WO2022188099A1

WO2022188099A1 - Detector, detection device and method, mobile platform, and readable storage medium

Info

Publication number: WO2022188099A1
Application number: PCT/CN2021/080234
Authority: WO
Inventors: 李想; 陈超帅; 江宝坦; 曹子晟; 夏斌强; 李琛
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2021-03-11
Filing date: 2021-03-11
Publication date: 2022-09-15

Abstract

A non-refrigeration infrared focal plane detector (100, 4), a detection device, a detection method, a mobile platform, and a computer readable storage medium. The detection device comprises a controller, a shielding structure (13, 3), and a detector (100, 4). The detector (100, 4) comprises a first imaging area (110) and a second imaging area (120). The controller is connected to the detector (100, 4). The first imaging area (110) is configured to receive thermal radiation from a target object and a particular component of the non-refrigeration infrared focal plane detection device. The shielding structure (13, 3) is configured to shield the second imaging area (120) to prevent the second imaging area (120) from receiving thermal radiation from the target object. The second imaging area (120) is configured to receive thermal radiation from the particular component of the non-refrigeration infrared focal plane detection device. The responsivity of the first imaging area (110) and the responsivity of the second imaging area (120) are separately adjustable. The controller is configured to calculate, according to the radiation amount received by the first imaging area (110) and the radiation amount received by the second imaging area (120), a net radiation amount of the target object received by the first imaging area (110).

Description

Detector, detection device and method, removable platform, readable storage medium

technical field

The present application generally relates to the field of integrated circuits, and more particularly, to an uncooled infrared focal plane detector, a detection device and a detection method, a movable platform, and a computer-readable storage medium.

Background technique

When the uncooled infrared focal plane detector works normally, in addition to receiving the optical imaging radiation from the target object, it also receives the thermal radiation from the internal structure of the detection device. When the uncooled infrared focal plane detection device measures temperature, the thermal radiation of the internal structure will increase with the temperature rise of specific components inside the detection device, and the increased thermal radiation will be superimposed on the thermal radiation of the target object, causing the detector to actually receive The amount of target radiation varies with the temperature rise of specific components inside the detection device, which brings about the problem of inaccurate temperature measurement of the target object.

SUMMARY OF THE INVENTION

A series of concepts in simplified form have been introduced in the Summary section, which are described in further detail in the Detailed Description section. The Summary of the Invention section of the present invention is not intended to attempt to limit the key features and essential technical features of the claimed technical solution, nor is it intended to attempt to determine the protection scope of the claimed technical solution.

A first aspect of the embodiments of the present application provides an uncooled infrared focal plane detector, the detector includes a first imaging area and a second imaging area;

the first imaging area configured to receive thermal radiation of the first object;

the second imaging area configured to receive thermal radiation from a second object, the first object including the second object;

Wherein, the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently.

A second aspect of the embodiments of the present application provides an uncooled infrared focal plane detection device, the uncooled infrared focal plane detection device includes a controller, a shielding structure, and a detector, the detector includes a first imaging area and a second imaging area an imaging area, the controller is connected to the detector;

the first imaging region configured to receive thermal radiation from a target object and specific components of the uncooled infrared focal plane detection device;

the blocking structure is configured to block the second imaging area to block the second imaging area from receiving thermal radiation from the target object;

The second imaging area is configured to receive thermal radiation from a specific component of the uncooled infrared focal plane detection device, and the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently ;

The controller is configured to calculate the net radiation amount of the target object received by the first imaging region based on the radiation amount received by the first imaging region and the radiation amount received by the second imaging region.

A third aspect of the embodiments of the present application provides a temperature measurement method for an uncooled infrared focal plane detection device, the detection device is provided with a detector, the detector includes a first imaging area and a second imaging area, the first imaging area is The responsivity of the imaging area and the second imaging area can be adjusted independently, and the temperature measurement method includes:

obtaining thermal radiation received by the first imaging region from a target object and a specific component of the detection device;

controlling the thermal radiation received by the second imaging region from certain components of the detection device;

The net radiation amount of the target object received by the first imaging region is calculated according to the radiation amount received by the first imaging region and the radiation amount received by the second imaging region.

A fourth aspect of the embodiments of the present application provides a movable platform, and the movable platform includes:

ontology;

In the aforementioned uncooled infrared focal plane detection device, the detection device is arranged on the body.

A fifth aspect of the embodiments of the present application provides a computer-readable storage medium, where the computer-readable storage medium stores a computer program, and the computer program includes at least one piece of code, and the at least one piece of code can be executed by a computer to control a computer program. The computer executes the temperature measurement method described above.

The present application provides an uncooled infrared focal plane detector, a detection device, and a detection method, in which the detection device calculates the first imaging area according to the radiation amount received by the first imaging area and the radiation amount received by the second imaging area The net radiation amount of the first object received by an imaging region. Through the improvement, the radiation brought by the specific structure inside the device can be directly detected, and the net radiation amount of the target can be obtained, thereby making the temperature measurement of the target object more accurate. The detection device has adaptability to the temperature rise process inside the detection device, changes in ambient temperature, and wind blowing.

Description of drawings

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative labor.

In the attached image:

1 shows a schematic structural diagram of an uncooled infrared focal plane detector according to an embodiment of the present application;

2 shows a schematic structural diagram of an uncooled infrared focal plane detector receiving thermal radiation according to an embodiment of the present application;

3 shows a schematic structural diagram of an uncooled infrared focal plane detection device according to an embodiment of the present application;

4 shows a schematic flowchart of the temperature measurement method of the uncooled infrared focal plane detection device provided by the present application;

5A is a schematic diagram of a second imaging region receiving thermal radiation according to an embodiment of the present application;

FIG. 5B is a schematic diagram of receiving thermal radiation in the first imaging region according to an embodiment of the present application.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present application more apparent, the exemplary embodiments according to the present application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein. Based on the embodiments of the present application described in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced without one or more of these details. In other instances, some technical features known in the art have not been described in order to avoid confusion with the present application.

