WO2022227975A1 - 半导体加工设备的物料调度方法和装置 - Google Patents

半导体加工设备的物料调度方法和装置 Download PDF

Info

Publication number
WO2022227975A1
WO2022227975A1 PCT/CN2022/083292 CN2022083292W WO2022227975A1 WO 2022227975 A1 WO2022227975 A1 WO 2022227975A1 CN 2022083292 W CN2022083292 W CN 2022083292W WO 2022227975 A1 WO2022227975 A1 WO 2022227975A1
Authority
WO
WIPO (PCT)
Prior art keywords
scheduling task
scheduling
task
groups
list
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/083292
Other languages
English (en)
French (fr)
Inventor
崔琳
史思雪
刘慕雅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Naura Microelectronics Equipment Co Ltd
Original Assignee
Beijing Naura Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Naura Microelectronics Equipment Co Ltd filed Critical Beijing Naura Microelectronics Equipment Co Ltd
Priority to US18/557,333 priority Critical patent/US12197195B2/en
Publication of WO2022227975A1 publication Critical patent/WO2022227975A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present invention relates to the field of semiconductor manufacturing, in particular, to a material scheduling method and device for semiconductor processing equipment.
  • the existing material scheduling method is an enumeration method based on a search tree. All possible moving sequences of materials are exhausted by means of a search tree, and the branch with the shortest time is selected from the search results as the moving sequence of materials.
  • the optimal scheduling result cannot be obtained in real time.
  • Another material scheduling method is to use an N-step segmented scheduling strategy, that is, specify a search range that includes N steps of material movement, use a specified algorithm to simulate the material scheduling results within N steps, and evaluate the material scheduling results. Then select the optimal path as the material moving sequence according to the evaluation result.
  • this method is not a global search, only the local optimal scheduling result can be obtained, and the global optimal scheduling result cannot be guaranteed. In some cases, it may cause waste of resources and reduce equipment capacity.
  • the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a material scheduling method and device for semiconductor processing equipment, which can not only obtain the global optimal scheduling result, but also improve the calculation speed, so as to realize Get the optimal scheduling result in real time.
  • a material scheduling method for semiconductor processing equipment comprising the following steps:
  • each material group includes a plurality of materials, and a plurality of the materials are divided into a plurality of material groups, and each of the material groups is divided into a plurality of material groups.
  • the material grouping includes at least one of said materials;
  • each of the material scheduling task groups includes a plurality of material scheduling task groups, and the material groups are in one-to-one correspondence with the material scheduling task groups; each material scheduling task group includes at least one material scheduling task;
  • step S3 includes:
  • the first preset rule includes:
  • the quantity of the material scheduling task groups selected from each of the material scheduling task groups is equal to the ratio of the specified quantity to the quantity of the process recipe.
  • the second preset rule includes:
  • a material scheduling task group is selected from the material scheduling task group corresponding to the earliest completed material scheduling task group in the first scheduling task list, and the material scheduling task group is inserted into the second scheduling task list with all the material scheduling task groups.
  • the earliest completed material scheduling task grouping belongs to the last material scheduling task grouping of the same material scheduling task group;
  • the material scheduling task group corresponding to other material scheduling task groups in the second material list A material scheduling task group is selected from the task group, and the material scheduling task group is inserted at the end of the material scheduling task group belonging to the same material scheduling task group in the second material list.
  • the multiple material scheduling tasks in each of the material scheduling task groups include a processing task for processing materials and a transmission task for transporting materials;
  • step S34 in the sub-optimal scheduling result, for the earliest completed material scheduling task group, at the end time point, if other material scheduling task groups have the unfinished transmission task , then the end time point of completing all the transmission tasks is set as the feeding time point;
  • the end time point of the earliest completed material scheduling task group is set as the material replenishing time point.
  • the material scheduling method further includes:
  • a plurality of the material scheduling tasks in the material scheduling task group include a processing task of processing materials and a transmission task of transmitting materials;
  • the constraints of the mathematical model used by the solver to calculate the optimal scheduling result include:
  • the time period between the end time point of each of the processing tasks and the start time point of the processing task is equal to the sum of the material processing time and the residence time of the material in the process chamber;
  • the start time point of the material scheduling task group arranged in the back is the start time point of the material scheduling task group arranged in the front end time point;
  • Each of the process chambers can only perform one of the processing tasks within the same time period
  • each of the processing tasks corresponds to one of the process chambers
  • the transmission task includes a take-out task and a put-in task of materials, and the take-out task and the put-in task of the same material scheduling task group are performed by the same manipulator;
  • the start time point of the put-in task of each material is later than the end time point of the take-out task of the previous material
  • step S1 includes:
  • the materials in the same tablet box are divided into a plurality of the material groups according to the different process recipes;
  • the preset principles include:
  • the parallel relationship means that multiple process chambers are processed at the same time;
  • the serial relationship means that multiple process chambers are processed sequentially in a specified order;
  • the disabling function means disabling the At least one process station in the process chamber.
  • an embodiment of the present invention also provides a material scheduling device for semiconductor processing equipment, including:
  • the material list module is used to establish a material list, the material list includes a plurality of material groups corresponding to different process recipes, each of the material groups includes a plurality of materials, and a plurality of the materials are divided into a plurality of material groups, each of the material groupings includes at least one of the materials;
  • a scheduling list module configured to establish and output a first scheduling task list according to the process recipe and the material list, the first scheduling task list includes a plurality of material scheduling task groups, the material groups and the material scheduling tasks One-to-one correspondence between groups, each of the material scheduling task groups includes multiple material scheduling task groups, and the material groups are in one-to-one correspondence with the material scheduling task groups; each material scheduling task group includes at least one material scheduling task ;as well as
  • a solver configured to receive the first scheduling task list, calculate and output the optimal scheduling result that takes the shortest time to execute all the material scheduling tasks in the first scheduling task list, and analyze the optimal scheduling result Parse to get the movement sequence of all materials.
  • the technical solution of the material scheduling method and device for semiconductor processing equipment includes: S1. Establishing a material list, where the material list includes a plurality of material groups corresponding to different process recipes, and a plurality of material groups in each material group The material is divided into a plurality of material groups, and each material group includes at least one material; S2, a first scheduling task list is established according to the process formula and the material list, and the first scheduling task list includes a plurality of material scheduling task groups, and the material group is the same as the material group.
  • Material scheduling task groups are in one-to-one correspondence, each material scheduling task group includes multiple material scheduling tasks, and material groups correspond to material scheduling tasks one-to-one; S3.
  • Scheduling results compared with the enumeration method based on search tree, not only can the global optimal scheduling results be obtained, but also because the solver can directly obtain the output results only by inputting the relevant parameters, saving a lot of intermediate processes, which can improve the Therefore, the optimal scheduling result can be obtained in real time.
  • FIG. 1 is a schematic structural diagram of a semiconductor processing equipment
  • FIG. 2 is a schematic structural diagram of a loading and unloading chamber in the semiconductor processing equipment
  • FIG. 3 is a flowchart of a material scheduling method for semiconductor processing equipment provided by the first embodiment of the present invention.
  • FIG. 4 is a flowchart of step S1 in the first embodiment of the present invention.
  • step S3 is a flowchart of step S3 in the first embodiment of the present invention.
  • FIG. 6 is a schematic block diagram of a material scheduling device of a semiconductor processing equipment provided by a second embodiment of the present invention.
  • Semiconductor processing equipment is used to process materials (such as wafers). Taking a semiconductor processing equipment applied to a degumming process shown in FIG. 1 and FIG. 2 as an example, the semiconductor processing equipment is, for example, a cluster type equipment. Ground, the equipment mainly includes a transfer chamber 1, three process chambers (21, 22, 23), a loading and unloading chamber (Load Lock) 3, a transition chamber 4 and three loading and unloading positions (51, 52, 53 ).
  • a transfer chamber 1 three process chambers (21, 22, 23), a loading and unloading chamber (Load Lock) 3, a transition chamber 4 and three loading and unloading positions (51, 52, 53 ).
  • three process chambers surround the transfer chamber 1 and are used to process the materials, and each process chamber includes two process positions, which can be used Simultaneous processing is possible; alternatively, one of the process bits can be disabled during the same period of time, and only the other process bit is used for individual process processing.
  • This disabling method is called ST disable.
  • ST disable the relationship between multiple process chambers that can be processed at the same time.
  • materials can enter any process chamber for processing; multiple process chambers that can be processed sequentially in a specified order
  • the relationship between chambers is called a serial relationship. In this case, materials need to enter multiple process chambers for processing in the order specified above according to the specified path.
  • the transfer chamber 1 is provided with a vacuum manipulator (VTR) to transfer materials between each process chamber and the loading and unloading chamber 3;
  • VTR vacuum manipulator
  • the vacuum manipulator has two mechanical arms (Dirty hand and Clean hand), each mechanical Each arm has two access positions for a total of four access positions.
  • the Dirty hand is used to grab the unprocessed material
  • the Clean hand is used to grab the processed material.
  • the loading and unloading chamber 3 is provided with two cooling positions (31, 33) and two alignment positions (32, 34), wherein the alignment positions (Aligner Station) are used for materials to be introduced into the process chamber. Before the chamber, the position of the material is calibrated, and each calibration position can place one material.
  • the cooling station (Buffer Station) is used to cool the material in the process chamber after the material has completed the process and before returning to the loading and unloading position.
  • An atmospheric manipulator is arranged in the transition chamber 4 to transfer materials between the loading and unloading chamber 3 and each loading and unloading position.
  • Three loading and unloading positions ( 51 , 52 , 53 ) are used for placing cassettes, each of which holds a plurality of materials (eg, a maximum of 25 pieces).
  • the first embodiment of the present invention provides a material scheduling method for semiconductor processing equipment. As shown in FIG. 3 , the method includes the following steps:
  • the above material list includes a plurality of material groups corresponding to different process recipes, each material group includes a plurality of materials, the plurality of materials are divided into a plurality of material groups, and each material group includes at least one material.
  • step S1 specifically includes:
  • three loading and unloading positions (51, 52, 53) can respectively place three cassettes, and multiple materials (for example, up to 25 pieces) can be dispensed into each cassette.
  • Each item in the box has a cassette number.
  • the preset principles for material grouping may be determined according to specific circumstances.
  • the preset principles may include:
  • the above parallel relationship means that multiple process chambers are processed at the same time;
  • the above serial relationship means that multiple process chambers are processed sequentially in a specified order;
  • the above disabled function means that the process chambers are disabled within a period of time. At least one process bit, ie, ST, is disabled.
  • the number of materials allocated to the process chamber for processing is 1 ; If there is no ST disabled condition in a process chamber, the number of materials allocated to the process chamber for processing is 2.
  • the three process chambers ( 21 , 22 , 23 ) shown in FIG. 1 it is assumed that ST is not disabled in process chambers 21 and 22 , and ST is disabled in process chamber 23 .
  • the relationship between the chambers is a parallel relationship, then the three process chambers (21, 22, 23) can be processed at the same time, and the materials in each material group can enter any process chamber for processing.
  • the 10 materials can be equally divided into 6 material groups, which are (1, 2, PM21) (3, 4, PM22) ( 5, PM23) (6, 7, PM21) (8, 9, PM22) (10, PM23), wherein PM is a process chamber.
  • two materials numbered 1 and 2 two materials numbered 3 and 4, and one material numbered 5 respectively enter three process chambers (21, 22, 23) for simultaneous processing Processing; after the processing is completed, two materials numbered 6 and 7, two materials numbered 8 and 9, and one material numbered 10 enter three process chambers (21, 22, 23) respectively for simultaneous processing .
  • the above-mentioned first scheduling task list includes a plurality of material scheduling task groups, the above-mentioned material groups are in one-to-one correspondence with the material scheduling task groups, each material scheduling task group includes a plurality of material scheduling task groups, and the above-mentioned material groups are grouped with the material scheduling task group One-to-one correspondence; each material scheduling task group includes at least one material scheduling task.
  • each step corresponds to a part (machine) in the semiconductor processing equipment, and corresponds to a material scheduling task (task), which includes the parts used in the process ( machine) and processing time (including start time and end time).
