WO2022246813A1 - Module de puissance doté d'un système de dissipation de chaleur, et onduleur - Google Patents

Module de puissance doté d'un système de dissipation de chaleur, et onduleur Download PDF

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Publication number
WO2022246813A1
WO2022246813A1 PCT/CN2021/096830 CN2021096830W WO2022246813A1 WO 2022246813 A1 WO2022246813 A1 WO 2022246813A1 CN 2021096830 W CN2021096830 W CN 2021096830W WO 2022246813 A1 WO2022246813 A1 WO 2022246813A1
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WO
WIPO (PCT)
Prior art keywords
passage
heat dissipation
cooling
power module
outflow
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Application number
PCT/CN2021/096830
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English (en)
Chinese (zh)
Inventor
戴一
庄艳
陈达
Original Assignee
舍弗勒技术股份两合公司
戴一
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 舍弗勒技术股份两合公司, 戴一 filed Critical 舍弗勒技术股份两合公司
Priority to PCT/CN2021/096830 priority Critical patent/WO2022246813A1/fr
Priority to CN202180096453.7A priority patent/CN117121356A/zh
Publication of WO2022246813A1 publication Critical patent/WO2022246813A1/fr

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention relates to the field of heat dissipation of a power module of a current conversion device, in particular to a power module with a heat dissipation system and an inverter including the power module.
  • inverters are used to perform the above functions.
  • the inverter may include various power modules, such as an insulated gate bipolar transistor (IGBT) module and a silicon carbide (SiC) module.
  • IGBT insulated gate bipolar transistor
  • SiC silicon carbide
  • the cooling medium (such as water) flows from one side of the power module to the other side of the power module (from the left side in Figure 1 to the right side in Figure 1 ) flow, so as to flow sequentially through the A-phase circuit module 201 , B-phase circuit module 202 and C-phase circuit module 203 arranged on the base body 10 of the power module.
  • the temperature of the A-phase circuit module 201 on the upstream side of the cooling medium flow is relatively low, and the temperature of the C-phase circuit module 203 on the downstream side of the cooling medium flow is relatively high, so the temperature of the entire power module
  • the heat dissipation of the three circuit modules is not uniform, resulting in a low utilization rate of the power module, and the circuit module with a higher temperature becomes an obstacle to increase the utilization rate of the entire power module.
  • the heat dissipation system has heat dissipation modules 30 corresponding to the circuit modules shown in Figure 1 respectively, and the cooling medium flows through the heat dissipation modules 30 to realize the cooling of the circuit modules. heat dissipation.
  • this heat dissipation scheme can improve the uniformity of heat dissipation of each circuit module to a certain extent, but in the case that the flow rate of the cooling medium flowing through each heat dissipation module 30 at the same time cannot be guaranteed to be the same, In fact, the heat dissipation of each circuit module is still not uniform enough, so there is also the problem of low utilization of the power module.
  • the inside of the heat dissipation system is provided with flow guide fins, etc., which also increases the structural complexity of the heat dissipation system and increases the manufacturing cost.
  • the present invention is made in view of the above-mentioned defects of the prior art.
  • An object of the present invention is to provide a power module with a heat dissipation system, which can achieve uniform heat dissipation for each circuit module in the power module at a lower cost.
  • Another object of the present invention is to provide an inverter including the above power module.
  • the present invention provides a power module with a heat dissipation system.
  • the power module includes a base body and a plurality of circuit modules arranged side by side on the base body.
  • the heat dissipation system includes:
  • An inflow portion is formed with an inlet for the cooling medium to flow in and a plurality of communication ports corresponding to each of the circuit modules, the inlet is in communication with the plurality of communication ports, and the inflow portion is configured such that The flow rate of the cooling medium through each of the communicating ports is approximately the same;
  • cooling portion that communicates with the inflow portion via the plurality of communication ports, the cooling portion is in contact with at least a corresponding portion of the base body where the plurality of circuit modules are provided, and the cooling portion
  • the interior is connected and corresponds to all the plurality of circuit modules as a whole, and the cooling medium that flows into the cooling part through the plurality of communication ports flows into the cooling part and then spreads throughout the entire cooling part;
  • the outflow part is arranged on the opposite side of the inflow part with respect to the cooling part, the outflow part communicates with the cooling part, and an outlet for the cooling medium to flow out is formed in the outflow part .
  • the inflow portion has a common passage and branch passages branching from the common passage, one end of the common passage is connected to the inlet, and the other end of the common passage is connected to the plurality of communication ports at a distance of The first communication port with the longest passage length of the inlet is connected to the first communication port, and the branch passages are respectively connected to other communication ports in the plurality of communication ports except the first communication port.
  • the common passage extends linearly from the inlet toward the first communication port.
  • the plurality of circuit modules are arranged side by side along an arrangement direction perpendicular to the vertical direction, in the arrangement direction, the inlet is located on one side relative to the first communicating port, and the common passage is opposite to the The alignment direction extends obliquely.
  • the branch passages extend linearly in a direction perpendicular to the arrangement direction.
  • the cross-sectional area of the common passage is greater than the sum of the cross-sectional areas of the branch passages; and/or
  • the cross-sectional area of the branch passages shorter the passage length from the inlet is smaller than the cross-sectional area of the branch passages long the passage length from the inlet;
  • the branch passage having a short passage length from the inlet has a passage length greater than a cross-sectional area of the branch passage having a long passage length from the inlet.
  • the outflow part includes a converging part and an outflow passage communicated with each other, the converging part is in communication with the cooling part, and the cooling fluid from the cooling part is converged to the outflow passage via the converging part, One end of the outflow path is connected to the converging part, and the other end of the outflow path is connected to the outlet.
  • the base body has a flat plate shape, the plane where the base body is located is arranged along a vertical direction or at a certain angle to the vertical direction, and the central axis of the outflow channel is perpendicular to the plane where the base body is located.
  • the position of the inlet is lower than that of the outlet.
  • the present invention provides the following inverter, which includes the power module described in any one of the above technical solutions.
  • the present invention provides a power module with a cooling system and an inverter including the power module.
  • the power module includes a base body and a plurality of circuit modules arranged side by side on the base body.
  • the cooling system includes an inflow part, a cooling part and an outflow part.
  • the inflow portion is formed with an inlet for the cooling medium to flow in and a plurality of communication ports corresponding to each circuit module, the inlet communicates with the plurality of communication ports, and the inflow portion is configured so that the flow rate of the cooling medium through each communication port is approximately the same.
  • the cooling part communicates with the inflow part through a plurality of communication ports, the cooling part is in contact with the part of the base body provided with a plurality of circuit modules, and the cooling part as a whole corresponds to all the circuit modules, and the cooling medium that flows into the cooling part through the plurality of communication ports flows into the cooling unit. section and then evenly throughout the entire cooling section.
  • the outflow part is arranged on the opposite side of the inflow part with respect to the cooling part, the outflow part communicates with the cooling part, and the outflow part is formed with an outlet for the cooling medium to flow out.