It should be understood that the application may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of this application to those skilled in the art.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a," "an," and "the/the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the terms "compose" and/or "include", when used in this specification, identify the presence of stated features, integers, steps, operations, elements and/or components, but do not exclude one or more other The presence or addition of features, integers, steps, operations, elements, parts and/or groups. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

For a thorough understanding of the present application, detailed structures will be presented in the following description in order to explain the technical solutions proposed by the present application. Alternative embodiments of the present application are described in detail below, however, the present application may have other embodiments in addition to these detailed descriptions.

An uncooled infrared focal plane detection device includes an uncooled infrared focal plane detector configured to receive thermal radiation from a target object. In practical applications, when the detection device is working normally, in addition to receiving the optical imaging radiation from the target object, it will also receive thermal radiation from the internal structure of the detection device (such as the thermal radiation from the front shell (including the lens) of the device), while the detection The thermal radiation of the internal structure of the device will increase with the temperature rise, and this part of the increased thermal radiation will be superimposed on the radiation of the target object, causing the actual amount of radiation received by the detector to change with the temperature rise, which in turn brings the target temperature measurement. inaccurate question.

Specifically, the thermal radiation of the internal structure of the detection device belongs to the non-imaging optical radiation for the detector. The thermal radiation actually received by each pixel in the detector is integrated at a solid angle of 180° in the hemispherical space. The ideal detector (No problem of detector uniformity) The thermal radiation of the internal structure of the detection device received by the entire area array is the same. Since this part of the thermal radiation occupies a large solid angle of the pixel space, a slight increase in the thermal radiation of the internal structure of the detection device will cause a great change in the thermal radiation received by the detector pixels, which will lead to the grayscale value output by the detection device. There are big fluctuations.

After the detection device is turned on, the heat generated at the back end of the detection device is transferred to the front shell of the detection device through thermal conduction and radiation, the temperature of the front shell rises, and the amount of internal radiation received by the detector increases. At the same time, when the external ambient temperature changes, the heat dissipation environment inside the detection device changes, and the temperature of the front casing also changes, resulting in changes in the radiation amount received by the detector from the internal structure of the detection device. In this way, the amount of radiation generated by the above-mentioned internal structure is superimposed on the target radiation, which will eventually lead to incorrect temperature measurement of the target.

At present, the thermal radiation of the internal structure of the detection device is mainly solved by adding a front shutter baffle structural member. Since the shutter baffle structural member and the internal temperature of the detection device are close, the internal structure of the detection device can be simulated by closing the shutter baffle structural member regularly. Heat radiation. The radiation received by the detector when the shutter structure is closed is used as the background, and the radiation received after the shutter structure is opened is subtracted from the background to obtain the target radiation, thereby offsetting the thermal radiation inside the detection device. However, this method has the following three problems: First, the temperature of the shutter baffle structure is often higher than the temperature of the front shell, which will cause the radiation amount of the shutter baffle structure to be greater than that of the front shell; second, the front shell contains the lens Therefore, the space solid angle of the front case removing the lens part is smaller than the space solid angle of the shutter baffle structural member, which will also cause the radiation amount when the shutter baffle structural member is closed to be greater than the radiation amount of the front case; third, the shutter baffle structure After the shutter is opened, the detection device is still heating up or cooling down. Before the shutter structure is opened next time, the radiation amount of the front shell of the detection device may change, so the thermal radiation brought by the front shell cannot be eliminated through the background. Therefore, the problem of changing the radiation amount caused by the temperature change of the front casing cannot be completely eliminated by the built-in shutter baffle structure of the detection device.

As mentioned above, in view of the inaccurate problem of target temperature measurement caused by the radiation amount of the internal structure of the detection device, the thermal radiation of part of the internal structure of the detection device can be offset by adding a shutter baffle structure, but it is still unable to effectively eliminate the radiation caused by the internal structure. The problem of inaccurate temperature measurement.

In order to solve this problem, the inventor tried to adopt the following processing methods:

Method 1: Only calibrate the difference between the radiation amount of the front shell and the radiation amount of the shutter after the detection device is thermally stabilized, and subtract this part of the difference from the grayscale value converted by the detector, so that the detection device is hot in operation. After stabilization, the temperature measurement is accurate. The solution is widely used in security thermal imaging cameras, mainly because the security equipment is always in the power-on working state, thermal stability is easy to ensure, and the calibration process is relatively simple. However, in some cases, if the detection device is affected by wind, the temperature measurement will be inaccurate, and the temperature measurement will be inaccurate during the period from the time when the device is powered on to the thermal stability.

Method 2: On the basis of method 1, the thickness of the casing is increased, so that the working state of the detection device is more stable, and the heat dissipation is also better, and it is not sensitive to the influence of environmental temperature changes and wind blowing. The above method increases the stability of target temperature measurement to a certain extent, but at the expense of volume and weight, this method can also be used in security and industrial cameras, but in drones, which are sensitive to weight and volume scene will not work.

Method 3: Calibrate the relationship between the difference between the target measured value and the actual measured value and the temperature rise of the detection device in the entire temperature rise process, and fit the functional relationship between the two. The calculation of the combined coefficient corresponds to the real-time correction of the correction amount. This method has certain adaptability to the temperature rise process of the detection device and the change of ambient temperature, and the reliability of temperature measurement is greatly improved. However, this method requires a very complicated calibration process, which not only takes a long time for calibration, but also requires calibration under different ambient temperatures, which greatly reduces the output of the equipment.

Based on this, the detector applied to the detection device proposed in this application includes a first imaging area and a second imaging area, wherein the first imaging area is used to receive the thermal radiation of the target object and the thermal radiation of the internal structure of the detection device. The second imaging area is used to receive the thermal radiation of the internal structure of the detection device, and the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently, so that the calculation based on the thermal radiation of the internal structure of the detection device received by the second imaging area can be calculated. The net radiation amount of the target object received by the first imaging area finally makes the temperature measurement more accurate. At the same time, in the present application, the casing of the detection device is not improved, but the detector is improved, and the volume and weight are not sacrificed when the temperature measurement accuracy is improved, so the application scenarios of the detection device are not limited. In addition, the present application obtains the net radiation amount of the target object received by the first imaging area by adjusting the responsivity of the first imaging area and the responsivity of the second imaging area, which is simpler and will not affect the equipment yield.

