WO2022201675A1 - Tape affixing device and tape affixing method - Google Patents

Tape affixing device and tape affixing method Download PDF

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Publication number
WO2022201675A1
WO2022201675A1 PCT/JP2021/046769 JP2021046769W WO2022201675A1 WO 2022201675 A1 WO2022201675 A1 WO 2022201675A1 JP 2021046769 W JP2021046769 W JP 2021046769W WO 2022201675 A1 WO2022201675 A1 WO 2022201675A1
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WO
WIPO (PCT)
Prior art keywords
tape
pressing
mechanical impedance
load control
operation mode
Prior art date
Application number
PCT/JP2021/046769
Other languages
French (fr)
Japanese (ja)
Inventor
浩光 和田
直行 熱田
由起 喜多
Original Assignee
東レエンジニアリング株式会社
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Application filed by 東レエンジニアリング株式会社 filed Critical 東レエンジニアリング株式会社
Publication of WO2022201675A1 publication Critical patent/WO2022201675A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/06Fibrous reinforcements only
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/30Shaping by lay-up, i.e. applying fibres, tape or broadsheet on a mould, former or core; Shaping by spray-up, i.e. spraying of fibres on a mould, former or core
    • B29C70/38Automated lay-up, e.g. using robots, laying filaments according to predetermined patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/04Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
    • B29C70/28Shaping operations therefor
    • B29C70/54Component parts, details or accessories; Auxiliary operations, e.g. feeding or storage of prepregs or SMC after impregnation or during ageing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/06Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
    • B29K2105/08Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts of continuous length, e.g. cords, rovings, mats, fabrics, strands or yarns

Definitions

  • the present invention relates to a tape applying apparatus and a tape applying method, and more particularly, a tape used when manufacturing a fiber reinforced plastic (FRP) molded product or the like by applying a tape to a surface to be applied.
  • the present invention relates to a sticking device and a tape sticking method using this tape sticking device.
  • a fiber reinforced plastic that is formed into a desired shape by pasting a tape-shaped fiber bundle (also called prepreg tape, UD tape, etc.) that is pre-impregnated with resin, such as carbon fiber, to the surface to be adhered.
  • FRP Fiber Reinforced Plastics
  • ATL Auto Tape Layup
  • ATW Automatic Tape Welding
  • AFP Automatic Fiber Placement
  • a conventional ATL device includes an ATL head that applies a tape while pressing it against a surface to be applied, and an articulated robot that controls the pressing position and/or the pressing posture of the ATL head.
  • the articulated robot controls the ATL head to apply the tape to the surface to be applied.
  • the control of the position and/or pressing attitude of the ATL head at which the tape is pressed against the surface to be adhered by the articulated robot is performed using, for example, coordinate data based on the three-dimensional design data of the work having the surface to be adhered. It is Then, the ATL device moves from a predetermined position (hereinafter referred to as a starting point) on the surface to be adhered, where the application of the tape is started, which is specified by the coordinate data, etc.
  • the tape is applied while moving the ATL head between points to a position (hereinafter referred to as an end point).
  • an end point a position
  • the tape is pasted while the ATL head is moved from the starting point to the terminal point, so that the trajectory of the switching movement of the ATL head and the shape of the surface to be pasted are different. It is assumed that there is no error between them (for example, Patent Document 1 below).
  • the ATL device 100 includes a pressure roller 103 for pressing a tape 102 onto a surface 106 of a workpiece 105 (hereinafter referred to as a surface 106), and a pressure position and a position of the pressure roller 103.
  • a surface 106 a workpiece 105
  • the parallel link mechanism 104 includes a base portion 107, an end portion 108 to which the pressure roller 103 is attached, and a plurality of link portions 109 which are provided in parallel between the base portion 107 and the end portion 108 and which expand and contract according to the flow of fluid.
  • the pressing position and/or pressing posture of the pressing roller 103 is controlled.
  • the parallel link mechanism 104 presses the tape 102 onto the surface 106 to be adhered while moving the pressure roller 103 so as to follow the shape of the surface 106 to be adhered. That is, even if the workpiece 105 has a shape error, the ATL device 100 can move the pressing roller 103 so as to follow the shape of the bonding surface 106 by the parallel link mechanism 104. It becomes possible to keep the pressing state of the tape 102 by the roller 103 constant.
  • the ATL head 101 when the ATL head 101 is moved in a state separated from the application surface 106 and when the pressure roller 103 of the ATL head 101 is pressed against the application surface 106 to apply the tape 102, the ATL head
  • the optimum value of the mechanical impedance required for 101 is different. If the machine is operated under a constant mechanical impedance, the pressure roller 103 may wobble, the pressure roller 103 may not contact the starting point, and the surface 106 may not be pressed at a predetermined position. In this case, since the pressing roller 103 contacts and presses a position shifted from the starting point, the tape 102 is applied at a position shifted from the predetermined position. That is, in some cases, the tape 102 cannot be attached to a predetermined position.
  • the pressure roller 103 cannot move so as to follow the shape of the surface 106 to be adhered when the tape 102 is adhered.
  • the direction in which the pressure roller 103 presses against the surface 106 to be stuck varies, resulting in an excess or deficiency of the pressing force at the time of sticking. Therefore, the ATL device 100 may not be able to adhere the tape 102 accurately.
  • the present invention has been made in view of the above problems, and an object of the present invention is to provide a tape applying device and a tape applying method capable of accurately applying a tape.
  • a tape applying apparatus of the present invention has a tape applying head that presses a tape against a surface to be applied, and a handling section to which the applying head is attached and that controls the pressing position of the applying head.
  • the sticking head includes a pressing section that presses the tape against the sticking surface, and a load control section that is provided between the handling section and the pressing section and controls the pressing force of the pressing section.
  • a mechanical impedance adjustment section for adjusting the mechanical impedance of the load control section, and a first operation mode in which the pressing section is pressed against the surface to be adhered with a predetermined load; and a second operation mode in which the tape is attached to the surface to be attached by relatively moving with respect to the surface to be attached, and the mechanical impedance adjustment unit is adapted to be in the first operation mode.
  • the mechanical impedance of the load control section and the mechanical impedance of the load control section in the second operation mode are adjusted to different mechanical impedances.
  • the mechanical impedance adjustment unit adjusts the mechanical impedance of the load control unit in the first operation mode and the load in the second operation mode.
  • the mechanical impedance of the controller is adjusted to different mechanical impedances.
  • the mechanical impedance adjustment section may be configured to adjust the mechanical impedance of the load control section in the first operation mode to be higher than the mechanical impedance of the load control section in the second operation mode.
  • the mechanical impedance adjustment section adjusts the mechanical impedance of the load control section in the first operation mode so as to be greater than the mechanical impedance of the load control section in the second operation mode. It is possible to prevent the pressing portion from wobbling in the operation mode. That is, the pressing portion can accurately bring the tape into contact with a predetermined position on the surface to be attached and press the tape.
  • the application head includes a parallel link mechanism for controlling the pressing position and/or the pressing posture of the pressing portion.
  • the parallel link mechanism includes a base portion connected to the handling portion and the pressing portion. An end portion to be attached, and a plurality of link portions provided in parallel between the base portion and the end portion and having the load control portion that expands and contracts, and each of the link portions is caused to expand and contract by the expansion and contraction operation of the load control portion.
  • the pressing position and/or the pressing posture of the pressing portion may be controlled so as to follow the shape of the adhered surface.
  • the parallel link mechanism includes the load control section, and the mechanical impedance of the load control section in the first operation mode and the mechanical impedance of the load control section in the second operation mode are adjusted by the mechanical impedance adjustment section. Adjusted for different mechanical impedances.
  • the mechanical impedance adjustment section Adjusted for different mechanical impedances.
  • the load control section expands and contracts according to the inflow and outflow of fluid
  • the mechanical impedance adjustment section adjusts the internal pressure of the load control section in the first operation mode so that the internal pressure of the load control section in the second operation mode It is good also as a structure controlled so that it may become larger than.
  • the mechanical impedance adjustment section may be configured as lock means for locking the expansion and contraction operation of the load control section from the outside in the first operation mode.
  • the tape applying method of the present invention comprises an applying head for pressing the tape against a surface to be applied, and a handling section to which the applying head is attached and which controls the pressing position of the applying head,
  • a tape comprising: a pressing portion in which the sticking head presses the tape against the surface to be stuck; and a load control portion provided between the handling portion and the pressing portion for controlling the pressing force of the pressing portion.
  • a tape application method using an application device comprising: a first operation step of pressing the pressing portion against the surface to be attached with a predetermined load; and moving the pressing portion relative to the surface to be attached.
  • a second operation step of applying the tape to the surface to be adhered by applying the mechanical impedance of the load control unit to the load control unit in the first operation step It is characterized by having a mechanical impedance adjustment step of adjusting the mechanical impedance to a mechanical impedance different from the mechanical impedance of the part.
  • the first operation step and the second operation step are provided, and the mechanical impedance of the load control unit in the first operation step and the mechanical impedance of the load control unit in the second operation step can be adjusted to different mechanical impedances.
  • the tape applying method of the present invention comprises an applying head for pressing the tape against the surface to be applied, the applying head comprising a pressing portion for pressing the tape against the surface to be applied, and the pressing portion.
  • a parallel link mechanism for controlling a pressing position and/or a pressing attitude, wherein the parallel link mechanism includes a base portion, an end portion to which the pressing portion is attached, and between the base portion and the end portion. and a plurality of link portions provided in parallel with each other and having load control portions that expand and contract.
  • a tape applying method using a tape applying device that applies the tape to the surface to be applied while operating the position and/or the pressing posture to follow the shape of the surface to be applied, wherein the pressing is performed with a predetermined load.
  • the second operation step includes a mechanical impedance adjustment step of adjusting the mechanical impedance of the load control unit to a mechanical impedance different from the mechanical impedance of the load control unit in the first operation step.
  • the parallel link mechanism is configured to include the load control section, and the load control section in the first operation process is
  • the mechanical impedance and the mechanical impedance of the load control section in the second operation step can be adjusted to different mechanical impedances. This makes it possible to switch the mechanical impedance of the load control unit to a mechanical impedance suitable for each operation process in the first operation process and the second operation process. Therefore, it is possible to accurately bring the tape into contact with a predetermined position and press it in the first operation process while coping with the shape error of the work in the second operation process. That is, the tape can be adhered with high accuracy.
  • the tape can be applied with high accuracy.
  • FIG. 1 is a schematic diagram of an ATL device according to an embodiment of the present invention
  • FIG. FIG. 2 is a view taken along line AA′ of FIG. 1
  • Fig. 3 shows an ATL head in a first mode of operation
  • Fig. 3 shows the ATL head in a second mode of operation
  • 1 is a flowchart of a tape application method using an ATL device according to one embodiment of the present invention
  • FIG. It is a figure which shows one variation of the ATL apparatus which concerns on one Embodiment of this invention.
  • FIG. 1 is a diagram showing a conventional ATL device
  • ATL device An ATL device according to an embodiment of the present invention will be described below with reference to the drawings.
  • the three axes of the orthogonal coordinate system are X, Y, and Z
  • the horizontal direction is expressed as the X-axis direction and the Y-axis direction
  • the direction perpendicular to the XY plane that is, the vertical direction
  • the Z-axis expressed as direction.
  • FIG. 1 is a diagram schematically showing an ATL device 1 according to one embodiment of the present invention.
  • FIG. 2 is a view taken along line AA' in FIG.
  • FIG. 3 shows the ATL head 10 in the first mode of operation.
  • FIG. 4 shows the ATL head 10 in the second mode of operation.
  • An ATL device (so-called tape application device) 1 includes an ATL head (so-called application head) 10 that presses a tape T as shown in FIG. A so-called handling robot) 70 is provided. Note that the ATL head 10 is attached to the handling section 70 . Further, the ATL device 1 has a first operation mode and a second operation mode as its own modes (operations) for attaching the tape T. As shown in FIG.
  • the ATL device 1 controls the position and attitude of the ATL head 10 by operating each part constituting the ATL head 10 and/or the handling part 70, and presses the tape T onto the work W to adhere the tape. For the production of T-reinforced moldings.
  • the workpiece W in the present embodiment is, for example, a molded product having a three-dimensional shape, and may be a molded product made of resin such as thermoplastic resin or thermosetting resin, or a molded product made of metal. may
  • the tape T in the present embodiment is, for example, a tape-like shape obtained by impregnating at least a part of a fiber bundle with a resin in advance, and is impregnated with a thermoplastic resin (also called a UD tape). or a tape impregnated with a thermosetting resin (also called a prepreg tape).
  • the tape T may contain carbon fibers, or may be a resin tape mixed with a large number of short fibers.
  • the type of the tape T is appropriately selected according to the material of the work W and the like.
  • the tape T may be of a form in which a plurality of tapes are arranged in parallel.
  • the ATL head 10 in this embodiment is for pressing the tape T against the work W with a predetermined load (details will be described later), and is attached to the handling section 70 .
  • This handling section 70 is for controlling the pressing position of the ATL head 10 .
  • the handling unit 70 moves the ATL head 10 according to the shape of the work W, and sticks the tape T on the surface H of the work W. wear.
  • the handling unit 70 includes a mechanism (three degrees of freedom) capable of translating the ATL head 10 in at least the XYZ-axis directions, such as a gantry structure 72 (see FIG. 1) or an articulated robot 78 (see FIG. 6). (see ), etc.).
  • Operation control of the handling unit 70 is executed by a robot control unit 71 (see FIG. 3).
  • the robot control unit 71 is composed of, for example, a general-purpose computer device, and controls each unit based on the three-dimensional coordinate data of the surface H to be adhered (hereinafter referred to as the surface H to be adhered) of the work W, and the three-dimensional coordinate data.
  • a program that controls the operation of the is stored.
  • the robot control unit 71 determines in advance a predetermined position (hereinafter referred to as a starting point S) on the surface H to start the application of the tape T, and a position where the application of the tape T is completed.
  • a predetermined position (hereinafter referred to as an end point E) on the adhered surface H is specified. With these, the pressing position of the ATL head 10 is controlled.
  • the handling unit 70 is configured by a gantry structure 72 as shown in FIG. 1
  • the gantry structure 72 includes an X-axis linear motion mechanism 73 having an X ⁇ Z-axis stage 74 that supports the workpiece W so as to be movable in the X-axis direction and rotatable in the yaw ( ⁇ z) direction (around the Z-axis);
  • a Y-axis linear motion mechanism 75 bridged over the X-axis linear motion mechanism 73 in the Y-axis direction, and a Z-axis linear motion mechanism 76 supported by the Y-axis linear motion mechanism 75 and movable in the Z-axis direction are provided.
  • the ATL head 10 is attached to an ATL head attachment portion 77 provided in the Z-axis direct-acting mechanism 76 (details will be described later).
  • the X-axis linear motion mechanism 73 includes an X-axis guide portion 73a, an X-axis slide table 73b slidably attached to the X-axis guide portion 73a, and a yaw ( ⁇ z) rotation on the X-axis slide table 73b. and an X ⁇ Z-axis stage 74 that is freely provided.
  • a workpiece W is placed on the X ⁇ Z-axis stage 74 . That is, the X-axis linear motion mechanism 73 can translate the work W in the X-axis direction, and the X ⁇ Z-axis stage 74 can rotate the work W in the yaw ( ⁇ z) direction.
  • the Y-axis direct-acting mechanism 75 includes a Y-axis guide portion 75a attached to a gate-shaped base and a Y-axis slider 75b slidably attached to the Y-axis guide portion 75a.
