WO2023003001A1 - Plated decorative article - Google Patents

Plated decorative article Download PDF

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Publication number
WO2023003001A1
WO2023003001A1 PCT/JP2022/028135 JP2022028135W WO2023003001A1 WO 2023003001 A1 WO2023003001 A1 WO 2023003001A1 JP 2022028135 W JP2022028135 W JP 2022028135W WO 2023003001 A1 WO2023003001 A1 WO 2023003001A1
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WO
WIPO (PCT)
Prior art keywords
plated
film
decorative
resin
plating
Prior art date
Application number
PCT/JP2022/028135
Other languages
French (fr)
Japanese (ja)
Inventor
雄二郎 原田
敦 遊佐
浩明 上野
建輝 鈴木
Original Assignee
マクセル株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by マクセル株式会社 filed Critical マクセル株式会社
Priority to CN202280051471.8A priority Critical patent/CN117693428A/en
Publication of WO2023003001A1 publication Critical patent/WO2023003001A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/20Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22Roughening, e.g. by etching

Definitions

  • the present invention relates to decorative plated products (design plated products).
  • a two-color molding method is generally used as a technique for selectively applying decorative plating to a part of a resin base material.
  • the plated portion on which the plated film is formed and the non-plated portion on which the plated film is not formed are formed by two-color molding using different resin materials to prepare the resin base material, and only the plated portion is formed.
  • a plating film is formed on the
  • the non-plated portion is made of a high-design resin called piano black, which is made of polycarbonate or the like, and the plated portion is made of an ABS resin that can be etched as a pretreatment for plating.
  • a decorative plated product is obtained in which a plated film pattern is formed on the piano black substrate.
  • Patent Document 1 discloses a technique for selectively forming a plating film on a piano black polycarbonate substrate without using two-color molding.
  • a pretreatment ink composition is applied in a pattern to a substrate, and a plated film is selectively formed according to the applied pattern. Since the pretreatment ink composition functions as a binder, the adhesion strength of the plated film increases.
  • Patent Document 1 since the two-color molding method requires two types of molds, the manufacturing cost is high, and a high-definition plating film pattern cannot be formed. Moreover, the technique disclosed in Patent Document 1 requires a masking step or the like for applying the pretreatment ink composition in a pattern, which also increases the manufacturing cost. Moreover, it is expected that, for example, it will be difficult to form a high-definition plating film pattern with a line width of 1 mm or less.
  • the present invention solves these problems, and provides a decorative plated product that can be manufactured through a simpler manufacturing process and has a high-definition plated film pattern with a high degree of design.
  • a decorative plated article comprising: a substrate including a resin molded body made of a resin material; and plating forming a predetermined pattern including linear portions on the surface of the substrate.
  • the surface roughness Ra of the plated region where the plated film is formed is greater than the surface roughness Ra of the non-plated region where the plated film is not formed,
  • a decorative plated product is provided in which the minimum line width of the linear portion of the plated film is 0.1 mm to 5 mm.
  • the resin molding may be composed of a single resin material.
  • the plated region may have a surface roughness Ra of 0.5 ⁇ m to 8.0 ⁇ m, and the non-plated region may have a surface roughness Ra of less than 0.5 ⁇ m.
  • the resin material may contain polyamide or polycarbonate.
  • a color tone of the non-plating region may be piano black.
  • the resin material contains polyamide, and a mixed layer of the resin material and the metal or metal compound contained in the plating film is provided in the vicinity of the surface of the resin molding, including the interface between the plating film and the resin molding. is formed, and the mixed layer may have a thickness of 0.5 ⁇ m or more. Also, a plurality of holes may be formed in the plated region on the surface of the base material. Further, the base material further has a coating film having a piano black color tone provided on the resin molded body, and the non-plating region on the surface of the base material is formed of the coating film. good too.
  • the plating film may be composed of a plurality of layers, and the outermost layer may be an electrolytic plating film containing one selected from the group consisting of hexavalent chromium, trivalent chromium, copper, and gold.
  • the outermost layer may be an electrolytic plated film containing hexavalent chromium or trivalent chromium.
  • the outermost layer may be an electrolytic plated film containing copper or gold.
  • the outermost layer may be an electrolytic plated film containing trivalent chromium.
  • the decorative plated product of the present invention has a high-definition plated film pattern with a high degree of design.
  • FIG. 1 is a schematic cross-sectional view of the peripheral portion of the plating film (linear portion) in the decorative plated product of the first embodiment.
  • 2(a) to 2(c) are diagrams for explaining the manufacturing method of the decorative plated product of the first embodiment, and are schematic cross-sectional views of the peripheral portion of the plated film (linear portion).
  • 3(a) and 3(b) are diagrams for explaining the method of manufacturing the decorative plated product of the second embodiment, and are schematic cross-sectional views of the peripheral portion of the plated film (linear portion).
  • FIGS. 4A to 4D are diagrams for explaining the method of manufacturing the decorative plated product according to the third embodiment, and are schematic cross-sectional views of the peripheral portion of the plating film (linear portion).
  • 5 is a photograph of the decorative plated product manufactured in Example 1.
  • FIG. 6 is a photograph of the decorative plated product manufactured in Example 2.
  • FIG. 7 is a cross-sectional SEM photograph of the decorative plated product manufactured in Example 1.
  • a decorative plated product (design plated product) 100 shown in FIG. 1 will be described.
  • a decorative plated product 100 has a base material 70 including a resin molded body 10 made of a resin material, and a plated film 20 formed on a surface 70 a of the base material 70 .
  • the plated film 20 forms a predetermined pattern including linear portions.
  • the plated film 20 may be three-dimensionally formed over a plurality of surfaces of the substrate 70 or along a three-dimensional surface including a spherical surface.
  • the resin material constituting the resin molded body 10 contains resin.
  • the resin contained in the resin material is not particularly limited, and for example, thermoplastic resin, thermosetting resin, and ultraviolet curable resin can be used.
  • thermoplastic resins include nylon 6 (PA6), nylon 66 (PA66), nylon 11 (PA11), nylon 12 (PA12), 6T nylon (6TPA), 9T nylon (9TPA), 10T nylon (10TPA), Polyamides such as 12T nylon (12TPA), MXD6 nylon (MXDPA) and their alloy materials, polycarbonate (PC), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyetheretherketone (PEEK), polyetherimide (PEI ), polyphenylsulfone (PPSU) and the like can be used.
  • PC polycarbonate
  • PPS polyphenylene sulfide
  • LCP liquid crystal polymer
  • PEEK polyetheretherketone
  • PEI polyetherimide
  • PPSU polyphenylsulfone
  • thermosetting resin for example, epoxy resin, silicone resin, polyimide resin, or the like
  • photocurable resin for example, polyimide resin, epoxy resin, or the like
  • These resins may be used alone or in combination of two or more.
  • nylon and polycarbonate are preferable. By using nylon or polycarbonate, it becomes easy to obtain the base material 70 having a piano black color tone which is excellent in decoration. Resin materials for piano black moldings containing nylon or polycarbonate, colorants, etc. are also commercially available.
  • the resin material that constitutes the resin molded body 10 may be composed only of the resins described above, or may contain fillers, colorants, and other general-purpose additives, which will be described later.
  • the amount of resin in the resin molded body 10 (resin material) may be, for example, 20 to 100% by weight, or 50 to 100% by weight.
  • the resin material may contain a filler such as glass fiber, calcium titanate, potassium titanate, or the like.
  • potassium titanate is preferable. Potassium titanate lowers the coefficient of linear expansion of the resin molding 10 and interacts with the plated film 20 to increase the adhesion strength of the plated film 20 .
  • the reliability of the decorative plated product 100 can be enhanced.
  • potassium titanate it is not necessary to greatly roughen the surface region (plating region 70B described later) of the base material 70 on which the plating film 20 is formed in order to increase the adhesion strength of the plating film 20. Thereby, the glossiness of the plated film 20 can be further enhanced.
  • the filler contained in the resin molding 10 is preferably a rod-shaped, needle-shaped, or fibrous filler with a small diameter so as not to adversely affect the appearance of the decorative plated product 100 .
  • the filler diameter (fiber diameter) may be, for example, 0.3 ⁇ m to 0.6 ⁇ m, and the filler length (fiber length) may be, for example, 10 ⁇ m to 20 ⁇ m.
  • the resin molding 10 of the base material 70 is preferably made of a single resin material.
  • the resin molded body 10 may be a one-color molded body (single-color molded body) made of a single resin material. Therefore, the resin molded body 10 of this embodiment is different from a two-color molded body composed of two kinds of resin materials.
  • the plated portion and the non-plated portion are made of the same resin material (resin material having the same composition).
  • the resin molded article 10 (single-color molded article) of the present embodiment which can be molded by one-color molding, can reduce manufacturing costs compared to two-color molded articles.
  • the resin molded body 10 is made of only one type of resin.
  • the resin material may be composed only of resin, or may contain fillers, colorants, additives, etc. in addition to resin, if necessary.
  • the surface 70a of the substrate 70 has a non-plating area 70A where the plating film 20 is not formed and a plating area 70B where the plating film 20 is formed.
  • the color tone of the non-plating region 70A is preferably a glossy black (jet black) called piano black.
  • piano black may be defined by glossiness and color tone evaluation based on the L * a * b * color system.
  • piano black preferably has a 60-degree specular gloss of 90 or more, and in the L * a * b * color system, L * is 8 or less, a * is ⁇ 0.5 to 0, and b * is ⁇ 1.5 to 0, more preferably 60-degree specular glossiness of 90 or more, and in the L * a * b * color system, L * is 1 or less, a * is ⁇ 0.2 to 0, b * is from -1 to 0.
  • the surface roughness Ra of the plated region 70B is preferably larger than the surface roughness Ra of the non-plated region 70A.
  • the surface roughness Ra of the plated region 70B is preferably larger than the surface roughness Ra of the non-plated region 70A.
  • the adhesion strength of the plated film 20 formed thereon is increased.
  • the surface roughness Ra of the non-plating region 70A for example, when the color tone of the non-plating region 70A is piano black, the gloss can be further enhanced.
  • a groove (recess) 70b may be formed in the plating region 70B.
  • the groove (recess) 70b extends along the plating pattern on the substrate surface 70a.
  • the surface roughness Ra of the plated region 70B is preferably 0.5 ⁇ m to 8.0 ⁇ m, or 0.5 ⁇ m to 3.0 ⁇ m, for example. If the surface roughness Ra of the plating region 70B is equal to or greater than the lower limit value of the above range, sufficient adhesion strength of the plating film 20 can be obtained. decrease in gloss can be suppressed.
  • the surface roughness Ra of the non-plating region 70A is preferably less than 0.5 ⁇ m, for example. If the surface roughness Ra of the non-plating area 70A is within the above range, the gloss of the non-plating area 70A is enhanced.
  • the plated film 20 may be composed of multiple layers.
  • the plated film 20 may include an electroless plated film (base plated film) 21 formed on the base material 70 and a plurality of electrolytic plated films 22 to 24 formed on the electroless plated film 21 .
  • the electroless plated film 21 is not particularly limited, it may be, for example, an electroless nickel phosphorus plated film or an electroless copper plated film. Among them, the electroless nickel phosphorus plated film is preferable.
  • the electrolytic plated films 22 and 23, which are intermediate layers of the plated film 20, are not particularly limited, but may be, for example, an electrolytic copper plated film or an electrolytic nickel plated film.
  • the electrolytic plated film 24, which is the outermost layer (outermost layer) of the plated film 20, preferably contains, for example, hexavalent chromium, trivalent chromium, copper, or gold.
  • an electrolytic plated film containing hexavalent chromium, trivalent chromium, copper, or gold as the outermost layer, the gloss of the plated film 20 is increased, and the design of the decorative plated product 100 is further enhanced.
  • the outermost layer 24 of the plating film 20 is preferably an electrolytic plating film containing trivalent chromium, copper, or gold, excluding hexavalent chromium.
  • An electrolytic plated film containing trivalent chromium is more preferable.
  • the hexavalent chromium electroplating solution may erode the surface of the resin molded body 10 to make it cloudy, making it impossible to maintain the piano black color tone of the non-plating region 70A.
  • the trivalent chromium electrolytic plating solution does not affect the piano black color tone of the resin molding 10, although it is the same chromium-based plating solution. Therefore, by forming the electrolytic plated film containing trivalent chromium as the outermost layer, the luster of the plated film 20 can be enhanced while maintaining the glossy piano black color tone of the non-plated region 70A.
  • the thickness of the plated film 20 is not particularly limited, and may be appropriately designed based on the application of the decorative plated product 100, the type of resin material of the resin molding 10, the type and/or configuration of the plated film 20, and the like.
  • the thickness of the plating film 20 (when the plating film 20 is composed of multiple layers, the total thickness of the multiple layers) may be 3 ⁇ m to 60 ⁇ m or 5 ⁇ m to 40 ⁇ m.
  • the thickness of each plated film forming the plated film 20 may be, for example, within the following range.
  • Electroless plating film 21 (base plating film): 0.2 ⁇ m to 3 ⁇ m
  • electrolytic plating film 22 (eg, electrolytic copper plating film): 3 ⁇ m to 30 ⁇ m
  • electrolytic plating film 23 eg, electrolytic nickel plating film
  • electrolytic plating film 24 (outermost layer): 0.02 ⁇ m to 1 ⁇ m.
  • both of the electrolytic plated film 22 (for example, electrolytic copper plated film) and the electrolytic plated film 23 (for example, electrolytic nickel plated film) are not essential, and only one of them may be used.
  • the plated film 20 has thin (narrow width) linear portions (linear portions).
  • the thin line-shaped plating film 20 can form a high-definition plating film pattern with a high degree of design.
  • the minimum line width (minimum line width) 20d of the linear portion of the plating film 20 is preferably 0.1 mm to 20 mm, 0.1 mm to 5 mm, 0.2 mm to 5 mm, or 0.2 mm to 1 mm.
  • the plating film 20 is formed on the resin molding 10 using laser drawing, as will be described later.
  • a high-definition plating film pattern with a high degree of design which could not be realized by a conventional two-color molding method or a method using the application of a treatment ink composition, can be achieved by a simple method rather than laser drawing. It can be realized using a process.
  • the predetermined pattern formed by the plated film of the present embodiment is not particularly limited as long as it has a thin (narrow width) linear portion (linear plated film). It may be a pattern formed only of linear portions, or a pattern in which linear portions and shape portions (polygons, circles, sectors, characters (alphabet), etc.) are combined. Also, the linear portion may be a straight line or a curved line.
  • the mixed layer 11 of the resin material constituting the resin molded body 10 and the metal or metal compound 20P contained in the plated film 20 is formed in the vicinity of the surface of the resin molded body 10 on which the plated film 20 is formed. good.
  • the mixed layer 11 is formed from the interface 11a between the plating film 20 and the resin molded body 10 toward the interior of the resin molded body 10 .
  • the metal or metal compound 20 ⁇ /b>P may be a metal or metal compound having the same composition as the electroless plated film 21 . Although the details will be described later, the metal or metal compound 20P is generated simultaneously with the electroless plating film 21 by an electroless plating reaction. A part of the metal or metal compound 20P may be connected to the electroless plated film 21 .
  • the metal or metal compound 20P is part of the electroless plated film 21, and it can be interpreted that the electroless plated film 21 grows from the inside (near the surface) of the resin molding 10.
  • FIG. 11 By having the mixed layer 11, the adhesion strength of the plated film 20 to the base material 70 is further increased. Further, when the resin molding 10 contains, for example, polyamide, the base material 70 is easily permeated with the electroless plating solution, so that the mixed layer 11 is easily formed.
  • the thickness 11d of the mixed layer 11 is preferably, for example, 0.5 ⁇ m or more, or 0.5 ⁇ m to 10 ⁇ m. If the thickness 11d is less than the lower limit of the above range, there is a risk that a high adhesion strength with the plated film 20 cannot be obtained. Also in this case, high adhesion strength with the plating film 20 cannot be obtained.
  • the decorative plated product 100 may further have a catalytic activity hindrance layer 80 formed on the non-plating region 70A of the resin molded body 10 (base material 70).
  • a catalytic activity hindrance layer 80 formed on the non-plating region 70A of the resin molded body 10 (base material 70).
  • the thickness of the catalytic activity impeding layer 80 is preferably, for example, 0.2 ⁇ m or less, or 0.1 ⁇ m or less so as not to affect the appearance of the decorative plated product 100 .
  • the resin molding 10 is prepared as the base material 70 .
  • the resin molding 10 may be a commercially available product, or may be obtained by molding a resin material.
  • the plated portion and the non-plated portion are made of the same resin material (made of a single resin material). Therefore, the base material 70 can be manufactured by one-color molding (single-color molding), and the manufacturing cost can be suppressed as compared with the case of using two-color molding.
  • the color tone of the surface 70a of the base material 70 is preferably piano black.
  • the resin molded body 10 may be molded using a commercially available resin material for piano black molded bodies.
  • the surface roughness Ra of the surface 70a is preferably less than 0.5 ⁇ m so as to obtain high gloss.
  • the plated film 20 composed of a plurality of layers is formed on the resin molding 10 .
  • an electroless plated film 21 is formed as a base plated film on the resin molding 10 .
