WO2022239346A1

WO2022239346A1 - Imaging device

Info

Publication number: WO2022239346A1
Application number: PCT/JP2022/006150
Authority: WO
Inventors: 秀雄宮野; 雅春坂田
Original assignee: ソニーグループ株式会社
Priority date: 2021-05-12
Filing date: 2022-02-16
Publication date: 2022-11-17
Also published as: JPWO2022239346A1

Abstract

An imaging device according to an embodiment of the present technology is provided with a rotation unit, an imaging unit, a board, and an inertial sensor. The rotation unit is configured to be rotatable about a predetermined rotation axis. The imaging unit is disposed in the rotation unit and rotates together with the rotation unit. The board is disposed in the rotation unit so as to be separated from the imaging unit, and rotates together with the rotation unit. The inertial sensor is disposed on the board. Therefore, the measurement accuracy of the inertial sensor can be improved.

Description

Imaging device

The present technology relates to an imaging device having an inertial sensor.

Patent Document 1 discloses an imaging device having a heat dissipation system. In this imaging device, the bottom of the housing is made of a member with high thermal conductivity. A member with high thermal conductivity is also provided between the bottom portion and the imaging element. As a result, the heat generated in the image pickup device can be efficiently released (Patent Document 1, page 2, lower right column, lines 17-20, page 3, upper right column, lines 1-4). , FIG. 1, etc.).

Patent Document 2 discloses a unit with a rotating mechanism that can correct the inclination of the movable body. This unit with a rotating mechanism has a movable body and a support, and is mounted on a moving body such as a vehicle or an aircraft through the support. In addition, an inertial sensor detects the tilt of the support with respect to the horizontal plane. Furthermore, the tilt of the movable body with respect to the reference posture is corrected based on the detection result of the inertial sensor. As a result, the movable body can maintain the reference posture (paragraphs [0001] [0006] [0047] [0048] FIG. 1 of Patent Document 2, etc.).

JP-A-63-94785 JP 2019-75676 A

Regarding imaging devices with inertial sensors, the decrease in measurement accuracy of inertial sensors is a problem.

In view of the circumstances as described above, the purpose of the present technology is to provide an imaging device capable of improving the measurement accuracy of the inertial sensor.

To achieve the above object, an imaging device according to one aspect of the present technology includes a rotating section, an imaging section, a substrate, and an inertial sensor.
The rotating part is configured to be rotatable about a predetermined rotating shaft.
The imaging section is installed on the rotating section and rotates integrally with the rotating section.
The substrate is installed on the rotating section so as to be spaced apart from the imaging section, and rotates integrally with the rotating section.
The inertial sensor is arranged on the substrate.

In this imaging device, an imaging unit is installed in a rotatable rotation unit. Further, a board is installed on the rotating part so as to be separated from the imaging part, and an inertial sensor is arranged on the board. This makes it possible to improve the measurement accuracy of the inertial sensor.

The imaging section may be installed on the rotating section so that the imaging direction faces the outside of the rotating section. In this case, the imaging direction may change according to the rotation of the rotating section.

The rotating part may have an internal space in which the rotating shaft is arranged.
In this case, the substrate divides the internal space into a first divided space including the center of gravity of the imaging section and the imaging section by a plane that is perpendicular to a perpendicular line from the center of gravity of the imaging section to the rotation axis and includes the rotation axis. When it is divided into a second divided space that does not include the center of gravity, the rotation part may be installed so that the center of gravity is included in the second divided space.

The imaging unit may be installed so as to be included in the first divided space. In this case, the substrate may be installed so as to be included in the second divided space.

The substrate may be arranged in a direction orthogonal to the imaging direction of the imaging unit.

The rotating part may have an outer peripheral part. In this case, the imaging device is further made of a material having thermal conductivity, is thermally connected to each of the imaging section and the outer peripheral section, and conducts heat generated from the imaging section to the outer peripheral section. A heat conducting portion may be provided.

At least one of the thermal connection between the imaging section and the thermally conductive section or the thermal connection between the outer peripheral section and the thermally conductive section may be realized by connection via a heat dissipation material.

The heat conducting section may be installed on the rotating section so as to press the imaging section against the rotating section.

The imaging unit may be installed on the rotating unit via a cushion material.

The imaging device may further include a rotation driving section that rotates the rotating section.

The imaging device may further include a rotation driving section that rotates the rotating section. In this case, the rotation driving section may be arranged so as to be spaced apart from the heat conducting section.

The imaging device may further include a rotation driving section that rotates the rotating section. In this case, the rotation drive part may be arranged so as to be spaced apart from the heat dissipation material.

The imaging device may further include a balancer installed at a predetermined position of the rotating section so that the center of gravity of the imaging device is located on the rotation axis.

The inertial sensor may be configured to include at least one of an acceleration sensor and an angular velocity sensor.

The imaging device may further include a rotation control section that controls rotation of the rotating section based on the detection result of the inertial sensor.

1 is a perspective view showing an appearance example of an imaging device; FIG. 3 is a functional block diagram for explaining basic operations of the imaging device; FIG. 1 is an exploded perspective view of an imaging device; FIG. FIG. 3 is a side view of the imaging device as seen from the positive direction side in the Z direction; FIG. 5 is a cross-sectional view taken along line AA of FIG. 4; FIG. 3 is a side view of the imaging device viewed from the negative direction side in the Y direction; FIG. 7 is a cross-sectional view taken along line BB of FIG. 6; It is a perspective view which shows the internal structure of an imaging device. 2 is a cross-sectional view showing a configuration example of a motor; FIG. FIG. 5 is a cross-sectional view taken along line AA of FIG. 4; FIG. 9 is a view of the imaging device shown in FIG. 8 as seen from the negative direction side in the Y direction; FIG. 12 is a side view of the imaging device shown in FIG. 11 as seen from the positive side in the Z direction; 12A and 12B are diagrams when a motor flexible substrate is installed in the imaging device shown in FIG. 11; 13A and 13B are diagrams when a motor flexible substrate is installed in the imaging device shown in FIG. 12; It is a schematic diagram which shows the outline|summary of a holding structure. It is a schematic diagram which shows the example of a variation of an adhesion structure. It is a schematic diagram which shows the example of a variation of an adhesion structure. It is a schematic diagram which shows the example of a variation of an adhesion structure. It is a schematic diagram which shows an example of a pressing structure. It is a schematic diagram which shows an example of a pressing structure. It is a schematic diagram which shows an example of the arrangement configuration of a connection structure part. It is a schematic diagram which shows an example of the arrangement configuration of a connection structure part.

Hereinafter, embodiments according to the present technology will be described with reference to the drawings.

[Overview of Imaging Device]
FIG. 1 is a perspective view showing an appearance example of an imaging device according to this embodiment.
As shown in FIG. 1, the imaging device 100 has a substantially cylindrical shape. FIG. 1 shows the exterior so that the bottom 2a and the side 3 of the two bottoms 2 (2a and 2b) of the imaging device 100 can be seen.

Hereinafter, the depth direction (perpendicular to the bottom portion 2a) is defined as the X direction, the horizontal direction is defined as the Y direction, and the vertical direction is defined as the Z direction.
Also, the positive direction and negative direction of the X direction shown in FIG. 1 may be referred to as the front direction and the back direction. The positive direction and negative direction of the Y direction may be described as the right direction and the left direction. The positive direction and negative direction of the Z direction may be described as upward direction and downward direction.
Furthermore, the above expressions may be used to indicate the viewing direction of the imaging device 100 . For example, the expression "viewing the imaging device 100 from the positive side of the X direction" means "viewing the imaging device 100 from the tip side of the arrow indicating the X axis".
Of course, in the application of the present technology, the orientation in which the imaging device 100 is used is not limited.

The imaging device 100 has a rotating section 1 configured to be rotatable about a predetermined rotation axis.
In this embodiment, the rotating portion 1 has a bottom portion 2 (2a and 2b) and side portions 3, and is configured to be rotatable about a rotating shaft 5 passing through the center of the bottom portion 2 and extending in the X direction. be.
The rotating part 1 is rotatable about the rotating shaft 5 in the clockwise or counterclockwise direction when viewed from the X direction. In FIG. 1, the direction of rotation of the rotating portion 1 is indicated by a thick arrow.
The rotating section 1 also functions as a housing for the imaging device 100 .

As shown in FIG. 1, a side portion 3 of the rotating portion 1 is provided with a window portion 4 .
Specifically, a concave portion 6 is formed in the side portion 3 of the rotating portion 1 , and the window portion 4 is arranged on the bottom surface of the concave portion 6 . The window part 4 has a substantially rectangular shape when viewed from the front. The shape of the window part 4 is not limited.
The window part 4 is configured as a transparent member. In the present disclosure, "transparency" includes not only complete transparency but also semi-transparency and colored transparency.

A camera module 21 (see FIG. 3) is installed inside the rotating portion 1 at a position facing the window portion 4 .
The camera module 21 is installed on the rotating part 1 so that the imaging direction 7 faces the outside of the rotating part 1 . As shown in FIG. 1 , the camera module 21 is installed such that the imaging direction 7 is perpendicular to the window 4 .
Note that the imaging direction 7 is the axial direction of the imaging optical axis of the camera module 21 .
The camera module 21 corresponds to an embodiment of an imaging unit according to the present technology.

As will be described later in detail, the camera module 21 is installed on the rotating section 1 so as to rotate integrally with the rotating section 1 .
Therefore, the imaging direction of the camera module 21 changes according to the rotation of the rotating section 1 .
For example, by controlling the rotation of the rotating portion 1, it is possible to arbitrarily set the imaging direction of the camera module 21 over the entire circumference of 360 degrees with the rotation axis 5 as the center.

[Rotation control]
FIG. 2 is a functional block diagram for explaining the basic operation of the imaging device 100. As shown in FIG.
As shown in FIG. 2 , the imaging device 100 has an inertial sensor 10 , a controller 11 and a rotation drive section 12 .

