WO2022210927A1

WO2022210927A1 - Soldering device and method for manufacturing soldered product

Info

Publication number: WO2022210927A1
Application number: PCT/JP2022/016161
Authority: WO
Inventors: めぐ丸山; 直人小澤; 純松田
Original assignee: 株式会社オリジン
Priority date: 2021-03-30
Filing date: 2022-03-30
Publication date: 2022-10-06
Also published as: JP7053126B1; JP2022154729A; TW202300263A

Abstract

This soldering device includes: a chamber; a heat source disposed on a bottom surface of the chamber or in the vicinity of the bottom surface; a light-transmissive window provided to a section of a top surface of the chamber; a radiation thermometer which is provided outside the chamber and measures the temperature of an arbitrary position of a workpiece via the window; and a first light-blocking member which closes off a peripheral space between a side surface of the chamber and the workpiece above the heat source in the chamber.

Description

Soldering device and method for manufacturing soldered products

The present disclosure relates to a soldering device and a method of manufacturing a soldered product.

Radiation thermometers are known that measure the temperature of a measurement target by detecting radiation energy from the measurement target with a detection element such as a photodiode. For example, in Japanese Patent Laid-Open No. 11-271147, in addition to the detection element, a radiation type sensor including a calculation means for obtaining a temperature based on an output signal when a current is passed through the detection element from a power supply and performing temperature compensation of the detection element A thermometer is provided.

In a radiation thermometer such as the one described above, noise is caused when radiant energy different from that from the object to be measured enters the detection element.

An object of the present disclosure is to provide a soldering device capable of temperature detection with reduced noise generation and a method for manufacturing a soldered product.

To achieve the above object, a radiation thermometer according to a first aspect of the present disclosure includes a detection element that detects radiant energy from an object to be measured, and is disposed between the object to be measured and the detection element. a focusing lens for focusing the radiant energy from the object to be measured; and a first aperture disposed between the detector element and the focusing lens and provided along the path of the radiant energy from the object to be measured. a second aperture disposed between the focusing lens and the measurement object and having a second aperture along the path of the radiant energy from the measurement object; and a lens barrel accommodating therein at least part of the detection element, the focusing lens, the first diaphragm, and the second diaphragm.

In such a radiation thermometer, the first aperture mainly prevents the radiant energy generated in the lens barrel from entering the detection element, and the second aperture mainly prevents radiation different from the radiant energy from the measurement target. Energy from the outside of the radiation thermometer can be prevented from entering the lens barrel and the focusing lens. As a result, it is possible to obtain a radiation thermometer capable of highly accurate detection that suppresses noise caused by detecting radiant energy different from the radiant energy from the object to be measured.

A radiation thermometer according to a second aspect of the present disclosure is the radiation thermometer according to the first aspect of the present disclosure, wherein the first aperture is provided between the detection element and the focusing lens. Two or more are arranged at intervals.

In such a radiation thermometer, by adopting two or more apertures as the first aperture, it is possible to effectively suppress disturbance light that has entered the lens barrel from entering the detection element. .

A radiation thermometer according to a third aspect of the present disclosure is the radiation thermometer according to the first or second aspect of the present disclosure, wherein the second aperture is between the focusing lens and the object to be measured. , two or more are arranged at predetermined intervals.

In such a radiation thermometer, by adopting two or more apertures as the second aperture, radiant energy different from the radiant energy from the object to be measured enters the lens barrel from the outside of the radiation thermometer. can be effectively suppressed.

A radiation thermometer according to a fourth aspect of the present disclosure is the radiation thermometer according to any one of the first to fourth aspects of the present disclosure, wherein the sensitivity wavelength range of the detection element on the inner surface of the barrel is is in the range of 0.5 to 1.0.

In such a radiation thermometer, since the emissivity of the inner surface of the lens barrel with respect to the sensitivity wavelength range of the detection element is within the range of 0.5 to 1.0, the disturbance light incident on the inner surface of the lens barrel By suppressing the reflection at the temperature, it is possible to suppress the incidence of energy other than the radiant energy from the desired measurement object to the detection element, so that a radiation thermometer that can detect noise with high accuracy can be obtained. be able to.

A radiation thermometer according to a fifth aspect of the present disclosure is the radiation thermometer according to the fourth aspect of the present disclosure, wherein the inner surface of the lens barrel has a high emissivity with respect to the sensitive wavelength range of the detection element. surface treatment is applied.

In such a radiation thermometer, the inner surface of the lens barrel is treated (for example, black plating or black alumite treatment). can be adjusted to the desired value.

A radiation thermometer according to a sixth aspect of the present disclosure includes a detection element that detects radiant energy from a measurement object, and is disposed between the measurement object and the detection element, and the radiation from the measurement object is A focusing lens for focusing energy, the detecting element and at least a part of the focusing lens are accommodated therein, and the emissivity of the inner surface thereof with respect to the sensitive wavelength range of the detecting element is within the range of 0.5 to 1.0. and a lens barrel.

In such a radiation thermometer, since the emissivity of the inner surface of the lens barrel with respect to the sensitivity wavelength range of the detection element is within the range of 0.5 to 1.0, the disturbance light incident on the inner surface of the lens barrel By suppressing the reflection at , it is possible to suppress the incidence of energy other than the radiant energy from the desired measurement target on the detection element. As a result, it is possible to obtain a radiation thermometer that can detect radiation with high accuracy while suppressing noise caused by detecting radiation energy different from the radiation energy from the object to be measured.

