WO2022267973A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022267973A1
WO2022267973A1 PCT/CN2022/099149 CN2022099149W WO2022267973A1 WO 2022267973 A1 WO2022267973 A1 WO 2022267973A1 CN 2022099149 W CN2022099149 W CN 2022099149W WO 2022267973 A1 WO2022267973 A1 WO 2022267973A1
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WIPO (PCT)
Prior art keywords
pressure
circuit
electronic device
sub
resistor
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Ceased
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PCT/CN2022/099149
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English (en)
French (fr)
Inventor
贺逸凡
谭琴
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication of WO2022267973A1 publication Critical patent/WO2022267973A1/zh
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412Digitisers structurally integrated in a display
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0414Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using force sensing means to determine a position
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/045Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means using resistive elements, e.g. a single continuous surface or two parallel surfaces put in contact

Definitions

  • the present application relates to the technical field of electronic equipment products, in particular to an electronic equipment.
  • the existing pressure-sensing modules usually include elastic steel sheets under the screen and deformation resistors respectively arranged on both sides of the elastic steel sheets. In this way, when the user presses the screen, the pop-up steel sheet will be deformed accordingly, which will drive the deformation resistor on one side to be stretched, and the deformation resistor on the other side will be compressed. By calculating the voltage difference between the deformation resistors on both sides of the elastic steel sheet , you can determine the pressure on the screen.
  • the pressure-sensitive module occupies a large thickness space, which is not conducive to the thinning and thinning of electronic equipment. It can be seen that the existing electronic equipment There is a problem that the thickness space occupied by the pressure-sensitive module is relatively large.
  • the present application provides an electronic device, which can solve the problem of a large thickness space occupied by a pressure-sensitive module existing in the existing electronic device.
  • An embodiment of the present application provides an electronic device, including: a rear case, a frame body, a display module, and a pressure-sensitive module, wherein the rear case, the frame body, and the display module are sequentially stacked;
  • the pressure-sensitive module includes a Wheatstone half-bridge circuit, and the Wheatstone half-bridge circuit is arranged on the side of the frame facing the display module;
  • a first groove is formed on a side of the frame body facing the display module, and the Wheatstone half-bridge circuit includes a deformation resistor, and the deformation resistor is connected across the first groove.
  • the frame as the bearing part of the pressure-sensing module, there is no need to provide additional bearing parts for carrying the bridge, which is beneficial to reduce the thickness of the pressure-sensing module.
  • the pressure detection function of the pressure-sensitive module is realized by using the Wheatstone half-bridge circuit. Since the Wheatstone half-bridge circuit is only arranged on one side of the frame, compared with the prior art, it is necessary to separate In terms of arranging the deformation resistors, the thickness space required by the bridge can be reduced, thereby further reducing the thickness of the pressure-sensitive module.
  • Fig. 1 is one of the schematic diagrams of the structure of the pressure-sensitive module arranged in the frame in the embodiment of the present application;
  • Figure 2 is one of the structural schematic diagrams of the connection between the pressure-sensitive module and the frame in the embodiment of the present application
  • Fig. 3 is a schematic diagram of the local structure at the first groove of the frame in the embodiment of the present application.
  • Fig. 4 is a partial cross-sectional view of the connection between the display module, the pressure-sensitive module and the frame in the embodiment of the present application;
  • Fig. 5 is the second structural schematic diagram of the connection between the pressure-sensitive module and the frame in the embodiment of the present application;
  • Fig. 6 is the third schematic diagram of the connection between the pressure-sensitive module and the frame in the embodiment of the present application.
  • Fig. 7 is a schematic diagram of the circuit connection inside the electronic device in the embodiment of the present application.
  • Fig. 8 is the structural representation of Wheatstone half-bridge circuit in the embodiment of the present application.
  • FIG. 9 is the second structural schematic diagram of the arrangement of the pressure-sensitive module in the frame in the embodiment of the present application.
  • an electronic device including: a rear case, a frame body 100, a display module 200 and a pressure-sensitive module 300, the rear case, the frame body 100 and The display modules 200 are sequentially stacked;
  • the pressure-sensitive module 300 includes a Wheatstone half-bridge circuit, and the Wheatstone half-bridge circuit is arranged on the side of the frame body 100 facing the display module 200;
  • a first groove 110 is defined on a side of the frame body 100 facing the display module 200 , and the Wheatstone half-bridge circuit includes a deformation resistor connected across the first groove 110 .
  • the frame body 100 may be a middle frame of an electronic device, and the frame body 100 may be a metal frame body 100 .
  • the pressure-sensitive module 300 can form a pressure-sensitive button of the electronic device, and the user can trigger a corresponding function in the electronic device through the pressure-sensitive button.
  • the pressure-sensitive button can enable the user to turn on the flashlight of the electronic device. In this way, The user can quickly turn on the flashlight function of the electronic device without turning on the screen.
  • the pressure-sensitive button may also be a button for quickly launching a specific application program in the electronic device, which is not limited.
  • the pressing part of the pressure-sensitive module 300 can be directed toward the display module 200, and the pressure-sensitive module 300 It can be attached to the display module 200 .
  • the area where the display module 200 is opposite to the pressure-sensitive module 300 can form the pressing part of the pressure-sensitive module 300, and the user only needs to press the pressing part through the display module 200 to trigger the pressure-sensitive module 300 to correspond.
