WO2022188795A1 - 摄像头模组和电子设备 - Google Patents

摄像头模组和电子设备 Download PDF

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Publication number
WO2022188795A1
WO2022188795A1 PCT/CN2022/079882 CN2022079882W WO2022188795A1 WO 2022188795 A1 WO2022188795 A1 WO 2022188795A1 CN 2022079882 W CN2022079882 W CN 2022079882W WO 2022188795 A1 WO2022188795 A1 WO 2022188795A1
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WIPO (PCT)
Prior art keywords
light
camera module
photosensitive unit
image sensor
filter
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Application number
PCT/CN2022/079882
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English (en)
French (fr)
Inventor
段俊杰
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2022188795A1 publication Critical patent/WO2022188795A1/zh
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
    • H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/67—Focus control based on electronic image sensor signals
    • H04N23/671—Focus control based on electronic image sensor signals in combination with active ranging signals, e.g. using light or sound signals emitted toward objects
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors

Definitions

  • the application belongs to the technical field of electronic equipment, and specifically relates to a camera module and an electronic equipment.
  • the present application aims to provide a camera module and an electronic device to at least solve the problem of focus offset.
  • an embodiment of the present application proposes a camera module, including: an image sensor, the image sensor includes a substrate, and a plurality of visible light photosensitive units and a plurality of infrared photosensitive units uniformly disposed on the substrate; The structure is covered on the image sensor, and the light is received by the image sensor through the first light-transmitting structure; the laser transmitter is arranged on one side of the image sensor, the laser transmitter is used to emit light outward, and the infrared photosensitive unit is used to receive the light passing through obstacles. The reflected light and the focusing distance are determined based on the light.
  • the camera module provided according to the embodiment of the present application includes an image sensor, a first light-transmitting structure, and a laser transmitter, wherein a visible light photosensitive unit and an infrared photosensitive unit are simultaneously integrated in the image sensor, on the one hand, it can effectively solve the problem of the prior art On the other hand, it can improve the coincidence degree of the field of view angle of the laser focus sensor and the visible light photosensitive unit in the image sensor, thereby improving the accuracy of the focus point, which is more convenient for users to use the camera model. Focusing requirements when shooting in groups.
  • the image sensor includes a substrate.
  • the focusing function can be integrated on the basis that the image sensor itself receives external light to realize imaging.
  • the uniform setting of the photosensitive units can also improve the uniformity of imaging and focusing.
  • the calculation circuit corresponding to the infrared photosensitive unit can be used to achieve fast focusing through accurate ranging.
  • the first light-transmitting structure at one end of the image sensor, and arranging the laser emitter at one side of the image sensor, the light from the external environment will enter the image sensor through the first light-transmitting structure, and be uniformly arranged on the substrate.
  • the visible light photosensitive unit of the cloth receives it to achieve a relatively complete imaging.
  • the first light-transmitting structure covers the image sensor. Specifically, the first light-transmitting structure is arranged at one end of the image sensor. On the other hand, the first light-transmitting structure can also protect the image sensor and play a shielding role. Further, a laser transmitter that can emit light is provided on one side of the image sensor. When the light emitted by the laser transmitter hits an obstacle, it will be reflected back to the first light-transmitting structure by the obstacle, and then pass through. It is received by the infrared photosensitive unit through the first light-transmitting structure, so as to realize the integrity of the focusing optical path.
  • first light-transmitting structure and the laser emitter are not arranged in the same orientation of the image sensor, wherein the first light-transmitting structure is arranged at the end, and the laser emitter is arranged at the side, which is more convenient for the laser emitter to emit
  • the side-by-side light rays can enter the visible light photosensitive unit through the first light-transmitting structure at the end after being reflected by the obstacle.
  • the laser transmitter when starting to focus, the laser transmitter will emit light in a specific frequency band, including but not limited to infrared laser beams, and the timing will start at this time, and the infrared photosensitive unit will receive the reflection from the photographed object or obstacle.
  • stop timing and by calculating the speed of light and time, the distance between the camera module and the obstacle can be obtained.
  • the distance can be sent to the focus controller in the camera module to control the focus motor. Run to the focal plane to achieve focus.
  • the visible light photosensitive unit is a complementary metal oxide semiconductor, that is, CMOS (Complementary Metal Oxide Semiconductor), and the infrared photosensitive unit is a single-photon avalanche diode, that is, SPAD (Single Photon Avalanche Diode).
  • CMOS Complementary Metal Oxide Semiconductor
  • SPAD Single Photon Avalanche Diode
  • an embodiment of the present application proposes an electronic device, comprising: a body; the camera module according to any one of the above-mentioned embodiments, which is arranged on the body, wherein the camera module is a front camera module of the electronic device and/or rear camera module.
  • the electronic device provided according to the embodiment of the present application includes a main body and the camera module of any of the above-mentioned embodiments.
  • the image formed by the camera module can be sent to the main body, so as to facilitate subsequent The secondary editing and sharing of the electronic device, in which the camera module can be a front module or a rear module, so that the front camera of the electronic device has the anti-shake function, or the rear camera has the anti-shake function, or
  • both the front and rear dual cameras have the anti-shake function of any of the above embodiments.
  • the electronic device includes the camera module of any of the above embodiments, it has the beneficial effects of the camera module of any of the above-mentioned embodiments, which will not be repeated here.
  • FIG. 1 is a schematic structural diagram of a camera and a focus sensor in the prior art
  • Fig. 2 is the structural representation of the angle of view in the prior art
  • FIG. 3 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a camera module according to an embodiment of the present application.
  • FIG. 10 is a spectral response diagram of a first filter and a second filter according to an embodiment of the present application
  • FIG. 11 is a schematic structural diagram of an electronic device according to an embodiment of the present application.
  • 100 camera module; 102: image sensor; 1022: substrate; 1024: infrared photosensitive unit; 104: visible light photosensitive unit; 1042: first imaging unit; 1044: second imaging unit; 1046: third imaging unit; 106 : filter structure; 1062: light barrier bracket; 1064: first filter element; 1066: second filter element; 108: first light-transmitting structure; 110: laser emitter; 112: second light-transmitting structure; 200 : electronic equipment; 210: body.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements.
