WO2022190551A1 - Optical sensor - Google Patents

Optical sensor Download PDF

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Publication number
WO2022190551A1
WO2022190551A1 PCT/JP2021/047172 JP2021047172W WO2022190551A1 WO 2022190551 A1 WO2022190551 A1 WO 2022190551A1 JP 2021047172 W JP2021047172 W JP 2021047172W WO 2022190551 A1 WO2022190551 A1 WO 2022190551A1
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WO
WIPO (PCT)
Prior art keywords
flange
hole
housing
optical sensor
cable
Prior art date
Application number
PCT/JP2021/047172
Other languages
French (fr)
Japanese (ja)
Inventor
紘行 水崎
裕介 小田
Original Assignee
オムロン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2021039428A external-priority patent/JP7511815B2/en
Application filed by オムロン株式会社 filed Critical オムロン株式会社
Publication of WO2022190551A1 publication Critical patent/WO2022190551A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00Apparatus or processes specially adapted for the manufacture of electric switches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H35/00Switches operated by change of a physical condition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02Bases, casings, or covers
    • H01H9/04Dustproof, splashproof, drip-proof, waterproof, or flameproof casings

Definitions

  • the present invention relates to optical sensors.
  • Optical sensors such as photoelectric sensors and image sensors have a circuit board that constitutes the control unit, etc., built into the housing.
  • a cable is connected to the circuit board through the housing in order to supply power from outside the housing to the circuit board and transmit signals processed by the circuit board to the outside of the housing (for example, Patent Documents 1 and 2). reference).
  • FIG. 2 of Patent Literature 1 discloses an optical sensor in which wires are extended long from the end of the outer skin to facilitate soldering. However, if the work is performed by extending the wires, a space is required to accommodate the long wires by folding them, which increases the size of the housing. Since optical sensors are often installed inside production lines and equipment in factories, compact housings are desired.
  • the optical sensor of Patent Document 2 has been proposed as an optical sensor that does not need to be soldered inside the housing.
  • a flexible board with a connector is preliminarily soldered to the tip of a cable, and in the process of assembling the optical sensor, the flexible board is elastically deformed to pass through the through hole, and the flexible board is attached to the connector of the circuit board.
  • the cable is mounted on the circuit board by inserting the connector.
  • an object of the present invention is to provide an optical sensor in which a cable can be mounted on a circuit board in a simple and space-saving manner.
  • An optical sensor includes a housing in which a through hole is formed, a plurality of strands whose core wires are covered with an inner skin, a cable having an outer sheath that bundles the plurality of strands, and an end of the outer sheath.
  • a flange integrally molded with the outer skin and the inner skin and formed to a size that can pass through the through-hole; a stopper that regulates the position of the flange with respect to the through-hole; a cover that covers a gap between the flange and the cover; a first sealing material that seals a gap between the outer surface of the housing and the cover; and a second sealing material that seals a gap between the flange and the cover.
  • a method for manufacturing an optical sensor includes: accommodating a circuit board in a housing in which a through hole is formed; preparing a cable having a flange dimensioned to be able to pass through the through-hole, inserting the flange into the through-hole deeper than the predetermined position at the time of completion, and soldering the core wire of the cable to the circuit board;
  • the circuit board is accommodated in the housing, the through-hole and the flange are arranged in a predetermined position, the stopper is attached and positioned, and the sealing material and the cover are attached to seal the boundary between the through-hole and the flange. includes doing.
  • the housing can be made compact by omitting the space for folding and accommodating the wire. Since a stopper is provided to regulate the position of the flange with respect to the through hole, the housing and cable can be positioned even after soldering. Further, the housing and the flange are in close contact with the stopper, and the inner skin and the outer skin are integrally molded with the flange and are in close contact with each other.
  • the optical sensor Since it is provided with a material and a cover, it is possible to fully satisfy the design requirements for the cable root, such as tensile resistance, bending resistance, and sealing performance. Since the optical sensor can be configured with inexpensive parts, the manufacturing cost of the optical sensor can be suppressed.
  • a light source that emits light may be further provided, the flange may be made of translucent resin, and the light from the light source may be reflected by the stopper to enter the flange.
  • the translucent flange into which the light is incident can be lit or blinked.
  • the flange can be used as an indicator to show the operational status of the optical sensor.
  • a twin ring in which the second O-ring and the first O-ring surrounding the second O-ring are integrally formed, the first sealing material is the first O-ring, and the second The sealing material may be the inner second O-ring.
  • the burden on the operator can be reduced in the assembly process compared to positioning them individually.
  • a first groove is formed in the outer peripheral surface of the flange
  • a second groove is formed in the through-hole at a position corresponding to the first groove
  • the stopper includes the first groove and the second groove. It may be a sheet metal inserted across the
  • the stopper can be configured with inexpensive parts.
  • the manufacturing cost of the optical sensor can be suppressed.
  • FIG. 1 is a cross-sectional view showing the internal structure of an optical sensor according to one embodiment of the present invention.
  • FIG. 2 is a partially exploded perspective view of the optical sensor shown in FIG. 1, viewed from the through hole side.
  • 3 is a cross-sectional view showing an enlarged root of the cable shown in FIG. 1.
  • FIG. 4 is a sectional view showing a state in which the stopper shown in FIG. 3 is removed and the cable is inserted deeper than the predetermined position.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG.
  • FIG. 6 is a diagram showing an example of a procedure for manufacturing a photosensor according to one embodiment of the present invention.
  • FIGS. 1 and 2 disclose a photoelectric sensor provided with a light projecting portion 4 for emitting light and a light receiving portion 5 for receiving light as an example of the optical sensor 1.
  • FIG. 1 The amount of light reaching the light receiving section 5 changes when the projected light is blocked or reflected by the workpiece.
  • the photoelectric sensor can detect this change, convert it into an electric signal, and output it to an external device.
  • the optical sensor 1 is not limited to a photoelectric sensor.
  • the optical sensor 1 may be a displacement sensor that measures the distance from the sensor to the object by detecting the amount of physical change in the object with an optical element and calculating the amount of change as a distance, or by using a camera. It may be an image sensor that calculates the area, center of gravity, length, position, etc. of the object by image processing the captured image and outputs data and judgment results, or reads barcodes and two-dimensional codes. It may be a code reader.
  • FIG. 1 is a cross-sectional view showing the internal structure of an optical sensor 1 according to one embodiment of the present invention.
  • the optical sensor 1 is configured as a retroreflective photoelectric sensor, and in addition to the light projecting unit 4 and the light receiving unit 5, includes an amplifier unit, a control unit, etc. (not shown). 10, it is connected to an external power source and an external device.
  • the optical sensor 1 may be configured as a transmissive photoelectric sensor, and the light projecting section 4 and the light receiving section 5 may be accommodated in separate housings 2, respectively. It may be configured as an amplifier-separated photoelectric sensor in which the amplifying section is separated outside the housing 2 , or may be configured as a power-source photoelectric sensor in which the power section is built in the housing 2 .
  • the amplifier section, control section, etc. described above are mounted on the circuit board 3 housed in the housing 2 .
  • the circuit board 3 may further comprise an indicator light source 6 for indicating the operating state of the optical sensor 1 .
