WO2022211087A1 - Dispositif à ondes élastiques - Google Patents
Dispositif à ondes élastiques Download PDFInfo
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- WO2022211087A1 WO2022211087A1 PCT/JP2022/016845 JP2022016845W WO2022211087A1 WO 2022211087 A1 WO2022211087 A1 WO 2022211087A1 JP 2022016845 W JP2022016845 W JP 2022016845W WO 2022211087 A1 WO2022211087 A1 WO 2022211087A1
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- electrode fingers
- wave device
- elastic wave
- hole
- bus bar
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- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000001465 metallisation Methods 0.000 claims description 11
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 claims description 10
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 10
- 230000004048 modification Effects 0.000 description 32
- 238000012986 modification Methods 0.000 description 32
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- 230000006866 deterioration Effects 0.000 description 16
- 238000005452 bending Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 13
- 235000019687 Lamb Nutrition 0.000 description 9
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000001902 propagating effect Effects 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910016570 AlCu Inorganic materials 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910003327 LiNbO3 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229910052878 cordierite Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- -1 diamond and glass Chemical compound 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- JSKIRARMQDRGJZ-UHFFFAOYSA-N dimagnesium dioxido-bis[(1-oxido-3-oxo-2,4,6,8,9-pentaoxa-1,3-disila-5,7-dialuminabicyclo[3.3.1]nonan-7-yl)oxy]silane Chemical compound [Mg++].[Mg++].[O-][Si]([O-])(O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2)O[Al]1O[Al]2O[Si](=O)O[Si]([O-])(O1)O2 JSKIRARMQDRGJZ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Definitions
- the present disclosure relates to an acoustic wave device having a piezoelectric layer.
- Patent Document 1 discloses an elastic wave device that uses plate waves.
- An acoustic wave device described in Patent Document 1 includes a support, a piezoelectric substrate, and an IDT electrode.
- the support is provided with a cavity.
- a piezoelectric substrate is provided on the support so as to overlap the cavity.
- the IDT electrode is provided on the piezoelectric substrate so as to overlap the cavity.
- plate waves are excited by IDT electrodes.
- the edge of the cavity does not include a straight portion extending parallel to the propagation direction of the Lamb waves excited by the IDT electrodes.
- An object of the present disclosure is to provide an elastic wave device capable of suppressing deterioration of characteristics.
- An elastic wave device includes: a support member including a support substrate having a thickness direction; a piezoelectric layer provided on the support member in the thickness direction; an IDT electrode provided on the piezoelectric layer in the thickness direction; with The support member is provided with a hollow portion at a position overlapping at least a part of the IDT electrode when viewed in plan in the thickness direction, The piezoelectric layer is provided with a through hole reaching the cavity,
- the IDT electrode includes a first bus bar, a second bus bar facing the first bus bar, a plurality of first electrode fingers provided on the first bus bar and extending toward the second bus bar, and the second bus bar.
- the plurality of first electrode fingers and the plurality of second electrode fingers are arranged adjacent to each other to face each other;
- the plurality of first electrode fingers and the plurality of second electrode fingers are arranged to overlap each other when viewed from the facing direction in which the plurality of adjacent first electrode fingers and the plurality of second electrode fingers face each other.
- the through-hole is between a first imaginary line passing through the tips of the plurality of first electrode fingers and a second imaginary line passing through the tips of the plurality of second electrode fingers in plan view in the thickness direction. are provided in positions other than
- an elastic wave device capable of suppressing deterioration of characteristics.
- FIG. 1 is a schematic perspective view showing the appearance of elastic wave devices according to first and second aspects;
- FIG. Plan view showing the electrode structure on the piezoelectric layer Sectional view of the part along the AA line in FIG. 1A Schematic front sectional view for explaining a Lamb wave propagating through a piezoelectric film of a conventional elastic wave device.
- Schematic front cross-sectional view for explaining waves of the elastic wave device of the present disclosure Schematic diagram showing a bulk wave when a voltage is applied between the first electrode and the second electrode so that the potential of the second electrode is higher than that of the first electrode.
- FIG. 4 is a diagram showing resonance characteristics of the elastic wave device according to the first embodiment of the present disclosure;
- FIG. 4 is a diagram showing the relationship between d/2p and the fractional bandwidth as a resonator of an elastic wave device;
- FIG. 2 is a reference diagram showing an example of resonance characteristics of an elastic wave device;
- FIG. 10 is a diagram showing the relationship between the fractional bandwidth when a large number of elastic wave resonators are configured and the amount of phase rotation of the spurious impedance normalized by 180 degrees as the magnitude of the spurious;
- a diagram showing the relationship between d/2p, metallization ratio MR, and fractional bandwidth A diagram showing a map of the fractional bandwidth with respect to the Euler angles (0°, ⁇ , ⁇ ) of LiNbO3 when d/p is infinitely close to 0.
- FIG. 1 is a partially cutaway perspective view for explaining an elastic wave device according to a first embodiment of the present disclosure
- FIG. Schematic plan view of an elastic wave device according to a second embodiment of the present disclosure
- Elastic wave devices include a piezoelectric layer made of lithium niobate or lithium tantalate, and a first electrode and a second electrode facing each other in a direction intersecting the thickness direction of the piezoelectric layer. and an electrode.
- a thickness shear mode bulk wave is used.
- the first electrode and the second electrode are adjacent electrodes, the thickness of the piezoelectric layer is d, and the distance between the centers of the first electrode and the second electrode is p.
- d/p is 0.5 or less.
- Lamb waves are used as plate waves. Then, resonance characteristics due to the Lamb wave can be obtained.
- An acoustic wave device includes a piezoelectric layer made of lithium niobate or lithium tantalate, and an upper electrode and a lower electrode facing each other in the thickness direction of the piezoelectric layer with the piezoelectric layer interposed therebetween.
- FIG. 1A is a schematic perspective view showing the appearance of an acoustic wave device according to a first embodiment with respect to first and second aspects
- FIG. 1B is a plan view showing an electrode structure on a piezoelectric layer
- 2 is a cross-sectional view of a portion taken along line AA in FIG. 1A.
- the acoustic wave device 1 has a piezoelectric layer 2 made of LiNbO 3 .
- the piezoelectric layer 2 may consist of LiTaO 3 .
- the cut angle of LiNbO 3 and LiTaO 3 is Z-cut in this embodiment, but may be rotational Y-cut or X-cut.
- the Y-propagation and X-propagation ⁇ 30° propagation orientations are preferred.
- the thickness of the piezoelectric layer 2 is not particularly limited, it is preferably 50 nm or more and 1000 nm or less in order to effectively excite the thickness-shear mode.
- the piezoelectric layer 2 has first and second main surfaces 2a and 2b facing each other. Electrodes 3 and 4 are provided on the first main surface 2a.
- the electrode 3 is an example of the "first electrode” and the electrode 4 is an example of the "second electrode”.
- the multiple electrodes 3 are multiple first electrode fingers connected to a first busbar 5 .
- the multiple electrodes 4 are multiple second electrode fingers connected to the second bus bar 6 .
- the plurality of electrodes 3 and the plurality of electrodes 4 are interleaved with each other.
- the electrodes 3 and 4 have a rectangular shape and a length direction.
