WO2022199251A1 - Circuit board structure - Google Patents

Abstract

Disclosed is a circuit board structure, which comprises at least one base plate module, as well as at least one core control module and at least one functional module that are assembled on the base plate module; and any of the functional modules and any of the core control modules are electrically connected to the base plate module. The base plate module, the core control modules and the functional modules have sheet-like layer plate structures, which achieves the full modularization of circuit board products, while the core control modules and different functional modules can be assembled on the base plate module according to requirements of different circuit products. Thus, the functional requirements of circuit board products are satisfied, therefore being applicable to the design requirements of different products; moreover, the flexible configuration of circuit board products is achieved, thus reducing the design costs of hardware and enhancing the universality of circuit board products.

Description

a circuit board structure

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the priority of the Chinese patent application with the application number CN202110328128.0 and the name of the invention-creation titled "A circuit board structure", which was filed with the China Patent Office on March 26, 2021, and is claimed on March 26, 2021 Submitted to the China Patent Office with the application number of 202120623806.1, the priority of the Chinese patent application entitled "a circuit board structure" for invention-creation, the entire contents of which are incorporated in this application by reference.

technical field

The invention relates to the technical field of circuit boards, in particular to a circuit board structure that is fully modularized and flexibly matched for different design requirements.

Background technique

The circuit board, also known as the printed circuit board, the English abbreviation PCB (Printed circuit board), is an important electronic component, a support body for electronic components, and a provider of circuit connections for electronic components.

At present, there is a lot of repetitive work in the design of circuit board hardware in the industry. Since the controller and a large number of supporting electronic components are integrated on the circuit board, once the product requirements proposed by customers change, the entire circuit board needs to be re-improved. , readjusting the layout and wiring of the circuit board, resulting in an increase in the cost of hardware design. It can be seen that the current rigid circuit board product design cannot adapt to the ever-changing needs of customers.

SUMMARY OF THE INVENTION

The invention proposes a circuit board structure to solve the technical problem that the existing circuit board products are rigid in design and cannot be flexibly configured and produced. The invention can realize the flexible configuration of circuit board products and adapt to the ever-changing demands of customers for circuit board products. It is beneficial to reduce the cost of hardware design and realize the versatility of circuit board products.

An embodiment of the present invention provides a circuit board structure, including:

At least one backplane module, at least one core control module and at least one functional module assembled on the backplane module, and any one of the functional modules and any one of the core control modules are electrically connected to the backplane module; wherein, all the The backplane module, the core control module, and the functional module are all of a chip-layer structure.

As one of the implementations, the core control module and the functional module are directly welded or plugged onto the baseboard module through sockets, and the core control module and the functional module are respectively perpendicular to/from the baseboard module. parallel/inclined;

Wherein, the core control module assembled on the base plate module is perpendicular/parallel/inclined between the functional module; and,

When at least two of the functional modules are assembled on the base plate module, the adjacent functional modules are perpendicular/parallel/inclined to each other.

As one of the embodiments, the core control module has several core board tongue boards;

Two sides of any one of the core board tongue plates are provided with mutually symmetrical core board front row type welding pieces and core board reverse row type welding pieces;

Correspondingly, the backplane module has a core control module interface area, and the core control module interface area is provided with a core board strip jack for inserting the core board tongue plate;

Two sides of any one of the core board strip-shaped sockets are provided with mutually symmetrical core board front row-type welding feet and core board reverse-side row-type welding feet.

As one embodiment, in the interface area of the core control module, a semi-circular hole is opened in each of the solder pads in the front row of the core board and the row of solder legs on the back of the core board, and The notch of the semi-circular hole coincides with the edge of the core plate-shaped socket.

As one of the implementation manners, the core control module is assembled on the base plate module, and the core board tongue plate is inserted into the corresponding core board strip socket;

Wherein, the front row-type solder lugs of the core board are welded on the front-side row-type welding legs of the core board, and the core board reverse-side row-type welding lugs are welded on the back-side row-type welding legs of the core board.

As one of the embodiments, the core control module is provided with a plurality of fasteners, the bottom plate module is provided with a plurality of fastener holes, and the fasteners and the fastener holes are in a one-to-one correspondence;

When the core control module is assembled on the base plate module, the clips are clipped in the corresponding clip holes.

As one of the implementations, the functional module has several functional tongue plates;

The two sides of any one of the function board tongue plates are provided with mutually symmetrical function board front row type welding pieces and function board reverse side row type welding pieces;

Correspondingly, the base plate module has a function module interface area, and the function module interface area is provided with a function board strip-shaped jack for inserting the function board tongue plate;

The two sides of any of the functional board strip sockets are provided with mutually symmetrical function board front row-type welding feet and function board reverse-side row-type welding feet.

As one of the embodiments, in the functional module interface area, each welding piece in the row of solder legs on the front side of the function board and the row of solder legs on the back of the function board is provided with a semi-circular hole, and all The notch of the semi-circular hole coincides with the edge of the functional board strip-shaped socket.

As one of the implementations, the functional module is assembled on the base plate module, and the functional board tongue plate is inserted into the corresponding functional board strip socket;

Wherein, the front row type solder tabs of the function board are welded on the front row type solder pins of the function board, and the function board rear row type solder tabs are welded to the back row type solder legs of the function board.

As one of the embodiments, the front-side row-type solder pads of the function board and the function-board rear-side row-type solder pads are composed of a high-voltage signal conducting sheet and a low-voltage signal conducting sheet;

Wherein, there is a high-voltage safety insulation distance between two adjacent high-voltage signal conductive sheets, and a low-voltage safety insulation distance is provided between two adjacent low-voltage signal conductive sheets.

As one of the embodiments, the core control module has three core board tongue boards, which are:

The tongue plate of the first core board is provided with a front row type soldering piece of the first core board and a reverse row type soldering piece of the first core board;

The tongue plate of the second core board is provided with a front row of solder tabs of the second core board and a rear row of solder tabs of the second core board;

The tongue plate of the third core board has a front row of solder lugs of the third core plate and a rear row of solder lugs of the third core plate;

Correspondingly, the interface area of the core control module is provided with:

The first core board strip-shaped jack is used for inserting the first core board tongue board, and has the first core board front row type welding feet and the first core board reverse row type welding feet;

The second core board strip-shaped socket is used for inserting the second core board tongue board, and has the second core board front row type welding feet and the second core board reverse row type welding feet;

The third core board strip-shaped jack is used for inserting the third core board tongue board, and has the third core board front row type welding leg and the third core plate reverse row type welding leg;

The functional module has two functional boards and tongues, which are:

The tongue plate of the first function board is provided with a front row-type welding piece of the first function board and a reverse-side row-type welding piece of the first function board;

