后的热成像信息。在目标成像区域内像元数量小于指定的像元数量阈值的情况下，相比于未经过能量补偿的热成像信息而言，补偿后的热成像信息的误差更小。
需要说明的是，若目标成像区域内像元数量不小于像元数量阈值，则说明测温设备内单个像元可以完整接收到待测对象的辐射能量，此时，可以不进行能量补偿。
S403，基于补偿后的热成像信息，确定待测对象的温度信息。
在得到待测对象的补偿后的热成像信息之后，可以基于补偿后的热成像信息，确定待测对象的温度信息。
若热成像信息为灰度信息，则可以基于预先构建的测温设备的灰度信息与温度信息之间的映射关系，对补偿后的热成像信息进行映射，得到待测对象的温度信息。而若热成像信息为温度信息，则可以将补偿后的热成像信息，作为待测对象的温度信息。
或者，为了进一步提高测量温度的准确性，还可以继续对补偿后的热成像信息进行辐射衰减修正等温度补偿措施，具体的，关于辐射衰减修正的温度补偿措施将在后续实施例详细描述，在此不再赘述。
本申请实施例所提供的热成像温度测量方法，由于可以在目标成像区域内像元数量小于指定的像元数量阈值时，基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，从而可以提高目标像元的热成像信息的准确性，进而可以在成像半径过小时，提高测温准确度。
基于图4所示的实施例，如图6所示，本申请实施例还提供一种热成像温度测量方法，上述基于目标成像区域内目标像元的邻近像元的热成像信息，对目标像元的热成像信息进行补偿，得到补偿后的热成像信息，可以包括步骤S601-S602：
S601，利用目标成像区域内目标像元各邻近像元的目标补偿参数，计算各邻近像元的热成像信息的加权和，得到补偿信息；
其中，目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对目标像元的补偿参数，而该邻近像元针对目标像元的补偿参数为：从补偿模板中查找到的该邻近像元针对目标像元的补偿参数。
上述补偿模块可以为预先构建的，补偿模板用于指示测温设备中任一像元的邻近像元针对该像元的补偿参数。
如图7所示，为本申请实施例提供的一种温度补偿模板的示意图，图中中心方格为中心像元，与中心像元相邻的方格中的每一数值即为该位置处像元针对中心像元的补偿参数。
上述补偿模板中的补偿参数为：在测温设备对点光源的测量状态下，基准像元的邻近 像元的热成像信息与基准像元的热成像信息的比值；点光源为：成像占据一个像元的光源；基准像元为：被点光源的成像占据的像元。
在一种实现方式中，可以采用如下方式预先针对测温设备构建补偿模板，包括步骤a-步骤d：
步骤a：对点光源进行温度测量；
其中，可以将具体小孔径尺寸的光阑放在黑体辐射源前面，利用平行光管，模拟点光源，通过控制光阑的孔径尺寸的大小，使得点光源的成像占据一个像元，进而，利用测温设备对目标光源进行温度测量。
如图8所示，为测温设备对点光源进行温度测量所得到的成像图。图中中心亮斑为基准像元，基准像元为被点光源的成像占据的像元。
步骤b：确定基准像元的热成像信息，以及基准像元的邻近像元的热成像信息；
在对点光源进行温度测量之后，可以根据预设像元间距阈值，确定基准位置的邻近像元，进而确定基准像元和基准像元的邻近像元的热成像信息。
由于此时点光源的成像仅占据一个基准像元，因此，基准像元的邻近像元的热成像信息可以反应点光源散射在该邻近象元处辐射能量的强弱。
步骤c：针对基准像元的每一邻近像元，计算该邻近像元的热成像信息与基准像元的热成像信息的比值，作为该邻近像元的补偿参数；
其中，基准像元的热成像信息为outTemp orgcenter，任一邻近像元(i,j)的热成像信息为outTemp(i,j)，则邻近像元(i,j)的补偿参数为：
Figure PCTCN2022097419-appb-000001
步骤d：基于基准像元的每一邻近像元的补偿参数，构建针对测温设备的补偿模板。
本步骤中，在计算出基准像元的每一邻近像元的补偿参数之后，即可构建如图7所示的补偿模板。
在确定点像元的每一邻近像元的目标补偿参数之后，可以计算点像元各邻近像元的热成像信息的加权和，作为补偿信息，该待补偿信息即为待测对象的辐射能量中，目标像元未能接收到的辐射能力对应的热成像信息。
S602，计算目标像元的热成像信息与补偿信息之和，作为补偿后的热成像信息。
本步骤中，在确定出目标像元的补偿信息之后，即可计算目标像元的热成像信息与补偿信息之和，作为补偿后的热成像信息。
可选的，可以通过卷积和的方式实现，例如：
Figure PCTCN2022097419-appb-000002
其中，outTemp2 center为补偿后的温度，outTemp1 N为像元的目标像元及其邻近像元的温度，P为所构建的补偿模板。