  • task includes the parts used in the process ( machine) and processing time (including start time and end time).
  • the material scheduling task group corresponding to the above material group is called PJob; the material scheduling task group corresponding to each material group in each PJob is called ScheduleJob, and each material scheduling task in each ScheduleJob is called task.
  • the task contains information such as the sequential use of certain parts (machines) by the materials in the same material group and the processing time (including the start time point and the end time point) on each part. It can be seen that there are multiple ScheduleJob in each PJob, and there is at least one task in each ScheduleJob.
  • the chip box task group corresponding to the materials in the same chip box is called CJob, and the same CJob is divided into multiple PJob according to different process recipes, wherein the respective chip box number of each material in the N materials is CJob respectively.
  • R in the same PJob
  • Each ScheduleJob is arranged in the sequence of the number of ScheduleJob IDs, and the numbers are consecutive to form the above-mentioned first scheduling task list.
  • the above solver is used to establish a mathematical model according to the input related parameters, calculate and output an optimal scheduling result, and the optimal scheduling result can achieve the shortest time spent executing all the material scheduling tasks in the first scheduling task list.
  • the optimal scheduling result includes all scheduling schemes in which all materials are processed sequentially through the specified machine at the specified time.
  • the above solver is a device for executing a model solving method, which needs to be used in combination with the above steps S1 and S2, so that the solver can calculate the input related parameters (the first scheduling task list) and analysis, that is to say, it is necessary to use the above steps S1 and S2 to obtain the relevant parameters that can be processed by the solver, and then use the solver to calculate and output the optimal scheduling result, because the solver belongs to the well-known technology, It is not repeated here.
  • the storage structure of the included parts (machine) and the processing time (including the start time point and the end time point) on each part is converted into the input format of each material scheduling task (task) in the solver.
  • Each task contains machine ID, duration (processing time) and other information, and the task is the scheduling unit.
  • the input format is, for example, a Json format
  • the conversion method is, for example, a conversion function of a corresponding json library for conversion.
  • a first scheduling task list that can be processed by a solver for calculation and analysis can be obtained through the above steps S1 and S2, and then an optimal scheduling result can be calculated based on the above solver through the above step S3 , compared with the enumeration method based on the search tree, not only can the global optimal scheduling result be obtained, but also because the solver can directly obtain the output result only by inputting the relevant parameters, saving a lot of intermediate processes, which can improve the calculation speed , and then the optimal scheduling result can be obtained in real time.
  • the vacuum manipulator in the transfer chamber 1 has two manipulators, and when one manipulator fails, the other manipulator can be used to continue processing, so as to ensure that the production line does not stop production, in this case , the hand-free function can be used, i.e., only one robotic arm works.
  • the atmospheric manipulator (ATR) in the transition chamber 4 uses the hand-free function, assuming that the number of materials in a material group is 2, the atmospheric manipulator needs to transfer two times, one material each time, thus, the atmospheric manipulator The transfer time is twice as long as a set of transfer actions (including taking, rotating, and placing). If the vacuum robot (VTR) is installed in the transfer chamber 1 to use the hand-forbidden function, only the Clean hand will work. Since the Clean hand has two positions, it only needs to be transferred once, and two materials are transferred each time, thus, The transmission time of the vacuum manipulator is the time spent by a set of transmission actions (including taking, rotating, and placing). Based on the above situation, according to whether the manipulator uses the hand-free function, the corresponding parameter format (for example, the processing duration parameter of the task) can be input into the solver.
  • the corresponding parameter format for example, the processing duration parameter of the task
  • the optimal scheduling result is analyzed to obtain the movement sequence of all materials.
  • a specific parsing method can parse the initial time points and end time points of all tasks included in the optimal scheduling result output by the solver into a move sequence (also called a move list) according to the interface rules. Since the material movement actions in the moving sequence are divided into pick move, place move, process move, etc., different material movement actions are different from those of materials, manipulators and parts ( machine) and other related parameters are also different, and these related parameters belong to the above interface rules.
  • certain solvers may have limited computational speed, as shown in Table 2 below.
  • the solver is often unable to calculate all the material scheduling task groups contained in the first scheduling task list in a relatively short period of time, that is, In other words, in order to obtain calculation results in real time, the number of material scheduling task groups calculated by the solver must be less than the total number of material scheduling task groups.
  • the total number of material scheduling task groups contained in the first scheduling task list above is There are about 40, and it can be seen from the above table 1 that it takes 156s for the solver to calculate 12 material scheduling task groups. Obviously, it takes longer for the solver to calculate 40 material scheduling task groups, so it is impossible to achieve real-time optimization. Scheduling results.
  • the material scheduling method provided by the embodiment of the present invention adopts the method of selection and calculation to control the solving scale of the solver, that is to say, the solver is used to calculate a certain number of material scheduling task groups in batches to It is ensured that the solver spends a short time to calculate each time, so that the total time spent to complete the group calculation of all material scheduling tasks can be shortened, and then the optimal scheduling results can be obtained in real time.
  • step S3 specifically includes:
  • S31 select a specified number of material scheduling task groups from the above-mentioned first scheduling task list to form a second scheduling task list;
  • MaxJobNum The setting of the above specified number (called MaxJobNum) should meet the actual requirements for the time it takes for the solver to calculate the specified number of ScheduleJob.
  • the above specified number is 6. It can be seen from the above Table 1 that the solver calculates 6 materials. It only takes 1s to schedule task grouping, which can meet the requirements for computing time.
  • the material scheduling task groups corresponding to different process recipes (recipes) can be parallelized, and each Each process chamber can only be occupied by one material scheduling task group (PJob).
  • the above-mentioned first preset rule includes: selecting the same number of material scheduling task groups (ScheduleJob) from each material scheduling task group (PJob), wherein, assuming that the number of process recipes (recipes) is N, The number of material scheduling task groups (ScheduleJob) selected from the material scheduling task group (PJob) corresponding to each process recipe (recipe) is equal to the ratio of the above specified number (MaxJobNum) to the number N of process recipes (recipe), that is, equal to MaxJobNum/N.
  • the above sub-optimal scheduling result can realize that all material scheduling tasks in the second scheduling task list take the shortest time.
  • the solver Since the solver only calculates MaxJobNum schedulejobs in the above step S33, and the actual number of ScheduleJob included in the above first scheduling task list is much larger than MaxJobNum, in this case, in order to maximize production capacity, it cannot wait for the previous round
  • the next MaxJobNum schedulejobs are all executed before "feeding", that is, new MaxJobNum schedulejobs are added to ensure that the solver can perform the next round of calculations in time, which requires selecting an optimal feeding time point in time Carry out "feeding", based on this, in the above sub-optimal scheduling results, select an appropriate material scheduling task group, and take the end time point corresponding to the completion of the material scheduling task group as the above feeding time point.
  • the part before the above-mentioned feeding time point is selected from the above-mentioned sub-movement sequence obtained by analysis as an output sequence, and the output sequence is stored.
  • This part is a part of the sub-movement sequence that includes all the material movement actions before the feeding time point.
  • the solver calculates the second scheduling task list including MaxJobNum schedulejobs selected in a new round
  • the state of the semiconductor processing equipment at the above-mentioned feeding time point is used as the initial state for the second scheduling task.
  • the task list continues to be calculated to obtain a new output sequence.
  • the new output sequence and the output sequence of the previous round can be spliced together with the feeding time point as the dividing line. In this way, the output sequences of all rounds can form one
  • a continuous sequence is the movement sequence of all materials.
  • the multiple material scheduling tasks (tasks) in each material scheduling task group include processing tasks for processing materials and transferring materials. That is to say, some material scheduling tasks are processing tasks, and some material scheduling tasks are transmission tasks.
  • the end time point when all transmission tasks are completed is set as the above-mentioned feeding time point. That is to say, if a ScheduleJob completes all tasks at the earliest, and all transmission tasks in other ScheduleJobs are completed, the end time point of this ScheduleJob is set as the feeding time point.
  • the end time point of the earliest completed material scheduling task group (ScheduleJob) is set as the above-mentioned feeding time point.
  • step S35 determine whether there is a material scheduling task group in the above-mentioned first scheduling task list, if so, go to step S36; if not, go to step S38;
  • step S37 is used to insert the newly selected schedulejob into the corresponding position in the second scheduling task list.
  • the second scheduling task list contains the newly selected schedulejob, and then returns to the above-mentioned step S32 to enter the next cycle, and proceeds to the next cycle.
  • step S33 a second scheduling task list including the newly selected schedulejob is input to the above solver to obtain a new output sequence.
  • the above-mentioned second preset rules include:
  • the material scheduling task group corresponding to the above-mentioned earliest completed material scheduling task group is empty. Then select a material scheduling task group from the material scheduling task group corresponding to other material scheduling task groups in the second material list, and insert the material scheduling task group into the second material list and belong to the same material scheduling task group. The last of the material scheduling task grouping.
  • all output sequences can form a continuous sequence, which is the movement sequence of all materials.
  • the output sequences of two adjacent rounds can be spliced, for example, using the feeding time point as a dividing line.
  • the material scheduling method further includes:
  • material scheduling tasks there are many kinds of material scheduling tasks, as mentioned above, for example, there are processing tasks, transmission tasks, and chamber cleaning tasks. Based on this, the above-mentioned number of material scheduling tasks for processing tasks is the cumulative number of processing tasks among all the material scheduling tasks executed.
  • the constraints of the mathematical model used by the solver to calculate the above optimal scheduling result include but are not limited to:
  • the time between the end time point of each processing task and the start time point of the processing task is equal to the sum of the material processing time and the residence time of the material in the process chamber;
  • the start time point of the material scheduling task group arranged in the back is the end time of the material scheduling task group arranged in the front point;
  • Each process chamber can only perform one processing task in the same time period
  • each processing task corresponds to one process chamber
  • the transmission task is the take-out task or the put-in task of the material; the take-out task and the put-in task of the material in the same material scheduling task group are performed by the same manipulator;
  • the start time point of the loading task of each material is later than the ending time point of the removal task of the previous material
  • the material scheduling device 6 includes a material list module 61, a scheduling list module 62 and a solver 63, wherein the material list module 61 is used to establish a material list,
  • the material list includes multiple material groups corresponding to different process recipes, each material group includes multiple materials, the multiple materials are divided into multiple material groups, and each material group includes at least one material;
  • the scheduling list module 62 is used for Establish and output a first scheduling task list according to the process recipe and the material list.
  • the first scheduling task list includes a plurality of material scheduling task groups, the material groups correspond to the material scheduling task groups one-to-one, and each material scheduling task group includes a plurality of material scheduling task groups.
  • Material scheduling task grouping, and material grouping corresponds to the material scheduling task grouping one-to-one; each material scheduling task grouping includes at least one material scheduling task; the solver 63 is used to receive the above-mentioned first scheduling task list, calculate and output the execution of the above-mentioned first All material scheduling tasks in the scheduling task list take the optimal scheduling result with the shortest time, and analyze the optimal scheduling result to obtain the movement sequence of all materials.
  • solver 63 is a device for executing the model solving method, and since the device belongs to the known technology, it will not be repeated here.
  • the technical solutions of the material scheduling method and device for semiconductor processing equipment provided by the above-mentioned embodiments of the present invention can obtain the first schedule that can use the solver to perform processing such as calculation and analysis through the above-mentioned steps S1 and S2. task list, and then calculate the optimal scheduling result based on the above solver through the above step S3.
  • the enumeration method based on the search tree not only the global optimal scheduling result can be obtained, but also because the solver only needs to input the relevant parameters.
  • the output results are directly obtained, which saves a lot of intermediate processes, thereby improving the calculation speed and realizing the optimal scheduling results in real time.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Factory Administration (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)