The tongue plate of the second function board is provided with a front row of solder lugs of the second function plate and a rear row of solder lugs of the second function plate;

Correspondingly, the function module interface area is provided with:

The first function board strip-shaped jack is used for inserting the first function board tongue plate, and has the first function board front row type welding feet and the first function board reverse row type welding feet;

The second function board bar-shaped jack is used for inserting the second function board tongue plate, and has the second function board front row type welding feet and the second function board reverse row type welding feet;

Wherein, the second core board strip socket is also compatible with the tongue plate of the first function board. Correspondingly, the front row type solder tabs of the second core board are matched with the front row type of the first function board. Soldering feet, the second core board reverse row type solder pads are matched with the first function board reverse row type welding feet;

The strip sockets of the third core board are also compatible with the tongue plate of the second function board. Correspondingly, the front row solder lugs of the third core board are matched with the front row solder feet of the second function board. , the row-type solder pads on the back side of the third core board are matched with the row-type solder pads on the back side of the second function board.

As one embodiment, the structure of the interface area of the core control module is adapted to the structure of the PCI-EX1 interface, and the length of the second core board strip jack and the third core board strip hole can be The specific setting is made according to the specification of the PCI-EX1 interface. In addition, a certain distance is set between the first core board strip socket and the second core board strip socket;

The structure of the functional module interface area can also be adapted to the structure of the PCI-EX1 interface. The specification of the first function board is set in detail. In addition, a certain distance is set between the first function board strip-shaped socket and the second function board strip-shaped socket.

As one of the implementation manners, in the interface area of the core control module, the front-side row-type solder pins of the first core board, the front-side row-type solder pins of the second core board, and the front-side row-type solder pins of the third core board The welding legs are spaced apart from each other. Correspondingly, the welding legs on the reverse side of the first core board, the welding legs on the reverse side of the second core board, and the welding legs on the reverse side of the third core board are spaced apart from each other. set up;

In the interface area of the functional module, the front row-type solder pins of the first function board and the front-side row-type solder pins of the second function board are spaced apart from each other. Correspondingly, the back-side row type of the first function board The soldering feet and the row-type soldering feet on the reverse side of the second function board are arranged at intervals from each other.

As one of the embodiments, a plurality of the functional board tongues are arranged on the same side of the functional module;

or,

Several of the functional board tongues are arranged on different sides of the functional module.

As one of the embodiments, the number of the backplane modules is at least two;

Opposite two sides of the core control module each have the core board tongue;

The core control module is plugged on two adjacent baseplate modules to achieve vertical expansion.

As one of the embodiments, the number of the backplane modules is at least two;

Each of the opposite sides of the functional module has the functional plate tongue;

The functional modules are inserted on two adjacent baseplate modules to achieve vertical expansion.

As one of the embodiments, at least one grounding pin, at least one I/O soldering pin, and at least one power supply soldering pin for soldering the core control module and the functional module are provided on the base plate module.

As one of the embodiments, the circuit board structure further includes a chip-type terminal module;

The terminal module has several terminal tongues;

Two sides of any one of the terminal tongue plates are provided with mutually symmetrical terminal front row type solder tabs and terminal back row type solder tabs;

Correspondingly, the base plate module has a terminal module interface area, and the terminal module interface area is provided with a terminal strip jack for inserting the terminal tongue plate;

Both sides of any of the terminal strip sockets are provided with mutually symmetrical terminal front row-type welding feet and terminal back-side row-type welding legs;

And in the interface area of the terminal module, a semi-circular hole is formed on the solder pads of the front-side row-type solder feet of the terminal and the terminal-side row-type solder feet, and the notch of the semi-circular hole is in the shape of the terminal strip. The sides of the jacks overlap.

As one of the embodiments, in the terminal module interface area, there is also:

front-side solder pins with round holes that are equipotentially connected to the front-side row-type solder pins of the terminal;

The reverse solder fillet with a round hole is equipotentially connected to the row-type solder fillet on the reverse side of the terminal.

As one of the embodiments, the circuit is etched on the PCB bottom plate, and the pin interface of the function module and the core control module is preset, and the pin interface is electrically connected;

Etch the functional circuit on the PCB bottom plate and install the supporting electronic components to form a functional circuit board;

The integrated circuit with control function is etched on the PCB bottom plate, the control device is installed, and the control circuit and electronic components are etched.

As one of the embodiments, the conductive pins of the functional module include a high-voltage signal conductive sheet and a low-voltage signal conductive sheet;

The insulation distance L3 between the high-voltage signal conductive sheet and the adjacent conductive sheet is not less than the high-voltage safety insulation distance L0; the insulation distance L4 between the low-voltage signal conductive sheet and the adjacent conductive pins is not less than the low-voltage safety insulation distance L0'.

Compared with the prior art, the circuit board structure provided by the embodiments of the present invention is composed of at least one backplane module, several slice-type functional modules and several slice-type core control modules to form a circuit board, wherein the backplane module, the The core control module and the functional modules are all of the chip layer structure, which not only realizes the full modularity of the circuit board products, but also can assemble the core control module and different functional modules on the backplane module according to the requirements of different circuit products. It not only meets the functional requirements of circuit board products and is suitable for various product design requirements, but also realizes flexible configuration of circuit board products, which not only reduces hardware design costs, but also enhances the versatility of circuit board products.

Description of drawings

FIG. 1 is a schematic structural diagram of a circuit board structure provided by an embodiment of the present invention;

2 is a schematic structural diagram of a circuit board structure provided by another embodiment of the present invention;

3 is a schematic structural diagram of a backplane module provided by an embodiment of the present invention;

4 is a schematic diagram of an interface area of a core control module provided by an embodiment of the present invention;

5 is a schematic plan view of a core control module provided by an embodiment of the present invention;

6 is a schematic plan view of a core control module provided by another embodiment of the present invention;

7 is a schematic diagram of a functional module interface area provided by an embodiment of the present invention;

8 is a schematic plan view of a functional module provided by an embodiment of the present invention;

9 is a schematic plan view of a functional module provided by another embodiment of the present invention;

10 is a schematic plan view of a core control module provided by another embodiment of the present invention;

11 is a schematic diagram of an interface area of a core control module provided by another embodiment of the present invention;

12 is a schematic plan view of a functional module provided by another embodiment of the present invention;

13 is a schematic diagram of a functional module interface area provided by another embodiment of the present invention;

14 is a schematic structural diagram of a functional module provided by another embodiment of the present invention;

15 is a schematic structural diagram of the front side of a terminal module provided by an embodiment of the present invention;

