WO2022257527A1 - 散热器和电子设备 - Google Patents

散热器和电子设备 Download PDF

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Publication number
WO2022257527A1
WO2022257527A1 PCT/CN2022/080759 CN2022080759W WO2022257527A1 WO 2022257527 A1 WO2022257527 A1 WO 2022257527A1 CN 2022080759 W CN2022080759 W CN 2022080759W WO 2022257527 A1 WO2022257527 A1 WO 2022257527A1
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WO
WIPO (PCT)
Prior art keywords
openings
heat dissipation
heat
opening
heat transfer
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Ceased
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PCT/CN2022/080759
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English (en)
French (fr)
Inventor
段凯文
李帅
刘帆
刘欣
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ZTE Corp
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ZTE Corp
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Filing date
Publication date
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Publication of WO2022257527A1 publication Critical patent/WO2022257527A1/zh
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Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the present application relates to the field of electronic technology, in particular to a heat sink and electronic equipment.
  • the heat dissipation capability of the radiator can only be improved by increasing the height of the radiator fins, which will lead to a significant increase in the weight of the radiator and cannot meet the requirements of lightweight radiator.
  • heat transfer pipes are usually arranged on the heat dissipation fins, and the heat transfer pipes are filled with heat transfer medium, and the thermal conductivity is improved through the phase change of evaporation and condensation of the heat transfer medium, so that heat can be transferred along the
  • the heat pipe is quickly transferred to achieve the purpose of improving heat dissipation efficiency.
  • the thermal cascade degree of the heat transfer pipes will gradually intensify along the direction of gravity, which hinders the condensation of steam in the heat transfer pipes in the upper area of the heat dissipation fins, which in turn leads to a decrease in heat dissipation performance in this area.
  • the embodiment of the present application provides a heat sink, including: a substrate; and a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged at intervals on the first surface of the substrate; wherein, the plurality of All or part of the heat dissipation fins are provided with a first heat transfer pipeline and an array of openings configured to be filled with a heat transfer working medium, and the array of openings includes a plurality of first openings.
  • an embodiment of the present application provides an electronic device, including the radiator described in the first aspect above.
  • the heat sink includes a substrate and a plurality of heat dissipation fins, and the plurality of heat dissipation fins are arranged at intervals on the first surface of the substrate; all or part of the plurality of heat dissipation fins
  • the heat dissipation fins are provided with a first heat transfer pipeline configured to be filled with a heat transfer working medium and an array of openings, the array of openings includes a plurality of first openings.
  • Fig. 1 is a schematic structural diagram of a heat sink provided by an embodiment of the present application
  • Fig. 2 is a schematic structural view of another radiator provided in the embodiment of the present application.
  • FIG. 3a-3d are structural schematic diagrams of different heat dissipation fins provided by the embodiment of the present application.
  • FIGS. 4a-4c are structural schematic diagrams of different heat dissipation fins provided by the embodiment of the present application.
  • FIGS. 5a-5e are structural schematic diagrams of different heat dissipation fins provided by the embodiment of the present application.
  • Fig. 6a-Fig. 6c are schematic diagrams of superimposed outlines of two adjacent heat dissipation fins in different situations
  • Fig. 7 is a schematic structural view of a protective plate provided by an embodiment of the present application.
  • Fig. 8 is a schematic diagram of a partial structure of a protective plate provided by an embodiment of the present application.
  • Fig. 9 is a schematic diagram of a partial structure of a protective plate provided by an embodiment of the present application.
  • At least one of the following and similar expressions refer to any combination of these items, including any combination of single items or plural items.
  • at least one of a, b, and c can represent: a, b, c, a and b, a and c, b and c or a and b and c, where a, b, c can be single, or Can be multiple.
  • a heat sink 100 provided in an embodiment of the present application includes a substrate 110 and a plurality of heat dissipation fins 120 , wherein the plurality of heat dissipation fins 120 are arranged on the first surface of the substrate 110 at intervals, All or part of the cooling fins 120 are provided with a first heat transfer pipeline and an array of openings configured to be filled with a heat transfer medium, and the array of openings includes a plurality of first openings 1202 .
  • the weight of the heat sink can be reduced by providing an array of openings on the heat dissipation fins 120, thereby meeting the requirements of lightening the weight of the heat sink;
  • the airflow turbulence in the intermediate channel increases the contact area between the heat and the air, accelerates the transfer of heat to the air, reduces the heat cascade, and significantly improves the overall heat dissipation efficiency of the radiator 100 .
  • the substrate 110 is made of metal materials or non-metal materials with good thermal conductivity, such as copper, aluminum, aluminum alloy, etc., and non-metal materials such as ceramics, graphite, etc.
  • the substrate 110 includes opposite first surfaces and second surfaces, wherein the first surface is configured to install a plurality of cooling fins 120, and the second surface is configured to be in contact with a heat source (referring to the heating components inside the electronic device), and the heat source Bonding with the second surface of the substrate 110 can be achieved through a thermally conductive interface material.
  • the heat from the heat source is transferred to the plurality of cooling fins 120 through the substrate 110 , and then the heat is dissipated to the surrounding environment through the cooling fins 120 .
  • the plurality of heat dissipation fins 120 includes a plurality of vertical heat dissipation fins 121, and the vertical heat dissipation fins 121 are along the first direction (in FIG. 1 ) on the first surface of the substrate 110.
  • a plurality of vertical cooling fins 121 are arranged at intervals along the third direction (horizontal direction in FIG. 1 ) on the first surface of the substrate 110 to form a vertical array of fins.
  • all the cooling fins 120 are provided with a first heat transfer pipeline and an array of openings configured to be filled with a heat transfer working medium.
  • first direction, the second direction and the third direction described in the embodiment of the present application are directions perpendicular to each other.
