WO2022215767A1 - 디스플레이 디바이스 - Google Patents
디스플레이 디바이스 Download PDFInfo
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- WO2022215767A1 WO2022215767A1 PCT/KR2021/004290 KR2021004290W WO2022215767A1 WO 2022215767 A1 WO2022215767 A1 WO 2022215767A1 KR 2021004290 W KR2021004290 W KR 2021004290W WO 2022215767 A1 WO2022215767 A1 WO 2022215767A1
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- optical layer
- light
- light emitting
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- 230000003287 optical effect Effects 0.000 claims abstract description 181
- 239000000945 filler Substances 0.000 claims abstract description 94
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000012798 spherical particle Substances 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 17
- 239000002245 particle Substances 0.000 claims description 12
- 238000002834 transmittance Methods 0.000 claims description 9
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- 229910052710 silicon Inorganic materials 0.000 description 11
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
- 238000006073 displacement reaction Methods 0.000 description 8
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- 230000002776 aggregation Effects 0.000 description 2
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
Definitions
- the present disclosure relates to a display device.
- Display As the information society develops, the demand for display devices is also increasing in various forms.
- OLED Organic Light Emitting Diode
- micro LED Micro Light Emitting Diode
- Digital signage is a communication tool that can induce marketing, advertising, training effects, and customer experience of companies as well as general TV. It is used in public places such as airports, hotels, hospitals and subway stations. It is a display device that provides not only a broadcast program but also specific information.
- Digital signage is installed in a certain place outdoors or on devices such as street furniture, LCD (Liquid Crystal Display), PDP (Plasma Display Panel), OLED (Organic Light Emitting Diode), micro LED (Light Emitting Diode), etc.
- LCD Liquid Crystal Display
- PDP Plasma Display Panel
- OLED Organic Light Emitting Diode
- micro LED Light Emitting Diode
- As a medium to display various contents and commercial advertisements by installing a display panel it can be installed not only in homes, but also in apartment elevators, subway stations, subways, buses, universities, banks, convenience stores, discount stores, shopping malls, etc. have.
- the present disclosure aims to solve the above and other problems.
- An object of the present disclosure may be to provide a display device that improves a color difference between a display panel.
- An object of the present disclosure may be to provide a display device that improves the light extraction efficiency of the display panel.
- An object of the present disclosure may be to provide a display device that improves the image quality of a display panel.
- a display device includes: a display panel; and a module cover to which the display panel is coupled, wherein the display panel includes: a flat substrate; a plurality of electrode pads formed on the substrate; a plurality of light emitting devices mounted on each of the plurality of electrode pads; an optical layer covering the plurality of light emitting devices and formed on the substrate; and a plurality of fillers formed of spherical particles and distributed in the optical layer, wherein 75 to 80 percent of the plurality of fillers have a diameter of 2 to 16 micrometers, and a weight ratio to the optical layer 15 to 23 percent.
- a display device for improving a color difference between a display panel.
- 1 to 4 are diagrams illustrating examples of display devices according to embodiments of the present disclosure.
- 5 and 6 are diagrams illustrating an example of light extraction efficiency according to a particle size distribution and content of a filler according to embodiments of the present disclosure.
- FIG. 7 and 8 are views illustrating other examples of light extraction efficiency according to particle size distribution and content of fillers according to embodiments of the present disclosure.
- FIG. 9 to 11 are views illustrating examples of display panels according to embodiments of the present disclosure.
- the display panel will be described with a micro LED as an example, but the display panel applicable to the present disclosure is not limited thereto.
- the multi-display device 1000 includes a display module 100 capable of displaying an image, a frame 200 supporting the display module 100 , and a display module 100 and a frame 200 . ) is mounted between, it may include a displacement control unit (300, leveling unit) to adjust their spacing.
- a displacement control unit 300, leveling unit
- the display module 100 may include a display panel 101 and a module cover 110 positioned at the rear of the display panel 101 .
- the display panel 101 may include a plurality of pixels R, G, and B.
- the plurality of pixels R, G, and B may be formed in each region where the plurality of data lines and the plurality of gate lines intersect.
- the plurality of pixels R, G, and B may be arranged or arranged in a matrix form.
- the plurality of pixels R, G, and B include a red (Red, 'R') sub-pixel, a green (Green, 'G') sub-pixel, and a blue (Blue, 'B') sub-pixel.
