WO2023037888A1 - 配線モジュール - Google Patents
配線モジュール Download PDFInfo
- Publication number
- WO2023037888A1 WO2023037888A1 PCT/JP2022/032061 JP2022032061W WO2023037888A1 WO 2023037888 A1 WO2023037888 A1 WO 2023037888A1 JP 2022032061 W JP2022032061 W JP 2022032061W WO 2023037888 A1 WO2023037888 A1 WO 2023037888A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solder
- wire
- core wire
- land
- relay member
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 85
- 238000005192 partition Methods 0.000 claims description 30
- 238000003860 storage Methods 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 abstract description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 16
- 238000005476 soldering Methods 0.000 description 16
- 238000003780 insertion Methods 0.000 description 11
- 230000037431 insertion Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000004146 energy storage Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000009434 installation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920003002 synthetic resin Polymers 0.000 description 4
- 239000000057 synthetic resin Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000005574 cross-species transmission Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/249—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders specially adapted for aircraft or vehicles, e.g. cars or trains
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/284—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders with incorporated circuit boards, e.g. printed circuit boards [PCB]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/298—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by the wiring of battery packs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/502—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing
- H01M50/507—Interconnectors for connecting terminals of adjacent batteries; Interconnectors for connecting cells outside a battery casing comprising an arrangement of two or more busbars within a container structure, e.g. busbar modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/50—Current conducting connections for cells or batteries
- H01M50/569—Constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Definitions
- the technology disclosed in this specification relates to wiring modules.
- a battery pack used in an electric vehicle, a hybrid vehicle, or the like is electrically connected to a plurality of single cells, a plurality of busbars that connect the electrodes of the plurality of single cells, and the busbars so that the voltage of each single cell can be measured. and a detection module (wiring module) for detection.
- a wiring module includes, for example, a busbar connection terminal connected to a busbar, a wire connection terminal connected to an end of a wire, and a fuse connecting the busbar connection terminal and the wire connection terminal.
- a fuse unit is provided (see Patent Document 1).
- the fuse unit includes a large number of members such as the busbar connection terminals, the wire connection terminals, and the synthetic resin housing that accommodates the fuse. be.
- a circuit board having conductive paths including lands for busbars and lands for electric wires and on which necessary electronic components are mounted is prepared. It is conceivable to connect an electric wire to each land. However, when the wire is directly connected to the land, for example, the wire may be lifted from the land during soldering, and the connection strength may not be ensured.
- a wiring module disclosed by the present specification is a wiring module attached to a plurality of power storage elements having electrode terminals, comprising: an electric wire having a core wire; a wire relay member connected to the core wire by first solder; a circuit board having a conductive path including a bus bar connected to an electrode terminal, a first land electrically connected to the bus bar, and a second land connected to the wire relay member by a second solder; Prepare.
- the connection reliability of electric wires can be improved.
- FIG. 1 is a partially enlarged plan view of the power storage module of Embodiment 1.
- FIG. 2 is a partially enlarged plan view showing a peripheral portion of the circuit board in the wiring module of Embodiment 1.
- FIG. 3 is a partially enlarged perspective view showing a peripheral portion of the circuit board in the wiring module of Embodiment 1.
- FIG. 4 is an enlarged exploded perspective view showing a board installation portion, a circuit board, a busbar relay member, and a wire relay member according to the first embodiment.
- FIG. 5 is a cross-sectional view taken along line AA of FIG. 6 is a cross-sectional view taken along the line BB of FIG. 2.
- FIG. FIG. 7 is a sectional view taken along line CC of FIG.
- FIG. 8 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of Embodiment 2.
- FIG. 9 is a cross-sectional view taken along line DD of FIG. 8.
- FIG. 10 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of Embodiment 3.
- FIG. 11 is a cross-sectional view taken along line EE of FIG. 10.
- FIG. 12 is a partially enlarged perspective view showing a peripheral portion of a wire relay member in the wiring module of Embodiment 4.
- FIG. 13 is a cross-sectional view taken along line FF of FIG. 12.
