WO2023035572A1 - Heat-dissipation structure and communication device - Google Patents

Heat-dissipation structure and communication device Download PDF

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Publication number
WO2023035572A1
WO2023035572A1 PCT/CN2022/080744 CN2022080744W WO2023035572A1 WO 2023035572 A1 WO2023035572 A1 WO 2023035572A1 CN 2022080744 W CN2022080744 W CN 2022080744W WO 2023035572 A1 WO2023035572 A1 WO 2023035572A1
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Prior art keywords
module
heat dissipation
channel
plug
baffle
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PCT/CN2022/080744
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French (fr)
Chinese (zh)
Inventor
李明
甘海峰
徐向辉
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中兴通讯股份有限公司
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Publication of WO2023035572A1 publication Critical patent/WO2023035572A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the embodiments of the present application relate to but are not limited to the field of heat dissipation technology, and in particular, relate to a heat dissipation structure and communication equipment.
  • the heat dissipation structures commonly used for communication equipment mainly include “I” type, “L” type, “Z” type and Type air duct structure, among them, “I”, “L” and “Z” type air ducts have simple structures, and are often used in communication equipment with simple structures and only one side of the plug-in module; and
  • the structure of the type air duct is relatively complicated, and it can be applied to communication equipment with front-plug modules and rear-plug modules.
  • the current Type air duct structure often requires a separate air inlet channel, which will reduce the internal space utilization of communication equipment.
  • Embodiments of the present application provide a heat dissipation architecture and a communication device.
  • the embodiment of the present application provides a heat dissipation structure, which is provided with a first installation state.
  • the heat dissipation structure includes: a housing, which is provided with a hollow baffle, The hollow baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module and the hollow The holes are connected; the rear plug-in module is located on the other side of the hollow baffle, the rear plug-in module communicates with the hollow hole, a first channel is provided between the rear plug-in module and the housing, and the The first passage communicates with the rear plug-in module, and the first passage is provided with a first air outlet; a first air exhaust device is installed on the housing, and is used to make air flow through the first through hole, The first front module, the hollow hole, the rear module, the first channel and the first air outlet.
  • the embodiment of the present application further provides a communication device, including the heat dissipation structure described in the first aspect above.
  • Figure 1 is a schematic structural view of an "I"-shaped air duct provided by an embodiment of the present application
  • Figure 2 is a schematic structural view of an "L"-shaped air duct provided by an embodiment of the present application
  • Fig. 3 is a schematic structural view of a "Z"-shaped air duct provided by an embodiment of the present application.
  • Figure 4 is provided by an embodiment of the present application Schematic diagram of the structure of the air duct
  • FIG. 5 is a front-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application.
  • FIG. 6 is a back-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application.
  • Fig. 7 is a side view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the second installation state;
  • Fig. 8 is a top view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the second installation state;
  • Fig. 9 is a side view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the first installation state;
  • Fig. 10 is a top view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the first installation state;
  • Fig. 11 is a schematic structural diagram of a first front-plug module and a second front-plug module provided by an embodiment of the present application;
  • Fig. 12 is a schematic structural diagram of a rear plug-in module provided by an embodiment of the present application.
  • Fig. 13 is a schematic structural view of an airtight baffle provided by an embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of a hollow baffle provided by an embodiment of the present application.
  • the purpose of building a heat dissipation structure is to take away the heat generated by the equipment during operation.
  • the capacity of communication equipment is getting larger, the functions are more and more comprehensive, and the structure is getting better and better.
  • the power consumption of communication equipment has increased sharply, and the heat dissipation requirements for equipment are getting higher and higher, and the size of equipment will be limited by industry standards.
  • Constructing different heat dissipation structures for heat dissipation of equipment is widely used in the field of communication or IT equipment.
  • the heat dissipation structure of communication equipment includes shells, plug-in modules and exhaust devices. By designing different structures, different heat dissipation structures are formed to control Different types of equipment dissipate heat.
  • FIG. 1 is a schematic structural view of an "I"-shaped air duct provided by an embodiment of the present application
  • Figure 2 is a schematic structural view of an "L”-shaped air duct provided by an embodiment of the present application
  • Fig. 3 is a schematic structural diagram of a "Z" air duct provided by an embodiment of the present application
  • Fig. 4 is provided by an embodiment of the present application Schematic diagram of the air duct structure.
  • plug-in modules for equipment and different modules may require different equipment heat dissipation structures, which will cause communication equipment to be incompatible with different plug-in modules and can only be used in a single scenario.
  • the "I”, "L” and “Z” air ducts have simple structures, and are often used in communication equipment with simple structures and only one side of the plug-in module; and
  • the structure of the type air duct is relatively complicated, and it can be applied to communication equipment with front-plug modules and rear-plug modules.
  • the current Type air duct structure often requires a separate air inlet channel, which will reduce the internal space utilization of communication equipment.
  • an embodiment of the present application provides a heat dissipation framework and communication equipment, wherein the heat dissipation framework in the first installation state includes a housing, a first front-plug module, a rear-plug module, and a first air exhaust device, wherein,
  • the shell is provided with a hollow baffle, and the hollow baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module is connected with the hollow The hole is connected; the rear plug-in module is located on the other side of the hollow baffle, and the rear plug-in module is connected to the hollow hole.
  • the first air exhaust device is installed on the housing, and is used to make air flow through the first through hole, the first front module, the hollow hole, the rear module, the first channel and the first air outlet in sequence.
  • the embodiment of the present application provides a first through hole for air intake on one side of the first front insertion module, and at the same time, the first through hole between the first front insertion module and the rear insertion module
  • the baffle is designed as a hollow baffle with hollow holes, so that the air can pass through the first through hole, the first front module and the hollow hole in sequence before entering the rear module, that is, the space where the first front module is located
  • the first front plug-in module can be installed normally, and it can also be used as the air inlet channel of the rear plug-in module. Therefore, the air inlet channel and the first front plug-in module are in the same spatial position, and there is no need to set up an air inlet channel separately, thereby improving the interior of the communication equipment. Space utilization.
  • the heat dissipation structure can also be switched to the second installation state.
  • the heat dissipation structure includes a housing, a first front-plug module, a rear-plug module, and a second exhaust fan.
  • the housing is provided with a first airtight baffle; one side of the first front plug-in module is provided with a first through hole, and the other side is installed on one side of the first airtight baffle; the rear The plug-in module is located on the other side of the first airtight baffle, and a first channel is provided between the upper and lower sides of the rear plug-in module and the housing, and the two first channels communicate with the rear plug-in module.
  • One air inlet, and the other first channel is provided with a first air outlet;
  • a second channel is provided between the left and right sides of the rear plug-in module and the housing, the second channel communicates with the first front plug-in module, and the second channel is provided with The second air outlet;
  • the second air exhaust device is installed on the housing, and is used to make the air flow through the first air inlet, a first channel, the rear plug-in module, another first channel and the first air outlet in sequence;
  • the third row The wind device is installed on the casing, and is used to make air flow through the first through hole, the first front module, the second channel and the second air outlet in sequence.
  • the heat dissipation architecture of the embodiment of the application can be switched to different installation states by changing the structure of the baffle and the exhaust device, so that the heat dissipation architecture of the communication equipment can be changed between different architectures. Changes to cope with different heat dissipation requirements and large-capacity communication scenarios.
  • FIG. 5 is a front-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application
  • FIG. 6 is a rear-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application.
  • the heat dissipation structure of the embodiment of the present application shown in FIG. 5 and FIG. 6 includes a housing 100, a baffle 200 is provided inside the housing 100, and two first airtight partitions 310 are provided at the front end of the baffle 200.
  • a first airtight partition 310 divides the front space of the baffle 200 into an upper front frame 410, a middle front frame 420, and a lower front frame 430.
  • the middle front frame 420 is used to place the first front module.
  • Both the socket frame 410 and the lower front frame 430 are used to place the second front-plug module.
  • the bezel 200 inside the housing 100 is also divided into an upper bezel 210, a middle bezel 220, and a lower bezel 230 according to areas.
  • a first channel 510 is opened below the lower front frame 430, the lower front frame 430 and the first channel 510 are not connected, and the first channel 510 is provided with a first air inlet; the left and right sides of the lower front frame 430
  • the third channel 530 is provided on the left and right sides of the side and the upper front frame 410, and the second front modules of the lower front frame 430 and the upper front frame 410 communicate with the corresponding third channels 530 respectively;
  • Second channels 520 are opened on the left and right sides of the subframe 420 , and the first front module of the middle front subrack 420 communicates with the second channel 520 .
  • the rear end of the baffle 200 is provided with a rear insertion frame 600, which is used to place the rear insertion module, and the above-mentioned first channel 510 is provided between the bottom of the rear insertion module and the housing 100, and the rear Another first passage 510 is provided between the top of the plug-in module and the housing 100, and the rear plug-in modules in the rear plug-in frame 600 all communicate with the first passage 510 below and the first passage 510 above; in addition, the rear plug-in frame
  • the above-mentioned second passage 520 is provided between the left and right sides of the middle position of 600 and the housing 100, and the second airtight partition 320 is provided between the left and right sides of the middle position of the rear frame 600 and the second passage 520; in addition,
  • the above-mentioned third channel 530 is provided between the left and right sides of the upper position of the rear frame 600 and the left and right sides of the lower position of the rear frame 600 and the housing 100 respectively, that is, the second channel 520 is provided on the
  • heat dissipation devices may be installed at the positions of the first channel 510 , the second channel 520 and the third channel 530 around the rear socket frame 600 .