  • the plurality of heat dissipation fins 120 includes a plurality of first oblique fins 122 and a plurality of second oblique fins 123, wherein the plurality of first oblique fins
  • the fins 122 are arranged at intervals along the fourth direction on the first surface of the substrate 110, and the plurality of first oblique fins 122 are parallel to each other and respectively extend along the fifth direction;
  • the fins are arranged at intervals along the fifth direction on the first surface of the substrate 110 , and the plurality of second oblique fins 123 are parallel to each other, and the distribution extends along the fourth direction.
  • the plurality of first oblique fins 122 and the plurality of second oblique fins form two oblique fin arrays on the first surface of the substrate 110 .
  • part of the cooling fins 120 is provided with a first heat transfer pipeline and an array of openings configured to be filled with a heat transfer working fluid, and the part of the cooling fins 120 is arranged in a V shape.
  • all the first oblique fins 122 and the second oblique fins 123 are provided with a first heat transfer pipeline and an array of openings configured to fill the heat transfer working medium, and there is no limitation here. .
  • the third direction, the fourth direction and the fifth direction described in the embodiment of the present application are different directions with an included angle between them, and are all parallel to the first surface of the substrate 110 .
  • the plurality of heat dissipation fins 120 described in the embodiment of the present application may also be a combination of a plurality of vertical heat dissipation fins 121 , a plurality of first oblique fins 122 and a plurality of second oblique fins 123 .
  • the embodiment of the present application does not impose too many restrictions on the arrangement form of the heat dissipation fins 120 .
  • the heat dissipation fin 120 with the first heat transfer pipeline described in the embodiment of the present application is a composite plate structure, including a first plate and a second plate, and the first plate and the second plate can have good thermal conductivity Made of copper and aluminum materials.
  • the first heat transfer pipeline can be formed on the cooling fins 120 through a rolling inflation process or a mold forming brazing process.
  • the first heat transfer pipeline is a closed micro-pipe network structure connected internally, and the first heat transfer pipeline is filled with a heat transfer working fluid, which can be realized through the phase change of the heat transfer working medium evaporation and condensation.
  • the efficient heat transfer phase change heat transfer technology improves the temperature uniformity of the entire cooling fin 120 .
  • the first heat transfer pipeline may include a honeycomb pipeline 1201a, and the inside of the honeycomb pipeline 1201a is connected.
  • the first heat transfer pipeline may include a plurality of steepest descent pipelines 1201b arranged at intervals along the first direction (that is, the length direction of the heat dissipation fins 120) and arranged to communicate with A plurality of connecting pipelines 1201c of the steepest descent pipeline 1201b.
  • the steepest descending line pipeline 1201b is in the shape of the steepest descending curve
  • the steepest descending line pipeline 1201b extends along the second direction (that is, the width direction of the cooling fins 120)
  • the end of the steepest descending line pipeline 1201b away from the substrate 110 faces in the opposite direction.
  • the direction of gravity is tilted (i.e. tilted up).
  • the connecting pipeline 1201c is connected between the steepest descent line pipelines 1201b, so that the fastest descent line pipelines 1201b communicate with each other.
  • the shape of the first heat transfer pipeline in the embodiment of the present application is not limited to one of the structures shown in FIG. 3a to FIG. 3c or FIG.
  • the combination of the structures shown can also be a circular honeycomb shape, a quadrangular honeycomb shape, a plurality of U-shaped, rhombus, triangle, circular ring, criss-cross nets, or any combination of any one or more of them.
  • the embodiment does not impose too many restrictions on the shape and structure of the first heat transfer pipeline.
  • the plurality of first openings 1202 are arranged at intervals along the first direction on the heat dissipation fin 120 , and the plurality of first openings 1202 are arranged in multiple rows on the heat dissipation fin 120 along the second direction, Thus, an array of openings is formed on the cooling fins 120 .
  • the first openings 1202 in two adjacent rows in the opening array adopt mutually misaligned mode settings.
  • the plurality of first openings 1202 should be distributed as far as possible in the micro-pipe network structure formed by the first heat transfer pipeline of the heat dissipation fin 120, so as to meet the overall heat dissipation of the heat dissipation fin 120 and promote heat dissipation.
  • the temperature uniformity of the fins 120 should be distributed as far as possible in the micro-pipe network structure formed by the first heat transfer pipeline of the heat dissipation fin 120, so as to meet the overall heat dissipation of the heat dissipation fin 120 and promote heat dissipation.
  • a plurality of first openings 1202 are distributed in a plurality of opening regions 1203 defined by the honeycomb pipeline 1201 a. It can be seen from Fig. 3a to Fig. 3c that the honeycomb pipeline 1201a forms a plurality of honeycomb units, and the honeycomb units are misaligned with each other, so each honeycomb unit can be used as the opening area 1203, and the opening area 1203 is implemented. hole.
  • the first heat transfer pipeline includes a plurality of hexagonal honeycomb pipelines 1201a, and a plurality of hexagonal opening areas 1203 are formed on the heat dissipation fin 120, and the first openings 1202 are covered with In each opening area 1203, that is, all opening areas 1203 are provided with first openings 1202; or as shown in Figure 3b or Figure 3c, there is at least one opening between the first openings 1202 in the same row
  • the spacing of the areas 1203 means that not all the opening areas 1203 are provided with the first openings 1202 .
  • the first holes 1202 in each row of the hole array are arranged in a broken line
  • FIG. 3 c the first holes 1202 in each row in the hole array are arranged in a diagonal line.
  • a plurality of first openings 1202 may be distributed in a plurality of opening areas 1203 defined by a plurality of steepest descent pipelines 1201b and a plurality of connecting pipelines 1201c, Each opening area 1203 may be provided with a plurality of first openings 1202 , and when implemented, the plurality of first openings 1202 in the opening area 1203 may be distributed at intervals along the extending direction of the steepest descent line pipeline 1201b.
  • the distance between the edge of each first opening 1202 and the first heat transfer pipeline should be no less than a preset second.
  • a distance from the threshold, where the value of the first distance threshold can be set according to the actual situation through experiments. For example, assuming that the value of the first distance threshold is 2 mm, there should be a distance not less than 2 mm between the edge of each first opening 1202 and its adjacent first heat transfer pipeline.
