WO2022166172A1 - 空调器及其电控箱 - Google Patents

空调器及其电控箱 Download PDF

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Publication number
WO2022166172A1
WO2022166172A1 PCT/CN2021/114509 CN2021114509W WO2022166172A1 WO 2022166172 A1 WO2022166172 A1 WO 2022166172A1 CN 2021114509 W CN2021114509 W CN 2021114509W WO 2022166172 A1 WO2022166172 A1 WO 2022166172A1
Authority
WO
WIPO (PCT)
Prior art keywords
box body
electric control
control box
heat dissipation
computer board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/114509
Other languages
English (en)
French (fr)
Inventor
延廷琪
吕福俊
陈朋
张岐军
王秀霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Air Conditioner Gen Corp Ltd
Qingdao Haier Air Conditioning Electric Co Ltd
Haier Smart Home Co Ltd
Original Assignee
Qingdao Haier Air Conditioner Gen Corp Ltd
Qingdao Haier Air Conditioning Electric Co Ltd
Haier Smart Home Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Air Conditioner Gen Corp Ltd, Qingdao Haier Air Conditioning Electric Co Ltd, Haier Smart Home Co Ltd filed Critical Qingdao Haier Air Conditioner Gen Corp Ltd
Publication of WO2022166172A1 publication Critical patent/WO2022166172A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/22—Arrangement or mounting thereof
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
    • F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
    • F24F1/20—Electric components for separate outdoor units
    • F24F1/24—Cooling of electric components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F11/00—Control or safety arrangements
    • F24F11/89—Arrangement or mounting of control or safety devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects

Definitions

  • the invention belongs to the technical field of air conditioners, and specifically provides an air conditioner and an electric control box thereof.
  • the existing air conditioners are equipped with electric control boxes for installing and protecting various electric control modules. Due to the limitation of the internal structure and space of the indoor unit, the electric control boxes of the existing air conditioners are usually set near the heat exchanger. As a result, the electric control box will be in constant contact with the heat-exchanged air. At the same time, since each electric control module in the electric control box will continuously generate heat during the working process, the existing electric control box is usually provided with a heat dissipation member to better conduct the heat inside the box to the outside of the box. However, these heat dissipation components can not only conduct the heat inside the box, but also conduct the heat outside the box.
  • the hot air generated by the indoor unit continuously blows through the heat-dissipating components, which can easily cause the temperature of the heat-dissipating components to be too high, and even conduct the heat directly into the box, resulting in the internal heat of the box.
  • Various electronic control modules can only operate in a high temperature environment; this can easily lead to the problem that the electronic control modules installed inside the box cannot work properly due to excessive temperature, and the entire air conditioner has to be shut down for repairs, and even It will cause the electronic control module to be damaged.
  • the present invention provides a An electric control box for an air conditioner, the electric control box includes an outer box body and an inner box body arranged in the outer box body, the inner box body and the outer box body are connected by at least one connecting member Therefore, a heat conduction cavity is formed between the inner box body and the outer box body, a computer board is arranged in the inner box body, and at least one pin is arranged on the computer board, and the pin penetrates the connecting member.
  • the outer box body is provided with a semiconductor refrigeration chip, and the cold surface of the semiconductor refrigeration chip is located on the side close to the inner box body, and the outer box body is also At least one through hole is provided, and the heat conduction cavity communicates with the outside through the through hole.
  • the top of the outer box is provided with an opening structure, and the semiconductor refrigeration chip is arranged at the opening and shields the opening.
  • the computer board is arranged close to the first side, and the top plate of the inner box is arranged inclined downward from the first side to the second side; wherein the first side and the The second side is opposite.
  • annular water accumulation platform is provided on the outer top surface of the inner box body, so as to accumulate condensed water for cooling.
  • the connecting member includes a first heat dissipation part and a second heat dissipation part that are connected, and the first heat dissipation part is arranged between the inner box body and the outer box body, The second heat dissipation part is disposed outside the outer casing.
  • a heat dissipation cavity is formed in the first heat dissipation part, and the pins penetrate through the first heat dissipation part through the heat dissipation cavity.
  • the computer board is arranged near the bottom of the inner box.
  • the through hole is a drainage hole
  • the installation height of the drainage hole in the vertical direction is located at the vertical height of the computer board and the vertical height of the bottom plate of the inner box. between straight heights.
  • the shape of the inner box body is a rectangular parallelepiped; and/or the shape of the outer box body is a rectangular parallelepiped shape.
  • the present invention also provides an air conditioner, which includes the electric control box described in any one of the above-mentioned preferred technical solutions.
  • the electric control box of the present invention includes an outer box body and an inner box body arranged in the outer box body, the inner box body and the outer box body.
  • the boxes are connected by at least one connecting member and thus form a heat conduction cavity between the inner box and the outer box
  • the inner box is provided with a computer board
  • the computer board is provided with at least one pin
  • the pins penetrate through the connecting member and extend to the outside of the outer box body
  • the outer box body is provided with a semiconductor refrigeration chip
  • the cold surface of the semiconductor refrigeration chip is located on the side close to the inner box body
  • the outer box body is also provided with at least one through hole, and the heat conduction cavity communicates with the outside through the through hole.