- the electrode 3 and the adjacent electrode 4 face each other in a direction perpendicular to the length direction.
- These electrodes 3 and 4, the first bus bar 5 and the second bus bar 6 constitute an IDT (Interdigital Transducer) electrode.
- IDT Interdigital Transducer
- Both the length direction of the electrodes 3 and 4 and the direction orthogonal to the length direction of the electrodes 3 and 4 are directions crossing the thickness direction of the piezoelectric layer 2 . Therefore, it can be said that the electrode 3 and the adjacent electrode 4 face each other in the direction intersecting the thickness direction of the piezoelectric layer 2 .
- the length direction of the electrodes 3 and 4 may be interchanged with the direction orthogonal to the length direction of the electrodes 3 and 4 shown in FIGS. 1A and 1B. That is, in FIGS. 1A and 1B, the electrodes 3 and 4 may extend in the direction in which the first busbar 5 and the second busbar 6 extend. In that case, the first busbar 5 and the second busbar 6 extend in the direction in which the electrodes 3 and 4 extend in FIGS. 1A and 1B.
- a plurality of pairs of structures in which an electrode 3 connected to one potential and an electrode 4 connected to the other potential are adjacent to each other are provided in a direction perpendicular to the length direction of the electrodes 3 and 4.
- the electrodes 3 and 4 are adjacent to each other, it does not mean that the electrodes 3 and 4 are arranged so as to be in direct contact with each other, but that the electrodes 3 and 4 are arranged with a gap therebetween.
- the electrode 3 and the electrode 4 are adjacent to each other, no electrode connected to the hot electrode or the ground electrode, including the other electrodes 3 and 4, is arranged between the electrode 3 and the electrode 4.
- the logarithms need not be integer pairs, but may be 1.5 pairs, 2.5 pairs, or the like.
- the center-to-center distance or pitch between the electrodes 3 and 4 is preferably in the range of 1 ⁇ m or more and 10 ⁇ m or less. Further, the center-to-center distance between the electrodes 3 and 4 means the center of the width dimension of the electrode 3 in the direction perpendicular to the length direction of the electrode 3 and the width dimension of the electrode 4 in the direction perpendicular to the length direction of the electrode 4.
- the center-to-center distance between the electrodes 3 and 4 is 1. .
- the width of the electrodes 3 and 4, that is, the dimension in the facing direction of the electrodes 3 and 4 is preferably in the range of 150 nm or more and 1000 nm or less.
- center-to-center distance between the electrodes 3 and 4 means the distance between the center of the dimension (width dimension) of the electrode 3 in the direction orthogonal to the length direction of the electrode 3 and the distance between the center of the electrode 4 in the direction orthogonal to the length direction of the electrode 4. It is the distance connecting the center of the dimension (width dimension) of
- the direction perpendicular to the length direction of the electrodes 3 and 4 is the direction perpendicular to the polarization direction of the piezoelectric layer 2 .
- “perpendicular” is not limited to being strictly perpendicular, but substantially perpendicular (the angle formed by the direction perpendicular to the length direction of the electrodes 3 and 4 and the polarization direction is, for example, 90° ⁇ 10°). It's okay.
- a supporting member 8 is laminated on the second main surface 2b side of the piezoelectric layer 2 with an insulating layer 7 interposed therebetween.
- the insulating layer 7 and the support member 8 have a frame shape and, as shown in FIG. 2, have openings 7a and 8a.
- a cavity 9 is thereby formed.
- the cavity 9 is provided so as not to disturb the vibration of the excitation region C of the piezoelectric layer 2 . Therefore, the support member 8 is laminated on the second main surface 2b with the insulating layer 7 interposed therebetween at a position not overlapping the portion where at least one pair of electrodes 3 and 4 are provided. Note that the insulating layer 7 may not be provided. Therefore, the support member 8 can be directly or indirectly laminated to the second main surface 2b of the piezoelectric layer 2 .
- the insulating layer 7 is made of silicon oxide. However, in addition to silicon oxide, suitable insulating materials such as silicon oxynitride and alumina can be used.
- the support member 8 is made of Si. The plane orientation of the surface of Si on the piezoelectric layer 2 side may be (100), (110), or (111). Preferably, high-resistance Si having a resistivity of 4 k ⁇ or more is desirable. However, the support member 8 can also be constructed using an appropriate insulating material or semiconductor material.
- Materials for the support member 8 include, for example, aluminum oxide, lithium tantalate, lithium niobate, piezoelectric materials such as crystal, alumina, magnesia, sapphire, silicon nitride, aluminum nitride, silicon carbide, zirconia, cordierite, mullite, and steer.
- Various ceramics such as tight and forsterite, dielectrics such as diamond and glass, and semiconductors such as gallium nitride can be used.
- the plurality of electrodes 3, 4 and the first and second bus bars 5, 6 are made of appropriate metals or alloys such as Al, AlCu alloys.
- the electrodes 3 and 4 and the first and second bus bars 5 and 6 have a structure in which an Al film is laminated on a Ti film. Note that an adhesion layer other than the Ti film may be used.
- an AC voltage is applied between the multiple electrodes 3 and the multiple electrodes 4 . More specifically, an AC voltage is applied between the first busbar 5 and the second busbar 6 . As a result, it is possible to obtain resonance characteristics using bulk waves in the thickness-shear mode excited in the piezoelectric layer 2 .
- d/p is 0.0, where d is the thickness of the piezoelectric layer 2 and p is the center-to-center distance between any one of the pairs of electrodes 3 and 4 adjacent to each other. 5 or less. Therefore, the thickness-shear mode bulk wave is effectively excited, and good resonance characteristics can be obtained. More preferably, d/p is 0.24 or less, in which case even better resonance characteristics can be obtained.
- the center-to-center distance p of the electrodes 3 and 4 is the average distance between the center-to-center distances of each adjacent electrode 3 and 4 .
- the elastic wave device 1 of the present embodiment has the above configuration, even if the logarithm of the electrodes 3 and 4 is reduced in order to reduce the size, the Q value is unlikely to decrease. This is because the resonator does not require reflectors on both sides, and the propagation loss is small. Moreover, the fact that the reflector is not required is due to the fact that the thickness shear mode bulk wave is used.
- FIG. 3A is a schematic front cross-sectional view for explaining Lamb waves propagating through a piezoelectric film of a conventional elastic wave device.
- a conventional elastic wave device is described, for example, in Japanese Unexamined Patent Publication No. 2012-257019.
- waves propagate through the piezoelectric film 201 as indicated by arrows.
- the first main surface 201a and the second main surface 201b face each other, and the thickness direction connecting the first main surface 201a and the second main surface 201b is the Z direction. is.
- the X direction is the direction in which the electrode fingers of the IDT electrodes are arranged. As shown in FIG.
- the wave propagates in the X direction as shown. Since it is a plate wave, although the piezoelectric film 201 as a whole vibrates, since the wave propagates in the X direction, reflectors are arranged on both sides to obtain resonance characteristics. Therefore, a wave propagation loss occurs, and the Q value decreases when miniaturization is attempted, that is, when the logarithm of the electrode fingers is decreased.