  • the Z-axis linear motion mechanism 76 includes a Z-axis guide portion 76a attached to the Y-axis slider 75b, a Z-axis slider 76b slidably attached to the Z-axis guide portion 76a, and a Z-axis slider 76b. and an ATL head attachment portion 77.
  • the ATL head 10 is attached to the lower end of the ATL head attachment portion 77 .
  • the ATL head 10 can be translated in the Y-axis direction by the Y-axis linear motion mechanism 75, and the ATL head 10 can be moved in the Z-axis direction by the Z-axis linear motion mechanism 76 (elevating and lowering with respect to the surface H to be applied). It is designed to be able to
  • the ATL head 10 of this embodiment includes a pressing portion 20 for pressing the tape T against the surface H to be bonded, a feeder 40 for feeding the tape T toward the pressing portion 20, and the feeder 40.
  • a heating means 50 that heats at least one of the fed tape T and the surface H to be adhered, and a parallel link mechanism 30 that operates so that the pressing position and/or posture of the pressing portion 20 follows the shape of the surface H to be adhered. and
  • the operation of each section of the ATL head 10 is controlled by the ATL head control section 11 (details will be described later).
  • the pressing part 20 presses the surface H to be stuck through the tape T, and presses the tape T against the surface H to be stuck. and a roller support portion 23 attached to the end portion 32 of the parallel link mechanism 30 in a state of being supported by the roller support portion 23 .
  • the pressing roller 21 is composed of a resin roller, an elastic roller, a metal roller, or the like, depending on the characteristics of the tape T, the material of the work W, or the like. Further, the size (diameter, width) of the pressing roller 21 is appropriately selected according to the type and size of the tape T to be used and the type and shape of the workpiece W. Note that in another configuration example, a pressing member such as a pressing shoe may be used instead of the pressing roller 21 .
  • the feeder 40 is for conveying the tape T to feed the tape T between the pressure roller 21 and the surface H to be adhered.
  • the feeder 40 has, for example, a pair of conveying belts 41, and conveys the tape T by rotating the conveying belt pair 41 with the power of a motor (not shown).
  • the feeder 40 may be equipped with an unwinding mechanism for unwinding the tape T from a bobbin, or may supply the tape T cut to a predetermined length in advance. Alternatively, the tape may be unwound from an unwinding mechanism mounted separately from the ATL head 10, and the tape T may be supplied to the feeder 40 along the transport path.
  • the heating means 50 is for heating at least one of the tape T fed by the feeder 40 and the surface H to be adhered, and is capable of heating the tape T and the surface H to be adhered in a non-contact manner. It may be composed of a radiation source such as a lamp, a laser, an IR lamp, or a hot air source such as a hot air nozzle. It should be noted that the heating means 50 is not an essential element. A portion may be provided to allow the heating means 50 to be detachable.
  • the parallel link mechanism 30 is for controlling the pressing position and/or pressing posture of the pressing portion 20 so as to follow the shape of the surface H to be adhered.
  • the parallel link mechanism 30 has a base portion 31 attached to the handling portion 70, an end portion 32 to which the pressing portion 20 is attached, and parallel links between the base portion 31 and the end portion 32. and a plurality of link portions 33 provided. By controlling the lengths of the plurality of link portions 33, the pressing position and/or pressing posture of the pressing roller 21 is controlled.
  • Each link portion 33 has universal joints 35a and 35b such as a spherical joint at both ends of itself, and a load control portion 34 (details will be described later) which is provided between these universal joints and expands and contracts according to the inflow and outflow of fluid. and
  • the length of the link portion 33 is controlled by the expansion and contraction of the load control portion 34 . That is, in the parallel link mechanism 30, the length of each of the plurality of link portions 33 is controlled by the expansion and contraction operation of the load control portion 34, so that the position (three directions of translation) and attitude (three directions of rotation) of the end portion 32 are controlled. can be changed. That is, the parallel link mechanism 30 moves in three translational directions (XYZ axis directions) and three rotational directions (around the XYZ axes) to control the pressing position and pressing posture of the pressing roller 103 .
  • the parallel link mechanism 30 is generally composed of three to six link portions 33, and the pressing position and/or pressing posture of the pressing roller 21 can be operated so as to follow the shape of the surface H to be adhered. If possible, the number of link portions 33 is not particularly limited. If the number of link portions 33 is reduced, the configuration of the parallel link mechanism 30 can be simplified. It is possible to make it difficult to be affected by the moment accompanying the operation of the parallel link mechanism 30 .
  • the load control section 34 is for controlling the pressing position and/or the pressing posture of the pressing roller 21 by controlling the length of each link section 33 . It is also for pressing against the adhered surface H with a predetermined load.
  • the load control section 34 includes a cylinder section 34a to which fluid (in this embodiment, air) is supplied, and a rod section 34b that advances and retreats (displaces) according to the internal pressure of the cylinder section 34a.
  • the ATL head 10 further includes a pressure sensor 34f that detects the internal pressure of the cylinder portion 34a, and a displacement sensor 34c (for example, a magnetic linear encoder) that detects displacement of the rod portion 34b.
  • the cylinder portion 34a is connected to a servo valve 34d via a pressure sensor 34f.
  • the servo valve 34d is connected to an air pressure supply section 34e (for example, a compressor) that outputs compressed air, and adjusts the flow rate and exhaust amount of air into the cylinder section 34a, thereby controlling both chambers of the cylinder section 34a. It is possible to control the pressure. Thereby, the displacement of the rod portion 34b is controlled.
  • the pressure signal detected by the pressure sensor 34f and the displacement signal detected by the displacement sensor 34c are output to the ATL head control section 11, respectively.
  • the ATL head control unit 11 is composed of, for example, a general-purpose computer device, and controls the ATL based on the three-dimensional shape data of the adhered surface H of the work W, the three-dimensional coordinate data, the pressure signal, the displacement signal, and the like. Programs and the like for controlling the operation of each part of the head 10 are stored.
  • the ATL head control unit 11 controls the operation of the servo valve 34d of each load control unit 34 using, for example, the detection signal received from the pressure sensor 34f or the displacement sensor 34c as a control parameter, and controls the operation of the cylinder of each load control unit 34. Processing is performed to control the internal pressure of the portion 34a and/or the displacement of the rod portion 34b. As a result, by changing the position (translation) and posture (rotation) of the end portion, the pressing position and/or the pressing posture of the pressing roller 21 can be driven and controlled so as to follow the shape of the surface H to be adhered. .
  • the pressing direction (load direction) of the pressing roller 21 against the surface H to be adhered so as to be in the normal direction (direction orthogonal to the surface H to be adhered). This makes it possible to apply a more uniform load to the pressing roller 21 . Further, even if there is a shape error between the three-dimensional coordinate data of the pasting surface H described above and the actual pasting surface H, the pressing position and/or position of the pressure roller 21 can be adjusted so as to absorb the shape error. Since the pressing posture can be flexibly controlled, the pressing state of the tape T against the surface H to be stuck by the pressing roller 21 can be kept constant. Therefore, the tape T can be adhered to the surface H to be adhered with high precision.
  • the tape T is pressed by the ATL device 1 including the handling unit 70 and the ATL head 10 as described above, and the tape T is applied to the surface of the workpiece W while controlling the pressing position and/or pressing attitude of the pressing roller 21. It can be attached to H.
  • the handling unit 70 moves the ATL head 10 onto the starting point S on the surface H to be adhered. position.
  • the Z-axis direct-acting mechanism 76 lowers the ATL head 10 toward the surface H to be adhered, and brings the pressure roller 21 into contact with the starting point S on the surface H to be adhered. Then, the pressing roller 21 is pressed against the adhered surface H with a predetermined load.
  • the operation until the pressure roller 21 is pressed against the surface H to be adhered with a predetermined load is referred to as a first operation mode.
  • the Y-axis direct-acting mechanism 75 moves the ATL head 10 relative to the surface H to be applied (to the end point E on the surface H to be applied) while pressing the tape T to adhere it to the surface H to be applied.
  • a series of operations for pressing the tape T and applying it to the surface H to be applied while the ATL head 10 is moved from the starting point S to the end point E on the surface H to be applied is referred to as a second operation mode. do.
  • each load control section 34 of the parallel link mechanism 30 is relatively adjusted so that the pressing position and/or the pressing posture of the pressing roller 21 follow the shape of the surface H to be adhered. making it smaller. That is, the mechanical impedance is differentiated (switched) between the first operation mode and the second operation mode, making it easier to change the length of each link portion 33 .
  • the mechanical impedance referred to here is the ratio of the response speed at a certain point on the structure to the force when a periodic excitation force is applied to the mechanical structure. It means the difficulty of movement of a substance (in the present invention, the load control section 34) when it is pressed.
  • the degree of difficulty in movement of the load control section 34 is represented by the magnitude of the mechanical impedance. That is, in the present embodiment, when the mechanical impedance of the load control section 34 increases, the load control section 34 is less likely to expand and contract, and when the mechanical impedance of the load control section 34 decreases, the load control section 34 expands and contracts more easily.
  • the ATL head 10 further includes a mechanical impedance adjuster (not shown).
  • the mechanical impedance adjuster is for adjusting the mechanical impedance of the load controller 34 .
  • the mechanical impedance adjustment section adjusts the mechanical impedance so that the mechanical impedance is optimized in each of the first operation mode and the second operation mode.
  • the servo valve 34d is a mechanical impedance adjustment unit.
  • the mechanical impedance adjustment section adjusts the mechanical impedance of the load control section 34 by controlling the internal pressure of the cylinder section 34a of each load control section 34 (when the internal pressure of the cylinder section 34a increases, the load control section 34 When the mechanical impedance increases and the internal pressure of the cylinder portion 34a decreases, the mechanical impedance of the load control portion 34 decreases).
  • the internal pressure of the cylinder portion 34a here refers to the sum of the pressures of both chambers within the cylinder portion 34a.
  • the internal pressure of the cylinder portion 34a of each load control portion 34 in the first operation mode is made larger by the mechanical impedance adjustment portion than the internal pressure of the cylinder portion 34a of each load control portion 34 in the second operation mode. controlled to be That is, the internal pressure P 1 of the cylinder portion 34a of each load control portion 34 in the first operation mode (see FIG. 3) and the internal pressure P 2 of the cylinder portion 34a of each load control portion 34 in the second operation mode (see FIG. 4) ), the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled for each mode so that at least the relationship of internal pressure P 1 >internal pressure P 2 is satisfied.
  • each load control section 34 in the first operation mode is higher than the mechanical impedance of each load control section 34 in the second operation mode.
  • the pressure roller 21 can be brought into contact with the starting point S without causing the pressure roller 21 to contact the starting point S. That is, the tape T can be accurately pressed at a predetermined position.
  • the mechanical impedance of each load control section 34 is smaller than the mechanical impedance of each load control section 34 in the first operation mode.
  • all the operations of the parallel link mechanism 30 control of the position and attitude of the pressure roller 21
  • the operation of the parallel link mechanism 30 is controlled so that the pressure roller 21 follows the shape of the surface H to be adhered.
  • FIG. As a result, the tape T can be adhered to the surface H to be adhered with higher accuracy.
  • the mechanical impedance adjustment section adjusts the mechanical impedance of the load control section 34 to the optimum value in each of the first operation mode and the second operation mode. Since the pressure roller 21 is adjusted, it is possible to prevent the pressure roller 21 from wobbling in the first operation mode, and the pressure roller 21 is brought into contact with and pressed against the starting point S on the surface H to be adhered without being displaced. becomes possible. Further, in the second operation mode, the operation of the parallel link mechanism 30 can be controlled so that the pressure roller 21 follows the shape of the surface H to be adhered. can always be in the normal direction, and it is possible to prevent excessive or insufficient pressing force. Therefore, it becomes possible to stick the tape T to a predetermined position with high precision. That is, the accuracy of attaching the tape T can be improved as compared with the conventional ATL device.
  • step S3 will be described as a first operation process
  • steps S4 to S6 will be described as a second operation process.
  • the robot control unit 71 operates the handling unit 70, and in this embodiment, the X-axis direct-acting mechanism 73 of the gantry structure 72, thereby moving the X ⁇ Z-axis stage on which the workpiece W is placed.
  • 74 is moved in the X-axis direction, and the Y-axis direct-acting mechanism 75 is operated to move the ATL head 10 so that the pressure roller 21 is positioned immediately above the starting point S of the surface H of the workpiece W (step S1). ).
  • the X ⁇ Z-axis stage 74 is rotated so that the trajectory along which the pressure roller 21 moves from the start point S to the end point E becomes a straight line, if necessary.
  • Step S2 the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled by the mechanical impedance adjustment portion to make the mechanical impedance of each load control portion 34 larger than the mechanical impedance of each load control portion 34 in the second operation step.
  • Step S3 the Z-axis direct-acting mechanism 76 lowers the pressure roller 21 toward the surface H to be adhered, bringing the pressure roller 21 into contact with the starting point S on the surface H to be adhered and pressing it with a predetermined load.
  • Step S4 the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled by the mechanical impedance adjustment portion to make the mechanical impedance of each load control portion 34 smaller than the mechanical impedance of each load control portion 34 in the first operation step.
  • the ATL head control unit 11 operates each part of the ATL head 10 to start applying the tape T to the application surface H, and apply the tape T from the starting point S to the end point E on the application surface H. It is added (step S5). Specifically, the ATL head control section 11 operates the feeder 40 to convey the tape T between the pressure roller 21 and the surface H to be adhered. In addition, the ATL head control unit 11 operates the parallel link mechanism 30 (if necessary, the robot control unit 71 may also operate the gantry structure 72), and the pressure roller 21 presses the tape T onto the application surface. Press H. Further, the ATL head controller 11 starts heat treatment by the heating means 50 to heat the tape T and/or the surface H to be adhered.
  • the ATL head control unit 11 controls the operation of the pressing position and/or pressing posture of the pressing roller 21 by the parallel link mechanism 30 .
  • the robot control unit 71 controls the operation of the gantry structure 72 .
  • the ATL head 10 adheres the tape T to the surface H to be applied by moving relative to the surface H to be applied. That is, the tape T is adhered to the surface H to be adhered along the application route of the tape T from the starting point S to the end point E on the surface H to be adhered.
  • the operation of each part of the parallel link mechanism 30 is controlled so that the pressing position and/or pressing attitude of the pressing roller 21 follow the shape of the surface H to be adhered.
  • step 6 the process of completing the application operation of the tape T is performed (step 6). Specifically, the ATL head control unit 11 determines whether or not the pressure roller 21 has reached the end point E. If it is determined that the pressure roller 21 has not reached the end point E, then step S5 in FIG. If it is determined that the end point E has been reached, processing is performed to complete the pasting operation. That is, the ATL head control unit 11 performs control to cut the tape T by a cutting unit (not shown) provided in the feeder 40, control to stop the heating operation by the heating means 50, and control to cancel the pressing operation by the pressing roller 21. , completes the application of the tape T for one line.
  • a cutting unit not shown
  • the mechanical impedance of the load control unit 34 is adjusted to the optimum value in each of the first operation process and the second operation process. Movement (control of the position and attitude of the pressing roller 21). As a result, the pressure roller 21 can be prevented from swaying, so that the tape T can be brought into contact with and pressed against the starting point S on the surface H to be adhered without the position of the pressure roller 21 shifting. Further, in the second operation process, all the operations of the parallel link mechanism 30 (control of the position and attitude of the pressure roller 21) become easy to move. As a result, the operation of the parallel link mechanism 30 can be controlled so that the pressure roller 21 follows the shape of the surface H to be adhered. It is possible to prevent excessive or insufficient pressing force. Therefore, it becomes possible to stick the tape T to a predetermined position with high precision. That is, the accuracy of attaching the tape T can be improved as compared with the conventional tape attaching method.
