WO2023019864A1 - 印刷电路板和印刷电路板布线方法 - Google Patents

印刷电路板和印刷电路板布线方法 Download PDF

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Publication number
WO2023019864A1
WO2023019864A1 PCT/CN2021/143423 CN2021143423W WO2023019864A1 WO 2023019864 A1 WO2023019864 A1 WO 2023019864A1 CN 2021143423 W CN2021143423 W CN 2021143423W WO 2023019864 A1 WO2023019864 A1 WO 2023019864A1
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WIPO (PCT)
Prior art keywords
signal line
printed circuit
circuit board
groove area
wiring
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Ceased
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PCT/CN2021/143423
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English (en)
French (fr)
Inventor
蔡元元
王志钢
皮本元
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Spreadtrum Communications Shanghai Co Ltd
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Spreadtrum Communications Shanghai Co Ltd
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Publication of WO2023019864A1 publication Critical patent/WO2023019864A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances

Definitions

  • the present application relates to the technical field of printed circuit boards, in particular to a printed circuit board and a wiring method for the printed circuit board.
  • the serpentine routing method is usually adopted to wind the shorter signal wires in a group of signal wires within the tolerance range of the length of the longest signal wire in the group, so as to control the delay.
  • the serpentine trace Because the distance between the line and the line is very close, the signal on the trace can be coupled to some adjacent transmission lines through space, and this process is Called crosstalk, crosstalk will not only affect the voltage amplitude on the victim line, but also affect the transmission delay of the signal on the victim line and affect the signal quality.
  • the embodiments of the present application provide a printed circuit board and a wiring method for the printed circuit board, in order to improve the electromagnetic shielding effect between the serpentine signal lines of the printed circuit board and improve the crosstalk problem of the serpentine signal lines.
  • the present application provides a printed circuit board wiring method, the printed circuit board includes a stacked wiring layer and a ground plane layer, the wiring layer is provided with a first signal line, and the first signal line is bent to form at least one recessed region, each recessed region comprising an opening and a bottom; the method comprising:
  • a shielding member is provided in a first recessed area of the at least one recessed area
  • the through hole is located at the opening of the first groove area
  • the shielding component is connected to the system ground of the ground plane layer through the through hole.
  • each groove region in the at least one groove region is the first groove region.
  • the method further includes: opening the ground wire at the bottom of the first groove area.
  • the shielding component is a ground wire; or, the shielding component is copper skin.
  • the first signal line is a single-ended signal line; or, the first signal line is a differential signal line, the opening direction of the first groove area is away from the second signal line, and the second signal line
  • the line is another differential signal line forming a differential signal line group with the first signal line.
  • the present application provides a printed circuit board, the printed circuit board includes a wiring layer and a ground plane layer stacked, the wiring layer is provided with a first signal line, and the first signal line is bent to form at least one recessed regions, each recessed region comprising an opening and a bottom;
  • the first groove area in the at least one groove area is provided with a shielding part, and a through hole is opened on the shielding part, and the through hole is located at the opening of the first groove area, and the shielding part passes through The through hole is connected to the system ground of the ground plane layer.
  • each groove region in the at least one groove region is the first groove region.
  • the shielding component is a ground wire; or, the shielding component is copper skin.
  • the first signal line is a single-ended signal line; or, the first signal line is a differential signal line, the opening direction of the first groove area is away from the second signal line, and the second signal line
  • the line is another differential signal line forming a differential signal line group with the first signal line.
  • a shielding component is provided in the groove area formed by bending the serpentine signal line of the wiring layer of the printed circuit board, and a through hole is opened on the shielding component, and the through hole is located at the opening of the groove area. Then, the shielding component is connected to the system ground of the ground plane layer of the printed circuit board through the through hole, which is conducive to improving the electromagnetic shielding effect between the serpentine signal lines and improving the crosstalk problem of the serpentine signal lines.
  • FIG. 1 is a schematic flow diagram of a printed circuit board wiring method provided in an embodiment of the present application
  • Fig. 2 is a schematic diagram of the position of a shielding component provided by the embodiment of the present application.
  • FIG. 3 is a simulation diagram of a printed circuit board wiring structure provided by an embodiment of the present application.
