WO2022268131A1 - Ensemble émetteur-récepteur optique - Google Patents

Ensemble émetteur-récepteur optique Download PDF

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Publication number
WO2022268131A1
WO2022268131A1 PCT/CN2022/100516 CN2022100516W WO2022268131A1 WO 2022268131 A1 WO2022268131 A1 WO 2022268131A1 CN 2022100516 W CN2022100516 W CN 2022100516W WO 2022268131 A1 WO2022268131 A1 WO 2022268131A1
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WIPO (PCT)
Prior art keywords
optical
optical signal
signal
bidirectional
uplink
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PCT/CN2022/100516
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English (en)
Chinese (zh)
Inventor
汪绍武
李志伟
廖永平
曾金林
王谦
锁靖
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华为技术有限公司
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Publication of WO2022268131A1 publication Critical patent/WO2022268131A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
    • G02B6/12009—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer comprising arrayed waveguide grating [AWG] devices, i.e. with a phased array of waveguides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/14—Mode converters
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4256—Details of housings
    • G02B6/426—Details of housings mounting, engaging or coupling of the package to a board, a frame or a panel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40—Transceivers

Definitions

  • the present application relates to the technical field of optical communication, and in particular to an optical transceiver component.
  • optical network termination belongs to the equipment on the user side, which can provide users with service interfaces and has the function of electro-optical conversion, realizing the communication between users and the access network. signal exchange.
  • BOSA bi-directional optical sub-assembly
  • the ONT generally uses a bi-directional optical sub-assembly (BOSA) structure to transmit and receive optical signals.
  • BOSA is a structure commonly used in optical communication systems, and its function is to realize integrated optical signal transmission and reception.
  • the BOSA structure contains many components and the packaging process is complicated, for example, it is difficult to accurately locate and fix the components when they are coupled, so there are defects of difficulty in integration and high cost.
  • An embodiment of the present application provides an optical transceiver component, which is used to design an optical transceiver component with low integration difficulty and low cost in an ONT.
  • an optical transceiver component including: an optical transmitter, a bidirectional wave splitter, and an optical receiver; the bidirectional wave splitter is coupled to the optical transmitter through a first optical waveguide port, The port is coupled with the optical receiver and is coupled with the optical fiber through the third optical waveguide port; wherein, the bidirectional wave splitter is prepared based on an optical waveguide chip; the optical transmitter is used to generate an uplink optical signal, and transmit the The uplink optical signal is injected into the bidirectional demultiplexer; the bidirectional demultiplexer is used to transmit the uplink optical signal into the optical fiber; and receive the downlink optical signal from the optical fiber, and transmit the The downlink optical signal is transmitted to the optical receiver; the optical receiver is configured to receive the downlink optical signal.
  • the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art.
  • the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost. Therefore, the present application provides an optical transceiver assembly that can be implemented in a simple manner, thereby reducing the cost of the optical transceiver assembly.
  • the optical transmitter is end-face-coupled with the first optical waveguide port of the bidirectional wave splitter by using a flip-chip bonding process.
  • the coupling between the optical transmitter and the bidirectional wave splitter can be realized by adopting a simple packaging method, and the transmission power of the optical signal can be guaranteed through the flip-chip bonding process.
  • the second optical waveguide port is designed as an inclined total reflection surface using a grinding and polishing process, and the optical receiver is configured to receive a downlink optical signal transmitted through the inclined total reflection surface.
  • the optical receiver can be patched on the output side of the second optical waveguide port of the bidirectional wave splitter after being reflected by the inclined total reflection surface, so that the optical receiver can effectively receive the downlink optical signal.
  • a signal amplifier is also included; the input end of the signal amplifier is connected to the output end of the optical receiver, and is used for signal amplification of the downlink optical signal received by the optical receiver .
  • the signal amplifier is used to amplify the received downlink optical signal, which can increase the signal gain of the downlink optical signal, thereby ensuring the accuracy of processing according to the downlink optical signal.
