WO2022191536A1

WO2022191536A1 - Circuit for reducing spurious signal from power amplifier, and electronic device comprising same

Info

Publication number: WO2022191536A1
Application number: PCT/KR2022/003166
Authority: WO
Inventors: 양재진; 김정준; 진윤수; 최현석
Original assignee: 삼성전자 주식회사
Priority date: 2021-03-08
Filing date: 2022-03-07
Publication date: 2022-09-15
Also published as: KR20220126023A

Abstract

Disclosed is an electronic device comprising: a power supplier; an amplifier for receiving voltage from the power supplier through a first signal path, and outputting an amplified output signal for an input signal; and a coupler for acquiring a signal coupled to the output signal, wherein the coupler is connected to a node on the first signal path to supply the coupled signal to the first signal path between the power supplier and the amplifier. Other various embodiments identified through the specification are possible.

Description

Circuit for reducing spurious signal from power amplifier and electronic device including same

Embodiments disclosed in this document relate to a circuit for reducing noise from a power amplifier and an electronic device including the same.

A power amplifier (PA) is a device for generating an output signal in which an input signal is amplified by a gain.

A low pass filter (LPF) may be provided in a transmission line between the power amplifier and the power supply to reduce unwanted signals and/or harmonic noise for an output signal induced from the power amplifier to the power supply.

An electronic device such as a smartphone may include a plurality of power amplifiers in a dense state due to space constraints. Accordingly, an unwanted signal and/or harmonic noise of the power amplifier may be easily induced to other elements of the electronic device.

Accordingly, when an unwanted signal and/or harmonic noise of the power amplifier is introduced into other elements through the power supply, the quality of the RF signal of the electronic device may be deteriorated, and thus, the wireless signal transmission/reception performance of the electronic device may be deteriorated. can be

Therefore, there is a need for a method for effectively reducing unwanted signals and/or harmonic noise of a power amplifier.

An electronic device according to an embodiment disclosed in this document includes a power supply, an amplifier receiving a voltage from the power supply through a first signal path, and outputting an amplified output signal with respect to an input signal, and a couple with the output signal a coupler for obtaining a ringed signal, the coupler connectable to a node on the first signal path to supply the coupled signal to a first signal path between the power supply and the amplifier.

An electronic device according to an embodiment disclosed in this document includes a power supply, an amplifier receiving a voltage from the power supply through a first signal path, and outputting an amplified output signal with respect to an input signal, and a couple with the input signal a coupler for obtaining a ringed signal, the coupler connectable to a node on the first signal path to supply the coupled signal to a first signal path between the power supply and the amplifier.

The technical problems to be achieved in the various embodiments of this document are not limited to the technical problems mentioned above, and other technical problems not mentioned are clear to those of ordinary skill in the art to which the present disclosure belongs from the description below. will be able to understand

According to the embodiments disclosed in this document, the intensity of an unwanted signal and/or harmonic noise transmitted from a power amplifier to a power supply may be reduced.

Effects that can be obtained in various embodiments of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned are clearly to those of ordinary skill in the art to which the present disclosure belongs from the description below. can be understood

1 is a block diagram of an electronic device according to an embodiment.

2 is a block diagram of an electronic device according to an embodiment.

3 is a block diagram of a power amplification module, a PMIC, and a coupling module according to an embodiment.

4 is a block diagram of a power amplification module, a PMIC, and a coupling module according to an embodiment.

5 is a block diagram of a power amplification module, a PMIC, and a coupling module according to an embodiment.

6 is a block diagram of a power amplification module, a PMIC, and a coupling module according to an embodiment.

In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

1 is a block diagram of an electronic device 100 according to an embodiment.

Referring to FIG. 1 , the electronic device 100 includes an application processor (AP) 101 , a communication processor (CP) 103 , a transceiver 105 , an antenna module 107 , and a power amplification module 110 . ), a power management integrated circuit (PMIC) 130 , a coupling module 150 , or a combination thereof. In an embodiment, the electronic device 100 may further include components other than those of FIG. 1 . In an embodiment, the electronic device 100 may further include a memory, an input module, a sound output module, a display module, an audio module, a sensor module, an interface, a connection terminal, a haptic module, a camera module, a battery, or a subscriber identification module. can

In an embodiment, the AP 101 may execute software to control at least one other component (eg, a hardware or software component) of the electronic device 100 connected to the AP 101 , and process various data Or you can perform an operation.

