WO2022247485A1

WO2022247485A1 - Current transmission plate, chip system, and electronic device

Info

Publication number: WO2022247485A1
Application number: PCT/CN2022/085798
Authority: WO
Inventors: 许亚晗; 靳雁冰; 白亚东; 史艳庚
Original assignee: 华为技术有限公司
Priority date: 2021-05-28
Filing date: 2022-04-08
Publication date: 2022-12-01
Also published as: CN115411956A

Abstract

The present application provides a current transmission plate, a chip system, and an electronic device. The chip system comprises: a motherboard, a chip, and a power supply unit. The motherboard comprises a first surface and a second surface. The chip is located on one side of the first surface of the motherboard. The power supply unit comprises a power supply module and a current transmission plate; the current transmission plate is located on one side of the second surface of the motherboard, and the current transmission plate comprises: a power input end and a power output end. The power input end is electrically connected to the power supply module; the power output end is electrically connected to a power pin of the chip by means of a power via hole of the motherboard; and the current transmission plate is used for converting the voltage output by the power supply module and transmitting current to the power pin of the chip. In the present application, the current transmission plate does not need to avoid a signal via hole and a ground via hole in the motherboard, so that the interference of a power supply path to high-speed signal transmission in a signal line can be reduced or eliminated, and the loss of the power supply path is reduced; moreover, the number of layers of the motherboard can be reduced, so that the process difficulty and cost are reduced.

Description

A current transmission board, chip system and electronic equipment

Cross References to Related Applications

This application claims the priority of the Chinese patent application with the application number 202110594022.5 and the application title "A Current Transmission Board, Chip System, and Electronic Device" filed with the China Patent Office on May 28, 2021, the entire contents of which are incorporated by reference in this application.

technical field

The present application relates to the field of chip technology, in particular to a current transmission board, a chip system and electronic equipment.

Background technique

With the development of the fifth generation mobile communication technology (5th generation mobile network, 5G) and artificial intelligence (artificial intelligence, AI) applications, network chips are required to provide stronger switching processing capabilities, and a central processing unit (central processing unit, CPU) and AI chips provide more powerful computing power, which will inevitably lead to these chips needing more current when working.

In the power supply scheme in the related art, the power supply current can reach the level of 800A or even 1000A+, but this brings a series of problems, for example, the power supply path loss is too large, and the local printed circuit board (printed circuit board, PCB) and chip welding The current of the ball is too large, as well as problems such as chip heat dissipation and reliability. Moreover, as the chip's demand for current continues to increase, the power supply solution in the related art cannot support the demand for greater current due to limitations in processing and cost.

Therefore, how to provide a larger current to the chip has become an urgent problem to be solved in this field.

Contents of the invention

Embodiments of the present application provide a current transmission board, a chip system and electronic equipment, which are used to reduce the loss of a power supply path supplying power to a chip and meet the high current demand of the chip.

In the first aspect, the embodiment of the present application provides a chip system, which may include: a motherboard, a chip, and a power supply unit, wherein: the motherboard includes a first surface and a second surface, and the chip is located on one side of the first surface of the motherboard , a power supply via hole is provided in the motherboard, the power supply via hole is connected to the first surface and the second surface, the chip is provided with a power supply pin, and the power supply pin is used to supply power to the chip. The power supply unit includes a power supply module and a current transmission board, and the current transmission board is located on one side of the second surface of the main board. The current transmission board includes: a power input terminal and a power output terminal; the power input terminal is electrically connected to the power supply module, the power output terminal is electrically connected to the power supply pin of the chip through the power supply hole in the motherboard, and the current transmission board is used to output power to the power supply module. The voltage is converted and the current is delivered to the power pin of the chip.

In the embodiment of the present application, the current transmission board can be bridged to avoid the signal via hole and the ground via hole in the motherboard, so that the interference of the power supply path to the high-speed signal transmission in the signal line can be reduced or eliminated. Moreover, since the current transmission board does not need to circumvent the signal vias and ground vias in the main board, it can reduce the loss of the power supply path without affecting the high-speed signal transmission of the main board, and can support large currents to supply power to the chip, avoiding Partial overheating ensures the reliable function of the chip and the motherboard. In addition, there is no need to set a power supply layer in the motherboard to supply power to the chip, which can reduce the number of layers of the motherboard, and reduce the difficulty and cost of the process.

Optionally, in this embodiment of the present application, the main board is provided with a power connection terminal on the second surface, and the power supply module is electrically connected to the power input terminal of the current transmission board through the power connection terminal.

In a possible implementation of the present application, the main board is provided with a ground connection terminal on the second surface, and a ground via hole is also provided in the main board, and the ground via hole is connected to the first surface and the second surface of the main board, and the chip is provided with a ground pin , the current transmission board further includes: a ground terminal; the ground terminal is electrically connected to the ground connection terminal, and the ground connection terminal is electrically connected to the ground pin of the chip through the ground via hole in the motherboard. In this way, a supply current return path can be formed, and the supply current return path returns from the ground pin of the chip to the ground via hole and the ground plane in the current transmission board through the ground via hole and the ground connection terminal in the main board.

When specifically setting the structure of the current transmission board, the power input terminal, the power output terminal, and the ground terminal of the current transmission board are all arranged on the side of the current transmission board close to the main board. In this way, the distance between the power input terminal, the power output terminal, and the ground terminal on the current transmission board and the main board is relatively close, so that the power input terminal, the power output terminal, and the ground terminal are connected to the corresponding terminals on the second surface of the main board. connect.

In a specific implementation, in the above chip system provided by the embodiment of the present application, the above power supply unit may include at least two current transmission boards, and the power output terminals of each current transmission board are connected in parallel. The output of the power output terminal of each current transmission board can be used as a power supply phase, and the power output terminals of multiple current transmission boards are connected in parallel to form a total output power supply with multi-phase power supply, so that the voltage of the corresponding phase can be provided to the chip. Of course, the above power supply unit may also include only one current transmission board, and the number of current transmission boards may be set according to actual needs, which is not limited here.

In a possible implementation manner, the above-mentioned power supply module may include: a front-stage power supply module and a power bus, and the front-stage power supply module is electrically connected to the power connection terminals in the main board through the power bus. That is to say, the pre-stage power supply module can be used as a voltage source or a current source to supply power to the chip. In actual implementation, the chip can be powered by multi-level power supply. The voltage of the front-stage power supply module is generally higher than the voltage required by the chip. The voltage is modulated by various components on the power supply path in the chip system, which can make The voltage supplied to the chip meets the needs of the chip.

