WO2023035574A1 - Dispositif de dissipation de chaleur à base de caloduc en boucle - Google Patents

Dispositif de dissipation de chaleur à base de caloduc en boucle Download PDF

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Publication number
WO2023035574A1
WO2023035574A1 PCT/CN2022/081045 CN2022081045W WO2023035574A1 WO 2023035574 A1 WO2023035574 A1 WO 2023035574A1 CN 2022081045 W CN2022081045 W CN 2022081045W WO 2023035574 A1 WO2023035574 A1 WO 2023035574A1
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WO
WIPO (PCT)
Prior art keywords
heat
heat sink
heat dissipation
pipe sections
capillary pump
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Application number
PCT/CN2022/081045
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English (en)
Chinese (zh)
Inventor
李碧莹
孙振
徐青松
李帅
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中兴智能科技南京有限公司
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Publication of WO2023035574A1 publication Critical patent/WO2023035574A1/fr

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Definitions

  • the embodiments of the present application relate to the technical field of heat management, and in particular to a heat dissipation device based on a loop heat pipe.
  • An embodiment of the present application provides a heat dissipation device based on a loop heat pipe, including a capillary pump, a vapor chamber, a heat sink, N evaporation pipe sections and N condensation pipe sections, the capillary pump is arranged on the vapor chamber, The N evaporating pipe sections are arranged on the uniform temperature plate, the N condensing pipe sections are arranged on the heat sink, and the N evaporating pipe sections and the N condensing pipe sections are alternately connected end to end to form a flow A pipeline, the two ends of the flow pipeline communicate with the inlet of the capillary pump and the outlet of the capillary pump respectively, and the N is greater than 1.
  • Figure 1a is a schematic structural diagram of the vapor chamber used in heat dissipation scenario 1;
  • Figure 1b is a schematic structural diagram of heat pipes lapped with vapor chambers used in heat dissipation scenario 2;
  • Fig. 1c is a schematic structural diagram of the loop heat pipe used in heat dissipation scenario 3;
  • FIG. 2 is a schematic structural diagram of a heat dissipation device based on a loop heat pipe according to an embodiment of the present application
  • Fig. 3 is a front structural schematic diagram of the heat dissipation device shown in Fig. 2;
  • FIG. 4 is another schematic structural view of a heat dissipation device provided according to an embodiment of the present application.
  • Fig. 5 is a front structural schematic diagram of the heat dissipation device shown in Fig. 4;
  • FIG. 6 is another structural schematic diagram of a heat dissipation device provided according to an embodiment of the present application.
  • Fig. 7 is a front structural schematic diagram of the heat dissipation device shown in Fig. 6;
  • Fig. 8 is a schematic structural diagram of a bellows provided according to an embodiment of the present application.
  • FIG. 9 is a schematic structural view of a heat dissipation device provided according to an embodiment of the present application when it includes two flow pipelines.
  • Figure 1a shows the structure of the vapor chamber used in heat dissipation scenario 1.
  • the vapor chamber can efficiently expand heat through the phase change process of the working fluid in the inner cavity, and has low thermal resistance and high heat flux carrying capacity ability, but its disadvantages are:
  • Figure 1b shows the structure of heat pipes overlapping vapor chambers used in heat dissipation scenario 2.
  • Lapping heat pipes between chambers can reduce the size of a single chamber and share heat through several heat pipes, but its disadvantages are;
  • Figure 1c shows the structure of the loop heat pipe used in heat dissipation scenario 3.
  • the working fluid evaporates in the evaporator, then condenses through the condenser tube, and then flows back to the evaporator for heat transfer.
  • the capillary core of the evaporator can provide greater capillary force to overcome gravity and circuit pressure loss, the distance between the heat source and the cold end can be longer.
  • the loop heat pipe is directly used, and the evaporation and heat absorption process is only carried out in the evaporator, and there are also some problems:
  • a heat dissipation device based on a loop heat pipe provided in the embodiment of the present application is shown in Figure 2 and Figure 3.
  • Pipe section 150, capillary pump 110 is arranged on the uniform temperature plate 120
  • N evaporation pipe sections 140 are arranged on the uniform temperature plate 120
  • N condensation pipe sections 150 are arranged on the heat sink 130
  • N evaporation pipe sections 140 and N condensation pipe sections 150 The end-to-end connections are alternated in turn to form a flow pipeline 160 , and the two ends of the flow pipeline 160 are respectively connected with the inlet 111 of the capillary pump 110 and the outlet 112 of the capillary pump 110 , where N is greater than 1.
  • the heat dissipation device In the heat dissipation device provided in the embodiment of the present application, after the heat of the heat source is diffused through the vapor chamber 120, the heat is transferred by the loop heat pipe, that is, the heat of the heat source device on the vapor chamber 120 will be diffused on the vapor chamber 120, and at the same time, the The working fluid in the capillary pump 110 evaporates, and after evaporation, the working fluid enters the condensation pipe section 150 provided on the heat sink 130 through the evaporation pipe section 140. One section of evaporating pipe section 140 starts the next evaporation process.
  • the vapor chamber 120 here can improve the heat flux carrying capacity of the heat sink, and the capillary suction of the capillary pump 110 can overcome gravity and pressure loss to provide circulating driving force for the working fluid, thus taking into account the gravity resistance of the heat sink.
