WO2022193345A1 - 晶圆位置采集机构及晶圆纠偏系统 - Google Patents

晶圆位置采集机构及晶圆纠偏系统 Download PDF

Info

Publication number
WO2022193345A1
WO2022193345A1 PCT/CN2021/082721 CN2021082721W WO2022193345A1 WO 2022193345 A1 WO2022193345 A1 WO 2022193345A1 CN 2021082721 W CN2021082721 W CN 2021082721W WO 2022193345 A1 WO2022193345 A1 WO 2022193345A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
wafer
transmitting element
position acquisition
acquisition mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/082721
Other languages
English (en)
French (fr)
Inventor
代璐
徐杰
王伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TSMC China Co Ltd
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Original Assignee
TSMC China Co Ltd
Taiwan Semiconductor Manufacturing Co TSMC Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TSMC China Co Ltd, Taiwan Semiconductor Manufacturing Co TSMC Ltd filed Critical TSMC China Co Ltd
Publication of WO2022193345A1 publication Critical patent/WO2022193345A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment

Definitions

  • the present application relates to the field of wafer manufacturing, and in particular, to a wafer position acquisition mechanism and a wafer deviation correction system.
  • the wafer needs to be precisely placed on the platform.
  • a capture ring is usually set on the platform, and the error between the wafer edge and the edge of the capture ring is found through manual visual inspection, and the process parameters are modified and returned to perform visual inspection and verification again.
  • the visual inspection results are greatly affected by manual work, and the accuracy is not high, which leads to the need to go through the whole process many times and the adjustment efficiency is relatively low.
  • the present application provides a wafer position acquisition mechanism and a wafer deviation correction system, which aims to solve the problem that the visual inspection results are greatly affected by manual labor, and the accuracy is not high, which leads to the need to go through the whole process many times and the adjustment efficiency is relatively low.
  • an embodiment of the present application proposes a wafer position acquisition mechanism, including:
  • a light-transmitting element which has a first side and a second side opposite to each other, and the light-transmitting element is disposed adjacent to the wafer to be tested through the first side;
  • the camera head is arranged on the second side of the light-transmitting element, and the camera head comprises a lens facing the light-transmitting element and a data transmission part for communicating with the external wafer adjustment mechanism;
  • the light source assembly is arranged on the second side of the light-transmitting element, and the light emitted by the light source assembly passes through the light-transmitting element;
  • the light source assembly includes a cover body and a light source, one end of the cover body is attached to the light-transmitting element, and the other end is provided with a camera for the camera.
  • the lens hole into which the lens is inserted; the light source is arranged in the cover, and is located outside the imaging area of the wafer to be tested in the lens.
  • a plurality of light sources are arranged around the end of the cover body close to the light-transmitting element, and the inner wall of the cover body is a spherical reflective surface, which can collect light from the plurality of light sources and reflect them to the light-transmitting element.
  • the light-transmitting element is provided with a fixing mechanism for fixing the cover body.
  • the end of the cover body close to the light-transmitting element has an annular outer edge
  • Any fixing mechanism includes a connecting part and a pressing part that are connected to each other. element.
  • the second side surface of the light-transmitting element is provided with a mounting bracket, the end of the mounting bracket away from the light-transmitting element is provided with a mounting portion facing the lens hole, and the camera is arranged on the side of the mounting portion.
  • a side surface of the mounting portion is provided with a mounting groove extending in a direction perpendicular to the second side surface of the light-transmitting element, and the camera is fixed to the mounting groove through a connection screw and a nut.
  • the second side of the light-transmitting element is further provided with a handle.
  • the light-transmitting element is an acrylic plate.
  • the cover body is an aluminum cover body.
  • an embodiment of the present application provides a wafer rectification system.
  • the wafer rectification system includes a platform for placing a wafer to be tested, a robot for clamping the wafer to be tested, a wafer adjustment mechanism, and the above-mentioned wafer rectification system.
  • the wafer position acquisition mechanism is arranged opposite to the platform, and the wafer adjustment mechanism is connected with the manipulator and controls the motion of the manipulator.
  • the light-transmitting element is close to the wafer to be tested, providing a relatively closed environment for it.
  • the cover body is covered on the second side surface of the light-transmitting element, and the light source is arranged in the cover body, which can better isolate the external light and avoid the interference of the external light.
  • the light emitted by the light source assembly can pass through the light-transmitting element, thereby providing a better imaging environment.
  • the camera captures the position image of the wafer to be tested, and sends it to the wafer adjustment mechanism through the data transmission device.
  • the wafer adjustment mechanism obtains the position information of the wafer to be tested, and then adjusts the position of the wafer to be tested. The adjustment process is not affected. Artificial influence, high precision, thus reducing the number of adjustments and high adjustment efficiency.
  • FIG. 1 is a schematic structural diagram of a wafer position acquisition mechanism disclosed in an embodiment of the present application
  • FIG. 2 is a schematic diagram of a partial structure of a wafer position acquisition mechanism disclosed in an embodiment of the present application
  • Fig. 3 is another perspective schematic diagram of the partial structure of the wafer position acquisition mechanism of Fig. 2;
  • FIG. 4 is another perspective view of the partial structure of the wafer position acquisition mechanism of FIG. 2 .
  • An embodiment of the present application provides a wafer position acquisition mechanism, referring to FIG. 1 , including: a light-transmitting element 100 , a light source assembly 200 , and a camera 300 .