  • the ATL head 10 has the parallel link mechanism 30, but the ATL head 10 does not have the parallel link mechanism 30 and only has one load control unit 34. It may be something that is
  • the ATL head 10 may be configured to have one load control section 34 between the handling section 70 and the pressing roller 21 . Even in such a case, the mechanical impedance adjustment section adjusts the mechanical impedance of each load control section 34 to the second operation mode (second operation process) immediately before the first operation mode (first operation process). ), it is possible to prevent the pressure roller 21 from wobbling. As a result, the tape T can be brought into contact with the starting point S without being displaced in the first operation mode.
  • the internal pressure of the cylinder portion 34a of the load control portion 34 is controlled by taking air in and out.
  • the mechanical impedance adjustment unit is not limited to the servo valve 34d (for example, an electropneumatic regulator or the like).
  • the mechanical impedance adjustment unit is the servo valve 34d and the mechanical impedance of each load control unit 34 is adjusted by controlling the internal pressure of the cylinder portion 34a of each load control unit 34
  • the expansion/contraction operation of each load control unit 34 may be locked from the outside.
  • the mechanical impedance adjuster may be composed of clamps 36, for example.
  • the rod portion 34b of each load control portion 34 is locked by a clamp 36 as shown in FIG. 7A, so that the mechanical impedance of the load control portion 34 is reduced to It is made larger than the mechanical impedance of the load control section 34 .
  • the rod portion 34b of each load control portion 34 is unlocked.
  • the control of adjusting the mechanical impedance of the load control section 34 by the mechanical impedance adjustment section so as to be greater than the mechanical impedance of the load control section 34 in the second operation mode is An example of performing immediately before the first operation mode (first operation step) has been described, but the present invention is not limited to this, at least until the pressure roller 21 is brought into contact with the surface H to be adhered and pressed with a predetermined load. It should be done on
  • the mechanical impedance should be different between the first operation mode (first operation process) and the second operation mode (second operation process) for optimum operation.
  • the mechanical impedance in the first operation mode (first operation process) may be higher than the mechanical impedance in the second operation mode (second operation process).
  • the feeder 40 is attached to the rotating shaft portion 22 of the pressing roller 21 via the member 60, but the member 60 may be a rotating member 60.
  • the rotating member 60 is rotatably attached to the rotating shaft portion 22 of the pressing roller 21 .
  • the rotary member 60 is provided with a rotary joint 83 for coupling with the rotary motion part 80 .
  • the rotary motion unit 80 includes a linear motion means 81 erected on the end portion 32 toward the base portion 31, and a cylinder portion 81a of the linear motion means 81, which controls the pressure in the rod.
  • a link whose both ends are rotatably attached via a rotary joint 83 between a linear motion member 82 that is linearly moved in the vertical direction by displacing the portion 81b and between the linear motion member 82 and the rotary member 60 arm 84; Thereby, the attitude of the feeder 40 can be controlled according to the operation of the parallel link mechanism 30 .
  • ATL device (tape applying device) 10 ATL head (pasting head) 11 ATL head control section 20 pressing section 21 pressing roller 22 rotating shaft section 23 roller support section 30 parallel link mechanism 31 base section 32 end section 33 link section 34 load control section 34a cylinder section 34b rod section 34c displacement sensor 34d servo valve 34e air pressure Supply unit 34f Pressure sensor 35a, 35b Universal joint 36 Clamp 40 Feeder (conveying means) 41 conveyor belt pair 50 heating means 60 member (rotating member) 70 handling unit 71 robot control unit 72 gantry structure 73 X-axis linear motion mechanism 73a X-axis guide unit 73b X-axis slide table 74 X ⁇ Z-axis stage 75 Y-axis linear motion mechanism 75a Y-axis guide unit 75b Y-axis slider 76 Z-axis linear motion mechanism Motion mechanism 76a Z-axis guide part 76b Z-axis slider 77 ATL head mounting part 78 Articulated robot 80 Rotating motion part 81 Linear motion means 81a Cylinder

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  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Robotics (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

Provided are a tape affixing device and a tape affixing method with which it is possible to accurately affix tape. This tape affixing device includes an affixing head that presses tape to an affixation surface, and a handling part to which the affixing head attaches and which controls a pressing position of the affixing head, wherein the affixing head comprises a pressing part that presses the tape on the affixation surface, a load control unit which is provided between the handling part and the pressing part and controls the force at which the pressing part presses, and a mechanical impedance adjustment unit which adjusts the mechanical impedance of the load control unit, the affixing head has a first operation mode until the pressing part is pressed on the affixation surface at a predetermined load, and a second operation mode in which the tape is affixed to the affixation surface by the pressing part moving relative to the affixation surface, and the mechanical impedance adjustment unit adjusts the mechanical impedance of the load control unit in the first operation mode and the mechanical impedance of the load control unit in the second operation mode to different mechanical impedances.

Description

テープ貼付装置、及びテープ貼付方法TAPE APPLICATION DEVICE AND TAPE APPLICATION METHOD
 本発明は、テープ貼付装置、及びテープ貼付方法に関するものであり、より詳細には、テープを被貼付面に貼り付けることにより、繊維強化プラスチック(FRP)成形品などを製造する際に用いられるテープ貼付装置、及びこのテープ貼付装置を用いたテープ貼付方法に関するものである。 TECHNICAL FIELD The present invention relates to a tape applying apparatus and a tape applying method, and more particularly, a tape used when manufacturing a fiber reinforced plastic (FRP) molded product or the like by applying a tape to a surface to be applied. The present invention relates to a sticking device and a tape sticking method using this tape sticking device.
 予め樹脂が含侵された炭素繊維等の繊維束をテープ状に成形したもの(プリプレグテープ、UDテープなどとも呼ぶ)を被貼付面に貼り付けてゆくことで、所望の形状をした繊維強化プラスチック(FRP:Fiber Reinforced Plastics)成形品を製造する方法が知られている。 A fiber reinforced plastic that is formed into a desired shape by pasting a tape-shaped fiber bundle (also called prepreg tape, UD tape, etc.) that is pre-impregnated with resin, such as carbon fiber, to the surface to be adhered. (FRP: Fiber Reinforced Plastics) A method for manufacturing a molded article is known.
 これらの製法は、ATL(Auto Tape Layup)、ATW(Auto Tape Welding)、AFP(Auto Fiber Placement)などの種々の称呼があるが、これらは厳密に区別されているものでない。本明細書においては、テープを押圧しながら被貼付面に貼り付けていく製法を総称してATLと呼び、その装置(テープ貼付装置)をATL装置と呼ぶこととする。 These manufacturing methods have various names such as ATL (Auto Tape Layup), ATW (Auto Tape Welding), and AFP (Auto Fiber Placement), but they are not strictly distinguished. In the present specification, the manufacturing method of pressing the tape onto the surface to be adhered is collectively called ATL, and the device (tape applying device) is called the ATL device.
 従来のATL装置は、テープを被貼付面に押圧しながら貼り付けるATLヘッドと、このATLヘッドの押圧位置及び/又は押圧姿勢制御する多関節ロボットとを備えている。この多関節ロボットにより、ATLヘッドを制御して被貼付面に押し付けることでテープを貼り付けることができるようになっている。このとき、多関節ロボットによるATLヘッドが被貼付面にテープを押圧する位置及び/又は押圧姿勢の制御は、たとえば、被貼付面を有するワークの3次元設計データに基づく座標データなどを用いて行われている。そして、ATL装置は、座標データなどによって指定されたテープの貼り付けを開始する被貼付面上の所定位置(以下、起点)から、同じく指定されたテープの貼り付けを終了する被貼付面の所定位置(以下、終点)まで、ATLヘッドを点間移動させながらテープを貼り付けるようになっている。このように従来のATL装置では、ATLヘッドを起点から終点へと点間移動させながらテープを貼り付けるようになっているので、このATLヘッドの転換移動の軌跡と、被貼付面の形状との間に誤差がないことが前提のものとなっていた(たとえば、下記特許文献1)。 A conventional ATL device includes an ATL head that applies a tape while pressing it against a surface to be applied, and an articulated robot that controls the pressing position and/or the pressing posture of the ATL head. The articulated robot controls the ATL head to apply the tape to the surface to be applied. At this time, the control of the position and/or pressing attitude of the ATL head at which the tape is pressed against the surface to be adhered by the articulated robot is performed using, for example, coordinate data based on the three-dimensional design data of the work having the surface to be adhered. It is Then, the ATL device moves from a predetermined position (hereinafter referred to as a starting point) on the surface to be adhered, where the application of the tape is started, which is specified by the coordinate data, etc. The tape is applied while moving the ATL head between points to a position (hereinafter referred to as an end point). As described above, in the conventional ATL apparatus, the tape is pasted while the ATL head is moved from the starting point to the terminal point, so that the trajectory of the switching movement of the ATL head and the shape of the surface to be pasted are different. It is assumed that there is no error between them (for example, Patent Document 1 below).
 しかし、被貼付面を有するワークは、3次元形状の成形品であり、設計上の形状・寸法に対して形状誤差を有していることが多い。そのため、前述したATLヘッドの点間移動の軌跡と、被貼付面の形状との間に誤差が生じることになり、従来のATLヘッドの押圧位置及び/又は押圧姿勢の制御では、ATLヘッドによる被貼付面へのテープの押圧が過不足する箇所が生じる。すなわち、ワークが形状誤差を有するものであった場合、ATLヘッドによる被貼付面へのテープの押圧状態にばらつきが生じる虞があった。そのため、被貼付面に対するATLヘッドによるテープの押圧状態を一定に保つことが望まれていた。これに対して、たとえば、下記の特許文献2に開示されたATL装置が提案されている。 However, a work having a surface to be adhered is a three-dimensional molded product, and often has shape errors with respect to the designed shape and dimensions. Therefore, an error occurs between the trajectory of the point-to-point movement of the ATL head described above and the shape of the surface to be adhered. There are places where the pressure of the tape on the sticking surface is excessive or insufficient. In other words, if the workpiece has a shape error, there is a possibility that the state of pressing the tape against the surface to be affixed by the ATL head may vary. Therefore, it has been desired to keep the state of pressing the tape against the surface to be affixed by the ATL head constant. In response to this, for example, an ATL device disclosed in Patent Document 2 below has been proposed.
 このATL装置100は、図8に示すように、テープ102を押圧しながらワーク105の被貼付面106(以下、被貼付面106)に貼り付ける押圧ローラ103と、この押圧ローラ103の押圧位置及び/又は押圧姿勢を制御するパラレルリンク機構104を備えるATLヘッド101から構成されている。パラレルリンク機構104は、ベース部107と、押圧ローラ103が取り付けられるエンド部108と、これらベース部107とエンド部108との間に並列に設けられ、流体の出し入れにより伸縮する複数のリンク部109を備えている。この複数のリンク部109の長さを制御することで、押圧ローラ103の押圧位置及び/又は押圧姿勢を制御する。これにより、パラレルリンク機構104が、押圧ローラ103を被貼付面106の形状に倣うように移動させながら、テープ102を被貼付面106に押圧して貼り付けるようになっている。すなわち、ATL装置100は、ワーク105が形状誤差を有している場合であっても、パラレルリンク機構104により押圧ローラ103を被貼付面106の形状に倣うように移動させることができるので、押圧ローラ103によるテープ102の押圧状態を一定に保つことが可能となる。 As shown in FIG. 8, the ATL device 100 includes a pressure roller 103 for pressing a tape 102 onto a surface 106 of a workpiece 105 (hereinafter referred to as a surface 106), and a pressure position and a position of the pressure roller 103. / Or it is composed of an ATL head 101 having a parallel link mechanism 104 for controlling the pressing attitude. The parallel link mechanism 104 includes a base portion 107, an end portion 108 to which the pressure roller 103 is attached, and a plurality of link portions 109 which are provided in parallel between the base portion 107 and the end portion 108 and which expand and contract according to the flow of fluid. It has By controlling the lengths of the plurality of link portions 109, the pressing position and/or pressing posture of the pressing roller 103 is controlled. As a result, the parallel link mechanism 104 presses the tape 102 onto the surface 106 to be adhered while moving the pressure roller 103 so as to follow the shape of the surface 106 to be adhered. That is, even if the workpiece 105 has a shape error, the ATL device 100 can move the pressing roller 103 so as to follow the shape of the bonding surface 106 by the parallel link mechanism 104. It becomes possible to keep the pressing state of the tape 102 by the roller 103 constant.
特開2018-149730号公報JP 2018-149730 A 国際公開WO2020/184237号公報International publication WO2020/184237
 しかし、上記ATL装置100では、テープ102を精度よく貼り付ける動作を行えない場合があった。 However, with the ATL device 100 described above, there were cases where the tape 102 could not be adhered accurately.
 具体的には、被貼付面106から離隔させた状態でATLヘッド101を移動させる場合と、ATLヘッド101の押圧ローラ103を被貼付面106に押し付けてテープ102を貼り付ける場合とで、ATLヘッド101に求められる機械インピーダンスの最適値が異なっている。仮に機械インピーダンスが一定の条件で動作させた場合、押圧ローラ103のふらつきが生じ、押圧ローラ103が前述した起点に接触できず、所定位置で被貼付面106を押圧できない可能性があった。この場合、押圧ローラ103が起点からずれた位置に接触して押圧することになるので、所定位置とずれた位置にテープ102が貼り付けられることになる。すなわち、テープ102を所定位置に貼り付けることができない場合があった。また、テープ102の貼り付け時に押圧ローラ103が被貼付面106の形状に倣うように移動できない可能性があった。この場合、被貼付面106に対する押圧ローラ103の押圧方向がばらつき、貼り付け時に押圧力の過不足が生じることになる。したがって、上記ATL装置100では、テープ102を精度よく貼り付けることができない場合があった。 Specifically, when the ATL head 101 is moved in a state separated from the application surface 106 and when the pressure roller 103 of the ATL head 101 is pressed against the application surface 106 to apply the tape 102, the ATL head The optimum value of the mechanical impedance required for 101 is different. If the machine is operated under a constant mechanical impedance, the pressure roller 103 may wobble, the pressure roller 103 may not contact the starting point, and the surface 106 may not be pressed at a predetermined position. In this case, since the pressing roller 103 contacts and presses a position shifted from the starting point, the tape 102 is applied at a position shifted from the predetermined position. That is, in some cases, the tape 102 cannot be attached to a predetermined position. Further, there is a possibility that the pressure roller 103 cannot move so as to follow the shape of the surface 106 to be adhered when the tape 102 is adhered. In this case, the direction in which the pressure roller 103 presses against the surface 106 to be stuck varies, resulting in an excess or deficiency of the pressing force at the time of sticking. Therefore, the ATL device 100 may not be able to adhere the tape 102 accurately.
 本発明は、上記課題を鑑みてされたものであり、テープを精度よく貼り付けることができるテープ貼付装置、及びテープ貼付方法を提供することを目的としている。 The present invention has been made in view of the above problems, and an object of the present invention is to provide a tape applying device and a tape applying method capable of accurately applying a tape.