Abstract

提供了一种半导体加工设备的物料调度方法和装置，包括以下步骤：S1、建立物料列表；S2、根据工艺配方和物料列表建立第一调度任务列表；S3、向求解器输入第一调度任务列表，利用求解器计算并输出执行第一调度任务列表中所有的物料调度任务花费时长最短的最优调度结果，并对最优调度结果解析获得所有物料的移动序列。提供一种半导体加工设备的物料调度方法和装置的技术方案，不仅可以得到全局最优调度结果，而且可以提高计算速度，从而可以实现实时得到最优调度结果。

Description

半导体加工设备的物料调度方法和装置 技术领域
本发明涉及半导体制造领域，具体地，涉及一种半导体加工设备的物料调度方法和装置。
背景技术
在使用半导体加工设备对多个物料(例如晶圆)进行加工的过程中，需要将每个物料从装卸载位按照指定路径传入工艺腔室进行加工，并在加工完成后返回装卸载位，而且在同一时间内会存在多个物料同时调度的需求。
为了实现物料调度的最优化，现有的物料调度方法是一种基于搜索树的枚举方法，具体是根据设定的物料传输路径以及设备中的各部件参数(例如，机械手传片时间)，采用搜索树的方式将物料可能的所有移动顺序穷举一遍，并从搜索结果中选择时间最短的分支作为物料的移动顺序。但是，由于全局搜索会耗费大量时间，导致无法实时得到最优调度结果。
还有一种物料调度方法是采用N步分段调度策略，即：指定一个包含物料移动N步的搜索范围，采用指定算法模拟N步之内的物料调度结果，并对该物料调度结果进行评价，然后根据评价结果选择最优的路径作为物料的移动顺序。但是，由于该方法不是全局搜索，只能得到局部最优调度结果，无法保证是全局最优调度结果，在某些情况下可能会造成资源浪费，降低了设备产能。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提出了一种半导体加工设备的物料调度方法和装置，其不仅可以得到全局最优调度结果，而 且可以提高计算速度，从而可以实现实时得到最优调度结果。
为实现本发明的目的而提供一种半导体加工设备的物料调度方法，包括以下步骤：
S1、建立物料列表，所述物料列表包括多个不同的工艺配方对应的物料组，每个所述物料组包括多个物料，多个所述物料被划分成多个物料分组，每个所述物料分组包括至少一个所述物料；
S2、根据所述工艺配方和所述物料列表建立第一调度任务列表，所述第一调度任务列表包括多个物料调度任务组，所述物料组与所述物料调度任务组一一对应，每个所述物料调度任务组包括多个物料调度任务分组，所述物料分组与所述物料调度任务分组一一对应；每个所述物料调度任务分组包括至少一个物料调度任务；
S3、向求解器输入所述第一调度任务列表，利用所述求解器计算并输出执行所述第一调度任务列表中所有的所述物料调度任务花费时长最短的最优调度结果，并对所述最优调度结果解析获得所有物料的移动序列。
可选的，所述步骤S3，包括：
S31、按第一预设规则从所述第一调度任务列表中选取指定数量的所述物料调度任务分组，组成第二调度任务列表；
S32、从所述第一调度任务列表中删除已选取的所述物料调度任务分组；
S33、向所述求解器输入所述第二调度任务列表，利用所述求解器计算并输出所述第二调度任务列表中所有的所述物料调度任务花费时长最短的子最优调度结果，并对所述子最优调度结果解析获得所述第二调度任务列表中所有物料的子移动序列；
S34、将所述子最优调度结果中最早完成的物料调度任务分组对应的结束时间点设定为补料时间点，并从所述子移动序列中筛选出在所述补料时间点以前的部分作为输出序列，且存储该输出序列；
S35、判断所述第一调度任务列表中是否还有所述物料调度任务分组，若有，则执行所述步骤S36；若没有，则执行所述步骤S38；
S36、从所述第二调度任务列表中删除所述最早完成的物料调度任务分组；
S37、按第二预设规则，从所述第一调度任务列表中重新选取一所述物料调度任务分组，并将重新选取的所述物料调度任务分组插入所述第二调度任务列表，然后返回所述步骤S32；
S38、将当前的所述子移动序列和之前存储的所有的所述输出序列拼接成所述移动序列。
可选的，所述第一预设规则包括：
从各个所述物料调度任务组中选取数量相同的所述物料调度任务分组；
其中，从各个所述物料调度任务组中选取的所述物料调度任务分组的数量等于所述指定数量与所述工艺配方的数量的比值。
可选的，所述第二预设规则包括：
从所述第一调度任务列表中所述最早完成的物料调度任务分组对应的物料调度任务组中选取一物料调度任务分组，将该物料调度任务分组插入在所述第二调度任务列表中与所述最早完成的物料调度任务分组属于同一物料调度任务组的物料调度任务分组的最后；
若所述第一调度任务列表中所述最早完成的物料调度任务分组对应的物料调度任务组中已没有物料调度任务分组，则从所述第二物料列表中其他物料调度任务分组对应的物料调度任务组中选取一物料调度任务分组，将该物料调度任务分组插入在所述第二物料列表中与之属于同一物料调度任务组的物料调度任务分组的最后。
可选的，每个所述物料调度任务分组中的多个所述物料调度任务包括加工物料的加工任务和传输物料的传输任务；
在所述步骤S34中，在所述子最优调度结果中，对于所述最早完成的物料调度任务分组，在其结束时间点，若其他的物料调度任务分组中有未完成的所述传输任务，则将完成所有的所述传输任务的结束时间点设定为所述补料时间点；
若其他的物料调度任务分组中没有未完成的所述传输任务，则将所述最早完成的物料调度任务分组的结束时间点设定为所述补料时间点。
可选的，所述物料调度方法还包括：
累计各个工艺腔室执行同一物料调度任务组中各所述物料调度任务分组中为加工任务的物料调度任务的次数；
判断各个所述工艺腔室的所述次数是否达到该物料调度任务组对应的工艺配方中预设的最大次数；
若达到，则在该物料调度任务组中的对应位置处插入为腔室清洗任务的物料调度任务。
可选的，所述物料调度任务分组中的多个所述物料调度任务包括加工物料的加工任务和传输物料的传输任务；
在所述步骤S3中，所述求解器计算所述最优调度结果所述采用的数学模型的约束条件包括：
每个所述加工任务的结束时间点与该加工任务的开始时间点之间的时长等于物料加工时长和物料在工艺腔室中的驻留时长之和；
对于每个所述物料调度任务组中任意相邻的两个所述物料调度任务分组，排列在后面的所述物料调度任务分组的开始时间点即为排列在前面的所述物料调度任务分组的结束时间点；
每个所述工艺腔室在同一时间段内只能执行一个所述加工任务；
若每个所述物料调度任务分组中的多个所述加工任务对应的工艺腔室之间是并列执行的关系，则每个所述加工任务对应一个所述工艺腔室；
所述传输任务包括物料的取出任务和放入任务，同一所述物料调度任务分组的所述取出任务和所述放入任务由同一机械手执行；
对于同一工艺腔室，每个物料的所述放入任务的开始时间点晚于上一个所述物料的所述取出任务的结束时间点；
在同一时间段内，用于传输物料的机械手中只有一个机械手臂在执行所述取出任务或所述放入任务。
可选的，所述步骤S1，包括：
S11，将多个物料按不同的片盒进行分配；
S12，将同一所述片盒中的物料按不同的所述工艺配方划分成多个所述物料组；
S13，将同一所述物料组中的多个所述物料按预设原则划分成多个所述物料分组。
可选的，所述预设原则包括：
根据各个工艺腔室之间是并行关系还是串行关系，以及各个工艺腔室是否开启禁用功能，将同一所述物料组中的多个所述物料划分成多个所述物料分组；
其中，所述并行关系是指多个工艺腔室同时进行加工；所述串行关系是指多个工艺腔室按指定顺序依次进行加工；所述禁用功能是指在一时间段内禁用所述工艺腔室中的至少一个工艺位。
作为另一个技术方案，本发明实施例还提供一种半导体加工设备的物料调度装置，包括：
物料列表模块，用于建立物料列表，所述物料列表包括多个不同的工艺配方对应的物料组，每个所述物料组包括多个物料，多个所述物料被划分成多个物料分组，每个所述物料分组包括至少一个所述物料；
调度列表模块，用于根据所述工艺配方和所述物料列表建立并输出第一 调度任务列表，所述第一调度任务列表包括多个物料调度任务组，所述物料组与所述物料调度任务组一一对应，每个所述物料调度任务组包括多个物料调度任务分组，所述物料分组与所述物料调度任务分组一一对应；每个所述物料调度任务分组包括至少一个物料调度任务；以及
