WO2022267750A1 - Modeling method and modeling apparatus, and electronic device and storage medium - Google Patents

Modeling method and modeling apparatus, and electronic device and storage medium Download PDF

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WO2022267750A1
WO2022267750A1 PCT/CN2022/093257 CN2022093257W WO2022267750A1 WO 2022267750 A1 WO2022267750 A1 WO 2022267750A1 CN 2022093257 W CN2022093257 W CN 2022093257W WO 2022267750 A1 WO2022267750 A1 WO 2022267750A1
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model
parameters
fitting
target
test data
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PCT/CN2022/093257
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French (fr)
Chinese (zh)
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薛小帝
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海光信息技术股份有限公司
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/36Circuit design at the analogue level
    • G06F30/367Design verification, e.g. using simulation, simulation program with integrated circuit emphasis [SPICE], direct methods or relaxation methods
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation

Definitions

  • Embodiments of the present disclosure relate to a modeling method, a modeling device, electronic equipment, and a storage medium.
  • Integrated circuit performance analysis circuit simulation program (Simulation Program With Integrated Circuits Emphasis, SPICE) is a language simulator software for circuit description and simulation, which can be used to detect the integrity of the connection and function of the circuit, and to predict the performance of the circuit. Behavior. SPICE is currently the most widely used circuit-level simulation program in the device design industry, mainly used for simulation of analog circuits and mixed-signal circuits.
  • At least one embodiment of the present disclosure provides a modeling method, including: obtaining a model library, wherein the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulations generated through simulation Physical parameters; obtaining multiple sets of test data; according to the multiple sets of test data, multiple initial models in the model library, and model parameters and simulated physical parameters of the multiple initial models, based on statistical distribution calculations, the target model is obtained .
  • a set of model parameters included in each initial model includes fitting parameters and candidate parameters, and according to the multiple sets of test data, multiple The initial model and the model parameters and simulation physical parameters of the multiple initial models are calculated based on statistical distribution to obtain the target model, including: based on each set of test data in the multiple sets of test data, from the multiple sets of test data in the model library Multiple fitting models are selected from the initial model, wherein each set of test data corresponds to multiple fitting models, and the simulation physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition; for each set of test data , performing statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and obtaining the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter; corresponding to the multiple sets of test data respectively According to the target physical parameters and the target fitting parameters, from multiple initial Select the candidate model in the model, and use the candidate parameters in the model parameters of the candidate model as the target candidate parameters, so
  • each set of test data includes a plurality of test physical parameters
  • the first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitting model
  • Each corresponding test physical parameter in the test data corresponding to the fitting model is respectively equal, or each of the simulated physical parameters included in the fitting model is the same as the test corresponding to the fitting model
  • the sum of the differences of each corresponding test physical parameter in the data is less than the first threshold.
  • the second condition includes: the simulated physical parameters of the candidate model are equal to the target physical parameters, and the model parameters of the candidate model are The fitting parameters are equal to the target fitting parameters, or each of the fitting parameters in the simulation physical parameters and model parameters of the alternative model is equal to the target physical parameters and the target fitting parameters The sum of the differences of each corresponding parameter is smaller than the second threshold.
  • the statistical distribution calculation includes normal distribution calculation.
  • the distribution calculation to obtain the target model further includes: optimizing the target fitting parameters to update the target fitting parameters.
  • optimizing the target fitting parameters to update the target fitting parameters includes: performing simulation based on the target fitting parameters to obtain a comparative physical parameter; judging whether the similarity between the comparison physical parameter and the multiple sets of test data is greater than the similarity threshold; if the similarity is greater than the similarity threshold, supplement the test data, and recalculate according to the supplemented test data the target fitting parameters to update the target fitting parameters.
  • obtaining the model library includes: defining the values of the model parameters of the original model, and obtaining multiple value combinations based on the values; based on the multiple The combination of values simulates the original model to obtain multiple sets of simulated physical parameters to obtain a model library including the multiple initial models; wherein the multiple value combinations are respectively used as models of the multiple initial models parameter.
  • the original model is simulated based on the multiple value combinations to obtain the multiple sets of simulated physical parameters, so as to obtain the
  • the model library includes: based on the multiple value combinations, using a script file to simulate the original model to obtain the multiple sets of simulated physical parameters, so as to obtain the model library including the multiple initial models.
  • the original model includes a Berkeley Short Channel Insulated Gate Field Effect Transistor SPICE model.
  • the set of model parameters includes at least mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters
  • the set of simulation physical parameters includes at least threshold voltage, effective drive current, and leakage current
  • two of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter are used as the fitting parameters, and the The other one of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter is used as the candidate parameter.
  • the multiple sets of test data are obtained based on a wafer acceptability test or a wafer screening test.
  • the modeling method is used for secondary development of the SPICE model based on the measured characteristics of the product.
  • At least one embodiment of the present disclosure also provides a modeling device, including: a first acquisition unit configured to acquire a model library, wherein the model library includes a plurality of initial models, and each initial model includes a set of model parameters and corresponding A set of simulated physical parameters generated through simulation; the second acquisition unit is configured to acquire multiple sets of test data; the calculation unit is configured to obtain multiple sets of test data, multiple initial models in the model library, and the The model parameters and simulation physical parameters of multiple initial models are calculated based on statistical distribution to obtain the target model.
  • a modeling device including: a first acquisition unit configured to acquire a model library, wherein the model library includes a plurality of initial models, and each initial model includes a set of model parameters and corresponding A set of simulated physical parameters generated through simulation; the second acquisition unit is configured to acquire multiple sets of test data; the calculation unit is configured to obtain multiple sets of test data, multiple initial models in the model library, and the The model parameters and simulation physical parameters of multiple initial models are calculated based on statistical distribution to obtain the target model.
  • a set of model parameters included in each initial model includes fitting parameters and candidate parameters;
  • the calculation unit includes a fitting model determination unit, a first statistical distribution calculation unit, a second statistical distribution calculation unit, and a target model determination unit;
  • the fitting model determination unit is configured to select from multiple initial models in the model library to obtain multiple A fitting model, wherein each set of test data corresponds to a plurality of fitting models, and the simulation physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition;
  • the first statistical distribution calculation unit is configured to, for For each group of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the group of test data, and obtain the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter;
  • the second statistics The distribution calculation unit is configured to perform statistical distribution calculation on the alternative fitting parameters corresponding to the plurality of sets of test data, and obtain the alternative fitting parameters corresponding to the maximum probability value as the target fitting parameter;
  • the target model determination unit configuration In order to select
  • each set of test data includes a plurality of test physical parameters
  • the first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitting model
  • Each corresponding test physical parameter in the test data corresponding to the fitting model is respectively equal, or each of the simulated physical parameters included in the fitting model is the same as the test corresponding to the fitting model
  • the sum of the differences of each corresponding test physical parameter in the data is less than the first threshold.
  • the second condition includes: the simulated physical parameters of the candidate model are equal to the target physical parameters, and the model parameters of the candidate model are The fitting parameters are equal to the target fitting parameters, or each of the fitting parameters in the simulation physical parameters and model parameters of the alternative model is equal to the target physical parameters and the target fitting parameters The sum of the differences of each corresponding parameter is smaller than the second threshold.
  • the calculation unit further includes an optimization unit; the optimization unit is configured to optimize the target fitting parameters, so as to update the target fitting parameters.
  • the optimization unit includes a first subunit, a second subunit, and a third subunit; the first subunit is configured to be based on the target fitting parameter , performing simulation to obtain a comparison physical parameter; the second subunit is configured to determine whether the similarity between the comparison physical parameter and the multiple sets of test data is greater than a similarity threshold; the third subunit is configured to, if If the similarity is greater than the similarity threshold, the test data is supplemented, and the target fitting parameters are recalculated according to the supplemented test data, so as to update the target fitting parameters.
  • At least one embodiment of the present disclosure further provides an electronic device, including the modeling apparatus provided by any embodiment of the present disclosure.
  • At least one embodiment of the present disclosure also provides an electronic device, including: a processor; a memory including one or more computer program modules; wherein the one or more computer program modules are stored in the memory and configured To be executed by the processor, the one or more computer program modules include instructions for implementing the modeling method provided by any embodiment of the present disclosure.
  • At least one embodiment of the present disclosure further provides a storage medium for storing non-transitory computer-readable instructions, and when the non-transitory computer-readable instructions are executed by a computer, the modeling provided by any embodiment of the present disclosure can be realized method.
  • Figure 1 is a flowchart of secondary development of a SPICE model
  • Fig. 2 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure
  • Fig. 3 is a schematic flow chart of step S10 in Fig. 2;
  • FIG. 4 is a schematic flow chart of step S30 in FIG. 2;
  • Fig. 5A is one of the schematic diagrams of statistical distribution calculation in the modeling method provided by some embodiments of the present disclosure.
  • FIG. 5B is the second schematic diagram of statistical distribution calculation in the modeling method provided by some embodiments of the present disclosure.
  • Fig. 6 is a logical schematic diagram of a modeling method provided by some embodiments of the present disclosure.
  • FIG. 7 is a schematic flowchart of another modeling method provided by some embodiments of the present disclosure.
  • FIG. 8 is a schematic flow chart of step S35 in FIG. 7;
  • FIG. 9 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure.
  • Fig. 10 is a schematic diagram of comparing the SPICE model obtained by the modeling method provided by some embodiments of the present disclosure with the original SPICE model and test data;
  • Fig. 11 is a schematic block diagram of a modeling device provided by some embodiments of the present disclosure.
  • Fig. 12 is a schematic block diagram of an electronic device provided by some embodiments of the present disclosure.
  • Fig. 13 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure.
  • Fig. 14 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure.
  • Fig. 15 is a schematic diagram of a storage medium provided by some embodiments of the present disclosure.
  • Figure 1 is a flow chart of the secondary development of a SPICE model.
  • the current secondary development of the SPICE model generally adopts the forward fitting method. That is, the parameters of the SPICE model are manually modified first, and then the physical parameters are generated by the simulator. Compare simulation-generated physical parameters with measured data. If the difference between the physical parameters generated by the simulation and the measured data is large and does not meet the requirements, the SPICE model parameters are manually modified again, and then the physical parameters are obtained through simulation, and the simulated physical parameters are compared with the measured data. At this time, the model parameters are usually modified based on the designer's experience and theoretical judgment.
  • the current SPICE model is a model that matches the actual product characteristics, thus completing the secondary development of the SPICE model.
  • the model parameters are continuously revised based on experience and theoretical judgment, so as to iteratively generate better model parameters to complete the secondary development of the SPICE model.
  • At least one embodiment of the present disclosure provides a modeling method, a modeling device, electronic equipment, and a storage medium.
  • This modeling method can solve the complex and cumbersome and low-efficiency problems of the manual iterative process, can realize the automatic process for the secondary development of the model, can handle a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and The customized secondary development of the model can be completed based on specific scope requirements and test data.
  • At least one embodiment of the present disclosure provides a modeling method.
  • the modeling method includes: obtaining a model library, the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation; obtaining multiple sets of test data; The data, multiple initial models in the model library, and the model parameters and simulation physical parameters of the multiple initial models are calculated based on the statistical distribution to obtain the target model.
  • Fig. 2 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure. As shown in Fig. 2, in some embodiments, the modeling method includes the following operations.
  • Step S10 Obtain a model library, the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation;
  • Step S20 Acquiring multiple sets of test data
  • Step S30 According to multiple sets of test data, multiple initial models in the model library, and model parameters and simulated physical parameters of the multiple initial models, the target model is obtained based on statistical distribution calculation.
  • the established and stored model library can be obtained, or the model library can be directly established in this step.
  • the Berkeley Short-channel IGFET Model (BSIM) can be used to form a model library.
  • the BSIM model is a commonly used SPICE model, which can more accurately simulate transistor performance and calculate various parameters.
  • the model library includes multiple initial models, and the initial model is a BSIM model.
  • Each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation.
  • a set of model parameters may include at least three model parameters, which are respectively a mobility correction parameter, a source-drain channel current correction parameter, and a threshold voltage drift parameter.
  • a set of corresponding simulation physical parameters can be obtained by simulating the model.
  • the set of simulated physical parameters may include at least three simulated physical parameters, which are threshold voltage, effective driving current and leakage current, respectively.
  • A represents a mobility correction parameter
  • B represents a source-drain channel current correction parameter
  • C represents a threshold voltage drift parameter
  • x represents a threshold voltage
  • y represents an effective driving current
  • z represents a leakage current.
  • the values of A, B, and C determine the characteristics of the model, and the parameters x, y, and z that reflect the characteristics of the model can be obtained by simulating the model.
  • different values of A, B, and C correspond to different initial models.
  • the model parameters A, B, and C of different initial models will not be exactly the same, so as to distinguish different initial models.
  • the simulation physical parameters x, y, and z of different initial models may be completely different, partly the same, or completely the same.
  • the modeling object of the SPICE model is not limited to transistors, but can be any device in integrated circuits, chips, etc.
  • the model parameters are not limited to mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters
  • the simulation physical parameters are not limited to threshold voltage, effective drive current, and leakage current.
  • the model parameters and simulation physical parameters are specific The category may be determined according to actual requirements and the type of model used, which is not limited in the embodiments of the present disclosure.
  • the number of a set of model parameters is not limited to 3, but can also be any number such as 2, 4, 5, etc.
  • the number of a set of simulation physical parameters is not limited to 3, and can also be 2, 4, 5, etc. Any number, such as 4, 5, etc., is not limited in the embodiments of the present disclosure.
  • the initial model in the model library is not limited to the BSIM model, and may also be other types of models, which may be determined according to actual requirements, which is not limited in the embodiments of the present disclosure.
  • step S10 may further include the following operations.
  • Step S11 Define the values of the model parameters of the original model, and obtain multiple value combinations based on the values;
  • Step S12 Simulating the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models.
  • the original model can adopt the BSIM model, that is, the Berkeley short-channel insulated gate field-effect transistor SPICE model
  • the model parameters can be mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, That is, A, B, and C described above (the mobility correction parameter is represented by A, the source-drain channel current correction parameter is represented by B, and the threshold voltage drift parameter is represented by C).
  • the respective values of A, B, and C to obtain multiple value combinations, that is, to obtain multiple sets of A, B, and C.
  • the values of A, B, and C determine the model characteristics, so multiple sets of A, B, and C correspond to multiple different models.
  • the values of different groups A, B, and C are not exactly the same, so that the multiple models are different from each other.
  • values can be uniformly selected with a certain step size, thereby obtaining multiple values of A.
  • B and C can also take values evenly with a certain step size within their respective value ranges, so as to obtain multiple B values and multiple C values.
  • Multiple sets of A, B, and C can be obtained by permuting and combining multiple values of A, multiple values of B, and multiple values of C.
  • the value range of A may be 0 ⁇ 1 or 0.7 ⁇ 1.2
  • the value range of B may be 0 ⁇ 1 or 0.7 ⁇ 1.2
  • the value range of C may be -1 ⁇ +1
  • the step size of each value of A, B, and C can be 0.01 or 0.001. It should be noted that the above value range and step size are exemplary rather than restrictive, and the value range and step size can be set according to actual requirements.
  • N1 values of A are obtained, N2 values of B are obtained, and N3 values of C are obtained, the number of combinations of values of A, B, and C that can be obtained is: N1 *N2*N3, where N1, N2, and N3 are all positive integers.
  • the original model is simulated based on multiple value combinations, that is, the above multiple sets of A, B, and C are respectively written into the original model for simulation, thereby obtaining multiple sets of simulated physical parameters.
  • the simulated physical parameters include threshold voltage, effective driving current, and leakage current, namely x, y, and z described above (the threshold voltage is represented by x, the effective driving current is represented by y, and the leakage current is represented by z).
  • Multiple sets of model parameters correspond one-to-one to multiple sets of simulation physical parameters, that is, multiple sets of A, B, and C correspond to multiple sets of x, y, and z.
  • a set of A, B, and C corresponds to a model, and a corresponding set of x, y, and z is obtained through simulation.
  • the script file may be used to simulate the original model based on multiple value combinations, so as to obtain multiple sets of simulated physical parameters, so as to obtain a model library including multiple initial models.
  • the script file may be written in any applicable language, and may also be executed in any applicable order and manner, which is not limited by the embodiments of the present disclosure.
  • Multiple sets of models corresponding to A, B, and C are used as initial models, thereby obtaining a model library including multiple initial models.
  • Multiple value combinations (that is, multiple sets of A, B, and C) are used as model parameters of multiple initial models, each initial model corresponds to a set of model parameters A, B, and C, and each initial model also corresponds to a A set of simulation physical parameters x, y, z generated by simulation.
  • step S20 multiple sets of test data are acquired.
  • the test data may be obtained by testing an actual product, that is, the test data is actually measured data.
  • a set of simulated physical parameters included in the initial model in the model library are threshold voltage, effective drive current, and leakage current
  • a set of test data is the threshold voltage, effective drive current, and leakage current obtained from testing the actual product. current.
  • the parameter category of the test data is the same as that of the simulated physical parameter, thereby facilitating subsequent analysis and calculation. It should be noted that when the simulated physical parameter is a parameter of another category, the type of the test data is also adjusted accordingly, as long as the parameter category of the test data is the same as that of the simulated physical parameter.
  • test data can be obtained based on wafer acceptance test (Wafer Acceptance Test, WAT) or wafer screening test (Wafer Sort, WS).
  • WAT wafer Acceptance Test
  • Wafer Sort wafer screening test
  • the embodiments of the present disclosure are not limited thereto, and other methods may also be used to obtain test data, which may be determined according to actual requirements.
  • step S30 according to multiple sets of test data, multiple initial models in the model library, model parameters and simulated physical parameters of the multiple initial models, the target model is obtained based on statistical distribution calculation.
  • the target model is a SPICE model obtained through secondary development based on the measured characteristics of the product, and the above steps S10 to S30 can realize the secondary development.
  • step S30 may further include the following operations.
  • Step S31 Based on each set of test data in multiple sets of test data, select multiple fitting models from multiple initial models in the model library, each set of test data corresponds to multiple fitting models, and the fitting model corresponding to each set of test data The simulated physical parameters included in the model satisfy the first condition;
  • Step S32 For each group of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the group of test data, and obtain the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter;
  • Step S33 Perform statistical distribution calculation on the candidate fitting parameters respectively corresponding to multiple sets of test data, and obtain the candidate fitting parameters corresponding to the maximum probability value as the target fitting parameters;
  • Step S34 According to the target physical parameters and the target fitting parameters, select a candidate model from a plurality of initial models in the model library, and use the candidate parameters in the model parameters of the candidate model as the target candidate parameters, thereby obtaining the target model.
  • step S31 multiple fitting models are selected from multiple initial models in the model library based on each set of test data, and each set of test data corresponds to multiple fitting models.
  • the selected initial model is referred to as a fitted model.
  • the initial models in the model library can be traversed, and the selection can be made according to whether the simulation physical parameters included in the initial models satisfy the first condition. If the first condition is satisfied, the initial model is selected as the fitting model; if the first condition is not satisfied, the initial model is not selected. By traversing all the initial models in the model library, multiple fitting models corresponding to each set of test data can be selected and obtained.
  • each set of test data includes a plurality of test physical parameters
  • the plurality of test physical parameters are threshold voltage, effective driving current and leakage current obtained from the test respectively.
  • x' represents the threshold voltage obtained by the test
  • y' represents the effective driving current obtained by the test
  • z' represents the leakage current obtained by the test.