 上記課題を解決するために本発明のテープ貼付装置は、テープを被貼付面に押圧する貼付ヘッドと、前記貼付ヘッドが取り付けられ、前記貼付ヘッドの押圧位置を制御するハンドリング部と、を有するテープ貼付装置であって、前記貼付ヘッドは、前記被貼付面に前記テープを押し付ける押圧部と、前記ハンドリング部と前記押圧部との間に設けられ、前記押圧部の押し付ける力を制御する荷重制御部と、前記荷重制御部の機械インピーダンスを調節する機械インピーダンス調節部と、を備えており、所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作モードと、前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作モードと、を有しており、前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の機械インピーダンスと前記第2の動作モードにおける前記荷重制御部の機械インピーダンスを異なる機械インピーダンスに調節することを特徴としている。 In order to solve the above-described problems, a tape applying apparatus of the present invention has a tape applying head that presses a tape against a surface to be applied, and a handling section to which the applying head is attached and that controls the pressing position of the applying head. In the sticking device, the sticking head includes a pressing section that presses the tape against the sticking surface, and a load control section that is provided between the handling section and the pressing section and controls the pressing force of the pressing section. and a mechanical impedance adjustment section for adjusting the mechanical impedance of the load control section, and a first operation mode in which the pressing section is pressed against the surface to be adhered with a predetermined load; and a second operation mode in which the tape is attached to the surface to be attached by relatively moving with respect to the surface to be attached, and the mechanical impedance adjustment unit is adapted to be in the first operation mode. The mechanical impedance of the load control section and the mechanical impedance of the load control section in the second operation mode are adjusted to different mechanical impedances.
 上記テープ貼付装置によれば、第1の動作モードと、第2の動作モードとを有し、機械インピーダンス調節部により第1の動作モードにおける荷重制御部の機械インピーダンスと第2の動作モードにおける荷重制御部の機械インピーダンスが異なる機械インピーダンスに調節される。これにより、第1の動作モードと第2の動作モードとで荷重制御部の機械インピーダンスをそれぞれの動作モードに適した機械インピーダンスに切り替えることが可能となる。したがって、テープを精度よく貼り付けることができる。 According to the above tape applying device, it has a first operation mode and a second operation mode, and the mechanical impedance adjustment unit adjusts the mechanical impedance of the load control unit in the first operation mode and the load in the second operation mode. The mechanical impedance of the controller is adjusted to different mechanical impedances. Thereby, it becomes possible to switch the mechanical impedance of the load control section to a mechanical impedance suitable for each operation mode in the first operation mode and the second operation mode. Therefore, the tape can be adhered with high accuracy.
 また、前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の機械インピーダンスが前記第2の動作モードにおける前記荷重制御部の機械インピーダンスよりも大きくなるよう調節する構成としてもよい。 Further, the mechanical impedance adjustment section may be configured to adjust the mechanical impedance of the load control section in the first operation mode to be higher than the mechanical impedance of the load control section in the second operation mode.
 この構成によれば、機械インピーダンス調節部により第1の動作モードにおける荷重制御部の機械インピーダンスが、第2の動作モードにおける荷重制御部の機械インピーダンスよりも大きくなるよう調節されるので、第1の動作モード時に押圧部がふらつくことを防ぐことができる。すなわち、押圧部がテープを被貼付面の所定位置に精度よく接触させて押圧することが可能となる。 According to this configuration, the mechanical impedance adjustment section adjusts the mechanical impedance of the load control section in the first operation mode so as to be greater than the mechanical impedance of the load control section in the second operation mode. It is possible to prevent the pressing portion from wobbling in the operation mode. That is, the pressing portion can accurately bring the tape into contact with a predetermined position on the surface to be attached and press the tape.
 また、前記貼付ヘッドは、前記押圧部の押圧位置及び/又は押圧姿勢を制御するパラレルリンク機構を備えており、前記パラレルリンク機構は、前記ハンドリング部と接続されるベース部と、前記押圧部が取り付けられるエンド部と、前記ベース部と前記エンド部との間に並列に設けられ、伸縮する前記荷重制御部を有する複数のリンク部を備え、前記荷重制御部の伸縮動作により各々の前記リンク部の長さを制御することで、前記押圧部の押圧位置及び/又は押圧姿勢を前記被貼付面の形状に倣うように制御する構成としてもよい。 The application head includes a parallel link mechanism for controlling the pressing position and/or the pressing posture of the pressing portion. The parallel link mechanism includes a base portion connected to the handling portion and the pressing portion. An end portion to be attached, and a plurality of link portions provided in parallel between the base portion and the end portion and having the load control portion that expands and contracts, and each of the link portions is caused to expand and contract by the expansion and contraction operation of the load control portion. By controlling the length of , the pressing position and/or the pressing posture of the pressing portion may be controlled so as to follow the shape of the adhered surface.
 この構成によれば、パラレルリンク機構が荷重制御部を含んで構成され、機械インピーダンス調節部により第1の動作モードにおける荷重制御部の機械インピーダンスと第2の動作モードにおける荷重制御部の機械インピーダンスが異なる機械インピーダンスに調節される。これにより、第1の動作モードと第2の動作モードとで荷重制御部の機械インピーダンスをそれぞれの動作モードに適した機械インピーダンスに切り替えることが可能となる。したがって、第2の動作モードにおいてワークの形状誤差に対応しつつ、第1の動作モードにおいて精度よくテープを所定位置に接触させて押圧することが可能となる。 According to this configuration, the parallel link mechanism includes the load control section, and the mechanical impedance of the load control section in the first operation mode and the mechanical impedance of the load control section in the second operation mode are adjusted by the mechanical impedance adjustment section. Adjusted for different mechanical impedances. Thereby, it becomes possible to switch the mechanical impedance of the load control section to a mechanical impedance suitable for each operation mode in the first operation mode and the second operation mode. Therefore, it is possible to accurately contact and press the tape to a predetermined position in the first operation mode while coping with the shape error of the work in the second operation mode.
 また、前記荷重制御部は、流体の出し入れにより伸縮し、前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の内圧が、前記第2の動作モードにおける前記荷重制御部の内圧よりも大きくなるよう制御する構成としてもよい。 Further, the load control section expands and contracts according to the inflow and outflow of fluid, and the mechanical impedance adjustment section adjusts the internal pressure of the load control section in the first operation mode so that the internal pressure of the load control section in the second operation mode It is good also as a structure controlled so that it may become larger than.
 この構成によれば、余計な機構を必要とせずに荷重制御部の機械インピーダンスを調節することが可能となる。 According to this configuration, it is possible to adjust the mechanical impedance of the load control section without requiring an extra mechanism.
 また、前記機械インピーダンス調節部は、前記第1の動作モードにおいて前記荷重制御部の伸縮動作を外部からロックするロック手段である構成としてもよい。 Further, the mechanical impedance adjustment section may be configured as lock means for locking the expansion and contraction operation of the load control section from the outside in the first operation mode.
 この構成によれば、煩雑な制御を必要とせずに荷重制御部の機械インピーダンスを制御することが可能となる。 According to this configuration, it is possible to control the mechanical impedance of the load control section without requiring complicated control.
 上記課題を解決するために本発明のテープ貼付方法は、テープを被貼付面に押圧する貼付ヘッドと、前記貼付ヘッドが取り付けられ、前記貼付ヘッドの押圧位置を制御するハンドリング部と、を備え、前記貼付ヘッドが、前記被貼付面に前記テープを押し付ける押圧部と、前記ハンドリング部と前記押圧部との間に設けられ、前記押圧部の押し付ける力を制御する荷重制御部と、を備えたテープ貼付装置を用いるテープ貼付方法であって、所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作工程と、前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作工程と、を有しており、前記第2の動作工程は、前記荷重制御部の機械インピーダンスを前記第1の動作工程における前記荷重制御部の機械インピーダンスと異なる機械インピーダンスに調節する機械インピーダンス調節工程を有することを特徴としている。 In order to solve the above problems, the tape applying method of the present invention comprises an applying head for pressing the tape against a surface to be applied, and a handling section to which the applying head is attached and which controls the pressing position of the applying head, A tape comprising: a pressing portion in which the sticking head presses the tape against the surface to be stuck; and a load control portion provided between the handling portion and the pressing portion for controlling the pressing force of the pressing portion. A tape application method using an application device, comprising: a first operation step of pressing the pressing portion against the surface to be attached with a predetermined load; and moving the pressing portion relative to the surface to be attached. and a second operation step of applying the tape to the surface to be adhered by applying the mechanical impedance of the load control unit to the load control unit in the first operation step. It is characterized by having a mechanical impedance adjustment step of adjusting the mechanical impedance to a mechanical impedance different from the mechanical impedance of the part.
 上記テープ貼付方法によれば、第1の動作工程と、第2の動作工程とを有し、第1の動作工程における荷重制御部の機械インピーダンスと第2の動作工程における荷重制御部の機械インピーダンスを異なる機械インピーダンスに調節できる。これにより、第1の動作工程と第2の動作工程とで荷重制御部の機械インピーダンスをそれぞれの動作工程に適した機械インピーダンスに切り替えることが可能となる。したがって、テープを精度よく貼り付けることができる。 According to the tape application method, the first operation step and the second operation step are provided, and the mechanical impedance of the load control unit in the first operation step and the mechanical impedance of the load control unit in the second operation step can be adjusted to different mechanical impedances. This makes it possible to switch the mechanical impedance of the load control unit to a mechanical impedance suitable for each operation process in the first operation process and the second operation process. Therefore, the tape can be adhered with high accuracy.
 上記課題を解決するために本発明のテープ貼付方法は、テープを被貼付面に押圧する貼付ヘッドを備え、前記貼付ヘッドが、前記被貼付面に前記テープを押し付ける押圧部と、前記押圧部の押圧位置及び/又は押圧姿勢を制御するパラレルリンク機構と、を備えており、前記パラレルリンク機構が、ベース部と、前記押圧部が取り付けられるエンド部と、前記ベース部と前記エンド部との間に並列に設けられ、伸縮する荷重制御部を有する複数のリンク部と、を備え、前記荷重制御部の伸縮動作により各々の前記リンク部の長さを制御することで、前記押圧部の前記押圧位置及び/又は前記押圧姿勢を前記被貼付面の形状に倣うように動作させながら、前記テープを前記被貼付面に貼り付けるテープ貼付装置を用いるテープ貼付方法であって、所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作工程と、前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作工程と、を有しており、前記第2の動作工程は、前記荷重制御部の機械インピーダンスを前記第1の動作工程における前記荷重制御部の機械インピーダンスと異なる機械インピーダンスに調節する機械インピーダンス調節工程を有することを特徴としている。 In order to solve the above-mentioned problems, the tape applying method of the present invention comprises an applying head for pressing the tape against the surface to be applied, the applying head comprising a pressing portion for pressing the tape against the surface to be applied, and the pressing portion. a parallel link mechanism for controlling a pressing position and/or a pressing attitude, wherein the parallel link mechanism includes a base portion, an end portion to which the pressing portion is attached, and between the base portion and the end portion. and a plurality of link portions provided in parallel with each other and having load control portions that expand and contract. A tape applying method using a tape applying device that applies the tape to the surface to be applied while operating the position and/or the pressing posture to follow the shape of the surface to be applied, wherein the pressing is performed with a predetermined load. a first operation step until the tape is pressed against a surface to be adhered; and a second operation step of affixing the tape to the surface to be adhered by moving the pressing portion relative to the surface to be adhered. , wherein the second operation step includes a mechanical impedance adjustment step of adjusting the mechanical impedance of the load control unit to a mechanical impedance different from the mechanical impedance of the load control unit in the first operation step. It is characterized by
 上記テープ貼付方法によれば、第1の動作工程と、第2の動作工程とを有しており、パラレルリンク機構が荷重制御部を含んで構成され、第1の動作工程における荷重制御部の機械インピーダンスと第2の動作工程における荷重制御部の機械インピーダンスを異なる機械インピーダンスに調節できる。これにより、第1の動作工程と第2の動作工程とで荷重制御部の機械インピーダンスをそれぞれの動作工程に適した機械インピーダンスに切り替えることが可能となる。したがって、第2の動作工程においてワークの形状誤差に対応しつつ、第1の動作工程において精度よくテープを所定位置に接触させて押圧することが可能となる。すなわち、テープを精度よく貼り付けることができる。 According to the tape application method, the first operation step and the second operation step are provided, the parallel link mechanism is configured to include the load control section, and the load control section in the first operation process is The mechanical impedance and the mechanical impedance of the load control section in the second operation step can be adjusted to different mechanical impedances. This makes it possible to switch the mechanical impedance of the load control unit to a mechanical impedance suitable for each operation process in the first operation process and the second operation process. Therefore, it is possible to accurately bring the tape into contact with a predetermined position and press it in the first operation process while coping with the shape error of the work in the second operation process. That is, the tape can be adhered with high accuracy.
 本発明のテープ貼付装置、及びテープ貼付方法によれば、テープを精度よく貼り付けることができる。 According to the tape applying device and the tape applying method of the present invention, the tape can be applied with high accuracy.
本発明の一実施形態に係るATL装置を概略的に示す図である。1 is a schematic diagram of an ATL device according to an embodiment of the present invention; FIG. 図1のA-A´矢視図である。FIG. 2 is a view taken along line AA′ of FIG. 1; 第1の動作モードにおけるATLヘッドを示す図である。Fig. 3 shows an ATL head in a first mode of operation; 第2の動作モードにおけるATLヘッドを示す図である。Fig. 3 shows the ATL head in a second mode of operation; 本発明の一実施形態に係るATL装置を用いたテープ貼付方法のフロー図である。1 is a flowchart of a tape application method using an ATL device according to one embodiment of the present invention; FIG. 本発明の一実施形態の係るATL装置の一つのバリエーションを示す図である。It is a figure which shows one variation of the ATL apparatus which concerns on one Embodiment of this invention. 本発明の一実施形態に係るATL装置の一つのバリエーションを示す図であり、(a)は第1の動作モード時、(b)は第2の動作モード時を示す図である。It is a figure which shows one variation of the ATL apparatus based on one Embodiment of this invention, (a) is a figure which shows the time of a 1st operation mode, (b) is a figure which shows the time of a 2nd operation mode. 従来のATL装置を示す図である。1 is a diagram showing a conventional ATL device; FIG.
 (ATL装置)
 以下、本発明の一実施形態におけるATL装置について図面を参照しながら説明する。なお、以下の説明では、直交座標系の3軸をX、Y、Zとし、水平方向をX軸方向、Y軸方向と表現し、XY平面と垂直な方向(つまり、鉛直方向)をZ軸方向と表現する。
(ATL device)
An ATL device according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the three axes of the orthogonal coordinate system are X, Y, and Z, the horizontal direction is expressed as the X-axis direction and the Y-axis direction, and the direction perpendicular to the XY plane (that is, the vertical direction) is the Z-axis. expressed as direction.
 図1は、本発明の一実施形態に係るATL装置1を概略的に示す図である。図2は、図1のA―A´矢視図である。図3は、第1の動作モードにおけるATLヘッド10を示す図である。図4は、第2の動作モードにおけるATLヘッド10を示す図である。 FIG. 1 is a diagram schematically showing an ATL device 1 according to one embodiment of the present invention. FIG. 2 is a view taken along line AA' in FIG. FIG. 3 shows the ATL head 10 in the first mode of operation. FIG. 4 shows the ATL head 10 in the second mode of operation.
 本実施形態におけるATL装置(所謂、テープ貼付装置)1は、図1に示すようにテープTを押圧するATLヘッド(所謂、貼付ヘッド)10と、ATLヘッド10の押圧位置を制御するハンドリング部(所謂、ハンドリングロボット)70とを備えている。なお、ATLヘッド10は、ハンドリング部70に取り付けられている。また、ATL装置1は、テープTを貼り付けるための自身のモード(動作)として、第1の動作モードと、第2の動作モードとを備えている。 An ATL device (so-called tape application device) 1 according to the present embodiment includes an ATL head (so-called application head) 10 that presses a tape T as shown in FIG. A so-called handling robot) 70 is provided. Note that the ATL head 10 is attached to the handling section 70 . Further, the ATL device 1 has a first operation mode and a second operation mode as its own modes (operations) for attaching the tape T. As shown in FIG.
