WO2022214373A1 - Unité capteur et procédé de fabrication d'une unité capteur - Google Patents

Unité capteur et procédé de fabrication d'une unité capteur Download PDF

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Publication number
WO2022214373A1
WO2022214373A1 PCT/EP2022/058395 EP2022058395W WO2022214373A1 WO 2022214373 A1 WO2022214373 A1 WO 2022214373A1 EP 2022058395 W EP2022058395 W EP 2022058395W WO 2022214373 A1 WO2022214373 A1 WO 2022214373A1
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WO
WIPO (PCT)
Prior art keywords
sensor
housing
circuit board
sensors
printed circuit
Prior art date
Application number
PCT/EP2022/058395
Other languages
German (de)
English (en)
Inventor
Anwar Hegazi
Joerg Siedentopf
Robert Remus
Thomas Breinlinger
Bernd Lutz
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2022214373A1 publication Critical patent/WO2022214373A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • G01P1/026—Housings for speed measuring devices, e.g. pulse generator

Definitions

  • the invention relates to a sensor unit and a method for producing such a sensor unit.
  • the sensor unit can be used, for example, as a rotational speed sensor for a vehicle wheel or for a rotatable shaft in the vehicle.
  • DE 102 22 204 A1 discloses a holder for a sensor unit and a method for producing a sensor unit.
  • a sensor element and evaluation electronics are electrically and mechanically attached to power rails by welding, soldering, crimping or gluing, which are connected to one another via connecting webs.
  • the busbars with the elements attached to them are placed in an injection mold and, in a first injection process, overmoulded with plastic.
  • the connecting bars are removed.
  • an electrical line or plug contacts are connected by welding, soldering, crimping, or gluing to the ends of the busbars that protrude from the housing and form an external connection.
  • the final outer geometry of the sensor unit is created in a final work step, the so-called final overmoulding, and at the same time the inner electronic components are protected from environmental influences such as moisture.
  • DE 102005 012 709 A1 discloses a magnetic field sensor, in particular a speed and/or direction of rotation sensor for a vehicle wheel or for the drive train of a vehicle.
  • the entire magnetic field sensor is overmoulded with a casing made of thermoplastic material.
  • a holder Inside is a holder that is also injection molded from thermoplastic material Has fusion ribs for secure integration of the holder in the cover.
  • the same polyamide material is used as the thermoplastic both for the cover and for the holder.
  • Two wires of a connection cable are injected into a connection-side end of the holder, the stripped ends of which are connected to busbars by means of a crimp connection.
  • busbars are initially in one piece to facilitate the positioning of the electrical connection parts and are then electrically insulated from one another by separating the connecting parts.
  • the free ends of the busbars are connected by welding or soldering to connection lines of an IC sensor element in the area of a window-like opening in the holder.
  • the holder has a pocket-like recess in the area of the read-side end face, in which the sensor element is inserted and is supported at least in the spray pressure direction during the final overmolding with plastic and is thus protected against mechanical damage.
  • the redundant sensor unit with the features of independent patent claim 1 and the method for producing a redundant sensor unit with the features of independent patent claims 11 or 12 each have the advantage that the actual sealing function is decoupled from the design variability of the housing. This results in a functional division between the seal and the shape of the housing, so that the sealing process in the second injection molding process can be optimized separately from the shape of the housing.
  • the shape of the housing can be adapted to different applications and installation situations, regardless of the seal.
  • the known sealing rib geometries and the holders used in the prior art can be dispensed with.
  • the connection between the casting compound and the housing can be based, for example, on the use of adhesion, bipolar forces or covalent bonds or on a combination of the effects mentioned.
  • Embodiments of the present invention provide a redundant sensor unit that includes two sensors and a printed circuit board.
  • each sensor are at least two first contact means on the Assigned circuit board, which are arranged at a first end of the circuit board and each form an internal electrical interface for contacting the two sensors.
  • at least two second contact means are arranged for each of the two sensors on a second end region of the printed circuit board opposite the first end region, each of which forms an external electrical interface for at least one connecting cable or at least one plug receptacle.
  • An injection-molded housing made of a plastic material defines the outer shape of the sensor unit and forms a sensor receptacle with at least one through-opening.
  • the housing partially encloses the printed circuit board so that the internal electrical interfaces in the area of the sensor receptacle are at least partially free and accessible and the external electrical interfaces for the at least one connection cable or the at least one plug receptacle are formed within the housing.
  • the two sensors are held by the sensor receptacle and each contacted with one of the internal electrical interfaces, with the internal electrical interfaces and the positioned and contacted sensors being enclosed media-tight by a casting compound and forming a sensor head sealed against the housing.
  • the potting compound of the sensor head consists of a material that can be processed at lower pressures and/or temperatures than the plastic material of the housing.