  • the display module 200 may include a display screen capable of generating deformation, so that the deformation of the display screen may be transmitted to the pressure-sensing module 300, for example, the display screen may be a flexible screen.
  • variable resistor can be a stress-sensing resistor in the prior art.
  • the resistance value of the variable resistor changes accordingly. It can be understood that the deformation amount of the variable resistor and the variable resistor There is a corresponding relationship between the resistance changes.
  • the Wheatstone half-bridge circuit can be powered through the power supply module in the electronic device, so that when the pressure-sensitive module 300 is pressed by the user, the shape of the deformation resistor changes, which in turn leads to the resistance of the deformation resistor. value changes.
  • the pressure on the pressure-sensing module 300 can be determined only by detecting the partial pressure of the deformation resistors, and the corresponding function of the pressure-sensing module 300 can be triggered when the pressure exceeds a preset threshold.
  • the above-mentioned deformation resistor connected across the first groove 110 may refer to: the deformation resistor is attached to the end face of the frame body 100 facing the display module 200, and the deformation resistor straddles the first groove 110.
  • the notch setting of the groove 110 specifically, a first connection point and a second connection point can be set on the side of the frame body 100 facing the display module 200, wherein the first connection point and the The second connection points are respectively located on two opposite sides of the first groove 110 .
  • One end of the variable resistor can be fixedly connected to the first connection point, and at the same time, the other end of the variable resistor can be connected to the second connection point. In this way, when the deformation resistor receives the pressing force transmitted by the display module 200 , it can be deformed toward the first groove 110 .
  • the above-mentioned Wheatstone half-bridge circuit may also include other components besides the deformation resistor, wherein, since other components are deformed, other components may be arranged on the frame body 100 toward the display module. One side of the group 200, and other components are relatively staggered from the first groove 110.
  • the frame body 100 as the load-bearing part of the pressure-sensitive module 300, there is no need to additionally provide a load-bearing part for carrying the bridge, that is, the steel sheet structure in the existing pressure-sensitive module 300 can be eliminated, and there is It is beneficial to reduce the thickness of the pressure-sensing module 300 .
  • the pressure detection function of the pressure-sensitive module 300 is realized by using the Wheatstone half-bridge circuit. Since the Wheatstone half-bridge circuit is only arranged on one side of the frame body 100, compared with the prior art, it is necessary to place the pressure sensor on both sides of the bearing part.
  • the deformation resistors located on the side of the steel sheet away from the pressure sensing module 300 in the existing pressure sensing module 300 can be eliminated, thereby reducing the thickness space required by the bridge to further reduce the The thickness of the pressure-sensitive module 300 is small.
  • the electronic device further includes a target device
  • the frame body 100 includes a reinforcing rib 120 for fixing the target device to the frame body 100, and the first groove 110 Set on the reinforcing rib 120 .
  • the above-mentioned reinforcing rib 120 may be the neck bone position used for installing various functional components in the electronic device in the frame body 100, for example, referring to FIG. 1, the said reinforcing rib 120 may be any one of the following neck bone positions : The first neck bone for installing the front camera, the second neck bone for installing the motor, the third neck bone for installing the rear camera, and the fourth neck bone for installing the battery, where , the first neck bone position, the second neck bone position and the third neck bone position are respectively annular reinforcing ribs located on the side of the frame body 100 facing away from the display module 200, and the fourth neck bone position It is located on the side of the frame body 100 facing away from the display module 200 , and the fourth neck bone position includes two strip-shaped reinforcing ribs arranged in parallel.
  • the first neck bone position can also be set on the side of the frame body 100 facing the display module 200, so as to install the front camera.
  • the target device may be any one of the following devices: a front camera, a motor, a rear camera and a battery.
  • the installation space of the middle frame does not need to be occupied, and therefore, the layout of other components on the middle frame will not be affected.
  • the integrity of the frame body 100 will not be damaged, thereby avoiding the problem of poor stress performance of the frame body 100 caused by opening holes on the frame body 100 .
  • the frame body 100 includes a first support portion 130 and a second support portion 140, and the first support portion 130 and the second support portion 140 are respectively located on two opposite sides of the first groove 110 ;
  • the first end of the variable resistor is connected to the first support part 130, and the second end of the variable resistor is connected to the second support part 140;
  • At least one of the first supporting portion 130 and the second supporting portion 140 is an elastic supporting portion, and the elastic supporting portion can elastically deform towards or away from the display module 200 .
  • the first support portion 130 and the second support portion 140 may respectively form the first connection point and the second connection point in the above embodiment.
  • the above-mentioned elastic support part may be an elastic support part formed by the structure of the frame body 100 itself, or may be an elastic support part formed by disposing elastic pieces on the frame body 100 and formed by the elastic pieces.
  • the elastic support part can generate elastic deformation, and at the same time, since the elastic support part is fixedly connected with the deformation resistor, the elastic support part can drive the deformation resistor to generate deformation while generating deformation.
  • the user can trigger the pressure-sensing module 300 by pressing the part of the display module 200 opposite to the elastic support part, and pressing the part of the display module 200 opposite to the deformation resistor, thereby increasing the sensitivity of the pressure-sensing module 300. area.
