WO2023026483A9

WO2023026483A9 - Display device provided with function for displaying laser machining state, and machining control device comprising same

Info

Publication number: WO2023026483A9
Application number: PCT/JP2021/031559
Authority: WO
Inventors: 航希及川; 淳一手塚
Original assignee: ファナック株式会社
Priority date: 2021-08-27
Filing date: 2021-08-27
Publication date: 2024-01-04
Also published as: JPWO2023026483A1; WO2023026483A1; CN117836085A; DE112021007853T5

Abstract

The present invention is a display device provided with a function for displaying a laser machining state based on the energy density per unit machining length, said display device being provided with: a machining data acquisition unit that acquires a laser output value and a radiation coordinate value for a machining laser beam performing laser machining; a calculation unit that calculates the energy density per unit machining length on a tool path of the machining laser beam on the basis of the acquired laser output value and radiation coordinate value; and a display unit that associates and displays the calculated energy density with a position on the tool path.

Description

Display device with a function to display laser processing status and processing control device including the same

The present invention relates to a display device and a processing control device including the same, and particularly to a display device having a function of displaying a laser processing state based on energy density per unit processing length.

Laser processing equipment, such as laser cutting machines and laser welding machines, transmits laser light output from a laser oscillator, irradiates the workpiece, and performs predetermined processing by moving the laser light and the workpiece relative to each other. Can be done. In particular, in order to obtain a good cut cross section in laser cutting or a stable weld bead in laser welding, it is desirable that the energy density per unit processing length on the processing path be uniform (within a predetermined range). .

In this type of laser processing, if the processing path for the workpiece consists of a simple straight line, the energy density per unit processing length can be made uniform if processing is performed at a constant processing speed and constant laser output. can. However, when processing a workpiece of arbitrary shape along a two-dimensional or three-dimensional processing path by irradiating a laser beam, the processing path includes curved parts and corner parts. Since the machining speed decreases at the corners, there is a problem in that when machining is performed with a constant laser output, the energy density per unit machining length becomes non-uniform.

As an example of a laser processing device intended to solve such a problem, for example, Patent Document 1 discloses a processing path display device that displays a processing path in a laser processing machine, in which a predetermined control period of at least one drive shaft is set. A position information acquisition unit that acquires position information for each time, a laser processing head coordinate calculation unit that calculates the coordinate values of the laser processing head from the position information and information on the mechanical configuration of the laser processing machine, and a laser processing head coordinate calculation unit that calculates the laser output value of the laser. A processing path is determined based on the laser output acquisition unit that acquires the laser output value, the display format setting unit that sets the laser display format according to the acquired laser output value, and the coordinate values of the laser processing head and the set display format. A display unit for displaying information is disclosed. According to such a machining path display device, it is said that the relationship between the machining path and the laser output can be easily recognized.

Japanese Patent Application Publication No. 2018-180780

As mentioned above, when position information on the processing path of laser processing and laser output are displayed in association with each other, only the laser output value input to each processing point on the processing path is displayed. Therefore, it does not indicate data per unit machining length that takes into account the influence of machining speed. For this reason, it is not possible to grasp the state of energy density on the processing path simply by obtaining the relationship between the position information on the processing path and the laser output.

From this background, there is a need for a display device that can grasp the laser processing state by obtaining the energy density per unit processing length on the processing path, and a processing control device using the display device.

According to one aspect of the present invention, a display device having a function of displaying a laser processing state based on energy density per unit processing length uses processing data that acquires a laser output value and irradiation coordinate value of a processing laser beam that performs laser processing. an acquisition unit, a calculation unit that calculates the energy density per unit machining length on the machining path of the machining laser beam based on the acquired laser output value and irradiation coordinate value, and a calculation unit that corresponds the energy density to the position on the machining path. and a display section for displaying the following information.