  • the light-transmitting element 100 has a first side and a second side opposite to each other, and the light-transmitting element 100 is disposed adjacent to the wafer to be tested through the first side.
  • the camera 300 is disposed on the second side of the light-transmitting element 100 , and the camera 300 includes a lens 310 facing the light-transmitting element 100 and a data transmission member 320 for communicating with an external wafer adjustment mechanism.
  • the light source assembly 200 is disposed on the second side of the transparent element 100 , and the light emitted by the light source assembly 200 passes through the transparent element 100 .
  • the light source assembly 200 includes a cover body 210 and a light source. One end of the cover body 210 is attached to the light-transmitting element 100, and the other end is provided with a lens hole 212 for inserting the lens 310 of the camera 300; The measurement wafer is outside the imaging area of the lens 310 .
  • the light-transmitting element 100 has better light transmittance, and the light-transmitting element 100 has opposite first and second sides, such as first and second sides in the thickness direction.
  • the light-transmitting element 100 is disposed adjacent to the wafer to be tested through the first side. Since the wafer to be tested is placed on the platform, the first side of the light-transmitting element 100 is the side close to the platform.
  • the light-transmitting element 100 is adjacent to the wafer to be tested to provide a relatively closed environment for it.
  • the light source assembly 200 is disposed on the second side of the light-transmitting element 100 , that is, the side away from the wafer to be tested.
  • One end of the cover body 210 is attached to the second side surface of the light-transmitting element 100 , and the other end is provided with a lens hole 212 .
  • the cover body 210 is covered on the second side surface of the light-transmitting element 100 , and the light source is arranged in the cover body 210 , which can better isolate the external light and avoid the interference of the external light.
  • the light emitted by the light source assembly 200 is at a certain angle with the light-transmitting element 100 , such as incident on the surface of the second side of the light-transmitting element 100 at a vertical or near-vertical angle, and is refracted. Then the light propagates in the light-transmitting element 100 , passes through the surface of the first side of the light-transmitting element 100 and is refracted again, and irradiates the wafer to be tested, thereby providing a better imaging environment for the wafer to be tested.
  • the light captured by the camera 300 is basically provided by the light source, so the light can be adjusted as required, such as the intensity of the light and the angle of the light, thereby enhancing the imaging effect of the camera 300 and further improving the positioning accuracy of the wafer.
  • the camera 300 is also disposed on the second side of the light-transmitting element 100, and the lens 310 faces the light-transmitting element 100, and is used to capture images of the wafer to be tested and the platform, and to record the positional relationship between the wafer to be tested and the platform.
  • the light source assembly 200 is located outside the imaging area of the wafer under test in the lens 310 , that is, the light source assembly 200 will not block the lens 310 , so as to prevent the light source assembly 200 from affecting the imaging of the wafer under test, for example, the light source assembly 200 is not in the imaging area of the lens 310 , the light source assembly 200 and the wafer do not overlap in the imaging area of the lens 310 .
  • the camera 300 further includes a data transmission member 320, which is connected to an external wafer adjustment mechanism, and transmits the captured images of the wafer to be tested and the platform to the wafer adjustment mechanism.
  • the data transmission member 320 may be a wireless transmission module such as a Bluetooth or an infrared module, and is connected with the wafer adjustment mechanism for wireless communication.
  • the data transmission member 320 may be a wired transmission module such as a data cable, and is connected to the wafer conditioning mechanism by wired communication.
  • the captured image actually records and reflects the positional relationship between the wafer under test and the stage.
  • the wafer adjustment mechanism includes a structure with information processing capabilities, such as a computer, which processes and analyzes these images to obtain the positional relationship between the wafer to be tested and the platform, thereby judging whether the position of the wafer to be tested on the platform is offset, If there is an offset, what is the offset direction and the offset amount.
  • the manipulator clamps the wafer according to the offset direction and the offset amount to adjust accordingly, and the adjustment is more accurate, so that the wafer to be tested is located in the center of the platform.
  • the adjustment process is not affected by manual labor, and the precision is high, so the adjustment times are reduced and the adjustment efficiency is high.
  • the light-transmitting element 100 is adjacent to the wafer to be tested, providing a relatively closed environment for it.
  • the light source is arranged in the cover body 210, which can better isolate the external light and avoid the interference of the external light.
  • the light emitted by the light source assembly 200 can pass through the light-transmitting element 100 to provide a better imaging environment.
  • the camera 300 captures the position image of the wafer, and sends it to the wafer adjustment mechanism through the data transmission member 320, and the wafer adjustment mechanism obtains the position information of the wafer, and then adjusts the position of the wafer, and the adjustment process is not affected by manual labor.
  • the precision is high, so the number of adjustments is reduced and the adjustment efficiency is high.
  • the end of the cover body 210 close to the light-transmitting element 100 is surrounded by a plurality of light sources, and the inner wall of the cover body 210 is a spherical reflective surface, which can gather the light of the plurality of light sources, and reflected to the light-transmitting element 100 .
  • a light source may emit light to provide light, such as an LED.
  • the number of the light sources is multiple, and the light sources are disposed at one end of the cover body 210 close to the light-transmitting element 100 and evenly distributed.
  • the light emitted by the light source does not directly irradiate the light-transmitting element 100, but irradiates on the reflective surface of the inner wall of the cover body 210.