  • Figure 7 is a side view of the air duct structure provided by one embodiment of the present application when the heat dissipation framework is in the second installation state;
  • Figure 8 is a side view of the heat dissipation framework provided by one embodiment of the present application in the second installation state The top view of the air duct structure in the state.
  • the heat dissipation structure is provided with a second installation state.
  • the heat dissipation structure includes but is not limited to a housing 100, a first airtight baffle, a second airtight baffle, a first front plug-in module, a second front Plug-in module, rear plug-in module, second exhaust device, third exhaust device and fourth exhaust device.
  • the first airtight baffle is the above-mentioned middle baffle 220
  • the second airtight baffle is the above-mentioned upper baffle 210 and the lower baffle 230
  • both the first airtight baffle and the second airtight baffle are arranged on the shell body 100
  • one side of the first front plug-in module is provided with a first through hole, and the other side is installed on one side of the first airtight baffle
  • one side of the second front plug-in module is provided with a second through hole, and the other side Installed on one side of the second airtight baffle
  • the rear plug-in module is located on the other side of the first airtight baffle and the second airtight baffle
  • a first channel 510 is provided between the upper and lower sides of the rear plug-in module and the housing 100 , the two first passages 510 communicate with the rear plug-in module, one first passage 510 is provided with a first air inlet, and the other first passage 510 is provided with a
  • the rear plug-in module is a "Z"-shaped air duct
  • the first front plug-in module and the second front plug-in module are both
  • the upper baffle 210, the middle baffle 220, and the lower baffle 230 all use airtight baffles. board, and a heat sink needs to be installed on the rear end of the first channel 510 above the rear subframe 600, the rear ends of the second channel 520 and the third channel 530 on the left and right sides of the rear subframe 600.
  • the air ducts of the first front-plug module and the second front-plug module are front-to-back as shown in Figure 8, and the air inlets are at the panels of the first front-plug module and the second front-plug module. That is, the above-mentioned first through hole and second through hole; the air outlets are located at the rear ends of the second channel 520 and the third channel 530 on the left and right sides of the rear frame 600 , that is, the above-mentioned second air outlet and third air outlet.
  • the air duct of the rear plug-in module is a "Z"-shaped air duct as shown in Fig.
  • the first channel 510 on the upper side of the rear frame 600 is the above-mentioned first air outlet.
  • the rear plug-in module is a "Z"-shaped air duct
  • the first front plug-in module and the second front plug-in module are both The font air duct, the two air ducts do not interfere with each other.
  • the heat dissipation frame in the second installation state will make the air duct distance between the first front-plug module and the second front-plug module short, which is suitable for the situation where the power consumption of the first front-plug module and the second front-plug module is large; however, due to The air duct of the rear module is long and the thermal cascade is serious.
  • the redundant backup of the "Z"-shaped air duct heat dissipation device has a single point of failure, the heat dissipation capacity of the rear module will deteriorate sharply, resulting in overheating of the equipment.
  • Figure 9 is a side view of the air duct structure when the heat dissipation framework provided by one embodiment of the present application is in the first installation state;
  • Figure 10 is a side view of the heat dissipation framework provided by one embodiment of the present application in the first installation state The top view of the air duct structure in the state.
  • the heat dissipation structure can also be provided with a first installation state.
  • the heat dissipation structure includes but is not limited to a housing 100, a hollow baffle, a second airtight baffle, a first front plug-in module, a second front Plug-in module, rear plug-in module, first exhaust device and fourth exhaust device.
  • the hollow baffle is the above-mentioned middle baffle 220
  • the second airtight baffle is the above-mentioned upper baffle 210 and the lower baffle 230
  • both the hollow baffle and the second airtight baffle are arranged on the housing 100
  • the hollow The baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module communicates with the hollow hole;
  • the second front insertion module One side is provided with a second through hole, and the other side is installed on one side of the second airtight baffle;
  • the rear insertion module is located on the other side of the hollow baffle, and the rear insertion module communicates with the hollow hole, and the rear insertion module and the housing 100
  • a first channel 510 is provided between them, and the first channel 510 communicates with the rear plug-in module, and the first channel 510 is provided with a first air outlet;
  • the first front-plug module in the middle and the rear-plug module form a type air duct
  • the second front module at the upper and lower parts is
  • the upper baffle 210 and the lower baffle 230 both use airtight baffles
  • the middle baffle 220 adopts a hollow baffle.
  • the upper airtight baffle, and the rear ends of the two first channels 510 above and below the rear frame 600, and the rear ends of the third channels 530 on the left and right sides of the rear frame 600 need to install heat sinks, and the second An airtight baffle is installed at the rear end of the channel 520 .
  • the channel 510 flows out, and the air outlets are located at the rear ends of the first channel 510 on the upper and lower sides of the rear frame 600 , that is, the above-mentioned two first air outlets at the upper and lower positions.
  • the air duct structure for the second front plug-in module is shown in FIG. 10 , which is consistent with the air duct structure in the second installation state.
  • the first front-plug module in the middle and the rear-plug module form a type air duct, and the second front module at the upper and lower parts is The font air duct, the two air ducts do not interfere with each other.
  • the case of low consumption because The type air duct shares the same air inlet, and the air outlet is divided into two places, which shortens the length of the air duct.
  • first passages 510 there are two first passages 510, and the two first passages 510 are respectively located between the upper and lower sides of the rear plug-in module and the housing 100.
  • the multiple second airtight baffles are respectively located at the upper and lower positions of the hollow baffle, and the hollow holes of the hollow baffle communicate with the middle position of the rear plug-in module.
  • a first airtight partition 310 is provided between the first front module and the second front module
  • a second airtight partition 320 is provided between the rear module and the second channel 520
  • the second A third airtight partition 330 is disposed between the channel 520 and the third channel 530 .
  • first air exhaust device second air exhaust device, third air exhaust device and fourth air exhaust device may all be fans.
  • the first airtight baffle corresponding to the first front module in the middle needs to be replaced with a hollow baffle, and the corresponding fan needs to be removed.
  • the fan at the bottom of the rear module needs to be installed, and the baffle corresponding to the lower fan 200 installed on.
  • the structure of the first front insertion module and the second front insertion module can be referred to as shown in Figure 11; the structure of the rear insertion module can be referred to as shown in Figure 12; the structure of the airtight baffle can be referred to as shown in Figure 13; The structure can refer to Figure 14.
  • the heat dissipation architectures in the above two installation states can be converted to each other by replacing the type of baffle 200 and changing the installation position of the fan while the overall architecture of the equipment remains unchanged, which makes up for the fact that the heat dissipation architecture of the existing equipment is fixed once it is determined.
  • the shortcomings that cannot be changed; and the use of the front module with the first through hole makes the air inlet duct and the front module integrated, which improves the space utilization rate of the communication equipment and makes up for the separation of the air duct and the module of the current cooling structure of the communication equipment. Disadvantages that lead to wasted space.
  • the above-mentioned hollow baffle plate with the first through hole can be a structure with dense holes such as a gauze net or a flow equalizer;
  • the above-mentioned heat dissipation device can be a fan, wherein the fan can be Exhaust devices such as fans, axial flow fans, and centrifugal fans; cooling devices can be installed in different positions of the equipment, such as the front frame, the rear frame 600, around and in the middle of the device, etc.
  • the embodiments of the present application have the following technical effects: 1. High space utilization rate: by using front-inserted modules with dense holes, the air duct and modules are integrated to make full use of equipment space; 2. The universal rate of equipment is improved. : Different heat dissipation architectures have their advantages and disadvantages. When the power consumption of the front plug-in module and the rear plug-in module changes, different heat dissipation architectures can be used for matching. Therefore, it has better compatibility with changeable plug-in modules and improves the equipment 3. Strong scalability: different structures can be designed to realize the conversion between various heat dissipation structures; 4.
  • the heat dissipation structure conversion is simple: by replacing the baffle 200 and other replaceable structures, changing the heat dissipation devices such as fans
  • the location of the device can change the heat dissipation structure of the device while the overall structure of the device remains unchanged.
  • the embodiment of the present application also provides a communication device, specifically, the communication equipment in the embodiment of the present application includes but is not limited to the heat dissipation architecture in any of the above embodiments .
  • the communication device in the embodiment of the present application includes the heat dissipation structure in any of the above-mentioned embodiments
  • the specific implementation and technical effects of the communication device in the embodiment of the present application can refer to any of the above-mentioned embodiments.
  • the specific implementation and technical effects of the heat dissipation architecture can refer to any of the above-mentioned embodiments.
  • the embodiment of the present application includes: the heat dissipation structure of the embodiment of the present application includes a housing, a first front insertion module, a rear insertion module and a first exhaust device, wherein the housing is provided with a hollow baffle, and the hollow baffle is provided with a hollow hole One side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module communicates with the hollow hole; the rear insertion module is located on the other side of the hollow baffle, The rear plug-in module communicates with the hollow hole, and there is a first channel between the rear plug-in module and the housing, the first channel communicates with the rear plug-in module, and the first channel is provided with a first air outlet; the first exhaust device is installed on the housing , for allowing air to flow through the first through hole, the first front module, the hollow hole, the rear module, the first channel and the first air outlet in sequence.