  • the first heat transfer pipeline adopts a honeycomb pipeline 1201a, and in implementation, the center of the hexagonal opening area 1203 can be used as the center of the opening According to the center of the hole, the first hole 1202 obtained by the hole should be kept at a distance of not less than 2 mm from the boundary of the honeycomb unit.
  • the first heat transfer pipeline adopts the fastest-falling line pipeline 1201b.
  • the boundary of the fastest-falling line pipeline 1201b can be scaled inwardly by 2mm as the opening range.
  • a plurality of first openings 1202 are implemented within this range.
  • three first openings 1202 are opened in the opening area 1203 formed by each steepest descent line pipeline 1201b, and the diameter of the three openings is variable to match the boundary of the opening range.
  • the cooling fin 120 includes a first root portion 1205 and a first tip portion 1206, the first root portion 1205 of the cooling fin 120 is connected to the substrate 110, and the first tip portion 1206 is opposite to the first root portion 1205 and away from the side of the substrate 110.
  • the first root portion 1205 of the heat dissipation fin 120 can be connected to the substrate 110 through cogs, bonding or welding.
  • the cooling fin 120 there is a distance between the first opening 1202 and the first root 1205 of the cooling fin 120 not less than the preset second distance threshold, that is, the cooling fin 120 is from the first root 1205 to the first
  • the value of the second distance threshold is 20 mm, that is, no first opening 1202 is provided within a distance of 20 mm from the first root 1205 .
  • a distance not less than the second distance threshold is set between the opening array and the first root 1205, so as to ensure the heat conduction of the first root 1205 and the overall heat conduction of the fins. Heat dissipation.
  • the shape of the first opening 1202 is not limited to circle, rectangle, triangle, star, special shape, etc., nor is it limited to the combination of different opening shapes.
  • the first openings 1202 between two adjacent heat dissipation fins 120 in the heat sink 100 are arranged to be offset from each other. That is to say, the first openings 1202 of two adjacent heat dissipation fins 120 are only partially overlapped or not overlapped at all in the direction of the orthographic projection, and are in a complementary opening relationship with offset intervals. Compared with the non-displaced opening relationship, the complementary opening design with dislocated intervals can reduce the flow resistance of the flow channel between the fins, increase the flow rate of the heat dissipation airflow, and thus improve the heat dissipation efficiency of the radiator 100 .
  • two adjacent heat dissipation fins 120 in the heat sink 100 may adopt fins with different opening forms.
  • Figures 5a to 5e illustrate fins in various aperture forms.
  • the plurality of cooling fins 120 in the radiator 100 can be the combination of cooling fins 120 shown in Figure 3a and Figure 5a, or the combination of cooling fins 120 shown in Figure 3a and Figure 5b, or the combination of cooling fins 120 shown in Figure 3b and Figure 5c
  • the combination of cooling fins 120 shown is either the combination of cooling fins 120 shown in Figure 3c and Figure 5d, or the combination of cooling fins 120 shown in Figure 3d and Figure 5e.
  • fins with two different opening forms in each heat dissipation fin combination are alternately arranged on the first surface of the substrate 110. Through this arrangement, the heat dissipation between two adjacent heat dissipation fins 120 can be achieved.
  • the first openings 1202 between them are arranged in offsets with each other.
  • the local overlapping outline of the two heat dissipation fins 120 superimposed can be as shown in Figure 6b, and the fins shown in Figure 5b Compared with the first opening 1202 of the fin shown in Figure 3a, the first opening 1202 is offset by one unit in the first direction (length direction), and the first openings 1202 of the two cooling fins are completely do not overlap;
  • the local overlapping outline of the two heat dissipation fins 120 superimposed can be as shown in Figure 6c, and the fins shown in Figure 5e Compared with the first opening 1202 of the fin shown in FIG. 3d, the first opening 1202 is offset by one unit in the second direction (width direction), and the first openings 1202 of the two cooling fins 120 are completely Do not overlap.
  • the heat sink 100 includes a substrate 110 and a plurality of heat dissipation fins 120, wherein the plurality of heat dissipation fins 120 are arranged at intervals on the first surface of the substrate 110, and each heat dissipation fin 120 is provided with a The first heat transfer pipeline filled with heat transfer fluid and the hole array, the hole array includes a plurality of first holes 1202 .
  • a plurality of first openings 1202 are arranged at intervals along the first direction on the heat dissipation fin 120 , and the plurality of first openings 1202 are arranged in multiple rows on the heat dissipation fin 120 along the second direction, and adjacent to two The first openings 1202 in the row are arranged in a mutually offset manner.
  • first openings 1202 between two adjacent heat dissipation fins 120 in the heat sink 100 are mutually offset.
  • the design of complementary openings with offset intervals can reduce the channel flow resistance between the fins and increase the The flow rate of the heat dissipation airflow is increased, thereby improving the heat dissipation efficiency of the radiator 100 .
  • the radiator 100 of the embodiment of the present application further includes two protective plates 130, which are respectively arranged on both sides of the first surface of the substrate 110, and the heat dissipation fins 120 are arranged between the two protective plates 130.
  • the two protective plates 130 are provided to enhance the structural strength of the heat sink 100 and protect the plurality of heat dissipation fins 120 to prevent deformation and damage to the heat dissipation fins 120 caused by external impact.
  • the protective plate 130 can be made of a plate with good thermal conductivity, and in order to meet a certain protective strength, the thickness of the protective plate 130 should be greater than the thickness of the heat dissipation fins 120 .
  • the height of the protective plate 130 in the second direction is greater than the height of the heat dissipation fins 120 in the second direction, that is, the protective plate 130 and the heat dissipation fins 120 are installed on the substrate respectively.
  • the first tip of the protective plate 130 protrudes relative to the first tip of the heat dissipation fin 120 , and this structure reduces the impact of external force on the heat dissipation fin 120 .
