WO2022237703A1 - 一种射频电路板、射频模组及电子设备 - Google Patents

一种射频电路板、射频模组及电子设备 Download PDF

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Publication number
WO2022237703A1
WO2022237703A1 PCT/CN2022/091584 CN2022091584W WO2022237703A1 WO 2022237703 A1 WO2022237703 A1 WO 2022237703A1 CN 2022091584 W CN2022091584 W CN 2022091584W WO 2022237703 A1 WO2022237703 A1 WO 2022237703A1
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pad
radio frequency
pin
wire
band signal
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PCT/CN2022/091584
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English (en)
French (fr)
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黄昌强
郭征
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广州视源电子科技股份有限公司
广州视琨电子科技有限公司
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Publication of WO2022237703A1 publication Critical patent/WO2022237703A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits

Definitions

  • the present application relates to the technical field of radio frequency communication, in particular to a radio frequency circuit board, radio frequency module and electronic equipment.
  • the radio frequency module is a basic component of wireless communication equipment. It plays two important roles in wireless communication, that is, it plays the role of converting binary signals into high-frequency wireless electromagnetic wave signals in the process of transmitting signals; In the process, the received electromagnetic wave signal is converted into a binary digital signal.
  • the traditional single-frequency radio frequency module only supports wireless signal transmission in a single frequency band of 2.4GHz.
  • the signal in the 2.4GHz frequency band has the characteristics of long transmission distance and is not easily blocked by obstacles. However, its transmission speed is relatively slow, and it is prone to network card failures. problems such as pauses and frequent disconnections.
  • the dual-frequency RF module provides wireless RF signals in two frequency bands of 2.4GHz and 5GHz at the same time, and can support a complete wireless network including 802.11a/b/g/n, which belongs to the fifth-generation RF transmission technology.
  • the 5GHz frequency band signal has the advantages of strong anti-interference ability, wide bandwidth and fast transmission speed.
  • a radio frequency module usually includes a circuit board and components located on the circuit board.
  • the circuit board design of a single-frequency radio frequency module and a dual-frequency radio frequency module are different, and the two are not compatible. Therefore, it is necessary to design different circuit boards for the single-frequency radio frequency module and the dual-frequency radio frequency module, which will undoubtedly increase the production cost.
  • Embodiments of the present application provide a radio frequency circuit board, a radio frequency module, and electronic equipment.
  • the radio frequency circuit board is compatible with a single-frequency radio frequency module and a dual-frequency radio frequency module, thereby reducing production costs.
  • the embodiment of the present application provides a radio frequency circuit board, including a substrate and an antenna connection socket, and the antenna connection socket is arranged on the substrate for connecting an external antenna;
  • the surface of the substrate is provided with several wires and several pads;
  • the first pad and the second pad are respectively used for welding the first frequency band signal pin and the second frequency band signal pin of the radio frequency chip;
  • the third pad, the fourth pad and the fifth pad are respectively used for welding the first pin, the second pin and the third pin of the duplexer;
  • the sixth pad forms a connection position with the seventh pad and the eighth pad respectively, and the ninth pad forms a connection position with the tenth pad and the eleventh pad respectively, and the connection position is used for welding and connecting devices;
  • the first pad is connected to the sixth pad through a first wire
  • the seventh pad is connected to the tenth pad through a second wire
  • the ninth pad is connected to the tenth pad through a third wire.
  • the above-mentioned antenna connection base is connected;
  • the eighth pad is connected to the third pad through a fourth wire, and the fifth pad is connected to the eleventh pad through a fifth wire;
  • the second pad is connected to the fourth pad through a sixth wire.
  • a grounding layer for grounding is also provided on the surface of the substrate, and the grounding layer is disposed on both sides of the wire and is insulated from the wire.
  • the surface of the substrate is further provided with several conductive holes penetrating the substrate, one end of the conductive holes is connected to the ground layer, and the other end is grounded.
  • a twelfth welding pad and a thirteenth welding pad are further arranged on the first wire;
  • the twelfth pad and the thirteenth pad form a matching bit, and the matching bit is used for soldering a radio frequency matching device.
  • a fourteenth pad and a fifteenth pad are also arranged on the third wire;
  • the fourteenth pad and the fifteenth pad form a matching bit, and the matching bit is used for soldering a radio frequency matching device.
  • the embodiment of the present application provides a radio frequency module, based on the radio frequency circuit board provided in the first aspect of the present application, including:
  • a first radio frequency chip the first radio frequency chip has a frequency band signal pin for transmitting a frequency band signal, and the frequency band signal pin is welded on the first pad;
  • the first pin of the first connection device is welded on the sixth pad, and the second pin of the first connection device is soldered on the seventh pad;
  • the second connection device, the first pin of the second connection device is welded on the ninth pad, and the second pin of the second connection device is soldered on the tenth pad.
  • the first connecting device and the second connecting device are zero-ohm resistors.
  • the embodiment of the present application provides a radio frequency module, based on the radio frequency circuit board provided in the first aspect of the present application, including:
  • the second radio frequency chip has a first frequency band signal pin and a second frequency band signal pin, which are respectively used to transmit the first frequency band signal and the second frequency band signal, and the first frequency band signal pin is welded on On the first pad, the second frequency band signal pin is welded on the second pad;
  • the first pin of the third connection device is welded on the sixth pad, and the second pin of the third connection device is soldered on the eighth pad;
  • a fourth connection device the first pin of the fourth connection device is welded on the ninth pad, and the second pin of the fourth connection device is soldered on the eleventh pad;
  • the first pin, the second pin and the third pin of the duplexer are soldered to the third bonding pad, the fourth bonding pad and the fifth bonding pad respectively.