- a wiring module disclosed in the present specification is a wiring module attached to a plurality of power storage elements having electrode terminals, and includes an electric wire having a core wire and a wire relay member connected to the core wire by a first solder. and a conductive path including a bus bar connected to the electrode terminal, a first land electrically connected to the bus bar, and a second land connected to the wire relay member by a second solder. And prepare.
- the degree of freedom in design for increasing the connection strength is increased, and the wire can be Connection reliability can be improved.
- the wire relay member includes a core wire connection portion on which the core wire is placed, and a partition wall erected from the core wire connection portion, wherein the first Solder may be placed in a space defined by the core wire connecting portion and the partition wall, and the core wire may be embedded in the first solder.
- the first solder is arranged with a certain thickness in the space defined by the core wire connecting portion and the partition wall, and the core wire is embedded in the first solder, thereby ensuring connection strength. can do.
- the first solder and the second solder have compositions different from each other and are arranged in a non-contact state with each other. I don't mind.
- FIG. 1 The power storage module 1 of the present embodiment is a power supply device used as a drive source for an electric vehicle or a hybrid vehicle. As shown in FIG. A wiring module 20 is provided.
- the storage element 10 is, for example, a secondary battery. As shown in FIG. 1, each energy storage element 10 has a flat rectangular parallelepiped shape as a whole and includes two electrode terminals 11A and 11B arranged on one surface. One of the two electrode terminals 11A and 11B is the positive electrode terminal 11A and the other is the negative electrode terminal 11B. A plurality of power storage elements 10 are arranged in a line. Two adjacent energy storage elements 10 are arranged such that the electrode terminals 11A and 11B of different polarities are adjacent to each other, that is, the positive electrode terminal 11A of one energy storage element 10 and the negative electrode terminal 11B of the other energy storage element 10 adjacent thereto. are arranged next to each other.
- the wiring module 20 includes a plurality of electric wires 30, a plurality of busbars 40, a plurality of circuit boards 50, a plurality of rivets 60 for fixing the circuit boards 50 to the busbars 40, and the busbars 40.
- the electric wire 30 includes a core wire 31 and a synthetic resin insulating coating 32 surrounding the core wire 31 .
- the core wire 31 is, for example, a single core wire made of metal and has electrical conductivity. Materials for the core wire 31 include copper, copper alloys, aluminum, aluminum alloys, and the like.
- the insulating coating 32 is stripped to expose the core wire 31.
- the other end of the electric wire 30 is connected to an external ECU (Electronic Control Unit) via a connector, for example.
- the ECU is equipped with a microcomputer, elements, etc., and has functions for detecting the voltage, current, temperature, etc., of each storage element 10 and for performing charge/discharge control of each storage element 10. It has a well-known configuration.
- Bus bar 40 is made of metal and has electrical conductivity. Materials for the bus bar 40 include copper, copper alloys, aluminum, aluminum alloys, stainless steel (SUS), and the like. As shown in FIGS. 1 and 4, the busbar 40 includes a busbar body 41 that connects the positive terminal 11A of one storage element 10 and the negative terminal 11B of another storage element 10 adjacent to this storage element 10, A substrate installation portion 42 is provided which is connected to the busbar main body 41 and to which the circuit substrate 50 is fixed.
- the busbar main body 41 includes a plate-like first electrode connection portion 41A that overlaps one of the electrode terminals 11A and 11B, a plate-like second electrode connection portion 41B that overlaps the other, and a second electrode connection portion 41B.
- a connecting portion 41C connecting the first electrode connecting portion 41A and the second electrode connecting portion 41B is provided.
- the first electrode connection portion 41A and the second electrode connection portion 41B are connected to the electrode terminals 11A and 11B, respectively, by laser welding, for example.
- the board installation part 42 continues to the first electrode connection part 41A and has a board support part 43 that supports the circuit board 50, and a wire holding part that continues to the board support part 43 and holds the wire 30. 45 , and a positioning protrusion 46 extending from the board support portion 43 and positioning the circuit board 50 .
- the board mounting portion 42 is plate-shaped and has a first fixing hole 44 .
- the first fixing hole 44 is a through hole for inserting the rivet 60 .
- the electric wire holding portion 45 has a U shape as a whole, and the electric wire 30 can be received inside the U shape.
