WO2022202988A1 - Film avec charge disposée - Google Patents

Film avec charge disposée Download PDF

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Publication number
WO2022202988A1
WO2022202988A1 PCT/JP2022/013940 JP2022013940W WO2022202988A1 WO 2022202988 A1 WO2022202988 A1 WO 2022202988A1 JP 2022013940 W JP2022013940 W JP 2022013940W WO 2022202988 A1 WO2022202988 A1 WO 2022202988A1
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WO
WIPO (PCT)
Prior art keywords
filler
group
article
film
fillers
Prior art date
Application number
PCT/JP2022/013940
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English (en)
Japanese (ja)
Inventor
大樹 野田
怜司 塚尾
Original Assignee
デクセリアルズ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2022047653A external-priority patent/JP2022151821A/ja
Application filed by デクセリアルズ株式会社 filed Critical デクセリアルズ株式会社
Priority to KR1020237021382A priority Critical patent/KR20230109182A/ko
Priority to CN202280022620.8A priority patent/CN117063351A/zh
Publication of WO2022202988A1 publication Critical patent/WO2022202988A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Definitions

  • the present invention provides a filler arrangement film in which fillers are arranged in a resin layer, a method for connecting a first fine article to a second article such as a substrate using the filler arrangement film, and a connected structure obtained by the method.
  • minute light-emitting elements such as mini-LEDs and ⁇ LEDs can be cited as the minute first articles.
  • a ⁇ LED display in which ⁇ LEDs, which are minute light-emitting elements, are arranged on a substrate, can be made thinner by omitting the backlight required for a liquid crystal display. , is expected as a display or light source that can realize power saving.
  • Patent Document 1 discloses that red, blue, and green ⁇ LED arrays formed on a carrier substrate are picked up by a transfer head, placed on a transfer destination substrate such as a display substrate, and soldered. It describes joining a ⁇ LED array and a destination substrate by welding, and then forming a contact line thereon with ITO or the like.
  • Patent Document 2 ⁇ LEDs formed on a wafer are arranged on a substrate, and an anisotropic conductive film in which conductive particles are dispersed in an adhesive component using a hydrogenated epoxy compound or the like is used to form the substrate. and a method for lifting off the wafer is described. According to the method using the anisotropic conductive film described in Patent Document 2, a display using ⁇ LEDs can be easily obtained.
  • Patent Document 3 when connecting an IC chip and an FPC using an anisotropic conductive film having a conductive particle arrangement layer in which the area occupancy of conductive particles in a plan view is 35% or less, the capture efficiency of conductive particles is increased.
  • a pulse heater type bonder is used, and in the first step, the IC chip and FPC are pressed into the insulating resin layer of the anisotropic conductive film to temporarily fix the electrodes close to the conductive particle arrangement layer.
  • a two-stage connection method is described in which main crimping is performed on the eye.
  • the size of the ⁇ LED becomes smaller for high-definition displays, and the size of the LED electrode also becomes smaller accordingly, when using an anisotropic conductive film in which conductive particles are simply mixed in an insulating material, individual ⁇ LEDs It becomes difficult to reliably capture the conductive particles on the electrodes.
  • the conductive particles tend to move due to the flow of the resin material that constitutes the anisotropic conductive film during heating and pressurization when connecting the ⁇ LED and the substrate through the anisotropic conductive film. Furthermore, since the space between electrodes is extremely narrow in a high-definition display, there is a risk of a short circuit occurring due to the conductive particles connecting between the electrodes.
  • an object of the present invention is to use a filler arrangement film in which fillers such as conductive particles are arranged in an insulating resin layer so that the connection part of a small first article such as an electrode of ⁇ LED can be used as an electrode of a substrate for a large screen television.
  • a filler arrangement film in which fillers such as conductive particles are arranged in an insulating resin layer so that the connection part of a small first article such as an electrode of ⁇ LED can be used as an electrode of a substrate for a large screen television.
