WO2022220409A1 - Wearable electronic device - Google Patents

Abstract

A wearable electronic device is disclosed. One embodiment comprises: a housing, which has an opening; a temperature sensor module, which is disposed in the housing, comprises a first member, a sensor unit, and a flexible printed circuit board on which the sensor unit is disposed, and, when the wearable electronic device is worn in an ear of a user, measures the temperature of the user; a wireless communication module, which is disposed in the housing, communicates wirelessly with the electronic device, and transmits to the electronic device the body temperature data that the temperature sensor module generated by measuring the temperature; and a main printed circuit board, which is disposed in the housing and is connected to the flexible printed circuit unit of the temperature sensor module, wherein a part of the first member may be exposed to the outside of the wearable electronic device through the opening and face a part of an outer ear of the user.

Description

wearable electronics

Various embodiments relate to a wearable electronic device.

The wearable electronic device may be worn on a user's body (eg, an ear, neck, or wrist). A user may listen to music or make a call with a counterpart through the wearable electronic device.

The wearable electronic device may be connected to an external electronic device by wire or wirelessly.

Since the shape and size of an ear may be different for each user, when a contact-type temperature sensor is embedded in the wearable electronic device, a measurement error of the corresponding temperature sensor may be large and accuracy may decrease.

The contact temperature sensor may measure a temperature higher than body temperature by a heat source (eg, heat generated by the operation of the wearable electronic device and/or heat transferred from the outside).

In order to embed a contact temperature sensor in a wearable electronic device, a structure design that makes good contact with the part to be measured and isolates it from a heat source is required, which may be physically difficult.

It can be difficult to embed a contact temperature sensor into a small wearable electronic device.

According to various embodiments, it is possible to secure a design structure in which a temperature sensor module capable of collecting body temperature information of a user is mounted on a wearable electronic device.

According to various embodiments, it is possible to provide a wearable electronic device that uses data of a temperature sensor module as a wear detection condition.

According to various embodiments, the wearable electronic device includes a housing having an opening, a flexible printed circuit board positioned within the housing, a first member, a sensor part, and a flexible printed circuit board on which the sensor part is positioned, and the wearable electronic device is installed in the user's ear ( ear), a temperature sensor module that measures the user's temperature, is located in the housing, performs wireless communication with an electronic device, and transmits temperature data generated by the temperature sensor module measuring the temperature to the electronic device a wireless communication module for transmitting and a main printed circuit board located in the housing and connected to the flexible printed circuit board of the temperature sensor module, wherein a part of the first member is exposed to the outside of the wearable electronic device through the opening It may be exposed and face a portion of the user's outer ear.

According to various embodiments, the wearable electronic device includes a housing having an opening, located in the housing, a first member, a sensor unit, and a flexible printed circuit board on which the sensor unit is located, and a temperature sensor module for measuring a user's temperature - and a main printed circuit board located in the temperature sensor module and the housing and connected to the flexible printed circuit board, wherein the main printed circuit board includes a predetermined time elapsed after the wearable electronic device is worn on the user's ear. In this case, there is a wireless communication module that performs wireless communication with a processor and an electronic device that control the temperature sensor module so that the temperature sensor module measures the temperature, and transmits the measurement result of the temperature sensor module to the electronic device, A portion of the first member may be exposed to the outside of the wearable electronic device through the opening to face a portion of the user's outer ear.

According to various embodiments, the wearable electronic device includes a housing, a temperature sensor module located in the housing and measuring a user's temperature, a wear detection module located in the housing and detecting whether the user wears the wearable electronic device, A main printed circuit board located in the housing and electrically connected to the flexible printed circuit board, and a processor positioned on the main printed circuit board, wherein the processor is configured to allow the user to wear the wearable electronic device from the wear detection module. receiving a detection result indicating whether the It is possible to check whether the user is within the range, and determine whether the user wears the wearable electronic device based on the check result and the detection result.

According to various embodiments of the present disclosure, body temperature information of a user may be obtained from an ear region through a temperature sensor module in the wearable electronic device.

According to various embodiments, it is possible to allow the user to check the user's biometric information in real time.

According to various embodiments, data of the temperature sensor module may be used as a factor for determining wear detection, so that performance enhancement of the wearable electronic device may be achieved.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.

2 is a diagram for describing an electronic device and a wearable electronic device according to various embodiments of the present disclosure;

3 to 4 are diagrams for explaining a wearable electronic device according to various embodiments of the present disclosure.

5 to 7 are diagrams for explaining a temperature sensor module in a wearable electronic device, according to various embodiments of the present disclosure.

8 is a diagram for describing an example of a temperature sensor module according to various embodiments of the present disclosure.

9 is a view for explaining another example of a temperature sensor module according to various embodiments of the present disclosure.

10 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure;

11 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure.