  • the present invention effectively reduces the influence of the heat generated by the heat exchanger on the temperature of the computer board by arranging a double-layer box structure and arranging the computer board in the inner box.
  • the pin is used to improve its own heat dissipation capacity, and at the same time, it is more convenient for technicians to perform various wiring work, and the present invention also effectively reduces the temperature in the heat conduction cavity by setting the semiconductor cooling chip, so as to ensure the maximum degree of all The temperature in the heat conduction cavity can be effectively ensured, so that the computer board can always work at a suitable temperature to ensure the reliability of the entire air conditioner.
  • Fig. 1 is the overall schematic diagram of the electric control box of the present invention (without front panel);
  • Fig. 2 is the front view of the electric control box of the present invention (without front panel);
  • Fig. 3 is the sectional view of A-A surface in Fig. 2;
  • Fig. 4 is the sectional view of B-B surface in Fig. 2;
  • Fig. 5 is the sectional view of C-C plane in Fig. 2;
  • Reference numerals 11, outer box body; 12, inner box body; 121, top plate; 13, connecting column; 131, first heat dissipation part; 1311, heat dissipation cavity; 132, second heat dissipation part; 14, computer board; 141 , pins; 15, semiconductor refrigeration sheet; 16, through holes; 101, heat conduction cavity.
  • connection and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components.
  • connection should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrally connected; it can be a mechanical connection or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or the internal communication between the two components.
  • FIG. 1 is an overall schematic diagram of the electric control box (without front panel) of the present invention
  • FIG. 2 is a front view of the electric control box (without front panel) of the present invention.
  • the present invention does not impose any restrictions on the specific application objects of the electric control box, that is, technicians can use the electric control box of the present invention in various types of air conditioners according to actual use requirements;
  • the change of the application object does not deviate from the basic principle of the present invention, and should all belong to the protection scope of the present invention.
  • none of the figures shows the front panel part of the electric control box, and the front panel can close the front opening of the electric control box.
  • the electric control box of the present invention includes an outer box body 11 and an inner box body 12 arranged in the outer box body 11.
  • the inner box body 12 and the outer box body 11 pass through two
  • the connecting posts 13 are connected so that a heat conduction cavity 101 is formed between the inner box 12 and the outer box 11.
  • the inner box 12 is provided with the computer board 14 of the air conditioner, and the computer board 14 is provided with a plurality of pins 141.
  • the pins 141 penetrate through the connecting column 13 and extend to the outside of the outer casing 11 .
  • the present invention does not impose any restrictions on the specific shapes and sizes of the outer box 11 and the inner box 12 , as long as the inner box 12 can accommodate the computer board 14 and the gap between the inner box 12 and the outer box 11
  • the heat conduction cavity 101 only needs to be formed, and technicians can set it according to the actual use requirements; preferably, the outer box body 11 and the inner box body 12 are both rectangular parallelepiped, so as to better plan their internal structure settings.
  • the connecting member described in this preferred embodiment is a connecting column structure, this is not limiting, and the technical personnel can set the specific structure of the connecting member according to the actual use requirements, as long as it can connect to the outer box
  • the body 11 and the inner box body 12 only need the pins 141 to pass through.
  • the present invention does not impose any restrictions on the specific type of the computer board 14 and the specific number of pins 141 .
  • the technicians can set it according to the actual use requirements of the air conditioner, and the specific structure and size of the computer board 14 are corresponding. Adjust the size of the entire electrical control box.
  • the changes of these specific structures do not deviate from the basic principles of the present invention, and belong to the protection scope of the present invention.
  • the outer box body 11 is a rectangular box-shaped structure with an open top, and a semiconductor refrigeration sheet 15 is provided at the top opening.
  • the semiconductor refrigeration sheet 15 serves as the top plate of the outer box body 11 to cover the top opening, so that the semiconductor refrigeration chip 15 and the outer box 11 together form a completely closed box structure.
  • the bottom surface of the semiconductor refrigeration chip 15 is directly in contact with the heat conduction cavity 101 as the inner top surface of the outer box 11. It is preferably powered by the computer board 14. Of course, other external power sources can also be used. It faces upwards so that its cold side can be located in the heat-conducting cavity 101 to better reduce the temperature in the heat-conducting cavity 101 . It can be understood by those skilled in the art that the technical person can set the specific type of the semiconductor refrigeration chip 15 according to actual use requirements, as long as it has a cold side and a hot side and the cold side is arranged in the heat conduction cavity 101 .
  • the present invention does not impose any restrictions on the specific arrangement and location of the semiconductor refrigeration sheet 15 , and technicians can set it according to actual use requirements, as long as the semiconductor refrigeration sheet 15 can cool the heat conduction cavity 101 .
  • the semiconductor refrigerating sheet 15 may also be disposed on the side or bottom of the outer box 11 ; for another example, the cold surface of the semiconductor refrigerating sheet 15 may be directly located in the heat conduction cavity 101 , or the heat conduction cavity may be connected to the heat conduction cavity through the panel of the outer box 11 . 101 to cool down.