  • one end of the elastic support part forms the groove wall of the first groove 110
  • the frame body 100 is provided with strip-shaped slits 150 respectively located on opposite sides of the elastic support part, and the strips The shaped slit 150 communicates with the first groove 110 .
  • strip-shaped slits 150 located on opposite sides of the elastic support part can respectively be provided through the frame body 100 , and the first groove 110 can disconnect the elastic support part close to the first groove.
  • 110 is connected to the frame body 100, so that only one end of the elastic support portion facing away from the first groove 110 is connected to other positions of the frame body 100, so that when the user presses the elastic support portion, the elastic support portion The first end close to the first groove 110 can be deformed on the side facing away from the display module 200 , thereby stretching the deformation resistor, and then triggering the pressure-sensitive module 300 .
  • the first support part 130 and the second support part 140 are the elastic support parts.
  • the user can trigger the first support part 130, the second support part 140 and the deformation resistance.
  • the above-mentioned pressure-sensing module 300 thereby further increasing the sensing area of the pressure-sensing module 300.
  • the electronic device further includes a circuit board, the circuit board includes a power supply terminal 430 and a pressure detection circuit 410, the Wheatstone half-bridge circuit includes an input end and an output end, the power supply terminal 430 is connected to the The input end of the Wheatstone half-bridge circuit is electrically connected, and the pressure detection circuit 410 is electrically connected to the output end of the Wheatstone half-bridge circuit.
  • the above-mentioned power supply terminal 430 can provide a fixed voltage to the Wheatstone half-bridge, the above-mentioned pressure detection circuit 410 can detect the change of the voltage division of each resistor in the Wheatstone half-bridge, and the storage module of the circuit board The corresponding relationship between the magnitude of the pressure received by the pressure-sensing module 300 and the variation of the divided voltage of each resistor in the Wheatstone half-bridge can be stored in advance.
  • the pressure detection circuit 410 can detect the change of the divided voltage of each resistor in the Wheatstone half-bridge, and according to the pressure received by the pressure-sensing module 300 and the Wheatstone Determine the pressure received by the pressure sensing module 300 through the corresponding relationship between the partial pressure changes of the resistors in the half bridge.
  • the function corresponding to the pressure-sensing module 300 is controlled to be turned on and off.
  • variable resistor includes a first variable resistor 310 and a second variable resistor 320, and the first variable resistor 310 and the second variable resistor 320 are respectively connected across the first groove 110;
  • the Wheatstone half-bridge circuit also includes a first fixed value resistor 330 and a second fixed value resistor 340, the first variable resistor 310 is connected in series with the first fixed value resistor 330 to form a first sub-circuit, and the first fixed value resistor 330 is connected in series to form a first sub-circuit.
  • Two variable resistors 320 are connected in series with the second fixed-value resistor 340 to form a second sub-circuit, and the input ends of the first sub-circuit and the input ends of the second sub-circuit are respectively electrically connected to the power supply terminal 430, so The output end of the first sub-circuit and the output end of the second sub-circuit are respectively grounded;
  • the output terminal of the Wheatstone half-bridge circuit includes a first sub-output terminal 350 and a second sub-output terminal 360, and the first sub-output terminal 350 is located between the first variable resistance 310 and the first constant value resistance.
  • the second sub-output terminal 360 is located between the second deformation resistor 320 and the second constant value resistor 340
  • the pressure detection circuit 410 includes a first terminal and a second terminal, the first Among the first terminal and the second terminal, one is electrically connected to the first sub-output terminal 350 , and the other is electrically connected to the second sub-output terminal 360 .
  • the first variable resistors 310 and the second variable resistors 320 are arranged at intervals, and are respectively connected to the first groove 110 .
  • the first sub-output terminal 350 is located between the first variable resistor 310 and the first constant value resistor 330, and the voltage value at both ends of the first sub-circuit is constant, In this way, when the resistance value of any one of the first variable resistor 310 and the first fixed-value resistor 330 changes, the divided voltage of the first variable resistor 310 and the first fixed-value resistor 330 will change accordingly , thereby causing the voltage value of the first sub-output terminal 350 to change accordingly.
  • the second sub-output terminal 360 is located between the second variable resistance 320 and the second fixed value resistance 340, and the voltage value at both ends of the second sub-circuit is constant, so when the When the resistance value of any one of the second variable resistor 320 and the second fixed-value resistor 340 changes, the divided voltage of the second variable resistor 320 and the second fixed-value resistor 340 will change accordingly, thereby causing the The voltage value of the second sub-output terminal 360 changes accordingly. Therefore, by connecting the first terminal and the second terminal of the pressure detection circuit 410 to the first sub-output terminal 350 and the second sub-output terminal 360 respectively, it is convenient to detect the pressure between the first sub-output terminal 350 and the second sub-output terminal 360.
  • the corresponding relationship between the pressure value received by the pressure sensing module 300 and the voltage difference can be pre-stored in the storage module of the circuit board, so that the pressure detection circuit 410 can determine according to the voltage difference The magnitude of the pressure value received by the pressure sensing module 300 .
  • R1 is used to represent the first variable resistor 310
  • R2 is used to represent the second variable resistor 320
  • R3 is used to represent the first fixed-value resistor 330
  • R4 is used to represent the second fixed-value resistor 340.