  • the inventor of the present invention uses a filler arrangement film in which fillers such as conductive particles are arranged in an insulating resin layer to connect small connecting portions of a first article such as an electrode of a ⁇ LED to a second article such as an electrode of a substrate for a large screen television.
  • the filler in the filler arrangement film forms the first group at the position corresponding to the connection part of the first article, and a plurality of the first groups are gathered to form the first article
  • the second group corresponding to the outer shape and arranging the second group corresponding to the arrangement of the first article
  • unnecessary fillers not involved in connection can be reduced as much as possible, and during connection of the resin flows between the second groups, and the filler that constitutes the first group is between the connection part of the first article and the connection part of the second article by making it difficult to affect the inside of the second group
  • the first article is a light-emitting element such as ⁇ LED
  • the filler does not interfere with the emission of light from the light-emitting element, and the light-emitting device mounted with the light-emitting element
  • the present invention was completed based on the conceived that the luminous efficiency of the LED is improved.
  • the present invention provides a filler arrangement film in which fillers are arranged in an insulating resin layer, A plurality of first groups formed of a plurality of fillers in the insulating resin layer are aggregated to form a second group, and the second groups are regularly arranged, The nearest distance between the second group is greater than the nearest distance between the first group, Provided is a filler array film in which the closest distance between first groups is greater than the closest distance between fillers within the first group.
  • connection portion of each first article and the connection portion of the second article are arranged in a filler arrangement in an insulating resin layer.
  • the nearest distance between the second group is greater than the nearest distance between the first group.
  • a plurality of first articles are arranged on the second article, and each connecting section of the first article and the connecting section of the second article are connected via a filler.
  • a connection structure The filler in the first group formed by a plurality of fillers constitutes the connection point,
  • a second group formed by gathering a plurality of the first groups exists corresponding to the mounting position of the first article, The second group is arranged corresponding to the arrangement of the first articles, The nearest distance between the second group is greater than the nearest distance between the first group,
  • a connecting structure is provided in which the closest distance between first groups is greater than the closest distance between fillers within the first group.
  • the connecting portion of the microscopic first article such as the ⁇ LED electrode is connected to the connecting portion of the second article such as the electrode of the substrate for a large screen television, and the filler such as conductive particles is an insulating resin.
  • the filler such as conductive particles is an insulating resin.
  • the first article is a light-emitting element such as ⁇ LED
  • the second group corresponding to the outer shape of the light-emitting element is arranged corresponding to the arrangement of the light-emitting elements, so that the light emitted from the light-emitting element is It is not blocked by the second group. Therefore, the luminous efficiency of the light-emitting device mounted with the light-emitting element is improved.
  • FIG. 1 is an arrangement diagram of fillers in a filler arrangement film of an example.
  • FIG. 2 is a diagram showing the correspondence between the arrangement of fillers in the filler arrayed film of the example and the joints of articles connected by the filler arrayed film.
  • FIG. 3 is a cross-sectional view of the filler arrangement film of FIG. 1 taken along the line AA.
  • FIG. 1 is an arrangement diagram of fillers in a filler arrangement film 1 of one embodiment of the present invention.
  • This filler arrangement film 1 is obtained by arranging conductive particles as fillers 2 in an insulating resin layer 10 .
  • the filler-arranged film 1 of the examples will be mainly described as an anisotropic conductive film, but the filler-arranged film of the present invention can also be used as a conductive film for electrically connecting articles.
  • the filler-arranged film of the present invention With the filler-arranged film of the present invention, a plurality of first articles are arranged on the second article, and the first article and the second article are heated or pressurized through the filler-arranged film to obtain individual first articles. and the connection part of the second article, and in this connected state, the filler is sandwiched between the connection part of the first article and the connection part of the second article, and the first article and the second article are adhered to each other by an insulating resin layer.
  • the first article is the ⁇ LED
  • the electrode is the connection portion of the first article
  • the second article is the substrate on which the wiring circuit for the ⁇ LED is formed
  • the electrode is the connection portion of the second article.
