WO2022265180A1 - Diplexeur à large bande comprenant un montant de mise à la terre pour la correction des artefacts - Google Patents

Diplexeur à large bande comprenant un montant de mise à la terre pour la correction des artefacts Download PDF

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Publication number
WO2022265180A1
WO2022265180A1 PCT/KR2022/001803 KR2022001803W WO2022265180A1 WO 2022265180 A1 WO2022265180 A1 WO 2022265180A1 KR 2022001803 W KR2022001803 W KR 2022001803W WO 2022265180 A1 WO2022265180 A1 WO 2022265180A1
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WIPO (PCT)
Prior art keywords
housing
stub
pass filter
conductive pattern
output port
Prior art date
Application number
PCT/KR2022/001803
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English (en)
Korean (ko)
Inventor
허광명
김영호
정태완
Original Assignee
주식회사 이너트론
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Publication date
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Priority to JP2022562962A priority Critical patent/JP7527040B2/ja
Publication of WO2022265180A1 publication Critical patent/WO2022265180A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2135—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/203—Strip line filters
    • H01P1/20309—Strip line filters with dielectric resonator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present disclosure relates to a wideband diplexer, and more particularly, to a wideband diplexer for removing interference with a high-pass filter (5G) of a spurious generated in a low-pass filter (4G).
  • 5G high-pass filter
  • 4G low-pass filter
  • the Massive Multiple-input and multiple-output (MIMO) system using multiple antennas is a key technology for 5G communication to maximize channel capacity and ensure signal reliability.
  • WBD Wide Band Diplexer
  • the diplexer may be implemented in the form of a cavity or a printed circuit board (PCB).
  • PCB printed circuit board
  • the present disclosure provides a wideband diplexer of a PCB structure for processing signals of 4G and 5G, respectively.
  • the present disclosure provides a PCB-based diplexer capable of preventing interference due to spurious while constantly implementing low-band (4G) and high-band (5G) phase delays.
  • a broadband diplexer includes a printed circuit board (PCB) board including a low pass filter (LPF) and a high pass filter (HPF), and a housing for mounting the PCB board.
  • PCB printed circuit board
  • the PCB substrate includes a dielectric layer formed inside the housing and spaced apart from each of the upper and lower surfaces of the housing, a first conductive pattern formed on at least a portion of the upper surface of the dielectric layer, and formed on at least a portion of the lower surface of the dielectric layer.
  • a second conductive pattern is included.
  • the housing extends vertically from an upper surface of the housing to a lower surface of the housing, spaced apart from a side surface of the housing, and penetrates a partial region of the dielectric layer in which neither the first conductive pattern nor the second conductive pattern is formed. , contains at least one ground pole.
  • the ground pillar may reduce an effect of a spurious of the first signal matching the low-pass filter on a target band of the second signal matching the high-pass filter.
  • the ground pillar has a cylindrical shape with a diameter of 5 to 6 mm and a height of 11 to 12 mm, an upper surface of the ground pillar is connected to an upper surface of the housing, and a lower surface of the ground pillar is connected to a lower surface of the housing. It can be.
  • the PCB substrate may be connected to an antenna input/output port, a 4G input/output port, and a 5G input/output port, respectively, through connection holes provided on a side surface of the housing.
  • the low pass filter performs a function of passing a 4G band between the antenna input/output port and the 4G input/output port
  • the high pass filter performs a function of passing a 5G band between the antenna input/output port and the 5G input/output port. can be performed.
  • the housing includes a first ground pillar disposed close to a conductive pattern portion where the antenna input/output port and the low pass filter are connected, and a conductive pattern portion where the antenna input/output port and the high pass filter are connected. and a third ground pillar disposed between two stubs matched with each of the two resonators constituting the high-pass filter.
  • the low-pass filter includes a first stub implementing a resonator having a first transmission zero, a second stub implementing a resonator having a second transmission zero, a third stub implementing a resonator having a third transmission zero, and the 4G
  • a fourth strip line connecting the third stub and the antenna input/output port.
