WO2022222804A1 - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
WO2022222804A1
WO2022222804A1 PCT/CN2022/086482 CN2022086482W WO2022222804A1 WO 2022222804 A1 WO2022222804 A1 WO 2022222804A1 CN 2022086482 W CN2022086482 W CN 2022086482W WO 2022222804 A1 WO2022222804 A1 WO 2022222804A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
circuit board
socket
socket tongue
tongue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/086482
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English (en)
French (fr)
Inventor
林振业
付绍儒
朱中武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vivo Mobile Communication Co Ltd
Original Assignee
Vivo Mobile Communication Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022222804A1 publication Critical patent/WO2022222804A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/73—Means for mounting coupling parts to apparatus or structures, e.g. to a wall
    • H01R13/74—Means for mounting coupling parts in openings of a panel

Definitions

  • the present application belongs to the technical field of communication devices, and in particular relates to an electronic device.
  • the purpose of the embodiments of the present application is to provide an electronic device, which can solve the problem of the large size of the socket of the electronic device in the background art.
  • an embodiment of the present application provides an electronic device.
  • the disclosed electronic device includes a housing, a socket tongue, and a substrate, the housing is provided with an inner cavity, and the housing is provided with a connection with the inner cavity.
  • a connected jack the first end of the socket tongue is connected to the base plate, the base plate is installed in the inner cavity, and the base plate blocks the inner port of the jack, and the second end of the socket tongue The end extends into the socket, and the portion of the socket tongue located in the socket is suspended within the socket.
  • the electronic device disclosed in the embodiments of the present application improves the structure of the electronic device in the related art.
  • an electronic device including a housing, a socket tongue and a substrate, the first end of the socket tongue is fixed on the substrate, and the first end of the socket tongue is fixed on the substrate.
  • the base plate is fixed in the inner cavity, and the base plate blocks the inner port of the jack, so that the socket tongue and the base plate can be electrically connected, and since the first end of the socket tongue is fixed on the base plate, the base and the socket tongue are The strength of the connection between them is guaranteed, and at the same time, there is no need for additional structures on the socket tongue to assist the electrical connection with the base plate, so that the volume of the structure composed of the shell, the socket tongue and the base plate can be reduced, thereby solving the problem of The problem of the larger size of sockets in electronic equipment.
  • FIG. 1 is a cross-sectional view of an electronic device disclosed in an embodiment of the present application.
  • FIG. 2 is a schematic structural diagram of a socket tongue of an electronic device disclosed in an embodiment of the present application.
  • FIG. 3 is a schematic diagram of an integrated structure of a plug-in limit portion and a cylindrical reinforcement portion of an electronic device disclosed in an embodiment of the present application;
  • Fig. 4 is the structural representation of the structure in Fig. 2 and Fig. 3 after assembling;
  • FIG. 5 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present application.
  • Fig. 6 is the partial structure enlarged schematic diagram of Fig. 5;
  • FIG. 7 is a schematic diagram of a partial explosion structure of an electronic device disclosed in an embodiment of the present application.
  • FIG. 8 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present application.
  • FIGS. 9 and 10 are schematic structural diagrams of different layout modes in the electronic device disclosed in the embodiments of the present application.
  • FIG. 11 is a partial structural schematic diagram of an electronic device disclosed in an embodiment of the present application.
  • first, second and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish between “first”, “second”, etc.
  • the objects are usually of one type, and the number of objects is not limited.
  • the first object may be one or more than one.
  • “and/or” in the description and claims indicates at least one of the connected objects, and the character “/" generally indicates that the associated objects are in an "or” relationship.
  • an embodiment of the present application discloses an electronic device, and the disclosed electronic device includes a housing 100 , a socket tongue 200 and a substrate 300 .
  • the housing 100 is the external structure of the electronic device, which can protect the internal structure of the electronic device.
  • the socket tongue 200 is the main functional structure in the electronic device, and can be connected with a charger and other devices to charge the electronic device, and use To support the normal functioning of electronic equipment.