本申请实施例所提供的热成像温度测量方法，可以在成像半径过小时，提高测温准确度，进一步的，通过预设的每一邻近像元针对目标像元的补偿参数，可以高效、准确地，在目标成像区域内像元数量小于指定的像元数量阈值时，对目标像元的热成像信息进行补偿，从而为在成像半径过小时，提高测温准确度提供了实现基础。
基于图4所示的实施例，如图9所示，本申请实施例还提供一种热成像温度测量方法，上述基于补偿后的热成像信息，确定待测对象的温度信息，可以包括：
S901，利用目标成像区域内像元数量，对补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；其中，辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正。
由图1已知，当对象在测温设备上成像所占的像元个数不同时，测温设备所测量的温度会发生变化，且成像所占像元个数越少，测温设备所测温度越低。
因此，为了进一步提高测温准确度，可以对测温对象进行辐射衰减修正，其中，该辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正，即对由待测对象的成像面积造成的测温设备的测量误差的修正，使得衰减修正后的热成像信息的更接近于待测对象真实的热成像信息。
基于此，可以根据目标成像区域的面积对补偿后的热成像信息进行辐射衰减修正。可选的，可以利用目标成像区域内像元数量表征目标成像区域的面积，目标成像区域内像元数量越多，目标成像区域的面积越大，反之，目标成像区域内像元数量越少，目标成像区域的面积越小。
由于在实际测温过程中，待测对象在热成像上的目标成像区域可能为不规则形状，为了使得修正结果更准确，可以确定与目标成像区域内像元数量对应的成像面积参数，从而使得象元数量相同的成像区域具有同一个成像面积参数，消除了不规则形状的影响。
此时，上述利用目标成像区域内像元数量，对待测对象的预确定温度进行辐射衰减修正，可以包括：
在一种实现方式中，可以采用如下方式，利用目标成像区域内像元数量，对待测对象的预确定温度进行辐射衰减修正，包括：
步骤1：确定与目标成像区域内像元数量对应的成像面积参数；
其中，上述任意成像区域的像元数量对应的成像面积参数可以为：与该成像区域等面积的规则几何形状的面积系数，例如正方形的边长、圆的半径、直径、等边三角形的边长等。
则确定与目标成像区域内像元数量对应的成像面积参数，可以包括以下至少一种实现方式：
第一方式，基于目标成像区域内像元数量，计算与目标成像区域等面积的正方形的边长，作为与目标成像区域内像元数量对应的成像面积参数。
具体的，根据下述公式得到目标成像区域的成像面积参数
Figure PCTCN2022097419-appb-000003
Figure PCTCN2022097419-appb-000004
其中，sumPixel_R为目标成像区域所占像元的像元数量，floor为取整操作。
第二方式，基于目标成像区域内像元数量，计算与目标成像区域等面积的圆形的半径，作为与目标成像区域内像元数量对应的成像面积参数。
具体的，根据下述公式得到目标成像区域的成像面积参数
Figure PCTCN2022097419-appb-000005
Figure PCTCN2022097419-appb-000006
步骤2：基于与所确定的成像面积参数对应的目标衰减率，对补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；
其中，与每一成像面积参数对应的衰减率为：在标定对象的成像数量与该成像面积参数对应的情况下，基于测温设备所测的热成像信息与标定对象的实际热成像信息所确定的衰减率。需要说明的，若热成像信息为灰度信息，则上述衰减率可以为针对灰度信息的灰度衰减率，若热成像信息为温度信息，则上述衰减率可以为针对温度信息的温度衰减率。
可以预先通过标定的方式确定成像面积参数与衰减率之间的对应关系。
具体的，在常温环境，标定距离条件下，对着不同温度的标定对象，如黑体辐射源，利用测温设备采集不同尺寸下黑体辐射源的热成像信息，进而根据采集到的热成像信息进行拟合，得到不同尺寸下对应的衰减率。
其中，在进行拟合时，可以先计算不同尺寸下黑体辐射源在测温设备中的成像区域的成像面积参数，进而确定成像面积参数与衰减率之间的对应关系。
上述根据采集到的成像面积参数进行拟合，得到不同成像面积参数下对应的衰减率中，针对每一成像面积参数，至少获取两组测温设备测量的热成像信息，示例性的，如表1所示：
表1
Figure PCTCN2022097419-appb-000007
其中，
Figure PCTCN2022097419-appb-000008
和
Figure PCTCN2022097419-appb-000009
为黑体辐射源的不同成像面积参数，T1、T2、T3和T4为不同温度的黑体辐射源，表格中的其他数据为测温设备对黑体辐射源测量得到的热成像信息，以T11说明，为测温设备在常温环境，标定距离条件下，对成像面积参数为