  • the third connecting device and the fourth connecting device are zero-ohm resistors.
  • the embodiment of the present application provides an electronic device, including the radio frequency circuit board as provided in the first aspect of the present application
  • the radio frequency circuit board provided by the embodiment of the present application includes a substrate and an antenna connection seat.
  • the antenna connection seat is arranged on the substrate for connecting an external antenna.
  • Several wires and several pads are provided on the surface of the substrate.
  • the first pad and the second The pads are respectively used for welding the first frequency band signal pin and the second frequency band signal pin of the radio frequency chip, and the third pad, the fourth pad and the fifth pad are respectively used for welding the first pin,
  • the second pin and the third pin, the sixth pad is connected with the seventh pad and the eighth pad respectively, and the ninth pad is connected with the tenth pad and the eleventh pad respectively.
  • the position is used for soldering and connecting the device, the first pad and the sixth pad are connected through the first wire, the seventh pad and the tenth pad are connected through the second wire, and the ninth pad is connected to the antenna socket through the third wire connection, the eighth pad is connected to the third pad through the fourth wire, the fifth pad is connected to the eleventh pad through the fifth wire, and the second pad is connected to the fourth pad through the sixth wire.
  • the RF circuit board is compatible with single-frequency RF modules and dual-frequency RF modules. In practical applications, the required components can be soldered on the RF circuit board according to the needs of single-frequency RF device, you can get a single-frequency radio frequency module or a dual-frequency radio frequency module, reducing production costs.
  • FIG. 1 is a circuit layout diagram of a radio frequency circuit board provided by an embodiment of the present application
  • Figure 2 is a top view of the single-frequency radio frequency module provided by the embodiment of the present application.
  • Fig. 3 is the circuit diagram of single frequency radio frequency module
  • FIG. 4 is a top view of a dual-frequency radio frequency module provided by an embodiment of the present application.
  • Fig. 5 is a circuit diagram of a dual-frequency radio frequency module.
  • connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • connection can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the terms “first” and “second” are only used for distinction in description and have no special meaning.
  • FIG. 1 is a circuit layout diagram of a radio frequency circuit board provided by the embodiment of the present application. As shown in FIG. For external antenna.
  • the substrate 110 includes an insulating board and several wires and pads located on the surface of the insulating board.
  • the insulating board may be a phenolic paper laminate, an epoxy paper laminate, a polyester glass felt laminate, an epoxy glass cloth laminate, etc.
  • Wires and pads can be formed on the surface of the insulating board by means of electroplating, printing, and the like. Specifically, as shown in FIG. 1, the surface of the substrate 110 is provided with a first pad P1, a second pad P2, a third pad P3, a fourth pad P4, a fifth pad P5, and a sixth pad P6.
  • the antenna mount 120 may be an IPEX antenna mount for connecting an IPEX antenna.
  • the first pad P1 and the second pad P2 are respectively used for welding the first frequency band signal pin and the second frequency band signal pin of the radio frequency chip.
  • the radio frequency chip can be a single-frequency chip or a dual-frequency chip.
  • the so-called single-frequency chip is a radio frequency chip with a working frequency band of 2.4GHz, which only has one frequency band signal pin.
  • the so-called dual-frequency chip means that the working frequency band includes 2.4GHz and 5GHz.
  • the radio frequency chip has a signal pin of a first frequency band and a signal pin of a second frequency band, which are respectively used for inputting and outputting a signal of a 2.4GHz frequency band and a signal of a 5GHz frequency band.
  • the first pad P1 is used for soldering the frequency band signal pins of the single-frequency chip
  • the second pad P2 is vacant or used for soldering other pins of the single-frequency chip.
  • the first pad P1 is used for welding the first frequency band signal pin of the dual-frequency chip
  • the second pad P2 is used for welding the second frequency band signal pin of the dual-frequency chip.
  • the single-frequency chip and the dual-frequency chip can be PIN to PIN chips.
  • the so-called PIN to PIN chip means that the functional pins of the two chips are the same, so that users can exchange chips without changing the circuit.
  • the third pad P3 , the fourth pad P4 and the fifth pad P5 are respectively used for soldering the first pin, the second pin and the third pin of the duplexer.
  • the duplexer is used in the antenna input and output section, and has the function of sorting or mixing two different frequency signals when transmitting and receiving.
  • the third pad P3, the fourth pad P4, and the fifth pad P5 are used to solder the first pin, the second pin, and the third pin of the duplexer, respectively. pin.
  • the sixth pad P6 forms a connection position with the seventh pad P7 and the eighth pad P8 respectively
  • the ninth pad P9 forms a connection position with the tenth pad P10 and the eleventh pad P11 respectively, and the connection position is used for welding
  • a connecting device which is used to connect two adjacent pads, usually has a very small impedance.
  • the connecting device is a zero ohm resistor.