  • the high-pass filter includes a fourth stub implementing a resonator having a fourth transmission zero point, a fifth stub implementing a resonator having a fifth transmission zero point, and a first connecting the 5G input/output port and the fourth stub. It may include an open coupling part, a second open coupling part connecting between the fourth stub and the fifth stub, and a third open coupling part connecting between the fifth stub and the antenna input/output port.
  • the housing is formed from a region of the lower surface of the housing facing at least a portion of the second conductive pattern to a point that is vertically extended in the direction of the second conductive pattern and is closely spaced from the second conductive pattern.
  • the fourth ground pillar extends vertically in the direction of the second conductive pattern from an area of the lower surface of the housing that faces a portion of the second conductive pattern matched with the resonator of the high-pass filter.
  • the fourth ground pillar may have a square pillar shape having a height of 3 mm to 5 mm.
  • a wideband diplexer includes a Printed Circuit Board (PCB) board including a low pass filter (LPF) and a high pass filter (HPF), and a housing for mounting the PCB board.
  • the PCB substrate includes a dielectric layer formed inside the housing and spaced apart from each of the upper and lower surfaces of the housing, a first conductive pattern formed on at least a portion of the upper surface of the dielectric layer, and formed on at least a portion of the lower surface of the dielectric layer.
  • a second conductive pattern is included.
  • the housing extends vertically in the direction of the second conductive pattern from a region facing at least a portion of the second conductive pattern on the lower surface of the housing to a point closely spaced apart from the second conductive pattern. Contains one ground pole.
  • the broadband diplexer according to the present disclosure has the effect of improving productivity as well as reducing costs by excluding a tuning process affecting phase delay characteristics.
  • the broadband diplexer according to the present disclosure has the advantage that the filter of the PCB structure can have a uniform phase delay characteristic in a non-tuning manner.
  • the wideband diplexer according to the present disclosure has an effect of suppressing a situation in which interference with the high-pass filter occurs according to the spurious of the low-pass signal generated through the low-pass filter.
  • the wideband diplexer according to the present disclosure has an advantage in that signal processing quality is improved because isolation of each of the low-pass filter and the high-pass filter is improved.
  • FIG. 1 is a perspective view for explaining the structure of a diplexer according to an embodiment of the present disclosure
  • Figure 2a is a plan view (top view) for explaining the configuration of the diplexer shown in Figure 1,
  • 2B is a diagram showing an equivalent circuit of each of a low-pass filter and a high-pass filter constituting the diplexer shown in FIG. 1;
  • FIG. 3 is a graph for explaining the signal characteristics of the diplexer shown in FIG. 1 and problems related to spurious;
  • 4A and 4B are diagrams for explaining the structure of a diplexer including a ground pillar for resolving spurious according to an embodiment of the present disclosure
  • Figure 5 is a graph for explaining the signal characteristics of the diplexer shown in Figures 4a to 4b;
  • 6A and 6B are diagrams for explaining the structure of a diplexer including a ground pillar for resolving spurious according to an embodiment of the present disclosure
  • Figure 7 is a graph for explaining the signal characteristics of the diplexer shown in Figures 6a to 6b.
  • FIG. 8 is a diagram for explaining a structure of a diplexer including a ground pillar for resolving spurious noise according to an embodiment of the present disclosure.
  • ordinal numbers such as “first” and “second” may be used to distinguish between elements. These ordinal numbers are used to distinguish the same or similar components from each other, and the meaning of the term should not be construed as being limited due to the use of these ordinal numbers. For example, the order of use or arrangement of elements associated with such ordinal numbers should not be limited by the number. If necessary, each ordinal number may be used interchangeably.
  • a part when a part is said to be connected to another part, this includes not only a direct connection but also an indirect connection through another configuration.
  • the meaning that a certain part includes a certain component means that it may further include other components without excluding other components unless otherwise stated.
  • FIG. 1 is a perspective view for explaining the structure of a diplexer according to an embodiment of the present disclosure.
  • the diplexer 10 of FIG. 1 may be mounted on a base station antenna, but is not limited thereto.
  • the diplexer 10 may be installed in various terminal devices other than the base station.