  • ANN is used to represent the first sub-output terminal 350
  • APN is used to represent the second sub-output terminal 360
  • VS is the power supply voltage of the power supply terminal 430 .
  • VANN VS ⁇ R3/(R1+R3)
  • VANP VS ⁇ R4/(R2+R4)
  • the voltage difference detected by the pressure detection circuit 410 is:
  • the first variable resistor 310, the second variable resistor 320, the first fixed value resistor 330 and the second fixed value resistor 340 are respectively arranged on the same side of the frame body 100, therefore, the Wheatstone half There is no temperature difference between the resistors in the bridge circuit, thereby alleviating the problem of low detection accuracy in the prior art due to the temperature difference between the two opposite sides of the bearing component.
  • there is no temperature difference between the resistors in the Wheatstone half-bridge circuit there is no need to add an additional temperature compensation circuit, which is beneficial to improving the space utilization ratio inside the electronic device.
  • the circuit board further includes a position detection circuit 420 and a control circuit 440, the position detection circuit 420 is used to detect the pressed position of the touch operation received by the display module 200;
  • the pressure detection circuit 410 and the position detection circuit 420 are respectively electrically connected to the control circuit 440;
  • control circuit 440 is configured to correct the detection result of the pressure detection circuit 410 according to the detection result of the position detection circuit 420 .
  • the deformation amount of the deformation resistance may be different, thereby causing the pressure change value detected by the pressure detection circuit 410 to be different, for example , under the same pressing force, the deformation amount of the deformation resistance when the user directly presses the deformation resistance is usually greater than the deformation amount of the deformation resistance when the user presses the first supporting part 130 .
  • the trigger condition of the pressure sensing module 300 is usually that the pressure change detected by the pressure detection circuit 410 reaches a certain threshold, which is referred to as the trigger voltage difference hereinafter. Therefore, when the user acts on other sensing areas other than the deformation resistance , may cause the problem that the pressure-sensitive module 300 cannot be triggered.