12 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure;

13 is a view for explaining another example of a temperature sensor module according to various embodiments of the present disclosure;

14 is a diagram for explaining another example of a temperature sensor module according to various embodiments of the present disclosure.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components are assigned the same reference numerals regardless of the reference numerals, and the overlapping description thereof will be omitted.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with at least one of the electronic device 104 and the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 stores a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) into the volatile memory 132 . may be stored in , process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The secondary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as a part of another functionally related component (eg, camera module 180 or communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176 ) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 , or an external electronic device (eg, a sound output module 155 ) connected directly or wirelessly with the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various techniques for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements defined in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of the one or more instructions stored from the storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is different from the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

2 is a diagram for describing an electronic device and a wearable electronic device according to various embodiments of the present disclosure;

Referring to FIG. 2 , the electronic device 210 (eg, the electronic device 101 of FIG. 1 ) may be wirelessly connected to first and second wearable electronic devices 220 - 1 and 220 - 2 . For example, the electronic device 210 may be connected to the first and/or second wearable electronic devices 220 - 1 and 220 - 2 through short-range wireless communication (eg, Bluetooth). The present disclosure is not limited thereto, and each of the first and second wearable electronic devices 220 - 1 and 220 - 2 may be connected to the electronic device 210 by wire.

According to an embodiment, the first and second wearable electronic devices 220 - 1 and 220 - 2 may correspond to devices that can be worn on a part of the body (eg, an ear). For example, each of the first and second wearable electronic devices 220 - 1 and 220 - 2 may be a wireless earphone that can be worn on the ear. The first wearable electronic device 220-1 may be worn on one ear of the user, and the second wearable electronic device 220-2 may be worn on the other ear of the user.

According to an embodiment, the first and second wearable electronic devices 220 - 1 and 220 - 2 may receive an audio signal from the electronic device 210 , and transmit the received audio signal to the first and second wearable electronic devices. The output may be performed through at least one or more speakers included in the electronic devices 220 - 1 and 220 - 2 . The audio signal may include, for example, a voice signal of a call party, a music signal, or a sound signal output during reproduction of multimedia content, but is not limited thereto.

According to an embodiment, the first and second wearable electronic devices 220-1 and 220-2 may receive a user's voice through at least one microphone, and process the received voice to generate voice data. and may transmit the generated voice data to the electronic device 210 .

According to an embodiment, when the first and/or second wearable electronic devices 220-1 and/or 220-2 are worn on each ear of the user, the first and/or second wearable electronic devices 220-1 and/or 220-2 may measure and measure the user's temperature (eg, body temperature). The measured temperature may be transmitted to the electronic device 210 .

According to an embodiment, the electronic device 210 may average the temperature received from each of the first and second wearable electronic devices 220-1 and 220-2 and display it on the display as the user's body temperature. For example, when the electronic device 210 receives the temperature T1 from the first wearable electronic device 220-1 and the temperature T2 from the second wearable electronic device 220-2, (T1+T2)/2 may be calculated. and (T1+T2)/2 can be displayed on the display as the user's body temperature. According to an embodiment, the electronic device 210 may receive temperature information a plurality of times from each of the first and second wearable electronic devices 220-1 and 220-2, and display the temperature information based on the received temperature information. can be displayed in

3 to 4 are diagrams for explaining a wearable electronic device according to various embodiments of the present disclosure.

Referring to FIG. 3 , the wearable electronic device 300 (eg, the first wearable electronic device 220-1 or the second wearable electronic device 220-2 of FIG. 2 ) includes a sensor module 310 and a wireless communication module. 311 , a processor 312 , a microphone 313 , and a speaker 314 .

According to an embodiment, the sensor module 310 may include a temperature sensor module 310 - 1 and/or a wear detection module 310 - 2 .

According to an embodiment, the wear detection module 310 - 2 may include a proximity sensor, a capacitive sensor, a force sensor, an ultrasonic sensor, an acceleration sensor, and a hall. It may include at least one of a sensor (hall sensor).

According to an embodiment, the wear detection module 310 - 2 may detect whether the wearable electronic device 300 is worn on the user's ear, and transmit the detection result to the processor 312 .

According to an embodiment, when the processor 312 receives a detection result indicating that the wearable electronic device 300 is worn on the user's ear from the wear detection module 310-2, the temperature sensor module 310-1 The temperature sensor module 310-1 may be controlled to measure the temperature of

According to an embodiment, the wearable electronic device 300 may include a sensor hub (not shown). The processor 312 may receive an operation result of the wear detection module 310 - 2 (eg, a detection result indicating whether the wearable electronic device 300 is worn on the user's ear) through the sensor hub. When it is detected that the wearable electronic device 300 is worn on the user's ear, the processor 312 may control the sensor hub so that the temperature sensor module 310-1 measures the user's temperature.

According to one embodiment, the processor 312 may be put to sleep to save power and the sensor hub may be woken up. The sensor hub may receive an operation result of the wear detection module 310 - 2 (eg, a detection result indicating whether the wearable electronic device 300 is worn on the user's ear). The sensor hub connects the temperature sensor module 310-1 so that the temperature sensor module 310-1 measures the user's temperature without the control of the processor 312 when it is detected that the wearable electronic device 300 is worn on the user's ear. can be controlled For example, the sensor hub may transmit the temperature obtained through the temperature sensor module 310-1 to the processor 312 .