- the plurality of pixels R, G, and B may further include a white (hereinafter 'W') sub-pixel.
- the display panel 101 may be referred to as a front side or a front side that displays an image.
- the side from which the image cannot be observed may be referred to as a rear or rear side.
- the upper side may be referred to as the upper side or the upper side.
- the lower side may be referred to as the lower side or the lower side.
- the right side may be referred to as the right or right side
- the left side may be referred to as the left side or the left side.
- the module cover 110 is disposed behind the display panel 101 to be coupled to the display panel 101 .
- the display module 100 may include a first display module 100a to a sixth display module 100f.
- the first display module 100a to the sixth display module 100f may be arranged adjacent to each other in the vertical direction or the left and right directions.
- the first display module 100a may be disposed on the upper right side of the frame 200 .
- the second display module 100b may be disposed below the first display module 100a.
- the third display module 100c may be disposed below the second display module 100b.
- the fourth display module 100d may be disposed on the left side of the first display module 100a.
- the fifth display module 100e may be disposed below the fourth display module 100d and on the left side of the second display module 100b.
- the sixth display module 100f may be disposed below the fifth display module 100e and on the left side of the third display module 100c.
- the frame 200 may be disposed behind the plurality of display modules 100 .
- the front side of the frame 200 may face the back side of the display module 100 .
- the frame 200 may be disposed to correspond to the display module 100 and the display module 100 in the thickness direction or the front and rear directions.
- the frame 200 may be formed in a frame shape with an open central region.
- the frame 200 may be elongated in the vertical direction and the left and right directions so that the plurality of display modules 100 are mounted.
- the length of the upper side of the frame 200 may be substantially the same as the sum of the upper side of the first display module 100a and the upper side of the fourth display module 100d.
- the length of the right side of the frame 200 may be substantially equal to the sum of the right side of the first display module 100a, the right side of the second display module 100b, and the right side of the third display module 100c. .
- the present invention is not limited thereto.
- the frame 200 may be formed to be longer or shorter than the display module 100 according to an external environment such as a building or wall where it is installed.
- the frame 200 may have a thickness greater than that of the plurality of display modules 100 .
- the frame 200 may include a first frame 200a to a sixth frame 200f.
- the first frame 200a to the sixth frame 200f may be stacked or assembled in substantially the same manner as the first display module 100a to the sixth display module 100f described above.
- the n-th display module 100 may be mounted on the n-th frame 200 .
- n may be a natural number.
- the displacement control unit 300 may be disposed between the plurality of display modules 100 and the plurality of frames 200 .
- the displacement control unit 300 may be mounted on the frame 200 in the thickness direction of the display module 100 .
- the displacement control unit 300 mounted on the front of the frame 200 may be attached to the rear of the display module 100 .
- the displacement control unit 300 may adjust the separation distance between the rear surface of the display module 100 and the front surface of the frame 200 .
- the displacement control unit 300 may be plural.
- the displacement control unit 300 may be disposed at each corner of the frame 200 .
- the displacement control unit 300 is disposed at each corner of the display module 100 and the frame 200 to adjust the separation distance therebetween.
- the display panel 101 may include a substrate 1010 , electrode pads 1020 , and light emitting devices RGB.
- the substrate 1010 may be a flat-panel PCB.
- the electrode pad 1020 may be formed on the substrate 1010 .
- the electrode pad 1020 may be formed of a conductive metal.
- the electrode pad 1020 may form a predetermined pattern on the substrate 1010 .
- the electrode pad 1020 may have a W shape.
- the electrode pad 1020 may include a first part 1021 , a second part 1022 , a third part 1023 , and a connection part 1024 .
- the light emitting device RGB may be an LED chip.
- a plurality of light emitting devices RGB may be mounted on the electrode pad 1020 .
- the light emitting device RGB may be bonded on the electrode pad 1020 .
- the first light emitting device R may be mounted on the first part 1021
- the second light emitting device G may be mounted on the second part 1022
- the third light emitting device B may be It may be mounted on the third part 1023 .
- the first light emitting device R may emit red light
- the second light emitting device G may emit green light
- the third light emitting device B may emit blue light.
- the light emitting device RGB may be an LED flip chip.
- the electrode pads 1020 may be visually recognized from the front surface of the display panel 101 .
