WO2022193840A1

WO2022193840A1 - Electronic device and temperature measurement method for electronic device

Info

Publication number: WO2022193840A1
Application number: PCT/CN2022/073548
Authority: WO
Inventors: 朱学艺
Original assignee: Oppo广东移动通信有限公司
Priority date: 2021-03-18
Filing date: 2022-01-24
Publication date: 2022-09-22
Also published as: CN113079230B; CN113079230A

Abstract

The present application discloses an electronic device and a temperature measurement method for the electronic device. The electronic device comprises: a cover plate disposed close to the outer side of the electronic device; a light source and a sensor disposed inside the electronic device opposite to the cover plate; and a film layer disposed on the cover plate and having a thickness that varies with temperature. The light emitted by the light source sequentially passes through the film layer and the cover plate, and is reflected by an object having the temperature to be measured to form reflected light, and the reflected light sequentially passes through the cover plate and the film layer to form temperature measurement light capable of being incident to the sensor.

Description

Temperature measurement methods for electronic equipment and electronic equipment

This application claims the priority of the Chinese patent application with the application number 202110292096.3 and the invention name "Electronic Device", which was filed with the China Patent Office on March 18, 2021, the entire contents of which are incorporated into this application by reference.

technical field

The present application relates to the technical field of electronic devices, and in particular, to an electronic device and a temperature measurement method for the electronic device.

Background technique

Temperature measurement has been widely used in many fields such as home, industrial manufacturing, navigation, aerospace, etc. There are various methods of temperature measurement. Common temperature measurement methods include thermal imaging solutions. Thermal imaging solutions are realized by uncooled infrared focal plane detectors. Temperature measurement function. However, the uncooled infrared focal plane detector takes up a lot of space in electronic equipment due to its large volume, and has a high cost.

SUMMARY OF THE INVENTION

In a first aspect, an embodiment of the present application provides an electronic device, and the electronic device includes:

a cover plate, the cover plate is arranged on the side of the electronic device close to the outside of the electronic device;

a light source, the light source is arranged on the side opposite to the cover plate inside the electronic device;

a sensor disposed inside the electronic device on a side opposite to the cover; and

a film layer, the film layer is arranged on the cover plate, and the thickness of the film layer can vary with temperature;

The light emitted by the light source passes through the film layer and the cover plate in turn, and is reflected by the object to be measured to form reflected light, and the reflected light passes through the cover plate and the film layer in turn to form a temperature measurement. light, and the temperature measuring light can be incident on the sensor.

In a second aspect, an embodiment of the present application provides a temperature measurement method for an electronic device. The electronic device includes a cover plate disposed on a side close to the outside of the electronic device, and a cover plate disposed inside the electronic device opposite to the cover plate. A light source and a sensor on one side and a film layer disposed on the cover plate, the thickness of the film layer can vary with temperature, and the temperature measurement method of the electronic device includes:

The light emitted by the light source sequentially passes through the film layer and the cover plate, and is reflected by the object to be measured to form reflected light, and the reflected light sequentially passes through the cover plate and the film layer to form temperature measurement light, and The temperature measuring light can be incident on the sensor;

The sensor receives the temperature measurement light, and calculates the difference between the light intensity of the temperature measurement light and the preset light intensity to obtain the light intensity difference;

According to the light intensity difference, calculate the reflectivity difference between the reflectivity of the film layer and the preset reflectivity;

According to the difference in reflectivity, the temperature difference between the temperature of the object to be measured and the preset temperature is calculated, and the temperature of the object to be measured is calculated according to the difference in temperature.

Description of drawings

FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.

FIG. 2 is a first structural block diagram of an electronic device provided by an embodiment of the present application.

FIG. 3 is a schematic structural diagram of a film layer provided in an embodiment of the present application.

FIG. 4 is a schematic diagram of the relationship between the wavelength band of the light source and the reflectance corresponding to the film layers of different materials provided in the embodiment of the present application.

FIG. 5 is a second structural block diagram of an electronic device provided by an embodiment of the present application.

FIG. 6 is a schematic diagram showing the relationship between the reflectivity and the temperature of the film provided by the embodiment of the present application.

FIG. 7 is a schematic diagram of a scene of temperature measurement of an electronic device provided by an embodiment of the present application.

FIG. 8 is a third structural block diagram of an electronic device provided by an embodiment of the present application.

FIG. 9 is a fourth structural block diagram of the electronic device provided by the embodiment of the present application.

FIG. 10 is a fifth structural block diagram of the electronic device provided by the embodiment of the present application.

FIG. 11 is a first schematic flowchart of a temperature measurement method for an electronic device provided by an embodiment of the present application.

FIG. 12 is a schematic diagram of a second structure of the temperature measurement method for an electronic device provided by an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of this application.

Temperature measurement methods include a variety of methods, such as contact measurement, the common use of thermometers to expand and contract away from each other. Under the condition of constant external pressure, when the temperature rises, the volume increases, and when the temperature decreases, the volume decreases. Temperature measurement, but this measurement method requires a certain measurement time; another example is the thermal imaging solution. The thermal imaging solution uses an uncooled infrared focal plane detector to realize the temperature measurement function, but the support-edge infrared focal plane detector is large due to its large size , which will take up more space in the electronic device.

In order to solve the above problem, an embodiment of the present application provides an electronic device. Please refer to FIG. 1 , which is a schematic structural diagram of the electronic device provided by the embodiment of the present application. The electronic device 100 may be a smart phone, a tablet computer, a PDA (Personal Digital Assistant), and the like.

The electronic device 100 may include a display screen 101 , a casing 102 , a circuit board 103 , a battery 104 and a camera 105 . It should be noted that the electronic device 100 is not limited to the above devices, and may also include other devices.

The display screen 101 is disposed on the casing 102 to form a display surface of the electronic device 100 for displaying information such as images and texts. The display screen 101 may include a liquid crystal display (Liquid Crystal Display, LCD) or an organic light-emitting diode (Organic Light-Emitting Diode, OLED) type display screen.