  • a method for producing a redundant sensor unit comprises the steps: providing a printed circuit board which, on a first end area for each sensor, has at least two first contact means, which each form an internal electrical interface for contacting the two sensors, and on a second end area opposite the first end area for each of the each of the two sensors comprises at least two second contact means, which form an external electrical interface for at least one connecting cable or at least one plug receptacle. Connecting cores of the at least one connection cable or contact elements of the at least one connector receptacle with the second contact means of the printed circuit board, which form the external interfaces.
  • Insertion of the printed circuit board with the at least one connection cable or with the contact elements of the at least one connector receptacle in a Cavity of a first injection mold which specifies a shape of a housing with egg ner sensor mount for two sensors. Execution of a first injection molding process with a plastic material and curing of the injection molded housing. Inserting and positioning a first sensor in the Sen sorability the housing and contacting the first sensor with the cor responding at least two first contact means of the circuit board, which form a first internal electrical interface. Inserting and positioning a second sensor in the sensor receptacle and contacting the second sensor with the corresponding at least two first contact means of the printed circuit board, which form a second internal electrical interface.
  • the sealing compound of the sensor head consists of a material which is introduced into the corresponding second injection mold at lower pressures and/or temperatures than the plastic material of the housing.
  • the two sensors are preferably arranged stacked on top of one another in the sensor mount, which means that the second sensor is placed on the first sensor placed on the sensor mount.
  • ICs integrated circuits
  • electronic components By using a printed circuit board, it is possible to arrange additional integrated circuits (ICs) or electronic components on the printed circuit board so that additional functions can be performed, which can be used, for example, for signal processing, signal evaluation or to protect the sensors.
  • the additional integrated circuits and electronic components can be arranged, for example, on surfaces of the printed circuit board or integrated or embedded in the printed circuit board.
  • Embodiments of the invention enable modular production of the redundant sensor unit according to the invention.
  • the housing with a connection area and a sensor mount can be manufactured as a supplied part in various embodiments.
  • the assembly of Housing with the two sensors and the final second injection molding process to seal the sensors and the internal interfaces can then be standardized for the various embodiments of the housing.
  • the standardization of the equipping process and the second injection molding process makes it possible to reduce variance or variety of designs or design variants.
  • sensors with different shapes and dimensions can be realized in a basic sensor design by exchanging a mold insert during the housing production.
  • a modular tool design with standardized inserts for different sensors can be implemented, and tool costs for positioning different sensors can be saved.
  • the standardized second injection molding process and the standardized sealing concept achieved with it enable a common production line for the various embodiments of the redundant sensor unit. Due to the potting compound introduced into the corresponding second injection mold with lower pressures and/or temperatures than the plastic material of the housing, excessive mechanical and/or thermal loading of the two sensors during the second injection molding process can be prevented in an advantageous manner.
  • a redundant sensor unit is understood to mean a structural unit which comprises two sensors which, independently of one another, directly or indirectly detect a physical variable or a change in a physical variable and preferably convert it into an electrical sensor signal. This can be done, for example, via the transmission and/or reception of sound waves and/or electromagnetic waves and/or via a magnetic field or the change in a magnetic field.
  • the sensors can react, for example, to a changing magnetic field and then convert these magnetic field changes directly into corresponding electrical signals and include a Hall sensor element or a magnetoresistive sensor element or an inductive sensor element that detects the change in a magnetic field for example, the voltage generated by magnetic induction re registered. This means that two independent electrical sensor signals are available for further evaluation.
  • Embodiments of the redundant sensor unit according to the invention can be used, for example, to measure rotational speeds and/or directions of rotation in the vehicle.
  • the sensor unit can be used as a speed sensor on the wheels for an anti-lock braking system (ABS), as a speed and phase sensor for an engine controller or as a steering angle sensor for so-called vehicle dynamics control systems and for electric power steering.
  • the sensors are usually constructed as integrated electronic circuits (IC) with at least one integrated sensor element and can also be referred to as sensor chips. These magnetic field changes can be generated, for example, by a pulse wheel or linear element that is moved relative to the sensors. As a result, the sensors can generate and output an electrical signal for determining a distance covered relative to the respective sensor, a speed, an acceleration, an acceleration gradient and/or an angle of rotation.
  • the two sensors can be held stacked one on top of the other by the sensor receptacle. By stacking the two sensors on top of each other, it is possible to create a sensor head with a smaller diameter.
  • a first passage opening can be made in the sensor receptacle in the area of the internal electrical interfaces.
  • the first through opening in the sensor mount facilitates the electrical contacting of the two sensors with the first contact elements on the circuit board.
  • a second passage opening can be made in the sensor receptacle in the direction of the free end of the sensor receptacle in an extension to the printed circuit board, in which the two sensors are arranged. The overall height of the sensor head can be further reduced by inserting the two sensors into the second passage opening.
  • the two sensors can be installed in the housing at the same time, since a first sensor from a first installation direction, preferably from "above”, and a second sensor from a second installation direction, preferably from "below” in the second passage opening Sensor recording can be used.