Specifically, a first aspect of the present application provides an uncooled infrared focal plane detector. As shown in FIG. 1 , the uncooled infrared focal plane detector 100 includes a first imaging area 110 and a second imaging area 120;

a first imaging area 110 configured to receive thermal radiation of the first object;

The second imaging area 120 is configured to receive thermal radiation of a second object, the first object including the second object;

In this application, the uncooled infrared focal plane detector 100 can be a product used to detect the thermal radiation of the target object to obtain the temperature distribution image of the target object, and then convert it into a video image, and the uncooled infrared detector does not need In addition to working at low temperatures, uncooled infrared detectors are inexpensive and can be mass-produced, enabling infrared detectors to enter the broad civilian market. The uncooled infrared focal plane detector of the present application can be applied to various fields and is not limited to a certain one. In an example of the present application, the uncooled infrared focal plane detector can be applied to movable platforms, such as non-aircraft, automobiles, etc. , in order to realize such as surveying and mapping, security, etc., which will not be listed one by one here.

Specifically, as a receiver, the uncooled infrared focal plane detector 100 may include two pixel regions, namely a first imaging region 110 and a second imaging region 120, the responsivity of the first imaging region 110 and the second imaging region The responsivity of 120 can be individually adjusted to map the radiation received by the first imaging region 110 from the second object (such as a specific component inside the uncooled infrared focal plane detection device) through the radiation of the second imaging region 120, thereby converting The net radiation amount of the target object received by the first imaging region 110 can be obtained by deducting the radiation amount from the second object received by the first imaging region 110 mapped by the second imaging region 120 from the thermal radiation received in the first imaging region 110 . Wherein, the first object may include a second object and a target object.

When the detector is installed and applied to the uncooled infrared focal plane detection device, the uncooled infrared focal plane detection device further includes a shielding structure, and the shielding structure is configured to shield the second imaging area 120 to prevent the second imaging area 120 from receiving The thermal radiation from the target object, only the first imaging region 110 receives the thermal radiation from the target object.

Optionally, since the first imaging area 110 is an effective pixel area, the resolution of the first imaging area 110 may be greater than that of the second imaging area 120, so as to utilize the radiation amount received by the second imaging area 120 with a smaller size, namely, It can be used to map the radiation amount from the internal structure of the uncooled infrared focal plane detection device, which is beneficial to the miniaturized design of the detector.

Exemplarily, when the detector 100 is installed on the detection device and used in practice, as shown in FIG. 2 , the detector 100 may include a first imaging area 110 and a second imaging area, and an optical lens 150 adapted to the detection device. The imaging area 140 may include the first imaging area 110 . In order to prevent the second imaging area 120 from not receiving the thermal radiation transmitted through the lens 150, the second imaging area 120 and part of the optical imaging area 140 of the shielding structure 130 may be used, so that only the first imaging area 110 is an effective pixel area, and can The thermal radiation transmitted through the lens 150 is received.

It should be noted that, in the present application, the first imaging area 110 and the second imaging area 120 may be set separately or integrated, and are not limited to a certain type, but the responsivity of the first imaging area 110 and the second imaging area The responsivity of the regions 120 can be adjusted individually.

For example, the first imaging area 110 and the second imaging area 120 are connected to each other or integrally provided, but have different control circuits; or as shown in FIG. 1 or FIG. 2 , the first imaging area 110 and the second imaging area 120 are isolated from each other Setting, the first imaging area 110 and the second imaging area 120 are physically separated to form two separate imaging areas, so as to adjust the responsivity of the first imaging area 110 and the second imaging area 120 respectively.

Specifically, when the first imaging region 110 and the second imaging region 120 are physically separated to form two separate imaging regions, the detector 100 may include a substrate, and the first imaging region 110 and the second imaging region 120 are spaced apart from each other are formed on the substrate, for example, the first imaging area 110 and the second imaging area 120 are physically separated by the substrate therebetween.

Wherein, the distance between the first imaging area and the second imaging area is greater than or equal to 100 μm, so as to ensure that the second imaging area 120 only receives the thermal radiation of the second object as much as possible, and is more convenient for the response rate of the first imaging area and the first imaging area. The responsivity of the two imaging regions is adjusted.

Optionally, the second imaging area 120 of the detector 110 may have various implementations, and may be the same pixel as the effective pixel area of the first imaging area 110, or may be a pixel of other material types.

Optionally, the composition of the pixel material, pixel structure and readout circuit of the first imaging area 110 may be the same as those of the second imaging area 120, but the first imaging area 110 and the second imaging area 120 have separate control circuits to The responsivity of the first imaging area and the responsivity of the second imaging area are adjusted respectively through independent control circuits.

In the present application, the first imaging area 110 is used to receive thermal radiation of the first object. When the detector is installed and applied to the uncooled infrared focal plane detection device, the first object includes the target object and specific components inside the uncooled infrared focal plane detection device, and the first imaging area 110 is used to receive the target object and the uncooled infrared focal plane detection device. Thermal radiation from specific components of a flat detection device.

The specific components include, but are not limited to, the front casing (a part of the casing), the shutter, and the lens barrel of the uncooled infrared focal plane detection device. Specifically, the specific components may be in the receiving direction of the first imaging area 110 at This will not be listed one by one.

Wherein, the second imaging area 120 is used to receive the thermal radiation of the second object, and the second object is a part of the first object. for receiving thermal radiation from certain components of an uncooled infrared focal plane detection device.