A soldering apparatus according to a seventh aspect of the present disclosure includes a chamber, a heat source disposed at or near the bottom surface of the chamber, and a translucent window provided on a portion of the top surface of the chamber. and the radiation thermometer according to any one of the first to sixth aspects, which is disposed outside the chamber and measures the temperature at an arbitrary position of the workpiece through the window, and The top surface has an emissivity within the range of 0.5 to 1.0 with respect to the sensitive wavelength range of the detection element.

In such a soldering apparatus, the radiation energy generated by the heat source is reduced to can be suppressed from being reflected on the top surface of the chamber, and the occurrence of disturbance light in the chamber can be suppressed. As a result, it becomes difficult for radiant energy other than that from the object to be measured to enter the radiation thermometer, and a soldering apparatus capable of highly accurate detection with reduced noise can be obtained.

A soldering apparatus according to an eighth aspect of the present disclosure is the soldering apparatus according to the seventh aspect of the present disclosure, wherein the first heat source is disposed in the space surrounding the workpiece above the heat source in the chamber. and a light shielding member.

In such a soldering apparatus, of the radiant energy from the heat source, the radiant energy that is not irradiated to the work but is irradiated to the top surface side of the chamber through the space surrounding the work can be blocked by the light blocking member. can.

A soldering apparatus according to a ninth aspect of the present disclosure is the soldering apparatus according to the seventh or eighth aspect of the present disclosure, wherein the window includes quartz glass, and the detection element includes an InGaAs photodiode.

In such a soldering device, by adopting an InGaAs photodiode as a detection element, it is possible to measure the temperature of the measurement target based on the radiant energy of the wavelength (0.9 to 2.6 μm) that passes through the quartz glass. can be done. Further, even if the inside of the chamber is in a formic acid atmosphere in order to remove the oxide film of the workpiece, the temperature of the object to be measured can be measured without any separate adjustment.

A soldering apparatus according to a tenth aspect of the present disclosure is the soldering apparatus according to any one of the seventh to ninth aspects of the present disclosure, wherein a housing having an opening in the bottom surface and a a support member arranged on the support member, a heat transfer plate on which the workpiece is arranged on the upper surface side of the support member; and a second light blocking member.

In such a soldering apparatus, since the carrier for transporting the workpiece is provided with a light shielding member, the radiation energy emitted from the heat source is emitted to the top surface side of the chamber through the gap of the carrier. The energy can be blocked by a blocking member.

A temperature measurement method according to an eleventh aspect of the present disclosure includes a step of measuring the temperature of a predetermined measurement target using the radiation thermometer according to any one of the first to sixth aspects.

In such a temperature measurement method, by measuring the temperature of the object to be measured using a radiation thermometer in which noise caused by the detection of radiant energy different from the radiant energy from the object to be measured is suppressed, It is possible to accurately measure the temperature of the object to be measured.

A method for manufacturing a soldered product according to a twelfth aspect of the present disclosure includes the steps of disposing the workpiece in the chamber of the soldering apparatus according to any one of the seventh to tenth aspects;
and soldering the workpiece using the soldering apparatus.

In such a soldered product manufacturing method, it becomes possible to perform soldering while measuring the temperature of the object to be measured with high accuracy, so that temperature control mainly in the soldering process can be performed reliably. , the manufacturing yield of soldered products is improved.

According to the soldering apparatus soldered product manufacturing method of the present disclosure, it is possible to suppress radiant energy different from that from the object to be measured from entering the detection element, and temperature detection can be performed with suppressed noise generation.

1 is a schematic cross-sectional view showing an example of a radiation thermometer according to a first embodiment of the present disclosure; FIG. It is a schematic sectional view showing an example of a radiation thermometer according to a second embodiment of the present disclosure. FIG. 11 is a schematic cross-sectional view showing an example of a radiation thermometer according to a third embodiment of the present disclosure; 1 is a schematic explanatory diagram showing an example of a soldering device according to a first embodiment of the present disclosure; FIG. FIG. 5 is a view taken along the line AA of FIG. 4; 5 is a flow chart showing an example of a method of manufacturing a soldered product using the soldering apparatus shown in FIG. 4; FIG. 5 is a schematic explanatory diagram showing an example of a soldering device according to a second embodiment of the present disclosure; FIG. 5 is an explanatory diagram showing a carrier of a soldering device according to a second embodiment of the present disclosure; FIG. FIG. 5 is an explanatory diagram showing a carrier of a soldering device according to a second embodiment of the present disclosure; FIG. FIG. 5 is an explanatory diagram showing a carrier of a soldering device according to a second embodiment of the present disclosure; FIG.

This application is based on Japanese Patent Application No. 2021-057904 filed on March 30, 2021 in Japan, the content of which forms part of the content of the present application.
Also, the present disclosure will be more fully understood from the detailed description that follows. Further areas of applicability of the present application will become apparent from the detailed description provided hereinafter. However, the detailed description and specific examples are preferred embodiments of the present disclosure and are given for purposes of illustration only. Various alterations and modifications within the spirit and scope of this disclosure will become apparent to those skilled in the art from this detailed description.
Applicant does not intend to offer to the public any of the described embodiments, and any modifications, alternatives disclosed that may not literally fall within the scope of the claims are equally valid. be part of the invention under discussion.