  • it is used as an anisotropic conductive film for anisotropically conductive connection between the first article and the second article.
  • This filler arrangement film 1 may be used as a conductive film.
  • each ⁇ LED 20 connected using the filler arrangement film 1 of this embodiment has two electrodes 21, which are regularly arranged in a grid pattern on the wafer 22. As shown in FIG. 2, each ⁇ LED 20 connected using the filler arrangement film 1 of this embodiment has two electrodes 21, which are regularly arranged in a grid pattern on the wafer 22. As shown in FIG. 2, each ⁇ LED 20 connected using the filler arrangement film 1 of this embodiment has two electrodes 21, which are regularly arranged in a grid pattern on the wafer 22. As shown in FIG.
  • the long side is 200 ⁇ m or less, less than 150 ⁇ m, less than 50 ⁇ m, or less than 20 ⁇ m. More specifically, for example, a rectangle of 10 ⁇ m ⁇ 20 ⁇ m, 7 ⁇ m ⁇ 14 ⁇ m, or 5 ⁇ m ⁇ 5 ⁇ m can be mentioned.
  • the outer shape of the ⁇ LED 20 is not limited to a rectangle, and may be, for example, a rhombus.
  • the shape and size of the electrodes 21 are not particularly limited, but when the ⁇ LED is small, a rectangular shape with a long side of 5 ⁇ m to 50 ⁇ m and a short side of 3 ⁇ m to 40 ⁇ m can be used. can be appropriately selected depending on the usage.
  • the lower limit is preferably 3 ⁇ m or more, more preferably 5 ⁇ m or more, from the viewpoint of convenience of the mounting process.
  • the thickness may be 1000 ⁇ m or less, 500 ⁇ m or less, 150 ⁇ m or less, or 20 ⁇ m or less.
  • a plurality of conductive particles (fillers) 2 arranged at positions corresponding to individual electrodes (connections) 21 of ⁇ LEDs (first article) 20 form a first group 3.
  • a second group 4 is formed by assembling a plurality of LEDs in the first group 3 so as to correspond to the outer shape of the ⁇ LEDs 20 .
  • the second group 4 is regularly arranged corresponding to the arrangement of the ⁇ LEDs 20 .
  • the first group 3 is arranged at a position corresponding to the electrode 21 of the ⁇ LEDs 20 means that when the plurality of ⁇ LEDs 20 in a predetermined array state and the filler array film 1 are aligned, each It means that the electrodes 21 of the ⁇ LEDs 20 and the first group 3 overlap, and the spaces Ls between the electrodes 21 of the ⁇ LEDs 20 and the spaces L2 between the first groups 3 overlap. It means to be positioned, or that one or more of the conductive particles 2 forming the first group 3 overlap the electrode 21 .
  • the second group 4 is arranged corresponding to the arrangement of the ⁇ LEDs 20 means that each ⁇ LED 20 overlaps the second group 4 in plan view due to the alignment described above, and the space between the ⁇ LEDs and the space between the second group 4
  • the total area of the conductive particles 2 outside the outer shape of the ⁇ LED 20 among the conductive particles 2 forming the second group 4 is 50% of the outer shape area of the ⁇ LED 20. More preferably, all the conductive particles 2 forming the second group 4 are positioned within the outer shape of each ⁇ LED 20 .
  • the second group 4 is arranged corresponding to the arrangement of the ⁇ LEDs 20 means that the arrangement direction and arrangement pitch of the second group 4 are equal to the arrangement direction and arrangement pitch of the ⁇ LEDs 20 .
  • the number of the conductive particles 2 is small, and in particular the particle diameter of the conductive particles 2 is less than 3 ⁇ m. In the case of (2), it is desirable that the number of agglomerated or irregular conductive particles present between the second groups 4 is small.
