WO2022234753A1 - 固体撮像装置及び電子機器 - Google Patents
固体撮像装置及び電子機器 Download PDFInfo
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- WO2022234753A1 WO2022234753A1 PCT/JP2022/016843 JP2022016843W WO2022234753A1 WO 2022234753 A1 WO2022234753 A1 WO 2022234753A1 JP 2022016843 W JP2022016843 W JP 2022016843W WO 2022234753 A1 WO2022234753 A1 WO 2022234753A1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14621—Colour filter arrangements
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14645—Colour imagers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
Definitions
- the present disclosure relates to solid-state imaging devices and electronic devices.
- the narrower the FWHM (Full Width at Half Maximum) of the multispectral sensor the better the wavelength analysis performance, so it is desirable to use a sensor with a narrow FWHM.
- the present disclosure provides an imaging device and an electronic device that acquire multispectral information with a narrow half-value width.
- a solid-state imaging device includes a light receiving element, an optical filter, and a multi-bandpass filter.
- the light receiving element photoelectrically converts incident light.
- the optical filter controls the color of light incident on the light receiving element.
- the multi-bandpass filter acquires light incident through the optical filter or light incident on the optical filter in a plurality of frequency bands.
- the optical filter is a filter corresponding to a plurality of the colors, and controls the color incident on each of the light receiving elements, and the multi-bandpass filter has at least one of the peaks of the transmitted frequency band It has a different frequency than the peak of the transmitted light in the filter corresponding to each of said plurality of colors.
- the plurality of colors may have different spectral peak frequencies.
- the optical filter may be at least one of a color filter, a plasmon filter and an organic photoelectric conversion film.
- the multi-bandpass filter may have a transmission band with a half-value width narrower than the half-value width of the optical filter corresponding to each of the plurality of colors.
- the multi-bandpass filter may be integrally formed by coating, adhesion, or film formation within the device.
- the multi-bandpass filter may have a plurality of transmission bands in transmission frequency bands of the optical filter corresponding to each of the plurality of colors.
- the light receiving element may output a signal having a plurality of spectral peaks through the multi-bandpass filter.
- the light-receiving element may include a first light-receiving element into which light enters through the multi-bandpass filter, and a second light-receiving element into which light enters without passing through the multi-bandpass filter. , a signal may be obtained based on the output of the first light receiving element and the output of the second light receiving element.
- Spectrum estimation may be performed based on the output of the first light receiving element and the output of the second light receiving element.
- the multibandpass filter may include a first multibandpass filter and a second multibandpass filter having a transmission band different from that of the first multibandpass filter, and the light receiving element may include the a third light receiving element into which light enters via the first multi-bandpass filter; and a fourth light receiving element into which light enters through the second multi-bandpass filter; A signal may be obtained based on the output of the third light receiving element and the output of the fourth light receiving element.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element may further include
- the multi-bandpass filter may include a third multi-bandpass filter and a fourth multi-bandpass filter having a transmission band different from that of the third multi-bandpass filter, and the light-receiving element is Light may be incident through the third multi-bandpass filter and the fourth multi-bandpass filter so as to have different transmission bands with respect to image height, and the wavelength extraction circuit may transmit light to the different images. Wavelength extraction may be performed using the wavelength extraction parameters for light received from the same target at height.
- the wavelength extraction circuit may perform the wavelength extraction by synthesizing the signal obtained through the third multi-bandpass filter and the signal obtained through the fourth multi-bandpass filter.
- the wavelength extraction circuit may perform the wavelength extraction based on signals acquired in different frames.
- an electronic device includes a display and an imaging device.
- the display displays image information with light emitted by light emitting elements.
- the image sensor is an image sensor that captures an image through the display on the side opposite to the light emitting surface of the display, and includes a light receiving element, an optical filter, and a multi-bandpass.
- the light receiving element photoelectrically converts incident light.
- the optical filter controls the color of light incident on the light receiving element.
- the multi-bandpass filter acquires light incident through the optical filter or light incident on the optical filter in a plurality of frequency bands.
- the optical filter is a filter corresponding to a plurality of the colors, and controls the color incident on each of the light receiving elements, and the multi-bandpass filter has at least one of the peaks of the transmitted frequency band It has a different frequency than the peak of the transmitted light in the filter corresponding to each of said plurality of colors.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element may be provided inside the imaging element.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element may be provided outside the imaging element.
- FIG. 1 is a block diagram schematically showing an electronic device according to one embodiment
- FIG. FIG. 4 is a diagram showing an example of frequency characteristics of an optical filter and a multi-bandpass filter according to one embodiment
- FIG. 4 is a diagram showing an example of a spectrum of white light through an optical filter and a multi-bandpass filter according to one embodiment
- FIG. 4 is a diagram showing an example of a result of performing matrix computation on an acquired spectrum according to one embodiment
- 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 4 is a diagram showing an example of spectral characteristics of a subject
- FIG. 4 is a diagram showing an example of acquired spectra according to one embodiment
- FIG. 4 is a diagram showing an example of spectra obtained using a multi-bandpass filter according to one embodiment
- FIG. 4 is a diagram showing an example of spectra obtained using a multi-bandpass filter according to one embodiment
- 1 is a diagram schematically showing at least part of a solid-state imaging device according to an embodiment
- FIG. 4 is a diagram showing an example of spectra acquired through a multi-bandpass filter according to one embodiment
- FIG. 4 is a diagram showing an example of spectra acquired through a multi-bandpass filter according to one embodiment
- FIG. 2 is a diagram showing an example of the arrangement of optical filters according to one embodiment
- FIG. 2 is a diagram showing an example of the arrangement of optical filters according to one embodiment
- 1A and 1B are diagrams illustrating an example of an electronic device according to an embodiment
- the half-value width in the present disclosure indicates the full width at half-value.