  • the circuit structure is integrated on the substrate 300 , which can realize the electrical connection between the socket tongue 200 and the housing 100 .
  • the housing 100 is provided with an inner cavity 110, and the inner cavity 110 is an accommodating space in the electronic device, which can accommodate the internal structure of the electronic device.
  • the housing 100 is provided with a jack 120 communicating with the inner cavity 110 , the first end of the socket tongue 200 is connected to the substrate 300 , the substrate 300 is installed in the inner cavity 110 , the substrate 300 blocks the inner port of the jack 120 , and the socket tongue The second end of the sheet 200 extends into the socket 120, and the part of the socket tongue 200 located in the socket 120 is suspended in the socket 120.
  • the socket 120 is connected to the external environment of the electronic device.
  • the user can realize the electrical connection between the charger and other devices and the socket tongue 200 through the jack 120, and the socket tongue 200 can realize the electrical connection with the electronic device through the base plate 300, so that the user can pass the shell 100, the socket tongue
  • the simple and small-volume socket structure of the chip 200 and the base plate 300 achieves the purpose of charging the electronic device.
  • the electronic device disclosed in the embodiment of the present application improves the structure of the electronic device in the related art, and by arranging the electronic device including the housing 100 , the socket tongue 200 and the base plate 300 , the first end of the socket tongue 200 is fixed on the On the base plate 300, the base plate 300 is installed in the inner cavity 110, and the base plate 300 blocks the inner port of the jack 120, so that the socket tongue 200 and the base plate 300 can be electrically connected.
  • the end is fixed on the base plate 300, so that the electrical connection between the base plate 300 and the socket tongue can be realized, and at the same time, the socket tongue 200 does not need any additional structure to assist the electrical connection with the base plate 300, so that the housing 100 can be ,
  • the socket structure composed of the socket tongue 200 and the base plate 300 has a small volume, which can solve the problem of the large volume of the socket in the electronic device.
  • the electronic device may further include a plug-in limit portion 400
  • the substrate 300 may include a first circuit board 310
  • the first circuit board 310 is electrically connected to the socket tongue 200
  • the plug-in limit The portion 400 is disposed on the side of the first circuit board 310 facing the outer port of the socket 120
  • the insertion limiting portion 400 is disposed around the socket tongue 200 .
  • the plug-in limit portion 400 is disposed between the first circuit board 310 and the socket tongue 200 , and since the plug-in limit portion 400 is disposed around the socket tongue 200 , the user can use the charger or other equipment to interact with the socket tongue 200 .
  • the socket structure that is plugged and matched with the socket tongue 200 will be in contact with the plug limiter 400 when it is plugged into a certain position, thereby the plugging limit
  • the part 400 can limit the position of the socket structure matched with the socket tongue 200, so as to avoid excessive contact with the socket tongue 200 due to excessive force when the user is plugged in, thereby causing contact with the socket tongue 200 The effect is not good, thus affecting the user's charging experience.
  • the setting of the plug-in limiting portion 400 around the socket tongue 200 can limit and support the socket tongue 200, thereby increasing the strength of the socket tongue 200, thereby improving the performance of the socket tongue 200, and Damage to the first circuit board 310 can also be avoided.
  • the electronic device may further include a cylindrical reinforcing portion 500 , the cylindrical reinforcing portion 500 and the plug-in limiting portion 400 may be of an integral structure, and the cylindrical reinforcing portion 500 wraps the first end of the socket tongue 200 .
  • the integral structure of the cylindrical reinforcing portion 500 and the plug-in limiting portion 400 is beneficial to production and manufacturing, thereby improving the economical performance of the electronic device.
  • the cylindrical reinforcing portion 500 wraps the first end of the socket tongue 200 It can increase the connection strength between the socket tongue 200 and the plug-in limit part 400, so that the function of the plug-in limit part 400 can be better played, and the overall strength of the socket tongue 200 can also be increased, so as to further ensure the socket tongue 200 The stability of the connection with the socket structure of the charger and other equipment.
  • the first end of the socket tongue 200 may be provided with an installation limiting portion 210 surrounding the socket tongue 200 .