  • the sensor receptacle can include a receptacle trough formed onto the housing.
  • the casting compound can form a filling which fills the receiving trough formed onto the housing in a media-tight manner and encloses the sensors inserted in the receiving trough and the internal electrical interfaces in a media-tight manner.
  • the sensor receptacle can include a holding web molded onto the housing.
  • the potting compound can form an encapsulation which encloses the holding web formed onto the housing and the sensors arranged on the holding web and the internal electrical interfaces in a media-tight manner.
  • the design of the sensor mount as a holding web enables a particularly thin casing and thus a particularly flat design of the sensor head.
  • the holding bar facilitates the contacting of the two sensors.
  • the first contact means for a first internal interface for a first sensor and the first contact means for a second internal interface for a second sensor can be next to each other or offset in the longitudinal direction of the circuit board on a top side or a bottom side of the circuit board or Cut be arranged from each other on different sides of the circuit board.
  • the second contact means for a first external interface for a first sensor and the second contact means for a second external interface for a second sensor can be placed side by side or offset in the longitudinal direction of the circuit board on an upper side or underside of the circuit board or separately are arranged from each other on different sides of the circuit board.
  • the printed circuit board can be adapted to different installation spaces, since the width and length of the printed circuit board can be varied by the different arrangement options for the first and second contact means.
  • the first contact means arranged on the first end region of the printed circuit board can be designed as contact surfaces, for example.
  • connection contacts of the two sensors can be electrically contacted simply by soldering to the contact surfaces.
  • the second contact means arranged on the opposite second end region of the printed circuit board can, for example, be designed as contact surfaces or as contact webs.
  • the stripped ends of the wires of the at least one connecting cable or the contact elements of the at least one plug socket can be electrically contacted with the printed circuit board by means of crimp connections made by crimp sleeves or by means of splice connections made by splice sleeves.
  • a fastening device can be formed onto the housing and can include a fastening tab or latching means. If the fastening device formed onto the housing includes a fastening strap, then the corresponding redundant sensor unit can be screwed to the installation site, such as an axle stub. Includes the molded to the case Fastening device locking means, the redundant sensor unit can be inserted and locked in example in a mounting hole.
  • the plastic material for the housing can be, for example, a polybutylene terephthalate (PBT) or a polyamide (PA).
  • PBT polybutylene terephthalate
  • PA polyamide
  • a hot-melt adhesive (hotmelt) or a thermoplastic elastomer (TPE) or a thermoplastic polyurethane (TPU) or a silicone can be used as the casting compound.
  • reactive binding substances can be mixed into the plastic material for the housing and/or into the material of the potting compound.
  • the casting compound can form a filling, for example, which in the hardened state fills a receptacle of the sensor receptacle and encloses the two sensors and the internal electrical interfaces in a media-tight manner and is connected to the housing in a media-tight manner.
  • the casting compound can form an encapsulation which, in the hardened state, encloses a holding web of the sensor receptacle with the two sensors and the internal electrical interfaces and is connected to the housing in a media-tight manner.
  • At least one sealing area on contact areas of the housing with the casting compound can be pretreated before the housing is inserted into the second injection molding tool in order to increase the connection between the housing, insert parts, sensor and casting compound, depending on the casting compound used.
  • the at least one sealing area of the housing can be polished, for example, in order to achieve a very smooth surface, as this is advantageous for the connection between the hot melt adhesive and the housing.
  • the housing, the inserts and the sensors can be preheated to improve the connection.
  • a rougher housing surface is advantageous for other casting materials, such as the above-mentioned thermoplastic elastomers (TPE) or thermoplastic polyurethane (TPU) or silicone TPE/TPU or silicone. So at least he can a sealing area of the housing can be roughened and/or specifically structured, for example by sandblasting or milling or by laser structuring. As a result, the connection between the casting compound and the housing, which is based on the utilization of adhesion, bipolar forces and/or covalent bonds, can be improved. Additionally or alternatively, the at least one sealing area of the housing can be plasma-cleaned and/or plasma-activated, for example.
  • the wettability and thus the ability to connect the at least one sealing area to the casting compound can be significantly improved.
  • the at least one sealing area of the housing can be coated with an adhesion promoter or primer, for example, which can improve the adhesion properties of surfaces.
  • an adhesion promoter or primer for example, which can improve the adhesion properties of surfaces.
  • Fig. 1 shows a schematic perspective plan view of an embodiment example of a redundant sensor unit according to the invention.
  • FIG. 2 shows a schematic perspective representation of a first exemplary embodiment of a printed circuit board with internal and external interfaces and a contacted connection cable for the redundant sensor unit according to the invention from FIG. 1.
  • Fig. 3 shows a schematic perspective view of a second exemplary embodiment of a printed circuit board with internal and external interfaces and a contacted connection cable for the redundant sensor unit according to the invention from Fig. 1.
  • FIG. 4 shows a schematic perspective representation of a housing of the redundant sensor unit according to the invention from FIG. 1.