  • the diplexer 10 may include a housing 100 for mounting a PCB substrate.
  • the inside of the housing 100 may be in a vacuum state.
  • the housing 100 may be implemented to mount a PCB substrate in an angular shape having a top surface, a bottom surface, and a plurality of side surfaces.
  • the plurality of side surfaces may correspond to a plurality of planes vertically connected to adjacent side surfaces.
  • the housing may have various other shapes.
  • a PCB substrate including the dielectric layer 210 , the first conductive pattern 220 - 1 , and the second conductive pattern 220 - 2 may be included in the housing 100 .
  • the dielectric layer 210 may be formed spaced apart from the upper and lower surfaces of the housing, the first conductive pattern 220-1 is formed on the upper surface of the dielectric layer 210, and the second conductive pattern 220-1 is formed on the lower surface of the dielectric layer 220.
  • 2 conductive patterns 220-2 may be formed.
  • the diplexer 10 may include a PCB substrate in the form of a strip line including the conductive patterns 220-1 and 2 formed on both sides of a dielectric layer, and the PCB substrate may include a housing ( 100) can be implemented in a form included in.
  • each filter is implemented through the principle of coupling between lines implemented through the first conductive pattern 220-1 and the second conductive pattern 220-2, resonance on the line, and multi-impedance connection.
  • the surface of the housing 100 may correspond to the ground, but each of the first conductive pattern 220-1 and the second conductive pattern 220-2 is on the surface of the housing. It is an unconnected and spaced form.
  • FIG. 2A is a plan view (top view) for explaining the configuration of the diplexer 10 shown in FIG. 1 .
  • the PCB substrate of the diplexer 10 may be connected to an antenna input/output port 1, a 4G input/output port 2, and a 5G input/output port 3, respectively.
  • the aforementioned ports 1 , 2 , and 3 may be connected to the first conductive pattern 220 - 1 through respective connection holes provided on the side surface of the housing 100 .
  • the PCB substrate of the diplexer 10 may be functionally divided into a low pass filter (LPF) 201 and a high pass filter (HPF) 202.
  • LPF low pass filter
  • HPF high pass filter
  • the housing 100 has a rectangular parallelepiped structure in which a portion between the low-pass filter 201 and the high-pass filter 202 is partially recessed in order to block an electrical signal between the low-pass filter 201 and the high-pass filter 202. It can be formed as (see Fig. 4b).
  • the low pass filter 201 may perform a 4G band pass function between the antenna input/output port 1 and the 4G input/output port 2.
  • the high pass filter 202 may perform a 5G band pass function between the antenna input/output port 1 and the 5G input/output port 3.
  • the conductive patterns 220 - 1 and 2 on both sides may face each other in a partially symmetrical shape and may be connected to each other through a plurality of via holes 221 .
  • the via hole 221 connects the conductive patterns 220-1 and 2 on both sides of the dielectric layer 210 regardless of the ground (housing surface). There is a difference in connecting them to each other.
  • each stub may include a short circuit stub (ST-L) serving as an inductor (L) and an open stub (ST-C) serving as a capacitor (C) to implement a series LC circuit.
  • ST-L short circuit stub
  • ST-C open stub
  • C capacitor
  • the L value and C value of the series LC circuit can be adjusted according to the length and width of the square patch type stub, and the transmission zero point can be adjusted accordingly.
  • a capacitor it may be implemented through a portion of conductive patterns on both sides configured to face each other with the dielectric layer 210 interposed therebetween.
  • the three stubs ST1 to ST3 may constitute the low pass filter 201, and the remaining two stubs ST4 to ST5 may constitute the high pass filter 202.
  • the low-pass filter 201 includes a first stub (ST1) implementing a resonator having a first transmission zero, a second stub (ST2) implementing a resonator having a second transmission zero, and a third transmission zero.
  • a third stub ST3 implementing a resonator may be included.
  • the low pass filter 201 includes a first strip line connecting the 4G input/output port 2 and the first stub ST1, and a second strip connecting the first stub ST1 and the second stub ST2. line, a third stripline connecting the second stub ST2 and the third stub ST3, and a fourth stripline connecting the third stub ST3 and the antenna input/output port 1, respectively. .
