WO2022169763A1 - Fanout flow cell - Google Patents

Fanout flow cell Download PDF

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Publication number
WO2022169763A1
WO2022169763A1 PCT/US2022/014740 US2022014740W WO2022169763A1 WO 2022169763 A1 WO2022169763 A1 WO 2022169763A1 US 2022014740 W US2022014740 W US 2022014740W WO 2022169763 A1 WO2022169763 A1 WO 2022169763A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
die
flow cell
adhesive
top surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2022/014740
Other languages
English (en)
French (fr)
Inventor
Ravi Billa
John Walker
Arvin Emadi
Jon Aday
Tara BOZORG-GRAYELI
Ludovic Vincent
Hai Tran
Sanket RATHORE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Illumina Inc
Original Assignee
Illumina Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Illumina Inc filed Critical Illumina Inc
Priority to AU2022217155A priority Critical patent/AU2022217155A1/en
Priority to CN202280005346.3A priority patent/CN116209523A/zh
Priority to EP22750252.3A priority patent/EP4288209A4/en
Priority to KR1020227045853A priority patent/KR20230138388A/ko
Priority to CA3183872A priority patent/CA3183872A1/en
Priority to US18/003,281 priority patent/US20240009665A1/en
Priority to JP2022580780A priority patent/JP2024507023A/ja
Publication of WO2022169763A1 publication Critical patent/WO2022169763A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0647—Handling flowable solids, e.g. microscopic beads, cells, particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0645—Electrodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/06—Auxiliary integrated devices, integrated components
    • B01L2300/0627—Sensor or part of a sensor is integrated
    • B01L2300/0663—Whole sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0819—Microarrays; Biochips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure

Definitions

  • Various protocols in biological or chemical research involve performing controlled reactions. The designated reactions can then be observed or detected and subsequent analysis can help identify or reveal properties of chemicals involved in the reaction.
  • an unknown analyte having an identifiable label e.g., fluorescent label
  • an identifiable label e.g., fluorescent label
  • Each known probe can be deposited into a corresponding well of a microplate. Observing any chemical reactions that occur between the known probes and the unknown analyte within the wells can help identify or reveal properties of the analyte.
  • Other examples of such protocols include known DNA sequencing processes, such as sequencing-by-synthesis (SBS) or cyclic-array sequencing.
  • an optical system is used to direct excitation light onto fluorophores, e.g., fluorescently-labeled analytes and to also detect the fluorescent emissions signal light that can emit from the analytes having attached fluorophores.
  • fluorophores e.g., fluorescently-labeled analytes
  • the controlled reactions in a flow cell are detected by a solid-state light sensor array (e.g., a complementary metal oxide semiconductor (CMOS) detector). These systems do not involve a large optical assembly to detect the fluorescent emissions.
  • CMOS complementary metal oxide semiconductor
  • the shape of the fluidic flow channel in a flow cell may determine its utility for various uses, for example, SBS or cyclic-array sequencing is enabled in a sensor system utilizing multiple liquid flows, and thus, a fluidic flow channel of specific shape is utilized for SBS or cyclic-array sequencing.
  • a sensor in the system e.g., a CMOS utilized as a detector
  • a significant portion of a CMOS is occupied by a fluidic path, minimizing usage of the sensor itself.
  • a region can create around the sensor called a “fan-out” region.
  • the fan-out region is an area that is packaged with a detector that extends a horizontal distance beyond the detector. For example, in examples where a CMOS sensor is utilized as a detector in the flow cell, the fan-out refers to the additional horizontal distance on each side of the horizontal boundaries of the CMOS sensor.
  • preparing the surface of the fan-out region to accomplish the fluidic requirements of the cell may be challenging from a manufacturing and fabrication standpoint. For example, in some cases, preparation of a surface for utilization as a fan-out region may involve a grinding procedure that can damage a surface if the material comprising the surface is not sufficiently tolerant of this process. When a ceramic substrate forms the fan-out region, this challenge may sometimes be appreciated. Meeting tolerance requirements may, in some situations, lead to selecting expensive materials, which may increase costs associated with the flow cell. Accordingly, it may be beneficial for a flow cell fabrication to exclude this grinding process.
  • the method comprises: applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts; orienting a package on the first adhesive, the package comprising a die where a top surface of the die comprises an active surface and electrical contact points and surfaces adjacent to the active surface on at least two opposing sides of the active surface form fanout regions for utilization in a fluidic path of the flow cell; connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die; applying a second adhesive to a part of the package; and attaching a lid to the second adhesive, where the attaching defines a fluidic flowcell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the method includes forming the package, the forming the package comprises: orienting the die on the first adhesive; and forming the fanout regions by orienting one or more support pieces on the first adhesive adjacent to at least two sides of the die, where the fanout regions comprise a portion of a top surface of the support pieces.
  • the one or more support pieces comprise two support pieces and the orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprise placing two support pieces adjacent to the die on opposing sides of the die.
  • the one or more support pieces comprise one support piece
  • the one support piece comprises a cutout
  • the orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprise orienting the one support piece such that the die and electrical contacts are within the cutout.
  • the package comprises a cured electronic molded compound (EMC) material molded around portions of the die, where a portion of the EMC material comprises the fanout regions.
  • EMC electronic molded compound
  • the forming the fanout regions further comprises: dispensing a material to fill gaps between the one or more support pieces and the die.
  • the one or more support pieces comprise a material selected from the group consisting of: glass, silicon, and ceramic.
  • the package comprises a cured electronic molded compound (EMC) material molded around portions of the die, and a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, and the fanout regions comprise portions of the layer.
  • EMC electronic molded compound
  • the method includes: forming the package, comprising: curing the EMC material around portions of the die.
  • forming the package further comprises: planarizing the EMC material surfaces adjacent to the active surface.
  • the planarizing comprises: depositing the layer on a surface comprising the top surface of the die and the EMC material surfaces adjacent to the active surface; opening the layer on the active surface; and curing the layer.
  • the layer comprises a photoresist.
  • a technique for opening the layer is selected from the group consisting of: lithography and lithography plus lift-off.
  • the package further comprises vias embedded in the EMC material.
  • forming the package further comprises: prior to the curing of the EMC material around portions of the die, embedding the vias in the EMC material.
  • the vias are comprised of an electrically conductive material.
  • the electrically conductive material is selected from the group consisting of: copper, gold, tungsten, and aluminum.
  • the vias extend through the EMC material from a surface of the die opposing the active surface in a direction opposing the active surface.
  • connecting the electrical contacts on the top surface of the substrate to the electrical contact points on the die comprises wirebonding the electrical contacts to the electrical contact points.
  • the method includes encasing the wire-bonded connections with an epoxy.
  • the method includes curing the first adhesive and the second adhesive.
  • the curing is selected from the group consisting of: thermally curing and ultraviolet (UV) curing.
  • the substrate is a printed circuit board.
  • the substrate comprises a material selected from the group consisting of: a glass-reinforced epoxy laminate material, FR4, and co-fired ceramic sheets.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, where the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the method includes forming a heating element in the substrate.
  • forming the heating element comprises: placing one or more resistors on one or more of the top surface of the substrate and the bottom surface of the substrate; and coupling the one or more resistors, via the vias, to a metal plane in the substrate.
  • the heating element comprises a long wound metal trace, and forming the heating element comprises: forming the heating element in the substrate to function as a resistive heater.
  • applying the second adhesive further comprises applying the second adhesive to a portion of the die.
  • the die is a complementary metal-oxide-semi conductor.
  • the lid comprises two apertures and each aperture defines one of an inlet or an outlet fluidic port.
  • the active surface of the die comprises nanowells.
  • the flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die; a first cured adhesive, where the first cured adhesive is joined to a package, the package comprising: the die, where the top surface of the die further comprises an active surface; and fanout regions comprising surfaces adjacent at least two opposing sides of the active surface, the fanout regions at least partially defining a fluidic path of the flow cell; a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions; and the lid.
  • the package further comprises: one or more support pieces adjacent to the at least two opposing sides of the active surface of the die, where the one or more support pieces comprise the fanout regions.
  • the one or more support pieces comprise two support pieces oriented on the at least two opposing sides of the active surface of the die.
  • the one or more support pieces comprise one support piece, the one support piece comprises a cutout, and the die and the electrical contacts on the top surface of the substrate are oriented within the cutout.
  • the package further comprises: a cured electronic molded compound (EMC) material molded around portions of the die; a portion of the EMC material forming EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface; and a portion of the EMC material surfaces comprise the fanout regions.
  • EMC electronic molded compound
  • the package comprises: a cured electronic molded compound (EMC) material molded around portions of the die; a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, where the fanout regions comprise portions of the layer.
  • EMC electronic molded compound
  • the package further comprises vias embedded in the EMC material.
  • the one or more support pieces comprise a material selected from the group consisting of: glass, silicon, and ceramic.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the substrate further comprises a heating element.
  • the heating element comprises: one or more resistors on one or more of the top surface of the substrate and the bottom surface of the substrate; a metal plane in the substrate; and vias through the substrate coupling the one or more resistors to the metal plane in the substrate.
  • the heating element comprises: a long wound metal trace in the substrate to function as a resistive heater.
  • the lid comprises two apertures and each aperture defines one of an inlet or an outlet fluidic port.
  • the top surface of the die comprises nanowells.
  • the substrate is a printed circuit board.
  • the substrate comprises a material selected from the group consisting of: a glass-reinforced epoxy laminate material, FR4, and co-fired ceramic sheets.
  • the die is a complementary metal-oxide- semi conductor.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, where the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the method comprises: applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts; orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points; forming fanout regions for utilization in a fluidic path of the flow cell, where the forming the fanout regions comprises orienting one or more support pieces on the first adhesive adjacent to at least two sides of the die, where a portion of a top surface of the support pieces on the at least two sides of the die comprise the fanout regions; connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die; applying a second adhesive to a portion of the one or more support pieces; and attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the one or more support pieces comprise two support pieces, and orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises placing two support pieces adjacent on opposing sides of the die.
  • the one or more support pieces comprise one support piece, where the one support piece comprises a cutout, and orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises orienting the one support piece such that the die and electrical contacts are within the cutout.
  • the method also includes securing the wire-bonded connections with an epoxy.
  • forming the heating element comprises: implementing a long wound metal trace in the substrate to function as a resistive heater.
  • the method further comprises utilizing the heating element to heat the substrate.
  • the flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die; a first cured adhesive, where the first cured adhesive joins the die and one or more support pieces adjacent to at least two sides of the die, to the substrate, where a portion of the top surface of the die and a portion of a top surface of the one or more support pieces, form a surface that is utilized in a fluidic path of the flow cell; a second cured adhesive, where the second cured adhesive joins areas of the one or more support pieces and areas of the top surface of the die proximate to the surface that is utilized in the fluidic path of the flow cell, to a lid; and the lid, where the lid defines a fluidic flow-cell cavity above the surface that is utilized in the fluidic path of the flow cell and below the lid.
  • the one or more support pieces comprise two support pieces oriented on opposing sides of the die.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the method comprises: applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts; orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points; forming fanout regions for utilization in a fluidic path of the flow cell, where the forming of the fanout regions comprises: orienting two support pieces on the first adhesive on opposing sides of the die, each of the two support pieces adjacent to the die, where the top surface of the die and top surfaces of the two support pieces form an upper surface; and dispensing a material to fill gaps between the two support pieces and the die; connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die; applying a second adhesive to a portion of the one or more support pieces and a portion of the die; and attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above the upper surface.