It can be understood that the display screen 101 may include a display surface and a non-display surface opposite to the display surface. The display surface is the surface of the display screen 101 facing the user, that is, the surface of the display screen 101 that is visible to the user on the electronic device 100 . The non-display surface is the surface of the display screen 101 facing the inside of the electronic device 100 . The display surface is used to display information, and the non-display surface does not display information.

It can be understood that a protective cover plate may also be provided on the display screen 101 to protect the display screen 101 and prevent the display screen 101 from being scratched or damaged by water. The protective cover plate may be a transparent glass cover plate, so that the user can observe the content displayed on the display screen 101 through the protective cover plate. It can be understood that the protective cover plate may be a glass cover plate made of sapphire.

The casing 102 is used to form the outer contour of the electronic device 100 so as to accommodate electronic devices, functional components, etc. of the electronic device 100 , and at the same time form a seal to protect the electronic devices and functional components inside the electronic device 100 . For example, functional components such as a circuit board, a camera, and a vibration motor of the electronic device 100 may be arranged inside the housing 102 . It can be understood that the housing 102 may include a middle frame and a back cover.

Wherein, the circuit board 103 may be arranged inside the casing 102 . For example, the circuit board 103 may be mounted on the middle frame of the housing 102 for fixing and sealing the circuit board 103 inside the electronic device through the battery cover. Specifically, the circuit board 103 can be installed on one side of the carrier board, and the above-mentioned display screen 101 can be installed on the other side of the carrier board. The circuit board 103 may be the main board of the electronic device 100 . Wherein, the circuit board 103 may also integrate one or more functional components such as a processor, a camera, and a headphone jack. Meanwhile, the display screen 101 may be electrically connected to the circuit board 103 to control the display of the display screen 101 through a processor on the circuit board 103 .

Wherein, the battery 104 may be arranged inside the casing 102 . For example, the battery 104 can be mounted on the middle frame of the housing 102 for fixing, and the battery 104 can be sealed inside the electronic device 100 through a battery cover. Meanwhile, the battery 104 may be electrically connected to the circuit board 103 to enable the battery 104 to power the electronic device 100 . Wherein, a power management circuit may be provided on the circuit board 103 , and the power management circuit is used for distributing the voltage provided by the battery 104 to each electronic device in the electronic device 100 .

The camera 105 may include a front camera 1051 and a rear camera 1052, and the camera 105 may be integrated on the circuit board 103, that is, electrically connected to the circuit board 103, so as to control the camera 105 to take pictures through the processor on the circuit board 103.

In order to realize the temperature measurement function of the electronic device 100 , this embodiment improves the internal components of the electronic device 100 . Please refer to FIG. 2 , which is a first structural block diagram of an electronic device provided by an embodiment of the present application. The electronic device 100 may include a cover plate 106 , a light source 107 , a sensor 108 and a film layer 109 . Components capable of implementing the temperature measurement function of the electronic device 100 may be integrated into the camera 105 , that is, the temperature measurement function of the electronic device 100 can be implemented through the camera 105 .

Wherein, the cover plate 106 can be arranged on the front camera 1051 or the rear camera 1052. If the cover plate 106 is arranged on the front camera 1051, the cover plate 106 is overlapped with the protective cover plate arranged on the display screen 101. In other words, the same cover is used; if the cover 106 is arranged on the rear camera 1052, the cover 106 can be arranged at the end of the rear camera 1052 close to the outside. The cover plate 106 may be a transparent glass cover plate, so that the user can realize the photographing function of the front camera 1051 and the rear camera 1052 through the cover plate 106 . It can be understood that the cover plate 106 is arranged on the side of the camera 105 close to the outside of the electronic device 100 , that is, the cover plate 106 is arranged on the side close to the outside of the electronic device 100 . Protection to prevent the camera 105 from being scratched.

The light source 107 can be arranged inside the camera 105, that is, inside the electronic device 100, and arranged on the opposite side of the cover plate 106, so that the light emitted by the light source 107 can pass through the cover plate 106 and be incident on the object to be measured. The light source 107 may be visible light in a special wavelength band, such as visible light to near infrared wavelengths ranging from 400 nm to 100 nm. The light source 107 can be set as a narrow-band light source with a special wavelength band, for example, an LED narrow-band light is installed inside the electronic device 100 such as the camera 105, and a lampshade that acts as a filter can be set outside the LED narrow-band light to realize the LED narrow-band light. The lamp emits a narrow-band light source in a specific wavelength band.

Wherein, the sensor 108 may be disposed inside the electronic device 100 , such as the inside of the camera 105 , on the side opposite to the cover plate 107 . The sensor 108 can be disposed farther from the cover plate 106 than the light source 107 , or can be disposed at a certain angle with the light source 107 to prevent the light emitted by the light source 107 from being directly received by the sensor 108 . Further, the light emitted by the light source 107 may only be directed towards the cover plate 106, and if the sensor 108 is disposed opposite to the cover plate 106 and behind the light source 107, or the sensor 108 is located at a position where the light cannot be incident, the sensor 108 can be effectively prevented from entering. The light emitted by the light source 107 is directly received. The sensor 108 can be a photosensitive chip, that is, it can receive a light source, and in order to further avoid directly receiving light, the surrounding area of the sensor 108 can be painted black, thereby improving the signal-to-noise ratio, where the signal-to-noise ratio is the difference between the signal received by the electronic device and the The ratio of noise, if the signal-to-noise ratio of the received signal is low, the signal cannot be separated from the noise, thereby affecting the effect of the sensor 108 receiving the light source.