16 is a schematic structural diagram of an interface area of a terminal module provided by an embodiment of the present invention;

Wherein, the reference signs in the accompanying drawings are as follows:

1. Core control module;

101. The tongue plate of the core board; 102. The front row of solder tabs of the core board; 104. The clip;

2. Functional modules;

201. Tongue plate for function board; 202. Front row soldering piece for function board; 204. Conductive sheet for high-voltage signal; 205. Conductive sheet for low-voltage signal;

3. Backplane module;

301, core control module interface area; 302, core board strip jack; 303, core board front row solder pins; 304, core board back row solder pins; 305, semicircular holes in the core board area;

311, functional module interface area; 312, functional board strip jack; 313, function board front row solder pins; 314, function board back row solder pins; 315, semi-circular holes in the function board area;

401, the first core board tongue; 402, the second core board tongue; 403, the third core board tongue;

501, the front row of solder lugs of the first core board; 502, the front row of solder lugs of the second core board; 503, the front row of solder lugs of the third core board;

601, the first core board strip socket; 602, the second core board strip socket; 603, the third core board strip socket;

701, the tongue plate of the first function board; 702, the tongue plate of the second function board; 703, the front row type welding piece of the first function board; 704, the front row type welding piece of the second function board;

801, the first function board strip jack; 802, the second function board strip jack;

901, terminal module; 902, terminal tongue plate; 903, terminal front row solder tab;

Block interface area; 1002, terminal strip socket; 1003, front-side solder pins of terminals; 1004, rear-side solder pins of terminals; 1005, semi-circular holes in the terminal area; 1006, front-side solder pins with round holes; 1007, with Welding feet on the reverse side of the round hole.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1

Referring to FIG. 1 , FIG. 1 shows a schematic diagram of a circuit board structure according to Embodiment 1 of the present invention. The details are as follows:

Circuit board structure, including:

At least one backplane module 3 and at least one core control module 1 and at least one functional module 2 assembled on the backplane module 3, and any functional module 2 and any core control module 1 are electrically connected to the backplane module 3; wherein, the backplane module 3. The core control module 1 and the functional module 2 are both chip laminate structures.

It should be noted that the backplane module 3, the core control module 1, and the functional module 2 are all chip laminate structures. Copper cladding) and multi-layer board structures are all within the scope of this application, and can be selected according to the hardware design requirements of the circuit during implementation. The following three modules are given as examples:

The backplane module 3 of the chip laminate structure may specifically be: etching a circuit on a PCB backplane, and presetting the pin interfaces of the functional module 2 and the core control module 1, and by electrically connecting the relevant pin interfaces, the backplane module 3 may not be Including electronic components, all functions can be realized through function module 2 and core control module 1. In addition, certain related electronic components can also be reserved on the backplane module 3 to realize the basic function of circuit connection.

The functional module 2 of the chip laminate structure may specifically be: a circuit board with a certain function formed by etching a functional circuit on a PCB bottom plate and installing supporting electronic components. The functional module 2 includes, but is not limited to, an analog quantity module, a communication function module, and a switch quantity input and output module, among which the analog quantity module is such as a temperature module, a humidity module, a pressure sensor module, etc.; the communication function module is such as an RS485 communication module, an RS232 communication module Wait.

The core control module 1 of the chip laminate structure can specifically be: etching an integrated circuit with a control function or installing a control device on a PCB bottom plate, and etching the control circuit and its supporting electronic components to realize the whole circuit board. Modular chip core control module for core control functions.

It should be noted that, in this preferred embodiment, the given structural diagram includes only one core control module and includes multiple functional modules. In other embodiments of the present invention, the number of core control modules 1 may be If there are multiple blocks, the number of functional modules 2 is at least one, and together with at least one backplane module 3, the function of the circuit board is realized.

To sum up, in the circuit board structure provided in the first embodiment, the backplane module 3, the core control module 1, and the functional module 2 are all chip-layer board structures, which not only realizes the full modularity of the circuit board products, but also can be used according to different To meet the requirements of circuit products, the core control module 1 and different functional modules 2 are assembled on the backplane module 3, which not only meets the functional requirements of circuit board products, is suitable for various product design requirements, but also realizes flexible configuration of circuit board products. It not only reduces the cost of hardware design, but also enhances the versatility of circuit board products.

Embodiment 2

Further improvements are made based on the variable circuit board structure of the first embodiment:

1 and 2, the positional relationship between the core control module 1, the functional module 2 and the base plate module 3 may be vertical, or a certain inclination angle may be formed according to actual design requirements.

The number of functional modules 2 is generally configured to be multiple, which is suitable for the ever-changing needs of customers. Among them, two adjacent functional modules 2 are parallel to each other, or perpendicular to each other, or at a certain inclination angle, while the core The control module 1 and the functional module 2 are parallel to each other, can also be perpendicular to each other, and can also be at a certain angle of inclination. Those skilled in the art can, according to the size of the backplane module 3 and the design requirements of the circuit board product, determine the requirements of the three modules. The positional relationship is flexibly designed, and the designed structures include but are not limited to those shown in Figures 1 and 2, and more structural designs are possible, which are all within the protection scope of the present invention. Specific examples are as follows:

The function module 2 is vertically connected to the base module 3, and the core control module 1 is vertically connected to the base module 3. As shown in Figure 1, the core control module 1 and the function module 2 are in a vertical relationship. As shown in Figure 2, the core control module 1 and the Function module 2 is in a parallel relationship.

The above location design has the following benefits:

1. It is convenient for R&D personnel/production machines to quickly insert the selected core control module 1 and function module 2 on the bottom plate module 3 to improve production efficiency; and because the solder tabs and solder feet are at the bottom, the vertical position relationship is convenient for welding operations. .

2. It is convenient for R&D personnel/production machines to quickly and vertically pull out the selected core control module 1 and function module 2 from the bottom plate module 3, to disassemble and replace the faulty module, to facilitate the maintenance of circuit board products, and to improve circuit board products. The utilization rate and service life of the circuit board can be improved, and the high cost and environmental protection of the circuit board product due to the failure of the partial functional module 2 are avoided.

3. It is beneficial to make full use of the limited space of the backplane module 3, and to assemble more functional modules 2 to the greatest extent, which is beneficial to the evolution of circuit board product design towards miniaturization, and constantly adapts to the high requirements put forward by the future industry.

4. By dividing the installation area on the backplane module 3, each functional module 2 and the core control module 1 are effectively divided into areas, which is convenient to quickly identify the corresponding functional module 2, which is beneficial to improve the customer experience.

