WO2022228300A1 - 摄像头模组和电子设备 - Google Patents

摄像头模组和电子设备 Download PDF

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Publication number
WO2022228300A1
WO2022228300A1 PCT/CN2022/088426 CN2022088426W WO2022228300A1 WO 2022228300 A1 WO2022228300 A1 WO 2022228300A1 CN 2022088426 W CN2022088426 W CN 2022088426W WO 2022228300 A1 WO2022228300 A1 WO 2022228300A1
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WIPO (PCT)
Prior art keywords
lens
circuit board
image sensor
camera module
carrier
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Ceased
Application number
PCT/CN2022/088426
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English (en)
French (fr)
Inventor
杨泽
朱林波
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022228300A1 publication Critical patent/WO2022228300A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals

Definitions

  • the application belongs to the field of camera technology, and specifically relates to a camera module and an electronic device.
  • the automatic focusing function of the existing camera is mainly realized by the voice coil motor driving the lens to move, so that the relative position between the lens and the sensor changes.
  • the above driving method has at least the following defects: due to the heavy weight of the lens, the reliability of the movable lens is poor, and the impact with other structures is more serious in the process of falling.
  • the purpose of the embodiments of the present application is to provide a camera module and an electronic device, which can solve the problem that when a camera adopts a movable lens in the prior art, due to the heavy weight of the lens, the reliability of the movable lens is poor, and the Structural impact is a more serious problem.
  • an embodiment of the present application provides a camera module, where the camera module includes: a lens, a lens fixing component, a photosensitive component, and a driving component;
  • the lens fixing assembly includes a casing and a base plate, the casing is arranged on the base plate, the casing is provided with an installation hole, and the lens is installed in the installation hole;
  • An accommodating cavity is formed by enclosing the lens, the casing and the substrate, the photosensitive component is disposed in the accommodating cavity, the photosensitive component includes a carrier and an image sensor, and the image sensor is disposed in the accommodating cavity. on the carrier and facing the lens;
  • the driving component is used for driving the carrier to drive the image sensor to move in the accommodating cavity along the optical axis direction of the lens.
  • the drive assembly includes a coil and a drive magnet, the drive magnet is disposed in the housing, the coil is disposed on the carrier, and the coil can be driven by the drive magnet when energized , so as to drive the carrier to move along the optical axis of the lens in the accommodating cavity.
  • the photosensitive assembly further includes a first circuit board, the image sensor is disposed on one side of the first circuit board, and the image sensor is electrically connected to the first circuit board.
  • the carrier is provided with a first stepped groove, and the first circuit board is installed in the first stepped groove.
  • the camera module further includes a second circuit board, the second circuit board is a flexible circuit board, the second circuit board is disposed on the substrate, and the second circuit board is close to the substrate
  • the outer edge region of the side surface of the first circuit board is connected to the substrate, and the side surface of the first circuit board away from the image sensor is connected to the central region of the side surface of the second circuit board away from the substrate.
  • the camera module further includes a position sensing module and a sensing magnet
  • the position sensing module is disposed on the first circuit board
  • the sensing magnet is disposed in the housing, and is located on the carrier.
  • the position sensing module determines the relative position between the image sensor and the lens by sensing changes in the magnetic field generated by the sensing magnet.
  • the camera module further includes a controller, and the controller is configured to control the driving assembly according to the imaging result of the image sensor and the relative position between the image sensor and the lens.
  • the photosensitive component further includes a filter, the filter is located between the image sensor and the lens, and the filter is perpendicular to the optical axis of the lens.
  • the carrier is provided with a second stepped groove, and the optical filter is installed in the second stepped groove.
  • the camera module further includes an elastic sheet, the elastic sheet is arranged in the housing, and when the carrier moves to a preset position along the optical axis of the lens in the direction of the lens, the elastic sheet is The carrier is abutted against the elastic piece.
  • an embodiment of the present application provides an electronic device, where the electronic device includes the camera module described in the first aspect.
