WO2023022388A1 - Dispositif électronique comprenant un ensemble carte de circuit imprimé - Google Patents

Dispositif électronique comprenant un ensemble carte de circuit imprimé Download PDF

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Publication number
WO2023022388A1
WO2023022388A1 PCT/KR2022/011161 KR2022011161W WO2023022388A1 WO 2023022388 A1 WO2023022388 A1 WO 2023022388A1 KR 2022011161 W KR2022011161 W KR 2022011161W WO 2023022388 A1 WO2023022388 A1 WO 2023022388A1
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WIPO (PCT)
Prior art keywords
circuit board
printed circuit
hole
body member
mounting space
Prior art date
Application number
PCT/KR2022/011161
Other languages
English (en)
Korean (ko)
Inventor
최종훈
김호종
김남우
박성관
박찬기
진창환
허재영
홍현철
Original Assignee
삼성전자주식회사
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Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2023022388A1 publication Critical patent/WO2023022388A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections

Definitions

  • Portable electronic devices including smart phones, wearable devices, tablet PCs, and the like are being miniaturized and lightweight.
  • a heat dissipation material may be applied around the electronic elements mounted on the printed circuit board.
  • a printed circuit board assembly capable of shielding noise from electronic devices by shielding an injection hole into which a liquid heat dissipation material is injected, and an electronic device including the same.
  • a printed circuit board assembly in which a mounting space of an electronic device is firmly supported and an electronic device including the printed circuit board assembly may be provided.
  • a printed circuit board assembly capable of securing a sufficient mounting space for electronic devices and an electronic device including the printed circuit board assembly may be provided.
  • a printed circuit board assembly includes a first printed circuit board having a first surface on which electronic devices are mounted, a cover part disposed to face the first surface of the first printed circuit board, and the first printed circuit board.
  • An electronic device includes a housing, a first printed circuit board disposed in an inner space of the housing and having electronic devices mounted thereon, and a second printed circuit board disposed facing the first printed circuit board in the inner space. , Electrically connecting the first printed circuit board and the second printed circuit board between the first printed circuit board and the second printed circuit board, and a mounting space together with the first printed circuit board and the second printed circuit board It may include an interposer forming an interposer, a body member having an inner hole connecting the outside and inside of the mounting space, and a shielding member shielding the inner hole.
  • An electronic device includes a housing, a first printed circuit board disposed in an inner space of the housing and having electronic devices mounted thereon, a second printed circuit board disposed facing the first printed circuit board in the inner space, electrically connecting the first printed circuit board and the second printed circuit board between the first printed circuit board and the second printed circuit board, and a mounting space together with the first printed circuit board and the second printed circuit board;
  • An interposer forming an interposer, a filler injection hole penetrating the second printed circuit board to inject a heat-preventing filler into the mounting space, interposed between the first printed circuit board and the second printed circuit board to insert the first printed circuit board.
  • noise from electronic devices mounted on a printed circuit board may be prevented from leaking through the injection port through which the liquid heat dissipation material is injected.
  • a mounting space of the electronic device may be firmly supported.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.
  • FIGS. 2A and 2B are perspective views of electronic devices according to various embodiments.
  • 3A is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
  • 3B is an exploded perspective view of a printed circuit board assembly according to various embodiments.
  • FIG. 4A is a cross-sectional view taken along line II of FIG. 3 showing a printed circuit board assembly according to various embodiments.
  • Figure 4b is a perspective view of a body member according to various embodiments.
  • FIG. 4C illustrates a state in which a liquid heat dissipation material is filled in a printed circuit board assembly according to various embodiments of the present disclosure.
  • 5 is a graph showing noise levels of electronic devices according to whether a printed circuit board assembly according to various embodiments is applied.
  • 6 to 9 are cross-sectional views illustrating printed circuit board assemblies according to various embodiments.
  • FIG. 10 is a perspective view illustrating a cut surface of a body member according to various embodiments.
  • FIG. 11 is a perspective view illustrating a state in which body members are disposed according to various embodiments.
  • FIG. 12 is a cross-sectional view illustrating a printed circuit board assembly according to various embodiments.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
  • eMBB peak data rate for eMBB realization
  • a loss coverage for mMTC realization eg, 164 dB or less
  • U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • Electronic devices may be devices of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • a storage medium eg, internal memory 136 or external memory 138
  • a machine eg, electronic device 101
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • two user devices e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components.
  • one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
  • FIGS. 2A and 2B are perspective views of electronic devices according to various embodiments.
  • the electronic device 200 (eg, the electronic device 101 of FIG. 1) has a first surface (or front surface) 210A, and a second surface (or rear surface) ( 210B), and a housing 210 including a side surface 210C surrounding a space between the first surface 210A and the second surface 210B.
  • the structure of the above-described housing 210 is exemplary, and in another embodiment (not shown), the housing 210 includes the first surface 210A, the second surface 210B, and the side surface 210C. It can also refer to a structure forming a part.
  • the first surface 210A may be formed by a front plate 202 that is at least partially transparent.
  • the front plate 202 may include a glass plate including various coating layers, or a polymer plate.
  • the second face 210B may be formed by a substantially opaque back plate 211 (eg, the back plate 280 of FIG. 3 ).
  • the rear plate 211 is formed, for example, of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. It can be.
  • the side surface 210C is coupled to the front plate 202 and the rear plate 211 and is formed by a side bezel structure 218 (eg, the frame structure 241 of FIG. 3) including metal and/or polymer. can be formed
  • the back plate 211 and the side bezel structure 218 may be integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the front plate 202 may include two first regions 210D that are curved from a partial region of the first surface 210A toward the rear plate 211 and extend seamlessly. there is.
  • the first regions 210D may be located at both ends of a long edge of the front plate 202 .
  • the rear plate 211 may include two second regions 210E that are curved and seamlessly extend from a partial region of the second surface 210B toward the front plate 202 .
  • the second regions 210E may be included at both ends of the long edge of the back plate 211 .
  • the front plate 202 may include only one of the first regions 210D (or the second regions 210E). Also, in another embodiment, the front plate 202 (or the back plate 211) may not include some of the first regions 210D (or the second regions 210E).
  • the side bezel structure 218 may be integrally formed with the back plate 211 .