  • At least one protective plate 130 is further provided with one or more second openings 132 , through which the weight of the protective plate and the heat sink can be reduced through the second openings 132 .
  • a second heat transfer pipeline 131 filled with a heat transfer medium can be installed on the protective plate 130, through the evaporation and condensation of the heat transfer medium The phase change improves the thermal conductivity of the protective plate 130 , thereby improving the heat transfer and heat dissipation efficiency of the protective plate 130 .
  • FIG. 7 the protective plate 130 shown in FIG. cloth.
  • the distance between two adjacent second openings 132 is not less than the preset fourth distance threshold, so as to ensure the structural strength of the protective plate 130 .
  • the distance between the second openings 132 should be no less than 3 mm.
  • the distance between the second opening 132 and the second tip 134 and the second root 133 of the protective plate 130 is not less than the preset third distance threshold.
  • the second root portion 133 is the side where the protective plate is connected to the base plate 110
  • the second tip 134 is the side opposite to the second root portion 133 .
  • the side spacing required by the strength of the protective plate 130 is met, so as to resist the impact of the lateral external force of the protective plate 130 .
  • the value of the third distance threshold is 5 mm
  • the distance between the second opening 132 and the second tip and the second root of the protective plate 130 should be no less than 5 mm.
  • the second opening 132 has a chamfered inner corner 1321.
  • the chamfer form of the second opening 132 may be a rounded corner, a chamfered corner or a combination of both.
  • At least one protective plate 130 has a chamfered outer corner 133.
  • the structural strength of the plate 130 can resist the impact of the radiator 100 falling on the corners of the protective plate 130 .
  • the chamfering form of the outer corner of the protective plate 130 may be a rounded corner as shown in FIG. 9 a , a chamfered corner as shown in FIG. 9 b or a combination of rounded corners and chamfered corners as shown in FIG. 9 c .
  • the second heat transfer pipeline 131 on the protective plate 130 includes a plurality of crisscrossed pipelines, and these crisscrossed pipelines define the opening area of the second opening 132 .
  • the boundary between the second heat transfer pipeline 131 and the boundary of the second opening 132 on the protective plate 130 has a distance not less than the preset fifth distance threshold, so as to avoid the second opening while satisfying the strength of the protective plate 130 .
  • Hole 132 structure For example, assuming that the value of the fifth distance threshold is 2 mm, there should be a distance not less than 2 mm between the edge of each second opening 132 and its adjacent second heat transfer pipe 131 .
  • preparation of the cooling fins 120/protection plate 130 in the embodiment of the present application may include the following methods:
  • the first way, using the rolling inflation process may include the following steps:
  • the board includes a first board and a second board that are set to be composite;