  • the reflective surface of the cover body 210 is spherical, which can gather and reflect the light emitted by each light source to the light-transmitting element 100 , so that the brightness of the light in the cover body 210 is relatively uniform, and at the same time, shadows are avoided, so the imaging effect of the camera 300 is good.
  • the light-transmitting element 100 is provided with a fixing mechanism 110 for fixing the cover body 210 .
  • the light-transmitting element 100 is provided with a fixing mechanism 110 , and the fixing mechanism 110 fixes the cover body 210 on the light-transmitting element 100 by clamping, snapping, gluing, screwing or the like.
  • the light-transmitting element 100 is more firmly fixed, and the integrity of the wafer position collecting mechanism is better.
  • the end of the cover body 210 close to the light-transmitting element 100 has an annular outer edge 211
  • the number of the fixing mechanisms 110 is multiple and distributed at equal intervals around the annular outer edge 211
  • any fixing mechanism 110 includes a connecting portion 111 and a pressing portion 112 connected to each other. The pressing portion 112 is pressed over the annular outer edge 211 and fixed to the light-transmitting element 100 through the connecting portion 111 .
  • the end of the cover body 210 close to the light-transmitting element 100 has an annular outer edge 211 , and the plurality of fixing mechanisms 110 are evenly distributed around the annular outer edge 211 , so that the force of the cover body 210 is more balanced, and the combination of the cover body 210 and the light-transmitting element 100 is more stable. for firmness.
  • the connecting portion 111 of the fixing structure is connected to the light-transmitting element 100 , such as by means of screws.
  • the pressing portion 112 has a groove, which matches with the annular outer edge 211 , and the groove wall is pressed against the annular outer edge 211 at the top of the groove away from the light-transmitting element 100 , so as to firmly fix the cover body 210 on the light-transmitting element. 100 on.
  • the second side surface of the light-transmitting element 100 is provided with a mounting bracket 120 , and the end of the mounting bracket 120 away from the light-transmitting element 100 is provided with a mounting bracket facing the lens hole 212 part 121 , the camera 300 is arranged on the side surface of the mounting part 121 .
  • One end of the mounting bracket 120 is disposed on the second side surface of the light-transmitting element 100 , and the other end has a mounting portion 121 .
  • the mounting portion 121 is aligned with the lens hole 212 , and the camera is disposed on the side of the mounting portion 121 , so that the lens 310 extends into the lens hole 212 and faces the light-transmitting element 100 .
  • the camera 300 is mounted and fixed to the light-transmitting element 100 through the mounting frame 120 , and the wafer position acquisition mechanism has a high degree of integration and is more convenient to use.
  • the side surface of the mounting portion 121 is provided with a mounting groove 122 extending in a direction perpendicular to the second side surface of the light-transmitting element 100 , and the camera 300 is fixed by means of a connecting screw and a nut. in the installation slot 122 .
  • the mounting slot 122 extends along the vertical direction of the light-transmitting element 100 , and the camera 300 is inserted into the mounting slot 122 through the connecting screw, and the position can be adjusted up and down in the mounting slot 122 , thereby adjusting the height between the camera 300 and the wafer to be tested, and further Adapt to different styles and models of cameras 300 or wafers to be tested, so that they can all obtain clear images.
  • the camera head 300 is adjusted to the required height, tighten the nut so that the position of the camera head 300 is fixed.
  • the second side of the light-transmitting element 100 is further provided with a handle 130 .
  • the wafer position collection mechanism is mainly used to collect the position of the wafer to be tested. It needs to be moved before and after collection, and the movement is more frequent.
  • the second side of the light-transmitting element 100 is further provided with a handle 130, which provides a force point and facilitates the movement of the wafer position collecting mechanism.
  • the light-transmitting element 100 is an acrylic plate.
  • the acrylic sheet has good light transmittance, which is convenient for the light of the light source to pass through, and the acrylic sheet has strong impact resistance, which can enhance the life of the light-transmitting element 100 .
  • the light weight of the acrylic sheet makes it easier to move the wafer position acquisition mechanism.
  • the cover body 210 is an aluminum cover body.
  • the aluminum cover is light in weight, which is convenient for moving the wafer position acquisition mechanism.
  • the embodiment of the present application provides a wafer deviation correction system.
  • the wafer deviation correction system includes a platform for placing a wafer to be tested, a robot for clamping the wafer to be tested, a wafer adjustment mechanism, and the above-mentioned wafer.
  • Position acquisition mechanism; the wafer position acquisition mechanism is arranged opposite to the platform, and the wafer adjustment mechanism is connected with the manipulator and controls the motion of the manipulator.
  • the wafer to be tested is placed on the platform, the wafer position acquisition mechanism is disposed opposite to the platform, and the light-transmitting element 100 is adjacent to the wafer to be tested.
  • the light source assembly 200 passes through the light-transmitting element 100 to provide a better imaging environment.
  • the data transmission member 320 of the camera 300 is connected to the wafer adjustment mechanism, and transmits the captured images of the wafer to be tested and the platform to the wafer adjustment mechanism.
  • the wafer adjustment mechanism processes and analyzes the image, and obtains the positional relationship between the wafer to be tested and the platform, so as to determine whether the position of the wafer to be tested on the platform is offset, such as the offset, the offset direction and the offset .
  • the manipulator clamps the wafer according to the offset direction and the offset amount and adjusts accordingly, and the adjustment is more precise, so that the wafer is located in the center of the platform.
  • the adjustment process of the wafer deviation correction system is not affected by manual labor and has high precision, thus reducing the number of adjustment times and having high adjustment efficiency.

