WO2023024611A1

WO2023024611A1 - Method and apparatus for controlling air supply of air conditioner, and air conditioner indoor unit

Info

Publication number: WO2023024611A1
Application number: PCT/CN2022/094666
Authority: WO
Inventors: 秦玲; 周小光; 张振富
Original assignee: 青岛海尔空调器有限总公司; 青岛海尔空调电子有限公司; 海尔智家股份有限公司
Priority date: 2021-08-25
Filing date: 2022-05-24
Publication date: 2023-03-02
Also published as: CN113819612B; CN113819612A

Abstract

The present application relates to the technical field of air supply of air conditioners, and discloses a method for controlling air supply of an air conditioner, comprising: determining a current operating mode of an air conditioner; when the air conditioner is operating in a cooling mode, controlling the windward side of a semiconductor element to perform cooling to cool down the airflow passing through an air outlet; or when the air conditioner is operating in a first mode, controlling the windward side of the semiconductor element to perform heating to heat the airflow passing through the air outlet; or when the air conditioner is operating in a direct blowing mode, controlling the windward side of the semiconductor element to perform cooling/heating to cool/heat the airflow passing through the air outlet. Users can switch the operation mode of the air conditioner according to their own needs. The air conditioner adjusts the cooling/heating on the windward side of an air deflector according to the mode selected by a user, and changes the outlet air temperature, so as to cause the outlet air temperature to meet individual needs of users. The present application also discloses an apparatus for controlling air supply of an air conditioner, and an air conditioner indoor unit.

Description

Method and device for controlling air supply of air conditioner and air conditioner indoor unit

This application is based on a Chinese patent application with application number 202110982947.7 and a filing date of August 25, 2021, and claims the priority of this Chinese patent application. The entire content of this Chinese patent application is hereby incorporated by reference into this application.

technical field

The present application relates to the technical field of air supply of air conditioners, for example, to a method and device for controlling air supply of an air conditioner, and an air conditioner indoor unit.

Background technique

At present, the air conditioner has become an indispensable household appliance for air conditioning in the family. During the use of the indoor unit of the air conditioner, condensation will occur on the air deflector. In order to avoid condensation on the air deflector of the indoor unit, the prior art discloses an air deflector for an air conditioner. An interlayer is formed between the bodies, and semiconductor elements capable of heating the first plate body and/or the second plate body are arranged in the interlayer.

In the process of using the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:

The prior art only discloses the structure of the wind deflector, but does not disclose a specific method for controlling the wind deflector.

Contents of the invention

In order to provide a basic understanding of some aspects of the disclosed embodiments, a brief summary is presented below. The summary is not intended to be an extensive overview nor to identify key/important elements or to delineate the scope of these embodiments, but rather serves as a prelude to the detailed description that follows.

An embodiment of the present disclosure provides a method for controlling air supply of an air conditioner, so as to realize variable temperature air supply and meet user's personalized air supply requirements.

In some embodiments, the method includes: determining the current operating mode of the air conditioner; when the air conditioner is operating in cooling mode, controlling the cooling of the windward side of the semiconductor element to cool down the airflow passing through the air outlet; or When operating in the first mode, control the heating on the windward side of the semiconductor element to heat the airflow passing through the air outlet; or control the cooling/heating on the windward side of the semiconductor element when the air conditioner is operating in the direct blowing mode, Cools/heats the airflow passing through the air outlet.

In some embodiments, the device includes a processor and a memory storing program instructions, and the processor is configured to execute the above-mentioned method for controlling air supply of an air conditioner when executing the program instructions.

In some embodiments, the air conditioner indoor unit includes: a wind deflector disposed at the air outlet; and the above-mentioned device for controlling the air supply of the air conditioner. Wherein, the wind deflector includes: a first plate body; a second plate body, arranged opposite to the first plate body, forming an interlayer with the first plate body; a semiconductor element, arranged on the interlayer middle.