Figure PCTCN2022097419-appb-000010
温度为T1的黑体辐射源进行测量得到的热成像信息。
根据测温设备所测量的数据，可以针对每一成像面积参数，基于该成像面积参数、所测的热成像信息以及标定对象的实际热成像信息，拟合出与该成像面积参数对应的衰减率。
例如，热成像信息为灰度信息，则可以针对每一成像面积参数，基于该成像面积参数、所测的灰度信息以及标定对象的实际灰度信息，拟合出该成像面积参数对应的灰度衰减率，即为该成像面积参数对应的衰减率。
又如，热成像信息为温度信息，则可以针对每一成像面积参数，基于该成像面积参数、所测的温度信息以及标定对象的实际温度信息，拟合出该成像面积参数对应的温度衰减率，即为该成像面积参数对应的衰减率。
进一步的，还可以对不同成像面积参数所对应的衰减率，利用最小二乘法法做进一步的拟合，将拟合后的衰减率作为不同成像面积参数对应的衰减率。
上述衰减率可以为标定对象的实际热成像信息与测温设备所测的热成像信息之比，此时，可以计算补偿后的热成像信息与目标衰减率的比值，作为衰减修正后的热成像信息。
示例性的，可以采用如下公式计算衰减修正后的热成像信息，包括：
Figure PCTCN2022097419-appb-000011
其中，outTemp3为衰减修正后的热成像信息，outTemp2为补偿后的热成像信息，K为目标成像区域的成像面积参数对应的目标衰减率。
S902，基于衰减修正后的热成像信息，确定待测对象的温度信息。
在得到待测对象的衰减修正后的热成像信息之后，可以基于衰减修正后的热成像信息，确定待测对象的温度信息，具体实现方式与步骤S403相似，本申请实施例，在此不再赘述。
本申请实施例所提供的热成像温度测量方法，可以在成像半径过小时，提高测温准确度，进一步的，可以对热成像信息进行辐射衰减修正，可以使得所得到的衰减修正后的热成像信息的更接近于待测对象真实的热成像信息，从而可以进一步的提高了测温准确度。
本申请实施例还提供一种热成像温度测量方法，还可以在从待测对象的热成像中提取目标成像区域内各像元的热成像信息之后，对各像元的热成像信息进行大气衰减修正，从而使得各象元的热成像信息更准确。
可选的，可以对目标成像区域内每一像元的热成像信息进行大气衰减修正。
其中，当测温设备为红外测温设备时，由于红外辐射在大气传播的影响因素主要有三个：一是大气中水蒸气、二是大气气体的影响，如红外吸收气体、大气分子、气溶胶的散射等，其中，红外辐射吸收气体包括：二氧化碳、臭氧、甲烷、一氧化碳、一氧化氮、氨气、硫化氢和氧化硫等，由于除二氧化碳外，其他的吸收气体在大气中的含量极其微少，通常可以不考虑其对红外辐射的影响；三是由气象条件(云、雾、霾、雨、雪)造成的衰减。
因此，实际大气透射率为各影响因素的乘积，即：
Figure PCTCN2022097419-appb-000012
Figure PCTCN2022097419-appb-000013
其中，τ a(λ)为光谱透射比，即大气透射率，τ 1(λ)水蒸气的影响，τ 2(λ)为大气气体的影响，τ 3(λ)为气象条件的影响，β λ是测温设备的入射波的波长为λ时，由上述不同因素引起的衰减系数之和，L是大气透过的距离，
Figure PCTCN2022097419-appb-000014
为水蒸气引起的衰减系数，
Figure PCTCN2022097419-appb-000015
为二氧化 碳引起的衰减系数，β s为大气气体(除二氧化碳外)与气溶胶引起的衰减系数，β r为气象条件引起的衰减系数。
进而，可以根据下式对每一象元的热成像信息大气透过率进行修正：
Figure PCTCN2022097419-appb-000016
其中，outTemp1 center为修正后的热成像信息度，T r为每一象元的热成像信息，T u为环境温度，T a为大气温度，τ a为大气透射率，ε为待测对象的发射率，ε a为大气的发射率，α为待测对象的吸收率，n为测温设备对应的设备参数。
若测温设备为HgCdTe(8～14μm)探测器，则上述设备参数n＝4.09。
本申请实施例所提供的热成像温度测量方法，可以在成像半径过小时，提高测温准确度，进一步的，可以在从待测对象的热成像中提取目标成像区域内各像元的热成像信息之后，对各像元的热成像信息进行大气衰减修正，从而使得各象元的热成像信息更准确。
如图10所示，为采用本申请实施例提供的热成像温度测量方法后，所得到的效果示意图，采用本申请实施例提供的热成像温度测量方法分别对150℃、550℃对象进行测温，结果如图11所示，可明显提高测温设备的测温精度，修正前随着对象成像所占像元个数越来越少，测温设备测得的温度信息会发生严重衰减，且当单个像元已经不能完全接收对象的辐射能量，即对象所占像元个数小于N时，温度衰减程度加深，采用本申请实施例提供的热成像温度测量方法，可显著改善这一现象。