  • the method comprises: applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts; orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points; forming fanout regions for utilization in a fluidic path of the flow cell, where the forming the fanout regions comprises: orienting a support piece on the first adhesive, where the support piece comprises a cutout, and where the orienting comprises placing the support piece on the first adhesive such that the die and electrical contacts are positioned within the cutout, where the fanout regions comprise portions of a top surface of the support piece on opposing sides of the die, and where the portions of the top surface and the active surface form an upper surface; connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die with bond wires; and dispensing a second adhesive into the cutout such that the second adhesive fills spaces in the cutout between the die and the support piece and encapsulates the bond wires; applying a third adhesive to a portion of the support piece and
  • the method comprises: applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts; orienting a package comprising a cured electronic molded compound (EMC) material molded around portions of a die, where a top surface of the die comprises an active surface and electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface; connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die; applying a second adhesive to a portion of a top surface of the package; and attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and fanout regions for utilization in a fluidic path of the flow cell, the fanout regions comprising another portion of the top surface of the package.
  • the fanout regions are comprised of the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface.
  • the package further comprises a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, and the fanout regions comprise portions of the layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface.
  • connecting the electrical contacts on the top surface of the substrate to the electrical contact points on the die comprises wire-bonding the electrical contacts to the electrical contact points.
  • the method includes securing the wire-bonded connections with an epoxy.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the method includes forming the package, where forming the package comprises: curing the EMC material around portions of the die.
  • the flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die; a first cured adhesive, where the first cured adhesive joins a package comprising a cured electronic molded compound (EMC) material molded around portions of a die, where a top surface of the die is exposed and comprises an active surface and the electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface, where a portion of the EMC material surfaces comprise fanout regions for utilization in a fluidic path; a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions; and the lid.
  • EMC electronic molded compound
  • the substrate is a printed circuit board
  • the die is a complementary metal-oxide-semi conductor
  • the flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die; a first cured adhesive, where the first cured adhesive joins a package comprising a cured electronic molded compound (EMC) material molded around portions of the die, where a top surface of the die is exposed and comprises an active surface and the electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface, where a layer is planarizing the EMC material surfaces, where a portion of the EMC material surfaces planarized by the layer comprise fanout regions for utilization in a fluidic path; a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions; and the lid.
  • EMC electronic molded compound
  • the method comprises: assembling a package comprising cured molded material surrounding portions of a one or more dies, where one or more pillars of a first electrically conductive material are embedded in the molded material, the assembling comprising: applying a temporary adhesive to a surface of a carrier; orienting the one or more pillars on the adhesive; orienting the one or more dies on the adhesive such that one or more pillars are oriented between each die of the one or more dies, where each one or more pillars is of a greater vertical length than each of the one or more dies; molding the material on the top surface of the carrier and around some surfaces of the one or more dies and the one or more pillars such that a top surface of the mold is of a greater vertical length that the one or more pillars, where the top surface of the mold is parallel to the surface of the carrier; curing the molded material; grinding the top surface of the mold to expose top surfaces of the one or more pillars and top surfaces of the one or more dies to create a
  • the method includes: applying surface chemistry to surfaces of the one or more dies exposed by removing the carrier and the temporary adhesive to create active surfaces; and plating surfaces of the one or more pillars exposed by removing the carrier and the temporary adhesive to create electrical contacts on the pillars.
  • the method includes: electrically coupling the electrical contacts on the pillars to portions of the surfaces of the one or more dies comprising the chemistry.
  • a method of electrically coupling the electrical contacts on the pillars to portions of the surfaces of the one or more dies comprising the chemistry is selected from the group consisting of: wire-bonding and printing. [0081] In some examples, the method includes: attaching one or more lids to the package surface, where a fluidic flow-cell cavity is defined below each of the one or more lids and above a surface of each of the corresponding one or more sensors comprising the active surface.
  • the first electrically conductive material and the third electrically conductive material are copper.
  • the second electrically conductive material comprises one or more of nickel and gold.
  • attaching the one or more lids comprises applying an adhesive to a portion of the package surface.
  • opening the portions of the layer to form openings comprises utilizing photolithography.
  • the one or more RDLs comprise three RDLs.
  • orienting the one or more pillars and orienting the one or more dies comprise utilizing a pick and place tool.
  • the molded material comprises electronic molded compound (EMC) material.
  • EMC electronic molded compound
  • the flow cell includes: a package comprising cured material molded around portions of a die, where one or more pillars of a first electrically conductive material are embedded in the molded material, where a top surface of the package comprises an active surface of the die; and a lid attached to portion of the top surface of the package, where a fluidic flow-cell cavity is defined below the lid and above the active surface.
  • the package includes one or more redistribution layers (RDLs), attached to a bottom surface of the package.
  • the RDLs comprise openings filled with electrically conductive material electrically coupled to the at least one of the one or more pillars.
  • the package includes electrical contacts electrically coupled to the electrically conductive material in the openings of the one or more RDLs.
  • the cured material comprises electronic molded compound (EMC).
  • EMC electronic molded compound
  • FIGS. 1-2 each depict an assembled view and an exploded view of a flow cell with fanout regions, the fanout regions having been formed by utilizing one or more support pieces and assembling the sensor or detector onto the substrate;
  • FIGS. 3-4 each depict a top view and a bottom view of the flow cells which are depicted in FIGS. 1-2, respectively;
  • FIG. 5 is a process flow that illustrates a step-by-step formation of the flow cell(s) of FIG. 1 and FIG 3;
  • FIG. 6 is a workflow that illustrates a method of forming the flow cell(s) of FIG. 1 and FIG. 3;
  • FIG. 7 is a process flow that illustrates a step-by-step formation of the flow cell(s) of FIG. 2 and FIG. 4;
  • FIG. 8 is a workflow that illustrates a method of forming the flow cell(s) of FIG. 2 and FIG. 4;
  • FIG. 9 depicts a side view of an example of a flow cell, specifically depicting heating elements that can be integrated into the examples discussed herein;
  • FIGS. 10-11 each depict an assembled view and an exploded view of a flow cell that includes a package that includes material molded around a sensor or detector;
  • FIGS. 12-13 each depict a side view of one of the packages depicted in FIGS. 10- i i;
  • FIGS. 14-15 each depict a top view and a bottom view of the flow cells which are depicted in FIGS. 10-11, respectively;
  • FIG. 16 is a process flow that illustrates a step-by-step formation of the flow cell(s) of FIG. 10 and FIG. 14;
  • FIG. 17 is a workflow that illustrates a method of forming the flow cell(s) of FIG.
  • FIG. 18 is a process flow that illustrates a step-by-step formation of the flow cell(s) of FIG. 11 and FIG. 15;
  • FIG. 19 is a workflow that illustrates a method of forming the flow cell(s) of FIG.
  • FIG. 20 depicts a side view of an example of a flow cell with elements of the flow cells depicted in FIGS. 10-11 and 14-15, specifically depicting heating elements that can be integrated into the examples discussed herein;
  • FIGS. 21-31 depict a process flow that illustrates a step-by-step formation of a flow cell that includes the certain aspects of the package depicted in the flow cells of FIGS. 10-11 and 14-15;
  • FIG. 32 is a workflow that illustrates a method of forming the flow cell(s) of FIG. 31.
  • connection is broadly defined herein to encompass a variety of divergent arrangements and assembly techniques. These arrangements and techniques include, but are not limited to (I) the direct joining of one component and another component with no intervening components therebetween (/. ⁇ ., the components are in direct physical contact); and (2) the joining of one component and another component with one or more components therebetween, provided that the one component being “connected to” or “contacting” or “coupled to” the other component is somehow in operative communication (e.g., electrically, fluidly, physically, optically, etc.) with the other component (notwithstanding the presence of one or more additional components therebetween).
  • operative communication e.g., electrically, fluidly, physically, optically, etc.
  • the terms “substantially”, “approximately”, “about”, “relatively”, or other such similar terms that may be used throughout this disclosure, including the claims, are used to describe and account for small fluctuations, such as due to variations in processing, from a reference or parameter.
  • Such small fluctuations include a zero fluctuation from the reference or parameter as well.
  • they can refer to less than or equal to ⁇ 10%, such as less than or equal to ⁇ 5%, such as less than or equal to ⁇ 2%, such as less than or equal to ⁇ 1%, such as less than or equal to ⁇ 0.5%, such as less than or equal to ⁇ 0.2%, such as less than or equal to ⁇ 0.1%, such as less than or equal to ⁇ 0.05%.
  • the terms “substantially”, “approximately”, “about”, “relatively,” or other such similar terms may also refer to no fluctuations, that is, ⁇ 0%.
  • a “flow cell” can include a device having a lid extending over a reaction structure to form a flow channel therebetween that is in communication with a plurality of reaction sites of the reaction structure and can include a detection device that detects designated reactions that occur at or proximate to the reaction sites.
  • a flow cell may include a solid-state light detection or “imaging” device, such as a Charge-Coupled Device (CCD) or Complementary Metal-Oxide Semiconductor (CMOS) (light) detection device.
  • CCD Charge-Coupled Device
  • CMOS Complementary Metal-Oxide Semiconductor
  • a flow cell can fluidically and electrically couple to a cartridge (having an integrated pump), which can fluidically and/or electrically couple to a bioassay system.
  • a cartridge and/or bioassay system may deliver a reaction solution to reaction sites of a flow cell according to a predetermined protocol (e.g., sequencing-by-synthesis), and perform a plurality of imaging events.
  • a cartridge and/or bioassay system may direct one or more reaction solutions through the flow channel of the flow cell, and thereby along the reaction sites.
  • At least one of the reaction solutions may include four types of nucleotides having the same or different fluorescent labels.
  • the nucleotides bind to the reaction sites of the flow cell, such as to corresponding oligonucleotides at the reaction sites.
  • the cartridge and/or bioassay system in these examples then illuminates the reaction sites using an excitation light source (e.g., solid-state light sources, such as light-emitting diodes (LEDs)).
  • an excitation light source e.g., solid-state light sources, such as light-emitting diodes (LEDs)
  • the excitation light has a predetermined wavelength or wavelengths, including a range of wavelengths.
  • the fluorescent labels excited by the incident excitation light may provide emission signals (e.g., light of a wavelength or wavelengths that differ from the excitation light and, potentially, each other) that may be detected by the light sensors of the flow cell.
  • flow cells described herein perform various biological or chemical processes. More specifically, the flow cells described herein may be used in various processes and systems where it is desired to detect an event, property, quality, or characteristic that is indicative of a designated reaction.
  • flow cells described herein may include or be integrated with light detection devices, sensors, including but not limited to, biosensors, and their components, as well as bioassay systems that operate with sensors, including biosensors.
  • the flow cells facilitate a plurality of designated reactions that may be detected individually or collectively.
  • the flow cells perform numerous cycles in which the plurality of designated reactions occurs in parallel.
  • the flow cells may be used to sequence a dense array of DNA features through iterative cycles of enzymatic manipulation and light or image detection/acquisition.
  • the flow cells may be in fluidic communication with one or more microfluidic channels that deliver reagents or other reaction components in a reaction solution to a reaction site of the flow cells.
  • the reaction sites may be provided or spaced apart in a predetermined manner, such as in a uniform or repeating pattern. Alternatively, the reaction sites may be randomly distributed.
  • Each of the reaction sites may be associated with one or more light guides and one or more light sensors that detect light from the associated reaction site.