  • the flow pipeline 160 reciprocates between the hot zone (that is, the area where the vapor chamber 120 is located) and the cold zone (that is, the area where the heat sink 130 is located), so that the working fluid undergoes multiple rounds of evaporation heat absorption and condensation heat release, realizing The uniform temperature heat transfer between the hot zone and the cold zone improves the heat dissipation efficiency of the heat sink through multiple cycles of heat release of the working fluid between the hot zone and the cold zone.
  • the vapor chamber 120 can be selected from copper VC (Vapor Chamber, vacuum cavity vapor chamber), aluminum VC or stainless steel VC, and can also use flat heat pipes, micro-channel flat heat pipes or micro-channel cold plates with high equivalent heat conduction. High-performance thermal parts instead, the vapor chamber 120 can convert the high heat flux heat input of the heat source into a low heat flux, thereby reducing the burden of heat flow resistance when the capillary pump 110 is in direct contact with the heat source, and at the same time, the heat of the heat source on the vapor chamber 120 It will evenly diffuse to the entire plane of the vapor chamber 120, and provide enough heat collecting area for the multiple evaporation tube sections 140 set on the vapor chamber 120, so that the evaporation effect of the multiple evaporator tube sections 140 set on the vapor chamber 120 can be obtained. fully use.
  • the capillary pump 110 here can provide power for the circulation of the working medium in the flow pipeline 160, and the power is provided by the capillary force of the capillary core in the capillary pump 110.
  • the capillary core is usually a gas-liquid separation design. Under the action of capillary force, no external drive is required, and the shape of the evaporating pipe section 140 and the condensing pipe section 150 can be designed according to the layout requirements to adapt to different heat dissipation occasions, so that the heat dissipation device has high flexibility in the actual layout.
  • the capillary pump 110 here can be a cylindrical capillary pump 110 or a flat capillary pump 110. The flat capillary pump 110 shown in FIG. The heat conduction efficiency between them is higher.
  • the capillary pump 110 is located on the vapor chamber 120 where it is in contact with the heat source device. After the capillary pump 110 absorbs the heat emitted by the heat source device, the internal liquid working medium begins to evaporate into a gaseous state. Directional outflow, first passes through a section of evaporation pipe section 140 connected with the outlet 112 of the capillary pump 110, further absorbs the heat on the vapor chamber 120 and fully vaporizes, and then enters into the condensation pipe section 150, releases heat after condensation in the low temperature area and becomes liquid, The released heat is transferred to the heat sink 130, and the liquid working fluid returns to the evaporation tube section 140 on the vapor chamber 120 to start the next evaporation process, and so on, until the liquid working fluid in the last condensation tube section 150 is The inlet 111 of the capillary pump 110 returns to the capillary pump 110, and continues to absorb heat and evaporate to start another cycle.
  • the number of reciprocations of the flow pipeline 160 between the vapor chamber 120 and the heat sink 130 is theoretically unlimited, except that the capillary force of the capillary pump 110 can provide power for the flow of the working fluid in the flow pipeline 160.
  • the evaporation process in each evaporation pipe segment 140 can also provide power for the flow of working fluid. Therefore, the flow pipeline 160 can be determined according to the specific heat transfer requirements and layout, that is, the number of evaporating pipe sections 140, the number of condensing pipe sections 150, and the form of the evaporating pipe sections 140 and the form of the condensing pipe sections 150 can be determined according to the specific heat transfer requirements of the heat sink. Depends on needs and layout.
  • the shape of the evaporation pipe section 140 and the shape of the condensation pipe section 150 are both U-shaped, that is, The working fluid enters the condensation pipe section 150 after a change of direction in the evaporation pipe section 140 , and enters the evaporation pipe section 140 after a change of direction in the condensation pipe section 150 .
  • each evaporating pipe section 140 may include two first straight sections and a first middle section connecting the two first straight sections
  • each condensing pipe section 150 may include two second straight sections and connect two The second middle section of the second straight section, the first straight section of each evaporating tube section 140 and the second straight section of each condensing tube section 150 extend along the same direction.
  • each evaporating pipe section 140 and each condensing pipe section 150 are equally divided into three parts, and the flow route of the gaseous working medium in each evaporating pipe section 140 is: the first first straight line section, the first middle section , the second first straight line segment; correspondingly, the flow route of the liquid working medium in each condensing tube section 150 is: the first second straight line segment, the second middle segment, and the second second straight line segment.
  • the working medium can flow toward the condensation pipe section 150 arranged on the heat sink 130 after evaporation in the evaporation pipe section 140 , and after condensation occurs in the condensation pipe section 150 , it returns to the evaporation pipe section 140 arranged on the vapor chamber 120 through a change of direction.
  • the first straight section of the evaporating pipe section 140 can be butted together with the second straight section of the condensing pipe section 150, so that during the flow of the working fluid in the evaporating pipe section 140 and the condensing pipe section 150, the number of direction changes is less, which can reduce the working time.
  • the kinetic energy loss of the substance in the flow pipeline 160 is reduced, that is, the thermal resistance of the flow pipeline 160 is reduced, so that the working fluid in the flow pipeline 160 can flow smoothly, thereby ensuring the smooth progress of the heat transfer process.