- the positioning convex portion 46 is a plate piece extending perpendicularly to the substrate support portion 43 .
- the circuit board 50 includes an insulating plate 51 and conductive paths 52 arranged on one surface of the insulating plate 51, as shown in FIGS.
- the insulating plate 51 is a hard plate made of, for example, a glass cloth-based epoxy resin, and has insulating properties.
- the conductive path 52 is made of a conductive metal such as copper or a copper alloy, and is formed by printed wiring technology.
- a part of the conductive path 52 serves as a first land 53 connected to the busbar 40 via a busbar relay member 70 to be described later, and the other part serves as a second land 54 connected to the electric wire 30 .
- a chip fuse 55 is connected to the conductive path 52 between the first land 53 and the second land 54 .
- Conductive path 52 has two third lands 56 between first land 53 and second land 54, and two terminal portions of chip fuse 55 are soldered to these two third lands 56, respectively. connected by attachment. Most of the conductive paths 52 except for the first land 53, the second land 54 and the two third lands 56 are covered with an insulating film made of synthetic resin.
- the insulating plate 51 has a second fixing hole 57 and a positioning recess 58 .
- the second fixing hole 57 is a through hole for inserting the rivet 60 .
- the positioning recess 58 is a recess recessed from the outer edge of the insulating plate 51 and is capable of receiving the positioning protrusion 46 therein.
- the circuit board 50 is positioned with respect to the board supporting portion 43 by accommodating the positioning convex portion 46 inside the positioning concave portion 58 .
- the rivet 60 is made of metal, and as shown in FIG. 44 and two heads 62A, 62B having an outer diameter larger than the hole diameter of the second fixing hole 57.
- the circuit board 50 is placed over the board support portion 43 , the shaft portion 61 is inserted into the first fixing hole 44 and the second fixing hole 57 , and the two heads 62 A and 62 B are first fixed to the board support portion 43 . It is arranged to sandwich the peripheral portion of the hole 44 and the peripheral portion of the second fixing hole 57 in the circuit board 50 . Thereby, the circuit board 50 is fixed to the board support portion 43 .
- busbar relay member 70 The busbar relay member 70 is a conductive metal plate member, and as shown in FIGS. 72.
- the busbar connection portion 71 is connected to the busbar 40 by welding, for example.
- the land connection portion 72 is connected to the first land 53 by soldering.
- the wire relay member 80 is made of a conductive metal, and as shown in FIG. It is provided with two partition walls 82 and a top wall 83 arranged to face the core wire connecting portion 81 and connecting the two partition walls 82 .
- the two partition walls 82 are arranged facing each other.
- half adjacent to one end of the core wire connection portion 81 is a high wall portion 82A, and the remaining half is a low wall portion 82B that is lower than the high wall portion 82A.
- the ceiling wall 83 bridges between the two high wall portions 82A.
- the core wire 31 exposed from the insulating coating 32 at the end portion of the electric wire 30 is placed on the core wire connection portion 81, and the core wire 31 is attached to the core wire connection portion 81 by soldering. It is connected.
- the solder that connects the core wire 31 to the core wire connecting portion 81 is referred to as first solder S1.
- the first solder S1 is arranged in a space surrounded by the core wire connecting portion 81 and the two partition walls 82 in the wire relay member 80, and the core wire 31 is embedded in the first solder S1.
- the first solder S1 is arranged with a certain thickness between the two partition walls 82, and the core wire 31 is embedded in the first solder S1.
- the wire relay member 80 has a tubular portion surrounded by the core wire connection portion 81, the two high wall portions 82A, and the ceiling wall 83, and the first Solder S1 is filled. Thereby, the core wire 31 is reliably embedded in the first solder S1, and the entire circumference of the core wire 31 is covered with the first solder S1.
- the wire relay member 80 is arranged on the second land 54 in such a manner that the core wire connecting portion 81 is superimposed on the second land 54, and is connected to the second land 54 by soldering.
- the solder that connects the wire connecting portion 81 to the wire relay member 80 to the second land 54 is the second solder S2 having a composition different from that of the first solder S1.