  • the heat dissipation system adopts a relatively simple structure to enable the medium in the cold zone to flow through multiple circuit modules at the same time in a more uniform manner, thereby realizing uniform heat dissipation of the multiple circuit modules, and further The utilization rate of the entire power module is improved.
  • Fig. 1 is a schematic diagram showing a conventional heat dissipation solution for a power module of an inverter, where the arrows indicate the flow direction of the cooling medium.
  • Fig. 2 is a schematic diagram showing another conventional heat dissipation solution for a power module of an inverter, where the arrows indicate the flow direction of the cooling medium.
  • FIG. 3 is a schematic diagram showing a power module with a heat dissipation system according to an embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view showing the power module in FIG. 3 , where the arrows indicate the flow direction of the cooling medium.
  • phase circuit module 202 B phase circuit module 203 C phase circuit module 30 cooling module
  • Base body 21 First circuit module 22 Second circuit module 23 Third circuit module 3 Cooling system 31 Inflow part 31i inlet 311 Public passage 311o First connection port 312 First branch passage 312o Second connection port 313 Second branch passage 313o Second connection port Three connection ports 32 cooling part 33 outflow part 33o outlet 331 converging part 332 outflow channel
  • a power module includes a substrate 1, three circuit modules (a first circuit module 21, a second circuit module 22 and a third circuit module 23) and a cooling system 3 .
  • the base body 1 has a flat plate shape, such as a circuit board.
  • the plane on which the base body 1 is located is arranged along the vertical direction V.
  • Three circuit modules 21, 22, 23 are arranged on the substrate 1 along an arrangement direction H (the left-right direction in FIG. 3 ) perpendicular to the vertical direction V, and each circuit module 21, 22, 23 forms a predetermined circuit structure, thereby Realize the intended function.
  • the heat dissipation system 3 includes an inflow portion 31, a cooling portion 32, and an outflow portion 33 that communicate with each other.
  • a cooling medium such as water flows into the heat dissipation system 3 from the inflow portion 31, and flows through the cooling portion 32 to the circuit modules 21, 22. , 23 for cooling to achieve heat dissipation of the circuit modules 21, 22, 23, and then flow out of the heat dissipation system 3 from the outflow portion 33.
  • the inflow portion 31 is located on the upstream side of the cooling medium flow.
  • the inflow part 31 is formed with an inlet 31i for the cooling medium to flow in, three communication ports 311o, 312o, 313o corresponding to each circuit module, and a communication path.
  • the inlet 31i communicates with the three communication ports 311o, 312o, 313o through the communication path.
  • the inflow part 31 is set so that the flow rate of the cooling medium flowing into the cooling part through each communication port 311o, 312o, 313o at the same time is approximately the same , so that the uniformity of heat dissipation of the three circuit modules 21, 22, 23 can be improved.
  • the communication passage has a common passage 311 and two branch passages 312, 313 branched from the common passage 311, and both the common passage 311 and the branch passages 312, 313 are formed in a tubular shape.
  • One end of the public passage 311 is connected to the entrance 31i, and the other end of the public passage 311 is connected to the communication port with the longest passage length from the entrance 31i among the plurality of communication ports 311o, 312o, 313o (in this embodiment, the communication port with the first circuit module 21
  • the corresponding first communication ports 311o are connected.
  • the inlet 31i is located on one side in the arrangement direction H with respect to the first communicating port 311o.
  • the common passage 311 extends linearly from the inlet 31i to the first communicating port 311o.
  • Both the first branch passage 312 and the second branch passage 313 extend linearly along the vertical direction V, and the first branch passage 312 extends linearly from the common passage 311 to the second communication port 312o corresponding to the second circuit module 22.
  • the second branch passage 313 linearly extends from the common passage 311 to the third communication port 313 o corresponding to the third circuit module 23 .
  • the cross-sectional area of the common passage 311 should be greater than the sum of the cross-sectional areas of the first branch passage 312 and the second branch passage 313, and Preferably, the flow rate of the cooling medium remaining in the common passage 311 after branching from the first branch passage 312 and the second branch passage 313 is substantially the same as the flow rate of the cooling medium flowing through the first branch passage 312 and the second branch passage 313 respectively.
  • the cross-sectional area of the first branch passage 312 is larger than the cross-sectional area of the second branch passage 313
  • the passage length of the first branch passage 312 is smaller than the passage length of the second branch passage 313 .
  • the cooling unit 32 communicates with the inflow unit 31 through the plurality of communication ports 311o, 312o, and 313o.
  • the cooling unit 32 is not divided into cooling modules corresponding to different circuit modules as shown in FIG. 2 .
  • the interior of the cooling unit 32 is connected and corresponds to all three circuit modules 21 , 22 , 23 as a whole.
  • the cooling part 32 is in contact with the corresponding part of the base body 1 provided with the three circuit modules 21, 22, 23, and the cooling medium flowing into the cooling part 32 through a plurality of communication ports 311o, 312o, 313o flows into the cooling part 32 It will be more uniform throughout the entire cooling portion 32 .
  • the outflow portion 33 is located on the downstream side of the cooling medium flow.
  • the outflow portion 33 is disposed on the opposite side of the inflow portion 31 relative to the cooling portion 32 , the outflow portion 33 communicates with the cooling portion 32 , and the outflow portion 33 is formed with an outlet 33 o for the cooling medium to flow out.
  • the outflow part 33 includes a converging part 331 and an outflow passage 332 communicating with each other.
  • the converging part 331 communicates with the cooling part 32.
  • the converging part 331 makes the cooling fluid from the cooling part 32 converge toward the converging end.
  • One end of the outflow passage 332 is connected to the converging part 331.
  • the converging ends are connected, and the other end of the outflow channel 332 is connected with the outlet 33o.
  • the central axis of the outflow channel 332 is perpendicular to the plane where the base body 1 is located.
  • the plane where the base body 1 of the power module is located is arranged along the vertical direction V.
  • the position of the inlet 31i is lower than that of the outlet 33o, and the cooling medium flows in from the lower inlet 31i and then flows out from the higher outlet 33o, which can reduce the probability of air bubbles gathering in the cooling system.
  • the present invention also provides an inverter, which has the power module with the above structure. Since the heat dissipation system 3 realizes uniform heat dissipation of each circuit module 21 , 22 , 23 in the power module, it can avoid the limitation of the utilization rate of the power module by a single circuit module 21 , 22 , 23 with high temperature. It can be understood that, in the case of the same heat dissipation as the heat dissipation solution shown in FIG. 1 and FIG. 2 , the power module according to the present invention can provide a larger current, thus improving the utilization rate of the power module.
  • the plate-shaped base 1 is arranged along the vertical direction V when the power module according to the present invention is in use, the present invention is not limited thereto.
  • the power module can be used with the base body 1 at an angle to the vertical direction V.
  • the inlet 31i of the inflow part 31 below the outlet 33o of the outflow part 33 in the vertical direction V. In this way, after the cooling medium flows in from the inlet 31i, the probability of air bubbles gathering in the cooling system 3 can be effectively reduced.
  • the first circuit module 21 , the second circuit module 22 and the third circuit module 23 respectively correspond to three corresponding AC circuits of the three-phase AC power.
  • the heat dissipation system 3 according to the present invention has a simple structure, is easy to manufacture, and has low cost.
  • the inverter according to the present invention is used in the transmission field of vehicles (such as automobiles).

