WO2023068582A1

WO2023068582A1 - Wireless charging coil and electronic device comprising same

Info

Publication number: WO2023068582A1
Application number: PCT/KR2022/014439
Authority: WO
Inventors: 류지수; 이승태
Original assignee: 삼성전자 주식회사
Priority date: 2021-10-18
Filing date: 2022-09-27
Publication date: 2023-04-27
Also published as: KR20230055245A

Abstract

An electronic device according to various embodiments of the present disclosure comprises: a housing; a battery disposed in the housing; a coil unit, which is disposed in the housing, and includes a substrate and a first coil of a spiral pattern formed on the substrate and electrically connected to the battery; and a temperature sensing unit, which is formed on the substrate, is disposed at a first designated distance from any one of straight lines passing through the center of the first coil, and is disposed at a second designated distance that is shorter than the first designated distance from the edge of the first coil, wherein the first coil may include a first curvature part in which at least one portion of the edge is recessed toward the center of the first coil.

Description

Wireless charging coil and electronic device including the same

Various embodiments disclosed in this document relate to an electronic device, for example, a wireless charging coil and an electronic device including the same.

Thanks to the remarkable development of information and communication technology and semiconductor technology, the supply and use of various electronic devices are rapidly increasing. Recently, electronic devices are being developed to be portable and communicate.

Electronic devices include home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, and vehicle navigation devices that perform specific functions according to installed programs. can mean For example, these electronic devices may output stored information as sound or image. As the degree of integration of electronic devices increases and ultra-high-speed, large-capacity wireless communication becomes common, recently, a single electronic device such as a mobile communication terminal may be equipped with various functions. For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, and functions such as schedule management and electronic wallets are integrated into one electronic device. will be. These electronic devices are miniaturized so that users can conveniently carry them.

In addition, in the information-based society, the importance of sensors and power supply problems embedded in electronic devices is gradually emerging in order for information communication devices to access and operate each other regardless of time or place. In general, as the types of mobile devices such as mobile phones are rapidly increasing, the task of charging the battery of the mobile device requires time and effort from users, and wireless power transmission technology has recently attracted attention as a method of solving this problem. are receiving For example, a wireless power receiver, such as a mobile device that wirelessly receives energy, is driven by the received wireless power or charges a battery using the received wireless power and is driven by the charged power. can

Wireless power transmission or wireless energy transfer is a technology that wirelessly transmits electrical energy from a transmitter to a receiver using the induction principle of a magnetic field. Energy transfer methods using wireless are largely magnetic induction and magnetic resonance ( Electromagnetic Resonance) method and power transmission method using short-wavelength radio frequency.

In general, a structure for wireless charging may be disposed toward a rear surface of the electronic device (eg, in a direction opposite to a display arrangement direction) of the electronic device. The wireless charging structure may include a substrate (eg, a flexible printed circuit board) and a wireless charging coil mounted on the substrate. Such a wireless charging structure may generate heat in the process of charging an electronic device through a charger such as a wireless charging pad. In this case, in order to prevent the external surface of the electronic device from increasing in temperature due to excessive heat generation of the wireless charging structure, the electronic device may include a sensor for detecting the temperature of the wireless charging structure. When the temperature of the wireless charging structure rises above a preset value, the detection sensor may transmit information about this to the processor. The processor may reduce the heat generated from the wireless charging structure to some extent by lowering the charging speed of the electronic device through the wireless charging structure.

Various embodiments disclosed in this document may provide a wireless charging coil with improved reliability for the temperature of a protection circuit module and/or the temperature of a wireless charging coil measured by a temperature sensor, and an electronic device including the same. .

However, the problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present invention.

An electronic device according to various embodiments disclosed in this document includes a housing, a battery disposed in the housing, and a coil unit disposed in the housing, including a substrate and a spiral formed on the substrate and electrically connected to the battery. It is formed on the coil unit including the first coil of the pattern and the substrate, is disposed at a first designated distance from any one of straight lines passing through the center of the first coil, and from an edge of the first coil. A temperature sensor disposed at a second designated distance smaller than the first designated distance, and the first coil may include a first curvature portion formed such that at least a portion of an edge is depressed toward a center of the first coil. there is.

An electronic device according to various embodiments disclosed in this document includes a housing, a battery disposed in the housing and including a protection circuit module, and a coil unit disposed in the housing, including a substrate and a battery disposed on the substrate. It is formed on a coil part including a first coil of a spiral pattern formed and electrically connected to the battery and the substrate, and is formed on a first designated line from any one of straight lines passing through the center of the protection circuit module. and a temperature sensor disposed at a second designated distance from an edge of the first coil that is smaller than the first designated distance, wherein at least one part of an edge of the first coil is at a center of the first coil ( It may include a first curvature portion formed to be depressed toward the center).

An electronic device according to various embodiments disclosed in this document includes a housing, a battery disposed in the housing, a wireless communication circuit disposed in the housing, and a coil unit disposed in the housing, and formed on the substrate and A coil unit including a first coil electrically connected to a battery, formed on the substrate, disposed at a first designated distance from any one of straight lines passing through a center of the first coil, the first coil A temperature sensor disposed at a second designated distance smaller than the first designated distance from an edge of a temperature sensor disposed on the substrate and electrically connected to the wireless communication circuit, at least a portion of which surrounds the first coil. It includes two coils, the first coil includes a first curvature portion formed such that at least a portion of an edge is depressed toward the center of the first coil, and the second coil includes at least a portion of an edge of the first coil. A second curvature portion formed to be depressed toward the center of the coil may be included.

According to various embodiments disclosed in this document, reliability of the temperature of the protection circuit module and/or the temperature of the wireless charging coil measured by the temperature sensor may be secured.

According to various embodiments disclosed in this document, by accurately measuring the temperature of the protection circuit module and/or the temperature of the wireless charging coil, unnecessary charging heat control can be minimized and the battery wireless charging time can be shortened.

1 is a block diagram of an electronic device in a network environment, according to various embodiments.

2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.

3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure;

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

5 is a schematic diagram illustrating a disposition relationship of a substrate, a protective circuit module, and a first coil according to various embodiments of the present disclosure.

6 is a plan view illustrating a substrate and a first coil according to various embodiments of the present disclosure.

FIG. 7 is an enlarged view of a partial area of FIG. 6 according to various embodiments of the present disclosure.

8 is a plan view illustrating a substrate, a first coil, a second coil, and a third coil according to various embodiments of the present disclosure.