- the core wire 31 is connected to the wire relay member 80 by the first solder S1
- the wire relay member 80 is connected to the second land 54 by the second solder S2. It is connected to the. Since the first solder S1 and the second solder S2 have different compositions, it is preferable that the first solder S1 and the second solder S2 are not mixed with each other, that is, are not in contact with each other. This is to avoid a drop in connection reliability.
- the partition wall 82 also serves to shield the first solder S1 from mixing with the second solder S2.
- the holding member 90 is made of synthetic resin and, as shown in FIG. 1, includes a busbar holding portion 91 that holds a plurality of busbars 40, and a wire routing portion 92 in which the wires 30 are routed. .
- the circuit board 50 is manufactured by printed wiring technology.
- the second solder S2 is applied onto the first land 53, the second land 54, and the third land 56 of the circuit board 50, and the land connection portion 72 of the busbar relay member 70, the wire relay member 80, and the chip A fuse 55 is connected to the first land 53, the second land 54, and the third land 56 by reflow soldering.
- the circuit board 50 to which the wire relay member 80 , the busbar relay member 70 and the chip fuse 55 are connected is placed on the board support portion 43 .
- the circuit board 50 is positioned by accommodating the positioning projections 46 inside the positioning recesses 58 .
- the circuit board 50 is fixed to the board mounting portion 42 by the rivets 60 .
- the rivet 60 before fixing does not have a head portion 62B.
- a head 62B is formed.
- the busbar connection portion 71 is connected to the busbar 40 by welding.
- the busbar 40 and the first land 53 are electrically connected via the busbar relay member 70 .
- the plurality of busbars 40 to which the circuit boards 50 are fixed are set in the busbar holding portions 91 of the holding member 90 respectively.
- the electric wire 30 is wired to the electric wire wiring portion 92 of the holding member 90 , and the core wire 31 exposed at the terminal portion of the electric wire 30 is placed on the core wire connecting portion 81 .
- a portion of the electric wire 30 which is adjacent to the exposed portion of the core wire 31 and is covered with the insulating coating 32 , is inserted inside the electric wire holding portion 45 and held.
- the core wire 31 is connected to the wire relay member 80 by the first solder S1 using, for example, a robot soldering device.
- manufacturing of the wiring module 20 is completed.
- the wiring module 20 is arranged on the plurality of power storage elements 10, and each bus bar 40 and the electrode terminals 11A and 11B are connected by laser welding. Thus, the manufacture of the power storage module 1 is completed.
- the wiring module 20 attached to the plurality of power storage elements 10 having the electrode terminals 11A and 11B is connected to the electric wire 30 having the core wire 31 and the core wire 31 by the first solder S1.
- a circuit board 50 comprising conductive paths 52 including 54;
- the degree of freedom in design for increasing the connection strength. is increased, and the connection reliability of the electric wire 30 can be improved.
- the wire relay member 80 includes a core wire connection portion 81 on which the core wire 31 is placed, and a partition wall 82 erected from the core wire connection portion 81. and the core wire 31 is embedded in the first solder S1.
- the first solder S1 is arranged with a certain thickness in the space defined by the core wire connection portion 81 and the partition wall 82, and the core wire 31 is embedded in the first solder S1. , the connection strength can be ensured.
- first solder S1 and the second solder S2 have compositions different from each other, and are arranged in a non-contact state with each other.
- FIG. 2 differs from the first embodiment in the configuration of the wire relay member 100 .
- the same reference numerals are given to the same configurations as in the first embodiment, and the description thereof is omitted.
- the wire relay member 100 is made of a conductive metal, and includes a rectangular plate-like core wire connection portion 101 that overlaps the second land 54 and a partition wall erected from one side edge of the core wire connection portion 101. 102 , and a ceiling wall 103 extending from the extending end of the partition wall 102 and arranged to face the core wire connecting portion 101 .
- the core wire 31 exposed from the insulating coating 32 at the end of the wire 30 is placed on the core wire connecting portion 101, and this core wire 31 is connected to the wire relay member 100 by the first solder S1.
- the extension length of the ceiling wall 103 is less than half that of the partition wall 102, so that soldering can be easily performed by inserting a soldering iron through the gap between the core wire connecting portion 101 and the ceiling wall 103.