  • the first group 3 of the conductive particles of the filler array film 1 corresponds to the electrode 21 of the ⁇ LED 20, and the second group 4 corresponds to the outer shape of the ⁇ LED 20. Therefore, the closest distance between the second groups 4 ( That is, the distance between the conductive particles constituting a certain second group and the conductive particles constituting the second group closest to the second group) is L1, and the closest distance between the first groups 3 (that is, The distance between the conductive particles constituting a certain first group and the conductive particles constituting the first group closest to the first group) is L2, and the closest distance between the conductive particles 2 in the first group 3 is L3, L1>L2>L3 becomes.
  • the second group 4 is a group of conductive particles having the same external shape and having the number of ⁇ LED electrodes (two) arranged in parallel.
  • the first group 3 in which the conductive particles are relatively dense at a distance L3 the second group 4 in which the conductive particles are spaced apart at a distance L2 to form a group, and the second group 4 are separated by a distance of L1. Therefore, the conductive particles (fillers) arranged in the film are not uniformly distributed over the entire surface, but are distributed over the entire surface in groups of regularity of different distances. Therefore, as described above, L1 is the distance defined as the "closest distance between the second groups", but it is possible that a second group distance having a greater distance than this exists (mixed). Practically preferred.
  • L1 and L2 are appropriately determined according to the outer shape, array pitch, inter-electrode distance, etc. of the ⁇ LEDs 20 .
  • L1 and L2 are also determined by the design of the ⁇ LED or mini-LED. Alternatively, it can be 500 ⁇ m or less.
  • the area of the contour shape of the second group 4 circumscribing the conductive particles 2 in the outer peripheral portion satisfies the following ratio to the corresponding external shape of the ⁇ LED 20. That is, if the lower limit of the ratio of the area of the contour shape of the second group 4 and the area of the outer shape of the ⁇ LED 20 is reduced, the conductive particles 2 can be easily accommodated within the outer shape of the ⁇ LED 20 .
  • This ratio is preferably 0.1 times or more, more preferably 0.2 times or more, and even more preferably 0.5 times or more so that the electrodes can easily capture the conductive particles.
  • the upper limit is increased, it is possible to avoid the concern that the conductive particles captured by the electrode will be insufficient, but there is a risk of impairing the transparency and aesthetic appearance.
  • 1.2 times or less is more preferable.
  • the outer peripheral portion of the conductive particles 2 constituting the first group 3 The area of the contour shape of the first group 3 circumscribing the conductive particles may be 0.5 to 1.8 times the area of the electrode 21 of the corresponding ⁇ LED 20, and is 0.8 to 1.2 times. is preferred. Within this range, the number of conductive particles is present in just the right amount, so both trapping and short-circuiting can be achieved, and a good trapping state can be easily obtained and confirmation is easy.
  • one second group 4 can include the first group 3 in a number corresponding to the number of connection portions of one first article, and in particular, three or less can be present, In this embodiment, two first groups 3 are present.
  • the relationship between the closest distance L3 between the conductive particles in the first group 3 and the average particle diameter D of the conductive particles 2 is such that the ratio L3/D has a lower limit of preferably 0.3 or more, more preferably It is 0.5 or more, and the upper limit is preferably 4 or less, more preferably 3 or less.
  • the arrangement of the conductive particles 2 in the first group 3 may be random or regular. However, in order to improve the ability to capture the conductive particles at each electrode 21, the conductive particles are arranged at a predetermined pitch in a predetermined direction.
  • a planar lattice pattern having one or more alignment axes is preferable, and examples thereof include an orthorhombic lattice, a hexagonal lattice, a square lattice, a rectangular lattice, and a parallel body lattice. Also, there may be regions with different planar grid patterns.
  • the average number density of fillers over the entire surface of the filler arrayed film 1 and the average number density of fillers in the first group 3 are designed according to the object for which the filler arrayed film is used.