- the electrode pads 1020 are visually recognized and the light emitting elements RGB are not switched on, the display panel 101 may be mistaken for displaying light information other than a black screen, or the black color of the display panel 101 expressive power may be reduced.
- the light emitting device RGB may not be horizontally maintained or may be tilted.
- the irradiation angle of the light emitting device RGB may not be constant. That is, when the light emitting element RGB is tilted from the electrode pad 1020 , a sense of heterogeneity may be given to the expression of natural colors in the front of the display panel 101 , and the user may recognize that there is a difference in color. This may mean that the image quality of the display panel 101 is deteriorated.
- an optical layer 1030 may be positioned on a substrate 1010 on which a light emitting device RGB is mounted.
- the optical layer 1030 may cover and seal the light emitting device RGB mounted on the substrate 1010 .
- the optical layer 1030 may be applied and cured in a liquid phase on the substrate 1010 and the light emitting device RGB.
- the optical layer 1030 may include silicon.
- the optical layer 1030 may have light-transmitting properties.
- a filler (S) may be included in the optical layer 1030 .
- the filler (S) may be a plurality of particles (S).
- the filler (S) may be, for example, SiO2.
- the filler S may be spherical and may have a diameter of 500 nanometers to 5 microns.
- the optical layer 1030 including the filler S may elapse at about 60 degrees Celsius for about 1 hour.
- the thickness of the elapsed optical layer 1030 may be reduced through a lapping process of grinding the surface.
- the surface processed through the lapping process may be the upper surface of the optical layer 1030 .
- the filler S may be exposed to the upper surface of the optical layer 1030 .
- the thickness of the optical layer 1030 may be about 150 micrometers, and the thickness from the top surface of the light emitting device RGB to the top surface of the optical layer 1030 may be about 50 micrometers.
- the thickness of the light emitting device RGB may be about 80 micrometers, and the thickness of the electrode pad 1020 may be about 20 micrometers.
- Light provided from the light emitting device RGB may be refracted or scattered by the pillar S. Light scattered from the filler S may flow out of the optical layer 1030 . After the optical layer 1030 is cured, it may have light-transmitting properties. For example, the cured optical layer 1030 including silicon may have a refractive index of 1.5 to 1.6. Accordingly, light may be totally reflected inside the optical layer 1030 . The filler S may refract or scatter light that is totally reflected inside the optical layer 1030 .
- the pillar S may include a plurality of pillars S having different sizes.
- the size of the pillars S may form a normal distribution.
- the plurality of pillars S may be 500 nanometer pillars. 5 shows the particle size distribution of the fillers S, the horizontal axis may be the size (micrometer, log scale) of the fillers, and the vertical axis may be the quantity distribution (percent).
- the fillers S may be included in the optical layer 1030 .
- the weight ratio of the filler S to the optical layer 1030 may be 0.5 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices RGB is 580 to 585 nits.
- the weight ratio of the filler S to the optical layer 1030 may be 1 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices RGB may be 600 to 605 nits. .
- the weight ratio of the filler (S) to the optical layer 1030 may be 5 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices (RGB) may be 640 to 648 nits. .
- the color coordinates may be 0.293 (Cx) and 0.323 (Cy).
- the weight ratio of the filler (S) to the optical layer 1030 may be 10 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices (RGB) may be 680 to 686 nits. .
- the color coordinates may be 0.291 (Cx) and 0.325 (Cy).
- the luminance of light passing through the optical layer 1030 containing 500 nanometer fillers (S) in a weight ratio of 0.5 percent to the optical layer 1030 is 100 percent, and the optical layer does not include the filler (S). It may be equal to the luminance of light passing through 1030 .
- the luminance of light passing through the optical layer 1030 including 500 nanometers of fillers (S) in a weight ratio of 1 percent to the optical layer 1030 is 102 to 104 percent, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the luminance of light passing through the optical layer 1030 including 500 nanometers of fillers (S) in a weight ratio of 5 percent to the optical layer 1030 is 110 to 112 percent, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the luminance of light passing through the optical layer 1030 containing 500 nanometers of fillers (S) in a weight ratio of 10% to the optical layer 1030 is 116 to 118%, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the weight ratio of the 500 nanometer fillers (S) is greater than 12 percent compared to the optical layer 1030, aggregation of the fillers (S) may occur, so that the luminance of light passing through the optical layer 1030 may be reduced.