  • the above-mentioned first condition may also be: the difference between each simulated physical parameter in the simulated physical parameters included in the fitted model and each corresponding tested physical parameter in the test data corresponding to the fitted model The sum of the values is less than the first threshold. That is, for a set of test data x', y', z', if the sum of the differences between x, y, z and x', y', z' of an initial model is less than the first threshold, ie ( x-x')+(y-y')+(z-z') ⁇ K1, then the initial model is selected as the fitting model corresponding to the set of test data x', y', z'.
  • K1 represents the first threshold
  • the first threshold can be set according to actual needs, and can be set to any value. Since the test data is close to the simulated physical parameters, a large number of fitting models can be obtained in this way, which is conducive to increasing the number of samples for subsequent calculations, and it is easier to obtain results through statistical distribution calculations.
  • a set of model parameters for each initial model (and fitted model) includes fitted parameters and candidate parameters.
  • a set of model parameters includes mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters
  • two of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters are used as pseudo
  • the combination parameter, the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter are used as a candidate parameter.
  • the fitting parameters in a set of model parameters are A and B (ie, the mobility correction parameter and the source-drain channel current correction parameter), and the candidate parameter is C (ie, the threshold voltage drift parameter).
  • step S32 for each set of test data, statistical distribution calculation is performed on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and the fitting parameter corresponding to the maximum probability value is obtained as an alternative fitting parameter.
  • this step executes the first statistical distribution calculation in the modeling method, and the fitting parameter corresponding to the maximum probability value may refer to the fitting parameter with the highest distribution proportion.
  • a set of test data corresponds to multiple fitting models, and the fitting parameters A and B among the model parameters of these fitting models are calculated for statistical distribution, so as to obtain the fitting parameters A and B corresponding to the maximum probability value, and the are called alternative fitting parameters.
  • the fitting parameters A and B are calculated as a two-dimensional array.
  • the normal distribution calculation can be performed on multiple sets of fitting parameters A and B, so as to obtain a set of fitting parameters A and B corresponding to the maximum probability value as an alternative fitting parameter.
  • alternative fitting parameters corresponding to each set of test data can be obtained, thereby obtaining multiple sets of alternative fitting parameters.
  • the way to select and obtain the fitted model is not limited to the one described above, and the following ways can also be used.
  • Figure 5A shows two fitted models, Fitted Model-1 and Fitted Model-2.
  • fitting parameters A, B among the model parameters A, B, and C of the fitting model For example, one set of fitting parameters is A2, B2, another set of fitting parameters is A3, B7, of course, there are other fitting parameters, which are not shown in Fig. 5A.
  • the fitting parameters corresponding to the maximum probability value can be obtained, which are called alternative fitting parameters.
  • the alternative fitting parameters are A2, B2.
  • step S33 the statistical distribution calculation is performed on the candidate fitting parameters respectively corresponding to multiple sets of test data, so as to obtain the candidate fitting parameter corresponding to the maximum probability value as the target fitting parameter.
  • this step executes the second statistical distribution calculation in the modeling method, and the candidate fitting parameter corresponding to the maximum probability value may refer to the candidate fitting parameter with the highest distribution proportion. Since the corresponding candidate fitting parameters are calculated for each set of test data in step S32, multiple sets of candidate fitting parameters can be obtained for multiple sets of test data. Statistical distribution calculations are performed on multiple sets of candidate fitting parameters, so that the candidate fitting parameters corresponding to the maximum probability value can be obtained, which are called target fitting parameters.
  • the alternative fitting parameters A, B are calculated as a two-dimensional array.
  • the normal distribution calculation can be performed on multiple sets of alternative fitting parameters A and B, so as to obtain a set of alternative fitting parameters A' and B' corresponding to the maximum probability value as the target fitting parameters.
  • a set of A' and B' can be finally obtained, which are the target fitting parameters.
  • these candidate fitting parameters After calculating corresponding candidate fitting parameters for N groups of test data (such as test data_1 to test data_N), these candidate fitting parameters Perform the statistical distribution calculation again.
  • N is a positive integer.
  • the alternative fitting parameters corresponding to test data_1 are A2, B2, the alternative fitting parameters corresponding to test data_2 are A3, B2, and the alternative fitting parameters corresponding to test data_N-1 are A2, B2, the alternative fitting parameters corresponding to the test data_N are A6 and B6, and the alternative fitting parameters corresponding to other test data are not shown in FIG. 5B.
  • the candidate fitting parameters corresponding to the maximum probability value can be obtained, which are called target fitting parameters.
  • the alternative fitting parameters A, B are calculated as a two-dimensional array.
  • the normal distribution calculation may be performed on multiple sets of candidate fitting parameters, so as to obtain a set of candidate fitting parameters corresponding to the maximum probability value as the target fitting parameters.
  • a set of target fitting parameters can be obtained, that is, a unique set of A' and B' can be obtained.
  • a candidate model is selected from a plurality of initial models in the model library, and the candidate parameters in the model parameters of the candidate model are As the target candidate parameters, the target model is obtained.
  • the target physical parameters also include threshold voltage, effective driving current, and leakage current.
  • the values of each parameter in the target physical parameters are preset values, which can be determined according to actual needs, such as the product requirements that need to be met or satisfied , which is not limited by the embodiments of the present disclosure.
  • x" represents the threshold voltage in the target physical parameter
  • y" represents the effective driving current in the target physical parameter
  • z" represents the leakage current in the target physical parameter.
  • the target fitting parameter is a value obtained in the above step S33 Group A', B'.
  • the selected initial model is referred to as a candidate model.
  • the initial model in the model library can be traversed, and the selection can be made according to whether the simulation physical parameters included in the initial model and the fitting parameters in the model parameters meet the second condition, that is, according to x, y, z, A, The selection is made based on whether the value of B satisfies the second condition. If the second condition is met, the initial model is selected as an alternative model; if the second condition is not met, the initial model is not selected.
  • the above-mentioned second condition may also be: each of the simulation physical parameters and the fitting parameters of the model parameters of the alternative model corresponds to each of the target physical parameters and the target fitting parameters
  • the sum of the differences of the parameters is smaller than the second threshold. That is, if the sum of the differences between x, y, z, A, B and x", y", z", A', B' of an initial model is less than the second threshold, that is, (x-x")+ (y-y")+(z-z")+(A-A')+(B-B') ⁇ K2, the initial model is selected as an alternative model.
  • K2 represents the second threshold
  • the second threshold can be set according to actual needs, and can be set to any value. Since the above-mentioned corresponding parameters are relatively close to each other, it is easier to obtain an alternative model in this way, which is conducive to obtaining the final result.
  • the candidate model can be obtained directly through the above method.
  • the target fitting parameters obtained in step S33 can also be optimized, and an alternative model can be obtained according to the optimized target fitting parameters. The optimization of the target fitting parameters will be described later, here I won't repeat them here.
  • a candidate parameter among the model parameters of the candidate model can be obtained, such as a threshold voltage drift parameter among the model parameters of the candidate model, and used as a target candidate parameter, denoted by C'.
  • the aforementioned target fitting parameters A', B' and the target candidate parameter C' obtained here are taken as a set of model parameters, and the model corresponding to the set of model parameters A', B', and C' is the target model.
  • the model parameters of the target model include target fitting parameters A', B' and target candidate parameters C'.
  • the target model with model parameters A', B', and C' can be obtained.
  • the target model is a model obtained by secondary development of the SPICE model based on the measured characteristics of the product, thus completing the secondary SPICE model. develop.
  • the target model matches the actual product characteristics, which is helpful for failure analysis and new product design.
  • the modeling method provided by the embodiments of the present disclosure is used for secondary development of the SPICE model based on the measured characteristics of the product, which can solve the problem of complex and cumbersome manual iteration process and low efficiency, and can realize the automated process for the secondary development of the model.
  • the process can be calculated automatically without human intervention or based on the experience and judgment of the designer.
  • the modeling method can handle a large amount of test data, and has high processing efficiency, fast processing speed and high accuracy.
  • the customized secondary development of the model can be completed based on specific range requirements and test data, so that the obtained model can well reflect the product characteristics within the limited test data range.
  • This modeling method incorporates the idea of neural network. Different from the traditional manual iterative method, this modeling method uses the model library as the sample set of the neural network, adopts the method of simulation traversal and combined with the neural network to strengthen learning, forms an automatic process, and converts the SPICE model problem into a neural network problem, by This improves modeling efficiency and accuracy.
  • this modeling method uses the model library as the sample set of the neural network, adopts the method of simulation traversal and combined with the neural network to strengthen learning, forms an automatic process, and converts the SPICE model problem into a neural network problem, by This improves modeling efficiency and accuracy.
  • the model parameter layer that is, the aforementioned A, B, C
  • the simulation layer that is, the simulator
  • the physical layer that is, the aforementioned x, y, z
  • Fig. 7 is a schematic flowchart of another modeling method provided by some embodiments of the present disclosure.
  • the modeling method may further include step S35.
  • Steps S31-S34 in the modeling method are basically the same as steps S31-S34 shown in FIG. 4, where No longer.
  • Step S35 Optimizing the target fitting parameters to update the target fitting parameters.
  • step S35 the target fitting parameters are optimized, and the updated target fitting parameters are used in the operation of selecting a candidate model in the subsequent step S34.
  • step S35 may further include the following operations.
  • Step S351 Based on the target fitting parameters, perform simulation to obtain comparison physical parameters
  • Step S352 judging whether the similarity between the compared physical parameters and multiple sets of test data is greater than the similarity threshold
  • Step S353 If the similarity is greater than the similarity threshold, supplement the test data, and recalculate the target fitting parameters according to the supplemented test data, so as to update the target fitting parameters.
  • step S351 according to the target fitting parameters (the aforementioned A', B'), the emulator is used to perform simulation to obtain the comparison physical parameters, and the comparison physical parameters include, for example, threshold voltage (indicated by x"'), effective Drive current (denoted by y"') and leakage current (denoted by z"').
  • the simulation C in the model parameters is uncertain, so multiple values of C can be used to match the target fitting parameter A ', B', so as to simulate the values of each C separately, thus obtaining multiple sets of physical parameters for comparison.
  • step S352 it is judged whether the similarity between the compared physical parameter and multiple sets of test data is greater than a similarity threshold. For example, there are multiple groups of physical parameters compared, corresponding to different C values. For different C values, judge whether the group of comparison physical parameters is the same or similar to the test data obtained under the same C value, so as to judge whether the comparison physical parameters are within the value range of C and the test data of multiple groups as a whole Whether the similarity on is greater than the similarity threshold.
  • the similarity threshold may be set according to actual requirements, for example, according to the similarity that needs to be achieved, which is not limited in the embodiments of the present disclosure.
  • comparing the similarity between a physical parameter and multiple sets of test data can be defined in various ways.
  • physical parameters can be fitted to obtain the first fitting curve
  • multiple sets of test data can be fitted to obtain the second fitting curve
  • the first fitting curve and the second fitting curve can be judged.
  • the sum of the difference values or the variance of the difference values of the fitting curve within the preset range is used as the similarity.
  • the sum of differences between multiple sets of comparison physical parameters and multiple sets of test data may be calculated respectively, and then the sum of differences may be used as the similarity.
  • the larger the value of the similarity the greater the difference between the comparison physical parameters and the test data
  • the similarity value the smaller the difference between the comparison physical parameters and the test data .
  • the definition of the similarity between the comparison physical parameters and the test data can be determined according to the data type and actual needs, as long as it can reflect the similarity between the comparison physical parameters and the test data, the implementation of the present disclosure Examples are not limited to this. According to different definition methods, the numerical value of the similarity degree and the difference between the comparison physical parameters and the test data can be positively correlated or negatively correlated, which is determined by the definition method of the similarity degree.
  • step S353 if the similarity is greater than the similarity threshold, the test data is supplemented, and the target fitting parameters are recalculated according to the supplemented test data, so as to update the target fitting parameters.
  • the similarity is greater than the similarity threshold, it means that the comparison physical parameters are quite different from the test data, so it is necessary to optimize the target fitting parameters A' and B'.
  • the test data can be supplemented, that is, the sample size of the test data is increased, and then the target fitting parameters are recalculated through two statistical distribution calculations in steps S32 and S33, thereby updating the target fitting parameters.
  • step S34 may be directly executed, that is, the candidate model is selected directly using the updated target fitting parameters.
  • steps S351 and S352 can also be executed again based on the updated target fitting parameters. If the similarity does not meet the requirements, then continue to supplement the test data, update the target fitting parameters again, and stop updating the target fitting parameters until the similarity meets the requirements. combined parameters.
  • the feedback method can be used to obtain more accurate target fitting parameters, thereby improving the accuracy of calculation and facilitating the subsequent acquisition of a more accurate target model.
  • Fig. 9 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure.
  • the specific execution process of the modeling method is as follows. First, define the parameters of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters (such as the aforementioned A, B, and C) in the model parameters, and prepare the original model (such as the BSIM model). Then, the simulation traverses (that is, the simulation is performed sequentially for multiple value combinations of A, B, and C) to generate a model library. Next, obtain WAT or WS test data (such as the aforementioned x', y', z') as training sample values.
  • WAT or WS test data such as the aforementioned x', y', z'
  • the first statistical distribution calculation is performed, that is, the aforementioned step S32 is executed to obtain multiple sets of candidate fitting parameters respectively corresponding to each set of test data.
  • perform the second statistical distribution calculation that is, execute the aforementioned step S33 to obtain a set of target fitting parameters (such as the aforementioned A', B').
  • write parameter verification is performed based on the target fitting parameters, that is, it is judged whether the similarity between the comparison physical parameters obtained according to the target fitting parameters and multiple sets of test data meets the requirements. If the requirements are not met, continue to supplement the WAT or WS test data, and then calculate again to obtain the updated target fitting parameters. If the requirements are met, based on the target fitting parameters and in conjunction with the target physical parameters, the candidate model is selected in the model library, thereby obtaining the candidate parameters in the model parameters of the candidate model as the target candidate parameters (such as the aforementioned C ').
  • the target fitting parameters and target candidate parameters together form a new set of model parameters A', B', and C', and the model corresponding to this set of model parameters is the target model, that is, the SPICE model obtained from the secondary development , just export the SPICE model.
  • Fig. 10 is a schematic diagram of comparing the SPICE model obtained by the modeling method provided by some embodiments of the present disclosure with the original SPICE model and test data.
  • the original SPICE model is obtained based on theoretical design, for example, and its performance deviates greatly from the actual test data of the product.
  • the SPICE model obtained by using the modeling method provided by the embodiments of the present disclosure is a SPICE model obtained by secondary development. It can be seen that the model has a high degree of agreement with the test data and can more accurately reflect the characteristics of the actual product.
  • modeling method provided by the embodiment of the present disclosure is not limited to the steps described above, and may further include more steps.
  • the execution sequence of the various steps is not limited, although the above described various steps in a specific order, this does not constitute a limitation to the embodiments of the present disclosure.
  • At least one embodiment of the present disclosure further provides a modeling device.
  • the modeling device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and The customized secondary development of the model can be completed based on specific scope requirements and test data.
  • Fig. 11 is a schematic block diagram of a modeling device provided by some embodiments of the present disclosure.
  • the modeling device 100 includes a first acquisition unit 110 , a second acquisition unit 120 , and a calculation unit 130 .
  • the modeling device 100 can be used for secondary development of the SPICE model based on the measured characteristics of the product.
  • the first obtaining unit 110 is configured to obtain a model library.
  • the model library includes multiple initial models, and each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation.
  • the first obtaining unit 110 may execute step S10 of the modeling method as shown in FIG. 2 .
  • the second acquiring unit 120 is configured to acquire multiple sets of test data.
  • the second acquiring unit 120 may execute step S20 of the modeling method as shown in FIG. 2 .
  • the calculation unit 130 is configured to obtain the target model based on statistical distribution calculation according to multiple sets of test data, multiple initial models in the model library, model parameters and simulated physical parameters of the multiple initial models.
  • the computing unit 130 may execute step S30 of the modeling method as shown in FIG. 2 .
  • the first acquisition unit 110, the second acquisition unit 120, and the calculation unit 130 may be hardware, software, firmware, or any feasible combination thereof.
  • the first acquisition unit 110, the second acquisition unit 120, and the calculation unit 130 may be dedicated or general-purpose circuits, chips or devices, or may be a combination of processors and memories.
  • the embodiment of the present disclosure does not limit it.
  • each unit of the modeling device 100 corresponds to each step of the aforementioned modeling method.
  • the specific functions of the modeling device 100 please refer to the relevant description of the modeling method above. I won't repeat them here.
  • the components and structures of the modeling device 100 shown in FIG. 11 are exemplary rather than limiting, and the modeling device 100 may also include other components and structures as required.
  • each initial model includes a set of model parameters including fitted parameters and candidate parameters.
  • the calculation unit 130 includes a fitting model determination unit, a first statistical distribution calculation unit, a second statistical distribution calculation unit, and a target model determination unit.
  • the fitting model determination unit is configured to select and obtain a plurality of fitting models from a plurality of initial models in the model library based on each set of test data in the plurality of sets of test data.
  • Each set of test data corresponds to multiple fitting models, and the simulated physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition.
  • each set of test data includes multiple test physical parameters.
  • the first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitted model is equal to each corresponding tested physical parameter in the test data corresponding to the fitted model, or, the simulated physical parameters included in the fitted model The sum of the differences between each simulation physical parameter among the parameters and each corresponding test physical parameter in the test data corresponding to the fitting model is less than the first threshold.
  • the first statistical distribution calculation unit is configured to, for each set of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and obtain the fitting parameter corresponding to the maximum probability value as a backup choose fitting parameters.
  • the second statistical distribution calculation unit is configured to perform statistical distribution calculation on the candidate fitting parameters respectively corresponding to multiple sets of test data, and obtain the candidate fitting parameter corresponding to the maximum probability value as the target fitting parameter.
  • the target model determination unit is configured to select a candidate model from multiple initial models in the model library according to the target physical parameters and target fitting parameters, and use the candidate parameters in the model parameters of the candidate model as target candidate parameters, thereby obtaining target model.
  • the simulation physical parameters of the candidate model and fitting parameters in the model parameters satisfy the second condition, and the model parameters of the target model include target fitting parameters and target candidate parameters.
  • the second condition includes: the simulation physical parameters of the alternative model are equal to the target physical parameters, and the fitting parameters in the model parameters of the alternative model are equal to the target fitting parameters, or, the simulation physical parameters of the alternative model and the model parameters The sum of the differences between each of the fitting parameters and the target physical parameter and each corresponding parameter of the target fitting parameters is less than a second threshold.
  • the above statistical distribution calculation includes normal distribution calculation.
  • computing unit 130 also includes an optimization unit.
  • the optimization unit is configured to optimize the target fitting parameters to update the target fitting parameters.
  • the optimization unit further includes a first subunit, a second subunit and a third subunit.
  • the first subunit is configured to perform simulation based on the target fitting parameters to obtain the comparison physical parameters.
  • the second subunit is configured to judge whether the similarity between the compared physical parameter and multiple sets of test data is greater than a similarity threshold.
  • the third subunit is configured to supplement the test data in response to the similarity being greater than the similarity threshold, and recalculate the target fitting parameters according to the supplemented testing data, so as to update the target fitting parameters.
  • the first acquisition unit 110 includes a definition unit and a simulation unit.
  • the definition unit is configured to define values of model parameters of the original model, and obtain multiple value combinations based on the values.
  • the simulation unit is configured to simulate the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models. For example, multiple value combinations are respectively used as model parameters of multiple initial models.
  • the simulation unit is further configured to use a script file to simulate the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models.
  • the original model includes the Berkeley Short Channel Insulated Gate Field Effect Transistor SPICE model, also known as the BSIM model.