  • Rolling rolling the riveted plate, including hot rolling and cold rolling;
  • the second way, using the brazing process can include the following steps:
  • the board includes a first board and a second board that are set to be composite;
  • Stamping pipeline stamping heat transfer pipeline on the plate
  • Coating brazing material, coating the brazing material on the plate to be brazed, can use the mask to coat the welding surface of any welding monomer, and at the same time achieve the purpose of the brazing material avoiding the heat transfer pipeline;
  • step of opening holes can also be set after the brazing material is applied and before the lap joint is fixed, and holes are independently implemented for each weldment unit.
  • the protective plate 130 is provided with a heat transfer
  • the second heat transfer pipeline 131 and the second opening 132 of the working fluid make the protective plate 130 not only play a protective role, but also improve the heat dissipation efficiency, and the second opening 132 is also beneficial to reduce the heat dissipation of the radiator 100. weight.
  • the embodiment of the present application also provides an electronic device, which includes a device and the heat sink 100 as described in any one of the above embodiments.
  • a heat source the device is attached to the second surface of the substrate 110 of the heat sink 100 through a thermally conductive glue or a thermally conductive interface material.
  • the heat from the heat source is transferred to the plurality of cooling fins 120 through the substrate 110 , and then the heat is dissipated to the surrounding environment through the cooling fins 120 .
  • the electronic devices described in the embodiments of the present application may be electronic devices such as communication products and home appliances.
  • Embodiments of the present application provide a heat sink and electronic equipment, which can meet the requirements of light weight and high heat dissipation of the heat sink.
  • the embodiment of the present application can reduce the weight of the heat sink by providing an array of openings on the heat dissipation fins, thereby meeting the requirement of lightening the weight of the heat sink;
  • the airflow disturbance in the inter-channel increases the contact area between the heat and the air, accelerates the transfer of heat to the air, reduces the thermal cascade, and significantly improves the overall heat dissipation efficiency of the radiator.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器和电子设备，其中，散热器(100)包括基板(110)和多个散热翅片(120)，所述多个散热翅片(120)间隔设置在所述基板(110)的第一表面上；所述多个散热翅片(120)中的全部或者部分散热翅片(120)设置有被设置为充装传热工质的第一传热管路和开孔阵列，所述开孔阵列包括多个第一开孔(1202)。

Description

散热器和电子设备
相关申请的交叉引用
本申请基于申请号为202110656027.6、申请日为2021年6月11日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及电子技术领域，特别涉及一种散热器和电子设备。
背景技术
随着电子技术的高速发展，电子设备越来越向大容量、大功率、高集成、轻量化方向发展，由此导致了电子设备的热耗密度越来越大，因而对散热器的散热能力要求越来越高。
在散热器长宽尺寸不变的情况下，往往只能通过增加散热翅片高度来提高散热器的散热能力，这样会导致散热器重量显著增加，无法满足散热器轻量化的要求。
另外，为了提高散热器性能，通常在散热翅片上设置传热管路，传热管路中充装了传热介质，通过传热介质的蒸发与冷凝相变提高导热系数，使得热量能够沿传热管路快速传递，达到提高散热效率目的。但是，传热管路的热级联程度会沿逆重力方向逐渐加剧，使得散热翅片上部区域的传热管路中的蒸汽冷凝受阻，进而导致该区域的散热性能下降。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