  • it also includes a first speckle converter; the input end of the first speckle converter is connected to the optical transmitter, and the output end is connected to the first optical waveguide port of the bidirectional wave splitter , for converting the spot size of the uplink optical signal output by the optical transmitter into the spot size of the uplink optical signal received by the bidirectional wave splitter through the first optical waveguide port.
  • the use of the mode spot converter can reduce the loss of the uplink optical signal during transmission, thereby ensuring the transmission power of the uplink optical signal.
  • the first speckle converter may be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating-type speckle converter.
  • a mode speckle converter with a suitable shape can be selected according to the actual needs of the optical transceiver components, so that the coupling rate between the two optical elements can be improved and the power during optical signal transmission can be guaranteed.
  • it also includes a second speckle converter; the input end of the second speckle converter is connected to the third optical waveguide port of the bidirectional wave splitter, and the output end is connected to the optical fiber, using Converting the spot size of the uplink optical signal output by the bidirectional wave splitter through the third optical waveguide port into the spot size of the uplink optical signal received by the optical fiber.
  • the loss of the downlink optical signal in the transmission process can be reduced by using the mode spot converter, so that the transmission power of the downlink optical signal can be guaranteed.
  • the second speckle converter may also be, but not limited to, a tapered speckle converter, an inverted tapered speckle converter, or a grating type speckle converter.
  • the mode speckle converter with a suitable shape can be selected according to the actual requirements of the optical transceiver components. Therefore, the coupling rate between the two optical elements can be improved, and the power during the transmission of the optical signal can be guaranteed.
  • the optical waveguide chip may be a planar optical waveguide chip.
  • the implementation of the bidirectional wave splitter by using the planar optical waveguide chip can simplify the implementation process of the optical transceiver component, thereby reducing the cost of the optical transceiver component.
  • the bidirectional wave splitter includes an optical waveguide and a silicon dioxide cladding; the optical waveguide can adopt a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer) , MZI) structure or arrayed waveguide grating (arrayed waveguide grating, AWG) structure design.
  • DC direct coupler
  • MZI Mach-Zehnder interferometer
  • AWG arrayed waveguide grating
  • the optical waveguide with a certain structural design is used to realize the optical splitter, and then through the coupling between different optical waveguide ports and optical transmitters, optical receivers and optical fibers, it can realize the transmission and reception of optical signals. , simplify the realization of the optical transceiver component, and reduce the cost of forming the optical transceiver component.
  • the embodiment of the present application further provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the first aspect or any possible design of the first aspect.
  • the processor can be used to encode and encapsulate the data into a data message conforming to the optical transmission protocol, and send it to the optical control chip.
  • the optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter included in the optical transceiver component to generate an uplink optical signal.
  • optical device in the above second aspect includes the optical transceiver components of the various designs in the above first aspect, it also has the technical effects that can be brought by the various designs in the above first aspect, and will not be repeated here.
  • FIG. 1 is a schematic diagram of a scene of an optical communication system
  • FIG. 2 is one of the structural schematic diagrams of an optical transceiver component provided in an embodiment of the present application
  • FIG. 3a is a schematic structural diagram of an optical transceiver component adopting a DC structure provided by an embodiment of the present application
  • Fig. 3b is a schematic diagram of signal transmission of an optical transceiver component adopting a DC structure provided by an embodiment of the present application;
  • FIG. 3c is a schematic structural diagram of an optical transceiver assembly using an MZI structure provided in an embodiment of the present application
  • FIG. 3d is a schematic structural diagram of an optical transceiver assembly using an AWG structure provided by an embodiment of the present application.
  • FIG. 4 is the second structural schematic diagram of an optical transceiver component provided by an embodiment of the present application.
  • Fig. 5 is the third structural schematic diagram of an optical transceiver component provided by the embodiment of the present application.
  • FIG. 6 is the fourth structural schematic diagram of an optical transceiver component provided by an embodiment of the present application.