According to an embodiment, the temperature sensor module 310-1 may include a first member (eg, a window), a sensor unit, a metal cap, a first circuit, and a flexible printed circuit board.

According to an embodiment, the sensor unit and the first circuit may be located on a flexible printed circuit board.

According to an embodiment, the metal cap may surround the sensor unit and/or the first circuit, and may be bonded to the flexible printed circuit board and the first member. The sensor unit and the first circuit may be protected by the metal cap.

According to an embodiment, a portion of the first member of the temperature sensor module 310-1 may face a portion of the user's outer ear when the wearable electronic device 300 is worn on the user's ear.

According to an embodiment, the first member of the temperature sensor module 310-1 may be formed of a material capable of transmitting radiant heat. Radiant heat may have a wavelength of, for example, a long infrared band, and the first member of the temperature sensor module 310-1 may be formed of a material capable of transmitting a wavelength of a long infrared band. For example, the first member of the temperature sensor module 310-1 may be formed of silicon, germanium, chalcogenide, or polyethylene having strong heat resistance, but is limited thereto. doesn't happen

According to an embodiment, the first member of the temperature sensor module 310-1 may be transparent or translucent, but is not limited thereto. In an embodiment, regardless of transparency, it may be sufficient for the first member of the temperature sensor module 310-1 to transmit radiant heat to the sensor unit. The first member of the temperature sensor module 310-1 may be glass or plastic, but is not limited thereto.

According to an embodiment, when the user wears the wearable electronic device 300 on the ear, radiant heat (or infrared rays) radiated from a part of the outer ear may pass through the first member and may be directed toward the sensor unit. In other words, the sensor unit may detect the radiant heat transmitted through the first member.

According to an embodiment, the sensor unit of the temperature sensor module 310-1 may include an infrared sensor and an ambient temperature sensor. The infrared sensor may generate first data by sensing the radiant heat transmitted through the first member, and may transmit the generated first data to the first circuit. The ambient temperature sensor may measure the internal temperature of the temperature sensor module 310-1, and may transmit the measured internal temperature to the first circuit.

According to an embodiment, the first circuit may be an application-specific integrated circuit (ASIC).

According to an embodiment, the first circuit may generate the user's temperature data using the first data received from the infrared sensor and the measured internal temperature of the temperature sensor module 310-1. For example, the first circuit may generate initial temperature data by converting the first data of the infrared sensor, and may generate the user's temperature data by compensating for the initial temperature data using the measurement result of the ambient temperature sensor. The first circuit may transmit the generated temperature data to the processor 312 . The processor 312 may transmit the temperature data to the electronic device 210 using the wireless communication module 311 .

According to an embodiment, the wireless communication module 311 may receive audio data from the electronic device 210 . According to an embodiment, the wireless communication module 311 may include a Bluetooth communication module, but is not limited thereto.

According to an embodiment, the speaker 314 may receive and output audio data from the wireless communication module 311 . For example, the wearable electronic device 300 may include one or more speakers 314 .

According to an embodiment, the microphone 313 may receive a user's voice, the processor 312 may process the received voice, and transmit the processed voice to the wireless communication module 311 . For example, the wearable electronic device 300 may include one or more microphones 313 . The wireless communication module 311 may transmit the processed voice to the electronic device 210 .

According to an embodiment, the processor 312 may use the detection result of the wear detection module 310 - 2 to determine whether the wearable electronic device 300 is worn by the user. According to another embodiment, the processor 312 combines the detection result of the wear detection module 310 - 2 with the temperature data generated by the temperature sensor module 310 - 1 so that the wearable electronic device 300 is worn by the user. It can be determined whether or not For example, the processor 312 may receive a detection result indicating that the wearable electronic device 300 is worn by the user from the wear detection module 310 - 2 . Even when the wear detection module 310 - 2 detects that the user wears the wearable electronic device 300 , the processor 312 may not make a final determination that the user wears the wearable electronic device 300 , and the temperature sensor The module 310-1 may be controlled to measure the user's temperature. The processor 312 may receive the temperature data from the temperature sensor module 310-1, and may determine whether the temperature data is within a body temperature range of a person. When the temperature data is within the body temperature range of the person, the processor 312 may finally determine that the wearable electronic device 300 is worn by the user.

According to an embodiment, the wear detection module 310 - 2 may be omitted in the wearable electronic device 300 , and the processor 312 allows a user to use the wearable electronic device through temperature data of the temperature sensor module 310 - 1 . It can be determined whether the 300 is worn.

According to an embodiment, high resolution may be required for body temperature measurement, so calibration of the infrared sensor may be required. According to an embodiment, for calibration of the infrared sensor, the temperature sensor module 310-1 may include a memory (eg, the memory 130 of FIG. 1 ) capable of storing various values or parameters for calibration. .

4 illustrates an example of an appearance of the wearable electronic device 300 according to an embodiment.