The method and device for controlling the air supply of an air conditioner and the air conditioner indoor unit provided by the embodiments of the present disclosure can achieve the following technical effects:

The user switches the operation mode of the air conditioner according to his own needs, and the air conditioner adjusts the cooling/heating situation on the windward side of the air deflector according to the mode selected by the user, and changes the outlet air temperature so that the outlet air temperature can meet the user's individual needs .

The foregoing general description and the following description are exemplary and explanatory only and are not intended to limit the application.

Description of drawings

One or more embodiments are exemplified by the corresponding drawings, and these exemplifications and drawings do not constitute a limitation to the embodiments, and elements with the same reference numerals in the drawings are shown as similar elements, The drawings are not limited to scale and in which:

FIG. 1 is a schematic structural diagram of an air conditioner indoor unit provided by an embodiment of the present disclosure;

Fig. 2 is a schematic structural diagram of an inner wind deflector provided by an embodiment of the present disclosure;

Fig. 3-1 is a schematic flow chart of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

Fig. 3-2 is a schematic flow chart of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

Fig. 3-3 is a schematic flow chart of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

3-4 are schematic flowcharts of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

3-5 are schematic flowcharts of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

3-6 are schematic flowcharts of controlling the air supply of an air conditioner provided by an embodiment of the present disclosure;

Fig. 4 is a schematic diagram of the position of the inner air deflector when the air conditioner is running in cooling mode and cooling running sleep mode according to an embodiment of the present disclosure;

Fig. 5 is a schematic diagram of the cooling/heating condition of the inner air deflector when the air conditioner is running in cooling mode according to an embodiment of the present disclosure;

Fig. 6 is a schematic diagram of the position of the inner air deflector when the air conditioner is running in the heating mode according to an embodiment of the present disclosure;

Fig. 7 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner is running in the heating mode provided by an embodiment of the present disclosure;

Fig. 8 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner is in cooling operation sleep mode provided by an embodiment of the present disclosure;

Fig. 9 is a schematic diagram of the position of the inner air deflector when the air conditioner operates in the direct blowing mode provided by an embodiment of the present disclosure;

Fig. 10 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner provided by an embodiment of the present disclosure is in the weakened direct blowing mode and the cooling operation;

Fig. 11 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner provided by an embodiment of the present disclosure is in the weakened direct blowing mode and the heating operation;

Fig. 12 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner provided by an embodiment of the present disclosure is in the enhanced direct blowing mode and cooling operation;

Fig. 13 is a schematic diagram of the cooling/heating situation of the inner air deflector when the air conditioner provided by an embodiment of the present disclosure is in the enhanced direct blowing mode and the heating operation;

Fig. 14 is a device for controlling air supply of an air conditioner provided by an embodiment of the present disclosure.

Reference signs:

1: outer wind deflector; 2: inner wind deflector; 3: first board; 4: semiconductor element; 5: second board; 6: connection structure; 7: windward side; 8: cold air; 9: 10: hot air; 11: heating side; 100: processor; 101: memory; 102: communication interface; 103: bus.

Detailed ways

In order to understand the characteristics and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. The attached drawings are only for reference and description, and are not intended to limit the embodiments of the present disclosure. In the following technical description, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown simplified in order to simplify the drawings.

The terms "first", "second" and the like in the description and claims of the embodiments of the present disclosure and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or sequence. It should be understood that the data so used may be interchanged under appropriate circumstances so as to facilitate the embodiments of the disclosed embodiments described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion.

In the embodiments of the present disclosure, the character "/" indicates that the preceding and following objects are an "or" relationship. For example, A/B means: A or B.

The term "and/or" is an associative relationship describing objects, indicating that there can be three relationships. For example, A and/or B means: A or B, or, A and B, these three relationships.

The term "correspondence" may refer to an association relationship or a binding relationship, and the correspondence between A and B means that there is an association relationship or a binding relationship between A and B.

Referring to FIG. 1 , an embodiment of the present disclosure provides an air conditioner indoor unit, including an outer air deflector 1 , an inner air deflector 2 and a processor (not shown in the figure).