- the wave is generated between the first main surface 2a and the second main surface 2a of the piezoelectric layer 2. It propagates almost in the direction connecting the surface 2b, that is, in the Z direction, and resonates. That is, the X-direction component of the wave is significantly smaller than the Z-direction component. Further, since resonance characteristics are obtained by propagating waves in the Z direction, no reflector is required. Therefore, no propagation loss occurs when propagating to the reflector. Therefore, even if the number of electrode pairs consisting of the electrodes 3 and 4 is reduced in an attempt to promote miniaturization, the Q value is unlikely to decrease.
- FIG. 4 schematically shows bulk waves when a voltage is applied between the electrodes 3 and 4 so that the potential of the electrode 4 is higher than that of the electrode 3 .
- the first region 451 is a region of the excitation region C between the first main surface 2a and a virtual plane VP1 that is perpendicular to the thickness direction of the piezoelectric layer 2 and bisects the piezoelectric layer 2 .
- the second region 452 is a region of the excitation region C between the virtual plane VP1 and the second main surface 2b.
- At least one pair of electrodes consisting of the electrodes 3 and 4 is arranged. It is not always necessary to have a plurality of pairs of electrode pairs. That is, it is sufficient that at least one pair of electrodes is provided.
- the electrode 3 is an electrode connected to a hot potential
- the electrode 4 is an electrode connected to a ground potential.
- electrode 3 may also be connected to ground potential and electrode 4 to hot potential.
- at least one pair of electrodes is an electrode connected to a hot potential or an electrode connected to a ground potential, as described above, and no floating electrodes are provided.
- FIG. 5 is a diagram showing resonance characteristics of the elastic wave device according to the first embodiment of the present disclosure.
- the design parameters of the elastic wave device 1 with this resonance characteristic are as follows.
- the number of pairs of electrodes 3 and 4 21 pairs
- center distance between electrodes 3 ⁇ m
- width of electrodes 3 and 4 500 nm
- d/p 0.133.
- Insulating layer 7 Silicon oxide film with a thickness of 1 ⁇ m.
- Support member 8 Si.
- the length of the excitation region C is the dimension along the length direction of the electrodes 3 and 4 of the excitation region C.
- the inter-electrode distances of the electrode pairs consisting of the electrodes 3 and 4 are all the same in a plurality of pairs. That is, the electrodes 3 and 4 were arranged at equal pitches.
- FIG. 6 is a diagram showing the relationship between this d/2p and the fractional bandwidth of the acoustic wave device as a resonator.
- a resonator with a wider specific band can be obtained, and a resonator with a higher coupling coefficient can be realized. Therefore, like the elastic wave device of the second aspect of the present disclosure, by setting d/p to 0.5 or less, a resonator having a high coupling coefficient using the thickness shear mode bulk wave is configured. you know you can.
- At least one pair of electrodes may be one pair, and p is the center-to-center distance between adjacent electrodes 3 and 4 in the case of one pair of electrodes. In the case of 1.5 pairs or more of electrodes, the average distance between the centers of adjacent electrodes 3 and 4 should be p.
- the thickness d of the piezoelectric layer if the piezoelectric layer 2 has variations in thickness, a value obtained by averaging the thickness may be adopted.
- FIG. 7 is a plan view of another elastic wave device according to the first embodiment of the present disclosure.
- elastic wave device 31 a pair of electrodes having electrode 3 and electrode 4 is provided on first main surface 2 a of piezoelectric layer 2 .
- K in FIG. 7 is the intersection width.
- the number of pairs of electrodes may be one. Even in this case, if d/p is 0.5 or less, bulk waves in the thickness-shear mode can be effectively excited.
- the adjacent electrodes 3 and 4 with respect to the excitation region, which is an overlapping region when viewed in the direction in which any of the adjacent electrodes 3 and 4 face each other. It is desirable that the metallization ratio MR of the electrodes 3 and 4 satisfy MR ⁇ 1.75(d/p)+0.075. That is, when viewed in the direction in which the plurality of adjacent first electrode fingers and the plurality of second electrode fingers face each other, the region where the plurality of first electrode fingers and the plurality of second electrode fingers overlap is excited.
- MR is the metallization ratio of the plurality of first electrode fingers and the plurality of second electrode fingers to the excitation region. MR ⁇ 1.75(d/p)+0.075. preferably fulfilled. In that case, spurious can be effectively reduced.
- FIG. 8 is a reference diagram showing an example of resonance characteristics of the acoustic wave device 1.
- a spurious signal indicated by an arrow B appears between the resonance frequency and the anti-resonance frequency.
- d/p 0.08 and the Euler angles of LiNbO 3 (0°, 0°, 90°).
- the metallization ratio MR was set to 0.35.
- the metallization ratio MR will be explained with reference to FIG. 1B.
- the excitation region means a region where the electrode 3 and the electrode 4 overlap each other when the electrodes 3 and 4 are viewed in a direction orthogonal to the length direction of the electrodes 3 and 4, that is, in a facing direction. and a region where the electrodes 3 and 4 in the region between the electrodes 3 and 4 overlap.
- the area of the electrodes 3 and 4 in the excitation region C with respect to the area of this excitation region is the metallization ratio MR. That is, the metallization ratio MR is the ratio of the area of the metallization portion to the area of the drive region.
- MR may be the ratio of the metallization portion included in the entire excitation region to the total area of the excitation region.
- FIG. 9 is a diagram showing the relationship between the fractional bandwidth and the amount of phase rotation of the spurious impedance normalized by 180 degrees as the magnitude of the spurious when a large number of acoustic wave resonators are configured according to this embodiment. be.
- the ratio band was adjusted by changing the film thickness of the piezoelectric layer and the dimensions of the electrodes.
- FIG. 9 shows the results when a Z-cut LiNbO 3 piezoelectric layer is used, but the same tendency is obtained when piezoelectric layers with other cut angles are used.
- the spurious is as large as 1.0.
- the fractional band exceeds 0.17, that is, exceeds 17%, a large spurious with a spurious level of 1 or more changes the parameters constituting the fractional band, even if the passband appear within. That is, as in the resonance characteristics shown in FIG. 8, a large spurious component indicated by arrow B appears within the band. Therefore, the specific bandwidth is preferably 17% or less. In this case, by adjusting the film thickness of the piezoelectric layer 2 and the dimensions of the electrodes 3 and 4, the spurious response can be reduced.
- FIG. 10 is a diagram showing the relationship between d/2p, metallization ratio MR, and fractional bandwidth.
- various elastic wave devices having different d/2p and MR were constructed, and the fractional bandwidth was measured.
- the hatched portion on the right side of the dashed line D in FIG. 10 is the area where the fractional bandwidth is 17% or less.
- FIG. 11 is a diagram showing a map of the fractional bandwidth with respect to the Euler angles (0°, ⁇ , ⁇ ) of LiNbO 3 when d/p is infinitely close to 0.
- the hatched portion in FIG. 11 is a region where a fractional bandwidth of at least 5% or more is obtained, and when the range of the region is approximated, the following formulas (1), (2) and (3) ).
- the fractional band can be sufficiently widened, which is preferable.
- FIG. 12 is a partially cutaway perspective view for explaining the elastic wave device according to the first embodiment of the present disclosure.
- the elastic wave device 81 has a support substrate 82 .
- the support substrate 82 is provided with a concave portion that is open on the upper surface.