  • the lower limit of the average number density on the entire surface is preferably 500/mm 2 or more when a sparse state is preferred, and preferably 20,000/mm 2 or more, more preferably 40,000/mm when a dense state is preferred. mm2 or more.
  • the lower limit of the average number density of the fillers in the first group 3 is preferably 50,000/mm 2 or more, more preferably 500,000/mm 2 or more, and the upper limit of the average number density is preferably 1,500,000/mm. 2 or less, more preferably 1,000,000/mm 2 or less.
  • the average number density of fillers in the space between the second groups 4 is preferably 1000/mm 2 or less, more preferably substantially zero.
  • the average filler area occupancy over the entire surface of the filler array film 1 and the average filler area occupancy in the first group 3 are similar to the average number density.
  • the average filler area occupancy in the first group 3 when the particle diameter is small and the dense state is preferable depending on the object using the filler array film 1 is, for example, 5% or more, 8% or more, or 25%. 85% or less, or 50% or less.
  • the area occupancy of the filler means the area occupancy of the conductive particles in this embodiment, and the number density of the conductive particles in the planar view of the filler-arranged film 1 (pieces/mm 2 ) ⁇ the planar view of one conductive particle It is obtained by the average area (mm 2 /piece) ⁇ 100.
  • the filler array film is cut into extremely small pieces, it refers to the number density measured in a state before being cut into pieces.
  • the number density of the conductive particles is obtained by observing using a metallurgical microscope, and image analysis software (for example, WinROOF (Mitani Shoji Co., Ltd.), Azo-kun (registered trademark) (Asahi Kasei Engineering Co., Ltd.), etc.) may be obtained by measuring the observed image. For the number of conductive particles, the number observed on the filler arrangement film is measured.
  • image analysis software for example, WinROOF (Mitani Shoji Co., Ltd.), Azo-kun (registered trademark) (Asahi Kasei Engineering Co., Ltd.), etc.
  • the particle size of the conductive particles 2 used as filler in this embodiment is not particularly limited, the lower limit of the particle size is preferably 1 ⁇ m or more.
  • the upper limit of the particle size is preferably, for example, 50 ⁇ m or less, more preferably 20 ⁇ m or less, from the viewpoint of capturing efficiency of the conductive particles in the connection structure.
  • the particle size of the conductive particles may be required to be less than 3 ⁇ m, preferably less than 2.5 ⁇ m, more preferably 2 ⁇ m or less. If the particle diameter is less than 1 ⁇ m, it may be treated as an aggregate of 1 ⁇ m or more.
  • the average particle size can be a value measured by an image-type particle size distribution analyzer (eg, FPIA-3000: manufactured by Malvern Panalytical).
  • the number of particles is preferably 1000 or more, preferably 2000 or more.
  • the type of conductive particles can be appropriately selected from conductive particles used in known anisotropic conductive films.
  • the conductive particles include metal particles such as nickel, cobalt, silver, copper, gold, and palladium, alloy particles such as solder, metal-coated resin particles, and metal-coated resin particles having insulating fine particles attached to their surfaces. mentioned. Two or more types can also be used together. Among them, the metal-coated resin particles are preferable because the resin particles repel each other after being connected, so that the contact with the terminals can be easily maintained and the conduction performance is stabilized.
  • the surface of the conductive particles may be subjected to an insulating treatment by a known technique so as not to interfere with the conductive properties.
  • inorganic fillers metal particles, metal oxide particles, metal nitride particles, etc.
  • organic fillers resin particles, rubber particles, etc.
  • fillers containing a mixture of organic and inorganic materials e.g., particles whose core is made of a resin material and whose surface is plated with metal (metal-coated resin particles), and insulating fine particles on the surface of conductive particles.
  • the material is appropriately selected from the materials attached to the surface, the surface of the conductive particles subjected to insulation treatment, etc.) depending on the performance required for the application, such as hardness and optical performance.
  • filler array film when used as a conductive film or an anisotropic conductive film, conductive particles are included as filler. Fillers other than conductive particles may be used depending on the application of the filler arrayed film.