  • the present application provides an embodiment of a camera module 100 , including: an image sensor 102 .
  • the image sensor 102 includes a substrate 1022 and a plurality of visible light photosensitive units 104 and infrared light sensitive units uniformly disposed on the substrate 1022
  • the photosensitive unit 1024; the first light-transmitting structure 108 is covered on the image sensor 102, and the light is received by the image sensor 102 through the first light-transmitting structure 108;
  • the laser transmitter 110 is arranged on one side of the image sensor 102, and the laser transmitter 110 It is used to emit light outward, and the infrared photosensitive unit 1024 is used to receive the light reflected by the obstacle and determine the focusing distance according to the light.
  • the camera module 100 provided according to the embodiment of the present application includes an image sensor 102 , a first light-transmitting structure 108 and a laser emitter 110 , wherein the visible light photosensitive unit 104 and the infrared photosensitive unit 1024 are simultaneously integrated in the image sensor 102 .
  • it can effectively solve the extra space required for arranging the laser focus sensor in the prior art, and on the other hand, it can also improve the degree of coincidence of the field angles of the laser focus sensor and the visible light photosensitive unit 104 in the image sensor 102, thereby improving the accuracy of the focus point. It is more favorable for the user's focusing requirements when using the camera module 100 for shooting.
  • the infrared photosensitive unit 1024 is integrated into the image sensor 102, on the one hand, the focus point and the imaging point can be macroscopically overlapped, which solves the problem of focus point shift in the traditional solution, and on the other hand In terms of high integration and space saving, it adopts point-to-point array laser focusing, which is fast and accurate.
  • the image sensor 102 includes a substrate 1022.
  • the image sensor 102 can integrate the focusing function on the basis that the image sensor 102 itself receives external light to realize imaging. Since the infrared photosensitive unit 1024 and the visible light photosensitive unit 104 are evenly arranged, the uniformity of imaging and focusing can also be improved.
  • the calculation circuit corresponding to the infrared photosensitive unit 1024 can be used to achieve fast focusing through accurate ranging.
  • the first light-transmitting structure 108 is disposed at one end of the image sensor 102.
  • the first light-transmitting structure 108 has a certain light transmittance, which can meet the light input requirement of the image sensor 102 to receive light entering from the end.
  • the first light-transmitting structure 108 can also protect the image sensor 102 and play a shielding role.
  • a laser transmitter 110 capable of emitting light is disposed on one side of the image sensor 102.
  • the light emitted by the laser transmitter 110 reaches an obstacle, it will be reflected back to the first light-transmitting structure by the obstacle. 108, and then pass through the first light-transmitting structure 108 to be received by the infrared photosensitive unit 1024, so as to realize the integrity of the focusing optical path.
  • the first light-transmitting structure 108 and the laser emitter 110 are not arranged in the same orientation of the image sensor 102 , wherein the first light-transmitting structure 108 is arranged at the end, the laser emitter 110 is arranged at the side, and more It is convenient for the laser emitters 110 to emit side-by-side light rays, and after being reflected by obstacles, they can enter the visible light photosensitive unit 104 through the first light-transmitting structure 108 at the end.
  • the laser transmitter 110 when starting to focus, the laser transmitter 110 will emit light in a specific frequency band, including but not limited to an infrared laser beam, at this time, the timing is started, and the photographed object or obstacle is received through the infrared photosensitive unit 1024 The reflected light stops timing at this time. By calculating the speed of light and time, the distance between the camera module 100 and the obstacle can be obtained. At this time, the distance can be sent to the focus controller in the camera module 100. To control the focus motor to run to the focal plane to achieve focus.
  • a specific frequency band including but not limited to an infrared laser beam
  • the visible light photosensitive unit 104 is a complementary metal oxide semiconductor, that is, a CMOS (Complementary Metal Oxide Semiconductor), and the infrared photosensitive unit 1024 is a single-photon avalanche diode, that is, a SPAD (Single Photon Avalanche Diode).
  • CMOS Complementary Metal Oxide Semiconductor
  • SPAD Single Photon Avalanche Diode
  • the infrared photosensitive unit 1024 uses SPAD, which is a single-photon avalanche diode made based on CMOS technology, compared with the CMOS visible light photosensitive unit 104, the SPAD avalanche diode can generate an avalanche phenomenon (photocurrent) under the irradiation of a single photon.
  • the SPAD can receive weak laser light, and the SPAD readout circuit will calculate the time it takes for the laser light to be transmitted from the time it is sent out, to recover the transmitted time, so as to accurately measure the distance and achieve fast focusing.
  • the visible light photosensitive unit and the infrared photosensitive unit are arranged in an array; or the visible light photosensitive unit is arranged around the infrared photosensitive unit.
  • the visible light photosensitive unit and the infrared photosensitive unit can be set in an array or in a surround setting according to the actual design requirements. It can be understood that the light received by the visible light photosensitive unit can be of different types, and it can include a variety of sub photosensitive units, so a plurality of sub photosensitive units and infrared photosensitive units can be arranged in an array, or a plurality of sub photosensitive units can be arranged around the infrared photosensitive unit. Arrangement, if a plurality of sub-photosensitive units are used as a whole, the visible light photosensitive unit array can be arranged on the infrared photosensitive unit, or a plurality of visible light photosensitive units can be wound around the infrared photosensitive unit as a whole.
  • each infrared photosensitive unit 1024 is disposed corresponding to at least one visible light photosensitive unit 104 . It may be that each infrared photosensitive unit 1024 is arranged in a matrix with the first imaging unit, the second imaging unit and the third imaging unit in one visible light photosensitive unit 104 .
  • Each infrared photosensitive unit 1024 can be set corresponding to one visible light photosensitive unit 104 or a plurality of visible light photosensitive units 104 according to requirements.
  • the visible light photosensitive unit 104 and the infrared photosensitive unit 1024 are uniformly arranged and exist in the form of an array.
  • the visible light photosensitive unit 104 and the focusing unit D are arranged in an equal ratio of 1:1.