  • the installation limiting portion 210 is positioned on the first circuit
  • a gap 311 is formed between the board 310 and the plug limiter 400 , and between the first circuit board 310 and the plug limiter 400 around the installation limiter 210 , the substrate 300 is sealedly connected to the inner port through the sealing connector 800 , Part of the sealing connection 800 fills the gap 311 .
  • the gap 311 can avoid direct contact between the first circuit board 310 and the plug-in limit portion 400 , thereby preventing the first circuit board from being damaged when the plug-in limit portion 400 cooperates with the socket tongue 200 .
  • the gap 311 is formed around the installation stop 210, so that there are more types of contact surfaces in the gap 311, so that the part of the sealing connector 800 filled in the gap 311 can be in contact with different contact surfaces , so that the contact area of the sealing connector 800 in the gap 311 can be increased, thereby facilitating the sealing connection between the sealing connector 800 to the first circuit board 310 and the plug-in limiting portion 400 .
  • the setting of the installation limit portion 210 enables the installation limit portion 210 to limit the socket tongue 200 after the electronic device is installed, that is, the installation limit portion 210 can prevent the socket tongue 200 from facing The direction of the outer port of the socket 120 is moved, so that the socket tongue 200 can be prevented from falling off during use, thereby helping to improve the stability and use performance of the socket tongue 200 .
  • the sealing connector 800 disclosed in the embodiment of the present application may be provided with conductive particles, so that the sealing connector 800 can also play a conductive role while playing the role of sealing connection.
  • the inner wall of the housing 100 may be provided with a first groove 130, the inner port is connected to the bottom wall of the first groove 130, and the plug-in limiting portion 400 is connected to the first groove 130 in the direction toward the outer port.
  • the bottom wall of the groove 130 is limited and matched, so that a part of the plug-in limit part 400 can be accommodated in the first groove 130, so that the plug-in limit part 400 can play a position-limiting role while reducing the impact on Occupation of dimensions in the thickness direction of an electronic device.
  • Part of the sealing connector 800 is solidified in the first groove 130 , which is beneficial to increase the bonding area, and further improves the stability of the sealing connection between the substrate 300 and the socket tongue 200 .
  • the sealing connector 800 may be a sealant, and the embodiment of the present application does not limit the specific type of the sealing connector 800 .
  • the substrate 300 may include a first circuit board 310, the first circuit board 310 may be a flexible circuit board, and the electronic device may further include a second circuit board 600, which is disposed on the In the inner cavity 110, the second circuit board 600 is the main board, the socket tongue 200 is fixed on the first end of the flexible circuit board, the second end of the flexible circuit board is electrically connected to the main board, and the socket tongue 200 is electrically connected to the main board through the flexible circuit board. connect.
  • the socket tongue 200 is electrically connected to the electronic device through the first circuit board 310 and the second circuit board 600 in turn. Since the first circuit board 310 is a flexible circuit board, the first circuit board 310 is connected to the electronic device.
  • the use space is less restrictive, and can be used in a small space, thus occupying less space in the electronic device, which is beneficial to the miniaturization of the electronic device.
  • the base plate 300 may further include a reinforcing plate member 320 , the reinforcing plate member 320 is disposed on the side of the first circuit board 310 facing away from the socket 120 , and the reinforcing plate member 320 is fixedly connected to the housing 100 .
  • the reinforcing plate member 320 is a structural member with high strength. Because it is fixedly connected to the housing 100 , the reinforcing plate member 320 also has good stability, so that the reinforcing plate member 320 can lift the first circuit board. 310 strength and installation stability.
  • the reinforcing plate member 320 may be a metal plate.
  • the reinforcing plate 320 may be provided with a first connection hole 321
  • the first circuit board 310 may be provided with a second connection hole 312
  • the substrate 300 can pass through the first connection hole 321 and the second connection hole.
  • the threaded connector 700 of 312 is fixedly connected to the housing 100, so that the base plate 300, the reinforcing plate 320, the first circuit board 310 and the housing 100 can be fixedly connected through the threaded connector 700, thereby improving the whole of the electronic device. Strength and stability of internal structural connections.