  • the filler array film When the filler array film is used for adjusting the color development of micro-optical elements such as ⁇ LEDs, or for applications such as black matrix in color displays, known dyes, pigments, light-scattering particles, etc. may be used as fillers.
  • silica filler titanium oxide filler, styrene filler, acrylic filler, melamine filler, various titanates and the like can be used. Titanium oxide, magnesium titanate, zinc titanate, bismuth titanate, lanthanum oxide, calcium titanate, strontium titanate, barium titanate, barium zirconate titanate, lead zirconate titanate and mixtures thereof in capacitor films etc.
  • the adhesive film may contain polymer rubber particles, silicone rubber particles, and the like.
  • FIG. 3 is a cross-sectional view of the filler array film 1 shown in FIG. 1 along the line AA.
  • the conductive particles 2 are arrayed in the insulating resin layer 10 .
  • the insulating resin layer 10 may be composed of a single insulating resin layer, or may be composed of a laminate of a plurality of resin layers. It is preferable that the positions of the ends of the conductive particles 2 substantially coincide with one surface of the layer. Approximately matching includes, for example, an error of about ⁇ 10% of the particle diameter.
  • the insulating resin layer is a laminate of a plurality of resin layers, for example, as shown in FIG. It can be the agent layer 12 .
  • the resin constituting the high-viscosity binder resin layer 11 and the adhesive layer 12 can be the same as the binder and adhesive layer constituting the insulating resin layer described in Patent Document 3, for example. Different layers may be laminated with different fillers.
  • a rubber component, an inorganic filler, a silane coupling agent, a monomer for dilution, a filler, a softening agent, a coloring agent, a flame retardant, a thixotropic agent, etc. can be added to the insulating resin layer 10 as necessary. .
  • a rubber component may be added to prevent warping and distortion of the connection structure.
  • the rubber component is not particularly limited as long as it is an elastomer with high cushioning properties (shock absorption). Specific examples include acrylic rubber, silicone rubber, butadiene rubber, polyurethane resin (polyurethane elastomer), and the like. be able to.
  • the thickness of the insulating resin layer 10 is such that when the ⁇ LED 20 and the substrate are connected by heating and pressurizing through the filler array film 1, unnecessary resin flow does not occur in the insulating resin layer.
  • the lower limit of the layer thickness is 0.6 times or more, preferably 0.9 times, the average particle diameter of the conductive particles 2. More preferably, it is 1 time or more, and the upper limit is 3 times or less, preferably 2 times or less, further preferably 1.5 times or less. If the layer thickness of the insulating resin layer 10 is less than 0.6 times the average particle diameter of the conductive particles 2, the conductive particles 2 are exposed from the insulating resin layer 10.
  • the lower limit of the layer thickness of the insulating resin layer 10 is preferably 2 ⁇ m or more, more preferably 3 ⁇ m or more.
  • the upper limit is preferably 32 ⁇ m or less, more preferably 20 ⁇ m or less, and even more preferably 8 ⁇ m or less, because if the layer thickness is too large, misalignment tends to occur during connection.
  • the ⁇ LED itself is small, and the size of the ⁇ LED and the size of the conductive particles are closer than before.
  • the connection structure avoids this misalignment.
  • the thickness of the insulating resin layer 10 is required to fall within the above range.
  • the filler array film 1 can be produced in the same manner as known anisotropic conductive films except that the conductive particles are arranged in a specific manner as described above.
  • a mold having recesses corresponding to the arrangement pattern of the conductive particles is prepared, and the mold is filled with the conductive particles 2,
  • a high-viscosity binder resin layer 11 formed on a release film is laminated thereon, the conductive particles 2 are pushed into the high-viscosity binder resin layer 11 and transferred, and an adhesive layer 12 is laminated on the transfer surface.