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

本申请涉及一种晶圆位置采集机构及晶圆纠偏系统，该采集机构包括：透光元件、光源组件和摄像头，透光元件具有相背的第一侧和第二侧，透光元件通过第一侧与待测晶圆相邻设置；光源组件设置于透光元件的第二侧，光源组件发出的光线透过透光元件；摄像头设置于透光元件的第二侧，摄像头包括镜头以及数据传输件。透光元件贴近待测晶圆，为其提供较为密闭环境。光源组件发出的光线能够透过所述透光元件，提供较好的成像环境。摄像头拍摄待测晶圆的位置图像，并通过数据传输件将其发送给晶圆调节机构，晶圆调节机构获取待测晶圆的位置信息，进而调节待测晶圆的位置，调节过程不受人工的影响，精度高，因此减少了调节次数，调节效率高。

Description

晶圆位置采集机构及晶圆纠偏系统
相关申请的交叉引用
本申请要求享有于2021年03月19日提交的名称为“晶圆位置采集机构及晶圆纠偏系统”的中国专利申请202120568797.0的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本申请涉及晶圆制造领域，特别是涉及一种晶圆位置采集机构及晶圆纠偏系统。
背景技术
在晶圆封装过程中，需要将晶圆精确放置在平台上。在该过程中，通常是通过在平台上设置捕捉环，通过人工目检发现晶圆边缘和捕捉环边缘的误差，修改工艺参数后返回重新进行目检验证。然而目检结果受到人工影响较大，精度不高，导致整个过程需要经历多次，调节效率比较低。
发明内容
本申请提供一种晶圆位置采集机构及晶圆纠偏系统，旨在解决目检结果受到人工影响较大，精度不高，导致整个过程需要经历多次，调节效率比较低的问题。
第一方面，本申请实施例提出了一种晶圆位置采集机构，包括：
透光元件，具有相背的第一侧和第二侧，透光元件通过第一侧与待测晶圆相邻设置；
摄像头，设置于透光元件的第二侧，摄像头包括朝向透光元件的镜头以及用于与外部的晶圆调节机构通讯连接的数据传输件；
光源组件，设置于透光元件的第二侧，光源组件发出的光线透过透光元件；光源组件包括罩体和光源，罩体的一端与透光元件贴合，另一端设有供摄像头的镜头插入的镜头孔；光源设置于罩体内，并位于待测晶圆在镜头的成像区域外。
根据本申请的一个实施例，罩体靠近透光元件的一端环绕设置有多个光源，罩体的内壁为球形反光面，能够聚拢多个光源的光线，并反射至透光元件。
根据本申请的一个实施例，透光元件设有用于固定罩体的固定机构。
根据本申请的一个实施例，罩体靠近透光元件的端部具有环形外沿，
固定机构的数量为多个，并环绕环形外沿等间距分布，任一固定机构包括彼此连接的连接部和压合部，压合部压覆于环形外沿，并通过连接部固定于透光元件。
根据本申请的一个实施例，透光元件的第二侧表面设有安装架，安装架远离透光元件的端部设有正对镜头孔的安装部，摄像头设置于安装部的侧面。
根据本申请的一个实施例，安装部的侧面设有沿垂直于透光元件的第二侧表面方向延伸的安装槽，摄像头通过连接螺杆和螺母配合固定于安装槽。
根据本申请的一个实施例，透光元件的第二侧还设有提手。
根据本申请的一个实施例，透光元件为亚克力板。
根据本申请的一个实施例，罩体为铝制罩体。
第二方面，本申请实施例提供一种晶圆纠偏系统，晶圆纠偏系统包括用于放置待测晶圆的平台、用于夹持待测晶圆的机械手、晶圆调节机构以及上述的晶圆位置采集机构；
晶圆位置采集机构与平台相对设置，晶圆调节机构与机械手连接并控制机械手运动。
根据本申请实施例的晶圆位置采集机构，透光元件贴近待测晶圆，为其提供较为密闭环境。罩体罩在透光元件的第二侧表面上，而光源设置于 罩体内，可较好的隔绝外部的光线，避免外部的光线产生干扰。光源组件发出的光线能够透过所述透光元件，提供较好的成像环境。摄像头拍摄待测晶圆的位置图像，并通过数据传输件将其发送给晶圆调节机构，晶圆调节机构获取待测晶圆的位置信息，进而调节待测晶圆的位置，调节过程不受人工的影响，精度高，因此减少了调节次数，调节效率高。
附图说明
下面将参考附图来描述本申请示例性实施例的特征、优点和技术效果。
图1是本申请一实施例公开的一种晶圆位置采集机构的结构示意图；
图2是本申请一实施例公开的一种晶圆位置采集机构部分结构的示意图；
图3是图2的晶圆位置采集机构部分结构的另一视角示意图；
图4是图2的晶圆位置采集机构的部分结构又一视角示意图。
在附图中，附图未必按照实际的比例绘制。
具体实施方式
下面结合附图和实施例对本申请的实施方式作进一步详细描述。以下实施例的详细描述和附图用于示例性地说明本申请的原理，但不能用来限制本申请的范围，即本申请不限于所描述的实施例。