 ATL装置1は、ATLヘッド10及び/又はハンドリング部70のそれぞれを構成する各部の動作により、ATLヘッド10の位置、姿勢を制御しながらテープTをワークWに押圧して貼り付けることにより、テープTで補強された成形品を製造するためのものである。 The ATL device 1 controls the position and attitude of the ATL head 10 by operating each part constituting the ATL head 10 and/or the handling part 70, and presses the tape T onto the work W to adhere the tape. For the production of T-reinforced moldings.
 本実施形態におけるワークWは、たとえば、3次元形状を有する成形品であり、熱可塑性樹脂又は熱硬化性樹脂などの樹脂製の成形品であってもよいし、金属製の成形品などであってもよい。 The workpiece W in the present embodiment is, for example, a molded product having a three-dimensional shape, and may be a molded product made of resin such as thermoplastic resin or thermosetting resin, or a molded product made of metal. may
 また、本実施形態におけるテープTは、たとえば、繊維束の少なくとも一部に予め樹脂を含侵させてテープ状にしたものであり、熱可塑性の樹脂が含侵されたもの(UDテープとも呼ばれる)や、熱硬化性の樹脂が含侵されたもの(プリプレグテープとも呼ばれる)などが適用される。また、テープTは、炭素繊維を含むものであってもよいし、樹脂テープに多数の短い繊維が混ぜ込まれたものであってもよい。なお、テープTは、ワークWの材質などに応じて、その種類が適宜選択される。また、テープTは、複数のテープが並列に配置された形態のものであってもよい。 In addition, the tape T in the present embodiment is, for example, a tape-like shape obtained by impregnating at least a part of a fiber bundle with a resin in advance, and is impregnated with a thermoplastic resin (also called a UD tape). or a tape impregnated with a thermosetting resin (also called a prepreg tape). Moreover, the tape T may contain carbon fibers, or may be a resin tape mixed with a large number of short fibers. The type of the tape T is appropriately selected according to the material of the work W and the like. Moreover, the tape T may be of a form in which a plurality of tapes are arranged in parallel.
 本実施形態におけるATLヘッド10は、テープTを所定荷重でワークWに押圧するためのものであり(詳細は後述する)、ハンドリング部70に取り付けられている。このハンドリング部70は、ATLヘッド10の押圧位置を制御するためのものである。たとえば、ハンドリング部70は、ATLヘッド10がテープTを押圧している状態で、ワークWの形状に応じてATLヘッド10を移動させる動作を行い、ワークWの被貼付面HにテープTを貼り付ける。また、ハンドリング部70は、ATLヘッド10を少なくともXYZ軸方向に並進運動可能な機構(3自由度)を備えるもの、たとえば、ガントリ構造体72(図1を参照)や多関節ロボット78(図6を参照)などの汎用産業用ロボットで構成されるとよい。このハンドリング部70の動作制御は、ロボット制御部71(図3を参照)により実行される。このロボット制御部71は、たとえば、汎用のコンピュータ装置によって構成されており、ワークWの被貼付面H(以下、被貼付面H)の3次元座標データ、これら3次元座標データなどに基づいて各部の動作を制御するプログラムなどが記憶されている。また、ロボット制御部71は、3次元座標データなどを基に予め、テープTの貼り付けを開始する被貼付面H上の所定位置(以下、起点S)と、テープTの貼り付けを完了する被貼付面H上の所定位置(以下、終点E)を指定している。これらにより、ATLヘッド10の押圧位置が制御されるようになっている。 The ATL head 10 in this embodiment is for pressing the tape T against the work W with a predetermined load (details will be described later), and is attached to the handling section 70 . This handling section 70 is for controlling the pressing position of the ATL head 10 . For example, while the ATL head 10 is pressing the tape T, the handling unit 70 moves the ATL head 10 according to the shape of the work W, and sticks the tape T on the surface H of the work W. wear. The handling unit 70 includes a mechanism (three degrees of freedom) capable of translating the ATL head 10 in at least the XYZ-axis directions, such as a gantry structure 72 (see FIG. 1) or an articulated robot 78 (see FIG. 6). (see ), etc.). Operation control of the handling unit 70 is executed by a robot control unit 71 (see FIG. 3). The robot control unit 71 is composed of, for example, a general-purpose computer device, and controls each unit based on the three-dimensional coordinate data of the surface H to be adhered (hereinafter referred to as the surface H to be adhered) of the work W, and the three-dimensional coordinate data. A program that controls the operation of the is stored. Further, based on the three-dimensional coordinate data and the like, the robot control unit 71 determines in advance a predetermined position (hereinafter referred to as a starting point S) on the surface H to start the application of the tape T, and a position where the application of the tape T is completed. A predetermined position (hereinafter referred to as an end point E) on the adhered surface H is specified. With these, the pressing position of the ATL head 10 is controlled.
 本実施形態では、ハンドリング部70が、図1に示すようなガントリ構造体72で構成されているものを例に説明する。このガントリ構造体72は、ワークWをX軸方向へ移動可能、かつヨー(θz)方向(Z軸回り)に回動可能に支持するXθZ軸ステージ74を備えたX軸直動機構73と、X軸直動機構73の上方にY軸方向に架け渡されたY軸直動機構75と、Y軸直動機構75に支持され、Z軸方向に移動可能なZ軸直動機構76とを備えている。ATLヘッド10は、Z軸直動機構76が備えるATLヘッド取付部77に取り付けられている(詳細は後述する)。 In the present embodiment, an example in which the handling unit 70 is configured by a gantry structure 72 as shown in FIG. 1 will be described. The gantry structure 72 includes an X-axis linear motion mechanism 73 having an XθZ-axis stage 74 that supports the workpiece W so as to be movable in the X-axis direction and rotatable in the yaw (θz) direction (around the Z-axis); A Y-axis linear motion mechanism 75 bridged over the X-axis linear motion mechanism 73 in the Y-axis direction, and a Z-axis linear motion mechanism 76 supported by the Y-axis linear motion mechanism 75 and movable in the Z-axis direction are provided. I have. The ATL head 10 is attached to an ATL head attachment portion 77 provided in the Z-axis direct-acting mechanism 76 (details will be described later).
 X軸直動機構73は、X軸ガイド部73aと、X軸ガイド部73aに摺動可能に取り付けられたX軸スライドテーブル73bと、X軸スライドテーブル73b上にヨー(θz)方向に回動自在に設けられたXθZ軸ステージ74とを含んで構成されている。そして、このXθZ軸ステージ74上にワークWが載置されるようになっている。すなわち、X軸直動機構73によりワークWをX軸方向に並進運動させることができ、XθZ軸ステージ74によりワークWをヨー(θz)方向に回動運動させることができるようになっている。 The X-axis linear motion mechanism 73 includes an X-axis guide portion 73a, an X-axis slide table 73b slidably attached to the X-axis guide portion 73a, and a yaw (θz) rotation on the X-axis slide table 73b. and an XθZ-axis stage 74 that is freely provided. A workpiece W is placed on the XθZ-axis stage 74 . That is, the X-axis linear motion mechanism 73 can translate the work W in the X-axis direction, and the XθZ-axis stage 74 can rotate the work W in the yaw (θz) direction.
 Y軸直動機構75は、門型の架台に取り付けられたY軸ガイド部75aと、Y軸ガイド部75aに摺動可能に取り付けられたY軸スライダ75bとを含んで構成されている。また、Z軸直動機構76は、Y軸スライダ75bに取り付けられたZ軸ガイド部76aと、Z軸ガイド部76aに摺動可能に取り付けられたZ軸スライダ76bと、Z軸スライダ76bに取り付けられたATLヘッド取付部77とを含んで構成されている。そして、ATLヘッド取付部77の下端部にATLヘッド10が取り付けられている。すなわち、Y軸直動機構75によりATLヘッド10をY軸方向に並進運動させることができ、Z軸直動機構76によりATLヘッド10をZ軸方向に移動させる(被貼付面Hに対して昇降させる)ことができるようになっている。 The Y-axis direct-acting mechanism 75 includes a Y-axis guide portion 75a attached to a gate-shaped base and a Y-axis slider 75b slidably attached to the Y-axis guide portion 75a. The Z-axis linear motion mechanism 76 includes a Z-axis guide portion 76a attached to the Y-axis slider 75b, a Z-axis slider 76b slidably attached to the Z-axis guide portion 76a, and a Z-axis slider 76b. and an ATL head attachment portion 77. The ATL head 10 is attached to the lower end of the ATL head attachment portion 77 . That is, the ATL head 10 can be translated in the Y-axis direction by the Y-axis linear motion mechanism 75, and the ATL head 10 can be moved in the Z-axis direction by the Z-axis linear motion mechanism 76 (elevating and lowering with respect to the surface H to be applied). It is designed to be able to
 本実施形態におけるATLヘッド10は、図2、図3に示すように被貼付面HにテープTを押し付ける押圧部20と、テープTを押圧部20に向かって送り出すフィーダー40と、このフィーダー40により送り出されたテープTと被貼付面Hの少なくともいずれかを加熱する加熱手段50と、押圧部20の押圧位置及び/又は押圧姿勢を被貼付面Hの形状に倣うように動作するパラレルリンク機構30とを備えている。これらATLヘッド10の各部の動作はATLヘッド制御部11により制御される(詳細は後述する)。 As shown in FIGS. 2 and 3, the ATL head 10 of this embodiment includes a pressing portion 20 for pressing the tape T against the surface H to be bonded, a feeder 40 for feeding the tape T toward the pressing portion 20, and the feeder 40. A heating means 50 that heats at least one of the fed tape T and the surface H to be adhered, and a parallel link mechanism 30 that operates so that the pressing position and/or posture of the pressing portion 20 follows the shape of the surface H to be adhered. and The operation of each section of the ATL head 10 is controlled by the ATL head control section 11 (details will be described later).
 押圧部20は、テープTを介して被貼付面Hを押圧し、テープTを被貼付面Hに圧着させるためのものであり、テープTを押圧する押圧ローラ21と、押圧ローラ21を回転可能に支持した状態でパラレルリンク機構30のエンド部32に取り付けられるローラ支持部23とを備えている。押圧ローラ21は、テープTの特性、又はワークWの材質などに応じて、樹脂ローラ、弾性ローラ、又は金属ローラなどで構成される。また、押圧ローラ21のサイズ(直径、幅)は、使用するテープTの種類やサイズ、ワークWの種類や形状に応じて適宜選択される。なお、別の構成例では、押圧ローラ21に代えて、押圧シュー等の押圧部材を用いてもよい。 The pressing part 20 presses the surface H to be stuck through the tape T, and presses the tape T against the surface H to be stuck. and a roller support portion 23 attached to the end portion 32 of the parallel link mechanism 30 in a state of being supported by the roller support portion 23 . The pressing roller 21 is composed of a resin roller, an elastic roller, a metal roller, or the like, depending on the characteristics of the tape T, the material of the work W, or the like. Further, the size (diameter, width) of the pressing roller 21 is appropriately selected according to the type and size of the tape T to be used and the type and shape of the workpiece W. Note that in another configuration example, a pressing member such as a pressing shoe may be used instead of the pressing roller 21 .
 フィーダー40は、テープTを搬送して押圧ローラ21と被貼付面Hとの間へとテープTを送り出すためのものであり、本実施形態では部材60を介して押圧ローラ21の回転軸部22に取り付けられている。このフィーダー40は、たとえば、一組の搬送ベルト対41を有しており、図示しないモータの動力により搬送ベルト対41を回転駆動させてテープTを搬送するようになっている。なお、フィーダー40は、ボビンからテープTを巻き出す巻き出し機構が搭載されたものでもよいし、予め所定の長さに裁断されたテープTを供給するものであってもよい。また、ATLヘッド10とは別に載置された巻き出し機構からテープを巻き出し、搬送経路にそってフィーダー40までテープTを供給する構成としてもよい。 The feeder 40 is for conveying the tape T to feed the tape T between the pressure roller 21 and the surface H to be adhered. attached to the The feeder 40 has, for example, a pair of conveying belts 41, and conveys the tape T by rotating the conveying belt pair 41 with the power of a motor (not shown). The feeder 40 may be equipped with an unwinding mechanism for unwinding the tape T from a bobbin, or may supply the tape T cut to a predetermined length in advance. Alternatively, the tape may be unwound from an unwinding mechanism mounted separately from the ATL head 10, and the tape T may be supplied to the feeder 40 along the transport path.
 加熱手段50は、フィーダー40により送りされたテープTと被貼付面Hの少なくともいずれかを加熱するためのものであり、テープTや被貼付面Hを非接触で加熱可能なもの、たとえば、赤外線ランプ、レーザー、IRランプなどの輻射光源や熱風ノズルなどの熱風源などで構成されるとよい。なお、加熱手段50は、必須の要素ではなく、テープTなどへの加熱処理が不要である場合は、ATLヘッド10に加熱手段を設けない構成としてもよいし、部材60に加熱手段50の着脱部を設けて、加熱手段50を着脱可能な構成としてもよい。 The heating means 50 is for heating at least one of the tape T fed by the feeder 40 and the surface H to be adhered, and is capable of heating the tape T and the surface H to be adhered in a non-contact manner. It may be composed of a radiation source such as a lamp, a laser, an IR lamp, or a hot air source such as a hot air nozzle. It should be noted that the heating means 50 is not an essential element. A portion may be provided to allow the heating means 50 to be detachable.
 パラレルリンク機構30は、被貼付面Hの形状に倣うように押圧部20の押圧位置及び/又は押圧姿勢を制御するためのものである。このパラレルリンク機構30は、図2、図3に示すようにハンドリング部70に取り付けられるベース部31と押圧部20が取り付けられるエンド部32と、ベース部31とエンド部32との間に並列に設けられる複数のリンク部33とを備えている。そして、これら複数のリンク部33の長さを制御することで押圧ローラ21の押圧位置及び/又は押圧姿勢を制御するようになっている。 The parallel link mechanism 30 is for controlling the pressing position and/or pressing posture of the pressing portion 20 so as to follow the shape of the surface H to be adhered. As shown in FIGS. 2 and 3, the parallel link mechanism 30 has a base portion 31 attached to the handling portion 70, an end portion 32 to which the pressing portion 20 is attached, and parallel links between the base portion 31 and the end portion 32. and a plurality of link portions 33 provided. By controlling the lengths of the plurality of link portions 33, the pressing position and/or pressing posture of the pressing roller 21 is controlled.