  • a base end of a cable 10 is mounted by soldering in a mounting area 7 defined by the circuit board 3 .
  • a connector 8 that can be connected to an external power source or a connector of an external device may be provided at the tip of the cable 10 .
  • the housing 2 is made of a metal material such as stainless steel or zinc die-cast, except for windows 4W and 5W in which the light projecting section 4 and the light receiving section 5 are provided.
  • the material of the housing 2 is not limited to the metal material.
  • the housing 2 may be formed from a resin material such as polybutylene terephthalate resin or ABS resin.
  • the windows 4W and 5W are made of, for example, a translucent material such as methacrylic resin or glass.
  • FIG. 2 is a partially exploded perspective view of the optical sensor 1 shown in FIG. 1 as seen from the through hole 9 side.
  • the housing 2 includes a case body 20 formed in a substantially rectangular parallelepiped cup shape, and a lid 21 that covers the opening of the case body 20 .
  • the case body 20 includes a bottom wall 22 and a peripheral wall 23 rising from the bottom wall 22 and extending toward the lid 21 .
  • the bottom wall 22 is located on the opposite side of the lid 21 .
  • a circular through hole 9 is formed in the peripheral wall 23 .
  • a cable 10 is inserted through the through hole 9 .
  • the cable 10 includes a plurality of strands (11, 12), an outer sheath 13 that bundles the plurality of strands (11, 12), a flange 14 that integrally forms the outer sheath 13 and the inner sheath 12 at the end of the sheath 13, have.
  • the strands (11, 12) have a core wire 11 made up of a plurality of conducting wires and an inner skin 12 covering the core wire 11.
  • the inner skin 12 and the outer skin 13 are made of vinyl chloride resin, for example.
  • the flange 14 is made of a resin material such as polybutylene terephthalate resin or ABS resin. Flange 14 may be formed from a translucent material. The translucent material may be transparent or milky white. In that case, the light from the light source 6 (shown in FIG. 1) mounted on the circuit board 3 or the like may be reflected by the stopper 15 formed of sheet metal or the like and incident on the flange 14 . When the flange 14 is made of translucent resin, the flange 14 can be used as an indicator for displaying the operating state of the optical sensor 1 .
  • the flange 14 is formed in a cylindrical shape having substantially the same cross section as the through hole 9 .
  • the aforementioned through hole 9 may have a shape other than circular.
  • the through hole 9 may be substantially D-shaped or oval.
  • the flange 14 has a substantially D-shaped (D-cut) or elliptical cross section. If the through hole 9 is formed in a shape other than circular, the flange 14 can be configured so as not to rotate with respect to the through hole 9 .
  • FIG. 3 is a cross-sectional view showing an enlarged root of the cable 10 shown in FIG.
  • the flange 14 integrally forming the outer skin 13 and the inner skin 12 is formed to have dimensions that allow it to pass through the through hole 9 .
  • a portion of the flange 14 protruding outward from the housing 2 is formed into a reduced diameter portion 19 having a smaller diameter than other portions.
  • a step surface formed by a step between the diameter-reduced portion 19 and other portions is flush with the end surface of the through hole 9 .
  • the optical sensor 1 further comprises a stopper 15, a cover 17, and first and second sealing members 16A, 16B.
  • the stopper 15 regulates the position P0 of the flange 14 with respect to the through hole 9.
  • a first groove 18 is formed on the outer peripheral surface of the flange 14
  • a second groove 28 is formed on the inner peripheral surface of the through hole 9 at a position corresponding to the first groove 18 .
  • the stopper 15 is formed, for example, from sheet metal in a substantially C shape (see FIG. 2), and is inserted across the first groove 18 and the second groove 28 . Note that the configuration of the stopper 15 is not particularly limited, and other configurations may be used.
  • the cover 17 is made of the same material as the housing 2 and covers the boundary portion B between the inner peripheral surface of the through hole 9 and the outer peripheral surface of the flange 14 . As shown in FIG. 2, the cover 17 has a substantially rectangular flat plate shape with a through hole in the center, and is fixed to the outer surface 2B of the housing 2 with tightening screws 17S or the like. The reduced diameter portion 19 of the flange 14 is inserted into the through hole of the cover 17 .
  • the first sealing material 16A seals the gap G1 between the outer surface 2B of the housing 2 and the inner surface of the cover 17.
  • the second sealing member 16B seals the gap G2 between the outer end surface of the flange 14 and the inner surface of the cover 17.
  • the first and second seals 16A, 16B are the second O-ring 16B and the first O-ring 16A surrounding (circumscribing the second O-ring 16B) the second O-ring 16B. It is composed of a twin ring 16 integrally formed with.
  • the sealing material is not limited to the illustrated example, and may be other types of sealing material.
  • the gaps G1 and G2 may be sealed with two separable large and small O-rings.
  • the twin ring 16 is arranged across the step surface of the flange 14 and the end surface of the through hole 9 .
  • FIG. 4 is a cross-sectional view showing a state in which the stopper 15 shown in FIG. 3 is removed and the cable 10 is inserted to a position P1 deeper than the predetermined position P0
  • FIG. 1 is a cross-sectional view along a line;
  • the flange 14 is configured to be able to pass through the through hole 9 when the stopper 15 is removed.
  • the assembly work can be performed by bringing the tip of the cable 10 close to the mounting area 7 of the circuit board 3 to the position P1 where soldering is easy.
  • the cable 10 can be attached to the housing 2 by placing the flange 14 at a predetermined position P0 in the completed state of the optical sensor 1 and attaching the stopper 15 to the flange 14. can be fixed to
  • FIG. 6 is a diagram showing an example of the procedure for manufacturing the optical sensor 1.
  • FIG. A cable 10 having a flange 14 in which an inner skin 12 and an outer skin 13 of the cable 10 are integrally formed is prepared.
  • the dimensions of the cross section of the flange 14 are formed so as to pass through the through hole 9 formed in the housing 2 (step S1).
  • the flange 14 is inserted into the through hole 9 from the outer surface 2B side of the housing 2 to a position P1 deeper than the predetermined position P0 at the time of completion, and the core wire 11 of the cable 10 inserted through the through hole 9 is inserted into the housing.
  • the core wire 11 of the cable 10 is soldered to the mounting area 7 of the circuit board 3 in a state of being pulled out of the body 2 (step S2). Since the soldering work can be performed in a state in which the core wire 11 can be freely moved, the burden on the worker can be reduced.
  • the circuit board 3 to which the core wire 11 of the cable 10 is soldered is housed in the housing 2 (step S3).
  • the through hole 9 and the flange 14 are arranged at a predetermined position P1, and the stopper 15 is attached to position the housing 2 and the cable 10 (step S4).
  • the cable 10 is fixed to the housing 2, and the inside and outside of the housing 2 are sealed.
  • the housing 2 can be made compact.
  • the housing and the flange are in close contact with the stopper, the inner skin and the outer skin are integrally molded with the flange, and the first sealing material, the second sealing material, and the second sealing material for sealing the boundary between the through hole and the flange Since the cover is provided, it is possible to sufficiently satisfy the design requirements for the cable root, such as tensile resistance, bending resistance, sealing performance, and the like. Since the root portion of the cable 10 can be configured with inexpensive parts such as sheet metal, the manufacturing cost of the optical sensor can be suppressed.