  • Fig. 5 shows a schematic sectional view of a sensor mount with inserted and contacted sensors of the redundant sensor unit according to the invention from Fig. 1.
  • FIG. 6 shows a schematic perspective illustration of a second exemplary embodiment of a redundant sensor unit according to the invention.
  • FIG. 7 shows a schematic perspective view of a third exemplary embodiment of a printed circuit board with internal and external interfaces and contact elements of a connector receptacle for the redundant sensor unit according to the invention from FIG. 6.
  • Fig. 8 shows a schematic perspective representation of a sensor recording of the redundant sensor unit according to the invention from Fig. 6.
  • FIG. 9 shows a schematic sectional view of a sensor head of the redundant sensor unit according to the invention from FIG.
  • FIG. 10 shows a schematic flow chart of an exemplary embodiment of a method according to the invention for producing the redundant sensor units according to the invention from FIG. 1 or 6.
  • Fig. 11 shows a schematic representation of a section of an injection molding tool for producing the redundant sensor unit according to the invention from Fig. 1.
  • FIG. 12 shows a schematic representation of a section of an injection molding tool for producing the redundant sensor unit according to the invention from FIG. 5.
  • the illustrated exemplary embodiments of a redundant sensor unit 1, 1A, 1B each include two sensors 26A, 26B and a printed circuit board 12, 12A, 12B, 12C.
  • Each sensor 26A, 26B has at least two first contact means 13 on the printed circuit board 12,
  • a housing 10, 10A, 10B made from a plastic material by injection molding provides an external shape for the redundant sensor unit 1, 1A, 1B and forms a sensor receptacle 16, 16A, 16B with at least one through-opening 16.1, 16.2.
  • the housing 10, 10A, 10B partially encloses the printed circuit board 12, 12A, 12B so that the internal electrical interfaces 9A1, 9A2 in the area of the sensor receptacle 16, 16A, 16B are at least partially free and accessible and the external electrical interfaces 9B1, 9B2 for the at least one connecting cable 3 or the at least one connector receptacle 7B are formed within the housing 10, 10A, 10B.
  • the two sensors 26A, 26B are held by the sensor receptacle 16, 16A, 16B and are each contacted with one of the internal electrical interfaces 9A1, 9A2.
  • the internal electrical interfaces 9A1, 9A2 and the positioned and contacted sensors 26A, 26B are enclosed media-tight by a potting compound 22 and form a sensor head 20, 20A, 20B sealed against the housing 10, 10A, 10B, with the potting compound 22 of the sensor head 20 , 20A, 20B consists of a material which can be processed at lower pressures and/or temperatures than the plastic material of the housing 10, 10A, 10B.
  • a polybutylene terephthalate (PBT) or a polyamide (PA) is used as the plastic material for the housing 10, 10A, 10B.
  • a hot-melt adhesive (hot melt) or a thermoplastic elastomer (TPE) or a thermoplastic polyurethane (TPU) or a silicone is used for the casting compound 22 .
  • reactive binding substances can be mixed into the plastic material for the housing 10, 10A, 10B and/or into the material of the casting compound 22.
  • the two sensors 26A, 26B are each designed as a sensor chip which, for example, comprises a Hall sensor element or a magnetoresistive sensor element.
  • the redundant sensor units 1, 1A, 1B are preferably used as speed sensors for detecting rotational movements of a vehicle wheel or shaft.
  • the two sensors 26A, 26B are stacked one on top of the other and held by the sensor holder 16, 16A, 16B.
  • a fastening device 17 is formed onto the housing 10, 10A, 10B and comprises a fastening lug 17A and a bushing 18 integrated into the fastening lug 17A.
  • a screw (not shown) can be passed through the socket 18 and the sensor unit 1, 1A, 1B can be screwed to the installation site, for example to a steering knuckle.
  • locking means can be formed on the housing 10 as a fastening device 17, for example, instead of the fastening tab 17A.
  • the sensor unit 1 can be inserted and latched, for example, into a receiving hole.
  • the sensor receptacles 16, 16A, 16B in the illustrated exemplary embodiments each have a first passage opening 16.1 in the area of the internal electrical interfaces 9A1, 9A2.
  • a second passage opening 16.2 is made in the sensor mounts 16, 16A, 16B, 16, in which the two sensors 26A, 26B are stacked are arranged.
  • the sensor receptacle 16 formed at a first end of the housing 10A of the illustrated first exemplary embodiment of the redundant sensor unit 1A according to the invention comprises a receptacle trough 16A formed onto the housing 10A.
  • the casting compound 22 forms a filling 22A, which fills the receiving trough 16A molded onto the housing 10A and the through-openings 16.1, 16.2 in a media-tight manner and the sensors 26A, 26B stacked in the second through-opening 16.2 of the receiving trough 16A and the internal electrical interfaces 9A1 , 9A2 encased on the circuit board 12A.