第一方面，本申请实施例提供了一种散热器，包括：基板；以及多个散热翅片，所述多个散热翅片间隔设置在所述基板的第一表面上；其中，所述多个散热翅片中的全部或者部分散热翅片设置有被设置为充装传热工质的第一传热管路和开孔阵列，所述开孔阵列包括多个第一开孔。
第二方面，本申请实施例提供了一种电子设备，包括如上第一方面所述的散热器。
本申请实施例的技术方案，散热器包括基板和多个散热翅片，所述多个散热翅片间隔设置在所述基板的第一表面上；所述多个散热翅片中的全部或者部分散热翅片设置有被设置为充装传热工质的第一传热管路和开孔阵列，所述开孔阵列包括多个第一开孔。
本申请的其它特征和优点将在随后的说明书中阐述，并且本申请的技术方案将从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和得到。
附图说明
附图用来提供对本申请技术方案的理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
图1是本申请实施例提供的一种散热器的结构示意图；
图2是本申请实施例提供的另一种散热器的结构示意图；
图3a-图3d是本申请实施例提供的不同散热翅片的结构示意图；
图4a-图4c是本申请实施例提供的不同散热翅片的结构示意图；
图5a-图5e是本申请实施例提供的不同散热翅片的结构示意图；
图6a-图6c是不同情况下相邻的两个散热翅片局部的叠加轮廓示意图；
图7是本申请实施例提供的一种防护板的结构示意图；
图8是本申请实施例提供的一种防护板的局部结构示意图；以及
图9是本申请实施例提供的一种防护板的局部结构示意图。
具体实施方式
为了使本申请的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本申请进行详细说明。应当理解，此处所描述的具体实施例仅用以解释本申请，并不用于限定本申请。
应了解，在本申请实施例的描述中，如果有描述到“第一”、“第二”等只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。“至少一个”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示单独存在A、同时存在A和B、单独存在B的情况。其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项”及其类似表达，是指的这些项中的任意组合，包括单项或复数项的任意组合。例如，a，b和c中的至少一项可以表示：a，b，c，a和b，a和c，b和c或a和b和c，其中a，b，c可以是单个，也可以是多个。
此外，下面所描述的本申请各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。
请参见图1和图2，本申请实施例提供的一种散热器100，包括基板110和多个散热翅片120，其中，多个散热翅片120间隔设置在基板110的第一表面上，全部或者部分散热翅片120设置有被设置为充装传热工质的第一传热管路和开孔阵列，该开孔阵列包括多个第一开孔1202。
本申请实施例，一方面，通过在散热翅片120上设置开孔阵列，能够减轻散热器的重量，从而满足散热器轻量化的要求；另一方面，通过开孔阵列增强散热翅片120之间流道内的气流扰动，增大了热量与空气的接触面积，加快了热量向空气中传递，减小了热级联，使得散热器100整体的散热效率显著提升。
可以理解的是，基板110为导热性能良好的金属材料或者非金属材料制成，金属材料例如是铜、铝、铝合金等，非金属材料例如是陶瓷、石墨等。基板110包括相对的第一表面和第二表面，其中，第一表面被设置为安装多个散热翅片120，第二表面被设置为与热源(指电子设备内部的发热元器件)接触，热源可以通过导热界面材料与基板110的第二表面实现贴合。热源的热量通过该基板110传递至多个散热翅片120，再通过散热翅片120将热量散发到周围的环境中。
如图1所示，在一种示例中，多个散热翅片120包括多个竖向散热翅片121，竖向散热 翅片121在基板110的第一表面沿第一方向(图1中的竖向)设置，多个竖向散热翅片121在基板110的第一表面上沿第三方向(图1中的横向)彼此间隔排布，在基板110的第一表面上形成直向式的翅片阵列。在图1所示的示例中，全部散热翅片120均设置有被设置为充装传热工质的第一传热管路和开孔阵列。
需说明的是，本申请实施例描述的第一方向、第二方向和第三方向为两两之间互相垂直的方向。
如图2所示，在另一种示例中，多个散热翅片120包括多个第一斜向翅片122和多个第二斜向散热翅片123，其中，多个第一斜向翅片122在基板110的第一表面上是沿第四方向彼此间隔排布的，且多个第一斜向翅片122之间相互平行，分别沿第五方向延伸；多个第二斜向散热翅片在基板110的第一表面上是沿第五方向彼此间隔排布的，且多个第二斜向翅片123之间相互平行，分布沿第四方向延伸。这样，多个第一斜向翅片122和多个第二斜向散热翅片在基板110的第一表面上形成两个斜向式的翅片阵列。在图2所示的示例中，部分散热翅片120设置有被设置为充装传热工质的第一传热管路和开孔阵列，且该部分散热翅片120呈V形排布。当然，也可以全部的第一斜向翅片122和第二斜向散热翅片123均设置有被设置为充装传热工质的第一传热管路和开孔阵列，此处不作限制。
需说明的是，本申请实施例描述的第三方向、第四方向和第五方向为不同的方向，两两之间具有夹角，且均平行于所述基板110的第一表面。
应当理解，本申请实施例描述的多个散热翅片120还可以是多个竖向散热翅片121、多个第一斜向翅片122以及多个第二斜向翅片123的组合。本申请实施例对散热翅片120的排布形式不作过多限制。
可以理解的是，本申请实施例描述的带第一传热管路的散热翅片120为复合板式结构，包括包括第一板材及第二板材，第一板材及第二板材可以由导热性能良好的铜、铝材料制成。第一传热管路可以通过轧制吹胀工艺或者模具成型钎焊工艺形成于散热翅片120。
可以理解的是，第一传热管路为内部连通的封闭式微细管网结构，在第一传热管路中充装有传热工质，通过传热工质蒸发与冷凝相变可实现高效传热的相变传热技术，提升整个散热翅片120的均温性。
请参见图3a至图3c，在一种示例中，第一传热管路可以包括蜂窝状管路1201a，且蜂窝状管路1201a内部是连通的。
请参见图3d，在另一种示例中，第一传热管路可以包括沿第一方向(即散热翅片120的长度方向)间隔设置的多个最速降线管路1201b以及被设置为连通最速降线管路1201b的多个连接管路1201c。其中，最速降线管路1201b呈最速降曲线形状，最速降线管路1201b沿第二方向(即散热翅片120的宽度方向)延伸，且最速降线管路1201b远离基板110的一端朝逆重力方向倾斜(即向上倾斜)。连接管路1201c连接在最速降线管路1201b之间，以使最速降线管路1201b之间相互连通。
需说明的是，本申请实施例的第一传热管路的形状不限于图3a至图3c或者图3d所示的结构之一，还可以是图3a至图3c所示结构和图3d所示结构的组合，也可以是圆形蜂窝状、四边形蜂窝状、首尾串联的多个U形、菱形、三角形、圆环形、纵横交错的网状或其中任意一种以上的任意组合，本申请实施例对第一传热管路的形状结构不作过多限制。
可以理解的是，多个第一开孔1202在散热翅片120上沿第一方向间隔排布，且多个第一 开孔1202在散热翅片120上沿第二方向呈多行排布，从而在散热翅片120上形成开孔阵列。
可以理解的是，为了在翅片间的流道内形成局部二次气流及涡旋，增强气流扰动，减小热级联，开孔阵列中相邻两行的第一开孔1202采用互相错位的方式设置。