  • the focusing function does not require as high a number of photosensitive points as the number of focusing points, so another adjustment arrangement can also be provided.
  • the photosensitive units 1024 and the visible light photosensitive units 104 are evenly arranged in a certain ratio, such as 1:2. Alternatively, in another specific embodiment, they are arranged in a ratio of 1:4, 1:8, etc., so as to ensure accurate focusing At the same time, without sacrificing photosensitivity.
  • the visible light photosensitive unit 104 specifically includes: a first imaging unit 1042 , a second imaging unit 1044 and a third imaging unit 1046 , wherein the first imaging unit 1042 , the second imaging unit 1044 and the third imaging unit 1046 The imaging colors of the imaging unit 1046 are different.
  • the visible light photosensitive unit 104 includes three imaging units, specifically a first imaging unit 1042, a second imaging unit 1044 and a third imaging unit 1046 with different imaging colors.
  • the imaging colors of the three imaging units are optical three primary colors: red, For green and blue, by setting different visible light photosensitive units 104 , different degrees of light reception can be improved, which is more convenient for imaging.
  • the arrangement of the three imaging units can be adjusted according to specific usage requirements and imaging requirements, such as diamond arrangement, RGB-Delta arrangement, or even matrix arrangement.
  • the visible light photosensitive units 104 are arranged in an array, and the first imaging unit 1042, the second imaging unit 1044 and the third imaging unit 1046 in each visible light photosensitive unit 104 are RGB (red green blue) unit.
  • a blank area is provided between the two third imaging units 1046 .
  • the camera module 100 further includes: a filter structure 106 disposed between the visible light photosensitive unit 104 and the first light-transmitting structure 108 , and the filter structure 106 is used for filtering the light entering the image sensor 102 .
  • the filter structure 106 By arranging the filter structure 106 between the visible light photosensitive unit 104 and the first light-transmitting structure 108, the light entering the image sensor 102 can be filtered. On the other hand, by filtering light, the visible light photosensitive unit 104 can obtain specific light, which is more convenient for imaging.
  • the light entering the image sensor 102 includes the light reflected back by the obstacle and the external ambient light used for shooting.
  • the light filtering structure 106 specifically includes: a light shielding bracket 1062, and the light shielding bracket 1062 includes a plurality of accommodating cavities formed in the light shielding bracket 1062, and each accommodating cavity is provided with a visible light photosensitive unit 104 or an infrared photosensitive unit 1024;
  • the first filter element 1064 is disposed on the side of the light-shielding bracket 1062 close to the first light-transmitting structure 108.
  • the first filter element 1064 is used for filtering infrared light, wherein the first filter element 1064 is connected to the infrared photosensitive unit 1024.
  • the corresponding position is hollowed out; the second filter 1066 is arranged between the first filter 1064 and the first light-transmitting structure 108, and the second filter 1066 is arranged in a one-to-one correspondence with the accommodating cavity to filter the incident light. Light in the chamber.
  • the filter structure 106 includes a light-shielding support 1062, a first filter 1064 and a second filter 1066, wherein the light-shielding support 1062 includes a plurality of accommodating cavities, and each visible light photosensitive unit 104 is correspondingly disposed in one accommodating cavity, That is to say, through the arrangement of multiple accommodating cavities, the mutual influence of two adjacent visible light photosensitive units 104 can be reduced, so as to ensure the stability of imaging.
  • the first filter element 1064 is disposed on the side of the light-shielding bracket 1062 close to the first light-transmitting structure 108 , that is, when the light enters from the outside to the inside, it will pass through the first light-transmitting structure 108 and the first filter element 1064 in sequence.
  • the first filter element 1064 can filter the light after the light passes through the first light-transmitting structure 108. Further, the first filter element 1064 filters infrared light to ensure visible light. Normal photosensitive imaging of the photosensitive unit 104 .
  • the second filter 1066 is arranged on the side of the first filter 1064 away from the first light-transmitting structure 108, so as to improve the pertinence of the received light of the visible light photosensitive unit 104 arranged in the accommodating cavity, that is, according to the second
  • the light that the visible light photosensitive unit 104 can receive will also be different depending on the filtering degree of the light filter 1066 , which is more conducive to the imaging of different imaging units in each visible light photosensitive unit 104 .
  • the position of the first filter 1064 opposite to the infrared photosensitive unit 1024 needs to be hollowed out to ensure that the infrared photosensitive unit 1024 can receive light normally.
  • the light is generally infrared
  • the first filter 1064 The main function of the filter is to filter out infrared rays, so the first filter element 1064 is hollowed out to ensure that the infrared photosensitive unit 1024 can completely receive infrared rays, so as to facilitate the process of ranging and focusing.
  • the second filter element 1066 is disposed at the end of the light-shielding bracket 1062 away from the first light-transmitting structure 108, that is, the second filter element 1066 and the first filter element 1064 are respectively It is arranged at both ends of the light-shielding bracket 1062.
  • each second optical filter 1066 is arranged correspondingly to an accommodating cavity, so as to filter different light entering the accommodating cavity, so as to realize the filtering of the light entering the accommodating cavity. Normal imaging of the visible light photosensitive unit 104 .
  • the spectral response diagrams of the first filter element 1064 and the second filter element 1066 are shown in FIG. 10 , corresponding to four second filter elements 1066 and one first filter element 1064 respectively, wherein the first filter element
  • the component 1064 is used to filter out the infrared light in the CMOS visible light photosensitive unit 104 as a whole, but it is hollowed out above the SPAD focusing single light, that is to say, it only filters out the infrared light of the CMOS visible light photosensitive unit 104 and retains the SPAD infrared light sensitivity Infrared light of cell 1024.
  • a visible light photosensitive unit is arranged in the accommodating cavity, and the filtering wavelength of the second filter element arranged on the accommodating cavity corresponds to the visible light photosensitive unit in the accommodating cavity;
  • the filter wavelength of the second filter element is arranged corresponding to the infrared photosensitive unit in the accommodating cavity.
  • a visible light photosensitive unit that is, a first imaging unit, a second imaging unit or a third imaging unit
  • a second filter element with different filter effects can be arranged according to different imaging units.
