WO2022227793A1 - Procédé de configuration de paramètre de haut-parleur et appareil associé - Google Patents

Procédé de configuration de paramètre de haut-parleur et appareil associé Download PDF

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Publication number
WO2022227793A1
WO2022227793A1 PCT/CN2022/076320 CN2022076320W WO2022227793A1 WO 2022227793 A1 WO2022227793 A1 WO 2022227793A1 CN 2022076320 W CN2022076320 W CN 2022076320W WO 2022227793 A1 WO2022227793 A1 WO 2022227793A1
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WIPO (PCT)
Prior art keywords
air pressure
preset
actual
resonant frequency
target audio
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PCT/CN2022/076320
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English (en)
Chinese (zh)
Inventor
王三军
张�成
许逸君
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Oppo广东移动通信有限公司
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Publication of WO2022227793A1 publication Critical patent/WO2022227793A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R29/00—Monitoring arrangements; Testing arrangements
    • H04R29/001—Monitoring arrangements; Testing arrangements for loudspeakers

Definitions

  • the present application relates to the technical field of electronic equipment, in particular to a speaker parameter configuration method and related devices.
  • the structure of the speakers generally includes a front cavity, a rear cavity, a diaphragm and a front cavity pipe.
  • the vibration of the diaphragm is controlled by an electrical signal, thereby producing sound.
  • the existing protection measures are to establish a reference voltage model through preset audio parameters in a normal temperature and normal pressure environment. The reference voltage model will limit the voltage to prevent the diaphragm displacement from exceeding the preset diaphragm displacement, but it is easily limited by hardware.
  • the present application proposes a speaker parameter configuration method and related device, which can configure appropriate audio parameters according to the change of the speaker resonance frequency after eliminating the interference of environmental temperature factors, which is suitable for various environments and saves hardware costs.
  • an embodiment of the present application provides a speaker parameter configuration method, which is applied to an electronic device, and the method includes:
  • mapping relationships includes a corresponding relationship between the ambient temperature measured in advance under a preset air pressure condition and the resonant frequency of the speaker;
  • Target audio parameters are configured according to the actual resonant frequency and the reference resonant frequency, and the target audio parameters are used to make the diaphragm displacement of the speaker not exceed a preset diaphragm displacement.
  • an embodiment of the present application provides a speaker parameter configuration device, which is applied to an electronic device, and the speaker parameter configuration device includes:
  • a detection unit configured to detect the actual resonance frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located;
  • the query unit is configured to query a preset set of mapping relationships to determine the reference resonance frequency corresponding to the ambient temperature, where the set of mapping relationships includes a relationship between the ambient temperature measured in advance under a preset air pressure condition and the resonance frequency of the speaker.
  • a configuration unit configured to configure target audio parameters according to the actual resonant frequency and the reference resonant frequency, where the target audio parameters are used to make the diaphragm displacement of the speaker not exceed a preset diaphragm displacement.
  • an embodiment of the present application provides an electronic device, including a processor, a memory, a speaker, a temperature sensor, a communication interface, and one or more programs, wherein the one or more programs are stored in the memory, And configured to be executed by the above-mentioned processor, the above-mentioned program includes instructions for executing the steps in the first aspect of the embodiments of the present application.
  • an embodiment of the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program for electronic data exchange, wherein the computer program causes a computer to execute the computer program as described in the first embodiment of the present application.
  • an embodiment of the present application provides a computer program product, wherein the computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute as implemented in the present application. Examples include some or all of the steps described in the first aspect.
  • the computer program product may be a software installation package.
  • the actual resonant frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located are detected; then, the preset mapping relationship set is queried to determine the The reference resonant frequency corresponding to the ambient temperature, and the mapping relationship set includes the corresponding relationship between the ambient temperature measured in advance under preset air pressure conditions and the resonant frequency of the speaker; finally, according to the actual resonant frequency and the resonant frequency
  • the reference resonant frequency configures target audio parameters for making the diaphragm displacement of the speaker not exceed a preset diaphragm displacement.
  • the ambient air pressure change can be simulated according to the change of the resonant frequency of the loudspeaker, and then appropriate audio parameters can be configured to increase the performance utilization of the loudspeaker, which is suitable for a variety of environments and saves hardware costs.