求解器，用于接收所述第一调度任务列表，计算并输出执行所述第一调度任务列表中所有的所述物料调度任务花费时长最短的最优调度结果，并对所述最优调度结果解析获得所有物料的移动序列。
本发明具有以下有益效果：
本发明实施例提供的半导体加工设备的物料调度方法和装置的技术方案，包括：S1、建立物料列表，该物料列表包括多个不同的工艺配方对应的物料组，每个物料组中的多个物料被划分成多个物料分组，每个物料分组包括至少一个物料；S2、根据工艺配方和物料列表建立第一调度任务列表，该第一调度任务列表包括多个物料调度任务组，物料组与物料调度任务组一一对应，每个物料调度任务组包括多个物料调度任务，物料分组与物料调度任务一一对应；S3、向求解器输入第一调度任务列表，利用该求解器计算并输出执行第一调度任务列表中所有的物料调度任务花费时长最短的最优调度结果，并对最优调度结果解析获得所有物料的移动序列。本发明实施例采用的上述物料调度方法，可以通过上述步骤S1和步骤S2获得能够使用求解器进行计算和解析等的处理的第一调度任务列表，然后通过上述步骤S3基于上述求解器计算最优调度结果，这与基于搜索树的枚举方法相比，不仅可以得到全局最优调度结果，而且由于求解器只需输入相关参数就可以直接得到输出结果，省去了大量中间过程，从而可以提高计算速度，进而可以实现实时得到最优调度结果。
附图说明
图1为一种半导体加工设备的结构示意图；
图2为半导体加工设备中的装卸载腔室的结构示意图；
图3为本发明第一实施例提供的半导体加工设备的物料调度方法的流程框图；
图4为本发明第一实施例中的步骤S1的流程框图；
图5为本发明第一实施例中的步骤S3的流程框图；
图6为本发明第二实施例提供的半导体加工设备的物料调度装置的原理框图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图来对本发明实施例提供的半导体加工设备的物料调度方法和装置进行详细描述。
半导体加工设备用于对物料(例如晶圆)进行加工，以图1和图2示出的一种应用于去胶工艺的半导体加工设备为例，该半导体加工设备例如为集簇型设备，具体地，该设备主要包括传输腔室1、三个工艺腔室(21，22，23)、装卸载腔室(Load Lock)3、过渡腔室4和三个装卸载位(51，52，53)。
其中，三个工艺腔室(21，22，23)环绕在传输腔室1的周围，用于对物料进行工艺加工，每个工艺腔室中包括两个工艺位，可以使用这两个工艺位可以同时加工；或者，也可以在同一时间段内禁用其中一个工艺位，而仅使用另一个工艺位单独进行工艺加工，这种禁用方式称为ST禁用。在实际应用中，可以同时进行加工的多个工艺腔室之间的关系称为并行关系，此种情况下，物料可以进入任意一个工艺腔室进行加工；按指定顺序依次加工的多个工艺腔室之间的关系称为串行关系，此种情况下，物料需要按指定路径以上述指定顺序依次进入多个工艺腔室进行加工。
传输腔室1中设置有真空机械手(VTR)，用以在各个工艺腔室与装卸 载腔室3之间传输物料；该真空机械手具有两个机械手臂(Dirty手和Clean手)，每个机械手臂均具有两个取片位，共四个取片位。其中，Dirty手用于抓取未工艺的物料，Clean手用于抓取已工艺的物料。
如图2所示，装卸载腔室3中设置有两个冷却位(31,33)和两个校准位(32,34)，其中，校准位(Aligner Station)用于在物料传入工艺腔室之前，对物料进行位置校准，每个校准位能够放置一个物料。冷却位(Buffer Station)用于在工艺腔室中的物料完成工艺之后，且在返回装卸载位之前，对该物料进行冷却。
过渡腔室4中设置有大气机械手(ATR)，用以在装卸载腔室3与各个装卸载位之间传输物料。
三个装卸载位(51，52，53)用于放置片盒，每个片盒中放置有多个物料(例如最多25个)。
在使用上述半导体加工设备对多个物料进行加工的过程中，需要将每个物料从装卸载位按照指定路径传入工艺腔室进行加工，并在加工完成后返回装卸载位，而且在同一时间内会存在对多个物料同时调度的需求，在此前提下，需要实现物料调度的最优化，以能够合理利用半导体加工设备中的各个部件，以达到单位时间内加工较多的物料的目的。
为了达到上述目的，本发明第一实施例提供一种半导体加工设备的物料调度方法，如图3所示，该方法包括以下步骤：
S1、建立物料列表；
上述物料列表包括多个不同的工艺配方对应的物料组，每个物料组包括多个物料，多个物料被划分成多个物料分组，每个物料分组包括至少一个物料。
在一些实施例中，可选的，如图4所示，上述步骤S1，具体包括：
S11，将多个物料按不同的片盒进行分配；
例如，如图1所示，三个装卸载位(51，52，53)可分别放置三个片盒，可向每个片盒中分配多个物料(例如最多25个)，每个片盒中的各个物料均具有一个片盒编号。
S12，将同一片盒中的物料按不同的工艺配方划分成多个物料组；
即，同一物料组中的多个物料均采用同一工艺配方，且各自具有一个物料组编号；不同物料组中的多个物料采用的工艺配方不同。
S13，将同一物料组中的多个物料按预设原则划分成多个物料分组。
物料分组的上述预设原则可以根据具体情况而定，例如，该预设原则可以包括：
根据各个工艺腔室之间是并行关系还是串行关系，以及各个工艺腔室是否开启禁用功能，将同一物料组中的多个物料划分成多个物料分组；
其中，上述并行关系是指多个工艺腔室同时进行加工；上述串行关系是指多个工艺腔室按指定顺序依次进行加工；上述禁用功能是指在一时间段内禁用工艺腔室中的至少一个工艺位，即，ST禁用。
具体来说，以工艺腔室中包括两个工艺位为例，若某一工艺腔室的其中一个工艺位存在ST禁用的情况，则分配至该工艺腔室中进行加工的物料数量为1个；若某一工艺腔室不存在ST禁用的情况，则分配至该工艺腔室中进行加工的物料数量为2个。
以图1中示出的三个工艺腔室(21，22，23)为例，假设工艺腔室21和22不存在ST禁用的情况，工艺腔室23存在ST禁用的情况，若多个工艺腔室之间的关系为并行关系，则三个工艺腔室(21，22，23)可以同时进行加工，此时每个物料分组中的物料可以进入任意一个工艺腔室进行加工，在这种情况下，假设每个物料组中有10个物料(编号为1-10)，10个物料可以平均分配为6个物料分组，分别为(1,2，PM21)(3,4，PM22)(5，PM23)(6,7，PM21)(8,9，PM22)(10，PM23)，其中，PM为工艺腔室。在进行 工艺加工时，首先，编号为1和2的两个物料、编号为3和4的两个物料、编号为5的一个物料分别进入三个工艺腔室(21，22，23)同时进行加工；待加工完成之后，编号为6和7的两个物料、编号为8和9的两个物料、编号为10的一个物料分别进入三个工艺腔室(21，22，23)同时进行加工。
假设工艺腔室21和22存在ST禁用的情况，若多个工艺腔室之间的关系为串行关系，且两个工艺腔室(21，22)先后加工，在这种情况下，假设每个物料组中有6个物料(编号为1-6)，6个物料平均分配为3个物料分组，分别为(1,2，PM21-PM22)(3,4，PM21-PM22)(5,6，PM21-PM22)。在进行工艺加工时，首先，编号为1和2的两个物料先进入工艺腔室21进行加工，后进入工艺腔室22进行加工；待加工完成之后，编号为3和4的两个物料先进入工艺腔室21进行加工，后进入工艺腔室22进行加工；待加工完成之后，编号为5和6的两个物料先进入工艺腔室21进行加工，后进入工艺腔室22进行加工。
假设工艺腔室21不存在ST禁用的情况，若多个工艺腔室之间的关系为串行关系，且只有工艺腔室21进行加工，在这种情况下，假设每个物料组中有6个物料(编号为1-6)，6个物料平均分配为3个物料分组，分别为(1,2，PM21)(3,4，PM21)(5,6，PM21)。在进行工艺加工时，首先，编号为1和2的两个物料进入工艺腔室21进行加工；待加工完成之后，编号为3和4的两个物料进入工艺腔室21进行加工；待加工完成之后，编号为5和6的两个物料进入工艺腔室21进行加工。
S2、根据上述工艺配方和上述物料列表建立第一调度任务列表；
上述第一调度任务列表包括多个物料调度任务组，上述物料组与该物料调度任务组一一对应，每个物料调度任务组包括多个物料调度任务分组，上述物料分组与该物料调度任务分组一一对应；每个物料调度任务分组包括至少一个物料调度任务。