  • a first sensor 26A is introduced from above and a second sensor 26B from below into the second passage opening 16.2, so that the two sensors 26A, 26B are arranged stacked on top of one another in the second passage opening 16.2.
  • the first contact means 13 for a first internal interface 9A1 for the first sensor 26A are arranged on a top side of the printed circuit board 12A, 12B, and the first contact means 13 for a second internal interface 9A2 for the second sensor 26B are arranged on an underside of the printed circuit board 12A, 12B.
  • the first contact means 13 for the internal electrical interfaces 9A1, 9A2 of the two sensors 26A, 26B are arranged separately from one another on different sides of the circuit board 12A, 12B.
  • the first contact means 13 for the internal electrical interfaces 9A1, 9A2 of the two sensors 26A, 26B can be arranged next to one another or offset in relation to one another in the longitudinal direction of the printed circuit board on the top or bottom of the printed circuit board 12.
  • the second contact means 14 for a first external interface 9B1 for the first sensor 26A and the second contact means 14 for a second external interface 9B2 for the second sensor 26B are next to one another arranged on an upper side of the circuit board 12A.
  • the two second contact means 14 are for the first sensor 26A arranged on the inside and the two second contact means 14 for the second sensor 26B on the outside.
  • the second contact means 14 are for the first external interface 9B1 for the first sensor 26A and the second contact means 14 are for the second external interface 9B2 for the second Sensor 26B in the longitudinal direction of the printed circuit board 12B offset from one another on top of the printed circuit board 12B.
  • the two second contact means 14 for the first sensor 26A are arranged on the inside and the two second contact means 14 for the second sensor 26B are arranged on the outside.
  • the second contact means 14 for the external electrical interfaces 9B1, 9B2 of the two sensors 26A, 26B can be arranged next to one another or offset from one another in the longitudinal direction of the printed circuit board on the underside of the printed circuit board 12.
  • the first contact means 13 arranged on the first end region of the printed circuit board 12A, 12B are designed as contact surfaces 13A, 13B, which are each contacted with connection contacts 28A, 28B of the sensors 26A, 26B.
  • the second contact means 14 arranged on the opposite second end region of the circuit board 12A, 12B are designed as contact webs 14A, 14B.
  • the second contact means 14 designed as contact webs 14A, 14B are each connected by means of a crimp sleeve 15A by a crimp connection to the stripped ends of the corresponding wires 5 of at least one connecting cable 3 .
  • the stripped ends of the wires 5 are placed on the contact bars 14A, 14B of the printed circuit board and the open crimp sleeve 16A is pushed over the wires 5 and the contact bars 14A and then pinched.
  • the second contact means 14 designed as contact webs 14A, 14B can be connected to the stripped ends of the corresponding wires 5 of the at least one connecting cable 3 by means of a splice connection in the case of an embodiment that is not shown.
  • the second contact means 14 can alternatively be designed as contact surfaces which are connected to the stripped ends of the corresponding cores 5 of the at least one connection cable 3 via soldered or welded connections.
  • a common connection cable 3 is used for contacting the external electrical interfaces 9B1, 9B2.
  • Both sides of the circuit board 12A in the area of the internal electrical interfaces 9A1, 9A2 are accessible through the first passage opening 16.1. This makes it easier to make electrical contact between the connection contacts 28A, 28B of the two sensors 26A, 26B and the contact surfaces 13A, 13B on the printed circuit board 12A, for example by resistance welding or soldering.
  • connection area 7 is formed on a second end of the housing 10A opposite the first end, which in the first exemplary embodiment shown comprises a cable receptacle 7A for the connection cable 3 .
  • the connecting cable 3 enters the housing 10A at the cable receptacle 7A.
  • a peripheral depression 19A is formed as a holding area 19 on the housing 10A at the transition to the sensor head 20A, on which the housing 10A is held during the introduction of the casting compound 22 into the receiving trough 16A.
  • the sensor receptacle 16 formed at a first end of the housing 10B of the illustrated second exemplary embodiment of the redundant sensor unit 1B comprises a holding web 16B formed onto the housing 10B.
  • the first through-opening 16.1 is made in the holding web 16B.
  • the casting compound 22 forms a casing 22B, which fills the first through-opening 16.1 and the second through-opening 16.2 and the holding web 16B molded onto the housing 10B and the sensors 26A, 26B arranged on the holding web 16B and the internal electrical interfaces 9A1, 9A2.
  • the redundant Sensor unit 1A introduces a first sensor 26A from above and a second sensor 26B from below into the second passage opening 16.2, so that the two sensors 26A, 26B are arranged stacked on top of one another in the second passage opening 16.2.
  • the first contact means 13 for a first internal interface 9A1 for the first sensor 26A are arranged on a top side of the printed circuit board 12C, and the first contact means 13 for a second internal interface 9A2 for the second sensor 26B are arranged on an underside of the circuit board 12C.