  • FIG. 1A is a schematic diagram of a corresponding relationship between a voltage and a resonance frequency according to an embodiment of the present application
  • FIG. 1B is a schematic diagram of a corresponding relationship between temperature and resonant frequency according to an embodiment of the present application
  • FIG. 1C is a schematic diagram of the correspondence between air pressure and resonant frequency according to an embodiment of the present application
  • FIG. 2 is a schematic flowchart of a speaker parameter configuration method provided by an embodiment of the present application
  • FIG. 3 is a schematic flowchart of another speaker parameter configuration method provided by an embodiment of the present application.
  • 4A is a schematic diagram of a diaphragm displacement provided by an embodiment of the present application.
  • 4B is a schematic diagram of another diaphragm displacement provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • FIG. 6 is a block diagram of functional units of a loudspeaker parameter configuration device provided by an embodiment of the present application.
  • FIG. 7 is a block diagram of functional units of another speaker parameter configuration apparatus provided in an embodiment of the present application.
  • Resonant frequency refers to the frequency corresponding to the point where the vibration plate vibrates most strongly when the speaker starts to vibrate from the low range.
  • the resonant frequency or resonant frequency of the loudspeaker referred to as F0.
  • the amplitude of the vibration system of the loudspeaker is the largest at the resonant frequency, that is, the diaphragm near the resonant frequency has a preset diaphragm displacement (Maximum excursion of speaker diaphragm, Xmax) under the same voltage.
  • FIG. 1A is a schematic diagram of the corresponding relationship between voltage and resonant frequency provided by an embodiment of the application. It can be seen that as the output power of the speaker decreases, the voltage decreases. is small, the resonant frequency gradually increases; as shown in FIG. 1B , FIG. 1B is a schematic diagram of the corresponding relationship between temperature and resonant frequency provided by the embodiment of the application, it can be seen that as the temperature increases, the resonant frequency gradually decreases; As shown in 1C, FIG. 1C is a schematic diagram of the corresponding relationship between air pressure and resonant frequency provided by an embodiment of the present application.
  • the resonant frequency under low air pressure is lower than the resonant frequency under high air pressure.
  • the resonant frequency is inversely proportional to the voltage
  • the resonant frequency is inversely proportional to the temperature
  • the resonant frequency is proportional to the air pressure.
  • the diaphragm displacement of the speaker When the resonant frequency increases and the other factors remain unchanged, the diaphragm displacement of the speaker will become smaller, so the diaphragm displacement will not exceed the preset diaphragm displacement when the speaker is working normally; when the resonant frequency decreases and other factors remain unchanged, The diaphragm displacement of the speaker will become larger, and at this time, it may exceed the preset diaphragm displacement. Moreover, the reduction of the resonant frequency caused by the low pressure state is often far greater than the reduction of the resonant frequency caused by the temperature increase.
  • the operating amplitude of the existing speaker is generally about 80% of the preset diaphragm displacement. , which greatly loses the performance of the speaker.
  • the embodiment of the present application provides a speaker parameter configuration method and a related device, which can confirm the air pressure state according to the change of the resonant frequency of the speaker after eliminating the interference of the environmental temperature factor, and further configure the appropriate audio frequency according to the air pressure state. parameters, increase speaker performance utilization, suitable for a variety of environments, saving hardware costs.
  • FIG. 2 is a schematic flowchart of a method for configuring loudspeaker parameters provided by an embodiment of the present application, applied to an electronic device, and specifically includes the following steps:
  • Step 201 Detect the actual resonant frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located.
  • the detection of the current actual resonance frequency of the speaker can be performed by a high-speed resonant frequency detector or by a built-in measurement algorithm, which is the prior art, and will not be repeated here.
  • the ambient temperature of the space where the electronic device is located may be acquired through a temperature sensor.
  • Step 202 query a preset set of mapping relationships to determine the reference resonance frequency corresponding to the ambient temperature.
  • the set of mapping relationships includes a correspondence relationship between the ambient temperature and the resonant frequency of the loudspeaker measured in advance under a preset air pressure condition, and the preset air pressure condition may represent a range between 0.9*standard atmospheric pressure and 1.1*standard atmospheric pressure. In the range of 0.9*standard atmospheric pressure to 1.1*standard atmospheric pressure, the relationship between different ambient temperature and resonance frequency is measured to determine the above-mentioned set of mapping relationships. In this way, the preset mapping relationship set can be directly called to find the reference resonance frequency corresponding to the current ambient temperature, where the reference resonance frequency is the resonance frequency corresponding to the ambient temperature under normal pressure.