- FIG. 1 is a block diagram schematically showing an electronic device according to one embodiment.
- the electronic device 1 includes a solid-state imaging device 10, a processing circuit 12, a memory circuit 14, and an input/output unit 16.
- the electronic device 1 has at least an imaging function, and may be, for example, a digital still camera or digital video camera with an imaging function, or a mobile terminal, smart phone, tablet terminal, head-mounted display, etc., with other functions. good.
- the solid-state imaging device 10 includes an optical system 100, pixels 120, a signal processing circuit 140, a memory circuit 160, and an interface 180.
- the solid-state imaging device 10 is a device or module that receives incident light from the outside, acquires and outputs image information and video information (hereinafter simply referred to as image information).
- the optical system 100 is an optical system that appropriately causes external light to enter the light receiving element.
- the optical system 100 includes, for example, lenses, diaphragms, and the like. Also, as will be described later, the optical system 100 may be provided with at least part of an optical filter or at least part of a multi-bandpass filter.
- a pixel 120 includes a light receiving element and a pixel circuit.
- the light receiving element acquires and outputs an analog signal based on the intensity of incident light by photoelectric conversion.
- the light receiving element may be, for example, a photodiode or an organic photoelectric conversion film.
- a pixel circuit is a circuit that outputs an analog signal output by a light-receiving element at an appropriate timing and with an appropriate magnification.
- Pixel 120 is a circuit that outputs an analog signal based on the intensity of light controlled by optical system 100 .
- the signal processing circuit 140 is a circuit that appropriately processes the signal output from the pixel 120 and outputs it.
- the signal processing circuit 140 may include, for example, a DAC (Digital to Analog Converter) that converts analog signals output from the pixels 120 into digital signals.
- the signal processing circuit 140 may extract wavelength characteristics from the signals output from the pixels 120, or may perform image processing based on the acquired signals, as will be described later.
- the memory circuit 160 is a circuit that stores data in the solid-state imaging device 10.
- Storage circuitry 160 may store digital signals processed by signal processing circuitry 140, for example.
- the signal processing circuit 140 can write necessary data to or read data from the memory circuit 160 at arbitrary timing.
- the signal processing circuit 140 is a general-purpose processor and information processing by software is specifically realized using hardware resources, the memory circuit 160 may store data related to this software.
- Storage circuit 160 may also be connected to interface 180 .
- the interface 180 is an interface that outputs the signal processed by the signal processing circuit 140 to the outside of the solid-state imaging device 10, or receives input of data including control information from the outside.
- the format, standard, etc. used for the interface 180 are not particularly limited, and an appropriate interface can be used.
- the solid-state imaging device 10 appropriately forms and outputs image information based on information from the outside.
- the imaging method of the solid-state imaging device 10 may be, for example, a rolling shutter method or a global shutter method.
- the solid-state imaging device 10 may also be compatible with various imaging methods and various image processing.
- the processing circuit 12, the memory circuit 14, and the input/output unit 16 are provided separately from the solid-state imaging device 10 in the electronic device 1.
- the processing circuit 12 appropriately processes the signal output from the solid-state imaging device 10 and outputs it. Also, a control signal from the outside may be obtained via the input/output unit 16 to control the solid-state imaging device 10 via the interface 180 .
- the memory circuit 14 forms a memory area outside the solid-state imaging device 10.
- the processing circuit 12 may write data to the memory circuit 14 or read data from the memory circuit 14 as needed. If the processing circuit 12 can perform various processes with software, the memory circuit 14 may store programs necessary for this software, like the memory circuit 160 .
- the input/output unit 16 is a user interface, and includes, for example, a display, buttons, and a touch panel. Also, the input/output unit 16 may have an interface for transferring data to the outside or transferring data from the outside. For example, the user can operate the electronic device 1 via the input/output unit 16 to control imaging in the solid-state imaging device 10 .
- optical system 100 and the pixel 120 A few non-limiting examples of the optical system 100 and the pixel 120 will be described.
- the drawing shows 2 to 4 light receiving elements, the light receiving elements are arranged in a two-dimensional array, and the drawing shows a part of these light receiving elements.
- the solid-state imaging device 10 includes a light-receiving element that photoelectrically converts incident light, an optical filter (may include the optical system 100) that controls the light that enters the light-receiving element, and this optical filter. a multi-bandpass filter that transmits a plurality of frequency bands for light emitted from or incident on the optical filter.
- An optical filter is, for example, a filter related to the color incident on a light receiving element, and is a filter that controls the spectrum of incident light according to color information.
- the optical filters may be general color filters or plasmon filters.
- an organic photoelectric conversion film may be used as a concept combining the optical filter and the light receiving element.
- An optical filter may be provided for each light receiving element.
- each light receiving element receives light having a predetermined frequency characteristic.
- a color image can be reconstructed by providing optical filters corresponding to a plurality of colors for different light receiving elements. These optical filters may have different peak frequencies for different colors in the spectrum.
- a multi-bandpass filter has at least one of the peaks of the transmission band having a frequency different from the peak of the spectrum transmitted by each optical filter.
- the half-value width of each transmission band of the multi-bandpass filter is narrower than the half-value width of the spectrum of the optical filter corresponding to each color.
- FIG. 2 is a diagram showing an example of the transmission characteristics of an optical filter and the transmission characteristics of a multi-bandpass filter.
- Optical filters are indicated by R (red), G (green), B (blue), Mg (magenta), Cy (cyan), Ye (yellow), W (white), and IR (infrared), respectively. It has a transmission characteristic that transmits a spectrum for a given color.
- a plurality of types of optical filters suitable for the solid-state imaging device 10 to function as a multispectral sensor are provided.