  • Zero-ohm resistors also known as jumper resistors, are special-purpose resistors. Zero-ohm resistors do not have a real resistance value of zero. Zero-ohm resistors are actually resistors with very small resistance values.
  • the first pad P1 is connected to the sixth pad P6 through the first wire L1
  • the seventh pad P7 is connected to the tenth pad P10 through the second wire L2
  • the ninth pad P9 is connected to the antenna connecting seat through the third wire L3 sub 120 connection.
  • the eighth pad P8 is connected to the third pad P3 through the fourth wire L4, and the fifth pad P5 is connected to the eleventh pad P11 through the fifth wire L5.
  • the second pad P2 is connected to the fourth pad P4 through a sixth wire L6.
  • the required components can be soldered on the radio frequency circuit board (specifically, the way of patching can be used), and the single-frequency radio frequency module can be obtained. group or dual-band RF module.
  • Figure 2 is a top view of the single-frequency radio frequency module provided by the embodiment of the present application
  • Figure 3 is a circuit diagram of the single-frequency radio frequency module, exemplary, as shown in Figure 2 and Figure 3, if required is a single-frequency radio frequency module , paste the single-frequency radio frequency chip U1 on the position of the radio frequency chip.
  • the model of the single-frequency radio frequency chip U1 can be MT7638GU.
  • Other pins are welded on other corresponding pads at the position of the radio frequency chip, which will not be described in detail in this application.
  • the first connection device R1 on the connection position composed of the sixth pad P6 and the seventh pad P7 the first end of the first connection device R1 is welded on the sixth pad P6, the second end of the first connection device R1 terminal is soldered on the seventh pad P7.
  • the second connection device R2 on the connection position composed of the ninth pad P9 and the tenth pad P10 the first end of the second connection device R2 is welded on the ninth pad P9, the second connection device R2 The end is soldered on the tenth pad P10.
  • the frequency band signal pin of the single-frequency radio frequency chip U1 is connected to the first pin of the antenna base 120 (CN1 in FIG. 3 ).
  • the first connecting device R1 and the second connecting device R2 are zero-ohm resistors.
  • Figure 4 is a top view of the dual-frequency radio frequency module provided by the embodiment of the present application
  • Figure 5 is a circuit diagram of the dual-frequency radio frequency module, exemplary, as shown in Figure 4 and Figure 5, if required is a dual-frequency radio frequency module , paste the dual-frequency radio frequency chip U2 on the position of the radio frequency chip.
  • the model of the dual-frequency radio frequency chip U2 can be MT766BU.
  • the second frequency band signal pin of U2 is soldered to the second pad P2, and the other pins of the dual-frequency radio frequency chip U2 are soldered to other corresponding pads at the position of the radio frequency chip, which will not be described in detail in this application.
  • the duplexer U3 is attached to the position where the third pad P3, the fourth pad P4 and the fifth pad P5 are located, wherein the first pin of the duplexer U3 is welded on the third pad P3, and the duplexer The second pin of U3 is welded on the fourth pad P4, and the third pin of the duplexer U3 is soldered on the fifth pad P5.
  • the first frequency band signal pin of the dual-frequency radio frequency chip U2 is connected to the first pin of the duplexer U3, and the second frequency band signal pin of the dual-frequency radio frequency chip U2 is connected to the second pin of the duplexer U3.
  • the third pin of the duplexer U3 is connected to the first pin of the antenna base 120 (CN1 in FIG. 5 ).
  • the third connecting device R3 and the fourth connecting device R4 are zero-ohm resistors.
  • the radio frequency circuit board provided by the embodiment of the present application includes a substrate and an antenna connection seat.
  • the antenna connection seat is arranged on the substrate for connecting an external antenna.
  • Several wires and several pads are provided on the surface of the substrate.
  • the first pad and the second The pads are respectively used for welding the first frequency band signal pin and the second frequency band signal pin of the radio frequency chip, and the third pad, the fourth pad and the fifth pad are respectively used for welding the first pin,
  • the second pin and the third pin, the sixth pad is connected with the seventh pad and the eighth pad respectively, and the ninth pad is connected with the tenth pad and the eleventh pad respectively.
  • the position is used for soldering and connecting the device, the first pad and the sixth pad are connected through the first wire, the seventh pad and the tenth pad are connected through the second wire, and the ninth pad is connected to the antenna socket through the third wire connection, the eighth pad is connected to the third pad through the fourth wire, the fifth pad is connected to the eleventh pad through the fifth wire, and the second pad is connected to the fourth pad through the sixth wire.
  • the RF circuit board is compatible with single-frequency RF modules and dual-frequency RF modules. In practical applications, the required components can be soldered on the RF circuit board according to the needs of single-frequency RF device, you can get a single-frequency radio frequency module or a dual-frequency radio frequency module, reducing production costs.
  • the surface of the substrate 110 is also provided with a grounding layer for grounding.
  • the grounding layer is laid flat on the surface of the substrate 110, wrapped around both sides of the wire and insulated from the wire, thereby forming a ground wrap, shielding The interference of external signals on the signal transmitted in the wire.
  • the surface of the substrate 110 is also provided with a plurality of conductive holes H penetrating the substrate.
  • a conductive layer (such as a copper layer) is deposited on the inner wall of the conductive hole H.
  • One end of the conductive hole H is connected to the ground layer, and the other end is grounded.