In a possible implementation manner, the above-mentioned current transmission board may include: a substrate, and an inductor, one end of the inductor is electrically connected to a power supply input end, and the other end of the inductor is electrically connected to a power supply output end. In practical applications, the front-end power supply module transmits the current to the power connection terminal of the main board through the power bus, and then transmits the current to the inductor through the power input terminal of the current transmission board. The inductor can rectify the current, and then the rectified current It is transmitted to the power pins of the chip through the power vias in the motherboard to provide the required current to the chip.

In a possible implementation manner of the present application, the above-mentioned chip system may further include a power controller, and the power controller is arranged on the first surface or the second surface of the main board, and the above-mentioned current transmission board may also include: a field effect The transistor device, the field effect transistor device is electrically connected to the input terminal of the power supply, the field effect transistor device is electrically connected to one end of the inductor, and the field effect transistor device is electrically connected to the power supply controller.

In practical applications, the front-stage power supply module transmits the power and current to the power connection terminal of the motherboard through the power bus, and then transmits it to the input pin of the field effect transistor device through the power input terminal of the current transmission board, and the field effect transistor device Under the control of the power controller, the voltage conversion of the transmission power is completed. After that, the field effect transistor device transmits the power current to the inductor, rectifies the power current through the inductor, and transmits the power current after voltage conversion and rectification to the power pin of the chip through the power via hole in the motherboard.

In one embodiment of the present application, the field effect transistor device is arranged on the side of the substrate away from the main board, the power input terminal is arranged on the side of the current transmission board close to the main board, and the field effect transistor device passes through the power supply hole in the current transmission board It is electrically connected with the power input terminal. That is to say, the field effect transistor device and the power input terminal are respectively located on both sides of the current transmission board, and the electrical connection between the field effect transistor device and the power supply input terminal can be realized through the power supply via hole in the current transmission board, so that the current can be reasonably used The wiring space in the transmission board makes the structure of the current transmission board more compact.

In another implementation manner of the present application, the above chip system may further include a power controller, the power controller is arranged on the first surface or the second surface of the motherboard, the first surface of the motherboard is provided with a field effect transistor, and the field effect transistor The device is electrically connected to the power input terminal through the power supply hole in the main board, the field effect transistor device is electrically connected to one end of the inductor, and the field effect transistor device is electrically connected to the power supply controller. In this way, the electrical connection between the field effect transistor device and the power supply input terminal is realized, and the wiring space in the main board and the current transmission board can be reasonably utilized, so that the structure of the main board and the current transmission board is more compact.

Optionally, the above field effect transistor device may include: a first field effect transistor and a second field effect transistor. The drain of the first field effect transistor is electrically connected to the power supply input terminal in the current transfer board, the source of the first field effect transistor is electrically connected to the drain of the second field effect transistor, and the gate of the first field effect transistor is connected to the power supply The controller is electrically connected. The drain of the second field effect transistor is electrically connected to the inductor, the source of the second field effect transistor is grounded, and the gate of the second field effect transistor is electrically connected to the power controller. The power controller can control the on-off of the first field effect transistor and the second field effect transistor. When the power controller controls the first field effect transistor to be turned on, the inductor stores energy, and when the power controller controls the first field effect transistor to turn off When it is turned off and the second field effect transistor is controlled to be turned on, the inductor can provide freewheeling current to the load.

In a specific implementation, the above-mentioned power controller may be electrically connected to the field effect transistor device through a control bus in the main board.

In order to reduce the overall thickness of the current transmission board 22 , a groove is provided on the surface of the substrate facing away from the main board, and a part of the inductor is embedded in the groove.

In a possible implementation manner of the present application, the inductor may include: an inductor via hole and a magnetic substance. One end of the inductor via hole is electrically connected to the power input end, and the other end is electrically connected to the power output end. The substrate is provided with a cavity, the inductor via hole runs through the cavity, the cavity is filled with magnetic material, and the magnetic material surrounds the inductor via hole. Optionally, the cavity may be in the shape of a ring, and the magnetic substance is filled in the cavity. Therefore, the magnetic substance may also be in the shape of a ring, so that the magnetic substance can surround the inductor via hole. In this way, the inductor via hole and the magnetic substance can form a vertical inductor structure, and by providing a cavity in the substrate and filling the cavity with the magnetic substance, the inductor can be embedded in the substrate to improve the space utilization of the current transmission board. Realize the high-density design of the current transmission board.

In a possible implementation manner of the present application, the above-mentioned current transmission board further includes: an input capacitor and an output capacitor, wherein the input capacitor is electrically connected to the power input terminal of the current transmission board, and can filter the power current. The output capacitor is electrically connected to the output terminal of the power supply in the current transmission board, that is, the output capacitor is electrically connected to the inductor. After the power current is converted and rectified by the voltage of the field effect transistor device and the inductor, the output capacitor can filter the power current.

Optionally, the input capacitor and the output capacitor are arranged on a side of the substrate away from the main board. The wiring space in the current transmission board can be reasonably utilized to make the structure of the current transmission board more compact.

In a possible implementation of the present application, at least one output capacitor is located inside the substrate, and the at least one output capacitor located inside the substrate is connected in parallel with at least one output capacitor located on the surface of the substrate, and has an intersection in a direction perpendicular to the surface of the substrate. The overlapping area constitutes a filter structure, so that the current passes through the output capacitor on the surface of the substrate, and then is transmitted to the output capacitor inside the substrate through the via hole, and finally output to the main board, thereby reducing the noise of the power supply wave. In addition, arranging at least one output capacitor inside the substrate can also save the surface area of the substrate, improve space utilization, and realize high-density design of the current transmission board.

In practical applications, the above-mentioned chip system may further include: a voltage detection feedback line, one end of the voltage detection feedback line is electrically connected to the power controller, and the other end of the voltage detection feedback line is electrically connected to the power pin of the chip. That is to say, the power supply pin of the chip is electrically connected to the power supply controller through the voltage detection feedback line, and the voltages at both ends of the voltage detection feedback line are approximately equal. In this way, the voltage at the position where the power supply controller is electrically connected to the voltage detection feedback line, To reflect the voltage at the power supply pin of the chip, so that the actual voltage at the power supply pin of the chip can be determined according to the voltage detection feedback line.