对于工艺配方(recipe)，其包含多个步骤(step)，每个步骤对应半导体加工设备中的一个部件(machine)，且对应一个物料调度任务(task)，该任务包含加工所使用的部件(machine)和加工时长(包括开始时间点和结束时间点)等的信息。
其中，与上述物料组对应的物料调度任务组称为PJob；每个PJob中的与每个物料分组对应的物料调度任务分组称为ScheduleJob，每个ScheduleJob中的各个物料调度任务称为task，这些task包含同一物料分组中的物料依次使用某几个部件(machine)以及在各个部件上的加工时长(包括开始时间点和结束时间点)等的信息。由此可知，每个PJob中有多个ScheduleJob，每个ScheduleJob中有至少一个task。
另外，同一片盒中的物料对应的片盒任务组称为CJob，同一CJob中按不同的工艺配方划分为多个PJob，其中，N个物料中的每个物料各自的片盒编号分别为CJob ID，其中，ID＝1,2,...,N；同一CJob中的M个物料的物料组编号为PJob ID，其中，ID＝1,2,...,M；同一PJob中的R个物料的物料分组编号为ScheduleJob ID，其中，ID＝1,2,...,R；需要说明的是，每个物料具有一个CJob ID和一个PJob ID，且同一PJob ID的物料来自同一个CJob ID，并且recipe相同。
按ScheduleJob ID的编号顺序排列各个ScheduleJob，且编号连续，构成上述第一调度任务列表。
S3、向求解器输入上述第一调度任务列表，利用该求解器计算并输出最优调度结果，并对该最优调度结果解析获得所有物料的移动序列。
上述求解器用于根据输入的相关参数建立数学模型，计算并输出最优调度结果，该最优调度结果可以实现执行第一调度任务列表中所有的物料调度任务花费时长最短。该最优调度结果包含所有物料在指定时间依次经过指定machine进行加工的所有调度方案。
需要说明的是，上述求解器是一种执行模型解算方法的装置，其需要与上述步骤S1和步骤S2结合使用，以使求解器能够对输入的相关参数(第一调度任务列表)进行计算和解析等的处理，也就是说，需要先利用上述步骤S1和步骤S2获得能够被求解器处理的相关参数，然后再利用求解器计算并输出最优调度结果，由于该求解器属于公知技术，在此不再赘述。
可选的，在向求解器输入上述第一调度任务列表之前，根据工艺配方对第一调度任务列表进行初始化，所谓初始化，是将上述第一调度任务列表中的各个物料调度任务(task)所包含的部件(machine)以及在各个部件上的加工时长(包括开始时间点和结束时间点)等的信息的存储结构转化为求解器中各个物料调度任务(task)的输入格式，格式转换之后，每个task中包含machine ID，duration(加工时长)等信息，且以task为调度单位。该输入格式例如为Json格式，转化方式例如采用相应json库的转化函数进行转化。
本发明实施例采用的物料调度方法可以通过上述步骤S1和步骤S2获得能够使用求解器进行计算和解析等的处理的第一调度任务列表，然后通过上述步骤S3基于上述求解器计算最优调度结果，这与基于搜索树的枚举方法相比，不仅可以得到全局最优调度结果，而且由于求解器只需输入相关参数就可以直接得到输出结果，省去了大量中间过程，从而可以提高计算速度，进而可以实现实时得到最优调度结果。
在一些实施例中，传输腔室1中的真空机械手具有两个机械手臂，当其中一个机械手臂出现故障时，还可以利用另一个机械手臂继续加工，从而保证生产线不停产，在这种情况下，可以使用禁手功能，即，只有一个机械手臂工作。
具体地，若过渡腔室4中的大气机械手(ATR)使用禁手功能，假设一个物料分组中的物料数量为2，则大气机械手需传递两次，每次传递一个物料，由此，大气机械手的传输时间是一套传输动作(包括取片、旋转、放片) 所花费时间的两倍。若传输腔室1中设置有真空机械手(VTR)使用禁手功能，则只有Clean手工作，由于该Clean手具有两个取片位，只需要传递一次，每次传递两个物料，由此，真空机械手的传输时间即为一套传输动作(包括取片、旋转、放片)所花费时间。基于上述情况，可以根据机械手是否使用禁手功能，以相应的参数格式(例如，task的加工时长(duaration)参数)输入至求解器中。
在上述步骤S3中，在利用求解器获得上述最优调度结果之后，对该最优调度结果进行解析，以获得所有物料的移动序列。具体的解析方式例如可以根据接口规则，将求解器输出的最优调度结果所包含的所有task的初始时间点和结束时间点解析成移动序列(又称move列表)。由于移动序列中的物料移动动作分为取片移动(pick move)、放片移动(place move)和工艺加工(process move)移动等等，不同的物料移动动作，与诸如物料、机械手和部件(machine)等的相关参数也不同，这些相关参数均属于上述接口规则。
在一些实施例中，可能会出现某些求解器的计算速度有限的情况，如下述表2所示。
表1、某些求解器计算不同数量的物料调度任务分组所花费的时间表。
Figure PCTCN2022083292-appb-000001
由上述表1可知，在要求计算速度满足实时得到最优调度结果的前提下，该求解器往往无法在较短的时间内计算上述第一调度任务列表所包含的所有物料调度任务分组，也就是说，若想实时获得计算结果，求解器计算物料调度任务分组的数量必须少于物料调度任务分组的总数，例如，在实际应用中， 上述第一调度任务列表所包含的物料调度任务分组的总数约为40个，而由上述表1可知，求解器计算12个物料调度任务分组就需要花费156s，显然求解器计算40个物料调度任务分组所要花费的时间更长，从而无法实现实时得到最优调度结果。
为了解决上述问题，本发明实施例提供的物料调度方法，采用选取和计算循环进行的方式来控制求解器的求解规模，也就是说，利用求解器分批计算一定数量的物料调度任务分组，以保证求解器每次花费很短的时间进行计算，从而可以缩短完成所有物料调度任务分组计算所花费的总时间，进而实现实时得到最优调度结果。
下面详细描述上述选取步骤和计算步骤循环进行的方式。具体地，如图5所示，上述步骤S3具体包括：
S31、按第一预设规则从上述第一调度任务列表中选取指定数量的物料调度任务分组，组成第二调度任务列表；
上述指定数量(称为MaxJobNum)的设定应满足对求解器计算该指定数量的ScheduleJob所花费的时间的实际要求，例如上述指定数量为6个，由上述表1可知，求解器计算6个物料调度任务分组只需要花费1s，可以满足对计算时间的要求。
由于上述第一调度任务列表满足：不同的工艺配方(recipe)之间在同一时间段内使用不同的工艺腔室，即，不同的工艺配方(recipe)对应的物料调度任务组可以并行，且每个工艺腔室只能被一个物料调度任务组(PJob)占用。基于此，可选的，上述第一预设规则包括：从各个物料调度任务组(PJob)中选取数量相同的物料调度任务分组(ScheduleJob)，其中，假设工艺配方(recipe)的数量为N，从各个工艺配方(recipe)对应的物料调度任务组(PJob)中选取的物料调度任务分组(ScheduleJob)的数量等于上述指定数量(MaxJobNum)与工艺配方(recipe)的数量N的比值，即，等于MaxJobNum/N。 需要说明的是，在从各个工艺配方(recipe)对应的物料调度任务组(PJob)中选取时，若某一工艺配方(recipe)对应的物料调度任务组(PJob)中的物料调度任务分组(ScheduleJob)的当前数量少于需要选取的数量(即，MaxJobNum/N)，则选取当前数量的物料调度任务分组(ScheduleJob)，即，将该物料调度任务组(PJob)中的物料调度任务分组全部选取。
S32、从上述第一调度任务列表中删除已选取的物料调度任务分组；
S33、向上述求解器输入上述第二调度任务列表(包含MaxJobNum个ScheduleJob)，利用该求解器计算并输出子最优调度结果，并对该子最优调度结果解析获得第二调度任务列表中所有物料的子移动序列；
