WO2022239345A1 - Imaging element, imaging device, and method for manufacturing imaging element - Google Patents

Abstract

The imaging element in one aspect according to the present disclosure comprises: a light-receiving chip (201) that is one example of a light-receiving substrate having a photoelectric conversion element (311) and an N-type transistor (312), which is one example of a first element electrically connected to the photoelectric conversion element (311); a detection chip (202) that is one example of a detection substrate having a plurality of elements that are electrically connected to the light-receiving chip (201) and that are included in an event detection unit for outputting an event signal in accordance with a change in the current outputted from the photoelectric conversion element (311); and a supply unit (313) that imparts, to a node of the photoelectric conversion element (311) or to a node of the N-type transistor (312), an electrical potential for deactivating an operation of the photoelectric conversion element (311) or the N-type transistor (312).

Description

IMAGE SENSOR, IMAGING DEVICE, AND IMAGE SENSOR CONTROL METHOD

The present disclosure relates to an image pickup device, an image pickup device, and an image pickup device control method.

In recent years, an asynchronous image pickup device (solid-state image pickup device) has been proposed that detects for each pixel that the amount of light in a pixel exceeds a threshold as an event. This imaging device is a sensor that has a function of detecting a change in the light amount of a photodiode (PD) and outputting it as an event signal, and is called an EVS (Event-based Vision Sensor), for example. As this EVS, a stacked EVS has been developed, and the stacked EVS is configured by bonding an upper chip and a lower chip.

Specifically, the stacked EVS includes a plurality of PDs and associated transistors on an upper chip (for example, a light receiving substrate), and a signal amplification element, a reset element, and an event detection section on a lower chip (for example, a detection substrate). etc. Ideally, an event signal is output only when there is a luminance change of an arbitrary level or more. There are a plurality of defective pixels in which is intermittently output. Conversely, there are non-responsive pixels (defective pixels) that do not output any event signal even when contrast light is input.

JP 2019-176334 A

In the above-mentioned stacked EVS, the upper chip and lower chip cannot be separated during characteristic evaluation and testing. For this reason, when analyzing the characteristic problem, it is not possible to determine whether the cause of an abnormality (for example, the cause of a defect) that cannot solve the characteristic problem is due to the upper chip or the lower chip, and it is difficult to specify the location of the cause of the abnormality.

Therefore, the present disclosure proposes an image pickup device, an image pickup device, and a control method for the image pickup device that can facilitate identification of the location of the cause of an abnormality.

An imaging device according to an embodiment of the present disclosure includes: a light receiving substrate having a photoelectric conversion device and a first device electrically connected to the photoelectric conversion device; a detection substrate having a plurality of elements included in an event detection unit that outputs an event signal according to a change in the current output from the photoelectric conversion element or the first element; and a supply for providing a node of the conversion element or a node of the first element.

An imaging device according to an embodiment of the present disclosure includes an imaging lens and an imaging element, and the imaging element includes a photoelectric conversion element and a light receiving substrate having a first element electrically connected to the photoelectric conversion element. a detection substrate electrically connected to the light-receiving substrate and having a plurality of elements included in an event detection unit that outputs an event signal according to a change in current output from the photoelectric conversion element; and the photoelectric conversion element. or a supply unit for applying a potential that disables the operation of the first element to the node of the photoelectric conversion element or the node of the first element.

A method for controlling an imaging element according to an embodiment of the present disclosure includes a light receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element; and a detection substrate having a plurality of elements included in an event detection unit that outputs an event signal according to a change in current output from a photoelectric conversion element, the method comprising: the photoelectric conversion element or the applying a potential to the node of the photoelectric conversion element or the node of the first element to disable the operation of the first element.

1 is a diagram illustrating an example of a schematic configuration of an imaging device according to an embodiment of the present disclosure; FIG. 1 is a diagram showing an example of a layered structure of an imaging device according to an embodiment of the present disclosure; FIG. 1 is a diagram illustrating an example of a schematic configuration of an imaging device according to an embodiment of the present disclosure; FIG. 1 is a diagram illustrating an example of a schematic configuration of a pixel according to an embodiment of the present disclosure; FIG. 1 is a first diagram showing an example of a schematic configuration of a pixel circuit according to an embodiment of the present disclosure; FIG. 2 is a second diagram illustrating an example of a schematic configuration of a pixel circuit according to an embodiment of the present disclosure; FIG. 7 is a diagram showing part of the schematic configuration of the pixel circuit shown in FIG. 6; FIG. FIG. 4 is a first diagram for explaining an application example of a switch to a pixel array section according to an embodiment of the present disclosure; FIG. 7 is a second diagram for explaining an application example of the switch to the pixel array section according to the embodiment of the present disclosure; FIG. 10 is a diagram showing part of a schematic configuration of a pixel circuit according to Modification 1; FIG. 10 is a diagram showing a part of a schematic configuration of a pixel circuit according to Modification 2; FIG. 11 is a diagram showing a part of a schematic configuration of a pixel circuit according to Modification 3; FIG. 11 is a diagram showing a part of a schematic configuration of a pixel circuit according to Modification 4; FIG. 11 is a diagram showing a part of a schematic configuration of a pixel circuit according to modification 5; FIG. 12 is a diagram showing a part of a schematic configuration of a pixel circuit according to Modification 6; FIG. 21 is a diagram showing a part of a schematic configuration of a pixel circuit according to Modification 7; FIG. 20 is a diagram showing part of a schematic configuration of a pixel circuit according to Modification 8; FIG. 21 is a diagram showing part of a schematic configuration of a pixel circuit according to Modification 9; FIG. 20 is a diagram showing part of a schematic configuration of a pixel circuit according to Modification 10; FIG. 21 is a diagram showing a part of a schematic configuration of a pixel circuit according to modification 11; FIG. 21 is a diagram showing a part of a schematic configuration of a pixel circuit according to modification 12; 1 is a block diagram showing an example of a schematic configuration of a vehicle control system; FIG. FIG. 4 is an explanatory diagram showing an example of installation positions of an outside information detection unit and an imaging unit;

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. In the present specification and drawings, constituent elements having substantially the same functional configuration are given basically the same reference numerals, thereby omitting redundant description. Elements, devices, methods, systems, etc. according to the present disclosure are not limited by the embodiments of the present disclosure.

Also, one or more embodiments (including examples and modifications) described below can be implemented independently. On the other hand, at least some of the embodiments described below may be implemented in combination with at least some of the other embodiments as appropriate. These multiple embodiments may include novel features that differ from each other. Therefore, these multiple embodiments can contribute to solving different purposes or problems, and can produce different effects.

The present disclosure will be described according to the order of items shown below.
1. Embodiment 1-1. Configuration example of imaging device 1-2. Configuration example of imaging device 1-3. Configuration example of pixel 1-4. Configuration example of pixel circuit 1-5. Operation example of supply unit 1-6. Application example of switch for each pixel in pixel array section 1-7. Modification of pixel circuit 1-8. Action and effect 2. Other Embodiments 3. Application example 4 . Supplementary note

<1. embodiment>
<1-1. Configuration Example of Imaging Device>
A configuration example of an imaging device 100 according to the present embodiment will be described with reference to FIG. FIG. 1 is a diagram showing an example of a schematic configuration of an imaging device 100 according to this embodiment.

As shown in FIG. 1, the imaging device 100 includes an imaging lens 110, an imaging element (solid-state imaging element) 200, a recording section 120, and a control section . Examples of the imaging device 100 include a camera mounted on a wearable device, an industrial robot, and the like, and an in-vehicle camera mounted on a car and the like.

The imaging lens 110 collects incident light and guides it to the imaging device 200 . For example, the imaging lens 110 captures incident light from a subject and forms an image on the imaging surface (light receiving surface) of the imaging device 200 .

The imaging element 200 photoelectrically converts incident light, detects the presence or absence of an event (address event), and generates the detection result. For example, the imaging device 200 detects, as an event, that the absolute value of the amount of change in luminance exceeds a threshold for each of a plurality of pixels. This imaging device 200 is also called an EVS (Event-based Vision Sensor).

Here, for example, events include on-events and off-events, and detection results include 1-bit on-event detection results and 1-bit off-event detection results. An on-event means, for example, that the amount of change in the amount of incident light (the amount of increase in luminance) exceeds a predetermined upper threshold. On the other hand, an off event means, for example, that the amount of change in the amount of incident light (the amount of decrease in luminance) has fallen below a predetermined lower threshold (a value less than the upper threshold).

For example, the imaging device 200 processes the detection result of the event (address event) and outputs data indicating the processing result to the recording unit 120 via the signal line 209 . For example, the imaging device 200 generates a detection signal (event signal) indicating the detection result of an event for each pixel. Each detection signal includes an on-event detection signal indicating presence/absence of an on-event and an off-event detection signal indicating presence/absence of an off-event. Note that the imaging device 200 may detect only one of the on-event detection signal and the off-event detection signal.