  • FIG. 1 is an exploded schematic diagram of a camera module provided by an embodiment of the present application.
  • FIG. 2 is a schematic connection diagram of a lens fixing assembly provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of the connection between the lens and the housing provided by the embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a photosensitive assembly provided by an embodiment of the present application.
  • FIG. 5 is a schematic top view of a first circuit board provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a carrier provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a second circuit board provided by an embodiment of the present application.
  • FIG. 8 is a schematic bottom view of a first circuit board provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of the positions of the sensing magnet and the driving magnet according to the embodiment of the present application.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • FIG. 1 is an exploded schematic diagram of a camera module provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of a connection of a lens fixing assembly provided by an embodiment of the present application
  • FIG. 3 is provided by an embodiment of the present application
  • FIG. 4 is a schematic diagram of the structure of the photosensitive assembly provided by the embodiment of the present application. As shown in FIGS.
  • the camera module in the embodiment of the present application includes a lens 11 , a lens fixing component, a photosensitive component, and a driving component, wherein the lens fixing component is used to fix the lens 11 , and the lens fixing component It includes a casing 121 and a base plate 122, the casing 121 is fixed on one side of the base plate 122, the casing 121 is provided with a mounting hole, and the lens 11 is installed in the mounting hole; A accommodating cavity is formed between them, and the photosensitive component is disposed in the accommodating cavity.
  • the photosensitive component includes a carrier 131 and an image sensor 132.
  • the image sensor 132 is fixed on the carrier 131, and the image sensor 132 It is arranged opposite to the lens 11, that is, the optical axis of the lens 11 is perpendicular to the photosensitive surface of the image sensor 132, so as to convert the received optical signal into an electrical signal; the driving component is used to drive the carrier 131 to drive the image fixed on it.
  • the sensor 132 moves in the accommodating cavity along the optical axis direction of the lens 11, thereby changing the relative distance between the image sensor 132 and the lens 11, and realizing the automatic focusing function of the camera module.
  • the embodiment of the present application realizes automatic focusing by fixing the lens and moving the image sensor, which can reduce or even avoid collision with other structures in the process of falling, and can also reduce the driving power consumption, improve the imaging effect, and reduce the volume of the camera module. And enhance the reliability of the camera module.
  • the lens 11 is fixed to the housing 121 by glue 111 , which can reduce the secondary impact force when the lens 11 hits other components during the falling process of the camera module.
  • the driving assembly includes a driving magnet 141 and a coil 142 , wherein the driving magnet 141 is fixedly arranged in the casing 121 , specifically, may be arranged on the inner wall of the casing 121 , and the coil 142 is fixedly arranged in the casing 121 .
  • the carrier 131 can be wound around the outer wall of the carrier 131 , and the coil 142 is located in the surrounding area of the driving magnet 141 , and the central axis of the coil 142 coincides with the optical axis of the lens 11 .
  • the coil 142 When the coil 142 is powered on, the coil 142 can be driven by the driving magnet 141 , thereby driving the carrier 131 fixed to the coil 142 to move along the optical axis of the lens 11 in the accommodating cavity to realize the carrier 131 Changes in the relative position between the image sensor 132 on the lens 11 and the lens 11 . Therefore, in the embodiment of the present application, the separate drive magnet 141 and coil 142 are used to replace the voice coil motor in the prior art, which can effectively reduce the volume occupied by the drive assembly, thereby reducing the volume of the camera module, and It is the image sensor 132 that needs to be driven, so the required driving force is small, so that the driving power consumption can be reduced.
  • FIG. 5 is a schematic top view of a first circuit board according to an embodiment of the present application.
  • the photosensitive component further includes a first circuit board 133 , the image sensor 132 is disposed on the first circuit board 133 , and the image sensor 132 is connected to the first circuit board 133 . It is electrically connected to transmit and transfer the electrical signals generated by the image sensor 132 .
  • FIG. 6 is a schematic structural diagram of a carrier provided by an embodiment of the present application.