  • the semiconductor refrigeration sheet 15 is disposed on the top of the outer box 11 and its cold surface is in direct contact with the air in the heat conduction cavity 101, so as to ensure the cooling effect to the greatest extent.
  • the outer box 11 is further provided with a through hole 16 , and the through hole 16 is located at the bottom right side of the rear panel of the outer box 11 .
  • the through hole 16 is used as a drainage hole.
  • the air humidity is high, the air is cooled on the cold surface of the semiconductor refrigerating sheet 15 to generate condensed water, and the condensed water continuously accumulates and drips onto the outer box 11 .
  • the accumulated water can further cool the air in the heat conduction cavity 101, and when the height of the accumulated water exceeds the setting height of the through hole 16, the excess water can be discharged through the through hole 16, thereby effectively avoiding excessive humidity.
  • the height of the through hole 16 in the vertical direction is located between the vertical height of the computer board 14 and the vertical height of the bottom plate of the inner box 12, so that the water accumulated in the outer box 11 It can be higher than the bottom plate of the inner box body 12 so as to better cool the inner box body 12 without exceeding the computer board 14 , thereby preventing the accumulated water from causing irreversible damage to the computer board 14 to the greatest extent.
  • the present invention does not impose any restrictions on the specific shape, specific arrangement quantity and specific arrangement position of the through holes 16 , and the technicians can set them according to actual use requirements.
  • the through hole 16 described in this preferred embodiment is a drainage hole disposed at the bottom of the outer box 11
  • the through hole 16 can obviously also be an exhaust hole disposed at the top of the outer box 11, which is obviously not a limitation Yes, it is a preferred way to further reduce the temperature by condensing water, which is more conducive to the reduction of the internal temperature.
  • the through hole 16 may be circular, square, or elongated; these are not restrictive, and technicians can set them according to actual use requirements.
  • FIG. 3 is a cross-sectional view of the A-A plane in FIG. 2
  • FIG. 4 is a cross-sectional view of the B-B plane in FIG. 2.
  • the length of the inner box 12 is set to be equal to the length of the computer board 14
  • its width is set to be greater than the width of the computer board 14 ;
  • the sides are abutted on the left and right side walls of the inner box body 12 for better heat conduction, so that the temperature of the computer board 14 can be quickly adjusted.
  • At least one elongated protruding structure is provided on the left side wall and the right side wall of the inner box 12, respectively, and the computer board 14 is abutted and fixed by the two protruding structures, so as to maximize the heat conduction efficiency
  • the technician can also set the fixing method according to the actual use requirements, as long as the abutment can be achieved.
  • the computer board 14 is arranged on the front side of the inner box 12 so that the rear space is free, so as to better ensure its heat dissipation effect.
  • the computer board 14 is arranged on the left side of the inner box body 12, and the top plate 121 of the inner box body 12 is inclined downward from left to right, so that the The water is guided to the side away from the computer board 14 to protect the computer board 14 to the greatest extent.
  • the setting of the specific orientation is not restrictive, and the technician can also set it according to the actual use requirements.
  • the top plate 121 of the inner box 12 is set from the first side to the first side.
  • the side to the second side is inclined downward, wherein the first side and the second side are opposite; It can be set by tilting down to the left, and the technician can adjust it according to the actual use needs.
  • the outer surface of the top plate 121 of the inner box body 12, that is, the outer top surface of the inner box body 12, is also provided with an annular water accumulation platform (not shown in the figure), and the annular water accumulation platform is formed by the top plate 121.
  • the outer surface is formed to protrude outwards, referring to the orientation in Figure 3, the annular water platform is set as an annular protrusion with a high right side and a left bottom bottom, so that the water level accumulated on the right side is higher than the water level accumulated on the left side, thereby making the accumulated water level on the right side higher than that on the left side.
  • the water covers a larger area to further enhance its cooling effect.
  • the cross-sectional shape of the annular water storage platform is set to be the same as the shape of the edge of the top plate 121, so that the water accumulated in the annular water storage platform can cover the entire top plate 121 more, so as to maximize the Improve cooling effect.
  • the annular water storage platform when the condensed water accumulated on the inner side wall of the outer box 11 drops, the water dropped into the annular water storage platform can be accumulated in the annular water storage platform.
  • the water level exceeds the vertical height of the annular water storage platform It will flow out of the inner box body 12 during the water storage process, so as to ensure the internal temperature of the inner box body 12 to the greatest extent, and thus effectively ensure the normal operation of the computer board 14 .
  • the annular water collecting platform described in this preferred embodiment is integrally formed with the top plate 121, it may also be a separate element and then connected to the top of the top plate 121, which is not limiting.
  • FIG. 5 is a cross-sectional view of plane C-C in FIG. 2 .
  • the cross-sectional shape of the connecting column 13 is square; it should be noted that the present invention does not impose any restrictions on the specific shape, number and location of the connecting column 13 , as long as at least a part of the connecting column 13 is located between the outer box 11 and the inner box 12, so that the outer box 11 and the inner box 12 are connected by the connecting column 13, and a heat conduction cavity 101 is formed between the two.