可选的，本申请实施例还提高一种热成像温度测量方法，热图像信息为灰度信息，包括步骤A1-A4：
A1：从待测对象的热成像中提取目标成像区域内各像元的灰度信息；其中，目标成像区域为：待测对象的成像所在的区域；
A2：若目标成像区域内像元数量小于指定的像元数量阈值，则基于目标成像区域内目标像元的邻近像元的灰度信息，对目标像元的灰度信息进行补偿，得到补偿后的灰度信息；
可选的，本步骤中，上述基于目标成像区域内目标像元的邻近像元的灰度信息，对目标像元的灰度信息进行补偿，得到补偿后的灰度信息，可以包括步骤步骤一和步骤二：
步骤一：利用目标成像区域内目标像元各邻近像元的目标补偿参数，计算各邻近像元的灰度信息的加权和，得到补偿信息；其中，目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对目标像元的补偿参数；
其中，目标像元的每一邻近像元针对目标像元的补偿参数为：从补偿模板中查找到的该邻近像元针对目标像元的补偿参数；其中，补偿模板用于指示：测温设备中任一像元的邻近像元针对该像元的补偿参数。
可选的，补偿模板中的补偿参数为：在测温设备对点光源的测量状态下，基准像元的邻近像元的灰度信息与基准像元的灰度信息的比值；点光源为：成像占据一个像元的光源； 基准像元为：被点光源的成像占据的像元。
步骤二：计算目标像元的灰度信息与补偿信息之和，作为补偿后的灰度信息。
A3：利用目标成像区域内像元数量，对补偿后的灰度信息进行辐射衰减修正，得到衰减修正后的灰度信息；其中，辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正；
可选的，在一种实现方式中，可以确定与目标成像区域内像元数量对应的成像面积参数，并基于与所确定的成像面积参数对应的目标灰度衰减率，对补偿后的灰度信息进行辐射衰减修正，得到衰减修正后的灰度信息。
其中，与每一成像面积参数对应的灰度衰减率为：在标定对象的成像数量与该成像面积参数对应的情况下，基于测温设备所测的灰度信息与标定对象的实际灰度信息所确定的灰度衰减率。
在一种实现方式中，上述灰度衰减率为标定对象的实际灰度信息与测温设备所测的灰度信息之比，则可以计算补偿后的灰度信息与目标灰度衰减率的比值，作为衰减修正后的灰度信息。
A4：基于预先构建的测温设备的灰度信息与温度信息之间的映射关系，对衰减修正后的灰度信息进行映射，得到待测对象的温度信息。
在得到衰减修正后的灰度信息之后，可以进一步地，基于预先构建的测温设备的灰度信息与温度信息之间的映射关系，将衰减修正后的灰度信息映射为待测对象的温度信息，从而完成对待测对象的温度测量。
本申请实施例所提供的热成像温度测量方法中，由于在目标成像区域内像元数量小于指定的像元数量阈值时，可以基于目标成像区域内目标像元的邻近像元的灰度信息，对目标像元的灰度信息进行补偿，并进一步地对补偿后的灰度信息进行辐射衰减修正，从而可以在成像半径过小时，有效提高测温准确度。
可选的，本申请实施例还提高一种热成像温度测量方法，热图像信息为温度信息，包括步骤B1-B5：
B1：从待测对象的热成像中确定目标成像区域各像元的灰度信息；
B2：针对目标成像区域内的每一像元，基于预先构建的测温设备的灰度信息与温度信息之间的映射关系，对该像元的灰度信息进行映射，得到该像元的温度信息；
B3：若目标成像区域内像元数量小于指定的像元数量阈值，则基于目标成像区域内目标像元的邻近像元的温度信息，对目标像元的温度信息进行补偿，得到补偿后的温度信息；
可选的，本步骤中，上述基于目标成像区域内目标像元的邻近像元的温度信息，对目标像元的温度信息进行补偿，得到补偿后的温度信息，可以包括步骤一和步骤二：
步骤一：利用目标成像区域内目标像元各邻近像元的目标补偿参数，计算各邻近像元的温度信息的加权和，得到补偿信息；其中，目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对目标像元的补偿参数；
其中，目标像元的每一邻近像元针对目标像元的补偿参数为：从补偿模板中查找到的 该邻近像元针对目标像元的补偿参数；其中，补偿模板用于指示：测温设备中任一像元的邻近像元针对该像元的补偿参数。
可选的，补偿模板中的补偿参数为：在测温设备对点光源的测量状态下，基准像元的邻近像元的温度信息与基准像元的温度信息的比值；点光源为：成像占据一个像元的光源；基准像元为：被点光源的成像占据的像元。
步骤二：计算目标像元的温度信息与补偿信息之和，作为补偿后的温度信息。
B4：利用目标成像区域内像元数量，对补偿后的温度信息进行辐射衰减修正，得到衰减修正后的温度信息；其中，辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正；