在本申请的描述中，需要说明的是，除非另有说明，“多个”的含义是两个以上；术语“上”、“下”、“左”、“右”、“内”、“外”等指示的方位或位置关系仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性。“垂直”并不是严格意义上的垂直，而是在误差允许范围之内。“平行”并不是严格意义上的平行，而是在误差允许范围之内。
在本申请的描述中，还需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连 接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可视具体情况理解上述术语在本申请中的具体含义。
为了更好地理解本申请，下面结合图1至图4对本申请实施例进行描述。
本申请实施例提供一种晶圆位置采集机构，参见图1，包括：透光元件100、光源组件200和摄像头300。透光元件100具有相背的第一侧和第二侧，透光元件100通过第一侧与待测晶圆相邻设置。摄像头300设置于透光元件100的第二侧，摄像头300包括朝向透光元件100的镜头310以及用于与外部的晶圆调节机构通讯连接的数据传输件320。光源组件200设置于透光元件100的第二侧，光源组件200发出的光线透过透光元件100。光源组件200包括罩体210和光源，罩体210的一端与透光元件100贴合，另一端设有供摄像头300的镜头310插入的镜头孔212；光源设置于罩体210内，并位于待测晶圆在镜头310的成像区域外。
透光元件100具有较好的透光率，透光元件100具有相背的第一侧和第二侧，如在厚度方向上的第一侧和第二侧。透光元件100通过第一侧与待测晶圆相邻设置，由于待测晶圆放置在平台上，因而透光元件100的第一侧为靠近平台的一侧。透光元件100邻近待测晶圆，为其提供较为密闭环境。
光源组件200设置于透光元件100的第二侧，即远离待测晶圆的一侧。罩体210一端与透光元件100的第二侧表面贴合，另一端设有镜头孔212。罩体210罩在透光元件100的第二侧表面上，而光源设置于罩体210内，可较好的隔绝外部的光线，避免外部的光线产生干扰。光源组件200发出的光线与透光元件100呈一定角度，如垂直或接近于垂直的角度入射至透光元件100第二侧的表面发生折射。随后光线在透光元件100内传播，从透光元件100第一侧的表面穿出并再次发生折射，照射在待测晶圆上，从而为待测晶圆提供较好的成像环境。摄像头300拍摄的光线基本由光源提供，因而可根据需要对光进行调节，如光的强度、光的角度，从而增强摄像头300的成像效果，进而提高晶圆的定位精度。
摄像头300同样设置在透光元件100的第二侧，且镜头310朝向透光元件100，用于拍摄待测晶圆以及平台的图像，记录待测晶圆和平台的位置关系。光源组件200位于待测晶圆在镜头310的成像区域外，即光源组件200不会遮挡镜头310，从而避免光源组件200对待测晶圆成像造成影响，如光源组件200不在镜头310的成像区域内，光源组件200和晶圆在镜头310的成像区域不重叠。
摄像头300还包括数据传输件320，数据传输件320连接外部的晶圆调节机构，将拍摄的待测晶圆以及平台的图像传输给晶圆调节机构。数据传输件320可以是无线传输模块如蓝牙、红外模块，与晶圆调节机构进行无线通讯连接。数据传输件320可以是有线传输模块如数据线，与晶圆调节机构进行有线通讯连接。拍摄的图像实际上记录和反映了待测晶圆和平台的位置关系。晶圆调节机构包括具有信息处理能力的结构，如电脑，该结构对这些图像进行处理和分析，获取待测晶圆和平台的位置关系，从而判断待测晶圆在平台的位置是否偏移，如发生偏移，偏移方向和偏移量是多少。机械手根据偏移方向和偏移量夹持晶圆进行相应调节，调节较为精确，使得待测晶圆位于平台的中心。调节过程不受人工的影响，精度高，因此减少了调节次数，调节效率高。
根据本申请实施例的晶圆位置采集机构，参见图1，透光元件100邻近待测晶圆，为其提供较为密闭环境。光源设置于罩体210内，可较好的隔绝外部的光线，避免外部的光线产生干扰。光源组件200发出的光线能够透过所述透光元件100，提供较好的成像环境。摄像头300拍摄晶圆的位置图像，并通过数据传输件320将其发送给晶圆调节机构，晶圆调节机构获取晶圆的位置信息，进而调节晶圆的位置，调节过程不受人工的影响，精度高，因此减少了调节次数，调节效率高。
根据本申请的一个实施例，参见图1至图4，罩体210靠近透光元件100的一端环绕设置有多个光源，罩体210的内壁为球形反光面，能够聚拢多个光源的光线，并反射至透光元件100。