  • Optical sensor (1)
  • soldering (S2), housing the circuit board (3) in the housing (2) (S3); Arranging the through-hole (9) and the flange (14) at the predetermined position (P0) and attaching a stopper (15) for positioning (S4); Attaching sealing materials (16A, 16B) and a cover (17) to seal the boundary (B) between the through hole (9) and the flange (14) (S5); A method for manufacturing an optical sensor (1).
  • SYMBOLS 1 ... Optical sensor, 2... Housing, 2A... Inner surface, 2B... Outer surface, 3... Circuit board, 4... Light projecting part, 5... Light receiving part, 4W, 5W... Window part, 6... Light source, 7... Mounting area, 8 Connector 9 Through hole 10 Cable 11 Core wire 12 Inner skin 13 Outer skin 14 Flange 15 Stopper 16 Twin ring 16A First seal 16B Second seal Material 17 Cover 17S Clamping screw 18 First groove 19 Reduced diameter portion 20 Case body 21 Lid 22 Bottom wall 23 Peripheral wall 28 Second groove B Boundaries, G1, G2, Gap, P0, P1, Position, S1 to S5, Optical sensor manufacturing method.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Manufacture Of Switches (AREA)
  • Switch Cases, Indication, And Locking (AREA)

Abstract

Provided is an optical sensor (1) which makes it possible to easily mount a cable (10) to a circuit substrate (3) while conserving space. An optical sensor (1) is equipped with: a housing (2) in which a through-hole (9) is formed; a cable (10) which has a plurality of wires (11, 12) comprising core wires (11) covered by inner sheaths (12), and also has an outer sheath (13) for bundling the plurality of wires (11, 12) with one another; a flange (14) which is integrally formed with the outer sheath (13) and the inner sheath (12) at an end of the outer sheath (13), and is formed to have a dimension which can pass through the through-hole (9); a stopper (15) which restricts the position (P1) of the flange (14) relative to the through-hole (9); a cover (17) which is secured to the outer surface (2B) of the housing (2) and covers the boundary (B) between the through-hole (9) and the flange (14); a first sealing material (16A) for sealing the gap (G1) between the cover (17) and the outer surface (2B) of the housing (2); and a second sealing material (16B) for sealing the gap (G2) between the flange (14) and the cover (17).

Description

光センサlight sensor
 本発明は、光センサに関する。 The present invention relates to optical sensors.
 光電センサや画像センサ等の光センサは、制御部等を構成する回路基板が筐体に内蔵されている。回路基板に筐体外からの電力を供給し、回路基板で処理された信号を筐体外へ送信するため、筐体を貫通して回路基板にケーブルが接続されている(例えば、特許文献1及び2参照)。 Optical sensors such as photoelectric sensors and image sensors have a circuit board that constitutes the control unit, etc., built into the housing. A cable is connected to the circuit board through the housing in order to supply power from outside the housing to the circuit board and transmit signals processed by the circuit board to the outside of the housing (for example, Patent Documents 1 and 2). reference).
特開2007-3348号公報Japanese Patent Application Laid-Open No. 2007-3348 特開2020-150205号公報Japanese Patent Application Laid-Open No. 2020-150205
 光センサの組立て工程において、ケーブルの外皮は筐体に固定されていて自由に動かすことができない。外皮の終端から延びる素線が短いと、ケーブルを回路基板にはんだ付けで実装する際に作業性が悪いため、作業者の負担が大きくなる。特許文献1の図2には、はんだ付けを容易にするために、外皮の終端から素線を長く延ばした光センサが開示されている。しかしながら、素線を延ばして作業すると長い素線を折り畳んで収容するスペースが必要になり、その分だけ筐体が大きくなる。光センサは、工場の生産ラインや設備の内部に設置されることが多いため、コンパクトな筐体が望まれている。  In the assembly process of the optical sensor, the outer sheath of the cable is fixed to the housing and cannot be moved freely. If the strands of wire extending from the end of the outer cover are short, workability is poor when mounting the cable on the circuit board by soldering, which increases the burden on the operator. FIG. 2 of Patent Literature 1 discloses an optical sensor in which wires are extended long from the end of the outer skin to facilitate soldering. However, if the work is performed by extending the wires, a space is required to accommodate the long wires by folding them, which increases the size of the housing. Since optical sensors are often installed inside production lines and equipment in factories, compact housings are desired.
 筐体内ではんだ付けする必要がない光センサとして、特許文献2の光センサが提案されている。特許文献2では、ケーブルの先端にコネクタ付きのフレキシブル基板をあらかじめはんだ付けしておき、光センサの組立て工程において、フレキシブル基板を弾性変形させて貫通孔を通過させ、回路基板のコネクタにフレキシブル基板のコネクタを挿入することで、回路基板にケーブルを実装する。特許文献2によれば、作業者の負担が軽減されるものの、高価なフレキシブル基板やコネクタをケーブルに追加する必要があるため、光センサの製造コストが増える。 The optical sensor of Patent Document 2 has been proposed as an optical sensor that does not need to be soldered inside the housing. In Patent Document 2, a flexible board with a connector is preliminarily soldered to the tip of a cable, and in the process of assembling the optical sensor, the flexible board is elastically deformed to pass through the through hole, and the flexible board is attached to the connector of the circuit board. The cable is mounted on the circuit board by inserting the connector. According to Patent Document 2, although the burden on the operator is reduced, the manufacturing cost of the optical sensor increases because it is necessary to add an expensive flexible substrate and connector to the cable.
 そこで、本発明は、ケーブルを回路基板に簡単に省スペースで実装できる光センサを提供することを目的とする。 Therefore, an object of the present invention is to provide an optical sensor in which a cable can be mounted on a circuit board in a simple and space-saving manner.
 本開示の一態様に係る光センサは、貫通孔が形成された筐体と、芯線を内皮で被覆した複数の素線、及び該複数の素線を束ねる外皮を有するケーブルと、外皮の端部において該外皮と内皮とを一体成形し、かつ貫通孔を通過可能な寸法に形成されたフランジと、貫通孔に対するフランジの位置を規制するストッパと、筐体の外面に固定され、貫通孔とフランジとの隙間を覆うカバーと、筐体の外面とカバーとの隙間を密閉する第1シール材と、フランジとカバーとの隙間を密閉する第2シール材と、を備えている。 An optical sensor according to an aspect of the present disclosure includes a housing in which a through hole is formed, a plurality of strands whose core wires are covered with an inner skin, a cable having an outer sheath that bundles the plurality of strands, and an end of the outer sheath. a flange integrally molded with the outer skin and the inner skin and formed to a size that can pass through the through-hole; a stopper that regulates the position of the flange with respect to the through-hole; a cover that covers a gap between the flange and the cover; a first sealing material that seals a gap between the outer surface of the housing and the cover; and a second sealing material that seals a gap between the flange and the cover.