  • connection method using filler arrangement film In the method of connecting the electrodes of the ⁇ LEDs 20 and the electrodes of the substrate with the plurality of ⁇ LEDs 20 arranged regularly on the wafer 22 using the filler array film 1, first, the filler array film 1 is placed on the electrodes of the substrate. The filler array film 1 and the ⁇ LEDs 20 arranged on the wafer 22 are aligned and bonded together, and heated and pressurized to connect the electrodes of the ⁇ LEDs 20 and the electrodes of the substrate. In this case, as described in Japanese Patent Laid-Open No. 2002-200000, the connection may be performed by heating and pressurizing in a two-step method. Also, when the conductive particles are solder particles or the like, they may be connected by reflow.
  • the insulating resin layer 10 of the filler array film 1 flows, fills the gaps between the surfaces facing the ⁇ LEDs 20 and the substrate, and hardens to bond the ⁇ LEDs 20 and the substrate.
  • the first group 3 is arranged with a distance L2 corresponding to the arrangement of the electrodes 21, so that short-circuiting between the electrodes 21 in one ⁇ LED 20 is suppressed. .
  • the filler array film 1 since the conductive particles 2 do not exist between the second groups 4, the light emitted from the ⁇ LED 20 after being connected to the substrate is not blocked by the conductive particles 2 between them.
  • the luminous efficiency of a light-emitting device mounted with ⁇ LEDs is improved as compared with the case of using a filler-arranged film in which conductive particles are uniformly present.
  • the filler array film may be in the form of individual pieces.
  • the size of the individual piece shape can be designed according to the object, and for example, one side can be 5 ⁇ m or more and 150 m or less. By doing so, it can be expected that the device can also be used for adjusting colors and light, which will be described later. That is, the first article and the second article may be connected by a piece-shaped film, or the piece-shaped film may be placed only on the electrodes.
  • the singulation can be formed by providing incisions using a mechanical method, a chemical method, a laser, or the like. Note that the cut does not have to be deep enough to reach the base material, and may be a half cut.
  • Temporary attachment of the filler array film, film transfer, and mounting of the ⁇ LED on the substrate can be performed by known methods such as a method using a stamp material or a laser (laser lift-off method) or a method to which it is applied (for example, Japanese Patent Laid-Open No. 9-124020, Japanese Patent Laid-Open No. 2011-76808, Japanese Patent No. 6636017, Japanese Patent No. 6187665, etc.) are not particularly limited as long as they are methods capable of exhibiting the effects of the invention.
  • connection structure In the connection structure between the ⁇ LED 20 and the substrate connected by the above-described method using the filler array film 1 of the example, the filler 2 in the first group 3 constitutes the connection point between the electrode 21 of the ⁇ LED 20 and the electrode of the substrate. is doing.
  • a ⁇ LED is used as an example, but the connection structure may be a mini-LED in the present invention.
  • the effect of resin flow during connection does not easily affect the arrangement of the conductive particles 2 in the second group 4, so the planar arrangement of the fillers after connection is the same as before connection.
  • a plurality of second groups are present corresponding to mounting positions of the ⁇ LEDs, and the second groups are arranged corresponding to the arrangement of the ⁇ LEDs. Then, regardless of whether or not they constitute a connection point, when all the conductive particles are seen, the closest distance between the second group after connection is L1 ', and the closest distance between the first group after connection is is L2' and the closest distance of the conductive particles is L3', L1'>L2'>L3' relationship is maintained.
  • connection structure has improved luminous efficiency compared to the connection structure in which the ⁇ LED and the substrate are connected using the filler array film in which the conductive particles are uniformly distributed over the entire surface of the film as described above. .
  • the captivity of the conductive particles in each electrode is high, and the rate of occurrence of short circuits is also reduced.
  • connection method using the filler arrangement film of the present invention and the connection structure obtained by the connection structure are configured such that the first article is the ⁇ LED, the second article is the substrate on which the wiring circuit of the ⁇ LED is formed, and the filler of the filler arrangement film is used. is used as conductive particles, but the present invention is not limited to this.