In a possible implementation manner, the above-mentioned substrate may include: a printed circuit board, so that the structure and manufacturing process of the current transmission board may be simpler; or, the above-mentioned substrate may include: a rigid-flex board, wherein the rigid-flex The board consists of: two rigid board areas, and a flex board area between the two rigid board areas. In this way, the structure of the current transfer plate can be made more flexible.

In addition, the above chip system in the embodiment of the present application may further include: a filter capacitor, the filter capacitor is electrically connected to the output terminal of the power supply in the current transmission board, and the filter capacitor can further filter the power current transmitted from the output terminal of the power supply to the main board . The filter capacitor is arranged on the first surface or the second surface of the main board, and the filter capacitor is electrically connected to the power supply pin of the chip through the power supply hole in the main board. In this way, the wiring space in the motherboard can be reasonably utilized. Of course, the filter capacitor can also be arranged on the first surface of the motherboard, or the filter capacitor can also be arranged at other positions, which is not limited here.

In a possible implementation manner, the above substrate may include: a first transmission layer, a second transmission layer, and a prepreg located between the first transmission layer and the second transmission layer. Wherein, the prepreg can bond the first transmission layer and the second transmission layer.

In a second aspect, the present application further provides an electronic device, and the electronic device may include: any one of the chip systems described above.

In a third aspect, the present application also provides a current transmission board, and the current transmission board may include: a power input terminal and a power output terminal. The power input end is electrically connected to the power supply module, and the power output end is electrically connected to the power supply pin of the chip through the power supply via hole in the motherboard. The current transmission board is used to convert the voltage output by the power supply module and transmit the current to the power pin of the chip.

In the embodiment of the present application, for the implementation of the current transmission board, reference may be made to the description of the current transmission board in the above-mentioned system-on-a-chip, and repeated descriptions will not be repeated.

Description of drawings

FIG. 1 is a schematic diagram of a power supply architecture of a chip in the related art;

FIG. 2 is a schematic diagram of a cross-sectional structure of a chip system in the related art;

FIG. 3 is a schematic cross-sectional structure diagram of a chip system in an embodiment of the present application;

FIG. 4 is a schematic diagram of the architecture of the chip system in the embodiment of the present application;

FIG. 5 is a schematic top view of the chip system in the embodiment of the present application;

FIG. 6 is another cross-sectional schematic diagram of the chip system in the embodiment of the present application;

FIG. 7 is another schematic cross-sectional structure diagram of the chip system in the embodiment of the present application;

8 is a schematic cross-sectional view of the current transmission plate in the embodiment of the present application;

FIG. 9 is another schematic cross-sectional view of the current transmission plate in the embodiment of the present application.

Reference signs:

21-Main board; 211, 212-Connection line; 214-Control bus; 22-Current transmission board; 200-Substrate; 22a-First transmission layer; 22b-Second transmission layer; 22c-Prepreg; Area; 223-flex board area; 23-chip; 23a-power supply area; 231-power pin; 232-ground pin; 233-signal pin; 24-power supply module; 241-pre-stage power module; 242-power supply Bus; 25-power controller; 26-voltage detection feedback line; 201-connection pad; 202-conductive layer; S1-first surface; S2-second surface; V1-power input terminal; V2-power output terminal; V3-ground terminal; W1-power supply connection terminal; W2-ground connection terminal; U1-power supply via; U2-ground via; U3-signal via; MOS-field effect transistor device; MOS1-first field effect transistor; MOS2-second field effect transistor; L-inductor; L1-inductor via; L2-magnetic material; P-cavity; C1-input capacitor; C2-output capacitor; C3-filter capacitor.

Detailed ways

FIG. 1 is a schematic diagram of a power supply architecture of a chip in the related art, and FIG. 2 is a schematic diagram of a cross-sectional structure of a chip system in the related art. As shown in FIG. 1 and FIG. 2 , in the related art, the printed circuit board 101 supplies power to the chip 102 in a horizontal manner, that is, the power module in the printed circuit board 101 and the chip 102 have no overlapping area in the vertical direction. A power layer 104 electrically connected to the power pins of the chip 102 is provided in the printed circuit board 101 , and the power level provided by the power module is transmitted to the chip 102 through the power layer 104 . In practical applications, an independent power module 103 a can be provided on the printed circuit board 101 , and the power module 103 a is electrically connected to the power layer 104 , so the power module 103 a can supply power to the chip 102 through the power layer 104 . In addition, a power controller 105 and at least one power module 106 can also be set on the printed circuit board 101, the power controller 105 and at least one power module 106 can be used as the power module 103b, and the power controller 105 controls the power module 106 to The power layer 104 provides electric energy to implement power supply to the chip 102 .

Since the

power module

103 a or 103 b is connected to the same surface of the printed circuit board 101 as the chip 102 , the current output by the power module needs to travel a certain distance on the power layer 104 before reaching the chip 102 . Moreover, due to the limitation of the processing technology, the thickness of each layer of the printed circuit board 101 is only 0.5 oz-2 oz, which leads to a relatively large DC resistance Rdc of the power supply layer 104 . When the current required by the chip 102 is relatively large, the energy consumption I^2*Rdc on the power supply path on the power layer 104 will exceed the specifications for heat dissipation and chip power supply. In addition, since the current that each power module can provide is limited, when the current required by the chip 102 is large, multiple power modules are required to supply power to the chip 102 at the same time, and the DC impedance of different power modules to the power pins of the chip 102 Rdc is different, therefore, the current passing through each power supply pin is different, and the current passing through the peripheral power supply pin of the chip 102 is much larger than that of the internal power supply pin, which may cause the current passing through the peripheral power supply pin to exceed the power supply pin The limit that can be tolerated causes damage to the chip 102 . Therefore, due to the limitation of process and cost, the power supply scheme in the related art cannot support the demand of large current.

Based on this, embodiments of the present application provide a current transmission board, a chip system, and an electronic device, which are used to reduce the loss of a power supply path supplying power to the chip and meet the high current demand of the chip.

In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings.

It should be noted that in this specification, similar numerals and letters denote similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be identified in subsequent drawings. for further definition and explanation.

In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientation construction and operation, therefore should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and should not be understood as indicating or implying relative importance.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.

The chip system provided by the embodiment of the present application can supply power to a chip that requires a large current. For example, the chip can be a central processing unit chip, an artificial intelligence chip, etc. Of course, the chip can also be other types of chips, which are not limited here . The chip system proposed in the embodiment of the present application can be applied to various electronic devices, such as smart phones, smart TVs, smart TV set-top boxes, personal computers (personal computers, PCs), wearable devices, smart broadband and other electronic devices. . It should be noted that the system-on-a-chip proposed by the embodiments of the present application is intended to include but not be limited to be applied in these and any other suitable types of electronic devices.