9A is a graph showing a temperature change of the first coil during wireless charging according to a comparative example, and FIG. 9B is a diagram showing a temperature change of the first coil during wireless charging according to an embodiment of the present disclosure.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that may operate independently of or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 uses less power than the main processor 121 or is set to be specialized for a designated function. It can be. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module). It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external

electronic devices

102 , 104 , and 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish that component from other corresponding components, and may refer to that component in other respects (eg, importance or order) is not limited. A (eg, first) component is said to be "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure;

Referring to FIGS. 2 and 3 , the electronic device 101 according to an embodiment has a front side 310A, a back side 310B, and a side surface 310C surrounding a space between the front side 310A and the back side 310B. It may include a housing 310 including a). In another embodiment (not shown), the housing 310 may refer to a structure forming some of the front face 310A of FIG. 2 , the rear face 310B and the side face 310C of FIG. 3 . According to one embodiment, the front surface 310A may be formed by a front plate 302 (eg, a glass plate or a polymer plate including various coating layers) that is substantially transparent at least in part. The rear surface 310B may be formed by the rear plate 311 . The rear plate 311 may be formed of, for example, glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side surface 310C may be formed by a side bezel structure (or "side member") 318 coupled to the front plate 302 and the rear plate 311 and including metal and/or polymer. In some embodiments, the back plate 311 and the side bezel structure 318 may be integrally formed and include the same material (eg, glass, a metal material such as aluminum, or ceramic).

In the illustrated embodiment, the front plate 302 includes two first edge regions 310D curved from the front surface 310A toward the rear plate 311 and extending seamlessly, the front plate ( 302) at both ends of the long edge. In the illustrated embodiment (see FIG. 3 ), the rear plate 311 has two second edge regions 310E that are curved from the rear surface 310B toward the front plate 302 and extend seamlessly at both ends of the long edges. can be included in In some embodiments, the front plate 302 (or the rear plate 311) may include only one of the first edge regions 310D (or the second edge regions 310E). In another embodiment, some of the first edge regions 310D or the second edge regions 310E may not be included. In the above embodiments, when viewed from the side of the electronic device 101, the side bezel structure 318 has a side that does not include the first edge areas 310D or the second edge areas 310E. A side surface may have a first thickness (or width), and a side surface including the first edge regions 310D or the second edge regions 310E may have a second thickness smaller than the first thickness.

According to an embodiment, the electronic device 101 includes a display 301,

audio modules

303, 307, and 314 (eg, the audio module 170 of FIG. 1), and a sensor module (eg, the sensor module of FIG. 1 ). (176)), camera modules 305, 312, 313 (eg, camera module 180 of FIG. 1), a key input device 317 (eg, input module 150 of FIG. 1), and a connector hole ( 308 and 309) (eg, the connection terminal 178 of FIG. 1). In some embodiments, the electronic device 101 may omit at least one of the components (eg, the connector hole 309) or may additionally include other components.

According to one embodiment, the display 301 may be visually exposed, for example, through a substantial portion of the front plate 302 . In some embodiments, at least a portion of the display 301 may be exposed through the front plate 302 forming the front surface 310A and the first edge regions 310D. In some embodiments, a corner of the display 301 may be substantially identical to an adjacent outer shape of the front plate 302 . In another embodiment (not shown), in order to expand an exposed area of the display 301 , the distance between the outer edge of the display 301 and the outer edge of the front plate 302 may be substantially the same.

According to one embodiment, the surface of the housing 310 (or the front plate 302) may include a screen display area formed as the display 301 is visually exposed. For example, the screen display area may include a front surface 310A and first edge areas 310D.

In another embodiment (not shown), a recess or an opening is formed in a portion of a screen display area (eg, the front surface 310A and the first edge area 310D) of the display 301, and the recess Alternatively, at least one of an audio module 314, a sensor module (not shown), a light emitting device (not shown), and a camera module 305 aligned with the opening may be included. In another embodiment (not shown), on the rear surface of the screen display area of the display 301, an audio module 314, a sensor module (not shown), a camera module 305, a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more. In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic stylus pen. can be placed. In some embodiments, at least a portion of the key input device 317 may be disposed in the first edge areas 310D and/or the second edge areas 310E.

According to one embodiment, the

audio modules

303 , 307 , and 314 may include, for example, a microphone hole 303 and speaker holes 307 and 314 . A microphone for acquiring external sound may be disposed inside the microphone hole 303, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 307 and 314 may include an external speaker hole 307 and a receiver hole 314 for communication. In some embodiments, the speaker holes 307 and 314 and the microphone hole 303 may be implemented as one hole, or a speaker may be included without the speaker holes 307 and 314 (eg, a piezo speaker). The

audio modules

303 , 307 , and 314 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some audio modules or adding new audio modules.

According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (eg, a proximity sensor) and/or a second sensor module (eg, a fingerprint sensor) disposed on the front surface 310A of the housing 310, and/or Alternatively, a third sensor module (eg, HRM sensor) and/or a fourth sensor module (eg, fingerprint sensor) disposed on the rear surface 310B of the housing 310 may be included. In some embodiments (not shown), the fingerprint sensor may be disposed on the rear surface 310B as well as the front surface 310A (eg, the display 301 ) of the housing 310 . The electronic device 101 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor may be further included. The sensor module is not limited to the above structure, and depending on the structure of the electronic device 101, the design may be variously changed, such as mounting only some sensor modules or adding a new sensor module.

According to one embodiment, the camera modules 305, 312, and 313 are, for example, a front camera module 305 disposed on the front side 310A of the electronic device 101, and a rear side disposed on the rear side 310B. A camera module 312 and/or a flash 313 may be included. The camera modules 305 and 312 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 313 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of electronic device 101 . The camera modules 305 , 312 , and 313 are not limited to the above structure, and may be variously designed depending on the structure of the electronic device 101, such as mounting only some camera modules or adding new camera modules.

According to an embodiment, the electronic device 101 may include a plurality of camera modules (eg, a dual camera or a triple camera) each having a different property (eg, angle of view) or function. For example, a plurality of camera modules 305 and 312 including lenses having different angles of view may be configured, and the electronic device 101 is a camera that is performed in the electronic device 101 based on a user's selection. It is possible to control the viewing angles of the modules 305 and 312 to be changed. For example, at least one of the plurality of camera modules 305 and 312 may be a wide-angle camera and at least the other may be a telephoto camera. Similarly, at least one of the plurality of camera modules 305 and 312 may be a front camera, and at least another one may be a rear camera. In addition, the plurality of camera modules 305 and 312 may include at least one of a wide-angle camera, a telephoto camera, or an infrared (IR) camera (eg, a time of flight (TOF) camera or a structured light camera). According to one embodiment, the IR camera may operate as at least a part of the sensor module. For example, the TOF camera may operate as at least a part of a sensor module (not shown) for detecting a distance to a subject.

According to one embodiment, the key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 101 may not include some or all of the above-mentioned key input devices 317, and the key input devices 317 that are not included are on the display 301, such as soft keys. It can be implemented in different forms. In some embodiments, the key input device may include a sensor module 316 disposed on the second side 310B of the housing 310 .