  • a method for forming the electroless plated film 21 is not particularly limited, and a general-purpose method can be used. In this embodiment, as shown in FIGS. 2(a) to 2(c), the electroless plated film 21 is formed by the method disclosed in International Publication No. 2018/131492 and described below, for example.
  • a catalytic activity hindering layer 80 is formed on the surface 70a of the base material 70 (resin molding 10) (see FIG. 2(a)).
  • the catalytic activity hindering layer 80 contains a catalytic activity hindering agent (catalyst deactivator) that hinders (obstructs) the catalytic activity of the electroless plating catalyst.
  • the catalyst activity inhibitor (catalyst deactivator) is not particularly limited, but is preferably, for example, a dendrimer, hyperbranched polymer, or other dendritic polymer disclosed in WO2018/131492. Since these materials are excellent in catalyst deactivation ability and are polymers, the catalyst activity hindering layer 80 can be formed without using a binder resin.
  • a region of the surface 70a on which the catalytic activity hindering layer 80 is formed, where the plating film 20 is to be formed is irradiated with a laser beam to remove the catalytic activity hindering layer 80 (FIG. 2 ( b) see).
  • the type of laser beam used for laser beam irradiation and the laser processing apparatus are not particularly limited, and can be appropriately selected in consideration of the type of the resin molded body 10 and the like.
  • the plated region 70B is irradiated with a laser beam to remove the catalytic activity hindering layer 80 and roughen the plated region 70B.
  • the surface roughness Ra of the plated region 70B after laser beam irradiation is larger than the surface roughness Ra of the non-plated region 70A (that is, the surface roughness Ra of the surface 70a of the substrate 70).
  • the surface roughness Ra of the plating region 70B after laser light irradiation is preferably 0.5 ⁇ m to 8.0 ⁇ m, or 0.5 ⁇ m to 3.0 ⁇ m, for example.
  • a groove (recess) 70b may be formed by removing part of the surface 70a of the resin molding 10 together with the catalytic activity hindering layer 80.
  • an electroless plating catalyst is applied to the plated region 70B irradiated with the laser beam, and then brought into contact with an electroless plating solution.
  • the catalytic activity impeding layer 80 impedes (prevents) the catalytic activity of the electroless plating catalyst applied thereon. Therefore, formation of an electroless plating film is suppressed on the catalytic activity hindering layer 80 in the non-plating region 70A.
  • the catalytic activity hindering layer 80 is removed from the plated region 70B, the electroless plated film 21 is formed (see FIG. 2(c)).
  • the electroless plating catalyst is not particularly limited, and a general-purpose one can be appropriately selected and used.
  • a plating catalyst solution containing a metal salt such as palladium chloride may be used.
  • the electroless plating solution is not particularly limited, and a general-purpose one can be appropriately selected and used.
  • it may be an electroless nickel phosphorous plating solution or an electroless copper plating solution, and among them, an electroless nickel phosphorous plating solution is preferable.
  • the resin material constituting the resin molding 10 and the metal or metal compound 20P contained in the plating film 20 are placed in the vicinity of the surface of the resin molding 10 on which the plating film 20 is formed.
  • a mixed layer 11 of may be formed.
  • the mixed layer 11 is formed by permeation of the electroless plating solution into the resin molding 10 and growth of the electroless plating film 21 from the inside of the resin molding 10 .
  • the adhesion strength of the plated film 20 to the substrate 70 is increased.
  • the resin molding 10 may contain polyamide. Containing polyamide facilitates penetration of the electroless plating solution into the base during electroless plating.
  • a swelling treatment may be performed in which the surface of the resin molding 10 is brought into contact with water (hot water), an organic solvent, or the like. Swelling of the resin molding 10 makes it easier for the electroless plating solution to permeate and the mixed layer 11 to be formed more easily.
  • Electroplated films 22 to 24 are formed on the electroless plated film 21 by a general-purpose electrolytic plating method to obtain the decorative plated product 100 shown in FIG.
  • a high-definition plated film pattern with a high degree of design which could not be realized by a conventional two-color molding method or a method using application (printing) of a treatment ink composition, is called laser drawing. It can be formed using a simpler process. For example, a decorative plated product 100 having a fine-line plating film pattern formed on a shiny piano black substrate can be obtained. Further, by adjusting the surface roughness Ra of the non-plating region 70A and the surface roughness Ra of the plating region 70B within an appropriate range, the adhesion strength of the plating film 20 can be maintained while maintaining the luster and brightness of the non-plating region 70A. And the gloss of the plating film 20 can be enhanced.
  • a decorative plated product (design plated product) 200 of this embodiment shown in FIG. 3(b) will be described.
  • a plurality of holes (recesses, non-through holes) 71 are formed in the plated region 70B of the substrate surface 70a. Since other configurations are substantially the same as those of the decorative plated product 100 described in the first embodiment, description thereof will be omitted.
  • the plurality of holes (concave portions, non-through holes) 71 increase the adhesion strength of the plated film 20 formed thereon.
  • a plurality of holes 71 may be regularly arranged on the plating region 70B.
  • the hole 71 preferably has a circular or elliptical opening shape in the plating region 70B.
  • the size of the hole 71 can be appropriately adjusted according to the width of the plating film 20 .
  • the diameter of the hole 71 (the diameter of the opening in the plating region 70B, the major axis in the case of an ellipse) may be 10 ⁇ m to 80 ⁇ m, and the depth may be 1 ⁇ m to 50 ⁇ m.
  • the decorative plated product 200 can be manufactured by the same method as the decorative plated product 100 of the first embodiment, except that a plurality of holes 71 are formed in the plated region 70B of the substrate surface 70a.
  • the plurality of holes 71 may be formed by laser light irradiation.
  • a plurality of holes 71 may be formed in the step of removing the catalytic activity hindering layer 80 in the plated region 70B by laser drawing (see FIG. 3(a)).
  • the decorative plated product 200 described above has the same effect as the decorative plated product of the first embodiment. Further, the bonding strength of the plating film 20 is further enhanced by the plurality of concave portions (non-through holes) 71 .
  • a decorative plated product (design plated product) 300 of this embodiment shown in FIG. 4(d) will be described.
  • the base material 70 is composed of the resin molded body 10 and the coating film 30 provided on the surface of the resin molded body 10 . That is, the non-plating region 70A of the substrate surface 70a is formed of the coating film 30.
  • FIG. Since other configurations are substantially the same as those of the decorative plated product 100 described in the first embodiment, description thereof will be omitted.
  • the coating film 30 preferably has a piano black color tone.
  • a decorative plated product 300 having a fine wire plating film pattern formed on a piano black substrate and having a high design property can be obtained.
  • the coating film 30 having a piano black color tone the resin molding 10 that is covered with the coating film 30 and becomes invisible does not necessarily need to have a high design. Thereby, the range of selection of materials used for the resin molded body 10 is widened.
  • the coating film 30 may be, for example, a coating film (piano black acrylic urethane coating film) formed using a commercially available two-pack acrylic urethane resin piano black coating.
  • the coating film 30 forms the non-plating region 70A of the substrate surface 70a. Therefore, the surface roughness Ra of the coating film 30 is preferably less than 0.5 ⁇ m, for example. Thereby, the glossiness of the coating film 30 can be improved.
  • the thickness of the coating film 30 may be, for example, 5 ⁇ m to 50 ⁇ m, or 8 ⁇ m to 40 ⁇ m.
  • the decorative plated product 300 of this embodiment can be manufactured by the same method as the decorative plated product 100 of the first embodiment, except that the coating film 30 is formed on the surface of the resin molding 10 .
  • the resin molding 10 is prepared, and the coating film 30 and the catalytic activity hindering layer 80 are formed thereon in this order (Fig. 4(a)).
  • the paint film 30 is formed by applying paint having a piano black color tone to the surface of the resin molding 10 by a general-purpose method.
  • paint having a piano black color tone for example, a commercially available two-liquid acrylic urethane resin piano black paint may be used.
  • a laser beam is applied to a region (plating region 70B) of the surface 70a on which the catalytic activity hindering layer 80 is formed, where the plating film 20 is to be formed, to remove the catalytic activity hindering layer 80 (see FIG. 4B). ).
  • the coating film 30 is also removed together with the catalytic activity hindering layer 80 .
  • a part of the surface of the resin molding 10 may be removed to form the groove (recess) 70b.
  • an electroless plated film 21 is formed by the same method as in the first embodiment (FIG. 4(c)), followed by electrolytic plated films 22 to 24 (FIG. 4(d)).
  • the decorative plated product 300 is obtained by the method described above.
  • the decorative plated product 300 has the same effects as the decorative plated product 100 of the first embodiment. Moreover, by providing the coating film 30, the design of the resin molding 10, which is covered with the coating film 30 and cannot be seen, does not necessarily need to be high, and the selection of materials used for the resin molding 10 is widened. For example, it is possible to select a resin having a low coefficient of linear expansion as the material of the resin molded body 10 while maintaining a high design property by the coating film 30 . By selecting a resin with a low coefficient of linear expansion, the reliability of the decorative plated product 300 can be enhanced.
  • the decorative plated product shown in FIG. 5 was produced as the decorative plated product 100 shown in FIG.
  • a plated film pattern including a linear portion (linear plated film) is formed on a three-dimensional surface (curved surface).
  • the minimum line width 20d and the maximum line width of the linear portion of the plated film 20 were set to 0.3 mm and 0.5 mm, respectively.
  • the linear expansion coefficient of the polyamide 6 (unreinforced resin) containing no filler used in Example 2 described later is 80 ppm, whereas the linear expansion coefficient of the resin used in this example contains a filler. By doing so, the value was suppressed to a low value of 50 ppm.
  • the plated film 20 was formed on the resin molding 10 by the method described below.
  • a hyperbranched polymer represented by formula (1) was synthesized by the method disclosed in WO2018/131492.
  • R 0 is a vinyl group or an ethyl group.
  • a polymer solution having a polymer concentration of 0.5% by weight was prepared by dissolving the synthesized polymer represented by formula (1) in methyl ethyl ketone.
  • the substrate was immersed in the room temperature polymer solution for 5 seconds and then dried in an 80° C. dryer for 10 minutes.
  • a catalytic activity hindering layer 80 was formed on the surface 70a of the resin molded body 10.
  • the thickness of the catalytically active impeding layer 80 was 0.08 ⁇ m.
  • (b) Laser drawing A region (plating region 70B) where the plating film 20 is to be formed on the surface 70a of the resin molded body 10 was irradiated with a laser beam (laser drawing).
  • a laser beam laser drawing
  • the plating regions 70B were drawn in a lattice pattern at a pitch of 20 ⁇ m under laser drawing conditions of power 20%, speed 2000 mm/s, and frequency 80 kHz.
  • the plated region 70B irradiated with the laser light was roughened while the catalytic activity hindering layer 80 was removed.
  • the surface roughness Ra of the plated region 70B was measured with a Keyence laser microscope. Table 1 shows the measurement results.
  • the resin molding 10 was immersed for 5 minutes in an electroless nickel phosphorous plating solution (manufactured by Okuno Chemical Industry Co., Ltd., Top Nicolon RCH) adjusted to 70°C.
  • An electroless nickel-phosphorus plating film 21 grew on the laser-drawn portion (plating region 70B) on the resin molded body 10 .
  • Electroplating formation of finish plating film
  • Electrolytic copper plating film 22, electrolytic nickel plating film 23, and electrolytic trivalent chromium plating film 24 are further laminated in this order on the electroless nickel phosphorus plating film 21 by a general-purpose electrolytic plating method.
  • a plated film 20 having a structure was formed. Table 1 shows the thickness of each plating film.
  • the decorative plated product 100 of this example was obtained by the method described above.
  • a cross section of the decorative plated product 100 was observed with an SEM. As shown in FIG. 7, from the interface 11a between the plated film 20 and the resin molded body 10, toward the inside of the resin molded body 10, the resin material (filler mixed PA6) and the metal compound (nickel It was confirmed that a mixed layer 11 with phosphorus) 20P was formed. The thickness 11d of the mixed layer 11 was 5 ⁇ m. It is presumed that the plating film 20 of this embodiment exhibits high adhesion strength due to the formation of the mixed layer 11 .
  • the decorative plated product shown in FIG. 6 was produced as the decorative plated product 100 shown in FIG.
  • a plated film pattern including a linear portion (linear plated film) is formed on the plane of a plate-shaped base material.
  • the minimum width 20d and the maximum width of the linear portion (linear plated film) were set to 0.3 mm and 0.5 mm, respectively, as in the first embodiment.
  • the resin molded body 10 was molded using polyamide 6 (PA6) (manufactured by BASF, D3K) with a piano black tone that does not contain a filler, and the thicknesses of the electrolytic plating films 22 and 23 are shown in Table 1.
  • a decorative plated product 100 (see FIG. 1) was produced in the same manner as in Example 1, except for the following changes.
  • the surface roughness Ra of the non-plated region 70A and the surface roughness Ra of the plated region 70B were measured. Table 1 shows the results.
  • the resin molding contained polyamide 6 in the same manner as in Example 1, and was subjected to a swelling treatment as a pretreatment for plating. Therefore, also in this embodiment, as in the first embodiment, the mixed layer 11 of the resin material (PA6) and the metal compound (nickel phosphorus) 20P contained in the plating film 20 is formed. is presumed to exhibit high adhesion strength.
  • a decorative plated product 200 was produced in which a plurality of holes (recesses, non-through holes) 71 were formed in the plated region 70B of the substrate surface 70a in order to increase the adhesion strength of the plated film 20 (FIG. 3). (b)).
  • the formation of the plurality of holes 71 was performed under laser light irradiation conditions of power 20%, speed 1000 mm/s, and frequency 60 kHz.
  • Electroless Plating, Electroplating After immersing the substrate 70 in a 2N sodium hydroxide solution (50° C.) for 1 minute, the same electroless plating catalyst solution and electroless plating solution as used in Example 1 were applied. was used to form the electroless plated film 21 . The immersion time in the electroless plating solution was 8 minutes. Further, electroplated films 22 to 24 were formed on the electroless plated film 21 by the same method as in Example 1 to obtain a decorative plated product 200 of this example. Table 1 shows the thickness of each plating film.
  • the surface roughness Ra of the non-plated region 70A and the surface roughness Ra of the plated region 70B were measured. Table 1 shows the results. In this embodiment, since a plurality of holes 71 are formed, the surface roughness Ra of the plated region 70B is larger than that of the first embodiment. For this reason, the line width of the plating film was made narrower than in Example 1 so that the surface roughness Ra of the plating region 70B was not conspicuous (see Table 1).
  • Example 4 In this example, a decorative plated product 300 having a coating film 30 with a piano black tone was produced (see FIG. 4(d)).
  • base material 70 Polyamide 9T (PA9T) (manufactured by Otsuka Chemical Co., Ltd., NMA964B) containing potassium titanate as a filler is injection-molded using a general-purpose molding machine similar to that of Example 1, and a resin molded body 10 is obtained. got A commercially available acrylic urethane piano black paint was applied to the surface of the obtained resin molding 10 to form a coating film 30 having a thickness of 10 ⁇ m, thereby obtaining a substrate 70 .
  • the filler (potassium titanate) contained in the base material 70 had a diameter (fiber diameter) of 0.3 ⁇ m to 0.6 ⁇ m and a length (fiber length) of 10 ⁇ m to 20 ⁇ m.
  • Electroless plated film 21 and electrolytic plated films 22 to 24 were formed in the same manner as in Example 3 to obtain a decorative plated product 300 of this example.
  • Table 1 shows the thickness of each plating film. Further, the surface roughness Ra of the non-plating region 70A (coating film 30) and the surface roughness Ra of the plating region 70B were measured in the same manner as in Example 1. Table 1 shows the results.
  • the resin molded body 10 of this embodiment contains potassium titanate as a filler, and thus has a low coefficient of linear expansion.
  • the filler since the diameter of the filler is small (the filler is thin), the filler does not increase the surface roughness of the resin molded body 10 .
  • potassium titanate interacts with the plated film 20, the adhesion strength of the plated film 20 can be increased without increasing the surface roughness of the plated region 70B.
  • the resin molding 10 of this example does not have a glossy color tone like piano black.
  • the decorative plated product 300 of this embodiment by covering the non-plating region 70A of the resin molded product 10 with the piano black-tone paint film 30, the decorative plated product 300 has the advantages of the resin molded product 10 described above. Enhanced design.
  • Example 2 For comparison with Example 1, the same as the decorative plated product 100 of Example 1 except that the outermost layer 24 of the plating film 20 was replaced with an electrolytic hexavalent chromium plating film instead of an electrolytic trivalent chromium plating film.
  • a decorative plated product having the configuration of was produced.
  • a highly precise plated film pattern was formed as designed, and the plated film 20 also had gloss.
  • the piano black color tone of the plating region 70A could not be maintained.
  • the minimum acceptable number of cycles in the reliability evaluation result was 100 cycles in Example 2, but the reliability was at a level where there was no problem in practical use. That is, the decorative plated products produced in Examples 1 to 4 had sufficient reliability. Further, it was confirmed that in the decorative plated products of Examples 1 to 4, the smaller the coefficient of linear expansion of the resin molded body 10, the better the reliability evaluation result (the number of acceptable cycles is large).
  • the decorative plated product of the present invention has high designability and reliability.
  • the decorative plated product of the present invention can be applied, for example, to interior and exterior parts of automobiles.