  • the electronic device 200 includes a display 201 (eg, the display 230 of FIG. 3 ), an audio module (eg, the microphone hole 203 of FIGS. 2A and 2B ), and a sensor module (not shown). , a second sensor module 206, a camera module 205, a key input device 217, a light emitting element (not shown), and a connector hole 208.
  • the electronic device 200 may omit at least one of the above components (eg, a key input device 217 or a light emitting device (not shown)) or may additionally include other components.
  • the display 201 may be exposed through at least a portion of the front plate 202 .
  • at least a portion of the display 201 may be exposed through the front plate 202 including the first surface 210A and the first regions 210D of the side surface 210C.
  • the shape of the display 201 may be formed substantially the same as the outer shape adjacent to the front plate 202 .
  • the distance between the periphery of the display 201 and the periphery of the front plate 202 may be substantially the same.
  • the surface of the housing 210 may include a screen display area where the display 201 is visually exposed and content is displayed through pixels.
  • the screen display area may include a first surface 210A and side first areas 210D.
  • the display 201 includes a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a stylus pen using a magnetic field, or is adjacent thereto. can be placed.
  • the screen display area 210A may include a sensing area 210F and/or a camera area 210G.
  • the sensing area 210F may at least partially overlap the screen display area 210A.
  • the sensing area 210F may display content like other areas of the screen display area 210A, and may additionally refer to an area through which an input signal related to the second sensor module 206 passes.
  • the second sensor module 206 may be disposed under the screen display area 210A.
  • the second sensor module 206 may form a sensing area 210F in at least a portion of the screen display area 210A.
  • the second sensor module 206 may be configured to receive an input signal transmitted through the sensing region 210F and generate an electrical signal based on the received input signal.
  • the input signal may have a specified physical quantity (eg, heat, light, temperature, sound, pressure, ultrasound).
  • the input signal may include a signal related to the user's biometric information (eg, fingerprint).
  • the second sensor module 206 can include an optical fingerprint sensor configured to receive light.
  • the second sensor module 206 is configured to receive an optical signal emitted from a pixel included in the display 201, reflected by a fingerprint of a user's finger, and transmitted through the sensing region 210F. can be configured.
  • the second sensor module 206 can include an ultrasonic fingerprint sensor configured to transmit and receive ultrasonic waves.
  • the second sensor module 206 may include a transmission module for transmitting ultrasonic waves toward a fingerprint of a user's finger and a receiving module for receiving ultrasonic waves reflected by a finger and transmitted through the sensing region 210F. .
  • the camera area 210G may at least partially overlap the screen display area 210A.
  • the camera area 210G may display content like other areas of the screen display area 210A, and may additionally refer to an area (eg, a transmissive area) through which an optical signal related to the first camera module 205 passes. there is.
  • the camera area 210G may be configured to display content similarly to other areas of the screen display area 210A when the first camera module 205 is not operating.
  • the camera area 210G of the display 201 may be formed as a transmissive area having a designated transmittance.
  • the transmission region may be formed to have a transmittance ranging from about 20% to about 40%.
  • the transmissive region may include a region in which pixel density and/or wiring density are lower than those of the surrounding region.
  • the first camera module 205 may be disposed below the screen display area 210A and configured to receive light passing through the camera area 210G.
  • the light received by the first camera module 205 may include light reflected by or emitted from the subject.
  • the first camera module 205 may be configured to generate an electrical signal related to an image based on the received light.
  • the first camera module 205 may not be exposed to the surface (eg, the front surface 210A) of the electronic device 200 .
  • the first camera module 205 may be covered by content displayed in the camera area 210G.
  • an optical axis of a lens included in the first camera module 205 may pass through a camera area 210G included in the display 201 .
  • the second camera module 212 may include a plurality of camera modules (eg, a dual camera, a triple camera, or a quad camera).
  • the second camera module 212 is not necessarily limited to including a plurality of camera modules, and may include one camera module.
  • the first camera module 205 and/or the second camera module 212 may include one or a plurality of lenses, an image sensor, and/or an image signal processor.
  • the flash 213 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors face the direction in which one side (eg, the second side 210B) of the electronic device 200 faces the inside of the housing. ) can be placed.
  • the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state.
  • the sensor module may be the first side 210A, the second side 210B, or the side 210C (eg, the first area 210D) of the housing 210 and/or It may be disposed on at least some of the second regions 210E).
  • the sensor module and/or the second sensor module 206 may include a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR ( infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • a fingerprint sensor may be disposed on the second side 210B.
  • the audio modules 203 and 207 may include a sound hole (eg, a microphone hole 203) and a speaker hole 207.
  • the microphone hole 203 may include a first microphone hole 203 formed on a portion of the side surface 210C and a second microphone hole 204 formed on a portion of the second surface 210B. there is.
  • microphones for acquiring external sound may be disposed inside the housing 210 .
  • the microphone may include a plurality of sound modules (eg, microphones) to sense the direction of sound.
  • the second microphone hole 204 formed in a partial area of the second surface 210B may be disposed adjacent to the camera module 205 .
  • the second microphone hole 204 may obtain a sound when the camera module 205 is executed or a sound when another function is executed.
  • the microphone hole 203 may be formed on another part of the side surface 210C.
  • the microphone hole 203 is a part of the side 210C where the speaker hole 207 is formed (eg, a part facing the -Y axis direction) and another part of the side 210C facing (eg, a +Y axis). direction) may be formed.
  • the speaker hole 207 may include a receiver hole (not shown) for communication.
  • the speaker hole 207 may be formed on a part of the side surface 210C of the electronic device 200 .
  • the speaker hole 207 and the microphone hole 203 may be implemented as one hole.
  • a receiver hole (not shown) for communication may be formed on another part of the side surface 210C.
  • a receiver hole (not shown) for communication is a part of the side 210C where the speaker hole 207 is formed (eg, a part facing the -Y axis direction) and another part of the side 210C facing (eg, the -Y axis direction). A portion facing the +Y axis direction) may be formed.
  • the electronic device 200 may include a speaker that is fluidly connected to the speaker hole 207 so that fluid flows therethrough.
  • the speaker may include a piezo speaker in which the speaker hole 207 is omitted.
  • the key input device 217 may be disposed on the side surface 210C of the housing 210 (eg, the first areas 210D and/or the second areas 210E).