According to one embodiment, a light emitting device (not shown) may be disposed on, for example, the front surface 310A of the housing 310 . A light emitting element (not shown) may provide, for example, state information of the electronic device 101 in the form of light. In another embodiment, a light emitting device (not shown) may provide a light source that interlocks with the operation of the front camera module 305, for example. The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 308 and 309 are, for example, a first connector hole capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device. 308, and/or a second connector hole (eg, earphone jack) 309 capable of accommodating a connector for transmitting and receiving an audio signal to and from an external electronic device.

According to one embodiment, some of the camera modules 305 of the camera modules 305 and 312 and/or some of the sensor modules (not shown) are exposed to the outside through at least a portion of the display 301. can be placed. For example, the camera module 305 may include a punch hole camera disposed inside a hole or recess formed on the rear surface of the display 301 . According to one embodiment, the camera module 312 may be disposed inside the housing 310 such that the lens is exposed to the second surface 310B of the electronic device 101 . For example, the camera module 312 may be disposed on a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ).

According to an embodiment, the camera module 305 and/or the sensor module may be in contact with the external environment through a transparent area from the internal space of the electronic device 101 to the front plate 302 of the display 301. can be placed. Also, some sensor modules 304 may be arranged to perform their functions without being visually exposed through the front plate 302 in the internal space of the electronic device.

Referring to FIG. 4 , an electronic device 101 (eg, the electronic device 101 of FIGS. 1 to 3 ) according to various embodiments includes a housing 370 (eg, the housing 310 of FIGS. 2 to 3 ). ), a front plate 320 (eg, front plate 302 in FIG. 2 ), a display module 330 (eg, display 301 in FIG. 2 ), a printed circuit board 340 (eg, PCB, FPCB ( flexible PCB), or RFPCB (rigid flexible PCB), battery 350 (eg battery 189 of FIG. 1), second support member 360 (eg rear structure), antenna (not shown) (eg : The antenna module 197 of FIG. 1) and the back plate 380 (eg, the back plate 311 of FIG. 2) may be included. In some embodiments, housing 370 may be a structure that further includes a front plate 320 and/or a back plate 380 . The housing 370 of the electronic device 101 according to an embodiment may include a side bezel structure 371 (eg, the side bezel structure 318 of FIG. 2 ) and a first support member 372 . .

In some embodiments, the electronic device 101 may omit at least one of the components (eg, the first support member 372 or the second support member 360) or may additionally include other components. . At least one of the components of the electronic device 101 may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 2 or 3 , and duplicate descriptions are omitted below.

According to various embodiments, the first support member 372 may be disposed inside the electronic device 101 and connected to the side bezel structure 371 or integrally formed with the side bezel structure 371 . The first support member 372 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The display module 330 may be coupled to one surface of the first support member 372 and the printed circuit board 340 may be coupled to the other surface.

According to various embodiments, a processor, a memory, and/or an interface may be mounted on the printed circuit board 340 . The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to various embodiments, the printed circuit board 340 may include a flexible printed circuit board type radio frequency cable (FRC). For example, the printed circuit board 340 may be disposed on at least a portion of the first support member 372, an antenna module (eg, the antenna module 197 of FIG. 1) and a communication module (eg, the antenna module 197 of FIG. 1). It may be electrically connected to the communication module 190).

According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.

According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface. The interface may electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

According to various embodiments, the battery 350 is a device for supplying power to at least one component of the electronic device 101, and is, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel. A battery may be included. At least a portion of the battery 350 may be disposed on a substantially coplanar surface with the printed circuit board 340 , for example. The battery 350 may be integrally disposed inside the electronic device 101 or may be disposed detachably from the electronic device 101 .

According to various embodiments, the second support member 360 (eg, a rear structure) may be disposed between the printed circuit board 340 and the antenna. For example, the second support member 360 may include one surface to which at least one of the printed circuit board 340 or the battery 350 is coupled and the other surface to which the antenna is coupled.

According to various embodiments, the antenna 390 may be disposed between the rear plate 380 and the battery 350 . The antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 371 and/or the first support member 372 or a combination thereof.

According to various embodiments, the rear plate 380 may form at least a part of the rear surface (eg, the second surface 310B of FIG. 3 ) of the electronic device 101 .

According to various embodiments, an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 to 3 ), a battery (eg, the electronic device 101 of FIG. 1 ). A battery 189), a coil unit 420 (eg, the antenna 390 of FIG. 4), and a temperature sensor 440 may be included.

According to various embodiments, a battery (eg, the battery 189 of FIG. 1 or the battery 350 of FIG. 4 ) disposed in a housing (eg, the housing 310 of FIGS. 2 and 3 ) includes a plurality of battery cells ( It may include battery cells (not shown) and a protection circuit module 450 (protection circuit module, PCM). For example, a plurality of battery cells (not shown) and the protection circuit module 450 are embedded in one battery case (not shown) disposed inside a housing (eg, the housing 310 of FIGS. 2 and 3 ). It can be. For another example, the plurality of battery cells (not shown) and the protective circuit module 450 may be provided in a housing (eg, the housing 310 of FIGS. 2 to 3 or the first support member 372 of FIG. 4 ) without a separate battery case. )) can be separated and embedded in the interior of

According to an embodiment, a plurality of battery cells (not shown) may be charged by receiving a charging current, and discharged by supplying the charged power to parts of an electronic device (eg, the electronic device 101 of FIG. 1 ). It can be.

According to one embodiment, the protection circuit module 450 has various functions (eg, a pre-blocking function) to prevent performance degradation or burnout of a battery (eg, the battery 189 of FIG. 1 or the battery 350 of FIG. 4 ). ) can perform one or more of these. For example, the protection circuit module 450 is additionally or alternatively a battery management system (battery It may be configured as at least part of a management system (BMS)). For example, the protection circuit module 450 is electrically connected to a plurality of battery cells (not shown) and may be a circuit for protecting the plurality of battery cells (not shown) from overvoltage/overcurrent conditions. In one embodiment, the protective circuit module 450 may be disposed on one area of the substrate 422 (eg, a flexible printed circuit board (FPCB)).

According to various embodiments, the coil unit 420 (eg, the antenna 390 of FIG. 4 ) may include a substrate 422 and a first coil 444 . For example, the substrate 422 may be a flexible printed circuit board (FPCB). For another example, the substrate 422 may be a rigid flexible PCB (RFPCB). The first coil 444 may be disposed on one area of the substrate 422 .