  • a through hole is formed in the middle of the carrier 131
  • a first stepped groove 1311 is formed on one end surface of the carrier 131
  • the first circuit board 133 is installed on the first side of the carrier 131 . in the stepped groove 1311.
  • the light transmitted by the lens 11 is irradiated to the image sensor 131 on the first circuit board 133 through the through hole in the middle of the carrier 131 to realize light sensing.
  • the photosensitive component further includes a filter 134, the filter 134 is located between the image sensor 132 and the lens 11, and the filter 134 is perpendicular to the optical axis of the lens 11. 134 is used to filter some specific light to improve image quality.
  • the end surface of the carrier 131 with the first stepped groove 1311 is further provided with a second stepped groove 1312 , and the filter 134 is installed in the second stepped groove 1312 . Since the embodiment of the present application does not require a bracket for fixing the filter, and there is no step between the lens 11 and the image sensor 132, the height of the camera module can be reduced.
  • the outer circumference of the carrier 131 is further provided with a coil winding slot 1313, and the coil winding slot 1313 is used for winding and fixing the coil 142;
  • the coil 142 wound in the coil winding slot 1313 can be connected to a power source through the coil wiring stud 1314 .
  • FIG. 7 is a schematic structural diagram of a second circuit board provided by an embodiment of the present application
  • FIG. 8 is a schematic bottom view of a first circuit board provided by an embodiment of the present application. As shown in FIGS.
  • the camera module further includes a second circuit board 15 , the second circuit board 15 is a flexible circuit board, and the second circuit board 15 is disposed on the substrate 122 , and the second circuit board 15 is partially covered by the housing 121, that is, the second circuit board 15 is partially located in the accommodating cavity; in the part of the second circuit board 15 located in the accommodating cavity, close to The outer edge area of one side of the substrate 122 is fixedly connected to the substrate 122 , while the central area of one side close to the substrate 122 is not connected to the substrate 122 , and the side of the first circuit board 133 away from the image sensor 132 is away from the second circuit board 15 .
  • the central area of the side surface of the substrate 122 (that is, the above-mentioned central area not connected to the substrate 122 ) is connected.
  • the side of the first circuit board 133 facing away from the image sensor 132 is provided with a circuit connection port 1331 .
  • the first circuit board 133 is the The circuit connection port 1331 is connected to the central area of the second circuit board 15 in the accommodating cavity (ie, the black filled part in FIG. 7 ). Therefore, during the movement of the carrier 131 along the optical axis of the lens 11 in the accommodating cavity, when the carrier 131 moves away from the substrate 122, the first circuit board 133 fixed on the carrier 131 will move away from the substrate 122 synchronously.
  • the second circuit board 15 is connected to the second circuit board 15, and since the second circuit board 15 is a flexible circuit board and has a certain degree of bending, the part of the second circuit board 15 connected to the first circuit board 133 will be pulled, providing an obstacle The resistance of the first circuit board 133 to move, when the coil 142 is powered off, the carrier 131 will be pulled back due to the restoring force of the second circuit board 15. In the above process, the second circuit board 15 is used as a return spring. .
  • FIG. 9 is a schematic diagram of the positions of the sensing magnet and the driving magnet according to an embodiment of the present application.
  • the camera module further includes a position sensing module (not shown in the figure) and a sensing magnet 17 , and the position sensing module can be disposed in the first circuit
  • the sensing magnet 17 is arranged in the housing 121 , and can be specifically arranged on the inner wall of the housing 121 and above the driving magnet 141 , and the carrier 131 drives the image sensor 132 along the direction of the lens 11 .
  • the position sensing module can determine the relative position between the image sensor 132 and the lens 11 by sensing the change of the magnetic field generated by the sensing magnet 17, that is, it can be acquired in real time.
