WO2022184092A1

WO2022184092A1 - Optical anti-shake photosensitive component and assembly method therefor, and corresponding camera module

Info

Publication number: WO2022184092A1
Application number: PCT/CN2022/078791
Authority: WO
Inventors: 方银丽; 阙嘉耀; 王明珠; 黄桢; 戎琦; 卞强龙; 何艳宁; 钱佳敏; 叶林敏; 姚施琴; 冯阳峰; 俞勤文
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2021-03-04
Filing date: 2022-03-02
Publication date: 2022-09-09
Also published as: CN116965046A

Abstract

The present invention relates to an optical anti-shake photosensitive component, comprising: a photosensitive chip; a chip carrier, which comprises a carrier portion and at least two cantilever portions, the carrier portion being adapted to directly or indirectly carry the photosensitive chip, the cantilever portions being formed by extending outwards from a side surface of the carrier portion, and at least one of the at least two cantilever portions being provided with a piezoelectric drive rod adapting hole; and a piezoelectric drive component, which comprises a fixing portion, a piezoelectric element mounted on the fixing portion, and a drive rod with one end thereof fixed to the piezoelectric element, the drive rod passing through the piezoelectric drive rod adapting hole of the at least one cantilever portion and being movably connected to the cantilever portion. The present invention further provides an assembly method for the optical anti-shake photosensitive component. The present invention has the advantages of having a simple structure, no electromagnetic interference, etc. In addition, two sides of the chip carrier are both supported and thus has good balance, which helps to ensure that the moving direction of the photosensitive chip is limited on an xoy plane.

Description

Optical anti-shake photosensitive assembly and assembly method thereof, and corresponding camera module

Related applications

This application requires a Chinese patent application entitled "Optical anti-shake photosensitive assembly and its assembly method", filed on March 4, 2021 with the application number 202110241333.3, entitled "Camera Module", filed on March 23, 2021 The Chinese patent application filed with the application number 202110308614.6, and the Chinese patent application with the application number 202110308580.0 filed on March 23, 2021, entitled "Camera Module Suitable for Super-Resolution Shooting", are entitled to the priority of This incorporates by reference the entire contents of the aforementioned application.

technical field

The present invention relates to the technical field of camera modules, in particular, the present invention relates to an optical anti-shake photosensitive assembly used in a camera module and an assembling method thereof, the present invention also relates to a camera module with improved circuit board structure, and a suitable camera module. A camera module that shoots at super-resolution.

Background technique

Mobile phone camera module is one of the important components of smart equipment, and its application scope and application volume in the market are increasing. With the advancement of technology, intelligence is being advocated in both work and life. One of the important prerequisites for realizing intelligence is to be able to achieve good interaction with the external environment. An important way to achieve good interaction is visual perception. The main dependency is the camera module. It can be said that the camera module has transformed from an obscure intelligent equipment accessory to one of the key components of intelligent equipment.

As one of the standard configurations of intelligent electronic terminal equipment (hereinafter sometimes referred to as intelligent terminal), the camera module's form and function are also constantly changing with the needs of the intelligent terminal and the market. The development trend of intelligent terminals has been developing towards the direction of high integration and thinning, while the camera module is constantly adding functions. The addition of some functions will increase the volume of the camera module to a certain extent. In the design of camera modules, the original installation space of modules with fewer functions in the past has become more and more difficult to meet the requirements. Specifically, the design of camera modules is constantly innovating, for example, from the original single-camera module to dual-camera and multi-camera modules; from the original single-line optical path design to the design with complex turning optical paths; Single focal length, small-range zoom capability developed to large-range optical zoom and so on. These developments continue to expand the shooting capability of the camera module, but also place higher requirements on the pre-installation space inside the smart terminal (such as a smart phone). At present, the pre-installation space inside the smart terminal has become more and more difficult to meet the development requirements of the camera module.

In order to reduce the requirement for pre-installation space, a retractable telescopic camera module has been proposed. A telescopic camera module (sometimes simply referred to as a telescopic module herein) has a multi-layered sleeve arranged coaxially, and the lenses of the lens group can be respectively installed in different sleeves. In the retracted state, the inner sleeve can be accommodated inside the outer sleeve, thereby reducing the occupied volume of the camera module, and when the sleeve module is installed inside the smart terminal as a rear camera module, the smart The surface of the camera module installation area on the back of the terminal may be substantially flush. In the extended state, the inner sleeve (or outer sleeve) can be extended from the original position, so as to adjust the axial position of the lens in the sleeve in the optical system (here, the axial position refers to the position in the camera module) position in the direction of the optical axis), which plays the role of optical zooming or increasing the back focal distance of the optical system. Among them, for the telephoto module, it often requires a large back focus distance, which is one of the important reasons why the telephoto module occupies a large space. For the telescopic sleeve structure, at least one of the sleeves can move in the direction along the optical axis relative to the other sleeves, so that it can drive the lens group away from the photosensitive chip, so it can increase the optical system. The effect of focal distance. However, in the existing sleeve-type modules, it is often necessary to manufacture a relatively complex transmission structure on the side wall of the sleeve. For example, a sleeve-type module solution is to set gears on the outside of the outermost sleeve, and the side walls of the sleeve (the inner and/or outer sides of the side walls) need to make gear grooves that mesh with the gears, In this way, the sleeve can be rotated by rotating the gear, so that the sleeve spirally rises (the rising direction is the direction of extending along the optical axis) to be away from the photosensitive chip, and the imaging optical path required for shooting (for example, the telephoto module needs to be constructed) is constructed. imaging optical path). Although the above-mentioned telescopic sleeve structure can be switched between two states of contraction and extension, its transmission structure is complex, and the side wall of the sleeve needs to be processed with a precise mechanical structure, so its reliability may be insufficient (eg, impact resistance). In addition, since the side wall of the sleeve needs to be processed with a precise mechanical structure, the side wall of the sleeve needs a large structural strength, which makes it difficult to reduce the thickness of the side wall of the sleeve, which is not conducive to reducing the lateral size of the camera module. The lateral dimension in this paper refers to the radial dimension of the camera module, and the radial direction of the camera module refers to the direction perpendicular to the optical axis of the camera module. The longitudinal dimension of the camera module is the dimension in the direction of the optical axis of the camera module, that is, the height of the camera module.

There are also some non-geared telescopic modules in the prior art, for example CN200910056990.X discloses a telescopic module based on pneumatic drive. In this solution, the sleeve can be driven to ascend (extend) or descend (contract) by changing the air pressure at the bottom of the sleeve, but the gas accommodating cavity used to push the sleeve to ascend or descend needs to occupy the size in the height direction of the module. And this solution may have higher requirements on the air tightness of the internal structure of the module.

In general, the existing sleeve-type modules often need to process a complex transmission structure on the sidewall of the sleeve, which leads to hidden dangers in terms of reliability. In addition, when the sleeve is in an extended state, part of the transmission structure may be exposed, which may lead to an unsightly appearance of the terminal device and affect the consumer experience and market value. If the transmission structure of the side wall of the sleeve is to be hidden, the extension distance of the module may be sacrificed, which will negatively affect the magnification of the telephoto module. For the sleeve-type modules driven by air pressure, there are uncertainties in the higher air tightness requirements, the miniaturization of the cylinder, and the reliability (such as impact resistance).

Therefore, there is an urgent need for a retractable camera module with high reliability, long extension distance, simple driving structure and beautiful appearance.

On the other hand, in the existing camera module, the anti-shake function is usually set at the lens end, and with the improvement of the lens quality (for example, glass lens instead of plastic lens, the use of periscope lens, etc. will increase the lens quality) , which will lead to insufficient driving force provided by the traditional motor, and also affect the accuracy of anti-shake adjustment. As for the sleeve-type lens assembly (ie, the assembly formed by installing the optical lens on the sleeve-type optical actuator), its mass will be further increased. One solution is to solve the problem of anti-shake during the shooting process of the module by driving the movement of the photosensitive chip, which can reduce the driving force requirement for the anti-shake driving element. At the same time, because the telescopic lens assembly itself does not need to be considered Therefore, the structure of the telescopic lens assembly can be simplified and the miniaturization of the camera module can be facilitated.

To drive the photosensitive chip to move, it is necessary to implement the OIS function (ie, the optical image stabilization function) in the photosensitive assembly, which will lead to a more complicated structure inside the photosensitive assembly. How to provide sufficient driving force for the OIS photosensitive assembly, how to ensure the reliability of the OIS photosensitive assembly, and how to reduce the size of the OIS photosensitive assembly (especially the size in the height direction) are all urgent problems to be solved at present.

Further, the telescopic camera module has a retractable function, so it has the potential to integrate various functions such as optical image stabilization, auto focus, optical zoom, etc. However, to add these functions, it must be implemented in the circuit board of the camera module. Various functional circuits corresponding to the above functions. This will make the design of the circuit board more difficult. Specifically, the conventional circuit board in the prior art is usually arranged on the back of the photosensitive chip, and the circuit board and the photosensitive chip are supported against each other to improve the structural strength. The functional circuit and motor driving circuit of the photosensitive chip for imaging are usually located in implemented in this board. On the other hand, another conventional circuit board in the prior art is a through-hole circuit board, and the photosensitive chip can be installed in the central through hole of the circuit board. This design helps to reduce the thickness of the photosensitive component, thereby reducing the The height of the camera module (referring to the dimension in the direction of the optical axis).

However, when there are many functional circuits to be implemented, the above two types of conventional circuit boards face many difficulties. Specifically, a. When there are many functional circuits to be implemented, the circuit board needs a larger wiring area, and how to realize the miniaturization of the device is a major difficulty. b. The anti-shake movement, focus movement and sleeve expansion and contraction of the camera module may need to be realized by multiple motors (optical actuators) at different positions, and may also need to be arranged in multiple different positions. Hall elements, etc. Auxiliary devices, these motors and auxiliary devices all need to be connected by wires. How to connect the wires to different positions in the camera module is also a major difficulty in design. If the wires are too messy, the reliability of the product will easily be reduced. c. If the traditional design is adopted, since the circuit of the circuit board needs to be greatly increased, the weight of the circuit board itself may lead to an increase in the driving force of the moving optical element, making it difficult to miniaturize the driving element, thereby increasing the total volume of the camera module. d. The line itself may pull or hinder the anti-shake movement, focus movement or sleeve expansion and contraction of the camera module, resulting in an increase in the driving force required to move the optical element, making it difficult to miniaturize the driving element. e. Finally, because the line itself may pull or hinder the anti-shake movement or focus movement, the movement accuracy of the optical components is reduced, which in turn leads to a reduction in the image quality.

To sum up, when a single camera module integrates more functions (such as anti-shake movement, focus movement, or telescoping and other functions), the traditional circuit board is difficult to apply. Circuit layout solution for functional camera module size.

On the other hand, in recent years, in the field of camera modules, a super-resolution shooting method based on OIS has emerged. For example, Google proposes to use the user's natural jitter to achieve pixel shift shooting through small displacements, that is, through sub-pixel shift, to fill the color channel of the pixel, so that a single pixel can obtain multiple true color channels when shooting The information is subsequently fitted to the same presented image information through an algorithm, so as to achieve a high resolution of a single image. In traditional image shooting, there is only one color channel information in a single pixel, and other color channel information is filled by interpolation. For example, the pixel is a 4x4 regular format. The other three color channel information is filled by the color channel information on the periphery of the pixel, but this method will produce moiré fringes, which will produce blur or mosaic when the image is enlarged. Specifically, in a current camera module, a single pixel generally has four color channels, and the color arrangement is generally RGGB (ie, red, green, green, and blue). Of course, there are other color arrangements such as RWGB, these are not limited. Super-resolution shooting can overcome some of the defects of traditional interpolation algorithms for image shooting. Super-resolution photography is mainly: When the object is not moving, the camera element is displaced relative to the subject at the pixel level by means of vibration, and four complete pixel-level movements are performed to achieve four times within a single pixel. Color channel real color information collection, that is, through the continuous shooting of multiple frames of images, the image information of multiple color channels is filled into each corresponding pixel, thereby realizing the shooting of super-resolution images. The pixel-level movement trajectory is a "mouth"-shaped trajectory, that is, three pixel-level offset images are supplemented on the basis of the original image information, and a high-resolution composite image is obtained through four pairs of images. .

The above-mentioned super-resolution shooting scheme can theoretically synthesize high-quality images, but in practical applications, it is limited by the hardware conditions of the camera module. For example, in the prior art, the movement accuracy of the movement of the lens driven by the optical anti-shake mechanism may be insufficient, which makes it difficult to accurately realize the pixel-level (or sub-pixel) shift of the optical system. However, if the movement position and attitude accuracy of the lens is insufficient, it may cause distortion in the composite image captured by super-resolution.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies of the prior art and provide a solution for an optical anti-shake photosensitive component with large driving force, high reliability and small size.

Another object of the present invention is to overcome the deficiencies of the prior art and provide a circuit layout solution that is helpful for reducing the size of the multi-function camera module.

Another object of the present invention is to overcome the deficiencies of the prior art and provide a solution for a camera module with high imaging quality suitable for super-resolution shooting.

In order to solve the above-mentioned first technical problem, the present invention provides an optical anti-shake photosensitive assembly, which includes: a photosensitive chip; a chip carrier, which includes a carrier part and at least two cantilever parts, the carrier part is suitable for direct or indirect The photosensitive chip is mounted on the ground, and the cantilever portion is formed by extending outward from the side surface of the carrier portion; at least one cantilever portion of the at least two cantilever portions has a piezoelectric drive rod fitting hole; and A piezoelectric drive assembly, comprising a fixed part, a piezoelectric element mounted on the fixed part, and a driving rod fixed to the piezoelectric element at one end, the driving rod passing through the piezoelectric element of at least one of the cantilever parts The driving rod is adapted to the hole and is movably connected with the cantilever part, wherein the central axis of the driving rod is parallel to the photosensitive surface of the photosensitive chip.

Wherein, the chip carrier includes a first chip carrier and a second chip carrier, the piezoelectric driving component includes a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are perpendicular to each other; the photosensitive chip is fixed on the The carrier portion of the first chip carrier, the fixing portion of the first piezoelectric driving component is fixed to the carrier portion of the second chip carrier.

Wherein, the cantilever part includes a driving-side cantilever part and a driven-side cantilever part, the driving-side cantilever part has the piezoelectric driving rod fitting hole, and the driven-side cantilever part has a guide rod bracket.

Wherein, the photosensitive assembly further includes an auxiliary guide structure, and the auxiliary guide structure includes a guide rod, and the guide rod passes through the guide rod bracket and is movably connected with the guide rod bracket, so that the guide rod bracket can move along the guide rod bracket. move with the guide rod.

Wherein, the carrier portion of the first chip carrier is a first carrier portion, the first chip carrier has a first driving side and a first driven side, the first driving side and the first driving side The driven side is two opposite sides of the first carrier part, and the driving side cantilever part and the driven side cantilever part of the first chip carrier A driven side is formed by extending outward; the carrier portion of the second chip carrier is a second carrier portion, the second chip carrier has a second driving side and a second driven side, the first The two driving sides and the second driven side are two opposite sides of the second carrier part, and the driving side cantilever part and the driven side cantilever part of the second chip carrier are respectively separated from the The second driving side and the second driven side are formed to extend outward; and the first driving side, the second driving side, the first driven side and the second driven side are surrounded by around the photosensitive chip.

Wherein, the adapting hole of the piezoelectric driving rod is formed by a bending bearing part and a flat plate part, the cross section of the bending bearing part is "V" shape, and the driving rod is placed in the bending part. In the bearing portion, the flat plate portion covers the opening of the bending bearing portion.

Wherein, the driven side cantilever part includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole.

The guide rod includes a first guide rod, the driven side cantilever portion of the first chip carrier is slidably connected to the first guide rod, and two ends of the first guide rod are fixed to the first guide rod. the carrier part of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric driving component.

Wherein, the photosensitive assembly further includes a housing base and a support seat, the housing base and the support seat encapsulate the photosensitive chip, the chip carrier and the piezoelectric drive assembly inside; the support seat The top of the base is suitable for installing the lens assembly; the center of the support base has a light-through hole.

Wherein, the guide rod further includes a second guide rod, the driven side cantilever part of the second chip carrier is slidably connected with the second guide rod, and the two ends of the second guide rod are fixed on the the housing base and/or the support base; the guiding direction of the second guide rod is parallel to the guiding direction of the driving rod of the second piezoelectric driving assembly.

Wherein, the fixing portion of the second piezoelectric driving assembly is fixed on the housing base and/or the support base.

Wherein, the first carrier portion is in the shape of a frame, and the photosensitive chip is attached to the peripheral edge region of the first carrier portion, and the photosensitive region of the photosensitive chip is placed at the window in the center of the first carrier portion.

Wherein, the second carrier portion is in the shape of a frame, and the photosensitive chip and the first carrier portion are arranged at a window in the center of the second carrier portion.

Wherein, the driving rod of the first piezoelectric driving assembly and the driving rod of the second piezoelectric driving assembly are arranged on the same reference plane, and the reference plane is parallel to the photosensitive surface of the photosensitive chip flat.

Wherein, the photosensitive assembly further includes a module circuit board attached to the photosensitive chip, the module circuit board is a foldable circuit board, and the foldable circuit board includes a plurality of hard boards and A soft board between two hard boards.

Wherein, the module circuit board has at least two bends, and the at least two bends include at least one bend in the vertical direction and at least one bend in the horizontal direction.

Wherein, the photosensitive assembly further includes a housing base and a support seat, the housing base and the support seat encapsulate the photosensitive chip, the chip carrier and the piezoelectric drive assembly inside; the support seat The top of the module is suitable for installing a lens assembly; the support seat serves as an upper cover of the photosensitive assembly, and the upper cover has a lead hole; the free end of the module circuit board is drawn out from the lead hole of the support seat.

According to another aspect of the present application, a method for assembling an optical anti-shake photosensitive assembly is also provided, which includes the following steps: 1) mounting a photosensitive chip on a first chip carrier, where the first chip carrier includes a first carrier portion and two first cantilever parts, the first cantilever parts are formed by extending outward from the side of the first carrier part, and the two first cantilever parts are respectively located on two opposite sides of the first carrier part side; 2) a first piezoelectric drive assembly or a first guide rod is installed in the first cantilever part, the first piezoelectric drive assembly includes a fixed part, a piezoelectric element mounted on the fixed part and one end fixed For the first driving rod of the piezoelectric element, the first driving rod passes through the first cantilever part and is movably connected with the first cantilever part, wherein the central axis of the first driving rod is parallel to the The photosensitive surface of the photosensitive chip; wherein, at least one of the two first cantilever parts is loaded into the first piezoelectric drive assembly; 3) the first chip carrier is loaded into the second chip carrier ; Wherein, the second chip carrier comprises a second carrier part and two second cantilever parts, the second cantilever part is formed by extending outward from the side of the second carrier part, the two second cantilever parts are respectively located on two opposite sides of the second carrier part; the fixing part of the first piezoelectric component is fixed to the second carrier part, and/or the two ends of the first guide rod are 4) A second piezoelectric drive assembly or a second guide rod is installed in the second cantilever part, and the second piezoelectric drive assembly includes a fixed part, which is installed on the fixed part. The piezoelectric element of the part and the second driving rod whose one end is fixed to the piezoelectric element, the second driving rod passes through the second cantilever part and is movably connected with the second cantilever part, wherein the second driving rod The central axis of the rod is parallel to the photosensitive surface of the photosensitive chip, and the central axes of the second driving rod and the first driving rod are perpendicular to each other; 5) Place the photosensitive chip, the first chip carrier, the The movable chip assembly of the second chip carrier, the first piezoelectric drive assembly, the second piezoelectric drive assembly, the first guide rod, and the second guide rod is put into an upside-down support seat ; and 6) mounting the housing base on the upside-down support base, so as to encapsulate the movable chip assembly in the accommodating space between the support base and the housing base.

Wherein, the step 1) also includes: assembling the photosensitive chip and the module circuit board into a photosensitive member, and installing the photosensitive member on the first chip carrier; between the step 5) and the step 6) It also includes the steps of: 51) arranging the module circuit board, and pulling the free end of the module circuit board out of the lead hole or avoidance groove of the support base; wherein, the module circuit board is foldable A circuit board, the foldable circuit board includes a plurality of hard boards and a flexible board connected between the plurality of hard boards; the modular circuit board has at least two bends, and the at least two bends It includes at least one bend in the vertical direction and at least one bend in the horizontal direction.

Further, in order to solve the above-mentioned second technical problem, the present application also provides a camera module, which includes: a lens assembly, which includes an actuator housing and an optical lens located in the actuator housing; The assembly includes a photosensitive chip, a support base, a housing base, an x-axis piezoelectric drive assembly and a y-axis piezoelectric drive assembly, wherein the x-axis and the y-axis are parallel to the photosensitive surface of the photosensitive chip, and the x-axis and the y-axis are parallel to the photosensitive surface of the photosensitive chip. The y-axes are perpendicular to each other; the support base is installed above the housing base, and the support base and the housing base connect the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly packaged inside, the top surface of the support seat has lead holes or avoidance grooves, the lens assembly is mounted on the top of the support seat; a first circuit board is attached to the photosensitive chip, and the first circuit The board includes a main body part and a second connection band; and a second circuit board, which includes a relay circuit board, the relay circuit board is supported on the top surface of the support seat, and the x-axis piezoelectric drive assembly and all the The piezoelectric elements of the y-axis piezoelectric drive assembly are respectively drawn out from the lead holes or the avoidance grooves through first connection strips, the first connection strips are fixed and electrically connected to the surface of the relay circuit board, and are connected to the surface of the relay circuit board. The first connecting belt and the first circuit board are separated inside the photosensitive assembly.

Wherein, the second connecting strip includes at least one vertical bending part and at least one horizontal bending part, wherein the vertical bending part is the normal line of the surface of the flexible board which is located on the vertical plane before and after bending a bending part, the horizontal bending part is a bending part where the normal line of the surface of the flexible board is located on the horizontal plane before and after bending; the second circuit board further includes a first expansion part and a second expansion part, the One side of the relay circuit board is connected to the first expansion part through a vertical bending part, and the first expansion part is connected to the second expansion part through a horizontal bending part; the first expansion part Both the first part and the second expansion part bear against the outer side surface of the actuator housing.

Wherein, at least a part of the electronic components are arranged on the outer surface of the second expansion part.

Wherein, the first circuit board further includes a third expansion part and a fourth expansion part located outside the actuator housing, and the third expansion part is connected to the photosensitive sensor through one of the horizontal bending parts The second connecting strip inside the assembly, the fourth expansion part is connected to the third expansion part through another horizontal bending part; the fourth expansion part and the second expansion part are located in the the same side of the actuator housing, and the fourth extension is fixed and electrically connected to the second extension.

Wherein, the fourth extension part and the second extension part are buckled together by a connector.

Wherein, the second expansion part is also connected to a general connecting strip through one of the vertical bending parts, and the general connecting strip has a general connector suitable for electrical connection with the outside world.

Wherein, the back surfaces of the first expansion part and the second expansion part are attached to two adjacent outer sides of the actuator housing.

Wherein, the second extension part includes a first sub-circuit board, a second sub-circuit board and one of the horizontal bending parts, and the first sub-circuit board and the second sub-circuit board pass through the horizontal bending part. The bent parts are connected and folded together, the second sub-circuit board is located between the first sub-circuit board and the actuator housing, and at least a part of the electronic components are mounted on the outer surface of the first sub-circuit board , the first sub-circuit board is a hard board, and the second sub-circuit board is a hard board or a flexible board.

Wherein, the third expansion part bears against the outer side surface of the actuator housing.

Wherein, the support seat is formed by an insert injection molding process, wherein the support seat contains a metal sheet for the embedded injection molding process.

Wherein, the lens assembly further includes an autofocus driving device, an optical anti-shake driving device or a zoom driving device for driving the movement of the optical lens, and the autofocus driving device, the optical anti-shake driving device or the zoom driving device is located in the In the cavity between the actuator housing and the top surface of the support seat, the lead wires of the autofocus driving device, the optical anti-shake driving device or the zoom driving device are connected to the transfer circuit board.

Wherein, the lens assembly further includes a vertical piezoelectric drive assembly, the axis of the drive shaft of the vertical piezoelectric drive assembly is perpendicular to the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is mounted on the at least one of the four corner regions of the top surface of the support seat; the moving part of the vertical piezoelectric drive assembly is integrated with the optical lens to drive the optical lens to extend or retract the actuation The piezoelectric element of the vertical piezoelectric drive assembly is connected to the relay circuit board through a lead wire.