  • FIG. 4 is a schematic diagram of the port voltage in the simulation diagram of the printed circuit board wiring structure provided by the embodiment of the present application.
  • FIG. 5 is a schematic diagram of the simulation results of the printed circuit board wiring structure provided by the embodiment of the present application.
  • FIG. 6 is a schematic diagram of the position of another shielding component provided in the embodiment of the present application.
  • Fig. 7 is a schematic diagram of the position of another shielding component provided by the embodiment of the present application.
  • Fig. 8 is a schematic diagram of the position of another shielding component provided by the embodiment of the present application.
  • FIG. 9 is a schematic diagram of the position of another shielding component provided by the embodiment of the present application.
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as “first” and “second” may explicitly or implicitly include at least one of these features.
  • plural means at least two, such as two, three, etc., unless otherwise specifically defined.
  • severeal means at least one, such as one, two, etc., unless otherwise specifically defined.
  • an embodiment of the present application provides a printed circuit board wiring method
  • the printed circuit board includes a stacked wiring layer and a ground plane layer, the wiring layer is provided with a first signal line, and the first The signal line is bent to form at least one groove area, each groove area includes an opening and a bottom; the method includes:
  • Step 101 disposing a shielding component in the first groove region of the at least one groove region
  • Step 102 opening a through hole on the shielding component, the through hole is located at the opening of the first groove area;
  • Step 103 connecting the shielding component to the system ground of the ground plane layer through the through hole.
  • the first signal line may be a signal line that adopts a serpentine wiring method. As shown by the gray line in FIG. 2, the first signal line is bent to form at least one groove area, and each groove area is The closed end of the first signal line is the bottom of the groove area, and the end not closed by the first signal line is the opening of the groove area.
  • a shielding part 2 is arranged in the first groove area, and a through hole 3 is opened on the shielding part 2, and the through hole 3 is located in the first groove The opening of area 1.
  • the shielding component 2 can be connected to the ground plane layer of the printed circuit board nearby through the through hole 3, so as to reduce the grounding path of the shielding component, further improve the electromagnetic shielding effect, and improve the crosstalk between signal lines.
  • the opening manner of the through hole is not specifically limited here, and the shielding component may be connected to the ground plane layer through the through hole.
  • the signal line gap of the serpentine wiring is formed by bending
  • the width of each groove area usually does not exceed three times the line width, and sometimes the width of each gap may even take twice the line width, that is, the diameter of the through hole may exceed the width of the first groove area.
  • the location of the through hole can specifically meet the following conditions: the maximum width of the part of the through hole falling in the first groove area does not exceed the width of the first groove area, that is, there is no need to increase the size of the through hole because of the opening of the through hole.
  • the width of the first groove area and the opening of the through hole will not occupy too much extra wiring space on the printed circuit board.
  • first signal line shown in Figure 2 is only to illustrate the position of the shielding component.
  • the wiring structure of the first signal line is set according to its actual signal transmission requirements.
  • the specific bending wiring method And the number of grooved areas formed by bending may be different from that shown in Figure 2; in addition, only one first grooved area is shown in Figure 2 as an example, and the number of first grooved areas in actual applications can be more
  • each groove area may be the first groove area, which is not specifically limited here.
  • a shielding component is provided in the groove area formed by bending the serpentine signal line of the wiring layer of the printed circuit board, and a through hole is opened on the shielding component, and the through hole is located at the opening of the groove area. Then, the shielding component is connected to the system ground of the ground plane layer of the printed circuit board through the through hole, which is conducive to improving the electromagnetic shielding effect between the serpentine signal lines and improving the crosstalk problem of the serpentine signal lines.
  • each groove region in the at least one groove region is the first groove region.
  • each groove area in at least one groove area is a first groove area, that is, each groove area formed by bending the first signal line is provided with a shielding component, and a through hole is opened on each shielding component , the position of the through hole is located at the opening of each groove area, and each shielding component can be connected to the ground plane layer of the printed circuit board by opening a through hole on it, that is, each shielding component is grounded nearby, shortening Path to ground for each shielded component.
  • each groove area in at least one groove area formed by bending the first signal line is a first groove area, that is, each groove area in which the first signal line is completely formed is provided with
  • Each shielding component is provided with a through hole, and each shielding component is grounded nearby, which is conducive to further improving the electromagnetic shielding effect between the serpentine signal lines and improving the crosstalk problem between the signal lines.