  • the embodiment of the present application provides a first through hole for air intake on one side of the first front insertion module, and at the same time, the first through hole between the first front insertion module and the rear insertion module
  • the baffle is designed as a hollow baffle with hollow holes, so that the air can pass through the first through hole, the first front module and the hollow hole in sequence before entering the rear module, that is, the space where the first front module is located
  • the first front plug-in module can be installed normally, and it can also be used as the air inlet channel of the rear plug-in module. Therefore, the air inlet channel and the first front plug-in module are in the same spatial position, and there is no need to set up an air inlet channel separately, thereby improving the interior of the communication equipment. Space utilization.

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Abstract

A heat-dissipation structure and a communication device. The heat-dissipation structure comprises: a housing (100), a first front insertion module, a rear insertion module, and a first exhaust apparatus; the housing (100) is provided with a hollowed baffle plate having hollowed holes; the first insertion module is provided with a first through hole, and is mounted on one side of the hollowed baffle plate and communicated with the hollowed holes; the rear insertion module is communicated with the hollowed holes, and a first channel (510) is provided between the rear insertion module and the housing (100); the first channel (510) is provided with a first air outlet; and the first exhaust apparatus is used for enabling air to flow through the first through hole, the first front insertion module, the hollowed holes, the rear insertion module, the first channel (510), and the first air outlet.

Description

散热架构和通讯设备Thermal architecture and communication equipment
相关申请的交叉引用Cross References to Related Applications
本申请基于申请号为202111066828.3、申请日为2021年9月13日的中国专利申请提出,并要求该中国专利申请的优先权,该中国专利申请的全部内容在此引入本申请作为参考。This application is based on a Chinese patent application with application number 202111066828.3 and a filing date of September 13, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.
技术领域technical field
本申请实施例涉及但不限于散热技术领域,尤其涉及一种散热架构和通讯设备。The embodiments of the present application relate to but are not limited to the field of heat dissipation technology, and in particular, relate to a heat dissipation structure and communication equipment.
背景技术Background technique
目前,对于通讯设备常用的散热架构,主要包括“I”型、“L”型、“Z”型和
Figure PCTCN2022080744-appb-000001
型风道结构,其中,“I”型、“L”型和“Z”型风道结构简单,常用于结构简单并且只有一侧拔插模块的通讯设备;而
Figure PCTCN2022080744-appb-000002
型风道结构较为复杂,可以适用于具有前插模块和后插模块的通讯设备。但是,对于目前的
Figure PCTCN2022080744-appb-000003
型风道结构,往往需要单独设置入风通道,从而会降低通讯设备的内部空间利用率。
At present, the heat dissipation structures commonly used for communication equipment mainly include "I" type, "L" type, "Z" type and
Figure PCTCN2022080744-appb-000001
Type air duct structure, among them, "I", "L" and "Z" type air ducts have simple structures, and are often used in communication equipment with simple structures and only one side of the plug-in module; and
Figure PCTCN2022080744-appb-000002
The structure of the type air duct is relatively complicated, and it can be applied to communication equipment with front-plug modules and rear-plug modules. However, for the current
Figure PCTCN2022080744-appb-000003
Type air duct structure often requires a separate air inlet channel, which will reduce the internal space utilization of communication equipment.
发明内容Contents of the invention
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。The following is an overview of the topics described in detail in this article. This summary is not intended to limit the scope of the claims.
本申请实施例提供了一种散热架构和通讯设备。Embodiments of the present application provide a heat dissipation architecture and a communication device.
第一方面,本申请实施例提供了一种散热架构,设置有第一安装状态,当所述散热架构处于所述第一安装状态,所述散热架构包括:壳体,设置有镂空挡板,所述镂空挡板设置有镂空孔;第一前插模块,一侧设置有第一通孔,另一侧安装于所述镂空挡板的一侧,所述第一前插模块与所述镂空孔连通;后插模块,位于所述镂空挡板的另一侧,所述后插模块与所述镂空孔连通,所述后插模块和所述壳体之间设置有第一通道,所述第一通道和所述后插模块连通,所述第一通道设置有第一出风口;第一排风装置,安装于所述壳体,用于使空气依次流经所述第一通孔、所述第一前插模块、所述镂空孔、所述后插模块、所述第一通道和所述第一出风口。In the first aspect, the embodiment of the present application provides a heat dissipation structure, which is provided with a first installation state. When the heat dissipation structure is in the first installation state, the heat dissipation structure includes: a housing, which is provided with a hollow baffle, The hollow baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module and the hollow The holes are connected; the rear plug-in module is located on the other side of the hollow baffle, the rear plug-in module communicates with the hollow hole, a first channel is provided between the rear plug-in module and the housing, and the The first passage communicates with the rear plug-in module, and the first passage is provided with a first air outlet; a first air exhaust device is installed on the housing, and is used to make air flow through the first through hole, The first front module, the hollow hole, the rear module, the first channel and the first air outlet.
第二方面,本申请实施例还提供了一种通讯设备,包括如上述第一方面所述的散热架构。In the second aspect, the embodiment of the present application further provides a communication device, including the heat dissipation structure described in the first aspect above.
本申请的其它特征和优点将在随后的说明书中阐述,并且,部分地从说明书中变得显而易见,或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。Additional features and advantages of the application will be set forth in the description which follows, and, in part, will be obvious from the description, or may be learned by practice of the application. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
附图说明Description of drawings
附图用来提供对本申请技术方案的进一步理解,并且构成说明书的一部分,与本申请的实施例一起用于解释本申请的技术方案,并不构成对本申请技术方案的限制。The accompanying drawings are used to provide a further understanding of the technical solution of the present application, and constitute a part of the specification, and are used together with the embodiments of the present application to explain the technical solution of the present application, and do not constitute a limitation to the technical solution of the present application.
图1是本申请一个实施例提供的“I”型风道的结构示意图;Figure 1 is a schematic structural view of an "I"-shaped air duct provided by an embodiment of the present application;
图2是本申请一个实施例提供的“L”型风道的结构示意图;Figure 2 is a schematic structural view of an "L"-shaped air duct provided by an embodiment of the present application;
图3是本申请一个实施例提供的“Z”型风道的结构示意图;Fig. 3 is a schematic structural view of a "Z"-shaped air duct provided by an embodiment of the present application;
图4是本申请一个实施例提供的
Figure PCTCN2022080744-appb-000004
型风道的结构示意图;
Figure 4 is provided by an embodiment of the present application
Figure PCTCN2022080744-appb-000004
Schematic diagram of the structure of the air duct;
图5是本申请一个实施例提供的散热架构的前端结构图;FIG. 5 is a front-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application;
图6是本申请一个实施例提供的散热架构的后端结构图;FIG. 6 is a back-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application;
图7是本申请一个实施例提供的散热架构处于第二安装状态时的风道结构侧视图;Fig. 7 is a side view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the second installation state;
图8是本申请一个实施例提供的散热架构处于第二安装状态时的风道结构俯视图;Fig. 8 is a top view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the second installation state;
图9是本申请一个实施例提供的散热架构处于第一安装状态时的风道结构侧视图;Fig. 9 is a side view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the first installation state;
图10是本申请一个实施例提供的散热架构处于第一安装状态时的风道结构俯视图;Fig. 10 is a top view of the air duct structure when the heat dissipation framework provided by an embodiment of the present application is in the first installation state;
图11是本申请一个实施例提供的第一前插模块和第二前插模块的结构示意图;Fig. 11 is a schematic structural diagram of a first front-plug module and a second front-plug module provided by an embodiment of the present application;
图12是本申请一个实施例提供的后插模块的结构示意图;Fig. 12 is a schematic structural diagram of a rear plug-in module provided by an embodiment of the present application;
图13是本申请一个实施例提供的密闭挡板的结构示意图;Fig. 13 is a schematic structural view of an airtight baffle provided by an embodiment of the present application;
图14是本申请一个实施例提供的镂空挡板的结构示意图。Fig. 14 is a schematic structural diagram of a hollow baffle provided by an embodiment of the present application.
具体实施方式Detailed ways
为了使本申请的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本申请进行进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本申请,并不用于限定本申请。In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, not to limit the present application.
需要说明的是,虽然在装置示意图中进行了功能模块划分,在流程图中示出了逻辑顺序,但是在某些情况下,可以以不同于装置中的模块划分,或流程图中的顺序执行所示出或描述的步骤。说明书、权利要求书或上述附图中的术语“第一”、“第二”等是用于区别类似的对象,而不必用于描述特定的顺序或先后次序。It should be noted that although the functional modules are divided in the schematic diagram of the device, and the logical sequence is shown in the flowchart, in some cases, it can be executed in a different order than the module division in the device or the flowchart in the flowchart. steps shown or described. The terms "first", "second" and the like in the specification, claims or the above drawings are used to distinguish similar objects, and not necessarily used to describe a specific order or sequence.