Further, a processing control device according to one aspect of the present invention that controls a laser processing apparatus based on a processing program includes a program analysis unit that analyzes the processing program, and a processing laser beam that is transmitted to a laser oscillator based on the analyzed processing program. An oscillation command section that outputs oscillation commands, an irradiation position command section that outputs relative movement commands between the machining laser beam and the workpiece based on the analyzed machining program, and an irradiation position command section that outputs commands for relative movement between the machining laser beam and the workpiece based on the analyzed machining program. a display device having a display function; the display device includes a processing data acquisition unit that obtains a laser output value and an irradiation coordinate value of a processing laser beam that performs laser processing; The apparatus further includes a calculation section that calculates the energy density per unit processing length on the processing path of the processing laser beam based on the value, and a display section that displays the energy density in association with the position on the processing path.

According to one aspect of the present invention, the calculation unit calculates the energy density per unit machining length on the machining path of the machining laser beam based on the laser output value and the irradiation coordinate value acquired by the machining data acquisition unit, By using a configuration in which the display section displays the calculated energy density in association with the machining path, the laser machining status can be grasped on the display device by obtaining the energy density per unit machining length on the machining path. .

1 is a schematic diagram showing the configuration of a laser processing apparatus including a display device and a processing control device according to a first embodiment, which is a typical example of the present invention. FIG. 2 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 1. FIG. FIG. 3 is a schematic diagram showing an example of a processing path of laser processing according to the first embodiment. It is an example of the display mode in the display part of a display device. It is an example of the display mode in the display part of a display device. It is a block diagram showing the relationship between a display device and a processing control device according to a second embodiment of the present invention. FIG. 7 is a block diagram showing the relationship between a display device and a processing control device according to a third embodiment of the present invention. This is an example of a display mode in which the energy density shown in FIG. 4A is displayed as a processing pattern. This is an example of a display mode in which the energy density shown in FIG. 4B is displayed as a processing pattern. It is a schematic diagram showing the composition of a laser processing device including a display device and a processing control device by a 4th embodiment. 9 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 8. FIG.

Hereinafter, embodiments of a display device having a function of displaying a laser processing state and a processing control device including the display device according to a typical example of the present invention will be described with reference to the drawings.

<First embodiment>
FIG. 1 is a schematic diagram showing the configuration of a laser processing apparatus including a display device and a processing control device according to a first embodiment, which is a typical example of the present invention. Further, FIG. 2 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 1.

As shown in FIG. 1, the laser processing apparatus 1 includes, for example, a laser oscillator 10 that oscillates a processing laser beam LB, a processing table 20 that holds a workpiece W, and a processing head that irradiates the workpiece W with the processing laser beam LB. 30, a transport mechanism 40 that moves the processing head 30 relative to the processing table 20, and a processing control device 50 that controls a predetermined laser processing operation on the workpiece W. Further, the processing control device 50 is connected to a display device 100.

The laser processing apparatus in this specification performs predetermined processing by irradiating a processing laser beam onto a workpiece W, such as laser welding, laser cutting, laser drilling (trepanning), laser marking, laser dicing, or laser annealing. It can be applied as any processing device. In addition, in the following embodiment, the case of laser cutting among the above-mentioned laser processing will be explained as an example.

As the laser oscillator 10, a laser source with a wavelength having high absorption efficiency is applied depending on the material of the workpiece W to be processed. Examples of such a laser oscillator 10 include those capable of fiber transmission, such as a YAG laser, a YVO ₄ laser, a fiber laser, and a disk laser. Furthermore, the processing laser beam LB output from the laser oscillator 10 is transmitted to the processing head 30 via a transmission path 12 such as an optical fiber.

As an example, the processing table 20 includes a chuck mechanism (not shown) for attaching the workpiece W, and is configured to grip and fix the workpiece W. Furthermore, the processing table 20 may include not only a mechanism for moving the workpiece W in the three axial directions of XYZ, but also a rotation mechanism.

As an example, the processing laser beam LB is introduced into the processing head 30 from one end (upper end) side, and is emitted toward the workpiece W from the nozzle 32 at the other end (lower end) side. At this time, the processing laser beam LB is focused to a predetermined beam diameter at a focusing point FP on the workpiece W by a condensing lens (not shown) disposed inside the processing head 30.