Wherein, the lens assembly is a sleeve-type lens assembly, and the sleeve-type lens assembly includes a sleeve assembly, the actuator housing, and the optical lens mounted on the sleeve assembly; the sleeve The cartridge assembly includes a plurality of nested single-piece sleeves, wherein any two adjacent single-piece sleeves are connected by a vertical piezoelectric drive assembly, and the axis of the drive shaft of the vertical piezoelectric drive assembly is perpendicular to the the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is installed on the bottom of the single sleeve located on the lower layer, and the moving part of the vertical piezoelectric drive assembly is connected with the piezoelectric element located on the upper layer. The bottoms of the single-piece sleeves are connected as a whole; the lead wires connecting the piezoelectric elements of the vertical piezoelectric driving components of the adjacent single-piece sleeves are fixed and electrically connected to the transfer circuit board.

Wherein, each of the single-piece sleeves has a corresponding sleeve circuit board, and the sleeve circuit board includes a bearing portion and a lead portion; the single-piece sleeve includes a cylinder wall and a bottom plate, and each of the single-piece sleeves has a corresponding circuit board. A sleeve circuit board support is arranged in the sleeve, the bottom of the sleeve circuit board support is integrated with the bottom plate of the corresponding single sleeve, and the top of the sleeve circuit board support is penetrated by a through hole the bottom plate of the single sleeve located on the upper layer; the bearing part of the sleeve circuit board is supported against the sleeve circuit board bracket; the lead part is a foldable circuit board, and is When the sleeve assembly is in an extended state, the lead part is unfolded and suspended, and the lead part passes through the bottom plate of the single sleeve and is electrically connected to the sleeve of the next layer of the single sleeve The circuit board is either electrically connected to the relay circuit board.

Wherein, for each of the single-piece sleeves, a Hall element is installed on the top of the circuit board support, and the circuit board of the sleeve is electrically connected with the Hall element.

Wherein, for each of the single-piece sleeves, the sleeve circuit board further has a third connecting belt, and the third connecting belt bears against the upper surface of the bottom plate of the single-piece sleeve, so The third connecting strip is used to connect the piezoelectric element of the vertical piezoelectric driving assembly mounted on the single sleeve, or to connect the sleeve circuit board of the single sleeve of the next layer.

Wherein, an IC element for sensing the Hall element is mounted on the second extension part.

Wherein, the driving circuit of the piezoelectric driving component is arranged in the second circuit board, and the working circuit of the photosensitive chip is arranged in the first circuit board.

Wherein, the photosensitive assembly further includes a chip carrier, which includes a carrier part and at least two cantilever parts, the carrier part is suitable for directly or indirectly carrying the photosensitive chip, and the cantilever part is formed from the side of the carrier part formed by extending outward; at least one cantilever part of the at least two cantilever parts has a piezoelectric drive rod adapter hole; the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are both horizontal A piezoelectric drive assembly is provided, which includes a fixed part, a piezoelectric element mounted on the fixed part, and a driving rod with one end fixed to the piezoelectric element, the driving rod passing through the at least one of the cantilever parts. The piezoelectric driving rod fits into the hole and is movably connected with the cantilever part, wherein the axis of the driving rod is parallel to the photosensitive surface of the photosensitive chip.

Wherein, the chip carrier includes a first chip carrier and a second chip carrier, the piezoelectric driving component includes a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are perpendicular to each other; the photosensitive chip is fixed on the the carrier part of the first chip carrier, the fixing part of the first piezoelectric driving component is fixed on the carrier part of the second chip carrier; the cantilever part includes a driving side cantilever part and a driven part a side cantilever part, the driving-side cantilever part has the piezoelectric driving rod fitting hole, and the driven-side cantilever part has a guide rod bracket; the photosensitive assembly further includes an auxiliary guide structure, and the auxiliary guide structure includes The guide rod passes through the guide rod bracket and is movably connected with the guide rod bracket, so that the guide rod bracket can move along the guide rod.

Further, in order to solve the above-mentioned third technical problem, the present application also provides a camera module suitable for super-resolution shooting, which includes: a lens assembly; a photosensitive assembly, which includes a photosensitive chip and a driving device, the driving The device is used to drive the photosensitive chip to move in the x-axis direction and the y-axis direction, wherein both the x-axis and the y-axis are coordinate axes parallel to the photosensitive surface of the photosensitive chip, and the x-axis and the y-axis are both coordinate axes parallel to the photosensitive surface of the photosensitive chip. The y-axes are perpendicular to each other; the first control unit is used to control the driving signal applied to the driving device to control the super-resolution shooting movement route of the photosensitive chip on the xoy plane; the super-resolution shooting The moving route includes a plurality of super-resolution offsets, and after each super-resolution offset is performed, the photosensitive chip is moved to an image sample collection position; wherein, each super-resolution offset makes the photosensitive chip The photosensitive pixel unit is moved along the xoy plane to a pixel position where the super-resolution image is mapped on the image plane; and a data processing unit, which is used for storing the photosensitive chip at a plurality of the image sample collection positions. The collected image samples are synthesized into super-resolution images.

Wherein, the photosensitive area of the photosensitive chip includes a plurality of macro pixels, and each macro pixel includes a plurality of monochromatic photosensitive pixel units of different colors; the super-resolution offset of the photosensitive chip is suitable for converting the macro pixels One of the single-color photosensitive pixel units is moved to the position of the other single-color photosensitive pixel unit.

Wherein, the moving route satisfies: for any pixel position mapped on the image plane by the super-resolution image, the single-color photosensitive pixel unit of each color is moved to the pixel position at least once.

Wherein, in the macro pixels of the photosensitive chip, a plurality of the monochromatic photosensitive pixel units are arranged in a rectangle or in a triangle.

Wherein, the resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the movement amount of the super-resolution offset is smaller than the distance between the adjacent photosensitive pixel units of the photosensitive chip .

Wherein, the resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the movement amount of the super-resolution offset is smaller than the spacing between the adjacent macro pixels of the photosensitive chip.

Wherein, the driving device includes a piezoelectric driving component, and the piezoelectric element of the piezoelectric driving component includes a first type piezoelectric material layer and a second type piezoelectric material layer, the first type piezoelectric material layer and the The second type of piezoelectric material layer is stacked to form the piezoelectric element, the first type of piezoelectric material layer is configured to be suitable for driving the moving part to move a first distance upon a single activation, and the first type of piezoelectric material layer is a distance is the set distance of the super-resolution offset; the second type of piezoelectric material layer is configured to be adapted to drive the moving part to move the second distance upon a single activation, the The second distance is greater than the first distance.

Wherein, the driving device includes a piezoelectric driving component; the first control unit is further configured to: control the amplitude of the driving voltage of the piezoelectric driving component or control the single activation time thereof to make the photosensitive The single moving distance of the chip is the distance shifted by the super-resolution.

Wherein, the driving device is a piezoelectric driving device, and the piezoelectric driving device includes: a chip carrier, each chip carrier includes a carrier part and at least two cantilever parts, and the carrier part is suitable for directly or indirectly carrying the A photosensitive chip, the cantilever portion is formed by extending outward from the side surface of the carrier portion; at least one cantilever portion of the at least two cantilever portions has a piezoelectric drive rod fitting hole; and a piezoelectric drive assembly , which comprises a fixed part, a piezoelectric element mounted on the fixed part, and a driving rod with one end fixed to the piezoelectric element, the driving rod passing through the piezoelectric driving rod of at least one of the cantilever parts to fit The hole is movably connected with the cantilever part, so that the chip carrier can move along the driving rod, and the guiding direction of the driving rod is parallel to the photosensitive surface of the photosensitive chip. Wherein, the chip carrier includes a first chip carrier and a second chip carrier, and the piezoelectric driving component includes a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are the x-axis direction and the y-axis direction respectively. An electric drive assembly; the photosensitive chip is fixed on the carrier part of the first chip carrier, and the fixed part of the first piezoelectric drive assembly is fixed on the carrier part of the second chip carrier.

Wherein, the cantilever part includes a driving-side cantilever part and a driven-side cantilever part, the driving-side cantilever part has the piezoelectric driving rod fitting hole, and the driven-side cantilever part has a guide rod bracket; the The photosensitive assembly further includes an auxiliary guide structure, the auxiliary guide structure includes a guide rod, the guide rod passes through the guide rod bracket and is movably connected with the guide rod bracket, so that the guide rod bracket can move along the guide rod bracket. Rod moves.

Wherein, the carrier portion of the first chip carrier is a first carrier portion, and the cantilever portion of the first chip carrier includes one of the drive-side cantilever portion and the driven-side cantilever portion, The driving-side cantilever portion and the driven-side cantilever portion are formed to extend outward from opposite two side surfaces of the first carrier portion.

Wherein, the carrier portion of the second chip carrier is a second carrier portion, and the cantilever portion of the second chip carrier includes one of the drive-side cantilever portions and the driven-side cantilever portion, The driving-side cantilever portion and the driven-side cantilever portion are formed to extend outward from opposite two side surfaces of the second carrier portion.

Wherein, the driven-side cantilever portion includes at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through-hole; the driven-side cantilever portion of the first chip carrier is connected to the A first guide rod is slidably connected, and two ends of the first guide rod are fixed on the carrier part of the second chip carrier; the guiding direction of the first guide rod is the same as that of the first piezoelectric drive assembly The guiding directions of the drive rods are parallel.

Wherein, the photosensitive assembly further includes a housing base and a support seat, the housing base and the support seat encapsulate the photosensitive chip, the chip carrier and the piezoelectric drive assembly inside; the support seat The top of the lens assembly is suitable for mounting.

Wherein, the driven side cantilever portion of the second chip carrier is slidably connected to a second guide rod, and two ends of the second guide rod are fixed to the housing base and/or the support seat; The guiding direction of the second guide rod is parallel to the guiding direction of the driving rod of the second piezoelectric driving assembly; the fixing portion of the second piezoelectric driving assembly is fixed to the housing base and/or or the support base.

Wherein, the first carrier portion is in the shape of a frame, and the photosensitive chip is attached to the peripheral edge area thereof, and the photosensitive area of the photosensitive chip is placed at the window in the center of the first carrier portion; the second carrier portion is in the shape of a frame. frame-shaped, the photosensitive chip and the first carrier part are arranged at the window in the center of the second carrier part; the driving rod of the first piezoelectric driving component and the The driving rods are arranged on the same reference plane, and the reference plane is a plane parallel to the photosensitive surface of the photosensitive chip.

Wherein, the photosensitive assembly further includes a module circuit board attached to the photosensitive chip, the module circuit board is a foldable circuit board, and the foldable circuit board includes a plurality of hard boards and A flexible board between two rigid boards; the modular circuit board has at least two bends, and the at least two bends include at least one vertical bend and at least one horizontal bend.

Wherein, the drive device is an electromagnetic drive device, and the electromagnetic drive device includes: an electromagnetic drive element; a support base; a module circuit board, the photosensitive chip and the module circuit board are fixed together; and a housing base, the housing base and the support seat encapsulate the photosensitive chip and the module circuit board inside; the lens assembly is mounted on the top of the support seat; a first chip carrier; and a second chip carrier, The first chip carrier is located between the second chip carrier and the support seat, and the center of the first chip carrier has a light window; the photosensitive chip is mounted on the upper surface of the second chip carrier; the The first chip carrier is adapted to move in the y-axis direction relative to the support seat under the driving of the electromagnetic driving element; the second chip carrier is adapted to be driven by the electromagnetic driving element relative to the The first chip carrier moves in the x-axis direction; wherein, the x-axis and the y-axis are both coordinate axes parallel to the surface of the photosensitive chip, and the x-axis and the y-axis are perpendicular to each other.

Wherein, a single layer of balls is arranged between the support seat and the second chip carrier, the first chip carrier has ball holes, and the balls pass through the ball holes; in the z-axis direction, the support seat and the first chip carrier is supported by the balls, and in the z-axis direction, the first chip carrier and the second chip carrier are supported by the balls; wherein the z-axis is perpendicular to the x-axis and the coordinate axis of the y-axis; wherein the inner surface of the ball hole bears against part of the outer surface of the ball.

Wherein, the lens assembly includes an optical lens and a first driving part, the first driving part is adapted to drive the optical lens to translate in the x-axis and y-axis directions, and the camera module further includes a device for realizing anti-shake A functional second control unit configured to control the first driving part and the driving device to move the optical lens and the photosensitive chip toward opposite directions.

Wherein, the second control unit is further configured to control the first driving part and the driving device to simultaneously drive the optical lens and the photosensitive chip to move.

Compared with the prior art, the present application has at least one of the following technical effects:

1. This application uses piezoelectric drive components for photosensitive components, and realizes the optical image stabilization (OIS) function of the camera module by driving the photosensitive chip to move. It has the advantages of simple structure and no electromagnetic interference, and is especially suitable for retractable cameras. in the module. Specifically, the piezoelectric drive assembly has the advantages of small size, large thrust, and high precision, and the drive structure is relatively simple. Compared with the traditional electromagnetic drive assembly, the piezoelectric drive assembly avoids the problem of electromagnetic interference and is very suitable for drive components. More camera modules. For example, for a retractable camera module, the optical lens is installed in a multi-stage sleeve. In order to promote the telescopic function of each stage of the sleeve, it may be necessary to use a large number of driving elements. Therefore, the piezoelectric driving assembly has a simple structure and no Electromagnetic interference and other characteristics make it especially suitable for use in photosensitive components of retractable camera modules.

2. In some embodiments of the present application, the x-axis and y-axis drive elements (such as the drive shaft of the piezoelectric drive assembly, etc.) can be set on the same reference plane, and the space occupied by the photosensitive assembly in the height direction can be effectively reduced. space. The reduction of the height of the photosensitive component has a more significant effect on the telescopic telescopic camera module. The sleeve-type camera module includes a multi-layer retractable sleeve. If the height of the photosensitive component is reduced by G, it means that the height of the sleeve-type optical actuator can be increased by G. Then the height of the sleeve-type optical actuator can be increased by G. The height of each layer of sleeve can be increased by G, so that the total extension distance of the sleeve optical actuator can be several times of G. This multiple is consistent with the number of sleeves. Therefore, when the height of the photosensitive assembly is reduced, when it is applied to a telescopic camera module, the extension distance of the camera module can be significantly increased, thereby providing a stronger telephoto shooting capability.

3. In some embodiments of the present application, the module circuit board attached to the photosensitive chip is a foldable circuit board, which provides two orthogonal bending directions, so that the photosensitive chip moves on the x-axis and the y-axis. It will not be pulled by the module circuit board, thereby reducing the resistance to the movement of the photosensitive chip and reducing the driving force requirement for the piezoelectric drive assembly. At the same time, since the module circuit board provides two orthogonal bending directions, the photosensitive chip will not be disconnected due to the pulling of the module circuit board when the photosensitive chip moves on the x-axis and the y-axis, thereby improving the optical image stabilization component reliability.

4. In some embodiments of the present application, the center of the chip carrier is hollowed out, the photosensitive chip can be arranged in the hollowed-out area, and the chip carrier used for realizing the OIS function can not occupy the size in the height direction, thereby helping to reduce the photosensitive chip. The height of the component.

5. In some embodiments of the present application, driving rods and driven rods (guide rods without piezoelectric elements) may be arranged on opposite sides of the chip carrier, so that fewer piezoelectric driving components can be used in two The driving of the photosensitive chip is realized on the degree of freedom. This design can save cost while simplifying the device structure.

6. In some embodiments of the present application, both sides of the chip carrier are provided with cantilever parts and corresponding driving rods or guide rods (that is to say, there are supports on both sides of the chip carrier), which has good balance and helps Make sure that the moving direction of the photosensitive chip is limited to the xoy plane (ie, the reference plane parallel to the photosensitive surface).

Description of drawings

1 shows a schematic perspective view of an optical image stabilization photosensitive assembly according to an embodiment of the present application;

FIG. 2 shows a schematic perspective view of a combination of a first chip carrier and a second chip carrier in an embodiment of the present application;

FIG. 3 shows a schematic perspective view of a first chip carrier in an embodiment of the present application;

FIG. 4 shows a schematic perspective view of the assembly of the second chip carrier and the first chip carrier in an embodiment of the present application;

FIG. 5 shows a schematic diagram of installing the combination of the first and second chip carriers and the photosensitive chip on the support seat according to an embodiment of the present application;

FIG. 6 shows a schematic diagram of an unassembled state of the photosensitive chip and the first chip carrier;

FIG. 7 shows a schematic perspective view of the appearance of a photosensitive assembly in an embodiment of the present application;

FIG. 8 shows a schematic perspective view of the appearance of the photosensitive assembly from another angle;

FIG. 9 shows a schematic three-dimensional appearance of a retractable camera module according to an embodiment of the present application;

10 shows a schematic perspective view of the retractable camera module after the actuator housing is hidden in an embodiment of the present application;

Figure 11 shows the state of the sleeve assembly retracted in the actuator housing;

Figure 12 shows a schematic structural diagram of an example of a piezoelectric drive assembly;

Figure 13 shows a schematic diagram of a piezoelectric element and a corresponding driving rod to realize the vibration conduction function;

FIG. 14 shows a modular circuit board in another embodiment of the present application;

FIG. 15 shows a schematic perspective view of a photosensitive assembly and its circuit arrangement and connection in an embodiment of the present application;

Figure 16a and Figure 16b respectively show the three-dimensional structure of the second circuit board at two different angles in an embodiment of the present application;

Fig. 17 shows the photosensitive assembly after the circuit board structure is assembled in one embodiment of the present application;

FIG. 18 shows a partial structural schematic diagram of the second expansion part in an embodiment of the present application;

FIG. 19 shows a three-dimensional structure diagram of a sleeve-type camera module in an embodiment of the present application;

Figure 20 shows a schematic diagram of the connection relationship between the photosensitive assembly and the sleeve assembly in an embodiment of the present application;

FIG. 21 shows a schematic structural diagram of the sleeve assembly and the photosensitive assembly in an embodiment of the present application from a top view;

Fig. 22 shows a longitudinal cross-sectional perspective schematic diagram of the telescopic camera module in an embodiment of the present application in an extended state;

FIG. 23 shows the assembly process of the optical image stabilization photosensitive assembly in an embodiment of the present application;

FIG. 24 shows the arrangement of the single-color photosensitive pixel units of different colors in the photosensitive chip;

Figure 25 shows the moving direction and four different position states of the photosensitive chip captured by super-resolution;

Fig. 26 shows the movement route of the photosensitive chip in another embodiment during super-resolution shooting and the image sample coverage area obtained by the four position states of the photosensitive chip;

FIG. 27 shows a schematic view of the movement of the driving device, the carrier, and the photosensitive chip mounted thereon corresponding to the movement route of the photosensitive chip of FIG. 26 from a top view;

FIG. 28 shows a schematic exploded perspective view of a photosensitive assembly in an embodiment of the present application;

FIG. 29 shows an assembly schematic diagram of the internal structure of the photosensitive assembly in an embodiment of the present application;

FIG. 30 shows a schematic perspective view of a first chip carrier in an embodiment of the present application;

31 shows a schematic cross-sectional view of the ball connection of the support seat, the first chip carrier and the second chip carrier in an embodiment of the present application;

Figure 32 shows the ball holes of the first chip carrier and the second ball guide grooves of the second chip carrier;

FIG. 33 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the tilt angle of the module in four different situations in this application.

Detailed ways

For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely descriptions of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature and do not imply any limitation on the feature. Accordingly, the first body discussed below could also be referred to as a second body without departing from the teachings of the present application.

In the drawings, the thickness, size and shape of objects have been slightly exaggerated for convenience of explanation. The drawings are examples only and are not drawn strictly to scale.

It will also be understood that the terms "comprising", "comprising", "having", "comprising" and/or "comprising" when used in this specification mean the presence of stated features, integers, steps, operations , elements and/or parts, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and/or combinations thereof. Furthermore, when an expression such as "at least one of" appears after a list of listed features, it modifies the entire listed feature and not the individual elements of the list. Furthermore, when describing embodiments of the present application, the use of "may" means "one or more embodiments of the present application." Also, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not of degree, and are intended to describe measurements that would be recognized by those of ordinary skill in the art. Inherent bias in a value or calculated value.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted to have meanings consistent with their meanings in the context of the related art, and will not be interpreted in an idealized or overly formal sense, unless It is expressly so limited herein.

It should be noted that the embodiments in the present application and the features of the embodiments may be combined with each other in the case of no conflict.

The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

FIG. 1 shows a schematic perspective view of an optical image stabilization photosensitive assembly according to an embodiment of the present application. In order to avoid occlusion, the upper cover of the photosensitive component is hidden in FIG. 1 . Referring to FIG. 1 , in this embodiment, the optical anti-shake photosensitive assembly (ie, the OIS photosensitive assembly) includes a photosensitive chip 10 , a chip carrier 20 and a piezoelectric driving assembly 30 . Among them, the photosensitive chip 10 is used for receiving the light passing through the optical lens and converting it into an electrical signal, thereby outputting image data. The chip carrier includes a carrier part 21 and at least two cantilever parts 22 . The carrier portion 21 is suitable for directly or indirectly mounting the photosensitive chip 10 . The cantilever portion 22 is formed by extending outward from the side surface of the carrier portion 21 . In this embodiment, at least one cantilever portion of the at least two cantilever portions 22 has a piezoelectric driving rod fitting hole 23 . The piezoelectric drive assembly 30 includes a fixed part 31, a piezoelectric element 32 mounted on the fixed part 31, and a driving rod 33 one end fixed to the piezoelectric element 32, the driving rod 33 passing through at least one of the cantilever parts The piezoelectric driving rod 22 is adapted to the hole 23 and is movably connected with the cantilever portion 22, so that the chip carrier 21 can move along the driving rod 33, and the guiding direction of the driving rod 33 is parallel to the The photosensitive surface of the photosensitive chip 10 . When the photosensitive surface is in a horizontal posture, the driving rod 33 of the piezoelectric driving assembly 30 is also in a horizontal posture. In this way, in this embodiment, the photosensitive chip 10 can move linearly in the horizontal direction (ie, the direction parallel to the photosensitive surface) under the driving of the piezoelectric driving component 30 . In this embodiment, the photosensitive chip 10 can be directly attached to the chip carrier 20; it can also be indirectly connected to the chip carrier 20, for example, there can be two chip carriers, one chip carrier is directly attached to the photosensitive chip, and the other chip carrier is It is connected with the previous chip carrier to indirectly mount the photosensitive chip. The two chip carriers can be designed to move in the x-axis and y-axis directions respectively (this OIS structure based on two chip carriers will be further described below with reference to more drawings and embodiments), The two coordinate values where the x-axis and the y-axis are perpendicular to each other, and the x-axis and the y-axis are both parallel to the photosensitive surface. The z-axis is perpendicular to the photosensitive surface, and the z-axis direction is the height direction of the photosensitive component. In this embodiment, the photosensitive chip can be driven by the piezoelectric driving component to move horizontally, so as to realize the anti-shake function of the camera module. Piezoelectric drive components have the advantages of small size, large thrust and high precision, and the drive structure is relatively simple. Compared with traditional electromagnetic drive components, piezoelectric drive components avoid electromagnetic interference problems and are very suitable for cameras with many driving components. module. For example, for a retractable camera module, the optical lens is installed in a multi-stage sleeve. In order to promote the telescopic function of each stage of the sleeve, it may be necessary to use a large number of driving elements. Therefore, the piezoelectric driving assembly has a simple structure and no Electromagnetic interference and other characteristics make it especially suitable for use in photosensitive components of retractable camera modules.