在相关的技术方案中,构建散热架构是为了带走设备在运行过程中产生的热量,如今通讯技术得到了长期的发展,通讯设备的容量越来越大,功能越来越全面,结构越来越复杂,所面临的场景多种多样。随之带来的是通讯设备的功耗急剧增大,对设备的散热要求越来越高,设备的尺寸会被行业标准所限制。构建不同的散热架构进行设备的散热广泛应用于通讯领域或IT设备领域通讯设备的散热架构包括壳体、插拔模块和排风装置,通过设计不同的结构,形成不同的散热架构,用于对不同类型的设备进行散热。In related technical solutions, the purpose of building a heat dissipation structure is to take away the heat generated by the equipment during operation. Nowadays, with the long-term development of communication technology, the capacity of communication equipment is getting larger, the functions are more and more comprehensive, and the structure is getting better and better. The more complex it is, the more diverse the scenarios it faces. As a result, the power consumption of communication equipment has increased sharply, and the heat dissipation requirements for equipment are getting higher and higher, and the size of equipment will be limited by industry standards. Constructing different heat dissipation structures for heat dissipation of equipment is widely used in the field of communication or IT equipment. The heat dissipation structure of communication equipment includes shells, plug-in modules and exhaust devices. By designing different structures, different heat dissipation structures are formed to control Different types of equipment dissipate heat.
根据不同散热架构的结构形式,可以分为“I”型、“L”型、“Z”型和
Figure PCTCN2022080744-appb-000005
型等,不同的散热架构其特点不同,使用场景也相应不同,但是其结构确定后散热架构是不变的。其中,如图1至图4所示,图1是本申请一个实施例提供的“I”型风道的结构示意图;图2是本申请一个实施例提供的“L”型风道的结构示意图;图3是本申请一个实施例提供的“Z”型风道的结构示意图;图4是本申请一个实施例提供的
Figure PCTCN2022080744-appb-000006
型风道的结构示意图。设备的插拔模块种类多,不同的模块所需要的设备散热构架可能不同,从而会导致通讯设备不能兼容不同的插拔模块,只能应用于单一的场景。
According to the structural form of different cooling structures, it can be divided into "I" type, "L" type, "Z" type and
Figure PCTCN2022080744-appb-000005
Different heat dissipation architectures have different characteristics and different usage scenarios, but the heat dissipation architecture remains unchanged after the structure is determined. Among them, as shown in Figures 1 to 4, Figure 1 is a schematic structural view of an "I"-shaped air duct provided by an embodiment of the present application; Figure 2 is a schematic structural view of an "L"-shaped air duct provided by an embodiment of the present application ; Fig. 3 is a schematic structural diagram of a "Z" air duct provided by an embodiment of the present application; Fig. 4 is provided by an embodiment of the present application
Figure PCTCN2022080744-appb-000006
Schematic diagram of the air duct structure. There are many types of plug-in modules for equipment, and different modules may require different equipment heat dissipation structures, which will cause communication equipment to be incompatible with different plug-in modules and can only be used in a single scenario.
目前,对于通讯设备常用的散热架构,“I”型、“L”型和“Z”型风道结构简单,常用于结构简单并且只有一侧拔插模块的通讯设备;而
Figure PCTCN2022080744-appb-000007
型风道结构较为复杂,可以适用于具有前插模块和后插模块的通讯设备。但是,对于目前的
Figure PCTCN2022080744-appb-000008
型风道结构,往往需要单独设置入风通道,从而会降低通讯设备的内部空间利用率。
At present, for the heat dissipation structure commonly used in communication equipment, the "I", "L" and "Z" air ducts have simple structures, and are often used in communication equipment with simple structures and only one side of the plug-in module; and
Figure PCTCN2022080744-appb-000007
The structure of the type air duct is relatively complicated, and it can be applied to communication equipment with front-plug modules and rear-plug modules. However, for the current
Figure PCTCN2022080744-appb-000008
Type air duct structure often requires a separate air inlet channel, which will reduce the internal space utilization of communication equipment.
基于上述情况,本申请实施例提供了一种散热架构和通讯设备,其中,处于第一安装状态的散热架构包括壳体、第一前插模块、后插模块和第一排风装置,其中,壳体设置有镂空挡板,镂空挡板设置有镂空孔;第一前插模块的一侧设置有第一通孔,另一侧安装于镂空挡板的一侧,第一前插模块与镂空孔连通;后插模块位于镂空挡板的另一侧,后插模块与镂空孔连通,后插模块和壳体之间设置有第一通道,第一通道和后插模块连通,第一通道设置有第一出风口;第一排风装置安装于壳体,用于使空气依次流经第一通孔、第一前插模块、镂空孔、后插模块、第一通道和第一出风口。根据本申请实施例的技术方案,本申请实施例在第一前插模块的一侧设置了用于进气的第一通孔,同时,还将第一前插模块和后插模块之间的挡板设计为带有镂空孔的镂空挡板,从而使得空气能够依次经过第一通孔、第一前插模块和镂空孔后再进入至后插模块,即第一前插模块所在的空间位置可以正常安装第一前插模块,还可以作为后插模块的入风通道,因此,入风通道和第一前插模块处于同一空间位置,无需单独设置入风通道,从而能够提高通讯设备的内部空间利用率。Based on the above, an embodiment of the present application provides a heat dissipation framework and communication equipment, wherein the heat dissipation framework in the first installation state includes a housing, a first front-plug module, a rear-plug module, and a first air exhaust device, wherein, The shell is provided with a hollow baffle, and the hollow baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module is connected with the hollow The hole is connected; the rear plug-in module is located on the other side of the hollow baffle, and the rear plug-in module is connected to the hollow hole. There is a first air outlet; the first air exhaust device is installed on the housing, and is used to make air flow through the first through hole, the first front module, the hollow hole, the rear module, the first channel and the first air outlet in sequence. According to the technical solution of the embodiment of the present application, the embodiment of the present application provides a first through hole for air intake on one side of the first front insertion module, and at the same time, the first through hole between the first front insertion module and the rear insertion module The baffle is designed as a hollow baffle with hollow holes, so that the air can pass through the first through hole, the first front module and the hollow hole in sequence before entering the rear module, that is, the space where the first front module is located The first front plug-in module can be installed normally, and it can also be used as the air inlet channel of the rear plug-in module. Therefore, the air inlet channel and the first front plug-in module are in the same spatial position, and there is no need to set up an air inlet channel separately, thereby improving the interior of the communication equipment. Space utilization.
另外,除了上述的第一安装状态,散热架构还可以切换至第二安装状态,当散热架构处于第二安装状态,散热架构包括壳体、第一前插模块、后插模块、第二排风装置和第三排风装置,其中,壳体设置有第一密闭挡板;第一前插模块的一侧设置有第一通孔,另一侧安装于第一密闭挡板的一侧;后插模块位于第一密闭挡板的另一侧,后插模块的上下两侧和壳体之间设置有第一通道,两个第一通道均与后插模块连通,一个第一通道设置有第一入风口,另一个第一通道设置有第一出风口;后插模块的左右两侧和壳体之间设置有第二通道,第二通道和第一前插模块连通,第二通道设置有第二出风口;第二排风装置安装于壳体,用于使空气依次流经第一入风口、一个第一通道、后插模块、另一个第一通道和第一出风口;第三排风装置安装于壳体,用于使空气依次流经第一通孔、第一前插模块、第二通道和第二出风口。根据本申请实施例的技术方案,本申请实施例的散热架构可以通过对挡板结构和排风装置的改变,从而切换至不同的安装状态,进而使得通讯设备的散热架构可以在不同架构之间变化,以应对不同散热需求和大容量的通讯场景。In addition, in addition to the above-mentioned first installation state, the heat dissipation structure can also be switched to the second installation state. When the heat dissipation structure is in the second installation state, the heat dissipation structure includes a housing, a first front-plug module, a rear-plug module, and a second exhaust fan. device and the third exhaust device, wherein, the housing is provided with a first airtight baffle; one side of the first front plug-in module is provided with a first through hole, and the other side is installed on one side of the first airtight baffle; the rear The plug-in module is located on the other side of the first airtight baffle, and a first channel is provided between the upper and lower sides of the rear plug-in module and the housing, and the two first channels communicate with the rear plug-in module. One air inlet, and the other first channel is provided with a first air outlet; a second channel is provided between the left and right sides of the rear plug-in module and the housing, the second channel communicates with the first front plug-in module, and the second channel is provided with The second air outlet; the second air exhaust device is installed on the housing, and is used to make the air flow through the first air inlet, a first channel, the rear plug-in module, another first channel and the first air outlet in sequence; the third row The wind device is installed on the casing, and is used to make air flow through the first through hole, the first front module, the second channel and the second air outlet in sequence. According to the technical solution of the embodiment of the application, the heat dissipation architecture of the embodiment of the application can be switched to different installation states by changing the structure of the baffle and the exhaust device, so that the heat dissipation architecture of the communication equipment can be changed between different architectures. Changes to cope with different heat dissipation requirements and large-capacity communication scenarios.
下面结合附图,对本申请实施例作进一步阐述。The embodiments of the present application will be further described below in conjunction with the accompanying drawings.
如图5至图6所示,图5是本申请一个实施例提供的散热架构的前端结构图;图6是本申请一个实施例提供的散热架构的后端结构图。As shown in FIGS. 5 to 6 , FIG. 5 is a front-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application; FIG. 6 is a rear-end structural diagram of a heat dissipation architecture provided by an embodiment of the present application.