- an MBP multi-bandpass filter
- MBP multi-bandpass filter
- the frequency characteristics in each transmission band of the multi-bandpass filter have a half width narrower than the half width in the frequency characteristics of each optical filter.
- the multi-bandpass filter may have multiple transmission bands in each color frequency band.
- Fig. 3 is a diagram showing an example of a spectrum obtained through a multi-bandpass filter.
- Fig. 3 shows the case where white light is obtained through an optical filter and a multi-bandpass filter.
- the outputs from the R, G, and Ye optical filters are superimposed. A combined diagram is shown.
- the signal obtained through the multi-bandpass filter is an output with multiple frequency peaks for each pixel.
- FIG. 4 is a diagram showing an example of the result of performing a matrix operation.
- FIG. 4 shows, as an example, the results of performing matrix operations for obtaining the spectroscopic results at 640 nm on the signals obtained through the optical filter and the multi-bandpass filter.
- the spectrum in Fig. 3 is calculated by setting the matrix operation as 2 ⁇ (Ye intensity) - 1.15 ⁇ (R intensity) - 2 ⁇ (G intensity).
- the color information used for calculation is not limited to these three colors. For example, even if you want to obtain the same 640 nm characteristics, you may use the result of receiving light through optical filters corresponding to more colors.
- This calculation may be performed by the signal processing circuit 140 inside the solid-state imaging device 10 in FIG. 1, or may be performed by the processing circuit 12 outside the solid-state imaging device 10.
- the above-described wavelength extraction and calculation for obtaining wavelength characteristics can be executed at an appropriate location inside or outside the solid-state imaging device 10 .
- optical filters and multi-bandpass filters described below are formed according to the filters shown in Fig. 2 as an example.
- FIG. 5 is a diagram showing an example of the arrangement of optical filters and imaging elements in the solid-state imaging device 10 according to one embodiment.
- the solid-state imaging device 10 includes a lens 101, a multi-bandpass filter 102, and an imaging element 110.
- the imaging device 110 is a device with multiple pixels 120 .
- the pixels 120 are arranged in a two-dimensional array in the imaging device 110, and form image information based on the light information acquired by each pixel.
- Image sensor 110 may comprise pixels 120 , signal processing circuitry 140 and interface 180 .
- the imaging device 110 may have a memory circuit 160 .
- the lens 101 is provided as part of the optical system 100.
- the lens 101 appropriately refracts and diffracts light incident from the outside, thereby propagating the incident light to the pixels 120 provided in the imaging element 110 .
- the multi-bandpass filter 102 may be formed separately from the imaging device 110 in the solid-state imaging device 10, for example.
- the multi-bandpass filter 102 is placed between the lens 101 and the imaging element 110. Light entering from the outside is refracted by the lens 101 and then enters the imaging element 110 via the multi-bandpass filter 102 .
- This multi-bandpass filter 102 may be formed by coating, adhering, or forming a film on a transmissive film within the solid-state imaging device 10, for example.
- the formation method is not particularly limited as long as the multi-bandpass filter 102 is appropriately arranged.
- the solid-state imaging device 10 may be provided with the multi-bandpass filter 102 outside the optical system 100 and the imaging device 110 for properly injecting light into the imaging device 110 .
- FIG. 6 is a diagram showing an example of the arrangement of optical filters and imaging elements in the solid-state imaging device 10 according to one embodiment.
- the solid-state imaging device 10 may include a multi-bandpass filter 102 inside the imaging device 110 .
- FIG. 7 is a diagram showing an example in which the imaging element 110 is provided with the multi-bandpass filter 102.
- FIG. 7 is a diagram showing an example in which the imaging element 110 is provided with the multi-bandpass filter 102.
- two pixels 120 each having one light-receiving element are shown as an example, but not limited to this.
- the pixel 120 may have a configuration in which one pixel circuit is provided for two light receiving elements, and is not limited to these configurations. Any configuration may be used as long as it is possible to acquire information about one color.
- a pixel 120 includes a light receiving element 121, a planarization film 122, a color filter 123, and an on-chip lens 124. Two pixels 120a, 120b are shown in FIG. 7 as an example.
- the light receiving element 121 is the light receiving element described above, and is formed of, for example, a photodiode.
- the light receiving element 121 photoelectrically converts the received light and outputs an analog signal based on the intensity to the pixel circuit.
- the planarizing film 122 is a layer that planarizes the upper surface of the light receiving element 121 and is made of a material having transparency in a desired band (eg, visible light region + near infrared region). This planarization film 122 may be formed not only on the top surface of the light receiving element 121, but also on the top surface of the color filter 123 or the top surface of the on-chip lens 124, if necessary.
- the color filter 123 is a filter that controls the spectral characteristics of light incident on the light receiving element 121.
- a color filter 123 is a filter corresponding to the optical filter described above. If the light receiving element 121 is formed of an organic photoelectric conversion film and generates an analog signal with appropriate spectral characteristics, this configuration is not essential.
- the color filter 123a may be a filter corresponding to R
- the color filter 123b may be a filter corresponding to G.
- a suitable color filter 123 may be provided for each light receiving element 121 .
- the color filter 123 may be a plasmon filter. In this case, light with different characteristics may be transmitted by appropriately controlling the arrangement, size, etc. of the openings. Further, the color filter 123 may be of a form in which a common color filter and a plasmon filter are mixed. By forming in this way, image information in the visible light region can be acquired, and information such as blood flow and blood oxygen concentration can also be acquired together.
- the on-chip lens 124 is a lens for appropriately condensing the light condensed by the optical system 100 onto the image sensor 110 for each pixel 120 .
- This on-chip lens 124 may be formed integrally with the pixel 120 including the light receiving element 121 and the like as a semiconductor device.
- an on-chip lens 124 is provided for each light receiving element 121, but a configuration in which one on-chip lens 124 is provided for a plurality of light receiving elements 121 may be adopted.