  • light guides include one or more filters for filtering certain wavelengths of light.
  • the light guides may be, for example, an absorption filter (e.g., an organic absorption filter) such that the filter material absorbs a certain wavelength (or range of wavelengths) and allows at least one predetermined wavelength (or range of wavelengths) to pass therethrough.
  • the reaction sites may be located in reaction recesses or chambers, which may at least partially compartmentalize the designated reactions therein.
  • a “designated reaction” includes a change in at least one of a chemical, electrical, physical, or optical property (or quality) of a chemical or biological substance of interest, such as an analyte-of-interest.
  • a designated reaction is a positive binding event, such as incorporation of a fluorescently labeled biomolecule with an analyte-of-interest, for example.
  • a designated reaction may be a chemical transformation, chemical change, or chemical interaction.
  • a designated reaction may also be a change in electrical properties.
  • a designated reaction includes the incorporation of a fluorescently labeled molecule with an analyte.
  • the analyte may be an oligonucleotide and the fluorescently labeled molecule may be a nucleotide.
  • a designated reaction may be detected when an excitation light is directed toward the oligonucleotide having the labeled nucleotide, and the fluorophore emits a detectable fluorescent signal.
  • the detected fluorescence is a result of chemiluminescence or bioluminescence.
  • a designated reaction may also increase fluorescence (or Forster) resonance energy transfer (FRET), for example, by bringing a donor fluorophore in proximity to an acceptor fluorophore, decrease FRET by separating donor and acceptor fluorophores, increase fluorescence by separating a quencher from a fluorophore, or decrease fluorescence by colocating a quencher and fluorophore.
  • FRET fluorescence resonance energy transfer
  • electrically coupled and optically coupled refers to a transfer of electrical energy and light waves, respectively, between any combination of a power source, an electrode, a conductive portion of a substrate, a droplet, a conductive trace, wire, waveguide, nanostructures, other circuit segment and the like.
  • the terms electrically coupled and optically coupled may be utilized in connection with direct or indirect connections and may pass through various intermediaries, such as a fluid intermediary, an air gap and the like.
  • reaction solution includes any substance that may be used to obtain at least one designated reaction.
  • potential reaction components include reagents, enzymes, samples, other biomolecules, and buffer solutions, for example.
  • the reaction components may be delivered to a reaction site in the flow cells disclosed herein in a solution and/or immobilized at a reaction site.
  • the reaction components may interact directly or indirectly with another substance, such as an analyte-of- interest immobilized at a reaction site of the flow cell.
  • reaction site is a localized region where at least one designated reaction may occur.
  • a reaction site may include support surfaces of a reaction structure or substrate where a substance may be immobilized thereon.
  • a reaction site may include a surface of a reaction structure (which may be positioned in a channel of a flow cell) that has a reaction component thereon, such as a colony of nucleic acids thereon.
  • the nucleic acids in the colony have the same sequence, being for example, clonal copies of a single stranded or double stranded template.
  • a reaction site may contain only a single nucleic acid molecule, for example, in a single stranded or double stranded form.
  • active surface is used herein to characterize a horizontal surface of a sensor or detector which operates as the sensor or detector within a package.
  • the active surface is a portion of the surface of the CMOS sensor that includes nanowells.
  • die and wafer are also used in reference to certain examples herein, as a die can include a sensor and the die is fabricated from a wafer.
  • fan-out is used herein to characterize an area that is packaged with a detector that extends a horizontal distance beyond the detector.
  • the fan-out refers to the additional horizontal distance on each side of the horizontal boundaries of the CMOS sensor.
  • pillar bump and the term “bump” are both used to describe electrical contacts in examples illustrated and described herein. Wherever the terms “pillar bump” or “bump” are utilized, a variety of examples of electrical contacts can also be utilized in various examples of apparatuses illustrated herein.
  • the electrical contacts which may be pillar bumps or bumps, may comprise an electrically conductive material, such as a metal material (e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof), but it is understood that other electrically conductive materials may be utilized.
  • a metal material e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof
  • CMOS complementary metal-oxide-semiconductor
  • Flow cells may be formed with fan-out regions in order to move certain of the fluidic functionality away from the active surface such that the full surface of the sensor can be more efficiently and more entirely utilized as a sensor or detector. But certain techniques for forming a fan-out region may increase costs as well as contribute to complexities associated with forming the flow cells.
  • the fan-out region is formed by assembling the sensor or detector onto the substrate.
  • the fan-out region itself is formed by various methods, including but not limited to: 1) assembling support pieces (e.g., glass, silicon, and ceramic) onto the substrate, a portion of the support pieces forming the fan-out region; and/or 2) packaging a sensor (e.g., CMOS image sensor die) by molding electronic molded compound (EMC) material (an epoxy mold compound) around it, a portion of the EMC material forming the fan-out region.
  • EMC electronic molded compound
  • the EMC molded around the dies may or may not be embedded with vias (e.g., copper vias) for thermal conduction.
  • the substrate is a PCB.
  • the PCB substrates may be embedded with a built-in heating mechanism which, as depicted herein, is accomplished utilizing at least two methods, including but not limited to: 1) implementing a heat spreading plane by placing power resistors on one or more of a top or bottom of a PCB substrate such that heat is carried to a desired location by vias (e.g., conductive vias, metal vias) to a metal plate within the substrate, wherein the (now) heated metal plate spreads the heat in order to maintain a uniform and/or close to uniform temperature distribution at a desired location; and/or 2) implementing resistive paths by utilizing interconnects in the PCB as heat sources by implanting or otherwise implementing (e.g., long-winding) traces in the desired location to generate heat by the resistance of each path.
  • a heat spreading plane by placing power resistor
  • FIGS. 1-9 depict various elements and aspects of examples of flow cells which are formed by utilizing support pieces and assembling the sensor or detector onto the PCB, the substrate.
  • FIGS. 10-20 depict various elements and aspects of examples of flow cells which are formed by assembling a package, which includes the sensor or detector and EMC material, onto the PCB, the substrate
  • FIGS. 21-32 depict the formation of some examples of EMC and sensor or detector packages which can be included in the flow cells described, at least in part, in FIGS. 10-20.
  • FIGS. 1-2 each include an assembled view and an exploded view of flow cells 100, 200 with fanout regions, which are formed by utilizing support pieces and assembling the sensor or detector onto the PCB, the substrate.
  • FIGS. 3-4 each provide a top view and a bottom view of the flow cells 100, 200 which are depicted in FIGS. 1-2.
  • FIGS. 1-4 are included to provide an overview of certain elements of a structure of various examples of flow cells 100, 200 which may be formed utilizing methods described herein.
  • FIGS. 5-8 illustrate these methods in greater detail.
  • FIG. 5 is a process flow 500 that illustrates a step-by-step formation of the flow cell 100 of FIG. 1 (and FIG.
  • FIG. 6 is a workflow 600 that reiterates various the aspects of FIG. 5, but without the illustrations of the flow cell 100 itself.
  • FIG. 7 is a process flow 700 that illustrates a step-by-step formation of the flow cell 200 of FIG. 2 (and FIG. 4).
  • FIG. 8 is a workflow 800 that reviews aspects in the formation of a flow cell, including flow cell 200 of FIG. 2 (and FIG. 4), without illustrations of these aspect.
  • FIG. 9 provides side views of examples of flow cells, to show heating elements that can be integrated into the examples discussed herein. [00115] Referring first to FIG. 1, included in this figure are two views of a flow cell 100, an assembled view 125, on the left, and an exploded view 135, on the right.
  • the detector or sensor 180 is attached to a PCB substrate 150.
  • the detector or sensor 180 is a CMOS image sensor with patterned nanowell structures on top (e.g., on the active surface).
  • the PCB substrate 150 may be comprised of standard PCB laminate materials, including, but not limited to, a glass-reinforced epoxy laminate material, like FR4 and/or co-fired ceramic sheets.
  • the PCB substrate 150 includes a built- in heater (not pictured).
  • the detector or sensor (e.g., CMOS) 180 is attached to the PCB substrate 150 using a film or adhesive 140, which likewise attaches support pieces 130 on either side of the detector or sensor (e.g., CMOS) 180, to form a fan-out region.
  • this adhesive is dispensed and/or a film is applied that attaches the detector or sensor 180 and the adjacent support pieces 130 to the substrate 150.
  • This film or adhesive 140 may be thermally cured and/or ultraviolet (UV) cured. Materials that these support pieces 130 may be comprised of include, but are not limited to, glass, silicon, and ceramic.
  • Another film or adhesive 120 is used to attach a lid (e.g., glass) 110.
  • This film or adhesive 120 may be dispensed or formed as a film to attach the lid 110 to the detector or sensor 180 (e.g., CMOS die) and to the fan-out support pieces 130.
  • the lid 110 defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 105.
  • CMOS complementary metal-oxide-semiconductor
  • electrical connections 160 are metal bond pads, which are on a top surface of the PCB substrate 150 to enable wire-bonding to bond pads on the top surface of the detector or sensor 180 (e.g., the CMOS die).
  • a difference between the flow cell 100 of FIG. 1 and the flow cell 200 of FIG. 2 is that in FIG. 2, a single support piece 230 is utilized to form fan-out regions on the sides of the detector or sensor (e.g., CMOS) 280.
  • the detector or sensor 280 is a CMOS image sensor with patterned nanowell structures on top (e.g., on the active surface).
  • the film or adhesive 240 used to attach the detector or sensor (e.g., CMOS) 280 to a PCB substrate is shaped differently.
  • the detector or sensor (e.g., CMOS) 280 is attached to a PCB substrate 250, which may include a built-in heater (not pictured), using the film or adhesive 240.
  • the PCB substrate 150 may be comprised of standard PCB laminate materials, including but not limited to a glass-reinforced epoxy laminate material, like FR4 and/or co-fired ceramic sheets.
  • the film or adhesive 240 is also used to attach a support piece 230, which surrounds the detector or sensor (e.g., CMOS) 280.
  • the support piece 280 includes a cutout 265, which accommodates the detector or sensor (e.g., CMOS) 280 as well as electrical connections (e.g., bond pads, contact pads) 260 on the PCB substrate 250.
  • the electrical connections (e.g., bond pads, contact pads) 260 are wire-bonded to electrical contacts (not pictured) on the detector or sensor (e.g., CMOS) 280.
  • the electrical connections 260 are metal bond pads, which are on a top surface of the PCB substrate 250 to enable wire-bonding to bond pads on the top surface of the detector or sensor 280 (e.g., the CMOS die).
  • the support piece 230 can be comprised of materials that include, but are not limited to, glass, silicon, and ceramic.
  • a lid e.g., glass
  • This film or adhesive 220 may be dispensed or formed as a film to attached lid 210 to the detector or sensor 280 (e.g., CMOS die) and fan-out support piece 230.
  • the lid 210 also defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 205.
  • FIG. 3 depicts a top view 145 and a bottom view 155 of the flow cell 100; the flow cell 100 is also depicted in FIG. 1.
  • the bottom view 155 of the flow cell 100, and specifically, of the substrate 150 depicts electrical contacts 167, which can include pads that include pogo pins (referred to as pogo pads). These electrical contacts 167 enable electrical connection of the flow cell 100 (specifically, ultimately, the detector or sensor 180) to a receiving socket and/or instrument. As will be illustrated in later figures, vias and/or various other conductive elements, formed throughout the PCB substrate 150, connect the electrical connections 160 to the electrical contacts 167.