上述子最优调度结果可以实现第二调度任务列表中所有的物料调度任务花费时长最短。
S34、将上述子最优调度结果中最早完成的物料调度任务分组(即，该物料调度任务分组中的全部物料调度任务均完成)对应的结束时间点设定为补料时间点，并从子移动序列中筛选出在该补料时间点以前的部分作为输出序列，且存储该输出序列；
由于求解器在上述步骤S33中只计算了MaxJobNum个schedulejob，而上述第一调度任务列表所包含的ScheduleJob的实际数量远大于MaxJobNum，在这种情况下，为了实现产能最大化，不能等待上一轮次的MaxJobNum个schedulejob全部执行完毕之后才“补料”，即，补入新的MaxJobNum个schedulejob，以保证求解器能够及时进行下一轮计算，这就需要选择一个最佳的补料时间点及时进行“补料”，基于此，在上述子最优调度结果中，选择一个合适的物料调度任务分组，将完成该物料调度任务分组对应的结束时间点作为上述补料时间点。
在上述补料时间点确定之后，从解析获得的上述子移动序列中筛选出在该补料时间点以前的部分作为输出序列，且存储该输出序列。该部分即为子 移动序列中包含在该补料时间点以前的所有的物料移动动作的一部分序列。
在实际应用中，求解器在计算包含新一轮次选取的MaxJobNum个schedulejob的第二调度任务列表时，将在上述补料时间点时的半导体加工设备的状态用作初始状态对该第二调度任务列表继续进行计算，以获得新的输出序列，新的输出序列与上一轮次的输出序列可以以该补料时间点作为分界线拼接在一起，这样，所有轮次的输出序列可以组成一个连续的序列，即为所有物料的移动序列。
选择一个最佳的补料时间点的方式有多种，例如，可选的，每个物料调度任务分组(ScheduleJob)中的多个物料调度任务(task)中包括加工物料的加工任务和传输物料的传输任务，也就是说，有的物料调度任务是加工任务，有的物料调度任务是传输任务。在这种情况下，在上述步骤S34中，在子最优调度结果中，对于最早完成的物料调度任务分组(ScheduleJob)，在其结束时间点，若其他的物料调度任务分组中有未完成的传输任务，则将完成所有的传输任务的结束时间点设定为上述补料时间点。也就是说，若有一个ScheduleJob最早完成全部的task，且其他的ScheduleJob中的所有传输任务执行完毕，则将该个ScheduleJob的结束时间点，设定为补料时间点。
若其他的物料调度任务分组中没有未完成的传输任务，则将最早完成的物料调度任务分组(ScheduleJob)的结束时间点设定为上述补料时间点。
S35、判断上述第一调度任务列表中是否有物料调度任务分组，若有，则执行步骤S36；若没有，则执行步骤S38；
上述第一调度任务列表中没有物料调度任务分组，即表示该第一调度任务列表为空。
S36、从上述第二调度任务列表中删除最早完成的物料调度任务分组；
S37、按第二预设规则，从第一调度任务列表中重新选取一物料调度任务分组，并将重新选取的物料调度任务分组插入在上述第二调度任务列表， 然后返回上述步骤S32；
上述步骤S37用于将新选取的schedulejob插入第二调度任务列表中的相应位置，此时第二调度任务列表中包含新选取的schedulejob，然后返回上述步骤S32进入下一循环，在下一循环进行至步骤S33时，向上述求解器输入包含新选取的schedulejob的第二调度任务列表，以获得新的输出序列。
将新选取的schedulejob插入至上一轮次对应的第二调度任务列表中的相应位置的方式有多种，例如，可选的，上述第二预设规则包括：
从第一调度任务列表中最早完成的物料调度任务分组对应的物料调度任务组(PJob)中重新选取一物料调度任务分组(ScheduleJob)，并将该物料调度任务分组插入在上述第二调度任务列表中与上述最早完成的物料调度任务分组属于同一物料调度任务组的物料调度任务分组的最后。也就是说，所选取的物料调度任务分组所属的物料调度任务组与所插入的物料调度任务组是同一种，且插入位置排在该物料调度任务组中所有物料调度任务分组的最后。
若上述第一调度任务列表中，上述最早完成的物料调度任务分组对应的物料调度任务组中已没有物料调度任务分组，即，上述最早完成的物料调度任务分组对应的物料调度任务组为空，则从上述第二物料列表中其他物料调度任务分组对应的物料调度任务组中选取一物料调度任务分组，并将该物料调度任务分组插入在上述第二物料列表中与之属于同一物料调度任务组的物料调度任务分组的最后。
S38、将当前的子移动序列和之前存储所有的输出序列拼接成上述移动序列。
如前述，所有的输出序列可以组成一个连续的序列，即为所有物料的移动序列。其中，相邻的两个轮次的输出序列例如可以以补料时间点作为分界线进行拼接。
可选的，为了保证各个工艺腔室的清洁度满足要求，物料调度方法还包括：
累计各个工艺腔室执行同一物料调度任务组中各物料调度任务分组中为加工任务的物料调度任务的次数；
判断各个工艺腔室的上述次数是否达到该物料调度任务组对应的工艺配方中预设的最大次数；
若达到，则在该物料调度任务组中的对应位置处插入为腔室清洗任务的物料调度任务。
需要说明的是，物料调度任务有多种，如前述，例如有加工任务、传输任务和腔室清洗任务等等。基于此，上述为加工任务的物料调度任务的次数，即为执行的所有物料调度任务中是加工任务的累计次数。
为了保证物料调度的正常执行，可选的，在上述步骤S3中，求解器计算上述最优调度结果采用的数学模型的约束条件包括但不限于：
(1)每个加工任务的结束时间点与该加工任务的开始时间点之间的时长等于物料加工时长和物料在工艺腔室中的驻留时长之和；
(2)对于每个物料调度任务组中任意相邻的两个物料调度任务，排列在后面的所述物料调度任务分组的开始时间点即为排列在前面的所述物料调度任务分组的结束时间点；
(3)每个工艺腔室在同一时间段内只能执行一个加工任务；
(4)若每个物料调度任务分组中的多个加工任务对应的工艺腔室之间是并列执行的关系，则每个加工任务对应一个工艺腔室；
(5)传输任务为物料的取出任务或者放入任务；同一物料调度任务分组中的物料的取出任务和放入任务由同一机械手执行；
(6)对于同一工艺腔室，每个物料的放入任务的开始时间点晚于上一个物料的取出任务的结束时间点；
(7)在同一时间段内，用于传输物料的机械手中只有一个机械手臂在执行上述取出任务或上述放入任务。
需要说明的是，以上约束条件的实现形式为求解器采用的数学模型中的各种数学等式或者不等式，本实施例利用上述文字描述来表示其含义。
本发明第二实施例提供一种物料调度装置，请参阅图6，该物料调度装置6包括物料列表模块61、调度列表模块62和求解器63，其中，物料列表模块61用于建立物料列表，该物料列表包括多个不同的工艺配方对应的物料组，每个物料组包括多个物料，多个物料被划分成多个物料分组，每个物料分组包括至少一个物料；调度列表模块62用于根据工艺配方和物料列表建立并输出第一调度任务列表，该第一调度任务列表包括多个物料调度任务组，该物料组与物料调度任务组一一对应，每个物料调度任务组包括多个物料调度任务分组，物料分组与该物料调度任务分组一一对应；每个物料调度任务分组包括至少一个物料调度任务；求解器63用于接收上述第一调度任务列表，计算并输出执行上述第一调度任务列表中所有的物料调度任务花费时长最短的最优调度结果，并对该最优调度结果解析获得所有物料的移动序列。
需要说明的是，上述求解器63是一种执行模型解算方法的装置，由于该装置属于公知技术，在此不再赘述。
综上所述，本发明上述各个实施例提供的半导体加工设备的物料调度方法和装置的技术方案，可以通过上述步骤S1和步骤S2获得能够使用求解器进行计算和解析等的处理的第一调度任务列表，然后通过上述步骤S3基于上述求解器计算最优调度结果，这与基于搜索树的枚举方法相比，不仅可以得到全局最优调度结果，而且由于求解器只需输入相关参数就可以直接得到输出结果，省去了大量中间过程，从而可以提高计算速度，进而可以实现实时得到最优调度结果。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示 例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (10)