- the multi-bandpass filter 102 may be provided on top of the on-chip lens 124. That is, in this embodiment, the light incident on the imaging element 110 via the optical system 100 is transmitted by band by band by the multi-bandpass filter 102, appropriately refracted by the on-chip lens 124, and furthermore, by the color filter 123 The spectrum is controlled for each color by and enters the light receiving element 121 .
- FIG. 8 is a diagram showing another example in which the imaging element 110 is provided with the multi-bandpass filter 102.
- the multi-bandpass filter 102 may be arranged at any position between the color filter 123 and the light receiving element 121.
- the light incident on the imaging device 110 Ni via the optical system 100 is appropriately refracted by the on-chip lens 124, the spectrum is controlled for each color by the color filter 123, and the multi-bandpass filter 102 passes through each band and enters the light-receiving element 121 .
- FIG. 9 is a diagram showing another example in which the imaging element 110 is provided with the multi-bandpass filter 102.
- Pixels 120a, 120b are pixels provided with the multi-bandpass filter 102
- pixels 120c, 120d are pixels not provided with the multi-bandpass filter 102.
- a light receiving element 121 (first light receiving element) to which light enters via the multi-bandpass filter 102 and a light receiving element 121 (first light receiving element) to which light enters without passing through the multi-bandpass filter 102. 2 light receiving element) may be mixed.
- wavelength information is, for example, information indicating spectral characteristics for a certain wavelength. For example, it may indicate intensity information at a given wavelength of light reflected or transmitted from an object.
- the solid-state imaging device 10 or the electronic device 1 may use the output results of these first and second light receiving elements to especially perform spectrum estimation. Performing spectral estimation also allows for more detailed analysis of information about the object.
- the solid-state imaging device 10 may include a first light receiving element and a second light receiving element in one imaging element 110, as shown in FIG.
- the imaging element 110 may have a configuration in which the multi-bandpass filter 102 is provided.
- FIG. 10 is a diagram showing another example having a first light receiving element and a second light receiving element.
- the solid-state imaging device 10 may have multiple imaging elements 110 .
- the solid-state imaging device 10 includes, for example, an imaging element 110a and an imaging element 110b.
- the bandpass filter 103 may be, for example, a filter that transmits light in the visible light band.
- the bandpass filter 103 may be a filter that transmits light in the visible light band and the infrared band.
- the multi-bandpass filter 102 and the bandpass filter 103 can also be provided outside the imaging element 110.
- the light receiving element arranged in the imaging element 110a operates in the same manner as the first light receiving element in FIG. 9, and the light receiving element arranged in the imaging element 110b operates in the same manner as the second light receiving element in FIG. Operate.
- one image sensor 110 has a first light receiving element and a second light receiving element.
- one image sensor 110 has a first light receiving element and a different image sensor 110 has a second light receiving element. It is the structure provided with an element. Thus, the first light receiving element and the second light receiving element may be arranged in the same imaging element 110 or may be arranged in separate imaging elements 110 .
- FIG. 11 is a diagram showing an example of spectral characteristics of a subject.
- FIG. 12 and FIG. 13 show the characteristics of the subject imaged through the first light receiving element and the second light receiving element.
- Fig. 12 shows the spectrum reconstructed, for example, using the second light receiving element as the light receiving element used for viewing.
- a sensor used for viewing acquires information on all wavelengths of visible light, and can acquire an image that is close to what the human eye can see.
- the light-receiving element used for viewing is less accurate in estimating the spectrum from the acquired signal than the light-receiving element used for sensing.
- Fig. 13 shows, for example, the spectrum extracted with the first light receiving element as the light receiving element used for sensing.
- Data obtained through a multi-bandpass filter can obtain results with higher accuracy than data obtained using sensors used for viewing for each band.
- information on the bright spot cannot be extracted, or noise occurs due to the overlapping of the bright spot and the band.
- the solid-state imaging device 10 or the electronic device 1 estimates a continuous spectrum with higher accuracy by synthesizing the signals acquired using the first light receiving pixel and the second light receiving pixel by signal processing. becomes possible.
- This estimation may be realized, for example, by performing interpolation processing from the continuous spectrum obtained using the second light-receiving pixels for the data for each band obtained using the first light-receiving pixels.
- FIG. 14 is a diagram showing an example of the synthesized spectrum estimation result by the above method. As shown in this figure, using the results of FIGS. 12 and 13, it is possible to estimate the spectral characteristics of the subject with higher precision than when only FIG. 12 is used or when only FIG. 13 is used. It becomes possible.
- FIG. 15 is a diagram showing another arrangement example of the multi-bandpass filter 102.
- lens 101 may be made of a material having the frequency transmission characteristics of multi-bandpass filter 102 . With such a configuration, the lens 101 can appropriately control incident light, and light having a narrow band spectrum can be incident on the imaging element 110 .
- lens 101 Although shown as one lens 101 in FIG. 15, it is not limited to this.
- a plurality of lenses 101 may be provided, each of which may have the characteristics of the multi-bandpass filter 102 and may not have the characteristics of the multi-bandpass filter 102, and may have the same functions as those shown in FIGS. 9 and 10 described above.
- FIG. 16 is a diagram showing the characteristics of spectra obtained through a multi-bandpass filter according to one embodiment.
- FIG. 16 shows G light as an example.
- the dashed line indicates the spectrum of G light
- the solid line indicates the transmission frequency characteristics of the multi-bandpass filter
- the dotted line indicates the signal received by the light receiving element.
- the band indicated by the arrow For example, consider the band indicated by the arrow.
- the half width of this band of the multi-bandpass filter is the width indicated by the solid arrow.
- the FWHM of the transmitted G light is the width indicated by the dotted arrow.