 本開示の一実施形態に係る光センサの製造方法は、貫通孔が形成された筐体内に回路基板を収容すること、内皮と外皮とが一体成形された状態のフランジであって筐体に形成された貫通孔を通過できる寸法のフランジを有するケーブルを用意すること、貫通孔に対して完成時における所定の位置よりも奥までフランジを挿入し、回路基板にケーブルの芯線をはんだ付けすること、筐体内に回路基板を収容すること、貫通孔とフランジとを所定の位置に配置し、ストッパを取り付けて位置決めすること、並びに、シール材及びカバーを取り付けて貫通孔とフランジとの境界部を密閉すること、を含んでいる。 A method for manufacturing an optical sensor according to an embodiment of the present disclosure includes: accommodating a circuit board in a housing in which a through hole is formed; preparing a cable having a flange dimensioned to be able to pass through the through-hole, inserting the flange into the through-hole deeper than the predetermined position at the time of completion, and soldering the core wire of the cable to the circuit board; The circuit board is accommodated in the housing, the through-hole and the flange are arranged in a predetermined position, the stopper is attached and positioned, and the sealing material and the cover are attached to seal the boundary between the through-hole and the flange. includes doing.
 これらの態様によれば、ケーブルが貫通孔を通過できるので、完成時における所定の位置よりも奥までケーブルを挿入した状態でケーブルと回路基板とをはんだ付けするため、作業者の負担を軽減できる。外皮から素線を長く延ばして作業する必要がないため、素線を折り畳んで収容するスペースを省略して筐体をコンパクトに構成できる。貫通孔に対するフランジの位置を規制するストッパを備えているため、はんだ付けした後からでも筐体とケーブルとを位置決めできる。また、ストッパにより筐体とフランジが密着しており、さらにフランジにより内皮と外皮とが一体成形されて密着しており、貫通孔とフランジとの境界部を密閉する第1シール材、第2シール材及びカバーを備えているため、ケーブル根元の設計要件である耐引張性能、耐屈曲性能、封止性能等を十分に満たすことができる。廉価な部品で構成できるため、光センサの製造コストを抑えることができる。 According to these aspects, since the cable can pass through the through-hole, the cable and the circuit board are soldered while the cable is inserted deeper than the predetermined position at the time of completion, so that the burden on the operator can be reduced. . Since there is no need to work by extending the wire from the outer cover, the housing can be made compact by omitting the space for folding and accommodating the wire. Since a stopper is provided to regulate the position of the flange with respect to the through hole, the housing and cable can be positioned even after soldering. Further, the housing and the flange are in close contact with the stopper, and the inner skin and the outer skin are integrally molded with the flange and are in close contact with each other. Since it is provided with a material and a cover, it is possible to fully satisfy the design requirements for the cable root, such as tensile resistance, bending resistance, and sealing performance. Since the optical sensor can be configured with inexpensive parts, the manufacturing cost of the optical sensor can be suppressed.
 上記態様において、光を発する光源を更に備え、フランジは透光性樹脂から形成され、光源からの光がストッパに反射されてフランジに入射するように構成されていてもよい。 In the above aspect, a light source that emits light may be further provided, the flange may be made of translucent resin, and the light from the light source may be reflected by the stopper to enter the flange.
 この態様によれば、回路基板等に光源を実装すれば、光が入射する透光性のフランジを点灯させたり、明滅させたりすることができる。光センサの稼働状態を表示するインジケータとしてフランジを使用できる。 According to this aspect, if the light source is mounted on the circuit board or the like, the translucent flange into which the light is incident can be lit or blinked. The flange can be used as an indicator to show the operational status of the optical sensor.
 上記態様において、第2のOリングと、該第2のOリングを囲む第1のOリングとが一体成形されたツインリングを備え、第1シール材が第1のOリングであり、第2シール材が前記内側第2のOリングであってもよい。 In the above aspect, a twin ring is provided in which the second O-ring and the first O-ring surrounding the second O-ring are integrally formed, the first sealing material is the first O-ring, and the second The sealing material may be the inner second O-ring.
 この態様によれば、第1シール材と第2シール材とが一体成形されているため、組立て工程においてそれらを個別に位置決めするよりも作業者の負担を軽減できる。 According to this aspect, since the first sealing material and the second sealing material are integrally molded, the burden on the operator can be reduced in the assembly process compared to positioning them individually.
 上記態様において、フランジの外周面には、第1溝が形成され、貫通孔内には、第1溝に対応する位置に第2溝が形成され、ストッパは、第1溝と第2溝とに跨って挿入された板金であってもよい。 In the above aspect, a first groove is formed in the outer peripheral surface of the flange, a second groove is formed in the through-hole at a position corresponding to the first groove, and the stopper includes the first groove and the second groove. It may be a sheet metal inserted across the
 この態様によれば、廉価な部品でストッパを構成できる。光センサの製造コストを抑えることができる。 According to this aspect, the stopper can be configured with inexpensive parts. The manufacturing cost of the optical sensor can be suppressed.
 本発明によれば、ケーブルを回路基板に簡単に省スペースで実装できる光センサを提供することができる。 According to the present invention, it is possible to provide an optical sensor in which a cable can be easily mounted on a circuit board while saving space.
図1は、本発明の一実施形態の光センサの内部構造を示す断面図である。FIG. 1 is a cross-sectional view showing the internal structure of an optical sensor according to one embodiment of the present invention. 図2は、図1に示された光センサを一部分解して貫通孔側から見た斜視図である。FIG. 2 is a partially exploded perspective view of the optical sensor shown in FIG. 1, viewed from the through hole side. 図3は、図1に示されたケーブルの根元を拡大して示す断面図である。3 is a cross-sectional view showing an enlarged root of the cable shown in FIG. 1. FIG. 図4は、図3に示されたストッパを取り外してケーブルを所定の位置よりも奥まで挿入した状態を示す断面図である。FIG. 4 is a sectional view showing a state in which the stopper shown in FIG. 3 is removed and the cable is inserted deeper than the predetermined position. 図5は、図4中のV-V線に沿う断面図である。FIG. 5 is a cross-sectional view taken along line VV in FIG. 図6は、本発明の一実施形態の光センサを製造する手順の一例を示す図である。FIG. 6 is a diagram showing an example of a procedure for manufacturing a photosensor according to one embodiment of the present invention.
 添付図面を参照して、本発明の好適な実施形態について説明する。なお、各図において、同一の参照符号を付したものは、同一又は同様の構成を有する。以下、図面を参照して各構成について詳しく説明する。図1及び図2において、光センサ1の一例として光を出す投光部4と光を受ける受光部5とを備えた光電センサを開示している。受光部5に到達する光の量は、投光された光がワークによって遮られたり反射したりすると変化する。光電センサは、この変化を検出して電気信号に変換し、外部機器へ出力できる。 A preferred embodiment of the present invention will be described with reference to the accompanying drawings. It should be noted that, in each figure, the same reference numerals have the same or similar configurations. Hereinafter, each configuration will be described in detail with reference to the drawings. FIGS. 1 and 2 disclose a photoelectric sensor provided with a light projecting portion 4 for emitting light and a light receiving portion 5 for receiving light as an example of the optical sensor 1. FIG. The amount of light reaching the light receiving section 5 changes when the projected light is blocked or reflected by the workpiece. The photoelectric sensor can detect this change, convert it into an electric signal, and output it to an external device.