 各リンク部33は、自身の両端にユニバーサルジョイント、又は球面ジョイントなどの自在継手35a、35bと、これら自在継手の間に設けられ、流体の出し入れにより伸縮する荷重制御部34(詳細は後述する)とを備えている。この荷重制御部34が伸縮動作をすることで、リンク部33の長さが制御されるようになっている。すなわち、パラレルリンク機構30は、複数のリンク部33の各々の長さが荷重制御部34の伸縮動作によって制御されることにより、エンド部32の位置(並進3方向)や姿勢(回転3方向)を変化させることができるようになっている。すなわち、パラレルリンク機構30は、並進3方向(XYZ軸方向)、回転3方向(XYZ軸の各軸回り)に運動することで、押圧ローラ103の押圧位置や押圧姿勢を制御するようになっている。 Each link portion 33 has universal joints 35a and 35b such as a spherical joint at both ends of itself, and a load control portion 34 (details will be described later) which is provided between these universal joints and expands and contracts according to the inflow and outflow of fluid. and The length of the link portion 33 is controlled by the expansion and contraction of the load control portion 34 . That is, in the parallel link mechanism 30, the length of each of the plurality of link portions 33 is controlled by the expansion and contraction operation of the load control portion 34, so that the position (three directions of translation) and attitude (three directions of rotation) of the end portion 32 are controlled. can be changed. That is, the parallel link mechanism 30 moves in three translational directions (XYZ axis directions) and three rotational directions (around the XYZ axes) to control the pressing position and pressing posture of the pressing roller 103 . there is
 パラレルリンク機構30は、一般的に3本~6本のリンク部33で構成されるが、押圧ローラ21の押圧位置及び/又は押圧姿勢を被貼付面Hの形状に倣うように動作させることが可能であれば、リンク部33の本数は特に限定しない。なお、仮に、このリンク部33の本数を少なくした場合、パラレルリンク機構30の構成を簡素化することができ、リンク部33の本数を多くした場合、エンド部32に取り付けられる部品の支持力が高まり、パラレルリンク機構30の動作に伴うモーメントの影響を受けづらくすることができるようになっている。 The parallel link mechanism 30 is generally composed of three to six link portions 33, and the pressing position and/or pressing posture of the pressing roller 21 can be operated so as to follow the shape of the surface H to be adhered. If possible, the number of link portions 33 is not particularly limited. If the number of link portions 33 is reduced, the configuration of the parallel link mechanism 30 can be simplified. It is possible to make it difficult to be affected by the moment accompanying the operation of the parallel link mechanism 30 .
 荷重制御部34は、各々のリンク部33の長さを制御することで、押圧ローラ21の押圧位置及び/又は押圧姿勢を制御するためのものであり、自身が伸縮することで押圧ローラ21を所定の荷重で被貼付面Hに押し付けるためのものでもある。この荷重制御部34は、図3に示すように流体(本実施形態では、空気)が供給されるシリンダ部34aと、シリンダ部34aの内圧に応じて進退(変位)するロッド部34bとを備えている。また、ATLヘッド10は、シリンダ部34aの内圧を検出する圧力センサ34fと、ロッド部34bの変位を検出する変位センサ34c(たとえば、磁気式のリニアエンコーダなど)をさらに備えている。 The load control section 34 is for controlling the pressing position and/or the pressing posture of the pressing roller 21 by controlling the length of each link section 33 . It is also for pressing against the adhered surface H with a predetermined load. As shown in FIG. 3, the load control section 34 includes a cylinder section 34a to which fluid (in this embodiment, air) is supplied, and a rod section 34b that advances and retreats (displaces) according to the internal pressure of the cylinder section 34a. ing. The ATL head 10 further includes a pressure sensor 34f that detects the internal pressure of the cylinder portion 34a, and a displacement sensor 34c (for example, a magnetic linear encoder) that detects displacement of the rod portion 34b.
 シリンダ部34aは、圧力センサ34fを介してサーボバルブ34dに接続されている。サーボバルブ34dは、圧縮した空気を出力する空気圧供給部34e(たとえば、コンプレッサなど)に接続されており、シリンダ部34a内への空気の流量や排気量を調整し、シリンダ部34aの両室の圧力を制御できるようになっている。これにより、ロッド部34bの変位が制御されるようになっている。 The cylinder portion 34a is connected to a servo valve 34d via a pressure sensor 34f. The servo valve 34d is connected to an air pressure supply section 34e (for example, a compressor) that outputs compressed air, and adjusts the flow rate and exhaust amount of air into the cylinder section 34a, thereby controlling both chambers of the cylinder section 34a. It is possible to control the pressure. Thereby, the displacement of the rod portion 34b is controlled.
 圧力センサ34fで検出された圧力信号と、変位センサ34cで検出された変位信号は、それぞれATLヘッド制御部11に出力される。このATLヘッド制御部11は、たとえば汎用のコンピュータ装置により構成されており、ワークWの被貼付面Hの3次元形状データの他、これら3次元座標データ、圧力信号、変位信号などに基づいてATLヘッド10各部の動作を制御するプログラムなどが記憶されている。 The pressure signal detected by the pressure sensor 34f and the displacement signal detected by the displacement sensor 34c are output to the ATL head control section 11, respectively. The ATL head control unit 11 is composed of, for example, a general-purpose computer device, and controls the ATL based on the three-dimensional shape data of the adhered surface H of the work W, the three-dimensional coordinate data, the pressure signal, the displacement signal, and the like. Programs and the like for controlling the operation of each part of the head 10 are stored.
 ATLヘッド制御部11は、たとえば、圧力センサ34fや変位センサ34cから取り込んだ検出信号を制御パラメータとして用いて、各荷重制御部34のサーボバルブ34dの動作を制御し、各荷重制御部34のシリンダ部34aの内圧、及び/又はロッド部34bの変位を制御する処理を実行する。これにより、エンド部の位置(並進)や姿勢(回転)を変化させて、押圧ローラ21の押圧位置及び/又は押圧姿勢が被貼付面Hの形状に倣うように駆動制御できるようになっている。すなわち、被貼付面Hに対する押圧ローラ21の押圧方向(荷重方向)が法線方向(被貼付面Hに対して直交する方向)となるように制御できる。これにより、押圧ローラ21により均一な荷重を付与することが可能となる。また、前述した被貼付面Hの3次元座標データと実際の被貼付面Hとの間に形状誤差があった場合であっても、形状誤差を吸収するよう押圧ローラ21の押圧位置及び/又は押圧姿勢を柔軟に制御することができるので、押圧ローラ21による被貼付面HへのテープTの押圧状態を一定に保つことが可能となる。したがって、テープTを被貼付面Hに精度よく貼り付けることができる。 The ATL head control unit 11 controls the operation of the servo valve 34d of each load control unit 34 using, for example, the detection signal received from the pressure sensor 34f or the displacement sensor 34c as a control parameter, and controls the operation of the cylinder of each load control unit 34. Processing is performed to control the internal pressure of the portion 34a and/or the displacement of the rod portion 34b. As a result, by changing the position (translation) and posture (rotation) of the end portion, the pressing position and/or the pressing posture of the pressing roller 21 can be driven and controlled so as to follow the shape of the surface H to be adhered. . That is, it is possible to control the pressing direction (load direction) of the pressing roller 21 against the surface H to be adhered so as to be in the normal direction (direction orthogonal to the surface H to be adhered). This makes it possible to apply a more uniform load to the pressing roller 21 . Further, even if there is a shape error between the three-dimensional coordinate data of the pasting surface H described above and the actual pasting surface H, the pressing position and/or position of the pressure roller 21 can be adjusted so as to absorb the shape error. Since the pressing posture can be flexibly controlled, the pressing state of the tape T against the surface H to be stuck by the pressing roller 21 can be kept constant. Therefore, the tape T can be adhered to the surface H to be adhered with high precision.
 上記のようなハンドリング部70と、ATLヘッド10とを備えるATL装置1により、テープTを押圧し、押圧ローラ21の押圧位置及び/又は押圧姿勢を制御しながらテープTをワークWの被貼付面Hに貼り付けることができる。 The tape T is pressed by the ATL device 1 including the handling unit 70 and the ATL head 10 as described above, and the tape T is applied to the surface of the workpiece W while controlling the pressing position and/or pressing attitude of the pressing roller 21. It can be attached to H.
 ATL装置1の動作について説明する。まず、ハンドリング部70、本実施形態では、ガントリ構造体72のX軸直動機構73、XθZ軸ステージ74およびY軸直動機構75により、ATLヘッド10を被貼付面H上の起点S上に位置決めする。次いで、Z軸直動機構76により、ATLヘッド10を被貼付面Hに向かって降下させ、押圧ローラ21を被貼付面H上の起点Sに接触させる。そして、押圧ローラ21を所定の荷重で被貼付面Hに押し付ける。この押圧ローラ21を所定の荷重で被貼付面Hに押し付けるまでの動作を本実施形態では、第1の動作モードとする。そして、Y軸直動機構75によりATLヘッド10を被貼付面Hに対して相対移動(被貼付面H上の終点Eまで)させながらテープTを押圧して被貼付面Hに貼り付ける。このATLヘッド10が被貼付面H上の起点Sから終点Eまで移動させられながら、テープTを押圧して被貼付面Hに貼り付ける一連の動作を本実施形態では、第2の動作モードとする。この第2の動作モード時に、押圧ローラ21の押圧位置及び/又は押圧姿勢を被貼付面Hの形状に倣うよう動作させるために、パラレルリンク機構30の各荷重制御部34の機械インピーダンスを比較的小さくしている。すなわち、第1の動作モードと第2の動作モードとで機械インピーダンスを異ならせ(切り替え)、各リンク部33の長さを変化させやすくしている。 The operation of the ATL device 1 will be explained. First, the handling unit 70, in this embodiment, the X-axis linear motion mechanism 73, the XθZ-axis stage 74, and the Y-axis linear motion mechanism 75 of the gantry structure 72 move the ATL head 10 onto the starting point S on the surface H to be adhered. position. Next, the Z-axis direct-acting mechanism 76 lowers the ATL head 10 toward the surface H to be adhered, and brings the pressure roller 21 into contact with the starting point S on the surface H to be adhered. Then, the pressing roller 21 is pressed against the adhered surface H with a predetermined load. In this embodiment, the operation until the pressure roller 21 is pressed against the surface H to be adhered with a predetermined load is referred to as a first operation mode. Then, the Y-axis direct-acting mechanism 75 moves the ATL head 10 relative to the surface H to be applied (to the end point E on the surface H to be applied) while pressing the tape T to adhere it to the surface H to be applied. In the present embodiment, a series of operations for pressing the tape T and applying it to the surface H to be applied while the ATL head 10 is moved from the starting point S to the end point E on the surface H to be applied is referred to as a second operation mode. do. In this second operation mode, the mechanical impedance of each load control section 34 of the parallel link mechanism 30 is relatively adjusted so that the pressing position and/or the pressing posture of the pressing roller 21 follow the shape of the surface H to be adhered. making it smaller. That is, the mechanical impedance is differentiated (switched) between the first operation mode and the second operation mode, making it easier to change the length of each link portion 33 .
 ここでいう、機械インピーダンスとは、機械構造物に周期的な加振力を加えたときの力と構造物上のある点の応答速度の比のことで、振動の応答特性、つまり力を加えたときの物質(本発明では、荷重制御部34)の動きにくさのことである。この荷重制御部34の動きにくさの度合を本発明では、機械インピーダンスの大小で表す。すなわち、本実施形態では、荷重制御部34の機械インピーダンスが大きくなると荷重制御部34が伸縮しにくくなり、荷重制御部34の機械インピーダンスが小さくなると荷重制御部34が伸縮しやすくなる。ここで、本実施形態のように複数の荷重制御部34を有する構成においては、各荷重制御部34の機械インピーダンスを大きくすることで、パラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きにくくなり、各荷重制御部34の機械インピーダンスを小さくすることで、パラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きやすくなる。 The mechanical impedance referred to here is the ratio of the response speed at a certain point on the structure to the force when a periodic excitation force is applied to the mechanical structure. It means the difficulty of movement of a substance (in the present invention, the load control section 34) when it is pressed. In the present invention, the degree of difficulty in movement of the load control section 34 is represented by the magnitude of the mechanical impedance. That is, in the present embodiment, when the mechanical impedance of the load control section 34 increases, the load control section 34 is less likely to expand and contract, and when the mechanical impedance of the load control section 34 decreases, the load control section 34 expands and contracts more easily. Here, in the configuration having a plurality of load control units 34 as in the present embodiment, by increasing the mechanical impedance of each load control unit 34, all operations of the parallel link mechanism 30 (such as the position of the pressure roller 21 and the By reducing the mechanical impedance of each load control unit 34, movement becomes easier in all operations of the parallel link mechanism 30 (control of the position and attitude of the pressure roller 21).
 ここで、本発明では、ATLヘッド10が、機械インピーダンス調節部(不図示)をさらに備えている。機械インピーダンス調節部は、荷重制御部34の機械インピーダンスを調節するためのものである。この機械インピーダンス調節部は、機械インピーダンスが第1の動作モード時と第2の動作モード時のそれぞれで最適となるよう、機械インピーダンスを調節するようになっている。なお、本実施形態では、サーボバルブ34dが機械インピーダンス調節部である。この機械インピーダンス調節部は、各荷重制御部34のシリンダ部34aの内圧を制御することで、荷重制御部34の機械インピーダンスを調節している(シリンダ部34aの内圧が大きくなると荷重制御部34の機械インピーダンスが大きくなり、シリンダ部34aの内圧が小さくなると荷重制御部34の機械インピーダンスが小さくなる)。なお、ここでいうシリンダ部34aの内圧とは、シリンダ部34a内の両室の圧力の和を指す。 Here, in the present invention, the ATL head 10 further includes a mechanical impedance adjuster (not shown). The mechanical impedance adjuster is for adjusting the mechanical impedance of the load controller 34 . The mechanical impedance adjustment section adjusts the mechanical impedance so that the mechanical impedance is optimized in each of the first operation mode and the second operation mode. In addition, in this embodiment, the servo valve 34d is a mechanical impedance adjustment unit. The mechanical impedance adjustment section adjusts the mechanical impedance of the load control section 34 by controlling the internal pressure of the cylinder section 34a of each load control section 34 (when the internal pressure of the cylinder section 34a increases, the load control section 34 When the mechanical impedance increases and the internal pressure of the cylinder portion 34a decreases, the mechanical impedance of the load control portion 34 decreases). It should be noted that the internal pressure of the cylinder portion 34a here refers to the sum of the pressures of both chambers within the cylinder portion 34a.
 そして、本発明では、機械インピーダンス調節部により第1の動作モードにおける各荷重制御部34のシリンダ部34aの内圧が、第2の動作モードにおける各荷重制御部34のシリンダ部34aの内圧よりも大きくなるよう制御される。すなわち、第1の動作モードにおける各荷重制御部34のシリンダ部34aの内圧P(図3を参照)と第2の動作モードにおける各荷重制御部34のシリンダ部34aの内圧P(図4を参照)との関係が少なくとも内圧P>内圧Pとなるようモードごとに各荷重制御部34のシリンダ部34aの内圧が制御されている。すなわち、第1の動作モードにおける各荷重制御部34の機械インピーダンスが、第2の動作モードにおける各荷重制御部34の機械インピーダンスよりも大きくなっている。これにより、第1の動作モード時にパラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きにくくなるので、押圧ローラ21がふらつくことを防ぐことができ、位置ずれを生じさせることなく、押圧ローラ21を起点Sに接触させることができる。すなわち、テープTを所定位置で精度よく押圧することができるようになっている。 In the present invention, the internal pressure of the cylinder portion 34a of each load control portion 34 in the first operation mode is made larger by the mechanical impedance adjustment portion than the internal pressure of the cylinder portion 34a of each load control portion 34 in the second operation mode. controlled to be That is, the internal pressure P 1 of the cylinder portion 34a of each load control portion 34 in the first operation mode (see FIG. 3) and the internal pressure P 2 of the cylinder portion 34a of each load control portion 34 in the second operation mode (see FIG. 4) ), the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled for each mode so that at least the relationship of internal pressure P 1 >internal pressure P 2 is satisfied. That is, the mechanical impedance of each load control section 34 in the first operation mode is higher than the mechanical impedance of each load control section 34 in the second operation mode. This makes it difficult to move the parallel link mechanism 30 in all operations (control of the position and attitude of the pressure roller 21) in the first operation mode, so that the pressure roller 21 can be prevented from wobbling and displacement. The pressure roller 21 can be brought into contact with the starting point S without causing the pressure roller 21 to contact the starting point S. That is, the tape T can be accurately pressed at a predetermined position.