Further, FIG. 2 shows a schematic perspective view of a combination of a first chip carrier and a second chip carrier in an embodiment of the present application. Referring to FIG. 2, in this embodiment, the chip carrier includes a first chip carrier 20a and a second chip carrier 20b. The piezoelectric driving component includes a first piezoelectric driving component 30a and a second piezoelectric driving component 30b whose driving directions are perpendicular to each other. The photosensitive chip 10 is fixed on the carrier portion (ie, the first carrier portion 21a) of the first chip carrier 20a, and the fixing portion of the first piezoelectric driving component 30a is fixed on the second chip carrier 20b. The carrier portion (ie, the first carrier portion 21b). In this embodiment, the cantilever portion includes a drive-side cantilever portion 22a and a driven-side cantilever portion 22b, the drive-side cantilever portion 22a has the piezoelectric drive rod fitting hole 23, and the driven-side cantilever portion 22b. 22b has a guide rod bracket 24 . The photosensitive assembly further includes an auxiliary guide structure, the auxiliary guide structure includes a guide rod 40, the guide rod 40 passes through the guide rod bracket 24 and is movably connected with the guide rod bracket 24, so that the guide rod bracket 24 is movable along the guide rod 24 . The carrier portion of the first chip carrier 20a is a first carrier portion 21a, and the cantilever portion of the first chip carrier 20a includes one of the drive-side cantilever portions 22a and the driven-side cantilever portion A portion 22b, the driving side cantilever portion 22a and the driven side cantilever portion 22b are formed to extend outward from two opposite sides of the first carrier portion 21a. The carrier portion of the second chip carrier 20b is the second carrier portion 21b, and the cantilever portion of the second chip carrier 21b includes one of the drive-side cantilever portions 22a and the driven-side cantilever portion A portion 22b, the driving side cantilever portion 22a and the driven side cantilever portion 22b are formed to extend outward from two opposite sides of the second carrier portion 21b.

Further, FIG. 3 shows a schematic perspective view of the first chip carrier in an embodiment of the present application. Referring to FIG. 3 , in this embodiment, the first chip carrier includes a first carrier portion 21 a and a driving side cantilever portion 22 a and a driven side cantilever portion 22 b extending outward from both sides of the first carrier portion 21 a respectively. The drive-side cantilever portion 22a has a piezoelectric drive rod fitting hole 23 . The piezoelectric driving rod adapter hole 23 is constructed by a bending and supporting portion 23a and a flat plate portion 23b. In the bending support portion 23a, the flat plate portion 23b covers the opening of the bending support portion 23a. The driven side cantilever portion 22b includes at least one cantilever 25 with a through hole, and the guide rod passes through the at least one cantilever 25 with a through hole. In the embodiment of FIG. 3 , each driven side cantilever portion 22 b has two cantilever arms 25 , a guide rod passes through the two cantilever arms 25 (refer to FIG. 2 and FIG. 3 in combination), and the cantilever arms 25 can slide on the guide rods . In this embodiment, the guide rods mounted on the side of the first chip carrier 20a may be referred to as first guide rods 40a. The driven side cantilever portion 22b of the first chip carrier is slidably connected to the first guide rod 40a, and both ends of the first guide rod 40a can be fixed to the carrier portion of the second chip carrier 20b (ie, the second carrier 2); the guiding direction of the first guide rod 40a is parallel to the guiding direction of the driving rod 33 of the first piezoelectric driving component 30a.

Further, FIG. 4 shows a schematic perspective view of the assembly of the second chip carrier and the first chip carrier in an embodiment of the present application. The driven side cantilever portion 22b of the second chip carrier 20b is slidably connected to the second guide rod 40b, and the two ends of the second guide rod 40b can be fixed to the housing base and/or the support seat (which may be 1 and 5); the guiding direction of the second guide rod 40b is parallel to the guiding direction of the driving rod 33 of the second piezoelectric driving assembly 30b. Fig. 5 shows a schematic diagram of installing the combination of the first and second chip carriers and the photosensitive chip on the support seat according to an embodiment of the present application. 1 and 5 , in this embodiment, the photosensitive assembly may further include a housing base 50 and a support base 60 , and the housing base 50 and the support base 60 are used to connect the photosensitive chip 10 , The chip carrier 20 and the piezoelectric driving assembly 30 are packaged inside. It should be noted that the support base 60 and the combination of the first and second chip carriers and the photosensitive chip in FIG. 5 are all inverted. This setting method is for the convenience of assembly. After the assembly is completed, the assembly can be inverted again, so that the photosensitive surface of the photosensitive chip is placed upward. The center of the support base 60 has a light-through hole, so that the light can pass through the support base 60 from the light-through hole after being transmitted by the optical lens, and then be projected on the photosensitive area of the photosensitive chip, and finally the photosensitive chip converts the light signal into a light signal. Electric signal, output image data. In this embodiment, the support base 60 is located above the housing base 50 and the assembly, and the support base 60 can serve as the top cover of the entire photosensitive assembly. Moreover, the top of the support base 60 is suitable for installing the lens assembly. The lens assembly may include an optical lens and an optical actuator. The camera module can be obtained by assembling the lens assembly and the photosensitive assembly together.

Further, referring to FIG. 5 , in an embodiment of the present application, the fixing portion 31 b of the second piezoelectric driving component 30 b may be fixed to the lower surface 61 of the support base 60 . It should be noted that since the support base 60 in FIG. 5 is inverted, the lower surface 61 thereof is facing upward in FIG. 5 .

Further, FIG. 6 shows a schematic diagram of an unassembled state of the photosensitive chip and the first chip carrier. Referring to FIG. 6 , in this embodiment, the first chip carrier 20a (refer to FIGS. 2-4 may be combined) includes a first carrier portion 21a and a driving side formed by extending outward from both sides of the first carrier portion 21a respectively. The cantilever portion 22a and the driven side cantilever portion 22b. The first carrier portion 21 a is in the shape of a frame, and the photosensitive chip 10 is attached to the peripheral edge region 26 a of the first carrier portion 21 a. After the assembly is completed, the photosensitive area of the photosensitive chip 10 can be placed at the window 26b in the center of the first carrier portion 21a. 1-5 all show the state after the photosensitive chip 10 is assembled with the first carrier portion 21a, and it can be seen that the photosensitive chip 10 is placed at the central window. In the design of this embodiment, since the center of the first carrier portion of the first chip carrier is hollowed out, the first chip carrier may not occupy the size in the height direction (that is, in the z-axis direction), thereby helping to reduce the photosensitive The height of the component.

Further, referring to FIG. 4 , in an embodiment of the present application, the second carrier portion 20b of the second chip carrier is in the shape of a frame, and the photosensitive chip 10 and the first carrier portion 20a are disposed on the second carrier portion 20a. At the window in the center of the carrier portion 20b. On the basis of the previous embodiment, the center of the second carrier portion 20b of the second chip carrier in this embodiment is also hollowed out, so the second chip carrier may not occupy the size in the height direction (ie, in the z-axis direction), This helps to better reduce the height of the photosensitive assembly.

Further, referring to FIG. 2, in an embodiment of the present application, the driving rod of the first piezoelectric driving assembly 30a and the driving rod of the second piezoelectric driving assembly 30b are arranged on the same reference plane, The reference plane is a plane parallel to the photosensitive surface of the photosensitive chip. In this embodiment, since the driving rod of the first piezoelectric driving assembly and the driving rod of the second piezoelectric driving assembly, which are respectively used to drive the movement of the x-axis and the y-axis, can be arranged on the same reference plane, therefore in the height direction (ie, In the z-axis direction), it is not necessary to arrange piezoelectric driving components with different driving directions in two layers, thereby helping to reduce the height of the photosensitive components.

Further, referring to FIG. 6 , in an embodiment of the present application, the photosensitive assembly further includes a module circuit board 70 attached to the photosensitive chip 10 , and the module circuit board 70 may be a foldable circuit board, The foldable circuit board includes a plurality of hard boards 71 (PCB) and a flexible board 72 (FPC) connected between the plurality of hard boards 71 . In addition, in this embodiment, the module circuit board 70 has at least two bends, and the at least two bends include at least one vertical bend 73a and at least one horizontal bend 73b. In this embodiment, the bending in the vertical direction is to fold the foldable circuit board upward or downward, and the bending in the horizontal direction is to fold the foldable circuit board forward, backward, left or right. of bending. The bending angle may be about 90 degrees, but it should be noted that the bending angle in this application is not limited to 90 degrees. In other embodiments, the bending angle may also be other angles such as 60 degrees and 120 degrees. In this embodiment, the flexible board is generally in the shape of a plate or a strip, which has two surfaces and four side surfaces, and the thickness direction thereof is consistent with the normal direction of the surface of the flexible board. In this embodiment, for the bending 73a in the vertical direction, the normal line of the surface of the flexible board is located on the vertical plane before and after bending, and for the bending 73b in the horizontal direction, the normal line of the surface of the flexible board is both before and after bending. on a horizontal plane. In this embodiment, the modular circuit board 70 may have a plurality of bends in the horizontal direction, so that a part of the modular circuit board 70 has an "S" shape, as shown in FIG. 6 . Further, FIG. 14 shows a modular circuit board in another embodiment of the present application. Referring to FIG. 14 , the number of bending times in the horizontal direction of the modular circuit board 70 in this embodiment is less than the number of bending times in the horizontal direction in the embodiment of FIG. 6 , and the modular circuit board 70 in this embodiment does not have an “S” shape. section. In the above two embodiments, both ends of the module circuit board 70 are bent in the above two directions (referring to the bending in the vertical direction and the bending in the horizontal direction), and the freedom of the module circuit board 70 is The ends (the free end can usually be provided with a connector) can be drawn out from both ends respectively. However, in some other embodiments of the present application, only one end of the modular circuit board 70 may be bent in the above two directions (referring to the bending in the vertical direction and the bending in the horizontal direction), and the modular circuit board The connector of the board 70 is drawn from one end only. The connector here refers to the connection structure of the module circuit board for electrical connection with the outside world (eg, electrical connection with the mainboard of the mobile phone). In the above embodiment, the module circuit board adopts a foldable circuit board and provides two mutually orthogonal bending directions, so that the movement of the photosensitive chip on the x-axis and the y-axis will not be pulled by the module circuit board. Reduce the resistance to the movement of the photosensitive chip, and reduce the requirement for the driving force of the piezoelectric driving component. At the same time, since the module circuit board provides two orthogonal bending directions, the photosensitive chip will not be disconnected due to the pulling of the module circuit board when the photosensitive chip moves on the x-axis and the y-axis, thereby improving the optical image stabilization component reliability.

Further, FIG. 7 shows a schematic perspective view of the appearance of a photosensitive assembly in an embodiment of the present application. FIG. 8 is a perspective view showing the appearance of the photosensitive assembly from another angle. Referring to FIG. 7 and FIG. 8 , in this embodiment, the photosensitive assembly includes a photosensitive chip 10 , a chip carrier 20 , a piezoelectric driving assembly 30 , a housing base 50 and a support base 60 . The housing base 50 and the support base 60 encapsulate the photosensitive chip 10 , the chip carrier 20 and the piezoelectric drive assembly 30 inside (encapsulated in the housing base 50 and the support base 60 ). inside the cavity). The top of the support base 60 is suitable for installing a lens assembly; the support base 60 serves as an upper cover of the photosensitive assembly, and the upper cover has a lead hole 62 or an escape groove 63 . The free end 79 of the module circuit board 70 can be drawn out from the lead hole 62 or the escape groove 63 of the support base 60 . Further, the piezoelectric driving assembly 30 may have a flexible circuit board 39 for connecting to an external circuit, and the flexible circuit board 39 may be electrically connected with the piezoelectric elements of the piezoelectric driving assembly 30 to provide a driving voltage. Each piezoelectric drive assembly 30 may have an independent flexible circuit board 39 . The flexible circuit board 39 can be drawn out from the lead hole 62 of the support base 60 . The lead holes 62 can also be replaced by avoidance grooves 63 or other types of avoidance structures.

Further, still referring to FIG. 7 and FIG. 8 , in this embodiment, the top surface of the support base 60 may further have a circuit board bracket 64 , and the circuit board bracket 64 may be used to support the circuit board of the lens assembly. The lens assembly may include an optical actuator and an optical lens mounted within the optical actuator. The circuit board of the lens assembly may be a foldable circuit board or a flexible circuit board. The circuit board of the lens assembly can be used to provide the drive circuit for the optical actuator. In this embodiment, the optical actuator may be a sleeve-type optical actuator. The support base 60 may also have a circuit board through hole 65, and the circuit board through hole 65 is disposed in the adjacent area of the circuit board bracket 64, so that the circuit board of the lens assembly can pass through the circuit board through hole 65 through the support base, Further, it communicates with the module circuit board located inside the photosensitive assembly. On the other hand, the circuit board of the lens assembly can still bear on the circuit board bracket 64 . In this embodiment, the support base 60 also has a light-passing hole 66, which can be located in the central area of the support base 66, so that the light passing through the optical lens passes through the support base and is then received by the photosensitive chip.

Further, FIG. 9 shows a schematic three-dimensional appearance diagram of a retractable camera module according to an embodiment of the present application. 9 and 10 , according to an embodiment of the present application, a retractable camera module is provided, and the camera module may include a photosensitive assembly 200 , a sleeve-type optical actuator 100 and an optical lens 300 . Wherein, the photosensitive assembly 200 may adopt the photosensitive assembly of any of the foregoing embodiments. The optical lens 300 may be installed in the sleeve-type optical actuator 100. Sleeve optical actuator 100 includes an actuator housing 140, a sleeve assembly 190, and a drive assembly. Sleeve assembly 190 is mounted within said actuator housing 140 and is adapted to controllably extend (from a light aperture) or retract within said actuator housing 140 in; the sleeve assembly 190 includes a plurality of sleeves (eg, the first sleeve 110, the second sleeve 120 and the third sleeve 130) arranged in a coaxial nest; at least one of the sleeves can be relative to The other of said sleeves extends and retracts. In this embodiment, the sleeve assembly includes three sleeves (the sleeves may also be referred to as single sleeves or single sleeves) that are coaxially nested. For any two adjacent sleeves, the inner sleeve can extend and retract relative to the outer sleeve. In this embodiment, the drive device of the optical actuator may include a piezoelectric drive assembly; in the sleeve assembly, at least two of the sleeves are connected by the piezoelectric drive assembly; the piezoelectric drive assembly comprising a fixed block (namely a fixed part), a piezoelectric element mounted on the fixed block, a driving rod mounted on the piezoelectric element at one end, and a moving block mounted on the driving rod and movable along the driving rod, The moving block is fixed on the bottom of one of the sleeves of the sleeve assembly, and the fixed block is fixed on the bottom of the other sleeve of the sleeve assembly; the moving block can be along the The drive rod moves so that the sleeve connected to the moving block extends or retracts relative to the other sleeve connected to the fixed block.

Further, in an embodiment of the present application, in the retractable camera module, the driving device of the optical actuator further includes a driving device for driving the sleeve assembly to extend out of the housing or retract in the The vertically arranged piezoelectric drive assembly in the housing, the fixed part of the vertically arranged piezoelectric drive assembly (may be referred to as a vertical piezoelectric drive assembly) is installed on the module base, and the first piezoelectric drive assembly The drive rod of the assembly passes through the support seat.

Further, FIG. 10 shows a three-dimensional schematic diagram of the retractable camera module with the actuator casing hidden in an embodiment of the present application. Referring to FIG. 10 , in this embodiment, the circuit board of the optical actuator 100 can surround the sleeve assembly 190 (in FIG. 10 the sleeve assembly is in an extended state, while FIG. 11 shows the sleeve assembly retracted in the actuator The state of the housing, where the sleeve assembly 190 is surrounded by the circuit board of the optical actuator 100). The circuit board of the optical actuator 100 may be referred to as an actuator circuit board 180 , and the surface 181 of the actuator circuit board 180 may be perpendicular to the top surface of the support base 60 . Further, the surface 181 of the actuator circuit board 180 (eg, its surface facing the outside) may be provided with an IC controller 182 , and the IC controller 182 may be connected with the Hall installed in each sleeve of the sleeve assembly 190 . The components cooperate to obtain the position of each sleeve based on electromagnetic induction, and then control each sleeve to expand and contract.

Further, the camera module of the present application is not limited to a retractable camera module. For example, the piezoelectric-driven optical anti-shake photosensitive component in the foregoing embodiment can also be combined with other types of lens components to form various types of camera modules. camera module. For example, in one embodiment, the optical anti-shake photosensitive assembly can be combined with a lens assembly with auto-focus function to form a camera module with auto-focus and optical anti-shake functions. The lens assembly may include an optical actuator for auto-focusing and an optical lens mounted on the optical actuator. The bottom of the optical actuator may be mounted on the top surface of the support seat of the optical anti-shake photosensitive assembly. For another example, in another embodiment, the optical anti-shake photosensitive assembly can be combined with a lens assembly with an optical zoom function to form a camera module with optical zoom and optical anti-shake functions. The lens assembly with the optical zoom function can also be called a zoom lens, the zoom lens can directly adopt the existing mature design, and the bottom of the zoom lens can be installed on the top surface of the support seat of the optical image stabilization photosensitive assembly. For another example, in another embodiment, the optical anti-shake photosensitive component can be combined with a traditional fixed-focus lens to form an optical anti-shake camera module. Since the fixed-focus lens eliminates the need for a motor and other mechanisms, it can have a larger aperture. On the other hand, because the movement of the photosensitive chip realizes optical anti-shake, the camera module of this embodiment can have both a large aperture and an optical anti-shake. shaking characteristics.

Many of the foregoing embodiments involve piezoelectric drive components. For ease of understanding, the working principles of the piezoelectric drive components are briefly described below. FIG. 12 shows a schematic structural diagram of an example of a piezoelectric drive assembly. Referring to FIG. 12 , in this example, the piezoelectric drive assembly includes: a piezoelectric element 1 (sometimes also called piezoelectric element), a drive rod 2 , a fixed part 3 (also called a counterweight) and a moving block ( The moving block is not shown in Figure 12). The piezoelectric element 1 can be mounted on the fixing part 3, and the piezoelectric element 1 is suitable for generating mechanical vibration under the driving of voltage. One end of the driving rod 2 is fixed to the vibration surface of the piezoelectric element 1 . FIG. 13 shows a schematic diagram of a piezoelectric element and a corresponding driving rod to realize the vibration conduction function. Wherein, the piezoelectric element 1 may be in the form of a membrane (it may be called a tympanic membrane), and one end of the driving rod 2 is fixed to the center of the piezoelectric element 1 . The piezoelectric element 1 can vibrate in the vertical direction under the driving of the voltage, so as to push the driving rod 2 up or down. Further, a moving block can be mounted on the driving rod 2 . In this embodiment, the piezoelectric driving component may be a piezoelectric component driven by inertia. Specifically, in the non-working state of the piezoelectric element, the moving block is fixed to the driving rod by the static friction force. In terms of specific design, the moving block may have a through hole through which the driving rod passes, and by selecting an appropriate manufacturing material, a static friction force can be formed between the wall of the through hole of the moving block and the outer side of the driving rod, The static friction force is sufficient to support the weight of the moving block and the sleeve connected to the moving block, thereby ensuring that the relative position of the moving block and the driving rod remains unchanged under the non-working state of the piezoelectric element. When the piezoelectric element is in the working state, by controlling the driving voltage, the piezoelectric element can move up relatively slowly, so as to push the driving rod to move upward relatively slowly. At this time, because the upward force on the driving rod is small, so The static friction force of the contact surface between the moving block and the driving rod can still keep the moving block and the driving rod relatively fixed, so that the moving block rises with the rising of the driving rod. When the piezoelectric element reaches the highest point, the downward movement of the piezoelectric element can be made relatively fast by controlling the driving voltage, thereby pulling the driving rod to move downward relatively quickly. At this time, the downward force on the driving rod is relatively high. Large, the friction force of the contact surface between the moving block and the driving rod is not enough to keep the moving block and the driving rod relatively fixed, causing the driving rod to move downward relative to the moving block (at this time, the contact surface between the moving block and the driving rod is The frictional force has actually been transformed into kinetic frictional force). That is to say, when the driving rod moves downward at a faster speed, the moving block will not descend with the descending of the driving rod, but basically maintains the original height. When the piezoelectric element drops to the lowest point, the driving voltage drives the piezoelectric element to move up slowly again, thereby pushing the moving block to rise again, and so on and so forth, the moving block can be pushed up continuously until it reaches the desired position. In a nutshell, the piezoelectric element can be controlled to rise and fall rapidly by setting the driving voltage, so that the driving rod can drive the moving block to rise through the action of static friction when it rises, and the driving rod can overcome the dynamic friction force and fall rapidly when it falls, avoiding The moving block is lowered by the driving rod. In this way, the moving mass is effectively lifted within one vibration period of the piezoelectric element. Repeatedly performing multiple vibration cycles, the moving block can be continuously lifted upwards until it reaches the desired position. On the contrary, by setting the driving voltage to control the piezoelectric element to descend and rise rapidly, the moving block can be lowered, and after multiple vibration cycles are repeatedly performed, the moving block can be continuously lowered until it reaches the desired position. Based on the above principle, the moving block can move bidirectionally along the direction of the driving rod (eg, vertical direction) under the control of the voltage signal, thereby realizing the expansion and contraction of the sleeve. The working principle of the piezoelectric component based on inertial drive has been briefly described above. It should be noted that the present application is not limited to such piezoelectric components. More types of piezoelectric components will be exemplarily introduced at the end of this article.

In the prior art, there are various implementation schemes of the piezoelectric drive assembly. The piezoelectric drive assembly is briefly described in the foregoing by taking the Tula scheme as an example. For more detailed implementation details of the Tula scheme, please refer to CN204993106U and CN105319663A. In the present application, the piezoelectric driving component may also adopt other types of piezoelectric driving schemes other than the Tula scheme, such as the multi-layer piezoelectric element scheme, the USM scheme, and the like. The implementation details of the linear actuation scheme can refer to CN107046093B, and the implementation details of the USM scheme can refer to CN10109301B. The common feature of the above piezoelectric driving solutions is that these piezoelectric driving components all have a fixed block, a piezoelectric element mounted on the fixed block, a driving rod (the top or bottom end of the driving rod is mounted on the piezoelectric element) and A moving block mounted on the drive rod and movable along the drive rod. The moving block may be formed separately or integrally formed with the driven object (for example, the driven sleeve).

Among them, the Tula solution and the multi-layer piezoelectric device solution are both linear actuation solutions. They have the advantages of small size, large thrust and high precision, and the driving structure is relatively simple, suitable for driving heavier products and suitable for large camera modules. Product trends such as image surfaces and glass lenses are used for chip image stabilization, prism image stabilization, etc. Among them, the multi-layer piezoelectric element scheme has a smaller area than the piezoelectric element of the Tula scheme (the piezoelectric element is disc-shaped from a top view, and the area here refers to the area of the disc), so it helps to reduce the size of the sleeve optics. The radial dimension of the actuator and the corresponding camera module (the radial dimension is the dimension perpendicular to the optical axis). Compared with the multilayer piezoelectric element scheme, the Tula scheme has a smaller thickness of the piezoelectric element, that is, the axial dimension is smaller (the axial dimension is the dimension in the direction parallel to the optical axis), which helps to reduce the sleeve size. Axial dimensions of the cartridge optical actuator and the corresponding camera module. In addition, the circuit of the multi-layer piezoelectric device scheme extends through the side of the base of the linear actuator, and the circuit is relatively simple, which is suitable for use in a module with compact space.

Further, according to an embodiment of the present application, a method for assembling an optical image stabilization photosensitive assembly is also provided. FIG. 23 shows an assembly process of an optical image stabilization photosensitive assembly in an embodiment of the present application. As shown in Figure 23, the assembly process includes the following steps.

In step S1, the photosensitive member is attached to the first chip carrier. For ease of description, in this embodiment, the combination of the photosensitive chip and the module circuit board is called a photosensitive member. In this step, the first chip carrier may include a carrier portion and two cantilever portions. One of the cantilever parts is the drive-side cantilever part, and the other cantilever part is the driven-side cantilever part. The cantilever part on the driving side comprises a bending support part and a flat plate part, the cross section of the bending support part is "V" shape, the flat plate part covers the opening of the bending support part, A piezoelectric driving rod fitting hole can be formed by bending the bearing part and the flat plate part. In this step, a complete first chip carrier may be fabricated first, and then the first chip carrier and the photosensitive member are attached. It is also possible to first manufacture the main body portion and the flat plate portion of the first chip carrier that are separated from each other, and then attach the photosensitive member to the main body portion of the first chip carrier (this step may correspond to sub-step S1-1 in FIG. 23 ); then Weld the flat plate portion to the opening of the bending and supporting portion, thereby constructing the fitting hole for the piezoelectric drive rod (this step may correspond to sub-step S1-2, sub-step S1-1 in FIG. 23 ) and sub-step S1-2 may together constitute step S1). In this step, the photosensitive member may include a photosensitive chip and a module circuit board, and the module circuit board may be a foldable circuit board, the specific structure of which can be referred to the foregoing description, and will not be repeated here.