The responsivity of the second imaging region 120 is negatively correlated with the spatial solid angle of the second imaging region 120 . Specifically, in the present application, when the detector 100 is installed and applied to an uncooled infrared focal plane detection device, the second imaging region 120 and the first imaging region 110 actually receive the spatial stereoscopic thermal radiation of specific components inside the detection device The angles are different. As shown in FIG. 5A , the angle at which the thermal radiation of the second object is incident on the pixel in the second imaging area 120 is in the range of 180°. By analogy to the spatial stereo radiation, it can be known that the spatial solid angle at which the pixel in the second imaging area 120 receives the thermal radiation of the second object is the hemispherical space 2π solid angle. Referring to FIG. 5B , the sum of the angles of the thermal radiation of the first object (including the second object and the target object) incident on the pixel in the first imaging area 110 is 180°, wherein the thermal radiation of the target object is incident on the image The angular size of the element is α, and the angular size of the incident thermal radiation of the second object to the pixel is (180°-α). By analogy to the spatial stereo radiation, it can be known that the sum of the spatial solid angles at which the pixels in the first imaging area 110 receive the thermal radiation of the second object and the target object is the hemispherical space 2π solid angle, and the pixels in the first imaging area 110 The spatial solid angle of receiving the thermal radiation of the second object is 2π-Ω, wherein Ω represents the spatial solid angle of the thermal radiation of the target object entering the pixel array. It should be noted that the spatial solid angle at which the thermal radiation of the target object enters the pixel array is determined by the optical system of the thermal radiation detector, that is, after the optical system of the thermal radiation detector is determined, the pixel array receives the thermal radiation of the target object. The solid angle of space has been determined.

In an embodiment of the present application, when the detector 100 is installed and applied to an uncooled infrared focal plane detection device, as shown in FIG. 2 , since the main purpose of the lens 150 is to map the thermal radiation of the target object onto the detector 100 , therefore, the lens 150 belongs to an object with a very high transmittance and a very low emissivity. That is, the transmittance of the lens 150 is generally close to 1, and the thermal radiation rate is only about 0.1, but the transmittance of the casing, lens barrel, shutter and other structural components is 0, and the thermal radiation rate is above 0.9, so the 180-degree The thermal radiation of the internal structure received by the spatial solid angle mainly comes from structural components such as the casing, the lens barrel, and the shutter, and the lens 150 basically does not generate thermal radiation. It can be seen that the spatial solid angles of the first imaging area 110 and the second imaging area 120 actually receiving the thermal radiation of the specific components inside the detection device are different, and the second imaging area 120 receives the specific components (that is, the above-mentioned second imaging area 120). The object, which can include the front shell, lens barrel and other structural components of the detection device), the spatial solid angle of the radiation is 180°, and the spatial solid angle of the first imaging area 110 receiving the radiation of a specific component inside the detection device needs to be removed. The lens 150 of the detection device corresponds to solid angle of space. Therefore, under the condition that the responsivity of the first imaging area 110 and the second imaging area 120 are the same, the amount of radiation received by the two of the specific components inside the detection device is also different.

When the detector 100 is installed on the detection device for actual use, it is necessary to adjust the responsivity of the second imaging region 120 according to the difference in the spatial solid angle of the two parts, so that the grayscale values of the two parts are converted to the radiation of specific components inside the detection device. Similarly, the radiation amount received by the first imaging region 110 from the uncooled infrared focal plane detection device is mapped with the radiation amount passing through the second imaging region 120, thereby obtaining the net radiation amount of the target object received by the first imaging region.

Wherein, the responsivity of the second imaging area 120 is negatively correlated with the spatial solid angle of the second imaging area 120, and the adjustment formula of the responsivity ρ _noi of the second imaging area 120 may be:

ω _a , ρ _a are the spatial solid angle of the first imaging area 110 receiving radiation from a specific component inside the detection device and the responsivity of the first imaging area 110 , wherein π is the spatial solid angle of the second imaging area 120 . Wherein, the responsivity of the first imaging area 110 is greater than the responsivity of the second imaging area 120 .

In addition, the responsivity of the second imaging area 120 is negatively correlated with the amount of radiation received by the second imaging area 120, and the adjustment formula for the responsivity ρ _noi of the first imaging area 110 may be:

in,

are the radiation amounts received by the first imaging area 110 and the second imaging area 120, respectively. ρ _a and ρ _noi are the responsivity of the first imaging area 110 and the second imaging area 120 , respectively.

Therefore, the responsivity of the second imaging region 120 can be adjusted in one of the above two ways.

In the present application, the size of the second imaging area 120 is not fixed, and may be a single pixel or multiple pixels, such as a single row of pixels or multiple rows of pixels, and is not limited to any one.

In one embodiment, the second imaging area 120 is configured as a single pixel, and the amount of radiation received by the second imaging area 120 is the amount of radiation received by a single pixel. In another embodiment, the second imaging area 120 is configured as a pixel array, and the amount of radiation received by the second imaging area 120 is the average amount of radiation received by the pixel array.

In the present application, the detector includes a first imaging region and a second imaging region whose responsivity can be adjusted respectively, to receive thermal radiation of the first object and thermal radiation of the second object, respectively. When the detector is applied to the detection device, the radiation amount received by the first imaging area and the radiation amount received by the second imaging area can be used to calculate the net radiation amount of the target object received by the first imaging area, thereby making the temperature measurement of the target object more accurate . The detection device has adaptability to the temperature rise process inside the detection device, changes in ambient temperature and wind blowing.

A second aspect of the present application provides an uncooled infrared focal plane detection device. As shown in FIG. 3 , the uncooled infrared focal plane detection device includes a controller, a shielding structure 3 and a detector 4. The detector 4 includes FIG. 1 As shown in the first imaging area 110 and the second imaging area 120, the controller is connected to the detector;

a first imaging region 110 configured to receive thermal radiation from the target object and specific components of the uncooled infrared focal plane detection device;

The blocking structure 3 is configured to block the second imaging area, so as to block the second imaging area from receiving thermal radiation from the target object;

The second imaging area 120 is configured to receive thermal radiation from a specific component of the uncooled infrared focal plane detection device, and the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently;

The structure of the detector is as described above, the pixel material, pixel structure and readout circuit of the first imaging area 110 and the second imaging area 120 are the same, and the first imaging area 110 and the second imaging area 120 have separate The control circuit is used to adjust the responsivity of the first imaging area 110 and the responsivity of the second imaging area respectively.

Wherein, the first imaging area 110 and the second imaging area 120 are arranged to be separated from each other. The first imaging area 110 and the second imaging area 120 are formed on a substrate spaced apart from each other, and the substrate between the first imaging area 110 and the second imaging area 120 is configured as an isolation structure.

Wherein, the resolution of the first imaging area 110 is greater than the resolution of the second imaging area 120 .