5. After the product is sold, if the core control module 1 fails and needs to be replaced, you can directly use the new core control module that was added when the original product was purchased, disassemble the faulty core control module, and replace the new core control module. The control module is plugged and soldered on the backplane module, and the quick maintenance of the circuit product can be easily realized without sending the faulty product back to the original factory.

6. When the software in the core control module 1 needs to be upgraded, there is no need to use the expensive OTA remote upgrade technology. You can contact the manufacturer to send the successfully upgraded core control module, and realize the disassembly and assembly by yourself to complete the circuit product upgrade operation. It greatly reduces the cost of product purchase and avoids circuit products being abandoned because the software cannot be upgraded.

In this embodiment, it should be noted that the connection between the core control module 1 and the backplane module 3 and the connection between the functional module 2 and the backplane module 3 can be indirectly plugged into the backplane module 3 by using sockets such as pin headers. It can also be directly welded on the backplane module 3 after being plugged in.

In this embodiment, the baseplate module 3 is provided with at least one grounding pin, at least one I/O soldering pin, and at least one power supply soldering pin for welding the core control module 1 and the functional module 2; wherein, one power supply soldering pin Compatible with an alternating voltage, which can be 1.8V, 3.3V, 5.0V, 12V or 24V; the communication pins consist of 4 specific solder pins, which can be compatible with a number of bus signal lines less than or equal to 4, for example: UART Interface/IIC interface/SPI interface/CAN interface/RS485 interface/RS422 interface/four-wire Ethernet interface; in addition, the backplane module 3 can also design spare solder pins and EN signal line solder pads according to design requirements.

Embodiment 3

Compared with the use of assembly processes such as pin headers and sockets, the third embodiment directly solders the circuit board of the core control module 1 on the general base plate, eliminating the need for middleware such as pin headers and sockets, thereby greatly reducing material costs. The third embodiment adopts the welding process to realize the assembly between the core control module 1 and the base plate module 3, and the details are as follows:

Please refer to FIGS. 3 to 6. FIG. 3 shows a schematic plan view of a backplane module, FIG. 4 shows a schematic plan view of the interface area 301 of the core control module in FIG. 3, and FIGS. Schematic. The core control module 1 has several core board tongue plates 101; the two sides of any core board tongue plate 101 are provided with mutually symmetrical core board front row type solder pads 102 and core board rear row type solder pads (not shown in the figure);

Correspondingly, the backplane module 3 has a core control module interface area 301, and the core control module interface area 301 is provided with a core board strip socket 302 for inserting the core board tongue 101; There are mutually symmetrical core board front row solder pins 303 and core board reverse row solder pins 304 .

The core control module 1 is assembled on the bottom plate module 3, and the tongue plate 101 of the core board is inserted into the corresponding core board strip-shaped socket 302; wherein, the front row of solder lugs 102 of the core board are welded to the front row of solder pins 303 of the core board On the back side of the core board, the row type solder pads are welded on the back side row type solder pins 304 of the core board.

In this embodiment, the row-type solder tabs of the core control module 1 are printed on the tongue plate 101 of the core board, and the purpose of this design is to:

1. The core board tongue 101 is plugged into the core board strip jack 302 corresponding to the backplane module 3. In the early stage of circuit board assembly, the initial fixation of the core control module 1 on the backplane module 3 can be realized, which is convenient for welding operations and also It is convenient for circuit board product verification before soldering;

2. The core control module 1 can be designed with core board tongues 101 of different lengths, and the corresponding core control module interface area 301 is designed with core board strip jacks 302 of different lengths, which can prevent reverse connection and facilitate the user's quick assembly;

3. The symmetrically distributed row-type solder tabs are respectively connected with the symmetrical row-type pins on both sides of the core board tongue 101, which can increase the number of communication pins and improve the versatility of the circuit board structure;

4. The tongue plate 101 of the core board has sufficient mechanical strength to prevent damage from external forces during processing and transportation, and improve the reliability of circuit board products;

5. The row-type solder tabs on the tongue plate 101 of the core board are in a corresponding relationship with the row-type solder pins in the interface area 301 of the core control module. Reliable connection (communication/conductivity) between solder tabs and solder pins is realized, and the later soldering operation is performed, so that the assembly work between the core control module 1 and the base module 3 can be carried out efficiently, and there is no need to perform pin, The tedious operations such as pin alignment greatly improve the assembly efficiency of the circuit board, which is conducive to improving production efficiency and reducing R&D investment costs.

Among them, it should be noted that the design of the core control module interface area 301 should be common to the structural design of various core control modules 1, and the number of core board strip jacks 302 on the core control module interface area 301 is related to the core board tongue plate. The number of 101 should be the same, and the shape and size of the core board strip socket 302 should match the shape and size of the core board tongue 101 .

As a further step, the row-type solder fillet of this embodiment adopts a semi-circular hole processing technology, and the formed structure is:

In the interface area 301 of the core control module, a semicircular hole 305 is defined in each welding piece of the front row of solder pins 303 on the front side of the core board and the row of solder feet 304 on the back side of the core board, and the notch of the semicircular hole 305 is connected to the core strip. The sides of the shaped socket 302 are coincident. The contact part of the row solder tab and the core board strip socket 302 has a semi-circular opening, which can be used only on the front of the backplane module 3 when the row solder pin is welded to the row pin of the core control module 1. Solder welding, the liquid solder can flow to the back through the semi-circular hole, so that the row-type solder pins on the back side can be welded to the row-type pins, which can effectively improve the welding quality.

In addition, optionally, as a structural design of the core control module 1, the core control module 1 can be stably assembled on the base plate module 3, and a snap-fit structure is adopted:

As shown in FIG. 4 , the core control module 1 is provided with a number of fasteners 104, and the bottom plate module 3 is provided with several fastener holes (not shown), the fasteners 104 and the fastener holes are in a one-to-one correspondence; the core When the control module 1 is assembled on the base plate module 3, the clips 104 are clipped in the corresponding clip holes.

Embodiment 4

Compared with the assembly process using pin headers and sockets, in this embodiment, the circuit board of the functional module 2 is directly welded on the base module 3, eliminating the need for middleware such as pin headers and sockets, thereby greatly reducing the material cost. The fourth embodiment adopts a welding process to realize the assembly between the functional module 2 and the base plate module 3, and the details are as follows:

Please refer to FIG. 3 , FIG. 7 and FIG. 8 . FIG. 3 shows a schematic plan view of a backplane module 3 , FIG. 7 shows a plan view of the functional module interface area 311 in FIG. 3 , and FIG. Schematic. The function module 2 has several function board tongue plates 201; the two sides of any function board tongue plate 201 are provided with mutually symmetrical function board front row type solder pieces 202 and function board reverse side row type solder pieces (the reverse side is not shown in the plan view);

Correspondingly, the backplane module 3 has a function module interface area 311, and the function module interface area 311 is provided with a function board strip-shaped jack 312 for inserting the function board tongue 201; Symmetrical function board front row type solder feet 313, function board reverse row type solder feet 314.