  • the position detection circuit 420 is set to detect the user's pressing position, so that different trigger conditions can be set for the pressure sensing module 300 according to different sensing positions, for example, in the pressure sensing In the sensing area of the module 300 , the farther away from the deformation resistor, the smaller the value of the above-mentioned trigger voltage difference can be. Therefore, the sensitivity of the pressure-sensing module 300 is further improved.
  • the electronic device further includes an insulating diaphragm, the insulating diaphragm covers the pressure sensing module 300, and the insulating diaphragm is located on the side of the pressure sensing module 300 facing the display module 200 .
  • the packaging of the pressure-sensing module 300 is achieved by setting an insulating diaphragm, so as to effectively separate the internal components of the pressure-sensing module 300 from other components inside the electronic device.
  • the position of the internal components of the pressure-sensing module 300 can be relatively fixed, preventing the internal components of the pressure-sensing module 300 from detaching from the pressure-sensing module 300 when the user presses the pressure-sensing module 300 .
  • the frame body 100 is provided with at least two first grooves 110 , and each of the first grooves 110 is correspondingly provided with one pressure-sensitive module 300 .
  • the above-mentioned at least two first grooves 110 may be respectively opened on different reinforcing ribs 120 of the frame body 100 .
  • the above-mentioned at least two first grooves 110 may also be opened in other positions of the frame body 100 than the reinforcing ribs 120 .
  • the user can pass through the pressure-sensitive modules 300 at different positions. Trigger the corresponding system functions to meet the pressure sensitivity requirements of different positions of the electronic equipment.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Force Measurement Appropriate To Specific Purposes (AREA)

Abstract

本申请提供一种电子设备,属于电子产品技术领域,所述电子设备包括:后壳、框体、显示模组和压感模组,所述后壳、所述框体和所述显示模组依次层叠设置;所述压感模组包括惠斯通半桥电路,所述惠斯通半桥电路设置于所述框体朝向所述显示模组一侧;所述框体朝向所述显示模组的一侧开设有第一凹槽,所述惠斯通半桥电路包括形变电阻,所述形变电阻跨接于所述第一凹槽。

Description

电子设备
相关申请的交叉引用
本申请主张在2021年06月23日在中国提交的中国专利申请No.202110696576.6的优先权,其全部内容通过引用包含于此。
技术领域
本申请涉及电子设备产品技术领域,具体涉及一种电子设备。
背景技术
随着移动技术的发展,压感模组被逐渐应用于各种电子设备中,并可作为电子设备中的隐藏式压感按键。然而,现有的压感模组通常包括位于屏下的弹性钢片和分别设置于弹性钢片两侧的形变电阻。这样,当用户按压屏幕时,弹出钢片随之产生形变,从而带动其一侧的形变电阻被拉伸,另一侧的形变电阻被压缩,通过计算弹性钢片两侧的形变电阻的电压差,即可确定屏幕所受到的压力值。
然而,采用此种结构,由于弹性钢片以及其两侧压感模组层叠设置,从而导致压感模组占用的厚度空间较大,不利于电子设备的轻薄化,可见,现有的电子设备存在压感模组所占用的厚度空间较大的问题。
发明内容
本申请提供了一种电子设备,可以解决现有的电子设备存在的压感模组所占用的厚度空间较大的问题。
本申请实施例提供了一种电子设备,包括:后壳、框体、显示模组和压感模组,所述后壳、所述框体和所述显示模组依次层叠设置;
所述压感模组包括惠斯通半桥电路,所述惠斯通半桥电路设置于所述框体朝向所述显示模组一侧;
所述框体朝向所述显示模组的一侧开设有第一凹槽,所述惠斯通半桥电路包括形变电阻,所述形变电阻跨接于所述第一凹槽。
本申请实施例中,通过采用框体作为压感模组的承载部件,从而无需额外设置用于承载电桥的承载部件,有利于减小压感模组的厚度。同时,通过采用惠斯通半桥电路实现压感模组的压力检测功能,由于惠斯通半桥电路仅布置于框体的一侧,相对于现有技术中需要在承载部件的两侧分别布置形变电阻而言,可以减小电桥所需占用的厚度空间,从而进一步减小压感模组的厚度。