  • the position information of the image sensor 132 is convenient to control the displacement amount of the image sensor 132 . It should be noted that, since the auto-focusing method adopted in the embodiment of the present application is to drive the image sensor while the lens does not move, and the relative position between the sensing magnet 17 and the driving magnet 141 is fixed, there is no relative position between the two. Therefore, the accuracy of the position of the image sensor 132 measured by the position sensing module can be ensured.
  • the camera module further includes a controller, and the controller is configured to control the image sensor according to the imaging result of the image sensor and the relative position between the image sensor and the lens.
  • drive components e.g, the position sensing module feeds back the sensed position information of the image sensor 132 to the controller, and the controller can obtain the imaging result (eg, imaging quality) of the image sensor and the position information of the image sensor fed back by the position sensing module , and then according to the imaging results and whether the relative position between the image sensor and the lens meets the requirements, the coil 142 in the drive assembly is then controlled and adjusted to obtain the best relative position between the image sensor and the lens to achieve good focus. , so as to obtain better imaging results.
  • the imaging result eg, imaging quality
  • the position sensing module by setting the position sensing module to realize double closed-loop feedback: that is, the feedback of the imaging result (imaging quality) and the position feedback of the image sensor, the control accuracy of the camera module can be effectively improved, and the imaging quality can be improved.
  • the camera module further includes an elastic piece 16 , the elastic piece 16 is disposed in the housing 121 , and the carrier 131 is located along the optical axis of the lens 11 .