- the distinction between RGB pixels may become unclear, and light correction may become difficult.
- the black expressive power of the display device may be improved.
- the pillar S may include a plurality of pillars S having different sizes.
- the size of the pillars S may form a normal distribution.
- the plurality of pillars S may be 5 micrometer pillars. 7 shows the particle size distribution of the fillers S, the horizontal axis may be the size (micrometer, log scale) of the fillers, and the vertical axis may be the quantity distribution (percent).
- fillers from 0 to 2 micron meters may have a distribution of 21.8 percent
- fillers from 2 to 6 micron meters may have a distribution of 46.7 percent
- fillers from 6 to 16 micron meters may have a distribution of 30.2 percent
- 16 to 24 micron meter fillers may have a distribution of 1.3 percent.
- fillers 2 to 16 microns in diameter may have a distribution of 75 to 80 percent.
- the fillers S may be included in the optical layer 1030 .
- the weight ratio of the filler S to the optical layer 1030 may be 0.5 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices RGB may be 587 to 590 nits.
- the weight ratio of the filler (S) to the optical layer 1030 may be 1 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices (RGB) may be 591 to 593 nits. .
- the weight ratio of the filler (S) to the optical layer 1030 may be 10 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices (RGB) may be 633 to 637 nits. .
- the color coordinates may be 0.301 (Cx) and 0.325 (Cy).
- the weight ratio of the filler (S) to the optical layer 1030 may be 20 percent, and the light passing through the optical layer 1030 from the above-described light emitting devices (RGB) may be 665 to 667 nits. .
- the color coordinates may be 0.296 (Cx) and 0.327 (Cy).
- the luminance of light passing through the optical layer 1030 including 5 micrometers of fillers (S) in a weight ratio of 0.5 percent to the optical layer 1030 is 101.2 percent, and the optical layer does not include the fillers (S). It may be greater than the luminance of light passing through 1030 .
- the luminance of light passing through the optical layer 1030 containing 5 micrometers of fillers (S) in a weight ratio of 1 percent to the optical layer 1030 is 100 to 102 percent, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the luminance of light passing through the optical layer 1030 containing 5 micrometers of fillers (S) in a weight ratio of 10% to the optical layer 1030 is 108 to 110%, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the luminance of light passing through the optical layer 1030 including 5 micrometers of fillers (S) in a weight ratio of 20 percent to the optical layer 1030 is 113 to 116 percent, and the filler (S) is not included. It may be greater than the luminance of light passing through the optical layer 1030 .
- the uniformity of light passing through the optical layer 1030 containing 5 micrometers of fillers (S) in a weight ratio of 15 to 23 percent relative to the optical layer 1030 is an optical layer that does not include the fillers (S). Brightness and uniformity may be improved than that of light passing through 1030 .
- the weight ratio of the pillars S of 5 micrometers is greater than 25 percent compared to the optical layer 1030 , aggregation of the pillars S may occur, so that the luminance of light passing through the optical layer 1030 may be reduced.
- the distinction between RGB pixels may become unclear, and light correction may become difficult.
- the black expressive power of the display device may be improved.
- an optical layer 1030 may be positioned on a substrate 1010 on which a light emitting device RGB is mounted.
- the optical layer 1030 may cover and seal the light emitting device RGB mounted on the substrate 1010 .
- the optical layer 1030 may be applied and cured in a liquid phase on the substrate 1010 and the light emitting device RGB.
- the optical layer 1030 may include silicon.
- the optical layer 1030 may have light-transmitting properties.
- a filler (S), as described above, may be included in the optical layer 1030 .
- the filler (S) may be a plurality of particles (S).
- the filler (S) may be, for example, SiO2.
- the filler S may be spherical and may have a diameter of 500 nanometers to 5 microns.
- the optical layer 1030 including the filler S may elapse at about 60 degrees Celsius for about 1 hour.
- the thickness of the elapsed optical layer 1030 may be reduced through a lapping process of grinding the surface.
- the surface processed through the lapping process may be the upper surface of the optical layer 1030 .
- the filler S may be exposed to the upper surface of the optical layer 1030 .
- a portion of the spherical shape of the filler S exposed to the upper surface of the optical layer 1030 may be cut out, and a cut surface of the filler S may be exposed to the outside.