- a piezoelectric layer 83 is laminated on the support substrate 82 .
- a hollow portion 9 is thereby formed.
- An IDT electrode 84 is provided on the piezoelectric layer 83 above the cavity 9 .
- Reflectors 85 and 86 are provided on both sides of the IDT electrode 84 in the elastic wave propagation direction.
- the outer periphery of the hollow portion 9 is indicated by broken lines.
- the IDT electrode 84 has first and second bus bars 84a and 84b, an electrode 84c as a plurality of first electrode fingers, and an electrode 84d as a plurality of second electrode fingers.
- the multiple electrodes 84c are connected to the first bus bar 84a.
- the multiple electrodes 84d are connected to the second bus bar 84b.
- the multiple electrodes 84c and the multiple electrodes 84d are interposed.
- a Lamb wave as a plate wave is excited by applying an AC electric field to the IDT electrodes 84 on the cavity 9. Since the reflectors 85 and 86 are provided on both sides, the resonance characteristics due to the Lamb wave can be obtained.
- the elastic wave device of the present disclosure may utilize plate waves.
- FIG. 13 is a schematic plan view of an elastic wave device according to the second embodiment of the present disclosure.
- FIG. 14 is a schematic enlarged view of the vicinity of the electrodes.
- FIG. 15 is a schematic cross-sectional view of the elastic wave device of FIG. 14 taken along line AA.
- the elastic wave device 100 includes a supporting member 101, a piezoelectric layer 110 and a resonator 120.
- FIG. A hollow portion 130 is provided in the support member 101 , and a wiring electrode 140 is connected to the resonator 120 .
- the support member 101 has a support substrate 102 and an intermediate layer 103 .
- the support member 101 is composed of a laminate of a support substrate 102 made of Si and an intermediate layer 103 laminated on the support substrate 102 and made of SiOx. Note that the support member 101 only needs to have the support substrate 102 and does not have to have the intermediate layer 103 .
- Intermediate layer 103 may be referred to herein as bonding layer 103 .
- the support substrate 102 is a substrate having a thickness in the first direction D11.
- the “first direction” is the thickness direction of the support substrate 102 and means the lamination direction in which the support member 101 and the piezoelectric layer 110 are laminated.
- a hollow portion 130 is provided in the support member 101 .
- the "cavity” may also be referred to as a "space”.
- the hollow portion 130 is provided between the support member 101 and the piezoelectric layer 110 . That is, the cavity 130 is a space defined by the support member 101 and the piezoelectric layer 110 . In this embodiment, the cavity 130 is provided in the intermediate layer 103 . Specifically, the intermediate layer 103 is provided with a recess opening on the surface opposite to the surface in contact with the support substrate 102 . A hollow portion 130 is formed by covering the recess with the piezoelectric layer 110 .
- hollow portion 130 may be provided in a part of the support member 101 and may be provided in the intermediate layer 103 instead of the support substrate 102 .
- cavity 130 may be provided in support substrate 102 .
- the piezoelectric layer 110 is provided on the support member 101 .
- the piezoelectric layer 110 is laminated on the support member 101 in the first direction D11.
- the piezoelectric layer 110 is provided on the intermediate layer 103 .
- the piezoelectric layer 110 is provided on the surface of the intermediate layer 103 opposite to the surface in contact with the support substrate 102 .
- the portion of the piezoelectric layer 110 located in the region overlapping the cavity portion 130 when viewed in plan in the first direction D11 is referred to as the membrane portion 111.
- “planarly viewed in the first direction D11” means viewing from the lamination direction of the support member 101 and the piezoelectric layer 110 .
- the hollow portion 130 may be provided in the support member 101 at a position overlapping at least a portion of the resonator 120 in plan view in the first direction D11.
- the piezoelectric layer 110 is made of LiNbOx or LiTaOx, for example.
- the piezoelectric layer 110 consists of lithium niobate or lithium tantalate.
- the thickness of the piezoelectric layer 110 is thinner than the thickness of the intermediate layer 103 .
- the resonator 120 has functional electrodes provided on the piezoelectric layer 110 .
- the functional electrode may also be referred to as an electrode portion.
- the functional electrodes are IDT electrodes.
- the IDT electrodes include a first bus bar 121 and a second bus bar 122 facing each other, a plurality of first electrode fingers 123 connected to the first bus bar 121, and a plurality of second electrode fingers 124 connected to the second bus bar 122.
- the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are interposed with each other, and adjacent first electrode fingers 123 and second electrode fingers 124 form a pair of electrode sets.
- the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 extend in a second direction D12 intersecting the first direction D11 and overlap each other when viewed from a third direction D13 orthogonal to the second direction D12. are placed.
- the second direction D ⁇ b>12 is the plane direction of the piezoelectric layer 110 , which intersects the stacking direction in which the support member 101 and the piezoelectric layer 110 are stacked.
- the plane direction of the piezoelectric layer 110 is the direction in which the surface of the piezoelectric layer 110 extends when viewed from above in the first direction D11.
- a third direction D13 is a direction orthogonal to the second direction D12 in a plan view of the first direction D11, and is a direction in which the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged. That is, the third direction D13 is the facing direction in which the plurality of adjacent first electrode fingers 123 and the plurality of second electrode fingers 124 face each other.
- the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged to face each other adjacent to each other.
- the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged to overlap each other. That is, the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are alternately arranged in the third direction D13. Specifically, adjacent first electrode fingers 123 and second electrode fingers 124 are arranged to face each other to form a pair of electrode sets. In the resonator 120, multiple electrode sets are arranged in the third direction D13.
- the plurality of first electrode fingers 123 extend in a second direction D12 intersecting the first direction D11. Base ends of the plurality of first electrode fingers 123 are connected to the first bus bar 121 .
- the plurality of second electrode fingers 124 face any one of the plurality of first electrode fingers 123 in a third direction D13 orthogonal to the second direction D12 and extend in the second direction D12. Base ends of the plurality of second electrode fingers 124 are connected to the second bus bar 122 .
- a region where the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged to overlap in the third direction D13 is the excitation region C1. That is, the excitation region C1 includes the plurality of first electrode fingers 123 and the plurality of second electrode fingers 123 when viewed in the direction in which the adjacent first electrode fingers 123 and the second electrode fingers 124 face each other, ie, the third direction D13. This is the area where the electrode fingers 124 overlap.
- the excitation region C1 may be referred to herein as the intersection region C1.
- the IDT electrode is provided on the piezoelectric layer 110 at a position overlapping with the cavity 130 when viewed in plan in the first direction D11.
- the hollow portion 130 includes a portion of a first bus bar 121, a portion of a second bus bar 122, a plurality of first electrode fingers 123, and a plurality of second bus bars 122, which will be described later. It is provided at a position overlapping with the electrode finger 124 .
- the IDT electrodes are provided on the membrane portion 111 .
- the IDT electrode may be provided on at least a portion of the membrane portion 111 when viewed in plan in the first direction D11.
- the IDT electrodes are connected to wiring electrodes 140 .
- wiring electrode 140 is provided on first bus bar 121 and second bus bar 122 .
- the wiring electrodes 140 are electrically connected to the first bus bar 121 and the second bus bar 122 respectively.