In an embodiment, the CP 103 may support establishment of a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 100 and an external electronic device, and performing communication through the established communication channel. In an embodiment, the CP 103 may operate independently of the AP 101 .

In one embodiment, the transceiver 105 down-converts a radio frequency (RF) signal from the antenna module 107 to an intermediate frequency (IF) signal and/or a baseband frequency signal. can be converted In an embodiment, the transceiver 105 may up-convert an intermediate band (IF) signal and/or a baseband signal from the CP 103 to convert it into a radio frequency signal.

In an embodiment, the antenna module 107 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 107 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 107 may include a plurality of antennas (eg, an array antenna).

In an embodiment, the power amplification module 110 may amplify the strength of a signal from the transceiver 105 . In an embodiment, the power amplification module 110 may amplify the strength of a signal from the antenna module 107 .

In an embodiment, the power amplification module 110 may include a coupler (not shown). In an embodiment, the coupler may provide at least a partial signal of the amplified signal of the power amplification module 110 to the transceiver 105 . In an embodiment, the transceiver 105 may monitor a signal transmitted through the antenna module 107 based on at least a portion of the amplified signal (a feedback signal).

In one embodiment, the CP 103 , the transceiver 105 , and the power amplification module 110 may also be referred to as a communication module.

In an embodiment, the PMIC 130 may manage power supplied to the electronic device 100 . In one embodiment, the PMIC 130 may also be referred to as a power supply.

In an embodiment, the PMIC 130 may supply power to the power amplification module 110 . In an embodiment, the PMIC 130 may supply power for the power amplification module 110 to amplify a signal.

In an embodiment, the coupling module 150 may obtain a signal coupled with a signal related to the power amplification module 110 (hereinafter, referred to as a 'coupling signal'). In an embodiment, the coupling module 150 may obtain a coupling signal to reduce (or eliminate) noise (hereinafter, referred to as 'noise') from the power amplification module 110 . In an embodiment, the coupling signal may be a signal induced by at least one signal. In an embodiment, the coupling signal may be a signal induced according to a change in a magnetic field caused by at least one signal. In an embodiment, the signal related to the power amplification module 110 may include a signal input to the power amplification module 110 and/or a signal output to the power amplification module 110 . In an embodiment, the noise may be a signal generated by the power amplification module 110 and transmitted to the PMIC 130 . In an embodiment, the noise may be at least a part of a signal output from the power amplification module 110 . In an embodiment, the noise may be at least a part of a signal input to the power amplification module 110 . In an embodiment, the noise may include a spurious signal and/or a harmonic signal.

In one embodiment, the coupling module 150 transmits a signal based on the coupling signal (hereinafter, referred to as a 'coupling-based signal') to a node ( 170) can be printed. In one embodiment, the coupling module 150 outputs the coupling-based signal to the node 170 on the signal path between the power amplification module 110 and the PMIC 130 so that the coupling-based signal and noise are canceled. can In an embodiment, there may be a phase difference of at least a degree to generate destructive interference between the coupling-based signal and the noise. In an embodiment, the phase difference between the coupling-based signal and the noise may be 180 degrees (or an angle within a specified phase difference range (eg, 90 to 270 degrees)).

In an embodiment, the coupling module 150 may further include a capacitor for blocking (or reducing) a direct current (DC) component in the coupling signal and/or the coupling-based signal. In an embodiment, a capacitor for blocking (or reducing) a DC component may be serially connected on a signal path through which a coupling signal and/or a coupling-based signal is transmitted.

In an embodiment, the coupling module 150 further includes a high pass filter (HPF) for filtering low-frequency components (or passing high-frequency components) in the coupling signal and/or the coupling-based signal. may include

In an embodiment, the coupling module 150 may further include a variable resistor for reducing the strength of the coupling signal and/or the coupling-based signal.

In an embodiment, the coupling module 150 may further include a switch for turning on or off the operation of the coupling module 150 .

In an embodiment, the coupling module 150 may further include a phase shifter for making the phase difference between the coupling-based signal and the noise within a specified phase difference range (eg, 90 to 270 degrees). . In an embodiment, the phase shifter may generate a coupling-based signal by converting a phase of the coupling signal.

2 is a block diagram of an electronic device 100 according to an embodiment.