  • the imaging unit, the second imaging unit and the third imaging unit are respectively the imaging of RGB three primary colors, then the first imaging unit can filter the light of other wavelengths except red, and the second imaging unit can filter the light of other wavelengths except green,
  • the third imaging unit may filter light of wavelengths other than blue.
  • the second filter only needs to retain the transmitted infrared light, and filter and reject the light of other frequency bands.
  • the camera module 100 further includes: a second light-transmitting structure 112 sleeved outside the first light-transmitting structure, and the second light-transmitting structure 112 covers the laser emitter 110 .
  • a second light-transmitting structure 112 can also be provided.
  • the second light-transmitting structure 112 By arranging the second light-transmitting structure 112 on the laser emitter 110 and covering the laser emitter 110, the light emitted by the laser emitter 110 will pass through the laser emitter 110.
  • the second light-transmitting structure 112 is directed to the obstacle, and the light reflected by the obstacle needs to enter the image sensor 102 through the first light-transmitting structure to realize ranging focusing and imaging.
  • the second light-transmitting structure can be made 112 is used as a supplementary light path to provide light support for imaging.
  • the second light-transmitting structure 112 is eliminated, which is more convenient for the appearance design and structural layout when applied to a product.
  • the first light-transmitting structure 108 covers the image sensor 102 , and the laser emitter 110 is disposed outside the first light-transmitting structure 108 .
  • the image sensor 102 By covering the image sensor 102 with the first light-transmitting structure 108 in the light entering direction of the camera module 100 , all the light entering the image sensor 102 needs to pass through the first light-transmitting structure 108 first. Disposing the laser emitter 110 outside the first transparent structure 108 can reduce the influence of the position of the laser emitter 110 on the light entering the first transparent structure 108 . Certainly, for the laser transmitter 110, the above-mentioned position setting can also reduce the influence of the first light-transmitting structure 108 on the penetrability of the light emitted by the laser transmitter 110, and improve the imaging and focusing quality.
  • the number of the laser transmitters 110 is one, which is provided on the peripheral side of the image sensor 102 .
  • the number of laser emitters 110 is multiple, and the multiple laser emitters 110 are evenly distributed on the peripheral side of the image sensor 102 .
  • a plurality of laser transmitters 110 can be provided according to requirements. By arranging the plurality of laser transmitters 110 evenly around the central axis of the image sensor 102, that is, the plurality of laser transmitters 110 are evenly distributed on the peripheral side of the image sensor 102, the To greatly improve the accuracy of focusing, the laser emitters 110 are arranged in a circle around the visible light photosensitive unit 104 . In fact, in order to meet the minimum requirements for focusing, the number of laser transmitters 110 is one, and the system can work normally when placed on any side of the visible light photosensitive unit 104. However, by setting multiple laser transmitters 110 above, it will be more It is conducive to accurate focusing, that is, it is easier to achieve fast focusing.
  • the number of image sensors 102 is multiple, the number of laser transmitters 110 is one, and the infrared photosensitive unit 1024 in each image sensor 102 can receive light.
  • one laser transmitter 110 can be used to realize the imaging of multiple image sensors 102 , in other words, two or even more such cameras are placed side by side, sharing the middle laser transmitter 110 , and multiple cameras can be formed.
  • the camera matrix capable of laser focusing can reduce the number of laser transmitters 110 , and reduce unnecessary equipment costs and location space.
  • an electronic device 200 which includes: a body 210 ; the camera module 100 in any of the above embodiments is disposed on the body 210 , wherein the camera module 100 It is the front camera module and/or the rear camera module of the electronic device 200 .
  • the electronic device 200 provided according to the embodiment of the present application includes the main body 210 and the camera module 100 of any of the above embodiments.
  • the camera module 100 By disposing the camera module 100 on the main body 210, the image formed by the camera module 100 can be sent to on the main body 210 to facilitate subsequent secondary editing and sharing, wherein the camera module 100 may be a front module or a rear module, so that the front camera of the electronic device 200 has an anti-shake function, or The rear camera has an anti-shake function, and optionally, both the front and rear dual cameras have the anti-shake function of any of the above embodiments.
  • the electronic device 200 includes the camera module 100 of any one of the above embodiments, it has the beneficial effects of the camera module 100 of any one of the above embodiments, which will not be repeated here.
  • the types of the electronic device 200 are various, for example, the electronic device may be a mobile phone, a tablet computer, a notebook computer, a palmtop computer, a vehicle-mounted electronic device, a Mobile Internet Device (MID), an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) devices, robots, wearable devices, ultra-mobile personal computer (UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc. , it can also be a server, a network attached storage (NAS), a personal computer (PC), a television (television, TV), a teller machine or a self-service machine and other equipment that requires a camera module.
  • NAS network attached storage
  • PC personal computer
  • TV television
  • teller machine teller machine
  • self-service machine self-service machine and other equipment that requires a camera module.
  • the visible light photosensitive unit and the infrared photosensitive unit are simultaneously integrated in the image sensor.
  • the additional space required for setting the laser focus sensor in the prior art can be effectively solved, and on the other hand It can also improve the degree of coincidence of the field of view of the visible light photosensitive unit in the laser focus sensor and the image sensor, thereby improving the accuracy of the focus point, and is more conducive to the user's focus requirements when using the camera module for shooting.