In step S2, the piezoelectric drive assembly is installed in the cantilever portion on the driving side of the first chip carrier, and the guide rod is installed in the cantilever portion on the driven side thereof. The guide rod is parallel to the axis of the drive rod of the piezoelectric drive assembly.

Step S3, loading the first chip carrier into the second chip carrier. Wherein, the fixing part of the first piezoelectric driving component (referring to the piezoelectric driving component installed on the driving side of the first chip carrier) is fixed to the carrier part of the second chip carrier; the guide rod of the first chip carrier (referring to the first chip carrier) Both end portions of the guide rod of the piezoelectric drive assembly mounted on the driven side are fixed to the carrier portion of the second chip carrier.

In step S4, a piezoelectric driving component is installed in the cantilever portion on the driving side of the second chip carrier, and a guide rod is installed in the cantilever portion on the driven side thereof. In this embodiment, the carrier portion of the first chip carrier may be referred to as a first carrier portion, the first chip carrier has a first driving side and a first driven side, and the first driving side and the first driven side are two opposite sides of the first carrier part, the driving side cantilever part and the driven side cantilever part of the first chip carrier are respectively driven from the first side and the first driven side are formed to extend outward. The carrier part of the second chip carrier can be referred to as the second carrier part, the second chip carrier having a second drive side and a second driven side, the second drive side and the second driven side The two sides are opposite sides of the second carrier part, and the driving side cantilever part and the driven side cantilever part of the second chip carrier are from the second driving side and the second slave side, respectively. The movable side extends outward. In addition, the first driving side, the second driving side, the first driven side and the second driven side surround the photosensitive chip. That is, the first driving side, the second driving side, the first driven side and the second driven side are respectively located on the four peripheral sides of the photosensitive chip. In this embodiment, the axes of the guide rod mounted on the second chip carrier and the driving rod of the piezoelectric driving component are parallel. For ease of description, the guide rod slidably connected with the first chip carrier is called the first guide rod, the drive rod movably connected with the first chip carrier is called the first drive rod, and the guide rod slidably connected with the second chip carrier is called the first drive rod. The rod is called the second guide rod, and the driving rod movably connected with the second chip carrier is called the second driving rod. The axes of the first drive rod and the second drive rod are perpendicular to each other, and the axes of the first guide rod and the second guide rod are also perpendicular to each other, so that the photosensitive chip can have the first guide rod direction (ie the x-axis direction) and the The two degrees of freedom of movement in the second guide rod direction (ie, the y-axis direction). In this embodiment, preferably, the first driving rod and the second driving rod may be disposed on the same reference plane, and the reference plane is a plane parallel to the photosensitive surface of the photosensitive chip. In this embodiment, since the driving rod of the first piezoelectric driving assembly and the driving rod of the second piezoelectric driving assembly (ie, the first driving rod and the second driving rod), which are respectively used to drive the movement of the x-axis and the y-axis, can be set On the same reference plane, it is not necessary to arrange piezoelectric driving components with different driving directions on two layers in the height direction (ie, in the z-axis direction), thereby helping to reduce the height of the photosensitive components.

Step S5, load the photosensitive member, the first chip carrier, the second chip carrier, the first piezoelectric drive assembly, the second piezoelectric drive assembly, the first guide rod and the second guide rod into the inverted support seat . For convenience of description, the above-mentioned assembly is referred to as a movable chip assembly. In this embodiment, the lower surface of the support seat (in the inverted state, the lower surface faces upwards) can be made into a accommodating space for accommodating the movable chip assembly, so that the assembly can be easily assembled with the support seat . Wherein, on the second driving side, the fixing block (or referred to as the fixing part) of the second piezoelectric driving assembly can be fixed on the support seat, and on the second driven side, both ends of the second guide rod can be fixed on the supporting seat. the support base. The second chip carrier can be supported by the second piezoelectric driving component and the second guide rod, that is, the second chip carrier can be in a suspended state relative to the support base.

Step S6, arrange the soft board of the module circuit board of the photosensitive member, and lead the free end of the module circuit board (the free end can be provided with a connector) from the lead hole or the avoidance groove of the support seat. Wherein, the connector of the modular circuit board refers to the connection structure of the modular circuit board used for electrical connection with the outside world (eg, electrical connection with the mainboard of the mobile phone). In this embodiment, the modular circuit board has at least two bends, and the at least two bends include at least one bend in the vertical direction and at least one bend in the horizontal direction. The details of the bending in the vertical direction and the bending in the horizontal direction have been described above, and will not be repeated here.

In step S7, the plate-shaped housing base is mounted on the upside-down support base, and the movable chip assembly is packaged in the accommodating space between the support base and the housing base. After installation, turn the finished product upside down with the support seat on top. After step S7 is completed, the photosensitive assembly can be obtained. The photosensitive assembly can form a camera module together with the lens assembly.

In the aforementioned embodiments of the present application, the photosensitive chip is moved in the x-axis and y-axis directions in the photosensitive assembly based on the piezoelectric drive assembly. Each piezoelectric driving component requires a corresponding driving circuit to provide a driving voltage, which will result in a larger wiring area on the module circuit board for arranging the corresponding driving circuit. In some embodiments of the present application, a solution is proposed to separate the image acquisition functional circuit supporting the operation of the photosensitive chip from the driving circuit supporting the piezoelectric driving component. In this solution, the two types of functional circuits are respectively arranged in different On the circuit board, the two circuit boards can be drawn out through the flexible board respectively and joined on the side of the casing, and finally connected to the outside world (for example, electrically connected to the main board of a mobile phone or other smart device) through a unified connector. The circuit arrangement and connection of the photosensitive assembly will be further described below with reference to a series of embodiments of the present application.

FIG. 15 shows a schematic perspective view of a photosensitive assembly and its circuit arrangement and connection in an embodiment of the present application. 2-8 and FIG. 15 , the photosensitive assembly of this embodiment includes a photosensitive chip 10, a first chip carrier 20a, a second chip carrier 20b, a first piezoelectric drive assembly 30a, a second piezoelectric drive assembly 30b, a A guide rod 40a, a second guide rod 40b, a housing base 50 and a support base 60, the housing base 50 and the support base 60 can connect the photosensitive chip 10, the first chip carrier 20a, the second The chip carrier 20b, the first piezoelectric drive assembly 30a, the second piezoelectric drive assembly 30b, the first guide rod 40a, the second guide rod 40b and other elements are encapsulated inside, that is, encapsulated in the housing base 50 and the support base 60 in the formed cavity. Photosensitive chip 10, first chip carrier 20a, second chip carrier 20b, first piezoelectric drive assembly 30a, second piezoelectric drive assembly 30b, first guide rod 40a, second guide rod 40b, housing base 50 and supports Various technical details of the seat 60 have been described in the first part, and will not be repeated here. The difference between this embodiment and each of the embodiments in the first part is that the circuit board structure of the camera module described in this embodiment has been improved, so that it is more suitable for piezoelectric drive components that can be used in the x-axis and y-axis directions. The photosensitive components and camera modules of the mobile photosensitive chip are moved up. Specifically, in this embodiment, the circuit board structure may include a first circuit board 71 and a second circuit board 72 . The first circuit board 71 may include a main body portion inside the photosensitive assembly and an extension portion extending outside the photosensitive assembly, and the main body portion may be attached to the photosensitive chip 10 . In FIG. 15 , the main body is covered by the support base 60 and the photosensitive chip 10 . The position and shape of the main body can be the same as the module circuit board 70 described above, so it is not repeated here. Different from the module circuit board 70 in the previous embodiment, the main body of the first circuit board in this embodiment may not be provided with the driving circuit of the piezoelectric driving component, but only be arranged to realize the image acquisition of the photosensitive chip. functional support circuits. In this way, the wiring area required by the first circuit board can be appropriately reduced, thereby reducing the driving force required for moving the photosensitive chip 10 and the first circuit board 71 . In this embodiment, since the functional circuit in the main body of the first circuit board 71 can be dedicated to supporting the image capture of the photosensitive chip 10 , the main body of the first circuit board 71 can also be called a chip circuit board. In this embodiment, the second circuit board 72 may include a relay circuit board 72 a attached to the top surface of the support base 60 . The relay circuit board 72a can be used to electrically connect the first piezoelectric driving component 30a and the second piezoelectric driving component 30b (refer to FIGS. 2-8 in combination), so as to output a driving voltage to the piezoelectric elements of the two to control the light-sensing The movement direction and movement amount of the chip 10 . The relay circuit board 72a can bear against the top surface of the support base 60, so the relay circuit board 72a has high mechanical reliability and can maintain a stable connection when the piezoelectric element vibrates at a high frequency. On the other hand, the relay circuit board 72a is located on the top surface of the support base 60, which is also helpful for connecting the lines of the lens assembly. For example, some lens assemblies may include optical actuators (such as conventional autofocus optical actuators or optical actuators for optical image stabilization), and the lines of the optical actuators may be connected to the top of the support base. The relay circuit board 72a on the surface is connected to the outside world (such as the mainboard of the mobile phone) through the relay circuit board 72a. Furthermore, in this embodiment, the driving circuit of each piezoelectric driving component is arranged on the second circuit board 72, and the working circuit (for example, the image acquisition circuit) of the photosensitive chip 10 is arranged on the first circuit board 71, which can make these two types of functions. The circuit is separated, so that the driving circuit and the working circuit of the photosensitive chip will not interfere with each other. For example, the line width of the lines in the first circuit board 71 may be smaller than the line width of the lines in the second circuit board 72. The larger line width of the second circuit board 72 helps to support a larger current, so as to improve the piezoelectric drive The driving power of the component, improving the response speed of anti-shake movement or other types of movement. The smaller line width of the first circuit board 71 is beneficial to reduce the required wiring area on the premise of realizing various functions, thereby reducing the volume and weight of the first circuit board 71 .

Further, FIG. 16a and FIG. 16b respectively show the three-dimensional structure of the second circuit board at two different angles in an embodiment of the present application. 15, 16a and 16b, in this embodiment, the second circuit board 72 may include a relay circuit board 72a, a first extension portion 72b and a second extension portion 72c. The transfer circuit board 72a is as described above and will not be repeated here. In this embodiment, the first extension portion 72b is formed by bending upward from one side of the relay circuit board 72a , that is, the first extension portion 72b is connected to the relay circuit board 72a through a vertical bending portion 73 . The second extension portion 72c is formed by horizontally bending the first extension portion 72b , that is, the second extension portion 72c is connected to the first extension portion 72b through a horizontal bending portion 74 . In this embodiment, the first extension part 72b and the second extension part 72c can bear against an actuator housing 80 (refer to FIG. 15 ), and the actuator housing 80 can be used as a housing of the lens assembly to cover the Above the support base 60 . An optical lens and an optical actuator (sometimes also referred to as a motor) for driving the optical lens can be accommodated between the actuator housing 80 and the support base 60 . The first extension portion 72b and the second extension portion 72c may respectively bear against two mutually perpendicular outer sides of the actuator housing 80 .

Further, still referring to FIGS. 15, 16a and 16b, in an embodiment of the present application, in the second circuit board 72, the relay circuit board 72a may be a PCB board (hard board) or a (FPC board) soft board. Since the relay circuit board 72a is supported on the top surface of the support base 60, whether a rigid board or a flexible board is used, it can have high mechanical reliability, and can maintain a stable connection when the piezoelectric element vibrates at a high frequency. Further, the drive circuit of the piezoelectric drive assembly of the photosensitive assembly can be arranged in the first extension part 72b and/or the second extension part 72c, so that the wiring of the relay circuit board 72a will be more concise, which is helpful to reduce the relay The thickness of the circuit board 72a helps to reduce the overall height of the camera module. At the same time, since the first extension portion 72b and the second extension portion 72c are both disposed outside the actuator housing 80, it is also beneficial to improve the heat dissipation performance of the driving circuit. Further, when the lens assembly has an optical actuator, the drive circuit of the lens assembly can also be provided in the first extension portion 72b and/or the second extension portion 72c, thereby further simplifying the built-in relay circuit board. wiring. Of course, the present application is not limited to the above-mentioned embodiments. In other embodiments of the present application, the relay circuit board 72a may also be arranged with functional circuits, such as the driving circuit of the piezoelectric driving component of the photosensitive component or the driving circuit of the lens component. circuit.

Further, FIG. 17 shows a photosensitive assembly after the circuit board structure is assembled in an embodiment of the present application. 15 , 16 a , 16 b and 17 , in this embodiment, the first circuit board may include a chip circuit board (or referred to as the main body of the first circuit board), and the chip circuit board may be adhered to Connected to the photosensitive chip 10, one end of the chip circuit board may have at least one vertical bending part and at least one horizontal bending part, so as to avoid the movement of the x-axis and the y-axis of the photosensitive chip 10 being hindered by the chip circuit board (chip circuit). The shape and structure of the board can be referred to the description of the module circuit board 70 above). Further, the chip circuit board can be drawn out from the lead groove on the top surface of the support base 60 . Specifically, the chip circuit board can be connected to the outside of the support base through a second connecting strip. The second connecting strip may be located inside the photosensitive assembly and include at least one vertical bending portion and at least one horizontal bending portion. The second connecting strip may be connected to the outside of the support base 60 through an "S" shaped transition section 71a. The other end of the "S"-shaped transition section 71a is connected to the third expansion part 71b, and the back of the third expansion part 71b can bear against the outer surface of the actuator housing 80 (refer to FIG. 15 in conjunction). In this embodiment, the third extension portion 71b can be connected to the fourth extension portion 71c through a horizontal bending portion (it should be noted that the fourth extension portion 71c has not been bent relative to the third extension portion 71b in FIG. 17 ), and the bending is performed. After folding, the fourth extension portion 71c can be snapped with the second extension portion 72c through a connector (for example, the second extension portion 72c can be provided with a plug-type connector, and the fourth extension portion 71c can be provided with a socket-type connector. Connector). For example, a connector 75a may be provided on the second extension portion 72c, a connector 75b may be provided on the fourth extension portion, and the connectors can be snapped to electrically connect the second extension portion 72c and the fourth extension portion 71c, and at the same time, the two It is firmly fixed to the outer side of the actuator housing 80 . This design not only has a regular circuit, but also facilitates the assembly of the circuit board, is suitable for an automated assembly process, and helps to improve the production efficiency and production yield of the product.

Further, in an embodiment of the present application, one side of the actuator housing 80 may have a protrusion 81 facing outward, so that the outer side surface of the actuator housing 80 on the side has a stepped structure 82 , the third expansion part 72b may be disposed above the step structure 82 . On the one hand, this design can make the actuator housing 80 have a larger accommodating space, so that devices such as piezoelectric driving components or guide rods can be arranged at the positions of the outward protrusions 81, or devices such as photosensitive components can be arranged. The second connecting strip of the first circuit board in the inner cavity. On the other hand, on the outside of the actuator housing, an escape area is formed above the step mechanism, and the escape area can avoid other functional modules of the intelligent electronic device (such as a smartphone equipped with a camera module). Alternatively, the avoidance area can be used to set the third expansion part, thereby improving the space utilization rate of the camera module.

Further, still referring to FIG. 15 and FIG. 17 , in an embodiment of the present application, the back surfaces of the first expansion part 72b and the second expansion part 72c can be attached to the side surface of the actuator housing 80 , Thus, the firmness and mechanical reliability of the circuit board structure are increased. The third extension portion 71b may not be pasted, but only bear against the outer surface of the actuator housing 80 . In this embodiment, the third extension portion 71b may be a flexible connecting tape formed of a flexible board (FPC board). This design can reserve a certain moving space for the third extension portion 71b. When the moving stroke of the photosensitive chip is large, this design can better avoid the reduction of the moving accuracy of the photosensitive chip caused by the pulling of the chip circuit board, thereby improving the Image quality. Referring to the description of the principle of the piezoelectric drive assembly above, it is easy to understand that the movement range of the photosensitive chip is usually significantly larger than the vibration range of the piezoelectric element. Therefore, in this embodiment, the first circuit board 71 (chip circuit board) The circuit board 72 can be provided with a larger movable space to match the larger movable range of the photosensitive chip. Since the fourth extension portion 71c and the second extension portion 72c can be fastened and fixed by the connector, and the back of the third extension portion 71b can bear against the outer side of the actuator housing 80, the third extension portion 71b and the third extension portion 71b and the The four extension parts 71c will not conduct the movement of the photosensitive chip to the outside world (eg, the mainboard of the mobile phone), so as to avoid disconnection or poor contact caused by the pulling of the cable (eg, the flexible connecting tape).

It should be noted that the implementation of the first circuit board of the present application is not limited to the previous embodiment. For example, in another embodiment, the back surface of the third expansion portion of the first circuit board may also be pasted on the outer surface of the actuator housing. This embodiment can be better applied to the situation where the movement stroke (or range of motion) of the photosensitive chip is small.

In an embodiment of the present application, functional circuits (for example, driving circuits of each piezoelectric driving component) may be arranged on the transfer circuit board, the first extension part, and the second extension part of the second circuit board, so as to better Use the wiring space of the second circuit board.

In an embodiment of the present application, the second extension part of the second circuit board may be composed of a hard board (PCB board), and the outer surface (the outer surface, that is, the surface facing the outside) of the second extension part Electronic elements such as resistive elements, capacitive elements, IC chips, and the like may be arranged. Arranging the electronic components on the outer side of the second extension part helps to reduce the number of electronic components inside the photosensitive assembly and inside the actuator housing, thereby contributing to the miniaturization of the camera module and improving the camera module's performance. heat dissipation capacity.

Further, referring to FIG. 15 , FIG. 16 a , FIG. 16 b and FIG. 17 , in an embodiment of the present application, the relay circuit board 72 a may be a rigid board (PCB) or a flexible board (FPC), the back of which is attached to the the top surface of the support base 60 . The support base 60 has a central light-passing hole 66, and the top surface of the support base 60 can also be provided with a plurality of escape grooves or escape holes, so as to lead out the lead wires of the piezoelectric driving component. In this embodiment, the shape of the relay circuit board 72a from a top view can be adapted to the top surface of the support base 60. For example, a light-passing hole can also be provided in the central area of the relay circuit board 72a, and the relay circuit board 72a avoids Avoidance grooves or avoidance holes on the top surface of the support base 60 . In this embodiment, the piezoelectric element of the piezoelectric driving assembly may have three electrode pieces. The first electrode sheet and the third electrode sheet may be respectively located on the upper surface and the lower surface of the piezoelectric element (ie the upper end face and the lower end face, the end face of the piezoelectric element is the outer surface perpendicular to the central axis of the drive shaft, parallel to the The outer surface of the central axis of the drive shaft may be referred to as the side surface of the piezoelectric element), and the second electrode sheet may be drawn out from the middle area of the side surface of the piezoelectric element. The second electrode sheet may protrude into the interior of the piezoelectric element, and a piezoelectric material layer may be provided between the first electrode sheet and the second electrode sheet, and between the second electrode sheet and the third electrode sheet. The polarities of the first electrode sheet and the third electrode sheet may be the same, for example, they may both be positive electrodes. The polarity of the second electrode sheet may be opposite to that of the first electrode sheet and the third electrode sheet, for example, the second electrode sheet may be a negative electrode. In actual use, the polarity of the first electrode sheet and the third electrode sheet may also be negative, while the polarity of the second electrode sheet is positive. Regarding the details of the arrangement of the three electrode sheets in the piezoelectric element, further reference may be made to the patent document CN204993106U. In this embodiment, the first electrode sheet, the second electrode sheet and the third electrode sheet of the piezoelectric element may be connected by a flexible connecting strip with three branches (herein, the flexible connecting strip may also be referred to as the first connection tape), the flexible connecting tape may be composed of a flexible board (FPC board). The three bifurcations of the bifurcated end of the flexible connecting tape are respectively connected to the first electrode sheet, the second electrode sheet and the third electrode sheet, and the non-bifurcated end is drawn out from the avoidance groove or avoidance hole of the support seat, and then passes through the conductive glue (such as conductive silver glue) or fixed to the transfer circuit board by welding. Because the support seat can be made based on the embedded injection molding process, in which metal sheets can be embedded, the support seat can have high structural strength and a flat surface, and the top surface of the support seat has a large area, so it is very convenient for automatic equipment to carry out Operation, that is to say, the process steps of drawing the flexible connecting tape out of the avoidance groove or avoidance hole and bonding or welding it to the upper surface of the transfer circuit board are easy to realize with automatic equipment, which is very beneficial to improve the production efficiency of the camera module and Production yield.

Further, in an embodiment of the present application, referring to FIGS. 16a , 16b and 17 , the second extension portion 72c can also lead out a general connecting belt 72d, and the general connecting belt 72d can be connected with electronic equipment (for example, carrying The mainboard of the camera module of the smartphone) or other modules of the electronic device are connected. In one example, the general connecting strip 72d may be connected to the second expansion portion 72c through a vertical bending portion. The vertical bending portion can be bent at about 90 degrees in the vertical direction, so that the total connecting strip 72d is horizontal, that is, the surface of the total connecting strip 72d is substantially in a horizontal state. Such a design can facilitate the connection of the general connecting strip 72d with the main board of the electronic device or other modules of the electronic device. The end of the header strap 72d may have a header connector. After being connected to the outside world through the general connecting strip and the general connector, the entire circuit board structure of the camera module can receive power supply from the outside world and receive signals from the outside world (eg, from a processor).

Further, FIG. 18 shows a partial structural schematic diagram of the second expansion part in an embodiment of the present application. Referring to FIG. 18 , the second expansion board in this embodiment may be implemented by a folded composite circuit board. The composite circuit board may include two PCB boards (which may be referred to as the first sub-circuit board 72c1 and the second sub-circuit board 72c2 respectively) and a horizontal bending portion 72c3 connecting the two PCB boards, and the horizontal bending portion may be Make a 180 degree bend so that the two PCB boards are folded together. The PCB board (the first sub-circuit board 72c1 ) located on the outside may be provided with electronic components, including resistance elements, capacitance elements, IC chips, and the like. This design helps to improve the structural strength of the second expansion board and at the same time increases the wiring area of the second expansion board. Further, the second expansion board may further include a reinforcement board, and the reinforcement board may be arranged between the PCB board and the actuator housing. The second expansion plate is fixed to the outer side surface of the actuator housing through a reinforcing plate. In this embodiment, the general connecting strip can be connected to the PCB board (ie, the second sub-circuit board 72c2 ) on the back side through the vertical bending portion. This design can avoid the relative displacement of the camera module and the main board of the electronic device (for example, the relative displacement caused by external impact or the influence of the moving parts), which may lead to poor line contact or open circuit problems. In another embodiment, the second expansion board may also include a PCB board, a horizontal bending part and an FPC board, and the horizontal bending part can be bent by 180 degrees, so that the PCB board and the FPC board are folded on the Together, or the FPC board can be attached to the back of the PCB board. Further, a reinforcing plate 72c4 can also be provided on the back of the FPC board to improve the structural strength. In this case, the general connecting tape can be drawn out from the FPC board on the back side through a vertical bending portion.

Further, referring to FIG. 17 , in an embodiment of the present application, the second expansion part 72c may be provided with two connectors distributed in different sections, and the fourth expansion board 71c is also provided with two connectors at corresponding positions. The snap connection of the two pairs of connectors can more firmly fix the first circuit board 71c and the second circuit board 72c together, and at the same time can also increase the connection channel of the electrical signals of the first circuit board 71 and the second circuit board 72 ( I/O channel). The fourth expansion board 71c may be a hard board (PCB board) or a flexible board (FPC board).

Hereinafter, the improved circuit arrangement and connection of the retractable camera module will be described with reference to some embodiments.