  • the influence of the ambient temperature on the resonance frequency of the loudspeaker can be excluded. Accuracy of barometric state.
  • Step 203 Configure target audio parameters according to the actual resonant frequency and the reference resonant frequency, where the target audio parameters are used to make the diaphragm displacement of the speaker not exceed a preset diaphragm displacement.
  • the above-mentioned target audio frequency parameter is used to make the diaphragm displacement of the loudspeaker not exceed the preset diaphragm displacement
  • the above-mentioned actual resonance frequency can be compared with the above-mentioned reference resonance frequency, and the magnitude relationship between the actual resonance frequency and the reference resonance frequency can be determined.
  • the actual resonant frequency is greater than or equal to the reference resonant frequency
  • it can be determined that the actual air pressure is greater than or equal to the preset air pressure
  • the actual resonant frequency is less than the reference resonant frequency
  • the difference between the actual resonant frequency and the reference resonant frequency can be obtained, and when the difference is less than or equal to a preset threshold, the actual air pressure at this time can be determined It is only slightly reduced.
  • the diaphragm displacement will not exceed the preset diaphragm displacement; when the difference is greater than the preset threshold, it can be determined that the actual air pressure at this time is greatly reduced.
  • the diaphragm will Exceeding the maximum displacement of the diaphragm, causing the speaker to work abnormally.
  • the above-mentioned preset threshold can be set through experimental data, and can be adjusted according to the material and size of the diaphragm of the speaker, which is not specifically limited here.
  • the resonant frequency of the speaker is affected by the ambient temperature and air pressure, after eliminating the interference of the ambient temperature, the actual air pressure and the actual air pressure of the space where the electronic device is located can be determined according to the actual resonant frequency and the reference resonant frequency.
  • the magnitude relationship between the preset air pressures can be obtained without an air pressure sensor, thereby reducing the hardware cost.
  • the diaphragm displacement of the speaker when the actual air pressure is greater than or equal to the preset air pressure, the diaphragm displacement of the speaker will become smaller under the same voltage condition, so the diaphragm displacement must not exceed the preset diaphragm displacement at this time.
  • Configure preset audio parameters as target audio parameters.
  • the above-mentioned preset audio parameters are used to establish a reference voltage protection model, and the reference voltage protection model is suitable for a normal temperature and normal pressure environment.
  • the reference voltage protection model can limit the output voltage within 5V to avoid the diaphragm displacement exceeding the preset diaphragm displacement of 0.5mm.
  • the diaphragm displacement of the speaker when the actual air pressure is less than the preset air pressure, under the same voltage condition, the diaphragm displacement of the speaker will increase, and there is a risk of exceeding the preset diaphragm displacement.
  • the corresponding relationship between the air pressure measured under the preset temperature condition and the resonant frequency of the speaker determines the target audio parameters corresponding to the actual air pressure for configuration, and the target audio parameters at this time can be used for the target voltage protection model.
  • the voltage protection model can prevent the diaphragm displacement from exceeding the preset diaphragm displacement by automatically attenuating the overall link gain, and can also prevent the diaphragm displacement from exceeding the preset diaphragm displacement by attenuating large audio signals in the low frequency part.
  • This goal The voltage protection model may also be a voltage protection model only applicable to a low pressure environment, which will not be repeated here.
  • the difference between the actual air pressure and the preset air pressure can be obtained, and when the difference between the actual air pressure and the preset air pressure is less than or equal to the preset threshold, it can be determined.
  • the reduction of the actual resonant frequency is very small, and the diaphragm displacement of the speaker will not exceed the preset diaphragm displacement, so the above reference voltage protection model can still be used at this time; between the above actual air pressure and the above preset air pressure
  • the target voltage protection model needs to be called at this time to prevent the diaphragm displacement of the speaker from exceeding the preset diaphragm displacement.
  • the above-mentioned preset threshold may be preset according to the preset diaphragm displacement corresponding to the actual resonance frequency. In this way, it can be ensured that the diaphragm displacement of the loudspeaker does not exceed the preset diaphragm displacement without wasting the performance of the loudspeaker.