附图说明
图1是本申请实施例中压感模组布置于框体的结构示意图之一;
图2是本申请实施例中压感模组与框体连接处的结构示意图之一
图3是本申请实施例中框体的第一凹槽处的局部结构示意题图;
图4是本申请实施例中显示模组、压感模组以及框体连接处的局部剖视图;
图5是本申请实施例中压感模组与框体连接处的结构示意图之二;
图6是本申请实施例中压感模组与框体连接处的结构示意图之三;
图7是本申请实施例中电子设备内部的电路连接示意图;
图8是本申请实施例中惠斯通半桥电路的结构示意图;
图9是本申请实施例中压感模组布置于框体的结构示意图之二。
具体实施方式
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域普通技术人员获得的所有其他实施例,都属于本申请保护的范围。
请参见图1-9,为本申请实施例提供的一种电子设备,包括:后壳、框体100、显示模组200和压感模组300,所述后壳、所述框体100和所述显示模组200依次层叠设置;
所述压感模组300包括惠斯通半桥电路,所述惠斯通半桥电路设置于所 述框体100朝向所述显示模组200一侧;
所述框体100朝向所述显示模组200的一侧开设有第一凹槽110,所述惠斯通半桥电路包括形变电阻,所述形变电阻跨接于所述第一凹槽110。
其中,所述框体100可以是电子设备的中框,且所述框体100可以是金属框体100。所述压感模组300可以形成所述电子设备的压感按键,用户可以通过该压感按键触发电子设备中的相应功能,例如,所述压感按键可以用户打开电子设备的手电筒,这样,用户在无需亮屏的情况下,即可快捷打开电子设备的手电筒功能。此外,所述压感按键还可以是快捷启动电子设备中的特定应用程序的按键,对此不作限制。
具体地,由于所述第一凹槽110的开口与所述显示模组200相对,因此,可以将所述压感模组300的按压部朝向显示模组200,且所述压感模组300可以与所述显示模组200相贴合。这样,显示模组200与压感模组300相对的区域即可形成压感模组300的按压部,用户仅需通过显示模组200按压该按压部即可触发所述压感模组300对应的功能。可以理解的是,所述显示模组200可以包括能够产生形变的显示屏,这样,显示屏的形变可以传递至所述压感模组300,例如,所述显示屏可以是柔性屏。
上述形变电阻可以是现有技术中的应力感应电阻,当所述形变电阻的形状发生变化时,所述形变电阻的阻值相应变化,可以理解的是,所述形变电阻的形变量与形变电阻的阻值变化量之间存在对应关系。
具体地,可以通过电子设备中的供电模块向所述惠斯通半桥电路供电,这样,当压感模组300受到用户的按压力时,形变电阻的形状发生变化,进而导致形变电阻的阻值变化。如此,仅需检测形变电阻的分压大小,即可确定压感模组300所受到的压力大小,并在压力大小压力值超过预设阈值的情况下,触发压感模组300对应的功能。
上述形变电阻跨接于所述第一凹槽110可以是指:所述形变电阻贴合所述框体100朝向所述显示模组200一侧的端面,且所述形变电阻跨越所述第一凹槽110的槽口设置,具体地,可以在所述框体100朝向所述显示模组200 的一侧设置第一连接点和第二连接点,其中,所述第一连接点和所述第二连接点分别位于所述第一凹槽110的两相对侧。并可将所述形变电阻的一端与所述第一连接点固定连接,同时,可以将所述形变电阻的另一端与所述第二连接点连接。这样,当所述形变电阻接收到由显示模组200传递的按压力时,可以朝向第一凹槽110内产生形变。
上述惠斯通半桥电路除了包括所述形变电阻之外,还可以包括其他元器件,其中,由于其他元器件产生形变,因此,其他元器件可以布置于所述框体100朝向所述显示模组200的一侧,且其他元器件与所述第一凹槽110相对错开。
该实施方式中,通过采用框体100作为压感模组300的承载部件,从而无需额外设置用于承载电桥的承载部件,即可以取消现有压感模组300中的钢片结构,有利于减小压感模组300的厚度。同时,通过采用惠斯通半桥电路实现压感模组300的压力检测功能,由于惠斯通半桥电路仅布置于框体100的一侧,相对于现有技术中需要在承载部件的两侧分别布置形变电阻而言,即可以取消现有压感模组300中位于钢片远离压感模组300一侧的形变电阻,从而可以减小电桥所需占用的厚度空间,以进一步减小压感模组300的厚度。
可选地,所述电子设备还包括目标器件,所述框体100包括加强筋120,所述加强筋120用于将所述目标器件固定于所述框体100,所述第一凹槽110开设于所述加强筋120。
上述加强筋120可以是框体100中,用于安装电子设备中的各种功能部件的颈骨位,例如,请参见图1,所述加强筋120可以是以下颈骨位中的任意一者:用于安装前置摄像头的第一颈骨位、用于安装马达的第二颈骨位、用于安装后置摄像头的第三颈骨位以及用于安装电池的第四颈骨位,其中,所述第一颈骨位、第二颈骨位和第三颈骨位分别为位于所述框体100背向所述显示模组200一侧的环形加强筋,所述第四颈骨位位于所述框体100背向所述显示模组200的一侧,且所述第四颈骨位包括两个平行设置的条形加强筋。此外,还可以将所述第一颈骨位设置于所述框体100朝向所述显示模组 200的一侧,以安装所述前置摄像头。相应地,所述目标器件可以是以下器件中的任意一者:前置摄像头、马达、后置摄像头和电池。
该实施方式中,通过将第一凹槽110开设于加强筋120,这样,无需占用中框的安装空间,因此,不会影响中框上其他器件的布局。此外,由于无需在框体100上设置开孔,因此,不会破坏框体100的完整性,进而可以避免由于在框体100上开孔而导致框体100的应力性能变差的问题。
可选地,所述框体100包括第一支撑部130和第二支撑部140,所述第一支撑部130和所述第二支撑部140分别位于所述第一凹槽110的两相对侧;
所述形变电阻的第一端与所述第一支撑部130连接,所述形变电阻的第二端与所述第二支撑部140连接;
所述第一支撑部130和所述第二支撑部140中,至少一者为弹性支撑部,所述弹性支撑部可朝向或背对所述显示模组200产生弹性形变。
上述第一支撑部130和所述第二支撑部140可以分别形成上述实施例中的第一连接点和第二连接点。
上述弹性支撑部可以是由框体100自身结构所形成的弹性支撑部,也可以是通过在所述框体100上设置弹片,并由该弹片所形成的弹性支撑部。这样,当用户按压弹性支撑部时,弹性支撑部可以产生弹性形变,同时,由于弹性支撑部与形变电阻固定连接,因此,弹性支撑部在产生形变的同时,可以带动形变电阻产生形变。如此,用户按压显示模组200与弹性支撑部相对的部分、以及按压显示模组200与形变电阻相对的部分均可触发所述压感模组300,从而可以增大压感模组300的感应面积。