  • the connecting column 13 may also be cylindrical; the number of the connecting column 13 may be one or a plurality of; the connecting column 13 may also be arranged on the side. None of this is restrictive, and technicians can adjust it according to actual usage needs.
  • the top of the pin 141 is connected to the computer board 14, and the connection method is preferably welded, so as to ensure the connection effect while effectively ensuring the degree of tightening.
  • the middle portion of 141 runs through the entire connecting column 13 , and the bottom thereof extends to the outside of the connecting column 13 .
  • the technical personnel can set the specific number and structure of the pins 141 according to the actual use requirements.
  • the number of the pins 141 can be set according to the number of wirings.
  • the outer covering of insulating rubber, etc., is not restrictive, and the technicians can adjust it according to the actual use needs.
  • long needle-shaped pins 141 are arranged on the connecting lines on the computer board 14 to effectively ensure the reliability of the connection, thereby effectively avoiding the problem of easy breakage of the connecting lines; and the pins 141 can extend from the inner box 12 to the The outside of the outer box body 11, so that the technician can directly connect the wire directly through the pin 141 located on the outside, without opening the electric control box to perform the connection operation, which also enables the electric control box to maintain In a better sealing state, it can even be directly connected by bonding to effectively ensure its airtightness, thereby effectively preventing external debris from entering the inner box 12 and affecting the normal operation of the computer board 14 .
  • the connecting column 13 includes a first heat dissipation portion 131 and a second heat dissipation portion 132, wherein the first heat dissipation portion 131 is disposed between the inner case 12 and the outer case 11, and the second heat dissipation portion 131 is disposed between the inner case 12 and the outer case 11.
  • the part 132 is disposed outside the outer casing 11 , the first heat dissipation part 131 and the second heat dissipation part 132 are connected as a whole, and the pins 141 can penetrate through the entire connecting column 13 .
  • connection post 13 is made of rubber material with good thermal conductivity and insulation performance.
  • the pins 141 can be directly penetrated on the connecting post 13, so as to ensure the heat dissipation effect, and also can effectively take into account the insulation effect.
  • the first heat dissipation portion 131 is a square cylindrical structure, and a square column-shaped heat dissipation cavity 1311 is formed inside.
  • the specific shape for example, the heat dissipation cavity 1311 may also be cylindrical.
  • the pins 141 pass through the first heat dissipation part 131 through the heat dissipation cavity 1311, so that the pins 141 can be better dissipated in the heat dissipation cavity 1311, and the heat can be transferred to the inner box 12 through the top of the heat dissipation cavity 1311, so as to effectively prevent the The problem of high temperature of pin 141.
  • the pins 141 are interspersed on the second heat dissipation part 132 for better fixing, thereby effectively ensuring the reliability of the operation of the computer board 14, thereby effectively ensuring the normal operation of the air conditioner, and better maintaining different
  • the spacing between the pins 141 can effectively ensure that different pins 141 can maintain their respective normal operations, so as to further improve their reliability.
  • the first heat dissipation portion 131 , the outer case 11 and the inner case 12 are all made of plastic, and the first heat dissipation portion 131 , the outer case 11 and the inner case 12 are integrally formed by injection molding, and the second heat dissipation portion 132 is made of plastic. It is made of rubber material, and is separately bonded to the bottom of the outer box 11 so as to be integrally connected with the first heat dissipation portion 131 , thereby effectively simplifying its production process.
  • the structure of the connecting column 13 described in this preferred embodiment is only a preferred setting, but not restrictive, and the technical personnel can set the specific structure and shape of the connecting column 13 according to the actual use requirements. and position; for example, the height of the first heat dissipation portion 131 is set according to the design requirements of the heat conduction cavity 101 between the outer case 11 and the inner case 12 .