According to an embodiment, the wearable electronic device 300 may include a housing 410 .

According to an embodiment, the sensor module 310 , the wireless communication module 311 , the processor 312 , the microphone 313 , and the speaker 314 of FIG. 3 may be located inside the housing 410 .

According to an embodiment, an opening 411 may be formed in the housing 410 , and a portion 412 of the first member of the temperature sensor module 310-1 may be exposed to the outside through the opening 411 . have.

According to an embodiment, when the user wears the wearable electronic device 300 on one ear, a portion 412 of the first member of the temperature sensor module 310-1 may face a portion of the user's outer ear. For example, when the user wears the wearable electronic device 300 on one ear, a portion 412 of the first member of the temperature sensor module 310-1 is a concha of the outer ear and a crus of helix. , intertragal notch, or tragus medial. However, the present invention is not limited thereto, and according to a state in which the user wears the wearable electronic device 300 , a portion 412 of the first member of the temperature sensor module 31 - 1 may face another portion of the outer ear.

5 to 7 are diagrams for explaining a temperature sensor module in a wearable electronic device, according to various embodiments of the present disclosure.

A perspective view of the temperature sensor module 310-1 is shown in FIG. 5, a bottom perspective view of the temperature sensor module 310-1 is shown in FIG. 6, and the temperature sensor module 310-1 of FIG. A side view viewed from the side (eg the x-axis) is shown.

According to an exemplary embodiment, the side shape of the first member 510 may be in the shape of “ㅗ” or in the shape of a hat (eg, in the shape of a fedora hat).

According to an embodiment, the first member 510 includes a first portion 510-1 for transmitting radiant heat (or infrared light) radiated from a portion of the user's outer ear and a first member for bonding with the inner wall of the housing 410 . It may include two parts 510 - 2 . An adhesive may be present on an upper surface (eg, a surface in the z-axis direction) of the second part 510 - 2 , so that the temperature sensor module 31 - 1 may be bonded to the housing 410 . Depending on the embodiment, the adhesive may act as a waterproofing agent.

According to an embodiment, the first surface (or upper surface) (eg, the z-axis direction surface) of the first portion 510-1 may be exposed to the outside through the opening 411 of FIG. 4 .

According to an embodiment, the first part 510-1 may protrude in the first direction (eg, the z-axis direction) than the second part 510-2.

According to an embodiment, the metal cap 520 may be bonded to the flexible printed circuit board 530 and the first member 510 . The metal cap 520 may be electrically connected to the ground of the flexible printed circuit board 530 .

According to an embodiment, although not shown in FIGS. 5 to 7 , a cushion for shock absorption may be provided on a bottom surface (eg, a -z-axis direction surface) of the flexible printed circuit board 530 .

8 is a diagram for describing an example of a temperature sensor module according to various embodiments of the present disclosure.

In FIG. 8, an example of a cross-sectional view taken from 5A-5A' of FIG. 5 is shown.

According to an embodiment, the first member 810 (eg, the first member 510 of FIG. 5 ) has a first portion 810-1 ( Example: including the first part 510-1 of FIG. 5) and the second part 810-2 for bonding to the inner wall of the housing 410 (eg, the second part 510-2 of FIG. 5). can do. According to an embodiment, an adhesive may be present on the first surface (eg, the z-axis direction surface) of the second part 810 - 2 .

According to an embodiment, the cross-sectional shape of the first part 810 - 1 may be a quadrangle.

According to an embodiment, at least one hole 822 may be formed in the first surface 821 of the metal cap 820 (eg, the metal cap 520 of FIG. 5 ). Radiant heat transmitted through the first portion 810 - 1 of the first member 810 may reach the sensor unit 840 through at least one hole 822 .

According to an embodiment, the first surface 821 of the metal cap 820 is the sensor unit so that a space can be secured between the sensor unit 840 and the first part 810 - 1 of the first member 810 . It may be spaced apart from the 840 by a predetermined distance.

According to an embodiment, the sensor unit 840 is configured to measure an infrared sensor for detecting radiant heat and an internal temperature of the temperature sensor module 310-1 (or a temperature of an internal space formed by the metal cap 820). It may include an ambient temperature sensor.

According to an embodiment, the first circuit (not shown) may be located on the flexible printed circuit board 830 and may be located in an internal space formed by the metal cap 820 .

9 is a view for explaining another example of a temperature sensor module according to various embodiments of the present disclosure.

In FIG. 9 , another example of a cross-sectional view taken from 5A-5A' of FIG. 5 is shown.

According to an embodiment, the first member 910 (eg, the first member 510 of FIG. 5 ) is a first portion 910 - 1 for transmitting radiant heat radiated from the user's outer ear to the sensor unit 940 . ) (eg, the first part 510-1 of FIG. 5) and the second part 910-2 for bonding to the inner wall of the housing 410 (eg, the second part 510-2 of FIG. 5) may include According to an embodiment, an adhesive may be present on the first surface (eg, the z-axis direction surface) of the second part 910 - 2 .