可选的，在一种实现方式中，可以确定与目标成像区域内像元数量对应的成像面积参数，并基于与所确定的成像面积参数对应的目标温度衰减率，对补偿后的温度信息进行辐射衰减修正，得到衰减修正后的温度信息。
其中，与每一成像面积参数对应的温度衰减率为：在标定对象的成像数量与该成像面积参数对应的情况下，基于测温设备所测的温度信息与标定对象的实际温度信息所确定的衰减率。
在一种实现方式中，上述衰减率为标定对象的实际温度信息与测温设备所测的温度信息之比，则可以计算补偿后的温度信息与目标温度衰减率的比值，作为衰减修正后的温度信息。
B5：将衰减修正后的温度信息，作为所述待测对象的温度信息。
在得到衰减修正后的温度信息之后，可以进一步地，基于预先构建的测温设备的温度信息与温度信息之间的映射关系，将衰减修正后的温度信息映射为待测对象的温度信息，从而完成对待测对象的温度测量。
本申请实施例所提供的热成像温度测量方法中，由于在目标成像区域内像元数量小于指定的像元数量阈值时，可以基于目标成像区域内目标像元的邻近像元的温度信息，对目标像元的温度信息进行补偿，并进一步地对补偿后的温度信息进行辐射衰减修正，从而可以在成像半径过小时，有效提高测温准确度。
如图11所示，本申请实施例还提供了一种热成像温度测量装置，应用于测温设备，装置包括：
热成像信息提取模块1101，用于从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；
热成像信息补偿模块1102，用于若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；
温度确定模块1103，用于基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
可选的，所述热成像信息补偿模块，包括：
补偿信息计算子模块，用于利用所述目标成像区域内目标像元各邻近像元的目标补偿参数，计算所述各邻近像元的热成像信息的加权和，得到补偿信息；其中，所述目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对所述目标像元的补偿参数；
热成像信息补偿子模块，用于计算所述目标像元的热成像信息与所述补偿信息之和，作为补偿后的热成像信息。
可选的，所述目标像元的每一邻近像元针对所述目标像元的补偿参数为：从补偿模板中查找到的该邻近像元针对所述目标像元的补偿参数；
其中，所述补偿模板用于指示：所述测温设备中任一像元的邻近像元针对该像元的补偿参数。
可选的，所述补偿模板中的补偿参数为：在所述测温设备对点光源的测量状态下，基准像元的邻近像元的热成像信息与所述基准像元的热成像信息的比值；所述点光源为：成像占据一个像元的光源；所述基准像元为：被所述点光源的成像占据的像元。
可选的，所述目标像元的邻近像元为：与所述目标像元的像元间距小于预设像元间距的像元。
可选的，所述温度确定模块，包括：
温度修正子模块，用于利用所述目标成像区域内像元数量，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；其中，辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正；
温度确定子模块，用于基于所述衰减修正后的热成像信息，确定所述待测对象的温度信息。
可选的，所述温度修正子模块，包括：
参数确定单元，用于确定与所述目标成像区域内像元数量对应的成像面积参数；
温度修正单元，用于基于与所确定的成像面积参数对应的目标衰减率，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；
其中，与每一成像面积参数对应的衰减率为：在标定对象的成像数量与该成像面积参数对应的情况下，基于所述测温设备所测的热成像信息与所述标定对象的实际热成像信息所确定的衰减率。
可选的，所述温度修正子模块，具体用于基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的正方形的边长，作为与所述目标成像区域内像元数量对应的成像面积参数；或者，基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的圆形的半径，作为与所述目标成像区域内像元数量对应的成像面积参数。
可选的，所述衰减率为所述标定对象的实际热成像信息与所述测温设备所测的热成像信息之比；
所述温度修正单元，具体用于计算所述补偿后的热成像信息与所述目标衰减率的比值，作为衰减修正后的热成像信息。
可选的，所述热成像信息为：灰度信息；
所述温度确定模块，具体用于基于预先构建的所述测温设备的灰度信息与温度信息之 间的映射关系，对所述补偿后的热成像信息进行映射，得到所述待测对象的温度信息。
可选的，所述热成像信息为：温度信息；