  • the method further includes: opening a shielding component at the bottom of the first groove region.
  • the number of electronic components per unit area of the printed circuit board in the terminal is also increasing, but the size of the terminal is limited, and the serpentine wiring itself will occupy a large area. Wiring space, and the through hole itself will occupy a large wiring space, therefore, the shielding part at the bottom of the first groove area is opened, that is, the bottom of the first groove area (or other positions inside the first groove area) is not opened Through-holes can further save space on the printed circuit board.
  • the shielding component at the bottom of the first groove area is open, which is beneficial to improve the electromagnetic shielding effect, improve the crosstalk problem between the serpentine signal lines, and save the wiring space of the printed circuit board.
  • multiple through holes can be opened on the shielding component, and the positions of the through holes can be inside the first groove area, such as port 1 in Figure 3 As shown by the signal line in the middle of port 2, the location of the via can be at the bottom of the first groove area.
  • FIG. 3 Three printed circuit board wiring structures are shown in FIG. 3, wherein, for the signal line a between port 1 and port 2, shielding components are provided in the multiple groove areas formed by bending the signal line a. , two through holes are opened on each shielding part, one through hole is located at the bottom of the groove area, and the other through hole is located at the opening of the groove area; for the signal line b between port 3 and port 4, the signal line b Shielding parts are provided in the multiple groove areas formed by bending, and only one through hole is opened on each shielding part. The through hole is located at the opening of the groove area, and no through hole is opened inside the groove area. The shielding part at the bottom of the groove area is open; for the signal line c between port 5 and port 6, no shielding part is provided between the signal lines.
  • the three wiring structures shown in Figure 3 are simulated according to the conditions shown in Figure 4, where the voltages V1, V2, and V3 at ports 1, 3, and 5 have the same amplitude at the same time point, and R1, R2, and R3 is also the same.
  • the signal simulation results at port 2, port 4, and port 6 are shown in Figure 5, where the black solid line is the simulation result of port 6, the black dotted line is the simulation result of port 4, and the gray solid line is the simulation result of port 2.
  • the horizontal axis represents the signal delay of the port, the unit is nS, and the vertical axis represents the port voltage amplitude, the unit is mV.
  • the shielding component is a ground wire; or, the shielding component is copper skin.
  • the conductive pattern of the shielding component can be in the form of a wire or a copper skin.
  • each groove area is the first groove area
  • the setting of the shielding component can be as shown in Figure 6, and the gray line in Figure 6 is The first signal line, the black line is the grounding line; when the shielding component is copper, the setting of the shielding component can be shown in FIG. 7 .
  • the black line is the first signal line, and the shaded part is the copper skin.
  • the width of the grounding wire can be selected and set according to the needs.
  • the shielding part shown in Figure 6 is only for describing the position of the shielding part.
  • the width of the shielding part can be selected according to the needs. Specifically, the value of the shielding part width It can be set as large as possible while satisfying the safety gap of the conductive pattern.
  • the shielding component may be a ground wire or a copper sheet, that is, the form of the shielding component may be flexibly selected.
  • the first signal line is a single-ended signal line; or, the first signal line is a differential signal line, and the opening direction of the first groove area is away from the second signal line, the The second signal line is another differential signal line forming a differential signal line group with the first signal line.
  • the single-ended signal line may be a single-ended high-speed signal line
  • the differential signal line may be a differential high-speed signal line for transmitting high-speed digital signals
  • At least one groove area formed by bending the second signal line may also include a first groove area, and the opening direction of the first groove area is away from the first signal line.
  • each groove area whose opening direction is away from the second signal line can be the first groove area.
  • each groove area whose opening direction is away from the first signal line may be the first groove area.
  • the shielding part is shown in the form of a ground wire in Figure 8, the gray line in Figure 8 is the first signal line and the second signal line, and the black line is the ground wire;
  • Figure 9 shows the shielding part in the form of a copper sheet Components, the black line in Figure 9 is the first signal line and the second signal line, and the shaded part is the copper skin.
  • the first signal line may be a single-ended signal line or a differential high-speed signal line, that is, this method may be applied to various types of signal lines to improve crosstalk between signal lines.