According to an embodiment, the shape of the cross-section of the first part 910-1 is "

"It could be

According to an embodiment, at least one hole 922 may be formed in the first surface 921 of the metal cap 920 . Radiant heat transmitted through the first portion 910 - 1 may reach the sensor unit 940 through at least one hole 922 .

According to an embodiment, the first surface (eg, the surface in the z-axis direction) 910 - 1a of the first part 910 - 1 may be exposed to the outside through the opening 411 of the housing 410 , , at least a portion of the second surface (eg, the surface in the -z-axis direction) 910-1b of the first portion 910-1 passes through at least one hole 950 of the metal cap 920 through the sensor unit ( 940) can be encountered. In an embodiment, the second surface 910 - 1b may be a surface of the first recess RS1.

According to an embodiment, the shape of the cross-section of the first part 910 - 1 is "

“Then, a space may be secured between the sensor unit 940 and the first portion 910 - 1 . A part or all of an upper portion of the first surface 921 of the metal cap 920 may be formed by the first member 910 . ) and a portion or all of a lower portion of the first surface 921 of the metal cap 920 may be bonded to the first surface (eg, a surface in the z-axis direction) of the sensor unit 940 .

According to an embodiment, the metal cap 920 may be bonded to the flexible printed circuit board 930 and may be electrically connected to the ground of the flexible printed circuit board 930 .

10 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure;

In FIG. 10 , another example of a cross-sectional view taken from 5A-5A' of FIG. 5 is shown.

According to an embodiment, the first member 1010 (eg, the first member 510 of FIG. 5 ) has a first portion 1010-1 (eg, FIG. 5 ) for transmitting radiant heat to the sensor unit 1040 . a first portion 510-1) of the housing 410 and a second portion 1010-2 (eg, the second portion 510-2 of FIG. 5) for bonding to the inner wall of the housing 410). According to an embodiment, an adhesive may be present on the first surface (eg, the surface in the z-axis direction) of the second part 1010 - 2 .

According to an embodiment, the first surface (eg, the surface in the z-axis direction) 1010-1a of the first part 1010-1 may be exposed to the outside through the opening 411 of the housing 410 and , a portion of the second surface (eg, a surface in the -z-axis direction) 1010-1b of the first portion 1010-1 is at least one hole 1022 of the first surface 1021 of the metal cap 1020 ) to face the sensor unit 1040 . In an embodiment, the second surface 1010-1b may be a surface of the second recess RS2.

According to an embodiment, the cross-sectional shape of the first part 1010-1 may be the cross-sectional shape of the aspherical convex lens. In other words, the second surface (eg, the surface in the -z-axis direction) 1010-1b may be in the form of an aspherical convex lens. Since the shape of the second surface 1010-1b may be an aspherical convex lens shape, radiation heat may be more focused, the field of view (FOV) of the sensor unit 1040 may be reduced, and the first member ( 1010) can be reduced.

According to an embodiment, the metal cap 1020 may be bonded to the flexible printed circuit board 1030 , and may be electrically connected to the ground of the flexible printed circuit board 1030 .

11 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure.

In FIG. 11 , another example of a cross-sectional view taken from 5A-5A' of FIG. 5 is shown.

According to an embodiment, the first member 1110 (eg, the first member 510 of FIG. 5 ) is a first part 1110 - 1 (eg, FIG. 5 ) for transmitting radiant heat to the sensor unit 1140 . a first portion 510-1) of the housing 410 and a second portion 1110-2 (eg, the second portion 510-2 of FIG. 5 ) for bonding to the inner wall of the housing 410 . According to an embodiment, an adhesive may be present on the first surface (eg, the surface in the z-axis direction) of the second part 1110 - 2 .

According to an embodiment, a first surface (eg, a surface in the z-axis direction) 1110-1a of the first part 1110-1 may be exposed to the outside through the opening 411 of the housing 410, and , at least one hole 1122 of the first surface 1121 of the metal cap 1120 is a part of the second surface (eg, the surface in the -z-axis direction) 1110-1b of the first portion 1110-1. ) to face the sensor unit 1140 . In an embodiment, the second surface 1110-1b may be a surface of the third recess RS3.

According to an embodiment, the shape of the cross-section of the first part 1110-1 may be that of a cross-section of a Fresnel lens. In other words, the second surface (eg, the surface in the -z-axis direction) 1110-1b may be in the form of a Fresnel lens. When the second surface (eg, a surface in the -z-axis direction) 1110-1b of the first portion 1110-1 has a Fresnel lens shape, radiation heat may be more concentrated and the sensor unit 1140 may decrease, and the size of the first member 1110 may be reduced.

According to an embodiment, the metal cap 1120 may be bonded to the flexible printed circuit board 1130 , and may be electrically connected to the ground of the flexible printed circuit board 1130 .

12 is a diagram for describing another example of a temperature sensor module according to various embodiments of the present disclosure;

In FIG. 12 , another example of a cross-sectional view taken from 5A-5A' of FIG. 5 is shown.