Referring to FIG. 2 , the electronic device 100 includes an AP 101 , a CP 103 , a transceiver 105 , an antenna module 107 , a power amplification module 110 , a PMIC 130 , and a coupling module 150 . ), or a combination thereof.

In an embodiment, the power amplification module 110 may include a power amplifier (PA) 120 . In an embodiment, the coupling module 150 may include a coupler 161 and a DC block capacitor 165 .

In an embodiment, the power amplifier 120 may receive a voltage from the PMIC 130 . In an embodiment, the power amplifier 120 may receive a voltage through a signal path between the power amplifier 120 and the PMIC 130 .

In an embodiment, the power amplifier 120 may generate an amplified output signal with respect to the input signal based on the voltage from the PMIC 130 . In one embodiment, the input signal may be a signal provided from the transceiver 105 . In an embodiment, the output signal may be a signal provided to the antenna module 107 .

In an embodiment, the power amplifier 120 may be implemented as a transistor (eg, a bipolar junction transistor (BJT) or a field effect transistor (FET)).

In an embodiment, noise based on at least one of an input signal and/or an output signal of the power amplifier 120 is transmitted to the PMIC 130 through a signal path between the power amplifier 120 and the PMIC 130 . can

In an embodiment, the coupler 161 may generate a coupling signal with respect to at least one of an input signal and/or an output signal of the power amplifier 120 . In an embodiment, the coupling signal may be a signal induced by at least one signal. In an embodiment, the coupling signal may be a signal induced according to a change in a magnetic field caused by at least one signal.

In an embodiment, the DC block capacitor 165 may be a device for blocking (or reducing) the DC component in the coupling signal. In an embodiment, the DC block capacitor 165 may be connected between the coupler 161 and the node 170 .

In one embodiment, the DC block capacitor 165 transmits a coupling signal (coupling-based signal) in which the DC component is blocked (or reduced) to a node on the signal path between the power amplification module 110 and the PMIC 130 ( 170) can be printed.

In one embodiment, as the coupling signal (coupling-based signal) in which the DC component is blocked (or reduced) is output to the node 170 , the PMIC through the signal path between the power amplifier 120 and the PMIC 130 . The intensity of the noise of the power amplifier 120 transmitted to the 130 may be canceled (or reduced).

The electronic device 100 according to an embodiment includes the coupling module 150 , thereby reducing the intensity of noise transmitted from the power amplification module 110 to the PMIC 130 . The electronic device 100 according to an embodiment may reduce the intensity of noise transmitted from the power amplification module 110 to the PMIC 130 through a coupling signal (or a signal based thereon) of the coupling module 150 . have.

3 is a block diagram of the power amplification module 110 , the PMIC 130 , and the coupling module 150 according to an embodiment.

3, the power amplification module 110 is a power amplifier 120, a low-pass filter 311, a matching network 313, a band selection switch (BSW, band selection switch, 315), or a combination thereof may include In one embodiment, the coupling module 150 includes a coupler 161 , a DC block capacitor 165 , a switch 331 , a high pass filter 333 , a variable resistor 335 , a phase shifter 337 , or combinations thereof may be included.

In an embodiment, the power amplifier 120 may be implemented as a transistor (eg, a BJT). In FIG. 3 , the power amplifier 120 is illustrated as an NPN BJT, but this is only an example. In an embodiment, the power amplifier 120 may be implemented as a PNP BJT, a FET (eg, a metal oxide semiconductor FET (MOSFET)), or a combination thereof.

In an embodiment, the power amplifier 120 may receive a signal from the transceiver 105 through the first node (eg, the base of the BJT). In an embodiment, the voltage from the PMIC 130 may be applied to the power amplifier 120 through a second node (eg, a BJT collector). In an embodiment, the power amplifier 120 may output an amplified signal with respect to an input signal through a second node (eg, a BJT collector). In FIG. 3 , the power amplifier 120 is illustrated as a common emitter (CE) amplifier, but this is only an example. In an embodiment, the power amplifier 120 may be implemented as an amplifier of a CE amplifier, a common base (CB) amplifier, a common collector (CC) amplifier, or a combination thereof.

In an embodiment, the low pass filter 311 may be connected between the power amplifier 120 and the PMIC 130 .

In an embodiment, the low-pass filter 311 may pass only a low-frequency component (or filter a high-frequency component) in the noise from the power amplifier 120 . In an embodiment, the low-pass filter 311 may be implemented with a choke inductor and a bypass capacitor.