  • the carrier 131 is in contact with the elastic piece 16 , and the elastic piece 16 is elastically deformed to provide resistance against the carrier 131 from moving forward. Therefore, when the camera module is dropped, the elastic sheet 16 can protect the carrier 131 and the image sensor 132 thereon, and since the driving assembly of the present application has a large thrust, the elastic sheet 16 can be properly enhanced. rigidity to enhance its reliability.
  • the embodiment of the present application further provides an electronic device, which includes the camera module described in any of the above embodiments, and can achieve the same technical effect. To avoid repetition, details are not repeated here.
  • the electronic device in this embodiment of the present application may be a mobile electronic device or a non-mobile electronic device.
  • the mobile electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, an in-vehicle electronic device, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (personal digital assistant).
  • assistant, PDA personal digital assistant
  • the non-mobile electronic device may be a personal computer (personal computer, PC), a television (television, TV), a teller machine or a self-service machine, etc., which are not specifically limited in the embodiments of the present application.

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Abstract

本申请公开了一种摄像头模组和电子设备，属于摄像技术领域。所述摄像头模组包括：透镜、透镜固定组件、感光组件以及驱动组件；所述透镜固定组件包括壳体和基板，所述壳体设置于所述基板上，所述壳体设有安装孔，所述透镜安装在所述安装孔内；所述透镜、所述壳体以及所述基板之间围合形成容置腔体，所述感光组件设置于所述容置腔体内，所述感光组件包括载体和图像传感器，所述图像传感器设置于所述载体上；所述驱动组件用于驱动所述载体在所述容置腔体内沿所述透镜的光轴方向移动。

Description

摄像头模组和电子设备
相关申请的交叉引用
本申请主张在2021年04月29日在中国提交的中国专利申请No.202110475146.1的优先权，其全部内容通过引用包含于此。
技术领域
本申请属于摄像技术领域，具体涉及一种摄像头模组和电子设备。
背景技术
随着市场对于手机摄像头功能要求的日益提高，自动对焦功能作为拍照时最常用的功能已成为手机拍照、录像的必备选项。现有摄像头的自动对焦功能主要通过音圈电机驱动透镜移动，使透镜与传感器之间的相对位置产生变化来实现。但是，上述驱动方式至少存在以下缺陷：由于透镜重量大，可活动的透镜的可靠性较差，在跌落过程中与其他结构撞击更加严重。
发明内容
本申请实施例的目的是提供一种摄像头模组和电子设备，能够解决现有技术中摄像头采用活动透镜时，由于透镜重量大，可活动的透镜的可靠性较差，在跌落过程中与其他结构撞击更加严重的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供了一种摄像头模组，该摄像头模组包括：透镜、透镜固定组件、感光组件以及驱动组件；
所述透镜固定组件包括壳体和基板，所述壳体设置于所述基板上，所述壳体设有安装孔，所述透镜安装在所述安装孔内；