  • the electrical contacts 160 are wire-bonded to bond pads on the top surface of the detector or sensor 180 (e.g., the CMOS die). Visible from the top view 145 in the lid 110 (which is translucent in this example and may be made of glass), are the inlet and outlet fluidic ports 105. Under the lid 110, and not visible from either view in FIG. 4, are the fan-out regions, which are formed, as depicted in FIG. 1, with support pieces 130.
  • FIG. 4 depicts a top view 245 and a bottom view 255 of the flow cell 200; this flow cell 200 is also depicted in FIG. 2.
  • the electrical contacts 260 are wire-bonded to bond pads on the top surface of the detector or sensor 280 (e.g., the CMOS die). Visible from the top view 245, in the lid 210 (which is translucent in this example and may be made of glass), are the inlet and outlet fluidic ports 205.
  • the flow cell 200 utilizes a single support piece 230, with a cutout to accommodate the detector or sensor 280 and the electrical contacts 260, portions of the support piece 230 are not covered by the lid 210, but, rather, extend, in this case, on a longitudinal axis, beyond the bounds of the lid 210.
  • the fan-out regions, formed from a portion of the single support piece 230 are not visible from either view in FIG. 4, as they are under the lid 210.
  • FIG. 5 illustrates a workflow 500 illustrating exemplary aspects in the formation of some examples of flow cells, including but not limited to, the flow cell 100 depicted in FIGS. 1 and 3. Reference numbers utilized in the workflow 500 which refer to various aspects of the flow cell 100, are provided throughout this process flow 500, for illustrative purposes and not to suggest any limitations.
  • a substrate 150 is fabricated with electrical contacts (e.g., FIG. 3, 167) such as pogo pads on the bottom, and electrical contacts 160 (e.g., wire-bond pads) on the top (505).
  • the substrate includes a built-in heater assembly (not depicted in FIG. 5). The electrical contacts (e.g., FIG.
  • the substrate 150 may be made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • An adhesive and/or film 140 is dispensed and/or applied to the substrate 150, between the electrical contacts 160 on the top of the substrate 150 (515).
  • a detector or sensor 180 e.g., a CMOS die
  • the detector or sensor 180 may be oriented, for example, utilizing a pick-and-place machine.
  • At least two support pieces 130 are placed adjacent to the detector or sensor 180, also on the adhesive and/or film 140, to form fanout regions (535).
  • gaps between each piece of the support pieces 130 and the detector or sensor 180 may be filled, for example, with a liquid dispensed adhesive, and cured (in order to create an even surface for the fluidic functionality of the flow cell 200).
  • the electrical contacts 160 are then wire-bonded to electrical contacts (not depicted) on the detector or sensor 180 (e.g., a CMOS die) (545).
  • wires 170 may be bonded to the electrical contacts 160 (e.g., wire-bond pads) on the substrate 150 and on the detector or sensor 180 (e.g., CMOS die) (these electrical contacts are not pictured) to form electrical connection between them.
  • the connections may be encased in an epoxy. This epoxy protection for the electrical connections may be added, in some examples, after a lid 110 is secured to the flow cell 100.
  • another adhesive and/or film 120 is dispensed or applied to a portion of the support pieces 130 and a portion of periphery of the detector or sensor 180 (e.g., CMOS die) (555). As illustrated in FIG. 5, fan-out regions formed by the support pieces 130 remain adjacent to the detector or sensor 180 (e.g., CMOS die), which are not covered with the adhesive and/or film 120.
  • a lid 110 is attached to this adhesive and/or film 120 (565).
  • a space below the lid 110 and above the active (top) surface of the detector or sensor (e.g., CMOS) 180 and a top surface of portions of the support pieces 130 (not covered by the film or adhesive 120 forms a flow channel.
  • the lid 110 also defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 105; the fluidic ports 105 are inlet and outlet openings in the lid 110.
  • FIG. 6 is a workflow 600 depicting a process similar to that of FIG. 5.
  • a substrate is fabricated with electrical contacts on a bottom surface and electrical contacts on a top surface (these are connected through the substrate using vias or other such connections) (605).
  • An adhesive and/or film is applied to the substrate between the electrical contacts on the top surface of the substrate (615).
  • a detector or sensor e.g., a CMOS die
  • At least two support pieces are placed on the adhesive and/or film, adjacent to the detector or sensor, to form fanout regions (635).
  • gaps between each piece of the support pieces and the detector or sensor may be filled, for example, with a liquid dispensed adhesive, and cured.
  • the electrical contacts on the top surface of the substrate are wire-bonded to electrical contacts on an active surface (top surface) of the detector or sensor (645). These wire-bonded connections may be protected after they are formed by applying an epoxy.
  • a second adhesive and/or film is applied to a portion of the support pieces and part of a periphery of the detector or sensor (655).
  • a lid is attached to the adhesive and/or film, defining a fluidic flow-cell cavity with inlet and outlet fluidic ports (665). Both the first and second adhesive and/or film are cured at some point after they are applied and utilized to form an attachment.
  • FIG. 7 illustrates a workflow 700 illustrating exemplary aspects in the formation of some examples of flow cells, including but not limited to, the flow cell 200 depicted in FIGS. 2 and 4.
  • the flow cell 200 of FIGS, 2 and 4 includes a single support piece 230 to form fanout regions.
  • Reference numbers utilized in the workflow 700 refer to various aspects of the flow cell 200, for illustrative purposes and not to introduce any limitations.
  • a substrate 250 is fabricated with electrical contacts (e.g., FIG. 4, 267) such as pogo pads on the bottom, and electrical contacts 260 (e.g., wire-bond pads) on the top (705).
  • the substrate includes a built-in heater assembly (not depicted in FIG. 7).
  • the electrical contacts (e.g., FIG. 4, 267) on the bottom, and electrical contacts 260 on the top are connected to each other through the substrate 250 with connectors, including but not limited to, vias.
  • the substrate 250 may be made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • An adhesive and/or film 240 is dispensed and/or applied to the substrate 250 (715). The adhesive and/or film 240 extends beyond the electrical contacts 260 but is not formed over the electrical contacts 260 (in order to leave the electrical contacts 260 accessible for wire-bonding or otherwise connected to electrical contacts of a sensor or detector 280).
  • a detector or sensor 280 (e.g., a CMOS die) is oriented on the adhesive and/or film 240, between the electrical contacts 260 (725).
  • the detector or sensor 280 may be oriented, for example, utilizing a pick-and-place machine.
  • a single (fanout) support piece 230 is placed on the adhesive and/or film 240, to form fanout regions (735).
  • the support piece 230 has a cutout 265 (which can be implemented using different methods including, but not limited to, laser dicing), so the support piece 230 does not cover a top surface (e.g., active surface) of the detector or sensor 280 or the electrical contacts 260.
  • the electrical contacts 260 are then wire-bonded to electrical contacts (not depicted) on the detector or sensor 280 (e.g., a CMOS die) (745).
  • wires 270 may be bonded to the electrical contacts 260 (e.g., wire-bond pads) on the substrate 250 and on the detector or sensor 280 (e.g., CMOS die) (these electrical contacts are not pictured) to form electrical connection between them.
  • adhesive e.g., epoxy
  • CMOS die e.g., CMOS die
  • another adhesive and/or film 220 is dispensed or applied to a portion of the support piece 230 and a periphery of the detector or sensor 280 (e.g., CMOS die) (755).
  • a lid 210 is attached to this adhesive and/or film 220 (765).
  • the lid 210 also defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 205; the fluidic ports 205 are inlet and outlet openings in the lid 210.
  • FIG. 8 is a workflow 800 depicting a process similar to that of FIG. 7.
  • a substrate is fabricated with electrical contacts on a bottom surface and electrical contacts on a top surface (these are connected through the substrate using vias or other such connections) (805).
  • An adhesive and/or film is applied to the substrate (815).
  • a detector or sensor e.g., a CMOS die
  • a support piece which includes a cutout that accommodates the detector or sensor as well as the electrical contacts, is placed on the adhesive and/or film, to form fanout regions (835).
  • the electrical contacts are wire-bonded to electrical contacts on the detector or sensor (845).
  • Adhesive e.g., epoxy
  • Adhesive is dispensed into the cavity surrounding the detector or sensor to encapsulate the bond wires and fill the gap on either side of the detector or sensor by capillary action (852).
  • Another adhesive and/or film is dispensed or applied to a portion of the support piece and a periphery of the detector or sensor (855).
  • a lid is attached to the adhesive and/or film, defining a fluidic flow-cell cavity with inlet and outlet fluidic ports (865). Both the first and second adhesive and/or film are cured at some point after they are applied and utilized to form an attachment.
  • FIG. 9 depicts a side view 900 flow cell 100 similar to the flow cell 100 of FIGS. 1 and 3, with this detail added to the substrate 150.
  • the consistency in the numbering is provided for illustrative purposes.
  • the flow cell 200 of FIGS. 2 and 4 may share substantially the same elements save a single support piece 230 (see, FIGS. 2 and 4) surrounds the detector or sensor 280 on all four sides.
  • FIG. 9 is not duplicated with reference numbers to a flow cell in FIGS. 2 and 4, but the commonly named elements are relevant in both configurations.
  • the flow cell 100 of FIG. 9 includes various aspects that are also visible in other figures.
  • the flow cell 100 includes at least two support pieces 160, which are on either side of a detector or sensor 180.
  • the support pieces 106 enable fluidic fan-out in the flow cell 100 and may be comprised of materials, including but not limited to, glass, silicon, and/or ceramic.
  • the detector or sensor 180 is CMOS image sensor with patterned nanowell structures 177 on top.
  • the support pieces 160 and the detector or sensor 180 are attached to a substrate with an adhesive and/or a film 140. This adhesive and/or a film 140 may be dispensed or applied as a film to make this attachment and may then be cured (e.g., thermally cured or UV cured).
  • the substrate 150 in this example is made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • the substrate includes electrical connections on its top surface 160, and electrical connections on its bottom surface 167.
  • the electrical connections of the top surface 160 are (e.g., metal) bond pads, which enable wire-bonding to bond-pads on the top surface of the detector or sensor 180 (e.g., the CMOS die).
  • the electrical connections on its bottom surface 167 are pogo pads, which enable electrical connection to a receiving socket or instrument.
  • Also included in the flow cell 100 are fluidics and a glass lid 110 defines the fluidic flow-cell cavity with inlet and outlet fluidic ports 105.
  • the (e.g., glass) lid 110 is attached to portions of the support pieces 160 and the detector or sensor 180 with an adhesive 120. Like the adhesive and/or a film 140, this adhesive or film 120 may also be dispensed or applied as a film. This adhesive or film 120 may then be cured (e.g., thermally cured or UV cured).
  • the substrate 150 of FIG. 9 has embedded heaters to control the temperature of the package. As aforementioned, some or all of these elements may also be integrated into the examples of flow cells 200 in FIGS. 2 and 4. In the flow cell 100 of FIG. 9, the heating can be achieved by one or more of two ways.
  • power resistors 152 may be placed on the top or bottom of the substrate 150 and heat is transferred to the desired location by vias 159, and a metal plane 153 spreads the heat over the desired area to maintain uniform temperature.
  • a long winding metal trace 156 in this desired location can function as a resistive heater, without separate power resistors. Depicted as structurally similar as are a heat spreading metal plane 153 and a long wound metal trace 156 functioning as a resistive heater.
  • vias 154 are metal interconnect layers in the substrate that enable electrical connection from the detector or sensor 180 to the electrical connections on its bottom surface 167.
