WO2022165694A1

WO2022165694A1 - System and method for manufacturing circuit board

Info

Publication number: WO2022165694A1
Application number: PCT/CN2021/075210
Authority: WO
Inventors: 夏源洪
Original assignee: 深圳市雅信宏达电子科技有限公司
Priority date: 2021-02-04
Filing date: 2021-02-04
Publication date: 2022-08-11

Abstract

The present invention provides a system and method for manufacturing a circuit board. The system comprises a gripper structure and a gripper housing; the gripper structure comprises a clamping cylinder provided with an accommodating cavity, and a gripping power rod; the gripping power rod extends into the accommodating cavity, and the gripping power rod is threadedly connected to one end of the clamping cylinder; the other end of the clamping cylinder is connected to at least three clamping plates; the clamping plates circumferentially surround the accommodating cavity; if the gripping power rod controls the clamping plates to retract into the gripper housing, the gripper structure grips a pin; if the gripping power rod controls the clamping plates to extend out of the gripper housing, the clamping plates are splayed out and release the pin; the gripper housing is used for pushing the pin into a circuit board. First, the pin is clamped by means of the accommodating cavity of the clamping cylinder and the circumferentially distributed clamping plates; then, the pin is displaced to a specific position; finally, the pin is pressed into a work platform plate by means of the gripper housing. Hence, comprehensive automation of circuit board manufacturing is implemented.

Description

Circuit board manufacturing system and method

technical field

The invention relates to PCB board production equipment, in particular to a circuit board production system and method in a PCB board production line.

Background technique

In the process of manufacturing PCB boards, it is necessary to use pins to fix materials such as copper plates and fiberboards. In this process, a series of operations such as feeding, nailing and stacking are required. In the traditional nailing process, both feeding and stacking have been automated, however, the operation of nailing has not been automated.

In the process of manual processing, it is necessary to punch holes in materials such as copper plates to make pin holes, and then use pins to fix them. If the diameter of the pin hole is large, the entire PCB board will be damaged; if the diameter of the pin hole is small, the drilling operation needs to be performed again. At this time, the pin hole is more likely to be damaged.

technical problem

The technical problem to be solved by the present invention is to provide a circuit board manufacturing system and method to realize automatic pinning.

technical solutions

In order to solve the above-mentioned technical problems, the technical solution adopted in the present invention is: a circuit board manufacturing system, comprising: a gripper structure and a gripper shell, the gripper structure includes a clamping cylinder provided with a accommodating cavity and a gripping cylinder a power rod, the grabbing power rod extends into the accommodating cavity, and the grabbing power rod is threadedly connected with one end of the clamping cylinder, and the other end of the clamping cylinder is connected with at least three clamping a plate, the clamping plate circumferentially surrounds the accommodating cavity;

Wherein, if the grabbing power rod controls the clamping plate to retract into the grabber shell, the grabber structure grabs the pin; if the grabbing power rod controls the clamping plate to extend the gripper shell, the clamping plate is opened and the pin is released;

Wherein, the gripper shell is used to push the pin into the circuit board.

The above circuit board manufacturing system further includes: an elastic structure close to the clamping cylinder, one end of the elastic structure is fixed to the clamping plate, and the other end of the elastic structure protrudes from the clamping plate;

Wherein, if the diameter of the pin is less than or equal to a preset diameter, the elastic structure clamps the pin;

If the diameter of the pin is larger than the predetermined diameter, the clamping cylinder and the clamping plate clamp the pin.

The above circuit board manufacturing system further includes a grab driving device and a pin displacement device;

the grabbing driving device is used to drive the grabbing power rod to control the clamping cylinder and the clamping plate to clamp the pin;

The pin displacement device is used to drive the pin and the circuit board to generate relative displacement along the z-axis direction, and drive the pin to enter the circuit board.

Further, the circuit board manufacturing system further includes a first displacement device of the system and/or a second displacement device of the system;

a first displacement device of the system, configured to control the movement of the pin along the x-axis, and/or control the movement direction of the pin along the z-axis to generate displacement with the circuit board;

The second displacement device of the system is used to control the movement of the circuit board along the y-axis.

Optionally, the circuit board manufacturing system further includes a rotating hole spindle, the rotating hole spindle is located in the y-axis direction of the gripper housing, and is respectively connected with the first displacement device of the system;

Wherein, the rotating hole main shaft is provided with a rotating hole mechanism along the z-axis direction, which is used for drilling holes on the circuit board.

Specifically, the diameter of the accommodating cavity is 1 mm or 2 mm; the number of the clamping plates is three or four, and the arc length of the inner wall of the clamping plates is 0.7 mm to 2.52 mm.