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Abstract

Provided is a plated decorative article having a plating film pattern with high design quality and high definition. The plated decorative article comprises a substrate that includes a molded resin body made of a resin material and a plating film that forms, on a surface of the substrate, a given pattern including a linear part. On the surface of the substrate, the surface roughness Ra of a plated region in which the plating film is formed is greater than the surface roughness Ra of a non-plated region in which the plating film is not formed. The minimum value of the width of the linear part of the plating film is 0.1-5.0 mm.

Description

装飾メッキ品decorative plating
 本発明は、装飾メッキ品(意匠メッキ品)に関する。 The present invention relates to decorative plated products (design plated products).
 近年、自動車の内外装部品には、メッキを使用した意匠部品(装飾メッキ品)が多く採用されている。樹脂基材の一部に選択的に装飾メッキを施す手法としては、2色成形法が一般的である。2色成形法では、メッキ膜が形成されるメッキ部と、メッキ膜が形成されない非メッキ部とを、それぞれ別々の樹脂材料を用いて2色成形して樹脂基材を作製し、メッキ部のみにメッキ膜を形成する。例えば、非メッキ部にはポリカーボネート等からなるピアノブラックと呼ばれる色調を有する高意匠樹脂を用い、メッキ部にはメッキ前処理であるエッチングが可能なABS樹脂を用いる。これにより、ピアノブラックの素地にメッキ膜パターンが形成された装飾メッキ品が得られる。 In recent years, design parts using plating (decorative plating products) are often used for interior and exterior parts of automobiles. A two-color molding method is generally used as a technique for selectively applying decorative plating to a part of a resin base material. In the two-color molding method, the plated portion on which the plated film is formed and the non-plated portion on which the plated film is not formed are formed by two-color molding using different resin materials to prepare the resin base material, and only the plated portion is formed. A plating film is formed on the For example, the non-plated portion is made of a high-design resin called piano black, which is made of polycarbonate or the like, and the plated portion is made of an ABS resin that can be etched as a pretreatment for plating. As a result, a decorative plated product is obtained in which a plated film pattern is formed on the piano black substrate.
 また、特許文献1には、2色成形を用いずに、ピアノブラックのポリカーボネート基材に選択的にメッキ膜を形成する技術が開示されている。特許文献1では、基材に前処理インキ組成物をパターン状に塗布し、塗布したパターン通りにメッキ膜を選択的に形成する。前処理インキ組成物は、バインダとして機能するため、メッキ膜の密着強度が高まる。 In addition, Patent Document 1 discloses a technique for selectively forming a plating film on a piano black polycarbonate substrate without using two-color molding. In Patent Document 1, a pretreatment ink composition is applied in a pattern to a substrate, and a plated film is selectively formed according to the applied pattern. Since the pretreatment ink composition functions as a binder, the adhesion strength of the plated film increases.
特開2019-206640号公報JP 2019-206640 A
 しかし、2色成形法は金型が2種類必要であるため製造コストが高くなり、また、高精細なメッキ膜パターンは形成できなかった。また、特許文献1に開示される技術は、前処理インキ組成物をパターン状に塗布するためのマスキング工程等が必要となり、やはり、製造コストが高くなる。また、例えば、線幅が1mm以下の高精細なメッキ膜パターンの形成は困難だと予想される。 However, since the two-color molding method requires two types of molds, the manufacturing cost is high, and a high-definition plating film pattern cannot be formed. Moreover, the technique disclosed in Patent Document 1 requires a masking step or the like for applying the pretreatment ink composition in a pattern, which also increases the manufacturing cost. Moreover, it is expected that, for example, it will be difficult to form a high-definition plating film pattern with a line width of 1 mm or less.
 本発明は、これらの課題を解決するものであり、より簡易な製造工程を経て製造可能であり、意匠性の高い高精細なメッキ膜パターンを有する装飾メッキ品を提供する。 The present invention solves these problems, and provides a decorative plated product that can be manufactured through a simpler manufacturing process and has a high-definition plated film pattern with a high degree of design.
 本発明の態様に従えば、装飾メッキ品であって、樹脂材料から構成されている樹脂成形体を含む基材と、前記基材の表面において、線状部分を含む所定のパターンを形成するメッキ膜とを有し、前記基材の表面において、前記メッキ膜が形成されているメッキ領域の表面粗さRaは、前記メッキ膜が形成されていない非メッキ領域の表面粗さRaよりも大きく、前記メッキ膜の線状部分の線幅の最小値が、0.1mm~5mmである装飾メッキ品が提供される。 According to an aspect of the present invention, a decorative plated article, comprising: a substrate including a resin molded body made of a resin material; and plating forming a predetermined pattern including linear portions on the surface of the substrate. on the surface of the base material, the surface roughness Ra of the plated region where the plated film is formed is greater than the surface roughness Ra of the non-plated region where the plated film is not formed, A decorative plated product is provided in which the minimum line width of the linear portion of the plated film is 0.1 mm to 5 mm.
 前記樹脂成形体が単一の前記樹脂材料から構成されていてもよい。前記メッキ領域の表面粗さRaが0.5μm~8.0μmであり、前記非メッキ領域の表面粗さRaが0.5μm未満であってもよい。前記樹脂材料が、ポリアミド、又はポリカーボネートを含んでもよい。前記非メッキ領域の色調が、ピアノブラックであってもよい。 The resin molding may be composed of a single resin material. The plated region may have a surface roughness Ra of 0.5 μm to 8.0 μm, and the non-plated region may have a surface roughness Ra of less than 0.5 μm. The resin material may contain polyamide or polycarbonate. A color tone of the non-plating region may be piano black.
 前記樹脂材料がポリアミドを含み、前記メッキ膜と前記樹脂成形体との界面を含む、前記樹脂成形体の表面近傍に、前記樹脂材料と、前記メッキ膜に含まれる金属又は金属化合物との混合層が形成されており、前記混合層の厚さが、0.5μm以上であってもよい。また、前記基材の表面の前記メッキ領域に複数の孔が形成されていてもよい。また、前記基材が、前記樹脂成形体上に設けられた、ピアノブラックの色調を有する塗装膜を更に有し、前記基材の表面の前記非メッキ領域が、前記塗装膜で形成されていてもよい。 The resin material contains polyamide, and a mixed layer of the resin material and the metal or metal compound contained in the plating film is provided in the vicinity of the surface of the resin molding, including the interface between the plating film and the resin molding. is formed, and the mixed layer may have a thickness of 0.5 μm or more. Also, a plurality of holes may be formed in the plated region on the surface of the base material. Further, the base material further has a coating film having a piano black color tone provided on the resin molded body, and the non-plating region on the surface of the base material is formed of the coating film. good too.
 前記メッキ膜は複数の層から構成されており、最外層が、6価クロム、3価クロム、銅、及び金からなる群から選択される1つを含む電解メッキ膜であってもよい。前記最外層が、6価クロム、または3価クロムを含む電解メッキ膜であってもよい。前記最外層が、銅、または金を含む電解メッキ膜であってもよい。前記最外層が、3価クロムを含む電解メッキ膜であってもよい。 The plating film may be composed of a plurality of layers, and the outermost layer may be an electrolytic plating film containing one selected from the group consisting of hexavalent chromium, trivalent chromium, copper, and gold. The outermost layer may be an electrolytic plated film containing hexavalent chromium or trivalent chromium. The outermost layer may be an electrolytic plated film containing copper or gold. The outermost layer may be an electrolytic plated film containing trivalent chromium.
 本発明の装飾メッキ品は、意匠性の高い高精細なメッキ膜パターンを有する。 The decorative plated product of the present invention has a high-definition plated film pattern with a high degree of design.
図1は、第1実施形態の装飾メッキ品における、メッキ膜(線状部分)の周辺部の断面の模式図である。FIG. 1 is a schematic cross-sectional view of the peripheral portion of the plating film (linear portion) in the decorative plated product of the first embodiment. 図2(a)~(c)は、第1実施形態の装飾メッキ品の製造方法を説明する図であり、メッキ膜(線状部分)の周辺部の断面の模式図である。2(a) to 2(c) are diagrams for explaining the manufacturing method of the decorative plated product of the first embodiment, and are schematic cross-sectional views of the peripheral portion of the plated film (linear portion). 図3(a)及び(b)は、第2実施形態の装飾メッキ品の製造方法を説明する図であり、メッキ膜(線状部分)の周辺部の断面の模式図である。3(a) and 3(b) are diagrams for explaining the method of manufacturing the decorative plated product of the second embodiment, and are schematic cross-sectional views of the peripheral portion of the plated film (linear portion). 図4(a)~(d)は、第3実施形態の装飾メッキ品の製造方法を説明する図であり、メッキ膜(線状部分)の周辺部の断面の模式図である。FIGS. 4A to 4D are diagrams for explaining the method of manufacturing the decorative plated product according to the third embodiment, and are schematic cross-sectional views of the peripheral portion of the plating film (linear portion). 図5は、実施例1で製造した装飾メッキ品の写真である。5 is a photograph of the decorative plated product manufactured in Example 1. FIG. 図6は、実施例2で製造した装飾メッキ品の写真である。6 is a photograph of the decorative plated product manufactured in Example 2. FIG. 図7は、実施例1で製造した装飾メッキ品の断面SEM写真である。7 is a cross-sectional SEM photograph of the decorative plated product manufactured in Example 1. FIG.
[第1実施形態]
<装飾メッキ品>
 図1に示す装飾メッキ品(意匠メッキ品)100について説明する。装飾メッキ品100は、樹脂材料から構成されている樹脂成形体10を含む基材70と、基材70の表面70aに形成されているメッキ膜20とを有する。メッキ膜20は、線状部分を含む所定のパターンを形成している。装飾メッキ品100において、メッキ膜20は、基材70の複数の面に亘って、又は球面等を含む立体形状の面に沿って、立体的に形成されていてもよい。
[First embodiment]
<Decorative plating>
A decorative plated product (design plated product) 100 shown in FIG. 1 will be described. A decorative plated product 100 has a base material 70 including a resin molded body 10 made of a resin material, and a plated film 20 formed on a surface 70 a of the base material 70 . The plated film 20 forms a predetermined pattern including linear portions. In the decorative plated product 100, the plated film 20 may be three-dimensionally formed over a plurality of surfaces of the substrate 70 or along a three-dimensional surface including a spherical surface.
 樹脂成形体10を構成する樹脂材料は、樹脂を含む。樹脂材料に含まれる樹脂は特に限定されず、例えば、熱可塑性樹脂、熱硬化性樹脂、紫外線硬化性樹脂を用いることができる。熱可塑性樹脂としては、例えば、ナイロン6(PA6)、ナイロン66(PA66)、ナイロン11(PA11)、ナイロン12(PA12)、6Tナイロン(6TPA)、9Tナイロン(9TPA)、10Tナイロン(10TPA)、12Tナイロン(12TPA)、MXD6ナイロン(MXDPA)等のポリアミド及びこれらのアロイ材料、ポリカーボネート(PC)、ポリフェニレンサルファイド(PPS)、液晶ポリマー(LCP)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルイミド(PEI)、ポリフェニルスルホン(PPSU)等を用いることができる。熱硬化性樹脂としては、例えば、エポキシ樹脂、シリコーン樹脂、ポリイミド樹脂等を用いることができる。光硬化性樹脂としては、例えば、ポリイミド樹脂、エポキシ樹脂等を用いることができる。これらの樹脂は、それぞれ単独で用いてもよいし、2種類以上を混合して用いてもよい。 The resin material constituting the resin molded body 10 contains resin. The resin contained in the resin material is not particularly limited, and for example, thermoplastic resin, thermosetting resin, and ultraviolet curable resin can be used. Examples of thermoplastic resins include nylon 6 (PA6), nylon 66 (PA66), nylon 11 (PA11), nylon 12 (PA12), 6T nylon (6TPA), 9T nylon (9TPA), 10T nylon (10TPA), Polyamides such as 12T nylon (12TPA), MXD6 nylon (MXDPA) and their alloy materials, polycarbonate (PC), polyphenylene sulfide (PPS), liquid crystal polymer (LCP), polyetheretherketone (PEEK), polyetherimide (PEI ), polyphenylsulfone (PPSU) and the like can be used. As the thermosetting resin, for example, epoxy resin, silicone resin, polyimide resin, or the like can be used. As the photocurable resin, for example, polyimide resin, epoxy resin, or the like can be used. These resins may be used alone or in combination of two or more.
 上述した樹脂の中でも、ナイロン、ポリカーボネートが好ましい。ナイロン又はポリカーボネートを用いることで、装飾的に優れるピアノブラックの色調を有する基材70を得ることが容易になる。ナイロン又はポリカーボネートと、着色剤等を含むピアノブラック成形体用の樹脂材料も市販されている。 Among the resins mentioned above, nylon and polycarbonate are preferable. By using nylon or polycarbonate, it becomes easy to obtain the base material 70 having a piano black color tone which is excellent in decoration. Resin materials for piano black moldings containing nylon or polycarbonate, colorants, etc. are also commercially available.
 樹脂成形体10を構成する樹脂材料は、上述の樹脂のみで構成されていてもよいし、後述するフィラー、着色剤、その他の汎用の添加剤を含んでもよい。樹脂成形体10(樹脂材料)中の樹脂の配合量は、例えば、20~100重量%、又は50~100重量%であってよい。 The resin material that constitutes the resin molded body 10 may be composed only of the resins described above, or may contain fillers, colorants, and other general-purpose additives, which will be described later. The amount of resin in the resin molded body 10 (resin material) may be, for example, 20 to 100% by weight, or 50 to 100% by weight.