  • the distance between two adjacent first straight line segments can be made equal, so that the first straight line segments of the plurality of evaporator tube segments 140 are spaced at the same interval Uniformly distributed on the vapor chamber 120 , the working medium can take away the heat from the vapor chamber 120 during each first straight line segment flowing, thereby taking away the heat on the vapor chamber 120 evenly.
  • the distance between two adjacent second straight sections can be made equal, like this, the second straight section of a plurality of condensation pipe sections 150 uses the same
  • the spacing is evenly distributed on the heat sink 130 , and the working medium can release heat evenly to the heat sink 130 during the flow of each second straight line segment.
  • the evaporating pipe section 140 and the condensing pipe section 150 can also be designed in other shapes, such as W-shaped or wave-shaped, according to the layout of the heat dissipation space.
  • the heat sink 130 can take different forms according to specific heat dissipation requirements.
  • the heat sink 130 can be a vapor chamber.
  • the heat vapor chamber and the above-mentioned vapor chamber 120 belong to two names of the same component.
  • the heat sink 130 is a vapor chamber
  • the heat sink 130 The vapor chamber 120 and the vapor chamber 120 are located on the same plane and are spaced apart from each other.
  • a plurality of condensation pipe sections 150 are attached to the surface of the heat sink 130 . At this time, through the two-phase change of the working fluid in the cavity of the vapor chamber (that is, the mutual transition between the liquid state and the gas state), the heat released by each condensation pipe section 150 can be better conducted.
  • a plurality of condensing pipe sections 150 can be embedded in the heat sink 130 .
  • the heat sink 130 here can be a metal plate with an inner cavity, or a plate made of a material with better thermal conductivity, such as a plate made of graphite.
  • the cooling element 130 and the vapor chamber 120 are also located on the same plane and arranged at intervals from each other, and a plurality of condensing pipe sections 150 are arranged in the inner cavity. In this way, the contact area between each condensation pipe section 150 and the heat sink 130 can be increased, thereby improving the heat conduction efficiency between the two.
  • fins may be provided on the heat sink 130 for forced air cooling.
  • the cooling element 130 can also be formed by a plurality of cooling fins 131 arranged parallel to each other and spaced on a plurality of condensation pipe sections 150 , and the working medium is released in the condensation pipe section 150 The heat is directly transferred to the heat sink. Although the total contact area between the two is reduced, the heat transfer per unit area may be limited, but it can also play the role of heat transfer.
  • the vapor chamber, the metal plate with a cavity, and the plurality of parallel and spaced heat sinks mentioned here can be selected according to the specific application requirements of the heat sink.
  • the heat dissipation element 130 adopts a vapor chamber or a metal plate with a cavity
  • the heat dissipation element 130 and the vapor chamber 120 are arranged at intervals, and the plurality of evaporation pipe sections 140 and the plurality of condensation pipe sections 150 of the flow pipeline 160 are respectively installed in different places.
  • bellows 170 can be used to realize the communication between the evaporating pipe sections 140 and the condensing pipe sections 150, and the bellows 170 is arranged on the evaporator Between the pipe section 140 and the condenser pipe section 150, the corrugated structure of the corrugated pipe 170 can form a soft connection floating between the evaporation pipe section 140 and the condenser pipe section 150, and the problem of eccentric stress can be avoided.
  • the evaporating pipe section 140 and the condensing pipe section 150 can also be in the form of corrugated pipes. In this way, when the evaporating pipe section 140 is connected to the condensing pipe section 150, the purpose of forming a soft connection floating between the evaporating pipe section 140 and the condensing pipe section 150 can also be achieved.
  • the cooling device can arrange a plurality of flow pipelines 160 so that the multiple flow pipelines 160 can run simultaneously.
  • the length reduces the instability of the working medium when it circulates in the longer flow pipeline 160 .
  • the cooling device includes two flow lines 160, the two flow lines 160 are arranged symmetrically with respect to the capillary pump 110, and one end of one of the flow lines 160 communicates with one of the inlets 111 of the capillary pump 110, The other end communicates with one of the outlets 112 of the capillary pump 110, one end of the other flow line 160 communicates with the other inlet 111 of the capillary pump 110, and the other end communicates with the other outlet 112 of the capillary pump 110, thereby forming two flows
  • the pipelines 160 carry out heat transfer at the same time without interfering with each other.
  • the capillary pump 110 can be The internal structure is optimized.
  • the outlet 112 of the capillary pump 110 can be set away from the heat sink 130 , and the inlet 111 of the capillary pump 110 can be set toward the heat sink.
  • the working fluid in the capillary pump 110 flows out from the outlet 112, it will be fully vaporized in the evaporation pipe section 140 on the vapor chamber 120, and then enter the condensation pipe section 150 on the heat sink 130.
  • the condensing pipe section 150 returns to the length of the pipeline between the inlet 111 of the capillary pump 110 to ensure that the liquid working medium returns to the inlet 111 of the capillary pump 110 normally.
  • the heat dissipation device provided by the embodiment of the present application can not only be applied to the scene of long-distance thermal migration, but also can be applied to the scene of heat dissipation in a vertical state, especially when the heat sink (heat dissipation device) is located at the heat source
  • the anti-gravity scene under the gravity of the device, and the heat dissipation device provided by the embodiment of the present application is not limited to the heat dissipation in communication products, automobiles, consumer electronics and other fields.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