The film layer 109 may be disposed on the cover plate 106, may be disposed on the side of the cover plate 106 facing the inside of the electronic device 100, such as the inside of the camera 105, or may be disposed on the side of the cover plate 106 facing the outside of the electronic device 100, but in order to protect the film The layer 109 does not contact the outside world as much as possible to cause damage or contamination, and the film layer 109 is usually disposed on the side facing the inside of the electronic device 100 . The film layer may be disposed on the cover plate 106 by coating a film on the inner side of the cover plate 106 . The thickness of the film layer 109 may vary with temperature, for example, the thickness of the film layer increases as the temperature increases, and the thickness of the film layer decreases as the temperature decreases. The film whose thickness can change with temperature is the optical lossless film 1091. The reflectance of the optical lossless film 1091 changes obviously under the light source 107 of a specific wavelength band. When the external temperature changes, the change of its thickness will cause the reflectance to change. , there is a corresponding mapping relationship between the reflectivity and the temperature, so the temperature measurement function of the electronic device 100 can be realized.

In order to further optimize the temperature measurement function of the electronic device 100 , the structure of the film layer 109 can be changed. Please refer to FIG. 3 , which is a schematic structural diagram of the film layer 109 provided by an embodiment of the present application. The film layer 109 may include at least one optically lossless film layer 1091 and at least two optically lossy film layers 1092, and any optically lossless film layer 1091 is disposed between the two optically lossy film layers 1092 to form an optically lossy film A three-layer composite structure of layer-optical lossless film layer-optical lossy film layer. Wherein, the degree of change in reflectivity of the three-layer composite structure with temperature is more sensitive than that of an optical lossless film layer 1091 , so the temperature measurement function of the electronic device 100 can be more accurately realized.

Wherein, the optical lossless film layer 1091 may be a metal material, such as realized by various metals, such as gold, silver, copper, zinc, chromium, aluminum, titanium, magnesium, indium, platinum, germanium, nickel, and metal alloys. In addition, optical dielectric materials with optical loss can also replace gold thin films, such as silicon. The optically lossless film layer 1092 can be made of polymethyl methacrylate material, and can also be replaced by silicon dioxide, optical glass, and various polymer films instead of the polymethyl methacrylate material.

The film layer 109 provided on the cover plate 106 is not limited to the above-mentioned three-layer composite structure of the optical loss film layer-optical lossless film layer-optical loss film layer, and can also be from three to dozens of layers. The optical lossless film layer 1091 and the optical lossy film layer 1092 can be kept alternately arranged, for example, if the film layer 109 includes five films, the optical loss film layer-optical lossless film layer-optical loss film layer-optical lossless film layer - Five-layer composite structure of optical loss film layers.

The thickness of the optical lossless film layer 1091 is greater than the thickness of the optical loss film layer 1092. Since the optical loss film layer 1092 has a great influence on the light source 107, a relatively thin optical loss film layer 1092 is provided to adjust the optical loss film layer. The effect of the degree of freedom of the thickness of the film layer 109 is to optimize the thickness of the film layer 109 so that the reflectivity of the film layer 109 changes significantly under the influence of the external temperature.

If the film layer 109 is a three-layer composite structure of an optical loss film layer-optical lossless film layer-optical loss film layer, the thicknesses of the two optical loss film layers 1092 disposed on both sides of the same optical lossless film layer 1091 are different . Since the optical loss film layer 1092 plays a role in adjusting the degree of freedom of the thickness of the film layer 109, two optical loss film layers 1092 with different thicknesses can be arranged to perform secondary adjustment on the same optical lossless film layer 1091, and the optical loss film layer 1091 can be adjusted twice. The thickness of the three-layer composite structure of layer-optical lossless film layer-optical lossy film layer is adjusted more optimally, so that the reflectivity of the three-layer composite structure of optical loss film layer-optical lossless film layer-optical loss film layer can be adjusted more optimally. The change is more obvious, and the temperature measurement function of the electronic device 100 is further improved.

Wherein, when the film layer 109 is a three-layer composite structure of an optical loss film layer-optical lossless film layer-optical loss film layer, the thickness of the optical lossless film layer ranges from 1 micron to 10 microns, and the thickness of the optical loss film layer is 5 nm to 50 nm. In addition, the wavelength range of the light emitted by the light source 107 is 400 nanometers to 1200 nanometers, wherein 400 nanometers to 700 nanometers are visible light wavelength bands, and 700 nanometers to 1200 nanometers are near infrared wavelengths. When the film layer 109 is a three-layer composite structure and satisfies the thickness range of the above film layer, and the light emitted by the light source 107 is within the above wavelength range, the reflectivity of the film layer 109 corresponding to the temperature measurement light received by the sensor 108 is extremely high It can be understood that the conditions for making the reflectivity of the film layer 109 to be a minimum value are the thickness of the optical lossless film layer in the film layer 109, the thickness of the optical loss film layer and the wavelength range of the light emitted by the light source 107 at the same time. meet the above range requirements.

For example, the three-layer composite structure of the optical loss film layer-optical lossless film layer-optical loss film layer has a thickness of 34.2nm, 1840nm, and 21.7nm at room temperature, respectively. The optical loss film layer is made of gold material, and the optical lossless film layer is made of gold. If the polymethyl methacrylate material is used, then based on the selected material and thickness of the film layer 109, when the light source 107 is in the wavelength band of 632 nm, the reflectivity of the film layer 109 is a minimum value.

As shown in FIG. 4 , FIG. 4 is a schematic diagram showing the relationship between the wavelength band of the light source and the reflectance corresponding to the film layers of different materials provided in the embodiment of the present application. It can be seen from the figure that the reflectivity of the three-layer composite structure 1093 of the optical loss film layer-optical lossless film layer-optical loss film layer and the reflectivity of the optical lossless film layer 1091 both reach the minimum value under the light source of 632nm, but at Under the same temperature and the same wavelength light source, the reflectivity of the three-layer composite structure 1093 of the optical loss film layer-optical lossless film layer-optical loss film layer changes significantly relative to the reflectance of the optical lossless film layer 1091. When the external temperature changes , the change of the reflectivity of the three-layer composite structure 1093 of the optical loss film layer-optical lossless film layer-optical loss film layer is also more sensitive, and a better temperature measurement effect can be achieved.