  • the target voltage protection model can be directly called, which can greatly improve the reliability of the speaker diaphragm displacement not exceeding the preset diaphragm displacement, but may waste some speaker performance.
  • the actual resonant frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located are detected; then, a preset set of mapping relationships is queried to determine the reference resonant frequency corresponding to the ambient temperature , the set of mapping relationships includes the corresponding relationship between the ambient temperature and the resonant frequency of the loudspeaker measured in advance under a preset air pressure condition; finally, the target audio parameters are configured according to the actual resonant frequency and the reference resonant frequency, Wherein, the above-mentioned target audio parameters are used to make the diaphragm displacement of the speaker not exceed the preset diaphragm displacement.
  • the ambient air pressure change can be simulated according to the change of the resonant frequency of the loudspeaker, and then appropriate audio parameters can be configured to increase the performance utilization of the loudspeaker, which is suitable for a variety of environments and saves hardware costs.
  • FIG. 3 is another speaker parameter configuration method provided by the embodiment of the present application, applied to an electronic device, and specifically includes the following steps:
  • Step 301 the resonant frequency of the loudspeaker under preset air pressure conditions and different temperatures is detected by the control variable method to determine a preset mapping relationship set.
  • the above-mentioned preset mapping relationship set may include the corresponding relationship between the ambient temperature measured in advance under the preset air pressure condition and the resonant frequency of the speaker.
  • Step 302 Detect the actual resonant frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located.
  • Step 303 query a preset set of mapping relationships to determine the reference resonance frequency corresponding to the ambient temperature.
  • Step 304 judging whether the actual resonant frequency is less than the reference resonant frequency.
  • step 305 is executed; if the above-mentioned actual resonance frequency is less than the above-mentioned reference resonance frequency, step 306 is executed.
  • Step 305 calling preset audio parameters as target audio parameters for configuration.
  • the above preset audio parameters can be used to construct a reference voltage protection model under normal temperature and normal pressure.
  • Step 306 Determine whether the difference between the actual resonant frequency and the reference resonant frequency is greater than a preset threshold.
  • step 305 is executed; the difference between the actual resonance frequency and the reference resonance frequency is greater than the preset threshold, and step 307 is executed .
  • Step 307 query the correspondence between the air pressure measured in advance under a preset temperature condition and the resonant frequency of the speaker to determine target audio parameters corresponding to the actual air pressure for configuration.
  • Step 308 detecting the audio playing state.
  • the playback state of the audio can be determined by detecting whether the audio process is closed. When the audio process is closed, it is in the state of audio stop playing, and when the audio process is running, it is in the state of audio playing.
  • Step 309 when the audio playing state is stop playing, adjust the target audio parameter to the preset audio parameter.
  • Step 310 when the audio playing state is playing, continue to call the target voltage protection model corresponding to the target audio parameter.
  • the diaphragm displacement of the loudspeaker under normal temperature and pressure is set to 0.43mm, and the preset diaphragm displacement at this time is 0.45mm.
  • the diaphragm displacement will gain 0.1mm.
  • the diaphragm displacement can be reduced by about 0.1mm by configuring the target audio parameters to attenuate the gain or suppress the low-frequency large audio signal, so that the diaphragm displacement of the speaker is also 0.43mm in a low pressure environment. about.
  • the diaphragm displacement of the speaker under normal temperature and pressure is shown in Figure 4A, and the damped diaphragm displacement after the resonant frequency F0 is reduced is shown in Figure 4B. It can be seen that by configuring the target audio parameters, the diaphragm displacement of the speaker can be prevented from exceeding the preset vibration. membrane displacement.
  • the altitude of the current electronic device can also be obtained through the positioning module of the electronic device, such as GPS, and the set of mapping relationships between altitude and air pressure can be queried to determine the altitude reference air pressure corresponding to the altitude, and further determine the altitude. Whether the reference air pressure belongs to a low air pressure environment, so as to configure the relevant audio parameters of the speaker and prevent the diaphragm displacement of the speaker from exceeding the preset diaphragm displacement.
  • the altitude reference air pressure corresponding to the altitude can be used as a comparison.
  • the lift information can be generated and fed back to the user.
  • the prompt information is used to remind the user of the currently detected air pressure. Status may be abnormal.