In an embodiment, the matching network 313 may be provided for impedance matching. In an embodiment, the matching network 313 may be implemented through at least one active element and/or at least one passive element. In other embodiments, the matching network 313 may be omitted.

In an embodiment, the band selection switch 315 may select a transmission path corresponding to the frequency band selected by the controller (not shown) and/or the CP 103 of the power amplification module 110 . In an embodiment, a signal output from the band selection switch 315 may be transmitted through the antenna module 107 .

In an embodiment, the coupler 161 may obtain a coupling signal for a signal transmitted through a transmission line between the power amplifier 120 and the band selection switch 315 .

In one embodiment, when the matching network 313 is present, the coupler 161 obtains a coupling signal for a signal transmitted through a transmission line between the matching network 313 and the band selection switch 315. can In another embodiment, when the matching network 313 is present, the coupler 161 may obtain a coupling signal for a signal transmitted through a transmission line between the power amplifier 120 and the matching network 313 . have.

In one embodiment, when the matching network 313 does not exist, the coupler 161 obtains a coupling signal for a signal transmitted through a transmission line between the power amplifier 120 and the band selection switch 315 . can do.

In an embodiment, the switch 331 may be connected between the coupler 161 and the node 170 .

In an embodiment, the switch 331 may be on or off under the control of the CP 103 . In an embodiment, the high-pass filter 333 may pass only the high-frequency component (or filter the low-frequency component) in the coupling signal from the coupler 161 . In an embodiment, the variable resistor 335 may reduce the strength of the coupling signal of the high frequency component.

In an embodiment, the phase shifter 337 may be connected between the coupler 161 and the node 170 .

In an embodiment, the phase shifter 337 may change the phase of the signal output from the variable resistor 335 . In an embodiment, the phase shifter 337 shifts the phase of the signal output from the variable resistor 335 so that at least a portion of the signal output from the variable resistor 335 cancels out the noise of the power amplifier 120 with each other. can be converted In an embodiment, the phase shifter 337 converts the phase of the signal output from the variable resistor 335 so that the phase difference between the signal output from the phase shifter 337 and the noise of the power amplifier 120 is 180 degrees can do.

In an embodiment, the DC block capacitor 165 may be connected between the coupler 161 and the node 170 .

In an embodiment, the DC block capacitor 165 may block (or reduce) the DC component of the signal output from the phase shifter 337 . In an embodiment, the DC block capacitor 165 may output an output signal in which the DC component is blocked (or reduced) to the node 170 on the signal path between the low pass filter 311 and the PMIC 130 . have.

In one embodiment, the signals input to or output from the DC block capacitor 165 , the switch 331 , the high pass filter 333 , the variable resistor 335 , or the phase shifter 337 are a coupling-based signal. may also be referred to as

The electronic device 100 according to an embodiment includes the coupler 161 to reduce the intensity of noise transmitted from the power amplifier 120 to the PMIC 130 . The electronic device 100 according to an embodiment may reduce the intensity of noise transmitted from the power amplifier 120 to the PMIC 130 through a coupling signal (or a signal based thereon) of the coupler 161 .

4 is a block diagram of the power amplification module 110 , the PMIC 130 , and the coupling module 150 according to an embodiment.

Referring to FIG. 4 , the power amplification module 110 may include a power amplifier 120 , a low pass filter 311 , a matching network 313 , a band selection switch 315 , or a combination thereof. In one embodiment, the coupling module 150 includes a coupler 161 , a DC block capacitor 165 , a switch 331 , a high pass filter 333 , a variable resistor 335 , a phase shifter 337 , or combinations thereof may be included.

4 , compared with FIG. 3 , the coupler 161 may be positioned adjacent to the band selection switch 315 . In this case, the coupler 161 may obtain a coupling signal with respect to the signal of the band selection switch 315 .

In an embodiment, the coupler 161 may be located adjacent to the band selection switch 315 . In an embodiment, the coupler 161 may be positioned at a position capable of acquiring a signal coupled to the signal of the band selection switch 315 . In an embodiment, the coupler 161 may be positioned at a position capable of acquiring a coupled signal with respect to a signal on the signal line of the band selection switch 315 .

In an embodiment, the coupling module 150 converts the coupling signal of the coupler 161 to the DC block capacitor 165 , the switch 331 , the high pass filter 333 , the variable resistor 335 , and the phase shifter. After generating a coupling-based signal through 337 , it may be provided to the node 170 . In an embodiment, the coupling-based signal may be a signal having a phase difference from noise within a specified phase difference range (eg, 90 to 270 degrees).