  • Fig. 7a is one of the optical signal transmission diagrams at the second optical waveguide port provided by the embodiment of the present application.
  • Fig. 7b is a second diagram of optical signal transmission at the port of the second optical waveguide provided by the embodiment of the present application.
  • the optical transceiver component provided in the embodiment of the present application may be applied in an optical communication system, and the optical communication system may be, for example, a PON system.
  • the PON system is a technology based on point-to-multipoint (point 2 multiple point, P2MP) topology.
  • Passive means that the optical network does not contain any electronic devices and electronic power sources, all of which are composed of passive devices and do not require expensive active electronic devices.
  • the PON system can be an Ethernet passive optical network (ethernet PON, EPON) system, a gigabit-capable PON (GPON) system, a passive optical network based on wavelength division multiplexing (wavelength division multiplexing) PON, WDM PON) system, passive optical network (asynchronous transfer mode PON, APON) system based on asynchronous transfer mode, etc.
  • Ethernet PON Ethernet PON
  • GPON gigabit-capable PON
  • WDM PON wavelength division multiplexing
  • APON passive optical network
  • an optical communication system may include at least multiple ONTs and optical splitters. Multiple ONTs may communicate with upper-layer access devices through optical splitters. Upper-layer access devices may be, for example, optical lines Terminal (optical line termination, OLT).
  • FIG. 1 is a schematic diagram of a partial scene of an optical communication system.
  • the multiple ONTs included in the optical communication system may be ONT1, ONT2, . . . , ONTn, respectively.
  • Each ONT can be connected to multiple users.
  • ONT1 can be connected to user 1 and user 2; or an ONT can also be connected to one user.
  • ONT1 can be connected to user 3, and ONTn can be connected to ONTm.
  • the ONT as the terminal equipment on the user side in the optical communication system, can provide the user with a service interface and has the function of electro-optic conversion to realize the signal conversion process between the user and the access network.
  • the ONT included in the optical communication system in the prior art usually uses a BOSA structure to implement signal sending and receiving.
  • BOSA can realize the transmission and reception of integrated optical signals.
  • BOSA needs to package laser diode (LD), trans-impedance amplifier (TIA), WDM, ceramic sleeve, ceramic ferrule components, etc. into a coaxial module.
  • LD laser diode
  • TIA trans-impedance amplifier
  • WDM ceramic sleeve
  • ceramic ferrule components etc. into a coaxial module.
  • the embodiment of the present application provides an optical transceiver component, which is used to obtain the optical transceiver component in a simple way to meet the optical signal transceiver function that can be realized by using the BOSA structure in the prior art. Therefore, the optical transceiver assembly provided by the embodiment of the present application can be used to replace the complex packaged BOSA structure existing in the prior art, thereby reducing the integration cost of the optical transceiver assembly.
  • FIG. 2 it is a schematic schematic diagram of an optical transceiver component 200 provided in an embodiment of the present application.
  • the optical transceiver component 200 may be used for optical equipment in an optical communication system to implement optical signal transmission and reception, and the optical equipment may be, for example, an ONT.
  • the optical transceiver assembly 200 may at least include:
  • the light transmitter 201 may be, for example, a laser, specifically a passive patch type laser. Wherein, the laser can generally be realized by using a laser diode (LD).
  • the optical transmitter 201 is configured to emit light according to the optical driving signal, that is, generate an uplink optical signal, and inject the uplink optical signal into the bidirectional demultiplexer 202 .
  • the data carried by the uplink optical signal may be represented as data sent to other devices when the optical device where the optical transceiver component is located serves as the sending end.
  • the data to be sent by the optical device where the optical transceiver component is located can be sent to an upper-layer access device based on an optical fiber in the form of an uplink optical signal, and then transmitted to the core network.
  • the bidirectional wave splitter 202 is used to perform bidirectional wavelength division multiplexing processing on the upstream optical signal and the downstream optical signal according to the wavelength, which can also be called wavelength division multiplexing (wavelength division multiplexing, WDM)+bidirectional (bidirectional, BiDi) )structure.