FIG. 3 is a schematic cross-sectional view of a chip system provided by an embodiment of the present application. As shown in FIG. 3 , the chip system provided by the embodiment of the present application may include: a main board 21 , a chip 23 , and a power supply unit. Wherein, the motherboard 21 includes a first surface S1 and a second surface S2, and the motherboard 21 is provided with a power supply via U1, a ground via U2 and a signal via U3, and the chip 23 is provided with a power supply pin 231, a ground pin 232 and Signal pin 233 . The power via U1 communicates with the first surface S1 and the second surface S2 of the motherboard 21 , and the power via U1 can be electrically connected with the power pin 231 of the chip 23 , so as to supply power to the chip. The ground via U2 communicates with the first surface S1 and the second surface S2 of the motherboard 21 , and the ground via U2 can be electrically connected with the ground pin 232 of the chip, so as to provide a ground signal to the chip. The signal via U3 communicates with the first surface S1 and the second surface S2 of the motherboard 21, and the signal via U3 can be electrically connected to the signal pin 233 of the chip, so as to provide corresponding signals to the chip, for example, to transmit control signals or high-speed signals Wait. It should be noted that, in the schematic cross-sectional view of the chip system in the embodiment of the present application, for example, in the cross-sectional view shown in FIG. The holes are all power vias U1, the vias filled in light gray in the figure are ground vias U2, and the vias filled in white in the figure are signal vias U3. Moreover, the power supply vias U1 are electrically connected to each other through the connection wire 211 , and the ground vias U2 are electrically connected to each other through the connection wire 212 . Optionally, the base material of the main board 21 may be a printed circuit board.

In the chip system provided by the embodiment of the present application, the chip 23 is located on one side of the first surface S1 of the motherboard 21 , and the chip 23 is provided with a power supply pin 231 , and the power supply pin 231 is used to supply power to the chip 23 . The above power supply unit may include a power supply module 24 and a current transmission board 22, the current transmission board 22 is located on one side of the second surface S2 of the main board 21, the current transmission board 22 includes: a power input terminal V1 and a power output terminal V2, the power input terminal V1 It is electrically connected to the power supply module 24 , and the power output terminal V2 is electrically connected to the power supply pin 231 of the chip 23 through the power supply via U1 in the main board 21 . The current transmission board 22 is used to convert the voltage output by the power supply module 24 and transmit the current to the power supply pin 231 of the chip 23 , so as to supply power to the chip.

In the chip system provided by the embodiment of the present application, the current transmission board can be bridged to avoid the signal via hole and the ground via hole in the motherboard, so that the interference of the power supply path to the high-speed signal transmission in the signal line can be reduced or eliminated. Moreover, since the current transmission board does not need to circumvent the signal vias and ground vias in the main board, it can reduce the loss of the power supply path without affecting the high-speed signal transmission of the main board, and can support large currents to supply power to the chip, avoiding Partial overheating ensures the reliable function of the chip and the motherboard. In addition, there is no need to set a power supply layer in the motherboard to supply power to the chip, which can reduce the number of layers of the motherboard, and reduce the difficulty and cost of the process.

Optionally, as shown in FIG. 3 , the main board 21 is provided with a power connection terminal W1 on the second surface S2 , and the power supply module 24 is electrically connected to the power input terminal V1 of the current transmission board 22 through the power connection terminal W1 .

Continuing to refer to FIG. 3 , in the embodiment of the present application, the main board 21 is provided with a ground connection terminal W2 on the second surface S2 . The current transmission board 22 may further include: a ground terminal V3 electrically connected to the ground connection terminal W2, and the ground connection terminal W2 is electrically connected to the ground pin 232 of the chip 23 through the ground via U2 in the motherboard 21 . In this way, a supply current return path can be formed. The supply current return path returns from the ground pin of the chip to the ground via hole and the ground plane in the current transmission board 22 through the ground via hole U2 and the ground connection terminal W2 in the main board 21 .

In the embodiment of the present application, by setting the current transmission board 22 on the side of the second surface S2 of the main board 21, the current transmission board 22 can bridge and avoid the signal via hole U3 and the ground via hole U2 in the main board 21, and carry out the chip 23 power supply, and can form a supply current return path, so as to meet the large current demand of the chip 23 .

When specifically setting the structure of the current transmission board, the power input terminal V1, the power output terminal V2, and the ground terminal V3 can all be arranged on the side of the current transmission board 22 close to the main board 21, so that the power supply on the current transmission board 22 The distance between the input terminal V1, the power output terminal V2, and the ground terminal V3 and the main board 21 is relatively close, so that the power input terminal V1, the power output terminal V2, and the ground terminal V3 are connected to the corresponding terminals on the second surface S2 of the main board 21. electrical connection.

In a possible implementation, as shown in FIG. 3 , the above-mentioned power supply module 24 may include: a front-stage power supply module 241 and a power bus 242, and the front-stage power supply module 241 is connected to the power supply terminal W1 in the main board 21 through the power bus 242 Electrical connection, that is to say, the pre-stage power supply module 241 can serve as a voltage source or a current source for supplying power to the chip 23 . In specific implementation, the chip can be powered by multi-level power supply. The voltage of the front-stage power supply module 241 is generally higher than the voltage required by the chip 23, and the voltage is modulated by various components on the power supply path in the chip system. The voltage supplied to the chip 23 can be made to meet the needs of the chip.

In specific implementation, the above-mentioned power supply unit provided by the embodiment of the present application may include at least two current transmission boards, the power output terminals of each current transmission board are connected in parallel, and the power output terminals of each current transmission board may be multi-phase down 1-phase or multi-phase integration in the pressure conversion (buck) circuit, the output of the power output terminal of each current transmission board can be used as a power supply phase, and the power output terminals of multiple current transmission boards are connected in parallel to form a multi-phase power supply The total output power supply can provide the corresponding phase voltage to the chip. Of course, the above chip system may also include only one current transmission board, and the number of current transmission boards may be set according to actual needs, which is not limited here.