  • the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 that are not included may have other forms such as soft keys on the display 201. can be implemented as
  • the key input device may include the second sensor module 206 forming the sensing area 210F included in the screen display area 210A.
  • connector hole 208 may receive a connector.
  • the connector hole 208 may be disposed on the side surface 210C of the housing 210 .
  • the connector hole 208 may be disposed on the side surface 210C to be adjacent to at least a portion of an audio module (eg, the microphone hole 203 and the speaker hole 207).
  • the electronic device 200 may include a first connector hole 208 capable of receiving a connector (eg, a USB connector) for transmitting/receiving power and/or data with an external electronic device and/or an external electronic device. It may include a second connector hole (not shown) capable of accommodating a connector (eg, an earphone jack) for transmitting/receiving audio signals with the device.
  • the electronic device 200 may include a light emitting element (not shown).
  • the light emitting device (not shown) may be disposed on the first surface 210A of the housing 210 .
  • the light emitting element (not shown) may provide state information of the electronic device 200 in the form of light.
  • the light emitting device (not shown) may provide a light source that interlocks with the operation of the first camera module 205 .
  • the light emitting device (not shown) may include an LED, an IR LED, and/or a xenon lamp.
  • FIG. 3A is an exploded perspective view of an electronic device 300 according to various embodiments
  • FIG. 3B is an exploded perspective view of a printed circuit board assembly 350 according to various embodiments.
  • the electronic device 300 includes a front plate (eg, front plate 202 of FIG. 2A ), a display 330 (eg, display 201 of FIG. 2A ), and a first member 340 . (e.g. bracket), printed circuit board assembly 350, third printed circuit board 350a, battery 320, second member 360 and back plate 380 (e.g. back plate 211 in FIG. 2B). )) may be included.
  • the electronic device 300 may omit at least one of the components or additionally include other components. At least one of the components of the electronic device 300 may be identical to or similar to at least one of the components of the electronic device 200 of FIGS. 2A and 2B , and overlapping descriptions are omitted below.
  • the front plate (eg, front plate 202 of FIG. 2A ), back plate 380 , and frame structure 341 of the first member 240 may be formed into a housing (eg, the front plate 202 of FIGS. 2A and 2B ). housing 210) may be formed.
  • the front plate eg, front plate 202 of FIG. 2A
  • display 330 may be referred to as a display module.
  • the front plate eg, the front plate 202 of FIG. 2A
  • the front plate may include at least one layer included in the display module.
  • the first member 340 may include a frame structure 341 and a plate structure 342.
  • the frame structure 341 may be formed to surround the edge of the plate structure.
  • frame structure 341 may form part of a housing (eg, housing 210 of FIG. 2A ).
  • the frame structure 341 surrounds a space between the front plate (eg, the front plate 202 of FIG. 2A ) and the back plate 380 and covers a portion of the surface (eg, side) of the electronic device 300 .
  • the frame structure 341 may be formed to connect edges of each of the front plate (eg, the front plate 202 of FIG. 2A ) and the rear plate 380 .
  • the plate structure 342 may be a structure in which various structures included in the electronic device are disposed.
  • the display 330 , the printed circuit board assembly 350 , and the third printed circuit board 350a may be disposed on the plate structure 342 .
  • the plate structure 342 of the first member 340 has a first face 340a at least partially facing the display 330 and a second face at least partially facing the rear plate 380. (340b).
  • the first surface 340a may be a surface facing the +z-axis direction
  • the second surface 340b may be a surface facing the -z-axis direction.
  • at least a portion of the display 330 may be positioned on the first surface 340a of the plate structure 342 .
  • at least a portion of each of the printed circuit board assembly 350 and the third printed circuit board 350a may be positioned on the second surface 340b of the plate structure 342 .
  • the battery 320 may be disposed on the second surface 340b of the plate structure 342 .
  • the plate structure 342 includes a first portion 342-1 defined on one side of the battery 320 and a second portion 342-2 defined on the other side of the battery 320. can do.
  • the first part 342-1 is positioned in the +y-axis direction with respect to the battery 320
  • the second part 342-2 is positioned in the -y-axis direction with respect to the battery 320.
  • at least a portion of the printed circuit board assembly 350 may be disposed on the first portion 342-1.
  • at least a portion of the third printed circuit board 350a may be disposed on the second portion 342-2.
  • the battery 320 is a device for supplying power to at least one component of the electronic device 300, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. can include In one embodiment, the battery 320 may be disposed on the second surface 340b of the plate structure 342 .
  • the second member 360 may be disposed to at least partially cover the second surface 340b of the plate structure 342, and a flexible printed circuit board (not shown) may be disposed on the second member 360. may be disposed on a surface facing the second surface 340b.
  • the flexible printed circuit board (not shown) may electrically connect the printed circuit board assembly 350 and the third printed circuit board 350a.
  • a conductive pattern for electrically connecting the printed circuit board assembly 350 and the third printed circuit board 350a may be formed on the flexible printed circuit board (not shown).
  • the second member 360 may be equipped with an antenna (not shown).
  • the antenna (not shown) may be provided on a surface of the second member 360 facing the rear plate 380 .
  • the antenna (not shown) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna (not shown) may be configured to, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • the printed circuit board assembly 350 may be disposed on at least one area of the first portion 342-1 of the plate structure 342, and the above-described printed circuit board assembly 350 may have a plurality of printed circuit boards.
  • the circuit boards 351 and 352 may be stacked.
  • the printed circuit board assembly 350 may include a first printed circuit board 351 , a second printed circuit board 352 and/or an interposer 353 .
  • the aforementioned printed circuit board assembly 350 may be a structure in which the interposer 353 and the second printed circuit board 352 are stacked in order based on the first printed circuit board 351 .
  • the first printed circuit board 351 may be disposed on the first part 342-1, and the second printed circuit board 352 is spaced apart from the first printed circuit board 351, It may be located on the -z direction with respect to the printed circuit board 351 .
  • the interposer 353 is located between the first printed circuit board 351 and the second printed circuit board 352 and is located on the -z direction of the first printed circuit board 351.
  • a printed circuit board 352 may be supported.
  • the interposer 353 may include at least one sidewall and/or at least one conductive via penetrating at least one region of the sidewall.