The function module 2 is assembled on the bottom plate module 3, and the function board tongue plate 201 is inserted into the corresponding function board strip-shaped socket 312; wherein, the function board front row type solder tabs 202 are welded on the function board front row type solder pins 313 , and the solder pads on the reverse side of the function board are welded to the solder pins 314 on the reverse side of the function board.

In this embodiment, the row-type solder tabs of the functional module 2 are printed on the tongue plate 101 of the core board, and the purpose of this design is to:

1. The tongue plate 201 of the function board is inserted into the strip jack 312 of the function board corresponding to the base plate module 3. In the initial stage of circuit board assembly, the preliminary fixation of the function module 2 on the base plate module 3 can be realized, which is convenient for welding operations and convenient for Circuit board product verification before soldering;

2. The function module 2 can be designed with different lengths of the function board tongue 201, and the corresponding function module interface area 311 is designed with different lengths of the function board strip jacks 312, which can prevent reverse connection and facilitate the user's quick assembly;

3. The symmetrically distributed row-type solder tabs are respectively connected with the symmetrical row-type pins on both sides of the core board tongue 101, which can increase the number of communication pins and improve the versatility of the circuit board structure;

4. The tongue plate 201 of the functional board has sufficient mechanical strength to prevent damage from external forces during processing and transportation, and improve the reliability of circuit board products;

5. The row-type solder tabs on the tongue plate 201 of the function board correspond to the row-type solder pins in the interface area 311 of the function module. When the function module 2 is plugged into the strip-shaped jack 312 of the function board, it can be realized. Reliable connection (communication/conductivity) between solder tabs and solder pins, and later soldering operations, enables efficient assembly between the functional module 2 and the base module 3, without the need for pins and pins as in the prior art and other complicated alignment operations, which greatly improves the assembly efficiency of the circuit board.

6. There are various types of functional modules 2. Not only can circuit board products that meet specific functions be quickly assembled according to customer needs, but customers can also directly purchase unsoldered baseboard module 3, core control module 1, and functional module 2. Follow the operating instructions Self-plugging and welding are used for teaching, research and development, testing and other purposes, which greatly broadens the application range of circuit board products, and is extremely flexible and versatile.

Among them, it should be noted that the design of the functional module interface area 311 should be common to the structural design of various functional modules 2, and the number of the functional board strip-shaped jacks 312 on the functional module interface area 311 and the number of the functional board tongue plates 201 It should be the same, and the shape and size of the functional board strip socket 312 should match the shape and size of the functional board tongue 201 .

Please continue to refer to FIG. 7 , as one of the embodiments, in the functional module interface area 311 , a semi-circular hole is opened in each welding piece in the front row of solder pins 313 of the function board and the row of solder pins 314 on the reverse side of the function board 315 , and the notch of the semicircular hole 315 is coincident with the edge of the functional plate strip-shaped insertion hole 312 . The contact part of the row solder tab and the function board strip socket 312 has a semi-circular opening, which can be used only on the front of the backplane module 3 when the row solder pin and the row pin of the core control module 1 are welded. Solder welding, the liquid solder can flow to the back through the semi-circular hole, so that the row-type solder pins on the back side can be welded to the row-type pins, which can effectively improve the welding quality.

Embodiment 5

As a further improvement description of the fourth embodiment, the front row type solder pads 202 of the function board and the rear row type solder pads of the function board are composed of a high voltage signal conductive sheet 204 and a low voltage signal conductive sheet 205; wherein, two adjacent high voltage signal conductive sheets There is a high-voltage safety insulation distance between 204, and a low-voltage safety insulation distance is arranged between two adjacent low-voltage signal conductive sheets 205.

In the specific implementation of this embodiment, referring to FIG. 9 , FIG. 9 shows a schematic structural diagram of the front side of a functional module 2 provided by another embodiment of the present invention. The conductive pins of the functional module 2 include a high-voltage signal conductive sheet 204 and a Low-voltage signal conductive sheet, the insulation distance L3 between the high-voltage signal conductive sheet 204 and the adjacent conductive sheet is not less than the high-voltage safety insulation distance L0; the insulation distance L4 between the low-voltage signal conductive sheet 205 and the adjacent conductive pins is not less than the low-voltage safety insulation The distance L0', wherein L0 is 2-4mm, preferably 2mm, L0' is 0.1-1mm, preferably 0.1mm. It can be understood that, in the case of different insulating materials, L0 and L0' will vary, and the commonly used insulation safety distance is given in this embodiment. Wherein, in this embodiment, the high-voltage signal conductive plates 204 and the low-voltage signal conductive plates 205 are arranged in two groups, and the number is 4; in other embodiments, the high-voltage signal conductive plates 204 and the low-voltage signal conductive plates 205 are arranged at intervals , and the number can also be set according to the actual situation. When the high-voltage signal conductive sheet 204 is adjacent to the low-voltage signal conductive sheet 205, the insulation spacing needs to satisfy both the high-voltage safety insulation spacing and the low-voltage safety insulation spacing. Further, various functional module 2 circuit boards use the gong edge function of the PCB board to cut one side into the shape of various solder pieces of different sizes, or several solder pieces can be assembled in one area, such as the low-voltage side, The remaining three sides can be square or circular, as long as they are shapes that do not affect the normal operation of other modules/circuits, they are all within the scope of the present application, and will not be repeated here.

In this embodiment, the row-type solder pins of the functional module 2 are divided into a high-voltage signal conductive sheet 204 and a low-voltage signal conductive sheet 205, which can facilitate planning and design of the insulation distance between the conductive sheets when the conductive sheets are arranged, and avoid the lead-in of the functional module 2. The pins are shorted to improve the stability of the circuit board.

It can be understood that when the functional module 2 is a digital input and output module, since the digital input and output module has strong electricity, in order to facilitate the digital output module to be connected to any position on the base plate module 3, each area has a unified interface. , that is, adopting the characteristics of strong/weak current separation, compressing the low-voltage side of the solder pins in one area, and setting the low-voltage side close to the inside of the baseboard module 3, so that the low-voltage signal line is connected to the MCU controller of the baseboard module 3; The solder pins of the high-voltage end are set as independent circular pads. In this embodiment, as long as the arrangement of solder pins specified by the state regarding electrical clearance, creepage distance and insulation penetration distance is satisfied, it is within the protection scope of the present invention. It is not repeated here.