According to an embodiment, the substrate 422 may be disposed inside an electronic device (eg, the electronic device 101 of FIG. 4 ). For example, the substrate 422 may be disposed between a rear case (eg, the second support member 360 of FIG. 4 ) and a rear plate (eg, the rear plate 380 of FIG. 4 ). One surface of the substrate 422 faces the rear plate (eg, the rear plate 380 of FIG. 4 ), and the other surface of the substrate 422 faces the rear case (eg, the second support member 360 of FIG. 4 ) and /or a battery (eg, battery 350 in FIG. 4 ). For example, at least a portion of a battery (eg, the battery 350 of FIG. 4 ) may be mounted on the other surface of the board 422 .

According to one embodiment, the first coil 424 may be formed on one side of the substrate 422 (eg, the side facing the back plate 380 of FIG. 4 ). For another example, the first coil 424 may be formed on the other surface of the substrate 422 (eg, the surface facing the second support member 360 of FIG. 4 ). According to an embodiment, the first coil 424 may be electrically connected to a charging circuit (not shown) of an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ). According to an embodiment, the protection circuit module 450 may be disposed between a battery (eg, the battery 350 of FIG. 4 ) and the first coil 424 . According to another embodiment, the protection circuit module 450 may be disposed adjacent to the battery (eg, the battery 350 of FIG. 4 ) and spaced apart from the first coil 424 . When an electronic device (eg, the electronic device 101 of FIG. 2 ) is mounted on a wireless charging pad (not shown) (eg, a wireless power transmission device), a coil (not shown) and an electronic device of the wireless charging pad (not shown) The first coil 424 of the device may be aligned. At this time, in response to the electromagnetic field generated by the coil of the wireless charging pad, the first coil 424 of the electronic device may generate an induced current, and the induced current generated by the first coil 424 may damage the battery. It can be used as charging power for charging.

According to one embodiment, the temperature sensor 440 may be formed on the substrate 422 . For example, the temperature sensor 440 may be formed on one surface of the substrate 422 (eg, a surface facing the back plate 380 of FIG. 4 ). For another example, the temperature sensor 440 may be formed on the other surface of the substrate 422 (eg, the surface facing the second support member 360 of FIG. 4 ). For example, the temperature sensor 440 may include a thermistor whose resistance value varies according to temperature, but is not limited thereto. The temperature sensor 440 may sense the temperature of the first coil 420 and/or the temperature of the protection circuit module 450 . For example, the temperature sensor 440 may be connected to a processor (eg, the processor 120 of FIG. 1 ). As an example, the temperature sensor 440 may be connected to a printed circuit board (eg, the printed circuit board 340 of FIG. 4 ) on which a processor (eg, the processor 120 of FIG. 1 ) is mounted via a substrate 422 . can

According to one embodiment, the temperature sensor 440 may be formed on the substrate 422 . According to an embodiment, the temperature sensor 440 may be formed on one side or the other side of the board 422, and is directed toward the printed circuit board (eg, the printed circuit board 340 of FIG. 4) on the board 422. Can be placed on site.

According to another embodiment (not shown), the temperature sensor 440 may be formed on the substrate 422 . According to another embodiment (not shown), the board 422 extends toward the printed circuit board (eg, the printed circuit board 340 of FIG. 4) to the upper portion of the protection circuit module 450 (eg, + in FIG. 4). Z direction). For example, the temperature sensor 440 may be formed on the substrate 422 in an area covering the upper portion of the protection circuit module 450 (eg, in the +Z direction of FIG. 4 ).

The first coil 420 may generate heat during wireless charging of an electronic device (eg, the electronic device 101 of FIGS. 2 to 4 ). The temperature sensor 440 may measure the temperature of the first coil 420 and transmit this temperature information to a processor (eg, the processor 120 of FIG. 1 ). A processor (eg, the processor 120 of FIG. 1 ) controls charging power per unit time of a battery (eg, the battery 189 of FIG. 1 ) through charging heat generation control when the first coil 420 heats up to a specified temperature or higher. can be set to lower Through this, the processor (eg, the processor 120 of FIG. 1 ) can mitigate excessive heat generation of the first coil 420 .

According to an embodiment, the protection circuit module 450 may generate heat during wireless charging of an electronic device (eg, the electronic device 101 of FIGS. 2 to 4 ). The temperature sensor 440 may measure the temperature of the protection circuit module 450 and transmit this temperature information to a processor (eg, the processor 120 of FIG. 1 ). A processor (eg, the processor 120 of FIG. 1 ) controls charging power per unit time of a battery (eg, the battery 189 of FIG. 1 ) through charging heat generation control when the protection circuit module 450 heats up to a specified temperature or higher. can be set to lower Through this, the processor (eg, the processor 120 of FIG. 1 ) can mitigate excessive heat generation of the protection circuit module 450 .

According to one embodiment, the temperature sensor 440 is formed on the substrate 422 and may be positioned correspondingly to the protection circuit module 450 with the substrate 422 interposed therebetween. According to one embodiment, the temperature sensor 440 is disposed on the substrate 422, and its arrangement may correspond to that of the protection circuit module 450. For example, the temperature sensing unit 440 may have a disposition facing the protection circuit module 450 with the substrate 422 interposed therebetween. In this case, the temperature sensor 440 may detect the temperature of the protection circuit module 450 transmitted through the substrate 422 .

According to an embodiment, the temperature sensor 440 may be disposed at a first designated distance M1 from one of imaginary straight lines L1 passing through the center 424a of the first coil 424. can "Any one of the imaginary straight lines L1 passing through the center 424a of the first coil 424" may be any one of radial directions when the first coil 424 is substantially circular. . For example, one of the imaginary straight lines L1 passing through the center 424a of the first coil 424 is the longitudinal direction (eg, the diagram of the housing 310 of FIGS. 2 and 3 ). +Y and -Y directions of 2) may be substantially parallel.

According to another embodiment, the temperature sensor 440 may be disposed at a first designated distance M1 from one of imaginary straight lines L1 passing through the center 450a of the protection circuit module 450. can For example, any one of the imaginary straight lines (L1) passing through the center (450a) of the protective circuit module 450 is the longitudinal direction (eg, Fig. 3 of the housing 310 of FIGS. 2 and 3). +Y and -Y directions of 2) may be substantially parallel.

According to another embodiment, the temperature sensor 440 is configured to first designate a first designated line from an imaginary straight line L1 that simultaneously passes through the center 424a of the first coil 424 and the center 450a of the protection circuit module 450. It can be placed at the distance M1.

According to one embodiment, the first designated distance M1 may be greater than or equal to about 9 mm and less than or equal to about 11 mm. For example, the first designated distance M1 may be substantially about 10 mm.