In some embodiments of the present application, the camera module may be a retractable camera module, and the retractable camera module may include a retractable lens assembly. The retractable lens assembly includes at least one piezoelectric drive assembly capable of driving the optical lens to retract. The piezoelectric driving component used to drive the photosensitive chip to move in the foregoing provides driving force in the horizontal direction, that is, driving force in the x-axis and y-axis directions, so it can be called a horizontal piezoelectric driving component. The piezoelectric driving assembly for driving the telescopic lens provides a driving force in the vertical direction (ie, the z-axis direction), and for convenience of description, it may be referred to as a vertical piezoelectric driving assembly. The axis of the drive rod (or drive shaft) of the vertical piezoelectric drive assembly is in a vertical state. Referring to FIG. 17 , in this embodiment, the top surface of the support base 60 has a mounting groove 67 suitable for mounting the vertical piezoelectric driving assembly 90 , and the mounting groove 67 opens upward, so that the driving element of the piezoelectric driving assembly 90 can be installed into the installation slot 67, so as to help reduce the overall height of the camera module (actuator housing) on the premise of providing sufficient telescopic movement stroke. In this embodiment, the piezoelectric elements of the vertical piezoelectric driving assembly 90 may be connected by bifurcated flexible connecting strips. The flexible connecting strip has a branched end and a non-branched end, the branched end is used to connect the electrodes of the piezoelectric element, and the non-branched end of the flexible connecting strip is connected to the upper surface of the transfer circuit board. In this embodiment, the vertical piezoelectric driving component may be installed in a corner area of the support base 60 from a top view. The other two corner areas of the support base 60 can be installed with guide posts (or referred to as upright posts 69 ), and the other corner area can be provided with a circuit board bracket 68 , which can be used to support and install from the photosensitive assembly and the /or a flexible connecting tape (eg, FPC board) drawn from the lens assembly, so that the photosensitive assembly and/or the lens assembly can be better connected to the transfer circuit board 72a. In this embodiment, the driving rod of the vertical piezoelectric drive assembly and the two uprights can jointly support the lens assembly, so that the movement of the retractable module is more stable; at the same time, since only one vertical piezoelectric drive assembly is used, there are Helps save costs and ease installation difficulty. It should be noted that in other embodiments of the present application, more vertical drive assemblies may also be provided to support the lens assembly. In this embodiment, the optical lens may be a conventional optical lens, or may be a zoom lens or an optical lens with an anti-shake function. The retractable module can have two states. In the first state, the optical lens can be placed in the actuator housing, so that the top surface of the optical lens is roughly flush with the back of the electronic device (or with the camera on the back of the electronic device). the height of the module area is flush). In the second state, the optical lens can extend out of the actuator housing from the central through hole of the actuator housing under the driving of the vertical piezoelectric driving assembly. The second state may generally be suitable for telephoto shooting that needs to provide a longer back focus.

In some embodiments of the present application, the lens assemblies of the camera module can be selected from various types of lens assemblies. For example, the lens assembly may be an auto-focus lens assembly, an optical anti-shake lens assembly, or an optical zoom lens assembly. The auto-focus lens assembly may further include an auto-focus driving device, and the lead wires of the auto-focus driving device are connected to the relay circuit board. The optical anti-shake lens assembly may further include an optical anti-shake driving device, and the leads of the optical anti-shake driving device are connected to the transfer circuit board. The optical zoom lens assembly may further include a zoom driving device, and the lead wires of the zoom driving device are connected to the relay circuit board.

Hereinafter, the improved circuit arrangement and connection of the telescopic camera module will be described with reference to some embodiments.

Further, in an embodiment of the present application, the camera module may be a telescopic camera module. FIG. 19 shows a three-dimensional structural diagram of a telescopic camera module in an embodiment of the present application. FIG. 20 is a schematic diagram showing the connection relationship between the photosensitive assembly and the sleeve assembly in an embodiment of the present application. FIG. 21 shows a schematic structural diagram of the sleeve assembly and the photosensitive assembly in a top view according to an embodiment of the present application. FIG. 22 is a schematic perspective view of a longitudinal section of a telescopic camera module in an extended state according to an embodiment of the present application. 19-22, in this embodiment, the telescopic camera module may include a telescopic lens assembly, and the lens assembly may include a sleeve assembly 990, an optical lens 300, a vertical first piezoelectric The drive assembly 810 (refer to FIG. 20 and FIG. 21 ), the vertical second piezoelectric drive assembly 820 (refer to FIG. 22 ), and the vertical third piezoelectric drive assembly 830 (refer to FIG. 22 , note that most of the drive rods are The optical lens 300 is blocked), wherein the vertical first piezoelectric driving assembly 810 is used to drive the entire sleeve assembly 990 to extend or retract the actuator housing 80 . The vertical second piezoelectric driving assembly 820 and the vertical third piezoelectric driving assembly 830 are used to drive the extension and retraction of each single sleeve of the sleeve assembly. In this embodiment, since there are a plurality of vertical piezoelectric driving components arranged in each single sleeve, and each single sleeve can be extended and retracted, more circuit arrangements are involved. Specifically, in the sleeve-type lens assembly, the sleeve assembly includes a plurality of single sleeves arranged in a nest. In this embodiment, the sleeve assembly 990 may include three single sleeves (refer to FIG. 19 ), the first sleeve 910 , the second sleeve 920 and the third sleeve 930 . The first sleeve 910 , the second sleeve 920 and the third sleeve 930 are nested in sequence from outside to inside. The vertical second piezoelectric driving assembly 820 and the vertical third piezoelectric driving assembly 830 may be arranged in two layers, and the vertical second piezoelectric driving assembly 820 may connect the first sleeve 910 and the second sleeve 920 . The vertical third piezoelectric driving assembly 830 may connect the second sleeve 920 and the third sleeve 930 . For two adjacent single-piece sleeves, the bottom plate of one single-piece sleeve is connected with the moving part of the corresponding vertical piezoelectric drive assembly, and the bottom of the other single-piece sleeve can be connected with the corresponding vertical piezoelectric driving assembly. The fixed parts of the direct piezoelectric drive assembly are connected together. In addition, when each single-piece sleeve is in an extended state, the single-piece sleeve on the topmost layer (the third sleeve 930 in this embodiment) may include a lens carrier, and the inner side of the lens carrier is suitable for installing the optical lens 300 . When each of the sleeves is in a retracted state, two vertical piezoelectric drive assemblies at different levels (for example, the vertical second piezoelectric drive assembly 820 and the vertical third piezoelectric drive assembly 830 ) are accommodated in the same accommodating cavity, The accommodating cavity is located between the lens carrier and the barrel wall of the sleeve. In this embodiment, the setting position of the vertical first piezoelectric driving component may be the same as the embodiment in the third part above, that is, the piezoelectric element may be arranged at one corner of the four-corner area of the support base. The moving part (or called the moving block) of the vertical piezoelectric element can be integrated with the bottom of the first sleeve 910 , so as to push the entire sleeve assembly 990 to extend or retract the actuator housing 80 .

Further, in an embodiment of the present application, each single sleeve of the sleeve assembly is provided with a corresponding circuit so as to connect the piezoelectric element of the piezoelectric driving assembly located in the single sleeve. In addition, in order to accurately detect the actual moving position of the single-piece sleeve, a Hall element is usually installed in each of the single-piece sleeves. actual location. Each Hall element is usually connected by a flexible circuit board (eg, FPC flexible board). The lines of the sleeve assembly are connected to the transfer circuit board through the foldable circuit board, and then connected to the outside world through the first expansion part, the second expansion part and the general connecting belt. Referring to FIG. 22 , in this embodiment, each single sleeve can be provided with a sleeve circuit board bracket, and the sleeve circuit board can be installed and supported on the sleeve circuit board bracket. A Hall element can be installed on the top of the sleeve circuit board support, and the sleeve circuit board extends to the top of the sleeve circuit board support and is electrically connected with the Hall element. The second extension portion 72c of the second circuit board 72 can be provided with an IC sensing module corresponding to the Hall element mounted on each single sleeve, and the IC sensing module can sense the Hall element of each single sleeve The position change of each single sleeve can be calculated to calculate the actual movement direction and movement amount of each single sleeve. In this embodiment, the sleeve circuit board of the single sleeve of each layer includes a bearing portion and a lead portion. The following description takes the first sleeve 910 and the sleeve circuit board support 821 as an example. In the first sleeve 910, the bearing portion 822 of the sleeve circuit board is supported against and mounted on the sleeve circuit board bracket 821, and the lead portion 823 is a foldable circuit board. When the sleeve assembly 990 is in an extended state, The lead portion 823 is unfolded and suspended, and the lead portion 823 can pass through the bottom plate of the single sleeve (eg, the first sleeve 910 ) and be electrically connected to the transfer circuit board. It should be noted that when there is a next-layer single sleeve under the single sleeve (eg, the second sleeve 920 or the third sleeve 930 ), the single sleeve (eg, the second sleeve 920 or the third sleeve 930 ) The lead portion of the sleeve circuit board of the three sleeves 930) is connected to the sleeve circuit board of the single sleeve of the next layer after passing through the bottom plate. And the lead portion of the sleeve circuit board of the bottommost sleeve (eg, the first sleeve 910 ) can be directly electrically connected to the relay circuit board. Through this layer-by-layer connection, the piezoelectric elements and Hall elements in the sleeves at different levels can be powered and provided with control signals. When the sleeve assembly is in a retracted state, the lead portions of each sleeve circuit board can be folded, so as to facilitate storage when the sleeve assembly is retracted inside the actuator housing.

Further, in an embodiment of the present application, in the single sleeve of each level, the circuit board of the sleeve can be connected to the piezoelectric elements of the piezoelectric driving assembly located at this level through a flexible connection tape. In the present application, the connection belt bearing against the upper surface of the bottom plate may also be referred to as the third connection belt. FIG. 21 shows the connection of the first sleeve 910 and the circuit board of the sleeve. Referring to FIG. 21 , the third connecting strip 911 may be arc-shaped in a plan view, so as to avoid the light-passing hole in the center of the single-piece sleeve. The flexible connecting belt 911 can bear against the bottom plate of the single-piece sleeve. When the piezoelectric element is relatively close to the sleeve circuit board support 821, the third connecting strip 911 can also be suspended, that is, the bifurcated flexible connecting strip of the piezoelectric element can be directly connected to the sleeve circuit board . When the piezoelectric element is far away from the sleeve circuit board support 821 , an arc-shaped or fold-line connecting belt (eg, the third connecting belt 911 ) can be drawn from the bearing portion 822 of the sleeve circuit board. The connecting belt bears against the upper surface of the bottom plate of the single-piece sleeve of this layer, and extends to the area near the piezoelectric element 824 of this layer, and then the bifurcated flexible connecting belt 825 of the piezoelectric element 824 is connected to the arc-shaped Or folded linear connection strips are connected and turned on. It should be noted that, in the present application, the piezoelectric element of the piezoelectric driving assembly may only have two electrode sheets with opposite polarities, so that the forked end of the forked flexible connecting belt only needs two forked parts, which The two branch parts are respectively connected to the two electrode pieces of the piezoelectric element. The piezoelectric driving components include both horizontal piezoelectric driving components and vertical piezoelectric driving components.

Further, still referring to FIG. 21 , in an embodiment of the present application, the third connecting strip 911 can also be used to connect the sleeve circuit boards of the single sleeves of adjacent layers. From a top-down perspective, the sleeve circuit board support of the upper sleeve and the sleeve circuit board support of the lower sleeve are usually staggered by a certain distance, so the sleeve circuit board of the upper sleeve can use the arc-shaped connecting belt along the upper sleeve. The surface of the bottom plate is connected to the sleeve circuit board bracket of the lower sleeve (or corresponding to the bottom plate opening of the lower sleeve circuit board bracket). The bearing part of the sleeve circuit board of the lower sleeve and the sleeve circuit board bracket of the lower sleeve can pass through the through hole of the bottom plate of the upper sleeve and be electrically connected to the arc connection. Using this method, the uppermost sleeve circuit board can be drawn down layer by layer until it is connected to the transfer circuit board located on the top surface of the support base. The arc-shaped connecting strip can also be in other shapes, as long as the central light-passing hole can be avoided. It should be noted that, in FIG. 21 , the first sleeve 910 is located at the bottommost layer of the sleeve assembly, so there is no sleeve circuit board bracket passing through the opening of the bottom plate for drawing the lead portion downward. Referring to FIG. 22 , it can be seen that the sleeve circuit board support 831 of the second sleeve 920 is staggered from the position of the sleeve circuit board support 821 of the first sleeve 910 (referring to the position staggered in the top view), so as to avoid The two sleeve circuit board supports 821 and 831 interfere with each other when the sleeve assembly is retracted. The lead portion 833 drawn downward from the position of the sleeve circuit board bracket 831 can be connected to the sleeve circuit of the next layer of single sleeve at the position of the sleeve circuit board 821 through the third connecting strip 911 board (in conjunction with reference to Figure 22). Further, in this embodiment, for each of the single sleeves, a Hall element is installed on the top of the circuit board support, and the circuit board of the sleeve is electrically connected to the Hall element. For example, for the first sleeve 910 , a Hall element 826 is installed on the top of the sleeve circuit board bracket 821 , and the bearing portion 822 of the sleeve circuit board is electrically connected to the Hall element 826 .

In the above-mentioned piezoelectric drive-based sleeve assembly, the multi-stage piezoelectric drive rods can gradually push the single sleeves at different levels (for ease of description, the single sleeves are sometimes referred to as sleeves hereinafter) to rise or rise. Down, so that the total extension distance of the top sleeve (referring to the sleeve at the top in the extended state) is extended, thereby increasing the back focus distance in the telephoto shooting state. Moreover, based on the design scheme of the above embodiment, the extension distance of the top sleeve can be extended by increasing the number of sleeve layers, thereby further improving the back focus distance and magnification of telephoto shooting. Specifically, in a variant embodiment of the present application, the sleeves of any adjacent layers may be connected by the piezoelectric drive assembly. Specifically, the fixing block of the piezoelectric drive assembly can be fixed on the i-th layer of sleeves, the fixing block can be located at the bottom of the i-th layer of sleeves, and the driving rod can be in a vertical state (that is, the axis of the driving rod and the The axis of the sleeve, that is, the optical axis is substantially parallel). The moving block is mounted on the driving rod and can move in a vertical direction along the driving rod. In addition, the moving block is fixed to the i+1th layer sleeve. In this embodiment, the moving block is fixed with the bottom of the sleeve of the i+1th layer. In this way, the sleeve of the i+1 layer can be moved in the vertical direction under the driving of the moving block, so as to realize the expansion and contraction of the sleeve of the i+1 layer relative to the sleeve of the i layer. where i=1, 2, ..., N-2, N-1. In this embodiment, the multi-layer sleeves can be connected layer by layer based on the piezoelectric drive assembly (the connection is a movable connection), thereby realizing a wide range of expansion and contraction of the multi-layer sleeves. Compared with the periscope telephoto module, the piezoelectric-driven sleeve-type actuator of this embodiment can reduce the pre-installation space inside the smart terminal in the retracted state. In the extended state, based on this piezoelectric drive For the sleeve assembly where the components are connected layer by layer, the optical path length of the module can reach several times the thickness of the smart terminal (such as a mobile phone) itself, which is sufficient to support the needs of telephoto shooting. When N=4, the sleeve assembly has 4 layers of sleeves, and when N=5, the sleeve assembly has 5 layers of sleeves. Generally speaking, when the number of sleeve layers is increased, the top sleeve will have a larger extension distance, so that the camera module can support a larger zoom factor.

On the other hand, with reference to FIG. 21 and FIG. 22 , in some embodiments of the present application, the piezoelectric driving rods in the telescopic module for driving telescopic telescopic sleeves at different levels may be arranged in the same accommodating cavity, so that It is advantageous to avoid setting up multiple mutually isolated accommodating cavities between the cylinder walls of multiple adjacent sleeves, which is beneficial to reduce the structural complexity of the module. At the same time, since the drive rods of different levels can be arranged in the same annular accommodating cavity, when the telescopic sleeve assembly is assembled, it can have a larger installation space, which is convenient for the automatic assembly of the actual product.

Furthermore, referring to FIG. 21 , in some embodiments of the present application, each layer of the sleeve may have a plurality of piezoelectric driving components, and these piezoelectric driving components may be evenly distributed in different directions from a top view, so as to The sleeve provides stable support, which is beneficial to ensure the straightness of the telescopic sleeve (that is, to ensure that the telescopic direction of each sleeve is kept on the same line parallel to the optical axis as much as possible).

Further, in some embodiments of the present application, the Nth layer sleeve (the topmost sleeve) includes an Nth layer barrel wall, a top cover and the lens carrier; the inner part of the Nth layer barrel wall The side surface, the outer side surface of the lens carrier and the lower surface of the top cover form the annular accommodating cavity. In a top view, a plurality of the piezoelectric driving components at the same level are evenly distributed around the lens carrier. In the contracted state, the piezoelectric driving components of different layers are arranged alternately in sequence in the annular accommodating cavity. Moreover, in a top view, the piezoelectric driving components located at different levels (except the piezoelectric driving components installed between the inner side of the casing and the outer side of the sleeve component) are staggered in the circumferential direction and distributed in a single ring. Herein, the circumferential direction refers to the circumferential direction. Circumferential staggering is staggering along the circumferential direction, rather than radially staggering. Radial refers to the diameter direction. Correspondingly, the circumferentially staggered design results in that the piezoelectric driving components and auxiliary guiding structures of different layers are distributed on the same ring (ie, distributed on a single ring or in a single ring), rather than two or more. on many concentric rings. This design can improve the space utilization of the annular accommodating cavity and help reduce the radial size of the module.

Further, in some embodiments of the present application, for any layer of sleeves, a part of the plurality of piezoelectric driving components that drive the expansion and contraction of the layer of sleeves may be replaced by auxiliary guide structures. For example, suppose i is any integer from 2 to N. Then, for the i-th layer of sleeves, the auxiliary guide structure may include, for example, a guide column having a vertical guide groove thereon. The bottom of the guide column can be connected to the sleeve of the i-1 layer, for example, can be connected to the bottom plate of the sleeve of the i-1 layer. A sliding block can be connected to the cylinder wall or bottom plate of the i-th layer of the sleeve, and the sliding block can slide along the guide column. The sliding block is provided with a ball accommodating groove, the ball is located in the ball accommodating groove, and the ball is supported between the guide column and the sliding block, so that when the sliding block slides along the guide column , the ball can roll along the vertical guide groove, and the ball is always located between the ball accommodating groove and the vertical guide groove. This ball-based auxiliary guide structure can reduce the resistance of the i-th layer sleeve to the telescopic movement relative to the i-1-th layer sleeve. The auxiliary guide structure can enhance the stability and straightness of the telescopic sleeve, and at the same time can help reduce the number of piezoelectric driving components and corresponding driving lines, so as to reduce the cost and the difficulty of the assembly process. In a modified embodiment, the guide column of the auxiliary guide structure can be eliminated, and the vertical guide groove can be provided on the inner side surface of the cylinder wall of the i-1th layer sleeve.

Further, in some embodiments, i may be 1, in this case, the i-1th layer of sleeves is the 0th layer of sleeves, and the casing may be regarded as the 0th layer of sleeves. That is to say, the vertical guide grooves may be provided on the housing, for example, on a guide column directly or indirectly connected with the housing, or directly on the inner side surface of the housing. The first-layer sleeve can expand and contract relative to the housing under the combined action of the piezoelectric drive assembly and the auxiliary guide structure.

Further, in one embodiment, the i=3, that is, the sleeve assembly has three layers of sleeves (if the casing is regarded as the 0th layer of sleeves, there are four sleeves in total). In this embodiment, the number of the first piezoelectric driving components may be two, which are respectively disposed in two diagonal corner areas, and the other two diagonal corner areas may be provided with first auxiliary guiding structures. The number of the second piezoelectric driving components may be four, and the second piezoelectric driving components are evenly distributed and dislocated from the first piezoelectric driving components and the first auxiliary guiding structure. Four third piezoelectric driving components may be provided, and the third piezoelectric driving components are evenly distributed and arranged at a dislocation from the first piezoelectric driving components, the first auxiliary guiding structure, and the second piezoelectric driving components. It should be noted that, in some variant embodiments, part of the second piezoelectric drive assembly may be replaced by the second auxiliary guide structure. In other variant embodiments, part of the third piezoelectric drive assembly may be replaced by a third auxiliary guide structure. For the specific constitution of the first, second and third auxiliary guiding structures, reference may be made to the description of the auxiliary guiding structures in the foregoing, which will not be repeated here.

Further, in some embodiments of the present application, the Nth layer sleeve (the topmost sleeve) includes an Nth layer barrel wall, a top cover and the lens carrier; the inner part of the Nth layer barrel wall The side surface, the outer side surface of the lens carrier and the lower surface of the top cover form the annular accommodating cavity. For the same pair of adjacent sleeves (referring to the two sleeves that are adjacent to each other up and down in the extended state), the two sleeves can be driven by at least one piezoelectric driving component (the driving direction of which is the vertical direction) and at least one auxiliary The guide structure is supported together. In a top view, at least one piezoelectric driving assembly and at least one auxiliary guiding structure connected between the same pair of adjacent layer sleeves are evenly distributed around the lens carrier. Moreover, from a top view, the piezoelectric drive assemblies and the auxiliary guide structures located at different levels are staggered in the circumferential direction and distributed in a single ring (the one installed between the inner side of the casing and the outer side of the sleeve assembly). Excluding Piezo Drive Components and Auxiliary Guidance Structures).

Further, in some embodiments of the present application, a light-passing hole may be provided in the center of the bottom plate of each sleeve of the sleeve assembly, so that light can pass through each layer of sleeves. It should be noted that a base plate (eg, the first base plate of the first layer of sleeves or the second base plate of the second layer of sleeves) is not a necessary component of the sleeve. For example, in some modified embodiments of the present application, part or all of the bottom plate of the sleeve can be eliminated, and the piezoelectric drive assembly can be mounted on the outer or inner floating structure of the cylinder wall at this time.

Further, in some embodiments of the present application, the sleeve assembly has a three-layer sleeve, and in the fully extended state of the sleeve-type module, the back focus distance is 15-25mm (the back focus distance D can be In conjunction with reference to Figure 5). The height of the sleeve-type optical actuator is: 5mm-10mm. In the fully extended state, the protruding distance of the top surface of the sleeve assembly relative to the top surface of the casing is: 20mm-35mm. Referring to FIG. 5 , the ratio of the extension distance L1 of the telescopic optical actuator to the original height L2 of the telescopic optical actuator is in the range of 2-5, that is, the range of L1/L2 is 2-5. Preferably, the range of L1/L2 is 3-4. The extension distance L1 of the telescopic optical actuator here refers to the extension distance that does not include the original height of the telescopic optical actuator itself.

Further, in an embodiment of the present application, in the retracted state, the top surfaces of the sleeves of each layer of the sleeve assembly are flush.

Further, in some embodiments of the present application, the optical anti-shake photosensitive assembly based on piezoelectric driving can be used to realize super-resolution photography, which will be further described below.

In one embodiment, a camera module suitable for super-resolution shooting is provided, and the camera module includes a lens assembly, an optical anti-shake photosensitive assembly, and a super-resolution shooting control unit (also referred to as a first control unit) and an image synthesis unit (also referred to as a data processing unit). The super-resolution shooting control unit is used to control the piezoelectric drive component of the optical anti-shake photosensitive component. The piezoelectric drive component drives the photosensitive chip to move linearly on the x-axis and y-axis, and moves linearly through the x-axis and y-axis of the photosensitive chip. Realize super-resolution shooting. The image synthesizing unit is used for synthesizing multiple images captured when the photosensitive chip is moved to multiple different positions into a super-resolution image.