  • the ambient air pressure change can be simulated according to the change of the speaker resonance frequency after eliminating the interference of the ambient temperature factor, and then the appropriate audio parameters can be configured, which is suitable for a variety of environments and saves hardware costs.
  • the electronic device 500 includes a processor 501, a communication The interface 502, the memory 503, the speaker 504 and the temperature sensor 505, the processor, the communication interface, the memory, the speaker and the temperature sensor are connected to each other, wherein the electronic device 500 may further comprise a bus 506, the processor 501, the communication interface 502 and the memory 503 can be connected to each other through a bus 506, and the bus 506 can be a Peripheral Component Interconnect (PCI for short) bus or an Extended Industry Standard Architecture (EISA for short) bus or the like.
  • PCI Peripheral Component Interconnect
  • EISA Extended Industry Standard Architecture
  • the bus 506 may be divided into an address bus, a data bus, a control bus, and the like. For ease of presentation, only one thick line is used in FIG. 5, but it does not mean that there is only one bus or one type of bus.
  • the memory 503 is used to store a computer program
  • the computer program includes program instructions
  • the speaker 504 includes a diaphragm, which is an electro-acoustic conversion device
  • the temperature sensor 505 is used to obtain the ambient temperature of the current space
  • the processor 501 is configured to invoke the program instructions to perform all or part of the methods described in FIG. 2 or FIG. 3 above.
  • the electronic device includes corresponding hardware structures and/or software modules for executing each function.
  • the present application can be implemented in hardware or in the form of a combination of hardware and computer software, in combination with the units and algorithm steps of each example described in the embodiments provided herein. Whether a function is performed by hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of this application.
  • the electronic device may be divided into functional units according to the foregoing method examples.
  • each functional unit may be divided corresponding to each function, or two or more functions may be integrated into one processing unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units. It should be noted that the division of units in the embodiments of the present application is illustrative, and is only a logical function division, and other division methods may be used in actual implementation.
  • the speaker parameter configuration device 600 in the embodiment of the present application is described below with reference to FIG. 6 , which is a block diagram of the functional units of the speaker parameter configuration device provided by the embodiment of the application. , applied to electronic equipment, the speaker parameter configuration device 600 includes:
  • a detection unit 610 configured to detect the actual resonance frequency of the speaker of the electronic device and the ambient temperature of the space where the electronic device is located;
  • the query unit 620 is configured to query a preset set of mapping relationships to determine a reference resonance frequency corresponding to the ambient temperature, where the set of mapping relationships includes a relationship between the ambient temperature measured in advance under a preset air pressure condition and the resonance frequency of the speaker the corresponding relationship;
  • the configuration unit 630 is used for wherein, the above-mentioned target audio parameters are used to make the diaphragm displacement of the speaker not exceed the preset diaphragm displacement.
  • the preset mapping relationship set is queried to determine the reference resonant frequency corresponding to the ambient temperature.
  • the set of mapping relationships includes the corresponding relationship between the ambient temperature and the resonant frequency of the loudspeaker measured in advance under a preset air pressure condition; then, determining the location where the electronic device is located according to the actual resonant frequency and the reference resonant frequency The size relationship between the actual air pressure of the space and the preset air pressure; finally, the target audio parameters are configured according to the size relationship between the actual air pressure of the space where the electronic device is located and the preset air pressure, and the target audio parameters Used to make the diaphragm displacement of the loudspeaker not exceed the preset diaphragm displacement.
  • the ambient air pressure change can be simulated according to the change of the resonant frequency of the loudspeaker, and then appropriate audio parameters can be configured to increase the performance utilization of the loudspeaker, which is suitable for a variety of environments and saves hardware costs.
  • the speaker parameter configuration apparatus 700 includes a processing unit 701 and a communication unit 702, wherein the The processing unit 701 is configured to perform any step in the above method embodiments, and when performing data transmission such as sending, the communication unit 702 can be selectively invoked to complete corresponding operations.
  • the speaker parameter configuration apparatus 700 may further include a storage unit 703 for storing program codes and data.
  • the processing unit 701 may be a processor, and the storage unit 703 may be a memory.
  • the processing unit 701 is specifically used for:
  • mapping relationships includes a corresponding relationship between the ambient temperature measured in advance under a preset air pressure condition and the resonant frequency of the speaker;
  • the target audio parameter is configured according to the magnitude relationship between the actual air pressure of the space where the electronic device is located and the preset air pressure, and the target audio parameter is used to make the diaphragm displacement of the speaker not exceed the preset diaphragm displacement.