  • the electronic device may further include a main board, and the socket tongue 200 is electrically connected to the main board.
  • the tongue piece 200 can be arranged in parallel with the main board, so that the size along the extension direction of the socket tongue piece 200 on the electronic device can be reduced, or the socket tongue piece 200 can be arranged perpendicular to the main board, thereby reducing the size of the socket tongue piece 200 on the electronic device.
  • the size of the extension direction of the sheet 200 is perpendicular to the dimension, and the embodiment of the present application does not limit the arrangement between the socket tongue sheet 200 and the main board.
  • the bottom wall of the inner cavity 110 may be provided with a second groove 140, and a portion of the substrate 300 may be located in the second groove 140.
  • the portion of the substrate 300 and the The cooperation of the second groove 140 can make the substrate 300 more stable in the inner cavity 110, and the second groove 140 is a sunken structure, so that the substrate 300 and the second groove have overlapping parts, so that the smaller The inner cavity 110 can satisfy the installation of the substrate 300 , thereby facilitating the miniaturization of the electronic device.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

本申请公开一种电子设备，所公开的电子设备包括壳体、插座舌片和基板，壳体内设有内腔，壳体上设有与内腔连通的插孔，插座舌片的第一端连接基板，基板安装在内腔中，且基板封堵插孔的内侧端口，插座舌片的第二端伸至插孔内，且插座舌片的位于插孔中的部分悬设在插孔之内。

Description

电子设备
交叉引用
本发明要求在2021年04月19日提交中国专利局、申请号为202110420534.X、发明名称为“电子设备”的中国专利申请的优先权，该申请的全部内容通过引用结合在本发明中。
技术领域
本申请属于通信设备技术领域，具体涉及一种电子设备。
背景技术
随着科技的进步与发展，电子设备上的插座的种类更加多样，受到广大用户的喜爱。但是，现阶段的各种插座一般使用外铁壳增加强度，由此导致了插座的整体体积较大的问题。
发明内容
本申请实施例的目的是提供一种电子设备，能够解决背景技术中的电子设备的插座体积较大的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提供一种电子设备，所公开的电子设备包括壳体、插座舌片和基板，所述壳体内设有内腔，所述壳体上设有与所述内腔连通的插孔，所述插座舌片第一端连接所述基板，所述基板安装在所述内腔，且所述基板封堵所述插孔的内侧端口，所述插座舌片的第二端伸至所述插孔内，且所述插座舌片的位于所述插孔中的部分悬设在所述插孔之内。
本申请采用的技术方案能够达到以下有益效果：