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un module de puissance ayant un système de dissipation de chaleur, comprenant un corps de base (1) et de multiples modules de circuit (21, 22, 23) qui sont disposés côte à côte sur le corps de base (1). Le système de dissipation de chaleur (3) comprend une partie de débit entrant (31), une partie de refroidissement (32) et une partie de débit sortant (33). La partie de débit entrant (31) est configurée de telle sorte que les débits de milieu de refroidissement s'écoulant vers la partie de refroidissement (32) par l'intermédiaire de chacune des ouvertures de communication (311o, 312o, 313o) sont sensiblement identiques. Les intérieurs de la partie de refroidissement (32) sont en communication l'un avec l'autre, et la partie de refroidissement (32) dans son ensemble correspond à tous les multiples modules de circuit (21, 22 23). Après écoulement dans la partie de refroidissement (32), le milieu de refroidissement s'écoule à travers toute la partie de refroidissement (32). Le milieu de refroidissement provenant de la partie de refroidissement (32) s'écoule hors de la partie de débit sortant (33). De cette manière, le système de dissipation de chaleur utilise une structure plus simple pour obtenir une dissipation de chaleur uniforme des multiples modules de circuit, ce qui permet d'améliorer le taux d'utilisation de l'ensemble du module de puissance. L'invention concerne en outre un onduleur qui comprend le module de puissance.
PCT/CN2021/096830 2021-05-28 2021-05-28 Module de puissance doté d'un système de dissipation de chaleur, et onduleur WO2022246813A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2021/096830 WO2022246813A1 (fr) 2021-05-28 2021-05-28 Module de puissance doté d'un système de dissipation de chaleur, et onduleur
CN202180096453.7A CN117121356A (zh) 2021-05-28 2021-05-28 具有散热系统的功率模块及逆变器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/096830 WO2022246813A1 (fr) 2021-05-28 2021-05-28 Module de puissance doté d'un système de dissipation de chaleur, et onduleur