  • the relationship set includes the corresponding relationship between the ambient temperature and the resonant frequency of the loudspeaker measured in advance under a preset air pressure condition; then, according to the actual resonant frequency and the reference resonant frequency, the space where the electronic device is located is determined.
  • the diaphragm displacement of the speaker is made not to exceed the preset diaphragm displacement.
  • the ambient air pressure change can be simulated according to the change of the resonant frequency of the loudspeaker, and then appropriate audio parameters can be configured to increase the performance utilization of the loudspeaker, which is suitable for a variety of environments and saves hardware costs.
  • Both the speaker parameter configuration apparatus 600 and the speaker parameter configuration apparatus 700 can execute all the speaker parameter configuration methods included in the foregoing embodiments.
  • Embodiments of the present application further provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data exchange, and the computer program causes the computer to execute part or all of the steps of any method described in the above method embodiments .
  • Embodiments of the present application further provide a computer program product, where the computer program product includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to cause a computer to execute any one of the method embodiments described above. some or all of the steps of the method.
  • the computer program product may be a software installation package, and the computer includes an electronic device.
  • the disclosed apparatus may be implemented in other manners.
  • the device embodiments described above are only illustrative.
  • the division of the above-mentioned units is only a logical function division.
  • multiple units or components may be combined or integrated. to another system, or some features can be ignored, or not implemented.
  • the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical or other forms.
  • the units described above as separate components may or may not be physically separated, and components shown as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.
  • each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the above-mentioned integrated units if implemented in the form of software functional units and sold or used as independent products, may be stored in a computer-readable memory.
  • the technical solution of the present application can be embodied in the form of a software product in essence, or the part that contributes to the prior art, or all or part of the technical solution, and the computer software product is stored in a memory.
  • a computer device which may be a personal computer, a server, or a network device, etc.
  • the aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, magnetic disk or optical disk and other media that can store program codes.

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  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • General Health & Medical Sciences (AREA)
  • Circuit For Audible Band Transducer (AREA)

Abstract

La présente invention concerne un procédé de configuration de paramètre de haut-parleur et un appareil associé. Le procédé comprend : tout d'abord, la détection d'une fréquence de résonance réelle d'un haut-parleur d'un dispositif électronique et d'une température ambiante d'un espace dans lequel se trouve le dispositif électronique ; puis, l'interrogation d'un ensemble de relations de mappage prédéfinies pour déterminer une fréquence de résonance de référence correspondant à la température ambiante, l'ensemble de relations de mappage comprenant une corrélation entre une température ambiante, qui est mesurée à l'avance dans des conditions de pression d'air prédéfinie, et la fréquence de résonance du haut-parleur ; et enfin, la configuration d'un paramètre audio cible en fonction de la fréquence de résonance réelle et de la fréquence de résonance de référence, le paramètre audio cible étant utilisé pour empêcher qu'un déplacement de la membrane du haut-parleur ne dépasse un déplacement de membrane prédéfini. Une variation de pression d'air dans un environnement peut être simulée en fonction d'une variation de la fréquence de résonance d'un haut-parleur après que la perturbation par un facteur température ambiante a été éliminée, et un paramètre audio approprié est ensuite configuré, de façon à améliorer le taux d'utilisation des performances du haut-parleur. La présente invention est appropriée pour divers environnements, et permet une économie de coût matériel.
PCT/CN2022/076320 2021-04-28 2022-02-15 Procédé de configuration de paramètre de haut-parleur et appareil associé WO2022227793A1 (fr)

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CN118646988A (zh) * 2024-08-15 2024-09-13 宁波富声达电机有限公司 一种扬声器振膜处理方法、系统、智能终端及存储介质

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CN113132850B (zh) * 2021-04-28 2023-05-26 Oppo广东移动通信有限公司 扬声器参数配置方法及相关装置
CN113727241A (zh) * 2021-08-25 2021-11-30 Oppo广东移动通信有限公司 音频输出的控制方法、装置、电子设备及存储介质
CN113993049B (zh) * 2021-08-26 2022-05-27 地球山(北京)科技有限公司 Mems数字扬声器设计方法

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