  • the embodiment of the present application also provides a printed circuit board, the printed circuit board includes a wiring layer and a ground plane layer stacked, the wiring layer is provided with a first signal line, and the first signal line is bent to form at least one concave Groove areas, each groove area includes an opening and a bottom; the first groove area in the at least one groove area is provided with a shielding component, and a through hole is opened on the shielding component, and the through hole is located in the first groove area.
  • the shielding component is connected to the system ground of the ground plane layer through the through hole.
  • each groove region in the at least one groove region is the first groove region.
  • the shielding component at the bottom of the first groove area is open.
  • the shielding component is a ground wire; or, the shielding component is copper skin.
  • the first signal line is a single-ended signal line; or, the first signal line is a differential signal line, and the opening direction of the first groove area is away from the second signal line, the The second signal line is another differential signal line forming a differential signal line group with the first signal line.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本申请提供一种印刷电路板和印刷电路板布线方法，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；所述至少一个凹槽区域中的第一凹槽区域设置有屏蔽部件，所述屏蔽部件上开设有通孔，所述通孔位于所述第一凹槽区域的开口处，所述屏蔽部件通过所述通孔连接所述地平面层的系统地。本申请有利于提高印刷电路板蛇形信号线间电磁屏蔽效果，改善蛇形信号线串扰问题。

Description

印刷电路板和印刷电路板布线方法 技术领域
本申请涉及印刷电路板技术领域，特别是涉及一种印刷电路板和印刷电路板布线方法。
背景技术
随着5G(5th Generation Mobile Communication，第五代移动通信技术Technology)的发展，对于高速信号传输的要求越来越高，在高速PCB(Printed Circuit Board，印刷电路板)设计时，为了满足高速信号的时序要求，需要进行信号等长绕线。
目前，通常采用蛇形走线的方式，将一组信号线中总长度较短的信号线绕到组内最长信号线长度公差范围内，从对延时进行控制。然而蛇形走线中信号线间距很近的部分会存在串扰问题(由于线与线之间的距离很近，走线上的信号可以通过空间耦合到其相邻的一些传输线上去，这个过程就叫串扰)，串扰不仅会影响受害线上的电压幅值，同时还会影响到受害线上信号的传输时延，影响信号质量。
发明内容
本申请实施例提供一种印刷电路板和印刷电路板布线方法，以期提高印刷电路板蛇形信号线间电磁屏蔽效果，改善蛇形信号线串扰问题。
第一方面，本申请提供一种印刷电路板布线方法，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；所述方法包括：
在所述至少一个凹槽区域中的第一凹槽区域设置屏蔽部件；
在所述屏蔽部件上开设通孔，所述通孔位于所述第一凹槽区域的开口处；
将所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
可选的，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