Hereinafter, each embodiment for carrying out the present disclosure will be described with reference to the drawings. In the following, the scope necessary for the description to achieve the purpose of the present disclosure is schematically shown, and the scope necessary for the description of the relevant part of the disclosure is mainly described. It shall be based on a well-known technique.

<Radiation thermometer>
FIG. 1 is a schematic cross-sectional view showing an example of a radiation thermometer according to a first embodiment of the disclosure. The radiation thermometer 1 according to the present embodiment measures the temperature of the measurement area TA based on the radiant energy RE radiated from a specific measurement area TA set on an arbitrary measurement object, for example, an arbitrary work W. It is what you measure. Therefore, the radiation thermometer 1 of the present embodiment may normally be arranged so as to face the measurement area TA with a predetermined gap therebetween. In order to measure the temperature of the measurement area TA, the radiation thermometer 1 of this embodiment includes at least a detection element 2, a condenser lens 3, and a first diaphragm 4A, as shown in FIG. , 4B, a second diaphragm 5, and a lens barrel 6. Note that the condenser lens 3 is an example of a condenser lens.

The detection element 2 may detect radiant energy RE emitted from the measurement area TA, more specifically, infrared radiant energy. As the detection element, a semiconductor element, more specifically, a photodiode using a Si (silicon), Ge (germanium) or InGaAs (indium-gallium-arsenic) element can be employed. A PN junction type or a PIN structure can be adopted for this photodiode. The detection element 2 is arranged in the lens barrel 6 so that its light receiving surface is positioned inside the lens barrel 6 and its electrode extends outside the lens barrel 6 and is connected to a control board on which an amplifier (not shown) is mounted. It can be attached to one end face.

The condenser lens 3 may be for converging (collecting) the radiant energy (specifically, infrared light) RE from the measurement area TA and making it incident on the light receiving surface of the detection element 2 . The condensing lens 3 is arranged between the measurement area TA and the detection element 2. Specifically, it is arranged inside the lens barrel 6 and at a position separated from the detection element 2 by a predetermined distance. can be set.

The

first diaphragms

4A and 4B may be provided to pass the radiant energy RE from the measurement area TA condensed by the condensing lens 3 and block other radiant energy. The

first diaphragms

4A, 4B are provided with

openings

7A, 7B at substantially the center thereof for passing the radiant energy RE from the measurement area TA, and have a relatively high emissivity (specifically, the detection element 2 (emissivity within the range of 0.5 to 1.0 for the sensitive wavelength range). As shown in FIG. 1, for example, two

first diaphragms

4A and 4B can be provided. may be attached to the Here, it is preferable that the sizes of the

first apertures

7A and 7B provided in the two

first diaphragms

4A and 4B are different in consideration of the path through which the radiant energy RE from the measurement area TA passes. . Specifically, the first aperture 7A of the first aperture 4A arranged on the side closer to the condenser lens 3 is the first aperture 7A of the first aperture 4B arranged on the side closer to the detection element 2. is preferably slightly larger than the opening 7B. Further, in the present embodiment, the case where two first diaphragms are arranged has been exemplified, but the present disclosure is not limited to this, and the number may be one or three or more. However, it is preferable to employ a plurality of first diaphragms, because it is possible to effectively prevent disturbance light that has passed through the condenser lens 3 from entering the detection element 2 .

The second aperture 5 may be provided to prevent radiant energy from entering the radiation thermometer 1 from areas other than the measurement area TA. The second diaphragm 5 has an opening 8 at its substantially central portion for passing the radiant energy RE from the measurement area TA, and has a relatively high emissivity (specifically, the sensitivity wavelength range of the detection element 2). It can be a plate-like or film-like member having an emissivity within the range of 0.5 to 1.0. As shown in FIG. 1, the second diaphragm 5 can be provided so as to partially cover the end of the lens barrel 6 on the side where the detection element 2 is not attached. Here, it is preferable that the size of the aperture 8 provided in the second diaphragm 5 is set in consideration of the path through which the radiant energy RE from the measurement area TA passes. Further, in the present embodiment, an example in which one second diaphragm 5 is provided is illustrated, but the present disclosure is not limited to this. One or more second diaphragms may also be arranged in the region in between. By providing a plurality of second diaphragms in this manner, it is possible to effectively prevent radiant energy from entering the condenser lens 3 from areas other than the measurement area TA.

The lens barrel 6 is a substantially cylindrical member with one end closed, and the detection element 2 is mounted substantially in the center of the end face on the closed side, and the other end is open. can be In this lens barrel 6, the detection element 2, two

first diaphragms

4B and 4A, a condenser lens 3, and a second diaphragm 5 are arranged in this order from one end at predetermined intervals (at least partially ) should be contained.

In the radiation thermometer 1 according to the present embodiment having the configuration described above, radiant energy from areas other than the measurement area TA is The detection element 2 is blocked from advancing in the direction of the light receiving surface. With this configuration, substantially only the radiant energy RE from the measurement area TA is incident on the detection element 2, thereby providing a radiation thermometer 1 capable of highly accurate temperature measurement without noise. will be able to

As described above, the radiation thermometer 1 according to the first embodiment suppresses noise generation mainly by means of a plurality of diaphragms. can be suppressed. Therefore, in the following, a radiation thermometer 1A that further suppresses the generation of noise by applying a predetermined process to the lens barrel in addition to adopting the diaphragm structure explained in the first embodiment will be explained. .