所述热成像信息提取模块，具体用于从待测对象的热成像中确定目标成像区域各像元的灰度信息；针对所述目标成像区域内的每一像元，基于预先构建的所述测温设备的灰度信息与温度信息之间的映射关系，对该像元的灰度信息进行映射，得到该像元的温度信息；
所述温度确定模块，具体用于将所述补偿后的热成像信息，作为所述待测对象的温度信息。
本申请实施例所提供的热成像温度测量方法，可以在目标成像区域内像元数量小于指定的像元数量阈值时，基于目标成像区域内目标像元的邻近像元的测量温度，对目标像元的测量温度进行补偿，从而可以提高目标像元的热成像信息的准确性，进而可以在成像半径过小时，提高测温准确度。
本申请实施例还提供了一种电子设备，如图12所示，包括处理器1201、通信接口1202、存储器1203和通信总线1204，其中，处理器1201，通信接口1202，存储器1203通过通信总线1204完成相互间的通信，
存储器1203，用于存放计算机程序；
处理器1201，用于执行存储器1203上所存放的程序时，实现上述热成像温度测量方法步骤。
上述电子设备提到的通信总线可以是外设部件互连标准(Peripheral Component Interconnect，PCI)总线或扩展工业标准结构(Extended Industry Standard Architecture，EISA)总线等。该通信总线可以分为地址总线、数据总线、控制总线等。为便于表示，图中仅用一条粗线表示，但并不表示仅有一根总线或一种类型的总线。
通信接口用于上述电子设备与其他设备之间的通信。
存储器可以包括随机存取存储器(Random Access Memory，RAM)，也可以包括非易失性存储器(Non-Volatile Memory，NVM)，例如至少一个磁盘存储器。可选的，存储器还可以是至少一个位于远离前述处理器的存储装置。
上述的处理器可以是通用处理器，包括中央处理器(Central Processing Unit，CPU)、网络处理器(Network Processor，NP)等；还可以是数字信号处理器(Digital Signal Processing，DSP)、专用集成电路(Application Specific Integrated Circuit，ASIC)、现场可编程门阵列(Field-Programmable Gate Array，FPGA)或者其他可编程逻辑器件、分立门或者晶体管逻辑器件、分立硬件组件。
在本申请提供的又一实施例中，还提供了一种计算机可读存储介质，该计算机可读存储介质内存储有计算机程序，所述计算机程序被处理器执行时实现上述任一热成像温度测量方法的步骤。
在本申请提供的又一实施例中，还提供了一种包含指令的计算机程序产品，当其在计算机上运行时，使得计算机执行上述实施例中任一热成像温度测量方法。
在上述实施例中，可以全部或部分地通过软件、硬件、固件或者其任意组合来实现。当使用软件实现时，可以全部或部分地以计算机程序产品的形式实现。所述计算机程序产 品包括一个或多个计算机指令。在计算机上加载和执行所述计算机程序指令时，全部或部分地产生按照本申请实施例所述的流程或功能。所述计算机可以是通用计算机、专用计算机、计算机网络、或者其他可编程装置。所述计算机指令可以存储在计算机可读存储介质中，或者从一个计算机可读存储介质向另一个计算机可读存储介质传输，例如，所述计算机指令可以从一个网站站点、计算机、服务器或数据中心通过有线(例如同轴电缆、光纤、数字用户线(DSL))或无线(例如红外、无线、微波等)方式向另一个网站站点、计算机、服务器或数据中心进行传输。所述计算机可读存储介质可以是计算机能够存取的任何可用介质或者是包含一个或多个可用介质集成的服务器、数据中心等数据存储设备。所述可用介质可以是磁性介质，(例如，软盘、硬盘、磁带)、光介质(例如，DVD)、或者半导体介质(例如固态硬盘Solid State Disk(SSD))等。
需要说明的是，在本文中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
本说明书中的各个实施例均采用相关的方式描述，各个实施例之间相同相似的部分互相参见即可，每个实施例重点说明的都是与其他实施例的不同之处。尤其，对于装置、设备、系统实施例而言，由于其基本相似于方法实施例，所以描述的比较简单，相关之处参见方法实施例的部分说明即可。
以上所述仅为本申请的较佳实施例，并不用以限制本申请，凡在本申请的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本申请保护的范围之内。

Claims (24)

  1. 一种热成像温度测量方法，应用于测温设备，所述方法包括：
    从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；
    若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；