Also, for example, the image sensor 200 executes predetermined signal processing such as image recognition processing on image data composed of detection signals, and outputs the processed data to the recording unit 120 via the signal line 209 . Note that the imaging element 200 may output at least data based on the event detection result. For example, if the image data is unnecessary in subsequent processing, a configuration may be adopted in which the image data is not output.

The recording unit 120 records data input from the imaging device 200 . As the recording unit 120, for example, storage such as flash memory, DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory) is used.

The control unit 130 controls each unit of the imaging device 100 by outputting various instructions to the imaging device 200 via the signal line 139 . For example, the control unit 130 controls the imaging device 200 and causes the imaging device 200 to detect the presence or absence of an event (address event). As the control unit 130, for example, a computer such as a CPU (Central Processing Unit) or MCU (Micro Control Unit) is used.

<1-2. Example of Schematic Configuration of Imaging Device>
An example of the schematic configuration of the imaging element 200 according to this embodiment will be described with reference to FIGS. 2 and 3. FIG. FIG. 2 is a diagram showing an example of the layered structure of the imaging element 200 according to this embodiment. FIG. 3 is a diagram showing an example of a schematic configuration of the imaging device 200 according to this embodiment.

As shown in FIG. 2 , the imaging device 200 includes a light receiving chip (light receiving substrate) 201 and a detection chip (detection substrate) 202 . The light receiving chip 201 is stacked on the detection chip 202 . The light receiving chip 201 corresponds to the first chip, and the detection chip 202 corresponds to the second chip. For example, the light-receiving chip 201 is provided with a light-receiving element (for example, a photoelectric conversion element such as a photodiode), and the detection chip 202 is provided with a circuit. The light-receiving chip 201 and the detection chip 202 are electrically connected through connecting portions such as vias, Cu--Cu junctions, and bumps.

As shown in FIG. 3, the imaging device 200 includes a pixel array section 12, a driving section 13, an arbiter section (arbitration section) 14, a column processing section 15, and a signal processing section 16. The drive section 13 , arbiter section 14 , column processing section 15 and signal processing section 16 are provided as a peripheral circuit section of the pixel array section 12 .

The pixel array section 12 has a plurality of pixels 11 . These pixels 11 are two-dimensionally arranged in an array, for example, in a matrix. A pixel address indicating the position of each pixel 11 is defined by a row address and a column address based on the matrix arrangement of the pixels 11 . Each pixel 11 generates, as a pixel signal, an analog signal having a voltage corresponding to a photocurrent as an electrical signal generated by photoelectric conversion. Further, each pixel 11 detects the presence or absence of an event depending on whether or not a change exceeding a predetermined threshold occurs in the photocurrent corresponding to the luminance of incident light. In other words, each pixel 11 detects as an event that the luminance change exceeds a predetermined threshold.

When each pixel 11 detects an event, it outputs a request to the arbiter unit 14 requesting output of event data representing the occurrence of the event. Then, each of the pixels 11 outputs the event data to the drive unit 13 and the signal processing unit 16 when receiving a response indicating permission to output the event data from the arbiter unit 14 . Also, the pixels 11 that have detected the event output analog pixel signals generated by photoelectric conversion to the column processing unit 15 .

The driving section 13 drives each pixel 11 of the pixel array section 12 . For example, the drive unit 13 detects an event, drives the pixel 11 that outputs the event data, and outputs an analog pixel signal of the pixel 11 to the column processing unit 15 .

The arbiter unit 14 arbitrates requests requesting output of event data supplied from each of the plurality of pixels 11, and responds based on the arbitration result (permission/non-permission of event data output) and event detection. A reset signal for resetting is transmitted to the pixel 11 .

The column processing unit 15 performs a process of converting analog pixel signals output from the pixels 11 in each column of the pixel array unit 12 into digital signals. For example, the column processing unit 15 can also perform CDS (Correlated Double Sampling) processing on digitized pixel signals. The column processing section 15 has, for example, an analog-to-digital converter made up of a set of analog-to-digital converters provided for each pixel column of the pixel array section 12 . As an analog-digital converter, for example, a single-slope analog-digital converter can be exemplified.

The signal processing unit 16 performs predetermined signal processing on the digitized pixel signals supplied from the column processing unit 15 and the event data output from the pixel array unit 12, and converts the signal-processed event data and Outputs pixel signals.

Here, the change in the photocurrent generated by the pixel 11 can be understood as the change in the amount of light (luminance change) incident on the pixel 11 . Therefore, it can be said that the occurrence of an event is a change in light amount (luminance change) of the pixel 11 exceeding a predetermined threshold. Note that the event data representing the occurrence of an event includes, for example, positional information such as coordinates representing the position of the pixel 11 where the change in the amount of light has occurred as an event. The event data can include the polarity of the change in the amount of light in addition to the positional information.

<1-3. Configuration Example of Pixel>
A configuration example of the pixel 11 according to the present embodiment will be described with reference to FIG. FIG. 4 is a diagram showing an example of a schematic configuration of the pixel 11 according to this embodiment.

As shown in FIG. 4, each pixel 11 has a light receiving section 61, a pixel signal generating section 62, and an event detecting section 63.

The light receiving unit 61 photoelectrically converts incident light to generate a photocurrent. Then, under the control of the drive unit 13 (see FIG. 3), the light receiving unit 61 outputs a voltage corresponding to the photocurrent generated by photoelectrically converting the incident light to either the pixel signal generation unit 62 or the event detection unit 63. provide a signal.

The pixel signal generation unit 62 generates a voltage signal corresponding to the photocurrent supplied from the light receiving unit 61 as an analog pixel signal SIG. Then, the pixel signal generation unit 62 supplies the generated analog pixel signal SIG to the column processing unit 15 (see FIG. 3) via the vertical signal line VSL wired for each pixel column of the pixel array unit 12 .

The event detection unit 63 detects whether an event has occurred, depending on whether the amount of change in photocurrent from each of the light receiving units 61 has exceeded a predetermined threshold. The events include, for example, an ON event indicating that the amount of change in photocurrent has exceeded the upper limit threshold, and an OFF event indicating that the amount of change has fallen below the lower limit threshold. Also, the event data representing the occurrence of an event consists of, for example, 1 bit indicating the detection result of an on-event and 1 bit indicating the detection result of an off-event. Note that the event detection unit 63 may be configured to detect only on-events.

The configuration of the pixel 11 exemplified here is an example, and the configuration is not limited to this example. For example, when there is no need to output the pixel signal SIG, a pixel configuration without the pixel signal generator 62 may be employed. By adopting a pixel configuration that does not output a pixel signal, it is possible to reduce the scale of the imaging device 200 .

When an event occurs, the event detection section 63 outputs a request to the arbiter section 14 (see FIG. 3) requesting output of event data representing the occurrence of the event. When receiving a response to the request from the arbiter unit 14 , the event detection unit 63 outputs event data to the drive unit 13 and the signal processing unit 16 .

Although the pixel signal generation unit 62 and the event detection unit 63 are provided for each pixel 11 (light receiving unit 61), the present invention is not limited to this. For example, a plurality of pixels 11 (eg, four pixels 11) may be grouped into a pixel block, and the pixel signal generator 62 and event detector 63 may be provided for each pixel block. In this case, the pixel signal generator 62 and the event detector 63 are common to the pixels 11 in the pixel block.

<1-4. Configuration Example of Pixel Circuit>
A configuration example of the pixel circuit 301 according to the present embodiment will be described with reference to FIGS. 5 and 6. FIG. 5 and 6 are diagrams each showing an example of a schematic configuration of the pixel circuit 301 according to this embodiment.

As shown in FIG. 5, the pixel circuit 301 has a current-voltage conversion section 310, a buffer 320, a differentiation circuit 330, a comparator 340, and a transfer section 350. These current-voltage conversion section 310 , buffer 320 , differentiating circuit 330 , comparator 340 and transfer section 350 function as an event detection section 63 . Although not shown in the example of FIG. 5, the pixel circuit 301 also includes the light receiving section 61, the pixel signal generating section 62, and the like.

The current-voltage converter 310 logarithmically converts a photocurrent into a pixel voltage Vp. For example, the photocurrent is converted into a pixel voltage Vp proportional to the logarithm of the photocurrent. The current-voltage converter 310 supplies the pixel voltage Vp to the buffer 320 .

The buffer 320 outputs the pixel voltage Vp from the current-voltage converter 310 to the differentiating circuit 330 . This buffer 320 can ensure impedance isolation before and after the buffer. Also, the buffer 320 can ensure noise isolation associated with the switching operation in the latter stage.

The differentiating circuit 330 obtains the amount of change in the pixel voltage Vp by differential calculation. The amount of change in the pixel voltage Vp indicates the amount of change in the amount of light. The differentiating circuit 330 supplies the comparator 340 with a differential signal Vout that indicates the amount of change in the amount of light.

The comparator 340 compares the differentiated signal Vout with a predetermined threshold (upper threshold or lower threshold). The comparison result COMP of this comparator 340 indicates the detection result of the event (address event). The comparator 340 supplies the comparison result COMP to the transfer section 350 .