- the first solder S ⁇ b>1 is arranged in a space surrounded by the core wire connection portion 101 , the partition wall 102 and the ceiling wall 103 in the wire relay member 100 .
- the first solder S1 is arranged with a certain thickness, the core wire 31 is embedded in the first solder S1, and connection strength is ensured.
- the wire relay member 100 is arranged on the second land 54 such that the core wire connecting portion 101 is superimposed on the second land 54, and is connected to the second land 54 by the second solder S2. . Since the first solder S1 and the second solder S2 have compositions different from each other, it is preferable that they do not mix with each other and are in a non-contact state.
- the partition wall 102 also serves to shield the first solder S1 from mixing with the second solder S2 at one side edge of the core wire connection portion 101 (the left side edge in FIG. 9). In addition, since the partition wall 102 is not disposed on the other side edge of the core wire connection portion 101, as shown in FIG. It is possible that it will spill over.
- the area adjacent to the other side edge of the core wire connection portion 101 (the side edge where the partition wall 102 is not arranged) is formed on the second land 54. is preferably a region where the second solder S2 is not arranged.
- FIG. 3 differs from the first embodiment in the configuration of the wire relay member 110 .
- the same reference numerals are given to the same configurations as in the first embodiment, and the description thereof is omitted.
- the wire relay member 110 is made of a conductive metal, and includes a rectangular plate-shaped core wire connection portion 111 that overlaps the second land 54 and a partition wall that is erected from one side edge of the core wire connection portion 111. 112 , and a top wall 113 extending from the extending end of the partition wall 112 and arranged to face the core wire connecting portion 111 .
- the core wire 31 exposed from the insulating coating 32 at the end of the wire 30 is placed on the core wire connecting portion 111, and this core wire 31 is connected to the wire relay member 110 by the first solder S1.
- the first solder S ⁇ b>1 is arranged in a space surrounded by the core wire connection portion 111 , the partition wall 112 and the ceiling wall 113 in the wire relay member 110 .
- the first solder S1 is arranged with a certain thickness, and the core wire 31 is embedded in the first solder S1.
- the projection length of the top wall 113 is equal to or slightly shorter than that of the partition wall 82, and more first solder S1 is arranged in the space surrounded by the core wire connection portion 111, the partition wall 112, and the top wall 113. It is designed to be Thereby, the core wire 31 is reliably embedded in the first solder S1, and connection strength is ensured.
- the ceiling wall 113 has a soldering iron insertion hole 114 .
- the soldering iron insertion hole 114 is a through hole for inserting the soldering iron Is. By inserting the soldering iron Is from the soldering iron insertion hole 114, soldering can be easily performed.
- the wire relay member 110 is arranged on the second land 54 such that the core wire connection portion 111 overlaps the second land 54, and is connected to the second land 54 by the second solder S2. . Since the first solder S1 and the second solder S2 have compositions different from each other, it is preferable that they do not mix with each other and are in a non-contact state.
- the partition wall 112 also serves to shield the first solder S1 from mixing with the second solder S2 at one side edge of the core wire connection portion 111 (the left side edge in FIG. 9). In addition, since the partition wall 112 is not arranged on the other side edge of the core wire connection portion 111, as shown in FIG. It is possible that it will spill over.
- an area adjacent to the other side edge of the core wire connection portion 111 (the side edge where the partition wall 112 is not arranged) is formed so that the first solder S1 and the second solder S2 are not mixed. is preferably a region where the second solder S2 is not arranged.
- FIG. 4 differs from the first embodiment in the configuration of the wire relay member 120 .
- the same reference numerals are given to the same configurations as in the first embodiment, and the description thereof is omitted.
- the wire relay member 120 is made of a conductive metal, and includes a rectangular plate-shaped core wire connection portion 121 that is superimposed on the second land 54, and a wire insertion member 120 that is erected from one side edge of the core wire connection portion 121. walls 122;
- the wire insertion wall 122 has a wire insertion hole 123 .
- the wire insertion hole 123 is a through hole through which the wire 30 can be inserted.