光源可发光提供光线，如LED。光源的数量为多个，设置于罩体210靠近透光元件100的一端均匀分布。光源发出的光线并非直接照射到透光 元件100，而是照射到罩体210的内壁的反光面上。罩体210的反光面为球形，可将各光源发出的光线聚拢并反射到透光元件100，使得罩体210内光的亮度较为均匀，同时避免产生影子，因而摄像头300的成像效果好。
根据本申请的一个实施例，参见图1至图4，透光元件100设有用于固定罩体210的固定机构110。透光元件100设有固定机构110，固定机构110通过夹持、卡扣、粘接、螺接等方式将罩体210固定在透光元件100上。透光元件100固定更为牢固，晶圆位置采集机构的整体性更好。
根据本申请的一个实施例，参见图1至图4，罩体210靠近透光元件100的端部具有环形外沿211，固定机构110的数量为多个，并环绕环形外沿211等间距分布，任一固定机构110包括彼此连接的连接部111和压合部112，压合部112压覆于环形外沿211，并通过连接部111固定于透光元件100。
罩体210靠近透光元件100的端部具有环形外沿211，多个固定机构110环绕环形外沿211均匀分布，使得罩体210受力更为均衡，罩体210和透光元件100结合更为牢固。固定结构的连接部111与透光元件100连接，如通过螺钉连接。压合部112具有一凹槽，该凹槽与环形外沿211匹配，凹槽远离透光元件100的顶部槽壁压覆在环形外沿211，从而将罩体210牢固的固定在透光元件100上。
根据本申请的一个实施例，参见图1至图4，透光元件100的第二侧表面设有安装架120，安装架120远离透光元件100的端部设有正对镜头孔212的安装部121，摄像头300设置于安装部121的侧面。
安装架120一端设置在透光元件100的第二侧表面，另一端具有安装部121。安装部121对准镜头孔212，摄像机设置在安装部121的侧面，因而镜头310伸入镜头孔212朝向透光元件100。摄像头300通过安装架120与透光元件100进行安装固定，晶圆位置采集机构的集成度较高，使用更为方便。
根据本申请的一个实施例，参见图1至图4，安装部121的侧面设有沿垂直于透光元件100的第二侧表面方向延伸的安装槽122，摄像头300通过连接螺杆和螺母配合固定于安装槽122。
安装槽122沿透光元件100的垂直方向延伸，摄像头300通过连接螺杆伸入安装槽122内，可在安装槽122内升降调节位置，从而调节摄像头300与待测晶圆之间的高度，进而适应不同款式、型号的摄像头300或待测晶圆，使其均可获取清晰的图像。当摄像头300调节到所需高度时，紧固螺母，使得摄像头300的位置固定。
根据本申请的一个实施例，参见图1至图4，透光元件100的第二侧还设有提手130。
晶圆位置采集机构主要是用于对待测晶圆进行位置采集的，采集前后均需要移动，移动较为频繁。透光元件100的第二侧还设有提手130，提供了着力点，便于搬动晶圆位置采集机构。
根据本申请的一个实施例，透光元件100为亚克力板。亚克力板透光性佳，便于光源的光线透过，并且亚克力板的抗冲击力强，可增强了透光元件100的寿命。此外，亚克力板的自重轻，因而也更便于搬动晶圆位置采集机构。
根据本申请的一个实施例，罩体210为铝制罩体。铝制罩体质量较轻，便于搬动晶圆位置采集机构。
第二方面本申请实施例提供一种晶圆纠偏系统，晶圆纠偏系统包括用于放置待测晶圆的平台、用于夹持待测晶圆的机械手、晶圆调节机构以及上述的晶圆位置采集机构；晶圆位置采集机构与平台相对设置，晶圆调节机构与机械手连接并控制机械手运动。
待测晶圆放置在平台上，晶圆位置采集机构与平台相对设置，透光元件100邻近待测晶圆。光源组件200穿过透光元件100提供较好的成像环境。摄像头300的数据传输件320连接晶圆调节机构，将拍摄的待测晶圆以及平台的图像传输给晶圆调节机构。晶圆调节机构对图像进行处理和分析，获取待测晶圆和平台的位置关系，从而判断待测晶圆在平台的位置是否偏移，如发生偏移，偏移方向和偏移量是多少。机械手根据偏移方向和偏移量夹持晶圆进行相应调节，调节较为精确，使得晶圆位于平台的中心。该晶圆纠偏系统的调节过程不受人工的影响，精度高，因此减少了调节次数，调节效率高。
虽然已经参考优选实施例对本申请进行了描述，但在不脱离本申请的范围的情况下，可以对其进行各种改进并且可以用等效物替换其中的部件，尤其是，只要不存在结构冲突，各个实施例中所提到的各项技术特征均可以任意方式组合起来。本申请并不局限于文中公开的特定实施例，而是包括落入权利要求的范围内的所有技术方案。