The transfer unit 350 transfers the detection signal DET, and after transfer, supplies the auto-zero signal XAZ to the differentiating circuit 330 for initialization. The transfer unit 350 supplies the arbiter unit 14 with a request to transfer the detection signal DET when an event is detected. Upon receiving a response to the request, the transfer section 350 supplies the comparison result COMP as the detection signal DET to the signal processing section 16 and supplies the auto-zero signal XAZ to the differentiating circuit 330 .

Specifically, as shown in FIG. 6 , the light receiving section 61 has a photoelectric conversion element 311 . The photoelectric conversion element 311 generates photocurrent by photoelectric conversion of incident light. A photodiode (FD), for example, is used as the photoelectric conversion element 311 .

The current-voltage conversion section 310 includes an N-type transistor 312 , a supply section 313 , a P-type transistor 314 and an N-type transistor 315 . The supply unit 313 has a switch (first switch) 313a. As the N-type transistor 312, the P-type transistor 314, and the N-type transistor 315, for example, MOS (Metal-Oxide-Semiconductor) transistors are used.

Here, the photoelectric conversion element 311, the N-type transistor 312, and the N-type transistor 315 are arranged in the light receiving chip 201, and the other switches 313a, P-type transistor 314, and subsequent circuits (buffer 320, differentiating circuit 330, comparator 340), etc. are placed on the detection chip 202 . The light receiving chip 201 and the detection chip 202 are electrically connected by, for example, Cu--Cu bonding (CCC). The circuits and elements arranged in each of the light receiving chip 201 and the detection chip 202 are not limited to this configuration.

The source of the N-type transistor 312 is connected to the photoelectric conversion element 311, and the drain is connected to the power supply terminal via the switch 313a. The P-type transistor 314 and N-type transistor 315 are connected in series between a power supply terminal and a reference terminal of a predetermined reference potential (ground potential, etc.). The source of the P-type transistor 314 and the drain of the N-type transistor 315 are connected to the gate of the N-type transistor 312 and the input terminal of the buffer 320 . A connection point between the N-type transistor 312 and the photoelectric conversion element 311 is connected to the gate of the N-type transistor 315 . Thus, the N-type transistor 312 and the N-type transistor 315 are connected in a loop. A predetermined bias voltage is applied to the gate of the P-type transistor 314 .

The supply unit 313 switches the path through which the current flows to the photoelectric conversion element 311 using the switch 313 a , and applies a potential Vsw (eg, ground potential) that disables the operations of the photoelectric conversion element 311 and the N-type transistor 312 to the N-type transistor 312 . give to the drain (node). The switch 313 a is an element for switching the path through which the current flows through the photoelectric conversion element 311 . The switch 313a is formed so as to switch between the connection between the drain of the N-type transistor 312 and the power supply terminal and the connection between the drain of the N-type transistor 312 and the Vsw terminal. The operation of the switch 313a is controlled by the controller 130, for example.

The buffer 320 includes a P-type transistor 321 and a P-type transistor 322 . For example, MOS transistors are used as these transistors.

The P-type transistor 321 and the P-type transistor 322 are connected in series between the power supply terminal and the reference potential terminal. The gate of the P-type transistor 322 is connected to the current-voltage converter 310 , and the connection point between the P- type transistors 321 and 322 is connected to the differentiating circuit 330 . A predetermined bias voltage Vbsf is applied to the gate of the P-type transistor 321 .

The differentiating circuit 330 includes a capacitor 331 , a P-type transistor 332 , a P-type transistor 333 , a capacitor 334 and an N-type transistor 335 . A MOS transistor, for example, is used as the transistor in the differentiating circuit 330 .

The P-type transistor 333 and the N-type transistor 335 are connected in series between the power supply terminal and the reference potential terminal. A predetermined bias voltage Vbdiff is input to the gate of the N-type transistor 335 . These transistors function as an inverting circuit having the gate of the P-type transistor 333 as an input terminal 391 and the connection point between the P-type transistor 333 and the N-type transistor 335 as an output terminal 392 .

A capacitor 331 is inserted between the buffer 320 and the input terminal 391 . The capacitor 331 supplies the input terminal 391 with a current corresponding to the time differentiation (in other words, the amount of change) of the pixel voltage Vp from the buffer 320 . Also, the capacitor 334 is inserted between the input terminal 391 and the output terminal 392 .

The P-type transistor 332 opens and closes the path between the input terminal 391 and the output terminal 392 according to the auto-zero signal XAZ from the transfer section 350 . For example, when a low-level auto-zero signal XAZ is input, the P-type transistor 332 transitions to an ON state according to the auto-zero signal XAZ and initializes the differential signal Vout.

The comparator 340 includes a P-type transistor 341 , an N-type transistor 342 , a P-type transistor 343 and an N-type transistor 344 . For example, MOS transistors are used as these transistors.

P-type transistor 341 and N-type transistor 342 are connected in series between the power supply terminal and the reference terminal, and P-type transistor 343 and N-type transistor 344 are also connected in series between the power supply terminal and the reference terminal. . Gates of the P-type transistor 341 and the P-type transistor 343 are connected to the differentiating circuit 330 . An upper voltage Vhigh indicating an upper threshold is applied to the gate of the N-type transistor 342 , and a lower voltage Vlow indicating a lower threshold is applied to the gate of the N-type transistor 344 .

A connection point between the P-type transistor 341 and the N-type transistor 342 is connected to the transfer section 350, and the voltage at this connection point is output as the comparison result COMP+ with the upper limit threshold. A connection point between the P-type transistor 343 and the N-type transistor 344 is also connected to the transfer section 350, and the voltage at this connection point is output as the comparison result COMP- with the lower limit threshold. The upper threshold is determined by the current driving capabilities of the P-type transistor 341 and the N-type transistor 342, respectively, and the lower threshold is determined by the current driving capabilities of the P-type transistor 343 and the N-type transistor 344, respectively. The comparison result COMP is a signal composed of these comparison results COMP+ and COMP-.

Although the comparator 340 compares both the upper limit threshold and the lower limit threshold with the differentiated signal Vout, only one of them may be compared with the differentiated signal Vout. In this case, unnecessary transistors can be eliminated. For example, when comparing only with the upper threshold, only the P-type transistor 341 and the N-type transistor 342 are arranged.

Also, in the pixel circuit 301, a capacitor may be added to the current-voltage converter 310. This capacitance is inserted, for example, between the gate of the N-type transistor 312 and the gate of the N-type transistor 315 . On the other hand, although the capacitor 334 is arranged in the differentiating circuit 330, the capacitor 334 may be reduced. Also, the buffer 320 may be removed from the pixel circuit 301 . In this manner, various elements, circuits, and the like can be added to the pixel circuit 301 and various elements, circuits, and the like can be deleted from the pixel circuit 301 .

<1-5. Operation example of supply unit>
An operation example of the supply unit 313 according to this embodiment will be described with reference to FIG. FIG. 7 is a diagram showing part of the schematic configuration of the pixel circuit 301 shown in FIG. 6 according to this embodiment.

As shown in FIG. 7, in the supply unit 313, the switch 313a is switched to connect the drain of the N-type transistor 312 to the Vsw terminal. Specifically, when the influence of the light receiving chip 201 is separated in the imaging device 200 and the characteristics of the detection chip 202 alone are evaluated, the drain of the N-type transistor 312 is connected to the Vsw terminal by the switch 313a. Thereby, the potential Vsw (eg, ground potential or the like) is applied to the drain of the N-type transistor 312, and the operations of the photoelectric conversion element 311 and the N-type transistor 312 are disabled.

On the other hand, for example, when evaluating characteristics of both the light-receiving chip 201 and the detecting chip 202 or when performing imaging, the switch 313a is switched, and the drain of the N-type transistor 312 is connected to the power supply terminal by the switch 313a (Fig. 6). As a result, the power supply potential VDD is applied to the drain of the N-type transistor 312, and the photoelectric conversion element 311 and the N-type transistor 312 can operate (normal operation).

In this way, by applying the potential Vsw that disables the operation of the light receiving chip 201 and the detecting chip 202 to the drain of the N-type transistor 312, it is possible to separate the influence of the light receiving chip 201 in the image pickup device 200, and the detection Characteristic evaluation of the chip 202 alone can be performed. Therefore, when analyzing the characteristic problem in the characteristic evaluation, it is possible to determine whether the cause of the abnormality (for example, the cause of the defect) that cannot solve the characteristic problem is due to the light receiving chip 201 or the detection chip 202. Location can be easily identified.

Here, for example, the switch 313a is switched according to the control by the control unit 130. As an example, the control unit 130 may switch the switch 313a according to an operator's input operation to an input unit (not shown). In this case, an operator such as an evaluator can switch the switch 313a as necessary. Further, for example, when the control unit 130 automatically performs characteristic evaluation, it is possible to automatically switch the switch 313a at the timing when the control unit 130 performs characteristic evaluation.