  • FIGS. 10-11 each include an assembled view and an exploded view of flow cells 1000, 1100 with fanout regions, which are formed, for example, by assembling a package that includes EMC material molded around a sensor or detector onto the PCB, the substrate.
  • FIGS, 12-13 depict side views of the packages that include the EMC material and the sensor or detector which are implemented into flow cell 1000 and flow cell 1100, respectively.
  • FIGS. 14-15 each provide a top view and a bottom view of the flow cells 1000, 1100 which are depicted in FIGS. 10-11.
  • FIGS. 10-11 each include an assembled view and an exploded view of flow cells 1000, 1100 with fanout regions, which are formed, for example, by assembling a package that includes EMC material molded around a sensor or detector onto the PCB, the substrate.
  • FIGS, 12-13 depict side views of the packages that include the EMC material and the sensor or detector which are implemented into flow cell 1000 and flow cell 1100, respectively.
  • FIGS. 14-15 each provide a top view and
  • FIGS. 16-19 illustrate these methods in greater detail.
  • FIG. 16 is a process flow 1600 that illustrates a step-by-step formation of the flow cell 1000 of FIG. 10 (and FIG. 14).
  • FIG. 17 is a workflow 1700 that reiterates various the aspects of FIG. 16, but without the illustrations of the flow cell 1000 itself.
  • FIG. 18 is a process flow 1800 that illustrates a step-by-step formation of the flow cell 1100 of FIG. 11 (and FIG. 15).
  • FIG. 19 is a workflow 1900 that reviews aspects in the formation of a flow cell, including flow cell 1100 of FIG. 11 (and FIG.
  • FIG. 20 provides side views of examples of flow cells, to show heating elements that can be integrated into the examples discussed herein.
  • FIG. 10 includes a detector or sensor (e.g., CMOS) 1080, which is molded into an EMC material 1082 is attached to a PCB substrate 1050.
  • the detector or sensor 1080 is a CMOS image sensor with patterned nanowell structures on top (e.g., on the active surface).
  • the PCB substrate 1050 may be comprised of standard PCB laminate materials, including, but not limited to, a glass-reinforced epoxy laminate material, like FR4 and/or co-fired ceramic sheets.
  • the PCB substrate 1050 includes a built-in heater (not pictured).
  • the package 1081 is attached to the PCB substrate 1050 using a film or adhesive. This attachment may or may not be formed by placing the package 1081 on a film or adhesive 1040 with a pick-and-place tool. In some examples, this adhesive is dispensed and/or a film is applied that attaches the package 1081 to the substrate 1050.
  • This film or adhesive 1040 may be thermally cured and/or ultraviolet (UV) cured.
  • Another film or adhesive 1020 is used to attach a lid (e.g., glass) 1010.
  • This film or adhesive 1020 may be dispensed or formed as a film to attach the lid 1010 to the package 1081.
  • the lid 1010 defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1005.
  • CMOS complementary metal-oxide-semiconductor
  • electrical connections 1060 are metal bond pads, which are on a top surface of the PCB substrate 1050 to enable wire-bonding to bond pads on the top surface of the detector or sensor 1080 (e.g., the CMOS die).
  • a difference between the flow cell 1000 of FIG. 10 and the flow cell 1100 of FIG. 11 is that in FIG. 11, molding the EMC material 1182 around the sensor or detector (e.g., CMOS) 1180, a layer 1183 is deposited on a front-side of the sensor or detector 1180 and EMC mold material 1182 to planarize the surface. As will be discussed in more detail later herein, this layer 1183 is opened on the sensor or detector and/or active surface (e.g., utilizing lithography or a lithography plus lift-off process).
  • the planarizing surface is a photoresist, including but not limited to, SU8.
  • the layer is patterned and is then cured (e.g., baked).
  • a package 1181 that includes a detector or sensor (e.g., CMOS) 1180, which is molded into an EMC material 1182 is attached to a PCB substrate 1150.
  • the detector or sensor 1180 is a CMOS image sensor with patterned nanowell structures on top (e.g., on the active surface).
  • the PCB substrate 1150 may be comprised of standard PCB laminate materials, including, but not limited to, a glass-reinforced epoxy laminate material, like FR4 and/or co-fired ceramic sheets.
  • the PCB substrate 1150 includes a built-in heater (not pictured).
  • the package 1181 is attached to the PCB substrate 1150 using a film or adhesive. This attachment may or may not be formed by placing the package 1181 on a film or adhesive 1140 with a pick-and-place tool.
  • this adhesive is dispensed and/or a film is applied that attaches the package 1181 to the substrate 1150.
  • This film or adhesive 1140 may be thermally cured and/or ultraviolet (UV) cured.
  • Another film or adhesive 1120 is used to attach a lid (e.g., glass) 1110. In these examples, the glass lid 1110 is attached to portion of the layer 1183.
  • This film or adhesive 1120 may be dispensed or formed as a film to attach the lid 1110 to the layer 1183.
  • the lid 1110 defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1105.
  • CMOS complementary metal-oxide-semiconductor
  • electrical connections e.g., bond pads, contact pads
  • the electrical connections 1160 are metal bond pads, which are on a top surface of the PCB substrate 1150 to enable wire-bonding to bond pads on the top surface of the detector or sensor 1180 (e.g., the CMOS die).
  • FIG. 12 depicts a side view of the flow cell 1000 illustrated in FIG. 10.
  • the lid 1010 defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1005.
  • the package 1081 includes vias 1087 of an electrically conductive material, such as a metal material (e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof), but it is understood that other electrically conductive materials may be utilized.
  • the vias 1087 and embedded in the EMC material 1082, at a bottom side 1086 of the sensor or detector 1080 may or may not include these vias 1087.
  • these vias 1087, if embedded in the EMC material 1082 may be embedded in various configurations. The configuration in this example is provided for illustrative purposes only and does not suggest any limitations to these configurations.
  • FIG. 13 depicts a side view of the flow cell 1100 illustrated in FIG. 11.
  • a difference between the flow cells 1000, 1100 is the inclusion, in flow cell 1100, of a layer 1183 deposited on a front-side of the sensor or detector 1180 and EMC mold material to planarize the surface.
  • a layer 1183 is deposited on a package 1181 that includes EMC material 1182 molded around a sensor or detector 1180 (e.g., a CMOS).
  • the layer 1183 is deposited on a front-side of the sensor or detector 1180 and EMC mold material to planarize the surface.
  • FIG. 13 depicts a side view of the flow cell 1100 illustrated in FIG. 11.
  • a difference between the flow cells 1000, 1100 is the inclusion, in flow cell 1100, of a layer 1183 deposited on a front-side of the sensor or detector 1180 and EMC mold material to planarize the surface.
  • a layer 1183 is deposited on a package 1181 that includes EMC material
  • this layer 1183 is opened on the sensor or detector and/or active surface (e.g., utilizing lithography or a lithography plus lift-off process) to expose the active surface.
  • a portion of the layer 1183, once cured or baked, is attached to a glass lid 1010 with a film or adhesive 1120.
  • the lid 1110 defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1105. As in FIG. 12, in the example illustrated in FIG.
  • the package 1181 includes vias 1187 of an electrically conductive material, such as a metal material (e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof), but it is understood that other electrically conductive materials may be utilized.
  • a metal material e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof
  • the vias 1187 and embedded in the EMC material 1182, at a bottom side 1186 of the sensor or detector 1180 may or may not include these vias 1187.
  • These vias 1187, if embedded in the EMC material 1182 may be embedded in various configurations. The configuration depicted in FIG. 13 is provided for illustrative purposes only and does not suggest any limitation to these configurations.
  • FIG. 14 depicts a top view 1045 and a bottom view 1055 of the flow cell 1000; the flow cell 1000 is also depicted in FIG. 10 and aspects of the flow cell 1000 are depicted in FIG. 12.
  • the bottom view 1055 of the flow cell 1000, and specifically, of the substrate 1050 depicts electrical contacts 1067, which can include pads that include pogo pins (referred to as pogo pads). These electrical contacts 1067 enable electrical connection of the flow cell 1000 (specifically, ultimately, the detector or sensor 1080) to a receiving socket and/or instrument. As will be illustrated in later figures, vias and/or various other conductive elements, formed throughout the PCB substrate 1050, connect the electrical connections 1060 to the electrical contacts 1067.
  • the electrical contacts 1060 are wire-bonded to bond pads on the top surface of the detector or sensor 1080 (e.g., the CMOS die). Visible from the top view 1045 in the lid 1010 (which is translucent in this example and may be made of glass), are the inlet and outlet fluidic ports 1005. Under the lid 1010, and not visible from either view in FIG. 14, are the fan-out regions, which are formed, as depicted in FIG. 10, from a portion of the EMC material 1082 in which the detector or sensor 1080 is molded. Portions of the EMC material 1082 are not covered by the lid 1010, but, rather, extend, in this case, on a longitudinal axis, beyond the bounds of the lid 1010. The fan-out regions, formed from a portion of the EMC material 1082 in which the detector or sensor 1080 is molded, are not visible from either view in FIG. 14, as they are under the lid 1010.
  • FIG. 15 depicts a top view 1145 and a bottom view 1155 of the flow cell 1100; this flow cell 1100 is also depicted in FIG. 11.
  • the electrical contacts 1160 are wire-bonded to bond pads on the top surface of the detector or sensor 1180 (e.g., the CMOS die). Visible from the top view 1145, in the lid 1110 (which is translucent in this example and may be made of glass), are the inlet and outlet fluidic ports 1105. Portions of the s EMC material 1182 are not covered by the lid 1110, but, rather, extend, in this case, on a longitudinal axis, beyond the bounds of the lid 1110. Portions of the layer 1183 patterned atop portion of the EMC material 1182 also extend on the longitudinal axis, beyond the bounds of the lid 1110. The fan-out regions, formed from a portion of the layer 1183 are not visible from either view in FIG. 15, as they are under the lid 1110.
  • FIG. 16 illustrates a workflow 1600 illustrating exemplary aspects in the formation of some examples of flow cells, including but not limited to, the flow cell 1000 depicted in FIGS.
  • a substrate 1050 is fabricated with electrical contacts (e.g., FIG. 14, 1067) such as pogo pads on the bottom, and electrical contacts 1060 (e.g., wirebond pads) on the top (1605).
  • the substrate includes a built-in heater assembly (not depicted in FIG. 16).
  • the electrical contacts (e.g., FIG. 14, 1067) on the bottom, and electrical contacts 1060 on the top are connected to each other through the substrate 1050 with connectors, including but not limited to, vias.
  • the substrate 1050 may be made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • An adhesive and/or film 1040 is dispensed and/or applied to the substrate 1050, between the electrical contacts 1060 on the top of the substrate 1050 (1615).
  • a package 1081 formed from a detector or sensor 1080 (e.g., a CMOS die) molded into an EMC material 1082 is placed on to the adhesive with a pick-and-place tool and is oriented on the adhesive and/or film 1040, between the electrical contacts 1060 (1625).
  • the detector or sensor 1080 may be oriented, for example, utilizing a pick-and-place machine.
  • the electrical contacts 1060 are then wire- bonded to electrical contacts (not depicted) on the detector or sensor 1080 (e.g., a CMOS die) (1635).
  • wires 1070 may be bonded to the electrical contacts 1060 (e.g., wire-bond pads) on the substrate 1050 and on the detector or sensor 1080 (e.g., CMOS die) (these electrical contacts are not pictured) to form electrical connection between them.