  • WDM wavelength division multiplexing
  • the wavelength of an uplink optical signal may generally be 1270 nm and/or 1310 nm
  • the wavelength of a downlink optical signal may generally be 1490 nm and/or 1577 nm.
  • the bidirectional demultiplexer 202 may be used to receive an uplink optical signal and transmit the uplink optical signal into an optical fiber.
  • the bidirectional demultiplexer 202 can also be used to receive the downlink optical signal from the optical fiber, and transmit the downlink optical signal to the optical receiver 203 .
  • the data carried by the downlink optical signal may be represented as data sent by other devices when the optical device where the optical transceiver component is located serves as the receiving end.
  • the downlink optical signal after the demultiplexing process by the bidirectional demultiplexer 202 can be received by the optical receiver 203 , and then undergoes photoelectric conversion to obtain the carried data.
  • the bidirectional wave splitter 202 can be fabricated based on an optical waveguide chip, and transmit optical signals through the optical waveguide. Moreover, the bidirectional wave splitter 202 can be coupled to the optical transmitter 201 through the first optical waveguide port, coupled to the optical receiver 203 through the second optical waveguide port, and coupled to the optical fiber through the third optical waveguide port.
  • the bidirectional wave splitter prepared by using the optical waveguide chip can realize the optical signal transceiver function that can be realized by the BOSA structure adopted in the prior art.
  • the optical transceiver assembly based on the bidirectional wave splitter prepared by the optical waveguide chip provided by the present application has the advantages of less difficulty in integration and lower cost.
  • the optical waveguide chip can be a planar lightwave circuit (PLC) chip, and can also be understood as a chip integrated based on PLC technology; or optionally, a silicon-based chip, etc.
  • PLC is a technology used to realize optical waveguide transmission.
  • chips integrated with PLC technology can be realized based on a variety of materials.
  • silicon dioxide is the most widely used material in the market, that is, chips integrated with PLC technology can be based on silicon dioxide materials with low refractive index characteristics as cladding.
  • the optical waveguide with a higher refractive index than the silica cladding is wrapped in the inner layer. In this way, the overflow of the optical signal transmitted through the optical waveguide can be avoided by the silica cladding, thereby avoiding the loss of the energy of the optical signal.
  • the bidirectional wave splitter 202 may include an optical waveguide and a silicon dioxide cladding.
  • the silicon dioxide cladding layer has a characteristic of low refractive index, so that the transmission of optical signals can be ensured, and the power loss of optical signals can be reduced.
  • the optical waveguide can be designed using a directional coupler (direction coupler, DC) structure, a Mach-Zehnder interferometer (mach zehnder interferometer, MZI) structure, or an arrayed waveguide grating (arrayed waveguide grating, AWG) structure.
  • DC direction coupler
  • MZI Mach-Zehnder interferometer
  • AWG arrayed waveguide grating
  • FIG. 3 a it is a schematic structural diagram of an optical transceiver component 200 adopting a DC structure provided by an embodiment of the present application.
  • a DC structure may contain two input ports and two output ports.
  • one of the two input ports of the DC structure is used as the port for injecting uplink optical signals into the optical transceiver assembly 200 by the optical transmitter 201, that is, the first optical waveguide port shown in FIG. 3a, assuming port A; the other input port is used as the port for the optical transceiver assembly 200 to receive downlink optical signals from the optical fiber, that is, the third optical waveguide port shown in FIG. 3 a , which is assumed to be port D.
  • one of the two output ports of the DC structure is used as the port for the optical receiver 203 to receive the downlink optical signal from the optical transceiver assembly 200, that is, the second optical waveguide port shown in FIG. 3a, assumed to be C port; the other output port can be used as a backup port, which can wait for new functions to be discovered, assuming it is port B.