- the output of the sensor is not constant but has a shape with a peak. Around the peak, the sensor output decreases. In the band that is decreasing from the peak, like the band indicated by the arrow in FIG. 16, it is possible to acquire spectral information with a narrower half-value width than the band of the multi-bandpass filter itself. Therefore, when acquiring the spectral characteristics of one light, it is possible to acquire more accurate characteristic values.
- the solid-state imaging device 10 can also perform sensing using a plurality of multi-bandpass filters with different characteristics.
- multi-bandpass filters with different bandwidths can be used.
- the results of filters with narrower bandwidths can be used to obtain the same results as in the above-described embodiments. It is also possible to remove noise and the like by calculation using the result of a wide filter.
- the solid-state imaging device 10 includes a third light receiving element that receives light through a first multibandpass filter, and a second multibandpass filter that has a different transmission band from the first multibandpass filter. and a fourth light receiving element that receives the
- the third light receiving element and the fourth light receiving element may be mixed in one image pickup element, or the third light receiving element and the fourth light receiving element may be separate image pickup elements. may be placed in
- the signal processing circuit 140 in the solid-state imaging device 10 or the processing circuit 12 outside the solid-state imaging device 10 can acquire wavelength information based on the results output from the third light receiving element and the fourth light receiving element. .
- Fig. 17 is a superimposition of spectral characteristics when using different multi-bandpass filters.
- ⁇ is the result based on the output from the third light receiving element, and ⁇ is the result based on the output from the fourth light receiving element. In this way, it is possible to acquire spectral information in different bands while having a certain amount of transmission bandwidth.
- FIG. 18 is a diagram schematically showing the imaging element 110 according to this embodiment.
- the left figure is a plan view, and the right figure is a cross-sectional view taken along line A-A of the left figure.
- the light receiving elements 121 may be provided with an on-chip lens 124 every 3 ⁇ 3 pieces.
- the light receiving element 121a in the periphery and the light receiving element 121b in the center receive light corresponding to images with different image heights from the same position of the object.
- the upper surface of the light receiving element 121a is provided with a third multi-bandpass filter 102a
- the upper surface of the light receiving element 121b is provided with a fourth multi-bandpass filter 102a having different characteristics from the third multi-bandpass filter 102a.
- a bandpass filter 102b is provided. Different properties may be, for example, having different transmission bands.
- the optical filters are not shown, as a non-limiting example, the light receiving elements belonging to the same on-chip lens 124 may be provided with color filters of the same color.
- the solid-state imaging device 10 may include a piezo element that gives the imaging device 110 minute vibrations, or the electronic device 1 may include a piezo element that gives the solid-state imaging device 10 minute vibrations. good too.
- FIG. 19 is an arrangement example of optical filters in a light receiving element according to one embodiment.
- filters may be arranged for receiving magenta, yellow, cyan, white, red, green, blue and infrared spectra, respectively.
- FIG. 20 is another arrangement example of optical filters in the light receiving element according to one embodiment.
- optical filters may be arranged as a combination of green and yellow, a combination of blue and cyan, and a combination of red and magenta.
- the solid-state imaging device 10 includes an imaging element including an ALS (Ambient Light Sensor) that photoelectrically converts only specific wavelengths with a limited wavelength band, and a multispectral sensor that does not lack a wavelength band at least in visible light. (preferably 4 or more colors) may be used to achieve spectral estimation.
- ALS Ambient Light Sensor
- the solid-state imaging device 10 or the electronic device 1 acquires, for example, light intensity information natural to the human eye from an illuminance sensor such as ALS, and image height from a multispectral sensor equipped with a multibandpass filter. It is possible to obtain spectral information dependent on Therefore, by appropriately mixing the outputs from these sensors, it is possible to obtain the effects of the above-described embodiments and also realize the reconstruction of an image that looks natural to the human eye.
- FIG. 21 is a mounting example of an electronic device 1 using the solid-state imaging device 10 of each embodiment described above.
- the electronic device 1 may be, for example, a smart phone, a tablet terminal, or the like.
- the electronic device 1 has a solid-state imaging device 10 that receives light transmitted through the display on the side opposite to the display surface of the display.
- the display surface 350z extends close to the external size of the electronic device 1, and the width of the bezel 350y around the display surface 350z is several millimeters or less.
- a front camera is usually mounted on the bezel 350y, but the solid-state imaging device 10 according to the present disclosure may be provided on the back side of the display approximately in the center of the display surface as indicated by the dashed line.
- This solid-state imaging device 10 can operate as an image sensor that functions as a front camera. In this way, the solid-state imaging device 10 can also be provided below the display.
- solid-state imaging device 10 Although a form in which one solid-state imaging device 10 is provided has been shown, the present invention is not limited to this, and a plurality of solid-state imaging devices 10 may be provided at different positions below the same display.
- the solid-state imaging device 10 may include a display and the solid-state imaging device 10 as an imaging element below the display.
- a display is equipped with a light-emitting element and displays image information with the light emitted by the light-emitting element.
- the solid-state imaging device 10 acquires external light through the display on the side opposite to the light-emitting surface of the display and captures an image.
- the solid-state imaging device 10 includes a light-receiving element that photoelectrically converts incident light, an optical filter that controls the color of the light that enters the light-receiving element, and a light that enters through the optical filter. and a multi-bandpass filter for capturing light or light incident on the optical filter in multiple frequency bands.
- An optical filter is a filter that has a transmission band corresponding to each of the multiple color spectra that you want to acquire, and controls the incident color for each light receiving element.
- At least one of the peaks of the transmitted frequency band has a frequency different from the peak of the transmitted light in the filter corresponding to each color.
- smartphones and tablet terminals can also be equipped with the solid-state imaging device 10 as a normal camera, and can also be equipped with the solid-state imaging device 10 of the present disclosure as an imaging element in devices other than these.