  • the connections may be encased in an epoxy. This epoxy protection for the electrical connections may be added, in some examples, after a lid 1010 is secured to the flow cell 1000. [00135] Returning to FIG.
  • another adhesive and/or film 1020 is dispensed or applied to a portion of the EMC material 1082 around the periphery of the detector or sensor 1080 (e.g., CMOS die) (1645).
  • a top surface 1072 of the EMC material 1082 which is not covered by the film or adhesive 1020 and is adjacent to the detector or sensor 1080 (e.g., CMOS die), forms a fan-out region.
  • a lid 1010 is attached to this adhesive and/or film 1020 (1655).
  • the lid 1010 also defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1005; the fluidic ports 1005 are inlet and outlet openings in the lid 1010.
  • FIG. 17 is a workflow 1700 depicting a process similar to that of FIG. 16.
  • a substrate is fabricated with electrical contacts on a bottom surface and electrical contacts on a top surface (these are connected through the substrate using vias or other such connections) (1705).
  • An adhesive and/or film is applied to the substrate between the electrical contacts on the top surface of the substrate (1715).
  • a package 1081 formed from a detector or sensor 1080 (e.g., a CMOS die) molded into an EMC material 1082 is oriented on the adhesive and/or film between the electrical contacts (1725).
  • the electrical contacts on the top surface of the substrate are wire-bonded to electrical contacts on an active surface (top surface) of the detector or sensor (1735).
  • wire-bonded connections may be protected after they are formed by applying an epoxy.
  • a second adhesive and/or film is applied to a portion of the EMC material around the periphery of the detector or sensor (1745).
  • a lid is attached to the adhesive and/or film, defining a fluidic flow-cell cavity with inlet and outlet fluidic ports (1755). Both the first and second adhesive and/or film are cured at some point after they are applied and utilized to form an attachment.
  • FIG. 18 illustrates a workflow 1800 illustrating exemplary aspects in the formation of some examples of flow cells, including but not limited to, the flow cell 1100 depicted in FIGS.
  • the flow cell 1100 of FIGS. 11, 13, and 15 includes a layer 1183 deposited on a front-side of the sensor or detector 1180 and EMC mold material 1182 to planarize this surface.
  • this layer 1183 is deposited on the front-side of the sensor or detector 1180 (e.g., the front-side CMOS) and mold material, to planarize the surface.
  • the layer 1183 is opened on sensor or detector 1180 active surface utilizing a process including, but not limited to, lithography or a lithography plus lift-off process.
  • a non-limiting example of such a planarizing surface could be a photoresist like SU8.
  • the layer 1183 may or may not be cured through baking.
  • a substrate 1150 is fabricated with electrical contacts (e.g., FIG. 15, 1167) such as pogo pads on the bottom, and electrical contacts 1160 (e.g., wire-bond pads) on the top (1805).
  • the substrate includes a built-in heater assembly (not depicted in FIG. 18).
  • the electrical contacts (e.g., FIG. 15, 1167) on the bottom, and electrical contacts 1160 on the top are connected to each other through the substrate 1150 with connectors, including but not limited to, vias.
  • the substrate 1150 may be made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • An adhesive and/or film 1140 (e.g., FIG. 11, 1140) is dispensed and/or applied to the substrate 1150 (1815).
  • the adhesive and/or film 1140 extends beyond the electrical contacts 1160 but is not formed over the electrical contacts 1160 (in order to leave the electrical contacts 1160 accessible for wire-bonding or otherwise connected to electrical contacts of a sensor or detector 1180).
  • a package 1181 which includes a sensor or detector 1180 molded into an EMC material 1182, the package having been planarized on top with a patternable resist (forming a layer 1183), including but not limited to, SU8, is oriented on the adhesive and/or film 1140, between the electrical contacts 1160 (1825).
  • the package 1181, which was planarized (forming the layer 1183) may be oriented, for example, utilizing a pick-and-place machine.
  • the electrical contacts 1160 are then wire-bonded to electrical contacts (not depicted) on the detector or sensor 1180 (e.g., a CMOS die) (1835).
  • wires 1170 may be bonded to the electrical contacts 1160 (e.g., wire-bond pads) on the substrate 1150 and on the detector or sensor 1180 (e.g., CMOS die) (these electrical contacts are not pictured) to form electrical connection between them.
  • adhesive e.g., epoxy
  • a lid 1110 is attached to this adhesive and/or film 1120 (1865).
  • the lid 1110 also defines a fluidic flow-cell cavity with inlet and outlet fluidic ports 1105; the fluidic ports 1105 are inlet and outlet openings in the lid 1110.
  • the adhesive and/or film 1120 is cured.
  • FIG. 19 is a workflow 1900 depicting a process similar to that of FIG. 18.
  • a package that includes a sensor or detector is formed by molding EMC material around a sensor or detector (1902).
  • a layer e.g., photoresist
  • the layer is opened on the sensor or detector to expose the active surface (1904).
  • the layer may or may not be opened utilizing a process including, but not limited to, lithography or a lithography plus lift-off process.
  • a non-limiting example of such a planarizing surface could be a photoresist like SU8.
  • the layer may or may not be cured through baking.
  • a substrate is fabricated with electrical contacts on a bottom surface and electrical contacts on a top surface (these are connected through the substrate using vias or other such connections) (1905).
  • An adhesive and/or film is applied to the substrate (1915).
  • a package that includes a detector or sensor (e.g., a CMOS die) molded into EMC material, where the package had been planarized with a layer of patternable resist, is oriented on the adhesive and/or film between the electrical contacts, which are not covered by the adhesive and/or film (1925).
  • the electrical contacts are wire-bonded to electrical contacts on the detector or sensor (1935).
  • an adhesive e.g., epoxy
  • Another adhesive and/or film is dispensed or applied to a portion of the layer around the periphery of the detector or sensor (1945).
  • a lid is attached to the adhesive and/or film, defining a fluidic flow-cell cavity with inlet and outlet fluidic ports (1955). Both the first and second adhesive and/or film are cured at some point after they are applied and utilized to form an attachment.
  • FIG. 20 depicts a side view 2000 flow cell 1000 similar to the flow cell 1000 of FIGS. 10 and 12, with this detail added to the substrate 1050.
  • the consistency in the numbering is provided for illustrative purposes.
  • the flow cell 1100 of FIGS. 11 and 13 may share substantially the same elements save a patterned layer (e.g., FIG. 13, 1183) above the EMC material (e.g., FIG. 13, 1182).
  • FIG. 20 is not duplicated with reference numbers to a flow cell in FIGS. 11 and 13, but the commonly named elements are relevant in both configurations.
  • the EMC material 1082 molded around the sensor or detector 1080 e.g., CMOS die
  • an electrically conductive material such as a metal material (e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof).
  • a metal material e.g., Cu (copper), Au (gold), W (tungsten), Al (aluminum) or a combination thereof. Examples of the structure and formation of the EMC material 1082 embedded with the vias 1087, are discussed further with reference to FIGS. 21-32.
  • the flow cell 1000 of FIG. 20 includes various additional aspects that are also visible in other figures.
  • the flow cell 1000 includes a package 1081 that includes EMC material 1082 molded around a sensor or detector 1080 to provide fluidic fan-out to utilize across the active surface of the flow cell 1000.
  • the detector or sensor 1080 is CMOS image sensor with patterned nanowell structures 1077 on top.
  • the package 1081 is attached to a substrate with an adhesive and/or a film 1040. This adhesive and/or a film 1040 may be dispensed or applied as a film to make this attachment and may or may not then be cured (e.g., thermally cured or UV cured).
  • the substrate 1050 in this example is made from standard PCB laminate materials, including but not limited to, FR4 and/or co-fired ceramic sheets.
  • the substrate includes electrical connections on its top surface 1060, and electrical connections on its bottom surface 1067.
  • the electrical connections of the top surface 1060 are (e.g, metal) bond pads, which enable wire-bonding to bond-pads on the top surface of the detector or sensor 1080 (e.g, the CMOS die).
  • the electrical connections on its bottom surface 1067 are pogo pads, which enable electrical connection to a receiving socket or instrument.
  • Also included in the flow cell 1000 are fluidics and a glass lid 1010 defines the fluidic flow-cell cavity with inlet and outlet fluidic ports 1005.
  • the (e.g., glass) lid 1010 is attached to portions of the support pieces 1060 and the detector or sensor 1080 with an adhesive 1020.
  • this adhesive or film 1020 may also be dispensed or applied as a film and may or may not then be cured (e.g., thermally cured or UV cured).
  • the substrate 1050 of FIG. 20 has embedded heaters to control the temperature of the package. As aforementioned, some or all of these elements may also be integrated into the examples of flow cells 1100 in FIGS. 11 and 13. In the flow cell 1000 of FIG. 20, the heating can be achieved by one or more of two ways. First, power resistors 1052 may be placed on the top or bottom of the substrate 1050 and heat is transferred to the desired location by vias 1059, and a metal plane 1053 spreads the heat over the desired area to maintain uniform temperature. Second, a long winding metal trace 1056 in this desired location can function as a resistive heater, without separate power resistors.
  • vias 1054 are metal interconnect layers in the substrate that enable electrical connection from the detector or sensor 1080 to the electrical connections on its bottom surface 1067.
  • the flow cells 1000, 1100 include a package 1081, 1181, which itself includes EMC material 1082, 1182, molded around a sensor or detector 1080, 1180.
  • FIGS. 21-32 depict various examples of a method of forming packages that include cured molded material (e.g., EMC material) surrounding portions of a one or more dies as well as one or more pillars or vias of an electrically conductive material (e.g., 2181, FIG. 29).
  • cured molded material e.g., EMC material
  • an electrically conductive material e.g., 2181, FIG. 29.
  • the dies e.g., sensors or detectors
  • these packages include aspects of the packages 1081 and 1181 of flow cells 1000 and 1100.
  • the packages 1081 and 1181 can be the substantially the same or somewhat similar to the packages depicted in FIGS. 21 A-21K.
  • FIG 21-32 focus on detailing examples related to forming the package itself. While FIGS. 21-31 depict examples of various elements throughout the formation of a flow cell with the package, and examples of the completed flow cell, FIG. 33, for the sake of clarity, reviews portions of some elements of the examples depicted in FIGS. 21-31, but without the illustrations.
  • the package is formed on a carrier (e.g., a glass carrier), by utilizing a temporary adhesive 2112 to attach elements such as the pillars 2114 and the die (e.g., sensor or detector) 2113 to the carrier 2111 (e.g., ceramic or glass).
  • a temporary adhesive 2112 to attach elements such as the pillars 2114 and the die (e.g., sensor or detector) 2113 to the carrier 2111 (e.g., ceramic or glass).
  • the carrier 2111 Depicted in FIG. 21 are the carrier 2111 and the temporary adhesive 2112 (e.g., a film or adhesive), which is dispensed onto the carrier 2111.
  • the adhesive 2112 is temporary as its removal (which includes the removal of the carrier 2111) is also a part of this example and will be discussed later.
  • the surface of the die 2113 will become the active surface of the sensor or detector 2180 is affixed to the temporary adhesive 2112.
  • the sensor or detector 2180 surface is labeled in FIGS. 23-31, but it may or may not be effective as a sensor or detector 2180 until it is chemically treated, which is discussed and illustrated in FIG. 29.
  • one or more pillars 2114 and one or more dies 2113 are oriented on the temporary adhesive 2112 on top of the carrier 2111. In some examples, these elements may be oriented utilizing a pick and place procedure.