The inertial sensor 10 is a sensor capable of measuring inertial force. In this embodiment, the inertial sensor 10 is configured to include at least one of an acceleration sensor and an angular velocity sensor. In this embodiment, an IMU (Inertial Measurement Unit) sensor is used as the inertial sensor 10 . IMU sensors are also called inertial measurement units.
The IMU sensor is capable of detecting (sensing) the acceleration and angular velocity of the imaging device 100 . The IMU sensor can detect the acceleration and angular velocity of the imaging device 100 with respect to, for example, three mutually orthogonal axes.
Of course, as the inertial sensor 10, only an acceleration sensor may be used, or only an angular velocity sensor may be used.
Any configuration may be adopted as a specific configuration of the inertial sensor 10 .

The controller 11 has hardware necessary for configuring a computer, such as a CPU, ROM, RAM, and HDD. For example, the CPU loads a program according to the present technology prerecorded in the ROM or the like into the RAM and executes the program, thereby executing the processing related to the rotation control and the like according to the present technology.
As the controller 11, for example, a PLD such as FPGA or a device such as ASIC may be used. Any computer such as a PC (Personal Computer) may function as the controller 11 .
As shown in FIG. 2, in this embodiment, the rotation control unit 13 as a functional block is configured by the CPU executing a predetermined program. Of course, dedicated hardware such as an IC (integrated circuit) may be used to implement the functional blocks.
Programs are installed, for example, via various recording media. Alternatively, program installation may be performed via the Internet or the like.
The type of recording medium on which the program is recorded is not limited, and any computer-readable recording medium may be used. For example, any computer-readable non-transitory storage medium may be used.
Note that the controller 11 is typically configured inside the imaging device 100 . The controller 11 is not limited to this, and the controller 11 may be configured outside the imaging device 100 and connected to the inertial sensor 10, the rotation driving section 12, and the like so as to be communicable.

The rotation driving section 12 rotates the rotating section 1 .
In this embodiment, a motor 16 (see FIG. 3) is used as the rotation drive section 12 .
The motor 16 is connected to the bottom portion 2b of the rotating portion 1 opposite to the bottom portion 2a.
A specific configuration of the motor 16 is not limited. Also, a device other than the motor 16 may be used as the rotation drive unit 12 .

The rotation control section 13 controls rotation of the rotating section 1 based on the detection result of the inertial sensor 10 .
For example, an operator (user) or the like of the imaging device 100 inputs an operation for controlling the imaging direction of the camera module 21 . The rotation control unit 13 controls the imaging direction 7 of the camera module 21 according to the operator's operation.
At that time, the rotation control unit 13 controls the rotation operation of the rotation driving unit 12 based on the detection result (sensing result) of the inertia sensor 10 . This makes it possible to control the rotation of the rotating section 1 with high accuracy, and to control the imaging direction 7 of the camera module 21 with high accuracy.

For example, the imaging device 100 can be mounted on a moving object such as a drone.
Based on the detection result of the inertial sensor 10, it is also possible to acquire information about the position and orientation of the imaging device 100 (camera module 21), and high-precision imaging by the imaging device 100 becomes possible. As a result, it becomes possible to capture a high-quality image.
A specific algorithm for rotation control by the rotation control unit 13 is not limited.

[Configuration of imaging device]
A specific configuration example of the imaging apparatus 100 will be described with reference to FIGS. 3 to 14. FIG. First, the description of each figure is described.
FIG. 3 is an exploded perspective view of the imaging device 100. FIG. FIG. 3 shows a perspective view of the disassembled state in which the imaging device 100 faces the same direction as in FIG.
FIG. 4 is a side view of the imaging device 100 viewed from the positive side in the Z direction.
5 is a cross-sectional view taken along line AA of FIG. 4. FIG.
FIG. 6 is a side view of the imaging device 100 viewed from the negative direction side in the Y direction.
7 is a cross-sectional view taken along line BB of FIG. 6. FIG.
FIG. 8 is a perspective view showing the internal configuration of the imaging device 100. As shown in FIG. FIG. 8 is a perspective view of the front holder 18 viewed from the inside.
FIG. 9 is a cross-sectional view showing a configuration example of the motor 16. As shown in FIG.
FIG. 10 is a cross-sectional view along line AA in FIG. 4, similar to FIG.
FIG. 11 is a view of the imaging device 100 shown in FIG. 8 as seen from the negative side in the Y direction.
FIG. 12 is a side view of the imaging device 100 shown in FIG. 11 viewed from the positive side in the Z direction.
13A and 13B are diagrams showing a case in which the motor flexible board 17 is installed in the imaging device 100 shown in FIG.
14A and 14B are diagrams showing a case in which the motor flexible board 17 is installed in the imaging device 100 shown in FIG.

As shown in FIG. 3, the imaging device 100 includes a window portion 4, a front holder 18, a cushion 19, a camera holder 20, a camera module 21, a camera flexible board 22, a heat sink 23, two heat sink screws 24, and three motors. screw 25 , IMU board 26 , board screw 27 , weight 28 , and rear holder 29 .
The imaging device 100 also has a motor 16 and a motor flexible substrate 17 .

The front holder 18 functions as a housing for the imaging device 100 .
The front holder 18 has a semi-cylindrical portion 30 and a bottom portion 31 . The semi-cylindrical portion 30 and the bottom portion 31 are made of, for example, rigid material. As a result, various members of the imaging device 100 are protected from external impact.
Of course, the specific material and shape of the front holder 18 are not limited.

In the present embodiment, the semi-cylindrical portion 30 has a shape approximately equal to one of the two halves of a cylinder (that is, a hollow cylinder) divided by a plane including the central axis of the cylinder.
That is, as shown in FIG. 3, the semi-cylindrical portion 30 has a shape of a cylinder cut in half.
The semi-cylindrical portion 30 is arranged such that the central axis of the cylinder coincides with the rotation axis 5 .

The semi-cylindrical portion 30 has an inner surface 32 on the rotating shaft 5 side and an outer surface 33 on the opposite side of the inner surface 32 . The semi-cylindrical portion 30 also has two semi-ring-shaped arc surfaces 34 (34a and 34b) facing each other along the X direction.

A concave portion 6 is formed on the outer surface 33 of the semi-cylindrical portion 30 . An opening 35 is formed in the bottom surface of the recess 6 . The opening 35 has a circular shape when viewed from the front.
As shown in FIG. 3, the window portion 4 is arranged so as to cover the opening portion 35 of the recess portion 6 .

The window part 4 is made of a member having high transparency and rigidity, such as an acrylic plate. Moreover, the window portion 4 has a substantially rectangular shape that is substantially the same shape as the bottom surface of the recess portion 6 .
Since the window part 4 has rigidity, it is possible to suppress the effect of the impact on the camera module 21 and the like when an impact is applied to the window part 4 from the outside. That is, the durability of the imaging device 100 is improved.
Of course, the material and shape of the window portion 4 are not limited, and any configuration may be adopted. Moreover, the method of fixing the window part 4 with respect to the recessed part 6 is not limited, either.

An internal space 61 is formed on the inner surface 32 side of the semi-cylindrical portion 30 .
The inner surface 32 of the semi-cylindrical portion 30 is provided with a mechanism for holding various members such as the camera module 21 and the IMU board 26 arranged in the internal space 61 .

The bottom portion 31 has a substantially disk shape.
The bottom portion 31 has a circumferential portion of which the bottom portion 31 has a half circumferential portion along the inner surface 32 of the semi-cylindrical portion 30 and further inside than the arc surface 34b on the negative direction side in the X direction (that is, X on the positive side of the direction).
Hereinafter, of the two circular surfaces of the bottom portion 31 , the surface located on the inner side (the positive side in the X direction) will be referred to as an inner surface 36 . A surface located on the outside side (negative direction side in the X direction) is called an outer surface 37 .

The motor 16 is screwed to the bottom portion 31 .
Specifically, through holes 38 are formed in portions corresponding to the three motor screws 25 shown in FIGS.
The motor screw 25 passes through a through hole 38 formed in the bottom portion 31 and fits into a screw hole formed in the motor 16 . As a result, the motor 16 is screwed to the bottom portion 31 .
The number of motor screws 25, fastening positions, etc. are not limited and may be designed arbitrarily.
Further, as shown in FIG. 7, an opening 39 into which the central shaft of the motor 16 is inserted is formed in the center of the bottom portion 31 . The opening 39 has a circular shape when viewed from the X direction.

The rear holder 29 functions as a housing of the imaging device 100 together with the front holder 18 .
The rear holder 29 has a semi-cylindrical portion 40 and a bottom portion 41 . The semi-cylindrical portion 40 and the bottom portion 41 are made of, for example, rigid material. Of course, specific materials and shapes are not limited.
As shown in FIG. 3 , the semi-cylindrical portion 40 of the rear holder 29 has substantially the same shape as the semi-cylindrical portion 30 of the front holder 18 . The bottom portion 41 of the rear holder 29 also has substantially the same shape as the bottom portion 31 of the front holder 18 .
On the inner surface 42 of the semi-cylindrical portion 40, a mechanism for holding various members of the imaging device 100 is configured, similarly to the inner surface 32 of the semi-cylindrical portion 30 of the front holder 18. As shown in FIG.

As shown in FIG. 3 and the like, the bottom portion 41 is formed with a cylindrical portion 46 . As shown in FIG. 4, the cylindrical portion 46 is configured to protrude from the bottom portion 41 in the positive direction of the X direction.
A circular opening is formed at the tip of the cylindrical portion 46 .

The bottom portion 41 is configured so that the half circumference portion of the circumference portion of the bottom portion 41 is along the inner surface 32 of the semi-cylindrical portion 40 .
Also, the bottom portion 41 is configured at a position substantially equal to the end portion of the semi-cylindrical portion 40 (the portion on the most positive side in the X direction) when viewed from the Y direction.

In FIG. 4 , the portion below the position of the rotating shaft 5 is the semi-cylindrical portion 30 of the front holder 18 . A semi-cylindrical portion 40 of the rear holder 29 is formed above the position of the rotating shaft 5 .

In the state shown in FIG. 3, the front holder 18 is arranged on the most positive side in the Y direction of the imaging device 100 . Also, the rear holder 29 is arranged on the most negative side in the Y direction.
Further, other members are arranged in the internal space 61 inside the front holder 18 and the rear holder 29 .
That is, in FIG. 3, the front holder 18 and the rear holder 29 are fitted to hold various members inside the front holder 18 and the rear holder 29, and the imaging device 100 is assembled as shown in FIG.