  • the first article is a light scattering film, a black matrix layer, or the like
  • the second article is a transparent substrate (a substrate on which ⁇ LED is mounted), or the like
  • the filler is silica or black-colored particles.
  • the color of the connection structure of the second article may be adjusted.
  • An adhesive film was obtained by mixing resins according to the resin composition shown in Table 1, applying the mixture onto a release film, and drying (60° C., 3 minutes).
  • the number of conductive particles captured by the bumps was measured. The lowest number in 100 bumps of this measured number was evaluated according to the following criteria.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

L'invention concerne un film comprenant une charge disposée, la charge, par exemple des particules électriquement conductrices, ayant été disposée sur une couche de résine isolante. Dans les cas où le film avec une charge disposée est utilisé pour relier une portion de raccordement d'un premier article qui est fin, par exemple une électrode d'une µ-LED, à une portion de raccordement d'un deuxième article, par exemple une électrode d'un substrat pour des télévisions à grand écran, par la charge, et même lorsque le premier article et le deuxième article présentent une différence d'alignement d'environ ±10 %, alors chaque portion de raccordement peut être conçue pour capturer réellement au moins une particule de charge sans défaillance. Ce film (1) comprend une couche de résine isolante (10) et une charge (2) disposée sur celle-ci. Sur la couche de résine isolante (10), une pluralité de particules de la charge (2) constituent un premier groupe (3), une pluralité de tels premiers groupes (3) sont regroupés pour constituer un deuxième groupe (4), et de tels deuxièmes groupes (4) ont été disposés régulièrement. La distance la plus courte L1 entre les deuxièmes groupes (4) est plus longue que la distance la plus courte L2 entre les premiers groupes. La distance la plus courte L2 entre les premiers groupes est plus longue que la distance la plus courte L3 entre les particules de charge dans les premiers groupes.
PCT/JP2022/013940 2021-03-26 2022-03-24 Film avec charge disposée WO2022202988A1 (fr)

Priority Applications (2)

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KR1020237021382A KR20230109182A (ko) 2021-03-26 2022-03-24 필러 배열 필름
CN202280022620.8A CN117063351A (zh) 2021-03-26 2022-03-24 填料排列膜

Applications Claiming Priority (4)

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JP2021054425 2021-03-26
JP2021-054425 2021-03-26
JP2022-047653 2022-03-23
JP2022047653A JP2022151821A (ja) 2021-03-26 2022-03-23 フィラー配列フィルム

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WO2022202988A1 true WO2022202988A1 (fr) 2022-09-29

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087957A (ja) * 1994-06-15 1996-01-12 Hitachi Chem Co Ltd 回路基板の接続方法、並びに接続構造体、及びそれに用いる接着フィルム
US20180145236A1 (en) * 2014-12-05 2018-05-24 Industrial Technology Research Institute Package structure for light emitting device
JP2020177916A (ja) * 2014-12-22 2020-10-29 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426227B1 (en) 2011-11-18 2013-04-23 LuxVue Technology Corporation Method of forming a micro light emitting diode array
JP2017157724A (ja) 2016-03-02 2017-09-07 デクセリアルズ株式会社 表示装置及びその製造方法、並びに発光装置及びその製造方法
TW202016232A (zh) 2018-06-06 2020-05-01 日商迪睿合股份有限公司 連接體之製造方法、連接方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH087957A (ja) * 1994-06-15 1996-01-12 Hitachi Chem Co Ltd 回路基板の接続方法、並びに接続構造体、及びそれに用いる接着フィルム
US20180145236A1 (en) * 2014-12-05 2018-05-24 Industrial Technology Research Institute Package structure for light emitting device
JP2020177916A (ja) * 2014-12-22 2020-10-29 デクセリアルズ株式会社 異方導電性フィルム及び接続構造体

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KR20230109182A (ko) 2023-07-19

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