In the case of wireless charging, an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) may be mounted on a wireless charging pad (not shown). In one embodiment, when the temperature sensor 440 is excessively far from the straight line L1 passing through the center 424a of the first coil 424 and/or the center 450a of the protection circuit module 450 ( Example: A case farther than the first designated distance M1) will be described as an example. In one embodiment, if the electronic device (eg, the electronic device 101 of FIGS. 1 to 4) is out of alignment with the wireless charging pad (eg, the electronic device is biased to either side of the wireless charging pad), The temperature sensor 440 may be disposed outside the wireless charging pad or at a position corresponding to a cooling fan of the wireless charging pad. In this case, since the temperature sensor 440 is located outside the wireless charging pad or corresponding to the cooling fan of the wireless charging pad, the actual temperature of the protection circuit module 450 and/or the first coil 424 Lower temperatures can be measured. In this case, the processor (for example, the processor 120 of FIG. 1 ) cannot properly control the heat generation by charging, and the temperature of the protection circuit module 450 and/or the first coil 424 rises excessively. There is a risk of damage.

According to one embodiment, the temperature sensor 440 is a first designated distance ( M1) can be placed. Since the temperature sensor 440 is disposed at a first designated distance M1 (eg, when the first designated distance is about 10 mm) based on the straight line L1, the electronic device (eg, those of FIGS. 1 to 4 ) In the interior of the housing of the electronic device 101 (eg, the housing 310 of FIGS. 2 and 3 ), the electronic device 101 has a disposition that is not excessively biased toward either side. Accordingly, even when the electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) and the wireless charging pad (not shown) are in a misaligned state, the temperature sensor 440 controls the temperature of the protection circuit module 450. The temperature and/or the temperature of the first coil 424 may be accurately measured.

According to an embodiment, the temperature sensor 440 may be formed on the substrate 422 and disposed adjacent to the first coil 424 . For example, the temperature sensor 440 may be disposed to be spaced apart from at least a portion of an outermost portion of the first coil 424 in the substrate 422 by a predetermined distance.

According to an embodiment, the temperature sensor 440 may be disposed at a second designated distance M2 from the edge of the first coil 424 .

According to an embodiment, the second designated distance M2 may be smaller than the first designated distance M1. According to one embodiment, the second designated distance M2 may be greater than or equal to about 4.5 mm and less than or equal to about 5.5 mm.

In the case of wireless charging, the first coil 424 may generate heat. If the temperature sensor 440 is excessively close to the first coil 424 (eg, closer than the second designated distance M2), the processor (eg, the processor 120 of FIG. 1 ) It can be recognized that the coil 424 frequently generates heat above a specified temperature. In this case, the processor (eg, the processor 120 of FIG. 1 ) performs charging heat generation control too often, and thus the charging efficiency of the battery (eg, the battery 189 of FIG. 1 ) may decrease.

According to an embodiment, the temperature sensor 440 may be disposed at a second designated distance M2 from the outermost part of the first coil 424 . Since the temperature sensor 440 is disposed at a second designated distance M2 (for example, when the second designated distance is about 5 mm) among the outermost parts of the first coil 424, it is too close to the first coil 424. You will have a layout that is not close. Accordingly, a processor (eg, the processor 120 of FIG. 1 ) frequently performs charging heat generation control is reduced, and charging efficiency of a battery (eg, the battery 189 of FIG. 1 ) can be improved.

6 is a plan view illustrating a substrate and a first coil according to various embodiments of the present disclosure, and FIG. 7 is an enlarged view of a partial area of FIG. 6 according to various embodiments of the present disclosure. Therefore, in looking at the present embodiment, reference may be made to the preceding embodiments, and detailed descriptions of configurations that can be easily understood through the preceding embodiments may be omitted.

The configurations of the substrate 422, the first coil 424, and the temperature sensor 440 of FIGS. 6 and 7 are the same as those of the substrate 422, the first coil 424, and the temperature sensor 440 of FIG. 5 . Some or all of them may be the same.

Referring to FIG. 6 , the first coil 424 may have a spiral pattern in which at least one wire is repeatedly wound on a substrate 422 . For example, the first coil 424 may have a spiral pattern wound at least once from the inner end 425 to the outer end 426 .

According to one embodiment, in the first coil 424 , a first extension line 425a extending in one direction from the inner end 425 may be connected to the connector 423 of the board 422 . According to one embodiment, in the first coil 424 , a second extension line 426a extending in one direction from an outer end 426 may be connected to the connector 423 of the board 422 .

According to an embodiment, the temperature sensor 440 may be disposed at a first designated distance M1 from one of imaginary straight lines L1 passing through the center 424a of the first coil 424 . "Any one of the imaginary straight lines L1 passing through the center 424a of the first coil 424" may be any one of radial directions when the first coil 424 is substantially circular. . For example, one of the imaginary straight lines L1 passing through the center 424a of the first coil 424 is the longitudinal direction (eg, the diagram of the housing 310 of FIGS. 2 and 3 ). +Y and -Y directions of 2) may be substantially parallel.

According to another embodiment, the temperature sensor 440 is any one of imaginary straight lines passing through the center 450a of a protection circuit module (not shown) (eg, the protection circuit module 450 of FIG. 5). It may be disposed at a first designated distance M1 from (L1). For example, any one of the imaginary straight lines (L1) passing through the center (450a) of the protective circuit module 450 is the longitudinal direction (eg, Fig. 3 of the housing 310 of FIGS. 2 and 3). +Y and -Y directions of 2) may be substantially parallel.

According to another embodiment, the temperature sensor 440 may include a center 424a of the first coil 424 and a center 450a of a protection circuit module (not shown) (eg, the protection circuit module 450 of FIG. 5 ). ) may be disposed at a first designated distance M1 from an imaginary straight line L1 passing simultaneously.

According to an embodiment, the temperature sensor 440 may be disposed at a second designated distance (eg, the second designated distance M2 in FIG. 5 ) from the edge of the first coil 424 .

According to an embodiment, the second designated distance (eg, the second designated distance M2 in FIG. 5 ) may be smaller than the first designated distance M1 . According to one embodiment, the second designated distance M2 may be greater than or equal to about 4.5 mm and less than or equal to about 5.5 mm.

According to one embodiment, the connector 423 may be physically and/or electrically connected to the printed circuit board (eg, the printed circuit board 340 of FIG. 4 ). According to an embodiment, the connector 423 may be physically and/or electrically connected to a battery (eg, the battery 350 of FIG. 4 ). According to another embodiment, the connector 423 is a charging circuit (eg, the electronic device 101 of FIGS. 1 to 4) through a printed circuit board (eg, the printed circuit board 340 of FIG. 4). not shown) and electrically connected.

According to one embodiment, the first coil 424 may include a first curvature portion 427 formed such that at least one portion of an edge is depressed toward the center 424a of the first coil 424 . For example, the first curvature portion 427 may be located at an edge of the first coil 424 to correspond to the temperature sensor 440 . The first curvature portion 427 may be formed at a portion facing the temperature sensor 440 among the outermost portions of the first coil 424 .