In addition, it is expected that false detection will increase due to an increase in the noise level of the photoelectric conversion element 311 in the dark in a normal image pickup device. It is difficult to do so, and erroneous detection caused by the detection chip 202 cannot be denied. Therefore, according to the present embodiment, by switching the path through which the current of the photoelectric conversion element 311 flows by the switch 313a, the circuit on the light receiving chip 201 and the circuit on the detection chip 202 are separated, for example, during characteristic evaluation. In addition, by fixing a specific node of the circuit to an arbitrary potential, it is possible to eliminate the influence of a specific element. This makes it possible to facilitate characteristic evaluation by analysis, test, or the like in the imaging device 200 (for example, stacked EVS) having a plurality of chips.

<1-6. Application Example of Switch for Each Pixel in Pixel Array Section>
An application example of the switch 313a for each pixel of the pixel array section 12 according to this embodiment will be described with reference to FIGS. 8 and 9. FIG. 8 and 9 are diagrams for explaining application examples of the switch 313a for each pixel of the pixel array section 12 according to the present embodiment.

As shown in FIG. 8, the switch 313a is applied to all effective pixels of the pixel array section 12, that is, the pixels 11 used for imaging. This switch 313a is provided for each effective pixel. In the example of FIG. 8, effective pixels are provided over the entire surface of the pixel array section 12 .

As shown in FIG. 9, a switch 313a is applied to some of the test pixels in the pixel array section 12, that is, the pixels 11 that are not used for imaging. This switch 313a is provided for each test pixel. In the example of FIG. 9, the test pixels are provided in one row at the end of the pixel array section 12 (lower end in FIG. 9). The test pixels may be provided, for example, at the ends such as the upper end, the left end, and the right end in FIG. 9, or may be provided in a plurality of columns. may be provided in

Here, the supply unit 313, that is, the switch 313a shown in FIG. 7 may be applied to either the effective pixels or the test pixels. However, depending on the position where the switch 313a is provided with respect to the current-voltage converter 310, it may be preferable to provide it in the test pixel.

Also, the switch 313a is provided for each pixel 11 such as an effective pixel or a test pixel, but is not limited to this. For example, the switch 313a may be provided for each pixel block (specific area) having a plurality of pixels 11, or only one switch 313a may be provided for all pixels 11 (entire area).

<1-7. Modification of Pixel Circuit>
Modifications 1 to 12 of the pixel circuit 301 according to the present embodiment will be described with reference to FIGS. 10 to 21. FIG. 10 to 21 are diagrams showing a part of the schematic configuration of the pixel circuit 301 according to the modified examples (modified examples 1 to 12), respectively.

[Modification 1]
As shown in FIG. 10, switch 313a may be provided in light-receiving chip 201, unlike the configuration shown in FIG. The configuration shown in FIG. 10 may be applied to either effective pixels or test pixels.

[Modification 2]
As shown in FIG. 11, a switch 313b may be provided in addition to the configuration according to Modification 1 (see FIG. 10). The supply unit 313 has a switch (first switch) 313a and a switch (second switch) 313b. The switch 313b is an element for switching a path through which a current flows through the photoelectric conversion element 311, and switches a potential Vsw2 (for example, a ground potential) that disables the operation of the photoelectric conversion element 311 to the cathode (node) of the photoelectric conversion element 311. give to This switch 313b is formed so as to be able to switch between connection and disconnection of the cathode of the photoelectric conversion element 311 and the Vsw2 terminal. The operations of the switches 313a and 313b are controlled by the control unit 130, for example.

In such a configuration, the switches 313a and 313b are switched, the drain of the N-type transistor 312 is connected to the Vsw1 terminal, and the cathode of the photoelectric conversion element 311 is connected to the Vsw2 terminal. As a result, the potential Vsw1 (for example, ground potential) is applied to the drain of the N-type transistor 312, and the potential Vsw2 (for example, ground potential) is applied to the cathode of the photoelectric conversion element 311. The operation of photoelectric conversion element 311 is disabled. At this time, compared to Modification 1 (see FIG. 10), the potential Vsw2 (for example, ground potential) is directly applied to the cathode of the photoelectric conversion element 311, so that the operation of the photoelectric conversion element 311 can be reliably disabled. can.

The configuration shown in FIG. 11 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels. Since the addition of the switch 313b increases the leakage path of the pixel current, if the configuration shown in FIG. 11, that is, the switch 313a and the switch 313b are applied to the effective pixels, there is a concern that the characteristics of the image sensor 200 will deteriorate. In order to suppress this characteristic deterioration, it is preferable to apply the switches 313a and 313b to the test pixels.

[Modification 3]
As shown in FIG. 12, a fixing portion 317 may be provided in addition to the configuration according to Modification 2 (see FIG. 11). The configuration shown in FIG. 12 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels. The reason for this is the same as the reason described above, so the explanation thereof is omitted (the same applies hereinafter).

The fixing unit 317 fixes the output potential from the light receiving chip 201 to the detection chip 202 at a predetermined potential. The fixed part 317 has a switch (third switch) 317a. The switch 317a is an element for fixing the output potential to a predetermined potential, and the potential Vsw3 (for example, a predetermined potential required for characteristic evaluation) is applied to the drain (node) of the P-type transistor 314, that is, the buffer 320 (see FIG. 6). ) to the input terminal (node). This switch 317a is formed so as to be able to switch between connection and disconnection of the drain of the P-type transistor 314 and the Vsw3 terminal. The operation of the switch 317a is controlled by the controller 130, for example.

In such a configuration, the switches 313a and 313b are switched to disable the photoelectric conversion element 311 and the N-type transistor 312 as in the second modification. Furthermore, the switch 317a is turned on, and the source of the P-type transistor 314 is connected to the Vsw3 terminal. As a result, the potential Vsw3 (for example, a predetermined potential required for characteristic evaluation) is applied to the drain of the P-type transistor 314, that is, the input terminal of the buffer 320, and the output potential from the light receiving chip 201 to the detection chip 202 reaches a predetermined potential. Fixed. At this time, the output potential from the light receiving chip 201 to the detecting chip 202 is stabilized by being fixed at a predetermined potential as compared with the modification 2 (see FIG. 11). The characteristics of the detection chip 202 alone can be evaluated with high accuracy.

[Modification 4]
As shown in FIG. 13, the switch 317a may be provided in the light-receiving chip 201, unlike the modification 3 (see FIG. 12). The configuration shown in FIG. 13 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 5]
As shown in FIG. 14, a switching unit 318 may be provided in addition to the configuration according to Modification 2 (see FIG. 11). The configuration shown in FIG. 14 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

The switching unit 318 switches the electrical connection between the light receiving chip 201 and the detecting chip 202 (output connection from the light receiving chip 201 to the detecting chip 202) between a disconnected state and a connected state. The switching unit 318 has a switch (fourth switch) 318a. The switch 318 a is an element for switching the output connection between a disconnected state and a connected state, and is provided between the connection point of the N-type transistor 312 and the N-type transistor 315 and the drain of the P-type transistor 314 . The switch 318 a is formed so as to be capable of switching connection and disconnection between the connection point of the N-type transistor 312 and the N-type transistor 315 and the drain of the P-type transistor 314 . The operation of the switch 318a is controlled by the controller 130, for example.

In such a configuration, the switches 313a and 313b are switched to disable the photoelectric conversion element 311 and the N-type transistor 312 as in the second modification. Furthermore, the switch 318a is turned off (disconnected state), and the connection point between the N-type transistor 312 and the N-type transistor 315 and the drain of the P-type transistor 314 are disconnected. As a result, the electrical connection between the light receiving chip 201 and the detection chip 202 is cut off. At this time, the electrical connection between the light-receiving chip 201 and the detection chip 202 is cut off compared to the modification 2 (see FIG. 11). can be accurately evaluated.

[Modification 6]
As shown in FIG. 15, the switch 318a may be provided in the light-receiving chip 201, unlike the fifth modification (see FIG. 14). The configuration shown in FIG. 15 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 7]
As shown in FIG. 16, the P-type transistor 314 may be provided in the light-receiving chip 201, unlike the sixth modification (see FIG. 15). The configuration shown in FIG. 16 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 8]
As shown in FIG. 17, modification 3 (see FIG. 12) and modification 5 (see FIG. 14) may be combined. Thereby, the effects of Modifications 3 and 5 can be obtained. The configuration shown in FIG. 17 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 9]
As shown in FIG. 18, the switch 318a may be provided in the light-receiving chip 201, unlike the eighth modification (see FIG. 17). The configuration shown in FIG. 18 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 10]
As shown in FIG. 19, the P-type transistor 314 may be provided in the light-receiving chip 201, unlike the ninth modification (see FIG. 18). The configuration shown in FIG. 19 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 11]
As shown in FIG. 20, the switch 317a may be provided in the light receiving chip 201, unlike the ninth modification (see FIG. 18). The configuration shown in FIG. 20 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

[Modification 12]
As shown in FIG. 21, the P-type transistor 314 and the switch 318a may be provided in the light receiving chip 201, unlike the ninth modification (see FIG. 18). The configuration shown in FIG. 21 may be applied to either effective pixels or test pixels, but is preferably applied to test pixels.