According to an embodiment, the metal cap 1220 may be bonded to the first member 1210 and the flexible printed circuit board 1230 .

According to an embodiment, the metal cap 1220 has a side portion surrounding the side surface of the sensor unit 1240 , and the first surface surrounding the upper surface (eg, a surface in the z-axis direction) of the sensor unit 1240 is there may not be

According to an embodiment, the metal cap 1220 may be bonded to the flexible printed circuit board 1230 and may be electrically connected to the ground of the flexible printed circuit board 1230 .

According to an embodiment, the shape of the first member 1210 may be the same as one of the shapes of the first members 910 to 1110 of FIGS. 9 to 11 .

13 is a view for explaining another example of a temperature sensor module according to various embodiments of the present disclosure.

In the case of the example shown in FIG. 13 , the temperature sensor module 1300 may not have a metal cap.

According to an embodiment, the temperature sensor module 1300 may include a first member 1310 , a first element 1320 , and a flexible printed circuit board 1330 .

According to an embodiment, the first device 1320 includes a sensor unit 1320 - 1 , a first circuit 1320 - 2 , a substrate 1320 - 3 , a molding member 1320 - 4 , and a coating layer 1320 - 5) may be included.

According to an embodiment, the sensor unit 1320-1 and the first circuit 1320-2 may be electrically connected, and the first circuit 1320-2 may be electrically connected to the substrate 1320-3 through wire bonding. can be connected to In another embodiment, the sensor unit 1320-1 and the first circuit 1320-2 may be formed of a chip, and the chip may be electrically connected to the substrate 1320-3 through wire bonding. have.

According to an embodiment, the sensor unit 1320-1, the first circuit 1320-2, and the substrate 1320-3 may be molded to form a package, and a coating layer 1320-5 is formed on the surface of the package. ) (eg, a conductive coating layer) may be formed. A portion of the coating layer and a part of the molding member are removed from the package on which the coating layer 1320-5 is formed so that the upper surface (eg, the surface in the z-axis direction) of the sensor unit 1320-1 is exposed, and the first device shown in FIG. 13 . 1320 may be formed.

According to an embodiment, the first device 1320 may be bonded to the flexible printed circuit board 1330 and the first member 1310 . The radiant heat may pass through the first member 1310 and be transmitted to the sensor unit 1320 - 1 .

According to an embodiment, the coating layer 1320 - 5 may be electrically connected to the ground of the flexible printed circuit board 1330 .

According to an embodiment, the shape of the first member 1310 may be the same as one of the shapes of the first members 910 to 1110 of FIGS. 9 to 11 .

14 is a diagram for explaining another example of a temperature sensor module according to various embodiments of the present disclosure.

A side view of the temperature sensor module 1400 is shown in FIG. 14 .

According to an embodiment, the shape of the first member 1410 may be a “TT” shape.

According to an embodiment, the first member 1410-1 includes a first part 1410-1 for transmitting infrared rays so that infrared rays emitted from a part of the outer ear reach the sensor unit and a second part for bonding with surrounding structures. (1410-2).

According to an embodiment, a cross-section of a side surface of the first portion 1410-1 may be the same as one of cross-sections of the first portions 810-1 to 1210-1 of FIGS. 8 to 12 . For example, the first part 1410-1 may not have a recess so that the shape of the cross-section of the first part 1410-1 may be the same as the shape of the cross-section of the first part 810-1 of FIG. 8 . have. As another example, there may be a first recess RS1 in the first part 1410-1, so that the cross-sectional shape of the first part 1410-1 is that of the first part 910-1 of FIG. shape may be the same. As another example, there may be a second recess RS2 in the first part 1410-1, so that the cross-sectional shape of the first part 1410-1 is the first part 1010-1 of FIG. may have the same shape as As another example, there may be a third recess RS3 in the first part 1410-1, so that the cross-sectional shape of the first part 1410-1 is the first part 1110-1 of FIG. 11 . may have the same shape as As another example, the first surface (eg, the z-axis direction) of the metal cap 1420 may not cover the sensor unit, so the shape of the cross-section of the first portion 1410 - 1 is the first portion ( 1210-1) may be the same as the shape of the present invention.

According to an embodiment, the metal cap 1420 may be bonded to the first member 1410 and the flexible printed circuit board 1430 , and a sensor unit (not shown) in the inner space formed by the metal cap 1420 and A first circuit (not shown) may be located.

The temperature sensor module 1400 shown in FIG. 14 may be substantially the same as the temperature sensor module 310-1 except for the shape of the first member.

According to an embodiment, the wearable electronic device 300 includes a housing 410 having an opening 411 formed therein, and is positioned in the housing 410 , and a flexible printed circuit board on which the first member 510 , the sensor unit, and the sensor unit are positioned. A temperature sensor module 310 - 1 that includes a 530 and measures a user's temperature when the wearable electronic device 300 is worn on the user's ear, is located in the housing 410 , and the electronic device 210 . is located in the wireless communication module 311 and the housing 410 that performs wireless communication with the electronic device 210 and transmits the temperature data generated by the temperature sensor module 310-1 measuring the user's temperature to the electronic device 210, the temperature It may include a main printed circuit board connected to the flexible printed circuit board 530 of the sensor module 310-1.