 樹脂成形体10の強度、線膨張係数等を改善するために、樹脂材料は、ガラス繊維、チタン酸カルシウム、チタン酸カリウム等のフィラーを含んでもよい。中でも、チタン酸カリウムが好ましい。チタン酸カリウムは、樹脂成形体10の線膨張係数を低下させると共に、メッキ膜20と相互作用してメッキ膜20の密着強度を高める。樹脂成形体10の線膨張係数を低下させることで、装飾メッキ品100の信頼性を高められる。また、チタン酸カリウムを含むことで、メッキ膜20の密着強度を高めるために、メッキ膜20が形成される基材70の表面領域(後述するメッキ領域70B)を大きく粗化する必要が無くなる。これにより、メッキ膜20の光沢をより高められる。 In order to improve the strength, linear expansion coefficient, etc. of the resin molded body 10, the resin material may contain a filler such as glass fiber, calcium titanate, potassium titanate, or the like. Among them, potassium titanate is preferable. Potassium titanate lowers the coefficient of linear expansion of the resin molding 10 and interacts with the plated film 20 to increase the adhesion strength of the plated film 20 . By reducing the coefficient of linear expansion of the resin molding 10, the reliability of the decorative plated product 100 can be enhanced. Further, by including potassium titanate, it is not necessary to greatly roughen the surface region (plating region 70B described later) of the base material 70 on which the plating film 20 is formed in order to increase the adhesion strength of the plating film 20. Thereby, the glossiness of the plated film 20 can be further enhanced.
 樹脂成形体10に含まれるフィラーは、装飾メッキ品100の外観に悪影響を与えないように、径の小さい棒状、針状又は、繊維状のフィラーであることが好ましい。フィラーの径(繊維径)は、例えば、0.3μm~0.6μmであってよく、フィラーの長さ(繊維長)は、例えば、10μm~20μmであってよい。 The filler contained in the resin molding 10 is preferably a rod-shaped, needle-shaped, or fibrous filler with a small diameter so as not to adversely affect the appearance of the decorative plated product 100 . The filler diameter (fiber diameter) may be, for example, 0.3 μm to 0.6 μm, and the filler length (fiber length) may be, for example, 10 μm to 20 μm.
 基材70の樹脂成形体10は、単一の樹脂材料から構成されていることが好ましい。樹脂成形体10は、単一の樹脂材料の一色成形体(単色成形体)であってよい。したがって、本実施形態の樹脂成形体10は、2種類の樹脂材料から構成される2色成形体とは異なる。本実施形態の樹脂成形体10は、メッキ部と、非メッキ部とは、同じ樹脂材料(同じ組成の樹脂材料)で形成されている。一色成形で成形できる本実施形態の樹脂成形体10(一色成形体)は、2色成形体と比較して製造コストを抑えられる。尚、ここで、「単一の樹脂材料から構成されている」とは、樹脂成形体10が一種類の樹脂のみから構成されているという意味ではない。上述のように、樹脂材料は、樹脂のみから構成されてもよいし、樹脂以外に必要に応じてフィラー、着色剤、添加剤等を含んでよい。 The resin molding 10 of the base material 70 is preferably made of a single resin material. The resin molded body 10 may be a one-color molded body (single-color molded body) made of a single resin material. Therefore, the resin molded body 10 of this embodiment is different from a two-color molded body composed of two kinds of resin materials. In the resin molding 10 of the present embodiment, the plated portion and the non-plated portion are made of the same resin material (resin material having the same composition). The resin molded article 10 (single-color molded article) of the present embodiment, which can be molded by one-color molding, can reduce manufacturing costs compared to two-color molded articles. Here, "made of a single resin material" does not mean that the resin molded body 10 is made of only one type of resin. As described above, the resin material may be composed only of resin, or may contain fillers, colorants, additives, etc. in addition to resin, if necessary.
 図1に示すように、基材70の表面70aは、メッキ膜20が形成されていない非メッキ領域70Aと、メッキ膜20が形成されているメッキ領域70Bとが存在する。非メッキ領域70Aの色調は、所謂、ピアノブラックと呼ばれる光沢のある黒色(漆黒)であることが好ましい。これにより、ピアノブラックの素地に細線のメッキ膜パターンが形成された意匠性の高い装飾メッキ品100が得られる。ピアノブラックは、光沢度と、L表色系による色調評価によって定義してもよい。例えば、ピアノブラックは、好ましくは、60度鏡面光沢度が90以上、且つ、L表色系において、Lが8以下、aが-0.5~0、bが-1.5~0であり、より好ましくは、60度鏡面光沢度が90以上、且つL表色系において、Lが1以下、aが-0.2~0、bが-1~0である。 As shown in FIG. 1, the surface 70a of the substrate 70 has a non-plating area 70A where the plating film 20 is not formed and a plating area 70B where the plating film 20 is formed. The color tone of the non-plating region 70A is preferably a glossy black (jet black) called piano black. As a result, the decorative plated product 100 having a fine wire plating film pattern formed on the piano black substrate and having a high design property can be obtained. Piano black may be defined by glossiness and color tone evaluation based on the L * a * b * color system. For example, piano black preferably has a 60-degree specular gloss of 90 or more, and in the L * a * b * color system, L * is 8 or less, a * is −0.5 to 0, and b * is −1.5 to 0, more preferably 60-degree specular glossiness of 90 or more, and in the L * a * b * color system, L * is 1 or less, a * is −0.2 to 0, b * is from -1 to 0.
 メッキ領域70Bの表面粗さRaは、非メッキ領域70Aの表面粗さRaよりも大きい方が好ましい。メッキ領域70Bの表面粗さRaを大きくすることで、その上に形成されるメッキ膜20の密着強度が高まる。また、非メッキ領域70Aの表面粗さRaを小さくすることで、例えば、非メッキ領域70Aの色調がピアノブラックである場合に、その光沢をより高めることができる。図1に示すように、メッキ領域70Bには溝(凹部)70bが形成されていてもよい。溝(凹部)70bは、基材表面70a上において、メッキパターンに沿って延在している。 The surface roughness Ra of the plated region 70B is preferably larger than the surface roughness Ra of the non-plated region 70A. By increasing the surface roughness Ra of the plated region 70B, the adhesion strength of the plated film 20 formed thereon is increased. Further, by reducing the surface roughness Ra of the non-plating region 70A, for example, when the color tone of the non-plating region 70A is piano black, the gloss can be further enhanced. As shown in FIG. 1, a groove (recess) 70b may be formed in the plating region 70B. The groove (recess) 70b extends along the plating pattern on the substrate surface 70a.
 メッキ領域70Bの表面粗さRaは、例えば、0.5μm~8.0μm、又は0.5μm~3.0μmが好ましい。メッキ領域70Bの表面粗さRaが上記範囲の下限値以上であれば、メッキ膜20の十分な密着強度が得られ、上記範囲の上限値以下であれば、この上に形成されるメッキ膜20の光沢の低下を抑制できる。非メッキ領域70Aの表面粗さRaは、例えば、0.5μm未満が好ましい。非メッキ領域70Aの表面粗さRaが上記範囲内であれば、非メッキ領域70Aの光沢が高まる。 The surface roughness Ra of the plated region 70B is preferably 0.5 μm to 8.0 μm, or 0.5 μm to 3.0 μm, for example. If the surface roughness Ra of the plating region 70B is equal to or greater than the lower limit value of the above range, sufficient adhesion strength of the plating film 20 can be obtained. decrease in gloss can be suppressed. The surface roughness Ra of the non-plating region 70A is preferably less than 0.5 μm, for example. If the surface roughness Ra of the non-plating area 70A is within the above range, the gloss of the non-plating area 70A is enhanced.
 メッキ膜20は、複数層から構成されてよい。メッキ膜20は、基材70上に形成される無電解メッキ膜(下地メッキ膜)21と、無電解メッキ膜21上に形成される複数の電解メッキ膜22~24を含んでよい。無電解メッキ膜21は、特に限定されないが、例えば、無電解ニッケルリンメッキ膜、無電解銅メッキ膜であってよく、中でも、無電解ニッケルリンメッキ膜が好ましい。メッキ膜20の中間層である電解メッキ膜22及び23は、特に限定されないが、例えば、電解銅メッキ膜、電解ニッケルメッキ膜であってよい。
また、メッキ膜20の最外層(最表面の層)である電解メッキ膜24は、例えば、6価クロム、3価クロム、銅、又は金を含むことが好ましい。6価クロム、3価クロム、銅、又は金を含む電解メッキ膜を最外層とすることでメッキ膜20の光沢が増し、装飾メッキ品100の意匠性がより高まる。また、樹脂成形体10がピアノブラックの色調を有する場合、メッキ膜20の最外層24は、6価クロムを除いた、3価クロム、銅、又は金を含む電解メッキ膜であることが好ましく、3価クロムを含む電解メッキ膜であることがより好ましい。6価クロム電解メッキ液は、樹脂成形体10の表面を侵食して白濁させ、非メッキ領域70Aのピアノブラックの色調を維持できない虞がある。これに対して、3価クロム電解メッキ液は、同じクロム系メッキ液であるにも関わらず、樹脂成形体10のピアノブラックの色調に影響を与えない。このため、3価クロムを含む電解メッキ膜を最外層とすることで、非メッキ領域70Aの光沢あるピアノブラックの色調を維持しつつ、メッキ膜20の光沢を高められる。
The plated film 20 may be composed of multiple layers. The plated film 20 may include an electroless plated film (base plated film) 21 formed on the base material 70 and a plurality of electrolytic plated films 22 to 24 formed on the electroless plated film 21 . Although the electroless plated film 21 is not particularly limited, it may be, for example, an electroless nickel phosphorus plated film or an electroless copper plated film. Among them, the electroless nickel phosphorus plated film is preferable. The electrolytic plated films 22 and 23, which are intermediate layers of the plated film 20, are not particularly limited, but may be, for example, an electrolytic copper plated film or an electrolytic nickel plated film.
The electrolytic plated film 24, which is the outermost layer (outermost layer) of the plated film 20, preferably contains, for example, hexavalent chromium, trivalent chromium, copper, or gold. By using an electrolytic plated film containing hexavalent chromium, trivalent chromium, copper, or gold as the outermost layer, the gloss of the plated film 20 is increased, and the design of the decorative plated product 100 is further enhanced. Further, when the resin molding 10 has a piano black color tone, the outermost layer 24 of the plating film 20 is preferably an electrolytic plating film containing trivalent chromium, copper, or gold, excluding hexavalent chromium. An electrolytic plated film containing trivalent chromium is more preferable. The hexavalent chromium electroplating solution may erode the surface of the resin molded body 10 to make it cloudy, making it impossible to maintain the piano black color tone of the non-plating region 70A. On the other hand, the trivalent chromium electrolytic plating solution does not affect the piano black color tone of the resin molding 10, although it is the same chromium-based plating solution. Therefore, by forming the electrolytic plated film containing trivalent chromium as the outermost layer, the luster of the plated film 20 can be enhanced while maintaining the glossy piano black color tone of the non-plated region 70A.
 メッキ膜20の厚さは特に限定されず、装飾メッキ品100の用途、樹脂成形体10の樹脂材料の種類、メッキ膜20の種類及び/又は構成等に基づいて、適宜、設計してよい。例えば、メッキ膜20の厚さ(メッキ膜20が複数層から構成される場合は、複数層の合計厚さ)は、3μm~60μm又は、5μm~40μmであってよい。また、本実施形態において、メッキ膜20を構成する各メッキ膜の厚さは、例えば、以下の範囲としてよい。無電解メッキ膜21(下地メッキ膜):0.2μm~3μm、電解メッキ膜22(例えば、電解銅メッキ膜):3μm~30μm、電解メッキ膜23(例えば、電解ニッケルメッキ膜):2μm~20μm、電解メッキ膜24(最外層):0.02μm~1μm。尚、本実施形態において、電解メッキ膜22(例えば、電解銅メッキ膜)、電解メッキ膜23(例えば、電解ニッケルメッキ膜)は両方が必須ではなく、どちらか一方だけでもよい。 The thickness of the plated film 20 is not particularly limited, and may be appropriately designed based on the application of the decorative plated product 100, the type of resin material of the resin molding 10, the type and/or configuration of the plated film 20, and the like. For example, the thickness of the plating film 20 (when the plating film 20 is composed of multiple layers, the total thickness of the multiple layers) may be 3 μm to 60 μm or 5 μm to 40 μm. Further, in the present embodiment, the thickness of each plated film forming the plated film 20 may be, for example, within the following range. Electroless plating film 21 (base plating film): 0.2 μm to 3 μm, electrolytic plating film 22 (eg, electrolytic copper plating film): 3 μm to 30 μm, electrolytic plating film 23 (eg, electrolytic nickel plating film): 2 μm to 20 μm , electrolytic plating film 24 (outermost layer): 0.02 μm to 1 μm. In this embodiment, both of the electrolytic plated film 22 (for example, electrolytic copper plated film) and the electrolytic plated film 23 (for example, electrolytic nickel plated film) are not essential, and only one of them may be used.
 メッキ膜20は、細い(幅の狭い)線状の部分(線状部分)を有する。細い線状のメッキ膜20によって、意匠性の高い高精細なメッキ膜パターンを形成できる。メッキ膜20の線状部分の線幅の最小値(最小線幅)20dは、0.1mm~20mm、0.1mm~5mm、0.2mm~5mm、又は0.2mm~1mmが好ましい。本実施形態では、後述するようにレーザー描画を用いて樹脂成形体10上にメッキ膜20を形成する。このように、本実施形態では、従来の2色成形方法や処理インキ組成物の塗布を用いた方法では実現できなかった、意匠性の高い高精細なメッキ膜パターンを、レーザー描画というより簡易な工程を用いて実現できる。 The plated film 20 has thin (narrow width) linear portions (linear portions). The thin line-shaped plating film 20 can form a high-definition plating film pattern with a high degree of design. The minimum line width (minimum line width) 20d of the linear portion of the plating film 20 is preferably 0.1 mm to 20 mm, 0.1 mm to 5 mm, 0.2 mm to 5 mm, or 0.2 mm to 1 mm. In the present embodiment, the plating film 20 is formed on the resin molding 10 using laser drawing, as will be described later. As described above, in the present embodiment, a high-definition plating film pattern with a high degree of design, which could not be realized by a conventional two-color molding method or a method using the application of a treatment ink composition, can be achieved by a simple method rather than laser drawing. It can be realized using a process.
 尚、本実施形態のメッキ膜が形成する所定のパターンは、細い(幅の狭い)線状部分(線状のメッキ膜)を有していれば特に限定されない。線状部分のみで形成されたパターンであってもよいし、線状部分と形状部分(多角形、円形、扇形、文字(アルファベット)等)とを組み合わせたパターンであってもよい。また、線状部分は、直線であってもよいし、曲線であってもよい。 The predetermined pattern formed by the plated film of the present embodiment is not particularly limited as long as it has a thin (narrow width) linear portion (linear plated film). It may be a pattern formed only of linear portions, or a pattern in which linear portions and shape portions (polygons, circles, sectors, characters (alphabet), etc.) are combined. Also, the linear portion may be a straight line or a curved line.