- the wiring electrodes 140 are arranged so as to overlap the first bus bar 121 and the second bus bar 122 when viewed in plan in the first direction D11.
- the wiring electrode 140 may be arranged on at least one of the first bus bar 121 and the second bus bar 122 .
- a dielectric film may be provided on the piezoelectric layer 110 so as to cover the IDT electrodes. Note that the dielectric film may not necessarily be provided.
- the piezoelectric layer 110 is provided with a plurality of through-holes 112 reaching the hollow portion 130 .
- the plurality of through holes 112 are provided on both outer sides of the IDT electrodes in the third direction D13 when viewed in plan in the first direction D11.
- the plurality of through-holes 112 communicate with the hollow portion 130 via the drawer portion 131 .
- the lead-out portion 131 is a path that communicates the through-hole 112 and the hollow portion 130 .
- the lead-out portion 131 is provided at a position overlapping the through-hole 112 in plan view in the first direction D11.
- the width of the lead-out portion 131 is smaller than the width of the hollow portion 130 .
- the width of the lead-out portion 131 means the dimension of the lead-out portion 131 in the second direction D12 when viewed from above in the first direction D11.
- the width of the hollow portion 130 means the dimension of the hollow portion 130 in the second direction D12 when viewed from above in the first direction D11.
- the plurality of through-holes 112 are provided outside the intersecting region C1 and at positions other than between the first imaginary line L1 and the second imaginary line L2 when viewed in plan in the first direction D11. .
- the first imaginary line L1 is an imaginary straight line extending in the third direction D13 through the tips 123a of the plurality of first electrode fingers 123 when viewed in plan in the first direction D11.
- the second imaginary line L2 is an imaginary straight line extending in the third direction D13 through the distal ends 124a of the plurality of second electrode fingers 124 in plan view in the first direction D11.
- the plurality of through holes 112 are provided at positions that do not overlap with the intersection region C1 when viewed from the third direction D13.
- the multiple through holes 112 include a first through hole 112A and a second through hole 112B arranged with the IDT electrodes therebetween when viewed in plan in the first direction D11.
- the first through hole 112A is provided closer to the first busbar 121 than the second imaginary line L2 in plan view in the first direction D11. Specifically, the first through hole 112A is provided between the second imaginary line L2 and the extension line of the first bus bar 121 in the second direction D12. Further, the first through hole 112A is provided inside the extension line of the first bus bar 121 outside the intersection region C1.
- the extension line of the first busbar 121 is a line extending in the longitudinal direction (third direction D13) of the first busbar 121 in plan view in the first direction D11.
- the second through hole 112B is provided closer to the second bus bar 122 than the first imaginary line L1 in plan view in the first direction D11. Specifically, the second through hole 112B is provided between the first imaginary line L1 and the extension line of the second bus bar 122 in the second direction D12. Further, the second through hole 112B is provided inside the extension line of the second bus bar 122 outside the intersection region C1.
- the extension line of the second bus bar 122 is a line extending in the longitudinal direction (the third direction D13) of the second bus bar 122 in plan view in the first direction D11.
- the first through-hole 112A and the second through-hole 112B are provided in regions close to the first bus bar 121 and the second bus bar 122, which have a larger metallized area than the first electrode fingers 123 and the second electrode fingers 124, respectively. It is The vicinity of the first bus bar 121 and the second bus bar 122 is a region where the supporting force is relatively stronger than the first electrode finger 123 and the second electrode finger 124 so that the piezoelectric layer 110 does not bend.
- the piezoelectric layer 110 is bent by the first through holes 112A and the second through holes 112B. can be suppressed. This can prevent the piezoelectric layer 110 from sticking to the bottom surface of the cavity 130 .
- the opening area of the first through-hole 112A is equal to the opening area of the second through-hole 112B.
- 112 A of 1st through-holes and the 2nd through-hole 112B have circular shape, for example, planarly viewed in the 1st direction D11.
- the opening area of the first through-hole 112A may differ from the opening area of the second through-hole 112B.
- first through-hole 112A and the second through-hole 112B communicate with the hollow portion 130 via the drawer portion 131, respectively.
- the first through-hole 112A and the second through-hole 112B are provided at positions that do not overlap when viewed from the third direction D13. That is, the first through hole 112A and the second through hole 112B are provided at positions that do not face each other with the resonator 120 interposed therebetween.
- the straight line L10 connecting the plurality of through holes 112 sandwiching the functional electrode (IDT electrode) does not have to be orthogonal to the second direction D12 in which the electrode fingers extend.
- the plurality of through holes 112 are likely to be arranged symmetrically with respect to the line L10 passing through the center of the functional electrode, the piezoelectric layer is more likely to flex evenly, and deterioration of characteristics is likely to be suppressed.
- the support member 101 including the support substrate 102 having the thickness direction in the first direction D11, the piezoelectric layer 110 provided on the support member 101 in the first direction D11, the first and an IDT electrode provided on the piezoelectric layer 110 in the direction D11.
- the support member 101 is provided with a hollow portion 130 at a position that overlaps at least a portion of the IDT electrode when viewed in plan in the first direction D11.
- the piezoelectric layer 110 is provided with a through hole 112 that reaches the hollow portion 130 .
- the IDT electrodes include a first bus bar 121 , a second bus bar 122 facing the first bus bar 121 , a plurality of first electrode fingers 123 provided on the first bus bar 121 and extending toward the second bus bar 122 , and a second bus bar 122 . and a plurality of second electrode fingers 124 provided on the busbar 122 and extending toward the first busbar 121 .
- the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged to face each other adjacent to each other.
- the through-hole 112 has a first imaginary line L1 passing through the tips 123a of the plurality of first electrode fingers 123 and a second imaginary line L1 passing through the tips 124a of the plurality of second electrode fingers 124 in plan view in the first direction D11. It is provided at a position other than between L2 and .
- through hole 112 is provided at a position other than between first imaginary line L1 and second imaginary line L2 in plan view in first direction D11. Thereby, the through hole 112 can be provided at a position where the piezoelectric layer 110 is difficult to bend.
- the through hole 112 can be provided near the first busbar 121 or the second busbar 122 .
- the vicinity of the first bus bar 121 and the second bus bar 122 is a region where a force supporting the piezoelectric layer 110 is likely to be applied and the piezoelectric layer 110 is less likely to bend.
- the through-hole 112 can be provided in a region where the piezoelectric layer 110 is difficult to bend, bending of the piezoelectric layer 110 due to the provision of the through-hole 112 can be suppressed. As a result, it is possible to prevent the piezoelectric layer 110 from bending and sticking to the bottom surface of the cavity 130 , thereby suppressing deterioration of the characteristics of the elastic wave device 100 .
- unnecessary waves generated from the IDT electrodes can be reduced. Specifically, the unnecessary waves generated from the IDT electrodes collide with the through holes 112 and are scattered, so that the leakage of the unnecessary waves can be suppressed.
- the through-hole 112 includes a first through-hole 112A and a second through-hole 11B arranged with the IDT electrode interposed therebetween when viewed in plan in the first direction D11.
- unnecessary waves generated from the IDT electrodes can collide with the first through holes 112A and the second through holes 112B and be scattered. Thereby, it is possible to further suppress the leakage of unnecessary waves, and suppress deterioration of the characteristics of the acoustic wave device 100 .