Further, high-pressure oxygen gas, compressed air, etc. are introduced into the processing head 30, and are injected coaxially with the processing laser beam LB from the nozzle 32 as an assist gas for laser cutting processing. Furthermore, the processing head 30 has a built-in output sensor (not shown) for measuring the laser output value P of the processing laser beam LB, and also has a function of transmitting the detection signal to the processing control device 50. ing.

The processing head 30 for irradiating the processing laser beam LB onto the focal point FP of the workpiece W may have a scanning optical unit (not shown) such as a galvano mirror built therein instead of the above-mentioned structure. The scanning optical unit may scan the optical axis of the processing laser beam LB with respect to the workpiece W. Thereby, by using the processing laser beam LB as a so-called long focal length laser, higher speed laser processing (remote processing) becomes possible.

As an example, the transport mechanism 40 is configured as a linear drive body that moves relatively in three axes directions of X, Y, and Z that are orthogonal to each other, and the processing head 30 is attached to one end of the linear drive body. Note that the transport mechanism 40 may be configured as a 6-axis or 7-axis type industrial robot including a robot arm with the processing head 30 attached to one end.

As shown in FIG. 2 as an example, the machining control device 50 according to the first embodiment includes a main control unit 52 that controls the overall operation of the machining control device 50, and a machining program that reads a machining program stored in a database or the like. A program analysis unit 54 that analyzes the machining program; an irradiation position command unit 56 that transmits and receives signals between the machining table 20 and the transport mechanism 40 based on the analysis result of the machining program; and an oscillation command section 58 that transmits and receives signals to and from the laser oscillator 10. Further, the machining control device 50 according to the first embodiment may further include an input interface (not shown) to be described later, and may be configured to manually modify the machining program.

[Amendment based on Rule 91 04.10.2023]
On the other hand, the display device 100 according to the first embodiment, as shown in FIG. A machining data acquisition unit 120 that acquires a value (P) and irradiation coordinate values (x, y, z), and a machining path of the machining laser beam LB based on the laser output value P and irradiation coordinate values (x, y, z). (See symbols S1 to S6 in FIG. 3, which will be described later) A calculation unit 130 that calculates the energy density J per unit machining length shown above, and a display unit 140 that displays the calculated energy density J in association with the machining path. Equipped with. As shown in FIG. 1, such a display device 100 may be configured not only as a stationary device alongside the processing control device 50 but also as a portable device such as a tablet terminal.

The main control unit 52 of the processing control device 50 sends control commands analyzed by a program analysis unit 54 (described later) to an irradiation position command unit 56 and an oscillation command unit 58 for each content, and the laser processing device 1 is not shown in the illustration. It is connected to various sensors, etc., and receives these detection signals. As an example, the main control unit 52 receives a detection signal from an output sensor provided in the processing head 30 of the laser processing apparatus 1 described above, and uses this as the laser output value P of the processing laser beam LB on the display device 100. It is transmitted to the processed data acquisition unit 120.

For example, the program analysis unit 54 reads blocks of a machining program from an external storage device (not shown) such as a database and analyzes them to determine what kind of control commands are included in the machining program. , temporarily stores and saves the loaded machining program block. Then, the program analysis section 54 sends a control command for the determined machining program to the main control section 52.

For example, the irradiation position command section 56 receives a control command including the optical axis and focal position of the processing laser beam LB based on the processing program and the movement position of the workpiece W from the main control section 52, and controls the processing table 20 and the transport mechanism. A drive command signal is individually outputted to each of the

motors

40 and 40. Furthermore, the irradiation position command unit 56 determines the irradiation coordinate value ( x, y, z) and sends the calculated data to the processed data acquisition unit 120 of the display device 100.