The first imaging area 110 is configured as a single pixel, and the amount of radiation received by the second imaging area 120 is the amount of radiation received by a single pixel. Alternatively, the second imaging area 120 is configured as a pixel array, and the amount of radiation received by the second imaging area 120 is the average amount of radiation received by the pixel array.

For the specific structure of the detector 4, reference may be made to the foregoing description, which will not be repeated here, and only other structures of the detection device will be described in detail below.

The detection device will be described in detail below with reference to FIG. 3 . Wherein, the detection device further includes: a casing, and the casing is enclosed by the casing to form a accommodating space, and the accommodating space is used to accommodate the controller, the detector 4 and other components of the detection device.

Specifically, the housing encloses an accommodating space to accommodate other components of the detection device, including but not limited to basic structures such as the detector 4 , the bridge board 5 , the middle frame 6 , the signal board 7 , and the heat sink 8 . In an embodiment of the present application, in the receiving direction of the detector 4 , the detector 4 , the middle frame 6 , the signal board 7 and the heat sink 8 are arranged in sequence from front to back. Among them, the detector is fixed on the bridge plate 5 .

The lens 1 is disposed in front of the receiving direction of the first imaging area 110 , and may be fixed on the housing, for example, and configured to shape the outgoing light of the target object so as to be received by the first imaging area 110 .

As a part of the housing, the front case 2 is arranged in front of the receiving direction of the detector 4, and the lens 1 is fixed on the front case. The imaging area receives thermal radiation from the target object.

The shielding structure 3 may be a shutter, for example, disposed in the accommodating space behind the front case 2 , or the shielding structure 3 may be a partial structure of the housing, such as the front case 2 .

Wherein, the signal board 7 is disposed in the housing and behind the detector 4, and can be a part of the controller. For example, the signal board 7 can be used to obtain the thermal radiation signals of the first imaging area 110 and the second imaging area 120, and according to The amount of radiation received by the first imaging area 110 and the amount of radiation received by the second imaging area 120 calculate the net radiation amount of the target object received by the first imaging area 110 .

The heat sink 8 is disposed behind the receiving direction of the detector 4, for example, disposed at the rear end of the housing, and is configured to dissipate the heat generated by the detection device to reduce the temperature of the detection device. Among them, the heat sink 8 can be made of a material with good heat dissipation performance and light weight, so as to reduce the overall weight of the detection device, and the selected material is not limited to a certain one.

In the present application, the distance between the first imaging area 110 and the second imaging area 120 is greater than or equal to 100 μm. On the one hand, the interference between the first imaging area 110 and the second imaging area 120 can be reduced, and on the other hand, it can be ensured by blocking Structure 3 enables the second imaging area 120 to receive only thermal radiation from specific components of the uncooled infrared focal plane detection device, and the setting of the shielding structure can be more easily realized by setting the separation distance.

In addition, in order to realize the function of the shielding structure 3, the thickness of the shielding structure 3 and the distance between the shielding structure 3 and the second imaging area 120 also need to be considered. In an embodiment of the present application, the thickness of the shielding structure 3 is 0.2 mm-2 mm, and the distance between the shielding structure 3 and the second imaging area 120 is 0.5 mm-1 mm, so as to ensure that the second imaging is made through the shielding structure 3 Region 120 only receives thermal radiation from certain components of the uncooled infrared focal plane detection device.

The thermal radiation inside the detection device includes the thermal radiation of the front casing, the thermal radiation of the lens barrel, the thermal radiation of the shutter, and the reflected radiation generated by the front casing. Among them, the front shell is generally made of materials with high emissivity, and the amount of reflected radiation is small and can be ignored; the temperature of the front shell and the lens barrel are close, and the radiation amount of the two is the same; therefore, the thermal radiation inside the detection device can be regarded as mainly from the front shell and shutter radiation.

When the detection device is used, as shown in FIG. 2 , the effective pixel area, that is, the first imaging area 110 is the same as that of the conventional detector, the difference is that the second imaging area 120 (non-optical imaging area) does not receive the target object passing through the lens. For thermal radiation, the non-optical imaging area is shielded by detecting the internal structure of the device, such as a shutter or a front case, so that the second imaging area 120 can receive the thermal radiation of specific components inside the device in real time. For the specific method, please refer to the foregoing content, which will not be repeated here.

In the present application, the controller is further configured to adjust the responsivity of the second imaging region 120 so that the radiation amount of the second imaging region 120 maps the radiation amount received by the first imaging region 110 from the uncooled infrared focal plane detection device .

After adjusting the responsivity of the second imaging region 120 , the controller is further configured to calculate the net amount of the target object received by the first imaging region 120 according to the amount of radiation received by the first imaging region 110 and the amount of radiation received by the second imaging region 120 amount of radiation. For example, the thermal radiation received in the first imaging area 110 is deducted from the radiation received by the first imaging area 110 mapped by the second imaging area 120 from the uncooled infrared focal plane detection device to obtain the target object received by the first imaging area 110 net radiation.

The detection device further includes a memory, and the memory is used for storing the corresponding relationship data between the net radiation amount and the temperature.

In an example of the present application, the relationship between the target net radiation amount and temperature at different temperatures is calibrated during the production process of the detection device. In actual use, only the target net radiation amount can correspond to the real temperature value of the target object.

In an embodiment of the present application, in addition to the memory, the detection device may further include one or more processors, where the memory is used for storing executable program instructions; the one or more processors are used for executing the program instructions stored in the memory, The processor is caused to execute the temperature measurement method of the detection device. One or more processors work together or individually.

The memory is used to store program instructions executable by the processor, and may include one or more computer program products, which may include various forms of computer-readable storage media, such as volatile memory and/or non-volatile memory Sexual memory. The volatile memory may include, for example, random access memory (RAM) and/or cache memory, or the like. The non-volatile memory may include, for example, read only memory (ROM), hard disk, flash memory, and the like.

The processor may be a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other form of processing unit with data processing capabilities and/or instruction execution capabilities . The processor can execute the instructions stored in the memory to execute the similar case retrieval method of the embodiments of the present application described herein. For example, a processor can include one or more embedded processors, processor cores, microprocessors, logic circuits, hardware finite state machines (FSMs), digital signal processors (DSPs), or combinations thereof.