The semi-cylindrical portion 30 of the front holder 18 and the semi-cylindrical portion 40 of the rear holder 29 constitute the side portion 3 shown in FIG. The bottom portion 31 of the front holder 18 constitutes the bottom portion 2b, and the bottom portion 41 of the rear holder 29 constitutes the bottom portion 2a. That is, the front holder 18 and the rear holder 29 constitute the entire rotating portion 1 shown in FIG.
The front holder 18 and the rear holder 29 correspond to one embodiment of the rotating part according to the present technology.
In addition, the semi-cylindrical portion 30 of the front holder 18 and the semi-cylindrical portion 40 of the rear holder 29, that is, the side portion 3 of the rotating portion 1, correspond to an embodiment of the outer peripheral portion according to the present technology.

The cushion 19 is made of a soft material such as urethane.
As shown in FIG. 3, the cushion 19 has a plate-like shape consisting of two generally square faces, and a circular opening is formed in the center of the square face. The cushion 19 is arranged so that the square faces are perpendicular to the Y-axis.
Of course, the specific material and shape of the cushion 19 are not limited.
Cushion 19 represents one embodiment of a cushioning material according to the present technology.

Camera holder 20 is a member for holding camera module 21 .
In order to stably hold the camera module 21, the camera holder 20 is made of, for example, rigid material.
As shown in FIG. 3, the camera holder 20 has a hollow quadrangular prism shape and has two openings facing each other along the Y direction. A camera module 21 is fitted inside the camera holder 20 .
Note that the specific material and shape of the camera holder 20 are not limited.

The camera module 21 performs imaging of the outside of the imaging device 100 .
Any camera may be used as the camera module 21 . For example, a digital camera capable of capturing still images or moving images, an infrared camera, or the like is used. Alternatively, a camera having a distance measuring function, such as a ToF (Time Of Flight) camera, stereo camera, or monocular camera, may be used.
The camera module 21 has various mechanisms for imaging such as a lens system.
The camera module 21 corresponds to an embodiment of an imaging unit according to the present technology.
A specific shape of the camera module 21 is not limited.

The camera module 21 rotates integrally with the front holder 18 and the rear holder 29 according to the rotation of the front holder 18 and the rear holder 29 . Further, the camera module 21 changes the imaging direction 7 according to the rotation of the front holder 18 and the rear holder 29 .

The camera flexible board 22 is a board for driving the camera module 21 . In this embodiment, flexible board 22 is connected to IMU board 26 .
The camera flexible substrate 22 has a rectangular shape and can be bent. One end of the camera flexible board 22 is connected to the camera module 21 . The other end of the camera flexible board 22 is connected to the IMU board 26 .
In this embodiment, as shown in FIG. 3, the camera flexible board 22 is folded in three along the Z direction and connected. The camera flexible board 22 in a bent state has a substantially U shape when viewed from the Z direction.
In this embodiment, the operation of the camera module 21 is controlled by the controller 11 . Power is supplied, control signals are output, and the like are performed via the camera flexible substrate 22 .

The heat sink 23 is a member for conducting heat generated from the camera module 21 .
The heat sink 23 is made of a thermally conductive material such as aluminum.
The heat sink 23 corresponds to one embodiment of the heat conducting part according to the present technology.

As shown in FIGS. 3 and 5 , the heat sink 23 has a central abutment surface 48 , two connection surfaces 49 and two end abutment surfaces 47 . These surfaces are constructed by bending sheet metal.
For example, two short sides of a substantially rectangular sheet metal are bent in the same direction by 90 degrees. The two bent portions become the two end contact surfaces 47 .
In addition, a recess is formed in the central portion of the region between the two end contact surfaces 47 in the direction in which the two end contact surfaces 47 are bent. The bottom surface of the formed recess serves as the central contact surface 48 . Two connection surfaces 49 are provided between the two end contact surfaces 47 and the central contact surface 48 .
A through hole 50 is formed in each of the two connection surfaces 49 .
Note that the specific configuration of the heat sink 23 is not limited.

A method of installing the camera module 21 on the front holder 18 will be described with reference to FIG.
A camera module 21 is set in the camera holder 20 .
The camera module 21 is attached to the camera holder 20 so that the lens of the camera module 21 is exposed from the front opening of the camera holder 20 .
A cushion 19 is installed on the front surface of the camera module 21 . The cushion 19 covers the camera module 21 so that the lens of the camera module 21 is exposed through the circular opening.
In this way, the camera module 21, the camera holder 20, and the cushion 19 are integrated, and as shown in FIG. be done.

A central abutment surface 48 of the heat sink 23 is connected to the rear surface of the camera module 21 . Through holes 50 formed in the two connection surfaces 49 of the heat sink 23 are aligned with screw holes formed in the front holder 18 .
The heat sink screw 24 is fitted into the screw hole via the through hole 50 . The heat sink 23 is thereby fixed to the front holder 18 . Also, the heat sink 23 is installed on the front holder 18 so as to press the camera module 21 against the front holder 18 .
A front portion of the camera module 21 is pressed and fixed to the front holder 18 via the cushion 19 .

The two end contact surfaces 47 of the heat sink 23 are connected to the inner surface 32 of the front holder 18 .
That is, the heat sink 23 is thermally connected to each of the camera module 21 and the front holder 18 . Therefore, the heat sink 23 can conduct heat generated from the camera module 21 to the front holder 18 .

A motor 16 is arranged to rotate the imaging device 100 . The motor 16 corresponds to one embodiment of the rotation drive unit according to the present technology.
As shown in FIG. 9 , the motor 16 has a rotor 51 and a stator 52 .
As shown in FIG. 9A , the rotor 51 has a substantially cylindrical shape centered on the shaft portion 53 , and magnets are embedded in the side portion facing the stator 52 .
The shaft portion 53 is positioned on the rotating shaft 5 .

As shown in FIG. 9B, the stator 52 has a substantially cylindrical shape with the rotating shaft 5 as the center. A coil 54 is wound around the stator 52 and functions as a motor coil.
The stator 52 is configured to cover the side portion of the rotor 51. By inserting the shaft portion 53 of the rotor 51 into the stator 52, the entire motor 16 is assembled as shown in FIG. .

As described above, the motor 16 is screwed to the bottom portion 31 of the front holder 18 with the motor screws 25 .
Specifically, a screw hole is provided in the stator 52 , and the stator 52 is screwed through the through hole 38 of the bottom portion 31 .
Further, as shown in FIG. 7, the tip of the shaft portion 53 of the rotor 51 is inserted into the opening portion 39 provided at the center of the bottom portion 31 .
In this manner, the motor 16 is fixed in the recess formed by the outer surface 37 of the bottom portion 31 of the front holder 18, the inner surface 32 of the semi-cylindrical portion 30 of the front holder 18, and the inner surface 42 of the semi-cylindrical portion 40 of the rear holder 29. be.

A motor 16 rotates the front holder 18 .
In this embodiment, a power source (not shown) is connected to the motor 16, and the motor 16 is driven by power supplied from the power source. Of course, the method of driving the motor 16 is not limited, and any method may be adopted.
When the motor 16 is driven, the entire imaging device 100 (excluding the rotor 51) rotates relative to the rotor 51. FIG. That is, for example, the stator 52 and the front holder 18 to which the stator 52 is fixed rotate. Also, for example, the IMU board 26 rotates together with the front holder 18 and the rear holder 29 . In this way, each member constituting the imaging device 100 rotates together.

Furthermore, in this embodiment, the shaft portion 53 of the rotor 51 is fixed to the outside of the imaging device 100 . Specifically, for example, the shaft portion 53 is fixed to a moving body on which the imaging device 100 is mounted.
In this case, the imaging device 100 (excluding the rotor 51) rotates relative to the moving body.
Thus, rotation of the imaging device 100 is realized.

The motor flexible board 17 is a board for driving the motor 16 .
The motor flexible substrate 17 can be bent. As shown in FIG. 7 , one end of the motor flexible substrate 17 is connected to the stator 52 of the motor 16 . The other end is connected to the surface of the IMU board 26 on the negative direction side in the Y direction (the surface not facing the camera module 21).
In this embodiment, the operation of the motor 16 is controlled by the rotation control section 13 of the controller 11 . Power supply, control signal output, and the like are performed via the motor flexible substrate 17 .

As shown in FIG. 8 and the like, an IMU sensor 60 is arranged on the IMU board 26 .
The IMU board 26 is a board having a substantially rectangular plate shape.
The IMU board 26 represents one embodiment of a board according to the present technology.
As shown in FIG. 3, each of the upper right corner and the lower right corner of the IMU board 26 is provided with a protrusion 55 protruding in the negative direction in the X direction. The protrusion 55 is provided to be inserted into the front holder 18 .

A through hole 56 is formed near the upper left corner. The IMU board 26 is screwed to the front holder 18 through the through holes 56 .
Specifically, as shown in FIG. 3, the front holder 18 is provided with a protrusion 57 at a position extending to the through hole 56 in the Y direction. Further, the convex portion 57 is provided with a screw hole.

As shown in FIG. 8 , the board screw 27 passes through the through hole 56 and is fitted into the screw hole formed in the projection 57 . The IMU board 26 is thereby screwed.
In this embodiment, a screw having a head and a screw portion is used as the board screw 27 . Of course, the specific material and shape of the board screw 27 are not limited.

A through hole 58 is formed in the bottom portion 31 of the front holder 18 at a position corresponding to the convex portion 55 of the IMU board 26 . That is, two through holes 58 are formed in the bottom portion 31 .
A projection 55 is inserted into each through hole 58 . Furthermore, the IMU board 26 is adhered to the front holder 18 by providing an adhesive 59 at the insertion position.

Thus, in this embodiment, the IMU board 26 is connected to the front holder 18 by screwing at one location and bonding at two locations.

As shown in FIG. 8, an IMU sensor 60 is arranged on the surface of the IMU board 26 on the negative direction side in the Y direction (the surface opposite to the camera module 21).
The IMU sensor 60 corresponds to one embodiment of an inertial sensor according to the present technology.
Also, the camera flexible board 22 and the motor flexible board 17 (not shown) are connected.
In addition, the specific configuration of the IMU board 26 is not limited. For example, when the controller 11 is provided on the IMU board 26 , hardware such as CPU, ROM, RAM, and HDD may be arranged on the IMU board 26 .