  • a set of model parameters at least includes mobility correction parameters, source-drain channel current correction parameters and threshold voltage drift parameters
  • a set of simulation physical parameters at least includes threshold voltage, effective driving current and leakage current. Two of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters are used as fitting parameters, and the other one of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters is used as a candidate parameter .
  • multiple sets of test data are obtained based on wafer acceptability testing or wafer screening testing.
  • At least one embodiment of the present disclosure further provides an electronic device.
  • the electronic device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and can Complete the customized secondary development of the model based on specific scope requirements and test data.
  • Fig. 12 is a schematic block diagram of an electronic device provided by some embodiments of the present disclosure.
  • the electronic device 200 includes a modeling device 210 .
  • the modeling device 210 may be the modeling device 100 shown in FIG. 11 .
  • At least one embodiment of the present disclosure also provides an electronic device, the electronic device includes a processor and a memory, one or more computer program modules are stored in the memory and configured to be executed by the processor, one or more computer programs The program modules are used to realize the modeling method provided by any embodiment of the present disclosure.
  • the electronic device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and can Complete the customized secondary development of the model based on specific scope requirements and test data.
  • Fig. 13 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure.
  • the electronic device 300 includes a processor 310 and a memory 320 .
  • Memory 320 is used to store non-transitory computer readable instructions (eg, one or more computer program modules).
  • the processor 310 is configured to execute non-transitory computer-readable instructions, and when the non-transitory computer-readable instructions are executed by the processor 310, one or more steps in the modeling method described above may be performed.
  • the memory 320 and the processor 310 may be interconnected by a bus system and/or other forms of connection mechanisms (not shown).
  • the processor 310 may be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), or other forms of processing units having data processing capabilities and/or program execution capabilities, such as field programmable Gate array (FPGA), etc.; for example, the central processing unit (CPU) can be X86 or ARM architecture, etc.
  • the processor 310 can be a general-purpose processor or a special-purpose processor, and can control other components in the electronic device 300 to perform desired functions.
  • memory 320 may include any combination of one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or nonvolatile memory.
  • the volatile memory may include random access memory (RAM) and/or cache memory (cache), etc., for example.
  • Non-volatile memory may include, for example, read only memory (ROM), hard disks, erasable programmable read only memory (EPROM), compact disc read only memory (CD-ROM), USB memory, flash memory, and the like.
  • One or more computer program modules can be stored on the computer-readable storage medium, and the processor 310 can run one or more computer program modules to realize various functions of the electronic device 300 .
  • Various application programs, various data, and various data used and/or generated by the application programs can also be stored in the computer-readable storage medium.
  • Fig. 14 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure.
  • the electronic device 400 is, for example, suitable for implementing the modeling method provided by the embodiment of the present disclosure.
  • the electronic device 400 may be a terminal device or a server. It should be noted that the electronic device 400 shown in FIG. 14 is only an example, which does not impose any limitation on the functions and application scope of the embodiments of the present disclosure.
  • the electronic device 400 may include a processing device (such as a central processing unit, a graphics processing unit, etc.) Various appropriate actions and processes are executed by programs in the memory (RAM) 43 .
  • RAM 43 various programs and data necessary for the operation of the electronic device 400 are also stored.
  • the processing device 41, the ROM 42, and the RAM 43 are connected to each other by a bus 44.
  • An input/output (I/O) interface 45 is also connected to the bus 44 .
  • the following devices can be connected to the I/O interface 45: input devices 46 including, for example, a touch screen, touchpad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; including, for example, a liquid crystal display (LCD), speaker, vibration an output device 47 such as a computer; a storage device 48 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 49.
  • the communication means 49 may allow the electronic device 400 to communicate with other electronic devices wirelessly or by wire to exchange data.
  • FIG. 14 shows electronic device 400 having various means, it should be understood that it is not required to implement or have all of the means shown, and electronic device 400 may alternatively implement or have more or fewer means.
  • the modeling method shown in FIG. 2 can be implemented as a computer software program.
  • embodiments of the present disclosure include a computer program product including a computer program carried on a non-transitory computer readable medium, the computer program including program code for executing the above-mentioned modeling method.
  • the computer program may be downloaded and installed from the network via the communication means 49, or installed from the storage means 48, or installed from the ROM 42.
  • the processing device 41 When the computer program is executed by the processing device 41, the functions defined in the modeling method provided by the embodiments of the present disclosure can be realized.
  • At least one embodiment of the present disclosure further provides a storage medium for storing non-transitory computer-readable instructions.
  • the modeling method provided by any embodiment of the present disclosure can be implemented. .
  • Using this storage medium can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, realize the automated process for the secondary development of the model, and be able to process a large amount of test data with high processing efficiency, fast processing speed, and high accuracy. And the customized secondary development of the model can be completed based on specific scope requirements and test data.
  • Fig. 15 is a schematic diagram of a storage medium provided by some embodiments of the present disclosure. As shown in FIG. 15 , the storage medium 500 is used to store non-transitory computer readable instructions 510 . For example, one or more steps in the modeling method described above may be performed when the non-transitory computer readable instructions 510 are executed by a computer.
  • the storage medium 500 can be applied to the above-mentioned electronic devices.
  • the storage medium 500 may be the memory 320 in the electronic device 300 shown in FIG. 13 .
  • the storage medium 500 for related descriptions about the storage medium 500, reference may be made to the corresponding description of the memory 320 in the electronic device 300 shown in FIG. 13 , which will not be repeated here.

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Abstract

A modeling method and a modeling apparatus, and an electronic device and a storage medium. The modeling method comprises: acquiring a model base, wherein the model base comprises a plurality of initial models, and each initial model comprises a group of model parameters and a corresponding group of simulated physical parameters, which are generated through simulation; acquiring a plurality of groups of test data; and obtaining a target model on the basis of a statistical distribution calculation and according to the plurality of groups of test data, the plurality of initial models in the model base, and the model parameters and simulated physical parameters of the plurality of initial models. By means of the modeling method, the problems of a manual iteration process being complex and tedious and having relatively low efficiency can be solved, an automatic process for secondary development of a model can be realized, a large amount of test data can be processed, with the processing efficiency, the processing speed and the accuracy being high, and a customized secondary development of the model can be completed on the basis of specific range requirements and the test data.

Description

建模方法及建模装置、电子设备及存储介质Modeling method and device, electronic device and storage medium
本申请要求于2021年06月25日递交的中国专利申请第202110713138.6号的优先权,在此出于所有目标全文引用上述中国专利申请公开的内容以作为本申请的一部分。This application claims the priority of Chinese patent application No. 202110713138.6 submitted on June 25, 2021, and the content disclosed in the above Chinese patent application is quoted in full for all purposes as a part of this application.
技术领域technical field
本公开的实施例涉及一种建模方法及建模装置、电子设备及存储介质。Embodiments of the present disclosure relate to a modeling method, a modeling device, electronic equipment, and a storage medium.
背景技术Background technique
集成电路性能分析电路模拟程序(Simulation Program With Integrated Circuits Emphasis,SPICE)是一种用于电路描述与仿真的语言仿真器软件,可用于检测电路的连接和功能的完整性,以及用于预测电路的行为。SPICE是目前器件设计行业中应用最为普遍的电路级模拟程序,主要用于模拟电路和混合信号电路的仿真。Integrated circuit performance analysis circuit simulation program (Simulation Program With Integrated Circuits Emphasis, SPICE) is a language simulator software for circuit description and simulation, which can be used to detect the integrity of the connection and function of the circuit, and to predict the performance of the circuit. Behavior. SPICE is currently the most widely used circuit-level simulation program in the device design industry, mainly used for simulation of analog circuits and mixed-signal circuits.
发明内容Contents of the invention
本公开至少一个实施例提供一种建模方法,包括:获取模型库,其中,所述模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;获取多组测试数据;根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。At least one embodiment of the present disclosure provides a modeling method, including: obtaining a model library, wherein the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulations generated through simulation Physical parameters; obtaining multiple sets of test data; according to the multiple sets of test data, multiple initial models in the model library, and model parameters and simulated physical parameters of the multiple initial models, based on statistical distribution calculations, the target model is obtained .
例如,在本公开一实施例提供的建模方法中,每个初始模型所包括的一组模型参数包括拟合参数和候选参数,根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到所述目标模型,包括:基于所述多组测试数据中每组测试数据从所述模型库的多个初始模型中选择得到多个拟合模型,其中,每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件;对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数;对所述多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数;根据目标物理参数和所述目标拟合参数,从所述模型库的多个初始模型中选择得到备选模型,并将所述备选模型的模型参数中的候选参数作为目标候选参数,从而得到所述目标模型;其中,所述备选模型的仿真物理参数和模型参数中的拟合参数满足第二条件,所述目标模型的模型参数包括所述目标拟合参数和所述目标候选参数。For example, in the modeling method provided by an embodiment of the present disclosure, a set of model parameters included in each initial model includes fitting parameters and candidate parameters, and according to the multiple sets of test data, multiple The initial model and the model parameters and simulation physical parameters of the multiple initial models are calculated based on statistical distribution to obtain the target model, including: based on each set of test data in the multiple sets of test data, from the multiple sets of test data in the model library Multiple fitting models are selected from the initial model, wherein each set of test data corresponds to multiple fitting models, and the simulation physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition; for each set of test data , performing statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and obtaining the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter; corresponding to the multiple sets of test data respectively According to the target physical parameters and the target fitting parameters, from multiple initial Select the candidate model in the model, and use the candidate parameters in the model parameters of the candidate model as the target candidate parameters, so as to obtain the target model; wherein, the simulation physical parameters of the candidate model and the model parameters The fitting parameters satisfy the second condition, and the model parameters of the target model include the target fitting parameters and the target candidate parameters.
例如,在本公开一实施例提供的建模方法中,每组测试数据包括多个测试物理参数,所述第一条件包括:所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数分别相等,或者,所述拟合模型所包括的仿 真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。For example, in the modeling method provided by an embodiment of the present disclosure, each set of test data includes a plurality of test physical parameters, and the first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitting model Each corresponding test physical parameter in the test data corresponding to the fitting model is respectively equal, or each of the simulated physical parameters included in the fitting model is the same as the test corresponding to the fitting model The sum of the differences of each corresponding test physical parameter in the data is less than the first threshold.
例如,在本公开一实施例提供的建模方法中,所述第二条件包括:所述备选模型的仿真物理参数与所述目标物理参数相等,且所述备选模型的模型参数中的拟合参数与所述目标拟合参数相等,或者,所述备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与所述目标物理参数和所述目标拟合参数中的每个对应的参数的差值的和小于第二阈值。For example, in the modeling method provided by an embodiment of the present disclosure, the second condition includes: the simulated physical parameters of the candidate model are equal to the target physical parameters, and the model parameters of the candidate model are The fitting parameters are equal to the target fitting parameters, or each of the fitting parameters in the simulation physical parameters and model parameters of the alternative model is equal to the target physical parameters and the target fitting parameters The sum of the differences of each corresponding parameter is smaller than the second threshold.
例如,在本公开一实施例提供的建模方法中,所述统计分布计算包括正态分布计算。For example, in the modeling method provided by an embodiment of the present disclosure, the statistical distribution calculation includes normal distribution calculation.
例如,在本公开一实施例提供的建模方法中,根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到所述目标模型,还包括:对所述目标拟合参数进行优化,以更新所述目标拟合参数。For example, in the modeling method provided by an embodiment of the present disclosure, according to the multiple sets of test data, the multiple initial models in the model library, and the model parameters and simulation physical parameters of the multiple initial models, based on statistics The distribution calculation to obtain the target model further includes: optimizing the target fitting parameters to update the target fitting parameters.
例如,在本公开一实施例提供的建模方法中,对所述目标拟合参数进行优化,以更新所述目标拟合参数,包括:基于所述目标拟合参数,进行仿真得到比对物理参数;判断所述比对物理参数与所述多组测试数据的相似度是否大于相似度阈值;若所述相似度大于所述相似度阈值,则补充测试数据,并根据补充的测试数据重新计算所述目标拟合参数,以更新所述目标拟合参数。For example, in the modeling method provided by an embodiment of the present disclosure, optimizing the target fitting parameters to update the target fitting parameters includes: performing simulation based on the target fitting parameters to obtain a comparative physical parameter; judging whether the similarity between the comparison physical parameter and the multiple sets of test data is greater than the similarity threshold; if the similarity is greater than the similarity threshold, supplement the test data, and recalculate according to the supplemented test data the target fitting parameters to update the target fitting parameters.
例如,在本公开一实施例提供的建模方法中,获取所述模型库包括:定义原始模型的模型参数的取值,并基于所述取值得到多个取值组合;基于所述多个取值组合对所述原始模型进行仿真,得到多组仿真物理参数,以得到包括所述多个初始模型的模型库;其中,所述多个取值组合分别作为所述多个初始模型的模型参数。For example, in the modeling method provided by an embodiment of the present disclosure, obtaining the model library includes: defining the values of the model parameters of the original model, and obtaining multiple value combinations based on the values; based on the multiple The combination of values simulates the original model to obtain multiple sets of simulated physical parameters to obtain a model library including the multiple initial models; wherein the multiple value combinations are respectively used as models of the multiple initial models parameter.
例如,在本公开一实施例提供的建模方法中,基于所述多个取值组合对所述原始模型进行仿真,得到所述多组仿真物理参数,以得到包括所述多个初始模型的模型库,包括:基于所述多个取值组合,利用脚本文件对所述原始模型进行仿真,得到所述多组仿真物理参数,以得到包括所述多个初始模型的模型库。For example, in the modeling method provided by an embodiment of the present disclosure, the original model is simulated based on the multiple value combinations to obtain the multiple sets of simulated physical parameters, so as to obtain the The model library includes: based on the multiple value combinations, using a script file to simulate the original model to obtain the multiple sets of simulated physical parameters, so as to obtain the model library including the multiple initial models.
例如,在本公开一实施例提供的建模方法中,所述原始模型包括伯克利短沟道绝缘栅场效应晶体管SPICE模型。For example, in the modeling method provided by an embodiment of the present disclosure, the original model includes a Berkeley Short Channel Insulated Gate Field Effect Transistor SPICE model.
例如,在本公开一实施例提供的建模方法中,所述一组模型参数至少包括迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数,所述一组仿真物理参数至少包括阈值电压、有效驱动电流和漏电流。For example, in the modeling method provided by an embodiment of the present disclosure, the set of model parameters includes at least mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, and the set of simulation physical parameters includes at least threshold voltage, effective drive current, and leakage current.
例如,在本公开一实施例提供的建模方法中,所述迁移率修正参数、所述源漏沟道电流修正参数、所述阈值电压漂移参数中的两个作为所述拟合参数,所述迁移率修正参数、所述源漏沟道电流修正参数、所述阈值电压漂移参数中的另外一个作为所述候选参数。For example, in the modeling method provided by an embodiment of the present disclosure, two of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter are used as the fitting parameters, and the The other one of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter is used as the candidate parameter.
例如,在本公开一实施例提供的建模方法中,所述多组测试数据基于晶圆可接受度测试或晶圆筛选测试得到。For example, in the modeling method provided by an embodiment of the present disclosure, the multiple sets of test data are obtained based on a wafer acceptability test or a wafer screening test.
例如,在本公开一实施例提供的建模方法中,所述建模方法用于基于产品实测特性对 SPICE模型进行二次开发。For example, in the modeling method provided by an embodiment of the present disclosure, the modeling method is used for secondary development of the SPICE model based on the measured characteristics of the product.
本公开至少一个实施例还提供一种建模装置,包括:第一获取单元,配置为获取模型库,其中,所述模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;第二获取单元,配置为获取多组测试数据;计算单元,配置为根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。At least one embodiment of the present disclosure also provides a modeling device, including: a first acquisition unit configured to acquire a model library, wherein the model library includes a plurality of initial models, and each initial model includes a set of model parameters and corresponding A set of simulated physical parameters generated through simulation; the second acquisition unit is configured to acquire multiple sets of test data; the calculation unit is configured to obtain multiple sets of test data, multiple initial models in the model library, and the The model parameters and simulation physical parameters of multiple initial models are calculated based on statistical distribution to obtain the target model.
例如,在本公开一实施例提供的建模装置中,每个初始模型所包括的一组模型参数包括拟合参数和候选参数;所述计算单元包括拟合模型确定单元、第一统计分布计算单元、第二统计分布计算单元和目标模型确定单元;所述拟合模型确定单元配置为基于所述多组测试数据中每组测试数据从所述模型库的多个初始模型中选择得到多个拟合模型,其中,每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件;所述第一统计分布计算单元配置为,对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数;所述第二统计分布计算单元配置为对所述多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数;所述目标模型确定单元配置为根据目标物理参数和所述目标拟合参数,从所述模型库的多个初始模型中选择得到备选模型,并将所述备选模型的模型参数中的候选参数作为目标候选参数,从而得到所述目标模型;其中,所述备选模型的仿真物理参数和模型参数中的拟合参数满足第二条件,所述目标模型的模型参数包括所述目标拟合参数和所述目标候选参数。For example, in the modeling device provided by an embodiment of the present disclosure, a set of model parameters included in each initial model includes fitting parameters and candidate parameters; the calculation unit includes a fitting model determination unit, a first statistical distribution calculation unit, a second statistical distribution calculation unit, and a target model determination unit; the fitting model determination unit is configured to select from multiple initial models in the model library to obtain multiple A fitting model, wherein each set of test data corresponds to a plurality of fitting models, and the simulation physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition; the first statistical distribution calculation unit is configured to, for For each group of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the group of test data, and obtain the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter; the second statistics The distribution calculation unit is configured to perform statistical distribution calculation on the alternative fitting parameters corresponding to the plurality of sets of test data, and obtain the alternative fitting parameters corresponding to the maximum probability value as the target fitting parameter; the target model determination unit configuration In order to select a candidate model from a plurality of initial models in the model library according to the target physical parameter and the target fitting parameter, and use the candidate parameters in the model parameters of the candidate model as target candidate parameters, thereby The target model is obtained; wherein, the simulation physical parameters of the alternative model and the fitting parameters in the model parameters meet the second condition, and the model parameters of the target model include the target fitting parameters and the target candidate parameters .
例如,在本公开一实施例提供的建模装置中,每组测试数据包括多个测试物理参数,所述第一条件包括:所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数分别相等,或者,所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。For example, in the modeling device provided by an embodiment of the present disclosure, each set of test data includes a plurality of test physical parameters, and the first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitting model Each corresponding test physical parameter in the test data corresponding to the fitting model is respectively equal, or each of the simulated physical parameters included in the fitting model is the same as the test corresponding to the fitting model The sum of the differences of each corresponding test physical parameter in the data is less than the first threshold.
例如,在本公开一实施例提供的建模装置中,所述第二条件包括:所述备选模型的仿真物理参数与所述目标物理参数相等,且所述备选模型的模型参数中的拟合参数与所述目标拟合参数相等,或者,所述备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与所述目标物理参数和所述目标拟合参数中的每个对应的参数的差值的和小于第二阈值。For example, in the modeling device provided in an embodiment of the present disclosure, the second condition includes: the simulated physical parameters of the candidate model are equal to the target physical parameters, and the model parameters of the candidate model are The fitting parameters are equal to the target fitting parameters, or each of the fitting parameters in the simulation physical parameters and model parameters of the alternative model is equal to the target physical parameters and the target fitting parameters The sum of the differences of each corresponding parameter is smaller than the second threshold.
例如,在本公开一实施例提供的建模装置中,所述计算单元还包括优化单元;所述优化单元配置为对所述目标拟合参数进行优化,以更新所述目标拟合参数。For example, in the modeling device provided in an embodiment of the present disclosure, the calculation unit further includes an optimization unit; the optimization unit is configured to optimize the target fitting parameters, so as to update the target fitting parameters.