In traditional image capture, there is only one color channel information in a single pixel, and other color channel information is filled by interpolation. For example, FIG. 24 shows the arrangement of single-color photosensitive pixel units of different colors in the photosensitive chip. In the example of FIG. 24, a complete color macro pixel consists of a 2x2 regular grid, and this 2x2 regular grid contains four monochrome photosensitive pixel units. In actual shooting, one color information is captured, and the other three color channel information is filled by the color channel information on the periphery of the pixel, but this method will produce moiré fringes, which will cause blur or mosaic when the image is enlarged. The color of a color channel to be filled is filled according to the information of the four color channels around it, that is, interpolation. In a current camera module, a single pixel generally has four color channels, and the color arrangement is generally RGGB (ie, red, green, green, and blue). In this embodiment, the photosensitive chip is periodically moved by an x-axis piezoelectric driving component (eg, the first piezoelectric driving component mentioned above) and a y-axis piezoelectric driving component (eg, the second piezoelectric driving component mentioned above) , so that each pixel of the image can obtain the measured values of the three color channels of red, green and blue. Specifically, it is assumed that the pixel array of the photosensitive chip is arranged in an RGGB (ie, red, green, green and blue) arrangement, as shown in FIG. 24 . Further, FIG. 25 shows the moving direction and four different position states of the photosensitive chip captured by super-resolution. The thick arrows in the figure indicate the transition from one state to another, and the thin arrows indicate the moving direction of the photosensitive chip. In this embodiment, the photosensitive chip can be moved to transfer the sample image acquisition position from one position state to another position state, and this moving process can be called super-resolution shift. This offset is usually performed at the pixel or sub-pixel scale. Specifically, referring to FIG. 25 , when performing super-resolution shooting, a base image is first shot. The base image corresponds to the a state in FIG. 25 . Then, the photosensitive chip is translated by a distance of one pixel unit in the positive x-axis direction through the x-axis piezoelectric drive component (or called translation of a pixel unit). At this time, the photosensitive area of the photosensitive chip will be translated by one pixel unit in the positive direction of the x-axis as a whole. , and enter the second state, that is, the b state in FIG. 25 . In the second state, the four photosensitive pixel units in the first state move to the right as a whole, the two photosensitive pixel units on the right enter the dotted frame in the second state, and the two photosensitive pixel units on the left occupy The position of the original two photosensitive pixel units on the right. The two photosensitive pixel units located on the further left outside the solid line frame in the first state are moved into the two pixel units on the left side in the second state. After the shooting of the second state is completed, the photosensitive chip is translated by a distance of one pixel unit in the negative direction of the y-axis through the y-axis piezoelectric drive assembly. At this time, the photosensitive area of the photosensitive chip will be translated by one pixel unit in the negative direction of the y-axis as a whole. Enter the third state, that is, the c state in FIG. 25 . After the shooting of the third state is completed, the photosensitive chip is translated by a distance of one pixel unit in the negative direction of the x-axis through the x-axis piezoelectric drive assembly. At this time, the photosensitive area of the photosensitive chip will be translated by one pixel unit in the negative direction of the x-axis as a whole. The fourth state is entered, that is, the d state in FIG. 25 . After completing the shooting of the fourth state, the photosensitive chip is translated by a distance of one pixel unit in the positive direction of the y-axis through the y-axis piezoelectric drive assembly. The first state, that is, state a in FIG. 25 , is the state of returning to the base image. Since only the photosensitive chip is moved in the transition between shooting states in this embodiment, the above four shooting states can also be understood as chip position states. For two adjacent chip position states, the movement amount of the photosensitive chip may be the distance of one pixel of the to-be-synthesized image (note that the pixel here refers to the pixel of the to-be-synthesized image, that is, the super-resolution image Pixels do not refer to the original macro pixels of the photosensitive chip. In this paper, macro pixels are the basic units that contain all monochrome photosensitive pixel units. For example, four monochrome photosensitive pixel units in Figure 24 can form a macro pixel. will be further introduced in the text).

Examining the above four shooting states, it can be seen that for each pixel unit in the solid line frame, in a complete shooting cycle, the photosensitive pixel units of the three colors (ie, the three primary colors) of the photosensitive chip are moved to the photosensitive chip at least once. Within the pixel unit (ie, the pixel unit corresponding to the solid line box). For example, it is assumed that the pixel unit in the upper left corner is the first pixel unit. In the first state, the green light-sensitive pixel unit (assuming the square mark represents green) is moved to the first pixel unit, where the green light-sensitive pixel unit receives the light signal and outputs the green channel value of the image; in the second state, the red The photosensitive pixel unit (assuming that the circular mark represents red) is moved to the first pixel unit, at which time the red photosensitive pixel unit receives the light signal and outputs the red channel value of the image; in the third state, another green photosensitive pixel unit is Move to the first pixel unit, at this time, the second green photosensitive pixel unit receives the light signal and outputs the green channel value of the image; in the fourth state, the blue photosensitive pixel unit (assuming that the triangle mark represents blue) is moved to The first pixel unit, at this time, the blue light-sensitive pixel unit receives the light signal and outputs the blue channel value of the image. In this way, in one shooting cycle, by combining the images taken four times, the channel values of all three primary colors of the first pixel unit can be obtained, thereby obtaining the complete image data of the color super-resolution image in this pixel unit without interpolation. Similarly, for the second pixel unit in the upper right corner, the third pixel unit in the lower right corner, and the fourth pixel unit in the lower left corner, each pixel unit can obtain the complete three primary color channel values within four shots of one shooting cycle. , and then obtain the complete image data of the color super-resolution image corresponding to the pixel unit without interpolation.

In the above embodiment, the pixel arrangement of the photosensitive chip is an RGGB arrangement, and the four single-color photosensitive pixel units of the RGGB can form a macro pixel containing all color image information. In other words, the four monochrome photosensitive pixel units of RGGB can be regarded as four sub-pixels of a macro pixel. The photosensitive area of the photosensitive chip is an array composed of a large number of macro pixels.

It should be noted that the four pixel units represented by the solid line frame in FIG. 24 represent the four pixel units of the color super-resolution image to be synthesized (hereinafter sometimes referred to as the image to be synthesized), which are captured in the super-resolution image. Within a cycle, the position of the pixel unit of the image to be synthesized remains unchanged. When the moving speed of the photosensitive chip is sufficiently fast and the duration of one cycle of super-resolution shooting is short enough, the subject and its shooting conditions (such as lighting conditions) can be considered to remain unchanged. In addition, the optical lens of the camera module The position and attitude assumptions of , also remain unchanged, so the position of the light from the object and projected to the image plane through the optical lens is also unchanged. For any position on the image plane (which can be characterized by the position of the pixel unit of the image to be synthesized), the photosensitive chip is shifted so that the single-color photosensitive pixel units of three colors can appear at this position at least once in a cycle, that is, The measured color values of the complete three primary colors can be obtained. Fill all the pixel units of the image to be synthesized with the measured color values of the three primary colors in one shooting cycle, and then a color composite image based on the measured values can be obtained. It should be noted that each pixel unit (or called each pixel) of the image to be synthesized corresponds to a coordinate position on the image plane (also called the image plane) in the actual shooting, and this coordinate position is the super-resolution image. A pixel location mapped on the image plane. During the movement of the photosensitive chip captured by the super-resolution, the pixel position of each pixel mapped on the image surface by the super-resolution image is always the same. In other words, what is changed in the super-resolution offset of the photosensitive chip is only the position of the photosensitive chip and the monochromatic photosensitive pixel unit of the photosensitive chip for collecting light signals. With super-resolution shifting, one single-color photosensitive pixel unit can be moved from its original position to the position of another single-color photosensitive pixel unit. The two single-color photosensitive pixel units may be single-color photosensitive pixel units of different color channels in the same macro pixel. In the design of the moving route, make the moving route satisfy: for any pixel position of the super-resolution image mapped on the image plane, the single-color photosensitive pixel unit of each color is moved to at least this pixel position once. In this way, the single-color photosensitive pixel units of all colors can be moved to each pixel position of the super-resolution image, so as to obtain the measured data values of all colors at all pixel positions. Imaging quality of the synthesized super-resolution images.

Note that the movement route shown in FIG. 24 is not unique. For example, FIG. 26 shows the moving route of the photosensitive chip in another embodiment during super-resolution shooting and the coverage area of the image sample obtained by the four position states of the photosensitive chip, and FIG. 27 shows the photosensitive chip of FIG. 26 . Schematic diagram of the movement from the top view of the driving device, the carrier and the photosensitive chip mounted thereon corresponding to the moving route of . Referring to FIGS. 26 and 27 , in this embodiment, a shooting cycle includes: shooting an original image, and the coverage area of the image sample obtained when the photosensitive chip is in the first position is shown in part a in FIG. 26 . On the basis of the original image shooting (that is, on the basis of the initial sample), first step 1 is performed, the photosensitive chip moves about a pixel distance in the positive direction of the y-axis, and the image sample obtained by the photosensitive chip in the second position is covered. The area is shown in part b in Figure 26; then step 2 is performed, the photosensitive chip moves about a pixel distance in the positive direction of the x-axis, and the image sample coverage area obtained by the photosensitive chip in the third position is shown in Figure 26. Then perform step 3, the photosensitive chip moves about a pixel distance in the negative direction of the y-axis, and the image sample coverage area obtained by the photosensitive chip in the fourth position is shown in part d in Figure 26. . After completing step ③, a super-resolution image capture can be completed. Finally, return to the position where the original image was taken, that is, the photosensitive chip moves about a pixel distance in the negative direction of the x-axis, so as to start the next super-resolution image capture. The moving route of the present application can also have more deformation forms. For example, in another embodiment of the present invention, the moving route of the photosensitive chip can also be the negative and reverse movement of the y-axis first, then the positive and negative movements of the x-axis, then the positive direction of the y-axis, and finally the positive direction of the x-axis. In yet another embodiment, the movement in the negative direction of the x-axis may also be performed first, then the movement in the positive and negative directions of the y-axis, and then the movement in the positive direction of the x-axis. There are many other kinds of square circular movement routes, which will not be repeated here.

It should be noted that the pixel arrangement of the photosensitive chip is not limited to the RGGB arrangement. For example, in some solutions, each macro pixel can be composed of three monochromatic photosensitive pixel units, and the three monochromatic photosensitive pixel units can be distributed in a triangle. . At this time, the movement route of the single shooting cycle configured by the super-divided shooting control unit can be adjusted accordingly. For example, the movement route of a single shooting cycle is defined as a route consistent with the pixel arrangement, that is, a triangular movement route (the movement route shown in FIG. 25 may be called a square movement route or a "mouth"-shaped movement route). Specifically, in an embodiment of the present application, the pixels of the photosensitive chip of the camera module are arranged in a triangular arrangement, and the super-division shooting control unit is used to control the x-axis piezoelectric drive assembly and the y-axis The driving voltage of the piezoelectric driving component makes the movement route of the photosensitive chip also a triangular movement route, wherein the movement distance of each movement is the distance of a single pixel. Each movement can be driven only by the x-axis or y-axis piezoelectric drive components, or it can be driven by both the x-axis and y-axis piezoelectric drive components (for example, when the moving route has both x and y components, that is, the moving route with non-zero angles to both the x- and y-axes).

In one embodiment of the present application, in one shooting cycle of the super-resolution image, the super-resolution shooting control unit is configured to control the amplitude and frequency of the driving voltage of the piezoelectric driving component of the photosensitive component. By periodically changing the driving voltage at a certain frequency, the photosensitive component can be periodically vibrated on the x-axis and y-axis driven by the piezoelectric driving component, so as to obtain a shooting cycle required for super-resolution images. Subimages in all states. The sub-image here refers to the image of the photosensitive chip in each position state (eg, the first state, the second state, the third state and the fourth state in FIG. 25 ) in one shooting cycle. In the sub-images of four shots of a shooting cycle, the overlapping regions of these four shots can be taken out to synthesize super-resolution images. In this application, the sub-image taken each time may also be referred to as an image sample. Each position state in a shooting cycle can be referred to as an image sample acquisition position of the photosensitive chip.

In the present application, the moving route of a single photographing cycle configured by the super-division photographing control unit is not limited to a square route, and the moving route can be flexibly designed according to the pixel arrangement of the photosensitive chip. The moving route satisfies the following conditions: within a shooting cycle, for each position in the picture (the position corresponding to each pixel unit of the image to be synthesized), the monochromatic photosensitive pixel unit of each color appears at this position at least once. In this way, when the photosensitive chip is driven to move according to the moving route, complete color information can be obtained to synthesize a super-resolution image.

In some embodiments of the present application, a piezoelectric driving component is introduced into the photosensitive component to drive the photosensitive chip radially (the radial direction refers to the direction parallel to the photosensitive surface of the photosensitive chip, and the axis is the normal direction of the photosensitive surface), So that the photosensitive chip can translate the distance of a single pixel along the image plane with high precision. Specifically, the superresolution imaging control unit only needs to control the amplitude of the driving voltage, and can control the actual amplitude of the piezoelectric element, thereby adjusting the movement amount of the carrier of the piezoelectric driving component in one vibration period. Therefore, by controlling the amplitude of the driving voltage, the moving amount of the carrier and the photosensitive chip mounted on it can be controlled within a distance of one pixel, so that in multiple shots on the moving route of the same super-resolution image shooting, each time The positions of the photosensitive pixel units during shooting are precisely overlapped, thereby ensuring the imaging quality of the synthesized super-resolution images.

On the other hand, in some embodiments of the present application, the super-resolution imaging control unit only needs to control the frequency of the driving voltage, so as to control the moving speed of a single super-resolution image capturing. Increasing the frequency of the driving voltage can increase the moving speed of the photosensitive chip, thereby completing a shooting cycle of super-resolution shooting in a shorter time. Shortening the super-resolution shooting time will help reduce the error of the synthesized super-resolution images. Ideally, for the multiple shots required for super-resolution images, the target should be in the same position each time, and its lighting and many other shooting conditions should be the same. However, this is not the case. That is to say, for the multiple shots required for super-resolution images, the actual target object and shooting conditions may change each time. If the time interval of the sub-shooting is too long, the position of the captured object and the shooting conditions may be shifted or changed, resulting in a large error in the synthesized super-resolution image. Compared with the traditional OIS driving method, the piezoelectric driving component of this embodiment has a large driving force and a fast response speed, so it can help to shorten the super-resolution shooting time, thereby reducing the error of the synthesized super-resolution image. In this embodiment, one super-resolution shooting is preferably completed within 0.1S. Of course, in some other embodiments, one super-resolution shooting can also be set to be completed within 1S.

In the foregoing embodiments, the high-precision translation of the photosensitive chip on the x-axis and the y-axis is realized based on the piezoelectric drive assembly. In this way, when performing super-resolution shooting, on the premise that the position and attitude of the imaging lens group of the optical lens remain unchanged, the photosensitive chip can be driven to perform a single-pixel translation on its image surface according to a preset moving route. , so that the super-resolution image is synthesized by capturing image data of all color channels of all pixel units of the super-resolution image for many times. All image data of the super-resolution image are actually collected imaging data, which has better imaging quality than traditional interpolation algorithms. Compared with the super-resolution shooting scheme that drives the optical lens to translate or adjust the tilt angle, in the direct translation photosensitive chip shooting scheme of the present application, multiple shootings in the same shooting cycle have better consistency. Specifically, if in the same shooting cycle, it is necessary to change the position of the imaging screen by adjusting the position or inclination of the optical lens, the repeatability of the light information projected on each position of the image plane will decrease, and the multiple The corresponding optical imaging systems during shooting (such as four shots under the RGGB arrangement) cannot be strictly consistent, that is to say, the light information projected on each position of the image plane after the light passes through the optical imaging system in each shooting is actually Certain changes will occur. However, in the present application, in the same shooting cycle, the position and posture of the imaging lens group of the optical lens can be always the same, so in each shooting in the same shooting cycle, the corresponding optical imaging systems are strictly consistent, The light information projected on each position of the image plane is exactly the same, so the direct translation photosensitive chip shooting solution of the present application can make the shooting of the same shooting cycle of the super-resolution image have better consistency, thereby improving the imaging quality .

Further, in the above-mentioned embodiment, the piezoelectric drive assembly can be used to realize both the anti-shake function and the super-resolution image capturing function. However, it should be noted that, in other embodiments of the present application, the piezoelectric driving assembly may also be used only to realize the super-resolution image capturing function. In such embodiments, the piezoelectric element of the piezoelectric driving assembly may be configured such that a single vibration of the piezoelectric element causes the photosensitive chip to move exactly one pixel distance. Here, the pixel distance refers to the distance of one pixel of the image to be synthesized. The pixels of the image to be synthesized are the pixels of the super-resolution image.

That is, in an embodiment of the present application, the first control unit controls the moving distance of the photosensitive chip through a driving voltage, the frequency control range of the driving voltage is 500~1000KHZ, and the amplitude value range is -5V~+5V . The control precision of the first control unit to the piezoelectric driving assembly may be 0.1 μm˜1 μm. Under this control precision, the offset distance of the photosensitive chip can be the size of a single pixel, or even the size of a sub-pixel level, such as the size of 1/2 pixel.

Further, in an embodiment of the present application, the piezoelectric element of the piezoelectric driving component may be formed by stacking a plurality of piezoelectric material layers, and these piezoelectric material layers may be divided into a first type of piezoelectric material layer and a second type of piezoelectric material layer Piezoelectric material layer. The first type of piezoelectric material layer and the second type of piezoelectric material layer may be separated by an electrode sheet, so that the two may be independently applied with a driving voltage. The surfaces of the first type of piezoelectric material layer and the second type of piezoelectric material layer may both be perpendicular to the driving rod of the piezoelectric driving component (that is, the thickness direction of the first type of piezoelectric material layer and the second type of piezoelectric material layer and the driving rod. The axis of the rod is in the same direction). The layer of piezoelectric material of the first type may be configured to be adapted to drive the moving part to move a first distance upon a single activation, the first distance being a set offset of the super-resolution a distance (eg one pixel distance); the second type of piezoelectric material layer is configured to be adapted to drive the moving portion to move a second distance greater than the first distance upon a single activation . Specifically, the first type of piezoelectric material layer can be dedicated to realize super-resolution image capturing function. For example, when a mobile phone (or other smart device) needs to perform super-resolution photography, only the corresponding driving voltage may be applied to the first type of piezoelectric material layer (the driving voltage may not be applied to the second type of piezoelectric material layer), so that the The photosensitive chip can precisely move a single pixel distance on the xoy plane (ie, the image plane). The second type of piezoelectric material layer can be used to realize the anti-shake function. When the mobile phone shakes, only the corresponding driving voltage can be applied to the second type of piezoelectric material layer, and the vibration of the second type of piezoelectric material layer can provide greater The driving force makes the photosensitive chip move faster, thereby achieving a faster anti-shake response and providing a larger anti-shake stroke. Further, when used for the anti-shake function, a driving voltage can also be applied to the first type of piezoelectric material layer and the second type of piezoelectric material layer at the same time, thereby providing a larger driving force to further improve the anti-shake response speed. and anti-shake stroke. In this embodiment, the piezoelectric element is designed to include a first-type piezoelectric material layer and a second-type piezoelectric material layer, and the amplitude of the second-type piezoelectric material layer may be greater than that of the first-type piezoelectric material layer. Amplitude, in which the first type of piezoelectric material layer with smaller amplitude can be dedicated to single-pixel or even sub-pixel level photoreceptor chip movement, in order to provide more precise chip positioning for super-resolution image capture, thereby improving super-resolution images image quality.

Further, in an embodiment of the present application, the camera module may further include a second control unit, the second control unit is used to control the driving voltage provided to the piezoelectric driving component, and the second control unit is It is configured to control the photosensitive chip to perform anti-shake movement. For example, a position sensor can be used to detect the shaking of the camera module and calculate the movement direction and movement amount of the anti-shake movement of the photosensitive chip required to compensate for the shaking. Then, according to the calculated movement direction and movement amount of the photosensitive chip anti-shake movement, a corresponding driving voltage is output to the piezoelectric driving component.

Further, in an embodiment of the present application, when performing super-resolution shooting, the photosensitive chip can be controlled to move at the x-axis by applying the set driving voltage to the piezoelectric driving component in the x-axis direction. A pixel-level shift is performed in the direction to achieve the super-resolution shift described above in the x-axis direction. Similarly, the pixel-level movement of the photosensitive chip can be controlled in the y-axis direction by applying the set driving voltage for the pixel-level movement to the piezoelectric driving component in the y-axis direction, so as to realize the above-mentioned movement in the y-axis direction. The super-resolution offset described above. In an example, it is assumed that the movement distance of a single activation of the piezoelectric driving device purchased in the market is L, and the single pixel size of the photosensitive chip is U (the single pixel size here refers to the size of a single-color photosensitive pixel unit, not the size of the macro pixel), and the driving voltage of the piezoelectric driver is V (for example, its rated driving voltage is V), then the driving voltage required for super-resolution offset can be configured as (U/L)V, so that The single activation distance of the piezoelectric driving device during super-resolution shooting can be exactly one pixel distance.

Further, in an embodiment of the present application, when the moving distance of the photosensitive chip driven by the single vibration of the piezoelectric element of the purchased piezoelectric driving component in its standard working state is greater than the distance of a single pixel (one pixel distance) , by proportionally controlling the amplitude of the driving voltage to ensure that the movement of the photosensitive chip is controlled within a single pixel distance.

Further, in another embodiment of the present application, when the piezoelectric element of the purchased piezoelectric driving component is in its standard working state, the moving distance of the photosensitive chip driven by a single vibration is greater than a single pixel distance (one pixel distance) , the movement of the photosensitive chip can be controlled within a single pixel distance by shortening the single activation time of the piezoelectric driving component.

Further, in an embodiment of the present application, the resolution of the super-resolution image may be higher than the resolution of the photosensitive chip. In this embodiment, when performing super-resolution shooting, the movement amount of the super-resolution offset is smaller than the distance between the adjacent photosensitive pixel units in the photosensitive chip. That is to say, after performing super-resolution offset, the photosensitive pixel unit can be moved to a position between two pixels in the original image sample (hereinafter referred to as the middle position) to capture the actual "image" at the middle position. Compared with the data value of the intermediate position that is virtually calculated by interpolation, the solution of actually collecting the optical signal by super-resolution offset in this embodiment can effectively improve the imaging quality of the super-resolution image. It should be noted that, in this embodiment, the middle position is not limited to the position of the center between two pixels (ie, the position offset by 1/2 pixel of the photosensitive chip along the x-axis or the y-axis). For example, the middle position can also be a position offset by 1/3 or 2/3 pixels along the x-axis or y-axis, that is, a super-resolution offset can be shifted along the x-axis or y-axis by 1/3 pixel of the photosensitive chip /3, 2/3 pixel positions. In this embodiment, for a photosensitive chip used for color image imaging, the distance of one pixel of the photosensitive chip can be understood as the distance of one macro pixel (that is, the distance between adjacent macro pixels, which can be calculated as a macro pixel distance when calculating the distance. The center point of the pixel is used as the reference for calculation). For a photosensitive chip used for black-and-white image imaging, the distance of one pixel of the photosensitive chip can be understood as the distance of one photosensitive pixel unit (that is, the distance between the adjacent photosensitive pixel units, and the distance between the photosensitive pixel units can be calculated as the distance between the photosensitive pixel units. The center point of the element is used as the datum for calculation).

The solution based on the ball suspension system and the electromagnetic drive assembly will be described below with reference to some embodiments.

In the foregoing embodiments, the high-precision translation of the photosensitive chip on the x-axis and the y-axis is realized based on the piezoelectric drive assembly, but it should be noted that the present application is not limited to this, and in other embodiments, a ball suspension system can be used And electromagnetic drive components to achieve high-precision translation of the photosensitive chip on the x-axis and y-axis. Among them, the ball suspension system can limit the position of the photosensitive chip carrier in the z-axis direction through the ball, so as to ensure that the photosensitive chip is strictly translated on the xoy plane.