5 is a block diagram of the power amplification module 110 , the PMIC 130 , and the coupling module 150 according to an embodiment.

Referring to FIG. 5 , the power amplification module 110 includes

power amplifiers

120 and 510 , low-

pass filters

311 and 520 , matching

networks

313 and 530 , a band selection switch 315 , and a plurality of band-pass filters. s 540 , a switch 550 , or a combination thereof. In one embodiment, the coupling module (coupling module 150 of FIGS. 1 to 4) includes a coupler 161, a DC block capacitor 165, a switch 331, a high pass filter 333, a variable resistor ( 335), a phase shifter 337, a splitter 560, or a combination thereof.

In an embodiment, the power amplification module 110 may include a multistage amplifier. In an embodiment, at least two

power amplifiers

120 and 510 of the power amplification module 110 may be cascaded. In an embodiment, the power amplifier 120 of the power amplification module 110 may be referred to as a main amplifier. In an embodiment, the power amplifier 510 of the power amplification module 110 may be referred to as a driving amplifier. In an embodiment, a gain of the power amplifier 120 may be greater than a gain of the power amplifier 510 .

In an embodiment, the

power amplifiers

120 and 510 may receive a voltage from the PMIC 130 . In an embodiment, the power amplifier 120 may receive a voltage through a signal path between the power amplifier 120 and the PMIC 130 . In an embodiment, the power amplifier 510 may receive a voltage through a signal path between the power amplifier 510 and the PMIC 130 .

In an embodiment, the power amplifier 510 may receive a signal from a transceiver (transceiver 105 of FIG. 1 or FIG. 2 ). In an embodiment, the power amplifier 510 may receive an input signal from the transceiver 105 through the first node (eg, the base of the BJT). In an embodiment, the power amplifier 510 may receive a voltage from the PMIC 130 through a second node (eg, a BJT collector). In an embodiment, the power amplifier 510 may output an output signal corresponding to an input signal through a second node (eg, a BJT collector). In FIG. 3 , the power amplifier 510 is illustrated as a CE amplifier, but this is only an example. In an embodiment, the power amplifier 510 may be implemented as an amplifier of a CE amplifier, a CB amplifier, a CC amplifier, or a combination thereof.

In an embodiment, the power amplifier 120 may receive an output signal from the power amplifier 510 . In an embodiment, the power amplifier 120 may receive a signal from the power amplifier 510 through a first node (eg, the base of the BJT). In an embodiment, the power amplifier 120 may receive a voltage from the PMIC 130 through a second node (eg, a BJT collector). In an embodiment, the power amplifier 120 may output an output signal corresponding to an input signal through a second node (eg, a collector of a BJT). In FIG. 3 , the power amplifier 120 is illustrated as a common emitter amplifier, but this is only an example. In an embodiment, the power amplifier 120 may be implemented as an amplifier of a CE amplifier, a CB amplifier, a CC amplifier, or a combination thereof.

In an embodiment, the low pass filter 520 may pass only low frequency components in the noise from the power amplifier 510 . In an embodiment, the low-pass filter 520 may be implemented with a choke inductor and a bypass capacitor.

In an embodiment, a matching network 530 may be provided between the power amplifier 120 and the power amplifier 510 for impedance matching. In an embodiment, the matching network 530 may be implemented through at least one active element and/or at least one passive element. In other embodiments, the matching network 530 may be omitted. In one embodiment, the matching network 530 may also be referred to as an inter-matching network.

In an embodiment, the low-pass filter 311 may pass only low-frequency components in the noise from the power amplifier 120 . In an embodiment, the low-pass filter 311 may be implemented as a choke inductor and a bypass capacitor.

In one embodiment, the band selection switch 315 is a transmission corresponding to the frequency band selected by the controller (not shown) and / or CP (CP 103 of FIG. 1 or 2) of the power amplification module 110 You can choose a path. In an embodiment, the band selection switch 315 corresponds to a frequency band selected by the controller (not shown) and/or the CP 103 of the power amplification module 110 among the plurality of band pass filters 540 . A band pass filter can be selected.

In an embodiment, the plurality of band pass filters 540 may pass signals of different frequency bands.