例如,在本公开一实施例提供的建模装置中,所述优化单元包括第一子单元、第二子单元和第三子单元;所述第一子单元配置为基于所述目标拟合参数,进行仿真得到比对物理参数;所述第二子单元配置为判断所述比对物理参数与所述多组测试数据的相似度是否大于相似度阈值;所述第三子单元配置为,若所述相似度大于所述相似度阈值,则补充测试数据, 并根据补充的测试数据重新计算所述目标拟合参数,以更新所述目标拟合参数。For example, in the modeling device provided in an embodiment of the present disclosure, the optimization unit includes a first subunit, a second subunit, and a third subunit; the first subunit is configured to be based on the target fitting parameter , performing simulation to obtain a comparison physical parameter; the second subunit is configured to determine whether the similarity between the comparison physical parameter and the multiple sets of test data is greater than a similarity threshold; the third subunit is configured to, if If the similarity is greater than the similarity threshold, the test data is supplemented, and the target fitting parameters are recalculated according to the supplemented test data, so as to update the target fitting parameters.
本公开至少一个实施例还提供一种电子设备,包括本公开任一实施例提供的建模装置。At least one embodiment of the present disclosure further provides an electronic device, including the modeling apparatus provided by any embodiment of the present disclosure.
本公开至少一个实施例还提供一种电子设备,包括:处理器;存储器,包括一个或多个计算机程序模块;其中,所述一个或多个计算机程序模块被存储在所述存储器中并被配置为由所述处理器执行,所述一个或多个计算机程序模块包括用于实现本公开任一实施例提供的建模方法的指令。At least one embodiment of the present disclosure also provides an electronic device, including: a processor; a memory including one or more computer program modules; wherein the one or more computer program modules are stored in the memory and configured To be executed by the processor, the one or more computer program modules include instructions for implementing the modeling method provided by any embodiment of the present disclosure.
本公开至少一个实施例还提供一种存储介质,用于存储非暂时性计算机可读指令,当所述非暂时性计算机可读指令由计算机执行时可以实现本公开任一实施例提供的建模方法。At least one embodiment of the present disclosure further provides a storage medium for storing non-transitory computer-readable instructions, and when the non-transitory computer-readable instructions are executed by a computer, the modeling provided by any embodiment of the present disclosure can be realized method.
附图说明Description of drawings
为了更清楚地说明本公开实施例的技术方案,下面将对实施例的附图作简单地介绍,显而易见地,下面描述中的附图仅仅涉及本公开的一些实施例,而非对本公开的限制。In order to illustrate the technical solutions of the embodiments of the present disclosure more clearly, the accompanying drawings of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure .
图1为一种SPICE模型二次开发的流程图;Figure 1 is a flowchart of secondary development of a SPICE model;
图2为本公开一些实施例提供的一种建模方法的流程示意图;Fig. 2 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure;
图3为图2中步骤S10的流程示意图;Fig. 3 is a schematic flow chart of step S10 in Fig. 2;
图4为图2中步骤S30的流程示意图;FIG. 4 is a schematic flow chart of step S30 in FIG. 2;
图5A为本公开一些实施例提供的建模方法中进行统计分布计算的示意图之一;Fig. 5A is one of the schematic diagrams of statistical distribution calculation in the modeling method provided by some embodiments of the present disclosure;
图5B为本公开一些实施例提供的建模方法中进行统计分布计算的示意图之二;FIG. 5B is the second schematic diagram of statistical distribution calculation in the modeling method provided by some embodiments of the present disclosure;
图6为本公开一些实施例提供的一种建模方法的逻辑示意图;Fig. 6 is a logical schematic diagram of a modeling method provided by some embodiments of the present disclosure;
图7为本公开一些实施例提供的另一种建模方法的流程示意图;FIG. 7 is a schematic flowchart of another modeling method provided by some embodiments of the present disclosure;
图8为图7中步骤S35的流程示意图;FIG. 8 is a schematic flow chart of step S35 in FIG. 7;
图9为本公开一些实施例提供的一种建模方法的流程示意图;FIG. 9 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure;
图10为本公开一些实施例提供的建模方法所得到的SPICE模型与原始SPICE模型及测试数据的比较示意图;Fig. 10 is a schematic diagram of comparing the SPICE model obtained by the modeling method provided by some embodiments of the present disclosure with the original SPICE model and test data;
图11为本公开一些实施例提供的一种建模装置的示意框图;Fig. 11 is a schematic block diagram of a modeling device provided by some embodiments of the present disclosure;
图12为本公开一些实施例提供的一种电子设备的示意框图;Fig. 12 is a schematic block diagram of an electronic device provided by some embodiments of the present disclosure;
图13为本公开一些实施例提供的另一种电子设备的示意框图;Fig. 13 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure;
图14为本公开一些实施例提供的另一种电子设备的示意框图;以及Fig. 14 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure; and
图15为本公开一些实施例提供的一种存储介质的示意图。Fig. 15 is a schematic diagram of a storage medium provided by some embodiments of the present disclosure.
具体实施方式detailed description
为使本公开实施例的目的、技术方案和优点更加清楚,下面将结合本公开实施例的附图,对本公开实施例的技术方案进行清楚、完整地描述。显然,所描述的实施例是本公开的一部 分实施例,而不是全部的实施例。基于所描述的本公开的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本公开保护的范围。In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Apparently, the described embodiments are some, not all, embodiments of the present disclosure. Based on the described embodiments of the present disclosure, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present disclosure.
除非另外定义,本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性,而只是用来区分不同的组成部分。同样,“一个”、“一”或者“该”等类似词语也不表示数量限制,而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同,而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接,而是可以包括电性的连接,不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系,当被描述对象的绝对位置改变后,则该相对位置关系也可能相应地改变。Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present disclosure belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Likewise, words like "a", "an" or "the" do not denote a limitation of quantity, but mean that there is at least one. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
通常,在设计阶段,需要针对晶体管等器件建立SPICE模型,然后通过仿真实现设计。在实际流片生产过程中,由于晶圆厂工艺的迭代可能会发生实际生产的产品特性和其提供的SPICE模型出现偏差的情况。通过晶圆厂进行的SPICE模型升版更新等操作存在周期长、困难多等问题,从而影响项目进度及新产品上市周期。因此,需要基于已量产产品的实际特性进行SPICE模型的二次开发,使得二次开发后得到的SPICE模型与实际的产品特性匹配,这对失效分析、新产品设计等具有重大实际意义和作用。Usually, in the design stage, it is necessary to establish a SPICE model for devices such as transistors, and then realize the design through simulation. In the actual tape-out process, due to the iteration of the fab process, there may be deviations between the actual product characteristics and the SPICE model provided by it. Operations such as updating the SPICE model through the fab have problems such as long cycle and many difficulties, which affect the project progress and the new product launch cycle. Therefore, it is necessary to carry out the secondary development of the SPICE model based on the actual characteristics of the mass-produced products, so that the SPICE model obtained after the secondary development matches the actual product characteristics, which has great practical significance and effect on failure analysis, new product design, etc. .
图1为一种SPICE模型二次开发的流程图。如图1所示,目前SPICE模型的二次开发一般采用正向拟合的方法。也即是,首先人工修改SPICE模型参数,然后通过仿真器生成物理参数。将仿真生成的物理参数与实测数据进行比较。若仿真生成的物理参数与实测数据的差异较大,不满足要求,则再次人工修改SPICE模型参数,然后仿真得到物理参数,将仿真得到的物理参数与实测数据进行比较。此时,通常基于设计人员的经验及理论判断来修改模型参数。若仿真生成的物理参数与实测数据的差异不大,满足要求,则当前的SPICE模型为与实际的产品特性匹配的模型,由此完成了SPICE模型的二次开发。采用上述方法,基于经验和理论判断不断修正模型参数,从而迭代生成较优的模型参数以完成SPICE模型的二次开发。Figure 1 is a flow chart of the secondary development of a SPICE model. As shown in Figure 1, the current secondary development of the SPICE model generally adopts the forward fitting method. That is, the parameters of the SPICE model are manually modified first, and then the physical parameters are generated by the simulator. Compare simulation-generated physical parameters with measured data. If the difference between the physical parameters generated by the simulation and the measured data is large and does not meet the requirements, the SPICE model parameters are manually modified again, and then the physical parameters are obtained through simulation, and the simulated physical parameters are compared with the measured data. At this time, the model parameters are usually modified based on the designer's experience and theoretical judgment. If the physical parameters generated by the simulation are not significantly different from the measured data and meet the requirements, the current SPICE model is a model that matches the actual product characteristics, thus completing the secondary development of the SPICE model. Using the above method, the model parameters are continuously revised based on experience and theoretical judgment, so as to iteratively generate better model parameters to complete the secondary development of the SPICE model.
然而,进行SPICE模型的二次开发时,通过人工修改模型参数并进行迭代的正向拟合方式,会耗费较多时间,并且对设计人员的要求较高,模型的二次开发难度较大。而且,在拟合大量实测数据时,会产生精度不够等问题,会影响所得到的SPICE模型的准确性。However, when carrying out the secondary development of the SPICE model, it takes a lot of time to manually modify the model parameters and perform iterative forward fitting, and the requirements for designers are high, so the secondary development of the model is more difficult. Moreover, when fitting a large amount of measured data, there will be problems such as insufficient precision, which will affect the accuracy of the obtained SPICE model.
本公开至少一个实施例提供一种建模方法及建模装置、电子设备及存储介质。该建模方法可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自 动化流程,能够处理大量的测试数据,处理效率高,处理速度快,准确性高,并且可以基于特定范围需求及测试数据完成模型的定制化二次开发。At least one embodiment of the present disclosure provides a modeling method, a modeling device, electronic equipment, and a storage medium. This modeling method can solve the complex and cumbersome and low-efficiency problems of the manual iterative process, can realize the automatic process for the secondary development of the model, can handle a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and The customized secondary development of the model can be completed based on specific scope requirements and test data.
下面,将参考附图详细地说明本公开的实施例。应当注意的是,不同的附图中相同的附图标记将用于指代已描述的相同的元件。Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. It should be noted that the same reference numerals will be used in different drawings to refer to the same elements already described.
本公开至少一个实施例提供一种建模方法。该建模方法包括:获取模型库,模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;获取多组测试数据;根据多组测试数据、模型库中的多个初始模型以及多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。At least one embodiment of the present disclosure provides a modeling method. The modeling method includes: obtaining a model library, the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation; obtaining multiple sets of test data; The data, multiple initial models in the model library, and the model parameters and simulation physical parameters of the multiple initial models are calculated based on the statistical distribution to obtain the target model.
图2为本公开一些实施例提供的一种建模方法的流程示意图。如图2所示,在一些实施例中,该建模方法包括如下操作。Fig. 2 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure. As shown in Fig. 2, in some embodiments, the modeling method includes the following operations.
步骤S10:获取模型库,模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;Step S10: Obtain a model library, the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation;
步骤S20:获取多组测试数据;Step S20: Acquiring multiple sets of test data;
步骤S30:根据多组测试数据、模型库中的多个初始模型以及多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。Step S30: According to multiple sets of test data, multiple initial models in the model library, and model parameters and simulated physical parameters of the multiple initial models, the target model is obtained based on statistical distribution calculation.
例如,在步骤S10中,可以获取已经建立并存储的模型库,也可以在该步骤中直接建立模型库。例如,以晶体管为例,为了准确描述晶体管的各项参数,可以采用伯克利短沟道绝缘栅场效应晶体管模型(Berkeley Short-channel IGFET Model,BSIM)来组成模型库。BSIM模型是一种常用的SPICE模型,可以较为准确地模拟晶体管性能并计算各种参数。For example, in step S10, the established and stored model library can be obtained, or the model library can be directly established in this step. For example, taking the transistor as an example, in order to accurately describe the parameters of the transistor, the Berkeley Short-channel IGFET Model (BSIM) can be used to form a model library. The BSIM model is a commonly used SPICE model, which can more accurately simulate transistor performance and calculate various parameters.
例如,该模型库包括多个初始模型,初始模型为BSIM模型。每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数。例如,在一些示例中,一组模型参数可以包括至少三个模型参数,分别为迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数。基于这些模型参数,通过对模型进行仿真可以得到一组对应的仿真物理参数。一组仿真物理参数可以至少包括三个仿真物理参数,分别为阈值电压、有效驱动电流和漏电流。例如,在一些示例中,A表示迁移率修正参数,B表示源漏沟道电流修正参数,C表示阈值电压漂移参数,x表示阈值电压,y表示有效驱动电流,z表示漏电流。A、B、C的数值决定了模型的特性,通过对模型进行仿真可以得到反映模型特性的参数x、y、z。例如,A、B、C的不同数值对应于不同的初始模型。在模型库中,不同的初始模型的模型参数A、B、C不会完全相同,以区分不同的初始模型。不同的初始模型的仿真物理参数x、y、z则可能完全不同,也可能部分相同,还可能完全相同。For example, the model library includes multiple initial models, and the initial model is a BSIM model. Each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation. For example, in some examples, a set of model parameters may include at least three model parameters, which are respectively a mobility correction parameter, a source-drain channel current correction parameter, and a threshold voltage drift parameter. Based on these model parameters, a set of corresponding simulation physical parameters can be obtained by simulating the model. The set of simulated physical parameters may include at least three simulated physical parameters, which are threshold voltage, effective driving current and leakage current, respectively. For example, in some examples, A represents a mobility correction parameter, B represents a source-drain channel current correction parameter, C represents a threshold voltage drift parameter, x represents a threshold voltage, y represents an effective driving current, and z represents a leakage current. The values of A, B, and C determine the characteristics of the model, and the parameters x, y, and z that reflect the characteristics of the model can be obtained by simulating the model. For example, different values of A, B, and C correspond to different initial models. In the model library, the model parameters A, B, and C of different initial models will not be exactly the same, so as to distinguish different initial models. The simulation physical parameters x, y, and z of different initial models may be completely different, partly the same, or completely the same.
需要说明的是,本公开的实施例中,SPICE模型的建模对象不限于为晶体管,可以为集 成电路、芯片等中的任意器件,虽然本公开以晶体管为例进行说明,但这并不构成对本公开实施例的限制。相应地,模型参数不限于为迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数,仿真物理参数不限于为阈值电压、有效驱动电流和漏电流,模型参数和仿真物理参数的具体类别可以根据实际需求以及所采用的模型类型而定,本公开的实施例对此不作限制。一组模型参数的数量不限于为3个,还可以为2个、4个、5个等任意数量,同样地,一组仿真物理参数的数量也不限于为3个,还可以为2个、4个、5个等任意数量,本公开的实施例对此不作限制。模型库中的初始模型不限于为BSIM模型,还可以为其他类型的模型,这可以根据实际需求而定,本公开的实施例对此不作限制。It should be noted that in the embodiments of the present disclosure, the modeling object of the SPICE model is not limited to transistors, but can be any device in integrated circuits, chips, etc. Although this disclosure uses transistors as an example for illustration, this does not constitute Limitations on Embodiments of the Disclosure. Correspondingly, the model parameters are not limited to mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, and the simulation physical parameters are not limited to threshold voltage, effective drive current, and leakage current. The model parameters and simulation physical parameters are specific The category may be determined according to actual requirements and the type of model used, which is not limited in the embodiments of the present disclosure. The number of a set of model parameters is not limited to 3, but can also be any number such as 2, 4, 5, etc. Similarly, the number of a set of simulation physical parameters is not limited to 3, and can also be 2, 4, 5, etc. Any number, such as 4, 5, etc., is not limited in the embodiments of the present disclosure. The initial model in the model library is not limited to the BSIM model, and may also be other types of models, which may be determined according to actual requirements, which is not limited in the embodiments of the present disclosure.
例如,在一些示例中,如图3所示,上述步骤S10可以进一步包括如下操作。For example, in some examples, as shown in FIG. 3 , the above step S10 may further include the following operations.
步骤S11:定义原始模型的模型参数的取值,并基于取值得到多个取值组合;Step S11: Define the values of the model parameters of the original model, and obtain multiple value combinations based on the values;
步骤S12:基于多个取值组合对原始模型进行仿真,得到多组仿真物理参数,以得到包括多个初始模型的模型库。Step S12: Simulating the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models.
例如,在步骤S11中,原始模型可以采用BSIM模型,也即伯克利短沟道绝缘栅场效应晶体管SPICE模型,模型参数可以为迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数,也即是,上文中描述的A、B、C(迁移率修正参数以A表示、源漏沟道电流修正参数以B表示,阈值电压漂移参数以C表示)。定义A、B、C各自的取值,由此得到多个取值组合,也即是,得到多组A、B、C。例如,A、B、C的取值决定了模型特性,因此多组A、B、C对应于多个不同的模型。例如,不同组A、B、C的取值不完全相同,从而使得多个模型彼此不同。For example, in step S11, the original model can adopt the BSIM model, that is, the Berkeley short-channel insulated gate field-effect transistor SPICE model, and the model parameters can be mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, That is, A, B, and C described above (the mobility correction parameter is represented by A, the source-drain channel current correction parameter is represented by B, and the threshold voltage drift parameter is represented by C). Define the respective values of A, B, and C to obtain multiple value combinations, that is, to obtain multiple sets of A, B, and C. For example, the values of A, B, and C determine the model characteristics, so multiple sets of A, B, and C correspond to multiple different models. For example, the values of different groups A, B, and C are not exactly the same, so that the multiple models are different from each other.
例如,可以在A的取值范围内以一定步长均匀取值,由此得到多个A的取值。类似地,B和C也可以在各自的取值范围内以一定步长均匀取值,从而得到多个B的取值和多个C的取值。将多个A的取值、多个B的取值、多个C的取值进行排列组合,从而可以得到多组A、B、C。例如,在一些示例中,A的取值范围可以为0~1或0.7~1.2,B的取值范围可以为0~1或0.7~1.2,C的取值范围可以为-1~+1,A、B、C各自取值的步长可以为0.01或0.001。需要说明的是,上述取值范围和步长是示例性的,而非限制性的,取值范围和步长可以根据实际需求而设置。For example, within the value range of A, values can be uniformly selected with a certain step size, thereby obtaining multiple values of A. Similarly, B and C can also take values evenly with a certain step size within their respective value ranges, so as to obtain multiple B values and multiple C values. Multiple sets of A, B, and C can be obtained by permuting and combining multiple values of A, multiple values of B, and multiple values of C. For example, in some examples, the value range of A may be 0~1 or 0.7~1.2, the value range of B may be 0~1 or 0.7~1.2, the value range of C may be -1~+1, The step size of each value of A, B, and C can be 0.01 or 0.001. It should be noted that the above value range and step size are exemplary rather than restrictive, and the value range and step size can be set according to actual requirements.
例如,在一些示例中,假设得到N1个A的取值,得到N2个B的取值,得到N3个C的取值,则可以得到的A、B、C的取值组合的数量为:N1*N2*N3,这里,N1、N2、N3均为正整数。For example, in some examples, assuming that N1 values of A are obtained, N2 values of B are obtained, and N3 values of C are obtained, the number of combinations of values of A, B, and C that can be obtained is: N1 *N2*N3, where N1, N2, and N3 are all positive integers.