Claims (10)

  1. 一种晶圆位置采集机构，包括：
    透光元件，具有相背的第一侧和第二侧，所述透光元件通过所述第一侧与待测晶圆相邻设置；
    摄像头，设置于所述透光元件的第二侧，所述摄像头包括朝向所述透光元件的镜头以及用于与外部的晶圆调节机构通讯连接的数据传输件；
    光源组件，设置于所述透光元件的第二侧，所述光源组件发出的光线透过所述透光元件；所述光源组件包括罩体和光源，所述罩体的一端与所述透光元件贴合，另一端设有供所述摄像头的镜头插入的镜头孔；所述光源设置于所述罩体内，并位于所述待测晶圆在所述镜头的成像区域外。
  2. 根据权利要求1所述的晶圆位置采集机构，其中，所述罩体靠近所述透光元件的一端环绕设置有多个光源，所述罩体的内壁为球形反光面，能够聚拢多个所述光源的光线，并反射至所述透光元件。
  3. 根据权利要求2所述的晶圆位置采集机构，其中，所述透光元件设有用于固定所述罩体的固定机构。
  4. 根据权利要求3所述的晶圆位置采集机构，其中，所述罩体靠近所述透光元件的端部具有环形外沿，
    所述固定机构的数量为多个，并环绕所述环形外沿等间距分布，任一所述固定机构包括彼此连接的连接部和压合部，所述压合部压覆于所述环形外沿，并通过所述连接部固定于所述透光元件。
  5. 根据权利要求1所述的晶圆位置采集机构，其中，所述透光元件的第二侧表面设有安装架，所述安装架远离所述透光元件的端部设有正对所述镜头孔的安装部，所述摄像头设置于所述安装部的侧面。
  6. 根据权利要求5所述的晶圆位置采集机构，其中，所述安装部的侧面设有沿垂直于所述透光元件的第二侧表面方向延伸的安装槽，所述摄像头通过连接螺杆和螺母配合固定于所述安装槽。
  7. 根据权利要求1所述的晶圆位置采集机构，其中，所述透光元件的第二侧还设有提手。
  8. 根据权利要求1所述的晶圆位置采集机构，其中，所述透光元件为亚克力板。
  9. 根据权利要求1～8中任一项所述的晶圆位置采集机构，其中，所述罩体为铝制罩体。
  10. 一种晶圆纠偏系统，所述晶圆纠偏系统包括用于放置待测晶圆的平台、用于夹持所述晶圆的机械手、晶圆调节机构以及权利要求1～9中任一项所述的晶圆位置采集机构；
    所述晶圆位置采集机构与所述平台相对设置，所述晶圆调节机构与所述机械手连接并控制所述机械手运动。
PCT/CN2021/082721 2021-03-19 2021-03-24 晶圆位置采集机构及晶圆纠偏系统 Ceased WO2022193345A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202120568797.0U CN213304093U (zh) 2021-03-19 2021-03-19 晶圆位置采集机构及晶圆纠偏系统
CN202120568797.0 2021-03-19