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Abstract

本申请公开了一种摄像头模组和电子设备，其中，摄像头模组包括：图像传感器，图像传感器包括衬底以及均匀设置于衬底上的多个可见光感光单元和多个红外感光单元；第一透光结构，覆盖于图像传感器上；激光发射器，设于图像传感器的一侧，激光发射器用于向外发射光线，红外感光单元用于接收经障碍物反射后的光线并根据光线确定对焦距离。

Description

摄像头模组和电子设备
相关申请的交叉引用
本申请要求于2021年03月11日提交的申请号为202110264532.6，发明名称为“摄像头模组和电子设备”的中国专利申请的优先权，其通过引用方式全部并入本申请。
技术领域
本申请属于电子设备技术领域，具体涉及一种摄像头模组和一种电子设备。
背景技术
随着手机的摄影功能的不断发展，摄像头的数量也随之变多，由于每个摄像头均带有自动对焦功能，随之带来的是单独设置一个对焦传感器102’，以通过对焦传感器102’测量被拍物体的距离，然而，对焦传感器102’是单独设置的，如图1所示，会由于其与摄像头并排设置，会占用有限的手机空间，同时其光轴与摄像头并不一致，无法精确计算对焦点，在一些特殊的角度下，如图2所示，会存在两个不重合区域，在不重合区域内无法使用对焦传感器102’辅助摄像头对焦，极大的影响用户的使用体验。
发明内容
本申请旨在提供一种摄像头模组和一种电子设备，至少解决对焦偏移的问题。
为了解决上述技术问题，本申请是这样实现的：
第一方面，本申请实施例提出了一种摄像头模组，包括：图像传感器，图像传感器包括衬底以及均匀设置于衬底上的多个可见光感光单元和多个红外感光单元；第一透光结构，覆盖于图像传感器上，光线经过第一透光结构被图像传感器接收；激光发射器，设于图像传感器的一侧，激光发射器用于向外发射光线，红外感光单元用于接收经障碍物反射后的光线并根据光线确定对焦距离。
根据本申请实施例提供的摄像头模组，包括图像传感器、第一透光结构 和激光发射器，其中，在图像传感器内同时集成了可见光感光单元和红外感光单元，一方面可有效解决现有技术中设置激光对焦传感器所需要的额外空间，另一方面还可提高激光对焦传感器和图像传感器中可见光感光单元的视场角的重合程度，从而提高对焦点的精准度，更利于用户在使用摄像头模组进行拍摄时的对焦需求。
具体地，图像传感器包括衬底，通过将可见光感光单元和红外感光单元均匀地设置在衬底上，可在图像传感器自身接收外部光线实现成像地基础上，集成对焦功能，由于红外感光单元和可见光感光单元均匀设置，还可提高成像和对焦的均匀程度，而在对焦时，可通过红外感光单元对应的计算电路的计算，进而通过精确测距实现快速对焦。此外，通过在图像传感器的一端设置第一透光结构，并在图像传感器的一侧设置激光发射器，外部环境的光线会通过第一透光结构向图像传感器射入，被衬底上均匀排布的可见光感光单元接收，实现较为完整的成像。进一步地，第一透光结构覆盖于图像传感器上，具体地，第一透光结构设置在图像传感器的一端，一方面第一透光结构具有一定的透光性，可满足图像传感器接收从端部向内进光的进光需求，另一方面，第一透光结构还可对图像传感器实现保护，起到遮蔽的作用。进一步地，在图像传感器的一侧设置有可向外发射光线的激光发射器，激光发射器向外发射的光线在射至障碍物时，会被障碍物反射回第一透光结构，进而穿过第一透光结构被红外感光单元接收，实现对焦光路的完整。
需要说明的，第一透光结构和激光发射器并非设置在图像传感器的同一方位，其中，第一透光结构设置在端部，激光发射器则是设置在侧部，更便于激光发射器发射并排的光线，在经障碍物反射后可通过端部的第一透光结构射入可见光感光单元处。
本领域技术人员可以理解，在开始对焦时，激光发射器会发出特定频段的光线，包括但不限于红外激光束，此时开始计时，通过红外感光单元接收到经拍摄物体或是障碍物反射回来的光线，此时停止计时，通过对光速和时间的计算，即可得到摄像头模组与障碍物之间的距离，此时可将距离发送给摄像头模组中的对焦控制器，以控制对焦马达运转到焦平面以实现对焦。
进一步地，可见光感光单元为互补金属氧化物半导体，也即CMOS(Complementary Metal Oxide Semiconductor)，红外感光单元为单光子雪崩二 极管，也即SPAD(Single Photon Avalanche Diode)。
第二方面，本申请实施例提出了一种电子设备，包括：本体；上述实施例中任一项的摄像头模组，设于本体上，其中，摄像头模组为电子设备的前置摄像模组和/或后置摄像模组。
根据本申请实施例提供的电子设备，包括本体和上述任一实施例的摄像头模组，通过将摄像头模组设置在本体上，可将摄像头模组所成的像发送至本体上，以便于后续的二次编辑和分享，其中，摄像头模组可以为前置模组，还可以为后置模组，从而使得电子设备的前摄像头具有防抖功能，或是后摄像头具有防抖功能，还可以地，前后双摄像头均具有上述任一实施例的防抖功能。
由于电子设备包括上述任一实施例的摄像头模组，故而具有上述任一实施例的摄像头模组的有益效果，在此不在赘述。
值得说明的是，电子设备的种类是多样的，比如：手机、平板电脑、电子阅读器等需要摄像头模组的设备。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是现有技术中摄像头和对焦传感器的结构示意图；
图2是现有技术中视场角的结构示意图；
图3是根据本申请一个实施例的摄像头模组的结构示意图；
图4是根据本申请一个实施例的摄像头模组的结构示意图；
图5是根据本申请一个实施例的摄像头模组的结构示意图；
图6是根据本申请一个实施例的摄像头模组的结构示意图；
图7是根据本申请一个实施例的摄像头模组的结构示意图；
图8是根据本申请一个实施例的摄像头模组的结构示意图；
图9是根据本申请一个实施例的摄像头模组的结构示意图；
图10是根据本申请一个实施例的第一滤光件和第二滤光件的光谱响应图；
图11是根据本申请一个实施例的电子设备的结构示意图。
附图标记：
100：摄像头模组；102：图像传感器；1022：衬底；1024：红外感光单元；104：可见光感光单元；1042：第一成像单元；1044：第二成像单元；1046：第三成像单元；106：滤光结构；1062：隔光支架；1064：第一滤光件；1066：第二滤光件；108：第一透光结构；110：激光发射器；112：第二透光结构；200：电子设备；210：本体。