- the thickness of the optical layer 1030 may be about 150 micrometers, and the thickness from the top surface of the light emitting device RGB to the top surface of the optical layer 1030 may be about 50 micrometers.
- the thickness of the light emitting device RGB may be about 80 micrometers, and the thickness of the electrode pad 1020 may be about 20 micrometers.
- Light provided from the light emitting device RGB may be refracted or scattered by the pillar S. Light scattered from the filler S may flow out of the optical layer 1030 . After the optical layer 1030 is cured, it may have light-transmitting properties. For example, the cured optical layer 1030 including silicon may have a refractive index of 1.5 to 1.6. Accordingly, light may be totally reflected inside the optical layer 1030 . The filler S may refract or scatter light that is totally reflected inside the optical layer 1030 .
- the optical film 1040 may be positioned on the optical layer 1030 .
- the optical film 1040 may be in contact with or adhered to the optical layer 1030 .
- the optical film 1040 may include a black material and may be laminated on the optical layer 1030 .
- the black material may be a particle of 10 nanometers or less.
- the optical film 1040 may have a light transmittance of 40 percent.
- the black expressive power of the display device may be improved.
- an optical layer 1030 may be positioned on a substrate 1010 on which a light emitting device RGB is mounted.
- the optical layer 1030 may cover and seal the light emitting device RGB mounted on the substrate 1010 .
- the optical layer 1030 may be applied and cured in a liquid phase on the substrate 1010 and the light emitting device RGB.
- the optical layer 1030 may include silicon.
- the optical layer 1030 may have light-transmitting properties.
- a filler (S), as described above, may be included in the optical layer 1030 .
- the filler (S) may be a plurality of particles (S).
- the filler (S) may be, for example, SiO2.
- the filler S may be spherical and may have a diameter of 500 nanometers to 5 microns.
- the optical layer 1030 may include a black material.
- the black material may be particles of 10 nanometers, and the weight ratio of the optical layer 1030 may be 10% or less.
- the optical layer 1030 including the filler S and the black material may elapse at about 60 degrees Celsius for about 1 hour.
- the thickness of the elapsed optical layer 1030 may be reduced through a lapping process of grinding the surface.
- the surface processed through the lapping process may be the upper surface of the optical layer 1030 .
- the filler S may be exposed to the upper surface of the optical layer 1030 .
- a portion of the spherical shape of the filler S exposed to the upper surface of the optical layer 1030 may be cut out, and a cut surface of the filler S may be exposed to the outside.
- the thickness of the optical layer 1030 may be about 150 micrometers, and the thickness from the top surface of the light emitting device RGB to the top surface of the optical layer 1030 may be about 50 micrometers.
- the thickness of the light emitting device RGB may be about 80 micrometers, and the thickness of the electrode pad 1020 may be about 20 micrometers.
- Light provided from the light emitting device RGB may be refracted or scattered by the pillar S. Light scattered from the filler S may flow out of the optical layer 1030 . After the optical layer 1030 including the filler S and the black material is cured, it may have semi-transmissive properties.
- the black expressive power of the display device may be improved.
- a first optical layer 1030 may be positioned on a substrate 1010 on which a light emitting device RGB is mounted.
- the first optical layer 1030 may cover and seal the light emitting device RGB mounted on the substrate 1010 .
- the first optical layer 1030 may be applied as a liquid on the substrate 1010 and the light emitting device RGB to be cured.
- the first optical layer 1030 may include silicon.
- the first optical layer 1030 may have light-transmitting properties.
- a filler (S), as described above, may be included in the first optical layer 1030 .
- the filler (S) may be a plurality of particles (S).
- the filler (S) may be, for example, SiO2.
- the filler S may be spherical and may have a diameter of 500 nanometers to 5 microns.
- the optical layer 1030 including the filler S may elapse at about 60 degrees Celsius for about 1 hour.
- the thickness of the elapsed optical layer 1030 may be reduced through a lapping process of grinding the surface.
- the surface processed through the lapping process may be the upper surface of the optical layer 1030 .
- the filler S may be exposed to the upper surface of the optical layer 1030 .
- a portion of the spherical shape of the filler S exposed to the upper surface of the optical layer 1030 may be cut out, and a cut surface of the filler S may be exposed to the outside.