In an embodiment, the switch 550 is a band pass filter corresponding to a frequency band selected by the controller (not shown) and/or the CP 103 of the power amplification module 110 among the plurality of band pass filters 540 . can be selected.

In an embodiment, a signal output through the band selection switch 315 , the plurality of band pass filters 540 , and the switch 550 may be transmitted through the antenna module 107 .

In an embodiment, the coupler 161 may obtain a signal coupled to a signal transmitted through a transmission line between the switch 550 and the antenna module 107 (hereinafter, 'coupling signal').

In an embodiment, the splitter 560 may divide the coupling signal into at least two signals having a specified power ratio. In an embodiment, the splitter 560 may input a first signal among the at least two signals to the switch 331 , and may input a second signal among the at least two signals to the transceiver 105 . In an embodiment, the CP 103 may monitor a signal transmitted through the antenna module 107 based on the second signal.

In an embodiment, the switch 331 may be on or off under the control of the CP 103 . In an embodiment, the high-pass filter 333 may pass only a high-frequency component in the coupling signal from the coupler 161 . In an embodiment, the variable resistor 335 may reduce the strength of the coupling signal of the high frequency component.

In FIG. 5 , the electronic device 100 is illustrated as having only one coupling module 150 including the coupler 161 , but this is only an example. In an embodiment, the electronic device 100 may include as many coupling modules as the number of

power amplifiers

120 and 510 . In an embodiment, the electronic device 100 may include a coupler for reducing noise of the power amplifier 510 and a coupler 161 for reducing noise of the power amplifier 120 , respectively. In an embodiment, the coupler for reducing noise of the power amplifier 510 is adjacent to a transmission line through which an input signal of the power amplifier 510 is transmitted and/or a transmission line through which an output signal of the power amplifier 510 is transmitted. can be located.

In FIG. 5 , the coupler 161 is illustrated as being positioned at a position capable of acquiring a coupled signal from a signal on a transmission line connected to the switch 550 , but this is only an example.

In an embodiment, the coupler 161 may be located at a position capable of acquiring a signal coupled to the signal of the switch 550 . In an embodiment, the coupler 161 may be located at a position capable of acquiring a signal coupled to a signal on a signal line of the switch 550 .

6 is a block diagram of the power amplification module 110 , the PMIC 130 , and the coupling module 150 according to an embodiment.

Referring to FIG. 6 , the power amplification module 110 includes the

power amplifiers

120 and 510 , the low pass filters 311 and 520 , the matching

networks

313 and 530 , the band selection switch 315 , or a combination thereof. may include In an embodiment, the coupling module (the coupling module 150 of FIGS. 1 to 4 ) may include a coupler 161 , a switch 331 , a high pass filter 333 , or a combination thereof.

6 , the coupler 161 may be positioned adjacent to the

power amplifiers

120 and 510 compared to FIG. 5 . In this case, the coupler 161 may obtain a coupling signal with respect to the input signal of the power amplifier 120 or the output signal of the power amplifier 510 .

In one embodiment, the coupling module 150 generates a coupling-based signal through the coupling signal of the coupler 161 through the DC block capacitor 165 , the switch 331 , and the high pass filter 333 . It can be provided to node 170 . In an embodiment, the coupling-based signal may be a signal having a phase difference from noise within a specified phase difference range (eg, 90 to 270 degrees).

In an embodiment, when the power amplifier 120 is a CE amplifier, the power amplifier 120 may generate an output signal in which the phase of the input signal is inverted. In this case, the phase shifter 337 may be omitted. In another embodiment, when the power amplifier 120 generates an output signal that does not invert the phase of the input signal, a phase shifter 337 may be added.

The electronic device 100 according to an embodiment of the present disclosure receives a voltage from a power supply (eg, the PMIC 130 of FIG. 1 ), the power supply through a first signal path, and outputs amplified input signals an amplifier (eg, the power amplifier 120 of FIG. 2 ) for outputting a signal and a coupler 161 for obtaining a signal coupled with the output signal, wherein the coupler 161 receives the coupled signal may be coupled to node 170 on the first signal path to supply a first signal path between the power supply and the amplifier.

In one embodiment, a capacitor (eg, a DC block capacitor 165) connected between the coupler 161 and the node 170 is further included, wherein the capacitor removes a DC component from the coupled signal, The coupled signal from which the DC component is removed may be supplied to the first signal path.

In one embodiment, further comprising a phase shifter 337 coupled between the coupler and the node, the phase shifter 337 transforms the phase of the coupled signal, the phase-shifted coupling signal may be supplied to the first signal path.