Here, in calculating the above-mentioned irradiation coordinate values (x, y, z), the irradiation position command unit 56 calculates, for example, the representative position (movement position) of the work W after movement instructed to the processing table 20 and the transport mechanism. A method of calculating the intersection of the extension line of the optical axis of the processing laser beam LB and the upper surface of the workpiece W as irradiation coordinate values (x, y, z) based on the nozzle tip position of the processing head 30 commanded by 40. etc. can be used. Alternatively, the processing program may include the irradiation coordinate values (x, y, z), and the movement command values for the processing table 20 and the transport mechanism 40 may be calculated backward from the irradiation coordinate values.

For example, the oscillation command unit 58 receives a control command including an output value of the machining laser beam LB corresponding to the irradiation coordinate values (x, y, z) on the machining path based on the machining program from the main control unit 52. , outputs an oscillation command signal to the laser oscillator 10. Here, in this specification, the processing laser beam LB can be applied to either continuous oscillation or pulse oscillation, but in the first embodiment, the oscillation command signal is set to a duty ratio D with an output command value Cp. An example of outputting pulse oscillation is shown below.

For example, the display control unit 110 of the display device 100 internally holds a display program, and outputs drive commands to the processed data acquisition unit 120, the calculation unit 130, and the display unit 140 based on the display program. Note that the drive command based on the display program may be selectively issued at a timing based on an external input from an operator.

The machining data acquisition unit 120 receives the actual measured value of the laser output value P of the machining laser beam LB and the command value of the irradiation coordinate values (x, y, z) from the main control unit 52 or the irradiation position command unit 56 of the machining control device 50. and sends the data of these acquired values to the display control section 110 and the calculation section 130. Further, the processed data acquisition unit 120 may be configured to include a memory (not shown) that temporarily stores the acquired data, and has a function of temporarily storing the data acquired in real time until the end of the process. Note that the display control section 110 can grasp the current processing position and processing state based on the data sent from the processing data acquisition section 120.

The calculation unit 130 calculates the value per unit machining length on the machining path of the machining laser beam LB based on the laser output value P and the irradiation coordinate values (x, y, z) sent from the machining data acquisition unit 120. Calculate energy density J. Then, the calculated energy density J data and each data from the processed data acquisition section 120 are sent to the display section 140.

Here, the calculation of the energy density J per unit machining length performed in the calculation unit 130 is performed as follows, as an example. That is, first, by substituting continuous displacement data for the time of the irradiation coordinate values (x, y, z) sent from the processing data acquisition unit 120 into the following formula 1, the processing path of the processing laser beam LB is determined. The processing speed F at the upper irradiation position (focusing point FP) is calculated.

Next, by substituting the above calculated machining speed F and the laser output value P for each irradiation coordinate value (x, y, z) sent from the machining data acquisition unit 120 into the following formula 2, the machining laser beam The energy density J per unit machining length on the machining path by LB is calculated. Then, as described above, the calculation unit 130 sends the thus calculated machining speed F and energy density J to the display unit 140 as data associated with each other on the machining path.

Based on the drive command from the display control unit 110, the display unit 140 displays each data sent from the calculation unit 130 as characters or charts in association with the machining path. Examples of such a display section 140 include known display means such as a liquid crystal display panel and an organic EL display. Further, the display unit 140 may be configured to use a touch panel display to allow input by the operator.

Next, a specific example of the operation of the display device according to the first embodiment will be described using FIGS. 3 and 4.

FIG. 3 is a schematic diagram showing an example of a processing path of laser processing according to the first embodiment. Further, FIGS. 4A and 4B are examples of display modes on the display section of the display device, respectively. Note that FIG. 4A shows the case where the same laser output value P is issued at all positions on the processing paths S1 to S6 shown in FIG. 3, and FIG. 4B shows the case where the laser output value P is appropriately set for each of the processing paths S1 to S6. This shows the case where the command is given so that the energy density J per unit machining length is constant.

[Amendment based on Rule 91 04.10.2023]
As shown in FIG. 3, the machining paths S1 to S6 according to the first embodiment are routes that return from the machining start point P1 to the machining start point P1 via intermediate passing points P2 to P6. By scanning the processing path with the processing laser beam LB, laser cutting processing is performed in which the inner portion W1 is cut out from the workpiece W.