本申请实施例公开的电子设备通过对相关技术中的电子设备的结构进行改进，通过设置包括壳体、插座舌片和基板的电子设备，将插座舌片的第一端固定在基板上，将基板固定在内腔中，且使基板封堵插孔的内侧端口，使得插座舌片与基板能够实现电连接，并且，由于插座舌片的第一端固定在基板上，使得基板与插座舌片之间的连接强度有所保证，同时，插座舌片上不需要额外的结构辅助与基板之间的电连接，从而能够使得壳体、插座舌片和基板组成的结构的体积减小，进而能够解决电子设备中的插座的体积较大的问题。
附图说明
图1是本申请实施例公开的电子设备的剖视图；
图2是本申请实施例公开的电子设备的插座舌片的结构示意图；
图3是本申请实施例公开的电子设备的插接限位部和筒状加强部一体式结构的示意图；
图4是图2和图3中的结构在装配后的结构示意图；
图5是本申请实施例公开的电子设备的局部结构示意图；
图6是图5的局部结构放大示意图；
图7是本申请实施例公开的电子设备的局部爆炸结构示意图；
图8是本申请实施例公开的电子设备的局部结构示意图；
图9和图10是本申请实施例公开的电子设备中不同布局方式的结构示意图；
图11是本申请实施例公开的电子设备的部分结构示意图。
附图标记说明：
100-壳体、110-内腔、120-插孔、130-第一凹槽、140-第二凹槽；
200-插座舌片、210-安装限位部；
300-基板、310-第一电路板、311-间隙、312-第二连接孔、320-补强板件、321-第一连接孔；
400-插接限位部；
500-筒状加强部；
600-第二电路板；
700-螺纹连接件；
800-密封连接件。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”等是用于区别类似的对象，而不用于描述特定的顺序或先后次序。应该理解这样使用的数据在适当情况下可以互换，以便本申请的实施例能够以除了在这里图示或描述的那些以外的顺序实施，且“第一”、“第二”等所区分的对象通常为一类，并不限定对象的个数，例如第一对象可以是一个，也可以是多个。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
下面结合附图，通过具体的实施例及其应用场景对本申请实施例提供的电子设备进行详细地说明。
如图1-图11所示，本申请实施例公开一种电子设备，所公开的电子设备包括壳体100、插座舌片200和基板300。
壳体100为电子设备的外部结构，能够对电子设备中的内部结构进行保护，插座舌片200为电子设备中的主要功能结构，能够与充电器等设备进行连接后对电子设备进行充电，用以支撑电子设备的正常功能运转。基板300上集成了电路结构，能够实现插座舌片200与壳体100之间的电连接。
壳体100内设有内腔110，内腔110为电子设备中的容纳空间，能够对 电子设备中的内部结构进行容纳。壳体100上设有与内腔110连通的插孔120，插座舌片200的第一端连接基板300，基板300安装在内腔110中，基板300封堵插孔120的内侧端口，插座舌片200的第二端伸至插孔120内，且插座舌片200的位于插孔120中的部分悬设在插孔120之内，在此种情况下，插孔120与电子设备的外界环境实现连通，用户能够通过插孔120实现充电器等设备与插座舌片200的电连接，而插座舌片200能够通过基板300实现与电子设备的电连接，从而用户能够通过壳体100、插座舌片200和基板300这种简单且小体积的插座结构实现对电子设备的充电目的。
本申请实施例公开的电子设备通过对相关技术中的电子设备的结构进行改进，通过设置包括壳体100、插座舌片200和基板300的电子设备，将插座舌片200的第一端固定在基板300上，将基板300安装在内腔110中，且使基板300封堵插孔120的内侧端口，使得插座舌片200与基板300能够实现电连接，并且，由于插座舌片200的第一端固定在基板300上，使得基板300与插座舌片之间的电连接能够实现，同时，插座舌片200上不需要额外的结构辅助与基板300之间的电连接，从而能够使得壳体100、插座舌片200和基板300组成的插座结构的体积较小，进而能够解决电子设备中的插座的体积较大的问题。
在本申请实施例公开的电子设备中，电子设备还可以包括插接限位部400，基板300可以包括第一电路板310，第一电路板310与插座舌片200电连接，插接限位部400设于第一电路板310的朝向插孔120的外侧端口的一侧，且插接限位部400围绕插座舌片200设置。