- the thickness of the optical layer 1030 may be about 150 micrometers, and the thickness from the top surface of the light emitting device RGB to the top surface of the optical layer 1030 may be about 50 micrometers.
- the thickness of the light emitting device RGB may be about 80 micrometers, and the thickness of the electrode pad 1020 may be about 20 micrometers.
- Light provided from the light emitting device RGB may be refracted or scattered by the pillar S. Light scattered from the filler S may flow out of the first optical layer 1030 .
- the first optical layer 1030 After the first optical layer 1030 is cured, it may have light-transmitting properties.
- the cured first optical layer 1030 including silicon may have a refractive index of 1.5 to 1.6.
- the first optical layer 1030 cured by including silicon may have a refractive index of 1.41.
- the second optical layer 1050 may be positioned on the first optical layer 1030 .
- the second optical layer 1050 may be cured by coating the second optical layer 1050 on the first optical layer 1030 in a liquid phase.
- the second optical layer 1050 may include silicon.
- the second optical layer 1050 may have light-transmitting properties.
- the cured second optical layer 1050 including silicon may have a refractive index of 1.4 to 1.5.
- the refractive index of the second optical layer 1050 that is cured including silicon may be 1.41.
- light extraction efficiency of light provided from the light emitting device RGB and passing through the first optical layer 1030 and the second optical layer 1050 may be improved.
- a display device includes: a display device comprising: a display panel; and a module cover to which the display panel is coupled, wherein the display panel includes: a flat substrate; a plurality of electrode pads formed on the substrate; a plurality of light emitting devices mounted on each of the plurality of electrode pads; an optical layer covering the plurality of light emitting devices and formed on the substrate; and a plurality of fillers formed of spherical particles and distributed in the optical layer, wherein 75 to 80 percent of the plurality of fillers have a diameter of 2 to 16 micrometers, and a weight ratio to the optical layer 15 to 23 percent.
- the optical layer may have transmittance, and the plurality of fillers may have a weight ratio of 20 percent to the optical layer.
- the optical layer as particles of 10 nanometers or less, may further include a black material having a weight ratio of 10 percent or less to the optical layer so that the optical layer may have semi-transmission properties.
- it may further include an optical film positioned on the optical layer and having a light transmittance of 35 to 45 percent.
- the optical layer is a first optical layer having a first refractive index, and further comprising a second optical layer positioned on the first optical layer and having a second refractive index smaller than the first refractive index.
- the first refractive index may be 1.5 to 1.6
- the second refractive index may be 1.4 to 1.5
- the first refractive index may be 1.53, and the second refractive index may be 1.41.
- At least some of the plurality of fillers may form a part of the upper surface of the optical layer.
- the thickness of the optical layer may be 140 to 160 micrometers, and the distance between the upper surface of the light emitting device and the upper surface of the optical layer may be 40 to 60 micrometers.
- the at least some of the plurality of pillars forming a part of the upper surface of the optical layer may have a spherical cut-out cut-out surface.
- configuration A described in a specific embodiment and/or drawings may be combined with configuration B described in other embodiments and/or drawings. That is, even if the combination between the configurations is not directly described, it means that the combination is possible except for the case that the combination is impossible (For example, a configuration "A” described in one embodiment of the disclosure and the drawings). and a configuration "B" described in another embodiment of the disclosure and the drawings may be combined with each other. Namely, although the combination between the configurations is not directly described, the combination is possible except in the case where it is described that the combination is impossible).
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Abstract
Description
Claims (10)
- 디스플레이 패널; 그리고,상기 디스플레이 패널이 결합되는 모듈커버를 포함하고,상기 디스플레이 패널은:평판의 기판;상기 기판 상에 형성되는 복수개의 전극패드;상기 복수개의 전극패드 각각에 장착되는 복수개의 발광소자;상기 복수개의 발광소자를 덮고, 상기 기판 상에 형성되는 광학층; 그리고,구형의 입자로 형성되고, 상기 광학층의 내부에 분포하는 복수개의 필러를 포함하고,상기 복수개의 필러는,75 내지 80 퍼센트가 직경이 2 내지 16 마이크로 미터이고, 상기 광학층 대비 중량비가 15 내지 23 퍼센트인 디스플레이 디바이스.