可选的，所述方法还包括：将所述第一凹槽区域的底部的地线开路。
可选的，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
可选的，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
第二方面，本申请提供一种印刷电路板，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；
所述至少一个凹槽区域中的第一凹槽区域设置有屏蔽部件，所述屏蔽部件上开设有通孔，所述通孔位于所述第一凹槽区域的开口处，所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
可选的，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
可选的，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
可选的，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
可以看出，本申请实施例中，在印刷电路板布线层的蛇形信号线弯曲形成的凹槽区域设置屏蔽部件，并在该屏蔽部件上开设通孔，该通孔位于凹槽区域的开口处，然后将该屏蔽部件通过该通孔连接该印刷电路板地平面层的系统地，有利于提高蛇形信号线间电磁屏蔽效果，改善蛇形信号线串扰问题。
附图说明
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的一种印刷电路板布线方法的流程示意图；
图2为本申请实施例提供的一种屏蔽部件的位置示意图；
图3为本申请实施例提供的一种印刷电路板布线结构仿真图；
图4为本申请实施例提供的印刷电路板布线结构仿真图中端口电压示意图；
图5为本申请实施例提供的印刷电路板布线结构仿真结果示意图；
图6为本申请实施例提供的另一种屏蔽部件的位置示意图；
图7为本申请实施例提供的另一种屏蔽部件的位置示意图；
图8为本申请实施例提供的另一种屏蔽部件的位置示意图；
图9为本申请实施例提供的另一种屏蔽部件的位置示意图。
具体实施方式
为了便于理解本申请，为使本申请的上述目的、特征和优点能够更加明显易懂，下面结合附图对本申请的具体实施方式做详细的说明。在下面的描述中阐述了很多具体细节以便于充分理解本申请，附图中给出了本申请的较佳实施方式。但是，本申请可以以许多不同的形式来实现，并不限于本文所描述的实施方式。相反地，提供这些实施方式的目的是使对本申请的公开内容理解的更加透彻全面。本申请能够以很多不同于在此描述的其它方式来实施，本领域技术人员可以在不违背本申请内涵的情况下做类似改进，因此本申请不受下面公开的具体实施例的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本申请的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。在本申请的描述中，“若干”的含义是至少一个，例如一个，两个等，除非另有明确具体的限定。
如图1所示，本申请实施例提供一种印刷电路板布线方法，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；所述方法包括：
步骤101，在所述至少一个凹槽区域中的第一凹槽区域设置屏蔽部件；
步骤102，在所述屏蔽部件上开设通孔，所述通孔位于所述第一凹槽区域的开口处；
步骤103，将所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
具体的，请参照图2，第一信号线可以是采用蛇形布线方式的信号线，如图2中灰色线条所示，第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域被第一信号线围合封闭的一端为该凹槽区域的底部，未被第一信号线封闭的一端为该凹槽区域的开口。
以图2中所指示的区域1为第一凹槽区域为例，第一凹槽区域内设置有屏蔽部件2，该屏蔽部件2上开设有通孔3，该通孔3位于第一凹槽区域1的开口处。屏蔽部件2通过通孔3可以实现与印刷电路板地平面层的就近连接，以减少屏蔽部件的接地路径，进一步提高电磁屏蔽效果，改善信号线间串扰问题。
其中，通孔的开口方式此处不做具体限制，屏蔽部件可以通过通孔连接地平面层即可。
具体实现中，由于通孔的直径通常比信号线直径大很多，而蛇形布线本身因为占用的印刷电路板空间较大，出于节省布线空间的考虑，蛇形布线的信号线间隙即弯曲形成的每个凹槽区域的宽度通常不会超过三倍线宽，有时每个间隙的宽度甚至可能采用两倍线宽，即通孔的直径可能会超过第一凹槽区域的宽度，此时，通孔的位置设置具体可以满足下述条件：通孔落在第一凹槽区域内的部分的最大宽度不超过第一凹槽区域的宽度，也就是说，不需要因为开设通孔而增大第一凹槽区域的宽度，通孔的开设不会占用印刷电路板过多额外的布线空间。
需要说明的是，图2中示出的第一信号线仅为说明屏蔽部件位置，实际应用中，第一信号线的布线结构是根据其实际信号传输需求进行设置的，其具体弯曲布线的方式以及弯曲形成的凹槽区域的数量均可能和图2所示的不同；另外，图2中仅示例性的示出了一个第一凹槽区域，实际应用中第一凹槽区域的数量可以更多，例如可以每个凹槽区域均为第一凹槽区域，此处不做具体限定。