  • the first contact means 13 for the internal electrical interfaces 9A1, 9A2 of the two sensors 26A, 26B are arranged separately from one another on different sides of the printed circuit board 12C.
  • the second contact means 14 for the first external interface 9B1 for the first sensor 26A are arranged on the upper side of the printed circuit board 12C, and the second contact means 14 for the second external Interfaces 9B2 for the second sensor 26B are arranged on the underside of the circuit board 12C.
  • the second contact means 13 for the external electrical interfaces 9B1, 9B2 of the two sensors 26A, 26B are arranged separately from one another on different sides of the circuit board 12C.
  • the second contact means 14 for the external interfaces 9B1, 9B2 are offset from one another in the longitudinal direction of the printed circuit board 12C.
  • the two second contact means 14 for the first sensor 26A are arranged on the inside and the two second contact means 14 for the second sensor 26B are arranged on the outside.
  • the first contact means 13 arranged on the first end area of the printed circuit board 12C are designed analogously to the other exemplary embodiments as contact surfaces 13A, 13B, which are each connected to connection contacts 28A, 28B of the sensors 26A, 26B are contacted.
  • the second contact means 14 arranged on the opposite second end region of the printed circuit board 12C are designed as contact webs 14A, 14B.
  • Contact webs 14A, 14B running second contact means 14 are each connected by a splice sleeve 15B by a splice with the contact elements 8 of the at least one connector receptacle 7B.
  • the contact elements 8 are placed on the contact webs 14A, 14B of the printed circuit board 12C.
  • the second contact means 14 embodied as contact webs 14A, 14B can be connected to the contact elements 8 of the at least one plug receptacle 7B by means of a crimp sleeve by means of a crimp connection in the exemplary embodiments that are not shown.
  • the second contact means 14 can alternatively be designed as contact surfaces which are connected to the contact elements 8 of the at least one plug receptacle 7B via soldered or welded connections.
  • a common plug receptacle 7B is used for contacting the external electrical interfaces 9B1, 9B2.
  • the two external electrical interfaces 9B1, 9B2 each with a plug receptacle 7B.
  • Both sides of the circuit board 12A in the area of the internal electrical interfaces 9A1, 9A2 are accessible through the first passage opening 16.1. This makes it easier to make electrical contact between the connection contacts 28A, 28B of the two sensors 26A, 26B and the contact surfaces 13A, 13B on the printed circuit board 12A, for example by resistance welding or soldering.
  • other connection techniques can also be used to connect the two sensors 26A,
  • connection area 7 is formed, which in the second exemplary embodiment shown comprises the common redundant plug receptacle 7B, into which a plug (not shown) for connecting the sensor unit 1B can be plugged.
  • the contact elements 8 of the common plug socket 7B are each designed as busbars 8A, which have the plug contacts 8.2A,
  • Form 8.2 B of the connector receptacle 7B and at the other end as contact bridges 8.1A, 8.1B are executed.
  • the contact webs 8.1A of the plug contacts 8 are electrically connected via the splice sleeves 15B to the second contact means 14, designed as contact webs 14A, 14B, of the external electrical interfaces 9B1, 9B2 of the sensor unit IC.
  • the power rails 8A are preferably manufactured as stamped and bent parts. In this case, several busbars 8 can be made available in the form of punched grids from a roll or as individual punched grid sheets.
  • two holding openings 19B are formed as holding areas 19 on the housing 10B at the transition to the sensor head 20B, at which the housing 10B is held during the overmolding process of the holding web 15B with the casting compound 22 .
  • the illustrated exemplary embodiment of a method 100 for producing a redundant sensor unit 1A, 1B includes a step S100, through which a printed circuit board 12A, 12B is provided, which is attached to a first end region for each sensor 26A, 26B at least two first contact means 13, each forming an internal electrical interface 9A1, 9A2 for contacting the two sensors 26A, 26B, and at least two second contact means in each case for each of the two sensors 26A, 26B on a second end region opposite the first end region 14 includes, which each form an external electrical interface 9B1, 9B2 for at least one connection cable 3 or at least one plug receptacle 7Baus.
  • the cores 5 of at least one connection cable 3 are connected to the second contact means 14 of the printed circuit board 12A, 12B in a step S110, which form the external interfaces 9B1, 9B2.
  • the contact elements 8 of the at least one plug receptacle 7B are connected to the second contact means 14 of the printed circuit board 12C, which form the external interfaces 9B1, 9B2.
  • a step S120 during the manufacture of the wired redundant sensor unit 1A, the printed circuit board 12A, 12B with the at least one connecting cable 3 is inserted into a cavity of a first injection mold, which is in the form of a housing 10A with a sensor receptacle 16A, 16B for two sensors 26A , 26B.
  • the printed circuit board 12C with the contact elements 8 of the in step S120 is in the production of the redundant sensor unit 1B with a plug receptacle 7B at least one plug receptacle 7B is inserted into the cavity of the first injection mold, which predetermines the shape of a housing 10B with a sensor receptacle 16A, 16B for two sensors 26A, 26B.