According to an embodiment, a portion of the first member 510 may be exposed to the outside of the wearable electronic device 300 through the opening 411 to face a portion of the user's outer ear.

According to an embodiment, the processor 312 may be located on the main printed circuit board, the processor 312 receives temperature data from the temperature sensor module 310-1, and the wearable electronic device 300 through the temperature data. ) can be determined to be worn.

According to an embodiment, the temperature sensor module 310-1 may further include a metal cap 520 that surrounds the sensor unit and is bonded to the flexible printed circuit board 530 and the first member 510. .

According to an embodiment, at least one hole 822 is formed on the first surface 821 of the metal cap 520 so that the user's infrared rays passing through the first member 510 reach the sensor unit. can

According to an embodiment, the first member 510 includes a first part 510-1 for transmitting infrared rays so that infrared rays emitted from a part of the outer ear reach the sensor unit and a first member 510 for bonding with the inner wall of the housing 410. It may include two parts 510 - 2 .

According to an embodiment, a part or all of the first surface of the first part 510-1 may be exposed to the outside through the opening 411, and the second surface of the first part 510-1 is a sensor. You can face wealth.

According to an embodiment, the shape of the second surface of the first part 510-1 may include an aspherical lens shape or a Fresnel lens shape.

According to an embodiment, the shape of the first member 510 may be a hat shape.

According to an embodiment, the sensor unit may include an infrared sensor that detects the user's infrared rays to generate first data, and an ambient temperature sensor that measures the internal temperature of the temperature sensor module 310-1. have.

According to an embodiment, the temperature sensor module 310 - 1 may further include a first circuit positioned on the flexible printed circuit board 530 .

According to an embodiment, the first circuit may generate the user's temperature data by using the first data of the infrared sensor and the measurement result of the ambient temperature sensor.

According to an embodiment, the wear detection module 310 - 2 is located in the housing 410 and detects whether the wearable electronic device 300 is worn on the ear, is located in the housing 410 , and receives a user's voice. 313, located in the housing 410, located in the speaker 314 and the housing 410 for outputting audio data received from the electronic device 210 through the wireless communication module 311, and processing the received voice It may further include a processor 312 .

According to an embodiment, the wireless communication module 311 may transmit the processed voice to the electronic device 210 .

According to an embodiment, the wearable electronic device 300 includes a housing 410 having an opening 411 formed therein, and a flexible printed circuit board on which the first member 510, the sensor unit, and the sensor unit are located. 530 , the temperature sensor module 310-1 for measuring the user's temperature, and a main printed circuit board located in the housing 410 and connected to the flexible printed circuit board 530 may be included.

According to an embodiment, the temperature sensor module 310 on the main printed circuit board so that the temperature sensor module 310 - 1 measures the temperature when a predetermined time has elapsed after the wearable electronic device 300 is worn on the user's ear. The wireless communication module 311 that performs wireless communication with the processor 312 and the electronic device 210 that controls -1) and transmits the measurement result of the temperature sensor module 310-1 to the electronic device 210 is can be located

According to an embodiment, a portion of the first member 510 may be exposed to the outside of the wearable electronic device 300 through the opening 411 to face a portion of the user's outer ear.

According to an embodiment, the temperature sensor module 310-1 may further include a metal cap 520 that surrounds the sensor unit and is bonded to the flexible printed circuit board 530 and the first member 510 .

According to an embodiment, at least one hole 822 may be formed in the first surface 821 of the metal cap 520 so that the user's infrared rays passing through the first member 510 reach the sensor unit.

According to an embodiment, the first member 510 includes a first part 510-1 for transmitting infrared rays so that infrared rays emitted from a part of the outer ear reach the sensor unit and a first member 510 for bonding with the inner wall of the housing 410. It may include two parts 510 - 2 .

According to an embodiment, a part or all of the first surface of the first part 510-1 may be exposed to the outside through the opening 411, and the second surface of the first part 510-1 is a sensor. You can face wealth.

According to an embodiment, the shape of the second surface may include an aspherical lens shape or a Fresnel lens shape.

According to an embodiment, the shape of the first member 510 may be a hat shape.

According to an embodiment, the wearable electronic device 300 is located in a housing 410 , located in the housing 410 , a temperature sensor module 310 - 1 measuring a user's temperature, and located in the housing 410 , and the wearable electronic device 300 is located in the housing 410 , when the user wears the wearable device. A wear detection module 310-2 for detecting whether the electronic device 300 is worn, located in the housing 410, and connected to the main printed circuit board and the main printed circuit board electrically connected to the flexible printed circuit board 530 It may include a processor 312 located there.