The light emitted by the light source 107 passes through the film layer 109 and the cover plate 106 in sequence, and is reflected by the object to be measured to form a reflected light. The reflected light passes through the cover plate 106 and the film layer 109 in turn to form a temperature measurement light. The temperature light can be incident on the sensor 108, that is, the sensor 108 can receive the temperature measurement light.

Please refer to FIG. 5. FIG. 5 is a second structural block diagram of an electronic device provided by an embodiment of the present application. The electronic device 100 further includes a processor 110, which can be electrically connected to the sensor 108. After the sensor 108 receives the temperature measurement light, the processor 110 can process the temperature measurement light to further realize the electronic device 100. temperature measurement function.

Specifically, the difference between the light intensity of the temperature measuring light received by the sensor 108 and the preset light intensity can be calculated to obtain the light intensity difference, and according to the light intensity difference, the reflectivity of the film layer 109 and the preset reflectivity can be calculated by calculating According to the reflectivity difference, the temperature difference between the temperature of the object to be measured and the preset temperature is calculated, and the temperature of the object to be measured is calculated according to the temperature difference.

The light intensity of the temperature measuring light is related to the brightness and darkness of the picture or image formed by the sensor 108 receiving the temperature measuring light. The brighter the picture or image, the greater the light intensity of the temperature measuring light; If it is dark, it means that the light intensity of the temperature measurement light is smaller. The light intensity of the temperature measuring light has a proportional relationship with the reflectivity of the film layer 109, so the reflectivity of the film layer 109 can be determined by the light intensity of the temperature measuring light.

Please refer to FIG. 6 . FIG. 6 is a schematic diagram illustrating the relationship between the reflectivity and the temperature of the film layer 109 provided by the embodiment of the present application. As can be seen from the figure, the reflectivity of the film layer 109 also has a proportional relationship with the temperature of the object to be measured. Therefore, the object to be measured can be calculated according to the reflectivity difference between the reflectivity of the film layer 109 and the preset reflectivity. The temperature difference between the temperature and the preset temperature, and then calculate the temperature of the object to be measured according to the sum of the temperature difference and the preset temperature. Among them, the reflectivity of the three-layer composite structure 1093 of the optical loss film layer-optical lossless film layer-optical loss film layer is more obvious than the reflectance of the optical lossless film layer 1091 with temperature. Therefore, the use of optical loss film The reflectivity of the three-layer composite structure 1093 of the layer-optical lossless film layer-optical lossy film layer can be used to calculate the temperature of the object to be measured more accurately.

Wherein, the above-mentioned preset light intensity, preset reflectivity and preset temperature may be calculated by the processor 110 at room temperature when no object to be temperature-measured touches the cover plate 106, such as when the electronic device 100 is at room temperature. The light intensity, reflectivity and temperature can be measured by taking the room temperature as a standard to measure the temperature when it is in contact with the object to be measured or is close to the cover plate 106 as a comparison.

In order to further increase the accuracy of the temperature measurement of the object to be measured by the electronic device 100, the thickness of the optical lossless film layer 1091 in the film layer 109 can be set to be different at different locations, such as the first position and the second position of the optical lossless film layer 1091. The thickness of the two positions is different. At this time, after the light emitted by the light source 107 passes through the film layer 109 - the cover plate 106 - the object to be measured - the cover plate 106 - the film layer 109 , the first temperature measurement light will be generated at the first position, and the second temperature measurement light will be generated at the second position. temperature light, the processor 110 can calculate the difference between the light intensity of the first temperature measuring light received by the sensor 108 and the light intensity of the second temperature measuring light and the preset light intensity, and obtain the first light intensity difference and the second light intensity Intensity difference value, according to the first light intensity difference value and the second light intensity difference value, respectively calculate the reflectivity of the first position and the difference between the reflectivity of the second position and the preset reflectivity, and obtain the first reflectivity difference value and the second reflectivity difference, according to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the object to be measured and the preset temperature are calculated and obtained. For the temperature difference, the first temperature difference and the second temperature difference are averaged, and then summed with the preset temperature to obtain the target temperature of the object to be temperature-measured. It can be understood that, the optical lossless film layer 1091 may further include a third position, a fourth position, etc., and the specific calculation method is the same as the above method, which is not repeated here.

Please refer to FIG. 7 . FIG. 7 is a schematic diagram of a temperature measurement scenario of an electronic device provided by an embodiment of the present application. When the electronic device 100 detects that the object to be temperature-measured contacts or approaches the outer surface of the cover plate 106 , the temperature measurement function of the electronic device 100 can be turned on through a preset operation, and the light source 107 is turned on, and the light source 107 faces the direction of the film layer 109 and the cover plate 106 Light is emitted, the light is first refracted through the film layer 109, then refracted once through the cover plate 106, and then reflected after touching the object to be measured, resulting in reflected light, which is transmitted through the cover plate 106 again. One refraction, and then another refraction occurs through the film layer 109, and finally a temperature measurement light is formed, and the sensor 108 receives the temperature measurement light. The processor 110 calculates the difference between the light intensity of the temperature measuring light and the light intensity at room temperature to obtain the light intensity difference, and according to the light intensity difference, calculates the reflectivity difference between the reflectivity of the film layer 109 and the reflectivity at room temperature According to the reflectivity difference, the temperature difference between the temperature of the object to be measured and the room temperature is calculated, and the sum of the temperature difference and the room temperature is calculated to obtain the temperature of the object to be measured, so as to realize the temperature measurement of the electronic device 100 Function.

Please refer to FIG. 8. FIG. 8 is a third structural block diagram of an electronic device provided by an embodiment of the present application. The electronic device 100 may further include a display screen 101 and a speaker 111 , and the display screen 101 and the speaker 111 may be electrically connected to the processor 110 respectively. After the processor 110 calculates the temperature of the object to be measured, the temperature of the object to be measured can be displayed through the display screen 101 , or the temperature of the object to be measured can be played through the speaker 111 . Of course, the temperature of the object to be temperature-measured measured by the user may also be prompted in other ways, which is not specifically limited here.