The memory is used to store program instructions, the processor is used to execute the program instructions stored in the memory, and when the program instructions are executed, the processor is used to implement the uncooled infrared focal plane detection device according to the embodiment of the present application. A temperature measurement method, comprising: acquiring thermal radiation received by a first imaging area from a target object and a specific component of a detection device; controlling the thermal radiation received by a second imaging area from a specific component of the detection device; The amount of radiation and the amount of radiation received by the second imaging region calculates the net radiation amount of the target object received by the first imaging region.

The detection device of the present application can offset the heat of the specific component superimposed on the thermal radiation of the target object in real time by designing a separate second imaging area on the detector to detect the overall thermal radiation of a specific component inside the detection device. radiation, thus making the target temperature measurement more accurate.

Further, during the temperature rise process after the detection device is turned on, the heat generated at the rear end is conducted to the front case by means of heat transfer and heat radiation, and the radiation amount generated by the front case is simultaneously absorbed by the first imaging area (effective pixel area). ) and the second imaging area (non-optical imaging area), the radiation amount of the two parts is equal to the converted grayscale value, which is canceled at the back end of signal processing, so the temperature rise process of specific components inside the detection device will not affect the target. The temperature of the object. Similarly, after the ambient temperature changes or is blown by the wind, the heat dissipation environment of the detection device changes, and the thermal radiation generated by the front case is also in the first imaging area (effective pixel area) and the second imaging area (non-optical imaging area). Changes occur at the same time and cancel each other, so it will not affect the temperature measurement of the target object.

The advantage of the detection device described in the present application is that the production calibration process is simple, no complicated temperature drift calibration process is required, and calibration experiments under different ambient temperatures are not required. In the production process, it is only necessary to establish a one-to-one mapping relationship between the target net radiation amount and the target real temperature. In actual temperature measurement, the target real temperature can be obtained by directly looking up the mapping table according to the obtained target net radiation amount, which is more conducive to the increase of production.

A third aspect of the present application provides a temperature measurement method for an uncooled infrared focal plane detection device, the detection device is provided with a detector, the detector includes a first imaging area and a second imaging area, the first imaging area is The responsivity of the area and the second imaging area can be adjusted independently, as shown in Figure 4, the temperature measurement method includes:

Step S1: acquiring the thermal radiation received by the first imaging area from the target object and specific components of the detection device;

Step S2: controlling the thermal radiation received by the second imaging area from a specific component of the detection device;

Step S3: Calculate the net radiation amount of the target object received by the first imaging area according to the radiation amount received by the first imaging area and the radiation amount received by the second imaging area.

In the above method, the method further includes: adjusting the responsivity of the second imaging region, so as to map the radiation amount from the uncooled infrared focal plane detection device received by the first imaging region through the radiation amount of the second imaging region.

Wherein, the responsivity of the first imaging area is greater than the responsivity of the second imaging area.

wherein the responsivity of the second imaging region is negatively correlated with the spatial solid angle of the second imaging region; or

The responsivity of the second imaging region is inversely related to the amount of radiation received by the second imaging region.

The pixel material, pixel structure and readout circuit of the first imaging area and the second imaging area are the same, and the first imaging area and the second imaging area respectively have independent control circuits to Responsiveness and responsivity of the second imaging region are adjusted.

Wherein, the first imaging area and the second imaging area are arranged in isolation from each other.

Wherein, the first imaging area and the second imaging area are formed on a substrate spaced apart from each other, and the substrate between the first imaging area and the second imaging area is configured as an isolation structure.

Wherein, the distance between the first imaging area and the second imaging area is greater than or equal to 100 μm.

Wherein, the detection device further includes a blocking structure configured to block the second imaging area, so as to block the second imaging area from receiving thermal radiation from the target object.

Wherein, the detection device further includes a housing configured to accommodate the detector and a controller connected to the detector.

Wherein, the detection device further includes a shutter, and the shielding structure includes a shutter or a partial structure of the casing.

Wherein, the thickness of the shielding structure is 0.2-2mm, and/or

The distance between the blocking structure and the second imaging area is 0.5-1 mm.

Wherein, the shielding structure is arranged in front of the receiving direction of the second imaging area.

Wherein, the resolution of the first imaging area is greater than the resolution of the second imaging area.

The second imaging area is configured as a single pixel, and the amount of radiation received by the second imaging area is the amount of radiation received by a single pixel.

The second imaging area is configured as a pixel array, and the amount of radiation received by the second imaging area is the average amount of radiation received by the pixel array.

The method further includes: acquiring the corresponding relationship data between the net radiation amount and the temperature; and calculating the actual temperature of the target object according to the corresponding relationship data and the net radiation amount.

The detection method described in the present application is based on the detection device described above, and the basic structure and working principle of the detection device can be referred to the relevant content above, which will not be repeated here.

A fourth aspect of the present application further provides a movable platform, wherein the aforementioned detection device can be applied to the movable platform, and the detection device can be installed on the movable platform body of the movable platform.

In certain embodiments, the movable platform includes at least one of an unmanned aerial vehicle, an automobile, a remote-controlled vehicle, and a robot. When the detection device is applied to the unmanned aerial vehicle, the movable platform body is the fuselage of the unmanned aerial vehicle. When the detection device is applied to an automobile, the movable platform body is the body of the automobile. The vehicle may be an autonomous driving vehicle or a semi-autonomous driving vehicle, which is not limited herein. When the detection device is applied to the remote control car, the movable platform body is the body of the remote control car. When the detection device is applied to a robot, the movable platform body is a robot.

Wherein, the movable platform may further include a power system for driving the movable platform body to move. For example, when the movable platform is a vehicle, the power system may be an engine inside the vehicle, which will not be listed here.

The movable platform is equipped with the detection device, so it has all the advantages of the detection device. For example, the detection device can directly detect the radiation brought by the specific structure inside the device through improvement, so as to obtain the target net radiation amount, so that the target Object temperature measurement is more accurate. The detection device has adaptability to the temperature rise process inside the detection device, changes in ambient temperature, and wind blowing.

A fifth aspect of the present application also provides a computer storage medium on which a computer program is stored. One or more computer program instructions may be stored on the computer-readable storage medium, and the computer program includes at least a piece of code that can be executed by a computer to control the computer to perform the aforementioned temperature measurement method .