  • the change of this specific arrangement does not deviate from the basic principle of the present invention, and belongs to the protection scope of the present invention.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Mechanical Engineering (AREA)
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  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明属于空调技术领域，具体提供一种空调器及其电控箱。本发明旨在解决现有电控箱的结构设计不佳而容易导致其内部温度过高，进而影响电控模块正常工作的问题。为此，本发明的电控箱包括外箱体以及设置在外箱体中的内箱体，内箱体和外箱体通过连接构件相连并因此在内箱体与外箱体之间形成导热腔，内箱体中设置有电脑板，以便有效减少换热器产生的热量对电脑板的温度影响，电脑板上设置有至少一个针脚，针脚贯穿连接构件并延伸至外箱体的外部，外箱体上设置有半导体制冷片，并且半导体制冷片的冷面位于靠近内箱体的一侧，外箱体上还设置有至少一个通孔，导热腔通过通孔与外部连通，以便有效降低导热腔中的温度，进而有效保证电脑板工作的可靠性。

Description

空调器及其电控箱 技术领域
本发明属于空调技术领域，具体提供一种空调器及其电控箱。
背景技术
现有空调器大多都设置有用于安装和保护各种电控模块的电控箱，由于受到室内机的内部结构及空间限制，现有空调器的电控箱通常都设置在换热器附近，因而导致电控箱会不断与换热后的空气接触。同时，又由于电控箱中的各个电控模块在工作过程中均会不断产生热量，因而现有电控箱通常都设置有散热构件以更好地将箱体内部的热量传导至箱体外部；然而这些散热构件不仅能将箱体内部的热量传导出去，同样也能将箱体外部的热量传导进去。特别是在空调器运行制热模式时，室内机产生的热风不断吹过散热构件，很容易导致散热构件的温度过高，甚至还会将热量直接传导至箱体内部，从而导致箱体内部的各种电控模块只能在高温环境下运行；这样很容易导致设置在箱体内部的电控模块因温度过高而无法正常工作的问题，进而导致整个空调器都不得不停机修整，甚至还会导致电控模块被损坏的问题。
相应地，本领域需要一种新的空调器及其电控箱来解决上述问题。
发明内容
为了解决现有技术中的上述问题，即为了解决现有空调器的电控箱的结构设计不佳而容易导致其内部温度过高，进而影响电控模块正常工作的问题，本发明提供了一种用于空调器的电控箱，所述电控箱包括外箱体以及设置在所述外箱体中的内箱体，所述内箱体和所述外箱体通过至少一个连接构件相连并因此在所述内箱体与所述外箱体之间形成导热腔，所述内箱体中设置有电脑板，所述电脑板上设 置有至少一个针脚，所述针脚贯穿所述连接构件并延伸至所述外箱体的外部，所述外箱体上设置有半导体制冷片，并且所述半导体制冷片的冷面位于靠近所述内箱体的一侧，所述外箱体上还设置有至少一个通孔，所述导热腔通过所述通孔与外部连通。
在上述电控箱的优选技术方案中，所述外箱体的顶部设置有开口结构，所述半导体制冷片设置于所述开口处并遮蔽所述开口。
在上述电控箱的优选技术方案中，所述电脑板靠近第一侧设置，所述内箱体的顶板从第一侧往第二侧呈向下倾斜设置；其中，所述第一侧和所述第二侧相对。
在上述电控箱的优选技术方案中，所述内箱体的外顶面上设置有环形积水台，以便蓄积冷凝水来进行降温。
在上述电控箱的优选技术方案中，所述连接构件包括相连的第一散热部和第二散热部，所述第一散热部设置于所述内箱体与所述外箱体之间，所述第二散热部设置于所述外箱体的外部。
在上述电控箱的优选技术方案中，所述第一散热部中形成有散热腔，所述针脚通过所述散热腔贯穿所述第一散热部。
在上述电控箱的优选技术方案中，所述电脑板靠近所述内箱体的底部设置。
在上述电控箱的优选技术方案中，所述通孔为排水孔，所述排水孔在竖直方向上的设置高度位于所述电脑板的竖直高度和所述内箱体的底板的竖直高度之间。
在上述电控箱的优选技术方案中，所述内箱体的形状为长方体形；并且/或者所述外箱体的形状为长方体形。
本发明还提供了一种空调器，所述空调器包括上述任一项优选技术方案中所述的电控箱。
本领域技术人员能够理解的是，在本发明的技术方案中，本发明的电控箱包括外箱体以及设置在所述外箱体中的内箱体，所述内箱体和所述外箱体通过至少一个连接构件相连并因此在所述内箱体与所述外箱体之间形成导热腔，所述内箱体中设置有电脑板，所述电脑板上设置有至少一个针脚，所述针脚贯穿所述连接构件并延伸至所述外箱体的外部，所述外箱体上设置有半导体制冷片，并且所述半导 体制冷片的冷面位于靠近所述内箱体的一侧，所述外箱体上还设置有至少一个通孔，所述导热腔通过所述通孔与外部连通。本发明通过设置双层箱体结构且将所述电脑板设置于所述内箱体中来有效减少换热器产生的热量对所述电脑板的温度影响，通过在所述电脑板上设置所述针脚来提升自身的散热能力，同时还能够更方便技术人员进行各种接线工作，并且本发明还通过设置所述半导体制冷片来有效降低所述导热腔中的温度，以便最大程度地保证所述导热腔中的温度，进而有效保证所述内箱体中的温度，以使所述电脑板始终能够在适宜温度下工作而保证整个空调器的可靠性。