 ただし、光センサ1は、光電センサに限定されない。光センサ1は、対象物の物理変化量を光学式素子で検知し,その変化量を距離に演算することでセンサから対象物までの距離を計測する変位センサであってもよいし、カメラでとらえた映像を画像処理することで、対象物の面積、重心、長さ、位置等を算出し、データや判定結果を出力する画像センサであってもよいし、バーコードや二次元コードを読み取るコードリーダであってもよい。 However, the optical sensor 1 is not limited to a photoelectric sensor. The optical sensor 1 may be a displacement sensor that measures the distance from the sensor to the object by detecting the amount of physical change in the object with an optical element and calculating the amount of change as a distance, or by using a camera. It may be an image sensor that calculates the area, center of gravity, length, position, etc. of the object by image processing the captured image and outputs data and judgment results, or reads barcodes and two-dimensional codes. It may be a code reader.
 図1は、本発明の一実施形態の光センサ1の内部構造を示す断面図である。図示した例では、光センサ1は、回帰反射型の光電センサとして構成され、投光部4、受光部5に加え、図示しない増幅部、制御部等を内蔵し、筐体2を貫通するケーブル10を介して外部電源や外部機器に接続されている。なお、光センサ1を透過型の光電センサとして構成し、投光部4と受光部5とを別々の筐体2にそれぞれ収容してもよい。増幅部を筐体2外に分離したアンプ分離型の光電センサとして構成してもよいし、電源部を筐体2内に内蔵した電源内蔵型の光電センサとして構成してもよい。 FIG. 1 is a cross-sectional view showing the internal structure of an optical sensor 1 according to one embodiment of the present invention. In the illustrated example, the optical sensor 1 is configured as a retroreflective photoelectric sensor, and in addition to the light projecting unit 4 and the light receiving unit 5, includes an amplifier unit, a control unit, etc. (not shown). 10, it is connected to an external power source and an external device. The optical sensor 1 may be configured as a transmissive photoelectric sensor, and the light projecting section 4 and the light receiving section 5 may be accommodated in separate housings 2, respectively. It may be configured as an amplifier-separated photoelectric sensor in which the amplifying section is separated outside the housing 2 , or may be configured as a power-source photoelectric sensor in which the power section is built in the housing 2 .
 前述した増幅部、制御部等は、筐体2に収容された回路基板3に実装されている。回路基板3は、光センサ1の稼働状態を知らせるインジケータの光源6を更に備えていてもよい。回路基板3に区画された実装領域7には、ケーブル10の基端がはんだ付けにより実装されている。ケーブル10の先端には、外部電源や外部機器のコネクタに接続可能なコネクタ8を設けてもよい。筐体2は、投光部4及び受光部5が設けられた窓部4W,5W除いて、例えば、ステンレスや亜鉛ダイカスト等の金属材料から形成されている。ただし、筐体2の材質は金属材料に限定されない。例えば、ポリブチレンテレフタレート樹脂やABS樹脂等の樹脂材料から筐体2を形成してもよい。窓部4W,5Wは、例えば、メタクリル樹脂やガラス等の透光性材料から形成されている。 The amplifier section, control section, etc. described above are mounted on the circuit board 3 housed in the housing 2 . The circuit board 3 may further comprise an indicator light source 6 for indicating the operating state of the optical sensor 1 . A base end of a cable 10 is mounted by soldering in a mounting area 7 defined by the circuit board 3 . A connector 8 that can be connected to an external power source or a connector of an external device may be provided at the tip of the cable 10 . The housing 2 is made of a metal material such as stainless steel or zinc die-cast, except for windows 4W and 5W in which the light projecting section 4 and the light receiving section 5 are provided. However, the material of the housing 2 is not limited to the metal material. For example, the housing 2 may be formed from a resin material such as polybutylene terephthalate resin or ABS resin. The windows 4W and 5W are made of, for example, a translucent material such as methacrylic resin or glass.
 図2は、図1に示された光センサ1を一部分解して貫通孔9側から見た斜視図である。図2に示すように、筐体2は、略直方体のカップ状に形成されたケース本体20と、ケース本体20の開口を覆う蓋体21と、を含んでいる。ケース本体20は、底壁22と、底壁22から起立して蓋体21に向かって延びる周壁23と、を含んでいる。筐体2において、底壁22は、蓋体21とは反対側に位置している。 FIG. 2 is a partially exploded perspective view of the optical sensor 1 shown in FIG. 1 as seen from the through hole 9 side. As shown in FIG. 2 , the housing 2 includes a case body 20 formed in a substantially rectangular parallelepiped cup shape, and a lid 21 that covers the opening of the case body 20 . The case body 20 includes a bottom wall 22 and a peripheral wall 23 rising from the bottom wall 22 and extending toward the lid 21 . In the housing 2 , the bottom wall 22 is located on the opposite side of the lid 21 .
 図示した例では、周壁23に円形の貫通孔9が形成されている。貫通孔9には、ケーブル10が挿通されている。ケーブル10は、複数の素線(11,12)と、複数の素線(11,12)を束ねる外皮13と、外皮13の端部において外皮13と内皮12とを一体成形するフランジ14と、を有している。素線(11,12)は、複数の導線からなる芯線11と、該芯線11を被覆する内皮12と、を有している。内皮12及び外皮13は、例えば塩化ビニル樹脂で形成されている。 In the illustrated example, a circular through hole 9 is formed in the peripheral wall 23 . A cable 10 is inserted through the through hole 9 . The cable 10 includes a plurality of strands (11, 12), an outer sheath 13 that bundles the plurality of strands (11, 12), a flange 14 that integrally forms the outer sheath 13 and the inner sheath 12 at the end of the sheath 13, have. The strands (11, 12) have a core wire 11 made up of a plurality of conducting wires and an inner skin 12 covering the core wire 11. - 特許庁The inner skin 12 and the outer skin 13 are made of vinyl chloride resin, for example.
 フランジ14は、例えばポリブチレンテレフタレート樹脂やABS樹脂等の樹脂材料から形成されている。フランジ14を透光性材料から形成してもよい。透光性材料は、透明であってもよいし、乳白色であってもよい。その場合、回路基板3等に実装された光源6(図1に示す)からの光が板金等で形成されたストッパ15に反射されてフランジ14に入射するように構成してもよい。フランジ14を透光性樹脂から形成する場合、光センサ1の稼働状態を表示するインジケータとしてフランジ14を使用できる。 The flange 14 is made of a resin material such as polybutylene terephthalate resin or ABS resin. Flange 14 may be formed from a translucent material. The translucent material may be transparent or milky white. In that case, the light from the light source 6 (shown in FIG. 1) mounted on the circuit board 3 or the like may be reflected by the stopper 15 formed of sheet metal or the like and incident on the flange 14 . When the flange 14 is made of translucent resin, the flange 14 can be used as an indicator for displaying the operating state of the optical sensor 1 .