例如,在步骤S12中,基于多个取值组合对原始模型进行仿真,也即是,将上述多组A、B、C分别写入原始模型中进行仿真,由此得到多组仿真物理参数。例如,仿真物理参 数包括阈值电压、有效驱动电流和漏电流,也即上文描述的x、y、z(阈值电压以x表示、有效驱动电流以y表示,漏电流以z表示)。多组模型参数与多组仿真物理参数一一对应,也即是,多组A、B、C与多组x、y、z一一对应。一组A、B、C对应于一个模型,由此仿真得到对应的一组x、y、z。For example, in step S12, the original model is simulated based on multiple value combinations, that is, the above multiple sets of A, B, and C are respectively written into the original model for simulation, thereby obtaining multiple sets of simulated physical parameters. For example, the simulated physical parameters include threshold voltage, effective driving current, and leakage current, namely x, y, and z described above (the threshold voltage is represented by x, the effective driving current is represented by y, and the leakage current is represented by z). Multiple sets of model parameters correspond one-to-one to multiple sets of simulation physical parameters, that is, multiple sets of A, B, and C correspond to multiple sets of x, y, and z. A set of A, B, and C corresponds to a model, and a corresponding set of x, y, and z is obtained through simulation.
例如,在一些示例中,可以基于多个取值组合,利用脚本文件对原始模型进行仿真,从而得到多组仿真物理参数,以得到包括多个初始模型的模型库。例如,脚本文件可以采用任意适用的语言编写,也可以采用任意适用的执行顺序和方式,本公开的实施例对此不作限制。通过利用脚本文件对原始模型进行仿真,可以高效、快速地遍历所有取值组合,而无需人工操作执行多次仿真,由此提高了仿真效率。For example, in some examples, the script file may be used to simulate the original model based on multiple value combinations, so as to obtain multiple sets of simulated physical parameters, so as to obtain a model library including multiple initial models. For example, the script file may be written in any applicable language, and may also be executed in any applicable order and manner, which is not limited by the embodiments of the present disclosure. By using the script file to simulate the original model, all value combinations can be efficiently and quickly traversed without manual operation to perform multiple simulations, thereby improving the simulation efficiency.
将多组A、B、C分别对应的模型作为初始模型,由此得到包括多个初始模型的模型库。多个取值组合(也即多组A、B、C)分别作为多个初始模型的模型参数,每个初始模型对应于一组模型参数A、B、C,每个初始模型还对应于一组经过仿真生成的仿真物理参数x、y、z。Multiple sets of models corresponding to A, B, and C are used as initial models, thereby obtaining a model library including multiple initial models. Multiple value combinations (that is, multiple sets of A, B, and C) are used as model parameters of multiple initial models, each initial model corresponds to a set of model parameters A, B, and C, and each initial model also corresponds to a A set of simulation physical parameters x, y, z generated by simulation.
例如,如图2所示,在步骤S20中,获取多组测试数据。例如,测试数据可以通过对实际产品进行测试而得到,也即,测试数据为实测数据。在模型库中的初始模型所包含的一组仿真物理参数为阈值电压、有效驱动电流和漏电流的情形下,一组测试数据为对实际产品进行测试而得到的阈值电压、有效驱动电流和漏电流。例如,测试数据的参数类别与仿真物理参数的参数类别相同,由此便于进行后续的分析和计算。需要说明的是,当仿真物理参数为其他类别的参数时,测试数据的类型也相应调整,只要测试数据的参数类别与仿真物理参数的参数类别相同即可。For example, as shown in FIG. 2, in step S20, multiple sets of test data are acquired. For example, the test data may be obtained by testing an actual product, that is, the test data is actually measured data. In the case where a set of simulated physical parameters included in the initial model in the model library are threshold voltage, effective drive current, and leakage current, a set of test data is the threshold voltage, effective drive current, and leakage current obtained from testing the actual product. current. For example, the parameter category of the test data is the same as that of the simulated physical parameter, thereby facilitating subsequent analysis and calculation. It should be noted that when the simulated physical parameter is a parameter of another category, the type of the test data is also adjusted accordingly, as long as the parameter category of the test data is the same as that of the simulated physical parameter.
例如,多组测试数据可以基于晶圆可接受度测试(Wafer Acceptance Test,WAT)或晶圆筛选测试(Wafer Sort,WS)得到。当然,本公开的实施例不限于此,也可以采用其他方法得到测试数据,这可以根据实际需求而定。For example, multiple sets of test data can be obtained based on wafer acceptance test (Wafer Acceptance Test, WAT) or wafer screening test (Wafer Sort, WS). Of course, the embodiments of the present disclosure are not limited thereto, and other methods may also be used to obtain test data, which may be determined according to actual requirements.
例如,在步骤S30中,根据多组测试数据、模型库中的多个初始模型以及多个初始模型的模型参数和仿真物理参数,基于统计分布计算,以得到目标模型。例如,目标模型为基于产品实测特性进行二次开发所得到的SPICE模型,上述步骤S10至S30可以实现二次开发。For example, in step S30, according to multiple sets of test data, multiple initial models in the model library, model parameters and simulated physical parameters of the multiple initial models, the target model is obtained based on statistical distribution calculation. For example, the target model is a SPICE model obtained through secondary development based on the measured characteristics of the product, and the above steps S10 to S30 can realize the secondary development.
例如,在一些示例中,如图4所示,上述步骤S30可以进一步包括如下操作。For example, in some examples, as shown in FIG. 4 , the above step S30 may further include the following operations.
步骤S31:基于多组测试数据中每组测试数据从模型库的多个初始模型中选择得到多个拟合模型,每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件;Step S31: Based on each set of test data in multiple sets of test data, select multiple fitting models from multiple initial models in the model library, each set of test data corresponds to multiple fitting models, and the fitting model corresponding to each set of test data The simulated physical parameters included in the model satisfy the first condition;
步骤S32:对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参 数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数;Step S32: For each group of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the group of test data, and obtain the fitting parameters corresponding to the maximum probability value as an alternative fitting parameter;
步骤S33:对多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数;Step S33: Perform statistical distribution calculation on the candidate fitting parameters respectively corresponding to multiple sets of test data, and obtain the candidate fitting parameters corresponding to the maximum probability value as the target fitting parameters;
步骤S34:根据目标物理参数和目标拟合参数,从模型库的多个初始模型中选择得到备选模型,并将备选模型的模型参数中的候选参数作为目标候选参数,从而得到目标模型。Step S34: According to the target physical parameters and the target fitting parameters, select a candidate model from a plurality of initial models in the model library, and use the candidate parameters in the model parameters of the candidate model as the target candidate parameters, thereby obtaining the target model.
例如,在步骤S31中,基于每组测试数据从模型库的多个初始模型中选择得到多个拟合模型,每组测试数据对应于多个拟合模型。这里,将被选择的初始模型称为拟合模型。例如,可以遍历模型库中的初始模型,根据初始模型所包括的仿真物理参数是否满足第一条件而进行选择。若满足第一条件,则选择该初始模型以作为拟合模型;若不满足第一条件,则不选择该初始模型。通过遍历模型库中所有的初始模型,可以选择得到与每组测试数据对应的多个拟合模型。For example, in step S31, multiple fitting models are selected from multiple initial models in the model library based on each set of test data, and each set of test data corresponds to multiple fitting models. Here, the selected initial model is referred to as a fitted model. For example, the initial models in the model library can be traversed, and the selection can be made according to whether the simulation physical parameters included in the initial models satisfy the first condition. If the first condition is satisfied, the initial model is selected as the fitting model; if the first condition is not satisfied, the initial model is not selected. By traversing all the initial models in the model library, multiple fitting models corresponding to each set of test data can be selected and obtained.
例如,每组测试数据包括多个测试物理参数,多个测试物理参数分别为测试得到的阈值电压、有效驱动电流和漏电流。例如,x’表示测试得到的阈值电压,y’表示测试得到的有效驱动电流,z’表示测试得到的漏电流。For example, each set of test data includes a plurality of test physical parameters, and the plurality of test physical parameters are threshold voltage, effective driving current and leakage current obtained from the test respectively. For example, x' represents the threshold voltage obtained by the test, y' represents the effective driving current obtained by the test, and z' represents the leakage current obtained by the test.
例如,在一些示例中,上述第一条件可以为:拟合模型所包括的仿真物理参数中每个仿真物理参数与拟合模型对应的测试数据中相对应的每个测试物理参数分别相等。也即是,对于一组测试数据x’、y’、z’,若某个初始模型的x、y、z与x’、y’、z’分别相等,即x=x’,y=y’,z=z’,则选择该初始模型作为与该组测试数据x’、y’、z’对应的拟合模型。由于测试数据与仿真物理参数完全相等,因此通过这种方式得到的拟合模型的匹配度高,有利于提高后续的计算精度和准确度。For example, in some examples, the above-mentioned first condition may be: each simulated physical parameter included in the fitted model is equal to each corresponding tested physical parameter in the test data corresponding to the fitted model. That is, for a set of test data x', y', z', if x, y, z of an initial model are equal to x', y', z' respectively, ie x=x', y=y ', z=z', then select the initial model as the fitting model corresponding to the set of test data x', y', z'. Since the test data and the simulated physical parameters are completely equal, the fitting model obtained in this way has a high degree of matching, which is beneficial to improve the subsequent calculation precision and accuracy.
例如,在另一些示例中,上述第一条件也可以为:拟合模型所包括的仿真物理参数中每个仿真物理参数与拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。也即是,对于一组测试数据x’、y’、z’,若某个初始模型的x、y、z与x’、y’、z’的差值的和小于第一阈值,即(x-x’)+(y-y’)+(z-z’)<K1,则选择该初始模型作为与该组测试数据x’、y’、z’对应的拟合模型。这里,K1表示第一阈值,第一阈值可以根据实际需求设置,可以设置为任意的数值。由于测试数据与仿真物理参数较为接近,因此通过这种方式可以得到数量较多的拟合模型,有利于增大后续计算的样本数量,更易于通过统计分布计算得到结果。For example, in some other examples, the above-mentioned first condition may also be: the difference between each simulated physical parameter in the simulated physical parameters included in the fitted model and each corresponding tested physical parameter in the test data corresponding to the fitted model The sum of the values is less than the first threshold. That is, for a set of test data x', y', z', if the sum of the differences between x, y, z and x', y', z' of an initial model is less than the first threshold, ie ( x-x')+(y-y')+(z-z')<K1, then the initial model is selected as the fitting model corresponding to the set of test data x', y', z'. Here, K1 represents the first threshold, and the first threshold can be set according to actual needs, and can be set to any value. Since the test data is close to the simulated physical parameters, a large number of fitting models can be obtained in this way, which is conducive to increasing the number of samples for subsequent calculations, and it is easier to obtain results through statistical distribution calculations.
例如,每个初始模型(以及拟合模型)的一组模型参数包括拟合参数和候选参数。例如,当一组模型参数包括迁移率修正参数、源漏沟道电流修正参数、阈值电压漂移参数时,迁移率修正参数、源漏沟道电流修正参数、阈值电压漂移参数中的两个作为拟合参数,迁移率修 正参数、源漏沟道电流修正参数、阈值电压漂移参数中的另外一个作为候选参数。例如,在一些示例中,一组模型参数中的拟合参数为A、B(也即迁移率修正参数和源漏沟道电流修正参数),候选参数为C(也即阈值电压漂移参数)。For example, a set of model parameters for each initial model (and fitted model) includes fitted parameters and candidate parameters. For example, when a set of model parameters includes mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, two of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters are used as pseudo The combination parameter, the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter are used as a candidate parameter. For example, in some examples, the fitting parameters in a set of model parameters are A and B (ie, the mobility correction parameter and the source-drain channel current correction parameter), and the candidate parameter is C (ie, the threshold voltage drift parameter).
例如,在步骤S32中,对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数。例如,该步骤执行建模方法中的第一次统计分布计算,最大概率值对应的拟合参数可以指分布比重最高的拟合参数。例如,一组测试数据对应多个拟合模型,对这些拟合模型的模型参数中的拟合参数A、B进行统计分布计算,从而得到最大概率值对应的拟合参数A、B,将其称为备选拟合参数。这里,拟合参数A、B作为一个二维数组进行计算。例如,可以对多组拟合参数A、B进行正态分布计算,从而得到最大概率值对应的一组拟合参数A、B以作为备选拟合参数。例如,针对每一组测试数据分别进行计算,可以得到与每一组测试数据分别对应的备选拟合参数,由此得到多组备选拟合参数。For example, in step S32, for each set of test data, statistical distribution calculation is performed on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and the fitting parameter corresponding to the maximum probability value is obtained as an alternative fitting parameter. combined parameters. For example, this step executes the first statistical distribution calculation in the modeling method, and the fitting parameter corresponding to the maximum probability value may refer to the fitting parameter with the highest distribution proportion. For example, a set of test data corresponds to multiple fitting models, and the fitting parameters A and B among the model parameters of these fitting models are calculated for statistical distribution, so as to obtain the fitting parameters A and B corresponding to the maximum probability value, and the are called alternative fitting parameters. Here, the fitting parameters A and B are calculated as a two-dimensional array. For example, the normal distribution calculation can be performed on multiple sets of fitting parameters A and B, so as to obtain a set of fitting parameters A and B corresponding to the maximum probability value as an alternative fitting parameter. For example, by performing calculations on each set of test data, alternative fitting parameters corresponding to each set of test data can be obtained, thereby obtaining multiple sets of alternative fitting parameters.
以一组测试数据x’、y’、z’为例,首先从模型库中选择得到与该组测试数据x’、y’、z’对应的拟合模型。例如,以第一条件为拟合模型所包括的仿真物理参数中每个仿真物理参数与拟合模型对应的测试数据中相对应的每个测试物理参数分别相等为例,可以直接选择满足条件x=x’,y=y’,z=z’的初始模型作为拟合模型,并得到拟合模型的模型参数A、B、C。Taking a set of test data x', y', z' as an example, first select the fitting model corresponding to the set of test data x', y', z' from the model library. For example, taking the first condition that each simulation physical parameter included in the fitting model is equal to each corresponding test physical parameter in the test data corresponding to the fitting model as an example, you can directly choose to satisfy the condition x The initial model of =x', y=y', z=z' is used as the fitting model, and the model parameters A, B, and C of the fitting model are obtained.
当然,选择得到拟合模型的方式不限于上文描述的这一种方式,也可以采用如下方式。如图5A所示,当x=x’时,选择该初始模型,遍历模型库中的所有模型,由此得到n1个初始模型,以得到n1组A、B、C;当y=y’时,选择该初始模型,遍历模型库中的所有模型,由此得到n2个初始模型,以得到n2组A、B、C;当z=z’时,选择该初始模型,遍历模型库中的所有模型,由此得到n3个初始模型,以得到n3组A、B、C。然后,选择n1组、n2组、n3组均包含的A、B、C,该A、B、C对应的初始模型即为拟合模型。例如,图5A示出了两个拟合模型,即拟合模型-1和拟合模型-2。Of course, the way to select and obtain the fitted model is not limited to the one described above, and the following ways can also be used. As shown in Figure 5A, when x=x', select the initial model, and traverse all models in the model library, thereby obtaining n1 initial models to obtain n1 groups A, B, C; when y=y' , select the initial model, traverse all the models in the model library, and thus obtain n2 initial models to obtain n2 groups A, B, C; when z=z', select the initial model, and traverse all the models in the model library model, thus obtaining n3 initial models to obtain n3 groups A, B, and C. Then, select A, B, and C included in groups n1, n2, and n3, and the initial model corresponding to A, B, and C is the fitting model. For example, Figure 5A shows two fitted models, Fitted Model-1 and Fitted Model-2.
如图5A所示,得到拟合模型以及拟合模型的模型参数A、B、C之后,对拟合模型的模型参数A、B、C中的拟合参数A、B进行统计分布计算。例如,一组拟合参数为A2、B2,另一组拟合参数为A3、B7,当然,还有其他拟合参数,图5A中未示出。进行统计分布计算后,可以得到最大概率值对应的拟合参数,将其称为备选拟合参数。在图5A所示的示例中,备选拟合参数为A2、B2。As shown in FIG. 5A , after the fitting model and the model parameters A, B, and C of the fitting model are obtained, statistical distribution calculation is performed on the fitting parameters A, B among the model parameters A, B, and C of the fitting model. For example, one set of fitting parameters is A2, B2, another set of fitting parameters is A3, B7, of course, there are other fitting parameters, which are not shown in Fig. 5A. After statistical distribution calculation, the fitting parameters corresponding to the maximum probability value can be obtained, which are called alternative fitting parameters. In the example shown in Figure 5A, the alternative fitting parameters are A2, B2.
例如,如图4所示,在步骤S33中,对多组测试数据分别对应的备选拟合参数进行统计分布计算,从而得到最大概率值对应的备选拟合参数以作为目标拟合参数。例如,该步骤执行建模方法中的第二次统计分布计算,最大概率值对应的备选拟合参数可以指分布比重 最高的备选拟合参数。由于在步骤S32中针对每一组测试数据计算得到了其对应的备选拟合参数,因此针对多组测试数据可以得到多组备选拟合参数。对多组备选拟合参数进行统计分布计算,从而可以得到最大概率值对应的备选拟合参数,将其称为目标拟合参数。这里,备选拟合参数A、B作为一个二维数组进行计算。例如,可以对多组备选拟合参数A、B进行正态分布计算,从而得到最大概率值对应的一组备选拟合参数A’、B’以作为目标拟合参数。通过计算,最终可以得到一组A’、B’,即为目标拟合参数。For example, as shown in FIG. 4 , in step S33 , the statistical distribution calculation is performed on the candidate fitting parameters respectively corresponding to multiple sets of test data, so as to obtain the candidate fitting parameter corresponding to the maximum probability value as the target fitting parameter. For example, this step executes the second statistical distribution calculation in the modeling method, and the candidate fitting parameter corresponding to the maximum probability value may refer to the candidate fitting parameter with the highest distribution proportion. Since the corresponding candidate fitting parameters are calculated for each set of test data in step S32, multiple sets of candidate fitting parameters can be obtained for multiple sets of test data. Statistical distribution calculations are performed on multiple sets of candidate fitting parameters, so that the candidate fitting parameters corresponding to the maximum probability value can be obtained, which are called target fitting parameters. Here, the alternative fitting parameters A, B are calculated as a two-dimensional array. For example, the normal distribution calculation can be performed on multiple sets of alternative fitting parameters A and B, so as to obtain a set of alternative fitting parameters A' and B' corresponding to the maximum probability value as the target fitting parameters. Through calculation, a set of A' and B' can be finally obtained, which are the target fitting parameters.
例如,如图5B所示,在一些示例中,通过对N组测试数据(例如测试数据_1至测试数据_N)分别计算得到对应的备选拟合参数后,对这些备选拟合参数再次进行统计分布计算。例如,N为正整数。例如,测试数据_1对应的备选拟合参数为A2、B2,测试数据_2对应的备选拟合参数为A3、B2,测试数据_N-1对应的备选拟合参数为A2、B2,测试数据_N对应的备选拟合参数为A6、B6,其他测试数据对应的备选拟合参数在图5B中未示出。通过统计分布计算,可以得到最大概率值对应的备选拟合参数,将其称为目标拟合参数。这里,备选拟合参数A、B作为一个二维数组进行计算。例如,可以对多组备选拟合参数进行正态分布计算,从而得到最大概率值对应的一组备选拟合参数以作为目标拟合参数。For example, as shown in FIG. 5B , in some examples, after calculating corresponding candidate fitting parameters for N groups of test data (such as test data_1 to test data_N), these candidate fitting parameters Perform the statistical distribution calculation again. For example, N is a positive integer. For example, the alternative fitting parameters corresponding to test data_1 are A2, B2, the alternative fitting parameters corresponding to test data_2 are A3, B2, and the alternative fitting parameters corresponding to test data_N-1 are A2, B2, the alternative fitting parameters corresponding to the test data_N are A6 and B6, and the alternative fitting parameters corresponding to other test data are not shown in FIG. 5B. Through statistical distribution calculation, the candidate fitting parameters corresponding to the maximum probability value can be obtained, which are called target fitting parameters. Here, the alternative fitting parameters A, B are calculated as a two-dimensional array. For example, the normal distribution calculation may be performed on multiple sets of candidate fitting parameters, so as to obtain a set of candidate fitting parameters corresponding to the maximum probability value as the target fitting parameters.