FIG. 2 is a schematic cross-sectional view showing an example of a radiation thermometer according to the second embodiment of the present disclosure. A radiation thermometer 1A according to the second embodiment, as shown in FIG. 2, employs the same configuration as the radiation thermometer 1 according to the above-described first embodiment except for the lens barrel 6A. There is. Therefore, the following description will focus on the components that are different from the radiation thermometer 1 according to the first embodiment, and the components that are the same as those of the radiation thermometer 1 are denoted by the same reference numerals. The explanation shall be omitted.

As shown in FIG. 2, the lens barrel 6A is a substantially cylindrical member with one end closed. The ends can be open. It is preferable that the entire inner surface 9A of the lens barrel 6A is subjected to surface treatment with a high emissivity for the sensitive wavelength range of the detection element 2. FIG. Here, examples of the surface treatment for high reflectance with respect to the sensitivity wavelength range of the detection element 2 include black alumite treatment and electroless black plating treatment, but are not limited to these. For example, the inner surface 9A of the lens barrel 6A may be simply coated with a black material having a high emissivity. By applying such a surface treatment, the inner surface 9A of the lens barrel 6A has a high emissivity, specifically, an emissivity with respect to the sensitive wavelength range of the detection element 2, within the range of 0.5 to 1.0. , and more preferably within the range of 0.7 to 1.0.

As described above, by increasing the emissivity of the inner surface 9A of the lens barrel 6A, it is possible to suppress the reflection of the radiant energy irradiated to the inner surface 9A of the lens barrel 6A. Therefore, in the radiation thermometer 1A according to the present embodiment, for example, the radiant energy from the area other than the measurement area TA unexpectedly incident from the opening 8 of the second diaphragm 5 is reflected on the inner surface 9A of the lens barrel 6A. incident on the condenser lens 3, and disturbance light generated in the lens barrel 6A reflected on the inner surface 9A of the lens barrel 6A and incident on the light receiving surface of the detection element 2 can be suppressed. can. This makes it possible to provide the radiation thermometer 1A capable of highly accurate temperature measurement without noise.

FIG. 3 is a schematic cross-sectional view showing an example of a radiation thermometer according to the third embodiment of the present disclosure. As shown in FIG. 3, the lens barrel 6B of the radiation thermometer 1B according to the third embodiment has an inner surface similar to the lens barrel 6A of the radiation thermometer 1A according to the second embodiment. A high-emissivity surface treatment for the sensitive wavelength region of the detection element 2 is applied over the entire surface of 9B. On the other hand, this radiation thermometer 1B does not have the diaphragm that the

radiation thermometers

1 and 1A according to the first and second embodiments have. If the inner surface 9B of the lens barrel 6B is subjected to high-emissivity surface treatment as in the radiation thermometer 1B according to the present embodiment, the radiant energy RE from the measurement area TA passes through the condenser lens 3 to the detector element. 2, and radiant energy from other than the measurement area TA is absorbed when irradiated to the lens barrel 6B, so incidence on the light receiving surface of the detecting element 2 can be suppressed. In the radiation thermometer 1B according to the present embodiment, as in the second embodiment, the same components as those of the

radiation thermometers

1 and 1A described above are denoted by the same reference numerals. Description is omitted.

In the second and third embodiments described above, as a specific method for making the emissivity of the

inner surfaces

9A and 9B of the lens barrels 6A and 6B within the range of 0.5 to 1.0, the surface treatment , but the present disclosure is not limited to this. For example, the emissivity of the lens barrels 6A and 6B themselves may be set to a desired value by including a highly radioactive material such as a carbon-based material containing graphite in the material of the lens barrels 6A and 6B. Further, it is sufficient that the surface treatment described above is applied at least to the

inner surfaces

9A and 9B of the lens barrels 6A and 6B. Therefore, for example, from the viewpoint of work efficiency of surface treatment, the entire lens barrels 6A and 6B may be subjected to surface treatment, and in the radiation thermometer 1A according to the second embodiment, , the inner surface 9A of the lens barrel 6A and the first and

second diaphragms

4A, 4B, 5 may be subjected to the same surface treatment.

According to the

radiation thermometers

1, 1A, and 1B having the configurations described above, due to the plurality of apertures and/or the surface treatment in the lens barrel, the radiant energy RE from the measurement area TA passes through a path different from the path of the lens barrel. can be suppressed from reaching the light-receiving surface of the detection element 2 . Therefore, the incidence of radiant energy from areas other than the measurement area TA on the light receiving surface of the detection element 2 is suppressed, so that the generation of noise caused by this is suppressed, and the radiation thermometer is capable of highly accurate temperature detection. 1, 1A, 1B can be obtained.

By using the

radiation thermometers

1, 1A, and 1B described above, it is possible to provide a method for measuring the temperature of a predetermined measurement target. As the measurement method, the ends of the lens barrels 6, 6A, and 6B of the

radiation thermometers

1, 1A, and 1B on the open side face a specific measurement object, and are arranged at a position facing the measurement object. After that, the detection result is acquired by the detection element 2, and the temperature of the object to be measured can be measured.

<Soldering device>
Next, a soldering device included in the present disclosure will be described. FIG. 4 is a schematic explanatory diagram showing an example of the soldering device according to the first embodiment of the present disclosure. 5 is a view taken along the line AA of FIG. 4. FIG. As shown in FIGS. 4 and 5, the soldering apparatus 10 according to the first embodiment can employ one that functions as a batch processing type reflow furnace. In this soldering apparatus 10, at least the raw material solder that is preliminarily provided in order to form hemispherical solder bumps on the semiconductor substrate as the work W is melted, or the solder is melted on the semiconductor substrate as the work W. It is possible to generate bumps or mount electronic components arranged via cream solder or preform solder. In this embodiment, the soldering apparatus 10 that performs a series of reflow soldering within a single apparatus is exemplified. As the work W, a semiconductor substrate on which electronic components are mounted is exemplified.