所述透镜、所述壳体以及所述基板之间围合形成容置腔体，所述感光组件设置于所述容置腔体内，所述感光组件包括载体和图像传感器，所述图像传感器设置于所述载体上且与所述透镜正对设置；
所述驱动组件用于驱动所述载体带动所述图像传感器在所述容置腔体内 沿所述透镜的光轴方向移动。
可选地，所述驱动组件包括线圈和驱动磁体，所述驱动磁体设置于所述壳体内，所述线圈设置于所述载体上，所述线圈在通电的情况下可被所述驱动磁体驱动，以带动所述载体在所述容置腔体内沿所述透镜的光轴移动。
可选地，所述感光组件还包括第一电路板，所述图像传感器设置于所述第一电路板一侧，且所述图像传感器与所述第一电路板电连接。
可选地，所述载体设有第一台阶槽，所述第一电路板安装在所述第一台阶槽内。
可选地，所述摄像头模组还包括第二电路板，所述第二电路板为柔性电路板，所述第二电路板设置于所述基板上，所述第二电路板靠近所述基板的侧面的外缘区域与所述基板连接，所述第一电路板远离所述图像传感器的侧面与所述第二电路板远离所述基板的侧面的中心区域连接。
可选地，所述摄像头模组还包括位置感知模块和感测磁体，所述位置感知模块设置于所述第一电路板上，所述感测磁体设置于所述壳体内，在所述载体带动所述图像传感器沿所述透镜的光轴移动的过程中，所述位置感知模块通过感知所述感测磁体产生的磁场的变化以确定所述图像传感器与所述透镜之间的相对位置。
可选地，所述摄像头模组还包括控制器，所述控制器用于根据所述图像传感器的成像结果以及所述图像传感器与所述透镜之间的相对位置控制所述驱动组件。
可选地，所述感光组件还包括滤光片，所述滤光片位于所述图像传感器和所述透镜之间，所述滤光片垂直于所述透镜的光轴。
可选地，所述载体设有第二台阶槽，所述滤光片安装在所述第二台阶槽内。
可选地，所述摄像头模组还包括弹片，所述弹片设置于所述壳体内，在所述载体沿所述透镜的光轴向所述透镜所在方向移动至预设位置的情况下，所述载体与所述弹片相抵。
第二方面，本申请实施例提供了一种电子设备，该电子设备包括如第一方面所述的摄像头模组。
在本申请实施例中，通过固定透镜、移动图像传感器的方式实现自动对焦，可以减轻甚至避免在跌落过程中与其他结构撞击，还可以降低驱动功耗，提升成像效果，减小摄像头模组体积以及增强摄像头模组的可靠性。
附图说明
图1为本申请实施例提供的一种摄像头模组的爆炸示意图；
图2为本申请实施例提供的透镜固定组件的连接示意图；
图3为本申请实施例提供的透镜与壳体的连接示意图；
图4为本申请实施例提供的感光组件的结构示意图；
图5为本申请实施例提供的第一电路板的俯视示意图；
图6为本申请实施例提供的载体的结构示意图；
图7为本申请实施例提供的第二电路板的结构示意图；
图8为本申请实施例提供的第一电路板的仰视示意图；
图9为本申请实施例提供的感测磁体和驱动磁体的位置示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的摄像头模组和电子设备进行详细地说明。
请参考图1至图4，图1为本申请实施例提供的一种摄像头模组的爆炸示意图，图2为本申请实施例提供的透镜固定组件的连接示意图，图3为本申请实施例提供的透镜与壳体的连接示意图，图4为本申请实施例提供的感光组件的结构示意图。如图1至图4所示，本申请实施例中的摄像头模组包括透镜11、透镜固定组件、感光组件以及驱动组件，其中，所述透镜固定组件用于固定透镜11，所述透镜固定组件包括壳体121和基板122，壳体121固定设置在基板122的一侧，壳体121设置有安装孔，透镜11即安装在所述安装孔内；而透镜11、壳体121以及基板122之间围合形成有一容置腔体，所述感光组件即设置于所述容置腔体内，所述感光组件包括载体131和图像传感器132，图像传感器132固定设置在载体131上，并且图像传感器132与透镜11正对设置，即透镜11的光轴与图像传感器132的感光面相垂直，以将接收到的光信号转换为电信号；所述驱动组件则用于驱动载体131带动其上固定的图像传感器132在所述容置腔体内沿透镜11的光轴方向移动，从而改变图像传感器132与透镜11之间的相对距离，实现摄像头模组的自动对焦功能。
由此，本申请实施例通过固定透镜、移动图像传感器的方式实现自动对焦，可以减轻甚至避免在跌落过程中与其他结构撞击，还可以降低驱动功耗，提升成像效果，减小摄像头模组体积以及增强摄像头模组的可靠性。
如图3所示，在本申请的一些实施例中，透镜11通过胶水111与壳体121固定，可以降低所述摄像头模组跌落过程中透镜11撞击其他部件时的二次冲击力。
本申请实施例的一些实施例中，所述驱动组件包括驱动磁体141和线圈142，其中，驱动磁体141固定设置于壳体121内，具体可以设置在壳体121的内壁，线圈142固定设置于载体131上，具体可以绕设在载体131的外壁，并且，线圈142位于驱动磁体141的围设区域内，线圈142的中心轴线与透镜11的光轴重合。在线圈142接通电源的情况下，线圈142可以被驱动磁体141所驱动，从而带动与所述线圈142固定的载体131在所述容置腔体内沿透镜11的光轴移动，以实现载体131上的图像传感器132与透镜11之间相对位置的改变。由此，本申请实施例采用分体设置的驱动磁体141和线圈142 来代替现有技术中的音圈电机，可以有效减小驱动组件所占用的体积，从而减小摄像头模组的体积，并且所需要驱动的是图像传感器132，因此所需的驱动力较小，从而可以降低驱动功耗。