Please refer to FIG. 9. FIG. 9 is a fourth structural block diagram of the electronic device provided by the embodiment of the present application. The electronic device 100 may further include a proximity sensor 112 . The proximity sensor 112 can detect the position information between the object to be measured and the cover plate 106 , and the processor 110 can turn on the electronic device after detecting the position information, for example, when the proximity sensor 112 detects that the object to be measured touches the cover plate 106 . The temperature measurement function of the device 100 is to turn on the light source.

It can be understood that the temperature measurement function can also be triggered to start the temperature measurement function by setting a physical button on the electronic device 100 or through a virtual button or an application program in the electronic device 100 to trigger the start of the temperature measurement function. The manner of enabling the temperature measurement function of the electronic device 100 is not limited to this, and is not specifically limited here.

It should be noted that, after the temperature measurement function of the electronic device 100 is turned on through the physical button or the virtual button, if there is an object to be measured close to or in contact with the cover 106, the temperature of the object to be measured is measured; if there is no object to be measured If it exists, the temperature measurement function of the electronic device 100 is turned off. In order to prevent the existence of false touch operations, after the temperature measurement function is turned on, it can be detected whether there is an object to be measured approaching or touching the cover 106 within a preset time, and if there is no object to be measured after the preset time, it will be automatically Turning off the temperature measurement function, of course, can also manually turn off the temperature measurement function, which can effectively prevent the wrong opening of the temperature measurement function from causing the power consumption of the electronic device 100 to increase and the battery life to decrease. The preset time may be specifically limited according to the actual situation, for example, 10 seconds or 20 seconds, etc., which is not specifically limited here.

Please refer to FIG. 1 and FIG. 10 . FIG. 10 is a fifth structural block diagram of the electronic device provided by the embodiment of the present application. The electronic device 100 may further include a fingerprint unlocking module 113 . It should be noted that the fingerprint unlocking module 113 includes the above-mentioned component cover 106 for realizing the temperature measurement function of the electronic device 100 , the light source 107 , the sensor 108 , and the light source 107 and the sensor 108 in the film layer 109 , wherein the processor 110 and the fingerprint unlocking module The sensor 108 in 113 is in an electrical connection relationship, so the temperature measurement of the object to be measured can be realized through the fingerprint unlocking module 113, and the fingerprint unlocking module 113 can be used for multiple purposes, that is, the user can realize the unlocking process through the fingerprint unlocking module 113. At the same time, the temperature measurement of the user is realized.

The functions and positions of the cover plate 106 , the light source 107 , the sensor 108 and the film layer 109 are similar to the above-mentioned ones. The sensor 108 is arranged on the side opposite to the cover plate 106 , the sensor 108 is arranged inside the fingerprint unlocking module 106 on the opposite side of the cover plate, and the film layer 109 is arranged on the cover plate 106 .

The difference between setting the light source 107 and the sensor 108 on the fingerprint unlocking module 113 and setting on the camera 105 is that the user can measure the user's body temperature during the process of unlocking the fingerprint. The sensor and other methods are more convenient, and the photographing function of the camera 105 will not be affected because the film layer 109 is arranged inside the cover plate 106 in the camera 105 .

As can be seen from the above, the electronic device provided in this embodiment includes: a cover plate, a light source, a sensor, a film layer and a processor. The thickness of the film layer can vary with temperature, and the sensor can transmit the emitted signal of the light source through the film layer and the cover plate in sequence. , when contacting the object to be measured, a reflected light is formed. After the reflected light passes through the cover plate and the film layer to form a temperature measuring light, the temperature measuring light is received. The processor calculates the temperature of the object to be measured according to the temperature measuring light. A film layer whose thickness changes with temperature is set in the electronic device, and the sensor receives different temperature measurement light formed under different thicknesses of the film layer to obtain the change of the reflectivity of the film layer, thereby realizing the temperature measurement of the object to be measured, and due to The film layer is small in size and does not take up too much space in electronic equipment.

Embodiments of the present application also provide a temperature measurement method for an electronic device. Please refer to FIG. 11 . FIG. 11 is a first schematic flowchart of a temperature measurement method for an electronic device provided by an embodiment of the present application. The temperature measurement method of the electronic device can be applied to the electronic device in the above-mentioned embodiment, and the temperature measurement method of the electronic device can include the following steps:

201. When measuring the temperature of the object to be measured, turn on the light source.

In this embodiment, the electronic device includes a cover plate, a light source, a sensor, and a film layer, and the above-mentioned devices can be integrated into a camera or a fingerprint unlocking module, and the film layer can be a single-layer optical lossless film layer, It can also be a three-layer composite structure of an optical loss film layer-optical lossless film layer-optical loss film layer, or it can be several layers to dozens of layers. Since the thickness of the film can change with temperature, the reflectivity of the optical lossless film changes significantly under the light source of a specific wavelength band. When the external temperature changes, the thickness change will cause the reflectivity to change, and there is a corresponding mapping between reflectivity and temperature. Therefore, the temperature measurement function of electronic equipment can be realized.

The electronic device may also include a proximity sensor. The proximity sensor can detect the position information between the object to be measured and the cover, and when it is detected that the object to be measured touches the cover, the temperature measurement function of the electronic device is turned on, that is, the light source is turned on.

It can be understood that, the temperature measurement function can also be triggered to start the temperature measurement function by setting a physical button on the electronic device, or the temperature measurement function can be triggered to start the temperature measurement function through a virtual button or an application program in the electronic device. The manner of enabling the temperature measurement function of the electronic device is not limited to this, and is not specifically limited here.

It should be noted that after the temperature measurement function of the electronic device is turned on through the physical button or virtual button, if there is an object to be measured close to or touch the cover, the temperature of the object to be measured will be measured; if there is no object to be measured, Turn off the temperature measurement function of the electronic device. In order to prevent the operation of false touches, after the temperature measurement function is turned on, it is possible to detect whether the object to be measured approaches or touches the cover plate within a preset time. If there is no object to be measured after the preset time, it will be automatically closed. The temperature measurement function, of course, can also be manually turned off, which can effectively prevent the wrong opening of the temperature measurement function from causing the power consumption of electronic devices to increase and the battery life to decrease. The preset time may be specifically limited according to the actual situation, for example, 10 seconds or 20 seconds, etc., which is not specifically limited here.