Referring to FIG. 2 , an embodiment of the present disclosure provides an inner wind deflector, including a first board body 3 , a second board body 5 and a semiconductor element 4 . The second board body 5 is arranged opposite to the first board body 3 and forms an interlayer with the first board body 3; the semiconductor element 4 is arranged in the interlayer. The semi-monolithic element 4 can be cooled on one side and heated on the other side under the control of the processor. The inner wind deflector is installed at the air outlet of the indoor unit of the air conditioner through the connection structure 6 .

As shown in FIG. 3-1 , an embodiment of the present disclosure provides a method for controlling air supply of an air conditioner, including:

S01, the processor determines the current operating mode of the air conditioner;

S021, when the air conditioner is running in the cooling mode, the processor controls the cooling of the windward side of the semiconductor element to cool down the airflow passing through the air outlet; or,

S022, when the air conditioner is running in the first mode, the processor controls the heating on the windward side of the semiconductor element to heat the airflow passing through the air outlet; or,

S023, when the air conditioner is running in the direct blowing mode, the processor controls the cooling/heating of the windward side of the semiconductor element to cool/heat the airflow passing through the air outlet.

The method for controlling the air supply of an air conditioner provided by the embodiments of the present disclosure can enable the air conditioner to adjust the cooling/heating conditions on the windward side of the air deflector according to the operation mode selected by the user, change the temperature of the air outlet, and make the air outlet The temperature can meet the individual needs of users.

Wherein, the windward side of the inner wind deflector in each mode is different, or the lower side of the inner wind deflector, or the upper side of the inner wind deflector. The lower side of the inner wind deflector is the side matching the connecting structure, and the upper side of the inner wind deflector is the side opposite to the lower side.

Optionally, the method for controlling the air supply of the air conditioner, after controlling the cooling or heating of the windward side of the semiconductor element, further includes:

S03, the processor adjusts the power of the semiconductor element according to the body surface temperature of the user.

By adjusting the power of semiconductor elements, adjusting the cooling capacity/heating capacity of the windward side of the inner air deflector, and more carefully adjusting the outlet air temperature, so that the outlet air temperature can change with the change of the user's body surface temperature to meet the user's individuality need.

More specifically, referring to Fig. 3-2, the method for controlling the air supply of the air conditioner includes:

S023, when the air conditioner is running in the direct blowing mode, the processor controls the cooling/heating of the windward side of the semiconductor element to cool/heat the airflow passing through the air outlet;

Optionally, the method for controlling the air supply of the air conditioner also includes:

S04, the processor adjusts the angle of the air deflector according to the current operating mode of the air conditioner.

In this way, the wind outlet angle can be adjusted according to the different modes, so that the user can independently choose the wind outlet direction to meet the individual needs of the user.

More specifically, referring to Fig. 3-3, the method for controlling the air supply of the air conditioner includes:

With reference to Figure 3-4, the method for controlling the air supply of the air conditioner includes:

S04, the processor adjusts the angle of the air deflector according to the current operating mode of the air conditioner;

With reference to Figure 3-5, the method for controlling the air supply of the air conditioner includes:

With reference to Fig. 3-6, the method for controlling the air supply of the air conditioner includes:

As shown in Figures 4 and 5, when the air conditioner is running in the cooling mode, the inner air deflector rotates to a position that is 0-10° obliquely upward from the horizontal direction, that is, the air conditioner is 0-10° obliquely upward. Blow out cool air8. The processor controls the direction of the current flowing through the semiconductor element 4 , so that the windward side 7 of the inner wind deflector is cooled by the semiconductor element 4 and becomes the cooling side 9 .

Wherein, the windward side 7 in cooling mode is the lower side of the inner wind deflector.

When the cooling side of the inner air deflector cools the cold air for the second time, the air outlet temperature of the air conditioner is lower than that of conventional air conditioners, and the cooling speed is faster, which meets the user's large demand for cooling capacity , to meet the individual needs of users.

In addition, since the cold air is blown obliquely upward, it will quickly occupy the upper space. The cold air is heavier than the hot air, so it will automatically sink to the lower space, which not only speeds up the air circulation in the indoor space, but also prevents the cold air from blowing directly to the user, improving the comfort of the user.