<1-8. Action/Effect>
As described above, according to the present embodiment, a light receiving substrate (for example, a light chip 201) and a detection substrate (for example, a detection substrate (for example, A detection chip 202) and a supply unit 313 for applying a potential to disable the operation of the photoelectric conversion element 311 or the first element to the node of the photoelectric conversion element 311 or the node of the first element are provided. Thus, by applying a potential that disables the operation of the photoelectric conversion element 311 or the first element to the node of the photoelectric conversion element 311 or the node of the first element, the influence of the light receiving substrate can be separated in the imaging element 200. is possible, and the characteristics of the detection substrate alone can be evaluated. Therefore, when analyzing a characteristic problem in characteristic evaluation, it is possible to determine whether the cause of an abnormality (for example, the cause of a defect, etc.) that cannot solve the characteristic problem is due to the light receiving substrate or the detection substrate. can facilitate identification.

The supply unit 313 also includes a first switch 313a for switching the path through which the current flows to the photoelectric conversion element 311 and for applying a potential that disables the operation of the first element to the node of the first element. good too. Thus, by applying a potential that disables the operation of the first element to the node of the first element, it is possible to reliably separate the influence of the light receiving substrate in the imaging element 200. Evaluation can be performed with high accuracy. Moreover, the supply unit 313 can be realized with a simple configuration.

Also, the first switch 313a may be provided on the detection substrate. Thereby, the degree of freedom in design can be improved.

Also, the first switch 313a may be provided on the light receiving substrate. Thereby, the degree of freedom in design can be improved.

Further, the supply unit 313 has a second switch 313b for switching the path through which the current flows to the photoelectric conversion element 311 and for applying a potential that disables the operation of the photoelectric conversion element 311 to the node of the photoelectric conversion element 311. good too. As a result, by directly applying a potential that disables the operation of the photoelectric conversion element 311 to the node of the photoelectric conversion element 311, it is possible to reliably separate the influence of the light receiving substrate in the imaging device 200, and the detection substrate alone can be isolated. Characteristic evaluation can be performed with high accuracy. Moreover, the supply unit 313 can be realized with a simple configuration.

Further, a fixing portion 317 may be provided for fixing the output potential from the light receiving substrate to the detection substrate to a predetermined potential. As a result, the output potential from the light-receiving substrate to the detection substrate is fixed at a predetermined potential, so that the influence of the light-receiving substrate can be separated in the imaging device 200, and the characteristics of the detection substrate alone can be evaluated more accurately.

Further, the fixing section 317 may have a third switch 317a for fixing the output potential from the light receiving substrate to the detection substrate to a predetermined potential. Accordingly, the fixing portion 317 can be realized with a simple configuration.

Also, the third switch 317a may be provided on the detection substrate. As a result, it is possible to improve the degree of freedom in designing the light-receiving substrate.

Also, the third switch 317a may be provided on the light receiving substrate. As a result, the degree of freedom in designing the detection substrate can be improved.

Also, a switching unit 318 may be provided for switching the electrical connection between the light receiving substrate and the detection substrate between a disconnected state and a connected state. As a result, the electrical connection between the light-receiving substrate and the detection substrate is disconnected, so that the characteristics of the detection substrate alone can be evaluated more accurately while separating the influence of the light-receiving substrate in the imaging device 200 .

Further, the switching section 318 may have a fourth switch 318a for switching the electrical connection between the light receiving substrate and the detection substrate between the disconnected state and the connected state. Thereby, the switching unit 318 can be realized with a simple configuration.

Also, the fourth switch 318a may be provided on the detection substrate. As a result, it is possible to improve the degree of freedom in designing the light-receiving substrate.

Also, the fourth switch 318a may be provided on the light receiving substrate. As a result, the degree of freedom in designing the detection substrate can be improved.

The event detection unit 63 also includes a current-voltage conversion unit 310 that converts the current output from the photoelectric conversion element 311 into a voltage. type transistor 314, N-type transistor 315, etc.). As a result, the event detector 63 can be realized with a simple configuration.

Also, part of each transistor may be provided on the detection substrate. As a result, it is possible to improve the degree of freedom in designing the light-receiving substrate.

Also, all of the transistors may be provided on the light receiving substrate. As a result, the degree of freedom in designing the detection substrate can be improved.

Further, a pixel array portion 12 having a plurality of pixels 11 arranged in an array (for example, matrix) is provided. Each pixel 11 has a photoelectric conversion element 311, a first element, and a plurality of elements. 11 may be divided into active pixels and test pixels, and the feed section 313 may be provided in the test pixels. As a result, it is possible to prevent the supply unit 313 from adversely affecting the effective pixels, so deterioration of the characteristics of the image sensor 200 can be suppressed.

Further, a pixel array portion 12 having a plurality of pixels 11 arranged in an array (for example, matrix) is provided. Each pixel 11 has a photoelectric conversion element 311, a first element, and a plurality of elements. 11 may be divided into a plurality of pixel blocks each containing a predetermined number (eg, four, etc.) of pixels 11, and the supply unit 313 may be provided for each pixel block. Accordingly, the device configuration can be simplified as compared with the case where the supply unit 313 is provided for each pixel 11 .

<2. Other Embodiments>
The processing according to the above-described embodiments (or modifications) may be implemented in various different forms (modifications) other than the above embodiments. For example, among the processes described in the above embodiments, all or part of the processes described as being automatically performed can be manually performed, or the processes described as being performed manually can be performed manually. All or part of this can also be done automatically by known methods. In addition, information including processing procedures, specific names, various data and parameters shown in the above documents and drawings can be arbitrarily changed unless otherwise specified. For example, the various information shown in each drawing is not limited to the illustrated information.

Also, each component of each device illustrated is functionally conceptual and does not necessarily need to be physically configured as illustrated. In other words, the specific form of distribution and integration of each device is not limited to the one shown in the figure, and all or part of them can be functionally or physically distributed and integrated in arbitrary units according to various loads and usage conditions. Can be integrated and configured.

In addition, the above-described embodiments (or modifications) can be appropriately combined within a range that does not contradict the processing content. Also, the effects described in this specification are only examples and are not limited, and other effects may be provided.

Also, in the embodiment (or modification) described above, a color filter may be provided for each pixel 11 . The imaging device 200 can detect an event in a specific wavelength band based on color filters. As a result, information in various wavelength bands can be detected as events. A color filter is an example of an optical filter that transmits predetermined light. Arbitrary light can be received as incident light by providing this color filter in the pixel 11 . For example, when the pixel 11 receives visible light as incident light, the event data represents the occurrence of a change in pixel value in an image showing a visible subject. Further, for example, when the pixel 11 receives infrared rays, millimeter waves, or the like for distance measurement as incident light, the event data indicates occurrence of a change in the distance to the subject. Further, for example, when the pixel 11 receives infrared rays for temperature measurement as incident light, the event data indicates the occurrence of a change in the temperature of the subject. As the color filter, for example, various color filters such as a 4×4 pixel quad Bayer array (also referred to as a quadra array), an 8×8 pixel array, and a 2×2 pixel Bayer array are used.

Here, for example, when a vehicle is running, the driver's eyes can see the lighting (blinking) of the brake lamps and tail lamps of the vehicle running in front of the own vehicle, the blinking of the direction indicator, the color change of the traffic light, and the electric light. Information in various wavelength bands such as signs, in particular, information in the R (red) wavelength band (brake lamps, tail lamps, red signals of traffic lights, etc.) jumps in. Basically, the driver visually detects and judges the contents of these various types of information. is. Therefore, a color filter, which is an example of a wavelength selection element, may be provided for each pixel 11 in the imaging device 200, and threshold detection may be performed for each pixel 11, thereby enabling event detection for each color. For example, motion detection of an object whose event is detected for each color is performed. As a result, event signals for each color in each wavelength band can be used to detect (detect) the lighting (blinking) of vehicle brake lights and tail lights, the blinking of direction indicators, the color changes of traffic lights, and the detection of electronic signs. can be done.

As for the arrangement of the color filters, for example, an RCCC filter in which R (red) pixels and C (clear) pixels are combined, or an RCCB filter in which B (blue) pixels are combined with R and C pixels. A filter or an RGB Bayer array filter in which R pixels, G (green), and B pixels are combined may be used. The C pixel is a pixel with no color filter or with a transparent filter, and is the same pixel as the W (white) pixel. For example, an RCCC filter that combines R (red) pixels and C (clear) pixels can realize high sensitivity capable of imaging distant obstacles and people even at low illumination equivalent to moonlit nights. In addition, the RCCC filter can improve the detection accuracy of light in the red wavelength band (for example, tail lamps, red lights of traffic lights, etc.), which is important for in-vehicle sensing and the like.