Wherein, the light source may be visible light in a special wavelength band, such as visible light from 400nm-100nm to near-infrared wavelengths. The light source can be set as a narrow-band light source with a special band, for example, an LED narrow-band light can be installed inside an electronic device such as a camera, and a lampshade that acts as a filter can be set outside the LED narrow-band light, so that the LED narrow-band light emits special light. narrow-band light source.

202. The light emitted by the control light source passes through the film layer and the cover plate in turn, and is reflected by the object to be measured to form reflected light. The reflected light passes through the cover plate and the film layer to form temperature measurement light, and the temperature measurement light can be incident on the sensor. .

The light source emits light toward the direction of the film layer and the cover plate. The light is refracted once through the film layer, and then refracted once through the cover plate, and then reflected after touching the object to be measured, resulting in reflected light, which is again reflected. A refraction occurs through the cover plate, and then a refraction occurs through the film layer, and finally a temperature measurement light is formed.

203. Control the sensor to receive the temperature measurement light, and calculate the difference between the light intensity of the temperature measurement light and the preset light intensity to obtain the light intensity difference.

The sensor receives the temperature measurement light, and the light intensity of the temperature measurement light is related to the brightness of the image and the image formed by the sensor receiving the temperature measurement light. The brighter the picture or image, the greater the light intensity of the temperature measurement light; The darker the picture or image, the lower the intensity of the temperature measurement light.

204. Calculate, according to the difference in light intensity, a difference in reflectivity between the reflectivity of the film layer and the preset reflectivity.

There is a proportional relationship between the light intensity of the temperature measuring light and the reflectivity of the film layer, so the reflectivity of the film layer can be determined by the light intensity of the temperature measuring light.

205. Calculate the temperature difference between the temperature of the object to be measured and the preset temperature according to the reflectivity difference, and calculate the temperature of the object to be measured according to the temperature difference.

There is also a proportional relationship between the reflectivity of the film layer and the temperature of the object to be measured. Therefore, the temperature of the object to be measured and the preset temperature can be calculated according to the difference between the reflectivity of the film layer and the preset reflectivity. The temperature difference is calculated according to the sum of the temperature difference and the preset temperature, and the temperature of the object to be measured is calculated.

Wherein, the above-mentioned preset light intensity, preset reflectivity and preset temperature may be the calculated light intensity, reflectivity and temperature at room temperature when no object to be measured touches the cover plate, such as when the electronic device is at room temperature. The temperature can be measured by taking the room temperature as the standard to measure the temperature when it is in contact with the object to be measured or when it is close to the cover plate.

It can be seen from the above that in this embodiment, when the temperature of the object to be measured is measured, the light source is turned on, and the emission signal of the control light source passes through the film layer and the cover plate in sequence, and when it contacts the object to be measured, a reflected light is formed, and the reflected light is transmitted in turn. The temperature measurement light is formed through the cover plate and the film layer, the sensor is controlled to receive the temperature measurement light, and the difference between the light intensity of the temperature measurement light and the preset light intensity is calculated to obtain the light intensity difference, and the film is calculated according to the light intensity difference. The reflectivity difference between the reflectivity of the layer and the preset reflectivity, according to the reflectivity difference, the temperature difference between the temperature of the object to be measured and the preset temperature is calculated, and the temperature difference of the object to be measured is calculated according to the temperature difference. temperature. By arranging a film layer whose thickness changes with temperature in the electronic device, the sensor receives different temperature measurement light formed under different thicknesses of the film layer, and obtains the change of the reflectivity of the film layer, thereby realizing the temperature measurement of the object to be measured, and Due to the small volume of the film layer, it does not take up too much space in electronic equipment.

Please refer to FIG. 12 . FIG. 12 is a second structural schematic diagram of the temperature measurement method of an electronic device provided by an embodiment of the present application. Specific steps are as follows:

301. When measuring the temperature of the object to be measured, turn on the light source.

302. The light emitted by the control light source passes through the film layer and the cover plate in turn, and is reflected by the object to be measured to form reflected light, and the reflected light passes through the cover plate and the film layer to form temperature measurement light, and the temperature measurement light can be incident on the sensor. .

In order to further increase the accuracy of the temperature measurement of the object to be measured by the electronic device, the thickness of the optical lossless film layer in the film layer can be set to be different, such as the thickness of the first position and the second position of the optical lossless film layer. different. After the emission signal from the light source passes through the film layer-cover plate-object to be temperature-measured-cover plate-film layer, the first temperature measurement light is generated at the first position, and the second temperature measurement light is generated at the second position.

Of course, a plurality of film layers with different initial thicknesses can also be plated on the inner surface of the cover plate, so that there are films with different thicknesses at different positions on the inner surface of the cover plate.

303. Control the sensor to receive the first temperature measurement light at the first position and the second temperature measurement light at the second position.

304. Calculate the difference between the light intensity of the first temperature measurement light generated at the first position and the light intensity of the second temperature measurement light generated at the second position and the preset light intensity, and obtain the first light intensity difference and the second light intensity difference.

305. According to the first light intensity difference and the second light intensity difference, calculate the difference between the reflectivity at the first position and the reflectivity at the second position and the preset reflectivity, respectively, to obtain the first reflectance difference and The second reflectivity difference.

306. Calculate, according to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the object to be temperature-measured and the preset temperature.

307. Calculate the target temperature of the object to be measured by averaging the first temperature difference and the second temperature difference.

It can be understood that the optical lossless film layer may further include a third position, a fourth position, etc., and the specific calculation method is the same as the above method, and details are not repeated here.