Optionally, the first mode includes a heating mode or a cooling operation sleep mode.

Among them, the cooling operation sleep mode is to run the cooling mode and the sleep mode at the same time. In the sleep mode, the air deflector is controlled to adjust the angle to reduce the wind speed, but the user's set temperature is not changed.

As shown in Figures 6 and 7, when the air conditioner is running in the heating mode, the inner wind deflector rotates to the vertical direction, that is, the air conditioner blows hot air 10 vertically downward. The processor controls the direction of the current flowing through the semiconductor element 4 so that the windward side 7 of the inner wind deflector becomes the heating side 11 after being heated by the semiconductor element 4 .

Wherein, in the heating mode, the windward side 7 of the inner air deflector is the lower side.

When the heating side of the inner air guide plate heats the hot air twice, the air outlet temperature of the air conditioner is higher than that of the conventional air conditioner, and the heating speed is faster, which meets the user's demand for heating capacity. Larger demand, able to meet the individual needs of users.

In addition, since the hot air is blown vertically downward, it will quickly occupy the lower space. The user's ankles are the first to touch the hot air. circulation, which in turn improves user comfort.

As shown in Figures 4 and 8, when the air conditioner is in cooling operation and sleep mode, the inner air deflector rotates to a position that is 0-10° obliquely upward to the horizontal direction, that is, the air conditioner is 0-10° obliquely upward Blow out cool air8. The processor controls the direction of the current flowing through the semiconductor element 4 so that the windward side 7 of the inner wind deflector becomes the heating side 11 after being heated by the semiconductor element 4 .

Wherein, in the cooling operation sleep mode, the windward side 7 of the inner air deflector is the lower side.

After the heating side of the inner air deflector heats the cold air to a certain extent, the outlet air temperature of the air conditioner is higher than that of conventional air conditioners. While the body temperature of the user in the sleep state will drop, increasing the outlet temperature will prevent the user from catching cold in the sleep state, which meets the user's small demand for cooling capacity and can meet the user's individual needs.

In addition, the obliquely upward air outlet angle can also speed up the indoor air circulation, avoid direct cold wind, and improve user comfort.

Optionally, the direct blow mode includes weakening the direct blow mode or strengthening the direct blow mode.

Among them, the weakened direct blowing mode refers to the effect of the semiconductor element adjusting the airflow temperature when the air conditioner is running in the direct blowing mode, which is opposite to the effect of the air conditioner on adjusting the airflow temperature for the first time, that is, through the offset between the effects, the Weaken the purpose of direct blowing. The enhanced direct blowing mode refers to the effect of the semiconductor element adjusting the airflow temperature when the air conditioner is running in the direct blowing mode, which is the same as the first time the air conditioner adjusts the airflow temperature. The purpose of blowing.

Optionally, when the air conditioner is running in the direct blowing mode, controlling the cooling/heating of the windward side of the semiconductor element includes, when the air conditioner is in the weakened direct blowing mode and cooling operation, controlling the heating of the windward side of the semiconductor element ; When the air conditioner is in the weakened direct blowing mode and heating operation, control the cooling of the windward side of the semiconductor element; when the air conditioner is in the enhanced direct blowing mode and cooling operation, control the cooling of the windward side of the semiconductor element; Controls the heating of the windward side of the semiconductor components when the device is in enhanced direct blowing mode and heating operation.

As shown in Figure 9, when the air conditioner is running in the direct blowing mode, the inner wind deflector is rotated to a 40-60° obliquely downward position relative to the horizontal direction, that is, the air conditioner is 40-60° obliquely downward. The air after the temperature adjustment of the semiconductor element 4 is blown out. The upper side of the inner wind deflector is the windward side 7 .

As shown in Figures 9 and 10, when the air conditioner is in the weakened direct blowing mode and cooling operation, the processor controls the direction of the current flowing through the semiconductor element 4, so that the windward side 7 of the inner wind deflector passes through the semiconductor element 4 for heating After that, it becomes the heating side 11 to heat the cold air 8 .