Des modes de réalisation de la présente demande concernent le domaine technique de la gestion de la chaleur et divulguent un dispositif de dissipation de chaleur à base de caloduc en boucle. Le dispositif de dissipation de chaleur comprend une pompe capillaire (110), une chambre de vapeur (120), un élément de dissipation de chaleur (130), N sections de tuyau d'évaporation (140) et N sections de tuyau de condensation (150). La pompe capillaire (110) est disposée sur la chambre de vapeur (120). Les N sections de tuyau d'évaporation (140) sont disposées sur la chambre de vapeur (120). Les N sections de tuyau de condensation (150) sont disposées sur l'élément de dissipation de chaleur (130). Les N sections de tuyau d'évaporation (140) et les N sections de tuyau de condensation (150) communiquent en alternance bout à bout en séquence de manière à former un tuyau d'écoulement (160) et deux extrémités du tuyau d'écoulement (160) communiquent avec une entrée (111) de la pompe capillaire (110) et une sortie (112) de la pompe capillaire (110), respectivement, N étant supérieur à 1.
PCT/CN2022/081045 2021-09-08 2022-03-15 Dispositif de dissipation de chaleur à base de caloduc en boucle WO2023035574A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111050611.3A CN115773681A (zh) 2021-09-08 2021-09-08 基于环路热管的散热装置
CN202111050611.3 2021-09-08