102’：对焦传感器。
具体实施方式
下面将详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能理解为对本申请的限制。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。此外，说明书以及权利要求中“和/或”表示所连接对象的至少其中之一，字符“/”，一般表示前后关联对象是一种“或”的关系。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对 于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
下面结合图3至图11描述根据本申请实施例的摄像头模组和电子设备。
如图3所示，本申请提供了一种摄像头模组100的实施例，包括：图像传感器102，图像传感器102包括衬底1022以及均匀设置于衬底1022上的多个可见光感光单元104和红外感光单元1024；第一透光结构108，覆盖于图像传感器102上，光线经过第一透光结构108被图像传感器102接收；激光发射器110，设于图像传感器102的一侧，激光发射器110用于向外发射光线，红外感光单元1024用于接收经障碍物反射后的光线并根据光线确定对焦距离。
根据本申请实施例提供的摄像头模组100，包括图像传感器102、第一透光结构108和激光发射器110，其中，在图像传感器102内同时集成了可见光感光单元104和红外感光单元1024，一方面可有效解决现有技术中设置激光对焦传感器所需要的额外空间，另一方面还可提高激光对焦传感器和图像传感器102中可见光感光单元104的视场角的重合程度，从而提高对焦点的精准度，更利于用户在使用摄像头模组100进行拍摄时的对焦需求。
当然，可以理解，本实施例中，由于将红外感光单元1024集成到图像传感器102中，可使得一方面对焦点与成像点宏观上是重合的，解决了传统方案对焦点偏移问题，另一方面集成度高节省空间，同时采用点对点阵列式激光对焦，快速精确。
具体地，图像传感器102包括衬底1022，通过将可见光感光单元104和红外感光单元1024均匀地设置在衬底1022上，可在图像传感器102自身接收外部光线实现成像地基础上，集成对焦功能，由于红外感光单元1024和可见光感光单元104均匀设置，还可提高成像和对焦的均匀程度，而在对焦时，可通过红外感光单元1024对应的计算电路的计算，进而通过精确测距实现快速对焦。此外，通过在图像传感器102上覆盖设置第一透光结构108，并在图像传感器102的一侧设置激光发射器110，外部环境的光线会通过第一透光结构108向图像传感器102射入，被衬底1022上均匀排布的可见光感光单元104接收，实现较为完整的成像。进一步地，第一透光结构108设置在图像传感器102的一端，一方面第一透光结构108具有一定的透光性，可满足 图像传感器102接收从端部向内进光的进光需求，另一方面，第一透光结构108还可对图像传感器102实现保护，起到遮蔽的作用。进一步地，在图像传感器102的一侧设置有可向外发射光线的激光发射器110，激光发射器110向外发射的光线在射至障碍物时，会被障碍物反射回第一透光结构108，进而穿过第一透光结构108被红外感光单元1024接收，实现对焦光路的完整。
需要说明的，第一透光结构108和激光发射器110并非设置在图像传感器102的同一方位，其中，第一透光结构108设置在端部，激光发射器110则是设置在侧部，更便于激光发射器110发射并排的光线，在经障碍物反射后可通过端部的第一透光结构108射入可见光感光单元104处。
本领域技术人员可以理解，在开始对焦时，激光发射器110会发出特定频段的光线，包括但不限于红外激光束，此时开始计时，通过红外感光单元1024接收到经拍摄物体或是障碍物反射回来的光线，此时停止计时，通过对光速和时间的计算，即可得到摄像头模组100与障碍物之间的距离，此时可将距离发送给摄像头模组100中的对焦控制器，以控制对焦马达运转到焦平面以实现对焦。
进一步地，可见光感光单元104为互补金属氧化物半导体，也即CMOS(Complementary Metal Oxide Semiconductor)，红外感光单元1024为单光子雪崩二极管，也即SPAD(Single Photon Avalanche Diode)。
可以理解，由于红外感光单元1024选用SPAD，其是基于CMOS工艺制作出的单光子雪崩二极管，相较于CMOS可见光感光单元104，SPAD雪崩二极管能够在单个光子的照射下就产生雪崩现象(光电流成倍激增)，SPAD能够接收微弱的激光，SPAD读出电路会计算激光从发出来回收所传输的时间，从而精确测距，实现快速对焦。
进一步地，可见光感光单元与红外感光单元阵列设置；或可见光感光单元绕红外感光单元设置。
可见光感光单元和红外感光单元可根据实际设计需求选择阵列设置或是环绕设置。可以理解，可见光感光单元所接收的光可以有不同种类，其可包括多种子感光单元，故而可将多个子感光单元与红外感光单元阵列排布，或者可将多个子感光单元绕设红外感光单元设置，若将多个子感光作为整体，则可将可见光感光单元阵列设置在红外感光单元上，也可以将多个可见光感 光单元整体绕设在红外感光单元上。
进一步地，每个红外感光单元1024与至少一个可见光感光单元104对应设置。可以是，每个红外感光单元1024与一个可见光感光单元104中的第一成像单元、第二成像单元和第三成像单元呈矩阵排列设置。
每个红外感光单元1024可根据需求与一个可见光感光单元104或多个可见光感光单元104对应设置，一般地，可见光感光单元104与红外感光单元1024均匀设置，以阵列形式存在，在一个具体的实施例中，可见光感光单元104与对焦单D是1:1等比例排列的，事实上，对焦功能对于对焦点的个数没有感光点要求那么高，所以也可以提供另一种调整排列方式，红外感光单元1024与可见光感光单元104以一定比例均匀排列，例如1:2，还可以地，在另一个具体的实施例中，以1:4、1:8等等比例排列，这样可以保证精准对焦的同时，也不牺牲感光灵敏度。
进一步地，如图9所示，可见光感光单元104具体包括：第一成像单元1042、第二成像单元1044和第三成像单元1046，其中，第一成像单元1042、第二成像单元1044和第三成像单元1046的成像颜色不同。