 フランジ14は貫通孔9と略同一の断面を有する円筒状に形成されている。前述の貫通孔9は、円形以外の形状であってもよい。例えば、貫通孔9は略D字形であってもよいし、長円形であってもよい。その場合、フランジ14は、断面が略D字形(Dカット)や長円形の筒状になる。貫通孔9を円形以外の形状にすれば、貫通孔9に対してフランジ14が回転しないように構成できる。 The flange 14 is formed in a cylindrical shape having substantially the same cross section as the through hole 9 . The aforementioned through hole 9 may have a shape other than circular. For example, the through hole 9 may be substantially D-shaped or oval. In that case, the flange 14 has a substantially D-shaped (D-cut) or elliptical cross section. If the through hole 9 is formed in a shape other than circular, the flange 14 can be configured so as not to rotate with respect to the through hole 9 .
 図3は、図1に示されたケーブル10の根元を拡大して示す断面図である。図3に示すように、外皮13と内皮12とを一体成形するフランジ14は、貫通孔9を通過可能な寸法に形成されている。フランジ14は、筐体2よりも外側に突出する部位が他の部位よりも径が小さい縮径部19に形成されている。縮径部19と他の部位との段差により形成された段差面は、貫通孔9の端面と面一に形成されている。ケーブル10の根元において、光センサ1は、ストッパ15と、カバー17と、第1及び第2シール材16A,16Bと、を更に備えている。 FIG. 3 is a cross-sectional view showing an enlarged root of the cable 10 shown in FIG. As shown in FIG. 3 , the flange 14 integrally forming the outer skin 13 and the inner skin 12 is formed to have dimensions that allow it to pass through the through hole 9 . A portion of the flange 14 protruding outward from the housing 2 is formed into a reduced diameter portion 19 having a smaller diameter than other portions. A step surface formed by a step between the diameter-reduced portion 19 and other portions is flush with the end surface of the through hole 9 . At the root of the cable 10, the optical sensor 1 further comprises a stopper 15, a cover 17, and first and second sealing members 16A, 16B.
 ストッパ15は、貫通孔9に対するフランジ14の位置P0を規制する。フランジ14の外周面には、第1溝18が形成され、貫通孔9の内周面には、第1溝18に対応する位置に第2溝28が形成されている。ストッパ15は、例えば板金から略C字形に形成され(図2参照)、第1溝18と第2溝28とに跨って挿入されている。なお、ストッパ15の構成は、特に限定されず、他の構成であってもよい。 The stopper 15 regulates the position P0 of the flange 14 with respect to the through hole 9. A first groove 18 is formed on the outer peripheral surface of the flange 14 , and a second groove 28 is formed on the inner peripheral surface of the through hole 9 at a position corresponding to the first groove 18 . The stopper 15 is formed, for example, from sheet metal in a substantially C shape (see FIG. 2), and is inserted across the first groove 18 and the second groove 28 . Note that the configuration of the stopper 15 is not particularly limited, and other configurations may be used.
 カバー17は、筐体2と同様の材料から形成され、貫通孔9の内周面とフランジ14の外周面との境界部Bを覆っている。図2に示すように、カバー17は、中央に貫通孔が開いた略矩形の平板状であり、筐体2の外面2Bに締付けねじ17S等で固定されている。カバー17の貫通孔には、フランジ14の縮径部19が挿入される。 The cover 17 is made of the same material as the housing 2 and covers the boundary portion B between the inner peripheral surface of the through hole 9 and the outer peripheral surface of the flange 14 . As shown in FIG. 2, the cover 17 has a substantially rectangular flat plate shape with a through hole in the center, and is fixed to the outer surface 2B of the housing 2 with tightening screws 17S or the like. The reduced diameter portion 19 of the flange 14 is inserted into the through hole of the cover 17 .
 図3に示すように、第1シール材16Aは、筐体2の外面2Bとカバー17の内面との隙間G1を密閉している。第2シール材16Bは、フランジ14の外端面とカバー17の内面との隙間G2を密閉している。図示した例では、第1及び第2シール材16A,16Bが、第2のOリング16Bと、第2のOリング16Bを囲む(第2のOリング16Bに外接する)第1のOリング16Aとが一体成形されたツインリング16で構成されている。シール材は、図示した例に限定されず、他種のシール材であってもよい。例えば、分離可能な大小二つのOリングで隙間G1,G2を密閉してもよい。ツインリング16は、前述したフランジ14の段差面と貫通孔9の端面とに跨って配置されている。 As shown in FIG. 3, the first sealing material 16A seals the gap G1 between the outer surface 2B of the housing 2 and the inner surface of the cover 17. The second sealing member 16B seals the gap G2 between the outer end surface of the flange 14 and the inner surface of the cover 17. As shown in FIG. In the illustrated example, the first and second seals 16A, 16B are the second O-ring 16B and the first O-ring 16A surrounding (circumscribing the second O-ring 16B) the second O-ring 16B. It is composed of a twin ring 16 integrally formed with. The sealing material is not limited to the illustrated example, and may be other types of sealing material. For example, the gaps G1 and G2 may be sealed with two separable large and small O-rings. The twin ring 16 is arranged across the step surface of the flange 14 and the end surface of the through hole 9 .
 続いて、図4から図6を参照して光センサ1を製造する手順について説明する。図4は、図3に示されたストッパ15を取り外してケーブル10を所定の位置P0よりも奥の位置P1まで挿入した状態を示す断面図であり、図5は、図4中のV-V線に沿う断面図である。図4及び図5に示すように、ストッパ15を取り外した状態では、フランジ14は貫通孔9を通過可能に構成されている。 Next, a procedure for manufacturing the optical sensor 1 will be described with reference to FIGS. 4 to 6. FIG. FIG. 4 is a cross-sectional view showing a state in which the stopper 15 shown in FIG. 3 is removed and the cable 10 is inserted to a position P1 deeper than the predetermined position P0, and FIG. 1 is a cross-sectional view along a line; FIG. As shown in FIGS. 4 and 5, the flange 14 is configured to be able to pass through the through hole 9 when the stopper 15 is removed.
 そのため、ケーブル10の先端をはんだ付けしやすい位置P1まで回路基板3の実装領域7に近づけて組立て作業を行うことができる。はんだ付けによりケーブル10を回路基板3に実装した後から、光センサ1が完成した状態における所定の位置P0にフランジ14を配置してストッパ15をフランジ14に装着すれば、ケーブル10を筐体2に固定できる。 Therefore, the assembly work can be performed by bringing the tip of the cable 10 close to the mounting area 7 of the circuit board 3 to the position P1 where soldering is easy. After mounting the cable 10 on the circuit board 3 by soldering, the cable 10 can be attached to the housing 2 by placing the flange 14 at a predetermined position P0 in the completed state of the optical sensor 1 and attaching the stopper 15 to the flange 14. can be fixed to
 図6は、光センサ1を製造する手順の一例を示す図である。ケーブル10の内皮12と外皮13とが一体成形された状態のフランジ14を有するケーブル10を用意する。フランジ14の断面の寸法は、筐体2に形成された貫通孔9を通過できる寸法に合わせて形成されている(ステップS1)。 FIG. 6 is a diagram showing an example of the procedure for manufacturing the optical sensor 1. FIG. A cable 10 having a flange 14 in which an inner skin 12 and an outer skin 13 of the cable 10 are integrally formed is prepared. The dimensions of the cross section of the flange 14 are formed so as to pass through the through hole 9 formed in the housing 2 (step S1).