  • FIG. 3 b is a schematic diagram of signal transmission of the optical transceiver assembly using the DC structure provided by the embodiment of the present application.
  • the uplink optical signal injected by the optical transmitter 201 from the A port to the bidirectional demultiplexer 202, after passing through the optical waveguide of the DC structure, can pass through the D The port is transmitted to the optical fiber.
  • the wavelength of the downlink optical signal is 1577nm
  • the downlink optical signal transmitted from the optical fiber at the D port passes through the optical waveguide of the DC structure, it can be transmitted to the optical receiver 203 through the C port for further processing. take over.
  • the optical waveguide of the DC structure can realize the transmission of the 1270nm optical signal from the upper waveguide to the lower waveguide, and can realize the transmission of the 1577nm optical signal from the lower waveguide to the upper waveguide and then to the lower waveguide Therefore, the length of the DC structure can be designed as an optical waveguide within a specified length range, and the optical waveguide within the specified length range can realize the optical signal transmission path as shown in Figure 3b. In this way, the uplink optical signal and the downlink optical signal can be separately processed according to the characteristics of different wavelengths through the DC structure, and then the optical signal transceiving function of the optical transceiver component 200 can be realized.
  • FIG. 3 c it is a schematic structural diagram of an optical transceiver assembly 200 using an MZI structure provided by an embodiment of the present application.
  • the principle of the MZI structure is mainly to construct optical waveguides of different lengths to realize mutual interference of optical signals after transmission through different optical paths, and finally, optical signals of different wavelengths can be output from two different ports respectively.
  • the MZI structure shown in Figure 3c contains two lengths of optical waveguides.
  • the downlink optical signal and the uplink optical signal can be respectively transmitted through two optical waveguides of different lengths in the MZI structure, so that they can be output from different ports, so as to ensure the demultiplexing of the downlink optical signal and the uplink optical signal by the optical transceiver component processing, so as to ensure that the optical transceiver component 200 realizes the optical signal transceiver function.
  • FIG. 3 d it is a schematic structural diagram of an optical transceiver assembly 200 adopting an AWG structure provided by an embodiment of the present application.
  • the AWG structure can be divided into a waveguide array and multiple ports on both sides of the waveguide array. After the optical signal passes through the waveguide array, a certain phase difference can be generated, so that optical signals of different wavelengths can be transmitted from different designated ports. .
  • the AWG structure can be used to input the uplink optical signal from the left port of the waveguide array (that is, the first optical waveguide port introduced in the previous embodiment), and from the waveguide
  • the specified port on the right side of the array outputs an uplink optical signal (that is, the third optical waveguide port introduced in the foregoing embodiments);
  • the third optical waveguide port introduced in the above) and the downlink optical signal is output from the designated port on the left side of the waveguide array (that is, the second optical waveguide port introduced in the foregoing embodiments).
  • the designated port for outputting the uplink optical signal on the right side of the waveguide array can be the same as the port for inputting the downlink optical signal, which can be understood as the third optical waveguide port; while the left side of the waveguide array is the port for inputting the uplink optical signal Different from the port for outputting downlink optical signals, it can be understood as the first optical waveguide port and the second optical waveguide port.
  • the downlink optical signal can be received from a transmission port different from the uplink optical signal, so that the uplink optical signal and the downlink optical signal can be processed separately according to different wavelength characteristics.
  • the light receiver 203 may be, for example, a detector.
  • the detector can generally be realized by an avalanche photodiode (APD).
  • the optical receiver 203 may be used to detect and receive the downlink optical signal.
  • An optical fiber port configured to connect the optical transceiver assembly 200 to an optical fiber, such as the third optical waveguide port shown in FIG. 2 .
  • the optical transceiver assembly 200 may implement optical signal transmission with an optical device such as the optical splitter 100 shown in FIG. 1 through a connected optical fiber.
  • the optical transceiver component 200 provided in the present application may further include a signal amplifier 204 .
  • FIG. 4 it is a schematic structural diagram of another optical transceiver component 200 provided in the embodiment of the present application.