  1. 一种半导体加工设备的物料调度方法，其特征在于，包括以下步骤：
    S1、建立物料列表，所述物料列表包括多个不同的工艺配方对应的物料组，每个所述物料组包括多个物料，多个所述物料被划分成多个物料分组，每个所述物料分组包括至少一个所述物料；
    S2、根据所述工艺配方和所述物料列表建立第一调度任务列表，所述第一调度任务列表包括多个物料调度任务组，所述物料组与所述物料调度任务组一一对应，每个所述物料调度任务组包括多个物料调度任务分组，所述物料分组与所述物料调度任务分组一一对应；每个所述物料调度任务分组包括至少一个物料调度任务；
    S3、向求解器输入所述第一调度任务列表，利用所述求解器计算并输出执行所述第一调度任务列表中所有的所述物料调度任务花费时长最短的最优调度结果，并对所述最优调度结果解析获得所有物料的移动序列。
  2. 根据权利要求1所述的物料调度方法，其特征在于，所述步骤S3，包括：
    S31、按第一预设规则从所述第一调度任务列表中选取指定数量的所述物料调度任务分组，组成第二调度任务列表；
    S32、从所述第一调度任务列表中删除已选取的所述物料调度任务分组；
    S33、向所述求解器输入所述第二调度任务列表，利用所述求解器计算并输出所述第二调度任务列表中所有的所述物料调度任务花费时长最短的子最优调度结果，并对所述子最优调度结果解析获得所述第二调度任务列表中所有物料的子移动序列；
    S34、将所述子最优调度结果中最早完成的物料调度任务分组对应的结束时间点设定为补料时间点，并从所述子移动序列中筛选出在所述补料时间点以前的部分作为输出序列，且存储该输出序列；
    S35、判断所述第一调度任务列表中是否还有所述物料调度任务分组，若有，则执行所述步骤S36；若没有，则执行所述步骤S38；
    S36、从所述第二调度任务列表中删除所述最早完成的物料调度任务分组；
    S37、按第二预设规则，从所述第一调度任务列表中重新选取一所述物料调度任务分组，并将重新选取的所述物料调度任务分组插入所述第二调度任务列表，然后返回所述步骤S32；
    S38、将当前的所述子移动序列和之前存储的所有的所述输出序列拼接成所述移动序列。
  3. 根据权利要求2所述的物料调度方法，其特征在于，所述第一预设规则包括：
    从各个所述物料调度任务组中选取数量相同的所述物料调度任务分组；
    其中，从各个所述物料调度任务组中选取的所述物料调度任务分组的数量等于所述指定数量与所述工艺配方的数量的比值。
  4. 根据权利要求3所述的物料调度方法，其特征在于，所述第二预设规则包括：
    从所述第一调度任务列表中所述最早完成的物料调度任务分组对应的物料调度任务组中选取一物料调度任务分组，将该物料调度任务分组插入在所述第二调度任务列表中与所述最早完成的物料调度任务分组属于同一物料调度任务组的物料调度任务分组的最后；
    若所述第一调度任务列表中所述最早完成的物料调度任务分组对应的物料调度任务组中已没有物料调度任务分组，则从所述第二物料列表中其他物料调度任务分组对应的物料调度任务组中选取一物料调度任务分组，将该物料调度任务分组插入在所述第二物料列表中与之属于同一物料调度任务 组的物料调度任务分组的最后。
  5. 根据权利要求2所述的物料调度方法，其特征在于，每个所述物料调度任务分组中的多个所述物料调度任务包括加工物料的加工任务和传输物料的传输任务；
    在所述步骤S34中，在所述子最优调度结果中，对于所述最早完成的物料调度任务分组，在其结束时间点，若其他的物料调度任务分组中有未完成的所述传输任务，则将完成所有的所述传输任务的结束时间点设定为所述补料时间点；
    若其他的物料调度任务分组中没有未完成的所述传输任务，则将所述最早完成的物料调度任务分组的结束时间点设定为所述补料时间点。
  6. 根据权利要求1所述的物料调度方法，其特征在于，所述物料调度方法还包括：
    累计各个工艺腔室执行同一物料调度任务组中各所述物料调度任务分组中为加工任务的物料调度任务的次数；
    判断各个所述工艺腔室的所述次数是否达到该物料调度任务组对应的工艺配方中预设的最大次数；
    若达到，则在该物料调度任务组中的对应位置处插入为腔室清洗任务的物料调度任务。
  7. 根据权利要求1所述的物料调度方法，其特征在于，所述物料调度任务分组中的多个所述物料调度任务包括加工物料的加工任务和传输物料的传输任务；
    在所述步骤S3中，所述求解器计算所述最优调度结果所述采用的数学模型的约束条件包括：
    每个所述加工任务的结束时间点与该加工任务的开始时间点之间的时 长等于物料加工时长和物料在工艺腔室中的驻留时长之和；
    对于每个所述物料调度任务组中任意相邻的两个所述物料调度任务分组，排列在后面的所述物料调度任务分组的开始时间点即为排列在前面的所述物料调度任务分组的结束时间点；
    每个所述工艺腔室在同一时间段内只能执行一个所述加工任务；
    若每个所述物料调度任务分组中的多个所述加工任务对应的工艺腔室之间是并列执行的关系，则每个所述加工任务对应一个所述工艺腔室；
    所述传输任务包括物料的取出任务和放入任务，同一所述物料调度任务分组的所述取出任务和所述放入任务由同一机械手执行；
    对于同一工艺腔室，每个物料的所述放入任务的开始时间点晚于上一个所述物料的所述取出任务的结束时间点；
    在同一时间段内，用于传输物料的机械手中只有一个机械手臂在执行所述取出任务或所述放入任务。
  8. 根据权利要求1所述的物料调度方法，所述步骤S1，包括：
    S11，将多个物料按不同的片盒进行分配；
    S12，将同一所述片盒中的物料按不同的所述工艺配方划分成多个所述物料组；
    S13，将同一所述物料组中的多个所述物料按预设原则划分成多个所述物料分组。
  9. 根据权利要求8所述的物料调度方法，所述预设原则包括：
    根据各个工艺腔室之间是并行关系还是串行关系，以及各个工艺腔室是否开启禁用功能，将同一所述物料组中的多个所述物料划分成多个所述物料分组；
    其中，所述并行关系是指多个工艺腔室同时进行加工；所述串行关系是 指多个工艺腔室按指定顺序依次进行加工；所述禁用功能是指在一时间段内禁用所述工艺腔室中的至少一个工艺位。
  10. 一种半导体加工设备的物料调度装置，其特征在于，包括：
    物料列表模块，用于建立物料列表，所述物料列表包括多个不同的工艺配方对应的物料组，每个所述物料组包括多个物料，多个所述物料被划分成多个物料分组，每个所述物料分组包括至少一个所述物料；
    调度列表模块，用于根据所述工艺配方和所述物料列表建立并输出第一调度任务列表，所述第一调度任务列表包括多个物料调度任务组，所述物料组与所述物料调度任务组一一对应，每个所述物料调度任务组包括多个物料调度任务分组，所述物料分组与所述物料调度任务分组一一对应；每个所述物料调度任务分组包括至少一个物料调度任务；以及
    求解器，用于接收所述第一调度任务列表，计算并输出执行所述第一调度任务列表中所有的所述物料调度任务花费时长最短的最优调度结果，并对所述最优调度结果解析获得所有物料的移动序列。
PCT/CN2022/083292 2021-04-27 2022-03-28 半导体加工设备的物料调度方法和装置 Ceased WO2022227975A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US18/557,333 US12197195B2 (en) 2021-04-27 2022-03-28 Material scheduling method and device of semiconductor processing equipment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110457592.X 2021-04-27
CN202110457592.XA CN112987674B (zh) 2021-04-27 2021-04-27 半导体加工设备的物料调度方法和装置