 次いで、貫通孔9に対して筐体2の外面2B側から完成時における所定の位置P0よりも奥の位置P1までフランジ14を挿入し、貫通孔9に挿通されたケーブル10の芯線11を筐体2外まで引き出した状態で回路基板3の実装領域7にケーブル10の芯線11をはんだ付けする(ステップS2)。芯線11を自由に動かすことができる状態ではんだ付けの作業ができるため、作業者の負担を軽減できる。ケーブル10の芯線11がはんだ付けされた状態の回路基板3を筐体2内に収容する(ステップS3)。 Next, the flange 14 is inserted into the through hole 9 from the outer surface 2B side of the housing 2 to a position P1 deeper than the predetermined position P0 at the time of completion, and the core wire 11 of the cable 10 inserted through the through hole 9 is inserted into the housing. The core wire 11 of the cable 10 is soldered to the mounting area 7 of the circuit board 3 in a state of being pulled out of the body 2 (step S2). Since the soldering work can be performed in a state in which the core wire 11 can be freely moved, the burden on the worker can be reduced. The circuit board 3 to which the core wire 11 of the cable 10 is soldered is housed in the housing 2 (step S3).
 そして、貫通孔9とフランジ14とを所定の位置P1に配置し、ストッパ15を取り付けて筐体2とケーブル10とを位置決めする(ステップS4)。ツインリング16を目視で位置を確認しながら筐体2の外面2Bに配置し、ツインリング16を押しつぶすようにカバー17を取り付けて貫通孔9とフランジ14との境界部Bを密閉する(ステップS5)。これにより、ケーブル10が筐体2に固定され、筐体2の内外が密閉される。 Then, the through hole 9 and the flange 14 are arranged at a predetermined position P1, and the stopper 15 is attached to position the housing 2 and the cable 10 (step S4). Place the twin ring 16 on the outer surface 2B of the housing 2 while visually confirming the position thereof, attach the cover 17 so as to press the twin ring 16, and seal the boundary portion B between the through hole 9 and the flange 14 (step S5). ). Thereby, the cable 10 is fixed to the housing 2, and the inside and outside of the housing 2 are sealed.
 以上のように構成された本実施形態の光センサ1によれば、完成時における所定の位置P0よりも奥までケーブル10を挿入した状態でケーブル10と回路基板3とをはんだ付けするため、作業者の負担を軽減できる。実装領域7の隣に素線11を折り畳んで収容するスペースが必要ないため、筐体2をコンパクトに構成できる。ストッパにより筐体とフランジが密着しており、さらにフランジにより内皮と外皮とが一体成形されて密着しており、貫通孔とフランジとの境界部を密閉する第1シール材、第2シール材及びカバーを備えているため、ケーブル根元の設計要件である耐引張性能、耐屈曲性能、封止性能等を十分に満たすことができる。板金等の廉価な部品でケーブル10の根元部分を構成できるため、光センサの製造コストを抑えることができる。 According to the optical sensor 1 of the present embodiment configured as described above, since the cable 10 and the circuit board 3 are soldered in a state where the cable 10 is inserted deeper than the predetermined position P0 at the time of completion, work is required. It can reduce the burden on people. Since there is no need for a space next to the mounting area 7 to accommodate the folded wires 11, the housing 2 can be made compact. The housing and the flange are in close contact with the stopper, the inner skin and the outer skin are integrally molded with the flange, and the first sealing material, the second sealing material, and the second sealing material for sealing the boundary between the through hole and the flange Since the cover is provided, it is possible to sufficiently satisfy the design requirements for the cable root, such as tensile resistance, bending resistance, sealing performance, and the like. Since the root portion of the cable 10 can be configured with inexpensive parts such as sheet metal, the manufacturing cost of the optical sensor can be suppressed.
 以上説明した実施形態は、本発明の理解を容易にするためのものであり、本発明を限定して解釈するためのものではない。実施形態が備える各要素並びにその配置、材料、条件、形状及びサイズ等は、例示したものに限定されるわけではなく適宜変更することができる。また、異なる実施形態で示した構成同士を部分的に置換し又は組み合わせることが可能である。 The embodiments described above are for facilitating understanding of the present invention, and are not intended to limit and interpret the present invention. Each element included in the embodiment and its arrangement, materials, conditions, shape, size, etc. are not limited to those illustrated and can be changed as appropriate. Also, it is possible to partially replace or combine the configurations shown in different embodiments.
 [付記1]
 貫通孔(9)が形成された筐体(2)と、
 芯線(11)を内皮(12)で被覆した複数の素線(11,12)、及び該複数の素線(11,12)を束ねる外皮(13)を有するケーブル(10)と、
 前記外皮(13)の端部において該外皮(13)と前記内皮(12)とを一体成形し、かつ前記貫通孔(9)を通過可能な寸法に形成されたフランジ(14)と、
 前記貫通孔(9)に対する前記フランジ(14)の位置(P0)を規制するストッパ(15)と、
 前記筐体(2)の外面(2B)に固定され、前記貫通孔(9)と前記フランジ(14)との境界部(B)を覆うカバー(17)と、
 前記筐体(2)の外面(2B)と前記カバー(17)との隙間(G1)を密閉する第1シール材(16A)と、
 前記フランジと前記カバーとの隙間(G2)を密閉する第2シール材(16B)と、を備えた、
光センサ(1)。
[Appendix 1]
A housing (2) in which a through hole (9) is formed;
A cable (10) having a plurality of strands (11, 12) in which a core wire (11) is covered with an inner sheath (12), and an outer sheath (13) bundling the plurality of strands (11, 12);
a flange (14) formed integrally with the outer skin (13) and the inner skin (12) at the end of the outer skin (13) and having a dimension that allows passage through the through hole (9);
a stopper (15) that regulates the position (P0) of the flange (14) with respect to the through hole (9);
a cover (17) fixed to the outer surface (2B) of the housing (2) and covering a boundary (B) between the through hole (9) and the flange (14);
a first sealing material (16A) for sealing a gap (G1) between the outer surface (2B) of the housing (2) and the cover (17);
A second sealing material (16B) that seals the gap (G2) between the flange and the cover,
Optical sensor (1).
 [付記2]
 内皮(12)と外皮(13)とが一体成形された状態のフランジ(14)であって筐体(2)に形成された貫通孔(9)を通過できる寸法の前記フランジ(14)を有するケーブル(10)を用意すること(S1)、
 前記貫通孔(9)に対して完成時の所定位置(P0)よりも奥(P1)まで前記フランジ(14)を挿入し、回路基板(3)に前記ケーブル(10)の芯線(11)をはんだ付けすること(S2)、
 前記筐体(2)内に前記回路基板(3)を収容すること(S3)、
 前記貫通孔(9)と前記フランジ(14)とを前記所定位置(P0)に配置し、ストッパ(15)を取り付けて位置決めすること(S4)、並びに、
 シール材(16A、16B)及びカバー(17)を取り付けて前記貫通孔(9)と前記フランジ(14)との境界部(B)を密閉すること(S5)、を含む、
光センサ(1)の製造方法。
[Appendix 2]
A flange (14) in which the inner skin (12) and the outer skin (13) are integrally molded, and has a dimension that allows the flange (14) to pass through a through hole (9) formed in the housing (2). preparing a cable (10) (S1);
The flange (14) is inserted into the through hole (9) to a depth (P1) beyond the predetermined position (P0) at the time of completion, and the core wire (11) of the cable (10) is attached to the circuit board (3). soldering (S2),
housing the circuit board (3) in the housing (2) (S3);
Arranging the through-hole (9) and the flange (14) at the predetermined position (P0) and attaching a stopper (15) for positioning (S4);
Attaching sealing materials (16A, 16B) and a cover (17) to seal the boundary (B) between the through hole (9) and the flange (14) (S5);
A method for manufacturing an optical sensor (1).