在上述情况下，插接限位部400设置于第一电路板310与插座舌片200之间，且由于插接限位部400围绕插座舌片200设置，使得用户在使用充电器等设备与插座舌片200插接配合对电子设备进行充电时，与插座舌片200进行插接配合的插口结构在插接到一定位置时，会与插接限位部400相接触，从而插接限位部400能够对与插座舌片200配合的插口结构起到限位的作用，从而能够避免用户在插接时用力过大而与插座舌片200产生过度接触，从而 导致与插座舌片200的接触效果不佳，从而影响用户的充电体验问题。并且，插接限位部400围绕插座舌片200的设置能够对插座舌片200起到限制和支撑作用，从而能够增加插座舌片200的强度，从而能够提升插座舌片200的使用性能，而且还能够避免对第一电路板310造成损坏。
在进一步的技术方案中，电子设备还可以包括筒状加强部500，筒状加强部500与插接限位部400可以为一体式结构，筒状加强部500包裹插座舌片200的第一端。一体式结构的筒状加强部500与插接限位部400能够有利于生产制造，从而能够提升电子设备的经济性能，与此同时，筒状加强部500对插座舌片200第一端的包裹能够增加插座舌片200与插接限位部400的连接强度，从而能够更好地发挥插接限位部400的作用，还能够增加插座舌片200的整体强度，从而可进一步保证插座舌片200与充电器等设备的插口结构的连接的稳定性。
在本申请实施例公开的电子设备中，插座舌片200的第一端可以设置有围绕插座舌片200的安装限位部210，如图1所示，安装限位部210定位于第一电路板310与插接限位部400之间，第一电路板310与插接限位部400之间形成围绕安装限位部210的间隙311，基板300通过密封连接件800与内侧端口密封相连，部分密封连接件800填充在间隙311内。在此种情况下，间隙311能够避免第一电路板310与插接限位部400之间的直接接触，从而能够避免插接限位部400与插座舌片200配合工作时对第一电路板310的损坏，并且，间隙311由于围绕安装限位部210形成，使得间隙311中具有较多类型的接触表面，从而使得填充于间隙311中的部分密封连接件800能够与不同的接触表面相接触，从而能够增大密封连接件800在间隙311中的接触面积，进而有利于密封连接件800对第一电路板310与插接限位部400之间的密封连接。
与此同时，安装限位部210的设置使得电子设备在安装完成后，安装限位部210能够对插座舌片200进行限位，也就是说，安装限位部210能够阻止插座舌片200朝向插孔120的外侧端口的方向移动，从而能够避免插座舌 片200在使用过程中发生脱落，从而有助于提升插座舌片200的稳定性和使用性能。本申请实施例公开的密封连接件800中可以设置有导电粒子，使得密封连接件800在起到密封连接作用的同时也能够发挥导电作用。
在更为具体的技术方案中，壳体100的内壁可以开设有第一凹槽130，内侧端口连通第一凹槽130的底壁，插接限位部400在朝向外侧端口的方向与第一凹槽130的底壁限位配合，使得部分的插接限位部400能够容纳于第一凹槽130中，从而使得插接限位部400在发挥限位作用的同时，还能够减小对电子设备的厚度方向上的尺寸的占用。而部分密封连接件800凝固在第一凹槽130内，有利于增加粘接面积，进而可进一步提升基板300与插座舌片200之间的密封连接的稳定性。密封连接件800可以为密封胶，本申请实施例不对密封连接件800的具体种类进行限制。
在本申请实施例公开的电子设备中，基板300可以包括第一电路板310，第一电路板310可以为柔性电路板，电子设备还可以包括第二电路板600，第二电路板600设置于内腔110中，第二电路板600为主板，插座舌片200固定在柔性电路板的第一端，柔性电路板的第二端与主板电连接，插座舌片200通过柔性电路板与主板电连接。在此种情况下，插座舌片200依次通过第一电路板310和第二电路板600实现与电子设备的电连接，而由于第一电路板310为柔性电路板，使得第一电路板310对使用空间的限制性较小，能够在较小的空间中使用，从而占用的电子设备中的空间较小，进而有利于电子设备的小型化。
在进一步的技术方案中，基板300还可以包括补强板件320，补强板件320设于第一电路板310背向插孔120的一侧，补强板件320与壳体100固定相连。补强板件320为具有较高强度的结构件，由于其与壳体100固定相连，使得补强板件320也具有较好的稳定性，从而使得补强板件320能够提升第一电路板310的强度和安装稳定性。补强板件320可以为金属板。
在更为具体的方案中，补强板件320可以开设有第一连接孔321，第一电路板310开设有第二连接孔312，基板300通过穿过第一连接孔321和第 二连接孔312的螺纹连接件700与壳体100固定相连，使得基板300、补强板件320、第一电路板310以及壳体100之间能够通过螺纹连接件700实现固定相连，从而提升电子设备的整体强度以及内部结构连接的稳定性。