附图说明
图1是本发明的电控箱(未带前面板)的整体示意图；
图2是本发明的电控箱(未带前面板)的正视图；
图3是图2中A-A面的剖视图；
图4是图2中B-B面的剖视图；
图5是图2中C-C面的剖视图；
附图标记：11、外箱体；12、内箱体；121、顶板；13、连接柱；131、第一散热部；1311、散热腔；132、第二散热部；14、电脑板；141、针脚；15、半导体制冷片；16、通孔；101、导热腔。
具体实施方式
下面参照附图来描述本发明的优选实施方式。本领域技术人员应当理解的是，这些实施方式仅用于解释本发明的技术原理，并非旨在限制本发明的保护范围。本领域技术人员可以根据需要对其作出调整，以便适应具体的应用场合。例如，本优选实施例中所述的电控箱可以用于室外机中，也可以用于室内机中；又例如，所述室内机可以是挂式内机，也可以是柜式内机。这些具体应用对象的改变均不偏离本发明的基本原理，属于本发明的保护范围。
需要说明的是，在本发明的描述中，术语“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方向或者位置关系的术语是基于附图所示的方向或位置关系，这仅仅是 为了便于描述，而不是指示或暗示所述装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性。
此外，还需要说明的是，在本发明的描述中，除非另有明确的规定和限定，术语“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域技术人员而言，可根据具体情况理解上述术语在本发明中的具体含义。
首先参阅图1和图2，其中，图1是本发明的电控箱(未带前面板)的整体示意图；图2是本发明的电控箱(未带前面板)的正视图。首先，需要说明的是，本发明不对所述电控箱的具体应用对象作任何限制，即技术人员可以根据实际使用需求自行将本发明的电控箱用于各类空调器中；这种具体应用对象的改变并不偏离本发明的基本原理，均应属于本发明的保护范围。另外，为了方便示出所述电控箱的内部结构，图中均未示出所述电控箱的前面板部分，所述前面板可以封闭所述电控箱的前端开口。如图1和2所示，本发明的电控箱包括外箱体11以及设置在外箱体11中的内箱体12，在本优选实施例中，内箱体12和外箱体11通过两个连接柱13相连，使得内箱体12和外箱体11之间形成导热腔101，内箱体12中设置有所述空调器的电脑板14，电脑板14上设置有多个针脚141，针脚141贯穿连接柱13并延伸至外箱体11的外部。
需要说明的是，本发明不对外箱体11和内箱体12的具体形状和尺寸作任何限制，只要内箱体12中可以容纳电脑板14，以及内箱体12和外箱体11之间形成有导热腔101即可，技术人员可以根据实际使用需求自行设定；优选地，外箱体11和内箱体12均为长方体形，以便更好地规划其内部结构设置。另外，虽然本优选实施例中所述的连接构件为连接柱结构，但这并不是限制性的，技术人员可以根据实际使用需求自行设定所述连接构件的具体结构，只要其能够连接外箱体11和内箱体12并供针脚141穿过即可。此外，本发明也不对 电脑板14的具体类型及针脚141的具体设置数量作任何限制，技术人员可以根据所述空调器的实际使用需求自行设定，并且根据电脑板14的具体结构及尺寸相应调节整个电控箱的尺寸。这些具体结构的改变均不偏离本发明的基本原理，属于本发明的保护范围。
具体地，在本优选实施例中，外箱体11为顶部开口的长方体形盒状结构，其顶部开口处设置有半导体制冷片15，半导体制冷片15作为外箱体11的顶板以遮蔽其顶部开口，以使半导体制冷片15和外箱体11共同形成一个完整封闭的箱体结构。半导体制冷片15的底面作为外箱体11的内顶面直接与导热腔101接触，其优选通过电脑板14供电，当然也可以采用其他外接电源，并且其设置方向为冷面朝下，热面朝上，以使其冷面能够位于导热腔101中，以便更好地降低导热腔101中的温度。本领域技术人员能够理解的是，技术人员可以根据实际使用需求自行设定半导体制冷片15的具体类型，只要其具有冷面和热面且其冷面设置于导热腔101中即可。
需要说明的是，本发明不对半导体制冷片15的具体设置方式和设置位置作任何限制，技术人员可以根据实际使用需求自行设定，只要半导体制冷片15能够对导热腔101进行降温即可。例如，半导体制冷片15还可以设置在外箱体11的侧部或底部；又例如，半导体制冷片15的冷面可以直接位于导热腔101中，也可以隔着外箱体11的面板对导热腔101进行降温。当然，优选地，半导体制冷片15设置在外箱体11顶部且其冷面直接与导热腔101中的空气接触，以便最大程度地保证降温效果。