As shown in FIG. 4, the soldering apparatus 10 according to the present embodiment includes at least a chamber 11, a translucent window 13 provided on a top plate (an example of a top surface) 12 of the chamber 11, and a heat source. An infrared (IR) lamp 14 and a radiation thermometer 1 are included as an example.

The chamber 11 may be composed of a box-shaped housing capable of accommodating the work W to be soldered inside, and an infrared lamp 14 as a heat source is arranged at or near the bottom of the housing, and above it is a heat source. A top plate 12 that can be opened and closed so that the work W can be taken in and out can be provided. In order to perform reflow soldering, the chamber 11 may be provided therein with a reducing gas supply section 17 for supplying a reducing gas for removing an oxide film formed on the surface of the solder. As the reducing gas, hydrogen gas, carboxylic acid (formic acid) gas, or the like can be used. In the present embodiment, formic acid gas is used as an example. In addition, an exhaust path (not shown) for exhausting the gas in the chamber 11 and a gas supply path for supplying other gases such as inert gas into the chamber 11 are provided at suitable locations of the chamber 11. It's okay to be In addition, a structure is adopted in which a vacuum pump is attached to the discharge path for discharging the gas in the chamber 11, and by operating this vacuum pump, the inside of the chamber 11 can be evacuated at a predetermined timing during reflow soldering. This is preferable from the viewpoint of suppressing voids (air gaps) in the solder.

The top plate 12 of the chamber 11 may be fixed to the upper part of the chamber 11 via a hinge on one side thereof, and may be composed of a plate-like member provided with a translucent window 13 in its central portion. It is preferable to provide the top plate 12 and/or the chamber 11 with a lock for fixing the top plate 12 or a seal for keeping the top plate 12 airtight so that the inside of the chamber 11 is airtight when the top plate 12 is closed. Here, it should be particularly noted that the top plate 12 has an emissivity within the range of 0.5 to 1.0 with respect to the sensitive wavelength range of the detection element 2 of the radiation thermometer 1. matter. Since the top plate 12 has a high emissivity in this manner, the reflection of the radiant energy irradiated to the top plate 12 is suppressed, and the generation of ambient light in the chamber 11 can be suppressed. In order to obtain the desired emissivity described above, the top plate 12 is preferably made of a high emissivity material such as a carbon plate.

The window 13 is provided at an arbitrary position on the top plate 12, specifically at a substantially central position facing the area in the chamber 11 where the work W is arranged. It may be inlaid with a member transparent to the radiant energy, for example quartz glass. The size and position of this window 13 can be adjusted as appropriate, but in this embodiment, the window 13 is formed in the central portion of the top plate 12 in a size that matches the size of the work W. is doing. Also, the member fitted in the window may be made of other than quartz glass.

The infrared lamp 14 functions as a heat source for heating the work W, and may heat the work W arranged in the chamber 11 from its lower surface side. The infrared lamp 14 according to the present embodiment is directed to the bottom surface of the chamber 11 or a position near the bottom surface, more specifically, the bottom surface of the workpiece W arranged on a plurality of support pins 15 erected from the bottom of the chamber 11. A plurality of (five in FIGS. 4 and 5) may be arranged parallel to each other at positions facing each other at predetermined intervals. Here, the vicinity of the bottom surface of the chamber 11 refers to a region closer to the bottom surface than the central portion of the chamber 11 in the height direction. In this embodiment, a plurality of infrared lamps 14 are used as the heat source, but the heat source is not limited to this as long as it can heat the workpiece W, and a heat source such as a hot plate can also be used. In addition, comb-like cooling means may be provided in the gaps between the plurality of infrared lamps 14 to cool the work W by selectively contacting it.

A plurality of support pins 15 (four in FIGS. 4 and 5) that support the workpiece W can be configured by pins of the same length extending substantially vertically from the bottom of the chamber 11 . The support pins 15 can be made of a material with low thermal conductivity, such as a ceramic material, in order to make the work W thermally independent. Further, it is preferable that the tip portion of the support pin 15 has a tapered shape in order to reduce the contact area with the work W. As shown in FIG.

The radiation thermometer 1 used in the soldering apparatus 10 according to this embodiment is arranged outside the chamber 11 and measures the temperature at any position on the work W through the window 13 . As the radiation thermometer 1, for example, the radiation thermometer 1 according to the first embodiment described above can be adopted. The radiation thermometer 1 can be arranged with the open end of the lens barrel 6 facing an arbitrary position of the object to be measured, for example, the work W, with the window 13 interposed therebetween. In addition, one or more radiation thermometers 1 may be employed in the soldering apparatus 10 according to the present embodiment. It may be movably provided (towards the position indicated by the dotted line). In the soldering apparatus 10 according to the present embodiment, the radiation thermometer 1 according to the first embodiment described above is used as the radiation thermometer, but other radiation thermometers such as

Radiation thermometers

1A and 1B according to the second or third embodiment can also be employed.