  • a twelfth pad P12 and a thirteenth pad P13 are also provided on the first wire L1, and the twelfth pad P12 and the thirteenth pad P13 form a matching bit, and the matching bit Used for soldering RF matching device C1.
  • the RF matching device C1 can be a capacitor, an inductor, etc., and is used to adjust the specific coordination relationship between the load impedance and the internal impedance of the signal source during signal transmission, so that all high-frequency signals can be transmitted to the load point without being reflected back to the source , improve transmission efficiency.
  • a fourteenth pad P14 and a fifteenth pad P15 are also provided on the third wire L3, and the fourteenth pad P14 and the fifteenth pad P15 form a matching bit, and the matching bit Used for soldering RF matching device C2.
  • the RF matching device C2 can be a capacitor, an inductor, etc., and is used to adjust the specific coordination relationship between the load impedance and the internal impedance of the signal source during signal transmission, so that all high-frequency signals can be transmitted to the load point without being reflected back to the signal source , improve transmission efficiency.
  • the embodiment of the present application also provides a radio frequency module, the radio frequency module is a single frequency radio frequency module, based on the radio frequency circuit board provided in the foregoing embodiments of the present application, including:
  • the first radio frequency chip is a single-frequency radio frequency chip, supporting a frequency band signal (2.4GHz), the first radio frequency chip has a frequency band signal pin, used to transmit a frequency band signal, and the frequency band signal pin is welded on the on a pad;
  • 2.4GHz frequency band signal
  • the first radio frequency chip has a frequency band signal pin, used to transmit a frequency band signal, and the frequency band signal pin is welded on the on a pad;
  • the first connection device, the first pin of the first connection device is soldered on the sixth pad, and the second pin of the first connection device is soldered on the seventh pad;
  • the first pin of the second connection device is welded on the ninth pad, and the second pin of the second connection device is soldered on the tenth pad.
  • the first connecting device and the second connecting device are zero-ohm resistors.
  • the embodiment of the present application also provides a radio frequency module, the radio frequency module is a dual-frequency radio frequency module, based on the radio frequency circuit board provided in the foregoing embodiments of the present application, including:
  • the second radio frequency chip, the first radio frequency chip is a dual-frequency radio frequency chip, which supports two frequency band signals (2.4GHz and 5GHz), and the second radio frequency chip has a first frequency band signal pin and a second frequency band signal pin, which are respectively used for transmission
  • the first frequency band signal and the second frequency band signal, the first frequency band signal pin is soldered on the first pad, and the second frequency band signal pin is soldered on the second pad;
  • the first pin of the third connection device is soldered on the sixth pad, and the second pin of the third connection device is soldered on the eighth pad;
  • the fourth connection device, the first pin of the fourth connection device is soldered on the ninth pad, and the second pin of the fourth connection device is soldered on the eleventh pad;
  • the first pin, the second pin and the third pin of the duplexer are welded on the third pad, the fourth pad and the fifth pad respectively.
  • the third connecting device and the fourth connecting device are zero-ohm resistors.
  • the first radio frequency chip and the second radio frequency chip are PIN to PIN chips.
  • the embodiment of the present application also provides an electronic device, including the radio frequency circuit board provided in any of the above-mentioned embodiments of the application.
  • the electronic device can be a router, a set-top box, a gateway and other hardware devices used to connect two or more networks, or it can be It is a terminal device, such as a smart phone, a tablet computer, a smart TV, etc., which is not limited in this application.

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Abstract

本申请公开一种射频电路板、射频模组及电子设备，射频电路板能够兼容单频射频模组和双频射频模组，在实际应用中，可以根据单频射频模组或双频射频模组的需要，在射频电路板上焊接上所需的元器件，就能得到单频射频模组或双频射频模组，降低生产成本。

Description

一种射频电路板、射频模组及电子设备 技术领域
本申请涉及射频通讯技术领域，尤其涉及一种射频电路板、射频模组及电子设备。
背景技术
射频模组是无线通讯设备的基础性零部件，在无线通讯中扮演着两个重要的角色，即在发射信号的过程中扮演着将二进制信号转换成高频率的无线电磁波信号；在接收信号的过程中将收到的电磁波信号转换成二进制数字信号。
传统的单频射频模组，只支持2.4GHz的单个频段的无线信号传输，2.4GHz频段信号具有传输距离远、不易并障碍物阻挡等特点，但是，其传输速度较慢，其容易出现网络卡顿、频繁掉线等问题。双频射频模组同时提供了2.4GHz和5GHz两个频段的无线射频信号，可支持包含802.11a/b/g/n完整无线网络，其属于第五代射频传输技术。5GHz频段信号具有抗干扰能力强、带宽较宽、传输速度快的优点。
随着电子设备和通讯技术的发展，用户在追求信号传输的稳定性的同时，也越来越关注信号的传输速度。因此，市面上出现了支持2.4GHz频段信号的单频射频模组和同时支持2.4GHz和5GHz两个频段信号的双频射频模组。
射频模组通常包括线路板和位于线路板上的元器件，单频射频模组和双频射频模组的线路板设计是不同的，二者不能兼容。因此，需要分别为单频射频模组和双频射频模组设计不同的线路板，这无疑会提高生产成本。
发明内容
本申请实施例提供了一种射频电路板、射频模组及电子设备，射频电路板能够兼容单频射频模组和双频射频模组，降低生产成本。
第一方面，本申请实施例提供了一种射频电路板，包括基板和天线连接座子，所述天线连接座子设置于所述基板上，用于外接天线；
所述基板表面设置有若干导线和若干焊盘；