When the computer program runs, the functions described in the embodiments of the present application (implemented by the processor) and/or other desired functions can be realized, for example, to execute the uncooled infrared focal plane detection device according to the embodiments of the present application In the corresponding steps of the temperature measurement method, various application programs and various data, such as various data used and/or generated by the application program, may also be stored in the computer-readable storage medium.

For example, the computer storage medium may include, for example, a memory card for a smartphone, a storage unit for a tablet computer, a hard disk for a personal computer, read only memory (ROM), erasable programmable read only memory (EPROM), portable compact disk Read only memory (CD-ROM), USB memory, or any combination of the above storage media.

Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above-described example embodiments are exemplary only, and are not intended to limit the scope of the application thereto. Various changes and modifications may be made therein by those of ordinary skill in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Skilled artisans may implement the described functionality using different methods for each particular application, but such implementations should not be considered beyond the scope of this application.

In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the device embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or May be integrated into another device, or some features may be omitted, or not implemented.

In the description provided herein, numerous specific details are set forth. It will be understood, however, that the embodiments of the present application may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

Similarly, it is to be understood that in the description of the exemplary embodiments of the present application, various features of the present application are sometimes grouped together into a single embodiment, FIG. , or in its description. However, this method of application should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as the corresponding claims reflect, the invention lies in the fact that the corresponding technical problem may be solved with less than all features of a single disclosed embodiment. Thus, the claims following the Detailed Description are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment of this application.

It will be understood by those skilled in the art that all features disclosed in this specification (including the accompanying claims, abstract and drawings) and any method or apparatus so disclosed may be used in any combination, except that the features are mutually exclusive. Processes or units are combined. Each feature disclosed in this specification (including accompanying claims, abstract and drawings) may be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise.

Furthermore, those skilled in the art will appreciate that although some of the embodiments described herein include certain features, but not others, included in other embodiments, that combinations of features of different embodiments are intended to be within the scope of the present application within and form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

Various component embodiments of the present application may be implemented in hardware, or in software modules running on one or more processors, or in a combination thereof. Those skilled in the art should understand that a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all functions of some modules according to the embodiments of the present application. The present application can also be implemented as a program of apparatus (eg, computer programs and computer program products) for performing part or all of the methods described herein. Such a program implementing the present application may be stored on a computer-readable medium, or may be in the form of one or more signals. Such signals may be downloaded from Internet sites, or provided on carrier signals, or in any other form.

It should be noted that the above-described embodiments illustrate rather than limit the application, and alternative embodiments may be devised by those skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The application can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In a unit claim enumerating several means, several of these means may be embodied by one and the same item of hardware. The use of the words first, second, and third, etc. do not denote any order. These words can be interpreted as names.

The above is only the specific embodiment of the present application or the description of the specific embodiment, and the protection scope of the present application is not limited thereto. Any changes or substitutions should be included within the protection scope of the present application. The protection scope of the present application shall be subject to the protection scope of the claims.

Claims

An uncooled infrared focal plane detector, characterized in that the detector includes a first imaging area and a second imaging area;

the first imaging area configured to receive thermal radiation of the first object;

the second imaging area configured to receive thermal radiation from a second object, the first object including the second object;

Wherein, the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently.
The uncooled infrared focal plane detector according to claim 1, wherein the first imaging area and the second imaging area have the same pixel material, pixel structure and readout circuit composition, and the first imaging area and the second imaging area have the same composition. An imaging area and the second imaging area have separate control circuits to adjust the responsivity of the first imaging area and the responsivity of the second imaging area, respectively.
The uncooled infrared focal plane detector according to claim 1 or 2, wherein the first imaging area and the second imaging area are arranged in isolation from each other.
The uncooled infrared focal plane detector according to claim 3, wherein the first imaging region and the second imaging region are formed on a substrate spaced apart from each other, and the first imaging region and the second imaging region are spaced apart from each other. The substrate between the second imaging regions is configured as an isolation structure.
The uncooled infrared focal plane detector according to claim 3, wherein the distance between the first imaging region and the second imaging region is greater than or equal to 100 μm.
The uncooled infrared focal plane detector according to claim 1 or 2, wherein the resolution of the first imaging area is greater than the resolution of the second imaging area.
The uncooled infrared focal plane detector according to claim 6, wherein the second imaging area is configured as a single pixel, and the amount of radiation received by the second imaging area is the amount of radiation received by a single pixel .
The uncooled infrared focal plane detector according to claim 6, wherein the second imaging area is configured as a pixel array, and the amount of radiation received by the second imaging area is the average radiation received by the pixel array quantity.
The uncooled infrared focal plane detector according to claim 1 or 2, wherein the responsivity of the first imaging area is greater than the responsivity of the second imaging area.
An uncooled infrared focal plane detection device, characterized in that the uncooled infrared focal plane detection device includes a controller, a shielding structure and a detector, the detector includes a first imaging area and a second imaging area, the a controller is connected to the detector;

the first imaging region configured to receive thermal radiation from a target object and specific components of the uncooled infrared focal plane detection device;

the blocking structure is configured to block the second imaging area to block the second imaging area from receiving thermal radiation from the target object;

The second imaging area is configured to receive thermal radiation from a specific component of the uncooled infrared focal plane detection device, and the responsivity of the first imaging area and the responsivity of the second imaging area can be adjusted independently ;

The controller is configured to calculate the net radiation amount of the target object received by the first imaging region based on the radiation amount received by the first imaging region and the radiation amount received by the second imaging region.
The uncooled infrared focal plane detection device according to claim 10, wherein the controller is further configured to adjust the responsivity of the second imaging area, so as to map the radiation quantity through the second imaging area The amount of radiation received by the first imaging region from the uncooled infrared focal plane detection device.
The uncooled infrared focal plane detection device according to claim 11, wherein the responsivity of the first imaging area is greater than the responsivity of the second imaging area.
The uncooled infrared focal plane detection device according to claim 11, wherein the responsivity of the second imaging region is negatively correlated with the spatial solid angle of the second imaging region; or