具体地,图5和图6中的本申请实施例的散热架构包括壳体100,壳体100的内部设置有挡板200,挡板200的前端设置有两块第一密闭隔板310,两块第一密闭隔板310将挡板200的前端空间划分为上前插框410、中前插框420和下前插框430,中前插框420用于放置第一前插模块,上前插框410和下前插框430均用于放置第二前插模块,对应地,壳体100内部的挡板200也按照区域划分为上挡板210、中挡板220和下挡板230,另外,下前插框430的下方开设有第一通道510,下前插框430和第一通道510之间不连通,第一通道510设置有第一入风口;下前插框430的左右两侧和上前插框410的左右两侧均开设有第三通道530,下前插框430和上前插框410的第二前插模块分别与各自位置对应的第三通道530连通;中前插框420的左右两侧开设有第二通道520,中前插框420的第一前插模块与第二通道520连通。Specifically, the heat dissipation structure of the embodiment of the present application shown in FIG. 5 and FIG. 6 includes a housing 100, a baffle 200 is provided inside the housing 100, and two first airtight partitions 310 are provided at the front end of the baffle 200. A first airtight partition 310 divides the front space of the baffle 200 into an upper front frame 410, a middle front frame 420, and a lower front frame 430. The middle front frame 420 is used to place the first front module. Both the socket frame 410 and the lower front frame 430 are used to place the second front-plug module. Correspondingly, the bezel 200 inside the housing 100 is also divided into an upper bezel 210, a middle bezel 220, and a lower bezel 230 according to areas. In addition, a first channel 510 is opened below the lower front frame 430, the lower front frame 430 and the first channel 510 are not connected, and the first channel 510 is provided with a first air inlet; the left and right sides of the lower front frame 430 The third channel 530 is provided on the left and right sides of the side and the upper front frame 410, and the second front modules of the lower front frame 430 and the upper front frame 410 communicate with the corresponding third channels 530 respectively; Second channels 520 are opened on the left and right sides of the subframe 420 , and the first front module of the middle front subrack 420 communicates with the second channel 520 .
另外,挡板200的后端设置有后插框600,该后插框600用于放置后插模块,后插模块的下方和壳体100之间设置有上述的第一通道510,同时,后插模块的上方和壳体100之间 还设置有另一个第一通道510,后插框600中的后插模块均连通下方的第一通道510和上方的第一通道510;另外,后插框600中部位置的左右两侧和壳体100之间设置有上述的第二通道520,后插框600中部位置的左右两侧和第二通道520之间设置有第二密闭隔板320;另外,后插框600上部位置的左右两侧和后插框600下部位置的左右两侧分别和壳体100之间设置有上述的第三通道530,即第二通道520设置于上下方的两个第三通道530之间,第二通道520和第三通道530之间设置有第三密闭隔板330。In addition, the rear end of the baffle 200 is provided with a rear insertion frame 600, which is used to place the rear insertion module, and the above-mentioned first channel 510 is provided between the bottom of the rear insertion module and the housing 100, and the rear Another first passage 510 is provided between the top of the plug-in module and the housing 100, and the rear plug-in modules in the rear plug-in frame 600 all communicate with the first passage 510 below and the first passage 510 above; in addition, the rear plug-in frame The above-mentioned second passage 520 is provided between the left and right sides of the middle position of 600 and the housing 100, and the second airtight partition 320 is provided between the left and right sides of the middle position of the rear frame 600 and the second passage 520; in addition, The above-mentioned third channel 530 is provided between the left and right sides of the upper position of the rear frame 600 and the left and right sides of the lower position of the rear frame 600 and the housing 100 respectively, that is, the second channel 520 is provided on the two upper and lower channels. A third airtight partition 330 is provided between the three channels 530 and between the second channel 520 and the third channel 530 .
另外,为了达到散热效果,可以将散热装置安装在后插框600周围的第一通道510、第二通道520和第三通道530的位置处。In addition, in order to achieve a heat dissipation effect, heat dissipation devices may be installed at the positions of the first channel 510 , the second channel 520 and the third channel 530 around the rear socket frame 600 .
基于上述图5和图6中的散热架构,下面分别介绍散热架构在不同安装状态下的风道结构。Based on the above-mentioned heat dissipation architectures in FIG. 5 and FIG. 6 , the air duct structures of the heat dissipation architectures in different installation states are respectively introduced below.
如图7至图8所示,图7是本申请一个实施例提供的散热架构处于第二安装状态时的风道结构侧视图;图8是本申请一个实施例提供的散热架构处于第二安装状态时的风道结构俯视图。As shown in Figures 7 to 8, Figure 7 is a side view of the air duct structure provided by one embodiment of the present application when the heat dissipation framework is in the second installation state; Figure 8 is a side view of the heat dissipation framework provided by one embodiment of the present application in the second installation state The top view of the air duct structure in the state.
散热架构设置有第二安装状态,当散热架构处于第二安装状态,散热架构包括但不限于有壳体100、第一密闭挡板、第二密闭挡板、第一前插模块、第二前插模块、后插模块、第二排风装置、第三排风装置和第四排风装置。The heat dissipation structure is provided with a second installation state. When the heat dissipation structure is in the second installation state, the heat dissipation structure includes but is not limited to a housing 100, a first airtight baffle, a second airtight baffle, a first front plug-in module, a second front Plug-in module, rear plug-in module, second exhaust device, third exhaust device and fourth exhaust device.
其中,第一密闭挡板即为上述的中挡板220,第二密闭挡板即为上述的上挡板210和下挡板230,第一密闭挡板和第二密闭挡板均设置于壳体100;第一前插模块的一侧设置有第一通孔,另一侧安装于第一密闭挡板的一侧;第二前插模块的一侧设置有第二通孔,另一侧安装于第二密闭挡板的一侧;后插模块位于第一密闭挡板和第二密闭挡板的另一侧,后插模块的上下两侧和壳体100之间设置有第一通道510,两个第一通道510均与后插模块连通,一个第一通道510设置有第一入风口,另一个第一通道510设置有第一出风口;后插模块的左右两侧和壳体100之间设置有第二通道520,第二通道520和第一前插模块连通,第二通道520设置有第二出风口;后插模块的左右两侧和壳体100之间设置有第三通道530,第三通道530和第二前插模块连通,第三通道530设置有第三出风口;第二排风装置安装于壳体100,用于使空气依次流经第一入风口、一个第一通道510、后插模块、另一个第一通道510和第一出风口;第三排风装置安装于壳体100,用于使空气依次流经第一通孔、第一前插模块、第二通道520和第二出风口;第四排风装置安装于壳体100,用于使空气依次流经第二通孔、第二前插模块、第三通道530和第三出风口。Wherein, the first airtight baffle is the above-mentioned middle baffle 220, the second airtight baffle is the above-mentioned upper baffle 210 and the lower baffle 230, and both the first airtight baffle and the second airtight baffle are arranged on the shell body 100; one side of the first front plug-in module is provided with a first through hole, and the other side is installed on one side of the first airtight baffle; one side of the second front plug-in module is provided with a second through hole, and the other side Installed on one side of the second airtight baffle; the rear plug-in module is located on the other side of the first airtight baffle and the second airtight baffle, and a first channel 510 is provided between the upper and lower sides of the rear plug-in module and the housing 100 , the two first passages 510 communicate with the rear plug-in module, one first passage 510 is provided with a first air inlet, and the other first passage 510 is provided with a first air outlet; the left and right sides of the rear plug-in module and the housing 100 There is a second channel 520 between them, the second channel 520 communicates with the first front module, and the second channel 520 is provided with a second air outlet; a third channel is provided between the left and right sides of the rear module and the housing 100 530, the third channel 530 communicates with the second front plug-in module, and the third channel 530 is provided with a third air outlet; the second air exhaust device is installed on the housing 100, and is used to make the air flow through the first air inlet, a second air outlet in sequence One channel 510, the rear module, another first channel 510 and the first air outlet; the third air exhaust device is installed on the housing 100, and is used to make air flow through the first through hole, the first front module, the second The second channel 520 and the second air outlet; the fourth air exhaust device is installed on the casing 100 for making air flow through the second through hole, the second front module, the third channel 530 and the third air outlet in sequence.
具体地,当后插模块为“Z”字型风道,并且第一前插模块和第二前插模块均为
Figure PCTCN2022080744-appb-000009
字型风道的散热架构时,上挡板210、中挡板220和下挡板230均使用密闭挡板,同时,需要在后插框600下方的第一通道510的后端安装上密闭挡板,并且需要在后插框600上方的第一通道510的后端、后插框600左右两侧的第二通道520和第三通道530的后端安装上散热装置。在第二安装状态下,第一前插模块和第二前插模块的风道为如图8所示的前进后出,进风口为第一前插模块和第二前插模块的面板处,即上述的第一通孔和第二通孔;出风口位于后插框600左右两侧的第二通道520和第三通道530的后端,即上述的第二出风口和第三出风口。另外,后插模块的风道为如图7所示的“Z”字型风道,进风口位于下前插框430下侧的第一通道510,即上述的第一入风口;出风口位于后插框600上侧的第一通道510,即上述的第一出风口。
Specifically, when the rear plug-in module is a "Z"-shaped air duct, and the first front plug-in module and the second front plug-in module are both
Figure PCTCN2022080744-appb-000009
When the heat dissipation structure of the font air duct is used, the upper baffle 210, the middle baffle 220, and the lower baffle 230 all use airtight baffles. board, and a heat sink needs to be installed on the rear end of the first channel 510 above the rear subframe 600, the rear ends of the second channel 520 and the third channel 530 on the left and right sides of the rear subframe 600. In the second installation state, the air ducts of the first front-plug module and the second front-plug module are front-to-back as shown in Figure 8, and the air inlets are at the panels of the first front-plug module and the second front-plug module. That is, the above-mentioned first through hole and second through hole; the air outlets are located at the rear ends of the second channel 520 and the third channel 530 on the left and right sides of the rear frame 600 , that is, the above-mentioned second air outlet and third air outlet. In addition, the air duct of the rear plug-in module is a "Z"-shaped air duct as shown in Fig. The first channel 510 on the upper side of the rear frame 600 is the above-mentioned first air outlet.