可见光感光单元104包括三种成像单元，具体为成像颜色不同的第一成像单元1042、第二成像单元1044和第三成像单元1046，一般的，三种成像单元的成像颜色为光学三原色：红、绿、蓝，通过设置不同的可见光感光单元104，可提高对光线不同的接收程度，更便于成像。
当然，三种成像单元的排列可根据具体的使用需求和成像需求调整，例如可以为钻石排列，还可以为RGB-Delta排列，甚至可以为矩阵排列。
其中，像素排列图可以如图4和图5所示，可见光感光单元104阵列设置，且每个可见光感光单元104中的第一成像单元1042、第二成像单元1044和第三成像单元1046为RGB(red green blue)单元。
具体地，如图5所示，两个第三成像单元1046之间设有空白区域。
进一步地，摄像头模组100还包括：滤光结构106，设于可见光感光单元104和第一透光结构108之间，滤光结构106用于过滤射入图像传感器102的光线。
通过在可见光感光单元104和第一透光结构108之间设置滤光结构106，可对射入图像传感器102的光线实现过滤，一方面减少外界特殊光线对内部 可见光感光单元104和红外感光单元1024的影响，另一方面，通过过滤光线，可可见光感光单元104对特定光线的获取，更便于成像。
其中，射入图像传感器102的光线包括经障碍物反射回的光线，以及用于拍摄的外部环境光线。
进一步地，滤光结构106具体包括：隔光支架1062，隔光支架1062包括隔光支架1062内形成有多个容纳腔，每个容纳腔内设置一个可见光感光单元104或者一个红外感光单元1024；第一滤光件1064，设于隔光支架1062靠近第一透光结构108的一侧，第一滤光件1064用于过滤红外光，其中，第一滤光件1064在与红外感光单元1024对应的位置上镂空；第二滤光件1066，设于第一滤光件1064与第一透光结构108之间，且第二滤光件1066与容纳腔一一对应设置，以过滤射入容纳腔内的光线。
滤光结构106包括隔光支架1062、第一滤光件1064和第二滤光件1066，其中，隔光支架1062包括多个容纳腔，每个可见光感光单元104对应设置在一个容纳腔内，也即通过多个容纳腔的设置，可减少相邻两个可见光感光单元104的相互影响，以保证成像的稳定。而第一滤光件1064设置在隔光支架1062靠近第一透光结构108的一侧，即光线在由外向内射入时，会依次经过第一透光结构108和第一滤光件1064后射入隔光支架1062内，通过设置第一滤光件1064可在光线穿过第一透光结构108后即实现滤光，进一步地，第一滤光件1064过滤红外光，以保证可见光感光单元104的正常感光成像。而在第一滤光件1064远离第一透光结构108的一侧设置第二滤光件1066，提高对容纳腔内设置的可见光感光单元104的接收光线的针对性，也即，根据第二滤光件1066滤光程度的不同，可见光感光单元104所能接收到的光线也会有所分别，从而更利于每个可见光感光单元104中不同的成像单元的成像。此外，在第一滤光件1064与对红外感光单元1024相对的位置上需要做镂空处理，以保证红外感光单元1024可正常接收光线，可以理解，光线一般为红外线，而第一滤光件1064的主要作用就是滤除红外线，故而通过对第一滤光件1064进行镂空处理，以保证红外感光单元1024可以完整的接收到红外线，以便于测距对焦的进行。
而对于第二滤光件1066而言，将第二滤光件1066设于隔光支架1062远离第一透光结构108的一端，也即第二滤光件1066和第一滤光件1064分别 设置在隔光支架1062的两端，在此基础上，通过将每个第二滤光件1066与一个容纳腔对应设置，以过滤不同的射入容纳腔内的光线，以实现在容纳腔内可见光感光单元104的正常成像。
其中，第一滤光件1064和第二滤光件1066的光谱响应图如图10所示，分别对应四个第二滤光件1066和一个第一滤光件1064，其中，第一滤光件1064用于整体滤除CMOS可见光感光单元104中的红外光，但其在SPAD对焦单光上方是镂空的，也就是说它只是滤除了CMOS可见光感光单元104的红外光，保留了SPAD红外感光单元1024的红外光。
进一步地，容纳腔内设有可见光感光单元，在容纳腔上设置的第二滤光件的过滤波长与容纳腔内的可见光感光单元相对应；容纳腔内设有红外感光单元，在容纳腔上设置的第二滤光件的过滤波长与容纳腔内的红外感光单元相对应。
在容纳腔内设置可见光感光单元时，即第一成像单元、第二成像单元或第三成像单元，可根据不同的成像单元设置具有不同滤光效果的第二滤光件，例如，若第一成像单元、第二成像单元和第三成像单元分别为RGB三原色的成像，则第一成像单元可将除红色外其他波长的光线过滤，第二成像单元可将除绿色外其他波长的光线过滤，第三成像单元可将除蓝色外其他波长的光线过滤。
在容纳腔内设置红外感光单元时，第二滤光件只需保留透过红外光即可，对其他频段的光进行过滤剔除。
进一步地，摄像头模组100还包括：第二透光结构112，套设于第一透光结构外，第二透光结构112覆盖于激光发射器110上。
在第一透光结构外还可设置第二透光结构112，通过将第二透光结构112设置在激光发射器110上，并将激光发射器110覆盖，激光发射器110发出的光线会穿过第二透光结构112射向障碍物，经障碍物反射后的光线，需通过第一透光结构射入图像传感器102，以实现测距对焦和成像，此时可使得第二透光结构112作为补光光路，对成像提供光线支撑。
当然，在另一个实施例中，第二透光结构112被取消，更便于在应用到产品上时的外观设计和结构布局。
在摄像头模组100的进光方向上，第一透光结构108覆盖图像传感器102， 激光发射器110设于第一透光结构108外。
通过在摄像头模组100的进光方向上，将第一透光结构108覆盖图像传感器102，使得所有射入图像传感器102的光线均需要先经过第一透光结构108，在此基础上，通过将激光发射器110设于第一透光结构108外，可减少激光发射器110的位置对第一透光结构108的进光影响。当然，对于激光发射器110而言，通过上述位置设置，还可减少第一透光结构108对激光发射器110向外发射的光线的穿透性的影响，提高成像和对焦质量。
在一个实施例中，如图6所示，激光发射器110的数量为一个，设于图像传感器102的周侧。
进一步地，如图7所示，激光发射器110的数量为多个，多个激光发射器110均匀分布于图像传感器102的周侧。