  • the input terminal of the signal amplifier 204 can be connected with the output terminal of the optical receiver 203 .
  • the signal amplifier 204 can generally be realized by a transimpedance amplifier (TIA), and can be used to amplify the downlink optical signal received by the optical receiver 203, so as to ensure the signal gain of the received downlink optical signal.
  • TIA transimpedance amplifier
  • the optical equipment including the optical transceiver assembly 200 may further include a processor and an optical control chip.
  • the processor for example, can be a CPU (Central Processing Unit), and the general implementation form can be a PON media access control (media access control, MAC) chip, which is used to encode the application data and encapsulate it into data conforming to the optical transmission protocol. The message is sent to the light control chip.
  • the optical control chip that is, the driving chip, can receive the data packet sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter 201 to generate an uplink optical signal.
  • the first optical waveguide port and/or the third optical waveguide port introduced in the foregoing embodiments may also be coupled by using a spot-mode converter.
  • the matching of transmitted optical signals between ports with different spot sizes can be realized through the mode-spot converter, so that more accurate coupling between ports of two optical devices can be realized to reduce loss during optical signal transmission.
  • FIG. 5 is a schematic structural diagram of another optical transceiver component 200 provided in an embodiment of the present application.
  • coupling can be realized by a first spot size converter (spot size converter, SSC) 1, the input end of SSC1 can be connected to the optical transmitter 201, and the output end can be connected to the bidirectional wave splitter 202.
  • SSC1 spot size converter
  • SSC1 may be used to convert the spot size of the uplink optical signal output by the optical transmitter 201 into the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port.
  • the speckle converter may be in the shape of a cone or an inverted cone.
  • the SSC1 may be tapered. If the spot size of the uplink optical signal output by the optical transmitter 201 is smaller than the spot size of the uplink optical signal received by the bidirectional wave splitter 202 through the first optical waveguide port, the SSC1 may be an inverted cone.
  • a flip-chip bonding process can also be used for end-face coupling, so as to ensure the transmission power of the optical signal through a simple packaging method.
  • a second speckle-mode converter SSC2 can also be set to achieve coupling, the input end of SSC2 can be connected to the bidirectional wave splitter 202, and the output end of SSC2 can be connected to an optical fiber.
  • the SSC2 may be used to convert the spot size of the uplink optical signal output by the bidirectional wave splitter 202 through the third optical waveguide port into the spot size of the uplink optical signal that the optical fiber can receive.
  • the SSC2 may also be used to convert the spot size of the downlink optical signal transmitted by the optical fiber into the spot size of the downlink optical signal that the bidirectional demultiplexer 202 can receive. Similar to SSC1, SSC2 can also be tapered or inverted tapered, and the specific shape can be designed according to actual needs.
  • the first speckle converter and/or the second speckle converter may also have other shapes, which may be designed according to the actual application scenario of the optical transceiver component.
  • SSC2 may also adopt a structure such as a grating SSC, so as to realize more efficient coupling between the optical fiber and the optical waveguide contained in the bidirectional wave splitter 202 .
  • the input spot size is 4 ⁇ m ⁇ 4 ⁇ m
  • After entering the grating-type SSC it can be gradually converted to 4 ⁇ m ⁇ 10 ⁇ m, and then further converted to 10 ⁇ m ⁇ 10 ⁇ m.
  • the spot size of 4 ⁇ m ⁇ 4 ⁇ m at the input can be converted to the spot size of 10 ⁇ m ⁇ 10 ⁇ m at the output, and the power of the optical signal can be guaranteed.
  • FIG. 6 it is a schematic structural diagram of an optical transceiver component provided by an embodiment of the present application.
  • a grating-type SSC can be designed to convert the spot size of the uplink optical signal output from the bidirectional demultiplexer 202 into the spot size of the uplink optical signal that can be received in the optical fiber.