 一方で、第2の動作モード時には、各荷重制御部34の機械インピーダンスが第1の動作モードにおける各荷重制御部34の機械インピーダンスよりも小さくなっている。これにより、パラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きやすくなるので、押圧ローラ21が被貼付面Hの形状に倣うようにパラレルリンク機構30の動作を制御することができるようになっている。すなわち、被貼付面Hに対して押圧ローラ21の押圧方向を常に法線方向にすることが可能であり、テープTへの押圧力が過不足することを防ぐことができる。これらにより、テープTを被貼付面Hにより精度よく貼り付けることが可能となる。 On the other hand, in the second operation mode, the mechanical impedance of each load control section 34 is smaller than the mechanical impedance of each load control section 34 in the first operation mode. As a result, all the operations of the parallel link mechanism 30 (control of the position and attitude of the pressure roller 21) are facilitated, so the operation of the parallel link mechanism 30 is controlled so that the pressure roller 21 follows the shape of the surface H to be adhered. You can do it. That is, the pressing direction of the pressing roller 21 can always be the normal direction with respect to the surface H to be stuck, and it is possible to prevent excess or deficiency of the pressing force on the tape T. FIG. As a result, the tape T can be adhered to the surface H to be adhered with higher accuracy.
 このように、上記実施形態におけるATL装置1によれば、機械インピーダンス調節部が、第1の動作モード時と第2の動作モード時のそれぞれで荷重制御部34の機械インピーダンスを最適値になるよう調節するので、第1の動作モード時には、押圧ローラ21がふらつくことを防ぐことができ、押圧ローラ21が位置ずれすることなく、テープTを被貼付面H上の起点Sに接触させて押圧することが可能となる。また、第2の動作モード時には、押圧ローラ21が被貼付面Hの形状に倣うようにパラレルリンク機構30の動作を制御することができるので、被貼付面Hに対して押圧ローラ21の押圧方向を常に法線方向にすることができ、押圧力が過不足することを防ぐことが可能となる。したがって、テープTを所定位置に精度よく貼り付けることが可能となる。すなわち、従来のATL装置と比べてテープTの貼り付け精度を向上させることができる。 As described above, according to the ATL device 1 of the above-described embodiment, the mechanical impedance adjustment section adjusts the mechanical impedance of the load control section 34 to the optimum value in each of the first operation mode and the second operation mode. Since the pressure roller 21 is adjusted, it is possible to prevent the pressure roller 21 from wobbling in the first operation mode, and the pressure roller 21 is brought into contact with and pressed against the starting point S on the surface H to be adhered without being displaced. becomes possible. Further, in the second operation mode, the operation of the parallel link mechanism 30 can be controlled so that the pressure roller 21 follows the shape of the surface H to be adhered. can always be in the normal direction, and it is possible to prevent excessive or insufficient pressing force. Therefore, it becomes possible to stick the tape T to a predetermined position with high precision. That is, the accuracy of attaching the tape T can be improved as compared with the conventional ATL device.
 (テープ貼付方法)
 以下、本発明の一実施形態に係るATL装置1を用いたテープ貼付方法について、図5を参照しながら説明する。なお、前述した装置構成と同様な構成については同様の符号を付し、詳細な説明は省略する。なお、下記ステップS3を第1の動作工程、ステップS4からステップS6を第2の動作工程として説明する。
(Tape application method)
A tape applying method using the ATL device 1 according to one embodiment of the present invention will be described below with reference to FIG. In addition, the same reference numerals are given to the same configurations as those of the apparatus described above, and detailed description thereof will be omitted. Note that step S3 below will be described as a first operation process, and steps S4 to S6 will be described as a second operation process.
 本実施形態におけるテープ貼付方法は、まずロボット制御部71が、ハンドリング部70、本実施形態ではガントリ構造体72のX軸直動機構73を動作させて、ワークWが載置されたXθZ軸ステージ74をX軸方向に移動させ、Y軸直動機構75を動作させてワークWの被貼付面Hの起点Sの直上に押圧ローラ21が配置されるようにATLヘッド10を移動させる(ステップS1)。このとき、必要に応じて、始点Sから終点Eまで、押圧ローラ21が移動する軌跡が直線になるよう、XθZ軸ステージ74を回動させる。 In the tape applying method in this embodiment, first, the robot control unit 71 operates the handling unit 70, and in this embodiment, the X-axis direct-acting mechanism 73 of the gantry structure 72, thereby moving the XθZ-axis stage on which the workpiece W is placed. 74 is moved in the X-axis direction, and the Y-axis direct-acting mechanism 75 is operated to move the ATL head 10 so that the pressure roller 21 is positioned immediately above the starting point S of the surface H of the workpiece W (step S1). ). At this time, the XθZ-axis stage 74 is rotated so that the trajectory along which the pressure roller 21 moves from the start point S to the end point E becomes a straight line, if necessary.
 次に、機械インピーダンス調節部により各荷重制御部34のシリンダ部34aの内圧を制御し、各荷重制御部34の機械インピーダンスを第2の動作工程における各荷重制御部34の機械インピーダンスよりも大きくする(ステップS2)。そして、Z軸直動機構76により押圧ローラ21を被貼付面Hに向かって降下させ、押圧ローラ21を被貼付面H上の起点Sに接触させて所定の荷重で押し付ける(ステップS3)。 Next, the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled by the mechanical impedance adjustment portion to make the mechanical impedance of each load control portion 34 larger than the mechanical impedance of each load control portion 34 in the second operation step. (Step S2). Then, the Z-axis direct-acting mechanism 76 lowers the pressure roller 21 toward the surface H to be adhered, bringing the pressure roller 21 into contact with the starting point S on the surface H to be adhered and pressing it with a predetermined load (step S3).
 次に、機械インピーダンス調節部により各荷重制御部34のシリンダ部34aの内圧を制御し、各荷重制御部34の機械インピーダンスを第1の動作工程における各荷重制御部34の機械インピーダンスよりも小さくする(ステップS4)。 Next, the internal pressure of the cylinder portion 34a of each load control portion 34 is controlled by the mechanical impedance adjustment portion to make the mechanical impedance of each load control portion 34 smaller than the mechanical impedance of each load control portion 34 in the first operation step. (Step S4).
 次に、ATLヘッド制御部11が、ATLヘッド10の各部を動作させて被貼付面HへのテープTの貼り付けを開始し、テープTを被貼付面H上の起点Sから終点Eまで貼り付けていく(ステップS5)。具体的には、ATLヘッド制御部11は、フィーダー40を動作させて、テープTを押圧ローラ21と被貼付面Hの間へと搬送する。また、ATLヘッド制御部11は、パラレルリンク機構30を動作させて(必要であれば、ロボット制御部71によりガントリ構造体72も動作させてもよい)、押圧ローラ21によりテープTを被貼付面Hに押し付ける。さらに、ATLヘッド制御部11は、加熱手段50による加熱処理を開始し、テープT及び/又は被貼付面Hの加熱を行う。そして、ATLヘッド制御部11が、パラレルリンク機構30による押圧ローラ21の押圧位置及び/又は押圧姿勢の動作制御を行う。また、ロボット制御部71が、ガントリ構造体72の動作の制御を行う。これらATLヘッド制御部11とロボット制御部71の制御により、ATLヘッド10は、被貼付面Hに対して相対移動することによってテープTを被貼付面Hに貼り付けていく。すなわち、被貼付面H上の起点Sから終点EまでのテープTの貼付経路に沿ってテープTを被貼付面Hに貼り付けていく。このとき、押圧ローラ21の押圧位置及び/又は押圧姿勢が被貼付面Hの形状に倣うようにパラレルリンク機構30の各部の動作を制御する。 Next, the ATL head control unit 11 operates each part of the ATL head 10 to start applying the tape T to the application surface H, and apply the tape T from the starting point S to the end point E on the application surface H. It is added (step S5). Specifically, the ATL head control section 11 operates the feeder 40 to convey the tape T between the pressure roller 21 and the surface H to be adhered. In addition, the ATL head control unit 11 operates the parallel link mechanism 30 (if necessary, the robot control unit 71 may also operate the gantry structure 72), and the pressure roller 21 presses the tape T onto the application surface. Press H. Further, the ATL head controller 11 starts heat treatment by the heating means 50 to heat the tape T and/or the surface H to be adhered. Then, the ATL head control unit 11 controls the operation of the pressing position and/or pressing posture of the pressing roller 21 by the parallel link mechanism 30 . Also, the robot control unit 71 controls the operation of the gantry structure 72 . Under the control of the ATL head control section 11 and the robot control section 71, the ATL head 10 adheres the tape T to the surface H to be applied by moving relative to the surface H to be applied. That is, the tape T is adhered to the surface H to be adhered along the application route of the tape T from the starting point S to the end point E on the surface H to be adhered. At this time, the operation of each part of the parallel link mechanism 30 is controlled so that the pressing position and/or pressing attitude of the pressing roller 21 follow the shape of the surface H to be adhered.
 次に、押圧ローラ21が、被貼付面H上の終点Eに到達したときテープTの貼り付け動作を完了する処理を行う(ステップ6)。具体的には、ATLヘッド制御部11が、押圧ローラ21が終点Eに到達したか否かを判断し、終点Eに到達していないと判断すれば、図5のステップS5を継続する一方、終点Eに到達したと判断すれば、貼り付け動作を完了する処理を行う。すなわち、ATLヘッド制御部11がフィーダー40に設けられた切断部(不図示)によりテープTを切断する制御、加熱手段50による加熱動作の停止制御、及び押圧ローラ21により押圧動作の解除制御を行い、1ライン分のテープTの貼り付けを終了する。 Next, when the pressure roller 21 reaches the end point E on the surface H to be adhered, the process of completing the application operation of the tape T is performed (step 6). Specifically, the ATL head control unit 11 determines whether or not the pressure roller 21 has reached the end point E. If it is determined that the pressure roller 21 has not reached the end point E, then step S5 in FIG. If it is determined that the end point E has been reached, processing is performed to complete the pasting operation. That is, the ATL head control unit 11 performs control to cut the tape T by a cutting unit (not shown) provided in the feeder 40, control to stop the heating operation by the heating means 50, and control to cancel the pressing operation by the pressing roller 21. , completes the application of the tape T for one line.
 そして、被貼付面HへのテープTの貼り付けが、すべて完了したか否かを判断し、すべて完了していないと判断すればステップS1に戻り、ガントリ構造体72によりATLヘッド10を次の起点Sの直上に移動させて、被貼付面HのテープTを順次並べて貼り付けていく制御を行う。一方、すべて完了したと判断すれば、すべての動作を終了する。 Then, it is determined whether or not the application of the tape T to the surface H to be applied has been completed. Control is performed such that the tape T on the surface H to be applied is sequentially arranged and applied by moving the tape T directly above the starting point S. On the other hand, if it is determined that all have been completed, all operations are terminated.
 上記テープ貼付方法では、第1の動作工程と第2の動作工程のそれぞれで荷重制御部34の機械インピーダンスが最適値になるよう調節するので、第1の動作工程では、パラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きにくくなる。これにより、押圧ローラ21がふらつくことを防ぐことができるので、押圧ローラ21が位置ずれすることなく、テープTを被貼付面H上の起点Sに接触させて押圧することが可能となる。また、第2の動作工程では、パラレルリンク機構30のすべての動作(押圧ローラ21の位置や姿勢の制御)において動きやすくなる。これにより、押圧ローラ21が被貼付面Hの形状に倣うようにパラレルリンク機構30の動作を制御することができるので、被貼付面Hに対して押圧ローラ21の押圧方向を常に法線方向にすることができ、押圧力が過不足することを防ぐことが可能となる。したがって、テープTを所定位置に精度よく貼り付けることが可能となる。すなわち、従来のテープ貼付方法と比べてテープTの貼り付け精度を向上させることができる。 In the tape application method, the mechanical impedance of the load control unit 34 is adjusted to the optimum value in each of the first operation process and the second operation process. movement (control of the position and attitude of the pressing roller 21). As a result, the pressure roller 21 can be prevented from swaying, so that the tape T can be brought into contact with and pressed against the starting point S on the surface H to be adhered without the position of the pressure roller 21 shifting. Further, in the second operation process, all the operations of the parallel link mechanism 30 (control of the position and attitude of the pressure roller 21) become easy to move. As a result, the operation of the parallel link mechanism 30 can be controlled so that the pressure roller 21 follows the shape of the surface H to be adhered. It is possible to prevent excessive or insufficient pressing force. Therefore, it becomes possible to stick the tape T to a predetermined position with high precision. That is, the accuracy of attaching the tape T can be improved as compared with the conventional tape attaching method.
 以上、本発明の実施形態について図面を参照しながら詳述したが、上記実施形態における構成、及びそれらの組み合わせ等は一例であり、本発明の趣旨から逸脱しない範囲内で、構成の追加、省略、置換、及びその他の変更が可能である。たとえば、上記実施形態では、ATLヘッド10が、パラレルリンク機構30を備えているものを例に説明したが、ATLヘッド10がパラレルリンク機構30を備えずに、一つの荷重制御部34のみを備えているものであってもよい。たとえば、図6に示すようにATLヘッド10が、ハンドリング部70と押圧ローラ21との間に一つの荷重制御部34を備えている構成をしてもよい。このような場合であっても、第1の動作モード(第1の動作工程)の直前に機械インピーダンス調節部により、各荷重制御部34の機械インピーダンスを第2の動作モード(第2の動作工程)時における荷重制御部34の機械インピーダンスよりも大きくすることで、押圧ローラ21のふらつきを防ぐことができる。これにより、第1の動作モード時にテープTを位置ずれすることなく、起点Sに接触させることが可能となる。 As described above, the embodiments of the present invention have been described in detail with reference to the drawings. , substitutions, and other modifications are possible. For example, in the above embodiment, the ATL head 10 has the parallel link mechanism 30, but the ATL head 10 does not have the parallel link mechanism 30 and only has one load control unit 34. It may be something that is For example, as shown in FIG. 6, the ATL head 10 may be configured to have one load control section 34 between the handling section 70 and the pressing roller 21 . Even in such a case, the mechanical impedance adjustment section adjusts the mechanical impedance of each load control section 34 to the second operation mode (second operation process) immediately before the first operation mode (first operation process). ), it is possible to prevent the pressure roller 21 from wobbling. As a result, the tape T can be brought into contact with the starting point S without being displaced in the first operation mode.
 また、上記実施形態では、荷重制御部34のシリンダ部34aの内圧が、空気の出し入れにより制御されることを例に説明したが、流体であればこれに限られない(たとえば、油などの液体など)。また、機械インピーダンス調節部はサーボバルブ34dに限られない(たとえば、電空レギュレータなど)。 Further, in the above-described embodiment, the internal pressure of the cylinder portion 34a of the load control portion 34 is controlled by taking air in and out. Such). Also, the mechanical impedance adjustment unit is not limited to the servo valve 34d (for example, an electropneumatic regulator or the like).
 また、上記実施形態では、機械インピーダンス調節部がサーボバルブ34dであり、各荷重制御部34のシリンダ部34aの内圧を制御することで、各荷重制御部34の機械インピーダンスを調節する例について説明したが、各荷重制御部34の伸縮動作を外部からロックするものであってもよい。たとえば、図7(a)、図7(b)に示すように機械インピーダンス調節部は、たとえばクランプ36で構成されてもよい。そして、第1の動作モード時には、図7(a)に示すように各荷重制御部34のロッド部34bをクランプ36によりロックすることで、荷重制御部34の機械インピーダンスを第2の動作モードにおける荷重制御部34の機械インピーダンスよりも大きくする。一方、第2の動作モード時には、図7(b)に示すように各荷重制御部34のロッド部34bのロックを解除するようになっている。 Further, in the above-described embodiment, the example in which the mechanical impedance adjustment unit is the servo valve 34d and the mechanical impedance of each load control unit 34 is adjusted by controlling the internal pressure of the cylinder portion 34a of each load control unit 34 has been described. However, the expansion/contraction operation of each load control unit 34 may be locked from the outside. For example, as shown in FIGS. 7(a) and 7(b), the mechanical impedance adjuster may be composed of clamps 36, for example. In the first operation mode, the rod portion 34b of each load control portion 34 is locked by a clamp 36 as shown in FIG. 7A, so that the mechanical impedance of the load control portion 34 is reduced to It is made larger than the mechanical impedance of the load control section 34 . On the other hand, in the second operation mode, as shown in FIG. 7(b), the rod portion 34b of each load control portion 34 is unlocked.