It should be noted that the radiation thermometer 1 used in the soldering apparatus 10 according to the present embodiment uses an InGaAs photodiode as the detection element 2 . This is because the soldering apparatus 10 according to the present embodiment uses formic acid as a reducing gas and quartz glass as a member fitted in the window. Specifically, formic acid has the property of absorbing radiant energy in a specific wavelength range, so temperature measurement based on the radiant energy of the wavelengths absorbed by formic acid will result in a lower detection result than the actual temperature. . Further, since silica glass transmits wavelengths of 0.9 to 2.6 μm, the thermometer must be able to measure temperature based on radiant energy within this range. In this regard, since the InGaAs photodiode has a light receiving wavelength range of 0.5 to 2.6 μm (PIN type), if an InGaAs photodiode is used as the detection element 2, the temperature can be measured based on the radiant energy transmitted through the quartz glass. It is possible, and there is substantially no need to consider absorption of radiant energy by formic acid, and good temperature measurement can be achieved. In addition, in the soldering apparatus 10 according to the present embodiment, an example in which an InGaAs photodiode is adopted as the detection element 2 is shown, but the detection element 2 is fitted into the gas used in the chamber 11 and the window 13. It can be changed according to the material of the member.

Moreover, the soldering apparatus 10 according to the present embodiment includes a first light shielding member disposed so as to block the surrounding space between the workpiece W above the infrared lamp 14 in the chamber 11 and the side surface of the chamber 11. including. As the first light shielding member, for example, a first light shielding member provided above the arrangement position of the infrared lamp 14 and below the work W supported on the support pins 15 shields the periphery of the work W. inner cover 16 can be adopted. In the first inner cover 16, the infrared light as radiant energy emitted from the infrared lamp 14 is directed to the top plate 12 side of the chamber 11 through the surrounding area (surrounding space) SA of the work W in the chamber 11. It may be a member for blocking irradiation. Therefore, this first inner cover 16 is a frame that at least partially, preferably completely covers the surrounding area of the workpiece W, i.e. the space between the workpiece and the side of the chamber, as shown in FIG. The inner end may extend to a position where it overlaps the outer edge of the workpiece W on the support pin 15 in a plan view. Moreover, the height position of the first inner cover 16 is a position close to the lower surface of the work W on the support pins 15 in order to minimize the radiant energy passing through the gap between the first inner cover 16 and the work W. may be set to The first inner cover 16 preferably has a high emissivity, for example, an emissivity comparable to that of the top plate 12 of the chamber 11, and can be made of, for example, a carbon plate. The specific shape and arrangement of the first inner cover 16 can be appropriately adjusted within a range in which the functions can be maintained.

According to the soldering apparatus 10 having the above-described configuration, since the emissivity of the detection element 2 of the top plate 12 with respect to the sensitive wavelength range is high, the radiant energy from the infrared lamp 14 reaching the top plate 12 or the inside of the workpiece W Radiant energy from outside the measurement area TA is suppressed from being reflected by the top plate 12 and becoming disturbance light. In addition, the first inner cover 16 prevents the radiant energy emitted from the infrared lamp 14 to the lower surface of the work W from reaching the top plate 12 through the surrounding area SA of the work W. With these configurations, it is possible to suppress radiant energy from other than the measurement area TA from entering the radiation thermometer 1 as disturbance light. On the other hand, since the radiation thermometer 1 is positioned so as to face the measurement area TA through the window 13, the radiant energy RE from the measurement area TA is surely incident on the radiation thermometer 1, resulting in high accuracy. temperature detection results can be obtained, and reflow soldering can be performed based on the temperature detection results.

FIG. 6 is a flow chart showing an example of a soldered product manufacturing method using the soldering apparatus shown in FIG. An example of a method of manufacturing a soldered product using the soldering apparatus described above will be described below mainly with reference to FIG.

First, the top plate 12 of the soldering device 10 is opened, and the workpiece W to be reflow soldered is arranged (placed) on the support pins 15 (step S1). Next, after the top plate 12 is closed to make the inside of the chamber 11 airtight, the infrared lamps 14 are operated to start heating the work W. As shown in FIG. At this time, the temperature detection operation by the radiation thermometer 1 is also started, and the radiation thermometer 1 performs continuous temperature detection. When the workpiece W is heated by the infrared lamp 14 and the radiation thermometer 1 detects that the reduction temperature (for example, 180 to 260° C.) has been reached (step S2), the reduction gas supply unit 17 is operated to open the chamber 11. Then, the supply of formic acid gas is started (step S3) to reduce and remove the oxide film formed on the surface of the solder bump or cream solder. Next, when the radiation thermometer 1 detects that the solder melting temperature (for example, 220 to 350° C.) has been reached (step S4), this temperature state is maintained for a predetermined time, and then an inert gas or the like is introduced into the chamber 11. is supplied to cool the workpiece W (step S5). When this cooling operation is completed, the work W that has undergone reflow soldering is taken out of the chamber 11 (step S6) and shipped as a soldered product or transferred to the next process.

According to the method for manufacturing a soldered product described above, the reduction temperature and the solder melting temperature can be detected with high accuracy by using the soldering apparatus 10 described above. It is possible to prevent the oxide film removal failure and the solder melting failure due to the deviation from the front and back, and improve the manufacturing yield of the soldered products.

In the soldering apparatus 10 according to the first embodiment, the apparatus functioning as a batch processing type reflow furnace in which the workpieces W are taken in and out one at a time or a predetermined number at a time has been described. , the disclosure is not limited thereto. Below, as a soldering apparatus 20 according to the second embodiment, an in-line A description will be given of what functions as a type reflow furnace.