According to an embodiment, the first curvature portion 427 may have an arc shape having a constant radius of curvature based on the center 440a of the temperature sensor 440 . For example, the first curvature portion 427 may have an arc shape based on the center 440a of the temperature sensor 440, and may be an edge of the first coil 424 (eg, the first curvature portion 427 )) to the temperature sensor 440, a gap of about 4.5 mm or more and about 5.5 mm or less may be formed.

According to an embodiment, the maximum depth h1 of the first curvature portion 427 may have a value of about 3.1% to about 3.7% of the diameter D of the first coil 424 . For example, the diameter of the first coil 424 may be greater than or equal to about 38 mm and less than or equal to about 46 mm, and the maximum depth h1 of the first curvature portion 427 may be greater than or equal to about 1.13 mm and less than or equal to about 1.73 mm. In some embodiments, when the first coil 424 has a substantially circular shape, "depth or maximum depth h1 of the first curved portion 427" refers to a direction passing through the first curved portion 427. It may refer to a difference between the diameter of the first coil 424 measured along the direction and the diameter of the first coil 424 measured along a direction not passing through the first curvature portion 427 .

According to an embodiment, the coil unit 420 may include one or more fifth extension lines 440b connected to the temperature sensor 440 . For example, the fifth extension line 440b may connect the temperature sensor 440 to the connector 423 of the board 422 .

The configuration of the substrate 422, the first coil 424, and the temperature sensor 440 of FIG. 8 is part or part of the configuration of the substrate 422, the first coil 424, and the temperature sensor 440 of FIG. can all be the same. Therefore, in looking at the present embodiment, reference may be made to the preceding embodiments, and detailed descriptions of configurations that can be easily understood through the preceding embodiments may be omitted.

Referring to FIG. 8 , an electronic device (eg, the electronic device 101 of FIGS. 2 to 4 ) includes a wireless communication circuit (eg, the communication module 190 or the wireless communication module 192 of FIG. 1 ), a second coil ( 431) and/or a third coil 436.

According to various embodiments, the wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ), the second coil 431 and/or the third coil 436 may include a housing (eg, the housing of FIGS. 2 and 3 ). (310)).

According to an embodiment, the second coil 431 may be formed on the substrate 422 and electrically connected to a wireless communication circuit (eg, the wireless communication module 192 of FIG. 1 ). For example, the second coil 431 may be formed on one surface of the substrate 422 (eg, a surface facing the back plate 390 of FIG. 4 ).

According to an embodiment, at least a portion of the second coil 431 may surround the first coil 424 . The second coil 431 may have, for example, a shape in which at least one wire is wound around the first coil 424 once or twice or more. For example, the second coil 431 may be disposed adjacent to an edge of the first coil 424 on the substrate 422 . For another example, the second coil 431 may be disposed on the substrate 422 to come into contact with an edge of the first coil 424 . In some embodiments, although disposed in contact with the edge of the first coil 424, the second coil 431 is disposed on the substrate 422 on a different layer than the first coil 424 to electrically can be separated

According to one embodiment, the second coil 431 may function as a magnetic secure transfer (MST) antenna. According to one embodiment, the second coil 431 may include a third extension line 432a extending in one direction from one region 432 of the outer end. The third extension line 432 may be connected to the connector 423 of the board 422 .

According to one embodiment, the second coil 431 includes a second curvature portion 433 formed such that at least one portion of an edge of the second coil 431 is depressed toward the center 424a of the first coil 424. can include

According to an embodiment, the second curvature portion 433 may be located at an edge of the second coil 432 to correspond to the temperature sensor 440 . The second curvature portion 433 may be formed at a portion facing the temperature sensor 440 among the outermost portions of the second coil 432 .

According to an embodiment, the second curvature portion 433 may be disposed between the first curvature portion 427 and the temperature sensor 440 .

According to an embodiment, the second curvature portion 433 may have an arc shape having a constant radius of curvature based on the center 440a of the temperature sensor 440 . For example, the second curvature portion 433 may have an arc shape based on the center 440a of the temperature sensor 440, and may be an edge of the second coil 432 (eg, the second curvature portion 433 )) to the temperature sensor 440, a gap of about 4.1 mm or more and about 5.4 mm or less may be formed.

According to an embodiment, the third coil 436 may be formed on the substrate 422 and electrically connected to a wireless communication circuit (not shown) (eg, the wireless communication module 192 of FIG. 1 ). For example, the third coil 436 may be formed on one surface of the substrate 422 (eg, a surface facing the back plate 390 of FIG. 4 ).

According to one embodiment, the third coil 436 may function as a near field communication (NFC) antenna.

According to an embodiment, at least a portion of the third coil 436 may surround the temperature sensor 440 . For example, at least a portion of the third coil 436 may be disposed between the temperature sensor 440 and the first coil 424 . The third coil 436 may be disposed on the substrate 422 to generally surround the first coil 424 and the second coil 436, and at least a portion of the first coil 424 and the second coil ( 436) may be arranged to overlap.

According to one embodiment, the third coil 436 may include a third curvature portion 437 formed such that at least a portion thereof surrounds the temperature sensor 440 .

According to an embodiment, the third curvature portion 437 may have an arc shape having a constant radius of curvature based on the center 440a of the temperature sensor 440 . For example, the third curvature portion 437 may have an arc shape based on the center 440a of the temperature sensor 440, and may have an edge of the third coil 436 (eg, the third curvature). A constant gap may be formed between the portion 437 and the temperature sensor 440 . According to an embodiment, the third curvature portion 437 of the third coil 436 may have an arc shape on the substrate 422 so as not to overlap with the temperature sensor 440 .

According to one embodiment, the third curvature portion 437 of the third coil 436 is the first curvature portion 427 of the first coil 424 and/or the second curvature portion of the second coil 431. It may be disposed closer to the temperature sensor 440 than the temperature sensor 433 . The third coil 436 may not generate much heat when functioning as an NFC antenna. Accordingly, even when the third curvature portion 437 of the third coil 436 is disposed adjacent to the temperature sensing unit 440, the processor (eg, the processor 120 of FIG. 1) operates on the third coil 436. ), it is possible to limit or prevent frequent charging heat generation control. According to an embodiment, the third coil 436 is a fourth extension line 438a extending in one direction in one region 438. ) may be included. The fourth extension line 438a may be connected to the connector 423 of the board 422 .

9a shows a case where the temperature sensor is excessively far from the center of the wireless charging coil and/or the center of the protection circuit module (eg, farther than the first designated distance M1 of the present disclosure) and/or of the wireless charging coil. It is a graph measuring the temperature (y-axis) of the wireless charging coil according to the measured time (x-axis) when it is too close to the outermost part (eg, closer than the second designated distance M2 of the present disclosure).