  • the first printed circuit board 351 positioned at the lower end of the interposer 353 (eg, the +z direction side of FIG. 3A) and the upper end of the interposer 353 (eg, the -z direction side of FIG. 3A) side) may be electrically connected to the second printed circuit board 352 through at least one via of the interposer 353 .
  • a plurality of electronic devices may be disposed on the first printed circuit board 351 and/or the second printed circuit board 352 constituting the printed circuit board assembly 350 .
  • the first printed circuit board 351 and/or the second printed circuit board 352 may include a processor (eg, the processor 120 of FIG. 1 , a memory (eg, the memory 130 of FIG. 1 ), and / or an interface (eg interface 177 of Fig.
  • Processor is, for example, a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor
  • the memory may include, for example, a volatile memory or a non-volatile memory
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) It may include an interface, an SD card interface, and/or an audio interface.
  • the interface may electrically or physically connect the electronic device 300 to an external electronic device, and may include, for example, a USB connector, an SD card/MMC
  • the plurality of electronic elements disposed on the first printed circuit board 351 and the plurality of electronic elements disposed on the second printed circuit board 352 are interposers. It may be electrically and/or operatively connected via 353.
  • the first printed circuit board 351 and/or the second printed circuit board 352 of the printed circuit board assembly 350 is a third printed circuit spaced apart from the printed circuit board assembly 350. It may be electrically connected to the substrate 350a.
  • the first printed circuit board 351 and/or the second printed circuit board 352 of the printed circuit board assembly 350 may be disposed on the first portion 342-1 of the plate structure 342.
  • the third printed circuit board 350a may be disposed on the second portion 342 - 2 of the plate structure 342 .
  • the first printed circuit board 351 and/or the second printed circuit board 352 and the third printed circuit board 350a may be electrically connected through an electrical connection member (not shown).
  • an electrical connection member electrically connects the first printed circuit board 351 and/or the second printed circuit board 352 and the third printed circuit board 350a across the battery 320.
  • the electrical connection member may include, but is not limited to, at least one of a flexible printed circuit board (FPCB), a coaxial cable, and a B to B connector. it is not going to be
  • the first printed circuit board 351 of the printed circuit board assembly 350 has a first surface facing a direction in which electronic devices are mounted (eg, -z direction in FIG. 3B ) ( 351a) may be included.
  • the second printed circuit board 352 has a second surface 352a spaced apart from the first printed circuit board 351 and facing the first surface 351a of the first printed circuit board 351, and A third surface 352b disposed opposite to the second surface 352a may be included.
  • electronic devices may be mounted on the other surface of the first printed circuit board 351 opposite to the first surface 351a.
  • the interposer 353 may be positioned between the first surface 351a of the first printed circuit board 351 and the second surface 352a of the second printed circuit board 352,
  • the printed circuit board 352 may be stacked on top of the first printed circuit board 351 (eg, on the -z direction side of FIG. 3B ) through the above-described interposer 353 .
  • a first solder pad (not shown) is positioned in at least one area of the interposer 353 facing the first printed circuit board 351, and the interposer 353 of the first printed circuit board 351 is positioned.
  • a 1-1 solder pad (not shown) may be positioned in at least one region facing the solder pad.
  • a second solder pad (not shown) is located in at least one area of the interposer 353 facing the second printed circuit board 352, and the second solder pad (not shown) faces the interposer 353 of the second printed circuit board 352.
  • a 2-1 solder pad (not shown) may be located in at least one area.
  • the first printed circuit board 351 and the interposer 353 may be physically connected or fixed.
  • the second printed circuit board 352 and the interposer 353 may be physically connected or fixed by soldering between the second solder pad and the 2-1 solder pad.
  • the first printed circuit board 351 is disposed at the lower end of the interposer 353 (eg, the +z direction side of FIG. 3B), and the second printed circuit board 352 is disposed on the interposer 353 ) may be stacked on top (eg, on the -z direction side of FIG. 3B).
  • the interposer 353 may include at least one sidewall 3531 and/or at least one via 3532 .
  • the at least one sidewall 3531 includes at least one through hole (not shown), and the second printed circuit disposed on the top of the interposer 353 (eg, the -z direction side of FIG. 3B). It may be formed extending along the edge of the substrate 352 .
  • at least one sidewall 3531 may be formed in a band-shaped closed curve shape corresponding to the edge shape of the second printed circuit board 352, but is not limited thereto.
  • the at least one via 3532 may be formed of a conductive material, and is located in the at least one through hole and disposed at the lower end of the interposer 353 (eg, the +z direction side of FIG. 3B).
  • the first printed circuit board 351 and the second printed circuit board 352 disposed on the upper end of the interposer 353 may be electrically connected.
  • the outer member 357 is disposed on at least one area of the third surface 352b of the second printed circuit board 352 to support a plurality of electronic elements disposed on the second printed circuit board 352. It can be shielded electromagnetically.
  • the outer member 357 is a shield can that can prevent noise generated from other components of the electronic device 300 from entering a plurality of electronic elements disposed on the second printed circuit board 352. (shield can).
  • the shield can which is the outer member 357 , may block noise generated from a plurality of electronic devices disposed on the second printed circuit board 352 from leaking to the outside.
  • FIG. 4A is a cross-sectional view taken along line I-I of FIG. 3, showing a printed circuit board assembly 350 according to various embodiments.
  • 4B is a perspective view of the body member 355 of the printed circuit board assembly 350 according to various embodiments
  • FIG. 4C is a liquid heat dissipation material (TIM: Thermal Interface) in the printed circuit board assembly 350 according to various embodiments. Material) shows how it is being charged.
  • TIM Thermal Interface
  • the printed circuit board assembly 350 is an interior of a housing (eg, the housing 210 of FIG. 2A ) of an electronic device (eg, the electronic device 200 of FIG. 2A ). can be placed in space.
  • the printed circuit board assembly 350 includes a first printed circuit board 351 having a first surface 351a on which electronic devices are mounted, and a first surface 351a of the first printed circuit board 351. ) and a cover portion (for example, the second printed circuit board 352) disposed to face, and a side portion (for example, the interposer 353) surrounding the first printed circuit board 351 and the cover portion. there is.
  • the printed circuit board assembly 350 includes a first printed circuit board 351 (eg, a main board) having a first surface 351a on which electronic devices are mounted, and the first printed circuit board 351. It may include a second printed circuit board 352 (for example, a sub board) disposed facing the first printed circuit board 352 and an interposer 353 disposed between the first printed circuit board 351 and the second printed circuit board 352. there is.