FIG. 4 is a schematic diagram of the power supply structure of the chip in the embodiment of the present application. In combination with FIGS. The power supply output terminal V2 is electrically connected. In practical applications, the front-stage power supply module 241 transmits the current to the power connection terminal W1 of the main board 21 through the power bus 242, and then transmits the current to the inductor L through the power input terminal V1 of the current transmission board 22, and the inductor L can rectify the current , and then, the rectified current is transmitted to the power supply pin 231 of the chip 23 through the power supply via U1 in the motherboard 21 to provide the required current to the chip 23 . In FIG. 4 , the current transmission board 22 includes an inductor L as an example. In practical applications, the current transmission board 22 may also include multiple inductors L, and the multiple inductors L may be connected in parallel or in series. There is no limit.

Continue to refer to Fig. 3 and Fig. 4, above-mentioned chip system can also comprise power supply controller 25, and power supply controller can be arranged on the first surface or the second surface of mainboard, among the figures, power supply controller 25 is arranged on the second surface of mainboard 21 S2 as an example. The above current transfer board may also include: a field effect transistor device MOS located on the substrate 200, the field effect transistor device MOS is electrically connected to the power input terminal V1 in the current transfer board 22, and the field effect transistor device MOS is electrically connected to one end of the inductor L. The field effect transistor device MOS is electrically connected to the power controller 25 . That is to say, one end of the inductor L is electrically connected to the field effect transistor device MOS, and the other end is electrically connected to the power output terminal V2 in the current transmission board 22 . The dotted box 23 a in FIG. 4 represents the power supply area of the chip 23 , and a plurality of power supply pins 231 are arranged in the power supply area, and the power supply output terminal V2 is electrically connected to the power supply pins 231 of the chip 23 .

During specific implementation, the connecting wires between the components in the current transmission board 22 are located inside the substrate 200, and there may be a plurality of pads on the surface of the substrate 200, and the pads are electrically connected to the connecting wires in the substrate 200, so that each component may be Welded to the corresponding pads, for example, the field effect transistor device MOS and the inductor L are fixed on the surface of the substrate 200 through the pads, so that the field effect transistor device MOS and the inductor L are electrically connected through the connecting wire inside the substrate 200 .

In the embodiment of the present application, by setting the current transmission board 22, the voltage provided by the front-stage power supply module 241 can be converted into the voltage required by the chip 23, and power filtering can be completed to meet the power supply specification requirements of the chip 23. The power controller 25 is electrically connected to the current transmission board 22. Optionally, the power controller 25 can be electrically connected to the field effect transistor device MOS through the control bus 214 in the main board 21, wherein the control bus 214 can be a plurality of control signal lines For example, the control bus 214 may be a general term for control signal lines such as drive signal lines, current detection lines, and temperature detection lines. That is to say, the power controller 25 can drive the current transmission board 22 , detect current and temperature, etc., so as to control the current transmission board 22 to perform voltage conversion and power current transmission.

In practical applications, the front-end power supply module 241 transmits the power and current to the power connection terminal W1 of the main board 21 through the power bus 242, and then transmits the power and current to the input of the field effect transistor device MOS through the power input terminal V1 of the current transmission board 22 The pin, the field effect transistor device MOS, completes the voltage conversion of the transmission power under the control of the power controller 25 . Afterwards, the field effect transistor device MOS transmits the power current to the inductor L, rectifies the power current through the inductor L, and transmits the power current after voltage conversion and rectification to the power supply pin 231 of the chip 23 through the power supply via U1 in the motherboard 21 .

As shown in Figure 4, each current transmission board 22 in the above-mentioned power supply unit is arranged in parallel, and the power controller 25 can adjust the switching frequency of each field effect transistor device MOS according to the needs of the chip 23, so that each current transmission board 22 is electrically connected. The sum of voltages output by the power supply output terminal V2 meets the requirements of the chip 23 .

FIG. 5 is a schematic top view of the chip system in the embodiment of the present application. As shown in FIG. 5 , the power supply unit may include a plurality of current transmission boards 22 , and a power controller 25 is electrically connected to each current transmission board 22 . In order to make the power supply path shorter, in the direction perpendicular to the first surface of the main board 21, the current transmission board 22 can have an overlapping area with the power supply area 23a of the chip 23. Optionally, the power supply output terminal in the current transmission board 22 It can be located directly under the power supply pin of the chip 23 to further shorten the power supply path. It should be noted that in FIG. 5 , the power supply unit includes six current transmission boards 22 as an example. In practical applications, the number of current transmission boards 22 can be set according to actual needs, which is not limited here.

As shown in FIG. 3 and FIG. 4 , the field effect transistor device MOS may include: a first field effect transistor MOS1 and a second field effect transistor MOS2 . The drain of the first field effect transistor MOS1 is electrically connected to the power supply input terminal V1 in the current transmission board, the source of the first field effect transistor MOS1 is electrically connected to the drain of the second field effect transistor MOS2, and the first field effect transistor MOS1 The gate of the grid is electrically connected to the power controller 25. The drain of the second field effect transistor MOS2 is electrically connected to the inductor L, the source of the second field effect transistor MOS2 is grounded, and the gate of the second field effect transistor MOS2 is electrically connected to the power controller 25 . The power controller 25 can control the on-off of the first field effect transistor MOS1 and the second field effect transistor MOS2. When the power controller 25 controls the first field effect transistor MOS1 to be turned on, the inductor L stores energy. When the power controller 25 When the first field effect transistor MOS1 is controlled to be turned off, and the second field effect transistor MOS2 is controlled to be turned on, the inductor L can provide freewheeling current to the load.

In one embodiment of the present application, as shown in FIG. 3 , the power input terminal V1 is arranged on the side of the current transmission board 22 close to the main board 21, so that it is convenient to connect the power input terminal V1 to the power connection terminal W1 on the main board 21. connect. The field effect transistor device MOS is disposed on the side of the substrate 200 away from the main board 21 , and the field effect transistor device MOS is electrically connected to the power input terminal V1 through the power supply via hole in the current transmission board 22 . That is to say, the field effect transistor device MOS and the power input terminal V1 are respectively located on both sides of the current transmission board 22, and the electrical connection between the field effect transistor device MOS and the power supply input terminal V1 can be realized through the power supply via hole in the current transmission board 22 , in this way, the wiring space in the current transmission board 22 can be reasonably utilized, making the structure of the current transmission board 22 more compact.