The electronic device may also include a display screen and a speaker. After calculating the temperature of the object to be measured, the temperature of the object to be measured can be displayed through the display screen, or the temperature of the object to be measured can be played through the speaker. Of course, the temperature of the object to be temperature-measured measured by the user may also be prompted in other ways, which is not specifically limited here.

The embodiment of the present application provides an electronic device, including:

a cover plate, the cover plate is arranged on a side close to the outside of the electronic device;

In an optional embodiment of the present application, the electronic device further includes a processor, the processor is electrically connected to the sensor, and the processor is used for:

Calculate the difference between the light intensity of the temperature measurement light received by the sensor and the preset light intensity to obtain a light intensity difference;

In an optional embodiment of the present application, the film layer includes at least one optically lossless film layer and at least two optically lossy film layers, and any one of the optically lossless film layers is disposed on the two layers of the optically lossy film layer. Between the film layers, the thickness of the optically lossless film layer is greater than the thickness of the optically lossy film layer.

In an optional embodiment of the present application, the thicknesses of the two optical lossy film layers disposed on both sides of the same optical lossless film layer are different.

In an optional embodiment of the present application, the optical lossy film layer is a metal material, and the optical lossless film layer is a polymethyl methacrylate material.

In an optional embodiment of the present application, the thickness of the optically lossless film layer is in the range of 1 micrometer to 10 micrometers, and the thickness of the optical lossy film layer is 5 nanometers to 50 nanometers.

In an optional embodiment of the present application, the wavelength range of the light emitted by the light source is 400 nanometers to 1200 nanometers.

In an optional embodiment of the present application, the electronic device further includes a display screen, the display screen is electrically connected to the processor, and the display screen is used to display the temperature of the object to be measured.

In an optional embodiment of the present application, the electronic device further includes a speaker, the speaker is electrically connected to the processor, and the speaker is used to play the temperature of the object to be measured.

In an optional embodiment of the present application, the thickness at the first position and the thickness at the second position in the film layer are different, and the processor is further configured to:

Calculate the difference between the light intensity of the first temperature measurement light generated at the first position and the light intensity of the second temperature measurement light generated at the second position and the preset light intensity, and obtain the first light intensity difference and the second light intensity difference;

According to the first light intensity difference and the second light intensity difference, calculate the reflectivity of the first position and the difference between the reflectivity of the second position and the preset reflectivity, respectively, to obtain the first reflectivity the difference and the second reflectivity difference;

According to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the temperature-measured object and the preset temperature are calculated to obtain the first temperature difference and the second temperature difference;

The target temperature of the object to be measured is calculated by averaging the first temperature difference and the second temperature difference.

In an optional embodiment of the present application, the electronic device further includes a proximity sensor, and the proximity sensor is used to detect the position information of the object to be temperature-measured and the cover plate, and the processor is further configured to:

When the proximity sensor detects that the object to be temperature-measured contacts the cover plate, the light source is turned on.

In an optional embodiment of the present application, the electronic device further includes a fingerprint unlocking module, and the fingerprint unlocking module includes the light source and the sensor.

In an optional embodiment of the present application, the sensor is disposed on the side of the light source away from the cover plate, so that the distance between the receiving surface of the sensor and the cover plate is greater than the emission of the light source The distance between the surface and the cover plate.

In an optional embodiment of the present application, the sensor is arranged outside the illumination range of the light source.

An embodiment of the present application further provides a temperature measurement method for an electronic device, wherein the electronic device includes a cover plate disposed on a side close to the outside of the electronic device, and a cover plate disposed inside the electronic device opposite to the cover plate. A light source and a sensor on the side and a film layer disposed on the cover plate, the thickness of the film layer can vary with temperature, and the temperature measurement method of the electronic device includes:

In an optional embodiment of the present application, the method further includes:

The sensor receives the first temperature measuring light at the first position and the second temperature measuring light at the second position, wherein the thickness of the first position and the thickness of the second position in the film layer are different;

respectively calculating the difference between the light intensity of the first temperature measuring light and the light intensity of the second temperature measuring light and the preset light intensity, to obtain the first light intensity difference and the second light intensity difference;

According to the first light intensity difference value and the second light intensity difference value, the reflectivity of the first position and the difference between the reflectivity of the second position and the preset reflectivity are calculated respectively, and the first the difference in reflectivity and the second difference in reflectivity;

According to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the object to be measured and the preset temperature are calculated and obtained. value;

In an optional embodiment of the present application, the optical loss film layer is a metal material, and the optical loss film layer is a polymethyl methacrylate material.

It should be noted that, for the temperature measurement method of the electronic device of the embodiment of the present application, ordinary testers in the art can understand that all or part of the process of realizing the temperature measurement method of the electronic device of the embodiment of the present application can be obtained through a computer program. Control related hardware to complete, the computer program can be stored in a computer-readable storage medium, such as stored in the memory of an electronic device, and executed by at least one processor in the electronic device, and the execution process can include Such as the flow of the embodiment of the temperature measurement method of the electronic device.

The electronic device provided by the embodiments of the present application has been described in detail above. The principles and implementations of the present application are described herein using specific examples, and the descriptions of the above embodiments are only used to help understand the methods and core ideas of the present application; meanwhile, for those skilled in the art, according to the Thoughts, there will be changes in specific embodiments and application scopes. To sum up, the contents of this specification should not be construed as limitations on the present application.