- the core wire 31 exposed from the insulating coating 32 at the end portion of the wire 30 is inserted into the wire insertion hole 123 and placed on the core wire connection portion 121, and is connected to the wire relay member 120 by the first solder S1. .
- the first solder S1 rises in a mountain shape on the core wire connection portion 121, and the core wire 31 is embedded in the first solder S1. This ensures connection strength.
- the wire relay member 120 is arranged on the second land 54 such that the core wire connecting portion 121 overlaps the second land 54, and is connected to the second land 54 by the second solder S2. .
- the first solder S1 is arranged only on the core wire connection portion 121 so as to be in a non-contact state with the second solder S2.
- the core wire 31 is a single core wire, but the core wire may be a twisted wire formed by twisting a plurality of strands.
- the circuit board 50 is fixed to the busbars 40 by the rivets 60, but the means for fixing the circuit board to the busbars is not limited to the above embodiment. etc. is acceptable.
- Electricity storage module 10 Electricity storage element 11A: Positive terminal (electrode terminal) 11B: Negative terminal (electrode terminal) 20: Wiring module 30: Electric wire 31: Core wire 32: Insulating coating 40: Bus bar 41: Bus bar main body 41A: First electrode connection part 41B: Second electrode connection part 41C: Connecting part 42: Board installation part 43: Board support part 44: First fixing hole 45: Wire holding part 46: Positioning convex part 50: Circuit board 51: Insulating plate 52: Conductive path 53: First land 54: Second land 55: Chip fuse 56: Third land 57: Third 2 fixing holes 58: positioning recesses 60: rivets 61: shafts 62A, 62B: head 70: busbar relay member 71: busbar connection portion 72: land connection portions 80, 100, 110, 120: wire relay members 81, 101, 111, 121: core wire mounting portions 82, 102, 112: partition wall 82A: high wall portion 82B: low wall portions 83, 103, 113: top
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Battery Mounting, Suspending (AREA)
- Connection Of Batteries Or Terminals (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
(1)本明細書によって開示される配線モジュールは、電極端子を有する複数の蓄電素子に取り付けられる配線モジュールであって、芯線を備える電線と、前記芯線に第1半田により接続される電線中継部材と、前記電極端子に接続されるバスバーと、前記バスバーに電気的に接続される第1ランドと、前記電線中継部材に第2半田により接続される第2ランドとを含む導電路を備える回路基板と、を備える。