  • the orientation of the vias (e.g., the pillars 2114) and the dies 2113 are such that each of the dies 2113 is between two pillars 2114.
  • This orientation is merely provided as an example.
  • the pillars 2113 provide electrical connectivity from each of the sensor or detectors 2180 to any element below the package, including a substrate.
  • This particular orientation demonstrates this advantage but one of skill in the art will appreciate that a variety of different orientations could be utilized to provide similar or the same functionality.
  • vias 1087, 1187 may be oriented below a sensor or detector 1080, 1180. Because the vias 1087, 1187, in FIGS. 21-31 demonstrate a particular configuration for electrically conductive elements, which differs from some earlier discussed orientations, these electrically conductive elements are referred to as pillars 2114 for the sake of clarity.
  • a material e.g., EMC material 2182
  • EMC material 2182 is molded onto the carrier 2111 such that the pillars 2114 and the dies 2113 are embedded in the EMC material 2182.
  • the EMC material 2182 may or may not cover every surface of the pillars 2114 and the dies 2113 except the surface that is affixed to the temporary adhesive 2112.
  • the EMC material 2182 is cured, which may or may not be accomplished by baking the material.
  • a top surface formed by the mold exceeds the height of the pillars 2114, which are taller than the dies 2113.
  • EMC material packages discussed herein include vias (e.g., pillars 2114) that provide electrical connectivity through the whole of the package to a sensor or detector 1080, 1180, 2180, hence, the pillars are made accessible by grinding the EMC material to form a surface 2116 that includes EMC material and surface of the dies 2113 and the pillars 2114.
  • these pillars 2114 are copper, which is conducive to the grinding process.
  • FIG. 26 depicts plating the top surfaces of the pillars 2114 with an electrically conductive material (e.g., nickel or gold) to create a seed layer 2117.
  • an electrically conductive material e.g., nickel or gold
  • this seed layer is used to connect the pillars 2114 to additional vias 2118 (e.g., FIG. 27).
  • the seed layer is not utilized and redistribution layer (RDL) pads or some other electrical contact serves as a mechanism to enable electrical coupling to the pillars 2114 and ultimately, the sensor or detector 2180.
  • FIGS. 27-31 do not depict the seed layer 2117 as it either was not implemented or, if implemented, not visible.
  • RDLs 2121 are applied to the surface 2116.
  • Each RDL applied may or may not be patterned above the surface 2116.
  • portions of the RDL are opened to provide accessibility to the electrical elements.
  • One non-limiting example of a process that can be utilized to form the openings 2122 is photolithography.
  • An electrically conductive material 2118 e.g., copper
  • the material in the openings 2122 forms vias to the pillars 2114.
  • Various non-limiting examples includes one (1) to three (3) RDLs.
  • the openings 2122 in the top RDL are plated (e.g., with gold and/or copper), to form electrical contacts 2119.
  • FIGS. 28-29 once the electrical contacts 2119 have been formed, as depicted in FIG. 28, the structure (thus far) is rotated one hundred and eighty (180) degrees and the temporary adhesive 2112 is disengaged so that both the temporary adhesive 2112 and the carrier 2111 may be removed from the structure.
  • FIG. 28 depicts the structure having been rotated and with the temporary adhesive 2112 and the carrier 2111 removed. Removing the temporary adhesive 2112 and the carrier 2111 exposes a surface of the package that includes what will become the active surface 2123 (see, FIG. 29).
  • FIG. 29 depicts an example of at least one package 2181.
  • chemistry 2124 is applied to a surface of each die 2113, enabling the treated surface of the die to act as a detector or sensor 2180 in certain flow cells. This treated portion of the surface is at least part of the active surface 2123 in some flow cells.
  • FIG. 30 depicts two different non-limiting examples of types of connections that can be formed between the electrical contacts 2119 and the sensor or detector 2180.
  • an electrical contact 2126 is wire-bonded to the sensor or detector 2180.
  • printing is utilized to form a printed connection 2127 between the sensor or detector 2180 and an electrical contact 2119.
  • a lid 2110 is added over each active surface 2123, defining a fluidic flow channel 2128 above the active surface 2123 and below the lid 2110.
  • an adhesive is used to affix the lid 2110 to a top surface of the package 2181.
  • FIG. 32 is a workflow 3200 that reviews aspects in the formation of a flow cells 2100.
  • the workflow 3200 illustrates aspects of assembling a package that includes cured molded material surrounding portions of a one or more dies.
  • one or more pillars of an electrically conductive material e.g., copper, gold, etc.
  • an adhesive is applied to a surface of a carrier (e.g., glass, ceramic, etc.) (3205).
  • a carrier e.g., glass, ceramic, etc.
  • One or more pillars and one or more dies are oriented on the adhesive (e.g., using pick and place) (3215).
  • the pillars are of a greater vertical length than the dies.
  • Material e.g., EMC material
  • EMC material is molded on the top surface of the carrier and around some surfaces of the one or more dies and the one or more pillars such that a top surface of the mold is of a greater vertical length that the pillars and the mold is cured (3225).
  • the surface of the cured molded material is ground down to expose top surfaces of the one or more pillars and top surfaces of the one or more dies to create a new surface (3235).
  • the top surfaces of the pillars are plated with an electrically conductive material to create a seed layer for conductive vias (3245).
  • one or more redistribution layers are applied and the application includes patterning each layer above the new surface, opening portions of the layer to form openings, and spreading an electrically conductive material into each opening so that the electrically conductive material is spread through the openings, forming the vias to the one or more pillars (3255).
  • Electrical contacts are attached to the vias and the carrier and the temporary adhesive are removed to expose a package surface (3265). Now that the package has been formed, in some examples, chemistry is applied to the package surface at the exposed die surface and the exposed pillar surfaces are plated to form electrical contacts (3275). The electrical contacts are electrically coupled to portions of the surfaces of the one or more dies that were or are treated with the chemistry (3297).
  • a lid is attached to the package at an orientation that defines a fluidic channel over the surfaces of the dies to which the chemistry was or is applied (3299).
  • Examples described herein include methods for forming flow cells as well as the flow cells themselves.
  • the method may include applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts.
  • the method may include orienting a package on the first adhesive, the package comprising a die where a top surface of the die comprises an active surface and electrical contact points and surfaces adjacent to the active surface on at least two opposing sides of the active surface form fanout regions for utilization in a fluidic path of the flow cell.
  • the method may include connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die.
  • the method may include applying a second adhesive to a part of the package; and attaching a lid to the second adhesive. The attaching defines a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the method may include forming the package, the forming the package comprising orienting the die on the first adhesive.
  • the method may also include forming the fanout regions by orienting one or more support pieces on the first adhesive adjacent to at least two sides of the die, where the fanout regions comprise a portion of a top surface of the support pieces.
  • the one or more support pieces comprise two support pieces and the orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises placing two support pieces adjacent to the die on opposing sides of the die.
  • the one or more support pieces comprise one support piece, the one support piece comprises a cutout, and the orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises orienting the one support piece such that the die and electrical contacts are within the cutout.
  • the package comprises a cured electronic molded compound (EMC) material molded around portions of the die, where a portion of the EMC material comprises the fanout regions.
  • EMC electronic molded compound
  • forming the fanout regions further comprises: dispensing a material to fill gaps between the one or more support pieces and the die.
  • the one or more support pieces comprise a material selected from the group consisting of glass, silicon, and ceramic.
  • the package comprises a cured electronic molded compound (EMC) material molded around portions of the die, and a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, and the fanout regions comprise portions of the layer.
  • EMC electronic molded compound
  • the method includes: forming the package, comprising: curing the EMC material around portions of the die.
  • forming the package further comprises: planarizing the EMC material surfaces adjacent to the active surface.
  • the planarizing comprises: depositing the layer on a surface comprising the top surface of the die and the EMC material surfaces adjacent to the active surface; opening the layer on the active surface; and curing the layer.
  • the layer comprises a photoresist.
  • a technique for opening the layer is selected from the group consisting of: lithography and lithography plus lift-off.
  • forming the package further comprises: prior to the curing of the EMC material around portions of the die, embedding the vias in the EMC material.
  • the vias are comprised of an electrically conductive material.
  • the electrically conductive material is selected from the group consisting of: copper, gold, tungsten, and aluminum.
  • the vias extend through the EMC material from a surface of the die opposing the active surface in a direction opposing the active surface.
  • connecting the electrical contacts on the top surface of the substrate to the electrical contact points on the die comprises wire-bonding the electrical contacts to the electrical contact points.
  • the method includes encasing the wire-bonded connections with an epoxy.
  • the method includes curing the first adhesive and the second adhesive.
  • the curing is selected from the group consisting of: thermally curing and ultraviolet (UV) curing.
  • the substrate is a printed circuit board.
  • the substrate comprises a material selected from the group consisting of: a glass-reinforced epoxy laminate material, FR4, and co-fired ceramic sheets.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, where the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the method includes forming a heating element in the substrate.
  • forming the heating element comprises: placing one or more resistors on one or more of the top surface of the substrate and the bottom surface of the substrate; and coupling the one or more resistors, via the vias, to a metal plane in the substrate.
  • the heating element comprises a long wound metal trace
  • forming the heating element comprises: forming the heating element in the substrate to function as a resistive heater.
  • applying the second adhesive further comprises applying the second adhesive to a portion of the die.
  • the die is a complementary metal-oxide-semi conductor.
  • the lid comprises two apertures and each aperture defines one of an inlet or an outlet fluidic port.
  • the active surface of the die comprises nanowells.
  • the flow cell may include a substrate comprising electrical contacts on a top surface.
  • the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die.
  • the flow call may also include a first cured adhesive, where the first cured adhesive is joined to a package.
  • the package may include the die, where the top surface of the die further comprises an active surface and fanout regions comprising surfaces adjacent at least two opposing sides of the active surface, the fanout regions at least partially defining a fluidic path of the flow cell.
  • the flow cell may also include a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the flow cell may also include the lid.
  • the package further comprises: one or more support pieces adjacent to the at least two opposing sides of the active surface of the die, where the one or more support pieces comprise the fanout regions.
  • the one or more support pieces comprise two support pieces oriented on the at least two opposing sides of the active surface of the die.
  • the one or more support pieces comprise one support piece, the one support piece comprises a cutout, and the die and the electrical contacts on the top surface of the substrate are oriented within the cutout.
  • the package further comprises: a cured electronic molded compound (EMC) material molded around portions of the die; a portion of the EMC material forming EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface; and a portion of the EMC material surfaces comprise the fanout regions.
  • EMC electronic molded compound
  • the package comprises: a cured electronic molded compound (EMC) material molded around portions of the die; a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, where the fanout regions comprise portions of the layer.
  • EMC electronic molded compound
  • the package further comprises vias embedded in the EMC material.
  • the one or more support pieces comprise a material selected from the group consisting of: glass, silicon, and ceramic.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the substrate further comprises a heating element.
  • the heating element comprises: one or more resistors on one or more of the top surface of the substrate and the bottom surface of the substrate; a metal plane in the substrate; and vias through the substrate coupling the one or more resistors to the metal plane in the substrate.
  • the heating element comprising: a long wound metal trace in the substrate to function as a resistive heater.
  • the lid comprises two apertures and each aperture defines one of an inlet or an outlet fluidic port.
  • the top surface of the die comprises nanowells.
  • the substrate is a printed circuit board.
  • the substrate comprises a material selected from the group consisting of: a glass-reinforced epoxy laminate material, FR4, and co-fired ceramic sheets.