例如,通过执行步骤S32和S33,经过两次统计分布计算后,可以得到一组目标拟合参数,也即,得到唯一的一组A’、B’。For example, by performing steps S32 and S33, after two statistical distribution calculations, a set of target fitting parameters can be obtained, that is, a unique set of A' and B' can be obtained.
例如,如图4所示,在步骤S34中,根据目标物理参数和目标拟合参数,从模型库的多个初始模型中选择得到备选模型,并将备选模型的模型参数中的候选参数作为目标候选参数,从而得到目标模型。例如,目标物理参数也包括阈值电压、有效驱动电流和漏电流,目标物理参数中各个参数的数值为预设的值,这可以根据实际需求而定,例如根据需要达到或满足的产品要求而定,本公开的实施例对此不作限制。例如,x”表示目标物理参数中的阈值电压,y”表示目标物理参数中的有效驱动电流,z”表示目标物理参数中的漏电流。例如,目标拟合参数为上述步骤S33中得到的一组A’、B’。For example, as shown in Figure 4, in step S34, according to the target physical parameters and the target fitting parameters, a candidate model is selected from a plurality of initial models in the model library, and the candidate parameters in the model parameters of the candidate model are As the target candidate parameters, the target model is obtained. For example, the target physical parameters also include threshold voltage, effective driving current, and leakage current. The values of each parameter in the target physical parameters are preset values, which can be determined according to actual needs, such as the product requirements that need to be met or satisfied , which is not limited by the embodiments of the present disclosure. For example, x" represents the threshold voltage in the target physical parameter, y" represents the effective driving current in the target physical parameter, and z" represents the leakage current in the target physical parameter. For example, the target fitting parameter is a value obtained in the above step S33 Group A', B'.
这里,将被选择的初始模型称为备选模型。例如,可以遍历模型库中的初始模型,根据初始模型所包括的仿真物理参数和模型参数中的拟合参数是否满足第二条件而进行选择,也即是,根据x、y、z、A、B的数值是否满足第二条件而进行选择。若满足第二条件,则选择该初始模型以作为备选模型;若不满足第二条件,则不选择该初始模型。Here, the selected initial model is referred to as a candidate model. For example, the initial model in the model library can be traversed, and the selection can be made according to whether the simulation physical parameters included in the initial model and the fitting parameters in the model parameters meet the second condition, that is, according to x, y, z, A, The selection is made based on whether the value of B satisfies the second condition. If the second condition is met, the initial model is selected as an alternative model; if the second condition is not met, the initial model is not selected.
例如,在一些示例中,上述第二条件可以为:备选模型的仿真物理参数与目标物理参数相等,且备选模型的模型参数中的拟合参数与目标拟合参数相等。也即是,若某个初始模型的x、y、z与x”、y”、z”分别相等,且该初始模型的A、B与A’、B’分别相等,即x=x”,y=y”,z=z”,A=A’,B=B’,则选择该初始模型作为备选模型。由于上述各个对应的参数彼 此相等,因此通过这种方式得到的备选模型的匹配度高,有利于得到更加准确的结果。For example, in some examples, the above second condition may be: the simulation physical parameters of the candidate model are equal to the target physical parameters, and the fitting parameters in the model parameters of the candidate model are equal to the target fitting parameters. That is, if x, y, z of an initial model are equal to x", y", and z" respectively, and A, B of the initial model are equal to A', B' respectively, that is, x=x", y=y", z=z", A=A', B=B', then select the initial model as the candidate model. Since the above-mentioned corresponding parameters are equal to each other, the matching degree of the candidate model obtained in this way is high, which is conducive to obtaining more accurate results.
例如,在另一些示例中,上述第二条件也可以为:备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与目标物理参数和目标拟合参数中的每个对应的参数的差值的和小于第二阈值。也即是,若某个初始模型的x、y、z、A、B与x”、y”、z”、A’、B’的差值的和小于第二阈值,即(x-x”)+(y-y”)+(z-z”)+(A-A’)+(B-B’)<K2,则选择该初始模型作为备选模型。这里,K2表示第二阈值,第二阈值可以根据实际需求设置,可以设置为任意的数值。由于上述各个对应的参数彼此较为接近,因此通过这种方式可以更容易得到备选模型,有利于得到最终的结果。For example, in some other examples, the above-mentioned second condition may also be: each of the simulation physical parameters and the fitting parameters of the model parameters of the alternative model corresponds to each of the target physical parameters and the target fitting parameters The sum of the differences of the parameters is smaller than the second threshold. That is, if the sum of the differences between x, y, z, A, B and x", y", z", A', B' of an initial model is less than the second threshold, that is, (x-x")+ (y-y")+(z-z")+(A-A')+(B-B')<K2, the initial model is selected as an alternative model. Here, K2 represents the second threshold, and the second threshold can be set according to actual needs, and can be set to any value. Since the above-mentioned corresponding parameters are relatively close to each other, it is easier to obtain an alternative model in this way, which is conducive to obtaining the final result.
例如,通过上述方式可以直接得到备选模型。或者,在一些示例中,还可以对步骤S33所得到的目标拟合参数进行优化,根据优化后的目标拟合参数得到备选模型,关于目标拟合参数的优化,将在后文描述,此处不再赘述。For example, the candidate model can be obtained directly through the above method. Alternatively, in some examples, the target fitting parameters obtained in step S33 can also be optimized, and an alternative model can be obtained according to the optimized target fitting parameters. The optimization of the target fitting parameters will be described later, here I won't repeat them here.
例如,在得到备选模型后,可以得到备选模型的模型参数中的候选参数,例如备选模型的模型参数中的阈值电压漂移参数,将其作为目标候选参数,用C’表示。由此,将前述的目标拟合参数A’、B’和这里得到的目标候选参数C’作为一组模型参数,该组模型参数A’、B’、C’对应的模型即为目标模型。目标模型的模型参数包括目标拟合参数A’、B’和目标候选参数C’。For example, after the candidate model is obtained, a candidate parameter among the model parameters of the candidate model can be obtained, such as a threshold voltage drift parameter among the model parameters of the candidate model, and used as a target candidate parameter, denoted by C'. Thus, the aforementioned target fitting parameters A', B' and the target candidate parameter C' obtained here are taken as a set of model parameters, and the model corresponding to the set of model parameters A', B', and C' is the target model. The model parameters of the target model include target fitting parameters A', B' and target candidate parameters C'.
通过上述方式,可以得到模型参数为A’、B’、C’的目标模型,该目标模型为基于产品实测特性对SPICE模型进行二次开发所得到的模型,由此完成了SPICE模型的二次开发。该目标模型与实际的产品特性匹配,有助于进行失效分析、新产品设计。Through the above method, the target model with model parameters A', B', and C' can be obtained. The target model is a model obtained by secondary development of the SPICE model based on the measured characteristics of the product, thus completing the secondary SPICE model. develop. The target model matches the actual product characteristics, which is helpful for failure analysis and new product design.
本公开实施例提供的建模方法用于基于产品实测特性对SPICE模型进行二次开发,可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自动化流程,整个过程可以自动计算,无需人工干预,也无需基于设计人员的经验与判断。该建模方法能够处理大量的测试数据,处理效率高,处理速度快,准确性高。并且,通过限定测试数据的范围,可以基于特定范围需求及测试数据完成模型的定制化二次开发,使得得到的模型能够很好地反映限定的测试数据范围内的产品特性。The modeling method provided by the embodiments of the present disclosure is used for secondary development of the SPICE model based on the measured characteristics of the product, which can solve the problem of complex and cumbersome manual iteration process and low efficiency, and can realize the automated process for the secondary development of the model. The process can be calculated automatically without human intervention or based on the experience and judgment of the designer. The modeling method can handle a large amount of test data, and has high processing efficiency, fast processing speed and high accuracy. Moreover, by limiting the scope of test data, the customized secondary development of the model can be completed based on specific range requirements and test data, so that the obtained model can well reflect the product characteristics within the limited test data range.
该建模方法融合了神经网络的思想。不同于传统的人工迭代方法,该建模方法将模型库作为神经网络的样本集,采用仿真遍历并结合神经网络加强学习的方法,形成了自动化流程,将SPICE模型问题转换成神经网络问题,由此提高了建模效率和准确性。如图6所示,通过建立模型参数层(也即前述的A、B、C)、仿真层(也即仿真器)、物理层(也即前述的x、y、z)等多层结构,采用多组测试数据x’、y’、z’进行训练,由此可以得到目标模型,完成SPICE模型的二次开发。This modeling method incorporates the idea of neural network. Different from the traditional manual iterative method, this modeling method uses the model library as the sample set of the neural network, adopts the method of simulation traversal and combined with the neural network to strengthen learning, forms an automatic process, and converts the SPICE model problem into a neural network problem, by This improves modeling efficiency and accuracy. As shown in Figure 6, by establishing a multi-layer structure such as the model parameter layer (that is, the aforementioned A, B, C), the simulation layer (that is, the simulator), and the physical layer (that is, the aforementioned x, y, z), Using multiple sets of test data x', y', z' for training, the target model can be obtained, and the secondary development of the SPICE model can be completed.
图7为本公开一些实施例提供的另一种建模方法的流程示意图。例如,在一些实施例中,如图7所示,该建模方法还可以进一步包括步骤S35,该建模方法中的步骤S31-S34与图4所示的步骤S31-S34基本相同,此处不再赘述。Fig. 7 is a schematic flowchart of another modeling method provided by some embodiments of the present disclosure. For example, in some embodiments, as shown in FIG. 7, the modeling method may further include step S35. Steps S31-S34 in the modeling method are basically the same as steps S31-S34 shown in FIG. 4, where No longer.
步骤S35:对目标拟合参数进行优化,以更新目标拟合参数。Step S35: Optimizing the target fitting parameters to update the target fitting parameters.
例如,在步骤S35中,对目标拟合参数进行优化,并将更新后的目标拟合参数用于后续步骤S34中选择备选模型的操作。For example, in step S35, the target fitting parameters are optimized, and the updated target fitting parameters are used in the operation of selecting a candidate model in the subsequent step S34.
例如,如图8所示,在一些示例中,上述步骤S35可以进一步包括如下操作。For example, as shown in FIG. 8 , in some examples, the above step S35 may further include the following operations.
步骤S351:基于目标拟合参数,进行仿真得到比对物理参数;Step S351: Based on the target fitting parameters, perform simulation to obtain comparison physical parameters;
步骤S352:判断比对物理参数与多组测试数据的相似度是否大于相似度阈值;Step S352: judging whether the similarity between the compared physical parameters and multiple sets of test data is greater than the similarity threshold;
步骤S353:若相似度大于相似度阈值,则补充测试数据,并根据补充的测试数据重新计算目标拟合参数,以更新目标拟合参数。Step S353: If the similarity is greater than the similarity threshold, supplement the test data, and recalculate the target fitting parameters according to the supplemented test data, so as to update the target fitting parameters.
例如,在步骤S351中,根据目标拟合参数(前述的A’、B’),采用仿真器进行仿真得到比对物理参数,比对物理参数例如包括阈值电压(用x”’表示)、有效驱动电流(用y”’表示)和漏电流(用z”’表示)。在仿真时,模型参数中的C是不确定的,因此可以采用多个C的取值分别与目标拟合参数A’、B’进行组合,从而针对各个C的取值分别进行仿真,由此得到多组比对物理参数。For example, in step S351, according to the target fitting parameters (the aforementioned A', B'), the emulator is used to perform simulation to obtain the comparison physical parameters, and the comparison physical parameters include, for example, threshold voltage (indicated by x"'), effective Drive current (denoted by y"') and leakage current (denoted by z"'). In the simulation, C in the model parameters is uncertain, so multiple values of C can be used to match the target fitting parameter A ', B', so as to simulate the values of each C separately, thus obtaining multiple sets of physical parameters for comparison.
例如,在步骤S352中,判断比对物理参数与多组测试数据的相似度是否大于相似度阈值。例如,比对物理参数为多组,分别对应于不同的C值。针对不同的C值,判断该组比对物理参数与在相同C值下测试得到的测试数据是否相同或相近,由此判断比对物理参数在C的取值范围区间内与多组测试数据整体上的相似度是否大于相似度阈值。例如,相似度阈值可以根据实际需求设置,例如根据所需要达到的相似性而定,本公开的实施例对此不作限制。For example, in step S352, it is judged whether the similarity between the compared physical parameter and multiple sets of test data is greater than a similarity threshold. For example, there are multiple groups of physical parameters compared, corresponding to different C values. For different C values, judge whether the group of comparison physical parameters is the same or similar to the test data obtained under the same C value, so as to judge whether the comparison physical parameters are within the value range of C and the test data of multiple groups as a whole Whether the similarity on is greater than the similarity threshold. For example, the similarity threshold may be set according to actual requirements, for example, according to the similarity that needs to be achieved, which is not limited in the embodiments of the present disclosure.
例如,比对物理参数与多组测试数据的相似度可以采用多种方式来定义。例如,在一些示例中,可以对比对物理参数进行拟合以得到第一拟合曲线,对多组测试数据进行拟合以得到第二拟合曲线,然后判断第一拟合曲线与第二拟合曲线在预设范围内的差值的和或者差值的方差,将差值的和或者差值的方差作为相似度。例如,在另一些示例中,可以分别计算多组比对物理参数与多组测试数据之间的差值的和,然后将该差值的和作为相似度。在上述两种相似度定义方式中,相似度的数值越大,说明比对物理参数与测试数据的差异越大,而相似度的数值越小,说明比对物理参数与测试数据的差异越小。For example, comparing the similarity between a physical parameter and multiple sets of test data can be defined in various ways. For example, in some examples, physical parameters can be fitted to obtain the first fitting curve, multiple sets of test data can be fitted to obtain the second fitting curve, and then the first fitting curve and the second fitting curve can be judged. The sum of the difference values or the variance of the difference values of the fitting curve within the preset range is used as the similarity. For example, in some other examples, the sum of differences between multiple sets of comparison physical parameters and multiple sets of test data may be calculated respectively, and then the sum of differences may be used as the similarity. In the above two similarity definition methods, the larger the value of the similarity, the greater the difference between the comparison physical parameters and the test data, and the smaller the similarity value, the smaller the difference between the comparison physical parameters and the test data .
需要说明的是,关于比对物理参数与测试数据的相似度的定义方式,可以根据数据类型和实际需求而定,只要能够反映比对物理参数与测试数据的相似性即可,本公开的实施例对 此不作限制。根据不同的定义方式,相似度的数值和比对物理参数与测试数据的差异可以呈正相关,也可以呈负相关,这由相似度的定义方式而确定。It should be noted that the definition of the similarity between the comparison physical parameters and the test data can be determined according to the data type and actual needs, as long as it can reflect the similarity between the comparison physical parameters and the test data, the implementation of the present disclosure Examples are not limited to this. According to different definition methods, the numerical value of the similarity degree and the difference between the comparison physical parameters and the test data can be positively correlated or negatively correlated, which is determined by the definition method of the similarity degree.
例如,在步骤S353中,若相似度大于相似度阈值,则补充测试数据,并根据补充的测试数据重新计算目标拟合参数,以更新目标拟合参数。例如,当相似度大于相似度阈值时,说明比对物理参数与测试数据的差异较大,因此需要对目标拟合参数A’、B’进行优化。例如,可以补充测试数据,也即,增大测试数据的样本量,然后采用步骤S32和S33的方式,通过两次统计分布计算,重新计算得到目标拟合参数,由此更新目标拟合参数。例如,得到更新后的目标拟合参数后,可以直接执行步骤S34,也即,直接利用更新后的目标拟合参数来选择备选模型。例如,也可以基于更新后的目标拟合参数,再次执行步骤S351和S352,若相似度不满足要求,则继续补充测试数据,再次更新目标拟合参数,直至相似度满足要求才停止更新目标拟合参数。For example, in step S353, if the similarity is greater than the similarity threshold, the test data is supplemented, and the target fitting parameters are recalculated according to the supplemented test data, so as to update the target fitting parameters. For example, when the similarity is greater than the similarity threshold, it means that the comparison physical parameters are quite different from the test data, so it is necessary to optimize the target fitting parameters A' and B'. For example, the test data can be supplemented, that is, the sample size of the test data is increased, and then the target fitting parameters are recalculated through two statistical distribution calculations in steps S32 and S33, thereby updating the target fitting parameters. For example, after the updated target fitting parameters are obtained, step S34 may be directly executed, that is, the candidate model is selected directly using the updated target fitting parameters. For example, steps S351 and S352 can also be executed again based on the updated target fitting parameters. If the similarity does not meet the requirements, then continue to supplement the test data, update the target fitting parameters again, and stop updating the target fitting parameters until the similarity meets the requirements. combined parameters.
通过上述方式,可以利用反馈方式得到更加准确的目标拟合参数,从而提升计算的准确性,便于后续得到更加准确的目标模型。Through the above method, the feedback method can be used to obtain more accurate target fitting parameters, thereby improving the accuracy of calculation and facilitating the subsequent acquisition of a more accurate target model.
图9为本公开一些实施例提供的一种建模方法的流程示意图。在一些示例中,如图9所示,该建模方法的具体执行流程如下。首先,对模型参数中的迁移率修正参数、源漏沟道电流修正参数、阈值电压漂移参数(例如前述的A、B、C)进行参数定义,并准备原始模型(例如BSIM模型)。然后,仿真遍历(也即,针对多个A、B、C的取值组合依次进行仿真),以生成模型库。接着,获取WAT或WS测试数据(例如前述的x’、y’、z’),作为训练样本取值。然后,进行第一次统计分布计算,也即,执行前述的步骤S32,得到与每组测试数据分别对应的多组备选拟合参数。接着,进行第二次统计分布计算,也即,执行前述的步骤S33,得到一组目标拟合参数(例如前述的A’、B’)。Fig. 9 is a schematic flowchart of a modeling method provided by some embodiments of the present disclosure. In some examples, as shown in FIG. 9 , the specific execution process of the modeling method is as follows. First, define the parameters of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters (such as the aforementioned A, B, and C) in the model parameters, and prepare the original model (such as the BSIM model). Then, the simulation traverses (that is, the simulation is performed sequentially for multiple value combinations of A, B, and C) to generate a model library. Next, obtain WAT or WS test data (such as the aforementioned x', y', z') as training sample values. Then, the first statistical distribution calculation is performed, that is, the aforementioned step S32 is executed to obtain multiple sets of candidate fitting parameters respectively corresponding to each set of test data. Next, perform the second statistical distribution calculation, that is, execute the aforementioned step S33 to obtain a set of target fitting parameters (such as the aforementioned A', B').