- the first through-hole 112A and the second through-hole 112B are provided at positions that do not overlap when viewed from the third direction D13.
- the piezoelectric layer 110 tends to be flexed uniformly, and deterioration of characteristics can be easily suppressed.
- unwanted waves that are excited by the IDT electrodes and propagate in the third direction D13 in which the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 are arranged collide with the first through holes 112A and the second through holes 112B. It scatters, making it easier to suppress deterioration of characteristics due to unwanted waves.
- the elastic wave device 100 includes wiring electrodes 140 provided on at least one of the first busbar 121 and the second busbar 122 . With such a configuration, the force supporting the piezoelectric layer 110 by the wiring electrode 140 is increased, and the bending of the piezoelectric layer 110 in the vicinity of the first bus bar 121 or the second bus bar 122 can be suppressed. Thereby, deterioration of the characteristics of the acoustic wave device 100 can be further suppressed.
- the support member 101 is provided with a lead-out portion 131 that communicates the hollow portion 130 and the through hole 112 .
- the hollow portion 130 and the through-hole 112 can be communicated with each other by the lead-out portion 131, so that the degree of freedom of the position where the through-hole 112 is provided can be improved.
- the through hole 112 can be provided away from the excitation region C1 (intersection region C1) in plan view in the first direction D11. As a result, the piezoelectric layer 110 can be prevented from bending due to the through holes 112 .
- first through-hole 112A and the second through-hole 112B are provided on both outer sides of the resonator 120 , but the present invention is not limited to this.
- one or more through holes 112 may be provided outside at least one of the resonators 120 .
- the hollow portion 130 is provided at a position overlapping the first busbar 121 and the second busbar 122 in plan view in the first direction D11, but the present invention is not limited to this.
- the hollow portion 130 may be provided at a position that does not overlap the first busbar 121 and the second busbar 122 when viewed in plan in the first direction D11.
- the through-hole 112 can also be used as an etching hole for introducing an etching solution, for example.
- the IDT electrodes may be provided on the piezoelectric layer 110 in the first direction D11.
- the IDT electrode may be provided on the side of the piezoelectric layer 110 on which the cavity 130 is provided.
- ⁇ Modification 1> 16 is a schematic enlarged view of the vicinity of the electrodes of the acoustic wave device of Modification 1.
- FIG. 16 the elastic wave device 100A differs from the elastic wave device 100 of the second embodiment in that the shape of the through hole 112C is different.
- the through-hole 112C has a rectangular shape when viewed in plan in the first direction D11. Further, the through hole 112C is larger than the width of the lead portion 131 when viewed in plan in the first direction D11.
- the bending of the piezoelectric layer 110 can be suppressed, and the deterioration of the characteristics of the elastic wave device 100 can be suppressed.
- the through hole 112C may have, for example, a triangular shape, an arc shape, a polygonal shape, an elliptical shape, or the like when viewed in plan in the first direction D11.
- a part of the through hole 112C may straddle the first virtual line L1 and/or the second virtual line L2.
- FIG. 17 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 2.
- FIG. 17 an elastic wave device 100B is different from the elastic wave device 100 of the second embodiment in that the lead-out portion 131 is not provided.
- the through-hole 112 is provided at a position overlapping the hollow portion 130 in plan view in the first direction D11.
- the through hole 112 is provided between the first bus bar 121 and the second bus bar 122 outside the intersection region C1 when viewed in plan in the first direction D11. That is, the through holes 112 are provided inside the first busbar 121 and inside the second busbar 122 outside the crossing region C1. No through hole 112 is provided in the region between the electrode fingers 123 and 124 .
- the first through hole 112A is provided between the first imaginary line L1 and the second bus bar 122 in a plan view in the first direction D11.
- Second through hole 112 ⁇ /b>B is provided between second imaginary line L ⁇ b>2 and first bus bar 121 .
- the plurality of through holes 112A and 112B are formed in gap regions between the tips 123a of the first electrode fingers 123 and the second bus bar 122, and between the tips 124a of the second electrode fingers 124 and the first bus bar 121, respectively. is provided in the gap region between the tips 123a of the first electrode fingers 123 and the second bus bar 122, and between the tips 124a of the second electrode fingers 124 and the first bus bar 121, respectively. is provided in the gap region between the tips 123a of the first electrode fingers 123 and the second bus bar 122, and between the tips 124a of the second electrode fingers 124 and the first bus bar 121, respectively. is provided in the gap region between
- the through hole 112 can be easily provided in the vicinity of the crossing area C1, so there is no need to provide the lead-out portion 131 leading to the through hole 112, thereby further saving space.
- the piezoelectric layer 110 can be restrained from bending, and the through holes 112 can scatter unnecessary waves generated from the intersection region C1. As a result, deterioration of the characteristics of the acoustic wave device 100B can be suppressed while reducing the manufacturing cost.
- At least one of the through hole 112 is positioned between the first virtual line L1 and the second bus bar 122 or between the second virtual line L2 and the first bus bar 121 in plan view in the first direction D11.
- FIG. 18 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 3.
- FIG. 18 As shown in FIG. 18, in the elastic wave device 100C, the first through-hole 112A and the second through-hole 112B overlap with each other when viewed from the third direction D13. different.
- the first through-hole 112A overlaps the second through-hole 112B when viewed from the third direction D13. That is, the first through hole 112A and the second through hole 112B face each other with the resonator 120 interposed therebetween. Specifically, the first through hole 112A and the second through hole 112B are provided between the first imaginary line L1 and the second bus bar 122 in plan view in the first direction D11.
- first through hole 112A and the second through hole 112B may be provided between the second imaginary line L2 and the first bus bar 121 in plan view in the first direction D11.
- At least a portion of the first through-hole 112A may overlap the second through-hole 112B when viewed from the third direction D13.
- ⁇ Modification 4> 19 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 4.
- FIG. 19 the elastic wave device 100D differs from the elastic wave device 100 of the second embodiment in that the second through holes 112B are provided outside the first busbar 121 in the second direction D12. different.
- the second through-hole 112B is provided outside the first bus bar 121 in the second direction D12 when viewed in plan in the first direction D11.
- the first bus bar 121 is arranged between the second through-hole 112B and the hollow portion 130 in plan view in the first direction D11.
- the lead-out portion 131 communicating between the second through-hole 112B and the hollow portion 130 is provided at a position overlapping the first bus bar 121 when viewed in plan in the first direction D11. extends to the outside of the
- the bending of the piezoelectric layer 110 due to the second through holes 112B can be further suppressed, so that deterioration of the characteristics of the acoustic wave device 100D can be further suppressed.
- first through hole 112A may be provided outside the second bus bar 122 in the second direction D12 when viewed in plan in the first direction D11. That is, the second bus bar 122 may be provided between the first through hole 112A and the hollow portion 130 when viewed in plan in the first direction D11.
- FIG. 20 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 5.
- FIG. 20 in the elastic wave device 100E, the second through-hole 112B is provided at a position overlapping the first bus bar 121 when viewed from the third direction D13. It differs from the wave device 100 .
- the second through-hole 112B is provided at a position overlapping the first busbar 121 when viewed from the third direction D13.
- a lead-out portion 131 connecting the second through-hole 112B and the hollow portion 130 is bent.