本明細書によって開示される技術の具体例を、以下に図面を参照しつつ説明する。なお、本発明はこれらの例示に限定されるものではなく、特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。
実施形態1を、図1から図7を参照しつつ説明する。本実施形態の蓄電モジュール1は、電気自動車やハイブリット車用の駆動源として使用される電源装置であって、図1に示すように、複数の蓄電素子10と、この蓄電素子10に接続される配線モジュール20とを備えている。
蓄電素子10は、例えば、二次電池である。各蓄電素子10は、図1に示すように、全体として扁平な直方体状であって、一面に配置された2つの電極端子11A、11Bを備えている。2つの電極端子11A、11Bのうち一方は正極端子11Aであり、他方は負極端子11Bである。複数の蓄電素子10は、一列に並べられている。隣り合う2つの蓄電素子10は、異なる極性の電極端子11A、11Bが互いに隣り合うように、つまり、一の蓄電素子10の正極端子11Aと、これと隣接する他の蓄電素子10の負極端子11Bとが互いに隣り合うように並べられている。
図1に示すように、配線モジュール20は、複数の電線30と、複数のバスバー40と、複数の回路基板50と、回路基板50をバスバー40にそれぞれ固定する複数のリベット60と、バスバー40と回路基板50とをそれぞれ電気的に接続する複数のバスバー中継部材70と、回路基板50と電線30とをそれぞれ電気的に接続する複数の電線中継部材80と、これらの部材を保持する保持部材90と、を備えている。
電線30は、図2および図3に示すように、芯線31と、芯線31の外周を包囲する合成樹脂製の絶縁被覆32とを備える。芯線31は、例えば、金属製の単芯線であって、導電性を有する。芯線31の材質としては、銅、銅合金、アルミニウム、アルミニウム合金等が挙げられる。電線30の一端部においては、絶縁被覆32が皮剥きされて芯線31が露出されている。電線30の他端は、例えば、コネクタを介して外部のECU(Electronic Control Unit)に接続されている。ECUは、マイクロコンピュータ、素子等が搭載されたものであって、各蓄電素子10の電圧、電流、温度等の検知や、各蓄電素子10の充放電制御コントロール等を行うための機能を備えた周知の構成のものである。
バスバー40は、金属製であって、導電性を有する。バスバー40の材質としては、銅、銅合金、アルミニウム、アルミニウム合金、ステンレス鋼(SUS)等が挙げられる。バスバー40は、図1および図4に示すように、一の蓄電素子10の正極端子11Aと、この蓄電素子10と隣り合う他の蓄電素子10の負極端子11Bとを接続するバスバー本体41と、バスバー本体41に連なり、回路基板50が固定される基板配設部42とを備えている。
回路基板50は、図2、図3および図4に示すように、絶縁板51と、絶縁板51の一面に配された導電路52とを備える。絶縁板51は、例えばガラス布基材エポキシ樹脂により構成された硬質の板であって、絶縁性を有している。導電路52は、例えば導電性を有する銅または銅合金等の金属からなり、プリント配線技術によって形成されている。導電路52の一部は、後述するバスバー中継部材70を介してバスバー40と接続される第1ランド53となっており、他の一部は、電線30と接続される第2ランド54となっている。導電路52には、第1ランド53と第2ランド54との間に、チップヒューズ55が接続されている。導電路52は、第1ランド53と第2ランド54との間に2つの第3ランド56を有しており、これら2つの第3ランド56に、チップヒューズ55の2つの端子部がそれぞれ半田付けにより接続されている。導電路52のうち、第1ランド53、第2ランド54、および2つの第3ランド56を除く大部分は、合成樹脂製の絶縁性フィルムによって覆われている。
リベット60は、金属製であって、図5に示すように、第1固定孔44および第2固定孔57に挿入される軸部61と、軸部61の両端に形成され、第1固定孔44及び第2固定孔57の孔径よりも大きな外径を有する2つの頭部62A、62Bと、を備える。回路基板50が基板支持部43に重なって配され、軸部61が第1固定孔44および第2固定孔57に挿入され、2つの頭部62A、62Bが、基板支持部43における第1固定孔44の周辺部分と、回路基板50における第2固定孔57の周辺部分とを挟んで配される。これにより、回路基板50が基板支持部43に固定される。
バスバー中継部材70は、導電性を有する金属製の板材であって、図2、図3および図4に示すように、一端部がバスバー接続部71となっており、他端部がランド接続部72となっている。バスバー接続部71は、例えば溶接によりバスバー40に接続されている。ランド接続部72は、第1ランド53に、半田付けによって接続されている。
電線中継部材80は、導電性を有する金属製であって、図4に示すように、長方形の板状の芯線接続部81と、芯線接続部81の平行な2つの側縁から立設された2つの区画壁82と、芯線接続部81と対向して配され、2つの区画壁82を繋ぐ天壁83とを備えている。2つの区画壁82は、互いに対向して配されている。各区画壁82において、芯線接続部81の一端に隣接する半分が高壁部82Aとなっており、残りの半分が、高壁部82Aよりも低背の低壁部82Bとなっている。天壁83は、2つの高壁部82Aの間に橋渡されている。
保持部材90は、合成樹脂製であって、図1に示すように、複数のバスバー40をそれぞれ保持するバスバー保持部91と、電線30が配索される電線配索部92とを備えている。