- the signal processing circuit 140 or the processing circuit 12 is a general-purpose processor, and this processor extracts the intensity of a predetermined wavelength and acquires spectral characteristics, but this is not the only option.
- the electronic device 1 may have a dedicated wavelength extraction circuit.
- This wavelength extraction circuit may be an ASIC, or may be provided so that wavelength extraction can be performed by software using a general-purpose processor.
- a light receiving element that photoelectrically converts incident light
- an optical filter that controls the color of light incident on the light receiving element
- a multi-bandpass filter that acquires light incident through the optical filter or light incident on the optical filter in a plurality of frequency bands; with The optical filter is A filter corresponding to a plurality of the colors, controlling the incident color for each of the light receiving elements;
- the multi-bandpass filter is at least one of the peaks of the transmitted frequency band has a different frequency than the peaks of the transmitted light in the filters corresponding to each of the plurality of colors; Solid-state imaging device.
- the plurality of colors have different spectral peak frequencies, The solid-state imaging device according to (1).
- optical filter is at least one of a color filter, a plasmon filter, or an organic photoelectric conversion film;
- the multi-bandpass filter has a transmission band with a half-value width narrower than the half-value width of the optical filter corresponding to each of the plurality of colors,
- the solid-state imaging device according to any one of (1) to (3).
- the multi-bandpass filter is integrally formed in the device by coating, adhesion or film formation,
- the solid-state imaging device according to any one of (1) to (4).
- the multi-bandpass filter has a plurality of transmission bands in transmission frequency bands of the optical filter corresponding to each of the plurality of colors,
- the solid-state imaging device according to any one of (1) to (5).
- the light receiving element outputs a signal having a plurality of spectral peaks through the multi-bandpass filter, The solid-state imaging device according to (6).
- the light receiving element is a first light receiving element into which light is incident via the multi-bandpass filter; a second light receiving element into which light enters without passing through the multi-bandpass filter; with obtaining a signal based on the output of the first light receiving element and the output of the second light receiving element;
- a solid-state imaging device according to any one of (1) to (7).
- the multi-bandpass filter is a first multi-bandpass filter; a second multibandpass filter having a transmission band different from that of the first multibandpass filter; with
- the light receiving element is a third light-receiving element into which light enters via the first multi-bandpass filter; a fourth light receiving element into which light enters via the second multi-bandpass filter; with
- the solid-state imaging device according to any one of (1) to (9), wherein a signal is acquired based on the output of the third light receiving element and the output of the fourth light receiving element.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element;
- the multi-bandpass filter is a third multi-bandpass filter; a fourth multibandpass filter having a transmission band different from that of the third multibandpass filter; with light is incident on the light-receiving element through the third multi-bandpass filter and the fourth multi-bandpass filter so that the light-receiving element has different transmission bands with respect to image height;
- the wavelength extraction circuit performs wavelength extraction using wavelength extraction parameters for light received from the same object at different image heights.