FIG. 28 shows a schematic exploded perspective view of a photosensitive assembly in an embodiment of the present application. Referring to FIG. 28 , in an embodiment of the present application, the photosensitive component includes a support base 210 , a first chip carrier 220 , a photosensitive chip 230 , a first electromagnetic driving component 240 , a second electromagnetic driving component 250 , and a second chip carrier 260 , the module circuit board 270 and the housing base 280 . The housing base 280 includes a bottom plate 281 and a side wall 282 . The support base 210 is fixed on the housing base 280 and constitutes the upper cover of the photosensitive assembly. The support base 210 and the housing base 280 can encapsulate other parts of the photosensitive assembly inside, so as to play a protective role. Meanwhile, the support base 210 can also play a role of supporting the sleeve-type optical actuator. In the entire camera module, the casing 140 (referring to the square casing of the telescopic optical actuator) can be fixed integrally with the support base 210 and the casing base 280 . A first chip carrier 220 , a photosensitive chip 230 , a second chip carrier 260 and a module circuit board 270 are arranged under the support base 210 in sequence. In this embodiment, the second chip carrier 260 is in the shape of a flat plate, and the photosensitive chip 230 is mounted on the upper surface of the second chip carrier 260 . The combination of the photosensitive chip 230 and the second chip carrier 260 is mounted on the upper surface of the module circuit board 270 . The modular circuit board 270 may include a hard board 271 , an S-shaped flexible board 272 and a connecting portion 273 . The hard board 271 may be a PCB board with a rectangular shape. Four sides of the hard board 271 are respectively connected to the S-shaped flexible board 272 (wherein each side can be connected to a plurality of S-shaped flexible boards 272 ), and the other end of the S-shaped flexible board 272 is connected to the connecting portion 273 . The connecting portion 273 is supported against the side wall 282 of the housing base 280 , and the connecting portion 273 can be used to realize the electrical connection between the module circuit board 270 and the outside world. In this embodiment, the support base 210 , the first chip carrier 220 and the second chip carrier 260 are movably connected through balls, so that the second chip carrier 260 can be driven relative to the first chip carrier by the second electromagnetic drive assembly 250 . 220 moves along the x-axis, so that the combination of the first chip carrier 220 and the second chip carrier 260 can move along the y-axis relative to the support base 210 under the driving of the first electromagnetic driving component 240 . The x-axis and the y-axis are both coordinate axes parallel to the surface of the photosensitive chip 230 . The x and y axes are perpendicular to each other. Herein, the z-axis represents the coordinate axis in the normal direction of the surface of the photosensitive chip 230 . Combined with the previous analysis, for the telescopic camera module, since its lens assembly includes a telescopic optical actuator for realizing the telescopic function, its sleeve assembly and its driving structure (such as pressing a plurality of electric motor assemblies) ) needs to occupy a certain volume (the dimensions in the x-axis, y-axis and z-axis directions may be increased compared with ordinary optical actuators); on the other hand, telescopic camera modules are often used for telephoto shooting, and Telephoto shooting is particularly sensitive to jitter, so the telescopic camera module needs to realize the anti-shake function. However, if a drive module and a suspension system for realizing the anti-shake function are directly added to the lens assembly, the size of the optical actuator will inevitably be further increased, which is not conducive to the miniaturization of the camera module. In this embodiment, the support base is used as the base part to realize the movement of the photosensitive chip relative to the x-axis and the y-axis of the support base through a clever concept, and the shaking of the camera module during the shooting process is compensated by the chip movement. Since the mass of the photosensitive chip is smaller than that of the lens assembly, the driving force required by the driving module for chip anti-shake can also be smaller, which is beneficial to reduce the size of the driving module (such as magnets and coils) itself. In addition, the piezoelectric drive components of the telescopic optical actuator will occupy a certain lateral space (that is, the space in the x-axis and y-axis directions) around the lens, and the various components used for the chip anti-shake function can just be arranged in the This part of the lateral space added by the telescopic optical actuator can effectively improve the space utilization of the telescopic camera module. Further, in this embodiment, the support seat 210 is located on the uppermost layer of the entire photosensitive assembly (that is to say, the support seat 210 can serve as the upper cover of the photosensitive assembly), which not only plays a guiding role in guiding the photosensitive chip to move in the y-axis direction, In addition, it also plays a role in encapsulating the overall photosensitive assembly, that is, encapsulating other elements of the photosensitive assembly inside the housing base 280, so that the overall structure remains stable in the working state. In addition, the integral package formed by the support base 210 and the housing base 280 can support the telescopic lens assembly (including the telescopic optical actuator and the optical lens installed therein), so that, When the telescopic lens performs the telescopic motion, the bottom structure of the telescopic lens can be better ensured to be stable, thereby helping to improve the precision of the telescopic lens' telescopic motion.

Further, FIG. 19 shows an assembly schematic diagram of the internal structure of the photosensitive assembly in an embodiment of the present application. In order to clearly show the internal structure, FIG. 19 hides the support base 210 . Referring to FIG. 28 and FIG. 19 , in one embodiment of the present application, the first chip carrier 220 is in the shape of a rectangular frame, and the center of the first chip carrier 220 is a hollow window (ie, a light window). After assembly, the photosensitive chip 230 can be Set the position of this window. Further, FIG. 30 shows a schematic perspective view of the first chip carrier in an embodiment of the present application. Referring to FIG. 30 , the first chip carrier 220 has two pairs of parallel sides, wherein the pair of parallel sides (may be referred to as the first side 221 ) has a convex cover 221 a formed by the side of the first chip carrier 220 (the first side 221 ). The side 221) is formed by bulging upward. The x-axis magnet 251 is mounted on the lower surface of the boss 221a. The x-axis magnet 251 may be in the shape of a sheet, which is elongated in a plan view and whose length direction is parallel to the first side 221 . The convex cover 221a may be made of a magnetic shielding material so as to prevent or inhibit the first electromagnetic driving assembly 240 (which is composed of the y-axis magnet 241 and the y-axis coil 242 ) and the second electromagnetic driving assembly 250 (which is composed of the x-axis magnet 251 ) and x-axis coil 252) electromagnetic interference. The other pair of parallel sides of the first chip carrier 220 (which may be referred to as the second sides 222 ) have avoidance grooves 222 a adapted to avoid the y-axis magnet 241 . The y-axis magnet 241 may be in a sheet shape, which is elongated in a plan view and whose length direction is parallel to the second side 222 . In this embodiment, the x-axis coil 252 and the y-axis coil 242 can be fixed on the second chip carrier 260 or on the module circuit board 270, and are electrically connected to the module circuit board 270. After the assembly is completed, the x-axis coil 252 is arranged directly under the x-axis magnet 251 , and the y-axis coil 242 is arranged directly under the y-axis magnet 241 . In this embodiment, the photosensitive chip 230 can be electrically connected to the module circuit board 270 through a wire bonding process (of course, the photosensitive chip of the present application can also be electrically connected to the module circuit board through other processes) . Since the module circuit board 270 and the photosensitive chip 230 are fixed together, during the anti-shake movement, the x-axis coil 252, the y-axis coil 242 and the connection wires between the photosensitive chip 230 and the module circuit board 270 will not be pulled. The reliability of the module is guaranteed. Four corners of the first chip carrier 220 may be provided with ball holes 223 , and each ball hole 223 may accommodate one ball 224 . In this embodiment, the y-axis magnet 241 can be fixed on the lower surface (or inner side) of the support base 210 , and after the assembly is completed, the y-axis magnet 241 is arranged at the position of the escape groove 222 a of the first chip carrier 220 place. The lower surface of the support base 210 also has a first ball guide groove 211 (refer to FIG. 31 ), the position of the first ball guide groove 211 can be adapted to the position of the ball hole of the first chip carrier 220 . In a bottom view, the first ball guide groove may be strip-shaped, and its guiding direction is the y-axis direction. Four corners of the second chip carrier 260 may be provided with second ball guide grooves 261 , and the positions of the second ball guide grooves 261 may be adapted to the positions of the ball holes 223 of the first chip carrier 220 . In a plan view, the second ball guide groove 261 may be strip-shaped, and its guiding direction is the x-axis direction.

Further, still referring to FIG. 30 , in an embodiment of the present application, the convex cover 221a of the first chip carrier 220 may have a magnetic conducting hole 221b. The convex cover 221a may include raised connecting parts 221d on both sides and a plate-shaped convex part 221c in the center. The magnetic conductive hole 221b is disposed on the plate-shaped convex portion 221c of the convex cover 221a, and penetrates through the upper surface and the lower surface of the plate-shaped convex portion 221c. In this way, the magnetic field of the magnet installed under the convex cover 221a can be led out through the magnetic conducting hole 221b, thereby ensuring sufficient driving force in the corresponding direction (eg, the x-axis direction). At the same time, the convex cover 221a can still suppress the electromagnetic interference between the first electromagnetic driving assembly 240 and the second electromagnetic driving assembly 250 .

Further, in an embodiment of the present application, the second chip carrier is in the shape of a flat plate, which may also be called a pad. The gasket is attached to the module circuit board, on the one hand, it can increase the structural strength of the module circuit board, and on the other hand, the surface flatness of the gasket can be higher than that of the module circuit board, which is beneficial to provide stability for the movement of the photosensitive chip (for example, it can avoid the bending of the bearing surface of the photosensitive chip during the movement).

Further, in an embodiment of the present application, the height of the housing base is less than or equal to 5 mm, the module circuit board is accommodated inside the housing base, and its peripheral side is in contact with the housing base through an S-shaped flexible board and a connector. .

Further, in an embodiment of the present application, the x-axis magnet and the y-axis magnet are arranged on the same plane, and the x-axis magnet can be wrapped under the convex cover of the first chip carrier, so that the x-axis magnet and the y-axis magnet can be suppressed. Electromagnetic interference between shaft magnets. At the same time, the x-axis magnet and the y-axis magnet are arranged on the same plane, which can effectively reduce the space occupied by the photosensitive component in the height direction.

Further, in an embodiment of the present application, in the photosensitive assembly, the movement of the photosensitive chip in the x-axis direction and the y-axis direction can share the balls. This design can effectively reduce the photosensitive assembly while simplifying the structure. height and dimensions in other directions. FIG. 31 shows a schematic cross-sectional view of the ball connection of the support base, the first chip carrier and the second chip carrier in an embodiment of the present application. Figure 32 shows the ball holes of the first chip carrier and the second ball guide grooves of the second chip carrier. Referring to FIG. 31 and FIG. 32 , in this embodiment, the top and bottom of the ball 224 may bear against the lower surface of the support seat 210 and the upper surface of the second chip carrier 260 , respectively. The first chip carrier 220 is located between the support seat 210 and the second chip carrier 260 , and the balls 224 pass through the ball holes 223 of the first chip carrier 220 . The inner side of the ball hole 223 can bear against part of the outer surface of the ball 224, so that after the assembly is completed, between the support seat 210 and the first chip carrier 220 and between the first chip carrier 220 and the second chip carrier 260 There are gaps between them. That is to say, in the z-axis direction (that is, in the direction of the normal line of the surface of the photosensitive chip), between the support seat 210 and the first chip carrier 220 and between the first chip carrier 220 and the second chip carrier 260 all pass through the The balls 224 are supported. It should be noted that FIG. 31 only shows the balls 224 at one position and a partial structure near them. In this embodiment, the balls 224 may be arranged in the four corners of the first chip carrier 220 from a top view. In other embodiments of the present application, the balls may also be arranged in other positions from a top view, as long as the support seat and the first chip carrier can be supported in the z-axis direction, and the first chip carrier can be supported in the z-axis direction. The support of one chip carrier and the second chip carrier is sufficient. The guide direction of the second ball guide groove 261 is the x-axis direction, which is a direction perpendicular to the paper surface in FIG. 32 . Since the balls 224 can realize rolling support, the friction force of the first chip carrier 220 moving relative to the second chip carrier 260 can be reduced, and the friction force of the first chip carrier 220 moving relative to the support base 210 can also be reduced. In this embodiment, only one layer of balls is used to realize the movable connection of movement in the x-axis direction and the y-axis direction. Compared with the solution of using double-layer balls, the structural complexity of the photosensitive assembly can be reduced, and the photosensitive assembly can also be reduced. high.

Further, in some embodiments of the present application, the camera module suitable for super-resolution shooting can also utilize the x-axis and y-axis movement capabilities of the photosensitive chip to realize the optical anti-shake function. For example, the lens assembly of the camera module may not include an optical actuator (ie, a motor); or the optical actuator of the lens assembly may only move the optical lens on the z-axis, that is, the lens assembly may only have automatic Focus function, without optical image stabilization. At this time, the camera module can still realize the optical anti-shake function through the x-axis and y-axis movement capabilities of the photosensitive chip.

The solution involving dual motion stabilization is described below with reference to some embodiments.

Further, in some embodiments of the present application, the camera module suitable for super-resolution shooting may include a lens assembly and a photosensitive assembly, wherein both the lens assembly and the photosensitive assembly may have an optical anti-shake function. The photosensitive component may be the optical anti-shake photosensitive component mentioned above, and the optical anti-shake photosensitive component is not only used to realize optical anti-shake, but also can be used to realize super-resolution shooting. More particularly, in this embodiment, since both the lens assembly and the photosensitive assembly have an optical anti-shake function, the dual movement capabilities of the photosensitive chip and the optical lens are used to improve the performance of the optical anti-shake. For example, by moving the photosensitive chip and the optical lens in opposite directions, the optical anti-shake can have a larger movement stroke, so as to compensate for the larger shake of the photographing device. For another example, the photosensitive chip and the optical lens move in opposite directions at the same time, which can improve the anti-shake response speed of the shooting device.

The solution for improving the performance of optical image stabilization by utilizing the dual movement capabilities of the photosensitive chip and the optical lens in the present application will be further described below with reference to FIG. 33 and a series of embodiments. In the third part (ie, the solution involving dual-movement image stabilization), the driving device for driving the optical lens may be referred to as a first driving part, and the first driving part may be a conventional optical actuator for optical image stabilization . The driving device used to drive the photosensitive chip to move can be referred to as the second driving part, and the second driving part can be the driving device based on the piezoelectric driving component described in the previous embodiment, or the ball suspension-based driving device described in the previous embodiment. Drives for systems and electromagnetic drive assemblies.

In an embodiment of the present application, the camera module may include a lens (ie an optical lens), a photosensitive chip, a first driving part and a second driving part. The photosensitive component may include a photosensitive chip. The first driving part is configured to drive the lens to move in two directions of x and y, and the second driving part is configured to drive the photosensitive chip to move in two directions of x and y. In this embodiment, the x and y directions are perpendicular to each other, and both are parallel to the photosensitive surface of the photosensitive chip. The z direction is parallel to the normal direction of the photosensitive surface. In this embodiment, the optical anti-shake of the camera module is realized by simultaneously driving the lens and the photosensitive chip to move in opposite directions by the control module (for example, the second control unit). Specifically, the lens and the photosensitive chip are configured to be driven at the same time and move in opposite directions. For example, if the lens is driven to move in the positive direction of the x-axis, the photosensitive chip is driven to move in the negative direction of the x-axis; the lens is driven to move toward the y-axis. Moving in the positive direction, the photosensitive chip is driven to move in the negative direction of the y-axis; or the lens is driven to move on the x-axis and y-axis, and the photosensitive chip is driven to move in the opposite direction of the lens movement on the x-axis and y-axis, in other words In other words, when it is necessary to move on the x-axis and the y-axis at the same time, the direction of the displacement vector of the lens and the displacement vector of the photosensitive chip on the xoy plane are opposite. The camera module usually includes a position sensor, and the position sensor is used to detect the shaking of the camera module or a terminal device (ie, an electronic device equipped with the camera module, such as a mobile phone). When jitter is detected, the position sensor sends a signal to the camera module to drive the lens and the photosensitive chip to move accordingly to compensate for the jitter, so as to achieve the purpose of optical anti-shake. In this embodiment, the lens and the photosensitive chip are configured to move at the same time, and the lens and the photosensitive chip move in opposite directions, which can achieve faster response and better anti-shake effect. In addition, the anti-shake angle range of the camera module is usually limited by the suspension system and the driving system, and a relatively large compensation angle range cannot be achieved. In this embodiment, by simultaneously driving the lens and the photosensitive chip to move in opposite directions, the Large angle shake compensation. In addition, in this embodiment, by simultaneously driving the lens or the photosensitive chip to move in opposite directions, compared with the solution of only driving the lens to move, there is a larger relative movement stroke between the lens and the photosensitive chip (for the convenience of description, the This relative movement stroke is referred to as the anti-shake stroke for short), which can have a better compensation effect. In particular, due to the increase of the anti-shake stroke, this embodiment also has a better compensation effect for the tilting and shaking of the camera module. Further, the movement direction of the anti-shake movement in this embodiment can be limited in the xoy plane, and it is not necessary to tilt the optical axis of the lens or the photosensitive chip, thereby avoiding the problem of image blur caused by the anti-shake movement.

Further, in an embodiment of the present application, the camera module includes a first driving part, a lens, a second driving part and a photosensitive assembly. The lens is mounted on the first driving part. The first driving part can have a cylindrical first motor carrier, the first motor carrier can be used as a movable part of the first driving part, and the lens is mounted on the inner side of the first motor carrier. The first driving part also has a stationary part, or a base part. In this embodiment, the base portion may be implemented as a motor housing. The motor housing may include a base and a cover. The base has a light hole. The movable part is movably connected with the base part. The driving element may be a coil magnet combination, which may be installed between the movable part and the base part. For example, it can be mounted between the first motor carrier and the motor housing. In fact, the first driving part in this embodiment can directly adopt the common structure of the optical anti-shake motor in the prior art. Further, in this embodiment, the second driving portion may be supported and fixed on the bottom surface of the first driving portion. Specifically, the top surface of the support base can bear against and be fixed on the bottom surface of the first driving part. Driven by the carrier of the second driving part, the photosensitive chip can translate relative to the support base in the x and y directions.

The following further introduces a method for compensating for the tilt and shake of the camera module through double movement based on the design idea of the present application. When the second driving part for driving the photosensitive chip to move adopts the driving device based on the piezoelectric driving component described in the previous embodiment, or when using the driving device based on the ball suspension system and the electromagnetic driving component described in the previous embodiment, The following compensation methods for tilting and shaking of the camera module through double movement are applicable.

FIG. 33 is a schematic diagram showing the relationship between the moving distance of the lens and the photosensitive chip and the inclination angle of the module in four different situations in this application. The position A in the figure represents the combination of the moving distance of the lens and the photosensitive chip for compensating the camera module shake angle a. As shown in Figure 33, the moving distance of the lens in the figure is b, the moving distance of the photosensitive chip (hereinafter sometimes referred to as the chip) is c, and the moving distance of the lens or chip can be equivalent to the angle of the image plane deviating from the optical axis during optical imaging. Specifically, when the translation distance of the lens in the xoy plane is b, it causes an arithmetic relationship between the image plane offset angle α1 and the image distance. The image distance is different at different shooting distances. For the convenience of calculation and expression, Here the image distance is replaced by the image square focal length. Specifically, the relationship between the image plane shift angle α1 and the focal length f of the lens image side is: tan(α1)=b/f, when the photosensitive chip moves at a distance c on the xoy plane, it causes the image plane shift The relationship between the angle α2 and the image-side focal length f of the lens is: tan(α2)=c/f. In this embodiment, the moving directions of the lens and the photosensitive chip are opposite, so the calculation method of the comprehensive compensation angle a of the camera module is: a=α1+α2=arctan(b/f)+arctan(c/f). In one embodiment, the moving distances of the lens and the photosensitive chip can be set to be the same, that is, b=c. In another embodiment, the moving distances of the lens and the photosensitive chip may be set to be unequal, for example, the moving distance of the lens may be greater than the moving distance of the photosensitive chip, that is, b>c.

Further, in an embodiment of the present application, the ratio of the moving distance of the lens to the moving distance of the photosensitive chip is optionally set to maintain a fixed ratio, such as b/c=6:4, or b/c=7:3, Or b/c=5:5, no matter what the compensation value of the camera module shake (such as the comprehensive compensation angle a) is, the distance between the lens and the photosensitive chip is maintained at the preset ratio, which is beneficial to the compensation of the camera module. The compensation effect within the range is uniform, and it is also beneficial to reduce the design difficulty of the driving logic module of the anti-shake system of the camera module.

Further, in the configuration in which the moving distance of the lens and the moving distance of the photosensitive chip are based on a fixed ratio for anti-shake movement, because the movable range of the photosensitive chip is small, sometimes the shaking of the camera module may exceed the maximum moving stroke of the photosensitive chip. Therefore, in an embodiment of the present application, an anti-shake threshold can be set. For example, for the jitter angle a that needs to be compensated, a threshold K can be set. When the actually calculated jitter angle a is less than or equal to the anti-shake threshold K, the lens The moving distance b and the moving distance c of the photosensitive chip are kept in a fixed ratio, and the fixed ratio can be preset, for example, b/c=6:4, or b/c=7:3, or b/c=5:5. When the actual calculated shaking angle a is greater than the anti-shake threshold K, the moving distance c of the photosensitive chip takes the maximum value of its travel stroke, that is, the maximum travel of the photosensitive chip c _max , and the moving distance of the lens b=tan(a/f)- c _max . In other words, when the shaking angle that the camera module needs to compensate is above the anti-shake threshold K, based on the preset fixed ratio, the lens moves to a position corresponding to the maximum moving distance of the photosensitive chip (ie, the maximum travel of the photosensitive chip c _max ) Afterwards, the first driving part may drive the lens to continue to move until the lens moves by a distance b=tan(a/f)-c _max . At the same time, the photosensitive chip first moves to the opposite direction synchronously to the maximum moving distance c _max of the photosensitive chip, and then remains stationary.

Further, in another embodiment of the present application, in the xoy plane, the anti-shake angle corresponding to the maximum travel b _max of the lens movement (the anti-shake angle refers to the angle at which the camera module tilts and shakes) may be smaller than the maximum distance of the photosensitive chip. The anti-shake angle corresponding to the stroke c _max . Under this design, the anti-shake system of the camera module can have a faster response speed. In high-end lenses, the lens often has a large number of lenses. For example, the number of lenses in the rear main camera lens of a smartphone can reach 8. In order to further improve the image quality, some lenses also use glass lenses. These all result in the lens being heavier. When the driving force does not increase significantly, the speed at which the driving device drives the lens to move will decrease. On the other hand, the photosensitive chip or photosensitive assembly is relatively light in weight, and can reach a preset position with a small driving force. Therefore, in the solution of this embodiment, the advantages of relatively light weight and relatively fast moving speed of the photosensitive chip can be better utilized, and the response speed of the anti-shake system of the camera module can be effectively improved.

Further, in another embodiment of the present application, the fixed ratio of the moving distance of the lens to the moving distance of the photosensitive chip may be based on the weight of the lens, the driving force of the first driving part, the weight of the photosensitive chip (or the photosensitive component), By setting the driving force of the second driving part and other factors, and setting an appropriate fixed ratio, the time for the lens and the photosensitive chip to move to their respective anti-shake target positions can be basically the same, so as to obtain a better anti-shake effect. Specifically, the weight of the lens and the driving force of the first driving part can basically determine the moving speed of the lens, while the weight of the photosensitive chip (or photosensitive component) and the driving force of the second driving part can basically determine the moving speed of the photosensitive chip. When the moving speed of the photosensitive chip is lower than the moving speed of the photosensitive chip (for example, when the weight of the lens is large), when the fixed ratio is set, the moving distance of the photosensitive chip can occupy a larger proportion. The fast feature makes the photosensitive chip move a longer distance, so that the time for the lens and the photosensitive chip to move to their respective anti-shake target positions is basically the same.

The above description is only a preferred embodiment of the present application and an illustration of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solution formed by the specific combination of the above technical features, and should also cover the above technical features without departing from the inventive concept. Other technical solutions formed by any combination of its equivalent features. For example, a technical solution is formed by replacing the above features with the technical features disclosed in this application (but not limited to) with similar functions.