After the heating side of the inner air deflector heats the cold air to a certain extent, the outlet air temperature of the air conditioner is higher than that of conventional air conditioners, so that the air conditioner can also meet the user's cooling capacity requirements when blowing directly. Minor needs to meet the individual needs of users.

As shown in Figures 9 and 11, when the air conditioner is in the weakened direct blowing mode and heating operation, the processor controls the direction of the current flowing through the semiconductor element 4, so that the windward side 7 of the inner wind deflector passes through the semiconductor element 4 for cooling. Afterwards, it becomes the cooling side 9 and cools down the hot air 10 .

After the cooling side of the inner air deflector cools down the hot air to a certain extent, the air outlet temperature of the air conditioner is lower than that of conventional air conditioners, so that the air conditioner can meet the user's small heating capacity requirement when blowing directly. needs to meet the individual needs of users.

As shown in Figures 9 and 12, when the air conditioner is in the enhanced direct blowing mode and cooling operation, the processor controls the direction of the current flowing through the semiconductor element 4, so that the windward side 7 of the inner wind deflector is cooled by the semiconductor element 4 , become the refrigeration side 9, cooling the cold air 8.

When the cooling side of the inner air deflector is used for secondary cooling of the cold air, the air outlet temperature of the air conditioner is lower than that of conventional air conditioners, so that the air conditioner can meet the user's larger cooling capacity when blowing directly. needs to meet the individual needs of users.

As shown in Figures 9 and 13, when the air conditioner is in the enhanced direct blowing mode and heating operation, the processor controls the direction of the current flowing through the semiconductor element 4, so that the windward side 7 of the inner wind deflector passes through the semiconductor element 4. After heating, it becomes the heating side 11 to heat the hot air 10 .

When the heating side of the inner air deflector is used for secondary heating of the hot air, the air outlet temperature of the air conditioner is higher than that of conventional air conditioners, so that the air conditioner can meet the user's demand for heating capacity when blowing directly. Greater demand, to meet the individual needs of users.

Optionally, an embodiment of the present disclosure provides a method for controlling air supply of an air conditioner, which further includes adjusting the power of the semiconductor element according to the user's body surface temperature after controlling cooling or heating on the windward side of the semiconductor element.

Optionally, adjusting the power of the semiconductor element according to the user's body surface temperature includes: when the air conditioner is running in the second mode, increasing/decreasing the power of the semiconductor element according to the user's body surface temperature; when the air conditioner is running in the third mode , according to the user's body surface temperature, the power of the semiconductor element is reduced/raised.

Wherein, the second mode includes cooling mode, heating mode, cooling operation enhanced direct blowing mode or heating operation enhanced direct blowing mode. The third mode includes a cooling operation sleep mode, a reduced cooling operation direct blowing mode, or a heating operation reduced direct blowing mode.

Wherein, the cooling operation enhanced direct blowing mode means that the air conditioner is in the enhanced direct blowing mode and is in cooling operation. Heating operation enhanced direct blowing mode means that the air conditioner is in enhanced direct blowing mode and heating operation. Cooling operation reduced direct blowing mode means that the air conditioner is in reduced direct blowing mode and cooling operation. The reduced direct blowing mode of heating operation means that the air conditioner is in the reduced direct blowing mode and the heating operation is performed.

Optionally, when the air conditioner is running in the second mode, increasing/decreasing the power of the semiconductor element according to the user's body surface temperature includes, when the air conditioner is running in the second mode, at the difference between the user's current body surface temperature and the target temperature When the difference is greater than or equal to the preset threshold, the power of the semiconductor element is increased; when the air conditioner is running in the second mode, when the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, the power of the semiconductor element is reduced. component power.

When the air conditioner is running in the cooling mode, or in the enhanced direct blowing mode and cooling operation, when the difference between the user's current body surface temperature and the target temperature is greater than or equal to the preset threshold, the processor increases the power supply of the semiconductor element Voltage, increase the power of semiconductor components, increase cooling capacity. By enhancing the cooling effect of the inner air deflector on the outlet air temperature, the cooling speed of the air conditioner is accelerated, and the user's body surface temperature is quickly dropped to the target temperature, which meets the user's demand for rapid cooling and meets the user's individual needs.

