WO2022268870A3 - Hermetically encapsulated optical projection arrangement and method for producing same - Google Patents

Hermetically encapsulated optical projection arrangement and method for producing same Download PDF

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Publication number
WO2022268870A3
WO2022268870A3 PCT/EP2022/066987 EP2022066987W WO2022268870A3 WO 2022268870 A3 WO2022268870 A3 WO 2022268870A3 EP 2022066987 W EP2022066987 W EP 2022066987W WO 2022268870 A3 WO2022268870 A3 WO 2022268870A3
Authority
WO
WIPO (PCT)
Prior art keywords
arrangement
optoelectronic component
mems
transmission radiation
partial substrate
Prior art date
Application number
PCT/EP2022/066987
Other languages
German (de)
French (fr)
Other versions
WO2022268870A2 (en
Inventor
Wolfgang Reinert
Vanessa Stenchly
Hans-Joachim Quenzer
Original Assignee
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. filed Critical Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
Priority to EP22734955.2A priority Critical patent/EP4359845A2/en
Publication of WO2022268870A2 publication Critical patent/WO2022268870A2/en
Publication of WO2022268870A3 publication Critical patent/WO2022268870A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/18—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for optical projection, e.g. combination of mirror and condenser and objective
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00317—Packaging optical devices
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02255—Out-coupling of light using beam deflecting elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/031—Anodic bondings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0225—Out-coupling of light
    • H01S5/02253—Out-coupling of light using lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion

Abstract

An optical projection arrangement (10) comprises a first assembly (10-1) arranged on a gastight first partial substrate (20-1), having an optoelectronic component (30) arranged on the first partial substrate (20-1), at least one portion of the transmission radiation (32) of the optoelectronic component (30) having a main emission direction in a range of ±30° with respect to a vertical of the first partial substrate (20-1), a gastight covering element (38) hermetically joined to the first partial substrate (20-1) in order to provide a hermetically tight housing for the optoelectronic component (30), the covering element (38) comprising a material transparent to the transmission radiation at least in the region of the main emission direction, a lens arrangement (40) arranged fixedly in relation to the covering element (38), for collimation of the transmission radiation (32) of the optoelectronic component (30), and a prism arrangement (50) configured to guide the collimated transmission radiation (32) of the optoelectronic component (30) and to couple it out at an output coupling surface (52), and furthermore comprises a second assembly (10-1) arranged on a second partial substrate (20-1), having a MEMS mirror arrangement (60) having a movably suspended and deflectable MEMS-based mirror element (62), the prism arrangement (50) and the MEMS mirror arrangement (60) being arranged geometrically with respect to one another such that the transmission radiation (32) coupled out impinges on the movably suspended MEMS-based mirror element (62) at an angle β of incidence, the angle β of incidence in the rest state of the MEMS-based mirror element (62) being in a range of between 30° and 50°.
PCT/EP2022/066987 2021-06-23 2022-06-22 Hermetically capped optical projection arrangement and method for producing same WO2022268870A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP22734955.2A EP4359845A2 (en) 2021-06-23 2022-06-22 Hermetically encapsulated optical projection arrangement and method for producing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021206477.9 2021-06-23
DE102021206477.9A DE102021206477B4 (en) 2021-06-23 2021-06-23 Hermetically sealed optical projection assembly and method of making same

Publications (2)

Publication Number Publication Date
WO2022268870A2 WO2022268870A2 (en) 2022-12-29
WO2022268870A3 true WO2022268870A3 (en) 2023-03-23

Family

ID=82308145

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2022/066987 WO2022268870A2 (en) 2021-06-23 2022-06-22 Hermetically capped optical projection arrangement and method for producing same

Country Status (3)

Country Link
EP (1) EP4359845A2 (en)
DE (1) DE102021206477B4 (en)
WO (1) WO2022268870A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008003345A1 (en) * 2008-01-07 2009-07-09 Robert Bosch Gmbh Micromirror device and method of manufacturing a micromirror device
DE102008012384A1 (en) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Lid for microsystems and method of making a lid
EP2709366A2 (en) * 2012-09-14 2014-03-19 Hitachi Media Electronics Co., Ltd. Scanning type projector
US20190121134A1 (en) * 2017-10-23 2019-04-25 North Inc. Free space multiple laser diode modules
US20200014172A1 (en) * 2018-07-06 2020-01-09 Himax Technologies Limited Projector, electronic device having projector and associated manufacturing method
WO2022175439A1 (en) * 2021-02-19 2022-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a cover substrate, method for producing a hermetically enclosed, optoelectronic component and hermetically enclosed optoelectronic component

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5640420B2 (en) 2009-05-29 2014-12-17 株式会社リコー Projection-type image display device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008003345A1 (en) * 2008-01-07 2009-07-09 Robert Bosch Gmbh Micromirror device and method of manufacturing a micromirror device
DE102008012384A1 (en) * 2008-03-04 2009-09-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Lid for microsystems and method of making a lid
EP2709366A2 (en) * 2012-09-14 2014-03-19 Hitachi Media Electronics Co., Ltd. Scanning type projector
US20190121134A1 (en) * 2017-10-23 2019-04-25 North Inc. Free space multiple laser diode modules
US20200014172A1 (en) * 2018-07-06 2020-01-09 Himax Technologies Limited Projector, electronic device having projector and associated manufacturing method
WO2022175439A1 (en) * 2021-02-19 2022-08-25 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing a cover substrate, method for producing a hermetically enclosed, optoelectronic component and hermetically enclosed optoelectronic component

Also Published As

Publication number Publication date
DE102021206477B4 (en) 2023-01-12
EP4359845A2 (en) 2024-05-01
DE102021206477A1 (en) 2022-12-29
WO2022268870A2 (en) 2022-12-29

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