继续参阅图2，如图2所示，外箱体11上还设置有一个通孔16，通孔16位于外箱体11的后背板的右侧底部。在本优选实施例中，通孔16作为排水孔使用，当空气湿度较大时，空气在半导体制冷片15的冷面遇冷而产生冷凝水，冷凝水不断积累并滴落至外箱体11的底部，蓄积的水能够进一步对导热腔101中的空气进行降温，并且当蓄积的水的高度超过通孔16的设置高度时，多余的水能够通过通孔16排出，从而有效避免湿度过大的问题，进而有效保证电脑板14的安全使用。作为一种优选设置方式，通孔16在竖直方向上的设置高度位于电脑板14的竖直高度和内箱体12的底板的竖直高度之间，以使外 箱体11中蓄积的水能够高于内箱体12的底板，以便更好地对内箱体12进行降温处理，而又不会超过电脑板14，进而最大程度地防止蓄积的水对电脑板14造成不可逆的损坏。
需要说明的是，本发明不对通孔16的具体形状、具体设置数量和具体设置位置作任何限制，技术人员可以根据实际使用需求自行设定。例如，虽然本优选实施例中所述的通孔16是设置在外箱体11底部的排水孔，但是，通孔16显然还可以是设置在外箱体11顶部的排气孔，这显然不是限制性的，只是通过冷凝水进行进一步降温是一种优选方式，更有利于内部温度的降低。又例如，通孔16可以是圆形，也可以是方形，还可以是长条形；这都不是限制性的，技术人员可以根据实际使用需求自行设定。
接着参阅图3和图4，其中，图3为图2中A-A面的剖视图，图4为图2中B-B面的剖视图。如图3和4所示，在本优选实施例中，内箱体12的长度设置为与电脑板14的长度相等，其宽度设置为大于电脑板14的宽度；基于此，电脑板14的两侧抵接至内箱体12的左右侧壁上，以便更好地进行导热，从而能够快速调节电脑板14的温度。优选地，内箱体12的左侧壁和右侧壁上分别设置有至少一个长条状凸起结构，电脑板14通过这两个凸起结构实现抵接固定，以便最大程度地提升导热效率；当然，这并不是限制性的，技术人员也可以根据实际使用需求自行设定固定方式，只要能够实现抵接即可。进一步地，电脑板14设置在内箱体12中的前侧，以使后部空间空余，从而更好地保证其散热效果。需要说明的是，上述设置方式均是优选设置方式，技术人员也可以根据实际使用需求自行设定电脑板14的具体固定方式及固定位置，只要电脑板14设置在内箱体12中即可。这种具体设置方式的改变并不偏离本发明的基本原理，属于本发明的保护范围。
进一步地，继续参阅图3，依据图3中的方位，电脑板14设置于内箱体12的左侧，内箱体12的顶板121从左往右呈向下倾斜设置，以便更快地将水导流至远离电脑板14的一侧，进而最大程度地对电脑板14进行保护。当然，这种有关具体方位的设置并不是限制性的，技术人员也可以根据实际使用需求自行设定，只要当电脑板14靠 近第一侧设置时，将内箱体12的顶板121从第一侧往第二侧呈向下倾斜设置即可，其中，第一侧和第二侧相对；例如，当电脑板14设置于内箱体12的右侧时，内箱体12的顶板121从右往左呈向下倾斜设置即可，技术人员可以根据实际使用需求自行调整。
进一步优选地，内箱体12的顶板121的外侧面上，即内箱体12的外顶面上还设置有环形积水台(图中未示出)，该环形积水台由顶板121的外侧面向外突出形成，参阅图3中的方位，该环形积水台设置为右侧高左侧底的环形凸起，以使其右侧蓄积的水位高于左侧蓄积的水位，进而使得积水覆盖面积更大，以便进一步提升其降温效果。作为一种优选设置方式，该环形积水台的横截面形状设置为与顶板121的边缘形状相同，以使所述环形积水台中蓄积的水能够更多地覆盖整个顶板121，以便最大程度地提升冷却效果。基于环形积水台的设置，当外箱体11的内侧壁蓄积的冷凝水滴落时，滴落至环形积水台中的水能够被蓄积在环形积水台中，当水位超过环形积水台的竖直高度时才会从中流出，以便在蓄水过程中进一步对内箱体12进行降温处理，从而最大程度地保证内箱体12中的内部温度，进而有效保证电脑板14的正常工作。需要说明的是，虽然本优选实施例中所述的环形积水台与顶板121一体形成，但其也可以是一个单独的元件，再连接至顶板121的顶部，这并不是限制性的。
继续参阅图5，该图是图2中C-C面的剖视图。如图2、3和5所示，在本优选实施例中，连接柱13的横截面形状为方形；需要说明的是，本发明不对连接柱13的具体形状、设置数量和设置位置作任何限制，只要连接柱13的至少一部分位于外箱体11和内箱体12之间，以使外箱体11和内箱体12通过连接柱13连接，并在两者之间形成导热腔101即可。例如，连接柱13还可以是圆柱状；连接柱13的数量既可以是一个，也可以是多个；连接柱13还可以设置在侧部。这都不是限制性的，技术人员可以根据实际使用需求自行调整。