  • a first injection molding process is carried out with a plastic material and the housing 10A, 10B manufactured by injection molding is cured.
  • a first sensor 26A is inserted and positioned in the sensor receptacle 16A, 16B of the housing 10A, 10B.
  • the first sensor 26A is contacted with the corresponding at least two first contact means 13 of the printed circuit board 12A, 12B, 12C, which form a first internal electrical interface 9A1.
  • a second sensor 26B is inserted and positioned in the sensor receptacle 16A, 16B.
  • a step S170 the second sensor 26B is contacted with the corresponding at least two first contact means 13 of the printed circuit board 12, which form a second internal electrical interface 9A2.
  • the housing 10A, 10B is placed in a second injection molding tool 30, 30A, 30B and in step S190 a second injection molding process with a casting compound 22 is carried out in such a way that the casting compound 22 in the hardened state has the internal electrical interfaces 9A1, 9A2 and encloses the positioned and contacted sensors 26A, 26B in a media-tight manner and forms a sensor head 20A, 20B sealed against the housing 10A, 10B.
  • the casting compound 22 of the sensor head 20A, 20B consists of a material which is introduced into the corresponding second injection mold 30, 30A, 30B at lower pressures and/or temperatures than the plastic material of the housing 10A, 10B.
  • the redundant sensor unit 1 with a receiving trough 16A such as the first exemplary embodiment of the sensor unit 1A shown in FIGS Sensor receptacle 16 and the through-openings 16.1, 16.2 fills and the two stacked sensors 26A, 26B and the internal electrical interfaces 9A1, 9A2 media-tight encloses and media-tight with the Ge housing 10A is connected.
  • the sensor unit 1 has a receptacle 16A and a plug receptacle 7B.
  • the sensor unit 1 with a holding web 16B such as the second exemplary embodiment of the redundant sensor unit 1B shown in FIGS Encloses sensors 26A, 26B and the internal electrical interfaces 9A1, 9A2 and fills the two passage openings 16.1, 16.2 and is connected to the housing 10B in a media-tight manner.
  • the sensor unit 1 has a holding web 16B and a connecting cable 3 .
  • an additional method step can be provided in which at least one sealing area 24, 24A, 24B is applied to contact areas of the housing 10A, 10B with the casting compound 22 before the housing is inserted 10A, 10B in the second injection mold 30, 30A, 30B to increase a connection between the housing 10A, 10B and the casting compound 22 is pretreated.
  • the at least one sealing area 24 corresponds to a wall 24A of the receiving trough and an edge of the passage openings 16.1, 16.2.
  • the at least one sealing area 24 corresponds to an overlapping area 24B, at which the cover 22B overlaps the housing 10B and at which a sealing contour 16.3 with an undercut is formed on the housing 10B in the exemplary embodiment shown.
  • the at least one sealing area 24 of the housing 10A, 10B can be polished and/or roughened and/or specifically structured will. Additionally or alternatively, the at least one sealing area 24 of the housing 10A, 10B can be plasma-cleaned and/or plasma-activated. Furthermore, the at least one sealing area 24 of the housing 10A, 10B can be coated with an adhesion promoter or primer. Of course, any combination of measures can also be carried out in order to achieve an optimal connection between the housing 10A, 10B and the casting compound 22.
  • the illustrated exemplary embodiments of the second injection molding tool 30, 30A, 30B each comprise a first tool part 32, 32A, 32B, which is shown as the upper tool part, and a second tool part 34, 34A, which is shown as the lower tool part , 34B and a holding device 36 which holds the housing 10A, 10B, IOC during the second injection process.
  • the holding device 36 in the illustrated first exemplary embodiment of the second injection molding tool 30A includes holding jaws 36A, which extend into the holding area 19, designed as a circumferential depression 19A, of the housing 10A of the redundant sensor unit 1A illustrated in FIG intervention.
  • the two tool parts 32A, 34A are of very simple design and only cover the receiving trough 15A and the through-opening 15.1 of the sensor holder 15, with channels not shown at least within one of the two tool parts 32A, 34A are formed, through which the liquid potting compound 22 can be injected.
  • the two tool parts 32B, 34B form a cavity 38 in the illustrated second exemplary embodiment of the second injection molding tool 30B, which predetermines the outer shape of the encapsulation 22B.