Referring to FIG. 9A , charging heat generation control was performed 84 times while the battery in a discharged state was being charged to a fully charged state, and accordingly, the time required to fully charge was measured to be about 143 minutes.

In the case of the comparative example as shown in FIG. 9A, the temperatures measured on the front and rear surfaces of the electronic device during wireless charging are shown in Table 1 below. The wireless charging pad used to transmit charging power of 15W per unit time.

구분division		전면Front	후면back side
무선충전(15W)Wireless charging (15W)	기준standard	38.0 ℃38.0 ℃	40.0 ℃40.0 ℃
무선충전(15W)Wireless charging (15W)	측정measurement	36.0 ℃36.0 ℃	43.6 ℃43.6 ℃

In the case of the comparative example as shown in FIG. 9A, the antenna characteristics of the wireless charging coil and the MST coil are shown in Table 2 below.

ANTANT	WPC(무선 충전 코일)WPC (Wireless Charging Coil)		MST(MST 코일)MST (MST Coil)
ANTANT	Ls (@200kHz)Ls (@200kHz)	Rs (@200kHz)Rs (@200kHz)	Ls (@200kHz)Ls (@200kHz)	Rs (@200kHz)Rs (@200kHz)	RdcRdc
비교예comparative example	8.548.54	0.6620.662	15.0715.07	1.931.93	1.261.26

In the case of the comparative example as shown in FIG. 9A, the charging efficiency of the wireless charging coil is shown in Table 3 below.

ANTANT	무선 충전 패드wireless charging pad	PinPin	PoutPout	EfficiencyEfficiency
비교예comparative example	제1 패드1st pad	15.15315.153	10.80710.807	71.31971.319
	제2 패드2nd pad	9.8569.856	7.4757.475	75.83875.838
	제3 패드3rd pad	19.31519.315	13.08913.089	67.76967.769

FIG. 9B shows that the temperature sensor (eg, the temperature sensor 440 of FIG. 5 ) is positioned at the center (eg, reference numeral 424a of FIG. 5 ) of the first coil (eg, the first coil 424 of FIG. 5 ). 1 is disposed at a designated distance (eg, the first designated distance M1 in FIG. 5 ), and is disposed at a second designated distance (eg, in FIG. A graph of the temperature (y-axis) of the first coil (eg, the temperature sensor 440 of FIG. 5) according to the measured time (x-axis) when disposed at the second designated distance (M2) of 5) am. FIG. 9B measured the time for the battery to be fully charged using the same wireless charging pad and battery as in FIG. 9A. Referring to FIG. 9B , charging heat generation control was performed 16 times while the battery in a discharged state was being charged to a fully charged state, and accordingly, the time required to fully charge was measured to be about 120 minutes. In the case of the present disclosure, the charging time was shortened by about 23 minutes compared to the comparative example.

In the case of the present disclosure as shown in FIG. 9B, the temperatures measured on the front and rear surfaces of the electronic device during wireless charging are shown in Table 4 below. The wireless charging pad used to transmit charging power of 15W per unit time.

구분division		전면Front	후면back side
무선충전(15W)Wireless charging (15W)	기준standard	38.0 ℃38.0 ℃	40.0 ℃40.0 ℃
무선충전(15W)Wireless charging (15W)	측정measurement	33.7 ℃33.7 ℃	39.6 ℃39.6 ℃

In the case of the present disclosure, unlike the comparative example, the temperatures of the front and rear surfaces of the electronic device were all measured below the reference value. In the case of the present disclosure as shown in FIG. 9B, the antenna characteristics of the wireless charging coil and the MST coil are shown in Table 5 below.

ANTANT	WPC(제1 코일)WPC (primary coil)		MST(제2 코일)MST (Second Coil)
ANTANT	Ls (@200kHz)Ls (@200kHz)	Rs (@200kHz)Rs (@200kHz)	Ls (@200kHz)Ls (@200kHz)	Rs (@200kHz)Rs (@200kHz)	RdcRdc
본 개시this disclosure	8.248.24	0.6030.603	15.0115.01	1.81.8	1.271.27

In the case of the present disclosure, both the wireless charging coil (first coil) and the MST coil (second coil) were measured to have antenna characteristics equivalent to those of the comparative example. In the case of the present disclosure as shown in FIG. 9B, the charging efficiency of the wireless charging coil is shown in Table 6 below.

ANTANT	무선 충전 패드wireless charging pad	PinPin	PoutPout	EfficiencyEfficiency
본 개시this disclosure	제1 패드1st pad	16.66116.661	11.93611.936	71.63871.638
	제2 패드2nd pad	9.9659.965	7.5157.515	75.41775.417
	제3 패드3rd pad	20.87520.875	14.27914.279	68.40268.402

In the case of the present disclosure, the charging efficiency of the wireless charging coil was measured to be equivalent to that of the comparative example. According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIGS. 1 to 4) A housing (eg, the housing 310 of FIGS. 2 and 3 ), a battery disposed within the housing (eg, the battery 189 of FIG. 1 or the battery 350 of FIG. 4 ), and a coil unit disposed within the housing (eg, the battery 189 of FIG. 1 or the battery 350 of FIG. 4 ). Example: As the coil unit 420 of FIGS. 5 to 8), a substrate (eg, the substrate 422 of FIGS. 5 to 8) and a first spiral pattern formed on the substrate and electrically connected to the battery Any one of straight lines formed on a coil unit including a coil (eg, the first coil 424 of FIGS. 5 to 8 ) and the substrate and passing through the center of the first coil (eg, the first coil 424 of FIGS. 5 to 8 ). It is disposed at a first designated distance (e.g., the first designated distance M1 of FIGS. 5 to 8) from reference numeral L1 of reference numerals L1 to 8, and is disposed at a second designated distance smaller than the first designated distance from the edge of the first coil. (eg, a temperature sensing unit (eg, the temperature sensing unit 440 of FIGS. 5 to 8 ) disposed at a predetermined distance M2 of FIGS. 5 to 8 ), and the first coil has at least one of the edges It may include a first curvature portion (eg, the first curvature portion 427 of FIGS. 5 to 8 ) formed so that the portion is depressed toward the center of the first coil.

According to various embodiments, one of the straight lines passing through the center of the first coil may be substantially parallel to the longitudinal direction of the housing.

According to various embodiments, the first designated distance may be greater than or equal to 9 mm and less than or equal to 11 mm, and the second designated distance may be greater than or equal to 4.5 mm and less than or equal to 5.5 mm.

According to various embodiments, the temperature sensor may include a thermistor.

According to various embodiments, the first curvature portion may be positioned to correspond to the temperature sensor among edges of the first coil.

According to various embodiments, the first curvature portion may have an arc shape having a constant radius of curvature based on the center of the temperature sensor.