- the wavelength extraction circuit performs the wavelength extraction by synthesizing the signal obtained through the third multi-bandpass filter and the signal obtained through the fourth multi-bandpass filter.
- a display that displays image information with light emitted by a light emitting element;
- An imaging element that captures an image through the display on the side opposite to the light emitting surface of the display, a light receiving element that photoelectrically converts incident light;
- an optical filter that controls the color of light incident on the light receiving element;
- a multi-bandpass filter that acquires light incident through the optical filter or light incident on the optical filter in a plurality of frequency bands;
- an imaging device having with The optical filter is A filter corresponding to a plurality of the colors, controlling the incident color for each of the light receiving elements;
- the multi-bandpass filter is at least one of the peaks of the transmitted frequency band has a different frequency than the peaks of the transmitted light in the filters corresponding to each of the plurality of colors; Electronics.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element; is provided inside the imaging element.
- a wavelength extraction circuit for extracting the intensity of light of a predetermined wavelength from the signal output by the light receiving element is provided outside the imaging element.
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Abstract
Description
をさらに備えていてもよい。
図5は、一実施形態に係る固体撮像装置 10 における光学フィルタと撮像素子の配置の一例を示す図である。固体撮像装置 10 は、レンズ 101 と、マルチバンドパスフィルタ 102 と、撮像素子 110 と、を備える。
図6は、一実施形態に係る固体撮像装置 10 における光学フィルタと撮像素子の配置の一例を示す図である。固体撮像装置 10 は、撮像素子 110 の内部にマルチバンドパスフィルタ 102 を備えてもよい。
図10は、第 1 受光素子及び第 2 受光素子を備える別の例を示す図である。固体撮像装置 10 は、複数の撮像素子 110 を備えていてもよい。固体撮像装置 10 は、例えば、撮像素子 110a と撮像素子 110b と、を備える。
図15は、マルチバンドパスフィルタ 102 の別の配置例を示す図である。例えば、マルチバンドパスフィルタ 102 の周波数透過特性を有する材質で、レンズ 101 を生成してもよい。このような構成とすることで、レンズ 101 により適切な入射光の制御をするとともに、狭帯域のスペクトルを有する光を撮像素子 110 へと入射することも可能となる。
前述の各実施形態においては、マルチバンドパスフィルタは、 1 種類を用いるものとしたが、これに限定されるものではない。固体撮像装置 10 は、複数の特性の異なるマルチバンドパスフィルタを用いてセンシングをすることも可能である。
第 5 実施形態においては、受光素子ごとに異なるマルチバンドパスフィルタを介して受光をすることを説明したが、固体撮像装置 10 は、さらに細かい粒度で異なる特性を有するマルチバンドパスフィルタを備えることもできる。
前述においては、固体撮像装置 10 の形態について説明したが、電子機器 1 のいくつかの限定されない実装例について説明する。
入射する光を光電変換する、受光素子と、
前記受光素子に入射する光の色を制御する、光学フィルタと、
前記光学フィルタを介して入射した光、又は、前記光学フィルタに入射する光を、複数の周波数帯において取得する、マルチバンドパスフィルタと、
を備え、
前記光学フィルタは、
複数の前記色に対応するフィルタであり、
前記受光素子ごとに入射する前記色を制御し、
前記マルチバンドパスフィルタは、
透過する周波数帯のピークのうち少なくとも 1 つが、それぞれの前記複数の色に対応するフィルタにおける透過光のピークと異なる周波数を有する、
固体撮像装置。
複数の前記色は、スペクトルのピーク周波数が異なる、
(1)に記載の固体撮像装置。
前記光学フィルタは、カラーフィルタ、プラズモンフィルタ又は有機光電変換膜のうち少なくとも 1 つである、
(1)又は(2)に記載の固体撮像装置。
前記マルチバンドパスフィルタは、透過帯域の半値幅が前記複数の色のそれぞれに対応する前記光学フィルタの半値幅より狭い、
(1)から(3)のいずれかに記載の固体撮像装置。
前記マルチバンドパスフィルタは、装置内において塗布、接着又は成膜により一体形成されている、
(1)から(4)のいずれかに記載の固体撮像装置。
前記マルチバンドパスフィルタは、前記複数の色のそれぞれに対応する前記光学フィルタの透過周波数帯において、複数の透過帯域を備える、
(1)から(5)のいずれかに記載の固体撮像装置。
前記受光素子は、前記マルチバンドパスフィルタを介して、複数の分光ピークを有する信号を出力する、
(6)に記載の固体撮像装置。
前記受光素子は、
前記マルチバンドパスフィルタを介して光が入射する、第 1 受光素子と、
前記マルチバンドパスフィルタを介せずに光が入射する、第 2 受光素子と、
を備え、
前記第 1 受光素子の出力と、前記第 2 受光素子の出力とに基づいて、信号を取得する、
(1)から(7)のいずれかに記載の固体撮像装置。
前記第 1 受光素子の出力と、前記第 2 受光素子の出力とに基づいて、スペクトル推定を実行する、
(8)に記載の固体撮像装置。
前記マルチバンドパスフィルタは、
第 1 マルチバンドパスフィルタと、
前記第 1 マルチバンドパスフィルタと異なる透過帯域を有する、第 2 マルチバンドパスフィルタと、
を備え、
前記受光素子は、
前記第 1 マルチバンドパスフィルタを介して光が入射する、第 3 受光素子と、
前記第 2 マルチバンドパスフィルタを介して光が入射する、第 4 受光素子と、
を備え、
前記第 3 受光素子の出力と、前記第 4 受光素子の出力とに基づいて、信号を取得する
(1)から(9)のいずれかに記載の固体撮像装置。
前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
をさらに備える、(1)から(10)のいずれかに記載の固体撮像装置。
前記マルチバンドパスフィルタは、
第 3 マルチバンドパスフィルタと、
前記第 3 マルチバンドパスフィルタとは異なる透過帯域を有する、第 4 マルチバンドパスフィルタと、
を備え、
前記受光素子は、像高に対して異なる透過帯域を有するように前記第 3 マルチバンドパスフィルタと、前記第 4 マルチバンドパスフィルタと、を介して光が入射され、
前記波長抽出回路は、異なる前記像高における同一対象から受光した光に対する波長抽出パラメータを用いて、波長抽出を実行する、
(11)に記載の固体撮像装置。