对于上述处于第二安装状态的散热架构,后插模块为“Z”字型风道,第一前插模块和第二前插模块均为
Figure PCTCN2022080744-appb-000010
字型风道,两个风道互不干扰。处于第二安装状态的散热构架会使得第一前插模块和第二前插模块的风道距离短,适合应用于第一前插模块和第二前插模块功耗大的情况;但是,由于后插模块的风道长,热级联严重,“Z”字型风道散热装置冗余备份出现单点失效时会使后插模块的散热能力急剧恶化,导致设备超温。
For the above-mentioned heat dissipation structure in the second installation state, the rear plug-in module is a "Z"-shaped air duct, and the first front plug-in module and the second front plug-in module are both
Figure PCTCN2022080744-appb-000010
The font air duct, the two air ducts do not interfere with each other. The heat dissipation frame in the second installation state will make the air duct distance between the first front-plug module and the second front-plug module short, which is suitable for the situation where the power consumption of the first front-plug module and the second front-plug module is large; however, due to The air duct of the rear module is long and the thermal cascade is serious. When the redundant backup of the "Z"-shaped air duct heat dissipation device has a single point of failure, the heat dissipation capacity of the rear module will deteriorate sharply, resulting in overheating of the equipment.
如图9至图10所示,图9是本申请一个实施例提供的散热架构处于第一安装状态时的风道结构侧视图;图10是本申请一个实施例提供的散热架构处于第一安装状态时的风道结构俯视图。As shown in Figures 9 to 10, Figure 9 is a side view of the air duct structure when the heat dissipation framework provided by one embodiment of the present application is in the first installation state; Figure 10 is a side view of the heat dissipation framework provided by one embodiment of the present application in the first installation state The top view of the air duct structure in the state.
散热架构还可以设置有第一安装状态,当散热架构处于第一安装状态,散热架构包括但不限于有壳体100、镂空挡板、第二密闭挡板、第一前插模块、第二前插模块、后插模块、第一排风装置和第四排风装置。The heat dissipation structure can also be provided with a first installation state. When the heat dissipation structure is in the first installation state, the heat dissipation structure includes but is not limited to a housing 100, a hollow baffle, a second airtight baffle, a first front plug-in module, a second front Plug-in module, rear plug-in module, first exhaust device and fourth exhaust device.
其中,镂空挡板即为上述的中挡板220,第二密闭挡板即为上述的上挡板210和下挡板230,镂空挡板和第二密闭挡板均设置于壳体100,镂空挡板设置有镂空孔;第一前插模块的一侧设置有第一通孔,另一侧安装于镂空挡板的一侧,第一前插模块与镂空孔连通;第二前插模块的一侧设置有第二通孔,另一侧安装于第二密闭挡板的一侧;后插模块位于镂空挡板的另一侧,后插模块与镂空孔连通,后插模块和壳体100之间设置有第一通道510,第一通道510和后插模块连通,第一通道510设置有第一出风口;后插模块的左右两侧和壳体100之间设置有第三通道530,第三通道530和第二前插模块连通,第三通道530设置有第三出风口;第一排风装置安装于壳体100,用于使空气依次流经第一通孔、第一前插模块、镂空孔、后插模块、第一通道510和第一出风口;第四排风装置安装于壳体100,用于使空气依次流经第二通孔、第二前插模块、第三通道530和第三出风口。Wherein, the hollow baffle is the above-mentioned middle baffle 220, the second airtight baffle is the above-mentioned upper baffle 210 and the lower baffle 230, both the hollow baffle and the second airtight baffle are arranged on the housing 100, and the hollow The baffle is provided with a hollow hole; one side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module communicates with the hollow hole; the second front insertion module One side is provided with a second through hole, and the other side is installed on one side of the second airtight baffle; the rear insertion module is located on the other side of the hollow baffle, and the rear insertion module communicates with the hollow hole, and the rear insertion module and the housing 100 A first channel 510 is provided between them, and the first channel 510 communicates with the rear plug-in module, and the first channel 510 is provided with a first air outlet; a third channel 530 is provided between the left and right sides of the rear plug-in module and the housing 100, The third channel 530 communicates with the second front module, and the third channel 530 is provided with a third air outlet; the first exhaust device is installed on the housing 100, and is used to make the air flow through the first through hole, the first Module, hollow hole, rear module, first channel 510 and first air outlet; the fourth air exhaust device is installed on the housing 100, used to make the air flow through the second through hole, the second front module, the third Channel 530 and the third air outlet.
具体地,当中部的第一前插模块与后插模块形成
Figure PCTCN2022080744-appb-000011
型风道,并且上下部的第二前插模块为
Figure PCTCN2022080744-appb-000012
字型风道的散热架构时,上挡板210和下挡板230均使用密闭挡板,中挡板220采用镂空挡板,同时,需要在后插框600下方的第一通道510的前端安装上密闭挡板,并且需要在后插框600上方和下方的两个第一通道510的后端、后插框600左右两侧的第三通道530的后端安装上散热装置,并且在第二通道520的后端安装上密闭挡板。在第一安装状态下,如图9所示,对于第一前插模块和后插模块,冷风从中部的第一前插模块进入,进风口为第一前插模块的面板处,即上述的第一通孔;然后流经第一前插模块和镂空挡板的镂空孔之后进入后插模块,分两路流经后插模块的上下部分,最后热风分别从后插模块上下侧的第一通道510流出,出风口位于后插框600上下两侧的第一通道510的后端,即上述的上下位置的两个第一出风口。另外,对于第二前插模块的风道结构如图10所示,和第二安装状态下的风道结构一致。
Specifically, the first front-plug module in the middle and the rear-plug module form a
Figure PCTCN2022080744-appb-000011
type air duct, and the second front module at the upper and lower parts is
Figure PCTCN2022080744-appb-000012
For the heat dissipation structure of the font-shaped air duct, the upper baffle 210 and the lower baffle 230 both use airtight baffles, and the middle baffle 220 adopts a hollow baffle. The upper airtight baffle, and the rear ends of the two first channels 510 above and below the rear frame 600, and the rear ends of the third channels 530 on the left and right sides of the rear frame 600 need to install heat sinks, and the second An airtight baffle is installed at the rear end of the channel 520 . In the first installation state, as shown in Figure 9, for the first front-plug module and the rear-plug module, cold air enters from the first front-plug module in the middle, and the air inlet is at the panel of the first front-plug module, that is, the above-mentioned The first through hole; then flows through the hollow hole of the first front module and the hollow baffle, and then enters the rear module, and flows through the upper and lower parts of the rear module in two ways, and finally the hot air flows from the first part of the upper and lower sides of the rear module respectively. The channel 510 flows out, and the air outlets are located at the rear ends of the first channel 510 on the upper and lower sides of the rear frame 600 , that is, the above-mentioned two first air outlets at the upper and lower positions. In addition, the air duct structure for the second front plug-in module is shown in FIG. 10 , which is consistent with the air duct structure in the second installation state.
对于上述处于第一安装状态的散热架构,中部的第一前插模块与后插模块形成
Figure PCTCN2022080744-appb-000013
型风道,并且上下部的第二前插模块为
Figure PCTCN2022080744-appb-000014
字型风道,两风道之间互不干扰。中部的第一前插模块与后插模块之间有热级联,导致中部的第一前插模块的散热能力下降,因此第一安装状态下的散热架构适用于中部的第一前插模块功耗较小的情况。由于
Figure PCTCN2022080744-appb-000015
型风道共用同一入风口,出风口分为两处,这就使得风道长度变短,在散热装置冗余备份出现单点失效时,后插模块散热可以满足基本的要求,设备可以长期正常工作。
For the above-mentioned heat dissipation structure in the first installation state, the first front-plug module in the middle and the rear-plug module form a
Figure PCTCN2022080744-appb-000013
type air duct, and the second front module at the upper and lower parts is
Figure PCTCN2022080744-appb-000014
The font air duct, the two air ducts do not interfere with each other. There is a thermal cascade between the first front module in the middle and the rear module, which reduces the heat dissipation capacity of the first front module in the middle. Therefore, the heat dissipation structure in the first installation state is suitable for the first front module in the middle. The case of low consumption. because
Figure PCTCN2022080744-appb-000015
The type air duct shares the same air inlet, and the air outlet is divided into two places, which shortens the length of the air duct. When a single point of failure occurs in the redundant backup of the cooling device, the heat dissipation of the rear plug-in module can meet the basic requirements, and the equipment can be normal for a long time. Work.
需要说明的是,第一通道510的数量为两个,两个第一通道510分别位于后插模块的上 下两侧和壳体100之间。It should be noted that there are two first passages 510, and the two first passages 510 are respectively located between the upper and lower sides of the rear plug-in module and the housing 100.
另外,需要说明的是,第二密闭挡板的数量为多块,多块第二密闭挡板分别位于镂空挡板的上下方位置,镂空挡板的镂空孔连通后插模块的中部位置。In addition, it should be noted that there are multiple second airtight baffles, and the multiple second airtight baffles are respectively located at the upper and lower positions of the hollow baffle, and the hollow holes of the hollow baffle communicate with the middle position of the rear plug-in module.