Embodiment 6

As a specific implementation manner, based on the second embodiment to the fifth embodiment, the structure of the developed circuit board product is described in detail below to facilitate a better understanding of the technical solution of the present invention.

Referring to FIG. 10, the core control module 1 has three core board tongue boards 101, which are:

The tongue plate 401 of the first core board has a front row type soldering piece 501 of the first core board and a reverse row type soldering piece of the first core board;

The tongue plate 402 of the second core board has a front row type soldering lug 502 of the second core plate and a rear row type welding lug of the second core plate;

The tongue plate 403 of the third core board has a front row of solder lugs 503 of the third core board and a row of solder lugs on the back of the third core board;

Correspondingly, please refer to FIG. 11 , the interface area 301 of the core control module is provided with:

The first core board strip-shaped socket 601 is used for inserting the first core board tongue 401, and has the first core board front row type solder pins 303 and the first core board back row type solder pins 304;

The second core board strip-shaped socket 602 is used for inserting the second core board tongue plate 402, and has the second core board front row type solder pins 303 and the second core board rear row type solder pins 304;

The third core board strip-shaped socket 603 is used for inserting the third core board tongue plate 403, and has the third core board front row type solder pins 303 and the third core board reverse row type solder pins 304;

Please refer to FIG. 12, the function module 2 has two function board tongue plates 201, which are:

The tongue plate 701 of the first function board has a front row type soldering piece 703 of the first function board and a reverse row type soldering piece of the first function board;

The tongue plate 702 of the second function board has a front row type soldering piece 704 of the second function board and a reverse row type soldering piece of the second function board;

Correspondingly, please refer to FIG. 13 , the function module interface area 311 is provided with:

The first functional board strip socket 801 is used for inserting the first functional board tongue 701, and has the first functional board front row type solder pins 313 and the first function board back row type solder pins 314;

The second functional board strip-shaped socket 802 is used for inserting the second functional board tongue plate 702, and has the second functional board front row type solder pins 313 and the second function board back row type solder pins 314;

In addition, it can be understood that the strip socket 602 of the second core board is also compatible with the tongue plate 701 of the first function board. Correspondingly, the front row type solder tabs 502 of the second core board are matched with the front row type of the first function board. Soldering pins 313, the second core board reverse row solder pads are matched with the first function board reverse row soldering pins 314;

The strip socket 603 of the third core board is also compatible with the tongue plate 702 of the second function board. Correspondingly, the front row type solder pads 503 of the third core board are matched with the front row type solder pins 313 of the second function board. The solder tabs on the back side of the board are matched with the solder pads 314 on the back side of the second functional board.

In the specific implementation, the number of solder pins of the front row of solder pins 303 of the first core board in the interface area 301 of the core control module is not less than the number of solder pins of the front row of solder pins 703 of the first function board of the functional module 2; the core control module The number of solder pins 304 on the back of the first core board in the interface area 301 is not less than the number of solder pins on the back of the first functional board of the functional module 2; wherein, the first core of the interface area 301 of the core control module The shape and size of the strip-shaped socket 601 is not smaller than the first functional board tongue 701 of the functional module 2 , and can meet the specification that the first functional board tongue 701 is plugged on the base module 3 .

The number of solder pins 303 on the front side of the second core board in the interface area 301 of the core control module is not less than the number of solder pins 704 on the front side of the second function board of the function module 2; The number of solder pins 304 on the back side of the two core boards is not less than the number of solder pins on the back side of the second function board of the functional module 2; wherein, the second core board strip-shaped jack in the interface area 301 of the core control module The shape and size of 602 is not smaller than that of the second function board tongue 702 of the functional module 2 , and can meet the plug-in specification of the second function board tongue 702 . The shape and size of the second core board strip-shaped jack 602 in the core control module interface area 301 is not smaller than the second function board tongue 702 of the function module 2, which can meet the requirements of the second function board tongue 702 being plugged into the backplane module 3. specifications above.

To sum up, the core board strip jack 302 in the core control module interface area 301 can be compatible with the function board tongue plate 201 and the function board row pins, so that the core control module interface area 301 can be compatible with the function module 2 .

As a further example, this embodiment also limits the distance parameters of the core control module interface area 301 and the function module interface area 311, so that the core control module interface area 301 and the function module interface area 311 are compatible with the PCI-EX1 interface structure standard . The structure of the core control module interface area 301 is adapted to the structure of the PCI-EX1 interface, specifically:

The length of the first core board slot 601 and the length of the second core board slot 602 can be specifically set according to the specifications of the PCI-EX1 interface. The core board strip sockets 602 are provided with a certain spacing;

The structure of the function module interface area 311 can also be adapted to the structure of the PCI-EX1 interface, specifically:

The length of the first function board strip hole 801 and the length of the second function board strip hole 802 can be specifically set according to the specifications of the PCI-EX1 interface. The two-function board strip jacks 802 are set at a certain distance.

As one of the embodiments, in the interface area 301 of the core control module, the front row solder pins of the first core board, the front row solder pins of the second core board, and the front row solder pins of the third core board are arranged at intervals from each other , Correspondingly, the back row solder pins of the first core board, the back row solder pins of the second core board, and the back row solder pins of the third core board are spaced apart from each other; in the function module interface area 311, the first function The row-type solder feet on the front of the board and the front-side row-type solder feet on the second function board are spaced apart from each other. Correspondingly, the row-type solder feet 314 on the back side of the first function board and the back-side row-type solder feet on the second function board are arranged at intervals from each other. . In the specific implementation of this embodiment, a preset distance is maintained between the row of solder pins in the interface area 301 of the core control module and the interface area of the functional module 311 and the adjacent solder pins. By reserving blank space, the solder pins can be expanded when needed. When the pin is expanded by using the blank space, the interface area 301 of the core control module and the interface area 311 of the function module have the function of pin expansion, which can be compatible with more pins of different signals.

Embodiment 7

The seventh embodiment studies the expansion design of the functional module 2 and the circuit board structure, and the details are as follows:

Referring to FIG. 14 , in the embodiment of the present invention, several functional board tongues 201 are arranged on the same side of the functional module 2 , or several functional board tongues 201 are arranged on different sides of the functional module 2 . Wherein, the number of tongue plates of the functional module 2 is two, and in other embodiments, the number of tongue plates may be one or more.