 メッキ膜20が形成されている樹脂成形体10の表面近傍に、樹脂成形体10を構成する樹脂材料と、メッキ膜20に含まれる金属又は金属化合物20Pとの混合層11が形成されていてもよい。混合層11は、メッキ膜20と樹脂成形体10との界面11aから、樹脂成形体10の内部に向かって形成される。金属又は金属化合物20Pは、無電解メッキ膜21と同一組成の金属又は金属化合物であってよい。詳細は後述するが、金属又は金属化合物20Pは、無電解メッキ膜21と同時に、無電解メッキ反応により生成する。金属又は金属化合物20Pは一部が連結して無電解メッキ膜21に連結していてもよい。即ち、金属又は金属化合物20Pは無電解メッキ膜21の一部であり、無電解メッキ膜21が樹脂成形体10の内部(表面近傍)から成長しているとも解釈できる。混合層11を有することで、メッキ膜20の基材70への密着強度がより高まる。また、樹脂成形体10が、例えばポリアミドを含む場合、基材70は無電解メッキ液を浸透し易くなるため、混合層11が形成され易い。混合層11の厚さ11dは、例えば、0.5μm以上、又は0.5μm~10μmが好ましい。厚さ11dが上記範囲の下限値より薄いと、メッキ膜20との高い密着強度を得られない虞があり、上記範囲の上限値より厚いと、樹脂成形体10が脆性破壊する虞があり、この場合も、メッキ膜20との高い密着強度が得られない。 Even if the mixed layer 11 of the resin material constituting the resin molded body 10 and the metal or metal compound 20P contained in the plated film 20 is formed in the vicinity of the surface of the resin molded body 10 on which the plated film 20 is formed. good. The mixed layer 11 is formed from the interface 11a between the plating film 20 and the resin molded body 10 toward the interior of the resin molded body 10 . The metal or metal compound 20</b>P may be a metal or metal compound having the same composition as the electroless plated film 21 . Although the details will be described later, the metal or metal compound 20P is generated simultaneously with the electroless plating film 21 by an electroless plating reaction. A part of the metal or metal compound 20P may be connected to the electroless plated film 21 . That is, the metal or metal compound 20P is part of the electroless plated film 21, and it can be interpreted that the electroless plated film 21 grows from the inside (near the surface) of the resin molding 10. FIG. By having the mixed layer 11, the adhesion strength of the plated film 20 to the base material 70 is further increased. Further, when the resin molding 10 contains, for example, polyamide, the base material 70 is easily permeated with the electroless plating solution, so that the mixed layer 11 is easily formed. The thickness 11d of the mixed layer 11 is preferably, for example, 0.5 μm or more, or 0.5 μm to 10 μm. If the thickness 11d is less than the lower limit of the above range, there is a risk that a high adhesion strength with the plated film 20 cannot be obtained. Also in this case, high adhesion strength with the plating film 20 cannot be obtained.
 また、装飾メッキ品100は、樹脂成形体10(基材70)の非メッキ領域70A上に形成された触媒活性妨害層80を更に有してもよい。触媒活性妨害層80を有することで、非メッキ領域70A上でのメッキ膜の生成をより確実に抑制できる。この結果、表面70aにおいてメッキ膜20の有無のコントラストをより明確にでき、装飾メッキ品100の意匠性がより高まる。触媒活性妨害層80を構成する材料等については後述する。触媒活性妨害層80の厚さは、装飾メッキ品100の外観に影響を与えないように、例えば、0.2μm以下、又は0.1μm以下が好ましい。 In addition, the decorative plated product 100 may further have a catalytic activity hindrance layer 80 formed on the non-plating region 70A of the resin molded body 10 (base material 70). By having the catalytic activity hindering layer 80, it is possible to more reliably suppress the formation of a plating film on the non-plating region 70A. As a result, the contrast between the presence or absence of the plating film 20 on the surface 70a can be made clearer, and the design of the decorative plated product 100 is further enhanced. Materials and the like that constitute the catalytic activity hindrance layer 80 will be described later. The thickness of the catalytic activity impeding layer 80 is preferably, for example, 0.2 μm or less, or 0.1 μm or less so as not to affect the appearance of the decorative plated product 100 .
<装飾メッキ品の製造方法>
 本実施形態の装飾メッキ品100の製造方法について以下に説明する。
(1)基材70の用意
 まず、基材70として樹脂成形体10を用意する。樹脂成形体10は市販品でもよいし、樹脂材料を成形して得てもよい。基材70は、メッキ部と、非メッキ部とが同じ樹脂材料から構成されている(単一の樹脂材料から構成されている)。このため、基材70は一色成形(単色成形)で製造でき、2色成形を用いる場合と比較して、製造コストを抑えられる。
<Manufacturing method of decorative plated product>
A method for manufacturing the decorative plated product 100 of this embodiment will be described below.
(1) Preparation of base material 70 First, the resin molding 10 is prepared as the base material 70 . The resin molding 10 may be a commercially available product, or may be obtained by molding a resin material. In the base material 70, the plated portion and the non-plated portion are made of the same resin material (made of a single resin material). Therefore, the base material 70 can be manufactured by one-color molding (single-color molding), and the manufacturing cost can be suppressed as compared with the case of using two-color molding.
 基材70(樹脂成形体10)の表面70aの色調は、ピアノブラックであることが好ましい。例えば、市販されているピアノブラック成形体用の樹脂材料を用いて樹脂成形体10を成形してもよい。また、高い光沢を得られるように、表面70aの表面粗さRaは、0.5μm未満が好ましい。 The color tone of the surface 70a of the base material 70 (resin molding 10) is preferably piano black. For example, the resin molded body 10 may be molded using a commercially available resin material for piano black molded bodies. Moreover, the surface roughness Ra of the surface 70a is preferably less than 0.5 μm so as to obtain high gloss.
(2)メッキ膜20の形成
 次に、樹脂成形体10に、複数層から構成されるメッキ膜20を形成する。まず、樹脂成形体10上に下地メッキ膜として、無電解メッキ膜21を形成する。無電解メッキ膜21を形成する方法は、特に限定されず、汎用の方法を用いることができる。本実施形態では、図2(a)~(c)に示すように、例えば、国際公開第2018/131492号に開示されている以下に説明する方法により無電解メッキ膜21を形成する。
(2) Formation of Plated Film 20 Next, the plated film 20 composed of a plurality of layers is formed on the resin molding 10 . First, an electroless plated film 21 is formed as a base plated film on the resin molding 10 . A method for forming the electroless plated film 21 is not particularly limited, and a general-purpose method can be used. In this embodiment, as shown in FIGS. 2(a) to 2(c), the electroless plated film 21 is formed by the method disclosed in International Publication No. 2018/131492 and described below, for example.
 まず、基材70(樹脂成形体10)の表面70aに、触媒活性妨害層80を形成する(図2(a)参照)。触媒活性妨害層80は、無電解メッキ触媒の触媒活性を妨げる(妨害する)触媒活性妨害剤(触媒失活剤)を含む。触媒活性妨害剤(触媒失活剤)は、特に限定されないが、例えば、国際公開第2018/131492号に開示されているデンドリマー、ハイパーブランチポリマー等のデンドリティックポリマーが好ましい。これらは、触媒失活能力に優れ、また、ポリマーであるので、バインダ樹脂を用いずに、触媒活性妨害層80を形成できる。 First, a catalytic activity hindering layer 80 is formed on the surface 70a of the base material 70 (resin molding 10) (see FIG. 2(a)). The catalytic activity hindering layer 80 contains a catalytic activity hindering agent (catalyst deactivator) that hinders (obstructs) the catalytic activity of the electroless plating catalyst. The catalyst activity inhibitor (catalyst deactivator) is not particularly limited, but is preferably, for example, a dendrimer, hyperbranched polymer, or other dendritic polymer disclosed in WO2018/131492. Since these materials are excellent in catalyst deactivation ability and are polymers, the catalyst activity hindering layer 80 can be formed without using a binder resin.
 次に、触媒活性妨害層80が形成された表面70aのメッキ膜20が形成される予定の領域(メッキ領域70B)にレーザー光を照射して、触媒活性妨害層80を除去する(図2(b)参照)。レーザー光照射に用いるレーザー光の種類、レーザー加工装置は特に限定されず、樹脂成形体10の種類等を考慮し、適宜選択できる。メッキ領域70Bは、レーザー光が照射され触媒活性妨害層80が除去されると共に粗化される。レーザー光照射後のメッキ領域70Bの表面粗さRaは、非メッキ領域70Aの表面粗さRa(即ち、基材70の表面70aの表面粗さRa)より大きい。レーザー光照射後のメッキ領域70Bの表面粗さRaは、例えば、0.5μm~8.0μm、又は0.5μm~3.0μmが好ましい。これにより、上に形成されるメッキ膜20の十分な密着強度が得られ、且つメッキ膜20の光沢の低下を抑制できる。尚、レーザー光を照射したメッキ領域70Bでは、触媒活性妨害層80と共に樹脂成形体10の表面70aの一部が除去されて、溝(凹部)70bが形成されてもよい。 Next, a region of the surface 70a on which the catalytic activity hindering layer 80 is formed, where the plating film 20 is to be formed (plating region 70B), is irradiated with a laser beam to remove the catalytic activity hindering layer 80 (FIG. 2 ( b) see). The type of laser beam used for laser beam irradiation and the laser processing apparatus are not particularly limited, and can be appropriately selected in consideration of the type of the resin molded body 10 and the like. The plated region 70B is irradiated with a laser beam to remove the catalytic activity hindering layer 80 and roughen the plated region 70B. The surface roughness Ra of the plated region 70B after laser beam irradiation is larger than the surface roughness Ra of the non-plated region 70A (that is, the surface roughness Ra of the surface 70a of the substrate 70). The surface roughness Ra of the plating region 70B after laser light irradiation is preferably 0.5 μm to 8.0 μm, or 0.5 μm to 3.0 μm, for example. As a result, sufficient adhesion strength of the plated film 20 formed thereon can be obtained, and reduction in gloss of the plated film 20 can be suppressed. In the plated region 70B irradiated with the laser beam, a groove (recess) 70b may be formed by removing part of the surface 70a of the resin molding 10 together with the catalytic activity hindering layer 80. FIG.
 次に、レーザー光を照射したメッキ領域70Bに無電解メッキ触媒を付与し、そして、無電解メッキ液を接触させる。触媒活性妨害層80は、その上に付与される無電解メッキ触媒の触媒活性を妨げる(妨害する)。このため、非メッキ領域70Aの触媒活性妨害層80上では、無電解メッキ膜の生成が抑制される。一方、メッキ領域70Bは、触媒活性妨害層80が除去されているため、無電解メッキ膜21が生成する(図2(c)参照)。 Next, an electroless plating catalyst is applied to the plated region 70B irradiated with the laser beam, and then brought into contact with an electroless plating solution. The catalytic activity impeding layer 80 impedes (prevents) the catalytic activity of the electroless plating catalyst applied thereon. Therefore, formation of an electroless plating film is suppressed on the catalytic activity hindering layer 80 in the non-plating region 70A. On the other hand, since the catalytic activity hindering layer 80 is removed from the plated region 70B, the electroless plated film 21 is formed (see FIG. 2(c)).
 無電解メッキ触媒は、特に限定されず、汎用のものを適宜選択して用いることができる。例えば、塩化パラジウム等の金属塩を含むメッキ触媒液を用いてもよい。また、無電解メッキ液は、特に限定されず、汎用のものを適宜選択して用いることができる。例えば、無電解ニッケルリンメッキ液、無電解銅メッキ液であってよく、中でも、無電解ニッケルリンメッキ液が好ましい。 The electroless plating catalyst is not particularly limited, and a general-purpose one can be appropriately selected and used. For example, a plating catalyst solution containing a metal salt such as palladium chloride may be used. Moreover, the electroless plating solution is not particularly limited, and a general-purpose one can be appropriately selected and used. For example, it may be an electroless nickel phosphorous plating solution or an electroless copper plating solution, and among them, an electroless nickel phosphorous plating solution is preferable.
 無電解メッキ膜21の形成と同時に、メッキ膜20が形成されている樹脂成形体10の表面近傍に、樹脂成形体10を構成する樹脂材料と、メッキ膜20に含まれる金属又は金属化合物20Pとの混合層11が形成されてもよい。混合層11は、無電解メッキ液が樹脂成形体10に浸透し、樹脂成形体10の内部から無電解メッキ膜21が成長することにより生じる。混合層11が形成されることで、メッキ膜20の基材70への密着強度が高まる。 Simultaneously with the formation of the electroless plating film 21, the resin material constituting the resin molding 10 and the metal or metal compound 20P contained in the plating film 20 are placed in the vicinity of the surface of the resin molding 10 on which the plating film 20 is formed. A mixed layer 11 of may be formed. The mixed layer 11 is formed by permeation of the electroless plating solution into the resin molding 10 and growth of the electroless plating film 21 from the inside of the resin molding 10 . By forming the mixed layer 11, the adhesion strength of the plated film 20 to the substrate 70 is increased.
 混合層11を形成し易くするために、樹脂成形体10はポリアミドを含んでもよい。ポリアミドを含むことで、無電解メッキ時に無電解メッキ液が基材の内部に浸透し易くなる。また、無電解メッキの前処理として、樹脂成形体10の表面に水(湯)や有機溶媒等を接触させる膨潤処理を行ってもよい。樹脂成形体10が膨潤することで、無電解メッキ液がより浸透し易くなり、混合層11がより形成され易くなる。 In order to facilitate formation of the mixed layer 11, the resin molding 10 may contain polyamide. Containing polyamide facilitates penetration of the electroless plating solution into the base during electroless plating. As a pretreatment for electroless plating, a swelling treatment may be performed in which the surface of the resin molding 10 is brought into contact with water (hot water), an organic solvent, or the like. Swelling of the resin molding 10 makes it easier for the electroless plating solution to permeate and the mixed layer 11 to be formed more easily.
 無電解メッキ膜21上に、電解メッキ膜22~24を汎用の電解メッキ法により形成して、図1に示す装飾メッキ品100が得られる。 Electroplated films 22 to 24 are formed on the electroless plated film 21 by a general-purpose electrolytic plating method to obtain the decorative plated product 100 shown in FIG.