第一焊盘和第二焊盘分别用于焊接射频芯片的第一频段信号引脚和第二频段信号引脚；
第三焊盘、第四焊盘和第五焊盘分别用于焊接双工器的第一引脚、第二引脚和第三引脚；
第六焊盘分别与第七焊盘和第八焊盘组成连接位，第九焊盘分别与第十焊盘和第十一焊盘组成连接位，所述连接位用于焊接连接器件；
所述第一焊盘与所述第六焊盘通过第一导线连接，所述第七焊盘与所述第十焊盘通过第二导线连接，所述第九焊盘通过第三导线与所述天线连接座子连接；
所述第八焊盘与所述第三焊盘通过第四导线连接，第五焊盘与第十一焊盘通过第五导线连接；
所述第二焊盘与所述第四焊盘通过第六导线连接。
可选的，所述基板表面还设置有用于接地的接地层，所述接地层设置于所述导线两侧，且与所述导线绝缘隔离。
可选的，所述基板表面还设置有若干贯穿所述基板的导电孔，所述导电孔的一端与所述接地层连接，另一端接地。
可选的，所述第一导线上还设置有第十二焊盘和第十三焊盘；
所述第十二焊盘和所述第十三焊盘组成匹配位，所述匹配位用于焊接射频匹配器件。
可选的，所述第三导线上还设置有第十四焊盘和第十五焊盘；
所述第十四焊盘和所述第十五焊盘组成匹配位，所述匹配位用于焊接射频匹配器件。
第二方面，本申请实施例提供了一种射频模组，基于本申请第一方面提供的射频电路板，包括：
第一射频芯片，所述第一射频芯片具有一个频段信号引脚，用于传输一种频段信号，所述频段信号引脚焊接在所述第一焊盘上；
第一连接器件，所述第一连接器件的第一引脚焊接在所述第六焊盘上，所述第一连接器件的第二引脚焊接在所述第七焊盘上；
第二连接器件，所述第二连接器件的第一引脚焊接在所述第九焊盘上，所述第二连接器件的第二引脚焊接在所述第十焊盘上。
可选的，所述第一连接器件和所述第二连接器件为零欧姆电阻。
第三方面，本申请实施例提供了一种射频模组，基于本申请第一方面提供的射频电路板，包括：
第二射频芯片，所述第二射频芯片具有第一频段信号引脚和第二频段信号引脚，分别用于传输第一频段信号和第二频段信号，所述第一频段信号引脚焊接在所述第一焊盘上，所述第二频段信号引脚焊接在所述第二焊盘上；
第三连接器件，所述第三连接器件的第一引脚焊接在所述第六焊盘上，所述第三连接器件的第二引脚焊接在所述第八焊盘上；
第四连接器件，所述第四连接器件的第一引脚焊接在所述第九焊盘上，所述第四连接器件的第二引脚焊接在所述第十一焊盘上；
双工器，所述双工器的第一引脚、第二引脚和第三引脚分别焊接在所述第三焊盘、所述第四焊盘和所述第五焊盘上。
可选的，所述第三连接器件和所述第四连接器件为零欧姆电阻。
第四方面，本申请实施例提供了一种电子设备，包括如本申请第一方面提供的射频电路板
本申请实施例提供的射频电路板，包括基板和天线连接座子，天线连接座子设置于基板上，用于外接天线，基板表面设置有若干导线和若干焊盘，第一焊盘和第二焊盘分别用于焊接射频芯片的第一频段信号引脚和第二频段信号引脚，第三焊盘、第四焊盘和第五焊盘分别用于焊接双工器的第一引脚、第二引脚和第三引脚，第六焊盘分别与第七焊盘和第八焊盘组成连接位，第九焊盘分别与第十焊盘和第十一焊盘组成连接位，连接位用于焊接连接器件，第一焊盘与第六焊盘通过第一导线连接，第七焊盘与第十焊盘通过第二导线连接，第九焊盘通过第三导线与天线连接座子连接，第八焊盘与第三焊盘通过第四导线连接，第五焊盘与第十一焊盘通过第五导线连接，第二焊盘与第四焊盘通过第六导线连接。该射频电路板能够兼容单频射频模组和双频射频模组，在实际应用中，可以根据单频射频模组或双频射频模组的需要，在射频电路板上焊接上所需的元器件，就能得到单频射频模组或双频射频模组，降低生产成本。
附图说明
下面根据附图和实施例对本申请作进一步详细说明。
图1为本申请实施例提供的一种射频电路板的线路布置图；
图2为本申请实施例提供的单频射频模组的俯视图；
图3为单频射频模组的电路图；
图4为本申请实施例提供的双频射频模组的俯视图；
图5为双频射频模组的电路图。
具体实施方式
为使本申请解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面将结合附图对本申请实施例的技术方案作进一步的详细描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。此外，术语“第一”、“第二”，仅仅用于在描述上加以区分，并没有特殊的含义。
本申请实施例提供了一种射频电路板，该射频电路板可用于制备射频模组，能够兼容单频射频模组和双频射频模组，降低生产成本。图1为本申请实施例提供的一种射频电路板的线路布置图，如图1所示，该射频电路板包括基板110和天线连接座子120，天线连接座子120设置于基板110上，用于外接天线。
基板110包括绝缘板和位于绝缘板表面的若干导线和若干焊盘，绝缘板可以是酚醛纸质层压板、环氧纸质层压板、聚酯玻璃毡层压板、环氧玻璃布层压板等，本申请实施例在此不做限定。导线和焊盘可以通过电镀、印刷等方式形成在绝缘板的表面。具体的，如图1所示，基板110的表面设置有第一焊盘P1、第二焊盘P2、第三焊盘P3、第四焊盘P4、第五焊盘P5、第六焊盘P6、第七焊 盘P7、第八焊盘P8、第九焊盘P9、第十焊盘P10、第十一焊盘P11、第一导线L1、第二导线L2、第三导线L3、第四导线L4、第五导线L5和第六导线L6。
示例性的，天线座子120可以是IPEX天线座子，用于连接IPEX天线。
第一焊盘P1和第二焊盘P2分别用于焊接射频芯片的第一频段信号引脚和第二频段信号引脚。具体的，射频芯片可以是单频芯片或双频芯片，所谓单频芯片即工作频段为2.4GHz的射频芯片，其仅具有一个频段信号引脚，所谓双频芯片即工作频段包含2.4GHz和5GHz的射频芯片，其具有第一频段信号引脚和第二频段信号引脚，分别用于输入输出2.4GHz频段的信号和5GHz频段的信号。当该射频电路板用于单频射频模组时，第一焊盘P1用于焊接单频芯片的频段信号引脚，第二焊盘P2空置或用于焊接单频芯片的其他引脚。当该射频电路板用于双频射频模组时，第一焊盘P1用于焊接双频芯片的第一频段信号引脚，第二焊盘P2用于焊接双频芯片的第二频段信号引脚。具体的，单频芯片和双频芯片可以是PIN to PIN芯片，所谓PIN to PIN芯片是指两个芯片功能引脚相同，使得用户无需更改电路就能互换芯片。