In order to realize the expansion design of the circuit board structure, the embodiment of the present invention carries out the expansion and extension of the vertical structure, as follows:

The number of backplane modules 3 is at least two;

The opposite sides of the core control module 1 each have a core board tongue 101, and/or, as shown in FIG. 14, the opposite sides of the functional module 2 each have a function board tongue 201;

The core control module 1 is inserted between two adjacent baseplate modules 3, and the functional module 2 is inserted into the two adjacent baseplate modules 3, thereby realizing vertical expansion. In this way, by arranging tongue plates on the two opposite sides of the functional module 2, the functional module 2 can be connected to the bottom plate module 3 through the bottom edge, and can be connected to the vertical expansion board in the vertical direction at the same time. The circuit structure and function can realize the communication between two or more circuit board products, realize the expansion of input and output points, and have the excellent characteristics of building block type, versatile type and white change type. And can effectively reduce the occupied space of the entire control circuit board, so that the expanded circuit board structure is more compact. This design can make the extension and expansion of the circuit board structure more flexible, thereby greatly improving the versatility and expandability of the backplane module 3, especially the "compact, stacked" circuit board structure formed after expansion When installed in control cabinets and industrial control boxes, this circuit board product is particularly competitive in the market.

Of course, two or more baseplate modules 3 can be expanded in the horizontal direction, and can also be expanded in the vertical direction through the above-mentioned embodiments, which can meet the needs of different customers.

It can be understood that, considering the heat generation of the power devices on the circuit board, through holes for heat dissipation can also be opened in the part of the backplane module 1 close to the power devices, and a cooling fan can be installed if necessary, so as to effectively ensure the safety of the circuit board products. performance.

Embodiment 8

Referring to FIG. 15, as one of the embodiments, the circuit board structure further includes a chip-type terminal module 901; the terminal module has several terminal tongue plates 902; the two sides of any terminal tongue plate are provided with mutually symmetrical terminal front row type Solder tab 903;

Correspondingly, the backplane module 3 has a terminal module interface area 1001, and the terminal module interface area 1001 is provided with a terminal strip jack 1002 for inserting the terminal tongue plate;

Both sides of any terminal strip socket 1002 are provided with mutually symmetrical terminal front row type solder pins 1003 and terminal back row type solder feet 1004; and in the terminal module interface area 1001, the terminal front row type solder feet 1003 and the back side Each of the row-type solder pins 1004 is provided with a semi-circular hole 1005, and the notch of the semi-circular hole 1005 coincides with the edge of the terminal strip-shaped socket.

Please refer to FIG. 16 , as one of the embodiments, in the interface area of the terminal module, there are also front-side solder pins 1006 with round holes that are equipotentially connected to the front-side row-type solder pins of the terminal, and equipotential with the back-side row-type solder pins of the terminal Reverse solder leg 1007 with round hole for connection. The design of the interface area of the terminal module can not only weld the terminal module, but also directly weld the terminal. When welding the terminal, insert the terminal into the round hole for welding.

To sum up, the embodiments of the present invention provide a circuit board structure, which has the following beneficial effects:

(1) The backplane module 3, the core control module 1, and the functional module 2 are all of the chip layer structure, which realizes the full modularity of the circuit board products.

(2) According to different circuit product requirements, the core control module 1 and different functional modules 2 can be assembled on the backplane module 3, which not only meets the functional requirements of circuit board products, is suitable for various product design requirements, but also realizes The flexible configuration of circuit board products not only reduces hardware design costs, but also enhances the versatility of circuit board products.

(3) The bottom plate module 3, the core control module 1, and the functional module 2 are independent of each other, and the spatial position of the three is arranged. The welding connection method is safe and reliable, which can work reliably for a long time and is convenient for mass production.

(4) The backplane module 3, the core control module 1, and the functional module 2 use electrical interfaces of uniform specifications, and the electrical signal compatibility is unified. Various types of functional module 2 circuit boards can be interchangeably used in any position of the backplane module 3. Manufacturers can freely choose 2 boards of different types of function modules for assembly, which is easy to use.

(5) A unique anti-reverse tongue strip opening design is designed between the core control module 1, the functional module 2 and the backplane module 3, as well as a unified electrical rule design, so that the functional module 2 circuit board will not be inserted incorrectly. The direction causes a short circuit of the signal and damages the electronic components, and each module will not be inserted wrongly in the corresponding position.

(6) The electrical interfaces of the backplane module 3, the core control module 1, and the functional module 2 are of uniform specifications, the electrical signal compatibility is uniform, the low-voltage signal area occupies a small space, and the installation is neat and tidy, and the installation is convenient, and any number of general-purpose backplanes can be connected in parallel. , which can meet the needs of a large number of functions.

The above are the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can be made, and these improvements and modifications may also be regarded as It is the protection scope of the present invention.

Claims (20)

1. A circuit board structure, characterized in that it includes:

   At least one backplane module, at least one core control module and at least one functional module assembled on the backplane module, and any one of the functional modules and any one of the core control modules are electrically connected to the backplane module; wherein, all the The backplane module, the core control module, and the functional module are all of a chip-layer structure.
2. The circuit board structure according to claim 1, wherein:

   The core control module and the function module are directly welded or plugged on the baseplate module through a socket, and the core control module and the function module are respectively perpendicular/parallel/inclined to the baseplate module;

   Wherein, the core control module assembled on the base plate module is perpendicular/parallel/inclined between the functional module; and,

   When at least two of the functional modules are assembled on the base plate module, the adjacent functional modules are perpendicular/parallel/inclined to each other.
3. The circuit board structure according to claim 1 or 2, characterized in that:

   The core control module has several core boards and tongue boards;

   Two sides of any one of the core board tongue plates are provided with mutually symmetrical core board front row type welding pieces and core board reverse row type welding pieces;

   Correspondingly, the backplane module has a core control module interface area, and the core control module interface area is provided with a core board strip jack for inserting the core board tongue plate;

   Two sides of any one of the core board strip-shaped sockets are provided with mutually symmetrical core board front row-type welding feet and core board reverse-side row-type welding feet.
4. The circuit board structure according to claim 3, wherein:

   In the interface area of the core control module, a semi-circular hole is formed in each welding piece of the front row of solder pins on the front side of the core board and the row of solder feet on the back side of the core board, and the notch of the semi-circular hole is the same as the The sides of the core board strip sockets are coincident.
5. The circuit board structure according to claim 3 or 4, characterized in that:

   The core control module is assembled on the base plate module, and the core board tongue plate is inserted into the corresponding core board strip socket;

   Wherein, the front row-type solder lugs of the core board are welded on the front-side row-type welding legs of the core board, and the core board reverse-side row-type welding lugs are welded on the back-side row-type welding legs of the core board.
6. The circuit board structure according to claim 1 or 2, characterized in that:

   The core control module is provided with a plurality of fasteners, the bottom plate module is provided with a plurality of fastener holes, and the fasteners and the fastener holes are in a one-to-one correspondence;