Publications (1)

Publication Number Publication Date
WO2022193345A1 true WO2022193345A1 (zh) 2022-09-22

Family

ID=76017242

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/082721 Ceased WO2022193345A1 (zh) 2021-03-19 2021-03-24 晶圆位置采集机构及晶圆纠偏系统

Country Status (2)

Country Link
CN (1) CN213304093U (zh)
WO (1) WO2022193345A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117532311B (zh) * 2024-01-10 2024-04-05 杭州沃镭智能科技股份有限公司 一种集成式线控制动系统的导热垫装配装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1717779A (zh) * 2003-02-17 2006-01-04 株式会社尼康 平台装置与曝光装置,以及元件制造方法
CN101740447A (zh) * 2008-11-19 2010-06-16 东京毅力科创株式会社 基板位置检测装置、基板位置检测方法、成膜装置、成膜方法
CN103151361A (zh) * 2011-12-07 2013-06-12 原相科技股份有限公司 晶圆级图像芯片封装及光学结构

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1717779A (zh) * 2003-02-17 2006-01-04 株式会社尼康 平台装置与曝光装置,以及元件制造方法
CN101740447A (zh) * 2008-11-19 2010-06-16 东京毅力科创株式会社 基板位置检测装置、基板位置检测方法、成膜装置、成膜方法
CN103151361A (zh) * 2011-12-07 2013-06-12 原相科技股份有限公司 晶圆级图像芯片封装及光学结构

Also Published As

Publication number Publication date
CN213304093U (zh) 2021-05-28

Similar Documents

Publication Publication Date Title
KR100413103B1 (ko) 본딩장치 및 본딩방법
WO2015014041A1 (zh) 检测系统
CN104122072A (zh) 镜头模组检测装置
CN114585912A (zh) 校正用面板、面板检查用校正装置以及面板检查装置的校正方法
CN110567973A (zh) 一种基于图像采集的活塞检测平台及方法
CN112097642A (zh) 一种三维十字交叉孔位置度检测仪器及检测方法
WO2022193345A1 (zh) 晶圆位置采集机构及晶圆纠偏系统
CN212180643U (zh) 一种光源投射角度调整装置
CN110873638A (zh) 一种光学模组自动检测设备
CN106644204B (zh) 集约式钢化玻璃表面应力仪
EP4597029A1 (en) Wheel alignment calibration device and wheel alignment apparatus
US20230069195A1 (en) Camera module manufacturing device
CN103486966B (zh) 光学测量机器及方法
JP3190153B2 (ja) 支持格子検査装置
CN206804277U (zh) 靶标自动调向式光轴平行性检测装置
EP3413029B1 (en) Method for verifying abnormality of inspection unit, inspection apparatus, and inspection system
CN214896202U (zh) 光学测量组件及对准测量装置
KR101576129B1 (ko) 밸브 스프링 형상 측정장치
TWM623844U (zh) 鏡頭檢測裝置
CN223637377U (zh) 一种新型双向反射分布函数测量系统
KR101212382B1 (ko) 박막 두께 측정장치
KR100214888B1 (ko) 원뿔거울쌍을 이용한 전방향 동축영상 촬상장치
CN101487693A (zh) 一种视觉部件对位装置
KR20170047140A (ko) 검사장치
CN119324160B (zh) 晶圆和密封环的装配及对位校准的检测工艺

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21930934

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 04/01/2024)

122 Ep: pct application non-entry in european phase

Ref document number: 21930934

Country of ref document: EP

Kind code of ref document: A1