Fig. 6 is another cross-sectional schematic diagram of the chip system in the embodiment of the present application. As shown in Fig. 6, in another implementation of the present application, the above-mentioned chip system may also include a power controller 25, and the power controller may be set On the first surface or the second surface of the mainboard, in the figure, the power controller 25 is arranged on the second surface S2 of the mainboard as an example for illustration. The first surface S1 of the motherboard is provided with a field effect transistor device MOS, the field effect transistor device MOS is electrically connected to the inductor L, and the field effect transistor device MOS is electrically connected to the power controller 25 . The field effect transistor device MOS is electrically connected to the power input terminal V1 in the current transmission board 22 through the power supply via hole in the main board 21, thereby realizing the electrical connection between the field effect transistor device MOS and the power supply input terminal V1, and the main board 21 can be reasonably used and the wiring space in the current transmission board 22 make the structure of the main board 21 and the current transmission board 22 more compact.

Optionally, as shown in FIG. 3 , the power controller 25 is disposed on the second surface S2 of the motherboard 21 , and the power controller 25 is electrically connected to the field effect transistor device MOS through the control bus 214 in the motherboard 21 . The power controller 25 is arranged on the second surface S2 of the main board 21, the distance between the power controller 25 and the field effect transistor device MOS can be made closer, and it is convenient to realize the electrical connection between the power controller 25 and the field effect transistor MOS, which can be reasonably The wiring space in the motherboard 21 is utilized. Of course, the power controller 25 can also be arranged on the first surface S1 of the motherboard 21 , and the specific location of the power controller 25 is not limited here.

FIG. 7 is a schematic diagram of another cross-sectional structure of the chip system in the embodiment of the present application. As shown in FIG. 4 and FIG. The power input terminal V1 in the transmission board 22 is electrically connected, and the output capacitor C2 is electrically connected to the power output terminal V2 in the current transmission board 22 . The front-stage power supply module 241 transmits the current to the power connection terminal W1 of the main board 21 through the power bus 242, and then through the power input terminal V1 of the current transmission board 22, the input capacitor C1 is electrically connected to the power input terminal V1 of the current transmission board 22, which can Filter the power current. The output capacitor C2 is electrically connected to the power supply output terminal V2 in the current transmission board 22, that is, the output capacitor C2 is electrically connected to the inductor L. After the power current is converted and rectified by the voltage of the field effect transistor device MOS and the inductor L, the output capacitor C2 can be used for The power current is filtered.

In addition, the above chip system in the embodiment of the present application may further include: a filter capacitor C3, the filter capacitor C3 is electrically connected to the power output terminal V2 in the current transmission board 22, and the filter capacitor C3 can transmit the power output terminal V2 to the main board The power current of 21 is further filtered, and the filtered power current is transmitted to the power pin 231 of the chip 23 through the power via U1 in the main board 21 . The filter capacitor C3 is disposed on the second surface S2 of the main board 21 , and the filter capacitor C3 is electrically connected to the power pin 231 of the chip 23 through the power via U1 in the main board 21 . In this way, the connection path between the filter capacitor C3 and the power supply pin 231 of the chip 23 can be shortened, and the wiring space in the motherboard 21 can be reasonably utilized. Of course, the filter capacitor C3 can also be arranged on the first surface S1 of the main board 21 , or the filter capacitor C3 can also be arranged at other positions, which is not limited here.

Continuing to refer to FIG. 7 , in order to facilitate the electrical connection with the main board 21, the power input terminal V1, the power output terminal V2, and the ground terminal V3 are generally arranged on the side of the substrate 200 close to the main board 21, and the above-mentioned input capacitor C1 and output capacitor C2 is disposed on the side of the substrate 200 away from the main board 21 , which can reasonably utilize the wiring space in the current transmission board 22 and make the structure of the current transmission board 22 more compact.

8 is a schematic cross-sectional view of the current transmission plate in the embodiment of the present application. As shown in FIG. The output capacitors C2 are connected in parallel, and have an overlapping area in the direction perpendicular to the surface of the substrate 200, thereby forming a filter structure, so that the current passes through the output capacitor C2 on the surface of the substrate, and then is transmitted to the output capacitor C2 inside the substrate 200 through the via hole , and finally output to the main board 21, thereby reducing the noise of the power supply signal. In FIG. 8, an output capacitor C2 located inside the substrate 200 is used as an example to illustrate. In actual implementation, the output capacitor set in the substrate 200 can be determined according to actual needs. The quantity of C2 is not limited here. In addition, disposing at least one output capacitor C2 inside the substrate 200 can also save the surface area of the substrate 200 , improve space utilization, and realize a high-density design of the current transmission board 22 . During the manufacturing process, at least one output capacitor C2 can be embedded in the current transmission plate 22 by adopting a device embedding process. It should be noted that, in the current transmission plate 22, all the output capacitors C2 can be arranged inside the substrate 200; or, all the output capacitors C2 can be arranged on the surface of the substrate 200; or, a part of the output capacitors C2 can also be arranged It is arranged inside the substrate 200 , and another part of the output capacitor C2 is arranged on the surface of the substrate 200 , and the specific location of the output capacitor C2 is not limited here.

Continuing to refer to FIG. 8 , the thickness of the general inductance L is relatively large. For example, the thickness of the inductance L is greater than the thickness of the field effect transistor device MOS. There is a groove T, and a part of the inductor L is embedded in the groove T. A connection pad 201 may be provided at the bottom of the groove T, and a conductive layer 202 may be provided on the sidewall of the groove T. The conductive layer 202 is electrically connected to the connection pad 201. For example, the conductive layer 202 may be formed by copper plating. During the process, the inductor L can be welded to the connection pad 201 so that the inductor L can be electrically connected to the field effect transistor device MOS, and the inductor L can be electrically connected to the output terminal V2 of the power supply. In order to make the thickness of the inductor L smaller, the inductor L can be a molded metal magnetic ultra-thin inductor. Of course, the inductor L can also be other types of inductors, which are not limited here. Certainly, the inductor L may also be directly arranged on the surface of the substrate 200 , and the specific location of the inductor L is not limited here.

Fig. 9 is another schematic cross-sectional view of the current transmission board in the embodiment of the present application. As shown in Fig. 9, the above-mentioned inductance L may include: an inductance via hole L1 and a magnetic substance L2, and the magnetic substance L2 may be a magnetic mixture. Of course, the The magnetic substance L2 can be any magnetic substance, which is not limited here. One end of the inductor via L1 is electrically connected to the power input terminal V1 , and the other end is electrically connected to the power output terminal V2 in the current transmission board 22 . A cavity P is provided in the substrate 200, the inductance via hole L1 runs through the cavity P, and the magnetic substance L2 is filled in the cavity P, and the magnetic substance L2 surrounds the inductance via hole L1. Optionally, the cavity P may be in the shape of a ring, The magnetic substance L2 is filled in the cavity P, therefore, the magnetic substance L2 can also be in the shape of a ring, so that the magnetic substance L2 can surround the inductor via hole L1. In this way, the inductance via hole L1 and the magnetic substance L2 can form a vertical inductance structure, and by providing a cavity P in the substrate 200, the magnetic substance L2 can be filled in the cavity P, so that the inductance L can be embedded in the substrate 200 to improve The space utilization of the current transmission board 22 realizes the high-density design of the current transmission board 22 .