  • a first printed circuit board 351 eg, a main board
  • the first printed circuit board 351 may include a second printed circuit board 352 (for example, a sub board) disposed facing the first printed circuit board 352 and an interposer 353 disposed between the first printed circuit board 351 and the second printed circuit board 352.
  • the first printed circuit board 351 is a second side of a plate structure (eg, the second side 340b of the plate structure 342 of FIG. 3) and a back plate (eg, the back plate of FIG. 3). 380), and the second printed circuit board 352 may be disposed between the first printed circuit board 351 and the back plate.
  • a mounting space surrounded by an interposer 353 may be formed between the first printed circuit board 1 and the second printed circuit board 2, and the electronic device C (eg, processor, memory) may be formed in the mounting space. , interfaces) may be arranged.
  • the electronic elements C may be electrically connected to the first printed circuit board 351 by soldering.
  • fillers may be filled around the electronic devices C of the mounting space, and, for example, a liquid heat dissipation material may be injected from the outside of the mounting space through a filler injection hole (eg, the filler injection hole 354 of FIG. 4C). )) can be filled into the mounting space.
  • a filler injection hole eg, the filler injection hole 354 of FIG. 4C.
  • the first printed circuit board 351 is interposed between the second printed circuit board 352 so that the first printed circuit board 351 and the second printed circuit board ( 352) may include a body member 355 supporting it.
  • the body member 355 may include a cylindrical body 3551 and an internal hole 3552 formed inside the body 3551 through which the liquid heat dissipation material passes.
  • the body 3551 of the body member 355 may be composed of a pem nut.
  • the first end 3551a of the body member 355 may contact the second surface 352a of the second printed circuit board 352, and the second end 3551b of the body member 355 may contact the first printed circuit board 352. It may contact the first surface 351a of the substrate 351 . Since both ends 3551a and 3551b of the body member 355 support the first printed circuit board 351 and the second printed circuit board 352, the mounting space can be firmly maintained.
  • the body member 355 may be coupled to the second printed circuit board 352 by soldering between the first end 3551a and the second surface 352a of the second printed circuit board. It may be coupled to the first printed circuit board 351 by soldering between the second end 3551b and the first surface 351a of the first printed circuit board 351 .
  • soldering may be formed only between the first end 3551a and the second surface 352a or between the second end 3551b and the first surface 351a. Even when an external force is applied to the body member 355 by the soldering, unwanted movement or rotation of the body member 355 can be prevented.
  • the filler injection hole 354 may be formed to pass through at least one of the first printed circuit board 351 , the second printed circuit board 352 , and the interposer 353 .
  • the filler injection hole 354 may be formed as a through hole penetrating the second surface 352a and the third surface 352b of the second printed circuit board 352 .
  • One end of the inner hole 3552 of the body member 355 may be aligned with the filler inlet 354, so that when the liquid heat dissipation material is injected from the nozzle N into the filler inlet 354, the heat dissipation material moves into the inner hole 3552 of the body member 355.
  • the mounting space may be entered through the hole 3552 .
  • the filler injection port 354 is preferably formed at a position where interference between the nozzle N and the electronic element C does not occur.
  • the inner hole 3552 may include a first hole extending into the body 3551 from a first opening 3553a formed in the first end 3551a of the body 3551, and It may include a second hole connected to the first hole and connected to the second opening 3553b formed on the side surface 3551c of the body 3551.
  • the size and location of the second opening 3553b may be set so that the liquid heat dissipation material is directed to a desired location in the mounting space.
  • the second opening 3553b may be formed in a direction toward the electronic element C having a high heating value in the mounting space.
  • the first hole may extend from the second printed circuit board 352 in a first direction toward the first printed circuit board 351 (eg, a longitudinal direction of the body 3551).
  • the second hole may extend from one side of the first hole in a second direction toward the interposer 353 (eg, a direction perpendicular to the first direction).
  • the printed circuit board assembly 350 may include a shielding member 356 capable of shielding the filler injection port 354 or the inner hole 3552 of the body member 355 .
  • a screw thread may be formed around at least a portion of the inner hole 3552 of the body member 355, and the shield member 356 may include a screw element capable of screwing with the screw thread.
  • the shielding member 356 may include a cover element 3562 having a larger cross-sectional area than the diameter of the inner hole 3552 or the cross-sectional area of the filler injection port 354 .
  • the shielding member 356 is composed of a screw in which a screw element and a cover element 3562 are combined, and shields the filler inlet 354 and the inner hole 3552 through screw coupling with the inner hole 3552. By doing so, the mounting space can be hermetically shielded.
  • the shielding member 356 is composed of only the cover element 3562 without a screw element, and is adhered around the filler injection port 354 to hermetically shield the mounting space. Since the shielding member 356 can hermetically shield the mounting space, noise generated from the electronic elements c disposed in the mounting space can be effectively blocked from leaking out of the mounting space.
  • FIG. 5 is a noise level (A) and a filler injection hole 354 of the electronic device (c) in a state in which the filler injection hole 354 of the printed circuit board assembly 350 is shielded with a shielding member 356 according to an embodiment. It is a graph comparing the noise level (B) of the electronic element (C) in a state where is not shielded. Referring to FIG. 5 , in a low frequency band between about 0.7 GHz and 0.9 GHz, it can be seen that the noise level (A) is improved by about 3 dB compared to the noise level (B). In a high frequency band between about 2.5 GHz and 2.7 GHz, it can be seen that the noise level (A) is improved by about 2 dB compared to the noise level (B). Through this, it can be seen that the printed circuit board assembly 350 according to an embodiment effectively shields noise within the mounting space in both the low frequency band and the high frequency band.
  • the outer member 357 may be disposed on the third surface (eg, the third surface 352b of FIG. 4A) of the second printed circuit board 352, and the shielding member 356 is It may be bound to the body member 355 while being engaged with at least a portion of the outer member 357 .
  • the binding force between the body member 355 and the shield member 356 can be further strengthened.
  • the outer member 357 may be a shield can that protects the electronic device C or prevents the electronic device C from being interfered with by an external electromagnetic field through noise shielding.