  • the high pass filter 202 includes a fourth stub (ST4) implementing a resonator having a fourth transmission zero point, a fifth stub (ST5) implementing a resonator having a fifth transmission zero point, and a 5G input/output port (3).
  • a first open coupling unit connecting the fourth stub ST4, a second open coupling unit connecting the fourth stub ST4 and the fifth stub ST5, and the fifth stub ST5 and the antenna input/output port 1 ) may each include a third open coupling portion connecting between them.
  • FIG. 2B is a diagram illustrating equivalent circuits of a low-pass filter and a high-pass filter constituting the diplexer shown in FIG. 1, respectively.
  • Each stripline provided in the low pass filter 201 may be matched to an inductor, and each open coupling part provided in the high pass filter 202 may be matched to a capacitor.
  • FIG. 3 is a graph for explaining the signal characteristics of the diplexer shown in FIG. 1 and problems related to spurious.
  • FIG. 3 corresponds to an S-parameter characteristic graph of the diplexer shown in FIG. 1 .
  • the horizontal axis represents the frequency (GHz), and the vertical axis represents the signal level (dB).
  • the target band for 4G mobile communication corresponds to 728 to 2150 MHz
  • the target band for 5G mobile communication corresponds to 3440 to 4200 MHz and 4400 to 4900 MHz.
  • the S(2,1) graph shows the characteristics of a low pass filter (LPF) that passes a relatively low frequency band of 2150 MHz or less, and the S(3,1) graph shows a relatively high frequency band of 3440 MHz or more. It shows the characteristics of a high pass filter (HPF) that passes and blocks low frequencies.
  • the S(1,1) graph shows the characteristics of isolating a low frequency band and a high frequency band from each other.
  • the diplexer according to an embodiment of the present disclosure, at least one ground spaced apart from the side of the housing 100 and vertically extending from the upper surface of the housing 100 to the lower surface of the housing 100 Can contain pillars.
  • the ground pillar may pass through the dielectric layer 210, but may not pass through the first conductive pattern 220-1 and the second conductive pattern 220-2. That is, the ground pillar may pass through a portion of the dielectric layer 210 where neither the first conductive pattern 220 - 1 nor the second conductive pattern 220 - 2 is formed.
  • FIGS. 4A and 4B are diagrams for explaining a structure of a diplexer including a ground pillar for resolving spurious noise according to an embodiment of the present disclosure.
  • the diplexer 10 may include three ground pillars 110-1, 2, and 3.
  • FIG. 4A corresponds to an example, and it is also possible that the diplexer 10 includes only one or two of the above-described ground pillars 110-1, 2, and 3. Also, of course, the position of at least one of the ground pillars 110-1, 2, and 3 may be changed or at least one ground pillar may be added.
  • Each of the ground pillars 110-1, 2, and 3 may have a cylindrical shape. Specifically, each of the ground pillars 110-1, 2, and 3 may have a cylindrical shape having a diameter of 5 to 6 mm and a height of 11 to 12 mm. Preferably, each of the ground pillars 110-1, 2, and 3 may have a diameter of 5.2 mm and a height of 11.7 mm.
  • each ground pillar 110-1, 2, and 3 is connected to the upper surface of the housing 100, and the lower surface of each ground pillar 110-1, 2, and 3 is connected to the lower surface of the housing 100. It can be.
  • FIG. 4B is a perspective view of the ground pole of FIG. 4A in a rotated state.
  • each of the ground pillars 110-1, 2, and 3 penetrates the dielectric layer 210 at a position spaced apart from the side surface of the housing 100, but is separated from the conductive patterns 220-1 and 2. not contacted
  • the first ground pillar 110-1 may be disposed close to a portion of the conductive pattern where the antenna input/output port 1 and the low pass filter 201 are connected. Specifically, the first ground pillar 110-1 may be disposed at a position surrounded by the third stub ST3, the fourth stripline, and the antenna input/output port 1.