According to various embodiments, the maximum depth of the first curvature portion may have a value of 3.1% or more and 3.7% or less of the diameter of the first coil.

According to various embodiments, a wireless communication circuit disposed in the housing and a second coil formed on the substrate, electrically connected to the wireless communication circuit, and having at least a portion surrounding the first coil (eg: The second coil 431 of FIG. 8 may be further included.

According to various embodiments, the second coil may include a second curvature portion (eg, the second curvature portion 433 of FIG. 8 ) formed such that at least one portion of an edge is depressed toward the center of the first coil. can

According to various embodiments, the second curvature portion may be disposed between the first curvature portion and the temperature sensor.

According to various embodiments, the battery includes a protection circuit module (eg, the protection circuit module 450 of FIG. 5), and one of the straight lines passing through the center of the first coil is the It may pass through the center of the protection circuit module.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) is disposed in a housing (eg, the housing 310 of FIGS. 2 to 3 ), the housing, and is protected. A battery (eg, battery 189 in FIG. 1 or battery 350 in FIG. 4) including a circuit module (eg, protection circuit module 450 in FIG. 5), a nose disposed in the housing As a part (coil part 420 of FIGS. 5 to 8 ), a substrate (eg, substrate 422 of FIGS. 5 to 8 ) and a first spiral pattern formed on the substrate and electrically connected to the battery Any one of straight lines formed on a coil unit including a coil (eg, the first coil 424 of FIGS. 5 to 8) and the substrate and passing through the center of the protective circuit module (FIGS. 5 to 8). It is disposed at a first designated distance (eg, the first designated distance M1 of FIGS. 5 to 8) from the reference numeral L1 of and a second designated distance smaller than the first designated distance from the edge of the first coil (eg, the first designated distance M1). : includes a temperature sensing unit (eg, the temperature sensing unit 440 of FIGS. 5 to 8) disposed at a second designated distance M2 of FIGS. 5 to 8; It may include a first curvature portion (eg, the first curvature portion 427 of FIGS. 6 to 8 ) formed to be depressed toward the center of the first coil.

According to various embodiments, one of the straight lines passing through the center of the protection circuit module may be substantially parallel to the longitudinal direction of the housing.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 101 of FIGS. 1 to 4 ) includes a housing (eg, the housing 310 of FIGS. 2 to 3 ), and a battery disposed in the housing. (eg, the battery 189 of FIG. 1 or the battery 350 of FIG. 4), a wireless communication circuit disposed in the housing, and a coil unit disposed in the housing (eg, the coil unit 420 of FIGS. 5 to 8) As, including a substrate (eg, the substrate 422 of FIGS. 5 to 8) and a first coil formed on the substrate and electrically connected to the battery (eg, the first coil 424 of FIGS. 5 to 8) A first designated distance (eg, FIGS. 5 to 8 ) from any one of straight lines (eg, reference numeral L1 in FIGS. 5 to 8 ) formed on the coil unit and the substrate and passing through the center of the first coil. It is disposed at a first designated distance (M1)), and is disposed at a second designated distance (eg, second designated distance (M2) of FIGS. 5 to 8) smaller than the first designated distance from the edge of the first coil. A second coil formed on a temperature sensing unit (eg, the temperature sensing unit 440 of FIGS. 5 to 8 ) and the substrate, electrically connected to the wireless communication circuit, and having at least a portion surrounding the first coil. (Example: the second coil 431 of FIG. 8), and the first curvature portion formed such that at least one part of the edge of the first coil is depressed toward the center of the first coil (eg, FIGS. 5 to 8) A first curvature portion 427) of the second coil, and at least one of the edges of the second coil is formed to be depressed toward the center of the first coil (e.g., the second curvature portion of FIG. 8 ( 433)).

In the above, the detailed description of this document has been described with respect to specific embodiments, but it will be apparent to those skilled in the art that various modifications are possible without departing from the scope of this document.

Claims

In electronic devices,

housing;

a battery disposed within the housing;

a coil unit disposed in the housing, including a substrate and a first coil having a spiral pattern formed on the substrate and electrically connected to the battery; and

A second specified distance formed on the substrate, disposed at a first specified distance from any one of straight lines passing through the center of the first coil, and smaller than the first specified distance from an edge of the first coil. Including a temperature sensor disposed on,

The electronic device of claim 1 , wherein the first coil includes a first curvature portion formed such that at least a portion of an edge is depressed toward a center of the first coil.
According to claim 1,

One of the straight lines passing through the center of the first coil is substantially parallel to the longitudinal direction of the housing.
According to claim 1,

The first specified distance is 9 mm or more and 11 mm or less,

The electronic device of the second designated distance is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.
According to claim 1,

The electronic device of claim 1, wherein the temperature sensor includes a thermistor.
According to claim 1,

The first curvature portion is located at an edge of the first coil to correspond to the temperature sensor.
According to claim 5,

The first curvature portion has an arc shape having a constant radius of curvature based on the center of the temperature sensor.
According to claim 1,

The electronic device of claim 1 , wherein the maximum depth of the first curvature portion has a value of 3.1% or more and 3.7% or less of a diameter of the first coil.
According to claim 1,

wireless communications circuitry disposed within the housing; and

The electronic device further comprising a second coil formed on the substrate, electrically connected to the wireless communication circuit, and having at least a portion surrounding the first coil.
According to claim 8,

The electronic device of claim 1 , wherein the second coil includes a second curvature portion formed such that at least a portion of an edge is depressed toward a center of the first coil.
According to claim 9,

The second curvature portion is disposed between the first curvature portion and the temperature sensor.
According to claim 1,

The battery includes a protection circuit module,

One of the straight lines passing through the center of the first coil passes through the center of the protective circuit module.
In electronic devices,

housing;

a battery disposed within the housing and including a protection circuit module;

a coil unit disposed in the housing, including a substrate and a first coil having a spiral pattern formed on the substrate and electrically connected to the battery; and

A second designated distance formed on the substrate, disposed at a first designated distance from any one of straight lines passing through the center of the protection circuit module, and smaller than the first designated distance from an edge of the first coil. Including a temperature sensor disposed on,

The electronic device of claim 1 , wherein the first coil includes a first curvature portion formed such that at least one portion of an edge is depressed toward a center of the first coil.
According to claim 12,

Any one of the straight lines passing through the center of the protection circuit module is substantially parallel to the longitudinal direction of the housing.
According to claim 12,

The first specified distance is 9 mm or more and 11 mm or less,

The electronic device of the second designated distance is greater than or equal to 4.5 mm and less than or equal to 5.5 mm.
According to claim 12,

wireless communications circuitry disposed within the housing; and

The electronic device further comprising a second coil formed on the substrate, electrically connected to the wireless communication circuit, and having at least a portion surrounding the first coil.