Optionally, the substrate 200 may include: a first transmission layer 22a, a second transmission layer 22b, and a prepreg 22c located between the first transmission layer 22a and the second transmission layer 22b, and the prepreg 22c may bond the first transmission layer 22a and the second transport layer 22b. During the manufacturing process, an annular groove can be opened in the first transmission layer 22a, and the magnetic substance L2 can be filled in the annular groove, and then the second transmission layer 22b is pressed onto the first transmission layer 22a by using the prepreg 22c, so that A cavity P is formed at the annular groove, and then an inductance via hole L1 is made, and the inductance via hole L1 passes through the magnetic substance L2 in the cavity P to form an inductance L. One end of the inductance via hole L1 is electrically connected to the field effect transistor device MOS, and the other end is electrically connected to the power supply output terminal V2 in the current transmission board 22, so that the field effect transistor device MOS and the inductance L can be controlled by the power controller Convert and transfer the supplied power.

In practical applications, as shown in FIG. 4 , the above-mentioned chip system provided by the embodiment of the present application may also include: a voltage detection feedback line 26, one end of the voltage detection feedback line 26 is electrically connected to the power controller 25, and the voltage detection feedback line 26 The other end is electrically connected to the power supply pin 231 of the chip 23 . That is to say, the power supply pin 231 of the chip 23 is electrically connected to the power controller 25 through the voltage detection feedback line 26, and the voltages at both ends of the voltage detection feedback line 26 are approximately equal. The voltage at the electrical connection position reflects the voltage at the power supply pin 231 of the chip 23 , so that the actual voltage at the power supply pin 231 of the chip 23 can be determined according to the voltage detection feedback line 26 . When the power controller 25 detects that the deviation between the actual voltage at the power supply pin 231 of the chip 23 and the target voltage for supplying power to the chip 23 exceeds the set threshold, it can adjust the switching frequency of each field effect transistor device MOS to make each current transfer The sum of the voltages output from the power supply output terminal V2 electrically connected to the board 22 meets the requirements of the chip 23 .

As shown in FIG. 3 , in a possible implementation manner, the substrate 200 may include: a printed circuit board. In this way, the structure and manufacturing process of the current transmission board 22 may be simplified. As shown in FIG. 7, in another possible implementation manner, the above-mentioned current transmission board may include: a rigid-flexible board, the rigid-flexible board includes two

hard board areas

221 and 222, and the hard board area 221 and the hard board The flexible board area 223 between the areas 222, in this way, can make the structure of the current transmission board 22 more flexible. over the hard board area 222 . For example, in the current transmission board 22 on the left side in FIG. 7 , the input capacitor C1 and the field effect transistor device MOS are arranged on the hard board area 221 , and the inductor L and the output capacitor C2 are arranged on the hard board area 222 . As another example, in the current transmission board 22 on the right side in FIG. 7 , a field effect transistor device MOS and an inductor L are provided on the rigid board area 221 , and an output capacitor C2 is provided on the rigid board area 222 . In the manufacturing process, hard materials can be used to make the substrate 200, and then the hard material in the flex board area is removed, thereby forming two

hard board areas

221 and 222, and forming a flexible board between the hard board area 221 and the hard board area 222 flex board area 223 .

Based on the same technical idea, an embodiment of the present application further provides an electronic device, where the electronic device includes any one of the chip systems described above. According to the above analysis, since the chip system is equipped with a current transmission board, the current transmission board 22 does not need to avoid the signal via U3 and the ground via U2 in the main board 21, which can reduce or eliminate the high-speed signal transmission of the power supply path to the signal line. interference. Moreover, it can reduce the loss of the power supply path without affecting the high-speed signal transmission of the main board, and can support high current to supply power to the chip, avoid local overheating, and ensure the reliable function of the chip and the main board. In addition, there is no need to set a power supply layer in the motherboard to supply power to the chip, which can reduce the number of layers of the motherboard, and reduce the difficulty and cost of the process.

Based on the same technical idea, the embodiment of the present application also provides a current transmission board. Referring to FIG. 3 , the current transmission board 22 may include: a power input terminal V1 and a power output terminal V2, and the power supply input terminal V1 is electrically connected to the power supply module 24 , the power supply output terminal V2 is electrically connected to the power supply pin 231 of the chip 23 through the power supply via hole U1 in the main board 21, and the current transmission board 22 is used to convert the voltage output by the power supply module 24 and transmit the current to the power supply of the chip 23 Pin 231. In the embodiment of the present application, for the implementation of the current transmission board, reference may be made to the description of the current transmission board in the above-mentioned system-on-a-chip, and repeated descriptions will not be repeated.

The above is only a specific implementation of the application, but the scope of protection of the application is not limited thereto. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the application. Should be covered within the protection scope of this application. Therefore, the protection scope of the present application should be determined by the protection scope of the claims.

Claims

A system on a chip, characterized in that it includes: a motherboard, a chip, and a power supply unit, wherein:

The motherboard includes a first surface and a second surface, the chip is located on one side of the first surface of the motherboard, and a power supply hole is provided in the motherboard, and the power supply hole communicates with the first a surface and said second surface;

The chip is provided with a power supply pin, and the power supply pin is used to supply power to the chip;

The power supply unit includes a power supply module and a current transmission board, and the current transmission board is located on one side of the second surface of the main board; the current transmission board includes: a power input terminal and a power output terminal, and the power input terminal terminal is electrically connected to the power supply module, and the power output terminal is electrically connected to the power supply pin of the chip through the power supply via hole in the main board;

The current transmission board is used for converting the voltage output by the power supply module, and transmitting the current to the power supply pin of the chip.
The chip system according to claim 1, wherein the main board is provided with a power connection terminal on the second surface, and the power supply module is connected to the power input of the current transmission board through the power connection terminal. electrical connection.
The chip system according to claim 1 or 2, wherein the main board is provided with a ground connection terminal on the second surface, and a ground via hole is also provided in the main board, and the ground via hole communicates with the said first surface and said second surface of a motherboard;