  • the second ground pillar 110-2 may be disposed close to a portion of the conductive pattern where the antenna input/output port 1 and the high pass filter 202 are connected. Also, the second ground pillar 110 - 2 may be disposed close to the fifth stub ST5 included in the high pass filter 202 .
  • first ground pillar 110-1 and the second ground pillar 110-2 have conductive pattern portions for connecting the antenna input/output port 1 to the third stripline and the third open coupling portion, respectively. They can be located on opposite sides of each other with a gap between them.
  • the third ground pillar 110 - 3 may be disposed between the stubs ST4 and ST5 matched to each of the resonators constituting the high pass filter 202 . Also, the third ground pillar 110-3 may be disposed close to the second open coupling part.
  • FIG. 5 is a graph for explaining signal characteristics of the diplexer shown in FIGS. 4a to 4b.
  • the spurious which previously existed within the 4400 to 4900 MHz band, has moved to the vicinity of 5.5 GHz, which is a higher frequency band.
  • the spurious that existed in the 3440 ⁇ 4200 MHz band also changed its occurrence position on a slightly elevated frequency compared to the case of FIG. 3, although it did not completely deviate from the corresponding band.
  • the pass band of the low-pass filter 201 is wider than in FIG. 3 .
  • the spurious of the signal S(2,1) matched to the low-pass filter 201 matches the signal S(3) matched to the high-pass filter 202. , 1)) has the effect of reducing the effect on the target band.
  • the diplexer 10 transmits the second conductive pattern 220-2 from a region facing at least a portion of the second conductive pattern 220-2 on the lower surface of the housing 100. It may include at least one ground pillar extending vertically in the direction.
  • the ground pillar may have a square pillar shape, and may extend vertically from the lower surface of the housing to a point close to the lower surface of the dielectric layer (the second conductive pattern 220 - 2 ). Specifically, the ground pillar may be formed to extend from the lower surface of the housing 100 to a point closely spaced from the second conductive pattern 220-2, but not in contact with the second conductive pattern 220-2. may not be
  • FIGS. 6A and 6B are diagrams for explaining a structure of a diplexer including a ground pillar for resolving spurious noise according to an embodiment of the present disclosure.
  • the diplexer 10 may further include a square pillar-shaped ground pillar 110-4 in addition to the above-described ground pillars 110-1, 2, and 3.
  • the ground pillar 110 - 4 may be formed vertically below the fourth stub ST4 matched with one of the resonators of the high pass filter 202 .
  • the ground pillar 110-4 is formed from a region of the housing 100 facing a portion of the second conductive pattern 220-2 that matches the fourth stub ST4 of the high pass filter 202. It may be formed to extend vertically in the direction of the second conductive pattern 220-2.
  • FIG. 6B corresponds to a side view of the diplexer 10 of FIG. 6A viewed from the side.
  • the ground pillar 110-4 may extend vertically from the lower surface of the housing 100 to a point closely spaced from the second conductive pattern 220-2.
  • the height of the ground pillar 110-4 may correspond to 3 to 5 mm, and may correspond to 4 mm as an example.
  • each of the horizontal and vertical sides of the square surface of the ground pillar 110-4, which is a square pillar, may correspond to 2 mm, but is not limited thereto.
  • FIGS. 6a to 6b are graphs for explaining signal characteristics of the diplexer shown in FIGS. 6a to 6b.
  • the ground pillar 110-1 is related to the result of the wider low-pass band confirmed according to the S (2, 1) graph
  • the ground pillar 110-2 is related to the result of the change in the frequency of the spurious that affected the 3440-4200 MHz band
  • the ground pillar 110-3 is the frequency of the spurious that affected the 4400-4900 MHz band. is changed and correlated with the result.
  • the S(3,1) graph of FIG. 3 showed a sharp power drop that occurred around 2.2 GHz.
  • the pass signal of the low-pass filter 201 and the high-pass filter It can be interpreted that the degree of isolation between passing signals of 202 is further improved.