FIG. 7 is a schematic explanatory diagram showing an example of a soldering device according to the second embodiment of the present disclosure. As shown in FIG. 7, the soldering apparatus 20 according to the present embodiment has the structure of the chamber 21 and the carrier 25 for transporting the work W, and is the same as the soldering apparatus according to the first embodiment. A configuration similar to that of the soldering device 10 may be provided. Therefore, the following description will focus on the configuration different from that of the soldering apparatus 10 according to the first embodiment, and the same components as those of the soldering apparatus 10 according to the first embodiment are denoted by the same reference numerals. and the description thereof will be omitted.

The soldering apparatus 20 according to the present embodiment can be used as part of a manufacturing system configured by connecting a plurality of chambers for performing different processes on a line. Therefore, the chamber 21 of the soldering apparatus 20 according to the present embodiment has an entrance side gate 23A for loading the work W conveyed on the line on the side thereof, and an entrance side gate 23A for loading the work W after reflow soldering. An exit side gate 23B is provided for transporting out of the chamber 21 for the execution of the next process. The

gates

23A and 23B on the entrance side and the exit side can be opened and closed by sliding in the vertical direction. Further, the top plate 22 of the chamber 21 is fixed so as not to be opened and closed, and a reducing gas supply unit 24 is connected. As with the top plate 12 of the soldering apparatus 10 according to the first embodiment, the top plate 22 has an emissivity of 0.5 to 1.0 with respect to the sensitive wavelength range of the detection element 2 of the radiation thermometer 1. Those within the range of are adopted.

In the chamber 21 of the soldering apparatus 20 according to the present embodiment, an infrared lamp 14, support pins 15, and a first inner cover 16 are provided in the same manner as the soldering apparatus 10 according to the first embodiment. are arranged. However, the infrared lamp 14 does not directly heat the workpiece W, but heats a heating plate 28 (see FIG. 8) of the carrier 25, which will be described later. Further, the support pins 15 also support a carrier 25 that supports the workpiece W therein. Further, the first inner cover 16 is formed along the surrounding area SA of the carrier 25 and blocks the radiant energy from the infrared lamp 14 that is irradiated to the top plate 22 side through the surrounding area SA of the carrier 25. there is

8A to 8C are explanatory diagrams showing the carrier of the soldering device according to the second embodiment of the present disclosure, FIG. 8A being a plan view, FIG. FIG. 8C is a view in the direction of arrow C of FIG. 8B. In the soldering apparatus 20 according to the present embodiment, a carrier 25 is used to support the work W so that the work W can be smoothly conveyed on the line regardless of its shape. As shown in FIGS. 8A to 8C, the carrier 25 includes a housing 26, heat insulating pins 27 as an example of a support member, a heating plate 28 as an example of a heat transfer plate, and an example of a second light shielding member. It includes at least the second inner cover 29 as.

The housing 26 can include a rectangular bottom surface 261 and side walls 262 with a predetermined height that stand up from the outer edge of the bottom surface 261 . A rectangular bottom opening 263 as an example of an opening may be provided in the center of the bottom surface 261 . The upper part of the housing 26 has an upper opening 264 that is open so that the work W can be taken in and out. Note that the specific shape of the housing 26 is not limited to this, and in particular, the structure other than the bottom surface 261 and the bottom opening 263 is not limited at all.

The heat insulating pins 27 can be pin-shaped members that are arranged at the four corners of the bottom surface 261 at peripheral positions close to the bottom opening 263 and support the heating plate 28 . Similar to the support pins 15, the heat insulating pins 27 are also made of a material with low thermal conductivity, such as a ceramic material, so as to thermally isolate the object to be supported (heating plate 28). In this embodiment, the case where a total of four heat insulating pins 27 are arranged, one at each of the four corners of the bottom surface 261, is illustrated, but the number and arrangement thereof can be changed as appropriate.

The heating plate 28 can be composed of a flat plate with high thermal conductivity placed on the heat insulating pins 27 . A workpiece W having an arbitrary shape is placed on the heating plate 28, and the workpiece W is heated by the heat of the heating plate 28 heated by the infrared lamp 14 during reflow soldering. The heating plate 28 is preferably made of a material with high thermal conductivity and relatively high heat dissipation, such as graphite. By employing this heating plate 28, the shape of the workpiece W to be heated is no longer restricted by the support structure (support pins 15 in this embodiment) in the chamber 21. FIG. Therefore, if the workpiece W has a shape that can be carried into the chamber 21 and placed on the heating plate 28, the soldering apparatus 20 can be used for reflow soldering. For example, as shown in FIGS. 7 and 8, reflow soldering of relatively small workpieces W is also possible.

As described above, the carrier 25 according to the present embodiment employs a structure in which the heating plate 28 is placed on the heat insulation pins 27 erected on the bottom surface of the housing 26 . In this case, part of the radiant energy from the infrared lamp 14 irradiated to the lower surface of the heating plate 28 through the bottom opening 263 passes through the gap G (see FIG. 8C) between the bottom surface 261 and the heating plate 28. There is a risk of leakage to the top plate 22 side of the chamber 21 . Therefore, in the carrier 25 according to the present embodiment, the second inner cover 29 is used in order to shield the leaked light from the gap G. As shown in FIG. The second inner cover 29 may consist of an annular member fixed to the bottom surface 261 and extending along the outer edge of the heating plate 28, as shown in FIGS. 8A to 8C. Like the first inner cover 16 and the top plate 22, the second inner cover 29 has a high emissivity, that is, an emissivity within the range of 0.5 to 1.0 with respect to the sensitive wavelength range of the detection element 2. It preferably has emissivity and can be formed of, for example, a carbon plate.