 以上説明した装飾メッキ品100は、従来の2色成形方法や処理インキ組成物の塗布(印刷)を用いた方法では実現できなかった、意匠性の高い高精細なメッキ膜パターンを、レーザー描画というより簡易な工程を用いて形成できる。例えば、光沢あるピアノブラックの素地に細線のメッキ膜パターンが形成された意匠性の高い装飾メッキ品100が得られる。また、非メッキ領域70Aの表面粗さRaと、メッキ領域70Bの表面粗さRaとを適当な範囲に調整することで、メッキ膜20の密着強度を維持しつつ、非メッキ領域70Aの光沢、及びメッキ膜20の光沢を高められる。 In the decorative plated product 100 described above, a high-definition plated film pattern with a high degree of design, which could not be realized by a conventional two-color molding method or a method using application (printing) of a treatment ink composition, is called laser drawing. It can be formed using a simpler process. For example, a decorative plated product 100 having a fine-line plating film pattern formed on a shiny piano black substrate can be obtained. Further, by adjusting the surface roughness Ra of the non-plating region 70A and the surface roughness Ra of the plating region 70B within an appropriate range, the adhesion strength of the plating film 20 can be maintained while maintaining the luster and brightness of the non-plating region 70A. And the gloss of the plating film 20 can be enhanced.
[第2実施形態]
 図3(b)に示す、本実施形態の装飾メッキ品(意匠メッキ品)200について説明する。装飾メッキ品200では、基材表面70aのメッキ領域70Bに、複数の孔(凹部、非貫通孔)71が形成されている。それ以外の構成は、第1実施形態で説明した装飾メッキ品100とほぼ同様であるため、説明を省略する。
[Second embodiment]
A decorative plated product (design plated product) 200 of this embodiment shown in FIG. 3(b) will be described. In the decorative plated product 200, a plurality of holes (recesses, non-through holes) 71 are formed in the plated region 70B of the substrate surface 70a. Since other configurations are substantially the same as those of the decorative plated product 100 described in the first embodiment, description thereof will be omitted.
 本実施形態では、複数の孔(凹部、非貫通孔)71により、その上に形成されるメッキ膜20の密着強度が高まる。複数の孔71は、メッキ領域70B上に規則的に配置させてもよい。孔71は、メッキ領域70Bにおける開口の形状が、円又は楕円であることが好ましい。孔71の大きさは、メッキ膜20の幅に合わせて適宜調整できる。例えば、孔71の直径(メッキ領域70Bにおける開口の直径、楕円の場合は長径)は、10μm~80μmであってよく、深さは1μm~50μmであってよい。 In this embodiment, the plurality of holes (concave portions, non-through holes) 71 increase the adhesion strength of the plated film 20 formed thereon. A plurality of holes 71 may be regularly arranged on the plating region 70B. The hole 71 preferably has a circular or elliptical opening shape in the plating region 70B. The size of the hole 71 can be appropriately adjusted according to the width of the plating film 20 . For example, the diameter of the hole 71 (the diameter of the opening in the plating region 70B, the major axis in the case of an ellipse) may be 10 μm to 80 μm, and the depth may be 1 μm to 50 μm.
 装飾メッキ品200は、基材表面70aのメッキ領域70Bに複数の孔71を形成すること以外、第1の実施形態の装飾メッキ品100と同様の方法により製造できる。複数の孔71は、レーザー光照射により形成してもよい。例えば、レーザー描画によりメッキ領域70Bの触媒活性妨害層80を除去する工程において、複数の孔71を形成してもよい(図3(a)参照)。 The decorative plated product 200 can be manufactured by the same method as the decorative plated product 100 of the first embodiment, except that a plurality of holes 71 are formed in the plated region 70B of the substrate surface 70a. The plurality of holes 71 may be formed by laser light irradiation. For example, a plurality of holes 71 may be formed in the step of removing the catalytic activity hindering layer 80 in the plated region 70B by laser drawing (see FIG. 3(a)).
 以上説明した装飾メッキ品200は、第1実施形態の装飾メッキ品と同様の効果を奏する。また、複数の凹部(非貫通孔)71により、メッキ膜20の密着強度が更に高まる。 The decorative plated product 200 described above has the same effect as the decorative plated product of the first embodiment. Further, the bonding strength of the plating film 20 is further enhanced by the plurality of concave portions (non-through holes) 71 .
[第3実施形態]
 図4(d)に示す、本実施形態の装飾メッキ品(意匠メッキ品)300について説明する。装飾メッキ品300は、基材70が、樹脂成形体10と、樹脂成形体10の表面上に設けられた塗装膜30とから構成される。即ち、基材表面70aの非メッキ領域70Aは、塗装膜30で形成されている。それ以外の構成は、第1実施形態で説明した装飾メッキ品100とほぼ同様であるため、説明を省略する。
[Third embodiment]
A decorative plated product (design plated product) 300 of this embodiment shown in FIG. 4(d) will be described. In the decorative plated product 300 , the base material 70 is composed of the resin molded body 10 and the coating film 30 provided on the surface of the resin molded body 10 . That is, the non-plating region 70A of the substrate surface 70a is formed of the coating film 30. As shown in FIG. Since other configurations are substantially the same as those of the decorative plated product 100 described in the first embodiment, description thereof will be omitted.
 塗装膜30は、ピアノブラックの色調を有することが好ましい。これにより、ピアノブラックの素地に細線のメッキ膜パターンが形成された意匠性の高い装飾メッキ品300が得られる。ピアノブラックの色調を有する塗装膜30を設けることで、塗装膜30に覆われて見えなくなる樹脂成形体10の意匠性は、必ずしも高い必要がなくなる。これにより、樹脂成形体10に用いる材料選択の幅が広がる。塗装膜30は、例えば、市販の2液型アクリルウレタン樹脂のピアノブラック塗料を用いて形成した塗膜(ピアノブラックのアクリルウレタン塗膜)であってもよい。 The coating film 30 preferably has a piano black color tone. As a result, a decorative plated product 300 having a fine wire plating film pattern formed on a piano black substrate and having a high design property can be obtained. By providing the coating film 30 having a piano black color tone, the resin molding 10 that is covered with the coating film 30 and becomes invisible does not necessarily need to have a high design. Thereby, the range of selection of materials used for the resin molded body 10 is widened. The coating film 30 may be, for example, a coating film (piano black acrylic urethane coating film) formed using a commercially available two-pack acrylic urethane resin piano black coating.
 塗装膜30は、基材表面70aの非メッキ領域70Aを形成する。このため、塗装膜30の表面粗さRaは、例えば、0.5μm未満が好ましい。これにより、塗装膜30の光沢性を高められる。塗装膜30の厚さは、例えば、5μm~50μm、又は8μm~40μmとしてもよい。 The coating film 30 forms the non-plating region 70A of the substrate surface 70a. Therefore, the surface roughness Ra of the coating film 30 is preferably less than 0.5 μm, for example. Thereby, the glossiness of the coating film 30 can be improved. The thickness of the coating film 30 may be, for example, 5 μm to 50 μm, or 8 μm to 40 μm.
 本実施形態の装飾メッキ品300は、樹脂成形体10の表面上に塗装膜30を形成すること以外、第1の実施形態の装飾メッキ品100と同様の方法により製造できる。 The decorative plated product 300 of this embodiment can be manufactured by the same method as the decorative plated product 100 of the first embodiment, except that the coating film 30 is formed on the surface of the resin molding 10 .
 まず、樹脂成形体10を用意し、その上に、塗装膜30、触媒活性妨害層80をこの順に形成する(図4(a))。塗装膜30は、ピアノブラックの色調を有する塗料を汎用の方法により、樹脂成形体10の表面に塗布して形成する。ピアノブラックの色調を有する塗料としては、例えば、市販の2液型アクリルウレタン樹脂のピアノブラック塗料を用いてもよい。 First, the resin molding 10 is prepared, and the coating film 30 and the catalytic activity hindering layer 80 are formed thereon in this order (Fig. 4(a)). The paint film 30 is formed by applying paint having a piano black color tone to the surface of the resin molding 10 by a general-purpose method. As the paint having a piano black color tone, for example, a commercially available two-liquid acrylic urethane resin piano black paint may be used.
 触媒活性妨害層80が形成された表面70aのメッキ膜20が形成される予定の領域(メッキ領域70B)にレーザー光を照射して、触媒活性妨害層80を除去する(図4(b)参照)。このとき、触媒活性妨害層80と共に塗装膜30も除去される。更に、樹脂成形体10の表面の一部が除去されて、溝(凹部)70bが形成されてもよい。次に、第1の実施形態と同様の方法により、無電解メッキ膜21を形成し(図4(c))、続いて、電解メッキ膜22~24を形成する(図4(d))。以上説明した方法により、装飾メッキ品300が得られる。 A laser beam is applied to a region (plating region 70B) of the surface 70a on which the catalytic activity hindering layer 80 is formed, where the plating film 20 is to be formed, to remove the catalytic activity hindering layer 80 (see FIG. 4B). ). At this time, the coating film 30 is also removed together with the catalytic activity hindering layer 80 . Furthermore, a part of the surface of the resin molding 10 may be removed to form the groove (recess) 70b. Next, an electroless plated film 21 is formed by the same method as in the first embodiment (FIG. 4(c)), followed by electrolytic plated films 22 to 24 (FIG. 4(d)). The decorative plated product 300 is obtained by the method described above.
 装飾メッキ品300は、第1実施形態の装飾メッキ品100と同様の効果を奏する。また、塗装膜30を設けることで、塗装膜30に覆われて見えなくなる樹脂成形体10の意匠性は、必ずしも高い必要がなくなり、樹脂成形体10に用いる材料選択の幅が広がる。
例えば、塗装膜30により高い意匠性を維持しつつ、樹脂成形体10の材料として線膨張係数の低い樹脂を選択することも可能となる。線膨張係数の低い樹脂を選択することで、装飾メッキ品300の信頼性を高められる。
The decorative plated product 300 has the same effects as the decorative plated product 100 of the first embodiment. Moreover, by providing the coating film 30, the design of the resin molding 10, which is covered with the coating film 30 and cannot be seen, does not necessarily need to be high, and the selection of materials used for the resin molding 10 is widened.
For example, it is possible to select a resin having a low coefficient of linear expansion as the material of the resin molded body 10 while maintaining a high design property by the coating film 30 . By selecting a resin with a low coefficient of linear expansion, the reliability of the decorative plated product 300 can be enhanced.
 以上説明した複数の実施形態は、互いに相手を排除しない限り、互いに組み合わせてもよい。 The multiple embodiments described above may be combined with each other as long as they do not exclude each other.
 以下、実施例及び比較例により本発明を具体的に説明するが、本発明は下記の実施例及び比較例により制限されない。 The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited by the following examples and comparative examples.
[実施例1]
 本実施例では、図1に示す装飾メッキ品100として、図5に示す装飾メッキ品を作製した。図5に示すように、本実施例の装飾メッキ品100では、立体的な面(曲面)に、線状部分(線状のメッキ膜)を含むメッキ膜のパターンが形成されている。また、メッキ膜20の線状部分の最小線幅20d及び最大線幅は、それぞれ、0.3mm、0.5mmとした。
[Example 1]
In this example, the decorative plated product shown in FIG. 5 was produced as the decorative plated product 100 shown in FIG. As shown in FIG. 5, in the decorative plated product 100 of this embodiment, a plated film pattern including a linear portion (linear plated film) is formed on a three-dimensional surface (curved surface). The minimum line width 20d and the maximum line width of the linear portion of the plated film 20 were set to 0.3 mm and 0.5 mm, respectively.
(1)樹脂成形体10(基材70)の成形
 粒子径がナノサイズのフィラーを含有するピアノブラック色調のポリアミド6(PA6)(ユニチカ製、M1030DHSZ)を汎用の成形機を用いて射出成形し、ピアノブラック色調を有する樹脂成形体10を得た。成形条件は、金型温度:120℃、樹脂温度:250℃とした。樹脂成形体10の表面70aの表面粗さRaをキーエンス製のレーザー顕微鏡で測定した。測定結果を非メッキ領域70Aの表面粗さRaとして表1に示す。尚、後述する実施例2で用いた、フィラーを含まないポリアミド6(非強化樹脂)の線膨張係数が80ppmであるのに対し、本実施例で用いた樹脂の線膨張係数は、フィラーを含有することで低い値に抑えられ、50ppmであった。
(1) Molding of resin molding 10 (base material 70) Polyamide 6 (PA6) (manufactured by Unitika, M1030DHSZ) of piano black tone containing a filler with a nano-sized particle size is injection molded using a general-purpose molding machine. , a resin molding 10 having a piano black color tone was obtained. The molding conditions were mold temperature: 120°C and resin temperature: 250°C. The surface roughness Ra of the surface 70a of the resin molding 10 was measured with a Keyence laser microscope. The measurement results are shown in Table 1 as the surface roughness Ra of the non-plating region 70A. In addition, the linear expansion coefficient of the polyamide 6 (unreinforced resin) containing no filler used in Example 2 described later is 80 ppm, whereas the linear expansion coefficient of the resin used in this example contains a filler. By doing so, the value was suppressed to a low value of 50 ppm.
(2)メッキ膜20の形成
 本実施例では、以下に説明する方法により、樹脂成形体10上にメッキ膜20を形成した。
(2) Formation of Plated Film 20 In this example, the plated film 20 was formed on the resin molding 10 by the method described below.
(a)触媒活性妨害層80の形成
 樹脂成形体10の表面70aに、触媒失活剤である下記式(1)で表されるハイパーブランチポリマーを含む触媒活性妨害層80を形成した。式(1)で表されるハイパーブランチポリマーは、国際公開第2018/131492号に開示される方法により合成した。式(1)において、Rはビニル基又はエチル基である。
(a) Formation of Catalytic Activity Hindering Layer 80 A catalytic activity hindering layer 80 containing a hyperbranched polymer represented by the following formula (1), which is a catalyst deactivator, was formed on the surface 70a of the resin molded body 10 . A hyperbranched polymer represented by formula (1) was synthesized by the method disclosed in WO2018/131492. In formula (1), R 0 is a vinyl group or an ethyl group.
Figure JPOXMLDOC01-appb-C000001
 