另外,需要说明的是,第一前插模块和第二前插模块之间设置有第一密闭隔板310,后插模块和第二通道520之间设置有第二密闭隔板320,第二通道520和第三通道530之间设置有第三密闭隔板330。In addition, it should be noted that a first airtight partition 310 is provided between the first front module and the second front module, a second airtight partition 320 is provided between the rear module and the second channel 520, and the second A third airtight partition 330 is disposed between the channel 520 and the third channel 530 .
另外,可以理解的是,关于上述的第一排风装置、第二排风装置、第三排风装置和第四排风装置,均可以为风扇。In addition, it can be understood that the above-mentioned first air exhaust device, second air exhaust device, third air exhaust device and fourth air exhaust device may all be fans.
基于上述图7至图8的散热架构处于第二安装状态时的风道结构以及图9至图10的散热架构处于第一安装状态时的风道结构,当需要由第二安装状态切换至第一安装状态时,需要把中部的第一前插模块对应的第一密闭挡板替换为镂空挡板,去掉对应的风扇,同时需要安装后插模块下部的风扇,把下侧风扇对应的挡板200安装上。Based on the above-mentioned air duct structure when the heat dissipation structure of FIGS. 7 to 8 is in the second installation state and the air duct structure when the heat dissipation structure of FIGS. 9 to 10 is in the first installation state, when it is necessary to switch from the second installation state to the first installation state In the installation state, the first airtight baffle corresponding to the first front module in the middle needs to be replaced with a hollow baffle, and the corresponding fan needs to be removed. At the same time, the fan at the bottom of the rear module needs to be installed, and the baffle corresponding to the lower fan 200 installed on.
其中,第一前插模块和第二前插模块的结构可以参照图11所示,后插模块的结构可以参照图12所示,密闭挡板的结构可以参照图13所示,镂空挡板的结构可以参照图14所示。Wherein, the structure of the first front insertion module and the second front insertion module can be referred to as shown in Figure 11; the structure of the rear insertion module can be referred to as shown in Figure 12; the structure of the airtight baffle can be referred to as shown in Figure 13; The structure can refer to Figure 14.
需要说明的是,以上两种安装状态下的散热架构可以在设备整体架构不变的情况下,通过替换挡板200类型,改变风扇的安装位置进行相互转换,弥补了现存设备散热架构一旦确定就不能改变的缺点;并且使用带第一通孔的前插模块,使得进风道与前插模块合一,提高了通讯设备的空间利用率,弥补了目前通讯设备散热架构风道与模块分离,导致空间浪费的缺点。It should be noted that the heat dissipation architectures in the above two installation states can be converted to each other by replacing the type of baffle 200 and changing the installation position of the fan while the overall architecture of the equipment remains unchanged, which makes up for the fact that the heat dissipation architecture of the existing equipment is fixed once it is determined. The shortcomings that cannot be changed; and the use of the front module with the first through hole makes the air inlet duct and the front module integrated, which improves the space utilization rate of the communication equipment and makes up for the separation of the air duct and the module of the current cooling structure of the communication equipment. Disadvantages that lead to wasted space.
另外,需要说明的是,关于上述带有第一通孔的镂空挡板,可以是纱网、均流网等带密孔的结构;关于上述的散热装置,可以是风扇,其中,风扇可以是风机、轴流式风机、离心式风机等排风装置;散热装置可以设置在设备的不同位置,如前插框、后插框600、设备四周和中部等。In addition, it should be noted that the above-mentioned hollow baffle plate with the first through hole can be a structure with dense holes such as a gauze net or a flow equalizer; the above-mentioned heat dissipation device can be a fan, wherein the fan can be Exhaust devices such as fans, axial flow fans, and centrifugal fans; cooling devices can be installed in different positions of the equipment, such as the front frame, the rear frame 600, around and in the middle of the device, etc.
另外,需要说明的是,通过对前插模块、后插模块中间的挡板200替换,风扇等散热装置的位置安装变化,而设计的不同散热架构之间转换的形式,其中包括但不限于:“Z”型与
Figure PCTCN2022080744-appb-000016
型风道相互转换、“Z”型与“L”型风道相互转换、“Z”型与“I”型风道相互转换、“L”型与“I”型风道相互转换、“L”型与
Figure PCTCN2022080744-appb-000017
型风道相互转换。
In addition, it should be noted that by replacing the baffle plate 200 in the middle of the front plug-in module and the rear plug-in module, the positions of cooling devices such as fans are changed, and the forms of conversion between different heat dissipation structures are designed, including but not limited to: "Z" type with
Figure PCTCN2022080744-appb-000016
The mutual conversion of "Z" and "L" air ducts, the mutual conversion of "Z" and "I" air ducts, the mutual conversion of "L" and "I" air ducts, the mutual conversion of "L" and "L""Type with
Figure PCTCN2022080744-appb-000017
The air ducts are converted to each other.
基于上述实施例,本申请实施例具有如下技术效果:1、空间利用率高:通过使用带密孔的前插模块,使得风道与模块合一,充分利用设备空间;2、设备通用率提升:不同的散热架构都有其优缺点,前插模块、后插模块的功耗变化时,可以使用不同的散热架构进行匹配,因此对于多变的插拔模块具有较好的兼容性,提高设备的通用;3、可扩展性强:可以通过设计不同的结构,来实现多种散热架构之间的转换;4、散热架构转换简单:通过替换挡板200等可替换结构,变化风扇等散热装置的位置,在设备整体架构不变的情况下转变设备的散热架构。Based on the above-mentioned embodiments, the embodiments of the present application have the following technical effects: 1. High space utilization rate: by using front-inserted modules with dense holes, the air duct and modules are integrated to make full use of equipment space; 2. The universal rate of equipment is improved. : Different heat dissipation architectures have their advantages and disadvantages. When the power consumption of the front plug-in module and the rear plug-in module changes, different heat dissipation architectures can be used for matching. Therefore, it has better compatibility with changeable plug-in modules and improves the equipment 3. Strong scalability: different structures can be designed to realize the conversion between various heat dissipation structures; 4. The heat dissipation structure conversion is simple: by replacing the baffle 200 and other replaceable structures, changing the heat dissipation devices such as fans The location of the device can change the heat dissipation structure of the device while the overall structure of the device remains unchanged.
另外,基于上述图5至图14所示的散热架构,本申请实施例还提供了一种通讯设备,具体地,本申请实施例的通讯设备包括但不限于上述任一实施例中的散热架构。In addition, based on the heat dissipation architecture shown in Figure 5 to Figure 14 above, the embodiment of the present application also provides a communication device, specifically, the communication equipment in the embodiment of the present application includes but is not limited to the heat dissipation architecture in any of the above embodiments .
需要说明的是,由于本申请实施例的通讯设备包括有上述任一实施例中的散热架构,因此,本申请实施例的通讯设备的具体实施方式和技术效果,可参照上述任一实施例中的散热架构的具体实施方式和技术效果。It should be noted that, since the communication device in the embodiment of the present application includes the heat dissipation structure in any of the above-mentioned embodiments, the specific implementation and technical effects of the communication device in the embodiment of the present application can refer to any of the above-mentioned embodiments. The specific implementation and technical effects of the heat dissipation architecture.
本申请实施例包括:本申请实施例的散热架构包括壳体、第一前插模块、后插模块和第一排风装置,其中,壳体设置有镂空挡板,镂空挡板设置有镂空孔;第一前插模块的一侧设置有第一通孔,另一侧安装于镂空挡板的一侧,第一前插模块与镂空孔连通;后插模块位于镂空挡板的另一侧,后插模块与镂空孔连通,后插模块和壳体之间设置有第一通道,第一通道和后插模块连通,第一通道设置有第一出风口;第一排风装置安装于壳体,用于使空气依次流经第一通孔、第一前插模块、镂空孔、后插模块、第一通道和第一出风口。根据本申请实施例的技术方案,本申请实施例在第一前插模块的一侧设置了用于进气的第一通孔,同时,还将第一前插模块和后插模块之间的挡板设计为带有镂空孔的镂空挡板,从而使得空气能够依次经过第一通孔、第一前插模块和镂空孔后再进入至后插模块,即第一前插模块所在的空间位置可以正常安装第一前插模块,还可以作为后插模块的入风通道,因此,入风通道和第一前插模块处于同一空间位置,无需单独设置入风通道,从而能够提高通讯设备的内部空间利用率。The embodiment of the present application includes: the heat dissipation structure of the embodiment of the present application includes a housing, a first front insertion module, a rear insertion module and a first exhaust device, wherein the housing is provided with a hollow baffle, and the hollow baffle is provided with a hollow hole One side of the first front insertion module is provided with a first through hole, and the other side is installed on one side of the hollow baffle, and the first front insertion module communicates with the hollow hole; the rear insertion module is located on the other side of the hollow baffle, The rear plug-in module communicates with the hollow hole, and there is a first channel between the rear plug-in module and the housing, the first channel communicates with the rear plug-in module, and the first channel is provided with a first air outlet; the first exhaust device is installed on the housing , for allowing air to flow through the first through hole, the first front module, the hollow hole, the rear module, the first channel and the first air outlet in sequence. According to the technical solution of the embodiment of the present application, the embodiment of the present application provides a first through hole for air intake on one side of the first front insertion module, and at the same time, the first through hole between the first front insertion module and the rear insertion module The baffle is designed as a hollow baffle with hollow holes, so that the air can pass through the first through hole, the first front module and the hollow hole in sequence before entering the rear module, that is, the space where the first front module is located The first front plug-in module can be installed normally, and it can also be used as the air inlet channel of the rear plug-in module. Therefore, the air inlet channel and the first front plug-in module are in the same spatial position, and there is no need to set up an air inlet channel separately, thereby improving the interior of the communication equipment. Space utilization.