A weight 28 is provided to adjust the center of gravity of the imaging device 100 .
The weight 28 is made of a material having a relatively high density, such as metal such as brass. Of course, the specific material and shape of the weight 28 are not limited.
As shown in FIG. 7, in this embodiment, the weight 28 is arranged along the boundary between the semi-cylindrical portion 40 and the bottom portion 41 of the rear holder 29 .
Weight 28 corresponds to one embodiment of a balancer according to the present technology.

[Arrangement configuration of IMU board and camera module]
A specific arrangement configuration of the IMU board 26 and the camera module 21 will be described.
In this embodiment, the IMU board 26 is installed on the front holder 18 so as to be separated from the camera module 21 .

In FIG. 7, the camera module 21 is installed above the imaging device 100 . Also, the IMU board 26 is installed below the rotating shaft 5 near the rotating shaft 5 .
Thus, the IMU board 26 and the camera module 21 are arranged so as to be separated from each other, and a space is formed between the IMU board 26 and the camera module 21 .
Furthermore, in this embodiment, the IMU board 26 and the camera module 21 are arranged to face each other with the rotating shaft 5 interposed therebetween.
Specifically, the front holder 18 and the rear holder 29 have an internal space 61 in which the rotating shaft 5 is arranged. The IMU board 26 divides the internal space 61 into a first divided space including the center of gravity of the camera module 21 and a first divided space including the center of gravity of the camera module 21 by a plane that is perpendicular to the perpendicular from the center of gravity of the camera module 21 to the rotation axis 5 and includes the rotation axis 5 . When it is divided into a second divided space that does not include the center of gravity, it is installed in the front holder 18 so that the center of gravity is included in the second divided space.

Here, the internal space 61 is a space surrounded by the front holder 18 and the rear holder 29 .
As shown in FIG. 10, an internal space 61 is formed as a substantially cylindrical space surrounded by the front holder 18 and the rear holder 29 . The rotary shaft 5 is arranged inside the internal space 61 .

The center of gravity 62 of the camera module 21 is the mass center of gravity of the camera module 21 (that is, the center of gravity considering the density). In FIG. 10, the center of gravity 62 of the camera module 21 is indicated by a black square.
A perpendicular line 63 from the center of gravity 62 of the camera module 21 to the rotation axis 5 passes through the center of gravity 62 of the camera module 21 and forms a straight line parallel to the Y-axis.
In FIG. 10, the vertical line 63 is indicated by a solid line.

A plane orthogonal to the perpendicular 63 and containing the rotation axis 5 is a plane orthogonal to the Y-axis and containing the rotation axis 5 (parallel to the Z-axis). Therefore, the plane includes the rotation axis 5 and is parallel to the XZ plane. This plane is hereinafter referred to as a dividing plane 64 .
In FIG. 10, the dividing plane 64 is schematically illustrated as a vertically long rectangle.

Furthermore, the dividing plane 64 divides the internal space 61 into two spaces.
That is, as shown in FIG. 10, the internal space 61 is divided into a space on the right side of the dividing plane 64 and a space on the left side.
The right space contains the center of gravity of the camera module 21 . That is, the right space corresponds to the first divided space 65 including the center of gravity of the camera module 21 .
Also, the center of gravity of the camera module 21 is not included in the left space. That is, the left space corresponds to the second divided space 66 that does not include the center of gravity of the camera module 21 .

When the internal space 61 is divided in this way, the IMU board 26 is installed in the front holder 18 so that the center of gravity is included in the second divided space 66 .
The center of gravity of IMU board 26 is also the center of mass of IMU board 26 . In FIG. 10, the center of gravity 67 of the IMU board 26 is indicated by a black square.
As shown in FIG. 10, the center of gravity 67 of the IMU board 26 is included in the second partitioned space 66 .

In this way, when the internal space 61 of the front holder 18 and the rear holder 29 includes the rotation axis 5 and is divided into two spaces by a plane parallel to the XZ plane, the center of gravity of the IMU board 26 and the center of gravity of the camera module 21 are located in different spaces (opposite sides).

For example, in each of the camera module 21 and the IMU board 26, when the center of gravity of mass and the center of gravity of position are different, the center of gravity of mass is contained in mutually different spaces, but the positional center of gravity is contained in the same space. may be adopted.

Furthermore, in this embodiment, the camera module 21 is installed so as to be included in the first divided space 65 . Also, the IMU board 26 is installed so as to be included in the second divided space 66 .
That is, not only the center of gravity 62 of the camera module 21 but the entire camera module 21 is installed so as to be included in the first divided space 65 . Also, not only the center of gravity 67 of the IMU board 26 but the entire IMU board 26 is installed so as to be included in the second divided space 66 .
As shown in FIG. 10 , in this embodiment, the entire camera module 21 is included in the first divided space 65 and the entire IMU board 26 is also included in the second divided space 66 .

Of course, for example, an arrangement configuration may be adopted in which only the center of gravity of the camera module 21 is included in the first divided space 65 and the entire camera module 21 is not included in the first divided space 65 .
For example, if only the end of the camera module 21 is included in the second divided space 66 and most of the rest is included in the first divided space 65, the center of gravity 62 is located in the first divided space 65. Therefore, such an arrangement configuration is possible.
The same applies to the IMU board 26 as well.

Furthermore, in this embodiment, the IMU board 26 is arranged in a direction perpendicular to the imaging direction 7 of the camera module 21 .
That is, the board surface of the IMU board 26 is arranged in a direction orthogonal to the imaging direction 7 .
As shown in FIG. 10, the imaging direction 7 is parallel to the Y-axis. Also, the surface of the IMU board 26 is arranged parallel to the XZ plane. That is, the imaging direction 7 and the plane of the IMU board 26 are orthogonal.
Of course, the orientation of the IMU board 26 is not limited. For example, the surface of the IMU board 26 may be arranged obliquely (not parallel) to the XZ plane.

By arranging the IMU board 26 and the camera module 21 apart from each other in this way, it is possible to suppress the transfer of heat from the camera module 21 to the IMU board 26 . That is, it becomes possible to improve the measurement accuracy of the IMU sensor 60 .

Furthermore, in this embodiment, the IMU board 26 and the camera module 21 are arranged in mutually different spaces (the first divided space 65 and the second divided space 66).
As a result, the center of gravity of the imaging apparatus 100 as a whole is positioned near the rotation axis 5 .

The IMU board 26 and camera module 21 are members having a certain amount of mass. When these are arranged in the same space (for example, when the camera module 21 is arranged on the IMU board 26, etc.), the mass will be biased with respect to the one space.
That is, the center of gravity of the imaging apparatus 100 as a whole is positioned away from the rotation axis 5 (on one side of the space).
When the center of gravity of the imaging device 100 as a whole is away from the rotation axis 5, the torque required to rotate the imaging device 100 increases. That is, the power required by the motor 16 increases. Therefore, a load is applied to the motor 16, and the amount of heat generated from the motor 16 increases.

In this embodiment, the center of gravity of the imaging apparatus 100 as a whole is positioned near the rotation axis 5, so the torque required for rotation is small, and heat generation by the motor 16 can be suppressed. This makes it possible to suppress heat transfer to the IMU board 26 and the like.
Furthermore, since the required output of the motor 16 is reduced, it is possible to reduce the size of the entire imaging apparatus 100 including the motor 16 . Moreover, it is possible to suppress power consumption during rotation.
Further, since the center of gravity is adjusted using the arrangement of the IMU board 26 and the camera module 21, no other mechanism for adjusting the center of gravity is required, and the weight of the imaging device 100 is reduced.

These effects appear when the center of gravity of each of the IMU board 26 and the camera module 21 are positioned in mutually different spaces. In this case, even higher effects can be obtained.

Furthermore, in this embodiment, the IMU board 26 is arranged in a direction perpendicular to the imaging direction 7 of the camera module 21 . As a result, for example, the wiring between the IMU board 26 and the camera module 21 becomes the shortest, and connection with a simple configuration is possible. That is, the imaging device 100 is miniaturized.
Further, for example, even when the IMU board 26 is arranged parallel to the imaging direction 7 of the camera module 21, it is possible to adjust the center of gravity of the imaging device 100 to be positioned near the rotation axis 5. , such an arrangement in an orthogonal direction enables the center of gravity to be adjusted more precisely.

[Arrangement configuration of heat sink, etc.]
A detailed arrangement configuration of the heat sink 23 and the like will be described.
A heat sink 23 is thermally connected to the camera module 21 .
As shown in FIG. 5 , in this embodiment, the rear surface of the camera module 21 is arranged in contact with the central contact surface 48 of the heat sink 23 .
As described above, the heat sink 23 is made of a thermally conductive material such as aluminum. When the camera module 21 generates heat, the generated heat is conducted from the rear surface of the camera module 21 to the heat sink 23 .

Further, the end side contact surface 47 of the heat sink 23 is thermally connected to the front holder 18 .
As shown in FIG. 5, the end side contact surfaces 47 of the heat sink 23 are arranged in contact with the upper and lower portions of the front holder 18 .
When the heat sink 23 is heated (high temperature), the heat is conducted from the heat sink 23 to the front holder 18 .

Therefore, when the camera module 21 generates heat, the heat is first conducted from the rear surface of the camera module 21 to the heat sink 23 . Furthermore, heat is conducted from the heat sink 23 to the front holder 18 . That is, heat generated from the camera module 21 is conducted to the front holder 18 .

Thereby, the heat generated from the camera module 21 can be efficiently released.
When the imaging device 100 is rotating, or when the moving body on which the imaging device 100 is mounted is moving, a large wind speed is generated on the surface of the housing (the outer surface of the front holder 18). Therefore, the heat conducted to the front holder 18 is efficiently released to the outside of the imaging device 100 . Therefore, efficient heat dissipation can be realized.
Of course, the method of thermally connecting the camera module 21 and the front holder 18 to the heat sink 23 is not limited, and any method may be adopted.

Further, as shown in FIG. 5, in this embodiment, at least one of the thermal connection between the camera module 21 and the heat sink 23 and the thermal connection between the front holder 18 and the heat sink 23 is made through a heat dissipation material. This is achieved by connecting
In this embodiment, both of the two thermal connections are realized through connections via heat-dissipating materials.