Figure JPOXMLDOC01-appb-C000001
 
 合成した式(1)で表されるポリマーをメチルエチルケトンに溶解して、ポリマー濃度0.5重量%のポリマー溶液を調製した。室温のポリマー溶液に、基材を5秒間浸漬し、その後、80℃乾燥機中で10分間乾燥した。これにより、樹脂成形体10の表面70aに触媒活性妨害層80を形成した。触媒活性妨害層80の厚さは、0.08μmであった。 A polymer solution having a polymer concentration of 0.5% by weight was prepared by dissolving the synthesized polymer represented by formula (1) in methyl ethyl ketone. The substrate was immersed in the room temperature polymer solution for 5 seconds and then dried in an 80° C. dryer for 10 minutes. Thus, a catalytic activity hindering layer 80 was formed on the surface 70a of the resin molded body 10. Next, as shown in FIG. The thickness of the catalytically active impeding layer 80 was 0.08 μm.
(b)レーザー描画
 樹脂成形体10の表面70aのメッキ膜20を形成する予定の領域(メッキ領域70B)にレーザー光を照射(レーザー描画)した。UVレーザー(キーエンス製)を用い、パワー20%、速度2000mm/s、周波数80kHzのレーザー描画条件で、メッキ領域70Bを20μmピッチで格子状に描画した。レーザー光を照射したメッキ領域70Bは、触媒活性妨害層80が除去されると共に粗化された。メッキ領域70Bの表面粗さRaをキーエンス製のレーザー顕微鏡で測定した。測定結果を表1に示す。
(b) Laser drawing A region (plating region 70B) where the plating film 20 is to be formed on the surface 70a of the resin molded body 10 was irradiated with a laser beam (laser drawing). Using a UV laser (manufactured by KEYENCE CORPORATION), the plating regions 70B were drawn in a lattice pattern at a pitch of 20 μm under laser drawing conditions of power 20%, speed 2000 mm/s, and frequency 80 kHz. The plated region 70B irradiated with the laser light was roughened while the catalytic activity hindering layer 80 was removed. The surface roughness Ra of the plated region 70B was measured with a Keyence laser microscope. Table 1 shows the measurement results.
(c)無電解メッキ(下地メッキ膜の形成)
 樹脂成形体10を30℃に調整した0.3Nの塩酸に浸漬した後、30℃に調整した市販の塩化パラジウム(PdCl)水溶液(奥野製薬工業製、アクチベータ)に5分間浸漬した。樹脂成形体10を洗浄した後、70℃に調整した1,3-ブタンジオールを20%混合した水溶液に5分浸漬して、樹脂成形体10の表面近傍を膨潤させた(膨潤処理)。
(c) Electroless plating (formation of underlying plating film)
After the resin molding 10 was immersed in 0.3N hydrochloric acid adjusted to 30° C., it was immersed in a commercially available palladium chloride (PdCl 2 ) aqueous solution (manufactured by Okuno Chemical Industry Co., Ltd., Activator) adjusted to 30° C. for 5 minutes. After washing the resin molded body 10, the resin molded body 10 was immersed in an aqueous solution containing 20% 1,3-butanediol adjusted to 70° C. for 5 minutes to swell near the surface of the resin molded body 10 (swelling treatment).
 膨潤処理後、70℃に調整した無電解ニッケルリンメッキ液(奥野製薬工業製、トップニコロンRCH)に、樹脂成形体10を5分間浸漬した。樹脂成形体10上のレーザー描画部分(メッキ領域70B)に無電解ニッケルリンメッキ膜21が成長した。 After the swelling treatment, the resin molding 10 was immersed for 5 minutes in an electroless nickel phosphorous plating solution (manufactured by Okuno Chemical Industry Co., Ltd., Top Nicolon RCH) adjusted to 70°C. An electroless nickel-phosphorus plating film 21 grew on the laser-drawn portion (plating region 70B) on the resin molded body 10 .
(d)電解メッキ(仕上げメッキ膜の形成)
 無電解ニッケルリンメッキ膜21上に、更に、汎用の電解メッキ法により、電解銅メッキ膜22、電解ニッケルメッキ膜23、電解3価クロムメッキ膜24を、この順に積層し、多層のメッキ膜から構成されるメッキ膜20を形成した。各メッキ膜の厚さを表1に示す。以上説明した方法により、本実施例の装飾メッキ品100を得た。
(d) Electroplating (formation of finish plating film)
Electrolytic copper plating film 22, electrolytic nickel plating film 23, and electrolytic trivalent chromium plating film 24 are further laminated in this order on the electroless nickel phosphorus plating film 21 by a general-purpose electrolytic plating method. A plated film 20 having a structure was formed. Table 1 shows the thickness of each plating film. The decorative plated product 100 of this example was obtained by the method described above.
 装飾メッキ品100の断面をSEM観察した。図7に示すように、メッキ膜20と樹脂成形体10との界面11aから、樹脂成形体10の内部に向かって、樹脂材料(フィラー混合PA6)と、メッキ膜20に含まれる金属化合物(ニッケルリン)20Pとの混合層11が形成されていることが確認できた。混合層11の厚さ11dは、5μmであった。
混合層11が形成されたことで、本実施例のメッキ膜20は高い密着強度を示すと推測される。
A cross section of the decorative plated product 100 was observed with an SEM. As shown in FIG. 7, from the interface 11a between the plated film 20 and the resin molded body 10, toward the inside of the resin molded body 10, the resin material (filler mixed PA6) and the metal compound (nickel It was confirmed that a mixed layer 11 with phosphorus) 20P was formed. The thickness 11d of the mixed layer 11 was 5 μm.
It is presumed that the plating film 20 of this embodiment exhibits high adhesion strength due to the formation of the mixed layer 11 .
[実施例2]
 本実施例では、図1に示す装飾メッキ品100として、図6に示す装飾メッキ品を作製した。図6に示すように、本実施例の装飾メッキ品100には、板状の基材の平面に線状の部分(線状のメッキ膜)を含むメッキ膜のパターンが形成されている。線状の部分(線状のメッキ膜)の最小幅20d及び最大幅は、実施例1と同様にそれぞれ、0.3mm、0.5mmとした。
[Example 2]
In this example, the decorative plated product shown in FIG. 6 was produced as the decorative plated product 100 shown in FIG. As shown in FIG. 6, in the decorative plated product 100 of this embodiment, a plated film pattern including a linear portion (linear plated film) is formed on the plane of a plate-shaped base material. The minimum width 20d and the maximum width of the linear portion (linear plated film) were set to 0.3 mm and 0.5 mm, respectively, as in the first embodiment.
 本実施例では、フィラーを含有しないピアノブラック色調のポリアミド6(PA6)(BASF製、D3K)を用いて樹脂成形体10を成形したこと、電解メッキ膜22、23の厚さを表1に示すように変更したこと以外は、実施例1と同様の方法により、装飾メッキ品100(図1参照)を作製した。 In this example, the resin molded body 10 was molded using polyamide 6 (PA6) (manufactured by BASF, D3K) with a piano black tone that does not contain a filler, and the thicknesses of the electrolytic plating films 22 and 23 are shown in Table 1. A decorative plated product 100 (see FIG. 1) was produced in the same manner as in Example 1, except for the following changes.
 実施例1と同様の方法により、非メッキ領域70Aの表面粗さRa、メッキ領域70Bの表面粗さRaを測定した。結果を表1に示す。また、本実施例では、実施例1と同様に樹脂成形体がポリアミド6を含有し、メッキ前処理として膨潤処理を行った。したがって、本実施例においても、実施例1と同様に、樹脂材料(PA6)と、メッキ膜20に含まれる金属化合物(ニッケルリン)20Pとの混合層11が形成され、これにより、メッキ膜20は高い密着強度を示すと推測される。 By the same method as in Example 1, the surface roughness Ra of the non-plated region 70A and the surface roughness Ra of the plated region 70B were measured. Table 1 shows the results. In addition, in this example, the resin molding contained polyamide 6 in the same manner as in Example 1, and was subjected to a swelling treatment as a pretreatment for plating. Therefore, also in this embodiment, as in the first embodiment, the mixed layer 11 of the resin material (PA6) and the metal compound (nickel phosphorus) 20P contained in the plating film 20 is formed. is presumed to exhibit high adhesion strength.
[実施例3]
 本実施例では、メッキ膜20の密着強度を高めるために基材表面70aのメッキ領域70Bに複数の孔(凹部、非貫通孔)71が形成された、装飾メッキ品200を作製した(図3(b)参照)。
[Example 3]
In this example, a decorative plated product 200 was produced in which a plurality of holes (recesses, non-through holes) 71 were formed in the plated region 70B of the substrate surface 70a in order to increase the adhesion strength of the plated film 20 (FIG. 3). (b)).
(1)樹脂成形体10の成形
 まず、樹脂材料(フィラーを含有しない、ピアノブラック色調のバイオポリカーボネート(バイオPC)(三菱ケミカル製、デュラビオD7340R))を実施例1と同様に汎用の成形機を用いて射出成形し、ピアノブラック色調を有する樹脂成形体10を得た。成形条件は、金型温度:120℃、樹脂温度:280℃とした。
(1) Molding of resin molded body 10 First, a resin material (piano black tone bio-polycarbonate (bio-PC) (Durabio D7340R, manufactured by Mitsubishi Chemical Co., Ltd.) containing no filler) was molded using a general-purpose molding machine in the same manner as in Example 1. A resin molded product 10 having a piano black color tone was obtained by injection molding using the resin. The molding conditions were mold temperature: 120°C and resin temperature: 280°C.
(2)メッキ膜20の形成
(a)触媒活性妨害層80の形成、レーザー描画(孔71の形成)
 実施例1と同様の方法により、触媒活性妨害層80を形成した後、メッキ領域70Bにレーザー描画を行い、触媒活性妨害層80を除去すると共に、一直線上に所定間隔で並ぶ複数の孔(凹部)71から形成される凹部列を、複数列形成した(図3(a)参照)。メッキ領域70Bにおける孔71の開口の形状は円であり、その直径は20μmとした。孔71の深さは5μmとした。複数の孔71の形成は、パワー20%、速度1000mm/s、周波数60kHzのレーザー光照射条件で行った。
(b)無電解メッキ、電解メッキ
 基材70を2Nの水酸化ナトリウム溶液(50℃)に1分間浸漬した後、実施例1で用いたものと同様の無電解メッキ触媒液、無電解メッキ液を用いて、無電解メッキ膜21を形成した。無電解メッキ液への浸漬時間は8分間とした。更に、実施例1と同様の方法により、無電解メッキ膜21の上に、電解メッキ膜22~24を形成して、本実施例の装飾メッキ品200を得た。各メッキ膜の厚さを表1に示す。
(2) Formation of plated film 20 (a) Formation of catalytic activity hindering layer 80, laser drawing (formation of holes 71)
After forming the catalytic activity obstructing layer 80 by the same method as in Example 1, the plating region 70B is subjected to laser drawing to remove the catalytic activity obstructing layer 80, and a plurality of holes (recesses) arranged in a straight line at predetermined intervals. ) 71 were formed (see FIG. 3A). The shape of the opening of the hole 71 in the plated region 70B was circular, and the diameter was 20 μm. The depth of the hole 71 was set to 5 μm. The formation of the plurality of holes 71 was performed under laser light irradiation conditions of power 20%, speed 1000 mm/s, and frequency 60 kHz.
(b) Electroless Plating, Electroplating After immersing the substrate 70 in a 2N sodium hydroxide solution (50° C.) for 1 minute, the same electroless plating catalyst solution and electroless plating solution as used in Example 1 were applied. was used to form the electroless plated film 21 . The immersion time in the electroless plating solution was 8 minutes. Further, electroplated films 22 to 24 were formed on the electroless plated film 21 by the same method as in Example 1 to obtain a decorative plated product 200 of this example. Table 1 shows the thickness of each plating film.
 実施例1と同様の方法により、非メッキ領域70Aの表面粗さRa、メッキ領域70Bの表面粗さRaを測定した。結果を表1に示す。尚、本実施例では、複数の孔71を形成したため、メッキ領域70Bの表面粗さRaが実施例1と比較して大きい。このため、メッキ領域70Bの表面粗さRaが目立たないように、実施例1と比較してメッキ膜の線幅を細くした(表1参照)。 By the same method as in Example 1, the surface roughness Ra of the non-plated region 70A and the surface roughness Ra of the plated region 70B were measured. Table 1 shows the results. In this embodiment, since a plurality of holes 71 are formed, the surface roughness Ra of the plated region 70B is larger than that of the first embodiment. For this reason, the line width of the plating film was made narrower than in Example 1 so that the surface roughness Ra of the plating region 70B was not conspicuous (see Table 1).
[実施例4]
 本実施例では、ピアノブラック色調の塗装膜30を有する装飾メッキ品300を作製した(図4(d)参照)。
[Example 4]
In this example, a decorative plated product 300 having a coating film 30 with a piano black tone was produced (see FIG. 4(d)).
(1)基材70の作製
 フィラーとしてチタン酸カリウムを含有するポリアミド9T(PA9T)(大塚化学製、NMA964B)を実施例1と同様の汎用の成形機を用いて射出成形して樹脂成形体10を得た。得られた樹脂成形体10の表面に、市販のアクリルウレタンピアノブラック色調の塗料を塗布して、厚さ10μmの塗装膜30を形成して、基材70を得た。尚、基材70に含まれるフィラー(チタン酸カリウム)の径(繊維径)は0.3μm~0.6μm、長さ(繊維長)は、10μm~20μmであった。
(1) Production of base material 70 Polyamide 9T (PA9T) (manufactured by Otsuka Chemical Co., Ltd., NMA964B) containing potassium titanate as a filler is injection-molded using a general-purpose molding machine similar to that of Example 1, and a resin molded body 10 is obtained. got A commercially available acrylic urethane piano black paint was applied to the surface of the obtained resin molding 10 to form a coating film 30 having a thickness of 10 μm, thereby obtaining a substrate 70 . The filler (potassium titanate) contained in the base material 70 had a diameter (fiber diameter) of 0.3 μm to 0.6 μm and a length (fiber length) of 10 μm to 20 μm.
(2)メッキ膜20の形成
(a)触媒活性妨害層80の形成、レーザー描画
 実施例1と同様の方法により、触媒活性妨害層80を形成した(図4(a)参照)。次に、実施例1と同様の方法により、メッキ領域70Bにレーザー描画を行い、触媒活性妨害層80及び塗装膜30を除去した(図4(a)参照)。
(2) Formation of Plated Film 20 (a) Formation of Catalytic Activity Hindering Layer 80 and Laser Drawing A catalytic activity hindering layer 80 was formed in the same manner as in Example 1 (see FIG. 4A). Next, laser drawing was performed on the plated region 70B by the same method as in Example 1 to remove the catalytic activity hindering layer 80 and the coating film 30 (see FIG. 4A).
(b)無電解メッキ、電解メッキ
 実施例3と同様の方法により、無電解メッキ膜21、電解メッキ膜22~24を形成して、本実施例の装飾メッキ品300を得た。各メッキ膜の厚さを表1に示す。また、実施例1と同様の方法により、非メッキ領域70A(塗装膜30)の表面粗さRa、メッキ領域70Bの表面粗さRaを測定した。結果を表1に示す。
(b) Electroless Plating and Electrolytic Plating Electroless plated film 21 and electrolytic plated films 22 to 24 were formed in the same manner as in Example 3 to obtain a decorative plated product 300 of this example. Table 1 shows the thickness of each plating film. Further, the surface roughness Ra of the non-plating region 70A (coating film 30) and the surface roughness Ra of the plating region 70B were measured in the same manner as in Example 1. Table 1 shows the results.
 本実施例の樹脂成形体10は、フィラーとしてチタン酸カリウムを含有するため線膨張係数が低い。また、フィラー径が小さい(フィラーが細い)ため、フィラーにより樹脂成形体10の表面粗さが大きくなることがない。また、チタン酸カリウムはメッキ膜20と相互作用するため、メッキ領域70Bの表面粗さ大きくせずとも、メッキ膜20の密着強度を高めることができる。一方で、本実施例の樹脂成形体10は、ピアノブラックのような光沢のある色調を有していない。本実施例の装飾メッキ品300では、樹脂成形体10の非メッキ領域70Aをピアノブラック色調の塗装膜30で覆うことで、上述の樹脂成形体10の利点を有しつつ、装飾メッキ品300の意匠性を高めた。 The resin molded body 10 of this embodiment contains potassium titanate as a filler, and thus has a low coefficient of linear expansion. In addition, since the diameter of the filler is small (the filler is thin), the filler does not increase the surface roughness of the resin molded body 10 . Further, since potassium titanate interacts with the plated film 20, the adhesion strength of the plated film 20 can be increased without increasing the surface roughness of the plated region 70B. On the other hand, the resin molding 10 of this example does not have a glossy color tone like piano black. In the decorative plated product 300 of this embodiment, by covering the non-plating region 70A of the resin molded product 10 with the piano black-tone paint film 30, the decorative plated product 300 has the advantages of the resin molded product 10 described above. Enhanced design.
[装飾メッキ品の評価]
(1)外観観察
 実施例1~4で作製した装飾メッキ品の外観観察を目視で行った。実施例1~4で作製した装飾メッキ品には、設計どおりの高精細なメッキ膜パターンが形成されていた。また、非メッキ領域70Aにおいて光沢あるピアノブラックの色調が維持されており、メッキ膜20も十分な光沢を有していた。即ち、実施例1~4で作製した装飾メッキ品は高い意匠性を有していた。
[Evaluation of decorative plated products]
(1) Observation of Appearance The appearance of the decorative plated products produced in Examples 1 to 4 was visually observed. The decorative plated products produced in Examples 1 to 4 had high-definition plated film patterns as designed. In addition, the glossy piano black color tone was maintained in the non-plating region 70A, and the plating film 20 also had sufficient gloss. That is, the decorative plated products produced in Examples 1 to 4 had high designability.
 尚、実施例1との比較のため、メッキ膜20の最外層24を、電解3価クロムメッキ膜に代えて、電解6価クロムメッキ膜とした以外は実施例1の装飾メッキ品100と同一の構成の装飾メッキ品を作製した。得られた装飾メッキ品では、設計どおりの高精細なメッキ膜パターンが形成され、メッキ膜20も光沢を有していたが、6価クロム電解メッキ液により成形体表面が白濁してしまい、非メッキ領域70Aのピアノブラック色調が維持できなかった。この結果から、樹脂成形体10のピアノブラック色調を維持する観点からは、メッキ膜20の最外層24には電解6価クロムメッキ膜ではなく、例えば、電解3価クロムメッキ膜を用いることが好ましいことが確認できた。 For comparison with Example 1, the same as the decorative plated product 100 of Example 1 except that the outermost layer 24 of the plating film 20 was replaced with an electrolytic hexavalent chromium plating film instead of an electrolytic trivalent chromium plating film. A decorative plated product having the configuration of was produced. In the obtained decorative plated product, a highly precise plated film pattern was formed as designed, and the plated film 20 also had gloss. The piano black color tone of the plating region 70A could not be maintained. From this result, from the viewpoint of maintaining the piano black color tone of the resin molded body 10, it is preferable to use, for example, an electrolytic trivalent chromium plating film instead of an electrolytic hexavalent chromium plating film for the outermost layer 24 of the plating film 20. I was able to confirm that.
(2)信頼性評価
 実施例1~4の装飾メッキ品のヒートショック試験を行った。評価用サンプルとして、実施例1~4の装飾メッキ品を3個ずつ用意した。評価用サンプルを-35℃の環境下に30分放置と、90℃の環境下に30分放置とを交互に繰り返し、10サイクル毎に評価用サンプルを取り出してメッキ膜20に膨れや剥離がないか目視で確認した。ヒートショック試験は、実施例1~4それぞれにおいて、1個以上の評価用サンプルにメッキ膜の膨れや剥離が生じるまで行った。そして、3個全ての評価用サンプルにメッキ膜に膨れや剥離が確認されなかった最大サイクル数を合格サイクル数とした。実施例1~4それぞれの合格サイクル数を表1に示す。
(2) Reliability Evaluation A heat shock test was performed on the decorative plated products of Examples 1-4. As samples for evaluation, three decorative plated products of Examples 1 to 4 were prepared. The evaluation sample was alternately left in an environment of −35° C. for 30 minutes and left in an environment of 90° C. for 30 minutes, and the evaluation sample was taken out every 10 cycles. I checked it visually. In each of Examples 1 to 4, the heat shock test was performed until swelling or peeling of the plating film occurred in one or more samples for evaluation. The maximum number of cycles at which no blistering or peeling of the plating film was observed for all three samples for evaluation was defined as the number of acceptable cycles. Table 1 shows the number of acceptable cycles for each of Examples 1-4.
Figure JPOXMLDOC01-appb-T000002