请参考图5，图5为本申请实施例提供的第一电路板的俯视示意图。如图5所示，本申请的另一些实施例中，所述感光组件还包括第一电路板133，图像传感器132即设置于第一电路板133上，并且图像传感器132与第一电路板133电连接，从而将图像传感器132产生的电信号进行传输转移。
请参考图6，图6为本申请实施例提供的载体的结构示意图。如图6所示，本申请的一些实施例中，载体131中部开设有通孔，在载体131的一端面上开设有第一台阶槽1311，第一电路板133即安装在载体131的第一台阶槽1311内。由此，透镜11透过的光线经由载体131中部的通孔照射到第一电路板133上的图像传感器131，实现感光。
本申请的另一些实施例中，所述感光组件还包括滤光片134，滤光片134位于图像传感器132和透镜11之间，且滤光片134垂直于透镜11的光轴，滤光片134用于过滤部分特定光线，以提高成像质量。如图6所示，可选地，所述载体131的开设有第一台阶槽1311的一端面还设有第二台阶槽1312，滤光片134即安装在所述第二台阶槽1312内。本申请实施例由于不需要固定滤光片的支架，并且透镜11与图像传感器132之间也不存在台阶，因此可以降低摄像头模组的高度。
在一些可选地实施方式中，载体131的外周还开设有线圈绕线槽1313，线圈绕线槽1313用于缠绕固定线圈142；载体131的外周还设置有线圈接线绕线柱1314，以方便线圈绕线槽1313中缠绕的线圈142可以通过线圈接线绕线柱1314与电源进行连接。
请参考图7和图8，图7为本申请实施例提供的第二电路板的结构示意图，图8为本申请实施例提供的第一电路板的仰视示意图。如图1-8所示，本申请的另一些实施例中，所述摄像头模组还包括第二电路板15，第二电路板15为柔性电路板，第二电路板15设置于基板122上，并且第二电路板15部分被壳体121盖住，也即第二电路板15部分位于所述容置腔体内；在第二电路板15的位于所述容置腔体内的部分中，靠近基板122的一侧面的外缘区 域与基板122固定连接，而靠近基板122的一侧面的中心区域则不与基板122连接，第一电路板133远离图像传感器132的侧面与第二电路板15远离基板122的侧面的中心区域(即上述不与基板122连接的中心区域)连接，示例性的，第一电路板133背离图像传感器132的一侧设置有电路连接端口1331，第一电路板133即通过电路连接端口1331与位于所述容置腔体内的第二电路板15部分的中心区域(即图7中的黑色填充部分)连接。由此，载体131在所述容置腔体内沿透镜11的光轴移动过程中，在远离基板122时，载体131上固定的第一电路板133将同步远离基板122，而由于第一电路板133与第二电路板15连接，且由于第二电路板15为柔性电路板，具有一定的弯折度，因此，第二电路板15的连接第一电路板133的部分将被拉动，提供阻碍第一电路板133移动的阻力，当线圈142断电后，由于第二电路板15的恢复力的作用，载体131将被拉回，在上述过程中，第二电路板15相当于复位弹簧使用。
请参考图9，图9为本申请实施例提供的感测磁体和驱动磁体的位置示意图。如图9所示，本申请的一些实施例中，所述摄像头模组还包括位置感知模块(图中未示出)和感测磁体17，所述位置感知模块可以设置于所述第一电路板133上，所述感测磁体17设置于所述壳体121内，具体可以设置在壳体121的内壁并位于驱动磁体141上方，在载体131带动所述图像传感器132沿所述透镜11的光轴移动的过程中，所述位置感知模块可以通过感知所述感测磁体17产生的磁场的变化，从而确定所述图像传感器132与所述透镜11之间的相对位置，也即可以实时获取图像传感器132的位置信息，从而方便控制图像传感器132的位移量。需要说明的是，由于本申请实施例中采用的自动对焦方式是透镜不动而驱动图像传感器，而感测磁体17与驱动磁体141之间的相对位置固定不变，不存在两者之间相对运动而产生的磁干扰问题，因此可以确保所述位置感知模块测得的图像传感器132位置的准确度。
可选地，在一些实施例中，所述摄像头模组还包括控制器，所述控制器用于根据所述图像传感器的成像结果以及所述图像传感器与所述透镜之间的相对位置控制所述驱动组件。也就是说，所述位置感知模块将感测到的图像传感器132的位置信息反馈给控制器，控制器可以获取图像传感器的成像结 果(例如成像质量)以及位置感知模块反馈的图像传感器的位置信息，然后根据成像结果以及图像传感器与透镜之间的相对位置是否满足要求，继而对驱动组件中的线圈142进行控制调整，以获得最佳的图像传感器与透镜之间的相对位置，实现良好的对焦，从而获得更好的成像效果。由此，本申请实施例中，通过设置位置感知模块实现双闭环反馈：即成像结果(成像质量)反馈以及图像传感器的位置反馈，可以有效提高摄像头模组的控制精度，提高成像质量。