第三焊盘P3、第四焊盘P4和第五焊盘P5分别用于焊接双工器的第一引脚、第二引脚和第三引脚。双工器用于天线输入输出部，拥有在收发时分类或混合两种不同频率信号的功能。当射频电路板用于双频射频模组时，第三焊盘P3、第四焊盘P4和第五焊盘P5分别用于焊接双工器的第一引脚、第二引脚和第三引脚。
第六焊盘P6分别与第七焊盘P7和第八焊盘P8组成连接位，第九焊盘P9分别与第十焊盘P10和第十一焊盘P11组成连接位，连接位用于焊接连接器件，连接器件用于连接相邻的两个焊盘，其通常具有极小的阻抗。示例性的，连接器件为零欧姆电阻。零欧姆电阻又称为跨接电阻器，是一种特殊用途的电阻，零欧姆电阻的并非真正的阻值为零，零欧姆电阻实际是电阻值很小的电阻。
第一焊盘P1与第六焊盘P6通过第一导线L1连接，第七焊盘P7与第十焊盘P10通过第二导线L2连接，第九焊盘P9通过第三导线L3与天线连接座子120连接。
第八焊盘P8与第三焊盘P3通过第四导线L4连接，第五焊盘P5与第十一焊盘P11通过第五导线L5连接。
第二焊盘P2与第四焊盘P4通过第六导线L6连接。
在实际应用中，可以根据单频射频模组或双频射频模组的需要，在射频电路板上焊接上所需的元器件(具体可以采用贴片的方式)，就能得到单频射频模组或双频射频模组。
图2为本申请实施例提供的单频射频模组的俯视图，图3为单频射频模组的电路图，示例性的，如图2和图3所示，若所需为单频射频模组，在射频芯片位置贴上单频射频芯片U1，该单频射频芯片U1的型号可以是MT7638GU，单频射频芯片U1的频段信号引脚焊接在第一焊盘P1上，单频射频芯片U1的其他引脚焊接在射频芯片位置的其他相应的焊盘上，本申请在此不做详细描述。
在第六焊盘P6和第七焊盘P7组成的连接位贴上第一连接器件R1，第一连接器件R1的第一端焊接在第六焊盘P6上，第一连接器件R1的第二端焊接在第七焊盘P7上。在第九焊盘P9和第十焊盘P10组成的连接位贴上第二连接器件R2，第二连接器件R2的第一端焊接在第九焊盘P9上，第二连接器件R2的第二端焊接在第十焊盘P10上。进而实现单频射频芯片U1的频段信号引脚与天线座子120(图3中CN1)的第一引脚连接。其中，第一连接器件R1和第二连接器件R2为零欧姆电阻。
图4为本申请实施例提供的双频射频模组的俯视图，图5为双频射频模组的电路图，示例性的，如图4和图5所示，若所需为双频射频模组，在射频芯片位置贴上双频射频芯片U2，该双频射频芯片U2的型号可以是MT766BU，双频射频芯片U2的第一频段信号引脚焊接在第一焊盘P1上，双频射频芯片U2的第二频段信号引脚焊接在第二焊盘P2上，双频射频芯片U2的其他引脚焊接在射频芯片位置的其他相应地焊盘上，本申请在此不做详细描述。
双工器U3贴在第三焊盘P3、第四焊盘P4和第五焊盘P5所在的位置，其中，双工器U3的第一引脚焊接在第三焊盘P3上、双工器U3的第二引脚焊接在第四焊盘P4上、双工器U3的第三引脚焊接在第五焊盘P5上。
在第六焊盘P6和第八焊盘P8组成的连接位贴上第三连接器件R3，第三连接器件R3的第一端焊接在第六焊盘P6上，第三连接器件R3的第二端焊接在第八焊盘P8上。在第九焊盘P9和第十一焊盘P11组成的连接位贴上第四连接器件R4，第四连接器件R4的第一端焊接在第九焊盘P9上，第四连接器件R4的第二端焊接在第十一焊盘P11上。进而实现双频射频芯片U2的第一频段信号引脚与双工器U3的第一引脚连接，双频射频芯片U2的第二频段信号引脚与双工器U3的第二引脚连接，双工器U3的第三引脚与天线座子120(图5中CN1) 的第一引脚连接。其中，第三连接器件R3和第四连接器件R4为零欧姆电阻。
本申请实施例提供的射频电路板，包括基板和天线连接座子，天线连接座子设置于基板上，用于外接天线，基板表面设置有若干导线和若干焊盘，第一焊盘和第二焊盘分别用于焊接射频芯片的第一频段信号引脚和第二频段信号引脚，第三焊盘、第四焊盘和第五焊盘分别用于焊接双工器的第一引脚、第二引脚和第三引脚，第六焊盘分别与第七焊盘和第八焊盘组成连接位，第九焊盘分别与第十焊盘和第十一焊盘组成连接位，连接位用于焊接连接器件，第一焊盘与第六焊盘通过第一导线连接，第七焊盘与第十焊盘通过第二导线连接，第九焊盘通过第三导线与天线连接座子连接，第八焊盘与第三焊盘通过第四导线连接，第五焊盘与第十一焊盘通过第五导线连接，第二焊盘与第四焊盘通过第六导线连接。该射频电路板能够兼容单频射频模组和双频射频模组，在实际应用中，可以根据单频射频模组或双频射频模组的需要，在射频电路板上焊接上所需的元器件，就能得到单频射频模组或双频射频模组，降低生产成本。
在本申请的一些实施例中，基板110表面还设置有用于接地的接地层，接地层平铺在基板110的表面，包绕在导线的两侧且与导线绝缘隔离，进而形成包地，屏蔽外界信号对导线中传输的信号的干扰。
基板110表面还设置有若干贯穿基板的导电孔H，导电孔H的内壁沉积有导电层(例如铜层)，导电孔H的一端与接地层连接，另一端接地。
在本申请的一些实施例中，第一导线L1上还设置有第十二焊盘P12和第十三焊盘P13，第十二焊盘P12和第十三焊盘P13组成匹配位，匹配位用于焊接射频匹配器件C1。射频匹配器件C1可以是电容、电感等，用于调节信号传输过程中负载阻抗和信源内阻抗之间的特定配合关系，使得所有高频信号均能传输到负载点而不会反射回信源，提高传输效率。
在本申请的一些实施例中，第三导线L3上还设置有第十四焊盘P14和第十五焊盘P15，第十四焊盘P14和第十五焊盘P15组成匹配位，匹配位用于焊接射频匹配器件C2。射频匹配器件C2可以是电容、电感等，用于调节信号传输过程中负载阻抗和信源内阻抗之间的特定配合关系，使得所有高频信号均能传输到负载点而不会反射回信源，提高传输效率。
本申请实施例还提供了一种射频模组，该射频模组为单频射频模组，基于本申请前述实施例提供的射频电路板，包括：
第一射频芯片，第一射频芯片为单频射频芯片，支持一个频段信号 (2.4GHz)，第一射频芯片具有一个频段信号引脚，用于传输一种频段信号，频段信号引脚焊接在第一焊盘上；
第一连接器件，第一连接器件的第一引脚焊接在第六焊盘上，第一连接器件的第二引脚焊接在第七焊盘上；
第二连接器件，第二连接器件的第一引脚焊接在第九焊盘上，第二连接器件的第二引脚焊接在第十焊盘上。
示例性的，第一连接器件和第二连接器件为零欧姆电阻。