   When the core control module is assembled on the base plate module, the clips are clipped in the corresponding clip holes.
7. The circuit board structure according to claim 1, wherein:

   The functional module has several functional tongue plates;

   The two sides of any one of the function board tongue plates are provided with mutually symmetrical function board front row type welding pieces and function board reverse side row type welding pieces;

   Correspondingly, the base plate module has a function module interface area, and the function module interface area is provided with a function board strip-shaped jack for inserting the function board tongue plate;

   The two sides of any of the functional board strip sockets are provided with mutually symmetrical function board front row-type welding feet and function board reverse-side row-type welding feet.
8. The circuit board structure according to claim 7, wherein:

   In the interface area of the functional module, a semi-circular hole is formed in each welding piece of the front row of solder pins of the function board and the row of solder legs of the function board, and the notch of the semi-circular hole is connected to all the solder pins. The sides of the strip jacks on the function board are coincident.
9. The circuit board structure according to claim 7 or 8, characterized in that:

   The function module is assembled on the base plate module, and the function board tongue plate is inserted into the corresponding function board strip socket;

   Wherein, the front row type solder tabs of the function board are welded on the front row type solder pins of the function board, and the function board rear row type solder tabs are welded to the back row type solder legs of the function board.
10. The circuit board structure according to claim 7, wherein:

    The front row type solder pads of the function board and the back row type solder pads of the function board are composed of a high voltage signal conducting sheet and a low voltage signal conducting sheet;

    Wherein, there is a high-voltage safety insulation distance between two adjacent high-voltage signal conductive sheets, and a low-voltage safety insulation distance is provided between two adjacent low-voltage signal conductive sheets.
11. The circuit board structure according to claim 3, wherein:

    The core control module has three core board tongues, which are:

    The tongue plate of the first core board is provided with a front row type soldering piece of the first core board and a reverse row type soldering piece of the first core board;

    The tongue plate of the second core board is provided with a front row of solder tabs of the second core board and a rear row of solder tabs of the second core board;

    The tongue plate of the third core board has a front row of solder lugs of the third core plate and a rear row of solder lugs of the third core plate;

    Correspondingly, the interface area of the core control module is provided with:

    The first core board strip-shaped jack is used for inserting the first core board tongue board, and has the first core board front row type welding feet and the first core board reverse row type welding feet;

    The second core board strip-shaped socket is used for inserting the second core board tongue board, and has the second core board front row type welding feet and the second core board reverse row type welding feet;

    The third core board strip-shaped jack is used for inserting the third core board tongue board, and has the third core board front row-type welding legs and the third core board reverse row-type welding legs;

    The functional module has two functional boards and tongues, which are:

    The tongue plate of the first function board is provided with a front row-type welding piece of the first function board and a reverse-side row-type welding piece of the first function board;

    The tongue plate of the second function board is provided with a front row of solder lugs of the second function plate and a rear row of solder lugs of the second function plate;

    Correspondingly, the function module interface area is provided with:

    The first function board strip-shaped jack is used for inserting the first function board tongue plate, and has the first function board front row type welding feet and the first function board reverse row type welding feet;

    The second function board bar-shaped jack is used for inserting the second function board tongue plate, and has the second function board front row type welding feet and the second function board reverse row type welding feet.
12. The circuit board structure according to claim 11, wherein:

    In the interface area of the core control module, the front row-type solder pins of the first core board, the front-side row-type solder pins of the second core board, and the front-side solder pins of the third core board are arranged at intervals from each other , Correspondingly, the back-row welding feet of the first core board, the back-row welding feet of the second core board, and the back-row welding feet of the third core board are spaced apart from each other;

    In the interface area of the functional module, the front row-type solder pins of the first function board and the front-side row-type solder pins of the second function board are spaced apart from each other. Correspondingly, the back-side row type of the first function board The soldering feet and the row-type soldering feet on the reverse side of the second function board are arranged at intervals from each other.
13. The circuit board structure according to claim 6, wherein:

    A plurality of the functional board tongues are arranged on the same side of the functional module;

    or,

    Several of the functional board tongues are arranged on different sides of the functional module.
14. The circuit board structure according to claim 3, wherein:

    The number of the backplane modules is at least two;

    Opposite two sides of the core control module each have the core board tongue;

    The core control module is plugged on two adjacent baseplate modules to achieve vertical expansion.
15. The circuit board structure according to claim 7, wherein:

    Each of the opposite sides of the functional module has the functional plate tongue;

    The functional modules are inserted on two adjacent baseplate modules to achieve vertical expansion.
16. The circuit board structure according to claim 1 or 2, characterized in that:

    At least one grounding pin, at least one I/O soldering pin, and at least one power supply soldering pin for soldering the core control module and the functional module are provided on the base plate module.
17. The circuit board structure according to claim 1 or 2, characterized in that:

    The circuit board structure also includes a chip-type terminal module;

    the terminal module has several terminal tongues;

    Two sides of any one of the terminal tongue plates are provided with mutually symmetrical terminal front row type solder tabs and terminal back row type solder tabs;

    Correspondingly, the base plate module has a terminal module interface area, and the terminal module interface area is provided with a terminal bar-shaped jack for inserting the terminal tongue plate;

    Both sides of any of the terminal strip sockets are provided with mutually symmetrical terminal front row-type welding feet and terminal back-side row-type welding legs;

    And in the interface area of the terminal module, a semi-circular hole is opened on the front side of the terminal and the side of the terminal is provided with a semicircular hole, and the notch of the semicircular hole is the same as the hole of the terminal bar socket. Edges coincide.
18. The circuit board structure according to claim 17, wherein:

    In the terminal module interface area, there are also:

    front-side solder pins with round holes that are equipotentially connected to the front-side row-type solder pins of the terminal;

    The reverse solder fillet with a round hole is equipotentially connected to the row-type solder fillet on the reverse side of the terminal.
19. The circuit board structure according to claim 1, wherein:

    The circuit is etched on the PCB bottom plate, the pin interface of the function module and the core control module is preset, and the pin interface is electrically connected;

    Etch the functional circuit on the PCB bottom plate and install the supporting electronic components to form a functional circuit board;

    The integrated circuit with control function is etched on the PCB bottom plate, the control device is installed, and the control circuit and electronic components are etched.
20. The circuit board structure according to claim 1, wherein:

    The conductive pins of the functional module include a high-voltage signal conductive sheet and a low-voltage signal conductive sheet;

    The insulation distance L3 between the high-voltage signal conductive sheet and the adjacent conductive sheet is not less than the high-voltage safety insulation distance L0; the insulation distance L4 between the low-voltage signal conductive sheet and the adjacent conductive pins is not less than the low-voltage safety insulation distance L0'.

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