- 제1 항에 있어서,상기 광학층은 투과성을 지니고,상기 복수개의 필러는,상기 광학층 대비 중량비가 20 퍼센트인 디스플레이 디바이스.
- 제2 항에 있어서,상기 광학층은,10 나노미터 이하의 입자로서, 상기 광학층 대비 중량비 10 퍼센트 이하의 검은색 물질을 더 포함하여 상기 광학층이 반투과성을 지니는 디스플레이 디바이스.
- 제2 항에 있어서,상기 광학층 상에 위치하고, 35 내지 45 퍼센트의 광투과율을 지니는 광필름을 더 포함하는 디스플레이 디바이스.
- 제2 항에 있어서,상기 광학층은 제1 굴절률을 지니는 제1 광학층이고,상기 제1 광학층 상에 위치하고, 제1 굴절률 보다 작은 제2 굴절률을 지니는 제2 광학층을 더 포함하는 디스플레이 디바이스.
- 제5 항에 있어서,상기 제1 굴절률은,1.5 내지 1.6일 수 있고,상기 제2 굴절률은,1.4 내지 1.5인 디스플레이 디바이스.
- 제6 항에 있어서,상기 제1 굴절률은 1.53이고, 상기 제2 굴절률은 1.41인 디스플레이 디바이스.
- 제2 항에 있어서,상기 복수개의 필러 중 적어도 일부는 상기 광학층의 상면의 일부를 형성하는 디스플레이 디바이스.
- 제8 항에 있어서,상기 광학층의 두께는 140 내지 160 마이크로 미터이고,상기 발광소자의 상면과 상기 광학층의 상면 사이의 거리는 40 내지 60 마이크로 미터인 디스플레이 디바이스.
- 제9 항에 있어서,상기 광학층의 상면의 일부를 형성하는 상기 적어도 일부의 복수개의 필러는, 구형이 컷아웃된 절단면을 구비하는 디스플레이 디바이스.
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PCT/KR2021/004290 WO2022215767A1 (ko) | 2021-04-06 | 2021-04-06 | 디스플레이 디바이스 |
KR1020237034976A KR20230158036A (ko) | 2021-04-06 | 2021-04-06 | 디스플레이 디바이스 |
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PCT/KR2021/004290 WO2022215767A1 (ko) | 2021-04-06 | 2021-04-06 | 디스플레이 디바이스 |
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WO2022215767A1 true WO2022215767A1 (ko) | 2022-10-13 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150106016A (ko) * | 2014-03-10 | 2015-09-21 | 삼성디스플레이 주식회사 | 표시장치 |
WO2019044409A1 (ja) * | 2017-08-28 | 2019-03-07 | パナソニックIpマネジメント株式会社 | 波長変換部材、光源、照明装置及び波長変換部材の製造方法 |
KR101957151B1 (ko) * | 2016-12-07 | 2019-06-19 | 엘지디스플레이 주식회사 | 비올로겐 화합물과 이를 포함하는 전해질, 광 투과도 가변 패널 및 표시장치 |
KR20190088587A (ko) * | 2018-01-18 | 2019-07-29 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
KR20190137173A (ko) * | 2017-06-08 | 2019-12-10 | 레이아 인코포레이티드 | 광원 및 그러한 광원을 이용하는 멀티뷰 백라이트 |
-
2021
- 2021-04-06 WO PCT/KR2021/004290 patent/WO2022215767A1/ko active Application Filing
- 2021-04-06 KR KR1020237034976A patent/KR20230158036A/ko unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20150106016A (ko) * | 2014-03-10 | 2015-09-21 | 삼성디스플레이 주식회사 | 표시장치 |
KR101957151B1 (ko) * | 2016-12-07 | 2019-06-19 | 엘지디스플레이 주식회사 | 비올로겐 화합물과 이를 포함하는 전해질, 광 투과도 가변 패널 및 표시장치 |
KR20190137173A (ko) * | 2017-06-08 | 2019-12-10 | 레이아 인코포레이티드 | 광원 및 그러한 광원을 이용하는 멀티뷰 백라이트 |
WO2019044409A1 (ja) * | 2017-08-28 | 2019-03-07 | パナソニックIpマネジメント株式会社 | 波長変換部材、光源、照明装置及び波長変換部材の製造方法 |
KR20190088587A (ko) * | 2018-01-18 | 2019-07-29 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
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