然后,基于目标拟合参数,进行写入参数验证,也即是,判断根据目标拟合参数所得到的比对物理参数与多组测试数据的相似度是否满足要求。若不满足要求,则继续补充WAT或WS测试数据,然后再次计算得到更新后的目标拟合参数。若满足要求,则基于目标拟合参数,并结合目标物理参数,在模型库中选择得到备选模型,由此得到备选模型的模型参数中的候选参数以作为目标候选参数(例如前述的C’)。最后,目标拟合参数和目标候选参数共同组成一组新的模型参数A’、B’、C’,该组模型参数对应的模型即为目标模型,也即是,二次开发得到的SPICE模型,将该SPICE模型输出即可。Then, write parameter verification is performed based on the target fitting parameters, that is, it is judged whether the similarity between the comparison physical parameters obtained according to the target fitting parameters and multiple sets of test data meets the requirements. If the requirements are not met, continue to supplement the WAT or WS test data, and then calculate again to obtain the updated target fitting parameters. If the requirements are met, based on the target fitting parameters and in conjunction with the target physical parameters, the candidate model is selected in the model library, thereby obtaining the candidate parameters in the model parameters of the candidate model as the target candidate parameters (such as the aforementioned C '). Finally, the target fitting parameters and target candidate parameters together form a new set of model parameters A', B', and C', and the model corresponding to this set of model parameters is the target model, that is, the SPICE model obtained from the secondary development , just export the SPICE model.
图10为本公开一些实施例提供的建模方法所得到的SPICE模型与原始SPICE模型及测试数据的比较示意图。如图10所示,原始SPICE模型例如是基于理论设计得到的,其性能与产品的实际测试数据有较大偏差。利用本公开实施例提供的建模方法得到的SPICE模 型为二次开发得到的SPICE模型,可见,该模型与测试数据的吻合度较高,能够较为准确地反映实际产品的特性。Fig. 10 is a schematic diagram of comparing the SPICE model obtained by the modeling method provided by some embodiments of the present disclosure with the original SPICE model and test data. As shown in FIG. 10 , the original SPICE model is obtained based on theoretical design, for example, and its performance deviates greatly from the actual test data of the product. The SPICE model obtained by using the modeling method provided by the embodiments of the present disclosure is a SPICE model obtained by secondary development. It can be seen that the model has a high degree of agreement with the test data and can more accurately reflect the characteristics of the actual product.
需要说明的是,本公开实施例提供的建模方法不限于上文中描述的步骤,还可以包括更多的步骤。各个步骤的执行顺序不受限制,虽然上文中以特定顺序描述了各个步骤,但这并不构成对本公开实施例的限制。It should be noted that the modeling method provided by the embodiment of the present disclosure is not limited to the steps described above, and may further include more steps. The execution sequence of the various steps is not limited, although the above described various steps in a specific order, this does not constitute a limitation to the embodiments of the present disclosure.
本公开至少一个实施例还提供一种建模装置。该建模装置可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自动化流程,能够处理大量的测试数据,处理效率高,处理速度快,准确性高,并且可以基于特定范围需求及测试数据完成模型的定制化二次开发。At least one embodiment of the present disclosure further provides a modeling device. The modeling device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and The customized secondary development of the model can be completed based on specific scope requirements and test data.
图11为本公开一些实施例提供的一种建模装置的示意框图。如图11所示,该建模装置100包括第一获取单元110、第二获取单元120、计算单元130。该建模装置100可以用于基于产品实测特性对SPICE模型进行二次开发。Fig. 11 is a schematic block diagram of a modeling device provided by some embodiments of the present disclosure. As shown in FIG. 11 , the modeling device 100 includes a first acquisition unit 110 , a second acquisition unit 120 , and a calculation unit 130 . The modeling device 100 can be used for secondary development of the SPICE model based on the measured characteristics of the product.
第一获取单元110配置为获取模型库。模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数。例如,第一获取单元110可以执行如图2所示的建模方法的步骤S10。第二获取单元120配置为获取多组测试数据。例如,第二获取单元120可以执行如图2所示的建模方法的步骤S20。计算单元130配置为根据多组测试数据、模型库中的多个初始模型以及多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。例如,计算单元130可以执行如图2所示的建模方法的步骤S30。The first obtaining unit 110 is configured to obtain a model library. The model library includes multiple initial models, and each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation. For example, the first obtaining unit 110 may execute step S10 of the modeling method as shown in FIG. 2 . The second acquiring unit 120 is configured to acquire multiple sets of test data. For example, the second acquiring unit 120 may execute step S20 of the modeling method as shown in FIG. 2 . The calculation unit 130 is configured to obtain the target model based on statistical distribution calculation according to multiple sets of test data, multiple initial models in the model library, model parameters and simulated physical parameters of the multiple initial models. For example, the computing unit 130 may execute step S30 of the modeling method as shown in FIG. 2 .
例如,第一获取单元110、第二获取单元120、计算单元130可以为硬件、软件、固件以及它们的任意可行的组合。例如,第一获取单元110、第二获取单元120、计算单元130可以为专用或通用的电路、芯片或装置等,也可以为处理器和存储器的结合。关于第一获取单元110、第二获取单元120、计算单元130的具体实现形式,本公开的实施例对此不作限制。For example, the first acquisition unit 110, the second acquisition unit 120, and the calculation unit 130 may be hardware, software, firmware, or any feasible combination thereof. For example, the first acquisition unit 110, the second acquisition unit 120, and the calculation unit 130 may be dedicated or general-purpose circuits, chips or devices, or may be a combination of processors and memories. Regarding specific implementation forms of the first acquiring unit 110 , the second acquiring unit 120 , and the calculating unit 130 , the embodiment of the present disclosure does not limit it.
需要说明的是,本公开的实施例中,建模装置100的各个单元与前述的建模方法的各个步骤对应,关于该建模装置100的具体功能可以参考上文中建模方法的相关描述,此处不再赘述。图11所示的建模装置100的组件和结构只是示例性的,而非限制性的,根据需要,该建模装置100还可以包括其他组件和结构。It should be noted that, in the embodiment of the present disclosure, each unit of the modeling device 100 corresponds to each step of the aforementioned modeling method. For the specific functions of the modeling device 100, please refer to the relevant description of the modeling method above. I won't repeat them here. The components and structures of the modeling device 100 shown in FIG. 11 are exemplary rather than limiting, and the modeling device 100 may also include other components and structures as required.
例如,每个初始模型所包括的一组模型参数包括拟合参数和候选参数。For example, each initial model includes a set of model parameters including fitted parameters and candidate parameters.
例如,计算单元130包括拟合模型确定单元、第一统计分布计算单元、第二统计分布计算单元、目标模型确定单元。For example, the calculation unit 130 includes a fitting model determination unit, a first statistical distribution calculation unit, a second statistical distribution calculation unit, and a target model determination unit.
拟合模型确定单元配置为基于多组测试数据中每组测试数据从模型库的多个初始模型中选择得到多个拟合模型。每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件。例如,每组测试数据包括多个测试物理参数。The fitting model determination unit is configured to select and obtain a plurality of fitting models from a plurality of initial models in the model library based on each set of test data in the plurality of sets of test data. Each set of test data corresponds to multiple fitting models, and the simulated physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition. For example, each set of test data includes multiple test physical parameters.
第一条件包括:拟合模型所包括的仿真物理参数中每个仿真物理参数与拟合模型对应的测试数据中相对应的每个测试物理参数分别相等,或者,拟合模型所包括的仿真物理参数中每个仿真物理参数与拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。The first condition includes: each simulated physical parameter in the simulated physical parameters included in the fitted model is equal to each corresponding tested physical parameter in the test data corresponding to the fitted model, or, the simulated physical parameters included in the fitted model The sum of the differences between each simulation physical parameter among the parameters and each corresponding test physical parameter in the test data corresponding to the fitting model is less than the first threshold.
第一统计分布计算单元配置为,对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数。The first statistical distribution calculation unit is configured to, for each set of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and obtain the fitting parameter corresponding to the maximum probability value as a backup Choose fitting parameters.
第二统计分布计算单元配置为对多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数。The second statistical distribution calculation unit is configured to perform statistical distribution calculation on the candidate fitting parameters respectively corresponding to multiple sets of test data, and obtain the candidate fitting parameter corresponding to the maximum probability value as the target fitting parameter.
目标模型确定单元配置为根据目标物理参数和目标拟合参数,从模型库的多个初始模型中选择得到备选模型,并将备选模型的模型参数中的候选参数作为目标候选参数,从而得到目标模型。例如,备选模型的仿真物理参数和模型参数中的拟合参数满足第二条件,目标模型的模型参数包括目标拟合参数和目标候选参数。The target model determination unit is configured to select a candidate model from multiple initial models in the model library according to the target physical parameters and target fitting parameters, and use the candidate parameters in the model parameters of the candidate model as target candidate parameters, thereby obtaining target model. For example, the simulation physical parameters of the candidate model and fitting parameters in the model parameters satisfy the second condition, and the model parameters of the target model include target fitting parameters and target candidate parameters.
第二条件包括:备选模型的仿真物理参数与目标物理参数相等,且备选模型的模型参数中的拟合参数与目标拟合参数相等,或者,备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与目标物理参数和目标拟合参数中的每个对应的参数的差值的和小于第二阈值。The second condition includes: the simulation physical parameters of the alternative model are equal to the target physical parameters, and the fitting parameters in the model parameters of the alternative model are equal to the target fitting parameters, or, the simulation physical parameters of the alternative model and the model parameters The sum of the differences between each of the fitting parameters and the target physical parameter and each corresponding parameter of the target fitting parameters is less than a second threshold.
例如,上述统计分布计算包括正态分布计算。For example, the above statistical distribution calculation includes normal distribution calculation.
例如,计算单元130还包括优化单元。优化单元配置为对目标拟合参数进行优化,以更新目标拟合参数。例如,优化单元进一步包括第一子单元、第二子单元和第三子单元。第一子单元配置为基于目标拟合参数,进行仿真得到比对物理参数。第二子单元配置为判断比对物理参数与多组测试数据的相似度是否大于相似度阈值。第三子单元配置为响应于相似度大于相似度阈值,补充测试数据,并根据补充的测试数据重新计算目标拟合参数,以更新目标拟合参数。For example, computing unit 130 also includes an optimization unit. The optimization unit is configured to optimize the target fitting parameters to update the target fitting parameters. For example, the optimization unit further includes a first subunit, a second subunit and a third subunit. The first subunit is configured to perform simulation based on the target fitting parameters to obtain the comparison physical parameters. The second subunit is configured to judge whether the similarity between the compared physical parameter and multiple sets of test data is greater than a similarity threshold. The third subunit is configured to supplement the test data in response to the similarity being greater than the similarity threshold, and recalculate the target fitting parameters according to the supplemented testing data, so as to update the target fitting parameters.
例如,第一获取单元110包括定义单元和仿真单元。定义单元配置为定义原始模型的模型参数的取值,并基于取值得到多个取值组合。仿真单元配置为基于多个取值组合对原始模型进行仿真,得到多组仿真物理参数,以得到包括多个初始模型的模型库。例如,多个取值组合分别作为多个初始模型的模型参数。在一些示例中,仿真单元还配置为基于多个取值组 合,利用脚本文件对原始模型进行仿真,得到多组仿真物理参数,以得到包括多个初始模型的模型库。For example, the first acquisition unit 110 includes a definition unit and a simulation unit. The definition unit is configured to define values of model parameters of the original model, and obtain multiple value combinations based on the values. The simulation unit is configured to simulate the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models. For example, multiple value combinations are respectively used as model parameters of multiple initial models. In some examples, the simulation unit is further configured to use a script file to simulate the original model based on multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including multiple initial models.
例如,原始模型包括伯克利短沟道绝缘栅场效应晶体管SPICE模型,也即BSIM模型。一组模型参数至少包括迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数,一组仿真物理参数至少包括阈值电压、有效驱动电流和漏电流。迁移率修正参数、源漏沟道电流修正参数、阈值电压漂移参数中的两个作为拟合参数,迁移率修正参数、源漏沟道电流修正参数、阈值电压漂移参数中的另外一个作为候选参数。例如,多组测试数据基于晶圆可接受度测试或晶圆筛选测试得到。For example, the original model includes the Berkeley Short Channel Insulated Gate Field Effect Transistor SPICE model, also known as the BSIM model. A set of model parameters at least includes mobility correction parameters, source-drain channel current correction parameters and threshold voltage drift parameters, and a set of simulation physical parameters at least includes threshold voltage, effective driving current and leakage current. Two of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters are used as fitting parameters, and the other one of the mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters is used as a candidate parameter . For example, multiple sets of test data are obtained based on wafer acceptability testing or wafer screening testing.
本公开至少一个实施例还提供一种电子设备。该电子设备可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自动化流程,能够处理大量的测试数据,处理效率高,处理速度快,准确性高,并且可以基于特定范围需求及测试数据完成模型的定制化二次开发。At least one embodiment of the present disclosure further provides an electronic device. The electronic device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and can Complete the customized secondary development of the model based on specific scope requirements and test data.
图12为本公开一些实施例提供的一种电子设备的示意框图。如图12所示,该电子设备200包括建模装置210。例如,建模装置210可以为图11所示的建模装置100。关于该电子设备200的相关说明可参考上文中关于建模装置100的描述,此处不再赘述。Fig. 12 is a schematic block diagram of an electronic device provided by some embodiments of the present disclosure. As shown in FIG. 12 , the electronic device 200 includes a modeling device 210 . For example, the modeling device 210 may be the modeling device 100 shown in FIG. 11 . For related descriptions about the electronic device 200 , reference may be made to the above description about the modeling apparatus 100 , which will not be repeated here.
本公开至少一个实施例还提供一种电子设备,该电子设备包括处理器和存储器,一个或多个计算机程序模块被存储在该存储器中并被配置为由该处理器执行,一个或多个计算机程序模块包括用于实现本公开任一实施例提供的建模方法。该电子设备可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自动化流程,能够处理大量的测试数据,处理效率高,处理速度快,准确性高,并且可以基于特定范围需求及测试数据完成模型的定制化二次开发。At least one embodiment of the present disclosure also provides an electronic device, the electronic device includes a processor and a memory, one or more computer program modules are stored in the memory and configured to be executed by the processor, one or more computer programs The program modules are used to realize the modeling method provided by any embodiment of the present disclosure. The electronic device can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, can realize the automatic process for the secondary development of the model, can process a large amount of test data, has high processing efficiency, fast processing speed, high accuracy, and can Complete the customized secondary development of the model based on specific scope requirements and test data.
图13为本公开一些实施例提供的另一种电子设备的示意框图。如图13所示,该电子设备300包括处理器310和存储器320。存储器320用于存储非暂时性计算机可读指令(例如一个或多个计算机程序模块)。处理器310用于运行非暂时性计算机可读指令,非暂时性计算机可读指令被处理器310运行时可以执行上文所述的建模方法中的一个或多个步骤。存储器320和处理器310可以通过总线系统和/或其它形式的连接机构(未示出)互连。Fig. 13 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure. As shown in FIG. 13 , the electronic device 300 includes a processor 310 and a memory 320 . Memory 320 is used to store non-transitory computer readable instructions (eg, one or more computer program modules). The processor 310 is configured to execute non-transitory computer-readable instructions, and when the non-transitory computer-readable instructions are executed by the processor 310, one or more steps in the modeling method described above may be performed. The memory 320 and the processor 310 may be interconnected by a bus system and/or other forms of connection mechanisms (not shown).
例如,处理器310可以是中央处理单元(CPU)、图形处理单元(GPU)、数字信号处理器(DSP)或者具有数据处理能力和/或程序执行能力的其它形式的处理单元,例如现场可编程门阵列(FPGA)等;例如,中央处理单元(CPU)可以为X86或ARM架构等。处理器310可以为通用处理器或专用处理器,可以控制电子设备300中的其它组件以执行期望的功能。For example, the processor 310 may be a central processing unit (CPU), a graphics processing unit (GPU), a digital signal processor (DSP), or other forms of processing units having data processing capabilities and/or program execution capabilities, such as field programmable Gate array (FPGA), etc.; for example, the central processing unit (CPU) can be X86 or ARM architecture, etc. The processor 310 can be a general-purpose processor or a special-purpose processor, and can control other components in the electronic device 300 to perform desired functions.
例如,存储器320可以包括一个或多个计算机程序产品的任意组合,计算机程序产品可以包括各种形式的计算机可读存储介质,例如易失性存储器和/或非易失性存储器。易失性存储器例如可以包括随机存取存储器(RAM)和/或高速缓冲存储器(cache)等。非易失性存储器例如可以包括只读存储器(ROM)、硬盘、可擦除可编程只读存储器(EPROM)、便携式紧致盘只读存储器(CD-ROM)、USB存储器、闪存等。在计算机可读存储介质上可以存储一个或多个计算机程序模块,处理器310可以运行一个或多个计算机程序模块,以实现电子设备300的各种功能。在计算机可读存储介质中还可以存储各种应用程序和各种数据以及应用程序使用和/或产生的各种数据等。For example, memory 320 may include any combination of one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or nonvolatile memory. The volatile memory may include random access memory (RAM) and/or cache memory (cache), etc., for example. Non-volatile memory may include, for example, read only memory (ROM), hard disks, erasable programmable read only memory (EPROM), compact disc read only memory (CD-ROM), USB memory, flash memory, and the like. One or more computer program modules can be stored on the computer-readable storage medium, and the processor 310 can run one or more computer program modules to realize various functions of the electronic device 300 . Various application programs, various data, and various data used and/or generated by the application programs can also be stored in the computer-readable storage medium.
需要说明的是,本公开的实施例中,电子设备300的具体功能和技术效果可以参考上文中关于建模方法的描述,此处不再赘述。It should be noted that, in the embodiments of the present disclosure, for the specific functions and technical effects of the electronic device 300 , reference may be made to the description about the modeling method above, which will not be repeated here.
图14为本公开一些实施例提供的另一种电子设备的示意框图。如图14所示,该电子设备400例如适于用来实施本公开实施例提供的建模方法。电子设备400可以是终端设备或服务器等。需要注意的是,图14示出的电子设备400仅仅是一个示例,其不会对本公开实施例的功能和使用范围带来任何限制。Fig. 14 is a schematic block diagram of another electronic device provided by some embodiments of the present disclosure. As shown in FIG. 14 , the electronic device 400 is, for example, suitable for implementing the modeling method provided by the embodiment of the present disclosure. The electronic device 400 may be a terminal device or a server. It should be noted that the electronic device 400 shown in FIG. 14 is only an example, which does not impose any limitation on the functions and application scope of the embodiments of the present disclosure.
如图14所示,电子设备400可以包括处理装置(例如中央处理器、图形处理器等)41,其可以根据存储在只读存储器(ROM)42中的程序或者从存储装置48加载到随机访问存储器(RAM)43中的程序而执行各种适当的动作和处理。在RAM 43中,还存储有电子设备400操作所需的各种程序和数据。处理装置41、ROM 42以及RAM 43通过总线44彼此相连。输入/输出(I/O)接口45也连接至总线44。As shown in FIG. 14 , the electronic device 400 may include a processing device (such as a central processing unit, a graphics processing unit, etc.) Various appropriate actions and processes are executed by programs in the memory (RAM) 43 . In the RAM 43, various programs and data necessary for the operation of the electronic device 400 are also stored. The processing device 41, the ROM 42, and the RAM 43 are connected to each other by a bus 44. An input/output (I/O) interface 45 is also connected to the bus 44 .
通常,以下装置可以连接至I/O接口45:包括例如触摸屏、触摸板、键盘、鼠标、摄像头、麦克风、加速度计、陀螺仪等的输入装置46;包括例如液晶显示器(LCD)、扬声器、振动器等的输出装置47;包括例如磁带、硬盘等的存储装置48;以及通信装置49。通信装置49可以允许电子设备400与其他电子设备进行无线或有线通信以交换数据。虽然图14示出了具有各种装置的电子设备400,但应理解的是,并不要求实施或具备所有示出的装置,电子设备400可以替代地实施或具备更多或更少的装置。Typically, the following devices can be connected to the I/O interface 45: input devices 46 including, for example, a touch screen, touchpad, keyboard, mouse, camera, microphone, accelerometer, gyroscope, etc.; including, for example, a liquid crystal display (LCD), speaker, vibration an output device 47 such as a computer; a storage device 48 including, for example, a magnetic tape, a hard disk, etc.; and a communication device 49. The communication means 49 may allow the electronic device 400 to communicate with other electronic devices wirelessly or by wire to exchange data. Although FIG. 14 shows electronic device 400 having various means, it should be understood that it is not required to implement or have all of the means shown, and electronic device 400 may alternatively implement or have more or fewer means.