可选地,所述弹性支撑部的一端形成所述第一凹槽110的槽壁,所述框体100开设有分别位于所述弹性支撑部相对两侧的条形缝150,且所述条形缝150与所述第一凹槽110连通。
具体地,请参见图5,位于弹性支撑部相对两侧的条形缝150可以分别贯穿所述框体100设置,所述第一凹槽110可以断开所述弹性支撑部靠近第一凹槽110的一端与框体100之间的连接,如此,弹性支撑部仅背对所述第 一凹槽110的一端与框体100其他位置连接,这样,当用户按压弹性支撑部时,弹性支撑部靠近第一凹槽110的第一端可以背对所述显示模组200一侧形变,从而拉伸形变电阻,进而可以触发压感模组300。
可选地,所述第一支撑部130和所述第二支撑部140为所述弹性支撑部。
该实施方式中,通过将所述第一支撑部130和第二支撑部140分别设为所述弹性支撑部,这样,用户可以通过第一支撑部130、第二支撑部140以及形变电阻触发所述压感模组300,从而进一步增大所述压感模组300的感应面积。
可选地,所述电子设备还包括电路板,所述电路板包括供电端子430和压力检测电路410,所述惠斯通半桥电路包括输入端和输出端,所述供电端子430与所述惠斯通半桥电路的输入端电连接,所述压力检测电路410与所述惠斯通半桥电路的输出端电连接。
上述供电端子430可以向所述惠斯通半桥提供固定的电压,上述压力检测电路410可以检测所述惠斯通半桥中各电阻的分压变化情况,并且所述电路板的储存模块中可以预先存储压感模组300接收到的压力大小与惠斯通半桥中各电阻的分压变化情况之间的对应关系。这样,当用户按压压感模组300时,所述压力检测电路410可以检测出惠斯通半桥中各电阻的分压变化情况,并根据压感模组300接收到的压力大小与惠斯通半桥中各电阻的分压变化情况之间的对应关系,确定所述压感模组300所接收到的压力大小,当所述压感模组300所接收到的压力大小超过预设阈值时,控制所述压感模组300所对应的功能启闭。
可选地,所述形变电阻包括第一形变电阻310和第二形变电阻320,所述第一形变电阻310和所述第二形变电阻320分别跨接于所述第一凹槽110;
所述惠斯通半桥电路还包括第一定值电阻330和第二定值电阻340,所述第一形变电阻310与所述第一定值电阻330串联形成第一子电路,所述第二形变电阻320与所述第二定值电阻340串联形成第二子电路,所述第一子电路的输入端和所述第二子电路的输入端分别与所述供电端子430电连接, 所述第一子电路的输出端和所述第二子电路的输出端分别接地;
所述惠斯通半桥电路的输出端包括第一子输出端350和第二子输出端360,所述第一子输出端350位于所述第一形变电阻310与所述第一定值电阻330之间,所述第二子输出端360位于所述第二形变电阻320与所述第二定值电阻340之间,所述压力检测电路410包括第一端子和第二端子,所述第一端子和所述第二端子中,一者与所述第一子输出端350电连接,另一者与所述第二子输出端360电连接。
请参见图2,在本申请一个实施例中,所述第一形变电阻310和第二形变电阻320间隔设置,且分别跨接于所述第一凹槽110。
具体地,请参见图8,由于第一子输出端350位于所述第一形变电阻310和所述第一定值电阻330之间,且所述第一子电路两端的电压值固定不变,这样,当所述第一形变电阻310和所述第一定值电阻330中的任意一者的电阻值发生变化时,第一形变电阻310和第一定值电阻330的分压将随之变化,进而导致所述第一子输出端350的电压值相应变化。相应地,由于第二子输出端360位于所述第二形变电阻320和所述第二定值电阻340之间,且所述第二子电路两端的电压值固定不变,这样,当所述第二形变电阻320和所述第二定值电阻340中的任意一者的电阻值发生变化时,第二形变电阻320和第二定值电阻340的分压将随之变化,进而导致所述第二子输出端360的电压值相应变化。因此,通过将压力检测电路410的第一端子和第二端子分别连接第一子输出端350和第二子输出端360,以便于检测第一子输出端350与第二子输出端360之间的电压差,所述电路板的存储模块中可以预先存储压感模组300所接收到的压力值与所述电压差之间的对应关系,这样,压力检测电路410可以根据所述电压差确定所述压感模组300所接收到的压力值大小。
请参见图8,在本申请一个实施例中,采用R1表示第一形变电阻310,采用R2表示第二形变电阻320,采用R3表示第一定值电阻330,采用R4表示第二定值电阻340,采用ANN表示第一子输出端350,采用APN表示第二子 输出端360,VS为供电端子430的供电电压。当用户按压压感模组300时,R1和R2的阻值变大,R3和R4的阻值不变,此时,第一子输出端350和第二子输出端360处的电压值分别为:
VANN=VS×R3/(R1+R3);
VANP=VS×R4/(R2+R4);
在此情况下,压力检测电路410所检测到的电压差为:
DeltaV=VANN–VANP;
这样,仅需判断电压差是否超过预设的阈值,以确定是否触发压感模组300所对应的功能。
该实施方式中,通过检测第一子输出端350与第二子输出端360之间的电压差,并基于电压差确定压力值,这样,当第一形变电阻310和第二形变电阻320中的任意形变电阻的阻值发生变化时,均会导致所述电压差变化,进而可以提高压感模组300的灵敏性。此外,由于本申请实施例中,第一形变电阻310、第二形变电阻320、第一定值电阻330和第二定值电阻340分别布置于框体100的同一侧,因此,惠斯通半桥电路中的各电阻之间不存在温度差,从而可以缓解了现有技术中,由于布置于承载部件的两相对侧存在温度差,而导致的检测的精度较低的问题。同时,由于惠斯通半桥电路中的各电阻之间不存在温度差,因此,无需额外增设温补电路,有利于提高电子设备内部的空间利用率。
可选地,所述电路板还包括位置检测电路420和控制电路440,所述位置检测电路420用于检测所述显示模组200所接收到的触控操作的按压位置;
所述压力检测电路410和所述位置检测电路420分别与所述控制电路440电连接;
其中,所述控制电路440用于根据所述位置检测电路420的检测结果,对所述压力检测电路410的检测结果进行修正。