In an embodiment, a phase difference between the phase-shifted coupled signal and the output signal is between a signal transmitted to the power supply through the first signal path among the output signals and the phase-shifted coupled signal destructive interference may occur.

In an embodiment, the coupler 161 may be located in a transmission line through which the output signal of the amplifier is transmitted.

In an embodiment, the coupler 161 may be positioned at a position where the output signal of the amplifier is coupled to a signal of an input device (eg, a band selection switch 315 ).

In an embodiment, the coupler 161 may be positioned at a position where the output signal of the amplifier is coupled with an output signal of an input device (eg, the band selection switch 315 ).

In an embodiment, at least a part of the coupled signal may be used as a feedback signal.

In one embodiment, the amplifier may be a BJT.

In one embodiment, the amplifier may be a common emitter amplifier.

In an embodiment, the power supply and the amplifier may be connected through a low pass filter 311 .

In an embodiment, a variable resistor 335 connected between the coupler 161 and the node 170 may be further included.

In an embodiment, a switch 331 connected between the coupler 161 and the node 170 may be further included.

In an embodiment, the amplifier may be implemented as a main amplifier (eg, the power amplifier 120 of FIG. 5 ) and a driving amplifier (eg, the power amplifier 510 of FIG. 5 ).

In an embodiment, the coupler 161 may obtain a coupled signal with respect to the output signal of the main amplifier.

In an embodiment, the main amplifier and the driving amplifier may be cascaded, and a gain of the main amplifier may be greater than a gain of the driving amplifier.

The electronic device 100 according to an embodiment of the present disclosure receives a voltage from a power supply (eg, the PMIC 130 of FIG. 1 ) and the power supply through a first path, and an output signal amplified with respect to an input signal an amplifier (eg, the power amplifier 120 of FIG. 2 ) that outputs may be coupled to node 170 on the first signal path to feed a first signal path between the supply and the amplifier.

In an embodiment, the phase of the output signal may be inverted compared to the input signal.

In an embodiment, the coupler 161 may be located in a transmission line through which the input signal is input to the amplifier.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish an element from other such elements, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims

In an electronic device,

power supply;

an amplifier receiving a voltage from the power supply through a first signal path and outputting an amplified output signal with respect to the input signal; and

a coupler for obtaining a signal coupled with the output signal;

and the coupler is coupled to a node on the first signal path to supply the coupled signal to a first signal path between the power supply and the amplifier.
The method according to claim 1,

Further comprising a capacitor connected between the coupler and the node,

The capacitor removes a DC component from the coupled signal, and supplies the coupled signal from which the DC component is removed to the first signal path.
The method according to claim 1,

Further comprising a phase shifter connected between the coupler and the node,

The phase shifter converts a phase of the coupled signal, and supplies the phase-shifted coupled signal to the first signal path.
The method according to claim 1,

The coupler is located in a transmission line through which the output signal of the amplifier is transmitted.
The method according to claim 1,

The coupler is positioned at a position where the output signal of the amplifier is coupled to a signal of an input device.
The method according to claim 1,

The coupler is positioned at a position where the output signal of the amplifier is coupled with an output signal of an input device.
The method according to claim 1,

At least a portion of the coupled signal is used as a feedback signal.
The method according to claim 1,

The amplifier is an electronic device of a bipolar junction transistor (BJT).
The method according to claim 1,

The power supply and the amplifier are connected through a low pass filter.
The method according to claim 1,

The electronic device further comprising a variable resistor connected between the coupler and the node.
The method according to claim 1,

The electronic device further comprising a switch connected between the coupler and the node.
The method according to claim 1,

The amplifier is an electronic device implemented as a main amplifier and a driving amplifier.
In an electronic device,

power supply;

an amplifier receiving a voltage from the power supply through a first signal path and outputting an amplified output signal with respect to the input signal; and

A coupler for obtaining a signal coupled with the input signal,

and the coupler is coupled to a node on the first signal path to supply the coupled signal to a first signal path between the power supply and the amplifier.
14. The method of claim 13,

The output signal is an electronic device whose phase is inverted compared to the input signal.
14. The method of claim 13,

Further comprising a capacitor connected between the coupler and the node,

The capacitor removes a DC component from the coupled signal, and supplies the coupled signal from which the DC component is removed to the first signal path.