When the air conditioner is running in heating mode, or in enhanced direct blowing mode and heating operation, when the difference between the user's current body surface temperature and the target temperature is greater than or equal to the preset threshold, the processor will increase the size of the semiconductor element Increase the power supply voltage of the semiconductor element and increase the heating capacity. By enhancing the heating effect of the inner air deflector on the temperature of the air outlet, the heating speed of the air conditioner is accelerated, and the user's body surface temperature rises to the target temperature quickly, meeting the user's needs for rapid heating and meeting the user's individual needs .

When the air conditioner is running in the cooling mode, or in the enhanced direct blowing mode and cooling operation, when the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, the processor reduces the power supply voltage of the semiconductor element, Reduce the power of semiconductor components and reduce cooling capacity. By weakening the cooling effect of the inner air deflector on the outlet air temperature, the user's body surface temperature is gently lowered to the target temperature, which meets the user's demand for gentle cooling and meets the user's individual needs.

When the air conditioner is running in heating mode, or in enhanced direct blowing mode and heating operation, when the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, the processor will reduce the power supply of the semiconductor element Voltage, reduce the power of semiconductor elements, and reduce the amount of heating. By weakening the heating effect of the inner air deflector on the outlet air temperature, the user's body surface temperature can be gently raised to the target temperature, meeting the user's demand for gentle heating and meeting the user's individual needs.

Optionally, when the air conditioner operates in the third mode, according to the user's body surface temperature, reducing/increasing the power of the semiconductor element includes, when the air conditioner operates in the third mode, at the difference between the user's current body surface temperature and the target temperature When the difference is greater than or equal to the preset threshold, reduce the power of the semiconductor element; when the air conditioner is running in the third mode, when the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, increase the power of the semiconductor element. component power.

When the air conditioner is in the sleep mode of cooling operation, or in the weakened direct blowing mode and cooling operation, when the difference between the user's current body surface temperature and the target temperature is greater than or equal to the preset threshold, the processor will reduce the power supply of the semiconductor element. Voltage, reduce the power of semiconductor elements, reduce the amount of heating. By weakening the heating effect of the inner air deflector on the outlet air temperature, the user's body surface temperature can be quickly dropped to the target temperature, which can meet the user's demand for rapid cooling and meet the user's individual needs.

When the air conditioner is in the weakened direct blowing mode and heating operation, if the difference between the user's current body surface temperature and the target temperature is greater than or equal to the preset threshold, the processor reduces the power supply voltage of the semiconductor element to reduce the temperature of the semiconductor element. Power, reduce cooling capacity. By weakening the cooling effect of the inner air deflector on the outlet air temperature, the user's body surface temperature can quickly rise to the target temperature, meeting the user's demand for rapid temperature rise and meeting the user's individual needs.

When the air conditioner is in the sleep mode of cooling operation, or in the weakened direct blowing mode and cooling operation, when the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, the processor increases the power supply voltage of the semiconductor element, Increase the power of semiconductor elements and increase the heating capacity. By strengthening the heating effect of the inner air guide plate on the outlet air temperature, the user's body surface temperature can be gently lowered to the target temperature, which can meet the user's demand for gentle cooling and meet the user's individual needs.

When the air conditioner is in the weakened direct blowing mode and the heating operation, and the difference between the user's current body surface temperature and the target temperature is less than the preset threshold, the processor increases the power supply voltage of the semiconductor element to increase the power of the semiconductor element. Increase cooling capacity. By strengthening the cooling effect of the inner air deflector on the outlet air temperature, the user's body surface temperature can be gently raised to the target temperature, meeting the user's demand for gentle heating and meeting the user's individual needs.

In the above embodiments, the air conditioner indoor unit has an inner wind deflector and an outer wind deflector. In the case where the indoor unit of the air conditioner has only one air deflector and the air deflector has an interlayer in which semiconductor elements are disposed, the method in the above embodiment is also applicable, and will not be repeated here.