<3. Application example>
The technology according to the present disclosure can be applied to various products. For example, the technology according to the present disclosure can be applied to any type of movement such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility, airplanes, drones, ships, robots, construction machinery, agricultural machinery (tractors), etc. It may also be implemented as a body-mounted device.

FIG. 22 is a block diagram showing a schematic configuration example of a vehicle control system 7000, which is an example of a mobile control system to which the technology according to the present disclosure can be applied. Vehicle control system 7000 comprises a plurality of electronic control units connected via communication network 7010 . In the example shown in FIG. 22, the vehicle control system 7000 includes a drive system control unit 7100, a body system control unit 7200, a battery control unit 7300, an outside information detection unit 7400, an inside information detection unit 7500, and an integrated control unit 7600. . The communication network 7010 that connects these multiple control units conforms to any standard such as CAN (Controller Area Network), LIN (Local Interconnect Network), LAN (Local Area Network), or FlexRay (registered trademark). It may be an in-vehicle communication network.

Each control unit includes a microcomputer that performs arithmetic processing according to various programs, a storage unit that stores programs executed by the microcomputer or parameters used in various calculations, and a drive circuit that drives various devices to be controlled. Prepare. Each control unit has a network I/F for communicating with other control units via a communication network 7010, and communicates with devices or sensors inside and outside the vehicle by wired communication or wireless communication. A communication I/F for communication is provided. In FIG. 22, the functional configuration of the integrated control unit 7600 includes a microcomputer 7610, a general-purpose communication I/F 7620, a dedicated communication I/F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle equipment I/F 7660, an audio image output unit 7670, An in-vehicle network I/F 7680 and a storage unit 7690 are shown. Other control units are similarly provided with microcomputers, communication I/Fs, storage units, and the like.

The drive system control unit 7100 controls the operation of devices related to the drive system of the vehicle according to various programs. For example, the driving system control unit 7100 includes a driving force generator for generating driving force of the vehicle such as an internal combustion engine or a driving motor, a driving force transmission mechanism for transmitting the driving force to the wheels, and a steering angle of the vehicle. It functions as a control device such as a steering mechanism to adjust and a brake device to generate braking force of the vehicle. The drive system control unit 7100 may have a function as a control device such as ABS (Antilock Brake System) or ESC (Electronic Stability Control).

A vehicle state detection section 7110 is connected to the drive system control unit 7100 . The vehicle state detection unit 7110 includes, for example, a gyro sensor that detects the angular velocity of the axial rotational motion of the vehicle body, an acceleration sensor that detects the acceleration of the vehicle, an accelerator pedal operation amount, a brake pedal operation amount, and a steering wheel steering. At least one of sensors for detecting angle, engine speed or wheel rotation speed is included. Drive system control unit 7100 performs arithmetic processing using signals input from vehicle state detection unit 7110, and controls the internal combustion engine, drive motor, electric power steering device, brake device, and the like.

The body system control unit 7200 controls the operation of various devices equipped on the vehicle body according to various programs. For example, the body system control unit 7200 functions as a keyless entry system, a smart key system, a power window device, or a control device for various lamps such as headlamps, back lamps, brake lamps, winkers or fog lamps. In this case, body system control unit 7200 can receive radio waves transmitted from a portable device that substitutes for a key or signals from various switches. Body system control unit 7200 receives the input of these radio waves or signals and controls the door lock device, power window device, lamps, etc. of the vehicle.

The battery control unit 7300 controls the secondary battery 7310, which is the power supply source for the driving motor, according to various programs. For example, the battery control unit 7300 receives information such as battery temperature, battery output voltage, or remaining battery capacity from a battery device including a secondary battery 7310 . The battery control unit 7300 performs arithmetic processing using these signals, and performs temperature adjustment control of the secondary battery 7310 or control of a cooling device provided in the battery device.

The vehicle exterior information detection unit 7400 detects information outside the vehicle in which the vehicle control system 7000 is installed. For example, at least one of the imaging section 7410 and the vehicle exterior information detection section 7420 is connected to the vehicle exterior information detection unit 7400 . The imaging unit 7410 includes at least one of a ToF (Time Of Flight) camera, a stereo camera, a monocular camera, an infrared camera, and other cameras. The vehicle exterior information detection unit 7420 includes, for example, an environment sensor for detecting the current weather or weather, or a sensor for detecting other vehicles, obstacles, pedestrians, etc. around the vehicle equipped with the vehicle control system 7000. ambient information detection sensor.

The environmental sensor may be, for example, at least one of a raindrop sensor that detects rainy weather, a fog sensor that detects fog, a sunshine sensor that detects the degree of sunshine, and a snow sensor that detects snowfall. The ambient information detection sensor may be at least one of an ultrasonic sensor, a radar device, and a LIDAR (Light Detection and Ranging, Laser Imaging Detection and Ranging) device. These imaging unit 7410 and vehicle exterior information detection unit 7420 may be provided as independent sensors or devices, or may be provided as a device in which a plurality of sensors or devices are integrated.

Here, FIG. 23 shows an example of the installation positions of the imaging unit 7410 and the vehicle exterior information detection unit 7420. FIG. The imaging units 7910 , 7912 , 7914 , 7916 , and 7918 are provided, for example, at least one of the front nose, side mirrors, rear bumper, back door, and windshield of the vehicle 7900 . An image pickup unit 7910 provided in the front nose and an image pickup unit 7918 provided above the windshield in the vehicle interior mainly acquire an image in front of the vehicle 7900 . Imaging units 7912 and 7914 provided in the side mirrors mainly acquire side images of the vehicle 7900 . An imaging unit 7916 provided in the rear bumper or back door mainly acquires an image behind the vehicle 7900 . An imaging unit 7918 provided above the windshield in the passenger compartment is mainly used for detecting preceding vehicles, pedestrians, obstacles, traffic lights, traffic signs, lanes, and the like.

Note that FIG. 23 shows an example of the imaging range of each of the imaging units 7910, 7912, 7914, and 7916. The imaging range a indicates the imaging range of the imaging unit 7910 provided in the front nose, the imaging ranges b and c indicate the imaging ranges of the imaging units 7912 and 7914 provided in the side mirrors, respectively, and the imaging range d is The imaging range of an imaging unit 7916 provided on the rear bumper or back door is shown. For example, by superimposing the image data captured by the imaging units 7910, 7912, 7914, and 7916, a bird's-eye view image of the vehicle 7900 viewed from above can be obtained.

The vehicle exterior information detectors 7920, 7922, 7924, 7926, 7928, and 7930 provided on the front, rear, sides, corners, and above the windshield of the vehicle interior of the vehicle 7900 may be, for example, ultrasonic sensors or radar devices. The exterior information detectors 7920, 7926, and 7930 provided above the front nose, rear bumper, back door, and windshield of the vehicle 7900 may be LIDAR devices, for example. These vehicle exterior information detection units 7920 to 7930 are mainly used to detect preceding vehicles, pedestrians, obstacles, and the like.

Return to Fig. 22 to continue the explanation. The vehicle exterior information detection unit 7400 causes the imaging section 7410 to capture an image of the exterior of the vehicle, and receives the captured image data. The vehicle exterior information detection unit 7400 also receives detection information from the vehicle exterior information detection unit 7420 connected thereto. When the vehicle exterior information detection unit 7420 is an ultrasonic sensor, radar device, or LIDAR device, the vehicle exterior information detection unit 7400 emits ultrasonic waves, electromagnetic waves, or the like, and receives reflected wave information. The vehicle exterior information detection unit 7400 may perform object detection processing or distance detection processing such as people, vehicles, obstacles, signs, or characters on the road surface based on the received information. The vehicle exterior information detection unit 7400 may perform environment recognition processing for recognizing rainfall, fog, road surface conditions, etc., based on the received information. The vehicle exterior information detection unit 7400 may calculate the distance to the vehicle exterior object based on the received information.

In addition, the vehicle exterior information detection unit 7400 may perform image recognition processing or distance detection processing for recognizing people, vehicles, obstacles, signs, characters on the road surface, etc., based on the received image data. The vehicle exterior information detection unit 7400 performs processing such as distortion correction or alignment on the received image data, and synthesizes image data captured by different imaging units 7410 to generate a bird's-eye view image or a panoramic image. good too. The vehicle exterior information detection unit 7400 may perform viewpoint conversion processing using image data captured by different imaging units 7410 .

The in-vehicle information detection unit 7500 detects in-vehicle information. The in-vehicle information detection unit 7500 is connected to, for example, a driver state detection section 7510 that detects the state of the driver. The driver state detection unit 7510 may include a camera that captures an image of the driver, a biosensor that detects the biometric information of the driver, a microphone that collects sounds in the vehicle interior, or the like. A biosensor is provided, for example, on a seat surface, a steering wheel, or the like, and detects biometric information of a passenger sitting on a seat or a driver holding a steering wheel. The in-vehicle information detection unit 7500 may calculate the degree of fatigue or concentration of the driver based on the detection information input from the driver state detection unit 7510, and determine whether the driver is dozing off. You may The in-vehicle information detection unit 7500 may perform processing such as noise canceling processing on the collected sound signal.

