WO2022228266A1 - Dispositif de dissipation de chaleur, module d'alimentation et véhicule - Google Patents
Dispositif de dissipation de chaleur, module d'alimentation et véhicule Download PDFInfo
- Publication number
- WO2022228266A1 WO2022228266A1 PCT/CN2022/088157 CN2022088157W WO2022228266A1 WO 2022228266 A1 WO2022228266 A1 WO 2022228266A1 CN 2022088157 W CN2022088157 W CN 2022088157W WO 2022228266 A1 WO2022228266 A1 WO 2022228266A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling
- heat dissipation
- assembly
- upper cooling
- dissipation device
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 143
- 238000007789 sealing Methods 0.000 claims description 29
- 238000004891 communication Methods 0.000 claims description 10
- 239000004519 grease Substances 0.000 claims description 5
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000005489 elastic deformation Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000005483 Hooke's law Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003090 exacerbative effect Effects 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Definitions
- Fig. 2 is the exploded view of Fig. 1;
- the corrugated hose 23 includes a pipe body 231 and connecting pieces 232 at both ends, and the connecting pieces 232 are connected to the connecting parts.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
La présente invention se rapporte au domaine technique des composants électroniques, et se rapporte spécifiquement à un dispositif de dissipation de chaleur, à un module d'alimentation et à un véhicule. Le dispositif de dissipation de chaleur comprend une plaque de refroidissement inférieure, un ensemble de refroidissement supérieur et un ensemble de fixation élastique ; un premier canal d'écoulement de refroidissement est disposé sur une surface inférieure de la plaque de refroidissement inférieure ; l'ensemble de refroidissement supérieur est fixé au-dessus d'une surface supérieure de la plaque de refroidissement inférieure au moyen de l'ensemble de fixation élastique ; et l'ensemble de refroidissement supérieur comprend une pluralité de plaques de refroidissement supérieures, des canaux de refroidissement sont respectivement disposés dans la pluralité de plaques de refroidissement supérieures, les canaux de refroidissement communiquent entre eux pour former un second canal d'écoulement de refroidissement, et deux extrémités du second canal d'écoulement de refroidissement communiquent de manière étanche avec le premier canal d'écoulement de refroidissement. À l'aide de l'ensemble de fixation élastique, la présente invention peut permettre à l'ensemble de refroidissement supérieur de presser étroitement sur un dispositif d'alimentation pour suivre une déformation au moyen de la déformation élastique de l'ensemble de fixation élastique, évitant les dommages provoqués par une déformation raisonnable et une force de serrage excessive.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110463955.0 | 2021-04-28 | ||
| CN202110463955.0A CN113206053B (zh) | 2021-04-28 | 2021-04-28 | 一种散热装置、功率模块以及车辆 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022228266A1 true WO2022228266A1 (fr) | 2022-11-03 |
Family
ID=77029259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2022/088157 WO2022228266A1 (fr) | 2021-04-28 | 2022-04-21 | Dispositif de dissipation de chaleur, module d'alimentation et véhicule |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113206053B (fr) |
| WO (1) | WO2022228266A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113206053B (zh) * | 2021-04-28 | 2023-10-31 | 北京国家新能源汽车技术创新中心有限公司 | 一种散热装置、功率模块以及车辆 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825246A (zh) * | 2005-02-25 | 2006-08-30 | 富准精密工业(深圳)有限公司 | 用于若干发热元件的冷却装置 |
| JP2014154752A (ja) * | 2013-02-12 | 2014-08-25 | Calsonic Kansei Corp | 半導体冷却構造 |
| CN208118402U (zh) * | 2018-02-08 | 2018-11-20 | 东莞市中元电线电缆科技有限公司 | 一种铁氟龙电缆押出机冷却成型装置 |
| CN113206053A (zh) * | 2021-04-28 | 2021-08-03 | 北京新能源汽车技术创新中心有限公司 | 一种散热装置、功率模块以及车辆 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202004007471U1 (de) * | 2004-05-10 | 2004-09-02 | Richard Wöhr GmbH | Gefederte Wärmeleitvorrichtung mit Wärmeleitrohr zur Kühlung eines auf einer Grundplatte getragenen Prozessors |
| JP2014232833A (ja) * | 2013-05-30 | 2014-12-11 | カルソニックカンセイ株式会社 | 半導体装置 |
| CN111418058A (zh) * | 2017-12-01 | 2020-07-14 | 三菱电机株式会社 | 半导体装置及其制造方法 |
| CN109003952A (zh) * | 2018-07-12 | 2018-12-14 | 合肥甘来智能科技有限公司 | 一种静力平衡的逆变器igbt封装结构 |
| CN111653530A (zh) * | 2019-03-04 | 2020-09-11 | 上海旭禾汽车电子科技有限公司 | 一种电驱动双面散热igbt功率模块散热装置 |
| CN111755399B (zh) * | 2019-03-28 | 2022-06-21 | 比亚迪半导体股份有限公司 | 功率模块的散热模组、负载控制器及车辆 |
| CN110060967A (zh) * | 2019-05-24 | 2019-07-26 | 东莞市迈泰热传科技有限公司 | 一种双面冷却散热器 |
| CN210900122U (zh) * | 2019-09-23 | 2020-06-30 | 合肥阳光电动力科技有限公司 | 水冷散热器、双面水冷组件及功率装置 |
| CN112582359B (zh) * | 2020-12-07 | 2023-05-12 | 佛山市国星光电股份有限公司 | 一种支架及功率模块 |
-
2021
- 2021-04-28 CN CN202110463955.0A patent/CN113206053B/zh active Active
-
2022
- 2022-04-21 WO PCT/CN2022/088157 patent/WO2022228266A1/fr active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1825246A (zh) * | 2005-02-25 | 2006-08-30 | 富准精密工业(深圳)有限公司 | 用于若干发热元件的冷却装置 |
| JP2014154752A (ja) * | 2013-02-12 | 2014-08-25 | Calsonic Kansei Corp | 半導体冷却構造 |
| CN208118402U (zh) * | 2018-02-08 | 2018-11-20 | 东莞市中元电线电缆科技有限公司 | 一种铁氟龙电缆押出机冷却成型装置 |
| CN113206053A (zh) * | 2021-04-28 | 2021-08-03 | 北京新能源汽车技术创新中心有限公司 | 一种散热装置、功率模块以及车辆 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113206053A (zh) | 2021-08-03 |
| CN113206053B (zh) | 2023-10-31 |
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