  • the die is a complementary metal-oxide- semi conductor.
  • the method may include applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts.
  • the method may also include orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points.
  • the method may also include forming fanout regions for utilization in a fluidic path of the flow cell, where the forming the fanout regions comprises orienting one or more support pieces on the first adhesive adjacent to at least two sides of the die, where a portion of a top surface of the support pieces on the at least two sides of the die comprise the fanout regions.
  • the method may further include connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die.
  • the method may also include applying a second adhesive to a portion of the one or more support pieces.
  • the method may also include attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the one or more support pieces comprise two support pieces, and orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises placing two support pieces adjacent on opposing sides of the die.
  • the one or more support pieces comprise one support piece, the one support piece comprises a cutout, and orienting the one or more support pieces on the first adhesive adjacent to the at least two sides of the die comprises orienting the one support piece such that the die and electrical contacts are within the cutout.
  • the method also includes securing the wire-bonded connections with an epoxy.
  • forming the heating element comprises: implementing a long wound metal trace in the substrate to function as a resistive heater.
  • the method also includes utilizing the heating element to heat the substrate.
  • a flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die; a first cured adhesive, where the first cured adhesive joins the die and one or more support pieces adjacent to at least two sides of the die, to the substrate, where a portion of the top surface of the die and a portion of a top surface of the one or more support pieces, form a surface that is utilized in a fluidic path of the flow cell; a second cured adhesive, where the second cured adhesive joins areas of the one or more support pieces and areas of the top surface of the die proximate to the surface that is utilized in the fluidic path of the flow cell, to a lid; and the lid, where the lid defines a fluidic flow-cell cavity above the surface that is utilized in the fluidic path of the flow cell and below the lid.
  • the one or more support pieces comprise two support pieces oriented on opposing sides of the die.
  • the lid comprises two apertures and each aperture defines one of an inlet or an outlet fluidic port
  • the method of forming a flow cell includes applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts.
  • the method may also include orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points.
  • the method may also include forming fanout regions for utilization in a fluidic path of the flow cell, where the forming of the fanout regions comprises: orienting two support pieces on the first adhesive on opposing sides of the die, each of the two support pieces adjacent to the die, where the top surface of the die and top surfaces of the two support pieces form an upper surface; and dispensing a material to fill gaps between the two support pieces and the die.
  • the method may also include connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die.
  • the method may also include applying a second adhesive to a portion of the one or more support pieces and a portion of the die.
  • the method may also include attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above the upper surface.
  • the method of forming a flow cell includes applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts.
  • the method may also include orienting a die on the first adhesive, where a top surface of the die comprises an active surface and electrical contact points.
  • the method may also include forming fanout regions for utilization in a fluidic path of the flow cell, where the forming the fanout regions comprises: orienting a support piece on the first adhesive, where the support piece comprises a cutout, and where the orienting comprises placing the support piece on the first adhesive such that the die and electrical contacts are positioned within the cutout, where the fanout regions comprise portions of a top surface of the support piece on opposing sides of the die, and where the portions of the top surface and the active surface form an upper surface.
  • the method also includes connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die with bond wires.
  • the method also includes dispensing a second adhesive into the cutout such that the second adhesive fills spaces in the cutout between the die and the support piece and encapsulates the bond wires.
  • the method also includes applying a third adhesive to a portion of the support piece and a portion of the die.
  • the method also includes attaching a lid to the third adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above the upper surface.
  • a method of forming a flow cell includes applying a first adhesive to a substrate, where a top surface of the substrate comprises electrical contacts.
  • the method may also include orienting a package comprising a cured electronic molded compound (EMC) material molded around portions of a die, where a top surface of the die comprises an active surface and electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface.
  • the method may also include connecting the electrical contacts on the top surface of the substrate to electrical contact points on the die.
  • EMC electronic molded compound
  • the method may also include applying a second adhesive to a portion of a top surface of the package; and attaching a lid to the second adhesive, where the attaching defines a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and fanout regions for utilization in a fluidic path of the flow cell, the fanout regions comprising another portion of the top surface of the package.
  • the fanout regions are comprised of the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface.
  • the package further comprises a layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface, and the fanout regions comprise portions of the layer deposited on the EMC material surfaces adjacent to the active surface on the at least two opposing sides of the active surface.
  • connecting the electrical contacts on the top surface of the substrate to the electrical contact points on the die comprises wirebonding the electrical contacts to the electrical contact points.
  • the method includes securing the wire-bonded connections with an epoxy.
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • the package further comprises vias embedded in the EMC material.
  • a flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die.
  • the flow cell may also include a first cured adhesive, where the first cured adhesive joins a package comprising a cured electronic molded compound (EMC) material molded around portions of a die, where a top surface of the die is exposed and comprises an active surface and the electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface, where a portion of the EMC material surfaces comprise fanout regions for utilization in a fluidic path.
  • EMC electronic molded compound
  • the flow cell may also include a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the flow cell may also include the lid.
  • the top surface of the die comprises nanowells.
  • the substrate is a printed circuit board
  • the die is a complementary metal-oxide-semiconductor
  • the substrate further comprises electrical contacts on a bottom surface of the substrate, and the electrical contacts on a bottom surface of the substrate are electrically coupled to the electrical contacts on the top surface of the substrate by vias formed through the substrate.
  • a flow cell includes: a substrate comprising electrical contacts on a top surface, where the electrical contacts on the top surface of the substrate are connected to electrical contact points on a top surface of a die.
  • the flow cell may include a first cured adhesive, where the first cured adhesive joins a package comprising a cured electronic molded compound (EMC) material molded around portions of the die, where a top surface of the die is exposed and comprises an active surface and the electrical contact points, and a portion of the EMC material forms EMC material surfaces adjacent to the active surface on at least two opposing sides of the active surface, where a layer is planarizing the EMC material surfaces, where a portion of the EMC material surfaces planarized by the layer comprise fanout regions for utilization in a fluidic path.
  • EMC electronic molded compound
  • the flow cell may include a second cured adhesive, where the second cured adhesive joins a portion of a top surface of the package to a lid defining a fluidic flow-cell cavity below the lid and above a surface comprising the active surface and the fanout regions.
  • the flow cell may include the lid.
  • a method includes assembling a package comprising cured molded material surrounding portions of a one or more dies, where one or more pillars of a first electrically conductive material are embedded in the molded material, the assembling comprising: applying a temporary adhesive to a surface of a carrier.
  • the method may also include orienting the one or more pillars on the adhesive.
  • the method may also include orienting the one or more dies on the adhesive such that one or more pillars are oriented between each die of the one or more dies, where each one or more pillars is of a greater vertical length than each of the one or more dies.
  • the method may also include molding the material on the top surface of the carrier and around some surfaces of the one or more dies and the one or more pillars such that a top surface of the mold is of a greater vertical length that the one or more pillars, where the top surface of the mold is parallel to the surface of the carrier.
  • the method may also include curing the molded material.
  • the method may also include grinding the top surface of the mold to expose top surfaces of the one or more pillars and top surfaces of the one or more dies to create a new surface.
  • the method may also include plating the top surfaces of the one or more pillars with a second electrically conductive material to create a seed layer.
  • the method may also include applying one or more redistribution layers (RDLs), where applying each RDL comprises: patterning the layer above the new surface.
  • RDLs redistribution layers
  • the method may also include opening portions of the layer to form openings.
  • the method may also include spreading a third electrically conductive material into each opening such that the third electrically conductive material is spread through the openings and electrically coupled to the seed layer.
  • the method may also include attaching electrical contacts to a portion of the third electrically conductive material in the openings of an RDL of the one or more RDLs.
  • the method may also include removing the carrier and the temporary adhesive to expose a package surface.
  • the method includes: applying surface chemistry to surfaces of the one or more dies exposed by removing the carrier and the temporary adhesive to create active surfaces; and plating surfaces of the one or more pillars exposed by removing the carrier and the temporary adhesive to create electrical contacts on the pillars.
  • the method includes: electrically coupling the electrical contacts on the pillars to portions of the surfaces of the one or more dies comprising the chemistry.
  • a method of electrically coupling the electrical contacts on the pillars to portions of the surfaces of the one or more dies comprising the chemistry is selected from the group consisting of: wire-bonding and printing.
  • the method includes: attaching one or more lids to the package surface, where a fluidic flow-cell cavity is defined below each of the one or more lids and above a surface of each of the corresponding one or more sensors comprising the active surface.
  • the first electrically conductive material and the third electrically conductive material are copper.
  • the second electrically conductive material comprises one or more of nickel and gold.
  • attaching the one or more lids comprises applying an adhesive to a portion of the package surface.
  • opening the portions of the layer to form openings comprises utilizing photolithography.
  • the one or more RDLs comprise three RDLs.
  • orienting the one or more pillars and orienting the one or more dies comprise utilizing a pick and place tool.
  • the molded material comprises electronic molded compound (EMC) material.
  • EMC electronic molded compound
  • a flow cell includes: a package comprising cured material molded around portions of a die, where one or more pillars of a first electrically conductive material are embedded in the molded material, where a top surface of the package comprises an active surface of the die.
  • the flow cell may also include a lid attached to portion of the top surface of the package, where a fluidic flow-cell cavity is defined below the lid and above the active surface.
  • the package includes one or more redistribution layers (RDLs), attached to a bottom surface of the package.
  • the RDLs comprise openings filled with electrically conductive material electrically coupled to the at least one of the one or more pillars.
  • the package includes electrical contacts electrically coupled to the electrically conductive material in the openings of the one or more RDLs.
  • the cured material comprises electronic molded compound (EMC).
  • each block in the flowchart or block diagrams can represent a module, segment, or portion of instructions, which comprises one or more executable instructions for implementing the specified logical function(s).
  • the functions noted in the blocks can occur out of the order noted in the Figures.
  • two blocks shown in succession can, in fact, be executed substantially concurrently, or the blocks can sometimes be executed in the reverse order, depending upon the functionality involved.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
  • Optical Measuring Cells (AREA)
  • External Artificial Organs (AREA)
PCT/US2022/014740 2021-02-05 2022-02-01 Fanout flow cell Ceased WO2022169763A1 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
AU2022217155A AU2022217155A1 (en) 2021-02-05 2022-02-01 Fanout flow cell
CN202280005346.3A CN116209523A (zh) 2021-02-05 2022-02-01 扇出型流通池
EP22750252.3A EP4288209A4 (en) 2021-02-05 2022-02-01 OUTLET FLOW CELL
KR1020227045853A KR20230138388A (ko) 2021-02-05 2022-02-01 팬아웃 플로우 셀
CA3183872A CA3183872A1 (en) 2021-02-05 2022-02-01 Fanout flow cell
US18/003,281 US20240009665A1 (en) 2021-02-05 2022-02-01 Fanout flow cell
JP2022580780A JP2024507023A (ja) 2021-02-05 2022-02-01 ファンアウトフローセル

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US202163146444P 2021-02-05 2021-02-05
US63/146,444 2021-02-05
US202163169423P 2021-04-01 2021-04-01
US63/169,423 2021-04-01

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KR20230138388A (ko) 2023-10-05
EP4288209A1 (en) 2023-12-13
JP2024507023A (ja) 2024-02-16
EP4288209A4 (en) 2024-12-11
AU2022217155A1 (en) 2023-01-05
CN116209523A (zh) 2023-06-02
US20240009665A1 (en) 2024-01-11

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