Further, the machining paths S1 to S6 according to the first embodiment include straight paths S1, S3, and S6 formed only by straight lines, a curved path S2 formed only by curved lines, and two straight lines at the passing point P5. It is composed of intersecting refraction paths S4+S5. When controlling the scanning of the processing laser beam LB in such a processing path, the straight paths S1, S3, S6 and the curved path S2 can be controlled at the same processing speed within each section, but the refracted path S4+S5 In this case, since the moving direction of the optical axis of the processing laser beam LB is switched, it is necessary to decelerate and reaccelerate near the passing point P5.

Therefore, as shown in FIG. 4A, if the laser output value P is controlled to be the same at all positions on the processing path, for example, the straight paths S1, S3 and If the laser output value P at the machining speed F in S6 is an appropriate output, the machining speed F is reduced in the curved path S2 or the refracted path S4+S5, so the energy density J per unit machining length is equal to the curved path S2. And the refraction path S4+S5 is larger than the straight paths S1, S3, and S6. Therefore, in these curved path S2 and refracted path S4+S5, excessive heat input by the processing laser beam LB to the workpiece W becomes a cause of quality deterioration such as generation of dross on the cut surface.

On the other hand, as shown in FIG. 4B, when controlling so that the energy density J per unit machining length is constant at all positions of the machining paths S1 to S6, the machining process at each of the machining paths S1 to S6 Increase or decrease the laser output value P in response to the speed F (for example, if the machining speed F increases, the laser output value P will be commanded to increase, and if the machining speed F decreases, the laser output value P will also decrease. An oscillation command is given to the laser oscillator 10 as shown in FIG. In this way, the energy density J per unit machining length is calculated based on the machining speed F calculated from the irradiation coordinate values (x, y, z) of the machining laser beam LB and the laser output value P at the coordinate values, By displaying this in association with each position on the machining paths S1 to S6, the heat input situation for each machining path can be grasped, making it possible to predict the machining quality such as the properties of the cut surface.

In the above specific example, the machining data acquisition unit 120 of the display device 100 acquires the laser output value P of the machining laser beam LB and the irradiation coordinates from the outside (the main control unit 52 and the irradiation position command unit 56 of the machining control device 50). Although the case where the values (x, y, z) are acquired in real time has been illustrated, as a modification of the first embodiment, when the machining program is analyzed by the program analysis unit 54 of the machining control device 50, the machining program includes the laser output value P and irradiation coordinate values (x, y, z) on the processing path of the processing laser beam LB, the processing data acquisition section 120 directly obtains these data from the main control section 52. Since the display as shown in FIGS. 4A and 4B can be performed without performing actual processing, it is also possible to predict the laser processing state from the processing program.

In addition, as another modification of the first embodiment, the calculation unit 130 calculates that the calculated energy density J is outside a predetermined range (for example, outside the upper or lower limit of the energy density J that provides appropriate properties of the cut surface). When this occurs, a notification command may be issued to the display unit 140 to indicate that there is an abnormality in the laser processing state. This makes it possible to determine whether there is an abnormality (such as a large processing defect) in the laser processing during or after the laser processing.

By having the above-described configuration, the display device according to the first embodiment allows the calculation unit to determine the position of the processing laser beam on the processing path based on the laser output value and the irradiation coordinate value acquired by the processing data acquisition unit. By using a configuration in which the energy density per unit machining length is calculated and the display section displays the calculated energy density in association with the machining path, the energy density per unit machining length on the machining path is obtained. It is possible to easily understand the laser processing state in the device.

<Second embodiment>
FIG. 5 is a block diagram showing the relationship between the display device and the processing control device according to the second embodiment of the present invention. In addition, in the second embodiment, in the schematic diagrams shown in FIGS. 1 to 4, the same reference numerals are given to those parts that can have the same or common configurations as those in the first embodiment. The explanation of the repetition of is omitted.