 
Figure JPOXMLDOC01-appb-T000002

 
 表1に示すように、信頼性評価結果の最も小さい合格サイクル数は実施例2の100サイクルであったが、実用上の信頼性には問題がないレベルであった。即ち、実施例1~4で作製した装飾メッキ品は十分な信頼性を有していた。また、実施例1~4の装飾メッキ品において、樹脂成形体10の線膨張係数が小さいほど、信頼性評価結果が良好である(合格サイクル数が多い)ことが確認できた。 As shown in Table 1, the minimum acceptable number of cycles in the reliability evaluation result was 100 cycles in Example 2, but the reliability was at a level where there was no problem in practical use. That is, the decorative plated products produced in Examples 1 to 4 had sufficient reliability. Further, it was confirmed that in the decorative plated products of Examples 1 to 4, the smaller the coefficient of linear expansion of the resin molded body 10, the better the reliability evaluation result (the number of acceptable cycles is large).
 本発明の装飾メッキ品は、意匠性及び信頼性が高い。本発明の装飾メッキ品は、例えば、自動車の内外装部品に応用可能である。 The decorative plated product of the present invention has high designability and reliability. The decorative plated product of the present invention can be applied, for example, to interior and exterior parts of automobiles.
10          樹脂成形体
11          混合層
20          メッキ膜
30          塗装膜
70          基材
71          孔(凹部、非貫通孔)
80          触媒活性妨害層
100、200、300 装飾メッキ品
 
REFERENCE SIGNS LIST 10 resin molding 11 mixed layer 20 plating film 30 coating film 70 base material 71 hole (concave portion, non-through hole)
80 Catalytic activity hindrance layer 100, 200, 300 Decorative plated product

Claims (12)

  1.  装飾メッキ品であって、
     樹脂材料から構成されている樹脂成形体を含む基材と、
     前記基材の表面において、線状部分を含む所定のパターンを形成するメッキ膜とを有し、
     前記基材の表面において、前記メッキ膜が形成されているメッキ領域の表面粗さRaは、前記メッキ膜が形成されていない非メッキ領域の表面粗さRaよりも大きく、
     前記メッキ膜の線状部分の線幅の最小値が、0.1mm~5mmである装飾メッキ品。
    It is a decorative plated product,
    a base material including a resin molded body made of a resin material;
    a plated film that forms a predetermined pattern including linear portions on the surface of the base material;
    On the surface of the base material, the surface roughness Ra of the plated region where the plated film is formed is greater than the surface roughness Ra of the non-plated region where the plated film is not formed,
    A decorative plated product, wherein the minimum line width of the linear portion of the plated film is 0.1 mm to 5 mm.
  2.  前記樹脂成形体が単一の前記樹脂材料から構成されている請求項1に記載の装飾メッキ品。 The decorative plated product according to claim 1, wherein the resin molded body is composed of a single resin material.
  3.  前記メッキ領域の表面粗さRaが0.5μm~8.0μmであり、前記非メッキ領域の表面粗さRaが0.5μm未満である請求項1又は2に記載の装飾メッキ品。 The decorative plated article according to claim 1 or 2, wherein the plated region has a surface roughness Ra of 0.5 µm to 8.0 µm, and the non-plated region has a surface roughness Ra of less than 0.5 µm.
  4.  前記樹脂材料が、ポリアミド、又はポリカーボネートを含む、請求項1~3のいずれか一項に記載の装飾メッキ品。 The decorative plated product according to any one of claims 1 to 3, wherein the resin material contains polyamide or polycarbonate.
  5.  前記非メッキ領域の色調が、ピアノブラックである請求項1~4のいずれか一項に記載の装飾メッキ品。 The decorative plated product according to any one of claims 1 to 4, wherein the color tone of the non-plated area is piano black.
  6.  前記樹脂材料がポリアミドを含み、
     前記メッキ膜と前記樹脂成形体との界面を含む、前記樹脂成形体の表面近傍に、前記樹脂材料と、前記メッキ膜に含まれる金属又は金属化合物との混合層が形成されており、
     前記混合層の厚さが、0.5μm以上である請求項1~5のいずれか一項に記載の装飾メッキ品。
    The resin material contains polyamide,
    A mixed layer of the resin material and the metal or metal compound contained in the plating film is formed in the vicinity of the surface of the resin molding, including the interface between the plating film and the resin molding,
    The decorative plated article according to any one of claims 1 to 5, wherein the mixed layer has a thickness of 0.5 µm or more.
  7.  前記基材の表面の前記メッキ領域に複数の孔が形成されている、請求項1~5のいずれか一項に記載の装飾メッキ品。 The decorative plated product according to any one of claims 1 to 5, wherein a plurality of holes are formed in the plated region on the surface of the base material.
  8.  前記基材が、前記樹脂成形体上に設けられた、ピアノブラックの色調を有する塗装膜を更に有し、
     前記基材の表面の前記非メッキ領域が、前記塗装膜で形成されている請求項1~5のいずれか一項に記載の装飾メッキ品。
    The base material further has a coating film having a piano black color tone provided on the resin molded body,
    The decorative plated product according to any one of claims 1 to 5, wherein the non-plated region on the surface of the base material is formed of the coating film.
  9.  前記メッキ膜は複数の層から構成されており、最外層が、6価クロム、3価クロム、銅、及び金からなる群から選択される1つを含む電解メッキ膜である、請求項1~8のいずれか一項に記載の装飾メッキ品。 The plating film is composed of a plurality of layers, and the outermost layer is an electrolytic plating film containing one selected from the group consisting of hexavalent chromium, trivalent chromium, copper, and gold. 9. The decorative plated product according to any one of 8.
  10.  前記最外層が、6価クロム、または3価クロムを含む電解メッキ膜である、請求項9に記載の装飾メッキ品。 The decorative plated article according to claim 9, wherein the outermost layer is an electrolytic plating film containing hexavalent chromium or trivalent chromium.
  11.  前記最外層が、銅、または金を含む電解メッキ膜である、請求項9に記載の装飾メッキ品。 The decorative plated article according to claim 9, wherein the outermost layer is an electrolytic plated film containing copper or gold.
  12.  前記最外層が、3価クロムを含む電解メッキ膜である、請求項9に記載の装飾メッキ品。
     
    10. The decorative plated article according to claim 9, wherein said outermost layer is an electrolytic plated film containing trivalent chromium.
PCT/JP2022/028135 2021-07-21 2022-07-20 Plated decorative article WO2023003001A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131793A (en) * 1999-11-09 2001-05-15 Kayoh Technical Industry Co Ltd Manufacturing method of ornament
JP2015175038A (en) * 2014-03-17 2015-10-05 吉田テクノワークス株式会社 Method for metal-plating resin molding
JP2016150693A (en) * 2015-02-18 2016-08-22 豊田合成株式会社 Front grille
JP2020147818A (en) * 2019-03-15 2020-09-17 マクセルホールディングス株式会社 Method for manufacturing plated component, and die used for molding base material

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001131793A (en) * 1999-11-09 2001-05-15 Kayoh Technical Industry Co Ltd Manufacturing method of ornament
JP2015175038A (en) * 2014-03-17 2015-10-05 吉田テクノワークス株式会社 Method for metal-plating resin molding
JP2016150693A (en) * 2015-02-18 2016-08-22 豊田合成株式会社 Front grille
JP2020147818A (en) * 2019-03-15 2020-09-17 マクセルホールディングス株式会社 Method for manufacturing plated component, and die used for molding base material

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