可以理解的是，多个第一开孔1202应尽量分散地布设在散热翅片120的第一传热管路形成的微细管网结构之中，以满足散热翅片120整体的散热，促进散热翅片120的均温性。
在一示例中，如图3a至图3c所示，多个第一开孔1202分布在由蜂窝状管路1201a所界定出的多个开孔区域1203内。从图3a至图3c可以看出，蜂窝状管路1201a形成了多个蜂窝单元，蜂窝单元之间相互错位，故每一个蜂窝单元均可作为开孔区域1203，在开孔区域1203内实施开孔。
如图3a所示，该第一传热管路包括多个六边形蜂窝状管路1201a，在散热翅片120上形成多个六边形的开孔区域1203，第一开孔1202满布在各个开孔区域1203中，即所有开孔区域1203中均开有第一开孔1202；又或者如图3b或者图3c所示，同一行的第一开孔1202之间具有至少一个开孔区域1203的间隔，即非所有开孔区域1203中均开有第一开孔1202。在图3b中，开孔阵列中每一列的第一开孔1202呈折线状排布，在图3c中，开孔阵列中每一列的第一开孔1202呈斜直线状排布。
在另一示例中，如图3d所示，多个第一开孔1202可以分布在由多个最速降线管路1201b和多个连接管路1201c所界定出的多个开孔区域1203内，每个开孔区域1203中可以设置有多个第一开孔1202，在实现时，开孔区域1203中的多个第一开孔1202可沿最速降线管路1201b的延伸方向间隔错位分布。
可以理解的是，为避免开孔影响第一传热管路的封闭性而发生工质泄漏，每个第一开孔1202的边缘与第一传热管路之间应具有不小于预设第一距离阈值的间距，其中第一距离阈值的取值可经过实验而视实际情况设定。例如，假定第一距离阈值的取值为2mm，每个第一开孔1202的边缘与其邻近的第一传热管路之间应具有不小于2mm的间距。
例如，在图3a至图3c所示的任一实施例中，第一传热管路采用了蜂窝状管路1201a，在实施时，可以六边形的开孔区域1203的中心作为开孔中心，根据该开孔中心实施开孔，开孔所得到的第一开孔1202应与所在的蜂窝单元的边界应保持不小于2mm的间距。
又例如，在图3d所示的实施例中，第一传热管路采用了最速降线管路1201b，在实施时，可以最速降线管路1201b边界向内缩放2mm作为开孔范围，在该范围内实施多个第一开孔1202。在图3d所示实施例中，每个最速降线管路1201b形成的开孔区域1203中开有3个第一开孔1202，3个开孔采用变孔径方式以匹配开孔范围边界。
可以理解的是，散热翅片120包括第一根部1205和第一稍部1206，散热翅片120的第一根部1205与基板110连接，第一稍部1206为与第一根部1205相对的、远离基板110的侧边。散热翅片120的第一根部1205可以通过嵌齿、粘接或者焊接方式与所述基板110连接。
可以理解的是，第一开孔1202与散热翅片120的第一根部1205之间具有不小于预设第二距离阈值的间距，也就是说，散热翅片120自第一根部1205向第一稍部1206的第二距离阈值范围内不设开孔，以加强第一根部1205导热及翅片整体散热。例如，假定第二距离阈值的取值是20mm，即在与第一根部1205距离20mm范围内不设第一开孔1202。
示例性的，如图4a至图4c所示的散热翅片120，开孔阵列与第一根部1205之间设有不小于第二距离阈值的间距，以保证第一根部1205导热及翅片整体散热。
可以理解的是，第一开孔1202的形状不限于圆形、矩形、三角形、星形、异形等，也不限于不同开孔形状的组合。
示例性的，散热器100中相邻的两个散热翅片120之间的第一开孔1202互相错位设置。也就是说，相邻两个散热翅片120的第一开孔1202在正投影方向上仅部分重叠或完全不重叠，呈间隔错位的互补开孔关系。对比非错位开孔关系，间隔错位的互补开孔设计可以减小翅片间的流道流阻，增大散热气流流速，从而提高散热器100的散热效率。
在实施时，散热器100中相邻的两个散热翅片120可以采用不同开孔形式的翅片。例如，图5a至图5e示出了多种开孔形式的翅片。散热器100中的多个散热翅片120可以是图3a和图5a所示的散热翅片120组合，或者是图3a和图5b所示的散热翅片120组合，或者是图3b和图5c所示的散热翅片120组合，或者是图3c和图5d所示的散热翅片120组合，或者是图3d和图5e所示的散热翅片120组合。
示例性的，每个散热翅片组合中的两种不同开孔形式的翅片在基板110的第一表面上轮流设置，通过这种设置方式，可实现相邻的两个散热翅片120之间的第一开孔1202互相错位设置。
例如，当相邻的两个散热翅片120采用图3a和图5a所示的散热翅片组合时，两个散热翅片120的局部叠加轮廓可如图6a所示，图5a所示翅片的第一开孔1202相比图3a所示翅片的第一开孔1202在第一方向(长度方向)、第二方向(宽度方向)分别偏移一个单位，两个散热翅片120的第一开孔1202在正投影方向上完全不重叠。
当相邻的两个散热翅片120采用图3a和图5b所示的散热翅片组合时，两个散热翅片120叠加的局部叠加轮廓可如图6b所示，图5b所示翅片的第一开孔1202相比图3a所示翅片的的第一开孔1202在第一方向(长度方向)偏移一个单位，两个散热翅片的第一开孔1202在正投影方向上完全不重叠；
当相邻的两个散热翅片120采用图3d和图5e所示的散热翅片组合时，两个散热翅片120叠加的局部叠加轮廓可如图6c所示，图5e所示翅片的第一开孔1202相比图3d所示翅片的第一开孔1202在第二方向(宽度方向)偏移一个单位，两个散热翅片120的第一开孔1202在正投影方向上完全不重叠。
在一个实施例中，散热器100包括基板110和多个散热翅片120，其中，多个散热翅片120间隔设置在基板110的第一表面上，每个散热翅片120设置有被设置为充装传热工质的第一传热管路和开孔阵列，开孔阵列包括多个第一开孔1202。多个第一开孔1202在散热翅片120上沿第一方向间隔排布，且所述多个第一开孔1202在散热翅片120上沿第二方向呈多行排布，且邻两行的第一开孔1202采用互相错位的方式设置，通过这种设计，可以在翅片间的流道内形成局部二次气流及涡旋，增强气流扰动，减小热级联。另外，散热器100中相邻的两个散热翅片120之间的第一开孔1202互相错位设置，这种间隔错位的互补开孔设计可以减小翅片间的流道流阻，增大散热气流流速，从而提高散热器100的散热效率。
请参见图1和图2，本申请实施例的散热器100，还包括两个防护板130，分别设置在基板110第一表面的两侧，散热翅片120设置在两个防护板130之间。两个防护板130被设置为增强散热器100的结构强度，并对多个散热翅片120形成保护，防止外力撞击对散热翅片120造成变形损坏。
示例性的，防护板130可以采用具有良好导热性的板材制成，且为了满足一定的防护强 度，防护板130的厚度应大于散热翅片120的厚度。
示例性的，为了达到良好的防护效果，防护板130在第二方向上的高度大于散热翅片120在第二方向上的高度，也就是说，防护板130和散热翅片120分别安装在基板110的第一表面之后，防护板130的第一稍部相对散热翅片120的第一稍部凸出，通过这种结构减小外力撞击对散热翅片120的影响。
示例性的，至少一个防护板130还设置有一个或者多个第二开孔132，通过第二开孔132实现防护板及散热器的轻量化减重。
另外，为了减小防护板130采取开孔措施后导致的散热性能损失，可以在防护板130上设置充装有传热工质的第二传热管路131，通过传热介质的蒸发与冷凝相变提高防护板130的导热系数，从而提高防护板130的传热及散热效率。
示例性的，请参见图7，图7所示的防护板130上设置有多个第二开孔132，多个第二开孔132在防护板130上沿第一方向(长度方向)间隔排布。