    基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
  2. 根据权利要求1所述的方法，其中，所述基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息，包括：
    利用所述目标成像区域内目标像元各邻近像元的目标补偿参数，计算所述各邻近像元的热成像信息的加权和，得到补偿信息；其中，所述目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对所述目标像元的补偿参数；
    计算所述目标像元的热成像信息与所述补偿信息之和，作为补偿后的热成像信息。
  3. 根据权利要求2所述的方法，其中，所述目标像元的每一邻近像元针对所述目标像元的补偿参数为：从补偿模板中查找到的该邻近像元针对所述目标像元的补偿参数；
    其中，所述补偿模板用于指示：所述测温设备中任一像元的邻近像元针对该像元的补偿参数。
  4. 根据权利要求3所述的方法，其中，所述补偿模板中的补偿参数为：在所述测温设备对点光源的测量状态下，基准像元的邻近像元的热成像信息与所述基准像元的热成像信息的比值；所述点光源为：成像占据一个像元的光源；所述基准像元为：被所述点光源的成像占据的像元。
  5. 根据权利要求1-4任一项所述的方法，其中，所述目标像元的邻近像元为：与所述目标像元的像元间距小于预设像元间距的像元。
  6. 根据权利要求1-4任一项所述的方法，其中，所述基于所述补偿后的热成像信息，确定所述待测对象的温度信息，包括：
    利用所述目标成像区域内像元数量，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；其中，所述辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正；
    基于所述衰减修正后的热成像信息，确定所述待测对象的温度信息。
  7. 根据权利要求6所述的方法，其中，所述利用所述目标成像区域内像元数量，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息，包括：
    确定与所述目标成像区域内像元数量对应的成像面积参数；
    基于与所确定的成像面积参数对应的目标衰减率，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；
    其中，与每一成像面积参数对应的衰减率为：在标定对象的成像数量与该成像面积参 数对应的情况下，基于所述测温设备所测的热成像信息与所述标定对象的实际热成像信息所确定的衰减率。
  8. 根据权利要求7所述的方法，其中，所述确定与所述目标成像区域内像元数量对应的成像面积参数，包括：
    基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的正方形的边长，作为与所述目标成像区域内像元数量对应的成像面积参数；或者，
    基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的圆形的半径，作为与所述目标成像区域内像元数量对应的成像面积参数。
  9. 根据权利要求7所述的方法，其中，所述衰减率为所述标定对象的实际热成像信息与所述测温设备所测的热成像信息之比；
    所述基于与所确定的成像面积参数对应的目标衰减率，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息，包括：
    计算所述补偿后的热成像信息与所述目标衰减率的比值，作为衰减修正后的热成像信息。
  10. 根据权利要求1-4任一项所述的方法，其中，所述热成像信息为：灰度信息；
    所述基于所述补偿后的热成像信息，确定所述待测对象的温度信息，包括：
    基于预先构建的所述测温设备的灰度信息与温度信息之间的映射关系，对所述补偿后的热成像信息进行映射，得到所述待测对象的温度信息。
  11. 根据权利要求1-4任一项所述的方法，其中，所述热成像信息为：温度信息；
    所述从待测对象的热成像中提取目标成像区域内各像元的热成像信息，包括：
    从待测对象的热成像中确定目标成像区域各像元的灰度信息；
    针对所述目标成像区域内的每一像元，基于预先构建的所述测温设备的灰度信息与温度信息之间的映射关系，对该像元的灰度信息进行映射，得到该像元的温度信息；
    所述基于所述补偿后的热成像信息，确定所述待测对象的温度信息，包括：
    将所述补偿后的热成像信息，作为所述待测对象的温度信息。
  12. 一种热成像温度测量装置，应用于测温设备，所述装置包括：