具体地，继续参阅图3，如图3所示，针脚141的顶部与电脑板14相连，并且优选采用焊接的连接方式，以便在保证连通效果的同时，还能够有效保证其紧固程度，针脚141的中部贯穿整个连接柱13，其底部延伸至连接柱13的外部。需要说明的是，技术人员可以 根据实际使用需求自行设定针脚141的具体数量和结构，例如，根据接线数量来设定针脚141的数量，又例如，根据实际使用需求选择性地在针脚141的外部包覆绝缘胶皮等，这都不是限制性的，技术人员可以根据实际使用需求自行调整。本发明通过将电脑板14上的连接线设置成长针状的针脚141，以便有效保证其连接的可靠性，从而有效避免连接线容易断裂的问题；并且针脚141能够从内箱体12中延伸至外箱体11的外部，以便技术人员可以直接通过位于外部的针脚141部分直接进行连线，而无需再开启所述电控箱才能进行连线操作，这也就使得所述电控箱能够维持更好的密封状态，甚至可以直接采用粘接的方式连接为一体，以便有效保证其密闭性，从而有效防止外部杂物进入内箱体12中而影响到电脑板14的正常工作。
进一步地，作为一种优选设置方式，连接柱13包括第一散热部131和第二散热部132，其中，第一散热部131设置于内箱体12与外箱体11之间，第二散热部132设置于外箱体11的外部，第一散热部131和第二散热部132连接为一体，针脚141能够贯穿整个连接柱13。需要说明的是，本发明不对连接柱13所使用的具体材质作任何限制，技术人员可以根据实际使用需求自行设定；优选地，连接柱13采用导热性能和绝缘性能均良好的橡胶材质制成，针脚141能够直接穿设于连接柱13上，以便在保证散热效果的同时，还能够有效兼顾绝缘效果。
更进一步地，第一散热部131为方筒状结构，其内部形成有方柱状的散热腔1311，当然，这显然不是限制性的，技术人员还可以根据实际使用需求自行设定散热腔1311的具体形状；例如，散热腔1311还可以是圆柱状。并且，针脚141通过散热腔1311贯穿第一散热部131，以使针脚141能够在散热腔1311中更好地散热，并且热量能够通过散热腔1311的顶部传递至内箱体12中，以便有效防止针脚141温度过高的问题。同时，针脚141穿插在第二散热部132上，以便更好地进行固定，从而有效保证电脑板14运行的可靠性，进而有效保证所述空调器的正常运行，并且还能够更好地维持不同针脚141之间的间距，从而有效保证不同针脚141能够维持各自的正常工作，以便进一步提升其可靠性。优选地，第一散热部131、外箱体11和内箱体12 均由塑料制成，并且第一散热部131、外箱体11和内箱体12一体注塑形成，第二散热部132由橡胶材料制成，其单独粘接至外箱体11的底部，以便与第一散热部131连接为一体，进而有效简化其生产过程。
需要说明的是，本优选实施例中所述的连接柱13的结构仅是一种优选设置，但并不是限制性的，技术人员可以根据实际使用需求自行设定连接柱13的具体结构、形状及位置；例如，根据外箱体11与内箱体12之间的导热腔101的设计需求来设定第一散热部131的高度。这种具体设置方式的改变并不偏离本发明的基本原理，属于本发明的保护范围。
至此，已经结合附图所示的优选实施方式描述了本发明的技术方案，但是，本领域技术人员容易理解的是，本发明的保护范围显然不仅局限于这些具体实施方式。在不偏离本发明的原理的前提下，本领域技术人员可以对相关技术特征作出等同的更改或替换，这些更改或替换之后的技术方案都将落入本发明的保护范围之内。

Claims (10)

  1. 一种用于空调器的电控箱，其特征在于，所述电控箱包括外箱体以及设置在所述外箱体中的内箱体，
    所述内箱体和所述外箱体通过至少一个连接构件相连并因此在所述内箱体与所述外箱体之间形成导热腔，
    所述内箱体中设置有电脑板，所述电脑板上设置有至少一个针脚，所述针脚贯穿所述连接构件并延伸至所述外箱体的外部，
    所述外箱体上设置有半导体制冷片，并且所述半导体制冷片的冷面位于靠近所述内箱体的一侧，
    所述外箱体上还设置有至少一个通孔，所述导热腔通过所述通孔与外部连通。
  2. 根据权利要求1所述的电控箱，其特征在于，所述外箱体的顶部设置有开口结构，所述半导体制冷片设置于所述开口处并遮蔽所述开口。
  3. 根据权利要求1所述的电控箱，其特征在于，所述电脑板靠近第一侧设置，所述内箱体的顶板从第一侧往第二侧呈向下倾斜设置；
    其中，所述第一侧和所述第二侧相对。
  4. 根据权利要求3所述的电控箱，其特征在于，所述内箱体的外顶面上设置有环形积水台，以便蓄积冷凝水来进行降温。
  5. 根据权利要求1所述的电控箱，其特征在于，所述连接构件包括相连的第一散热部和第二散热部，
    所述第一散热部设置于所述内箱体与所述外箱体之间，所述第二散热部设置于所述外箱体的外部。
  6. 根据权利要求5所述的电控箱，其特征在于，所述第一散热部中形成有散热腔，所述针脚通过所述散热腔贯穿所述第一散热部。
  7. 根据权利要求1至6中任一项所述的电控箱，其特征在于，所述电脑板靠近所述内箱体的底部设置。
  8. 根据权利要求7所述的电控箱，其特征在于，所述通孔为排水孔，所述排水孔在竖直方向上的设置高度位于所述电脑板的竖直高度和所述内箱体的底板的竖直高度之间。
  9. 根据权利要求1至6中任一项所述的电控箱，其特征在于，所述内箱体的形状为长方体形；并且/或者
    所述外箱体的形状为长方体形。
  10. 一种空调器，其特征在于，所述空调器包括权利要求1至9中任一项所述的电控箱。
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