Claims

An electronic device comprising:

a cover plate, the cover plate is arranged on a side close to the outside of the electronic device;

a light source, the light source is arranged on the side opposite to the cover plate inside the electronic device;

a sensor disposed inside the electronic device on a side opposite to the cover; and

a film layer, the film layer is arranged on the cover plate, and the thickness of the film layer can vary with temperature;

The light emitted by the light source passes through the film layer and the cover plate in turn, and is reflected by the object to be measured to form reflected light, and the reflected light passes through the cover plate and the film layer in turn to form a temperature measurement. light, and the temperature measuring light can be incident on the sensor.
The electronic device of claim 1, wherein the electronic device further comprises a processor electrically connected to the sensor, the processor for:

Calculate the difference between the light intensity of the temperature measurement light received by the sensor and the preset light intensity to obtain a light intensity difference;

According to the light intensity difference, calculate the reflectivity difference between the reflectivity of the film layer and the preset reflectivity;

According to the difference in reflectivity, the temperature difference between the temperature of the object to be measured and the preset temperature is calculated, and the temperature of the object to be measured is calculated according to the difference in temperature.
The electronic device according to claim 1, wherein the film layer comprises at least one optically lossless film layer and at least two optically lossy film layers, and any one of the optically lossless film layers is disposed on the two optically lossless film layers. Between the lossy film layers, the thickness of the optically lossless film layer is greater than the thickness of the optical lossy film layer.
The electronic device according to claim 3, wherein the thicknesses of the two optically lossy film layers disposed on both sides of the same optically lossless film layer are different.
The electronic device according to claim 3, wherein the optical lossy film layer is a metal material, and the optical lossless film layer is a polymethyl methacrylate material.
The electronic device according to any one of claims 3-5, wherein the thickness of the optically lossless film layer is in the range of 1 micrometer to 10 micrometers, and the thickness of the optical lossy film layer is 5 nanometers to 50 nanometers.
The electronic device according to claim 6, wherein the wavelength range of the light emitted by the light source is 400 nanometers-1200 nanometers.
The electronic device according to claim 2, wherein the electronic device further comprises a display screen, the display screen is electrically connected to the processor, and the display screen is used for displaying the temperature of the object to be measured.
The electronic device according to claim 2, wherein the electronic device further comprises a speaker, the speaker is electrically connected to the processor, and the speaker is used to play the temperature of the object to be measured.
The electronic device according to claim 2, wherein the thickness of the first position and the thickness of the second position in the film layer are different, and the processor is further configured to:

Calculate the difference between the light intensity of the first temperature measurement light generated at the first position and the light intensity of the second temperature measurement light generated at the second position and the preset light intensity, and obtain the first light intensity difference and the second light intensity difference;

According to the first light intensity difference and the second light intensity difference, calculate the reflectivity of the first position and the difference between the reflectivity of the second position and the preset reflectivity, respectively, to obtain the first reflectivity the difference and the second reflectivity difference;

According to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the object to be measured and the preset temperature are calculated to obtain the first temperature difference and the second temperature difference;

The target temperature of the object to be measured is calculated by averaging the first temperature difference and the second temperature difference.
The electronic device according to claim 2, wherein the electronic device further comprises a proximity sensor, the proximity sensor is used to detect the position information of the object to be measured and the cover plate, and the processor is further configured to :

When the proximity sensor detects that the object to be temperature-measured contacts the cover plate, the light source is turned on.
The electronic device according to claim 1, wherein the electronic device further comprises a fingerprint unlocking module comprising the light source and the sensor.
The electronic device according to claim 1, wherein the sensor is disposed on a side of the light source away from the cover plate, so that the distance between the receiving surface of the sensor and the cover plate is greater than the distance between the light source and the cover plate. The distance between the emission surface and the cover plate.
The electronic device of claim 1, wherein the sensor is disposed outside the illumination range of the light source.
A temperature measurement method for an electronic device, wherein the electronic device comprises a cover plate arranged on a side close to the outside of the electronic device, a light source and a sensor arranged on the opposite side of the cover plate inside the electronic device, and For the film layer disposed on the cover plate, the thickness of the film layer can vary with temperature, and the temperature measurement method of the electronic device includes:

The light emitted by the light source sequentially passes through the film layer and the cover plate, and is reflected by the object to be measured to form reflected light, and the reflected light sequentially passes through the cover plate and the film layer to form temperature measurement light, and The temperature measuring light can be incident on the sensor;

The sensor receives the temperature measurement light, and calculates the difference between the light intensity of the temperature measurement light and the preset light intensity to obtain the light intensity difference;

According to the light intensity difference, calculate the reflectivity difference between the reflectivity of the film layer and the preset reflectivity;

According to the difference in reflectivity, the temperature difference between the temperature of the object to be measured and the preset temperature is calculated, and the temperature of the object to be measured is calculated according to the difference in temperature.
The temperature measurement method of an electronic device according to claim 15, wherein the method further comprises:

The sensor receives the first temperature measuring light at the first position and the second temperature measuring light at the second position, wherein the thickness of the first position and the thickness of the second position in the film layer are different;

respectively calculating the difference between the light intensity of the first temperature measuring light and the light intensity of the second temperature measuring light and the preset light intensity, to obtain the first light intensity difference and the second light intensity difference;

According to the first light intensity difference value and the second light intensity difference value, the reflectivity of the first position and the difference between the reflectivity of the second position and the preset reflectivity are calculated respectively, and the first the difference in reflectivity and the second difference in reflectivity;

According to the first reflectivity difference and the second reflectivity difference, the first temperature difference and the second temperature difference between the first temperature and the second temperature of the object to be measured and the preset temperature are calculated and obtained. value;

The target temperature of the object to be measured is calculated by averaging the first temperature difference and the second temperature difference.
The temperature measurement method for electronic equipment according to claim 15, wherein the film layer comprises at least one optically lossless film layer and at least two optically lossy film layers, and any one of the optically lossless film layers is disposed on the two layers. between the optical loss film layers, the thickness of the optical lossless film layer is greater than the thickness of the optical loss film layer.
The temperature measurement method of an electronic device according to claim 17, wherein the thicknesses of the two optical lossy film layers disposed on both sides of the same optical lossless film layer are different.
The temperature measurement method of an electronic device according to claim 17, wherein the optical loss film layer is a metal material, and the optical loss film layer is a polymethyl methacrylate material.
The temperature measurement method of an electronic device according to any one of claims 17-19, wherein the thickness of the optical lossless film layer is in the range of 1 micrometer to 10 micrometers, and the thickness of the optical loss film layer is 5 nanometers to 50 nm.