By providing the second inner cover 29, the gap G between the bottom surface 261 and the heating plate 28 is also shielded from light. As a result, even with the soldering apparatus 20 using the carrier 25, it is possible to effectively suppress the radiant energy from the infrared lamp 14 from irradiating the top plate 22 side. Although the second inner cover 29 shown in FIG. 8 is arranged to surround the outside of the heating plate 28, the second inner cover 29 of the present disclosure is limited to such a structure. not. For example, at least a portion of the inner side of the second inner cover 29 may extend to a position where it overlaps the outer edge of the heating plate 28 in plan view. In addition, the height of the second inner cover 29 shown in FIG. 8 is set higher than the lower surface of the heating plate 28 placed on the heat insulating pins 27. can be as low as

As described above, according to the

soldering apparatuses

10 and 20 according to the first and second embodiments, the radiation thermometer 1 (1A, In 1B), incident radiant energy other than radiant energy from the measurement area TA is effectively suppressed. Therefore, the accuracy of temperature measurement by the radiation thermometer 1 is improved, and the soldering process can be performed smoothly.

In the

soldering apparatuses

10 and 20 described above, an example in which the measurement area TA is part of the workpiece W and the measured temperature is used for control in reflow soldering has been described for ease of understanding. The present disclosure is not limited to these. For example, the measurement area TA may be something other than the work W, such as the heating plate 28 or any jig attached to the work W. FIG. It may also be used for adjusting the output of the infrared lamp 14 during maintenance work on the

soldering devices

10 and 20 . In the radiation thermometer, soldering apparatus, temperature measurement method, and soldered product manufacturing method of the present disclosure, noise during temperature detection is suppressed. measurements can be made.

The present disclosure is not limited to the above-described embodiments, and various changes can be made without departing from the gist of the present disclosure. All of them are included in the technical idea of the present disclosure.

All documents, including publications, patent applications, and patents, cited in this specification are individually identified and incorporated by reference, and the entire contents of each are set forth herein. To the same extent, incorporated herein by reference.

The use of nouns and similar denoting terms used in connection with the description of the present disclosure (especially in connection with the claims below) unless otherwise indicated herein or clearly contradicted by context. , to cover both the singular and the plural. The phrases “comprising,” “having,” “including,” and “including” are to be construed as open-ended terms (ie meaning “including but not limited to”) unless stated otherwise. Recitation of numerical ranges herein, unless otherwise indicated herein, is intended merely to serve as a shorthand method for referring individually to each value falling within the range. , and each value is incorporated into the specification as if it were individually recited herein. All methods described herein can be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by context. Any examples or exemplary language (e.g., "such as") used herein are intended merely to better illustrate the present disclosure and constitute limitations on the scope of the present disclosure, unless otherwise claimed. is not. No language in the specification should be construed as indicating any non-claimed element as essential to the practice of the disclosure.

This specification describes preferred embodiments of the present disclosure, including the best mode known to the inventors for carrying out the present disclosure. Variations of those preferred embodiments will become apparent to those of ordinary skill in the art upon reading the above description. The inventors expect skilled artisans to apply such variations as appropriate, and anticipate that the disclosure will be practiced otherwise than as specifically described herein. . Accordingly, this disclosure includes all modifications and equivalents of the subject matter recited in the claims appended hereto as permitted by applicable law. Moreover, any combination of the above-described elements in all variations thereof is encompassed by the disclosure unless otherwise indicated herein or otherwise clearly contradicted by context.

Claims

a chamber;
a heat source disposed at or near the bottom surface of the chamber;
a translucent window provided on a part of the top surface of the chamber;
a radiation thermometer disposed outside the chamber and measuring a temperature at an arbitrary position of the workpiece through the window;
a first light shielding member arranged to block a surrounding space between the workpiece above the heat source in the chamber and the side surface of the chamber;
soldering equipment.
The top surface of the chamber has an emissivity in the range of 0.5 to 1.0 with respect to the sensitive wavelength range of the detection element of the radiation thermometer,
A soldering device according to claim 1.
the window comprises quartz glass, and the sensing element of the radiation thermometer comprises an InGaAs photodiode;
3. A soldering device according to claim 1 or 2.
a housing having an opening in the bottom;
a support member provided around the opening;
a heat transfer plate disposed on the support member and having the work disposed on the upper surface thereof;
a second light shielding member disposed inside the housing along a gap between the bottom surface and the heat transfer plate;
4. The soldering device according to any one of claims 1 to 3.
The radiation thermometer is
a detection element that detects radiant energy from a measurement target;
a focusing lens disposed between the measurement object and the detector element for focusing the radiant energy from the measurement object;
a first aperture disposed between the detector element and the focusing lens and having a first aperture along the path of the radiant energy from the measurement object;
a second aperture disposed between the focusing lens and the measurement object and having a second aperture along the path of the radiant energy from the measurement object;
a lens barrel housing therein at least a part of the detection element, the focusing lens, the first diaphragm, and the second diaphragm;
5. The soldering device according to any one of claims 1 to 4.
disposing the workpiece in the chamber of the soldering apparatus according to any one of claims 1 to 5;
and soldering the workpiece using the soldering device.
A method of manufacturing a soldered product.