The integrated control unit 7600 controls overall operations within the vehicle control system 7000 according to various programs. An input section 7800 is connected to the integrated control unit 7600 . The input unit 7800 is realized by a device that can be input-operated by the passenger, such as a touch panel, button, microphone, switch or lever. The integrated control unit 7600 may be input with data obtained by recognizing voice input by a microphone. The input unit 7800 may be, for example, a remote control device using infrared rays or other radio waves, or may be an externally connected device such as a mobile phone or PDA (Personal Digital Assistant) corresponding to the operation of the vehicle control system 7000. may The input unit 7800 may be, for example, a camera, in which case the passenger can input information through gestures. Alternatively, data obtained by detecting movement of a wearable device worn by a passenger may be input. Furthermore, the input section 7800 may include an input control circuit that generates an input signal based on information input by the passenger or the like using the input section 7800 and outputs the signal to the integrated control unit 7600, for example. A passenger or the like operates the input unit 7800 to input various data to the vehicle control system 7000 and instruct processing operations.

The storage unit 7690 may include a ROM (Read Only Memory) that stores various programs executed by the microcomputer, and a RAM (Random Access Memory) that stores various parameters, calculation results, sensor values, and the like. Also, the storage unit 7690 may be realized by a magnetic storage device such as a HDD (Hard Disc Drive), a semiconductor storage device, an optical storage device, a magneto-optical storage device, or the like.

The general-purpose communication I/F 7620 is a general-purpose communication I/F that mediates communication between various devices existing in the external environment 7750. General-purpose communication I/F 7620 is a cellular communication protocol such as GSM (registered trademark) (Global System of Mobile communications), WiMAX (registered trademark), LTE (registered trademark) (Long Term Evolution) or LTE-A (LTE-Advanced) , or other wireless communication protocols such as wireless LAN (also referred to as Wi-Fi®), Bluetooth®, and the like. General-purpose communication I / F 7620, for example, via a base station or access point, external network (e.g., Internet, cloud network or operator-specific network) equipment (e.g., application server or control server) connected to You may In addition, the general-purpose communication I/F 7620 uses, for example, P2P (Peer To Peer) technology to connect terminals (for example, terminals of drivers, pedestrians, stores, or MTC (Machine Type Communication) terminals) near the vehicle. may be connected with

The dedicated communication I/F 7630 is a communication I/F that supports a communication protocol designed for use in vehicles. The dedicated communication I/F 7630 uses standard protocols such as WAVE (Wireless Access in Vehicle Environment), DSRC (Dedicated Short Range Communications), which is a combination of lower layer IEEE 802.11p and higher layer IEEE 1609, or cellular communication protocol. May be implemented. The dedicated communication I/F 7630 is typically used for vehicle-to-vehicle communication, vehicle-to-infrastructure communication, vehicle-to-home communication, and vehicle-to-pedestrian communication. ) perform V2X communication, which is a concept involving one or more of the communications.

The positioning unit 7640, for example, receives GNSS signals from GNSS (Global Navigation Satellite System) satellites (for example, GPS signals from GPS (Global Positioning System) satellites), performs positioning, and obtains the latitude, longitude, and altitude of the vehicle. Generate location information containing Note that the positioning unit 7640 may specify the current position by exchanging signals with a wireless access point, or may acquire position information from a terminal such as a mobile phone, PHS, or smart phone having a positioning function.

The beacon receiving unit 7650 receives, for example, radio waves or electromagnetic waves transmitted from wireless stations installed on the road, and acquires information such as the current position, traffic jams, road closures, or required time. Note that the function of the beacon reception unit 7650 may be included in the dedicated communication I/F 7630 described above.

The in-vehicle device I/F 7660 is a communication interface that mediates connections between the microcomputer 7610 and various in-vehicle devices 7760 present in the vehicle. The in-vehicle device I/F 7660 may establish a wireless connection using a wireless communication protocol such as wireless LAN, Bluetooth (registered trademark), NFC (Near Field Communication), or WUSB (Wireless USB). In addition, the in-vehicle device I/F 7660 is connected via a connection terminal (and cable if necessary) not shown, USB (Universal Serial Bus), HDMI (registered trademark) (High-Definition Multimedia Interface, or MHL (Mobile High -definition Link), etc. In-vehicle equipment 7760 includes, for example, at least one of mobile equipment or wearable equipment possessed by passengers, or information equipment carried in or attached to the vehicle. In-vehicle equipment 7760 may also include a navigation device that searches for a route to an arbitrary destination.In-vehicle equipment I/F 7660 exchanges control signals with these in-vehicle equipment or exchange data signals.

The in-vehicle network I/F 7680 is an interface that mediates communication between the microcomputer 7610 and the communication network 7010. In-vehicle network I/F 7680 transmits and receives signals and the like according to a predetermined protocol supported by communication network 7010 .

The microcomputer 7610 of the integrated control unit 7600 uses at least one of a general-purpose communication I/F 7620, a dedicated communication I/F 7630, a positioning unit 7640, a beacon receiving unit 7650, an in-vehicle device I/F 7660, and an in-vehicle network I/F 7680. The vehicle control system 7000 is controlled according to various programs on the basis of the information acquired by. For example, the microcomputer 7610 calculates control target values for the driving force generator, steering mechanism, or braking device based on acquired information on the inside and outside of the vehicle, and outputs a control command to the drive system control unit 7100. good too. For example, the microcomputer 7610 realizes the functions of ADAS (Advanced Driver Assistance System) including collision avoidance or shock mitigation, follow-up driving based on inter-vehicle distance, vehicle speed maintenance driving, vehicle collision warning, or vehicle lane deviation warning. Cooperative control may be performed for the purpose of In addition, the microcomputer 7610 controls the driving force generator, the steering mechanism, the braking device, etc. based on the acquired information about the surroundings of the vehicle, thereby autonomously traveling without depending on the operation of the driver. Cooperative control may be performed for the purpose of driving or the like.

Microcomputer 7610 receives information obtained through at least one of general-purpose communication I/F 7620, dedicated communication I/F 7630, positioning unit 7640, beacon receiving unit 7650, in-vehicle device I/F 7660, and in-vehicle network I/F 7680. Based on this, three-dimensional distance information between the vehicle and surrounding objects such as structures and people may be generated, and local map information including the surrounding information of the current position of the vehicle may be created. Further, based on the acquired information, the microcomputer 7610 may predict dangers such as vehicle collisions, pedestrians approaching or entering closed roads, and generate warning signals. The warning signal may be, for example, a signal for generating a warning sound or lighting a warning lamp.

The audio/image output unit 7670 transmits at least one of audio and/or image output signals to an output device capable of visually or audibly notifying the passengers of the vehicle or the outside of the vehicle. In the example of FIG. 22, an audio speaker 7710, a display section 7720, and an instrument panel 7730 are illustrated as output devices. Display 7720 may include, for example, at least one of an on-board display and a head-up display. The display unit 7720 may have an AR (Augmented Reality) display function. Other than these devices, the output device may be headphones, a wearable device such as an eyeglass-type display worn by a passenger, or other devices such as a projector or a lamp. When the output device is a display device, the display device displays the results obtained by various processes performed by the microcomputer 7610 or information received from other control units in various formats such as text, images, tables, and graphs. Display visually. When the output device is a voice output device, the voice output device converts an audio signal including reproduced voice data or acoustic data into an analog signal and outputs the analog signal audibly.

In the example shown in FIG. 22, at least two control units connected via the communication network 7010 may be integrated as one control unit. Alternatively, an individual control unit may be composed of multiple control units. Furthermore, vehicle control system 7000 may comprise other control units not shown. Also, in the above description, some or all of the functions that any control unit has may be provided to another control unit. In other words, as long as information is transmitted and received via the communication network 7010, the predetermined arithmetic processing may be performed by any one of the control units. Similarly, sensors or devices connected to any control unit may be connected to other control units, and multiple control units may send and receive detection information to and from each other via communication network 7010. .

A computer program for realizing each function of the imaging device 100 described in each embodiment (including modifications) can be installed in any control unit or the like. It is also possible to provide a computer-readable recording medium storing such a computer program. The recording medium is, for example, a magnetic disk, an optical disk, a magneto-optical disk, a flash memory, or the like. Also, the above computer program may be distributed, for example, via a network without using a recording medium.

In the vehicle control system 7000 described above, the imaging device 100 described in each embodiment (including modifications) can be applied to the integrated control unit 7600 of the application example shown in FIG. For example, the control unit 130 and the recording unit (storage unit) 120 of the imaging device 100 may be realized by the microcomputer 7610 and the storage unit 7690 of the integrated control unit 7600 . Further, the imaging device 100 described in each embodiment includes the imaging unit 7410 and the vehicle exterior information detection unit 7420 of the application example shown in FIG. , 7918, vehicle exterior information detection units 7920 to 7930, and the like. By using the imaging device 100 described in each embodiment, the vehicle control system 7000 can also easily identify the location of the cause of the abnormality.