 また、上記実施形態では、機械インピーダンス調節部による荷重制御部34の機械インピーダンスを第2の動作モード(第2の動作工程)における荷重制御部34の機械インピーダンスよりも大きくなるよう調節する制御は、第1の動作モード(第1の動作工程)の直前に行うことを例に説明したが、これに限られず、少なくとも押圧ローラ21が被貼付面Hに接触させられ、所定の荷重で押し付けられるまでに行われるとよい。 Further, in the above embodiment, the control of adjusting the mechanical impedance of the load control section 34 by the mechanical impedance adjustment section so as to be greater than the mechanical impedance of the load control section 34 in the second operation mode (second operation process) is An example of performing immediately before the first operation mode (first operation step) has been described, but the present invention is not limited to this, at least until the pressure roller 21 is brought into contact with the surface H to be adhered and pressed with a predetermined load. It should be done on
 また、第1の動作モード(第1の動作工程)と第2の動作モード(第2の動作工程)とで、それぞれ最適な動作をさせるために少なくとも機械インピーダンスが異なっていればよい。場合によっては第1の動作モード(第1の動作工程)における機械インピーダンスが第2の動作モード(第2の動作工程)における機械インピーダンスよりも大きくなっていてもよい。 In addition, at least the mechanical impedance should be different between the first operation mode (first operation process) and the second operation mode (second operation process) for optimum operation. In some cases, the mechanical impedance in the first operation mode (first operation process) may be higher than the mechanical impedance in the second operation mode (second operation process).
 また、上記実施形態では、フィーダー40が部材60を介して押圧ローラ21の回転軸部22に取り付けられているものを例に説明したが、この部材60が回動部材60であってもよい。具体的には、図3に示すように回動部材60が、押圧ローラ21の回転軸部22に回動可能に取り付けられている。この回動部材60には、回動動作部80と連結するための回動継手83が設けられている。そして、回動動作部80は、エンド部32上にベース部31に向けて立設される直動動作手段81と、この直動動作手段81が有するシリンダ部81a内の圧力を制御してロッド部81bを変位させることで上下方向に直動される直動部材82と、直動部材82と回動部材60との間に、両端が回動継手83を介して回動可能に取り付けられるリンクアーム84とを備えている。これにより、パラレルリンク機構30の動作に合わせて、フィーダー40の姿勢を制御することができる。 Further, in the above embodiment, the feeder 40 is attached to the rotating shaft portion 22 of the pressing roller 21 via the member 60, but the member 60 may be a rotating member 60. Specifically, as shown in FIG. 3, the rotating member 60 is rotatably attached to the rotating shaft portion 22 of the pressing roller 21 . The rotary member 60 is provided with a rotary joint 83 for coupling with the rotary motion part 80 . The rotary motion unit 80 includes a linear motion means 81 erected on the end portion 32 toward the base portion 31, and a cylinder portion 81a of the linear motion means 81, which controls the pressure in the rod. A link whose both ends are rotatably attached via a rotary joint 83 between a linear motion member 82 that is linearly moved in the vertical direction by displacing the portion 81b and between the linear motion member 82 and the rotary member 60 arm 84; Thereby, the attitude of the feeder 40 can be controlled according to the operation of the parallel link mechanism 30 .
 1 ATL装置(テープ貼付装置)
 10 ATLヘッド(貼付ヘッド)
 11 ATLヘッド制御部
 20 押圧部
 21 押圧ローラ
 22 回転軸部
 23 ローラ支持部
 30 パラレルリンク機構
 31 ベース部
 32 エンド部
 33 リンク部
 34 荷重制御部
 34a シリンダ部
 34b ロッド部
 34c 変位センサ
 34d サーボバルブ
 34e 空気圧供給部
 34f 圧力センサ
 35a、35b 自在継手
 36 クランプ
 40 フィーダー(搬送手段)
 41 搬送ベルト対
 50 加熱手段
 60 部材(回動部材)
 70 ハンドリング部
 71 ロボット制御部
 72 ガントリ構造体
 73 X軸直動機構
 73a X軸ガイド部
 73b X軸スライドテーブル
 74 XθZ軸ステージ
 75 Y軸直動機構
 75a Y軸ガイド部
 75b Y軸スライダ
 76 Z軸直動機構
 76a Z軸ガイド部
 76b Z軸スライダ
 77 ATLヘッド取付部
 78 多関節ロボット
 80 回動動作部
 81 直動動作手段
 81a シリンダ部
 81b ロッド部
 82 直動部材
 83 回動継手
 84 リンクアーム
 T テープ
 W ワーク
 H 被貼付面
 S 起点
 E 終点
 P 内圧
 P 内圧
1 ATL device (tape applying device)
10 ATL head (pasting head)
11 ATL head control section 20 pressing section 21 pressing roller 22 rotating shaft section 23 roller support section 30 parallel link mechanism 31 base section 32 end section 33 link section 34 load control section 34a cylinder section 34b rod section 34c displacement sensor 34d servo valve 34e air pressure Supply unit 34f Pressure sensor 35a, 35b Universal joint 36 Clamp 40 Feeder (conveying means)
41 conveyor belt pair 50 heating means 60 member (rotating member)
70 handling unit 71 robot control unit 72 gantry structure 73 X-axis linear motion mechanism 73a X-axis guide unit 73b X-axis slide table 74 XθZ-axis stage 75 Y-axis linear motion mechanism 75a Y-axis guide unit 75b Y-axis slider 76 Z-axis linear motion mechanism Motion mechanism 76a Z-axis guide part 76b Z-axis slider 77 ATL head mounting part 78 Articulated robot 80 Rotating motion part 81 Linear motion means 81a Cylinder part 81b Rod part 82 Linear motion member 83 Rotating joint 84 Link arm T Tape W Work H Attachment surface S Start point E End point P1 internal pressure P2 internal pressure

Claims (7)

  1.  テープを被貼付面に押圧する貼付ヘッドと、
     前記貼付ヘッドが取り付けられ、前記貼付ヘッドの押圧位置を制御するハンドリング部と、を有するテープ貼付装置であって、
     前記貼付ヘッドは、前記被貼付面に前記テープを押し付ける押圧部と、
     前記ハンドリング部と前記押圧部との間に設けられ、前記押圧部の押し付ける力を制御する荷重制御部と、
     前記荷重制御部の機械インピーダンスを調節する機械インピーダンス調節部と、を備えており、
     所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作モードと、
     前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作モードと、を有しており、
     前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の機械インピーダンスと前記第2の動作モードにおける前記荷重制御部の機械インピーダンスを異なる機械インピーダンスに調節することを特徴とするテープ貼付装置。
    a sticking head that presses the tape against a surface to be stuck;
    A tape applying device including a handling section to which the applying head is attached and which controls a pressing position of the applying head,
    The sticking head includes a pressing portion that presses the tape against the sticking surface;
    a load control unit provided between the handling unit and the pressing unit for controlling the pressing force of the pressing unit;
    a mechanical impedance adjustment unit that adjusts the mechanical impedance of the load control unit,
    a first operation mode until the pressing portion is pressed against the surface to be adhered with a predetermined load;
    a second operation mode in which the tape is attached to the surface to be attached by moving the pressing portion relative to the surface to be attached;
    The mechanical impedance adjuster adjusts the mechanical impedance of the load controller in the first operation mode and the mechanical impedance of the load controller in the second operation mode to different mechanical impedances. Device.
  2.  前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の機械インピーダンスが前記第2の動作モードにおける前記荷重制御部の機械インピーダンスよりも大きくなるよう調節することを特徴とする請求項1に記載のテープ貼付装置。 3. The mechanical impedance adjustment section adjusts the mechanical impedance of the load control section in the first operation mode so that the mechanical impedance of the load control section in the second operation mode is higher than the mechanical impedance of the load control section. 2. The tape applying device according to 1.
  3.  前記貼付ヘッドは、前記押圧部の押圧位置及び/又は押圧姿勢を制御するパラレルリンク機構を備えており、
     前記パラレルリンク機構は、前記ハンドリング部と接続されるベース部と、前記押圧部が取り付けられるエンド部と、前記ベース部と前記エンド部との間に並列に設けられ、伸縮する前記荷重制御部を有する複数のリンク部を備え、
     前記荷重制御部の伸縮動作により各々の前記リンク部の長さを制御することで、前記押圧部の押圧位置及び/又は押圧姿勢を前記被貼付面の形状に倣うように制御することを特徴とする請求項1若しくは請求項2のいずれかに記載のテープ貼付装置。
    The pasting head includes a parallel link mechanism for controlling a pressing position and/or a pressing posture of the pressing portion,
    The parallel link mechanism includes a base portion connected to the handling portion, an end portion to which the pressing portion is attached, and the load control portion that is provided in parallel between the base portion and the end portion and expands and contracts. comprising a plurality of link parts having
    By controlling the length of each of the link portions by the expansion and contraction operation of the load control portion, the pressing position and/or the pressing posture of the pressing portion is controlled so as to follow the shape of the surface to be adhered. 3. The tape application device according to claim 1 or 2.
  4.  前記荷重制御部は、流体の出し入れにより伸縮し、
     前記機械インピーダンス調節部は、前記第1の動作モードにおける前記荷重制御部の内圧が、前記第2の動作モードにおける前記荷重制御部の内圧よりも大きくなるよう制御することを特徴とする請求項1から請求項3のいずれかに記載のテープ貼付装置。
    The load control unit expands and contracts due to the inflow and outflow of the fluid,
    2. The mechanical impedance control section controls the internal pressure of the load control section in the first operation mode to be higher than the internal pressure of the load control section in the second operation mode. 4. The tape applying device according to any one of claims 3 to 4.
  5.  前記機械インピーダンス調節部は、前記第1の動作モードにおいて前記荷重制御部の伸縮動作を外部からロックするロック手段であることを特徴とする請求項1から請求項3のいずれかに記載のテープ貼付装置。 4. The tape applying device according to claim 1, wherein said mechanical impedance adjusting section is lock means for locking the expansion and contraction of said load control section from the outside in said first operation mode. Device.
  6.  テープを被貼付面に押圧する貼付ヘッドと、
     前記貼付ヘッドが取り付けられ、前記貼付ヘッドの押圧位置を制御するハンドリング部と、を備え、
     前記貼付ヘッドが、前記被貼付面に前記テープを押し付ける押圧部と、
     前記ハンドリング部と前記押圧部との間に設けられ、前記押圧部の押し付ける力を制御する荷重制御部と、を備えたテープ貼付装置を用いるテープ貼付方法であって、
     所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作工程と、
     前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作工程と、を有しており、
     前記第2の動作工程は、前記荷重制御部の機械インピーダンスを前記第1の動作工程における前記荷重制御部の機械インピーダンスと異なる機械インピーダンスに調節する機械インピーダンス調節工程を有することを特徴とするテープ貼付方法。
    a sticking head that presses the tape against a surface to be stuck;
    a handling unit to which the pasting head is attached and which controls a pressing position of the pasting head;
    a pressing portion for pressing the tape against the surface to be adhered by the applying head;
    A tape applying method using a tape applying device including a load control section provided between the handling section and the pressing section for controlling the pressing force of the pressing section,
    a first operation step until the pressing portion is pressed against the surface to be adhered with a predetermined load;
    a second operation step of attaching the tape to the surface to be attached by moving the pressing portion relative to the surface to be attached;
    The second operation step includes a mechanical impedance adjustment step of adjusting the mechanical impedance of the load control unit to a mechanical impedance different from the mechanical impedance of the load control unit in the first operation step. Method.
  7.  テープを被貼付面に押圧する貼付ヘッドを備え、
     前記貼付ヘッドが、前記被貼付面に前記テープを押し付ける押圧部と、
     前記押圧部の押圧位置及び/又は押圧姿勢を制御するパラレルリンク機構と、を備えており、
     前記パラレルリンク機構が、ベース部と、前記押圧部が取り付けられるエンド部と、
     前記ベース部と前記エンド部との間に並列に設けられ、伸縮する荷重制御部を有する複数のリンク部と、を備え、
     前記荷重制御部の伸縮動作により各々の前記リンク部の長さを制御することで、前記押圧部の前記押圧位置及び/又は前記押圧姿勢を前記被貼付面の形状に倣うように動作させながら、前記テープを前記被貼付面に貼り付けるテープ貼付装置を用いるテープ貼付方法であって、
     所定の荷重で前記押圧部を被貼付面に押し付けるまでの第1の動作工程と、
     前記押圧部が前記被貼付面に対して相対的に移動することにより前記テープを前記被貼付面に貼り付ける第2の動作工程と、を有しており、
     前記第2の動作工程は、前記荷重制御部の機械インピーダンスを前記第1の動作工程における前記荷重制御部の機械インピーダンスと異なる機械インピーダンスに調節する機械インピーダンス調節工程を有することを特徴とするテープ貼付方法。
    Equipped with a sticking head that presses the tape against the surface to be stuck,
    a pressing portion for pressing the tape against the surface to be adhered by the applying head;
    and a parallel link mechanism for controlling the pressing position and/or the pressing attitude of the pressing portion,
    The parallel link mechanism includes a base portion, an end portion to which the pressing portion is attached, and
    a plurality of link portions provided in parallel between the base portion and the end portion and having a load control portion that expands and contracts;
    By controlling the length of each of the link portions by the expansion and contraction operation of the load control portion, the pressing position and/or the pressing posture of the pressing portion are operated so as to follow the shape of the surface to be adhered, A tape applying method using a tape applying device for applying the tape to the surface to be applied,
    a first operation step until the pressing portion is pressed against the surface to be adhered with a predetermined load;
    a second operation step of attaching the tape to the surface to be attached by moving the pressing portion relative to the surface to be attached;
    The second operation step includes a mechanical impedance adjustment step of adjusting the mechanical impedance of the load control unit to a mechanical impedance different from the mechanical impedance of the load control unit in the first operation step. Method.
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JPH02196636A (en) * 1989-01-25 1990-08-03 Nitto Boseki Co Ltd Automatic defoaming device for frp molding
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WO2021010318A1 (en) * 2019-07-12 2021-01-21 東レエンジニアリング株式会社 Tape application device, tape application method, and method for manufacturing composite molded article
US20210046716A1 (en) * 2019-08-14 2021-02-18 Industrial Technology Research Institute Tape laying apparatus

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* Cited by examiner, † Cited by third party
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US4461669A (en) * 1983-09-30 1984-07-24 The Boeing Company Pivotal mount for laminating head
JPH02196636A (en) * 1989-01-25 1990-08-03 Nitto Boseki Co Ltd Automatic defoaming device for frp molding
JPH0550571A (en) * 1991-08-27 1993-03-02 Kawasaki Heavy Ind Ltd Roving material laminating device
WO2021010318A1 (en) * 2019-07-12 2021-01-21 東レエンジニアリング株式会社 Tape application device, tape application method, and method for manufacturing composite molded article
US20210046716A1 (en) * 2019-08-14 2021-02-18 Industrial Technology Research Institute Tape laying apparatus

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