Specifically, as shown in FIG. 5, an adhesive heat radiating agent 68 is applied to the connecting portion between the camera module 21 and the heat sink 23 . That is, the adhesive heat radiating agent 68 is applied between the rear surface of the camera module 21 and the central contact surface 48 of the heat sink 23 .
The adhesive heat sink 68 has thermal conductivity. Therefore, heat generated from the camera module 21 can be efficiently conducted to the heat sink 23 .

In FIG. 5, the adhesive heat-dissipating agent 68 is indicated by dotted circles, but it may be applied to the entire connecting portion. Of course, it may be applied only partially.
Moreover, the heat dissipation material arranged in the connecting portion is not limited. For example, a heat-dissipating material having no adhesion function, such as heat-dissipating grease or a heat-dissipating sheet, may be arranged.
The adhesive heat dissipation agent 68 corresponds to one embodiment of the heat dissipation material according to the present technology.

In addition, as shown in FIG. 5, the adhesive heat-radiating agent 68 is also applied to the connecting portion between the front holder 18 and the heat sink 23 . That is, the adhesive heat-radiating agent 68 is applied between the inner surface 32 of the front holder 18 and the end-side contact surface 47 of the heat sink 23 .
Thereby, heat can be efficiently conducted from the heat sink 23 to the front holder 18 .

Of course, the adhesive heat-radiating agent 68 may be applied only to one connecting portion. That is, for example, a configuration may be employed in which the adhesive heat-radiating agent 68 is applied to the connecting portion between the camera module 21 and the heat sink 23 and not applied to the connecting portion between the front holder 18 and the heat sink 23 . Also, different heat dissipating materials may be arranged at each connecting portion.

By applying the adhesive heat dissipation agent 68 in this way, more efficient heat dissipation can be achieved.
For example, when the camera module 21 can capture an image with high resolution, the amount of heat generated increases. In such a case, by applying the adhesive heat-dissipating agent 68, efficient heat dissipation is realized, and it becomes possible to suppress thermal runaway of the camera module 21 or the like.

Also, the camera module 21 is installed on the front holder 18 via a cushion material.
As shown in FIG. 5, the cushion 19 is installed between the camera module 21 and the front holder 18 in this embodiment.

Thereby, the camera module 21 is stably held. For example, by designing the cushion 19 so as to fill the gap between the camera module 21 and the front holder 18, the position of the camera module 21 is less likely to shift even when the imaging device 100 rotates.
In addition, it is possible to suppress displacement of the camera module 21 due to vibration such as movement of a moving object.

Also, the heat sink 23 is installed on the front holder 18 so as to press the camera module 21 against the front holder 18 .
In this embodiment, the camera module 21 is sandwiched between the heat sink 23 and the cushion 19 and pressed from both sides.
For example, by fixing the heat sink 23 at a position close to the front holder 18, the space for installing the camera module 21 is reduced, and the pressure acting on the camera module 21 is increased. Further, the pressure acting on the camera module 21 is adjusted by appropriately adjusting the material of the cushion 19 and changing the flexibility of the cushion 19 . In this way, the camera module 21 is pressed with the desired pressure.
Of course, the method of pressing the camera module 21 is not limited, and any method may be adopted.

As a result, the camera module 21 is pressed against the heat sink 23, and heat is efficiently conducted.
In addition, since the cushion 19 is sandwiched between the front surfaces of the camera module 21, a uniform pressure can be applied regardless of the contact position between the camera module 21 and the heat sink 23. FIG. That is, it is less likely that only a specific part of the back surface is pressed with a strong pressure, or part of the back surface is not in contact with the heat sink 23 . Therefore, efficient heat dissipation is possible.

[Arrangement of motors]
In this embodiment, the motor 16 is arranged away from the heat sink 23 .
Also, the motor 16 is arranged so as to be spaced apart from the adhesive heat radiating agent 68 .
FIG. 7 shows the heat sink 23 installed on the rear surface of the camera module 21. As shown in FIG. As shown in FIG. 7, the heat sink 23 is arranged parallel to the XZ plane.
A gap is provided between the heat sink 23 and the motor 16 on the right side (that is, on the negative side in the X direction). For example, the camera flexible substrate 22 and the bottom portion 31 of the front holder 18 are positioned in the gap.

Thus, the heat sink 23 is spaced apart from the motor 16 .
In addition, as shown in FIG. 7, the adhesive heat-radiating agent 68 applied to the rear surface of the camera module 21 is also spaced apart from the motor 16 .
Although not shown in FIG. 7, of course, the adhesive heat radiating agent 68 applied to the contact portion between the heat sink 23 and the front holder 18 is also arranged apart from the motor 16 .

For example, when the motor 16 and the heat sink 23 are arranged in contact with each other, the heat of the motor 16 is transferred to the heat sink 23 , and the heat transferred to the heat sink 23 is transferred to the camera module 21 . In other words, the heat of the motor 16 is transferred to the camera module 21 . This is the same even when the motor 16 and the adhesive heat radiating agent 68 are arranged in contact with each other.
By arranging the motor 16 away from the heat sink 23 and the adhesive heat radiating agent 68 as in the present embodiment, it is possible to suppress the conduction of heat from the motor 16 to the camera module 21 .
Of course, the method of arranging the motors 16 apart (specific arrangement configuration, etc.) is not limited.

[Arrangement of weights]
The weight 28 is installed at a predetermined position of the front holder 18 so that the center of gravity of the imaging device 100 is positioned on the rotation axis 5 .
In this embodiment, as shown in FIG. 7, the weight 28 is arranged along the boundary between the semi-cylindrical portion 40 and the bottom portion 41 of the rear holder 29 . That is, the vicinity of the boundary corresponds to the predetermined position.

By arranging the weight 28 , the center of gravity of the imaging apparatus 100 as a whole is adjusted to be positioned on the rotation axis 5 .
Specifically, the position where the weight 28 is arranged and the shape of the weight 28 are adjusted. Alternatively, the density and mass of the weight 28 may be adjusted by appropriately changing the material forming the weight 28 . The position, shape, material, density, mass, etc. of the weight 28 are not limited and can be changed arbitrarily.
For example, in FIG. 7, when the center of gravity is shifted upward with respect to the rotating shaft 5, adjustment is performed so that the mass of the weight 28 is increased. As a result, the center of gravity moves downward, and the position of the center of gravity can be aligned with the rotating shaft 5 .

As a result, the rotational load of the motor 16 is reduced, and heat generation by the motor 16 can be suppressed. That is, it is possible to suppress heat transfer to the IMU board 26 and the like.
In addition, since the center of gravity is adjusted by the weight 26 having a small volume, the size of the imaging device 100 can be reduced.

[Substrate holding structure]
The outline of the holding structure for holding the substrate will be described below.
FIG. 15 is a schematic diagram showing an outline of a holding structure 200 according to the present technology.

As shown in FIGS. 15A and 15B , the holding structure 200 is a structure for installing the substrate 81 on which the inertial sensor 10 is arranged on the object 80 .
The holding structure 200 is configured at two or more locations on the substrate 81 and comprises two or more connection structures 82 for connecting the substrate 81 to the object 80 .
15A and B show two connection structures 82 formed at two locations on the substrate 81, three or more connection structures 82 may be formed at three or more locations on the substrate 81. FIG.
15 to 20, illustration of the inertial sensor 10 arranged on the substrate 81 is omitted.

In the example shown in FIG. 15A , each of the two or more connecting structure portions 82 is configured by an adhesive structure 83 .
The adhesive structure 83 is a structure in which an adhesive material is provided between the object 80 and the substrate 81 that are spaced apart from each other.
In the example shown in FIG. 15B , one of the two or more connection structures 82 is configured by the pressing structure 84 . Others are composed of the adhesive structure 83 .
The pressing structure 84 is a structure that presses and fixes the substrate 81 to the object 80 .

It is not limited to the examples shown in FIGS. 15A and 15B, and any number of connection structures 82 greater than or equal to two, such as three or four, may be configured. Also, all of the connecting structure portions 82 may be the bonding structure 83 , or one may be the pressing structure 84 and all of the others may be the bonding structure 83 .
The bonding structure 83 and the pressing structure 84 can be configured in the following combinations, for example.
(1) When there are two connecting structure portions 82 There are two bonding structures 83 One bonding structure 83 and one pressing structure 84 (2) When there are three connecting structure portions 82 There are three bonding structures 83 Two bonding structures 83 and one pressing structure 84 (3) When there are four connection structures 82 Four bonding structures 83 Three bonding structures 83 and one pressing structure 84 That is, two or more connection structures 82 are configured, of which at most one is a pressing structure 84 and all others are bonding structures 83 .

As described above, the substrate 81 is connected to the object 80 by the bonding structure 83 or the pressing structure 84 .
That is, installation of the substrate 81 with respect to the object 80 is realized.

[Holding structure in imaging device]
In the imaging device 100 according to the present embodiment, the holding structure 200 shown in FIG. 15 is adopted with the front holder 18 (rotating section 1) as the object 80. As shown in FIG. That is, the holding structure 200 is configured to mount the IMU board 26 on the front holder 18 (rotating portion 1) so as to rotate integrally with the front holder 18 (rotating portion 1).

As shown in FIG. 8, in this embodiment, the IMU board 26 is screwed to the projection 57 of the front holder 18 .
This realizes a pressing structure 84 that presses and fixes the IMU board 26 to the front holder 18 .
In this embodiment, as the pressing structure 84, a structure is adopted in which the IMU board 26 is fixed to the front holder 18 via the board screw 27 (fastening member).

Further, in this embodiment, the projections 55 of the IMU board 26 are inserted into the two through holes 58 formed in the bottom portion 31 of the front holder 18 and adhered with the adhesive 59 .
As a result, a bonding structure 83 is realized in which the bonding material is provided between the front holder 18 and the IMU substrate 26 that are spaced apart from each other.
In this embodiment, as the bonding structure 83, an adhesive material is provided with the position of the through-hole 58 as a reference in a state in which the convex portion 55 (insertion portion) of the IMU substrate 26 is inserted into the through-hole 58 of the front holder 18. structure is adopted.

That is, in this embodiment, the holding structure 200 comprises three connection structures 82 arranged at three locations on the IMU board 26 .
Among the three connection structure portions 82 , one connection structure portion 82 is configured by the pressing structure 84 . The other two connecting structures 82 are constituted by adhesive structures 83 .