- the second through hole 112B can be provided in the vicinity of the first bus bar 121, so that bending of the piezoelectric layer 110 can be further suppressed.
- the second through hole 112B may overlap the first bus bar 121 when viewed from the third direction D13.
- the first through hole 112A may be provided at a position overlapping the second bus bar 122 when viewed from the third direction D13.
- FIG. 21 is a schematic plan view of an elastic wave device according to the third embodiment of the present disclosure.
- FIG. 22 is a schematic enlarged view of the vicinity of the electrodes of the acoustic wave device according to the third embodiment of the present disclosure.
- FIG. 23 is a schematic cross-sectional view of the elastic wave device of FIG. 22 taken along line BB.
- the thickness of first electrode fingers 123 and the thickness of second electrode fingers 124 are 0.5 times or more the thickness of piezoelectric layer 110.
- the plurality of through holes 112 are provided at positions overlapping the crossing region C1 when viewed from the third direction D13.
- the thickness of the plurality of first electrode fingers 123 and the thickness of the plurality of second electrode fingers 124 are 0.5 times or more the thickness of the piezoelectric layer 110 . That is, the film thickness of the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 is at least half the film thickness of the region of the piezoelectric layer 110 that overlaps with the hollow portion 130 in plan view in the first direction D11. .
- the force supporting the piezoelectric layer 110 by the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 in the intersecting region C1 increases, and the elastic wave device 100 of the second embodiment In comparison, bending of the piezoelectric layer 110 in the crossing region C1 can be suppressed. Therefore, even when a plurality of through-holes 112 are provided in the vicinity of the intersection region C1, the bending of the piezoelectric layer 110 due to the through-holes 112 can be suppressed.
- the plurality of through holes 112 are located outside the intersection region C1 and between the first virtual line L1 and the second virtual line L2. is provided.
- the first through holes 112A and the second through holes 112B are provided at overlapping positions when viewed from the third direction D13. That is, the first through hole 112A and the second through hole 112B are provided so as to face each other with the resonator 120, that is, the IDT electrode interposed therebetween when viewed in plan in the first direction D11.
- the through-hole 112 is provided between the first virtual line L1 and the second virtual line L2 in plan view in the first direction D11.
- unnecessary waves generated from the intersection region C1 collide with the plurality of through holes 112 and are easily scattered.
- the intersection area C1 is an area where unwanted waves are likely to occur, the unwanted waves generated from the intersection area C1 propagate more slowly in the area between the first virtual line L1 and the second virtual line L2 than in other areas. Cheap. Therefore, by providing the through hole 112 in the region between the first virtual line L1 and the second virtual line L2, it is possible to further suppress the propagation of unnecessary waves.
- the thickness of the plurality of first electrode fingers 123 and the thickness of the plurality of second electrode fingers 124 are 0.5 times or more the thickness of the piezoelectric layer 110 .
- the thickness of the plurality of first electrode fingers 123 and the thickness of the plurality of second electrode fingers 124 is 0.5 times or more the thickness of the piezoelectric layer 110
- the present invention is limited to this. not.
- the thickness of the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 can support the piezoelectric layer 110 to such an extent that the piezoelectric layer 110 does not bend
- the thickness of the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 The thickness of the two-electrode fingers 124 does not have to be limited to the thickness of the piezoelectric layer 110 .
- ⁇ Modification 6> 24 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 6.
- FIG. 24 the elastic wave device 100G differs from the elastic wave device 100F of the third embodiment in that the shape of the through hole 112D is different.
- the through-hole 112D has a rectangular shape when viewed in plan in the first direction D11. Further, the through hole 112D is larger than the width of the lead portion 131 when viewed in plan in the first direction D11.
- the through hole 112D may have, for example, a triangular shape, an arc shape, a polygonal shape, an elliptical shape, or the like when viewed in plan in the first direction D11.
- FIG. 25 is a schematic enlarged view of the vicinity of the electrodes of another elastic wave device of Modification 6.
- FIG. 25 in the elastic wave device 100H, a part of the through hole 112D may straddle the first imaginary line L1 and the second imaginary line L2 in plan view in the first direction D11. By increasing the opening area of the through hole 112D in this way, it is possible to further suppress the propagation of unnecessary waves.
- FIG. 26 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 7.
- FIG. 26 the elastic wave device 100I is different from the elastic wave device 100F of the third embodiment in that the lead-out portion 131 is not provided.
- the through-hole 112 is provided at a position overlapping the hollow portion 130 in plan view in the first direction D11.
- the through hole 112 is provided between the first bus bar 121 and the second bus bar 122 outside the intersection region C1 when viewed in plan in the first direction D11. That is, the through hole 112 is provided inside the first busbar 121 and inside the second busbar 122 .
- ⁇ Modification 8> 27 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 8.
- FIG. 27 As shown in FIG. 27, in the elastic wave device 100J, the second through-hole 112B is not provided between the first imaginary line L1 and the second imaginary line L2 in plan view in the first direction D11. , and is different from the elastic wave device 100F of the third embodiment.
- first through hole 112A is provided between first imaginary line L1 and second imaginary line L2. It is provided in the gap region between the second virtual line L2 and the first bus bar 121 .
- ⁇ Modification 9> 28 is a schematic enlarged view of the vicinity of the electrodes of the elastic wave device of Modification 9.
- FIG. 28 in the elastic wave device 100K, the first through-hole 112A and the second through-hole 112B are provided at positions that do not overlap when viewed from the third direction D13. It differs from the acoustic wave device 100F in terms of shape.
- the straight line connecting the plurality of through holes 112 sandwiching the IDT electrodes is not orthogonal to the second direction D12 in which the plurality of first electrode fingers 123 and the plurality of second electrode fingers 124 extend. .
- the plurality of through holes 112 are likely to be arranged symmetrically with respect to the line L11 passing through the center of the IDT electrode, the piezoelectric layer 110 is more likely to bend uniformly, and deterioration of characteristics can be suppressed.
- An acoustic wave device of the present disclosure includes a support member including a support substrate having a thickness direction, a piezoelectric layer provided on the support member in the thickness direction, and an IDT electrode provided on the piezoelectric layer in the thickness direction.
- the support member is provided with a cavity at a position overlapping at least a part of the IDT electrode when viewed in plan in the thickness direction, and the piezoelectric layer is provided with a through hole reaching the cavity, and the IDT electrode is a first bus bar; a second bus bar facing the first bus bar; a plurality of first electrode fingers provided on the first bus bar and extending toward the second bus bar; and a plurality of second electrode fingers extending toward each other, wherein the plurality of first electrode fingers and the plurality of second electrode fingers are arranged adjacent to each other to face each other, and the plurality of adjacent first electrode fingers are arranged to face each other.
- the plurality of first electrode fingers and the plurality of second electrode fingers are opposed to each other, the plurality of first electrode fingers and the plurality of second electrode fingers are arranged to overlap each other, and the through holes are arranged in the thickness direction in plan view It is provided at a position other than between a first virtual line passing through the tips of the plurality of first electrode fingers and a second virtual line passing through the tips of the plurality of second electrode fingers.
- the through-hole may include a first through-hole and a second through-hole arranged with the IDT electrode interposed therebetween in plan view in the thickness direction.