    热成像信息提取模块，用于从待测对象的热成像中提取目标成像区域内各像元的热成像信息；其中，所述目标成像区域为：所述待测对象的成像所在的区域；
    热成像信息补偿模块，用于若所述目标成像区域内像元数量小于指定的像元数量阈值，则基于所述目标成像区域内目标像元的邻近像元的热成像信息，对所述目标像元的热成像信息进行补偿，得到补偿后的热成像信息；
    温度确定模块，用于基于所述补偿后的热成像信息，确定所述待测对象的温度信息。
  13. 根据权利要求12所述的装置，其中，所述热成像信息补偿模块，包括：
    补偿信息计算子模块，用于利用所述目标成像区域内目标像元各邻近像元的目标补偿参数，计算所述各邻近像元的热成像信息的加权和，得到补偿信息；其中，所述目标像元的每一邻近像元的目标补偿参数为：预设的该邻近像元针对所述目标像元的补偿参数；
    热成像信息补偿子模块，用于计算所述目标像元的热成像信息与所述补偿信息之和， 作为补偿后的热成像信息。
  14. 根据权利要求13所述的装置，其中，所述目标像元的每一邻近像元针对所述目标像元的补偿参数为：从补偿模板中查找到的该邻近像元针对所述目标像元的补偿参数；
    其中，所述补偿模板用于指示：所述测温设备中任一像元的邻近像元针对该像元的补偿参数。
  15. 根据权利要求14所述的装置，其中，所述补偿模板中的补偿参数为：在所述测温设备对点光源的测量状态下，基准像元的邻近像元的热成像信息与所述基准像元的热成像信息的比值；所述点光源为：成像占据一个像元的光源；所述基准像元为：被所述点光源的成像占据的像元。
  16. 根据权利要求12-15任一项所述的装置，其中，所述目标像元的邻近像元为：与所述目标像元的像元间距小于预设像元间距的像元。
  17. 根据权利要求12-15任一项所述的装置，其中，所述温度确定模块，包括：
    温度修正子模块，用于利用所述目标成像区域内像元数量，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；其中，辐射衰减修正为对由成像面积所造成的辐射衰减导致的测量误差的修正；
    温度确定子模块，用于基于所述衰减修正后的热成像信息，确定所述待测对象的温度信息。
  18. 根据权利要求17所述的装置，其中，所述温度修正子模块，包括：
    参数确定单元，用于确定与所述目标成像区域内像元数量对应的成像面积参数；
    温度修正单元，用于基于与所确定的成像面积参数对应的目标衰减率，对所述补偿后的热成像信息进行辐射衰减修正，得到衰减修正后的热成像信息；
    其中，与每一成像面积参数对应的衰减率为：在标定对象的成像数量与该成像面积参数对应的情况下，基于所述测温设备所测的热成像信息与所述标定对象的实际热成像信息所确定的衰减率。
  19. 根据权利要求18所述的装置，其中，所述温度修正子模块，具体用于基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的正方形的边长，作为与所述目标成像区域内像元数量对应的成像面积参数；或者，基于所述目标成像区域内像元数量，计算与所述目标成像区域等面积的圆形的半径，作为与所述目标成像区域内像元数量对应的成像面积参数。
  20. 根据权利要求18所述的装置，其中，所述衰减率为所述标定对象的实际热成像信息与所述测温设备所测的热成像信息之比；
    所述温度修正单元，具体用于计算所述补偿后的热成像信息与所述目标衰减率的比值，作为衰减修正后的热成像信息。
  21. 根据权利要求12-15任一项所述的装置，其中，所述热成像信息为：灰度信息；
    所述温度确定模块，具体用于基于预先构建的所述测温设备的灰度信息与温度信息之间的映射关系，对所述补偿后的热成像信息进行映射，得到所述待测对象的温度信息。
  22. 根据权利要求12-15任一项所述的装置，其中，所述热成像信息为：温度信息；
    所述热成像信息提取模块，具体用于从待测对象的热成像中确定目标成像区域各像元的灰度信息；针对所述目标成像区域内的每一像元，基于预先构建的所述测温设备的灰度信息与温度信息之间的映射关系，对该像元的灰度信息进行映射，得到该像元的温度信息；
    所述温度确定模块，具体用于将所述补偿后的热成像信息，作为所述待测对象的温度信息。
  23. 一种电子设备，包括处理器、通信接口、存储器和通信总线，其中，处理器，通信接口，存储器通过通信总线完成相互间的通信；
    存储器，用于存放计算机程序；
    处理器，用于执行存储器上所存放的程序时，实现权利要求1-11任一所述的方法步骤。
  24. 一种计算机可读存储介质，所述计算机可读存储介质内存储有计算机程序，所述计算机程序被处理器执行时实现权利要求1-11任一项所述的方法步骤。
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