Also, the portion to which the IMU board 26 is connected, such as the convex portion 57 and the bottom portion 31, is sometimes called a holder.

In the imaging device 100, the IMU board 26 is connected to the front holder 18 by being screwed at one location and adhered at two locations.
Accordingly, three connection structure portions 82 are configured.
Of course, the order of screwing and bonding the IMU board 26 is not limited. For example, the adhesive may be applied after screwing. Alternatively, a method may be adopted in which the screwed portions are temporarily fixed, and the temporarily fixed portions are screwed after the adhesion is performed. In addition, screwing and bonding may be performed by any method.

A bonding portion between the through hole 58 configured in the bottom portion 31 and the convex portion 55 of the IMU substrate 26 corresponds to an embodiment of the bonding structure according to the present technology. In other words, two adhesive structures 83 are configured in the imaging device 100 .
In this embodiment, the protrusion 55 is inserted into the through hole 58 so as to be spaced apart. That is, the projection 55 is positioned in the space (inside the hole) formed by the through hole 58, but is inserted so as not to contact the surface of the bottom 31 forming the through hole 58. As shown in FIG.
An adhesive 59 is provided in the gap formed between the protrusion 55 and the through hole 58 and in the vicinity thereof. That is, the protrusion 55 and the through hole 58 are bonded together by the adhesive 59 so as to bridge the spaced apart protrusion 55 and the through hole 58 .
The adhesive 59 corresponds to one embodiment of the adhesive material according to the present technology.
Of course, the bonding structure 83 is not limited to such.

A portion where the convex portion 57 of the front holder 18 and the IMU board 26 are screwed corresponds to an embodiment of the pressing structure according to the present technology. That is, one pressing structure 84 is configured in the imaging device 100 .
In this embodiment, the pressing structure 84 is a structure for fixing the IMU board 26 to the front holder 18 via the board screws 27 .
Specifically, a through hole 56 is formed in the IMU board 26 , and the screw portion of the board screw 27 passes through the through hole 56 . Furthermore, the screw hole formed in the convex portion 57 extends, and the screw hole and the screw portion are fitted. The IMU board 26 is thereby screwed.
The board screw 27 corresponds to one embodiment of the fastening member and the screw according to the present technology.

The screwed IMU board 26 is sandwiched between the head of the board screw 27 and the projection 57 of the front holder 18 .
That is, the head of the board screw 27 presses and fixes the IMU board 26 to the front holder 18 .
Of course, the pressing structure 84 is not limited to such a structure. That is, a pressing and fixing method other than the method using screws may be employed.

By connecting the substrate 81 by two or more connection structures 82, one of which is a pressing structure 84 and all of which are adhesive structures 83, the measurement accuracy of the IMU sensor 60 arranged on the IMU substrate 26 can be improved. can be improved.

Specifically, first, the bonding structure 83 enables the IMU board 26 to be fixed without applying stress to the IMU board 26 .
The IMU substrate 26 and the front holder 18 are spaced apart from each other at the bonding location by the bonding structure 83, and the adhesive 59 is provided therebetween.
Therefore, no stress acts on the IMU board 26 from the front holder 18 . Instead, the adhesive 59 generates stress due to curing shrinkage during curing, but compared to the stress acting from the front holder 18 when connected by screws, it is extremely small and negligible. is the size of

Also, the pressing structure 84 enables the IMU board 26 to be stably fixed. For example, in the imaging device 100, the IMU board 26 is sandwiched between the head of the board screw 27 and the projection 57 of the front holder 18, and the threaded portion of the board screw 27 is fitted into the screw hole. As a result, even if the IMU board 26 continues to vibrate, the holding of the IMU board 26 will not be weakened. That is, the IMU board 26 is stably fixed.

When the IMU board 26 is fixed only by screwing at one place, the IMU board 26 is stably fixed. However, when vibration occurs due to the movement of the imaging device 100 or the moving body, the IMU sensor 60 is greatly affected by the vibration.
For example, the IMU board 26 vibrates, and the IMU sensor 60 mounted on the IMU board 26 also vibrates. As a result, the measurement accuracy of the IMU sensor 60 is degraded.

In this embodiment, the IMU board 26 is fixed by one pressing structure 84 and one or more bonding structures 83 . That is, the IMU board 26 is fixed at a plurality of locations. This makes it possible to suppress the influence of vibration on the IMU board 26 .
In addition, since the fixing method includes the pressing structure 84, the IMU board 26 is stably fixed.

When the IMU board 26 is fixed only by screwing at two or more locations, the IMU board 26 is stably fixed. However, a force that deforms the IMU board 26 acts on the board.
Specifically, height variations occur due to design errors and the like at locations where the substrate is fixed by screws. When the IMU board 26 is screwed to each of a plurality of fixing points having different heights, the IMU board 26 is pulled and fixed to the fixing points having a smaller height, and the IMU board 26 is deformed. Power works.

As a result, the IMU board 26 is deformed, and the position and angle of the IMU sensor 60 on the board are shifted. That is, the measurement accuracy of the IMU sensor 60 is lowered.
In this embodiment, since the fixing method includes only one pressing structure 84, a force that deforms the IMU substrate 26 due to height variations does not act.

As described above, with the configuration in which one is the pressing structure 84 and all others are the bonding structures 83, it is possible to stably fix the IMU board 26 while suppressing the force that deforms the IMU board 26. becomes.
Also, it is possible to suppress the influence of vibration on the IMU board 26 .
This makes it possible to improve the measurement accuracy of the IMU sensor 60 .

Also, the measurement accuracy of the IMU sensor 60 can be improved by a fixing method in which all of the connection structures 82 are adhesive structures 83 .
Specifically, each adhesive structure 83 fixes the IMU board 26 while suppressing the stress acting on the IMU board 26, so that the force that deforms the board does not act.
In addition, since the IMU board 26 is fixed at two or more points, the influence of vibration is suppressed.
This makes it possible to improve the measurement accuracy of the IMU sensor 60 .

[Variation of adhesion structure]
16 to 18 are schematic diagrams showing variations of the bonding structure 83. FIG.
16 to 18, as an example of the pressing structure 84, connection points by screwing are illustrated.

The adhesive structure 83 includes a structure in which the adhesive 59 is provided with reference to the position of the hole in a state where the insertion portion of the substrate 81 is inserted into the hole of the object 80 .
In the example shown in FIG. 16, a portion of the substrate 81 is inserted into the through hole 58 of the object 80. In the example shown in FIG. That is, the through-hole 58 corresponds to an embodiment of the hole included in the object according to the present technology. Of course, the shape of the hole that the object 80 has is not limited. For example, instead of a through hole, a concave portion may be provided as the hole, and a portion of the substrate 81 may be inserted.

Also, the portion of the substrate 81 that is inserted into the through hole 58 corresponds to an embodiment of the insertion portion of the substrate according to the present technology. In FIG. 16, the insertion portion 86 is indicated by a dotted pattern.
In the imaging device 100, the convex portion 55 formed on the IMU board 26 corresponds to an embodiment of the insertion portion of the board according to the present technology.

The adhesive 59 is provided with reference to the positions of the holes.
In the example shown in FIG. 16, the adhesive 59 is provided so as to cover at least part of the opening of the through hole 58 .
Specifically, an adhesive 59 is provided between the object 80 and the substrate 81 so as to partially cover the opening on the right side of the through hole 58 .
Typically, the adhesive 59 is provided so as to cover at least a portion of the opening on the side where the projection 55 is inserted.
Of course, it is not limited to this, and the adhesive 59 may be provided so as to cover all of the two openings.

In the example shown in FIG. 17, an adhesive 59 is filled inside the through hole 58 .
In FIG. 17 , the adhesive 59 is filled in the entire space inside the through-hole 58 except for the area occupied by the insertion portion 86 . That is, the upper and lower portions of the insertion portion 86 are filled with the adhesive 59 so as to completely fill the space.
Of course, a part of the space inside the through hole 58 may be filled with the adhesive 59 .

The method of providing an adhesive 59 that covers at least part of the opening of the through hole 58 shown in FIG. 16 and the method of filling the inside of the through hole 58 shown in FIG. good.
That is, a configuration may be employed in which the adhesive 59 filled inside the through hole 58 overflows the outside of the through hole 58 to cover the opening.
Of course, the shape of the hole that the substrate 81 has is not limited. For example, recesses may be provided as holes.

As shown in FIG. 18, as the bonding structure, a structure in which an adhesive material is provided based on the position of the hole in a state where the insertion portion of the object 80 is inserted into the hole of the substrate 81 may be adopted.
An object 80 is shown on the left side of FIG. The object 80 has an insertion portion 88 at its tip portion facing upward. In FIG. 18, the insertion portion 88 is indicated by a dotted pattern.
The insertion section 88 corresponds to an embodiment of the insertion section of the object according to the present technology.
For example, a boss configured on the object 80 functions as the insertion portion 88 . Of course, the specific shape and the like of the insertion portion 88 are not limited.

The adhesive 59 is provided with reference to the positions of the holes.
In the example shown in FIG. 18, the insertion portion 88 is inserted into the through hole 87 so as to protrude upward. An adhesive 59 is provided to cover the upper opening of the through hole 87 .
The adhesive 59 is provided in contact with the surface of the upper portion of the insertion portion 88 and the upper portion of the substrate 81 near the through hole 87 . Thereby, the substrate 81 and the object 80 are adhered.

As described above, various variations of the bonding structure 83 as shown in FIGS. 16 to 18 can be adopted according to the configuration of the object 80, the substrate 81, and the like.
For example, in the imaging device 100, if it is advantageous in terms of design to provide a through hole in the IMU substrate 26, effective adhesion can be realized by adopting an adhesion structure 83 as shown in FIG.

In particular, in the example of FIG. 18, the through holes 87 may function as positioning holes for the substrate 81 . In this case, it is possible to accurately position the substrate 81 with respect to the object 80 .
In addition, the specific structure of the bonding structure 83 is not limited, and any structure may be adopted. For example, the bonding may be over a wide area such that the entire side of the substrate 81 is bonded.
Moreover, when the bonding structure 83 is configured at a plurality of locations, the bonding structure 83 may have different structures.