例如,根据本公开的实施例,图2所示的建模方法可以被实现为计算机软件程序。例如,本公开的实施例包括一种计算机程序产品,其包括承载在非暂态计算机可读介质上的计算机程序,该计算机程序包括用于执行上述建模方法的程序代码。在这样的实施例中,该计算机程序可以通过通信装置49从网络上被下载和安装,或者从存储装置48安装,或者从ROM 42安装。在该计算机程序被处理装置41执行时,可以实现本公开实施例提供的建模方法中限定的功能。For example, according to an embodiment of the present disclosure, the modeling method shown in FIG. 2 can be implemented as a computer software program. For example, embodiments of the present disclosure include a computer program product including a computer program carried on a non-transitory computer readable medium, the computer program including program code for executing the above-mentioned modeling method. In such an embodiment, the computer program may be downloaded and installed from the network via the communication means 49, or installed from the storage means 48, or installed from the ROM 42. When the computer program is executed by the processing device 41, the functions defined in the modeling method provided by the embodiments of the present disclosure can be realized.
本公开至少一个实施例还提供一种存储介质,用于存储非暂时性计算机可读指令,当该非暂时性计算机可读指令由计算机执行时可以实现本公开任一实施例提供的建模方法。利用该存储介质,可以解决人工迭代过程复杂繁琐及效率较低的问题,可以实现针对模型的二次开发的自动化流程,能够处理大量的测试数据,处理效率高,处理速度快,准确性高,并且可以基于特定范围需求及测试数据完成模型的定制化二次开发。At least one embodiment of the present disclosure further provides a storage medium for storing non-transitory computer-readable instructions. When the non-transitory computer-readable instructions are executed by a computer, the modeling method provided by any embodiment of the present disclosure can be implemented. . Using this storage medium can solve the complex and cumbersome and low-efficiency problems of the manual iteration process, realize the automated process for the secondary development of the model, and be able to process a large amount of test data with high processing efficiency, fast processing speed, and high accuracy. And the customized secondary development of the model can be completed based on specific scope requirements and test data.
图15为本公开一些实施例提供的一种存储介质的示意图。如图15所示,存储介质500用于存储非暂时性计算机可读指令510。例如,当非暂时性计算机可读指令510由计算机执行时可以执行根据上文所述的建模方法中的一个或多个步骤。Fig. 15 is a schematic diagram of a storage medium provided by some embodiments of the present disclosure. As shown in FIG. 15 , the storage medium 500 is used to store non-transitory computer readable instructions 510 . For example, one or more steps in the modeling method described above may be performed when the non-transitory computer readable instructions 510 are executed by a computer.
例如,该存储介质500可以应用于上述电子设备中。例如,存储介质500可以为图13所示的电子设备300中的存储器320。例如,关于存储介质500的相关说明可以参考图13所示的电子设备300中的存储器320的相应描述,此处不再赘述。For example, the storage medium 500 can be applied to the above-mentioned electronic devices. For example, the storage medium 500 may be the memory 320 in the electronic device 300 shown in FIG. 13 . For example, for related descriptions about the storage medium 500, reference may be made to the corresponding description of the memory 320 in the electronic device 300 shown in FIG. 13 , which will not be repeated here.
有以下几点需要说明:The following points need to be explained:
(1)本公开实施例附图只涉及到本公开实施例涉及到的结构,其他结构可参考通常设计。(1) Embodiments of the present disclosure The drawings only relate to the structures involved in the embodiments of the present disclosure, and other structures may refer to common designs.
(2)在不冲突的情况下,本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。(2) In the case of no conflict, the embodiments of the present disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.
以上所述,仅为本公开的具体实施方式,但本公开的保护范围并不局限于此,本公开的保护范围应以所述权利要求的保护范围为准。The above description is only a specific implementation manner of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims (21)

  1. 一种建模方法,包括:A modeling method comprising:
    获取模型库,其中,所述模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;Obtaining a model library, wherein the model library includes a plurality of initial models, each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation;
    获取多组测试数据;Obtain multiple sets of test data;
    根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。According to the multiple sets of test data, the multiple initial models in the model library, and the model parameters and simulated physical parameters of the multiple initial models, the target model is obtained based on statistical distribution calculation.
  2. 根据权利要求1所述的建模方法,其中,每个初始模型所包括的一组模型参数包括拟合参数和候选参数,The modeling method according to claim 1, wherein a set of model parameters included in each initial model includes fitting parameters and candidate parameters,
    根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到所述目标模型,包括:According to the multiple sets of test data, multiple initial models in the model library, and model parameters and simulated physical parameters of the multiple initial models, based on statistical distribution calculations, the target model is obtained, including:
    基于所述多组测试数据中每组测试数据从所述模型库的多个初始模型中选择得到多个拟合模型,其中,每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件;Based on each set of test data in the multiple sets of test data, a plurality of fitting models are selected from a plurality of initial models in the model library, wherein each set of test data corresponds to a plurality of fitting models, and each set of test data corresponds to The simulated physical parameters included in the fitted model satisfy the first condition;
    对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数;For each group of test data, the fitting parameters in the model parameters of the fitting model corresponding to the group of test data are calculated for statistical distribution, and the fitting parameters corresponding to the maximum probability value are obtained as alternative fitting parameters;
    对所述多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数;Perform statistical distribution calculation on the alternative fitting parameters corresponding to the plurality of sets of test data respectively, and obtain the alternative fitting parameters corresponding to the maximum probability value as the target fitting parameters;
    根据目标物理参数和所述目标拟合参数,从所述模型库的多个初始模型中选择得到备选模型,并将所述备选模型的模型参数中的候选参数作为目标候选参数,从而得到所述目标模型;According to the target physical parameters and the target fitting parameters, a candidate model is selected from a plurality of initial models in the model library, and the candidate parameters in the model parameters of the candidate model are used as target candidate parameters, thereby obtaining said target model;
    其中,所述备选模型的仿真物理参数和模型参数中的拟合参数满足第二条件,所述目标模型的模型参数包括所述目标拟合参数和所述目标候选参数。Wherein, the simulation physical parameters of the candidate model and the fitting parameters of the model parameters satisfy the second condition, and the model parameters of the target model include the target fitting parameters and the target candidate parameters.
  3. 根据权利要求2所述的建模方法,其中,每组测试数据包括多个测试物理参数,The modeling method according to claim 2, wherein each group of test data comprises a plurality of test physical parameters,
    所述第一条件包括:The first condition includes:
    所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数分别相等,或者Each of the simulated physical parameters included in the fitting model is equal to each corresponding test physical parameter in the test data corresponding to the fitting model, or
    所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。A sum of differences between each simulated physical parameter included in the fitting model and each corresponding test physical parameter in the test data corresponding to the fitting model is less than a first threshold.
  4. 根据权利要求2或3所述的建模方法,其中,所述第二条件包括:The modeling method according to claim 2 or 3, wherein the second condition comprises:
    所述备选模型的仿真物理参数与所述目标物理参数相等,且所述备选模型的模型参数中的拟合参数与所述目标拟合参数相等,或者The simulated physical parameters of the alternative model are equal to the target physical parameters, and the fitting parameters in the model parameters of the alternative model are equal to the target fitting parameters, or
    所述备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与所述目标物理 参数和所述目标拟合参数中的每个对应的参数的差值的和小于第二阈值。The sum of the difference between each of the simulation physical parameters and the fitting parameters in the model parameters of the candidate model and each corresponding parameter of the target physical parameter and the target fitting parameters is less than the second threshold.
  5. 根据权利要求2-4任一项所述的建模方法,其中,根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到所述目标模型,还包括:The modeling method according to any one of claims 2-4, wherein, based on the multiple sets of test data, multiple initial models in the model library, and model parameters and simulation physical parameters of the multiple initial models , based on the statistical distribution calculation, the target model is obtained, which also includes:
    对所述目标拟合参数进行优化,以更新所述目标拟合参数。Optimizing the target fitting parameters to update the target fitting parameters.
  6. 根据权利要求5所述的建模方法,其中,对所述目标拟合参数进行优化,以更新所述目标拟合参数,包括:The modeling method according to claim 5, wherein optimizing the target fitting parameters to update the target fitting parameters comprises:
    基于所述目标拟合参数,进行仿真得到比对物理参数;Based on the target fitting parameters, performing simulation to obtain comparison physical parameters;
    判断所述比对物理参数与所述多组测试数据的相似度是否大于相似度阈值;Judging whether the similarity between the compared physical parameters and the multiple sets of test data is greater than a similarity threshold;
    若所述相似度大于所述相似度阈值,则补充测试数据,并根据补充的测试数据重新计算所述目标拟合参数,以更新所述目标拟合参数。If the similarity is greater than the similarity threshold, supplement test data, and recalculate the target fitting parameters according to the supplemented test data, so as to update the target fitting parameters.
  7. 根据权利要求1-6任一项所述的建模方法,其中,获取所述模型库包括:The modeling method according to any one of claims 1-6, wherein obtaining the model library comprises:
    定义原始模型的模型参数的取值,并基于所述取值得到多个取值组合;Define the values of the model parameters of the original model, and obtain multiple value combinations based on the values;
    基于所述多个取值组合对所述原始模型进行仿真,得到多组仿真物理参数,以得到包括所述多个初始模型的模型库;Simulating the original model based on the multiple value combinations to obtain multiple sets of simulated physical parameters to obtain a model library including the multiple initial models;
    其中,所述多个取值组合分别作为所述多个初始模型的模型参数。Wherein, the multiple value combinations are respectively used as model parameters of the multiple initial models.
  8. 根据权利要求7所述的建模方法,其中,基于所述多个取值组合对所述原始模型进行仿真,得到所述多组仿真物理参数,以得到包括所述多个初始模型的模型库,包括:The modeling method according to claim 7, wherein the original model is simulated based on the multiple value combinations to obtain the multiple sets of simulated physical parameters, so as to obtain a model library including the multiple initial models ,include:
    基于所述多个取值组合,利用脚本文件对所述原始模型进行仿真,得到所述多组仿真物理参数,以得到包括所述多个初始模型的模型库。Based on the multiple value combinations, the script file is used to simulate the original model to obtain the multiple sets of simulated physical parameters, so as to obtain a model library including the multiple initial models.
  9. 根据权利要求1-8任一所述的建模方法,其中,所述一组模型参数至少包括迁移率修正参数、源漏沟道电流修正参数和阈值电压漂移参数,所述一组仿真物理参数至少包括阈值电压、有效驱动电流和漏电流。The modeling method according to any one of claims 1-8, wherein the set of model parameters at least includes mobility correction parameters, source-drain channel current correction parameters, and threshold voltage drift parameters, and the set of simulation physical parameters Including at least threshold voltage, effective drive current and leakage current.
  10. 根据权利要求9所述的建模方法,其中,所述迁移率修正参数、所述源漏沟道电流修正参数、所述阈值电压漂移参数中的两个作为所述拟合参数,The modeling method according to claim 9, wherein two of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter are used as the fitting parameters,
    所述迁移率修正参数、所述源漏沟道电流修正参数、所述阈值电压漂移参数中的另外一个作为所述候选参数。The other one of the mobility correction parameter, the source-drain channel current correction parameter, and the threshold voltage drift parameter is used as the candidate parameter.
  11. 根据权利要求1-10任一所述的建模方法,其中,所述多组测试数据基于晶圆可接受度测试或晶圆筛选测试得到。The modeling method according to any one of claims 1-10, wherein the multiple sets of test data are obtained based on wafer acceptability test or wafer screening test.
  12. 根据权利要求1-11任一所述的建模方法,其中,所述建模方法用于基于产品实测特性对SPICE模型进行二次开发。The modeling method according to any one of claims 1-11, wherein the modeling method is used for secondary development of the SPICE model based on the measured characteristics of the product.
  13. 一种建模装置,包括:A modeling device comprising:
    第一获取单元,配置为获取模型库,其中,所述模型库包括多个初始模型,每个初始模型包括一组模型参数和对应的经过仿真生成的一组仿真物理参数;The first acquisition unit is configured to acquire a model library, wherein the model library includes a plurality of initial models, and each initial model includes a set of model parameters and a corresponding set of simulated physical parameters generated through simulation;
    第二获取单元,配置为获取多组测试数据;The second acquisition unit is configured to acquire multiple sets of test data;
    计算单元,配置为根据所述多组测试数据、所述模型库中的多个初始模型以及所述多个初始模型的模型参数和仿真物理参数,基于统计分布计算,得到目标模型。The calculation unit is configured to obtain a target model based on statistical distribution calculation according to the multiple sets of test data, the multiple initial models in the model library, and the model parameters and simulated physical parameters of the multiple initial models.
  14. 根据权利要求13所述的建模装置,其中,每个初始模型所包括的一组模型参数包括拟合参数和候选参数;The modeling apparatus according to claim 13, wherein the set of model parameters included in each initial model includes fitting parameters and candidate parameters;
    所述计算单元包括拟合模型确定单元、第一统计分布计算单元、第二统计分布计算单元和目标模型确定单元;The calculation unit includes a fitting model determination unit, a first statistical distribution calculation unit, a second statistical distribution calculation unit and a target model determination unit;
    所述拟合模型确定单元配置为基于所述多组测试数据中每组测试数据从所述模型库的多个初始模型中选择得到多个拟合模型,其中,每组测试数据对应于多个拟合模型,每组测试数据对应的拟合模型所包括的仿真物理参数满足第一条件;The fitting model determining unit is configured to select a plurality of fitting models from a plurality of initial models in the model library based on each set of test data in the plurality of sets of test data, wherein each set of test data corresponds to a plurality of Fitting the model, the simulation physical parameters included in the fitting model corresponding to each set of test data satisfy the first condition;
    所述第一统计分布计算单元配置为,对于每组测试数据,对该组测试数据对应的拟合模型的模型参数中的拟合参数进行统计分布计算,得到最大概率值对应的拟合参数以作为备选拟合参数;The first statistical distribution calculation unit is configured to, for each set of test data, perform statistical distribution calculation on the fitting parameters in the model parameters of the fitting model corresponding to the set of test data, and obtain the fitting parameters corresponding to the maximum probability value as follows: as an alternative fitting parameter;
    所述第二统计分布计算单元配置为对所述多组测试数据分别对应的备选拟合参数进行统计分布计算,得到最大概率值对应的备选拟合参数以作为目标拟合参数;The second statistical distribution calculation unit is configured to perform statistical distribution calculation on the candidate fitting parameters respectively corresponding to the plurality of sets of test data, and obtain the candidate fitting parameter corresponding to the maximum probability value as the target fitting parameter;
    所述目标模型确定单元配置为根据目标物理参数和所述目标拟合参数,从所述模型库的多个初始模型中选择得到备选模型,并将所述备选模型的模型参数中的候选参数作为目标候选参数,从而得到所述目标模型;The target model determining unit is configured to select a candidate model from a plurality of initial models in the model library according to the target physical parameter and the target fitting parameter, and select the candidate model among the model parameters of the candidate model Parameters are used as target candidate parameters, thereby obtaining the target model;
    其中,所述备选模型的仿真物理参数和模型参数中的拟合参数满足第二条件,所述目标模型的模型参数包括所述目标拟合参数和所述目标候选参数。Wherein, the simulation physical parameters of the candidate model and the fitting parameters of the model parameters satisfy the second condition, and the model parameters of the target model include the target fitting parameters and the target candidate parameters.
  15. 根据权利要求14所述的建模装置,其中,每组测试数据包括多个测试物理参数,The modeling device according to claim 14, wherein each set of test data includes a plurality of test physical parameters,
    所述第一条件包括:The first condition includes:
    所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数分别相等,或者Each of the simulated physical parameters included in the fitting model is equal to each corresponding test physical parameter in the test data corresponding to the fitting model, or
    所述拟合模型所包括的仿真物理参数中每个仿真物理参数与所述拟合模型对应的测试数据中相对应的每个测试物理参数的差值的和小于第一阈值。A sum of differences between each simulated physical parameter included in the fitting model and each corresponding test physical parameter in the test data corresponding to the fitting model is less than a first threshold.
  16. 根据权利要求14或15所述的建模装置,其中,所述第二条件包括:The modeling device according to claim 14 or 15, wherein the second condition comprises:
    所述备选模型的仿真物理参数与所述目标物理参数相等,且所述备选模型的模型参数中的拟合参数与所述目标拟合参数相等,或者The simulated physical parameters of the alternative model are equal to the target physical parameters, and the fitting parameters in the model parameters of the alternative model are equal to the target fitting parameters, or
    所述备选模型的仿真物理参数和模型参数中的拟合参数中的每个参数与所述目标物理参数和所述目标拟合参数中的每个对应的参数的差值的和小于第二阈值。The sum of the difference between each of the simulation physical parameters and the fitting parameters in the model parameters of the candidate model and each corresponding parameter of the target physical parameter and the target fitting parameters is less than the second threshold.
  17. 根据权利要求13-16任一项所述的建模装置,其中,所述计算单元还包括优化单元;The modeling device according to any one of claims 13-16, wherein the calculation unit further includes an optimization unit;
    所述优化单元配置为对所述目标拟合参数进行优化,以更新所述目标拟合参数。The optimization unit is configured to optimize the target fitting parameters to update the target fitting parameters.
  18. 根据权利要求17所述的建模装置,其中,所述优化单元包括第一子单元、第二子 单元和第三子单元;The modeling device according to claim 17, wherein said optimization unit comprises a first subunit, a second subunit and a third subunit;
    所述第一子单元配置为基于所述目标拟合参数,进行仿真得到比对物理参数;The first subunit is configured to perform simulation based on the target fitting parameter to obtain a comparison physical parameter;
    所述第二子单元配置为判断所述比对物理参数与所述多组测试数据的相似度是否大于相似度阈值;The second subunit is configured to determine whether the similarity between the compared physical parameter and the multiple sets of test data is greater than a similarity threshold;
    所述第三子单元配置为,若所述相似度大于所述相似度阈值,则补充测试数据,并根据补充的测试数据重新计算所述目标拟合参数,以更新所述目标拟合参数。The third subunit is configured to supplement test data if the similarity is greater than the similarity threshold, and recalculate the target fitting parameters according to the supplemented test data, so as to update the target fitting parameters.
  19. 一种电子设备,包括如权利要求13-18任一所述的建模装置。An electronic device, comprising the modeling device according to any one of claims 13-18.
  20. 一种电子设备,包括:An electronic device comprising:
    处理器;processor;
    存储器,包括一个或多个计算机程序模块;memory, including one or more computer program modules;
    其中,所述一个或多个计算机程序模块被存储在所述存储器中并被配置为由所述处理器执行,所述一个或多个计算机程序模块包括用于实现权利要求1-12任一所述的建模方法的指令。Wherein, the one or more computer program modules are stored in the memory and are configured to be executed by the processor, and the one or more computer program modules include components for implementing any of claims 1-12. Instructions for the modeling method described above.
  21. 一种存储介质,用于存储非暂时性计算机可读指令,当所述非暂时性计算机可读指令由计算机执行时可以实现权利要求1-12任一所述的建模方法。A storage medium for storing non-transitory computer-readable instructions, when the non-transitory computer-readable instructions are executed by a computer, the modeling method described in any one of claims 1-12 can be realized.
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