激光发射器110可根据需求设置为多个，通过将多个激光发射器110绕图像传感器102的中心轴线均匀设置，也即多个激光发射器110均匀分布于图像传感器102的周侧，可极大地提高对焦的精准度，激光发射器110是围绕着可见光感光单元104一圈来排列的。事实上，为了满足对焦的最低需求，激光发射器110的数量为一个，放置在可见光感光单元104任何一侧，系统都是可以正常工作的，但通过上述设置多个激光发射器110，会更有利于对焦精准，也即更便于实现快速对焦。
进一步地，如图8所示，图像传感器102的数量为多个，激光发射器110的数量为一个，每个图像传感器102中的红外感光单元1024均能够接收光线。
通过设置多个图像传感器102，可利用一个激光发射器110实现多个图像传感器102的成像，换言之，并排摆放两个甚至多个这样的摄像头，共用中间的激光发射器110，可以形成多个可激光对焦的摄像头矩阵，可减少激光发射器110的数量，降低不必要的器材成本以及位置空间。
如图11所示，本申请的另一实施例提出了一种电子设备200，包括：本体210；上述任一实施例中的摄像头模组100，设于本体210上，其中，摄像头模组100为电子设备200的前置摄像模组和/或后置摄像模组。
根据本申请实施例提供的电子设备200，包括本体210和上述任一实施例的摄像头模组100，通过将摄像头模组100设置在本体210上，可将摄像头模组100所成的像发送至本体210上，以便于后续的二次编辑和分享，其 中，摄像头模组100可以为前置模组，还可以为后置模组，从而使得电子设备200的前摄像头具有防抖功能，或是后摄像头具有防抖功能，还可以地，前后双摄像头均具有上述任一实施例的防抖功能。
由于电子设备200包括上述任一实施例的摄像头模组100，故而具有上述任一实施例的摄像头模组100的有益效果，在此不在赘述。
值得说明的是，电子设备200的种类是多样的，示例性的，电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、移动上网装置(Mobile Internet Device，MID)、增强现实(augmented reality，AR)/虚拟现实(virtual reality，VR)设备、机器人、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer，UMPC)、上网本或者个人数字助理(personal digital assistant，PDA)等，还可以为服务器、网络附属存储器(Network Attached Storage，NAS)、个人计算机(personal computer，PC)、电视机(television，TV)、柜员机或者自助机等等需要摄像头模组的设备，本申请实施例不作具体限定。
根据本申请实施例的摄像头模组和电子设备，在图像传感器内同时集成了可见光感光单元和红外感光单元，一方面可有效解决现有技术中设置激光对焦传感器所需要的额外空间，另一方面还可提高激光对焦传感器和图像传感器中可见光感光单元的视场角的重合程度，从而提高对焦点的精准度，更利于用户在使用摄像头模组进行拍摄时的对焦需求。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例，本领域的普通技术人员可以理解：在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本申请的范围由权利要求及其等同物限定。

Claims (10)

  1. 一种摄像头模组，包括：
    图像传感器，所述图像传感器包括衬底以及均匀设置于所述衬底上的多个可见光感光单元和多个红外感光单元；
    第一透光结构，覆盖于所述图像传感器上，光线经过所述第一透光结构被所述图像传感器接收；
    激光发射器，设于所述图像传感器的一侧，所述激光发射器用于向外发射光线，所述红外感光单元用于接收经障碍物反射后的所述光线并根据所述光线确定对焦距离。
  2. 根据权利要求1所述的摄像头模组，其中，
    所述可见光感光单元与所述红外感光单元阵列设置；或
    所述可见光感光单元绕所述红外感光单元设置。
  3. 根据权利要求1所述的摄像头模组，其中，所述可见光感光单元具体包括：
    第一成像单元、第二成像单元和第三成像单元，
    其中，所述第一成像单元、所述第二成像单元和所述第三成像单元的颜色不同。
  4. 根据权利要求3所述的摄像头模组，还包括：
    滤光结构，设于所述可见光感光单元和所述第一透光结构之间，所述滤光结构用于过滤射入所述图像传感器的光线。
  5. 根据权利要求4所述的摄像头模组，其中，所述滤光结构具体包括：
    隔光支架，所述隔光支架内形成有多个容纳腔，每个所述容纳腔内设置一个所述可见光感光单元或者一个所述红外感光单元；
    第一滤光件，设于所述隔光支架靠近所述第一透光结构的一侧，所述第一滤光件用于过滤红外光，其中，所述第一滤光件在与所述红外感光单元对应的位置上镂空；
    第二滤光件，设于所述第一滤光件与所述图像传感器之间，且所述第二滤光件与所述容纳腔一一对应设置，以过滤射入所述容纳腔内的光线。
  6. 根据权利要求5所述的摄像头模组，其中，
    所述容纳腔内设有所述可见光感光单元，在所述容纳腔上设置的所述第 二滤光件的过滤波长与所述容纳腔内的可见光感光单元相对应；
    所述容纳腔内设有所述红外感光单元，在所述容纳腔上设置的所述第二滤光件的过滤波长与所述容纳腔内的红外感光单元相对应。
  7. 根据权利要求1所述的摄像头模组，还包括：
    第二透光结构，套设于所述第一透光结构外，且所述第二透光结构覆盖于所述激光发射器上。
  8. 根据权利要求1所述的摄像头模组，其中，在所述摄像头模组的进光方向上，所述第一透光结构覆盖所述图像传感器，所述激光发射器设于所述第一透光结构外。
  9. 根据权利要求1所述的摄像头模组，其中，
    所述激光发射器的数量为多个，多个所述激光发射器均匀分布于所述图像传感器的周侧；或
    所述图像传感器的数量为多个，所述激光发射器的数量为一个，每个所述图像传感器中的红外感光单元均能够接收所述光线。
  10. 一种电子设备，包括：
    本体；
    如权利要求1至9中任一项所述的摄像头模组，设于所述本体上，
    其中，所述摄像头模组为所述电子设备的前置摄像模组和/或后置摄像模组。
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