Publications (1)

Publication Number Publication Date
WO2022227975A1 true WO2022227975A1 (zh) 2022-11-03

Family

ID=76340260

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2022/083292 Ceased WO2022227975A1 (zh) 2021-04-27 2022-03-28 半导体加工设备的物料调度方法和装置

Country Status (4)

Country Link
US (1) US12197195B2 (zh)
CN (1) CN112987674B (zh)
TW (1) TWI815378B (zh)
WO (1) WO2022227975A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116435235A (zh) * 2023-03-30 2023-07-14 上海普达特半导体设备有限公司 用于半导体处理设备的传输装置以及半导体处理设备

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112987674B (zh) * 2021-04-27 2021-09-17 北京北方华创微电子装备有限公司 半导体加工设备的物料调度方法和装置
CN113658890B (zh) * 2021-08-17 2023-09-29 长鑫存储技术有限公司 提高半导体设备产能的方法和系统
CN113871330B (zh) * 2021-08-30 2025-09-16 北京北方华创微电子装备有限公司 一种物料调度方法和一种半导体工艺设备
CN114462781A (zh) * 2021-12-28 2022-05-10 西安北方华创微电子装备有限公司 一种任务调度方法和半导体工艺设备
CN114757483B (zh) * 2022-03-16 2025-08-08 西安北方华创微电子装备有限公司 一种半导体工艺设备的物料调度方法和半导体工艺设备
CN115555981B (zh) * 2022-10-31 2025-05-27 上海华力微电子有限公司 基于派工规则的自适应铜化学机械抛光设备智能排程控制方法
CN116029538A (zh) * 2022-12-30 2023-04-28 北京北方华创微电子装备有限公司 工艺启动、排程方法、电子设备、存储介质和工艺设备
CN116611200A (zh) * 2023-02-28 2023-08-18 北京北方华创微电子装备有限公司 半导体工艺设备的物料调度方法及半导体工艺设备
CN120033104B (zh) * 2023-11-22 2025-12-12 北京北方华创微电子装备有限公司 调度方法、装置、半导体工艺设备及计算机可读存储介质
CN120439315B (zh) * 2025-07-09 2025-09-16 埃克斯控股(北京)有限公司 机械手动作序列生成方法、装置、设备及存储介质

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020198757A1 (en) * 2001-06-26 2002-12-26 International Business Machines Corporation Method for allocating limited component supply and capacity to optimize production scheduling
JP2007102435A (ja) * 2005-10-04 2007-04-19 Kobe Steel Ltd 生産スケジューリング装置及び生産スケジューリング方法、並びにプログラム
CN101751025A (zh) * 2008-12-12 2010-06-23 北京北方微电子基地设备工艺研究中心有限责任公司 一种硅片优化调度的方法和装置
JP2015005085A (ja) * 2013-06-20 2015-01-08 Ｊｆｅスチール株式会社 スケジューリング方法及びスケジューリング装置
CN108805325A (zh) * 2018-04-11 2018-11-13 杭州电子科技大学 一种生产计划与调度集成优化方法
CN109034596A (zh) * 2018-07-19 2018-12-18 北京北方华创微电子装备有限公司 一种物料优化调度的方法和设备
CN109934393A (zh) * 2019-02-28 2019-06-25 杭州电子科技大学 一种需求不确定下生产计划与调度的集成优化方法
CN112987674A (zh) * 2021-04-27 2021-06-18 北京北方华创微电子装备有限公司 半导体加工设备的物料调度方法和装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030171972A1 (en) * 2002-01-28 2003-09-11 James Heskin Scheduling system and method
TWI291665B (en) * 2005-12-30 2007-12-21 Ind Tech Res Inst Product managing system and method using RFID technology

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020198757A1 (en) * 2001-06-26 2002-12-26 International Business Machines Corporation Method for allocating limited component supply and capacity to optimize production scheduling
JP2007102435A (ja) * 2005-10-04 2007-04-19 Kobe Steel Ltd 生産スケジューリング装置及び生産スケジューリング方法、並びにプログラム
CN101751025A (zh) * 2008-12-12 2010-06-23 北京北方微电子基地设备工艺研究中心有限责任公司 一种硅片优化调度的方法和装置
JP2015005085A (ja) * 2013-06-20 2015-01-08 Ｊｆｅスチール株式会社 スケジューリング方法及びスケジューリング装置
CN108805325A (zh) * 2018-04-11 2018-11-13 杭州电子科技大学 一种生产计划与调度集成优化方法
CN109034596A (zh) * 2018-07-19 2018-12-18 北京北方华创微电子装备有限公司 一种物料优化调度的方法和设备
CN109934393A (zh) * 2019-02-28 2019-06-25 杭州电子科技大学 一种需求不确定下生产计划与调度的集成优化方法
CN112987674A (zh) * 2021-04-27 2021-06-18 北京北方华创微电子装备有限公司 半导体加工设备的物料调度方法和装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116435235A (zh) * 2023-03-30 2023-07-14 上海普达特半导体设备有限公司 用于半导体处理设备的传输装置以及半导体处理设备

Also Published As

Publication number Publication date
CN112987674B (zh) 2021-09-17
US20240210926A1 (en) 2024-06-27
TW202308021A (zh) 2023-02-16
CN112987674A (zh) 2021-06-18
TWI815378B (zh) 2023-09-11
US12197195B2 (en) 2025-01-14

Similar Documents

Publication Publication Date Title
WO2022227975A1 (zh) 半导体加工设备的物料调度方法和装置
US11308453B2 (en) Method and system for scheduling pieces of materials based on real-time device status
TWI841084B (zh) 一種任務調度方法和半導體製程設備
US20150162180A1 (en) Method, storage medium and system for controlling the processing of lots of workpieces
EP4524851A1 (en) Path generation method and apparatus, computer device and storage medium
Lee et al. Cleaning plan optimization for dual-armed cluster tools with general chamber cleaning periods
TWI786746B (zh) 半導體製程設備中製程任務的啟動方法、裝置
WO2024088294A9 (zh) 一种晶片调度方法和一种电子设备
CN114551296B (zh) 分区管理方法、装置、计算机设备和存储介质
US20250068144A1 (en) Semiconductor process apparatus scheduling control method and semiconductor process apparatus
CN118313637B (zh) 一种晶圆盒存取方法、装置、电子设备和存储介质
TW523800B (en) Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
CN115116909A (zh) 半导体加工设备异常工况下的晶圆调度控制方法与装置
TW202427256A (zh) 製程任務啟動方法、製程任務排程方法、電子設備、存儲介質和半導體製程設備
WO2026040858A1 (zh) 一种调度方法及相关装置
CN118919446A (zh) 物料调度方法及半导体工艺设备
WO2025237230A1 (zh) 一种调度方法及相关装置
CN114620389A (zh) 容器搬运方法、装置、电子设备和计算机可读介质
CN110850819A (zh) 单臂组合设备调度方法、系统、移动终端及存储介质
US20220365516A1 (en) Scheduling substrate routing and processing
US11211268B2 (en) Deadlock determination method and semiconductor apparatus
CN106298604A (zh) 一种晶片传输方法和装置
TW202137383A (zh) 一種防止調度死鎖的物料分類調度方法
KR20250133951A (ko) 로봇 컨트롤 방법 및 장치, 및 제품 처리 시스템
CN119987295A (zh) 调度方法、装置、半导体工艺设备及计算机可读存储介质

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22794448

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 18557333

Country of ref document: US

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 11202307841T

Country of ref document: SG

122 Ep: pct application non-entry in european phase

Ref document number: 22794448

Country of ref document: EP

Kind code of ref document: A1