上以上是对本申请的一些实施进行了具体说明,但本申请并不局限于上述实施方式,熟悉本领域的技术人员在不违背本申请范围的共享条件下还可作出种种等同的变形或替换,这些等同的变形或替换均包括在本申请权利要求所限定的范围内。The above is a specific description of some implementations of the present application, but the present application is not limited to the above-mentioned embodiments. Those skilled in the art can also make various equivalent deformations or replacements without violating the sharing conditions of the scope of the present application. These equivalent modifications or replacements are all within the scope defined by the claims of the present application.

Claims (10)

  1. 一种散热架构,设置有第一安装状态,当所述散热架构处于所述第一安装状态,所述散热架构包括:A heat dissipation structure, provided with a first installation state, when the heat dissipation structure is in the first installation state, the heat dissipation structure includes:
    壳体,设置有镂空挡板,所述镂空挡板设置有镂空孔;The shell is provided with a hollow baffle, and the hollow baffle is provided with a hollow hole;
    第一前插模块,一侧设置有第一通孔,另一侧安装于所述镂空挡板的一侧,所述第一前插模块与所述镂空孔连通;The first front insertion module is provided with a first through hole on one side, and the other side is installed on one side of the hollow baffle, and the first front insertion module communicates with the hollow hole;
    后插模块,位于所述镂空挡板的另一侧,所述后插模块与所述镂空孔连通,所述后插模块和所述壳体之间设置有第一通道,所述第一通道和所述后插模块连通,所述第一通道设置有第一出风口;The rear plug-in module is located on the other side of the hollow baffle, the rear plug-in module communicates with the hollow hole, a first channel is provided between the rear plug-in module and the housing, and the first channel Communicating with the rear plug-in module, the first channel is provided with a first air outlet;
    第一排风装置,安装于所述壳体,用于使空气依次流经所述第一通孔、所述第一前插模块、所述镂空孔、所述后插模块、所述第一通道和所述第一出风口。The first air exhaust device is installed on the housing, and is used to make the air flow through the first through hole, the first front module, the hollow hole, the rear module, and the first channel and the first air outlet.
  2. 根据权利要求1所述的散热架构,其中,所述第一通道的数量为两个,两个所述第一通道分别位于所述后插模块的上下两侧和所述壳体之间。The heat dissipation structure according to claim 1, wherein the number of the first channels is two, and the two first channels are respectively located between the upper and lower sides of the rear plug-in module and the housing.
  3. 根据权利要求2所述的散热架构,其中,所述散热架构设置有第二安装状态,当所述散热架构处于所述第二安装状态,所述散热架构包括:The heat dissipation architecture according to claim 2, wherein the heat dissipation architecture is provided with a second installation state, and when the heat dissipation architecture is in the second installation state, the heat dissipation architecture includes:
    所述壳体,设置有第一密闭挡板;The housing is provided with a first airtight baffle;
    所述第一前插模块,一侧设置有所述第一通孔,另一侧安装于所述第一密闭挡板的一侧;One side of the first front plug-in module is provided with the first through hole, and the other side is installed on one side of the first airtight baffle;
    所述后插模块,位于所述第一密闭挡板的另一侧,所述后插模块的上下两侧和所述壳体之间设置有所述第一通道,两个所述第一通道均与所述后插模块连通,一个所述第一通道设置有第一入风口,另一个所述第一通道设置有所述第一出风口;所述后插模块的左右两侧和所述壳体之间设置有第二通道,所述第二通道和所述第一前插模块连通,所述第二通道设置有第二出风口;The rear plug-in module is located on the other side of the first airtight baffle, the first channel is provided between the upper and lower sides of the rear plug-in module and the housing, and the two first channels are all connected to the rear plug-in module, one of the first passages is provided with the first air inlet, and the other first passage is provided with the first air outlet; the left and right sides of the rear plug-in module and the A second passage is provided between the housings, the second passage communicates with the first front-plug module, and the second passage is provided with a second air outlet;
    第二排风装置,安装于所述壳体,用于使空气依次流经所述第一入风口、一个所述第一通道、所述后插模块、另一个所述第一通道和所述第一出风口;The second air exhaust device is installed on the housing, and is used to make the air flow through the first air inlet, one of the first channels, the rear plug-in module, the other of the first channel and the first air outlet;
    第三排风装置,安装于所述壳体,用于使空气依次流经所述第一通孔、所述第一前插模块、所述第二通道和所述第二出风口。The third exhaust device is installed on the housing, and is used to make air flow through the first through hole, the first front module, the second channel and the second air outlet in sequence.
  4. 根据权利要求3所述的散热架构,其中,还包括:The heat dissipation architecture according to claim 3, further comprising:
    第二密闭挡板,设置于所述壳体;a second airtight baffle disposed on the housing;
    第二前插模块,一侧设置有第二通孔,另一侧安装于所述第二密闭挡板的一侧;The second front plug-in module has a second through hole on one side, and the other side is installed on one side of the second airtight baffle;
    第三通道,设置于所述后插模块的左右两侧和所述壳体之间,所述第三通道和所述第二前插模块连通,所述第三通道设置有第三出风口;The third channel is arranged between the left and right sides of the rear module and the housing, the third channel communicates with the second front module, and the third channel is provided with a third air outlet;
    第四排风装置,安装于所述壳体,用于使空气依次流经所述第二通孔、所述第二前插模块、所述第三通道和所述第三出风口。The fourth air exhaust device is installed on the housing, and is used to make air flow through the second through hole, the second front module, the third channel and the third air outlet in sequence.
  5. 根据权利要求4所述的散热架构,其中,所述第二密闭挡板的数量为多块,多块所述第二密闭挡板分别位于所述镂空挡板的上下方位置,所述镂空挡板的所述镂空孔连通所述后插模块的中部位置。The heat dissipation structure according to claim 4, wherein the number of the second airtight baffles is multiple, and the plurality of second airtight baffles are respectively located at the upper and lower positions of the hollow baffles, and the hollow baffles The hollow hole of the board communicates with the middle position of the rear plug-in module.
  6. 根据权利要求4所述的散热架构,其中:所述第一前插模块和所述第二前插模块之间设置有第一密闭隔板。The heat dissipation structure according to claim 4, wherein: a first airtight partition is arranged between the first front plug-in module and the second front plug-in module.
  7. 根据权利要求3所述的散热架构,其中:所述后插模块和所述第二通道之间设置有第二密闭隔板。The heat dissipation structure according to claim 3, wherein a second airtight partition is arranged between the rear plug-in module and the second channel.
  8. 根据权利要求4所述的散热架构,其中:所述第二通道和所述第三通道之间设置有第三密闭隔板。The heat dissipation structure according to claim 4, wherein: a third airtight partition is arranged between the second channel and the third channel.
  9. 根据权利要求4所述的散热架构,其中,所述第一排风装置、所述第二排风装置、所述第三排风装置和所述第四排风装置均为风扇。The heat dissipation structure according to claim 4, wherein the first air exhaust device, the second air exhaust device, the third air exhaust device and the fourth air exhaust device are all fans.
  10. 一种通讯设备,包括如权利要求1至9中任意一项所述的散热架构。A communication device, comprising the heat dissipation structure according to any one of claims 1-9.
PCT/CN2022/080744 2021-09-13 2022-03-14 Heat-dissipation structure and communication device WO2023035572A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102405694A (en) * 2011-09-06 2012-04-04 华为技术有限公司 Single board heat radiation method, radiation device, and communication device
CN102436298A (en) * 2012-01-20 2012-05-02 华为技术有限公司 Cooling device and blade server
CN102984923A (en) * 2012-11-20 2013-03-20 华为技术有限公司 Communication single board and communication device
US20160324035A1 (en) * 2013-12-27 2016-11-03 Zte Corporation Subrack and terminal
CN108541196A (en) * 2018-05-31 2018-09-14 烽火通信科技股份有限公司 A kind of heat dissipation water conservancy diversion cabinet
CN209731914U (en) * 2019-02-21 2019-12-03 烽火通信科技股份有限公司 A kind of blade server radiator structure and blade server

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102405694A (en) * 2011-09-06 2012-04-04 华为技术有限公司 Single board heat radiation method, radiation device, and communication device
CN102436298A (en) * 2012-01-20 2012-05-02 华为技术有限公司 Cooling device and blade server
CN102984923A (en) * 2012-11-20 2013-03-20 华为技术有限公司 Communication single board and communication device
US20160324035A1 (en) * 2013-12-27 2016-11-03 Zte Corporation Subrack and terminal
CN108541196A (en) * 2018-05-31 2018-09-14 烽火通信科技股份有限公司 A kind of heat dissipation water conservancy diversion cabinet
CN209731914U (en) * 2019-02-21 2019-12-03 烽火通信科技股份有限公司 A kind of blade server radiator structure and blade server

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