  • FIGS. 6A and 6B show only the case where the diplexer 10 includes both the round-shaped ground pillars 110-1, 2, and 3 and the square-shaped ground pillars 110-4, An embodiment in which the diplexer 10 includes only one or more quadrangular ground pillars is of course also possible.
  • FIG. 8 is a diagram for explaining a structure of a diplexer including a ground pillar for resolving spurious noise according to an embodiment of the present disclosure.
  • the diplexer 10 may include a ground pillar 110-4 vertically extending from the lower surface of the housing 100 in the direction of the second conductive pattern 220-2. Compared to the diplexer 10 of FIG. 1 , the diplexer 10 of FIG. 1 may also show superior performance in terms of spurious interference and/or filter signal isolation.
  • the ground pillar 110-4 of FIG. 8 may have the same location and size as the ground pillar 110-4 of FIG. 6A.
  • ground pillar 110-4 of FIG. 8 may extend vertically from the lower surface of the housing 100 to a point closely spaced from the second conductive pattern 220-2.
  • the ground pillar 110-4 of FIG. 8 is a portion (fourth stub ST4) of the second conductive pattern 220-2 matched to the resonator of the high-pass filter 202 on the lower surface of the housing 100. It may be formed extending vertically from one region facing the second conductive pattern 220-2.
  • the height of the ground pillar 110-4 of FIG. 8 may correspond to 3 to 5 mm, and the horizontal and vertical sides of the upper and lower surfaces may respectively correspond to 2 mm, but is not limited thereto.

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Abstract

La présente invention concerne un diplexeur à large bande. Le diplexeur à large bande comprend : une carte de circuit imprimé (PCB) comprenant un filtre passe-bas et un filtre passe-haut ; et un boîtier dans lequel la PCB est destinée à être montée. La PCB comprend : une couche diélectrique ; un premier motif conducteur formé sur au moins une zone partielle de la surface supérieure de la couche diélectrique ; et un second motif conducteur formé sur au moins une zone partielle de la surface inférieure de la couche diélectrique. Le boîtier comprend au moins un montant de mise à la terre qui s'étend verticalement de la surface supérieure à la surface inférieure du boîtier tout en étant espacé de la surface latérale du boîtier, et traverse une zone partielle de la couche diélectrique dépourvue du premier motif conducteur et du second motif conducteur.
PCT/KR2022/001803 2021-06-14 2022-02-07 Diplexeur à large bande comprenant un montant de mise à la terre pour la correction des artefacts WO2022265180A1 (fr)

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JP2022562962A JP7527040B2 (ja) 2021-06-14 2022-02-07 スプリアスを調整するグラウンドポストを含む広帯域ダイプレクサ

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KR1020210076506A KR102361896B1 (ko) 2021-06-14 2021-06-14 스퓨리어스를 조정하는 그라운드 기둥을 포함하는 광대역 다이플렉서
KR10-2021-0076506 2021-06-14

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KR20130034990A (ko) * 2011-09-29 2013-04-08 엘에스전선 주식회사 다중 광대역 컴바이너 및 이에 적용되는 튜닝 구조
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KR20210025947A (ko) * 2019-08-28 2021-03-10 주식회사 이너트론 신호의 위상 밸런스 최소화를 위한 pcb 구조의 광대역 필터

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KR20010051385A (ko) * 1999-11-02 2001-06-25 무라타 야스타카 유전체 필터, 복합 유전체 필터, 유전체 듀플렉서, 유전체다이플렉서 및 이들을 사용한 통신 장치
KR20090032187A (ko) * 2007-09-27 2009-04-01 전자부품연구원 서스펜디드 기판 구조의 광대역 여파기
KR20130034990A (ko) * 2011-09-29 2013-04-08 엘에스전선 주식회사 다중 광대역 컴바이너 및 이에 적용되는 튜닝 구조
KR20180064054A (ko) * 2016-12-05 2018-06-14 순천향대학교 산학협력단 Pimd 성능 개선을 위한 광대역 대역결합기
KR20210025947A (ko) * 2019-08-28 2021-03-10 주식회사 이너트론 신호의 위상 밸런스 최소화를 위한 pcb 구조의 광대역 필터

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