 1…光センサ、2…筐体、2A…内面、2B…外面、3…回路基板、4…投光部、5…受光部、4W,5W…窓部、6…光源、7…実装領域、8…コネクタ、9…貫通孔、10…ケーブル、11…芯線、12…内皮、13…外皮、14…フランジ、15…ストッパ、16…ツインリング、16A…第1シール材、16B…第2シール材、17…カバー、17S…締付けねじ、18…第1溝、19…縮径部、20…ケース本体、21…蓋体、22…底壁、23…周壁、28…第2溝、B…境界部、G1,G2…隙間、P0,P1…位置、S1~S5…光センサの製造方法。 DESCRIPTION OF SYMBOLS 1... Optical sensor, 2... Housing, 2A... Inner surface, 2B... Outer surface, 3... Circuit board, 4... Light projecting part, 5... Light receiving part, 4W, 5W... Window part, 6... Light source, 7... Mounting area, 8 Connector 9 Through hole 10 Cable 11 Core wire 12 Inner skin 13 Outer skin 14 Flange 15 Stopper 16 Twin ring 16A First seal 16B Second seal Material 17 Cover 17S Clamping screw 18 First groove 19 Reduced diameter portion 20 Case body 21 Lid 22 Bottom wall 23 Peripheral wall 28 Second groove B Boundaries, G1, G2, Gap, P0, P1, Position, S1 to S5, Optical sensor manufacturing method.

Claims (5)

  1.  貫通孔が形成された筐体と、
     芯線を内皮で被覆した複数の素線、及び該複数の素線を束ねる外皮を有するケーブルと、
     前記外皮の端部において該外皮と前記内皮とを一体成形し、かつ前記貫通孔を通過可能な寸法に形成されたフランジと、
     前記貫通孔に対する前記フランジの位置を規制するストッパと、
     前記筐体の外面に固定され、前記貫通孔と前記フランジとの境界部を覆うカバーと、
     前記筐体の外面と前記カバーとの隙間を密閉する第1シール材と、
     前記フランジと前記カバーとの隙間を密閉する第2シール材と、を備えた、
    光センサ。
    a housing in which a through hole is formed;
    A cable having a plurality of strands in which a core wire is covered with an inner skin and an outer sheath that bundles the plurality of strands;
    a flange that integrally molds the outer skin and the inner skin at the end of the outer skin and is formed to have dimensions that allow passage through the through hole;
    a stopper that regulates the position of the flange with respect to the through hole;
    a cover fixed to the outer surface of the housing and covering a boundary between the through hole and the flange;
    a first sealing material that seals a gap between the outer surface of the housing and the cover;
    a second sealing material that seals a gap between the flange and the cover,
    light sensor.
  2.  光を発する光源を更に備え、
     前記フランジは透光性樹脂から形成され、
     前記光源からの光が前記ストッパに反射されて前記フランジに入射するように構成されている、
    請求項1に記載の光センサ。
    further comprising a light source for emitting light,
    The flange is made of translucent resin,
    configured such that light from the light source is reflected by the stopper and enters the flange;
    The optical sensor of claim 1.
  3.  第2のOリングと、該第2のOリングを囲む第1のOリングとが一体成形されたツインリングを備え、
     前記第1シール材が前記第1のOリングであり、前記第2シール材が前記第2のOリングである、
    請求項1又は2に記載の光センサ。
    A twin ring in which a second O-ring and a first O-ring surrounding the second O-ring are integrally formed,
    The first sealing material is the first O-ring, and the second sealing material is the second O-ring,
    3. The optical sensor according to claim 1 or 2.
  4.  前記フランジの外周面には、第1溝が形成され、前記貫通孔内には、前記第1溝に対応する位置に第2溝が形成され、
     前記ストッパは、前記第1溝と前記第2溝とに跨って挿入された板金である、
    請求項1から3のいずれか一項に記載の光センサ。
    A first groove is formed on the outer peripheral surface of the flange, and a second groove is formed in the through hole at a position corresponding to the first groove,
    The stopper is a sheet metal inserted across the first groove and the second groove,
    4. The optical sensor according to any one of claims 1-3.
  5.  内皮と外皮とが一体成形された状態のフランジであって筐体に形成された貫通孔を通過できる寸法の前記フランジを有するケーブルを用意すること、
     前記貫通孔に対して完成時における所定の位置よりも奥まで前記フランジを挿入し、回路基板に前記ケーブルの芯線をはんだ付けすること、
     前記筐体内に前記回路基板を収容すること、
     前記貫通孔と前記フランジとを前記所定の位置に配置し、ストッパを取り付けて位置決めすること、並びに、
     シール材及びカバーを取り付けて前記貫通孔と前記フランジとの境界部を密閉すること、を含む、
    光センサの製造方法。
    Preparing a cable having a flange in which an inner skin and an outer skin are integrally molded and having a dimension that allows the flange to pass through a through hole formed in a housing;
    inserting the flange deeper into the through hole than a predetermined position at the time of completion, and soldering the core wire of the cable to the circuit board;
    housing the circuit board within the housing;
    arranging the through-hole and the flange at the predetermined position and attaching a stopper for positioning;
    installing a sealant and cover to seal the interface between the through hole and the flange;
    A method for manufacturing an optical sensor.
PCT/JP2021/047172 2021-03-11 2021-12-21 Optical sensor WO2022190551A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0498221U (en) * 1991-01-23 1992-08-25
JPH0565038U (en) * 1992-02-06 1993-08-27 エナジーサポート株式会社 Cover mounting structure for switch in case
JP2000195394A (en) * 1998-12-28 2000-07-14 Nabco Ltd Photoelectric switch for automatic door
JP2013041739A (en) * 2011-08-15 2013-02-28 Azbil Corp Cable extraction structure and photoelectric sensor
JP2017157486A (en) * 2016-03-03 2017-09-07 オムロン株式会社 Sensor device, and manufacturing method of the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0498221U (en) * 1991-01-23 1992-08-25
JPH0565038U (en) * 1992-02-06 1993-08-27 エナジーサポート株式会社 Cover mounting structure for switch in case
JP2000195394A (en) * 1998-12-28 2000-07-14 Nabco Ltd Photoelectric switch for automatic door
JP2013041739A (en) * 2011-08-15 2013-02-28 Azbil Corp Cable extraction structure and photoelectric sensor
JP2017157486A (en) * 2016-03-03 2017-09-07 オムロン株式会社 Sensor device, and manufacturing method of the same

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