可以看出，本申请实施例中，在印刷电路板布线层的蛇形信号线弯曲形成的凹槽区域设置屏蔽部件，并在该屏蔽部件上开设通孔，该通孔位于凹槽区域 的开口处，然后将该屏蔽部件通过该通孔连接该印刷电路板地平面层的系统地，有利于提高蛇形信号线间电磁屏蔽效果，改善蛇形信号线串扰问题。
在一些可能的示例中，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
具体的，至少一个凹槽区域中每个凹槽区域均为第一凹槽区域，即第一信号线弯曲形成的每个凹槽区域均设置屏蔽部件，且每个屏蔽部件上开设有通孔，通孔的位置位于每个凹槽区域的开口处，每个屏蔽部件通过开设在其上通孔即可实现与印刷电路板地平面层的连接，即每个屏蔽部件均就近接地，减短每个屏蔽部件接地的路径。
可见，本示例中，第一信号线弯曲形成的至少一个凹槽区域中每个凹槽区域都是第一凹槽区域，即在第一信号线完全形成的每个凹槽区域中均设置有屏蔽部件，且每个屏蔽部件上开设有通孔，每个屏蔽部件就近接地，有利于进一步提高蛇形信号线之间的电磁屏蔽效果，改善信号线间串扰问题。
在一些可能的示例中，所述方法还包括：将所述第一凹槽区域的底部的屏蔽部件开路。
具体实现中，考虑到目前例如手机等终端的功能繁多，终端内印刷电路板单位面积的电子元器件数量也越来越多，但终端整机尺寸受限，蛇形布线本身会占用较大的布线空间，且通孔本身会占用较大的布线空间，因此，将第一凹槽区域的底部的屏蔽部件开路，即第一凹槽区域底部(或第一凹槽区域内部其他位置)不开设通孔，可进一步节省印刷电路板的空间。
可见，本示例中，第一凹槽区域的底部的屏蔽部件开路，有利于在提高电磁屏蔽效果，改善蛇形信号线间串扰问题的同时，节省印刷电路板的布线空间。
或者，在其他实施例中，若印刷电路板布线空间本身比较充裕的情况下，屏蔽部件上可以开设多个通孔，通孔的位置可以在第一凹槽区域内部，例如图3中端口1和端口2中间的信号线所示，通孔的位置可以在第一凹槽区域的底部。
具体的，图3中示出了三种印刷电路板布线结构，其中，对于端口1和端口2之间的信号线a，在信号线a弯折形成的多个凹槽区域均设置了屏蔽部件，每个屏蔽部件上开设有两个通孔，一个通孔位于凹槽区域的底部，一个通孔位 于凹槽区域的开口；对于端口3和端口4之间的信号线b，在信号线b弯折形成的多个凹槽区域中均设置了屏蔽部件，每个屏蔽部件上仅开设了一个通孔，通孔位置位于凹槽区域的开口处，凹槽区域内部没有开设通孔，每个凹槽区域的底部的屏蔽部件开路；对于端口5和端口6之间的信号线c，并未在信号线间设置屏蔽部件。
按照图4所示的条件对图3所示的三种布线结构进行仿真，其中，端口1、端口3和端口5处的电压V1、V2和V3在相同时间点幅值相同，R1、R2和R3也相同。端口2、端口4和端口6处的信号仿真结果如图5所示，其中，黑色实线为端口6的仿真结果、黑色虚线为端口4的仿真结果、灰色实线为端口2的仿真结果，横轴表示端口的信号时延，单位为nS，纵轴表示端口电压幅值，单位为mV，从图5中可以看出，端口2和端口4处仿测的信号由于在信号线间隙中设置了屏蔽部件，减小了自身的电磁耦合，所以信号时延基本一致，而在端口6处仿测的信号由于自身未作串扰布线防护，所以电磁能力部分相互耦合，以致信号在时延上提前到达，信号时延的控制未能达到期望。
在一些可能的示例中，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
具体实现中，屏蔽部件的导电图形既可以是线的形式也可以是铜皮。
具体的，以至少一个凹槽区域中每个凹槽区域均为第一凹槽区域为例，当屏蔽部件为接地线时，屏蔽部件的设置可以如图6所示，图6中灰色线条为第一信号线，黑色线条为接地线；当屏蔽部件为铜皮时，屏蔽部件的设置可以如图7所示。图7中黑色线条为第一信号线，阴影部分为铜皮。
实际应用中，接地线的宽度可以根据需要进行选择设置，图6中示出的屏蔽部件仅为描述屏蔽部件的位置，屏蔽部件的宽度可以根据需要进行选择，具体的，屏蔽部件宽度的取值可以在满足导电图形安全间隙的情况下尽量取大。
可见，本示例中，屏蔽部件可以是接地线或者铜皮，即屏蔽部件的形式可以灵活选择。
在一些可能的示例中，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
其中，单端信号线可以是单端高速信号线，差分信号线可以是差分高速信号线，用于传输高速数字信号。
其中，第二信号线弯曲形成的至少一个凹槽区域中也可以包括第一凹槽区域，该第一凹槽区域的开口方向背离第一信号线。
具体的，参见图8和图9，第一信号线弯曲形成的至少一个凹槽区域中，每个开口方向背离第二信号线的凹槽区域都可以是第一凹槽区域，同样的，第二信号线弯曲形成的至少一个凹槽区域中，每个开口方向背离第一信号线的凹槽区域都可以是第一凹槽区域。其中，图8中以接地线的形式示出了屏蔽部件，图8中灰色线条为第一信号线和第二信号线，黑色线条为接地线；图9中以铜皮的形式示出了屏蔽部件，图9中黑色线条为第一信号线和第二信号线，阴影部分为铜皮。
可见，本示例中，第一信号线可以是单端信号线或者是差分高速信号线，即本方法可以应用到多种形式的信号线中，以改善信号线间串扰问题。