可以理解的是，相邻两个第二开孔132之间具有不小于预设第四距离阈值的间距，以保证防护板130的结构强度。例如，假定第四距离阈值的取值为3mm，第二开孔132之间应具有不小于3mm的间距。
可以理解的是，第二开孔132与防护板130的第二稍部134和第二根部133分别具有不小于预设第三距离阈值的间距。如图7所示，第二根部133为防护板与基板110相连接的侧边，第二稍部134为与第二根部133相对的侧边。通过这种结构，满足防护板130强度所需的边间距，以抵御防护板130侧方外力冲击。例如，假定第三距离阈值的取值为5mm，第二开孔132与防护板130的第二稍部和第二根部应分别具有不小于5mm的间距。
示例性的，如图8a所示，第二开孔132具有倒角内边角1321，通过将第二开孔132的边角设置成倒角，替代常见的尖角，以此增强开孔防护板130的结构强度。第二开孔132的倒角形式可以是倒圆角、倒斜角或者二者的结合。
示例性的，如图9a至图9c所示，至少一个防护板130具有倒角外边角133，通过将防护板130的边角设置成倒角，替代常见的尖角，以此增强开孔防护板130的结构强度，抵御散热器100跌落对防护板130边角部位的冲击。防护板130的外边角倒角形式可以是如图9a所示的倒圆角、如图9b所示的倒斜角或者如图9c所示的倒圆角和倒斜角结合的形式。
示例性的，如图7所示，防护板130上的第二传热管路131包括纵横交错的多个管路，这些纵横交错的管路界定出第二开孔132的开孔区域。
应了解，防护板130上的第二传热管路131边界与第二开孔132边界之间分别具有不小于预设第五距离阈值的间距，以在满足防护板130强度同时避让第二开孔132结构。例如，假定第五距离阈值的取值为2mm，每个第二开孔132的边缘与其邻近的第二传热管路131之间应具有不小于2mm的间距。
可以理解的是，本申请实施例的散热翅片120/防护板130的制备可以包括以下几种方式：
第一种方式，采用轧制吹胀工艺，可以包括以下步骤：
清洗，对板材进行清洗，其中，板材包括被设置为复合的第一板材和第二板材；
印刷铆合，在第一板材和/或第二板材上印刷传热管路图案，将第一板材和第二板材铆合；
轧制，对铆合后的板材进行轧制，包括热轧和冷轧；
退火，对经过轧制的板材进行退火；
开孔，对板材进行冲切开孔，以在板材上制得开孔，
高压吹胀，利用吹胀工艺在板材上制得传热管路；
冲切、裁剪和焊接用于填充工质的充液管，得到成品。
第二种方式，采用钎焊工艺，可以包括以下步骤：
裁剪，对板材进行裁剪，其中，板材包括被设置为复合的第一板材和第二板材；
冲压管路，在板材上冲压传热管路；
清洗除油，对冲压后的板材进行清洗除油；
涂敷钎料，在板材上涂敷钎料以待钎焊，可采用掩板对任一焊接单体的焊接面涂敷钎料，同时达到钎料避让传热管路目的；
搭接固定，对待焊接的单体进行搭接固定；
开孔，对各层板材进行一体式冲孔，以在板材上制得开孔；
钎焊退火、焊接用于填充工质的充液管，得到成品。
可以理解的是，开孔步骤也可设置在涂敷钎料之后、搭接固定之前，针对各焊件单体独立实施开孔。
在钎焊过程中，钎料过热、焊件超时、钎料析出气体等因素会导致钎缝表面及焊接面内部出现气孔，造成焊件强度及可靠性下降。基于钎焊翅片，可以通过开孔在钎焊过程中排出多余气体，以提升开孔翅片的钎焊强度。
可以理解的是，本申请实施例针对防护板130为增强结构强度采用的加厚、加高措施带来的散热效率降低、重量增加的负面影响，在防护板130上设置有充装有传热工质的第二传热管路131和第二开孔132，使得防护板130不仅起到防护作用，还起到提高散热效率作用，而且通过第二开孔132还有利于减轻散热器100的重量。
本申请实施例还提供一种电子设备，该电子设备包括器件以及如上任一实施例所述的散热器100。器件作为热源通过导热胶或导热界面材料与安装在散热器100基板110的第二表面实现贴合。热源的热量通过该基板110传递至多个散热翅片120，再通过散热翅片120将热量散发到周围的环境中。
本申请实施例描述的电子设备可以是通信产品、家电产品等电子设备。
本申请实施例提供了一种散热器和电子设备，能够满足散热器轻量化、高散热的要求。一方面，本申请实施例通过在散热翅片上设置开孔阵列，能够减轻散热器的重量，从而满足散热器轻量化的要求；另一方面，本申请实施例通过开孔阵列增强散热翅片之间流道内的气流扰动，增大了热量与空气的接触面积，加快了热量向空气中传递，减小了热级联，使得散热器整体的散热效率显著提升。
以上是对本申请的实施进行了说明，但本申请并不局限于上述实施方式，熟悉本领域的技术人员在不违背本申请精神的共享条件下还可作出种种等同的变形或替换，这些等同的变形或替换均包括在本申请权利要求所限定的范围内。

Claims (14)

  1. 一种散热器，包括：
    基板；以及
    多个散热翅片，所述多个散热翅片间隔设置在所述基板的第一表面上；
    其中，所述多个散热翅片中的全部或者部分散热翅片设置有被设置为充装传热工质的第一传热管路和开孔阵列，所述开孔阵列包括多个第一开孔。
  2. 根据权利要求1所述的散热器，其中，所述开孔阵列的多个第一开孔在所述散热翅片上沿第一方向间隔排布，且所述多个第一开孔在所述散热翅片上沿第二方向呈多行排布，相邻两行的所述第一开孔互相错位设置。
  3. 根据权利要求1所述的散热器，其中，相邻的两个所述散热翅片之间的第一开孔互相错位设置。
  4. 根据权利要求1-3任一所述的散热器，其中，所述第一传热管路包括蜂窝状管路，所述蜂窝状管路界定出多个开孔区域，多个所述第一开孔分布在多个所述开孔区域内；
    和/或，
    所述第一传热管路包括沿第一方向间隔设置的多个最速降线管路以及被设置为连通所述最速降线管路的多个连接管路，多个所述最速降线管路和多个所述连接管路界定出多个开孔区域，多个所述第一开孔分布在多个所述开孔区域内。
  5. 根据权利要求1-3任一所述的散热器，其中，每个所述第一开孔的边缘与所述第一传热管路之间具有不小于预设第一距离阈值的间距。
  6. 根据权利要求1-3任一所述的散热器，其中，所述第一开孔与所述散热翅片的第一根部之间具有不小于预设第二距离阈值的间距，所述散热翅片的第一根部与所述基板连接。
  7. 根据权利要求1-3任一所述的散热器，还包括：
    两个防护板，分别设置在所述基板的两侧，所述多个散热翅片设置在所述两个防护板之间，所述防护板在第二方向上的高度大于所述散热翅片在第二方向上的高度。
  8. 根据权利要求7所述的散热器，其中，至少一个所述防护板设置有被设置为充装传热工质的第二传热管路。
  9. 根据权利要求7所述的散热器，其中，至少一个所述防护板还设置有一个或者多个第二开孔。
  10. 根据权利要求9所述的散热器，其中，每个所述第二开孔的边缘与所述第二传热管路之间具有不小于预设第五距离阈值的间距。
  11. 根据权利要求9所述的散热器，其中，所述第二开孔具有倒角内边角，且所述第二开孔与所述防护板的第二根部和第二稍部分别具有不小于预设第三距离阈值的间距，所述第二根部为所述防护板与所述基板相连接的侧边，所述第二稍部为与所述第二根部相对的侧边。
  12. 根据权利要求9所述的散热器，其中，所述第二开孔的数量为多个，多个所述第二开孔在所述防护板上沿第一方向间隔排布，且相邻两个所述第二开孔之间具有不小于预设第四距离阈值的间距。
  13. 根据权利要求7所述的散热器，其中，至少一个所述防护板具有倒角外边角。
  14. 一种电子设备，包括如权利要求1至13任一所述的散热器。
PCT/CN2022/080759 2021-06-11 2022-03-14 散热器和电子设备 Ceased WO2022257527A1 (zh)

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