在本申请实施例公开的电子设备中，电子设备还可以包括主板，插座舌片200与主板电连接，在此种情况下，插座舌片200与主板之间的设置方式可以有多种，插座舌片200可以与主板平行设置，使得能够减小电子设备上沿插座舌片200延伸方向上的尺寸，或者，插座舌片200可以与主板相垂直设置，从而能够减小电子设备上与插座舌片200的延伸方向相垂直方向的尺寸，本申请实施例不对插座舌片200与主板之间的设置方式进行限定。
在本申请实施例公开的电子设备中，内腔110的底壁可以开设有第二凹槽140，基板300的部分可以位于第二凹槽140内，在此种情况下，基板300的部分与第二凹槽140的配合能够使得基板300在内腔110中更加稳定，并且，第二凹槽140为下沉式结构，使得基板300与第二凹槽具有重合部分，从而能够使得较小的内腔110便可满足基板300的安装，进而有利于电子设备的小型化。
需要说明的是，在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者装置不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者装置所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括该要素的过程、方法、物品或者装置中还存在另外的相同要素。
上面结合附图对本申请的实施例进行了描述，但是本申请并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本申请的启示下，在不脱离本申请宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本申请的保护之内。

Claims (10)

  1. 一种电子设备，包括壳体、插座舌片和基板，所述壳体内设有内腔，所述壳体上设有与所述内腔连通的插孔，所述插座舌片的第一端连接所述基板，所述基板安装在所述内腔中，且所述基板封堵所述插孔的内侧端口，所述插座舌片的第二端伸至所述插孔内，且所述插座舌片的位于所述插孔中的部分悬设在所述插孔之内。
  2. 根据权利要求1所述的电子设备，其中，所述电子设备还包括插接限位部，所述基板包括第一电路板，所述第一电路板与所述插座舌片电连接，所述插接限位部设于所述第一电路板的朝向所述插孔的外侧端口的一侧，且所述插接限位部围绕所述插座舌片设置。
  3. 根据权利要求2所述的电子设备，其中，所述电子设备还包括筒状加强部，所述筒状加强部与所述插接限位部为一体式结构，所述筒状加强部包裹所述插座舌片的第一端。
  4. 根据权利要求2所述的电子设备，其中，所述插座舌片的第一端设置有围绕所述插座舌片的安装限位部，所述安装限位部定位于所述第一电路板与所述插接限位部之间，所述第一电路板与所述插接限位部之间形成围绕所述安装限位部的间隙，所述基板通过密封连接件与所述内侧端口密封相连，部分所述密封连接件填充在所述间隙内。
  5. 根据权利要求4所述的电子设备，其中，所述壳体的内壁开设有第一凹槽，所述内侧端口连通所述第一凹槽的底壁，所述插接限位部在朝向所述外侧端口的方向与所述第一凹槽的底壁限位配合，所述密封连接件为密封胶，部分所述密封连接件凝固在所述第一凹槽内。
  6. 根据权利要求1所述的电子设备，其中，所述基板包括第一电路板， 所述第一电路板为柔性电路板，所述电子设备还包括第二电路板，所述第二电路板设置于所述内腔中，所述第二电路板为主板，所述插座舌片固定在所述柔性电路板的第一端，所述柔性电路板的第二端与所述主板电连接，所述插座舌片通过柔性电路板与所述主板电连接。
  7. 根据权利要求6所述的电子设备，其中，所述基板还包括补强板件，所述补强板件设于所述第一电路板背向所述插孔的一侧，所述补强板件与所述壳体固定相连。
  8. 根据权利要求7所述的电子设备，其中，所述补强板件开设有第一连接孔，所述第一电路板开设有第二连接孔，所述基板通过穿过所述第一连接孔和所述第二连接孔的螺纹连接件与所述壳体固定相连。
  9. 根据权利要求1所述的电子设备，其中，所述电子设备还包括主板，所述插座舌片与所述主板电连接，其中：
    所述插座舌片与所述主板平行，或者，所述插座舌片与所述主板相垂直。
  10. 根据权利要求1所述的电子设备，其中，所述内腔的底壁开设有第二凹槽，所述基板的部分位于所述第二凹槽内。
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