在本申请的一些可选实施例中，所述摄像头模组还包括弹片16，所述弹片16设置于所述壳体121内，在所述载体131沿所述透镜11的光轴向所述透镜11所在方向移动至预设位置的情况下，所述载体131与所述弹片16相抵，弹片16发生弹性形变以提供阻碍载体131继续前移的阻力。由此，在所述摄像头模组发生跌落时，弹片16可以对载体131及其上的图像传感器132进行保护，并且，由于本申请的驱动组件具有较大的推力，因而可以适当增强弹片16的刚性，以提升其可靠性。
在本申请实施例中，通过固定透镜、移动图像传感器的方式实现自动对焦，可以减轻甚至避免在跌落过程中与其他结构撞击，还可以降低驱动功耗，提升成像效果，减小摄像头模组体积以及增强摄像头模组的可靠性。
可选地，本申请实施例还提供一种电子设备，包括上述任一实施例中所述的摄像头模组，且能达到相同的技术效果，为避免重复，这里不再赘述。
本申请实施例中的电子设备可以是移动电子设备，也可以为非移动电子设备。示例性的，移动电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，非移动电子设备可以为个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等，本申请实施例不作具体限定。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情 况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。此外，需要指出的是，本申请实施方式中的方法和装置的范围不限按示出或讨论的顺序来执行功能，还可包括根据所涉及的功能按基本同时的方式或按相反的顺序来执行功能，例如，可以按不同于所描述的次序来执行所描述的方法，并且还可以添加、省去、或组合各种步骤。另外，参照某些示例所描述的特征可在其他示例中被组合。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (11)

  1. 一种摄像头模组，包括：透镜、透镜固定组件、感光组件以及驱动组件；
    所述透镜固定组件包括壳体和基板，所述壳体设置于所述基板上，所述壳体设有安装孔，所述透镜安装在所述安装孔内；
    所述透镜、所述壳体以及所述基板之间围合形成容置腔体，所述感光组件设置于所述容置腔体内，所述感光组件包括载体和图像传感器，所述图像传感器设置于所述载体上且与所述透镜正对设置；
    所述驱动组件用于驱动所述载体带动所述图像传感器在所述容置腔体内沿所述透镜的光轴方向移动。
  2. 根据权利要求1所述的摄像头模组，其中，所述驱动组件包括线圈和驱动磁体，所述驱动磁体设置于所述壳体内，所述线圈设置于所述载体上，所述线圈在通电的情况下可被所述驱动磁体驱动，以带动所述载体在所述容置腔体内沿所述透镜的光轴移动。
  3. 根据权利要求1或2所述的摄像头模组，其中，所述感光组件还包括第一电路板，所述图像传感器设置于所述第一电路板一侧，且所述图像传感器与所述第一电路板电连接。
  4. 根据权利要求3所述的摄像头模组，其中，所述载体设有第一台阶槽，所述第一电路板安装在所述第一台阶槽内。
  5. 根据权利要求3所述的摄像头模组，其中，还包括第二电路板，所述第二电路板为柔性电路板，所述第二电路板设置于所述基板上，所述第二电路板靠近所述基板的侧面的外缘区域与所述基板连接，所述第一电路板远离所述图像传感器的侧面与所述第二电路板远离所述基板的侧面的中心区域连接。
  6. 根据权利要求3所述的摄像头模组，其中，还包括位置感知模块和感测磁体，所述位置感知模块设置于所述第一电路板上，所述感测磁体设置于所述壳体内，在所述载体带动所述图像传感器沿所述透镜的光轴移动的过程中，所述位置感知模块通过感知所述感测磁体产生的磁场的变化以确定所述 图像传感器与所述透镜之间的相对位置。
  7. 根据权利要求6所述的摄像头模组，其中，还包括控制器，所述控制器用于根据所述图像传感器的成像结果以及所述图像传感器与所述透镜之间的相对位置控制所述驱动组件。
  8. 根据权利要求1所述的摄像头模组，其中，所述感光组件还包括滤光片，所述滤光片位于所述图像传感器和所述透镜之间，所述滤光片垂直于所述透镜的光轴。
  9. 根据权利要求8所述的摄像头模组，其中，所述载体设有第二台阶槽，所述滤光片安装在所述第二台阶槽内。
  10. 根据权利要求1所述的摄像头模组，其中，还包括弹片，所述弹片设置于所述壳体内，在所述载体沿所述透镜的光轴向所述透镜所在方向移动至预设位置的情况下，所述载体与所述弹片相抵。
  11. 一种电子设备，包括如权利要求1-10任一项所述的摄像头模组。
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