  • the shielding member 356 may pass through at least a portion of the shield can or pass through a filler injection hole (eg, the filler injection hole 354 of FIG. 4C ) while being engaged with the shield can and coupled to the body member 355 .
  • FIG. 7 shows a state in which the second end 4551b of the body member 455 of the printed circuit board assembly 450 contacts the third surface 452b of the second printed circuit board 452 according to various embodiments.
  • a printed circuit board assembly 450 faces a first printed circuit board 451 (eg, a main board) on which electronic devices are mounted, and the first printed circuit board 451 faces each other.
  • a second printed circuit board 452 (for example, a sub-board) disposed to be seen and disposed between the first printed circuit board 451 and the second printed circuit board 452 to allow the first printed circuit board 451 and the second printed circuit board 451 to An interposer 453 electrically connecting the printed circuit board 452 may be included.
  • fillers may be filled around the electronic devices C of the mounting space, and for example, a liquid heat dissipation material may flow from a nozzle (eg, nozzle N of FIG. 4C) to the filler injection port 454. It can be filled into the mounting space through.
  • the body member 455 may be coupled to the third surface 452b of the second printed circuit board 452 .
  • An inner hole 4552 may be formed inside the body 4551 of the body member 455, and the inner hole 4552 may be formed through the body 4551 in one direction.
  • the second end 4551b of the body member 455 may be disposed on the third surface 452b of the second printed circuit board 452. there is.
  • the printed circuit board assembly 450 may include a shielding member 456 capable of shielding the filler injection port 454 and the inner hole 4552 of the body member 455 .
  • a screw thread may be formed around at least a portion of the inner hole 4552 of the body member 455, and the shield member 456 may include a screw element capable of screwing with the screw thread.
  • the shielding member 456 is coupled to the body member 455 to shield the inner hole 4552, so that the filler injection port 454 can be shielded. Since the shielding member 456 can hermetically shield the mounting space, noise generated from the electronic elements c disposed in the mounting space can be effectively blocked from leaking out of the mounting space. Moreover, since the body member 455 is located on the third surface 452b of the second printed circuit board 452 and the body member 455 is not disposed inside the mounting space, sufficient mounting space can be secured. .
  • FIG. 8 shows that the body member 555 of the printed circuit board assembly 550 according to various embodiments is disposed on the third surface 552b of the second printed circuit board 552, and at least a portion of the body member 555 is provided. It shows a state coupled to the outer member 557.
  • a printed circuit board assembly 550 includes a first printed circuit board 551 (eg, a main board) on which an electronic device C is mounted, and the first printed circuit board 551 ) and an interposer 553 disposed between the second printed circuit board 552 (for example, a sub board) and the first printed circuit board 551 and the second printed circuit board 552 disposed to face each other.
  • fillers may be filled around the electronic devices C of the mounting space, and for example, a liquid heat dissipation material may be filled into the mounting space through the filling material inlet 554 from the outside of the mounting space.
  • an inner hole 5552 may be formed inside the body 5551 of the body member 555, and the inner hole 5552 may be formed through the body 5551 in one direction.
  • the outer member 557 may be a shield can that protects the electronic device or prevents the electronic device from being interfered with by an external electromagnetic field through noise shielding.
  • the shield can may cover at least a portion of the third surface 552b of the second printed circuit board 552 where the filler injection hole 554 is formed, and the filler injection hole 554 and the inner hole 5552 are aligned.
  • the body member 555 may be disposed in the inner space formed by the shield can.
  • the shielding member 556 is coupled to the inner hole 5552 of the body member 555 through a through hole formed at one side of the shield can, the filler injection hole 554 can be shielded. Since the shielding member 556 can hermetically shield the mounting space, noise generated from the electronic devices c disposed in the mounting space can be effectively blocked from leaking out of the mounting space. Furthermore, since the body member 555 is positioned on the third surface 552b of the second printed circuit board 552 and the shield member 556 is coupled to the body member 555 together with the outer member 557, sufficient mounting is performed. It is possible to secure the space and increase the binding force of the shield member 556, and the outer member 557 can be firmly supported by the body member 555.
  • a printed circuit board assembly 650 faces a first printed circuit board 651 (eg, a main board) on which electronic devices are mounted, and the first printed circuit board 651 faces each other. It may include a second printed circuit board 652 (eg, a sub-board) disposed to see and an interposer 653 disposed between the first printed circuit board 651 and the second printed circuit board 652 . In one embodiment, fillers may be filled around the electronic devices C in the mounting space.
  • an inner hole 6552 may be formed inside the body 6551 of the body member 655, and the inner hole 6552 may be formed to penetrate the body 6551 in one direction. With only the first end 6551a of the body 6551 in contact with the second surface 652a of the second printed circuit board 652, the body 6551 may be spaced apart from the first printed circuit board 651. there is.
  • the inner hole 6552 is aligned with the filler injection hole (eg, the filler injection hole 354 of FIG. 4A ), so that the liquid heat dissipation material can be filled into the mounting space through the inner hole 6552 .
  • the shielding member 656 shields the inner hole 6552 of the body member 655 through the filler inlet, leakage of noises in the mounting space to the outside of the mounting space can be suppressed.
  • the body member 655 is in contact with only one side (eg, the second printed circuit board 652) of the mounting space, sufficient mounting space can be secured.
  • FIG. 10 shows a cut surface of a body member 755 according to various embodiments, and is a perspective view of a cut surface along a direction perpendicular to the longitudinal direction of the body member 755 .
  • the inner hole of the body member 755 eg, the inner hole 3552 of FIG. 4C
  • a first direction eg, the length of the body member 755.
  • a second hole 7552b extending along and a third direction connected to the first hole 7552a and not parallel to the first hole 7552a (eg, a direction perpendicular to the first and second directions) ) may include a third hole 7552c extending along.
  • the inner hole of the body member 755 may further include a fourth hole 7552d extending along a fourth direction opposite to the third direction.
  • the first hole 7552a is connected to the filler injection hole (eg, the filler injection hole 354 of FIG.
  • the second hole 7552b is connected to the first printed circuit board (eg, the first printed circuit board 351 of FIG. 4C ).
  • the second printed circuit board eg, the second printed circuit board 352 of FIG. 4c
  • the interposer eg, the interposer 453 of FIG. 4c
  • a third hole 7552c may also be connected to the mounting space, and a connection point between the third hole 7552c and the mounting space may be different from a connection point between the second hole 7552b and the mounting space. there is.