続いて、上記の構成の蓄電モジュール1を製造する方法の一例を説明する。
以上のように本実施形態によれば、電極端子11A、11Bを有する複数の蓄電素子10に取り付けられる配線モジュール20は、芯線31を備える電線30と、芯線31に第1半田S1により接続される電線中継部材80と、電極端子11A、11Bに接続されるバスバー40と、バスバー40に電気的に接続される第1ランド53と、電線中継部材80に第2半田S2により接続される第2ランド54とを含む導電路52を備える回路基板50と、を備える。
次に、実施形態2を図8および図9を参照しつつ説明する。本実施形態は、電線中継部材100の構成が実施形態1と異なる。本実施形態において、実施形態1と同様の構成には同一の符号を付して説明を省略する。
次に、実施形態3を図10および図11を参照しつつ説明する。本実施形態は、電線中継部材110の構成が実施形態1と異なる。本実施形態において、実施形態1と同様の構成には同一の符号を付して説明を省略する。
次に、実施形態4を図12および図13を参照しつつ説明する。本実施形態は、電線中継部材120の構成が実施形態1と異なる。本実施形態において、実施形態1と同様の構成には同一の符号を付して説明を省略する。
(1)上記実施形態では、芯線31が単芯線であったが、芯線が、複数の素線が撚り合されてなる撚り線であっても構わない。
(2)上記実施形態では、回路基板50がバスバー40に対してリベット60により固定されていたが、回路基板をバスバーに固定する手段は上記実施形態の限りではなく、例えば、ねじや、接着剤等であっても構わない。
10:蓄電素子
11A:正極端子(電極端子)
11B:負極端子(電極端子)
20:配線モジュール
30:電線
31:芯線
32:絶縁被覆
40:バスバー
41:バスバー本体
41A:第1電極接続部
41B:第2電極接続部
41C:連結部
42:基板配設部
43:基板支持部
44:第1固定孔
45:電線保持部
46:位置決め凸部
50:回路基板
51:絶縁板
52:導電路
53:第1ランド
54:第2ランド
55:チップヒューズ
56:第3ランド
57:第2固定孔
58:位置決め凹部
60:リベット
61:軸部
62A、62B:頭部
70:バスバー中継部材
71:バスバー接続部
72:ランド接続部
80、100、110、120:電線中継部材
81、101、111、121:芯線載置部
82、102、112:区画壁
82A:高壁部
82B:低壁部
83、103、113:天壁
90:保持部材
91:バスバー保持部
92:電線配索部
114:半田ごて挿入孔
122:電線挿通壁
123:電線挿通孔
Is:半田ごて
S1:第1半田
S2:第2半田
Claims (3)
- 電極端子を有する複数の蓄電素子に取り付けられる配線モジュールであって、
芯線を備える電線と、
前記芯線に第1半田により接続される電線中継部材と、
前記電極端子に接続されるバスバーと、
前記バスバーに電気的に接続される第1ランドと、前記電線中継部材に第2半田により接続される第2ランドとを含む導電路を備える回路基板と、を備える、配線モジュール。 - 前記電線中継部材が、前記芯線が載置される芯線接続部と、前記芯線接続部から立設される区画壁とを備え、
前記第1半田が前記芯線接続部と前記区画壁とで区画される空間内に配置されており、
前記芯線が前記第1半田に埋設されている、請求項1に記載の配線モジュール。 - 前記第1半田と前記第2半田とが互いに異なる組成を有しており、かつ、互いに非接触の状態で配されている、請求項1または請求項2に記載の配線モジュール。
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11120988A (ja) * | 1997-10-13 | 1999-04-30 | Toyota Motor Corp | バッテリーホルダ用接続プレート |
KR20170131899A (ko) * | 2016-05-23 | 2017-12-01 | 한국단자공업 주식회사 | 버스바 조립체 |
JP2018097987A (ja) * | 2016-12-09 | 2018-06-21 | 矢崎総業株式会社 | 導体の接続構造および導電モジュール |
WO2021124814A1 (ja) * | 2019-12-16 | 2021-06-24 | 株式会社オートネットワーク技術研究所 | 配線モジュール、および、蓄電モジュール |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11120988A (ja) * | 1997-10-13 | 1999-04-30 | Toyota Motor Corp | バッテリーホルダ用接続プレート |
KR20170131899A (ko) * | 2016-05-23 | 2017-12-01 | 한국단자공업 주식회사 | 버스바 조립체 |
JP2018097987A (ja) * | 2016-12-09 | 2018-06-21 | 矢崎総業株式会社 | 導体の接続構造および導電モジュール |
WO2021124814A1 (ja) * | 2019-12-16 | 2021-06-24 | 株式会社オートネットワーク技術研究所 | 配線モジュール、および、蓄電モジュール |
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