The chip is provided with a ground pin;

The current transmission board further includes: a ground terminal; the ground terminal is electrically connected to the ground connection terminal, and the ground connection terminal is electrically connected to the ground pin of the chip through the ground via hole in the motherboard.
The chip system according to claim 3, wherein the power input terminal, the power output terminal, and the ground terminal of the current transmission board are all arranged on the current transmission board close to the main board side.
The chip system according to any one of claims 1-4, wherein the power supply unit includes at least two current transmission boards; and the power output ends of each current transmission board are connected in parallel.
The chip system according to claim 2, further comprising: the power supply module includes a front-stage power supply module and a power bus;

The front-stage power supply module is electrically connected to the power connection terminal in the main board through the power bus.
The chip system according to any one of claims 1-6, wherein the current transmission board comprises: a substrate, and an inductor;

One end of the inductor is electrically connected to the input end of the power supply, and the other end is electrically connected to the output end of the power supply.
The chip system according to claim 7, wherein the chip system further comprises a power controller, and the power controller is arranged on the first surface or the second surface of the motherboard;

The current transfer plate further includes: a field effect transistor device located on the substrate;

The field effect transistor device is electrically connected to the input terminal of the power supply, the field effect transistor device is electrically connected to one end of the inductor, and the field effect transistor device is electrically connected to the power supply controller.
The chip system according to claim 8, wherein the field effect transistor device is arranged on the side of the substrate away from the mainboard, and the power input terminal is arranged on the side of the current transmission board close to the mainboard side;

The field effect transistor device is electrically connected to the power supply input terminal through the power supply via hole in the current transmission board.
The chip system according to claim 7, wherein the chip system further comprises a power controller, and the power controller is arranged on the first surface or the second surface of the motherboard;

The first surface of the motherboard is provided with a field effect transistor;

The field effect transistor device is electrically connected to the power supply input terminal through the power supply via hole in the main board, and the field effect transistor device is electrically connected to one end of the inductor;

The field effect transistor device is electrically connected to the power controller.
The chip system according to any one of claims 8-10, wherein the power controller is electrically connected to the field effect transistor device through a control bus in the main board.
The chip system according to claim 7, wherein the surface of the substrate facing away from the main board is provided with a groove;

A part of the inductor is embedded in the groove.
The chip system according to claim 7, wherein the inductor comprises: an inductor via hole and a magnetic substance;

One end of the inductance via hole is electrically connected to the power input end, and the other end is electrically connected to the power output end;

A cavity is provided in the substrate, and the inductance via hole runs through the cavity;

The magnetic substance is filled in the cavity, and the magnetic substance surrounds the inductor via hole.
The chip system according to any one of claims 1-13, wherein the current transmission board further comprises: an input capacitor and an output capacitor;

The input capacitor is electrically connected to the power input terminal in the current transmission board, and the output capacitor is electrically connected to the power output terminal in the current transmission board.
The chip system according to claim 14, wherein the input capacitor and the output capacitor are disposed on a side of the substrate away from the main board.
The chip system according to claim 14, wherein at least one of the output capacitors is located inside the substrate;

At least one of the output capacitors located inside the substrate is connected in parallel with at least one of the output capacitors located on the surface of the substrate, and have an overlapping area in a direction perpendicular to the surface of the substrate.
The chip system according to any one of claims 8-11, further comprising: a voltage detection feedback line; one end of the voltage detection feedback line is electrically connected to the power controller, and the voltage detection feedback line The other end of the chip is electrically connected to the power pin of the chip.
The chip system according to any one of claims 6-17, wherein the substrate comprises: a printed circuit board;

Alternatively, the substrate includes: a rigid-flex board; the rigid-flex board includes: two rigid board areas, and a flexible board area located between the two rigid board areas.
The chip system according to any one of claims 1-18, further comprising: a filter capacitor;

The filter capacitor is arranged on the first surface or the second surface of the motherboard, and the filter capacitor is electrically connected to the power supply pin of the chip through the power supply via hole in the motherboard.
The chip system according to any one of claims 7-18, wherein the substrate comprises: a first transmission layer, a second transmission layer, and an between prepregs.
An electronic device, characterized by comprising: the chip system according to any one of claims 1-20.
A current transmission board, characterized by comprising: a power input terminal and a power output terminal;

The power supply input terminal is electrically connected to the power supply module, and the power supply output terminal is electrically connected to the power supply pin of the chip through the power supply via hole in the motherboard;

The current transmission board is used for converting the voltage output by the power supply module, and transmitting the current to the power supply pin of the chip.
The current transmission board according to claim 22, further comprising: a ground terminal; the ground terminal is electrically connected to the ground connection terminal in the main board.
The current transmission board according to claim 22, wherein the current transmission board comprises: a substrate, and an inductor;

One end of the inductor is electrically connected to the input end of the power supply, and the other end is electrically connected to the output end of the power supply.
The current transfer plate of claim 24, further comprising: a field effect transistor device located on the substrate;

The field effect transistor device is electrically connected to the input terminal of the power supply, the field effect transistor device is electrically connected to one end of the inductor, and the field effect transistor device is electrically connected to the power supply controller.
The current transmission plate according to claim 24 or 25, wherein grooves are provided on the surface of the substrate;

A part of the inductor is embedded in the groove.
The current transmission board according to claim 24 or 25, wherein the inductance comprises: an inductance via hole and a magnetic substance;

One end of the inductance via hole is electrically connected to the input end of the power supply, and the other end is electrically connected to the output end of the power supply;

A cavity is provided in the substrate, and the inductance via hole runs through the cavity;

The magnetic substance is filled in the cavity, and the magnetic substance surrounds the inductor via hole.
The current transmission board according to any one of claims 24-27, wherein the current transmission board further comprises: an input capacitor and an output capacitor;

The input capacitor is electrically connected to the power input terminal in the current transmission board, and the output capacitor is electrically connected to the power output terminal in the current transmission board.
The current transfer board of claim 28, wherein at least one of said output capacitors is located within said substrate;

At least one of the output capacitors located inside the substrate is connected in parallel with at least one of the output capacitors located on the surface of the substrate, and have an overlapping area in a direction perpendicular to the surface of the substrate.
The current transmission board according to any one of claims 24-29, wherein the substrate comprises: a printed circuit board;

Alternatively, the substrate includes: a rigid-flex board; the rigid-flex board includes: two rigid board areas, and a flexible board area located between the two rigid board areas.