As shown in FIG. 5, in the display device 100 according to the second embodiment, the machining data acquisition unit 120 receives the laser output value P of the machining laser beam LB from the irradiation position command unit 56 and the oscillation command unit 58 of the machining control device 50. The configuration differs from the display device 100 according to the first embodiment shown in FIG. 2 in that the actual measured value and the command value of the irradiation coordinate values (x, y, z) are acquired. That is, the display device 100 according to the second embodiment uses the output command value Cp to the laser oscillator 10 that oscillates the processing laser beam LB as the laser output value P to be acquired.

That is, as described above, the oscillation command unit 58 of the processing control device 50 outputs an oscillation command signal by pulse oscillation with an output command value Cp and a duty ratio D to the laser oscillator 10 based on the analysis result of the processing program. Therefore, by substituting these output command value Cp and duty ratio D into Equation 3 shown below, it is converted into a laser output value P for each irradiation coordinate value (x, y, z) of the processing laser beam LB.

Then, by substituting the laser output value P calculated by the above formula 3 into the formula 2 together with the machining speed F separately calculated by the formula 1, the energy density J per unit machining length on the machining path by the machining laser beam LB is calculated. Calculate. In this way, the laser processing state can be predicted using the oscillation command signal sent to the laser oscillator 10 by the oscillation command unit 58 without actually measuring the laser output value P of the processing laser beam LB using an output sensor or the like.

By having the above configuration, the display device according to the second embodiment can include the laser output value of the processing laser beam in the oscillation command signal to the laser oscillator, in addition to the effects described in the first embodiment. By performing the conversion using the output command value, it is possible to omit detection means such as an output sensor for actually measuring the laser output value during processing.

<Third embodiment>
FIG. 6 is a block diagram showing the relationship between the display device and the processing control device according to the third embodiment of the present invention. In addition, in the third embodiment, in the schematic diagrams shown in FIGS. 1 to 5, the same reference numerals are given to parts that can adopt the same or common configurations as those in the first and second embodiments. A repeated explanation of these steps will be omitted.

As shown in FIG. 6, in the display device 100 according to the third embodiment, based on the irradiation coordinate values (x, y, z) acquired by the processing data acquisition unit 120 and the energy density J calculated by the calculation unit 130, The configuration differs from the display device 100 according to the first embodiment shown in FIG. 2 in that it further includes a pattern creation section 150 that creates a processing pattern along the processing path. That is, the display device 100 according to the third embodiment reflects the data of the energy density J calculated on the machining pattern simulating the machining path, instead of the graph shown in FIG. 4A or FIG. 4B of the first embodiment. indicate.

FIGS. 7A and 7B are examples of display modes in which the energy densities shown in FIGS. 4A and 4B, respectively, are displayed as processing patterns. As shown in FIGS. 7A and 7B, when the laser output value P is controlled to be the same at all positions on the processing path, the pattern creation unit 150 creates the irradiation coordinate values ( x, y, z) and the energy density J to create a planar processing pattern that imitates the processing path shown in FIG. 3. The display unit 140 then displays the created machining pattern.

At this time, the machining pattern is colored or expressed in shading according to the value of the energy density J, thereby displaying the height of the energy density J on the machining paths S1 to S6. For example, as shown in FIG. 7A, if the energy density J per unit machining length on straight paths S1, S3, and S6 is within a "predetermined range" that provides an appropriate machining state, the machining speed F is small and the energy The curved path S2 and the refracted path S4+S5 where the density J increases are displayed in a gradation of shading depending on the density.

In particular, in the machining pattern shown in FIG. 7A, in the refraction path S4+S5, the machining speed F gradually decreases toward the passing point P5, so the energy density J per unit machining length changes from area A2 to area A3. The display gradually becomes darker as it gradually increases in size. By displaying such machining patterns, it is possible to intuitively understand which position on the machining path is within the appropriate energy density range. location or area).

On the other hand, as shown in FIG. 7B, when the laser output value P is controlled so that the energy density J per unit machining length is constant at all positions on the machining path, a predetermined range is shown in all the machining paths. The machining pattern will be displayed. Accordingly, it can be assumed that the laser processing state has been properly completed.