具体地,由于用户采用相同的按压力,按压压感模组300的感应区域中的不同位置时,形变电阻的形变量可能不同,进而导致压力检测电路410所 检测到的压力变化值不同,例如,在按压力相同的情况下,用户直接按压形变电阻时形变电阻的形变量,通常大于用于按压第一支撑部130时形变电阻的形变量。而压感模组300的触发条件通常是压力检测电路410检测到的压力变化达到一定的阈值,下文将该阈值称之为触发电压差,因此,用户作用于形变电阻之外的其他感应区域时,可能导致无法触发压感模组300的问题。
基于此,本申请实施例中,通过设置位置检测电路420,用于检测用户的按压位置,这样,可以根据不同的感应位置,为压感模组300设置不同的触发条件,例如,在压感模组300的感应区域中,偏离形变电阻越远,则上述触发电压差的取值可以越小。从而进一步提高压感模组300的灵敏度。
可选地,所述电子设备还包括绝缘隔膜,所述绝缘隔膜覆盖于所述压感模组300,且所述绝缘隔膜位于所述压感模组300朝向所述显示模组200的一侧。
该实施方式中,通过设置绝缘隔膜,实现压感模组300的封装,从而有效的将压感模组300的内部器件与电子设备内部的其他器件隔开。同时,还可以实现压感模组300的内部器件的位置相对固定,防止用户按压压感模组300的过程中,压感模组300的内部器件脱离压感模组300。
可选地,所述框体100开设有至少两个所述第一凹槽110,且每一所述第一凹槽110处均对应设有一个所述压感模组300。
请参见图1,在本申请一个实施例中,上述至少两个第一凹槽110可以分别开设于所述框体100的不同加强筋120上。请参见图9,在本申请另一实施例中,上述至少两个第一凹槽110也可以开设于所述框体100处所述加强筋120之外的其他位置。
该实施方式中,通过在框体100的不同位置设置第一凹槽110,并在每一第一凹槽110处设置一个压感模组300,这样,用户可以通过不同位置压感模组300触发对应的系统功能,以满足电子设备不同位置的压感需求。
需要说明的是,在本文中,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或 者装置不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
通过以上的实施方式的描述,本领域的技术人员可以清楚地了解到上述实施例方法可借助软件加必需的通用硬件平台的方式来实现,当然也可以通过硬件,但很多情况下前者是更佳的实施方式。基于这样的理解,本申请的技术方案本质上或者说对现有技术做出贡献的部分可以以软件产品的形式体现出来,该计算机软件产品存储在一个存储介质(如ROM/RAM、磁碟、光盘)中,包括若干指令用以使得一台电子设备(可以是手机,计算机,服务器,空调器,或者网络设备等)执行本申请各个实施例所述的方法。
上面结合附图对本申请的实施例进行了描述,但是本申请并不局限于上述的具体实施方式,上述的具体实施方式仅仅是示意性的,而不是限制性的,本领域的普通技术人员在本申请的启示下,在不脱离本申请宗旨和权利要求所保护的范围情况下,还可做出很多形式,均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备,包括:后壳、框体、显示模组和压感模组,所述后壳、所述框体和所述显示模组依次层叠设置;
    所述压感模组包括惠斯通半桥电路,所述惠斯通半桥电路设置于所述框体朝向所述显示模组一侧;
    所述框体朝向所述显示模组的一侧开设有第一凹槽,所述惠斯通半桥电路包括形变电阻,所述形变电阻跨接于所述第一凹槽。
  2. 根据权利要求1所述的电子设备,其中,所述电子设备还包括目标器件,所述框体包括加强筋,所述加强筋用于将所述目标器件固定于所述框体,所述第一凹槽开设于所述加强筋。
  3. 根据权利要求1所述的电子设备,其中,所述框体包括第一支撑部和第二支撑部,所述第一支撑部和所述第二支撑部分别位于所述第一凹槽的两相对侧;
    所述形变电阻的第一端与所述第一支撑部连接,所述形变电阻的第二端与所述第二支撑部连接;
    所述第一支撑部和所述第二支撑部中,至少一者为弹性支撑部,所述弹性支撑部可朝向或背对所述显示模组产生弹性形变。
  4. 根据权利要求3所述的电子设备,其中,所述弹性支撑部的一端形成所述第一凹槽的槽壁,所述框体开设有分别位于所述弹性支撑部相对两侧的条形缝,且所述条形缝与所述第一凹槽连通。
  5. 根据权利要求3所述的电子设备,其中,所述第一支撑部和所述第二支撑部为所述弹性支撑部。
  6. 根据权利要求1所述的电子设备,其中,所述电子设备还包括电路板,所述电路板包括供电端子和压力检测电路,所述惠斯通半桥电路包括输入端和输出端,所述供电端子与所述惠斯通半桥电路的输入端电连接,所述压力检测电路与所述惠斯通半桥电路的输出端电连接。
  7. 根据权利要求6所述的电子设备,其中,所述形变电阻包括第一形变电阻和第二形变电阻,所述第一形变电阻和所述第二形变电阻分别跨接于所述第一凹槽;
    所述惠斯通半桥电路还包括第一定值电阻和第二定值电阻,所述第一形变电阻与所述第一定值电阻串联形成第一子电路,所述第二形变电阻与所述第二定值电阻串联形成第二子电路,所述第一子电路的输入端和所述第二子电路的输入端分别与所述供电端子电连接,所述第一子电路的输出端和所述第二子电路的输出端分别接地;
    所述惠斯通半桥电路的输出端包括第一子输出端和第二子输出端,所述第一子输出端位于所述第一形变电阻与所述第一定值电阻之间,所述第二子输出端位于所述第二形变电阻与所述第二定值电阻之间,所述压力检测电路包括第一端子和第二端子,所述第一端子和所述第二端子中,一者与所述第一子输出端电连接,另一者与所述第二子输出端电连接。
  8. 根据权利要求6所述的电子设备,其中,所述电路板还包括位置检测电路和控制电路,所述位置检测电路用于检测所述显示模组所接收到的触控操作的按压位置;
    所述压力检测电路和所述位置检测电路分别与所述控制电路电连接;
    其中,所述控制电路用于根据所述位置检测电路的检测结果,对所述压力检测电路的检测结果进行修正。
  9. 根据权利要求1所述的电子设备,其中,所述电子设备还包括绝缘隔膜,所述绝缘隔膜覆盖于所述压感模组,且所述绝缘隔膜位于所述压感模组朝向所述显示模组的一侧。
  10. 根据权利要求1-9中任意一项所述的电子设备,其中,所述框体开设有至少两个所述第一凹槽,且每一所述第一凹槽处均对应设有一个所述压感模组。
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