本申请实施例还提供一种印刷电路板，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；所述至少一个凹槽区域中的第一凹槽区域设置有屏蔽部件，所述屏蔽部件上开设有通孔，所述通孔位于所述第一凹槽区域的开口处，所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
在一些可能的示例中，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
在一些可能的示例中，所述第一凹槽区域的底部的屏蔽部件开路。
在一些可能的示例中，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
在一些可能的示例中，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
以上实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对本申请专利范围的限制。应当指出的是，对于本领域的 普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (20)

  1. 一种印刷电路板布线方法，其特征在于，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；所述方法包括：
    在所述至少一个凹槽区域中的第一凹槽区域设置屏蔽部件；
    在所述屏蔽部件上开设通孔，所述通孔位于所述第一凹槽区域的开口处；
    将所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
  2. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
  3. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述方法还包括：
    将所述第一凹槽区域的底部的地线开路。
  4. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
  5. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
  6. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述第一信号线为采用蛇信布线方式的信号线。
  7. 根据权利要求1所述的印刷电路板布线方法，其特征在于，所述通孔的开设位置满足如下条件：所述通孔落在所述第一凹槽区域内的部分的最大宽度不超过所述第一凹槽区域的宽度。
  8. 根据权利要求5所述的印刷电路板布线方法，其特征在于，所述单端信号线为单端高速信号线。
  9. 根据权利要求5所述的印刷电路板布线方法，其特征在于，所述差分信号线为差分高速信号线。
  10. 根据权利要求5所述的印刷电路板布线方法，其特征在于，所述第二信 号线弯曲形成的至少一个凹槽区域包括所述第一凹槽区域，所述第二信号线弯曲形成的所述第一凹槽区域的开口方向背离所述第一信号线。
  11. 一种印刷电路板，其特征在于，所述印刷电路板包括层叠设置的布线层和地平面层，所述布线层设置有第一信号线，所述第一信号线弯曲形成至少一个凹槽区域，每个凹槽区域包括开口和底部；
    所述至少一个凹槽区域中的第一凹槽区域设置有屏蔽部件，所述屏蔽部件上开设有通孔，所述通孔位于所述第一凹槽区域的开口处，所述屏蔽部件通过所述通孔连接所述地平面层的系统地。
  12. 根据权利要求11所述的印刷电路板，其特征在于，所述至少一个凹槽区域中每个凹槽区域均为所述第一凹槽区域。
  13. 根据权利要求11所述的印刷电路板，其特征在于，所述第一凹槽区域的底部的屏蔽部件开路。
  14. 根据权利要求11所述的印刷电路板，其特征在于，所述屏蔽部件为接地线；或者，所述屏蔽部件为铜皮。
  15. 根据权利要求11所述的印刷电路板，其特征在于，所述第一信号线为单端信号线；或者，所述第一信号线为差分信号线，所述第一凹槽区域的开口方向背离第二信号线，所述第二信号线为与所述第一信号线形成差分信号线组的另一差分信号线。
  16. 根据权利要求11所述的印刷电路板，其特征在于，所述第一信号线为采用蛇信布线方式的信号线。
  17. 根据权利要求11所述的印刷电路板，其特征在于，所述通孔的开设位置满足如下条件：所述通孔落在所述第一凹槽区域内的部分的最大宽度不超过所述第一凹槽区域的宽度。
  18. 根据权利要求15所述的印刷电路板，其特征在于，所述单端信号线为单端高速信号线。
  19. 根据权利要求15所述的印刷电路板，其特征在于，所述差分信号线为差分高速信号线。
  20. 根据权利要求15所述的印刷电路板，其特征在于，所述第二信号线弯 曲形成至少一个凹槽区域包括所述第一凹槽区域，所述第二信号线弯曲形成的所述第一凹槽区域的开口方向背离所述第一信号线。
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