前記波長抽出回路は、前記第 3 マルチバンドパスフィルタを介して取得した信号と、前記第 4 マルチバンドパスフィルタを介して取得した信号とを合成して、前記波長抽出を実行する、
(12)に記載の固体撮像装置。
前記波長抽出回路は、異なるフレームにおいて取得された信号に基づいて、前記波長抽出を実行する、
(12)又は(13)に記載の固体撮像装置。
発光素子が射出する光で画像情報を表示する、ディスプレイと、
前記ディスプレイの発光面と逆側において、前記ディスプレイを介して撮像する、撮像素子であって、
入射する光を光電変換する、受光素子と、
前記受光素子に入射する光の色を制御する、光学フィルタと、
前記光学フィルタを介して入射した光、又は、前記光学フィルタに入射する光を、複数の周波数帯において取得する、マルチバンドパスフィルタと、
を有する撮像素子と、
を備え、
前記光学フィルタは、
複数の前記色に対応するフィルタであり、
前記受光素子ごとに入射する前記色を制御し、
前記マルチバンドパスフィルタは、
透過する周波数帯のピークのうち少なくとも 1 つが、それぞれの前記複数の色に対応するフィルタにおける透過光のピークと異なる周波数を有する、
電子機器。
前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
を、前記撮像素子の内部に備える、(15)に記載の電子機器。
前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
を、前記撮像素子の外部に備える、(15)に記載の電子機器。
10: 固体撮像装置、
100: 光学系、
101: レンズ、
102: マルチバンドパスフィルタ、
103: バンドパスフィルタ、
110: 撮像素子、
120: 画素、
121: 受光素子、
122: 平坦化膜、
123: カラーフィルタ、
124: オンチップレンズ、
140: 信号処理回路、
160: 記憶回路、
180: インタフェース、
12: 処理回路、
14: 記憶回路、
16: 入出力部、
Claims (17)
- 入射する光を光電変換する、受光素子と、
前記受光素子に入射する光の色を制御する、光学フィルタと、
前記光学フィルタを介して入射した光、又は、前記光学フィルタに入射する光を、複数の周波数帯において取得する、マルチバンドパスフィルタと、
を備え、
前記光学フィルタは、
複数の前記色に対応するフィルタであり、
前記受光素子ごとに入射する前記色を制御し、
前記マルチバンドパスフィルタは、
透過する周波数帯のピークのうち少なくとも 1 つが、それぞれの前記複数の色に対応するフィルタにおける透過光のピークと異なる周波数を有する、
固体撮像装置。 - 複数の前記色は、スペクトルのピーク周波数が異なる、
請求項1に記載の固体撮像装置。 - 前記光学フィルタは、カラーフィルタ、プラズモンフィルタ又は有機光電変換膜のうち少なくとも 1 つである、
請求項1に記載の固体撮像装置。 - 前記マルチバンドパスフィルタは、透過帯域の半値幅が前記複数の色のそれぞれに対応する前記光学フィルタの半値幅より狭い、
請求項1に記載の固体撮像装置。 - 前記マルチバンドパスフィルタは、装置内において塗布、接着又は成膜により一体形成されている、
請求項1に記載の固体撮像装置。 - 前記マルチバンドパスフィルタは、前記複数の色のそれぞれに対応する前記光学フィルタの透過周波数帯において、複数の透過帯域を備える、
請求項1に記載の固体撮像装置。 - 前記受光素子は、前記マルチバンドパスフィルタを介して、複数の分光ピークを有する信号を出力する、
請求項6に記載の固体撮像装置。 - 前記受光素子は、
前記マルチバンドパスフィルタを介して光が入射する、第 1 受光素子と、
前記マルチバンドパスフィルタを介せずに光が入射する、第 2 受光素子と、
を備え、
前記第 1 受光素子の出力と、前記第 2 受光素子の出力とに基づいて、信号を取得する、
請求項1に記載の固体撮像装置。 - 前記第 1 受光素子の出力と、前記第 2 受光素子の出力とに基づいて、スペクトル推定を実行する、
請求項8に記載の固体撮像装置。 - 前記マルチバンドパスフィルタは、
第 1 マルチバンドパスフィルタと、
前記第 1 マルチバンドパスフィルタと異なる透過帯域を有する、第 2 マルチバンドパスフィルタと、
を備え、
前記受光素子は、
前記第 1 マルチバンドパスフィルタを介して光が入射する、第 3 受光素子と、
前記第 2 マルチバンドパスフィルタを介して光が入射する、第 4 受光素子と、
を備え、
前記第 3 受光素子の出力と、前記第 4 受光素子の出力とに基づいて、信号を取得する
請求項1に記載の固体撮像装置。 - 前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
をさらに備える、請求項1に記載の固体撮像装置。 - 前記マルチバンドパスフィルタは、
第 3 マルチバンドパスフィルタと、
前記第 3 マルチバンドパスフィルタとは異なる透過帯域を有する、第 4 マルチバンドパスフィルタと、
を備え、
前記受光素子は、像高に対して異なる透過帯域を有するように前記第 3 マルチバンドパスフィルタと、前記第 4 マルチバンドパスフィルタと、を介して光が入射され、
前記波長抽出回路は、異なる前記像高における同一対象から受光した光に対する波長抽出パラメータを用いて、波長抽出を実行する、
請求項11に記載の固体撮像装置。 - 前記波長抽出回路は、前記第 3 マルチバンドパスフィルタを介して取得した信号と、前記第 4 マルチバンドパスフィルタを介して取得した信号とを合成して、前記波長抽出を実行する、
請求項12に記載の固体撮像装置。 - 前記波長抽出回路は、異なるフレームにおいて取得された信号に基づいて、前記波長抽出を実行する、
請求項12に記載の固体撮像装置。 - 発光素子が射出する光で画像情報を表示する、ディスプレイと、
前記ディスプレイの発光面と逆側において、前記ディスプレイを介して撮像する、撮像素子であって、
入射する光を光電変換する、受光素子と、
前記受光素子に入射する光の色を制御する、光学フィルタと、
前記光学フィルタを介して入射した光、又は、前記光学フィルタに入射する光を、複数の周波数帯において取得する、マルチバンドパスフィルタと、
を有する撮像素子と、
を備え、
前記光学フィルタは、
複数の前記色に対応するフィルタであり、
前記受光素子ごとに入射する前記色を制御し、
前記マルチバンドパスフィルタは、
透過する周波数帯のピークのうち少なくとも 1 つが、それぞれの前記複数の色に対応するフィルタにおける透過光のピークと異なる周波数を有する、
電子機器。 - 前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
を、前記撮像素子の内部に備える、請求項15に記載の電子機器。 - 前記受光素子が出力する信号について、所定波長の光の強度を抽出する、波長抽出回路、
を、前記撮像素子の外部に備える、請求項15に記載の電子機器。
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JP2017032537A (ja) * | 2015-08-03 | 2017-02-09 | 采▲ぎょく▼科技股▲ふん▼有限公司VisEra Technologies Company Limited | スペクトル測定装置 |
JP2017526910A (ja) * | 2014-07-24 | 2017-09-14 | エコール・ポリテクニーク・フェデラル・ドゥ・ローザンヌ (ウ・ペ・エフ・エル)Ecole Polytechnique Federale De Lausanne (Epfl) | 撮像分光法用のコンパクトな多機能システム |
JP2018098344A (ja) * | 2016-12-13 | 2018-06-21 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子及び電子機器 |
JP2021022758A (ja) * | 2019-07-24 | 2021-02-18 | ソニー株式会社 | 画像処理装置、撮像装置、および画像処理方法、並びにプログラム |
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JP2017032537A (ja) * | 2015-08-03 | 2017-02-09 | 采▲ぎょく▼科技股▲ふん▼有限公司VisEra Technologies Company Limited | スペクトル測定装置 |
JP2018098344A (ja) * | 2016-12-13 | 2018-06-21 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子及び電子機器 |
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