As shown in FIG. 14 , an embodiment of the present disclosure provides an apparatus for controlling air supply of an air conditioner, including a processor (processor) 100 and a memory (memory) 101 . Optionally, the device may also include a communication interface (Communication Interface) 102 and a bus 103. Wherein, the processor 100 , the communication interface 102 , and the memory 101 can communicate with each other through the bus 103 . Communication interface 102 may be used for information transfer. The processor 100 can call the logic instructions in the memory 101 to execute the method for controlling the air supply of the air conditioner in the above embodiments.

In addition, when the above logic instructions in the memory 101 are implemented in the form of software function units and sold or used as independent products, they can be stored in a computer-readable storage medium.

As a storage medium, the memory 101 can be used to store software programs and computer executable programs, such as program instructions corresponding to the methods in the embodiments of the present disclosure. The processor 100 executes the program instructions stored in the memory 101 to execute function applications and data processing, that is, to implement the method for controlling the air supply of the air conditioner in the above-mentioned embodiments.

The memory 101 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and an application program required by at least one function; the data storage area may store data created according to the use of the terminal device, and the like. In addition, the memory 101 may include a high-speed random access memory, and may also include a non-volatile memory.

The above description and drawings sufficiently illustrate the embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, procedural, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. Also, the words used in the present application are used to describe the embodiments only and shall not be used to limit the claims. As used in the examples and description of the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well unless the context clearly indicates otherwise . Similarly, the term "and/or" as used in this application is meant to include any and all possible combinations of one or more of the associated listed ones. Additionally, when used in this application, the term "comprise" and its variants "comprises" and/or comprising (comprising) etc. refer to stated features, integers, steps, operations, elements, and/or The presence of a component does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and/or groupings of these. Without further limitations, an element defined by the statement "comprising a ..." does not exclude the presence of additional identical elements in the process, method or apparatus comprising said element. Herein, what each embodiment focuses on may be the difference from other embodiments, and the same and similar parts among the various embodiments may be referred to each other. For the method, product, etc. disclosed in the embodiment, if it corresponds to the method part disclosed in the embodiment, then the relevant part can refer to the description of the method part.

Those skilled in the art can appreciate that the units and algorithm steps of the examples described in conjunction with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed by hardware or software may depend on the specific application and design constraints of the technical solution. Said artisans may implement the described functions using different methods for each particular application, but such implementation should not be regarded as exceeding the scope of the disclosed embodiments. The skilled person can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

In the embodiments disclosed herein, the disclosed methods and products (including but not limited to devices, equipment, etc.) can be implemented in other ways. For example, the device embodiments described above are only illustrative. For example, the division of the units may only be a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined Or it can be integrated into another system, or some features can be ignored, or not implemented. In addition, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces, and the indirect coupling or communication connection of devices or units may be in electrical, mechanical or other forms. The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to implement this embodiment. In addition, each functional unit in the embodiments of the present disclosure may be integrated into one processing unit, each unit may exist separately physically, or two or more units may be integrated into one unit.

The flowchart in the figures shows the architecture, functionality, and operation of possible implementations of systems, methods and computer program products according to embodiments of the disclosure. In this regard, each block in the flowchart may represent a module, program segment, or portion of code that includes one or more executable instruction. In some alternative implementations, the functions noted in the block may occur out of the order noted in the figures. For example, two blocks in succession may, in fact, be executed substantially concurrently, or they may sometimes be executed in the reverse order, depending upon the functionality involved. In the description corresponding to the flowchart in the drawings, the operations or steps corresponding to different blocks may also occur in a different order than disclosed in the description, and sometimes there is no specific order between different operations or steps. For example, two consecutive operations or steps may, in fact, be performed substantially concurrently, or they may sometimes be performed in the reverse order, depending upon the functionality involved. Each block of the flowchart illustrations, and combinations of blocks in the flowchart illustrations, can be implemented by special purpose hardware-based systems that perform the specified functions or actions, or by a combination of special purpose hardware and computer instructions.