  • the fourth hole 7552d may also be connected to the mounting space, and a connection point between the fourth hole 7552d and the mounting space is different from a connection point between the second hole 7552b and the mounting space.
  • a connection point between the hole 7552c and the mounting space may also be different.
  • the configuration of the inner hole of the body member 755 according to FIG. 10 is an example, and the electronic device including the printed circuit board assembly according to various embodiments described in this document is not limited to the configuration of FIG. 10 .
  • the shape and number of internal holes may be variously set according to the direction and amount of application of the liquid heat dissipation material.
  • FIG. 11 shows a state in which a body member 855 according to various embodiments is disposed in a mounting space.
  • a body member 855 according to various embodiments is disposed in a mounting space.
  • at least one surface of the body member 855 is disposed to come into contact with a part of the interposer 853 (eg, the interposer 353 of FIG. 4C), and the side surface 8551c of the body member 855.
  • the shape of at least a portion of may be designed to correspond to the shape of a portion of the interposer 853 that is in contact with each other.
  • the body member 855 is disposed close to the interposer 853, physical stress applied to the interposer 853 can be dispersed, and at least a portion of the body member 855 and the interposer 853 correspond Since it has a shape, rotation of the body member 855 can be effectively prevented even when a rotational force is applied by a shielding member (eg, a screw).
  • a shielding member eg, a screw
  • FIG. 12 is a cross-sectional view illustrating a printed circuit board assembly 950 according to various embodiments.
  • a printed circuit board assembly 950 according to various embodiments is provided in an internal space of a housing (eg, the housing 210 of FIG. 2A ) of an electronic device (eg, the electronic device 200 of FIG. 2A ). can be placed.
  • the printed circuit board assembly 950 includes a first printed circuit board 951 on which the electronic device C is mounted and a region of the first printed circuit board 951 on which the electronic device C is mounted.
  • a shield can 957 may be included.
  • the shield can 957 may be formed of a material (eg, aluminum) that protects the electronic device C, and prevents the electronic device C from being interfered with by an external electromagnetic field through noise shielding.
  • Electronic elements C eg, a processor, memory, interface
  • the shield can 957 may be formed of a material (eg, aluminum) that protects the electronic device C, and prevents the electronic device C from being interfered with by an external electromagnetic field through noise shielding.
  • Electronic elements C eg, a processor, memory, interface
  • the electronic elements C may be disposed in a mounting space surrounded by the first printed circuit board 951 and the shield can 957 .
  • the electronic elements C may be electrically connected to the first printed circuit board 351 by soldering.
  • a liquid heat dissipation material may be filled around the electronic devices C in the mounting space, and the heat dissipation material passes through a filler injection hole formed to penetrate one side of the shield can 957 and into the mounting space. can be filled in.
  • the printed circuit board assembly 950 includes a first printed circuit board 951 and a body member 955 interposed between one surface of the shield can 957 facing the first printed circuit board 951. ), and the body member 955 may support the one surface of the first printed circuit board 951 and the shield can 957 .
  • the body member 955 may include a cylindrical body 9551 and an internal hole 9552 formed inside the body 9551 through which a liquid heat dissipation material passes.
  • the body 9551 of the body member 955 may be composed of a pem nut.
  • one end of the body member 955 may be coupled to the printed circuit board 951 by soldering, and the other end of the body member 955 may also be attached to the one surface of the shield can 957 by soldering.
  • one end of the inner hole 9552 of the body member 955 may be aligned with the filler injection hole, so that the liquid heat dissipation material is injected into the filler injection hole from a nozzle (eg, nozzle N in FIG. 4C). When this happens, the heat dissipation material may enter the inner hole 9552.
  • the inner hole 9552 may include a first hole extending into the body 9551 from one end of the body 9551 and a second hole connected to the side of the body 9551 by being connected to the first hole.
  • the first hole may extend from the one surface of the shield can 957 in a first direction toward the first printed circuit board 951 (eg, the longitudinal direction of the body 9551),
  • the second hole may extend along a second direction (eg, a direction perpendicular to the first direction) from one side of the first hole.
  • the printed circuit board assembly 950 may include a shielding member 956 capable of shielding the inner hole 9552 of the body member 955.
  • a screw thread may be formed around at least a portion of the inner hole 9552 of the body member 955, and the shield member 956 may include a screw element capable of being screwed into the screw thread.
  • the shielding member 956 is composed of a screw in which a screw element and a cover element 9562 are coupled, and can hermetically shield the mounting space through screw coupling with the inner hole 9552. Since the shielding member 356 can hermetically shield the mounting space, leakage of noise generated from the electronic devices c disposed in the mounting space to the outside of the mounting space can be effectively blocked.
  • the printed circuit board assembly 350 includes a first printed circuit board 351 having a first surface 351a on which an electronic device C is mounted, and a portion of the first printed circuit board 351.
  • a cover portion disposed to face the first surface 351a, a side portion surrounding the first printed circuit board 351 and the cover portion, and penetrating the first printed circuit board 351, the cover portion, or the side portion.
  • the printed circuit board 351, the cover part and the side part form a mounting space, the inner hole 3552 is connected to the mounting space, and the mounting space can be sealed by the shielding member 356. there is.
  • one end 3551b of the body member 355 is in contact with the first surface 351a of the first printed circuit board 351 and the other end 3551a of the body member 355 is the The body member 355 may support the first printed circuit board 351 and the cover part by coming into contact with the second surface 352a of the cover part facing the first surface 351a.
  • the inner hole 7552 is connected to a first hole 7552a extending along a first direction from one end of the body member 755 and the first hole 7552a, and is connected to the first hole 7552a.
  • a second hole 7552b extending along a second direction not parallel to the direction, the first hole 7552a being connected to the filler inlet, and the second hole 7552b being connected to the mounting space.
  • the inner hole 7552 further includes a third hole 7552c connected to the first hole 7552a and extending along a third direction not parallel to the first hole 7552a.
  • the third hole 7552c is connected to the mounting space, and a connection point between the second hole 7552b and the mounting space and a connection point between the third hole 7552c and the mounting space may be different from each other. there is.
  • the shielding member 356 includes a screw element, and a screw thread coupled to the screw element may be formed around the inner hole 3552 of the body member 355 .