Claims

An optical anti-shake photosensitive assembly, characterized in that it includes:

photosensitive chip;

a chip carrier, which includes a carrier part and at least two cantilever parts, the carrier part is suitable for directly or indirectly carrying the photosensitive chip, and the cantilever part is formed by extending outward from the side surface of the carrier part; At least one cantilever part of the at least two cantilever parts has a piezoelectric drive rod fitting hole; and

A piezoelectric drive assembly, comprising a fixed part, a piezoelectric element mounted on the fixed part, and a driving rod fixed to the piezoelectric element at one end, the driving rod passing through the piezoelectric element of at least one of the cantilever parts The driving rod is adapted to the hole and is movably connected with the cantilever part, wherein the central axis of the driving rod is parallel to the photosensitive surface of the photosensitive chip.
The photosensitive assembly according to claim 1, wherein the chip carrier comprises a first chip carrier and a second chip carrier, and the piezoelectric driving component comprises a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are perpendicular to each other Piezoelectric drive assembly; the photosensitive chip is fixed on the carrier part of the first chip carrier, and the fixed part of the first piezoelectric drive assembly is fixed on the carrier part of the second chip carrier.
The photosensitive assembly according to claim 2, wherein the cantilever portion comprises a driving-side cantilever portion and a driven-side cantilever portion, the driving-side cantilever portion has the piezoelectric driving rod fitting hole, the The driven side cantilever portion has a guide rod bracket.
The photosensitive assembly according to claim 3, wherein the photosensitive assembly further comprises an auxiliary guide structure, the auxiliary guide structure includes a guide rod, the guide rod passes through the guide rod bracket and is connected with the guide rod The bracket is articulated so that the guide rod bracket can move along the guide rod.
The photosensitive assembly according to claim 4, wherein the carrier portion of the first chip carrier is a first carrier portion, and the first chip carrier has a first driving side and a first driven side , the first driving side and the first driven side are two opposite sides of the first carrier part, the driving side cantilever part and the driven side cantilever part of the first chip carrier formed by extending outward from the first driving side and the first driven side, respectively;

The carrier portion of the second chip carrier is a second carrier portion, the second chip carrier has a second drive side and a second driven side, the second drive side and the second driven side The two sides are opposite sides of the second carrier part, and the driving side cantilever part and the driven side cantilever part of the second chip carrier are respectively from the second driving side and the second slave side. The driving side is formed by extending outward; and the first driving side, the second driving side, the first driven side and the second driven side surround the periphery of the photosensitive chip.
The photosensitive assembly according to claim 4, wherein the piezoelectric driving rod fitting hole is formed by a bending support part and a flat plate part, and the cross section of the bending support part is "v" The driving rod is placed in the bending and resting portion, and the flat plate portion covers the opening of the bending and resting portion.
The photosensitive assembly according to claim 4, wherein the driven side cantilever portion comprises at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole.
The photosensitive assembly according to claim 7, wherein the guide rod comprises a first guide rod, the driven side cantilever portion of the first chip carrier is slidably connected with the first guide rod, and the Two ends of the first guide rod are fixed on the carrier part of the second chip carrier; the guiding direction of the first guide rod is parallel to the guiding direction of the driving rod of the first piezoelectric driving assembly .
The photosensitive assembly according to claim 8, wherein the photosensitive assembly further comprises a housing base and a support seat, the housing base and the support seat connect the photosensitive chip, the chip carrier and the The piezoelectric drive assembly is packaged inside; the top of the support base is suitable for installing the lens assembly; the center of the support base has a light-through hole.
The photosensitive assembly according to claim 9, wherein the guide rod further comprises a second guide rod, and the driven side cantilever portion of the second chip carrier is slidably connected to the second guide rod, so The two ends of the second guide rod are fixed on the housing base and/or the support base; the guiding direction of the second guide rod is the same as the guide of the driving rod of the second piezoelectric driving assembly direction is parallel.
The photosensitive assembly according to claim 10, wherein the fixing portion of the second piezoelectric driving assembly is fixed to the housing base and/or the support base.
The photosensitive assembly according to claim 4, wherein the first carrier portion is in the shape of a frame, and the photosensitive chip is attached to the peripheral edge region thereof, and the photosensitive region of the photosensitive chip is placed on the first carrier portion central window.
The photosensitive assembly according to claim 12, wherein the second carrier portion is frame-shaped, and the photosensitive chip and the first carrier portion are disposed at a window in the center of the second carrier portion.
The photosensitive assembly according to claim 2, wherein the driving rod of the first piezoelectric driving assembly and the driving rod of the second piezoelectric driving assembly are arranged on the same reference plane, and the reference The surface is a plane parallel to the photosensitive surface of the photosensitive chip.
The photosensitive assembly according to claim 2, wherein the photosensitive assembly further comprises a module circuit board attached to the photosensitive chip, the module circuit board is a foldable circuit board, and the foldable circuit The board includes a plurality of hard boards and a flexible board connected between the plurality of hard boards.
The photosensitive assembly according to claim 15, wherein the module circuit board has at least two bends, and the at least two bends include at least one bend in a vertical direction and at least one bend in a horizontal direction of bending.
The photosensitive assembly according to claim 15, wherein the photosensitive assembly further comprises a housing base and a support seat, the housing base and the support seat connect the photosensitive chip, the chip carrier and the The piezoelectric drive assembly is encapsulated inside; the top of the support seat is suitable for installing the lens assembly; the support seat serves as the upper cover of the photosensitive assembly, and the upper cover has lead holes; the free end of the module circuit board Lead out from the lead hole of the support base.
A method for assembling an optical anti-shake photosensitive assembly, comprising the following steps:

1) Mount the photosensitive chip on a first chip carrier, the first chip carrier includes a first carrier part and two first cantilever parts, the first cantilever parts extend outward from the side surface of the first carrier part to forming, the two first cantilever parts are respectively located on two opposite sides of the first carrier part;

2) A first piezoelectric drive assembly or a first guide rod is installed in the first cantilever part, and the first piezoelectric drive assembly includes a fixed part, a piezoelectric element installed on the fixed part, and one end fixed to the fixed part; The first driving rod of the piezoelectric element, the first driving rod passes through the first cantilever part and is movably connected with the first cantilever part, wherein the central axis of the first driving rod is parallel to the photosensitive chip The photosensitive surface; wherein, at least one of the two first cantilever parts is loaded into the first piezoelectric drive assembly;

3) Loading the first chip carrier into a second chip carrier; wherein, the second chip carrier includes a second carrier part and two second cantilever parts, and the second cantilever parts extend from the side of the second carrier part extending outward to form, the two second cantilever parts are respectively located on two opposite sides of the second carrier part; fixing the fixing part of the first piezoelectric component to the second carrier part, and /or fixing the two ends of the first guide rod to the second carrier part;

4) A second piezoelectric drive assembly or a second guide rod is installed in the second cantilever part, and the second piezoelectric drive assembly includes a fixed part, a piezoelectric element installed on the fixed part, and one end fixed to the fixed part; the second driving rod of the piezoelectric element, the second driving rod passes through the second cantilever part and is movably connected with the second cantilever part, wherein the central axis of the second driving rod is parallel to the photosensitive chip the photosensitive surface, and the central axes of the second driving rod and the first driving rod are perpendicular to each other;

5) Assemble the photosensitive chip, the first chip carrier, the second chip carrier, the first piezoelectric driving component, the second piezoelectric driving component, the first guide rod and the first The movable chip assembly of the two guide rods is installed in the inverted support seat; and

6) Mounting the housing base on the upside-down support base to encapsulate the movable chip assembly in the accommodating space between the support base and the housing base.
The method for assembling an optical anti-shake photosensitive assembly according to claim 18, wherein the step 1) further comprises: assembling the photosensitive chip and the module circuit board into a photosensitive member, and installing the photosensitive member on the photosensitive member. the first chip carrier;

Between described step 5) and described step 6) also comprise steps:

51) Arrange the module circuit board, and lead the free end of the module circuit board out of the lead hole or avoidance groove of the support base; wherein, the module circuit board is a foldable circuit board, and the The foldable circuit board includes a plurality of hard boards and a flexible board connected between the plurality of hard boards; the modular circuit board has at least two bends, and the at least two bends include at least one vertical Straight bends and at least one horizontal bend.
A camera module, comprising:

a lens assembly including an actuator housing and an optical lens within the actuator housing;

A photosensitive assembly, which includes a photosensitive chip, a support base, a housing base, an x-axis piezoelectric drive assembly, and a y-axis piezoelectric drive assembly, wherein both the x-axis and the y-axis are parallel to the photosensitive surface of the photosensitive chip, and the x-axis and the y-axis are perpendicular to each other; the support base is installed above the housing base, and the support base and the housing base drive the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive The component is encapsulated inside, the top surface of the support base has lead holes or escape grooves, and the lens assembly is mounted on the top of the support base;

a first circuit board attached to the photosensitive chip, and the first circuit board includes a main body portion and a second connection tape; and

The second circuit board includes a relay circuit board, the relay circuit board is supported on the top surface of the support base, and the piezoelectric elements of the x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly They are respectively drawn out from the lead holes or avoidance grooves through a first connecting tape, the first connecting tape is fixed and electrically connected to the surface of the transfer circuit board, and the first connecting tape is connected to the surface of the relay circuit board inside the photosensitive assembly. The first circuit board is separate.
The camera module according to claim 20, wherein the second connecting strip comprises at least one vertical bending part and at least one horizontal bending part, wherein the vertical bending part is the surface of the soft board The normal line is located on the bending part on the vertical plane before and after bending, and the horizontal bending part is the bending part where the normal line of the surface of the flexible board is located on the horizontal plane before and after bending; the second circuit board also It includes a first extension part and a second extension part, one side of the relay circuit board is connected to the first extension part through a vertical bending part, and the first extension part is connected by a horizontal bending part The second expansion part is connected; the first expansion part and the second expansion part both bear against the outer side surface of the actuator housing.
The camera module according to claim 21, wherein at least a part of the electronic components are disposed on the outer surface of the second extension portion.
The camera module according to claim 22, wherein the first circuit board further comprises a third extension portion and a fourth extension portion located outside the actuator housing, the third extension portion passing through One of the horizontal bending parts is connected to the second connecting belt inside the photosensitive assembly, and the fourth extension part is connected to the third extension part through the other horizontal bending part; the fourth extension part is connected to the third extension part. The expansion part and the second expansion part are located on the same side of the actuator housing, and the fourth expansion part is fixed and electrically connected to the second expansion part.
The camera module according to claim 23, wherein the fourth extension portion and the second extension portion are fastened together by a connector.
The camera module according to claim 23, wherein the second expansion part is further connected to a general connection belt through one of the vertical bending parts, and the general connection belt has a suitable for electrical connection with the outside world. the total connector.
The camera module according to claim 23, wherein the back surfaces of the first extension portion and the second extension portion are attached to two adjacent outer side surfaces of the actuator housing.
The camera module according to claim 26, wherein the second extension part comprises a first sub-circuit board, a second sub-circuit board and one of the horizontal bending parts, the first sub-circuit board and the second sub-circuit board are connected and folded together through the horizontal bending portion, the second sub-circuit board is located between the first sub-circuit board and the actuator housing, the At least a part of electronic components are mounted on the outer surface of the first sub-circuit board, the first sub-circuit board is a rigid board, and the second sub-circuit board is a rigid board or a flexible board.
The camera module according to claim 23, wherein the third extension part is supported on the outer side surface of the actuator housing.
The camera module according to claim 20, wherein the support base is formed by an insert injection molding process, wherein the support base contains a metal sheet for the insert injection molding process.
The camera module according to claim 20, wherein the lens assembly further comprises an auto-focus driving device, an optical anti-shake driving device or a zoom driving device for driving the optical lens to move, the auto-focus driving device The device, the optical anti-shake driving device or the zoom driving device is located in the cavity between the actuator housing and the top surface of the support seat, and the autofocus driving device, the optical anti-shake driving device or the zoom driving device Lead wires are connected to the relay circuit board.
The camera module according to claim 20, wherein the lens assembly further comprises a vertical piezoelectric drive assembly, and the axis of the drive shaft of the vertical piezoelectric drive assembly is perpendicular to the photosensitive surface; the The piezoelectric element of the vertical piezoelectric drive assembly is installed in at least one corner area of the four corner areas of the top surface of the support base; the moving part of the vertical piezoelectric drive assembly is integrated with the optical lens to drive The optical lens extends or retracts from the actuator housing; the piezoelectric element of the vertical piezoelectric driving assembly is connected to the relay circuit board through lead wires.
The camera module according to claim 20, wherein the lens assembly is a sleeve-type lens assembly, and the sleeve-type lens assembly comprises a sleeve assembly, the actuator housing and a the optical lens of the sleeve assembly;

The sleeve assembly includes a plurality of nested single sleeves, wherein any two adjacent single sleeves are connected by a vertical piezoelectric drive assembly, and the drive shaft of the vertical piezoelectric drive assembly is The axis is perpendicular to the photosensitive surface; the piezoelectric element of the vertical piezoelectric drive assembly is installed on the bottom of the single sleeve located on the lower layer, and the moving part of the vertical piezoelectric drive assembly is connected to the piezoelectric element located on the upper layer. The bottoms of the single sleeves are connected as a whole; the lead wires connecting the piezoelectric elements of the vertical piezoelectric driving components of the adjacent single sleeves are fixed and electrically connected to the transfer circuit board.
The camera module according to claim 32, wherein each of the single sleeve has a corresponding sleeve circuit board, and the sleeve circuit board includes a bearing part and a lead part; the single sleeve The barrel includes a barrel wall and a bottom plate, and a sleeve circuit board bracket is arranged in each of the single sleeves, and the bottom of the sleeve circuit board bracket is integrated with the bottom plate of the corresponding single sleeve, The top of the sleeve circuit board bracket passes through the bottom plate of the single sleeve located on the upper layer through a through hole; the bearing portion of the sleeve circuit board supports against the sleeve circuit board bracket ; The lead part is a foldable circuit board, when the sleeve assembly is in an extended state, the lead part is unfolded and suspended, and the lead part passes through the bottom plate of the single sleeve and is electrically connected to the bottom The sleeve circuit board of one layer of the single sleeve is either electrically connected to the relay circuit board.
The camera module according to claim 33, wherein for each of the single sleeves, a Hall element is installed on the top of the circuit board bracket, and the sleeve circuit board is connected to the Hall element. Components are electrically connected.
The camera module according to claim 33, wherein for each of the single-piece sleeves, the sleeve circuit board further has a third connecting band, and the third connecting band is supported against the sleeve. The upper surface of the bottom plate of the single-piece sleeve, and the third connecting strip is used for connecting the piezoelectric element of the vertical piezoelectric driving assembly mounted on the single-piece sleeve, or for connecting the next layer of the piezoelectric element. The sleeve circuit board of the single sleeve.
The camera module according to claim 35, wherein an IC element for sensing the Hall element is mounted on the second extension portion.
The camera module according to any one of claims 20-36, wherein a driving circuit of a piezoelectric driving component is arranged in the second circuit board, and a driving circuit of the photosensitive chip is arranged in the first circuit board working circuit.
The camera module according to any one of claims 20-36, wherein the photosensitive component further comprises a chip carrier, which comprises a carrier part and at least two cantilever parts, the carrier part is suitable for direct or indirect The photosensitive chip is mounted on the ground, and the cantilever portion is formed by extending outward from the side surface of the carrier portion; at least one cantilever portion of the at least two cantilever portions has a piezoelectric drive rod fitting hole;

The x-axis piezoelectric drive assembly and the y-axis piezoelectric drive assembly are both horizontally arranged piezoelectric drive assemblies, which include a fixed portion, a piezoelectric element mounted on the fixed portion, and one end fixed to the piezoelectric drive. a driving rod of the element, the driving rod passes through at least one of the piezoelectric driving rod fitting holes of the cantilever part and is movably connected with the cantilever part, wherein the axis of the driving rod is parallel to the photosensitive chip of the photosensitive chip noodle.
The camera module according to claim 38, wherein the chip carrier comprises a first chip carrier and a second chip carrier, and the piezoelectric driving component comprises a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are perpendicular to each other. Two piezoelectric driving components; the photosensitive chip is fixed on the carrier part of the first chip carrier, and the fixing part of the first piezoelectric driving component is fixed on the carrier part of the second chip carrier ;

The cantilever part includes a drive-side cantilever part and a driven-side cantilever part, the drive-side cantilever part has the piezoelectric drive rod fitting hole, and the driven-side cantilever part has a guide rod bracket;

The photosensitive assembly further includes an auxiliary guide structure, the auxiliary guide structure includes a guide rod, the guide rod passes through the guide rod bracket and is movably connected with the guide rod bracket, so that the guide rod bracket can move along the guide rod bracket. The guide rod moves.
The camera module according to claim 39, wherein the carrier portion of the first chip carrier is a first carrier portion, and the first chip carrier has a first driving side and a first driven side side, the first driving side and the first driven side are two opposite sides of the first carrier part, the driving side cantilever part and the driven side cantilever part of the first chip carrier The portions are respectively formed to extend outward from the first driving side and the first driven side;

The carrier portion of the second chip carrier is a second carrier portion, the second chip carrier has a second drive side and a second driven side, the second drive side and the second driven side The two sides are opposite sides of the second carrier part, and the driving side cantilever part and the driven side cantilever part of the second chip carrier are from the second driving side and the second slave side, respectively. The driving side is formed by extending outward; and the first driving side, the second driving side, the first driven side and the second driven side surround the periphery of the photosensitive chip.
A camera module suitable for super-resolution shooting, comprising:

lens assembly;

A photosensitive assembly, which includes a photosensitive chip and a driving device, the driving device is used to drive the photosensitive chip to move in the x-axis direction and the y-axis direction, wherein the x-axis and the y-axis are both parallel to the photosensitive the coordinate axis of the photosensitive surface of the chip, and the x-axis and the y-axis are perpendicular to each other;

a first control unit, which is used to control the driving signal applied to the driving device to control the super-resolution photographing moving route of the photosensitive chip on the xoy plane; the super-resolution photographing moving route includes a plurality of super-resolution photographing moving routes rate shift, after each super-resolution shift is performed, the photosensitive chip is moved to an image sample collection position; wherein, each super-resolution shift causes the photosensitive pixel units in the photosensitive chip to move along the moving the xoy plane to a pixel position on the image plane where the super-resolution image is mapped; and

A data processing unit, which is used for synthesizing a super-resolution image from the image samples collected by the photosensitive chip at a plurality of the image sample collection positions.
The camera module according to claim 41, wherein the photosensitive area of the photosensitive chip includes a plurality of macro pixels, and each macro pixel includes a plurality of monochromatic photosensitive pixel units of different colors; The super-resolution shift is adapted to move one of the single-color photosensitive pixel units of the macro-pixel to the position of another of the single-color photosensitive pixel units.
The camera module according to claim 42, wherein the moving route satisfies: for any pixel position of the super-resolution image mapped on the image plane, the single-color photosensitive pixel unit of each color are moved to the pixel position at least once.
The camera module according to claim 43, wherein in the macro pixels of the photosensitive chip, a plurality of the single-color photosensitive pixel units are arranged in a rectangle or a triangle.
The camera module according to claim 41, wherein the resolution of the super-resolution image is higher than that of the photosensitive chip, and the movement amount of the super-resolution offset is smaller than that of the photosensitive chip The spacing between the adjacent photosensitive pixel units.
The camera module according to claim 42, wherein the resolution of the super-resolution image is higher than the resolution of the photosensitive chip, and the movement amount of the super-resolution offset is smaller than that of the photosensitive chip The spacing between the adjacent macro pixels.
The camera module according to claim 41, wherein the driving device comprises a piezoelectric driving component, and the piezoelectric element of the piezoelectric driving component comprises a first type piezoelectric material layer and a second type piezoelectric material layer layer, the layer of piezoelectric material of the first type and the layer of piezoelectric material of the second type are stacked to form the piezoelectric element, the layer of piezoelectric material of the first type is configured to be suitable for a single activation The moving part is driven to move a first distance, the first distance being the set distance of the super-resolution offset; the second type of piezoelectric material layer is configured to be suitable for a single activation The moving part is driven to move a second distance, and the second distance is greater than the first distance.
The camera module according to claim 41, wherein the driving device comprises a piezoelectric driving component; and the first control unit is further configured to: control the amplitude of the driving voltage of the piezoelectric driving component or By controlling its single activation time, the single moving distance of the photosensitive chip is the distance displaced by the super-resolution.
The camera module according to claim 41, wherein the driving device is a piezoelectric driving device, and the piezoelectric driving device comprises:

Chip carriers, each chip carrier includes a carrier part and at least two cantilever parts, the carrier part is suitable for directly or indirectly carrying the photosensitive chip, and the cantilever part is formed by extending outward from the side of the carrier part at least one cantilever part of the at least two cantilever parts has a piezoelectric drive rod adapter hole; and

A piezoelectric drive assembly, comprising a fixed part, a piezoelectric element mounted on the fixed part, and a driving rod fixed to the piezoelectric element at one end, the driving rod passing through the piezoelectric element of at least one of the cantilever parts The driving rod is adapted to the hole and is movably connected with the cantilever part, so that the chip carrier can move along the driving rod, and the guiding direction of the driving rod is parallel to the photosensitive surface of the photosensitive chip;

Wherein, the chip carrier includes a first chip carrier and a second chip carrier, and the piezoelectric driving component includes a first piezoelectric driving component and a second piezoelectric driving component whose driving directions are the x-axis direction and the y-axis direction respectively. An electric drive assembly; the photosensitive chip is fixed on the carrier part of the first chip carrier, and the fixed part of the first piezoelectric drive assembly is fixed on the carrier part of the second chip carrier.
The camera module according to claim 49, wherein the cantilever part comprises a drive-side cantilever part and a driven-side cantilever part, and the drive-side cantilever part has the piezoelectric drive rod adaptation hole, so the driven side cantilever part has a guide rod bracket;

The photosensitive assembly further includes an auxiliary guide structure, the auxiliary guide structure includes a guide rod, the guide rod passes through the guide rod bracket and is movably connected with the guide rod bracket, so that the guide rod bracket can move along the guide rod bracket. The guide rod moves.
The camera module according to claim 50, wherein the carrier portion of the first chip carrier is a first carrier portion, and the cantilever portion of the first chip carrier includes one of the driving sides The cantilever part and one of the driven side cantilever parts, the driving side cantilever part and the driven side cantilever part are formed by extending outward from two opposite sides of the first carrier part.
The camera module of claim 50, wherein the carrier portion of the second chip carrier is a second carrier portion, and the cantilever portion of the second chip carrier includes one of the driving sides A cantilever portion and one of the driven side cantilever portions, the driving side cantilever portion and the driven side cantilever portion are formed by extending outward from two opposite sides of the second carrier portion.
The camera module according to claim 50, wherein the driven side cantilever portion comprises at least one cantilever with a through hole, and the guide rod passes through the at least one cantilever with a through hole; the The driven side cantilever portion of the first chip carrier is slidably connected to a first guide rod, and two ends of the first guide rod are fixed to the carrier portion of the second chip carrier; the first guide rod The guiding direction of the rod is parallel to the guiding direction of the driving rod of the first piezoelectric driving assembly.
The camera module according to claim 50, wherein the photosensitive assembly further comprises a housing base and a support seat, the housing base and the support seat connect the photosensitive chip, the chip carrier and the The piezoelectric drive assembly is packaged inside; the top of the support base is suitable for installing the lens assembly.
The camera module according to claim 54, wherein the driven side cantilever portion of the second chip carrier is slidably connected to a second guide rod, and two ends of the second guide rod are fixed to the housing base and/or the support seat; the guide direction of the second guide rod is parallel to the guide direction of the drive rod of the second piezoelectric drive assembly; the guide direction of the second piezoelectric drive assembly The fixing portion is fixed on the housing base and/or the support base.
The camera module according to claim 51, wherein the first carrier portion is in the shape of a frame, and the photosensitive chip is attached to the peripheral edge area thereof, and the photosensitive area of the photosensitive chip is placed on the first carrier the window in the center of the second carrier part; the second carrier part is frame-shaped, the photosensitive chip and the first carrier part are arranged at the window in the center of the second carrier part; The driving rod and the driving rod of the second piezoelectric driving component are arranged on the same reference plane, and the reference plane is a plane parallel to the photosensitive surface of the photosensitive chip.
The camera module according to claim 49, wherein the photosensitive assembly further comprises a module circuit board attached to the photosensitive chip, the module circuit board is a foldable circuit board, and the foldable circuit board The circuit board includes a plurality of hard boards and a flexible board connected between the plurality of hard boards; the module circuit board has at least two bends, and the at least two bends include at least one vertical direction bends and at least one horizontal bend.
The camera module according to claim 41, wherein the driving device is an electromagnetic driving device, and the electromagnetic driving device comprises:

Electromagnetic drive element;

Support base;

a modular circuit board, the photosensitive chip is fixed with the modular circuit board; and

a housing base, the housing base and the support seat encapsulate the photosensitive chip and the module circuit board inside; the lens assembly is mounted on the top of the support seat;

a first chip carrier; and

The second chip carrier, the first chip carrier is located between the second chip carrier and the support seat, and the center of the first chip carrier has a light window; the photosensitive chip is mounted on the second chip carrier the upper surface of the ; the first chip carrier is adapted to move in the y-axis direction relative to the support seat under the driving of the electromagnetic driving element; the second chip carrier is adapted to be driven by the electromagnetic driving element move in the x-axis direction relative to the first chip carrier; wherein, the x-axis and the y-axis are both coordinate axes parallel to the surface of the photosensitive chip, and the x-axis and the y-axis are Perpendicular to each other.
The camera module according to claim 58, wherein a single layer of balls is arranged between the support base and the second chip carrier, the first chip carrier has ball holes, and the balls pass through the ball holes; in the z-axis direction, the support seat and the first chip carrier are supported by the balls, and in the z-axis direction, the first chip carrier and the second chip carrier are supported by the balls support; wherein, the z-axis is a coordinate axis perpendicular to the x-axis and the y-axis; wherein the inner surface of the ball hole bears against part of the outer surface of the ball.
The camera module according to claim 41, wherein the lens assembly comprises an optical lens and a first driving part, and the first driving part is adapted to drive the optical lens to translate in the x-axis and y-axis directions ;

The camera module further includes a second control unit for implementing an anti-shake function, which is configured to control the first driving part and the driving device to move the optical lens and the photosensitive chip in opposite directions.
The camera module according to claim 60, wherein the second control unit is further configured to control the first driving part and the driving device to simultaneously drive the optical lens and the photosensitive chip to move .