Claims

A method for controlling the air supply of an air conditioner, characterized in that the air conditioner includes an air guide plate arranged at the air outlet, and the air guide plate includes a first plate body; a second plate body, and the air guide plate The first plate body is arranged oppositely, and an interlayer is formed between the first plate body; the semiconductor element is arranged in the interlayer; the method includes:

Determine the current operating mode of the air conditioner;

When the air conditioner is running in cooling mode, control the cooling of the windward side of the semiconductor element to cool down the airflow passing through the air outlet; or,

When the air conditioner operates in the first mode, control the heating on the windward side of the semiconductor element to heat the airflow passing through the air outlet; or,

When the air conditioner is running in the direct blowing mode, the windward side of the semiconductor element is controlled to cool/heat, and the airflow passing through the air outlet is cooled/heated.
The method according to claim 1, wherein the first mode comprises a heating mode or a cooling operation sleep mode.
The method according to claim 1, wherein the direct blowing mode includes a weakened direct blowing mode or an enhanced direct blowing mode.
The method according to claim 3, characterized in that, when the air conditioner operates in the direct blowing mode, controlling the cooling/heating of the windward side of the semiconductor element comprises:

When the air conditioner is in reduced direct blowing mode and cooling operation, control the heating of the windward side of the semiconductor element; or,

Controlling cooling of the windward side of the semiconductor element when the air conditioner is in reduced direct blowing mode and in heating operation; or,

Controlling cooling of the windward side of the semiconductor element when the air conditioner is in enhanced direct blowing mode and cooling operation; or,

Controls the heating on the windward side of the semiconductor element when the air conditioner is in enhanced direct blowing mode and in heating operation.
The method according to any one of claims 1 to 4, characterized in that, after controlling the cooling or heating of the windward side of the semiconductor element, further comprising:

According to the user's body surface temperature, the power of the semiconductor element is adjusted.
The method according to claim 5, wherein the adjusting the power of the semiconductor element according to the body surface temperature of the user comprises:

When the air conditioner is operating in the second mode, increasing/decreasing the power of the semiconductor element according to the body surface temperature of the user; or,

When the air conditioner is running in the third mode, reduce/increase the power of the semiconductor element according to the body surface temperature of the user;

Wherein, the second mode includes: cooling mode, heating mode, cooling operation enhanced direct blowing mode or heating operation enhanced direct blowing mode;

The third mode includes: cooling operation sleep mode, cooling operation reduced direct blowing mode or heating operation reduced direct blowing mode.
The method according to claim 6, wherein when the air conditioner is running in the second mode, increasing/decreasing the power of the semiconductor element according to the body surface temperature of the user comprises:

When the air conditioner is running in the second mode, when the difference between the user's current body surface temperature and the target temperature is greater than or equal to a preset threshold, the power of the semiconductor element is increased; or,

When the air conditioner is running in the second mode, if the difference between the user's current body surface temperature and the target temperature is less than a preset threshold, the power of the semiconductor element is reduced.
The method according to claim 6, wherein when the air conditioner is operating in the third mode, reducing/increasing the power of the semiconductor element according to the body surface temperature of the user comprises:

When the air conditioner is running in the third mode, if the difference between the user's current body surface temperature and the target temperature is greater than or equal to a preset threshold, reduce the power of the semiconductor element; or,

When the air conditioner operates in the third mode, if the difference between the user's current body surface temperature and the target temperature is less than a preset threshold, the power of the semiconductor element is increased.
A device for controlling the air supply of an air conditioner, comprising a processor and a memory storing program instructions, characterized in that the processor is configured to execute any of claims 1 to 8 when running the program instructions. A method for controlling the air supply of an air conditioner.
An air conditioner indoor unit is characterized in that it comprises:

a wind deflector arranged at the air outlet; and,

The device for controlling air supply of an air conditioner as claimed in claim 9;

Wherein, the wind deflector includes:

first board;

The second plate body is arranged opposite to the first plate body and forms an interlayer with the first plate body;

A semiconductor element is arranged in the interlayer.