In the specific example shown in FIGS. 7A and 7B, the machining pattern is expressed as a two-dimensional planar one, but depending on the shape of the workpiece and the machining path, the machining pattern can be expressed as a three-dimensional solid. It may be configured to express the Moreover, although the case where the energy density per unit machining length is displayed in color or shading has been exemplified, it may be configured so that the magnitude of the energy density is expressed by the width of the machining pattern. These representations make it possible to provide more intuitive visual information to the operator.

By having the above-described configuration, the display device according to the third embodiment has, in addition to the effects described in the first embodiment, a pattern creation section that creates a processing pattern along the processing path. This makes it possible to intuitively check the energy density distribution in the machining pattern. In particular, by displaying the energy density on the machining path in color or in shading, it becomes possible to grasp at which position or region the machining accuracy decreases.

<Fourth embodiment>
FIG. 8 is a schematic diagram showing the configuration of a laser processing apparatus including a display device and a processing control device according to the fourth embodiment. Further, FIG. 9 is a block diagram showing the relationship between the display device and the processing control device shown in FIG. 8. In addition, in the third embodiment, in the schematic diagrams shown in FIGS. 1 to 7, the same reference numerals are given to parts that can have the same or common configurations as those in the first to third embodiments. A repeated explanation of these steps will be omitted.

As shown in FIG. 8, the processing control device 50 of the laser processing apparatus 1 according to the fourth embodiment is different from the processing according to the first embodiment shown in FIG. The configuration is different from that of the control device 50 and the display device 100. Although FIG. 8 shows an example in which the display device 100 is incorporated into the same housing as the processing control device 50, it is also possible to configure the display device 100 shown in FIG. 1 to include the processing control device 50. You may.

[Amendment based on Rule 91 04.10.2023]
As shown in FIG. 9 as an example, the machining control device 50 includes a main control unit 52 that controls the overall operation of the machining control device 50, and reads a machining program stored in a database or the like and analyzes the machining program. A program analysis section 54, an irradiation position command section 56 that transmits and receives signals between the processing table 20 and the transport mechanism 40 based on the analysis results of the processing program, and a laser oscillator 10 based on the analysis results of the processing program. It includes an oscillation command section 58 for transmitting and receiving signals between the two, an input interface 60 for an operator to input various information, and a display device 100 integrated therein. As in the case of the first embodiment, the display device 100 includes a display control unit 110 that controls the overall operation of the display device 100, and a laser output value (P) and a laser output value (P) of the processing laser beam LB that performs laser processing. A machining data acquisition unit 120 that acquires irradiation coordinate values (x, y, z), and a unit machining length on the machining path of the machining laser beam LB based on the laser output value P and the irradiation coordinate values (x, y, z). It includes a calculation section 130 that calculates the energy density J per area, and a display section 140 that displays the calculated energy density J in association with the machining path.

Further, as shown in FIG. 9, in the processing control device 50 according to the fourth embodiment, the main control section 52 is configured to exchange signals with the display control section 110 of the display device 100. A command can be issued to 140 to display various information necessary for controlling the operation of the laser processing apparatus 1. Note that although FIG. 9 illustrates a case where the main control unit 52 of the processing control device 50 and the display control unit 110 of the display device 100 are configured separately, the main control unit 52 is a display control unit. 110 may be integrated and configured to serve the functions of 110.

The input interface 60 is configured as an information input terminal including, for example, input buttons and a numeric keypad. As a result, the operator who sees the result of the energy density J displayed on the display unit 140 of the display device 100 manually inputs various parameters in the machining program, such as the machining speed F and the laser output value P (or output command value Cp). It can be corrected by Although FIGS. 8 and 9 illustrate a case where the input interface 60 and the display unit 140 of the display device 100 are configured separately, the display unit 140 may be a panel display unit that allows touch input. It is also possible to adopt a configuration that integrates the two.