Moreover, at least some of the components of the imaging device 100 described in each embodiment (including modifications) are modules (for example, composed of one die) for the integrated control unit 7600 of the application example shown in FIG. integrated circuit module). Alternatively, part of the imaging device 100 described in each embodiment may be implemented by multiple control units of the vehicle control system 7000 shown in FIG.

<4. Note>
Note that the present technology can also take the following configuration.
(1)
a light receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element;
a detection substrate electrically connected to the light-receiving substrate and having a plurality of elements included in an event detection unit that outputs an event signal according to a change in the current output from the photoelectric conversion element;
a supply unit that applies a potential that disables the operation of the photoelectric conversion element or the first element to a node of the photoelectric conversion element or the node of the first element;
An image sensor.
(2)
The supply unit
a first switch for switching a path through which the current flows to the photoelectric conversion element and for applying a potential to a node of the first element to disable the operation of the first element;
The imaging device according to (1) above.
(3)
The first switch is provided on the detection substrate,
The imaging device according to (2) above.
(4)
The first switch is provided on the light receiving substrate,
The imaging device according to (2) above.
(5)
The supply unit
a second switch for switching a path through which the current flows to the photoelectric conversion element and for applying a potential to a node of the photoelectric conversion element to disable the operation of the photoelectric conversion element;
The imaging device according to any one of (2) to (4) above.
(6)
further comprising a fixing unit that fixes an output potential from the light receiving substrate to the detection substrate to a predetermined potential;
The imaging device according to any one of (1) to (5) above.
(7)
The fixed part is
a third switch for fixing the output potential to the predetermined potential;
The imaging device according to (6) above.
(8)
The third switch is provided on the detection substrate,
The imaging device according to (7) above.
(9)
The third switch is provided on the light receiving substrate,
The imaging device according to (7) above.
(10)
further comprising a switching unit for switching electrical connection between the light receiving substrate and the detection substrate between a disconnected state and a connected state;
The imaging device according to any one of (1) to (9) above.
(11)
The switching unit is
a fourth switch for switching the electrical connection between the light receiving substrate and the detection substrate between the disconnected state and the connected state;
The imaging device according to (10) above.
(12)
The fourth switch is provided on the detection substrate,
The imaging device according to (11) above.
(13)
The fourth switch is provided on the light receiving substrate,
The imaging device according to (11) above.
(14)
The event detection unit
a current-voltage conversion unit that converts the current output from the photoelectric conversion element into a voltage;
The current-voltage conversion unit has a plurality of transistors,
The imaging device according to any one of (1) to (13) above.
(15)
Some of the plurality of transistors are provided on the detection substrate,
The imaging device according to (14) above.
(16)
all of the plurality of transistors are provided on the light receiving substrate;
The imaging device according to (14) above.
(17)
further comprising a pixel array section having a plurality of pixels in an array,
the plurality of pixels each have the photoelectric conversion element, the first element, and the plurality of elements;
the plurality of pixels are divided into effective pixels and test pixels;
The supply unit is provided in the test pixel,
The imaging device according to any one of (1) to (16) above.
(18)
further comprising a pixel array section having a plurality of pixels in an array,
the plurality of pixels each have the photoelectric conversion element, the first element, and the plurality of elements;
the plurality of pixels are divided into a plurality of pixel blocks each including a predetermined number of pixels;
The supply unit is provided for each pixel block,
The imaging device according to any one of (1) to (16) above.
(19)
an imaging lens;
an imaging device;
with
The imaging element is
a light receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element;
a detection substrate electrically connected to the light-receiving substrate and having a plurality of elements included in an event detection unit that outputs an event signal according to a change in the current output from the photoelectric conversion element;
a supply unit that supplies a node of the photoelectric conversion element or the node of the first element with a potential that disables the operation of the photoelectric conversion element or the first element;
An imaging device having
(20)
a light-receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element; A method for controlling an imaging device comprising a detection substrate having a plurality of elements included in an event detection unit that outputs a signal,
Applying a potential that disables the operation of the photoelectric conversion element or the first element to the node of the photoelectric conversion element or the node of the first element;
A control method for an imaging device, comprising:
(21)
An imaging device comprising the imaging device according to any one of (1) to (18) above.
(22)
An imaging device control method for controlling the imaging device according to any one of (1) to (18) above.

11 pixel 12 pixel array unit 13 driving unit 14 arbiter unit 15 column processing unit 16 signal processing unit 61 light receiving unit 62 pixel signal generation unit 63 event detection unit 100 imaging device 110 imaging lens 120 recording unit 130 control unit 139 signal line 200 imaging element 201 light-receiving chip 202 detection chip 209 signal line 301 pixel circuit 310 current-voltage conversion unit 311 photoelectric conversion element 312 N-type transistor 313 supply unit 313a switch 313b switch 314 P-type transistor 315 N-type transistor 317 fixed unit 317a switch 318 switching unit 318a switch 320 Buffer 321 P-type Transistor 322 P-type Transistor 330 Differentiation Circuit 331 Capacitance 332 P-type Transistor 333 P-type Transistor 334 Capacitance 335 N-type Transistor 340 Comparator 341 P-type Transistor 342 N-type Transistor 343 P-type Transistor 344 N-type Transistor 350 Transfer Unit 391 Input terminal 392 Output terminal

Claims (20)

1. a light receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element;
   a detection substrate electrically connected to the light-receiving substrate and having a plurality of elements included in an event detection unit that outputs an event signal according to a change in the current output from the photoelectric conversion element;
   a supply unit that applies a potential that disables the operation of the photoelectric conversion element or the first element to a node of the photoelectric conversion element or the node of the first element;
   An image sensor.
2. The supply unit
   a first switch for switching a path through which the current flows to the photoelectric conversion element and for applying a potential that disables the operation of the first element to a node of the first element;
   The imaging device according to claim 1 .
3. The first switch is provided on the detection substrate,
   The imaging device according to claim 2 .
4. The first switch is provided on the light receiving substrate,
   The imaging device according to claim 2 .
5. The supply unit
   a second switch for switching a path through which the current flows to the photoelectric conversion element and for applying a potential to a node of the photoelectric conversion element to disable the operation of the photoelectric conversion element;
   The imaging device according to claim 2 .
6. further comprising a fixing unit that fixes an output potential from the light receiving substrate to the detection substrate to a predetermined potential;
   The imaging device according to claim 1 .
7. The fixed part is
   a third switch for fixing the output potential to the predetermined potential;
   The imaging device according to claim 6 .
8. The third switch is provided on the detection substrate,
   The imaging device according to claim 7 .
9. The third switch is provided on the light receiving substrate,
   The imaging device according to claim 7 .
10. further comprising a switching unit for switching electrical connection between the light receiving substrate and the detection substrate between a disconnected state and a connected state;
    The imaging device according to claim 1 .
11. The switching unit is
    a fourth switch for switching the electrical connection between the light receiving substrate and the detection substrate between the disconnected state and the connected state;
    The imaging device according to claim 10.
12. The fourth switch is provided on the detection substrate,
    The imaging device according to claim 11.
13. The fourth switch is provided on the light receiving substrate,
    The imaging device according to claim 11.
14. The event detection unit
    a current-voltage conversion unit that converts the current output from the photoelectric conversion element into a voltage;
    The current-voltage conversion unit has a plurality of transistors,
    The imaging device according to claim 1 .
15. Some of the plurality of transistors are provided on the detection substrate,
    The imaging device according to claim 14.
16. all of the plurality of transistors are provided on the light receiving substrate;
    The imaging device according to claim 14.
17. further comprising a pixel array section having a plurality of pixels in an array,
    the plurality of pixels each have the photoelectric conversion element, the first element, and the plurality of elements;
    the plurality of pixels are divided into effective pixels and test pixels;
    The supply unit is provided in the test pixel,
    The imaging device according to claim 1 .
18. further comprising a pixel array section having a plurality of pixels in an array,
    the plurality of pixels each have the photoelectric conversion element, the first element, and the plurality of elements;
    the plurality of pixels are divided into a plurality of pixel blocks each including a predetermined number of pixels;
    The supply unit is provided for each pixel block,
    The imaging device according to claim 1 .
19. an imaging lens;
    an imaging device;
    with
    The imaging element is
    a light receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element;
    a detection substrate electrically connected to the light-receiving substrate and having a plurality of elements included in an event detection unit that outputs an event signal according to a change in the current output from the photoelectric conversion element;
    a supply unit that applies a potential that disables the operation of the photoelectric conversion element or the first element to a node of the photoelectric conversion element or the node of the first element;
    An imaging device having
20. a light-receiving substrate having a photoelectric conversion element and a first element electrically connected to the photoelectric conversion element; A method of controlling an imaging device comprising a detection substrate having a plurality of elements included in an event detection unit that outputs a signal, comprising:
    applying a potential that disables the operation of the photoelectric conversion element or the first element to the node of the photoelectric conversion element or the node of the first element;
    A control method for an imaging device, comprising:

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