  • an inclined total reflection surface can also be designed by grinding and polishing technology, so as to realize effective detection and reception of downlink optical signals by the optical receiver 203 .
  • FIG. 7a it is a diagram of optical signal transmission at a second optical waveguide port provided by an embodiment of the present application.
  • the optical receiver 203 can be patched above the bidirectional wave splitter 202, and after the downlink optical signal is reflected by the inclined total reflection surface at the second optical waveguide port, the downlink optical signal can be The light receiver 203 performs active reception.
  • FIG. 7 b is another optical signal transmission diagram at the port of the second optical waveguide provided by the embodiment of the present application.
  • the optical receiver 203 can also be placed between the printed circuit board (PCB) board and the bidirectional wave splitter 202, wherein the PCB board and the bidirectional wave splitter 202 can be supported by a gasket to have a certain space, in this space Used to place the light receiver 203 in.
  • the downlink optical signal can be effectively received by the optical receiver 203 after being reflected by the inclined total reflection surface at the port of the second optical waveguide.
  • the embodiment of the present application also provides an optical device, which may include the optical transceiver component, processor, and optical control chip as introduced in the foregoing embodiments.
  • the processor can be used to encode the application data, encapsulate it into a data message conforming to the optical transmission protocol, and send it to the optical control chip.
  • the optical control chip can receive the data message sent by the processor and convert it into an optical driving signal (analog signal) to drive the optical transmitter contained in the optical transceiver component to generate an uplink optical signal. Since the optical device proposed here includes the optical transceiver component described in the above embodiments, the optical device also has the technical effects of the above optical transceiver component.
  • the word "exemplary” is used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as “example” is not to be construed as preferred or advantageous over other embodiments or designs. Or it can be understood that the use of the word example is intended to present a concept in a specific manner, and does not constitute a limitation to the application.
  • the power of an optical signal may also be referred to as optical power.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un ensemble émetteur-récepteur optique (200), comprenant un émetteur optique (201), un démultiplexeur bidirectionnel (202) et un récepteur optique (203), le démultiplexeur bidirectionnel (202) étant couplé à l'émetteur optique (201) au moyen d'un premier port de guide d'ondes optique, couplé au récepteur optique (203) au moyen d'un deuxième port de guide d'ondes optique, et couplé à une fibre optique au moyen d'un troisième port de guide d'ondes optique ; le démultiplexeur bidirectionnel (202) est préparé en se basant sur une puce de guide d'ondes optique ; l'émetteur optique (201) est utilisé pour produire un signal optique de liaison montante et injecter le signal optique de liaison montante dans le démultiplexeur bidirectionnel (202) ; le démultiplexeur bidirectionnel (202) est utilisé pour transmettre le signal optique de liaison montante à la fibre optique, recevoir un signal optique de liaison descendante de la fibre optique, et transmettre le signal optique de liaison descendante au récepteur optique (203) ; et le récepteur optique (203) est utilisé pour recevoir le signal optique de liaison descendante. L'ensemble émetteur-récepteur optique (200) a une structure simple, et est encapsulé facilement.
PCT/CN2022/100516 2021-06-23 2022-06-22 Ensemble émetteur-récepteur optique WO2022268131A1 (fr)

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CN202110696439.2A CN115508954A (zh) 2021-06-23 2021-06-23 一种光收发组件
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CN115865206A (zh) * 2023-02-23 2023-03-28 深圳市力子光电科技有限公司 光收发组件、组合光模块及光网络设备

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CN101464540A (zh) * 2007-12-19 2009-06-24 中国科学院半导体研究所 混合集成单纤三向器
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CN107294606A (zh) * 2017-07-26 2017-10-24 深圳市傲科光电子有限公司 一种单模光纤双向光收发器
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CN201051158Y (zh) * 2007-07-02 2008-04-23 深圳新飞通光电子技术有限公司 Plc型单纤双向三端口组件
CN101464540A (zh) * 2007-12-19 2009-06-24 中国科学院半导体研究所 混合集成单纤三向器
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