[Variation of pressing structure]
In the imaging device 100, the IMU board 26 is fixed by screwing, but the pressing structure 84 is not limited to such a structure.
Variations of the pressing structure 84 will be described below.

19 and 20 are schematic diagrams showing an example of the pressing structure 84. FIG.
19 and 20 show different examples of the pressing structure 84. FIG.
19 and 20, the object 80 and the substrate 81 are bonded by the bonding structure 83 in a portion not shown.

In the example shown in FIG. 19 , the pressing structure 84 is a structure that sandwiches and fixes the substrate 81 between the object 80 .
As shown in FIG. 19, the object 80 has a first fixing portion 89 protruding rightward. It also has a second fixing portion 90 protruding leftward.
The substrate 81 is sandwiched between the first fixing portion 89 and the second fixing portion 90 . That is, the substrate 81 is sandwiched so that the first fixing portion 89 is brought into contact with the left side surface of the substrate 81 and the second fixing portion 90 is brought into contact with the right side surface of the substrate 81, pressed and fixed.

When such a pressing structure 84 is realized in the imaging device 100, for example, each of the front holder 18 and the rear holder 29 is provided with a convex portion, and the IMU board 26 is sandwiched and fixed by each convex portion. be. In this case, the front holder 18 and the rear holder 29 correspond to the object 80 . Further, for example, the convex portion of the front holder 18 corresponds to the first fixing portion 89 , and the convex portion of the rear holder 29 corresponds to the second fixing portion 90 .
Of course, when the first fixing portion 89 and the second fixing portion 90 are configured, each specific shape is not limited. Also, the method of pinching and fixing by the object 80 is not limited, and any method may be adopted.

At least one of the first fixing portion 89 and the second fixing portion 90 may fix the substrate 81 via an elastic body.
In the example shown in FIG. 20 , a plate-like elastic body 91 is sandwiched between the first fixing portion 89 and the substrate 81 . Therefore, the left side surface of the substrate 81 is in contact with the right side surface of the elastic body 91, and the right side surface is in contact with the second fixing portion 90, so that the substrate 81 is sandwiched. pressed and fixed.

In this example, the substrate 81 is fixed via the elastic member 91 only by the first fixing portion 89 , but of course the elastic member 91 is sandwiched only between the second fixing portion 90 and the substrate 81 . may be Also, the elastic body 91 may be sandwiched between both the first fixing portion 89 and the substrate 81 and between the second fixing portion 90 and the substrate 81 .

As the elastic body 91, any elastic member such as rubber or a spring may be used.
Moreover, the method for fixing the substrate 81 via the elastic body 91 is not limited. For example, the substrate 81 may be fixed by a method other than the method in which the elastic body 91 is sandwiched between the substrate 81 and the fixing portion.

The substrate 81 can be stably fixed by the pressing structure 84 that sandwiches and fixes the substrate 81 between the objects 80 .
Specifically, since the substrate 81 is strongly pressed by the force applied from the first fixing portion 89 and the second fixing portion 90, the substrate 81 is not fixed to the fixed portion when force acts on the substrate 81 from the outside. It becomes less likely to slip off or come off from the fixing point.

In addition, when the substrate 81 is fixed via the elastic body 91, by appropriately adjusting the elasticity of the elastic body 91, it is possible to press and fix with a desired force. For example, by using the elastic body 91 having great elasticity, it is possible to stably fix the substrate 81 with a strong force.

[Arrangement Configuration of Connection Structure]
In this embodiment, the position of each of the two or more connection structures 82 is set with reference to the position of the inertial sensor 10 on the substrate 81 .
Variations in the arrangement configuration of the connection structure portion 82 will be described below.

21 and 22 are schematic diagrams showing an example of the arrangement configuration of the connection structure portion 82. FIG.
In the example shown in FIG. 21 , connection structure portions 82 are formed at three locations of the substrate 81 , the upper left corner, the lower left corner, and the upper right corner.
Moreover, the inertial sensor 10 is arranged so as to be surrounded by the connecting structure portions 82 at three locations.

In the imaging device 100 as well, the inertial sensor 10 is arranged so as to be surrounded by the three connection structures 82 . Specifically, bonding structures 83 are formed at two locations, the upper left corner and the lower left corner of the IMU substrate 26 in FIG. Also, a pressing structure 84 is configured in the upper right corner. The IMU sensor 60 is arranged near the center of the IMU board 26 so as to be surrounded by three connection structures 82 .

In the example shown in FIG. 22, connection structure portions 82 are formed at four locations of the substrate 81, namely, the upper left corner, the lower left corner, the upper right corner, and the vicinity of the center of the lower side.
In this example as well, the inertial sensor 10 is arranged so as to be surrounded by the connection structures 82 at four locations.

In this way, the inertial sensor 10 is arranged so as to be surrounded by, for example, two or more connection structures 82 . That is, the position of the inertial sensor 10 is set with reference to the positions of the two or more connection structures 82 .
In other words, the position of each of the two or more connection structures 82 is set so as to surround the inertial sensor 10 on the basis of the position of the inertial sensor 10 .

A method of setting the positions of the two or more connection structures 82 with reference to the position of the inertial sensor 10 is not limited.
For example, the connection structure portion 82 may be configured at a portion other than the corner portion of the substrate 81 .
Further, for example, when there are two connection structure portions 82 , the connection structure portions 82 may be arranged such that the inertial sensor 10 is positioned between the connection structure portions 82 .
In addition, the position may be set by any method.
Also, the combination of the bonding structure 83 and the pressing structure 84 of each connection structure 82 is not limited.

For example, by minimizing the number of pressing structures 84, the residual stress acting on the substrate 81 can be reduced.
Also, by arranging the inertial sensor 10 away from the position of the pressing structure 84, residual stress can be reduced.
In addition, by arranging two or more bonding structures 83 and arranging the inertial sensor 10 inside the triangle connecting the two bonding structures 83 and one pressing structure 84, the measurement accuracy of the inertial sensor 10 can be improved. It becomes possible.
In addition, one bonding structure 83 and two pressing structures 84 are arranged to form an isosceles triangle with the bonding structure 83 as the apex, and the inertial sensor 10 is placed on a perpendicular line extending from the apex to the base, By arranging it in the vicinity of the bonding structure 83, it is possible to evenly and minimize the stress that the substrate 81 is subjected to.
In this way, by appropriately setting the positions of the connection structure 82 and the inertial sensor 10, it is possible to suppress the effects of stress and vibration on the substrate 81, and it is possible to improve the measurement accuracy of the inertial sensor 10. becomes.

Furthermore, in this example, the inertial sensor 10 is arranged at the center of gravity of each position of the two or more connecting structures 82 .
In FIG. 21 , the inertial sensor 10 is arranged at the triangular positional center of gravity formed by the three connection structures 82 .
In addition, in FIG. 22, the inertial sensor 10 is arranged at the center of gravity of the quadrangle formed by the four connection structures 82 .
In addition, for example, when there are two connecting structure portions 82, the positional center of gravity is the middle point of the two connecting structure portions 82. FIG. Therefore, the inertial sensor 10 is arranged at the midpoint.

By setting the position of the connection structure 82 in this manner, the inertial sensor 10 is stably arranged on the substrate 81 .
For example, as shown in FIG. 21, when the connection structure 82 is configured at three locations, the upper left corner, the lower left corner, and the upper right corner, the lower right corner is attached to the object 80. It will not be fixed. Therefore, when the substrate 81 vibrates, the lower right corner is greatly affected by the vibration.
For example, if the inertial sensor 10 is placed in the lower right corner, the inertial sensor 10 will vibrate and the sensing accuracy will decrease.

On the other hand, the area surrounded by the connection structure 82 on the substrate 81 is less susceptible to vibration. In the present embodiment, since the inertial sensor 10 is arranged in a location surrounded by the connection structure 82, the influence of vibration on the inertial sensor 10 can be suppressed.
This makes it possible to improve the measurement accuracy of the inertial sensor 10 .

Further, among the locations surrounded by the connection structure portions 82, the positional center of gravity of each connection structure portion 82 is a location that is particularly resistant to vibration.
In this embodiment, since the inertial sensor 10 is arranged at the positional center of gravity, it is possible to greatly suppress the influence of vibration on the inertial sensor 10 .
This makes it possible to improve the measurement accuracy of the inertial sensor 10 .

Note that when the substrate 81 is small, the substrate 81 is less susceptible to vibration. In such a case, even if the inertial sensor 10 is not surrounded by the connection structure 82, the influence of the vibration on the inertial sensor 10 does not appear so large.
Therefore, it is also possible to employ an arrangement configuration in which the connection structures 82 are configured at two locations, for example, the upper left corner and the upper right corner of the substrate 81 , and the inertial sensor 10 is arranged at the center of the substrate 81 .

As described above, in the imaging device 100 according to the present embodiment, the camera module 21 is installed in the rotating section 1 configured to be rotatable. Also, an IMU board 26 is installed on the rotating part 1 so as to be separated from the camera module 21 , and an IMU sensor 60 is arranged on the IMU board 26 . This makes it possible to improve the measurement accuracy of the IMU sensor 60 .

The IMU sensor 60 is a device that is extremely sensitive to temperature changes. For example, when heat is transferred to the IMU board 26 and the IMU sensor 60, the IMU board 26 and the IMU sensor 60 are thermally deformed, and the sensing of the IMU sensor 60 is significantly affected. Specifically, erroneous values are detected as acceleration and angular velocity.

The camera module 21 generates heat as it performs operations such as imaging. The generated heat is transmitted to members arranged around the camera module 21 . When the IMU board 26 and the IMU sensor 60 are arranged around the camera module 21, heat is transmitted, and the sensing accuracy of the IMU sensor 60 is lowered.

In this embodiment, since the IMU board 26 and the camera module 21 are arranged apart from each other, it is possible to suppress the transfer of heat from the camera module 21 to the IMU board 26 . That is, it becomes possible to improve the measurement accuracy of the IMU sensor 60 .

Also, in the holding structure 200 according to the present embodiment, two or more connection structure portions 82 for connecting the substrate 81 to the object 80 are formed at two or more locations on the substrate 81 . Each of the two or more connection structures 82 is composed of a bonding structure 83 in which an adhesive 59 is provided between the object 80 and the substrate 81 which are spaced apart from each other. Alternatively, one of the two or more connection structures 82 is configured by a pressing structure 84 that presses and fixes the substrate 81 to the object 80 , and the other is configured by an adhesive structure 83 . This makes it possible to improve the measurement accuracy of the inertial sensor 10 .