By having the above configuration, the machining control device according to the fourth embodiment has the effects described in the first embodiment, and by incorporating the display device into the machining control device, the internal configuration can be improved. It is possible to integrate them and to make the overall size compact.

Note that the present invention is not limited to the above embodiments, and can be modified as appropriate without departing from the spirit. Within the scope of the present invention, any component of the embodiments may be modified or any component of the embodiments may be omitted.

For example, the specific examples shown in the first to fourth embodiments may be applied by combining their respective characteristics. For example, it is also possible to have a configuration in which the display device shown in the second embodiment and the processing control device shown in the fourth embodiment are combined.

1 Laser processing device 10 Laser oscillator 12 Transmission path 20 Processing table 30 Processing head 32 Nozzle 40 Transport mechanism 50 Processing control device 52 Main control section 54 Program analysis section 56 Irradiation position command section 58 Oscillation command section 60 Input interface 100 Display device 110 Display Control unit 120 Processing data acquisition unit 130 Calculation unit 140 Display unit 150 Pattern creation unit

Claims

A display device having a function of displaying a laser processing state based on energy density per unit processing length,
a processing data acquisition unit that obtains a laser output value of a processing laser beam that performs laser processing and an irradiation coordinate value of the processing laser beam;
a calculation unit that calculates an energy density per unit machining length on a machining path of the machining laser beam based on the laser output value and the irradiation coordinate value;
a display unit that displays the energy density in association with a position on the processing path;
A display device equipped with
The display device according to claim 1, wherein the machining data acquisition unit acquires the laser output value and the irradiation coordinate value of the machining laser beam in real time during the laser machining.
The display device according to claim 1, wherein the machining data acquisition unit acquires the laser output value and the irradiation coordinate value of the machining laser beam by analyzing a machining program that controls the laser machining.
4. The display device according to claim 1, wherein the laser output value is an output command value to a laser oscillator that oscillates the processing laser beam.
further comprising a pattern creation unit that creates a processing pattern along the processing path based on the irradiation coordinate value and the energy density,
5. The display device according to claim 1, wherein the display section displays the energy density on the machining path by coloring or shading the machining pattern.
The display device according to any one of claims 1 to 5, wherein the calculation unit issues a notification command to the display unit to display that there is an abnormality when the calculated energy density falls outside a predetermined range. .
A processing control device that controls a laser processing device based on a processing program,
a program analysis unit that analyzes the machining program;
an oscillation command unit that outputs a processing laser beam oscillation command to a laser oscillator based on the analyzed processing program;
an irradiation position command unit that outputs a relative movement command between the processing laser beam and the workpiece based on the analyzed processing program;
a display device having a function of displaying a laser processing state based on energy density per unit processing length;
Equipped with
The display device includes:
a processing data acquisition unit that obtains a laser output value of a processing laser beam that performs laser processing and an irradiation coordinate value of the processing laser beam;
a calculation unit that calculates an energy density per unit machining length on a machining path of the machining laser beam based on the laser output value and the irradiation coordinate value;
a display unit that displays the energy density in association with a position on the processing path;
A processing control device further equipped with
The processing control device according to claim 7, wherein the processing data acquisition unit obtains the laser output value and the irradiation coordinate value of the processing laser beam in real time during the laser processing.
The processing control device according to claim 7, wherein the processing data acquisition unit obtains the laser output value and the irradiation coordinate value of the processing laser beam by analyzing a processing program that controls the laser processing.
The processing control device according to any one of claims 7 to 9, wherein an output command value to a laser oscillator that oscillates the processing laser beam is used as the laser output value.
further comprising a pattern creation unit that creates a processing pattern along the processing path based on the irradiation coordinate value and the energy density,
The processing control device according to any one of claims 7 to 10, wherein the display section displays the energy density on the processing path by coloring or shading the processing pattern.
The processing control according to any one of claims 7 to 11, wherein the calculation unit issues a notification command to the display unit to display that there is an abnormality when the calculated energy density falls outside a predetermined range. Device.
The machining control device according to any one of claims 7 to 12, further comprising an input interface for modifying the machining program.