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WO2022246813A1 true WO2022246813A1 (fr) 2022-12-01

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1728365A (zh) * 2004-07-01 2006-02-01 国际商业机器公司 用于半导体集成电路封装的微通道冷却的设备和方法
WO2011048585A1 (fr) * 2009-10-21 2011-04-28 Cooltek 2 Go Ltd. Système de distribution et de refroidissement de liquide
US20140196871A1 (en) * 2013-01-11 2014-07-17 Fuji Electric Co., Ltd. Semiconductor module cooler and semiconductor module
CN109640601A (zh) * 2019-01-31 2019-04-16 英特换热设备(浙江)有限公司 一种用介质冷却的散热器，以及具有该散热器的空调变频器、电子设备
CN111226299A (zh) * 2017-10-19 2020-06-02 Acp动力公司 改进的用于功率半导体器件的散热装置和方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1728365A (zh) * 2004-07-01 2006-02-01 国际商业机器公司 用于半导体集成电路封装的微通道冷却的设备和方法
WO2011048585A1 (fr) * 2009-10-21 2011-04-28 Cooltek 2 Go Ltd. Système de distribution et de refroidissement de liquide
US20140196871A1 (en) * 2013-01-11 2014-07-17 Fuji Electric Co., Ltd. Semiconductor module cooler and semiconductor module
CN111226299A (zh) * 2017-10-19 2020-06-02 Acp动力公司 改进的用于功率半导体器件的散热装置和方法
CN109640601A (zh) * 2019-01-31 2019-04-16 英特换热设备(浙江)有限公司 一种用介质冷却的散热器，以及具有该散热器的空调变频器、电子设备

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