With a configuration in which one is the pressing structure 84 and all the others are the bonding structures 83 , it is possible to stably fix the substrate 81 while suppressing the force that deforms the substrate 81 . Moreover, it is possible to suppress the influence of vibration on the substrate 81 .
This makes it possible to improve the measurement accuracy of the inertial sensor 10 .

Moreover, the substrate 81 is fixed while suppressing the stress acting on the substrate 81 due to the configuration in which the entire connection structure portion 82 is the bonding structure 83 . Moreover, since the substrate 81 is fixed at two or more locations, the influence of vibration is suppressed.
This makes it possible to improve the measurement accuracy of the inertial sensor 10 .

Each configuration such as the imaging device and the holding structure described with reference to each drawing is merely one embodiment, and can be arbitrarily modified without departing from the scope of the present technology. That is, any other configuration or the like for implementing the present technology may be adopted.

In the present disclosure, when the word “abbreviated” is used, it is used only for the purpose of facilitating the understanding of the description, and the use/non-use of the word “abbreviated” does not have a special meaning. .
That is, in the present disclosure, “central,” “central,” “uniform,” “equal,” “identical,” “perpendicular,” “parallel,” “symmetric,” “extended,” “axial,” “cylindrical,” “cylindrical,” and “ring-shaped.” Concepts that define shape, size, positional relationship, state, etc. such as "annular shape", "rectangular shape", "disk shape" are "substantially centered", "substantially central", "substantially uniform", " substantially equal, substantially the same, substantially orthogonal, substantially parallel, substantially symmetrical, substantially elongated, substantially axial, substantially cylindrical The concept includes "substantially cylindrical shape", "substantially ring shape", "substantially toric shape", "substantially rectangular shape", "substantially disk shape", and the like.
For example, "perfectly centered", "perfectly centered", "perfectly uniform", "perfectly equal", "perfectly identical", "perfectly orthogonal", "perfectly parallel", "perfectly symmetrical", "perfectly extended", "perfectly Axial direction", "perfectly cylindrical", "perfectly cylindrical", "perfectly ring", "perfectly toric", "perfectly rectangular", "perfectly disk", etc. ±10% range) is also included.
Therefore, even when the word "abbreviation" is not added, the concept expressed by adding the so-called "abbreviation" can be included. Conversely, a complete state is not excluded for states expressed with the addition of "abbreviated".

In the present disclosure, expressions using "more than" such as "greater than A" and "less than A" encompass both the concept including the case of being equivalent to A and the concept not including the case of being equivalent to A. is an expression contained in For example, "greater than A" is not limited to not including equal to A, but also includes "greater than or equal to A." Also, "less than A" is not limited to "less than A", but also includes "less than A".
When implementing the present technology, specific settings and the like may be appropriately adopted from concepts included in “greater than A” and “less than A” so that the effects described above are exhibited.

It is also possible to combine at least two characteristic portions among the characteristic portions according to the present technology described above. That is, various characteristic portions described in each embodiment may be combined arbitrarily without distinguishing between each embodiment. Moreover, the various effects described above are only examples and are not limited, and other effects may be exhibited.

Note that the present technology can also adopt the following configuration.
(1)
a rotating part configured to be rotatable about a predetermined rotating shaft;
an imaging unit that is installed on the rotating unit and rotates integrally with the rotating unit;
a substrate that is installed in the rotating section so as to be spaced apart from the imaging section and that rotates integrally with the rotating section;
and an inertial sensor arranged on the substrate.
(2) The imaging device according to (1),
The imaging device, wherein the imaging section is installed on the rotating section so that the imaging direction faces the outside of the rotating section, and the imaging direction changes according to the rotation of the rotating section.
(3) The imaging device according to (1) or (2),
The rotating part has an internal space in which the rotating shaft is arranged,
The substrate divides the internal space into a first divided space including the center of gravity of the imaging unit and the center of gravity of the imaging unit by a plane perpendicular to a perpendicular line from the center of gravity of the imaging unit to the rotation axis and including the rotation axis. The imaging device is installed in the rotating section so that the center of gravity is included in the second divided space when divided into a second divided space that does not include the second divided space.
(4) The imaging device according to (3),
The imaging unit is installed so as to be included in the first divided space,
The imaging device, wherein the substrate is installed so as to be included in the second divided space.
(5) The imaging device according to any one of (1) to (4),
The imaging device, wherein the substrate is arranged in a direction orthogonal to the imaging direction of the imaging unit.
(6) The imaging device according to any one of (1) to (5),
The rotating part has an outer peripheral part,
The imaging device further includes a thermally conductive section that is made of a material having thermal conductivity, is thermally connected to each of the imaging section and the outer peripheral section, and conducts heat generated from the imaging section to the outer peripheral section. An imaging device comprising:
(7) The imaging device according to (6),
At least one of thermal connection between the imaging section and the thermally conductive section and thermal connection between the outer peripheral section and the thermally conductive section is realized by connection via a heat dissipation material.
(8) The imaging device according to (6) or (7),
The imaging device, wherein the heat conducting section is installed on the rotating section so as to press the imaging section against the rotating section.
(9) The imaging device according to any one of (1) to (8),
The imaging device, wherein the imaging unit is installed on the rotating unit via a cushion material.
(10) The imaging device according to any one of (1) to (9), further comprising:
An imaging device comprising a rotation driving section that rotates the rotating section.
(11) The imaging device according to (6) or (7), further comprising:
comprising a rotation drive unit that rotates the rotating unit;
The imaging device, wherein the rotation driving section is arranged to be spaced apart from the heat conducting section.
(12) The imaging device according to (7), further comprising:
comprising a rotation drive unit that rotates the rotating unit;
The imaging device, wherein the rotation drive unit is arranged to be spaced apart from the heat dissipation material.
(13) The imaging device according to any one of (1) to (12), further comprising:
An image pickup apparatus comprising a balancer installed at a predetermined position of the rotating section such that the center of gravity of the image pickup apparatus is positioned on the rotation axis.
(14) The imaging device according to any one of (1) to (13),
The imaging device, wherein the inertial sensor includes at least one of an acceleration sensor and an angular velocity sensor.
(15) The imaging device according to any one of (1) to (14), further comprising:
An imaging apparatus comprising a rotation control section that controls rotation of the rotating section based on a detection result of the inertial sensor.

DESCRIPTION OF SYMBOLS 1... Rotation part 5... Rotation shaft 7... Imaging direction 10... Inertia sensor 12... Rotation drive part 13... Rotation control part 16... Motor 18... Front holder 19... Cushion 21... Camera module 23... Heat sink 26... IMU board 27... Board screw 28 weight 29 rear holder 59 adhesive 60 IMU sensor 61 internal space 62 center of gravity 63 vertical line 64 divided plane 65 first divided space 66 second divided space 67 center of gravity 68 adhesion Heat dissipation agent 80 Object 81 Substrate 82 Connection structure 83 Bonding structure 84 Pressing structure 86 Insertion part 87 Through hole 88 Insertion part 89 First fixed part 90 Second fixed part 91 Elastic body 100... Imaging device 200... Holding structure

Claims

a rotating part configured to be rotatable about a predetermined rotating shaft;
an imaging unit that is installed on the rotating unit and rotates integrally with the rotating unit;
a substrate that is installed in the rotating section so as to be spaced apart from the imaging section and that rotates integrally with the rotating section;
and an inertial sensor arranged on the substrate.
The imaging device according to claim 1,
The imaging device, wherein the imaging section is installed on the rotating section so that the imaging direction faces the outside of the rotating section, and the imaging direction changes according to the rotation of the rotating section.
The imaging device according to claim 1,
The rotating part has an internal space in which the rotating shaft is arranged,
The substrate divides the internal space into a first divided space including the center of gravity of the imaging unit and the center of gravity of the imaging unit by a plane perpendicular to a perpendicular line from the center of gravity of the imaging unit to the rotation axis and including the rotation axis. The imaging device is installed in the rotating section so that the center of gravity is included in the second divided space when divided into a second divided space that does not include the second divided space.
The imaging device according to claim 3,
The imaging unit is installed so as to be included in the first divided space,
The imaging device, wherein the substrate is installed so as to be included in the second divided space.
The imaging device according to claim 1,
The imaging device, wherein the substrate is arranged in a direction orthogonal to the imaging direction of the imaging unit.
The imaging device according to claim 1,
The rotating part has an outer peripheral part,
The imaging device further includes a thermally conductive section that is made of a material having thermal conductivity, is thermally connected to each of the imaging section and the outer peripheral section, and conducts heat generated from the imaging section to the outer peripheral section. An imaging device comprising:
The imaging device according to claim 6,
At least one of thermal connection between the imaging section and the thermally conductive section and thermal connection between the outer peripheral section and the thermally conductive section is realized by connection via a heat dissipation material.
The imaging device according to claim 6,
The imaging device, wherein the heat conducting section is installed on the rotating section so as to press the imaging section against the rotating section.
The imaging device according to claim 1,
The imaging device, wherein the imaging unit is installed on the rotating unit via a cushion material.
The imaging device according to claim 1, further comprising:
An imaging device comprising a rotation driving section that rotates the rotating section.
The imaging device according to claim 6, further comprising:
comprising a rotation drive unit that rotates the rotating unit;
The imaging device, wherein the rotation driving section is arranged to be spaced apart from the heat conducting section.
The imaging device according to claim 7, further comprising:
comprising a rotation drive unit that rotates the rotating unit;
The imaging device, wherein the rotation drive unit is arranged to be spaced apart from the heat dissipation material.
The imaging device according to claim 1, further comprising:
An image pickup apparatus comprising a balancer installed at a predetermined position of the rotating section such that the center of gravity of the image pickup apparatus is positioned on the rotation axis.
The imaging device according to claim 1,
The imaging device, wherein the inertial sensor includes at least one of an acceleration sensor and an angular velocity sensor.
The imaging device according to claim 1, further comprising:
An imaging apparatus comprising a rotation control section that controls rotation of the rotating section based on a detection result of the inertial sensor.