  • the shielding member 356 may include a cover element 3562 having a larger cross-sectional area than the filler injection port 354 .
  • the body member 355 may be a second surface of the cover facing the first surface 351a of the first printed circuit board 351 or a surface of the cover opposite to the second surface. Contacting one of the third surfaces, the inner hole 3552 may be formed through the body member.
  • At least one surface of the body member 855 may be in contact with the side surface, and a shape of at least one surface of the body member 853 may correspond to a shape of the adjacent side surface.
  • the cover part may be composed of a second printed circuit board 352 different from the first printed circuit board 351 .
  • the side part may be composed of an interposer 353 connecting the first printed circuit board 351 and the second printed circuit board 352 .
  • an outer member 357 is disposed on a third surface of the cover part that does not face the first surface 351a of the first printed circuit board 351, and the body member 355 is disposed on the outer side. It may be coupled with at least a part of the member 357.
  • the outer member 557 is composed of a shield can, one end of the body member 555 is in contact with the third surface, and the other end of the body member 555 is in contact with the shield can ,
  • the body member 555 may support the cover part and the shield can.
  • the cover part and the side part may be configured as a shield can 957 covering the first surface of the first printed circuit board 951 .
  • An electronic device includes a housing, a first printed circuit board 351 disposed in an inner space of the housing and on which an electronic device C is mounted, and a first printed circuit board 351 and A second printed circuit board 352 facing each other, between the first printed circuit board 351 and the second printed circuit board 352, the first printed circuit board 351 and the second printed circuit board
  • An interposer 353 electrically connecting 352 and forming a mounting space with the first printed circuit board 351 and the second printed circuit board 352, and an interior connecting the outside and inside of the mounting space.
  • a body member 355 having a hole 3552 and a shielding member 356 shielding the inner hole 3552 may be included.
  • the body member 355 may be interposed between the first printed circuit board 351 and the second printed circuit board 352 .
  • At least one side of the body member 855 is disposed to be in contact with the interposer 953, and the shape of at least one side of the body member 955 that is in contact with the interposer 853 is the same as the one in contact with the interposer 853. It may correspond to the inner shape of the interposer 853.
  • the second printed circuit board 352 is provided with a filler injection hole 354 passing through the second printed circuit board 352, and one end of the inner hole 3552 is the filler injection hole ( 354), and the other end of the inner hole 3552 may face the mounting space.
  • the direction of the other end of the inner hole 3552 may be set based on the calorific value of the electronic device C mounted in the mounting space.
  • the blocking member 356 may include a screw that is screwed into the inner hole 3552 of the body member 355 .
  • An electronic device includes a housing, a first printed circuit board 351 disposed in an inner space of the housing and having an electronic device C mounted thereon, and facing the first printed circuit board 351 in the inner space.
  • a second printed circuit board 352 disposed to be seen, and between the first printed circuit board 351 and the second printed circuit board 352, the first printed circuit board 351 and the second printed circuit board ( 352) and an interposer 353 that forms a mounting space together with the first printed circuit board 351 and the second printed circuit board 352, and the heat dissipation filler is injected into the mounting space.
  • a member 356 may be included, one end of the inner hole 3552 may be connected to the filler injection port 354, and the other end of the inner hole 3552 may face the mounting space.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention concerne un ensemble carte de circuit imprimé selon divers modes de réalisation. L'ensemble carte de circuit imprimé peut comprendre : une première carte de circuit imprimé ayant une première surface sur laquelle un élément électronique est monté ; une partie couvercle disposée de manière à faire face à la première surface de la première carte de circuit imprimé ; une partie latérale entourant la première carte de circuit imprimé et la partie couvercle ; un trou d'injection de charge formé de manière à passer à travers la première carte de circuit imprimé, la partie couvercle, ou la partie latérale ; un élément de corps ayant un trou interne aligné avec le trou d'injection de charge ; et un élément de blindage pour protéger le trou interne. La première carte de circuit imprimé, la partie couvercle et la partie latérale formant un espace de montage, le trou interne est relié à l'espace de montage, et l'espace de montage peut être scellé par l'élément de blindage.
PCT/KR2022/011161 2021-08-18 2022-07-29 Dispositif électronique comprenant un ensemble carte de circuit imprimé WO2023022388A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0108829 2021-08-18
KR1020210108829A KR20230026789A (ko) 2021-08-18 2021-08-18 인쇄 회로 기판 어셈블리를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2023022388A1 true WO2023022388A1 (fr) 2023-02-23

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PCT/KR2022/011161 WO2023022388A1 (fr) 2021-08-18 2022-07-29 Dispositif électronique comprenant un ensemble carte de circuit imprimé

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KR (1) KR20230026789A (fr)
WO (1) WO2023022388A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308117A (ja) * 2000-04-25 2001-11-02 Matsushita Electric Works Ltd フリップチップ実装体の樹脂封止方法、この方法に使用する樹脂封止用印刷マスクおよび半導体装置
JP2015018864A (ja) * 2013-07-09 2015-01-29 新電元工業株式会社 電子機器の熱管理構造
JP2015076580A (ja) * 2013-10-11 2015-04-20 新電元工業株式会社 電気機器の製造方法、および電気機器
JP2017099035A (ja) * 2015-11-18 2017-06-01 コーセル株式会社 電源装置及びその製造方法
KR102269852B1 (ko) * 2018-04-05 2021-06-28 엘지전자 주식회사 Pcb 적층 구조체와 이를 포함하는 이동 단말기

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308117A (ja) * 2000-04-25 2001-11-02 Matsushita Electric Works Ltd フリップチップ実装体の樹脂封止方法、この方法に使用する樹脂封止用印刷マスクおよび半導体装置
JP2015018864A (ja) * 2013-07-09 2015-01-29 新電元工業株式会社 電子機器の熱管理構造
JP2015076580A (ja) * 2013-10-11 2015-04-20 新電元工業株式会社 電気機器の製造方法、および電気機器
JP2017099035A (ja) * 2015-11-18 2017-06-01 コーセル株式会社 電源装置及びその製造方法
KR102269852B1 (ko) * 2018-04-05 2021-06-28 엘지전자 주식회사 Pcb 적층 구조체와 이를 포함하는 이동 단말기

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