According to an embodiment, the processor 312 receives a detection result indicating whether the user wears the wearable electronic device 300 from the wear detection module 310 - 2 , and the temperature sensor module 310 - 1 receives the temperature. controls the temperature sensor module 310-1 to measure the temperature, receives the temperature data generated by measuring the temperature from the temperature sensor module 310-1, checks whether the temperature data is within the body temperature range, the confirmation result and Based on the detection result, it may be determined whether the user wears the wearable electronic device 300 .

According to an embodiment, when the wear detection module 310 - 2 detects that the user wears the wearable electronic device 300 and the temperature data is within the body temperature range, the can be judged to have been worn.

According to an embodiment, the temperature sensor module 310-1 may include a first member 510, a sensor unit, and a flexible printed circuit board 530 on which the sensor unit is positioned.

According to an embodiment, a portion of the first member 510 may be exposed to the outside of the wearable electronic device 300 through the opening 411 formed in the housing 410 to face a portion of the user's outer ear.

Claims (15)

1. A wearable electronic device comprising:

   a housing having an opening;

   A temperature sensor located in the housing, comprising a first member, a sensor unit, and a flexible printed circuit board on which the sensor unit is located, and measuring the temperature of the user when the wearable electronic device is worn on the user's ear module;

   a wireless communication module located in the housing, performing wireless communication with an electronic device, and transmitting temperature data generated by the temperature sensor module measuring the temperature to the electronic device; and

   A main printed circuit board located in the housing and connected to the flexible printed circuit board of the temperature sensor module

   including,

   A portion of the first member is exposed to the outside of the wearable electronic device through the opening to face a portion of the user's outer ear,

   wearable electronics.
2. According to claim 1,

   A processor is located on the main printed circuit board,

   the processor receives the temperature data from the temperature sensor module, and determines that the wearable electronic device is worn through the temperature data;

   wearable electronics.
3. According to claim 1,

   The temperature sensor module,

   A metal cap surrounding the sensor unit and bonded to the flexible printed circuit board and the first member

   further comprising,

   wearable electronics.
4. 4. The method of claim 3,

   At least one hole is formed in the first surface of the metal cap so that the user's infrared rays passing through the first member reach the sensor unit,

   wearable electronics.
5. According to claim 1,

   The first member is

   a first portion for transmitting the infrared rays emitted from a portion of the outer ear to reach the sensor unit; and

   a second portion for joining with the inner wall of the housing

   comprising,

   wearable electronics.
6. 6. The method of claim 5,

   a part or all of the first surface of the first part is exposed to the outside through the opening,

   At least a portion of the second surface of the first portion faces the sensor unit,

   wearable electronics.
7. 7. The method of claim 6,

   The shape of the second surface comprises an aspherical lens shape or a Fresnel lens shape,

   wearable electronics.
8. According to claim 1,

   The shape of the first member is a hat shape,

   wearable electronics.
9. According to claim 1,

   The sensor unit may include: an infrared sensor that detects the user's infrared and generates first data; and an ambient temperature sensor for measuring the internal temperature of the temperature sensor module,

   The temperature sensor module further comprises a first circuit located on the flexible printed circuit board,

   The first circuit generates the user's temperature data by using the first data of the infrared sensor and the measurement result of the ambient temperature sensor,

   wearable electronics.
10. According to claim 1,

    a wear detection module located in the housing and configured to detect whether the wearable electronic device is worn on the ear;

    a microphone located in the housing and receiving the user's voice;

    a speaker located in the housing and configured to output audio data received from the electronic device through the wireless communication module; and

    A processor located in the housing and processing the received voice

    further comprising,

    The wireless communication module transmits the processed voice to the electronic device,

    wearable electronics.
11. A wearable electronic device comprising:

    a housing having an opening;

    a temperature sensor module located in the housing, including a first member, a sensor unit, and a flexible printed circuit board on which the sensor unit is located, and measuring a user's temperature; and

    A main printed circuit board located in the housing and connected to the flexible printed circuit board

    including,

    The main printed circuit board,

    a processor for controlling the temperature sensor module so that the temperature sensor module measures the temperature when a predetermined time has elapsed after the wearable electronic device is worn on the user's ear; and

    A wireless communication module that performs wireless communication with an electronic device and transmits a measurement result of the temperature sensor module to the electronic device is located;

    A portion of the first member is exposed to the outside of the wearable electronic device through the opening to face a portion of the user's outer ear,

    wearable electronics.
12. 12. The method of claim 11,

    The temperature sensor module,

    A metal cap surrounding the sensor unit and bonded to the flexible printed circuit board and the first member

    further comprising,

    wearable electronics.
13. 13. The method of claim 12,

    At least one hole is formed in the first surface of the metal cap so that the user's infrared rays passing through the first member reach the sensor unit,

    wearable electronics.
14. 12. The method of claim 11,

    The first member is

    a first portion for transmitting the infrared rays emitted from a portion of the outer ear to reach the sensor unit; and

    a second portion for joining with the inner wall of the housing

    containing,

    wearable electronics.
15. 15. The method of claim 14,

    a part or all of the first surface of the first part is exposed to the outside through the opening,

    At least a portion of the second surface of the first portion faces the sensor unit,

    wearable electronics.

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