The responsivity of the second imaging region is inversely related to the amount of radiation received by the second imaging region.
The uncooled infrared focal plane detection device according to claim 10, wherein the pixel material, pixel structure and readout circuit of the first imaging area and the second imaging area are the same, and the first imaging area and the second imaging area are the same in composition. An imaging area and the second imaging area have separate control circuits to adjust the responsivity of the first imaging area and the responsivity of the second imaging area, respectively.
The uncooled infrared focal plane detection device according to any one of claims 10 to 14, wherein the first imaging area and the second imaging area are arranged in isolation from each other.
The uncooled infrared focal plane detection device according to claim 15, wherein the first imaging region and the second imaging region are formed on a substrate spaced apart from each other, and the first imaging region and the second imaging region are spaced apart from each other. The substrate between the second imaging regions is configured as an isolation structure.
The uncooled infrared focal plane detection device according to claim 15, wherein the distance between the first imaging area and the second imaging area is greater than or equal to 100 μm.
The uncooled infrared focal plane detection device of any one of claims 10 to 14, further comprising a housing configured to house the controller and the detector.
The uncooled infrared focal plane detection device according to claim 18, further comprising a shutter, and the shielding structure comprises a part of the shutter or the casing.
The uncooled infrared focal plane detection device according to any one of claims 10 to 14, wherein the shielding structure has a thickness of 0.2-2 mm, and/or

The distance between the shielding structure and the second imaging area is 0.5-1 mm.
The uncooled infrared focal plane detection device according to any one of claims 10 to 14, wherein the shielding structure is arranged in front of the receiving direction of the second imaging area.
The uncooled infrared focal plane detection device according to any one of claims 10 to 14, wherein the resolution of the first imaging area is greater than the resolution of the second imaging area.
The uncooled infrared focal plane detection device according to claim 22, wherein the second imaging area is configured as a single pixel, and the amount of radiation received by the second imaging area is the amount of radiation received by a single pixel .
The uncooled infrared focal plane detection device according to claim 22, wherein the second imaging area is configured as a pixel array, and the amount of radiation received by the second imaging area is the average radiation received by the pixel array quantity.
The uncooled infrared focal plane detection device according to any one of claims 10 to 14, further comprising a memory configured to store the corresponding data of the net radiation amount and the temperature.
The uncooled infrared focal plane detection device according to claim 25, wherein the controller is further configured to calculate the actual temperature of the target object according to the correspondence data and the net radiation amount.
A temperature measurement method for an uncooled infrared focal plane detection device, characterized in that the temperature measurement method comprises:

The thermal radiation received by the first imaging area from the target object and the specific components of the detection device is obtained, the detection device is provided with a detector, the detector includes a first imaging area and a second imaging area, and the first imaging area is The responsivity of an imaging area and the second imaging area can be adjusted independently;

obtaining thermal radiation received by the second imaging region from a particular component of the detection device;

The net radiation amount of the target object received by the first imaging region is calculated according to the radiation amount received by the first imaging region and the radiation amount received by the second imaging region.
The temperature measurement method according to claim 27, wherein the method further comprises:

The responsivity of the second imaging region is adjusted to map the radiation amount received by the first imaging region from the uncooled infrared focal plane detection device through the radiation amount of the second imaging region.
The temperature measurement method according to claim 28, wherein the responsivity of the first imaging area is greater than the responsivity of the second imaging area.
The temperature measurement method according to claim 28, wherein the responsivity of the second imaging area is negatively correlated with the spatial solid angle of the second imaging area; or

The responsivity of the second imaging region is inversely related to the amount of radiation received by the second imaging region.
The temperature measurement method according to claim 27, wherein the first imaging area and the second imaging area have the same pixel material, pixel structure and readout circuit composition, and the first imaging area and the second imaging area have the same composition. The second imaging areas respectively have separate control circuits to adjust the responsivity of the first imaging area and the responsivity of the second imaging area respectively.
The temperature measurement method according to any one of claims 27 to 31, wherein the first imaging area and the second imaging area are arranged in isolation from each other.
The temperature measurement method according to claim 32, wherein the first imaging area and the second imaging area are formed on a substrate spaced apart from each other, and the first imaging area and the second imaging area are formed on a substrate. The substrate between regions is configured as an isolation structure.
The temperature measurement method according to claim 32, wherein the distance between the first imaging area and the second imaging area is greater than or equal to 100 μm.
The temperature measurement method according to any one of claims 27 to 34, wherein the detection device further comprises a shielding structure configured to shield the second imaging area to prevent the second imaging area from receiving Thermal radiation from the target object.
The temperature measurement method of claim 35, wherein the detection device further comprises a housing configured to accommodate the detector and a controller connected to the detector.
The temperature measurement method according to claim 36, wherein the detection device further comprises a shutter, and the shielding structure comprises a part of the shutter or the casing.
The temperature measurement method according to claim 35, wherein the shielding structure has a thickness of 0.2-2 mm, and/or

The distance between the shielding structure and the second imaging area is 0.5-1 mm.
The temperature measurement method according to any one of claims 35 to 38, wherein the shielding structure is arranged in front of the receiving direction of the second imaging area.
The temperature measurement method according to any one of claims 27, wherein the resolution of the first imaging area is greater than the resolution of the second imaging area.
The temperature measurement method according to claim 40, wherein the second imaging area is configured as a single pixel, and the amount of radiation received by the second imaging area is the amount of radiation received by a single pixel.
The temperature measurement method according to claim 40, wherein the second imaging area is configured as a pixel array, and the amount of radiation received by the second imaging area is an average amount of radiation received by the pixel array.
The temperature measurement method according to claim 27, wherein the method further comprises:

obtaining the corresponding relationship data between the net radiation amount and the temperature;

The actual temperature of the target object is calculated according to the correspondence data and the net radiation amount.
A movable platform, characterized in that the movable platform comprises:

ontology;

The uncooled infrared focal plane detection device according to any one of claims 10-26, wherein the detection device is arranged on the body.
A computer-readable storage medium, characterized in that, the computer-readable storage medium stores a computer program, and the computer program includes at least one piece of code, and the at least one piece of code can be executed by a computer, so as to control the computer to execute as claimed in the claim. The temperature measurement method described in any one of requirements 27-43.