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WO2023035574A1 true WO2023035574A1 (fr) 2023-03-16

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117545226A (zh) * 2023-04-27 2024-02-09 荣耀终端有限公司 均热板和电子设备

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131306A (zh) * 2006-08-23 2008-02-27 富准精密工业(深圳)有限公司 脉动式热管
US20080073066A1 (en) * 2006-09-21 2008-03-27 Foxconn Technology Co., Ltd. Pulsating heat pipe with flexible artery mesh
CN101196382A (zh) * 2007-12-25 2008-06-11 海蜚尔能源科技（北京）有限公司 热能再生设备
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
CN102628655A (zh) * 2012-03-22 2012-08-08 中国科学院工程热物理研究所 一种脉动热管扩热板及其制作方法
CN102691999A (zh) * 2012-05-11 2012-09-26 南昌大学 一种用于大功率led散热的板式脉动热管
CN202630760U (zh) * 2012-05-14 2012-12-26 南昌大学 Led散热板式脉动热管

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101131306A (zh) * 2006-08-23 2008-02-27 富准精密工业(深圳)有限公司 脉动式热管
US20080073066A1 (en) * 2006-09-21 2008-03-27 Foxconn Technology Co., Ltd. Pulsating heat pipe with flexible artery mesh
CN101196382A (zh) * 2007-12-25 2008-06-11 海蜚尔能源科技（北京）有限公司 热能再生设备
US20110067843A1 (en) * 2008-11-14 2011-03-24 Vasiliev Jr Leonid Heat exchange device made of polymeric material
CN102628655A (zh) * 2012-03-22 2012-08-08 中国科学院工程热物理研究所 一种脉动热管扩热板及其制作方法
CN102691999A (zh) * 2012-05-11 2012-09-26 南昌大学 一种用于大功率led散热的板式脉动热管
CN202630760U (zh) * 2012-05-14 2012-12-26 南昌大学 Led散热板式脉动热管

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117545226A (zh) * 2023-04-27 2024-02-09 荣耀终端有限公司 均热板和电子设备

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