  • the holding device 36 in the illustrated second exemplary embodiment includes two holding pistons 36B, which move into the holding openings 19B of the holding area 19 of the housing 10B of the redundant sensor unit 1B illustrated in FIG. At least within one of the two tool parts 32B, 34B, channels (not shown) are formed, through which the liquid casting compound 22 can be injected into the cavity 38.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

L'invention concerne une unité capteur redondante (1) comprenant deux capteurs (26A, 26B) et une carte de circuit imprimé (12), ainsi qu'un procédé de fabrication d'une telle unité capteur redondante (1). Chaque capteur (26A) est associé à au moins deux premiers moyens de contact (13) sur la carte de circuit imprimé (12), lesdits moyens de contact étant disposés sur une première région d'extrémité de la carte de circuit imprimé (12) et chaque moyen de contact formant une interface électrique interne (9A1, 9A2) permettant de mettre en contact les deux capteurs (26A). Au moins deux seconds moyens de contact respectifs sont disposés sur une seconde région d'extrémité de la carte de circuit imprimé (12) située à l'opposée de la première région d'extrémité pour chacun des deux capteurs (26A), chaque second moyen de contact formant une interface électrique externe (9B1, 9B2) pour au moins un câble de connexion (3) ou au moins une zone de réception de fiche, un boîtier (10) constitué d'un matériau plastique au moyen d'un processus de moulage par injection spécifiant la forme extérieure de l'unité capteur (1) et formant une zone de réception de capteur (16) avec au moins une ouverture de passage ; le boîtier (10) entoure partiellement la carte de circuit imprimé (12) de sorte que les interfaces électriques internes (9A1, 9A2) soient au moins partiellement libres et accessibles dans la région de la zone de réception de capteur (16) et de telle sorte que les interfaces électriques externes (9B1, 9B2) pour le ou les câbles de connexion (3) ou la ou les zones de réception de fiche soient formées à l'intérieur du boîtier (10) ; les deux capteurs (26A) sont maintenus par la zone de réception de capteur (16), et chaque capteur est mis en contact au moyen de l'une des interfaces électriques internes (9A1, 9A2) ; les interfaces électriques internes (9A1, 9A2) et les capteurs (26A) positionnés et mis en contact sont entourés d'un matériau d'enrobage (22) de manière étanche au milieu et forment une tête de capteur (20) qui est rendue étanche vis-à-vis du boîtier (10) ; et le composé d'enrobage (22) de la tête de capteur (20) est constitué d'un matériau qui peut être traité à des pressions et/ou à des températures inférieures à celles du matériau plastique du boîtier (10).
PCT/EP2022/058395 2021-04-07 2022-03-30 Unité capteur et procédé de fabrication d'une unité capteur WO2022214373A1 (fr)

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DE102021108659.0 2021-04-07
DE102021108659.0A DE102021108659A1 (de) 2021-04-07 2021-04-07 Sensoreinheit und Verfahren zur Herstellung einer Sensoreinheit

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DE102022123119A1 (de) 2022-09-12 2024-03-14 Erwin Quarder Systemtechnik Gmbh Hybridbauteil und Verfahren zur Herstellung desselben

Citations (8)

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US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
DE10222204A1 (de) 2002-05-18 2003-11-27 Bosch Gmbh Robert Halterung für ein elektrisches Bauteil und ein Verfahren zu dessen Herstellung
DE102005012709A1 (de) 2005-03-22 2006-09-28 Robert Bosch Gmbh Magnetfeldsensor
US20150177025A1 (en) * 2013-12-24 2015-06-25 Denso Corporation Position detecting device
EP3246666A1 (fr) * 2016-05-19 2017-11-22 Jtekt Corporation Unité de capteur et module de collecte de magnétisme et appareil capteur
DE102017222681A1 (de) * 2017-12-13 2019-06-13 Robert Bosch Gmbh Sensorkopf und Verfahren zur Herstellung eines Sensorkopfes
WO2019224167A2 (fr) * 2018-05-25 2019-11-28 Robert Bosch Gmbh Capteur de vitesse de roue, tête de capteur de capteur de vitesse de roue et véhicule
EP3756851A1 (fr) * 2019-06-25 2020-12-30 Nxp B.V. Ensemble capteur double et procédé de fabrication

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034421A (en) * 1996-12-09 2000-03-07 Denso Corporation Semiconductor device including molded IC fixed to casing
DE10222204A1 (de) 2002-05-18 2003-11-27 Bosch Gmbh Robert Halterung für ein elektrisches Bauteil und ein Verfahren zu dessen Herstellung
DE102005012709A1 (de) 2005-03-22 2006-09-28 Robert Bosch Gmbh Magnetfeldsensor
US20150177025A1 (en) * 2013-12-24 2015-06-25 Denso Corporation Position detecting device
EP3246666A1 (fr) * 2016-05-19 2017-11-22 Jtekt Corporation Unité de capteur et module de collecte de magnétisme et appareil capteur
DE102017222681A1 (de) * 2017-12-13 2019-06-13 Robert Bosch Gmbh Sensorkopf und Verfahren zur Herstellung eines Sensorkopfes
WO2019224167A2 (fr) * 2018-05-25 2019-11-28 Robert Bosch Gmbh Capteur de vitesse de roue, tête de capteur de capteur de vitesse de roue et véhicule
EP3756851A1 (fr) * 2019-06-25 2020-12-30 Nxp B.V. Ensemble capteur double et procédé de fabrication

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