- the first through hole and the second through hole may be provided at positions that do not overlap when viewed from the opposing direction.
- the elastic wave device may include wiring electrodes provided on at least one of the first bus bar and the second bus bar.
- the through-hole may be provided outside the IDT electrode when viewed in plan in the thickness direction.
- the support member may be provided with a lead-out portion that communicates the hollow portion and the through hole.
- the through hole is located between the extension line of the first virtual line and the extension line of the second busbar, or between the second virtual line and the first busbar. may be provided in at least one of between and
- the region where the plurality of first electrode fingers and the plurality of second electrode fingers overlap when viewed from the opposing direction is the intersection region, and the through hole is outside the intersection region. and may be provided inside the extension line of the first bus bar and inside the extension line of the second bus bar.
- At least one of the first bus bar and the second bus bar is arranged between the through hole and the hollow portion when viewed in plan in the thickness direction.
- the piezoelectric layer may be made of lithium niobate or lithium tantalate.
- the film thickness of the piezoelectric layer is d, and the distance between the centers of adjacent electrode fingers among the plurality of first electrode fingers and the plurality of second electrode fingers.
- d/p may be 0.5 or less.
- d/p may be 0.24 or less.
- the support member may have an intermediate layer provided on the support substrate, and the cavity may be provided in the intermediate layer.
- the cavity may be provided in the support substrate.
- the elastic wave device may be configured to be able to use a thickness-shear mode bulk wave as the main wave.
- the Euler angles ( ⁇ , ⁇ , ⁇ ) of lithium niobate or lithium tantalate are within the range of the following formula (1), formula (2) or formula (3) There may be. (0° ⁇ 10°, 0° to 20°, arbitrary ⁇ ) Equation (1) (0° ⁇ 10°, 20° to 80°, 0° to 60° (1-( ⁇ -50) 2 /900) 1/2 ) or (0° ⁇ 10°, 20° to 80°, [180 °-60° (1-( ⁇ -50) 2 /900) 1/2 ] ⁇ 180°) Equation (2) (0° ⁇ 10°, [180°-30°(1-( ⁇ -90) 2 /8100) 1/2 ] ⁇ 180°, arbitrary ⁇ ) Equation (3)
- An elastic wave device includes a support member having a support substrate, a piezoelectric layer provided on the support member, and an IDT electrode provided on the piezoelectric layer.
- a cavity opening toward the piezoelectric layer is provided at a position overlapping with a part of the electrode, and the piezoelectric layer is provided with a through hole leading to the cavity.
- a second bus bar facing each other; a plurality of first electrode fingers provided on the first bus bar and extending toward the second bus bar; and a plurality of second electrode fingers provided on the second bus bar and extending toward the first bus bar.
- the through-holes are defined by a first imaginary line passing through the tips of the plurality of first electrode fingers and a second imaginary line passing through the tips of the plurality of second electrode fingers. It is provided between the line and
- the thickness of the plurality of first electrode fingers and the thickness of the plurality of second electrode fingers may be 0.5 times or more the thickness of the piezoelectric layer.
- the through-hole may be provided outside the IDT electrode in plan view.
- the support member may be provided with a lead-out portion that communicates the hollow portion and the through hole.
- the through-hole may include a first through-hole and a second through-hole arranged with the IDT electrode therebetween in plan view.
- the first through holes and the second through holes are positioned so as not to overlap when viewed from a direction perpendicular to the direction in which the plurality of first electrode fingers and the plurality of second electrode fingers extend. may be provided.
- the piezoelectric layer may be lithium niobate or lithium tantalate.
- the film thickness of the piezoelectric layer is d, and the distance between the centers of adjacent electrode fingers among the plurality of first electrode fingers and the plurality of second electrode fingers.
- d/p may be 0.5 or less.
- the support member may have an intermediate layer provided on the support substrate, and the cavity may be provided in the intermediate layer.
- the cavity may be provided in the support substrate.
- the Euler angles ( ⁇ , ⁇ , ⁇ ) of lithium niobate or lithium tantalate are within the range of the following formula (1), formula (2) or formula (3) There may be. (0° ⁇ 10°, 0° to 20°, arbitrary ⁇ ) Equation (1) (0° ⁇ 10°, 20° to 80°, 0° to 60° (1-( ⁇ -50) 2 /900) 1/2 ) or (0° ⁇ 10°, 20° to 80°, [180 °-60° (1-( ⁇ -50) 2 /900) 1/2 ] ⁇ 180°) Equation (2) (0° ⁇ 10°, [180°-30°(1-( ⁇ -90) 2 /8100) 1/2 ] ⁇ 180°, arbitrary ⁇ ) Equation (3)
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Abstract
Un dispositif à ondes élastiques selon la présente divulgation comprend : un élément de support comprenant un substrat de support ayant un sens de l'épaisseur ; une couche piézoélectrique disposée sur l'élément de support ; et une électrode IDT disposée sur la couche piézoélectrique. Dans l'élément de support, une cavité est ménagée à une position qui chevauche au moins une partie de l'électrode IDT dans une vue en plan le long du sens de l'épaisseur. Un trou traversant atteignant la cavité est ménagé dans la couche piézoélectrique. L'électrode IDT comprend : une première barre omnibus ; une seconde barre omnibus opposée à la première barre omnibus ; une pluralité de premiers doigts d'électrode qui sont disposés sur la première barre omnibus et qui s'étendent vers la seconde barre omnibus ; et une pluralité de seconds doigts d'électrode qui sont disposés sur la seconde barre omnibus et qui s'étendent vers la première barre omnibus. La pluralité de premiers doigts d'électrode et la pluralité de seconds doigts d'électrode sont agencés de façon à se chevaucher entre eux lorsqu'ils sont vus dans une direction opposée dans laquelle la pluralité de premiers doigts d'électrode et la pluralité de seconds doigts d'électrode qui sont adjacents les uns aux autres sont opposés les uns aux autres. Dans une vue en plan dans le sens de l'épaisseur, le trou traversant est ménagé à une position excluant une région entre une première ligne imaginaire passant par les extrémités avant de la pluralité de premiers doigts d'électrode et une seconde ligne imaginaire passant par les extrémités avant de la pluralité de seconds doigts d'électrode.
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WO2016098526A1 (fr) * | 2014-12-18 | 2016-06-23 | 株式会社村田製作所 | Dispositif à ondes acoustiques et son procédé de fabrication |
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JP2010147875A (ja) * | 2008-12-19 | 2010-07-01 | Panasonic Electric Works Co Ltd | Baw共振装置およびその製造方法 |
JP2010233210A (ja) * | 2009-03-03 | 2010-10-14 | Nippon Dempa Kogyo Co Ltd | 弾性波デバイス及び電子部品 |
JP2013528996A (ja) * | 2010-04-23 | 2013-07-11 | テクノロジアン テュトキムスケスクス ヴェーテーテー | 広帯域音響結合薄膜bawフィルタ |
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JP2014013991A (ja) * | 2012-07-04 | 2014-01-23 | Taiyo Yuden Co Ltd | ラム波デバイスおよびその製造方法 |
JP2016086308A (ja) * | 2014-10-27 | 2016-05-19 | 株式会社村田製作所 | 圧電共振器、及び圧電共振器の製造方法 |
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