具体的，该射频模组的具体结构和电路在前述实施例中已有详细记载，可以参考图2和图3，本申请实施例在此不再赘述。
本申请实施例还提供了一种射频模组，该射频模组为双频射频模组，基于本申请前述实施例提供的射频电路板，包括：
第二射频芯片，第一射频芯片为双频频射频芯片，支持两个频段信号(2.4GHz和5GHz)，第二射频芯片具有第一频段信号引脚和第二频段信号引脚，分别用于传输第一频段信号和第二频段信号，第一频段信号引脚焊接在第一焊盘上，第二频段信号引脚焊接在第二焊盘上；
第三连接器件，第三连接器件的第一引脚焊接在第六焊盘上，第三连接器件的第二引脚焊接在第八焊盘上；
第四连接器件，第四连接器件的第一引脚焊接在第九焊盘上，第四连接器件的第二引脚焊接在第十一焊盘上；
双工器，双工器的第一引脚、第二引脚和第三引脚分别焊接在第三焊盘、第四焊盘和第五焊盘上。
示例性的，第三连接器件和第四连接器件为零欧姆电阻。
具体的，该射频模组的具体结构和电路在前述实施例中已有详细记载，可以参考图4和图5，本申请实施例在此不再赘述。
上述实施例中，第一射频芯片和第二射频芯片为PIN to PIN芯片。
本申请实施例还提供了一种电子设备，包括如申请前述任意实施例提供的射频电路板，电子设备可以是路由器、机顶盒、网关等用于连接两个或多个网络的硬件设备，也可以是终端设备，例如，智能手机、平板电脑、智能电视等，本申请在此不做限定。
于本文的描述中，需要理解的是，术语“上”、“下”、“左”“右”、等方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述和简 化操作，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本说明书的描述中，参考术语“一实施例”、“示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。
此外，应当理解，虽然本说明书按照实施方式加以描述，但并非每个实施方式仅包含一个独立的技术方案，说明书的这种叙述方式仅仅是为清楚起见，本领域技术人员应当将说明书作为一个整体，各实施例中的技术方案也可以适当组合，形成本领域技术人员可以理解的其他实施方式。
以上结合具体实施例描述了本申请的技术原理。这些描述只是为了解释本申请的原理，而不能以任何方式解释为对本申请保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本申请的其它具体实施方式，这些方式都将落入本申请的保护范围之内。

Claims (10)

  1. 一种射频电路板，其特征在于，包括基板和天线连接座子，所述天线连接座子设置于所述基板上，用于外接天线；
    所述基板表面设置有若干导线和若干焊盘；
    第一焊盘和第二焊盘分别用于焊接射频芯片的第一频段信号引脚和第二频段信号引脚；
    第三焊盘、第四焊盘和第五焊盘分别用于焊接双工器的第一引脚、第二引脚和第三引脚；
    第六焊盘分别与第七焊盘和第八焊盘组成连接位，第九焊盘分别与第十焊盘和第十一焊盘组成连接位，所述连接位用于焊接连接器件；
    所述第一焊盘与所述第六焊盘通过第一导线连接，所述第七焊盘与所述第十焊盘通过第二导线连接，所述第九焊盘通过第三导线与所述天线连接座子连接；
    所述第八焊盘与所述第三焊盘通过第四导线连接，第五焊盘与第十一焊盘通过第五导线连接；
    所述第二焊盘与所述第四焊盘通过第六导线连接。
  2. 根据权利要求1所述的射频电路板，其特征在于，所述基板表面还设置有用于接地的接地层，所述接地层设置于所述导线两侧，且与所述导线绝缘隔离。
  3. 根据权利要求2所述的射频电路板，其特征在于，所述基板表面还设置有若干贯穿所述基板的导电孔，所述导电孔的一端与所述接地层连接，另一端接地。
  4. 根据权利要求1-3任一所述的射频电路板，其特征在于，所述第一导线上还设置有第十二焊盘和第十三焊盘；
    所述第十二焊盘和所述第十三焊盘组成匹配位，所述匹配位用于焊接射频匹配器件。
  5. 根据权利要求1-3任一所述的射频电路板，其特征在于，所述第三导线上还设置有第十四焊盘和第十五焊盘；
    所述第十四焊盘和所述第十五焊盘组成匹配位，所述匹配位用于焊接射频匹配器件。
  6. 一种射频模组，其特征在于，基于权利要求1-5任一所述的射频电路板，包括：
    第一射频芯片，所述第一射频芯片具有一个频段信号引脚，用于传输一种 频段信号，所述频段信号引脚焊接在所述第一焊盘上；
    第一连接器件，所述第一连接器件的第一引脚焊接在所述第六焊盘上，所述第一连接器件的第二引脚焊接在所述第七焊盘上；
    第二连接器件，所述第二连接器件的第一引脚焊接在所述第九焊盘上，所述第二连接器件的第二引脚焊接在所述第十焊盘上。
  7. 根据权利要求6所述的射频模组，其特征在于，所述第一连接器件和所述第二连接器件为零欧姆电阻。
  8. 一种射频模组，其特征在于，基于权利要求1-5任一所述的射频电路板，包括：
    第二射频芯片，所述第二射频芯片具有第一频段信号引脚和第二频段信号引脚，分别用于传输第一频段信号和第二频段信号，所述第一频段信号引脚焊接在所述第一焊盘上，所述第二频段信号引脚焊接在所述第二焊盘上；
    第三连接器件，所述第三连接器件的第一引脚焊接在所述第六焊盘上，所述第三连接器件的第二引脚焊接在所述第八焊盘上；
    第四连接器件，所述第四连接器件的第一引脚焊接在所述第九焊盘上，所述第四连接器件的第二引脚焊接在所述第十一焊盘上；
    双工器，所述双工器的第一引脚、第二引脚和第三引脚分别焊接在所述第三焊盘、所述第四焊盘和所述第五焊盘上。
  9. 根据权利要求8所述的射频模组，其特征在于，所述第三连接器件和所述第四连接器件为零欧姆电阻。
  10. 一种电子设备，其特征在于，包括如权利要求1-5任一所述射频电路板。
PCT/CN2022/091584 2021-05-08 2022-05-08 一种射频电路板、射频模组及电子设备 WO2022237703A1 (zh)

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