Wherein, the pin is provided with a grab portion and a force-receiving portion, and the grab portion and the force-receiving portion have different diameters.

The middle position of the grabbing power rod is provided with a thread; the grabbing power rod is threadedly connected to the clamping cylinder through the thread.

A second aspect of the present application provides a circuit board manufacturing method, which is applied to a circuit board manufacturing system. The circuit board manufacturing system includes a gripper structure and a gripper housing. The gripper structure is provided with a clamping cylinder and a clamping plate. The method includes the steps of:

Control the clamping plate to retract into the gripper shell, and use the clamping cylinder and the clamping plate to clamp the pin;

controlling the pin to move to the corresponding position;

The pins are forced into the circuit board by the gripper housing.

Wherein, the clamping plate is connected with an elastic structure; the clamping cylinder and the clamping plate are used to clamp the pin, which specifically includes:

If the diameter of the pin is less than or equal to the preset diameter, part of the elastic structure is retracted into the clamping plate, and the elastic structure is used to clamp the pin;

If the diameter of the pin is larger than the preset diameter, the elastic structure is fully retracted into the clamping plate, and the clamping cylinder and the clamping plate are used to clamp the pin.

beneficial effect

The beneficial effects of the present invention are: in the technical solution of the present application, the pin is first clamped by the accommodating cavity of the clamping cylinder and the circumferentially distributed clamping plates, and then the pin is displaced to a specific position, and finally, the pin is clamped by grasping The hand housing presses the pins into the work table. Wherein, because the grabbing power rod is threadedly connected to one end of the clamping cylinder, the opening and closing of the clamping plate is controlled by the rotation of the grabbing power rod and the clamping cylinder. As a result, full automation of circuit board manufacturing is achieved.

Description of drawings

The specific structure of the present invention will be described in detail below in conjunction with the accompanying drawings

FIG. 1 is a structural diagram of the circuit board manufacturing system in the first embodiment of the present invention without grasping the pins;

2 is a cross-sectional view of the circuit board manufacturing system in the first embodiment of the present invention without grasping the pins;

3 is a structural diagram of a circuit board manufacturing system grabbing a pin according to the first embodiment of the present invention;

4 is a three-dimensional structural view of the gripper structure in the first embodiment of the present invention;

FIG. 5 is a three-dimensional schematic diagram of the clamping plate in the second embodiment of the present invention;

6 is a schematic perspective view of the elastic structure in the second embodiment of the present invention;

FIG. 7 is a three-dimensional schematic diagram of a grabbing power rod in a third embodiment of the present invention;

8 is a schematic perspective view of a gripper structure in a third embodiment of the present invention;

9 is an overall system diagram of a circuit board manufacturing system in a fourth embodiment of the present invention;

10 is an effect diagram of an embodiment of the present invention;

100-Gripper structure; 110-Clamping cylinder; 120-Gripping power rod; 130-Clamping plate; 131-Elastic structure; 200-Gripper shell; 301-Grip drive device; 302-Pin displacement device; 303 - First displacement device; 304 - Second displacement device; 305 - Spindle spindle; 400 - Control device.

Embodiments of the present invention

In order to describe the technical content, structural features, achieved objects and effects of the present invention in detail, the following detailed description is given in conjunction with the embodiments and the accompanying drawings.

Please refer to FIGS. 1 to 4 , FIG. 1 is a structural diagram of the circuit board manufacturing system in the first embodiment of the present invention without grasping the pins; FIG. 2 is the circuit board manufacturing system in the first embodiment of the present invention without grasping the pins Figure 3 is a structural diagram of a circuit board manufacturing system grabbing a pin in the first embodiment of the present invention; Figure 4 is a perspective structural diagram of the grabbing handle structure in the first embodiment of the present invention.

The first embodiment of the present application provides a circuit board manufacturing system, including: a gripper structure 100 and a gripper housing 200 , the gripper structure 100 includes a clamping cylinder 110 with a accommodating cavity and a gripping power rod 120 , the grabbing power rod 120 extends into the accommodating cavity, and the grabbing power rod 120 is threadedly connected with one end of the clamping cylinder 110, and the other end of the clamping cylinder 110 is connected with at least three A clamping plate 130, the clamping plate 130 circumferentially surrounds the accommodating cavity; wherein, if the grasping power rod 120 controls the clamping plate 130 to retract into the gripper housing 200, the grasping The hand structure 100 grabs the pin; if the grabbing power rod 120 controls the gripping plate 130 to extend out of the gripper housing 200 , the gripping board 130 opens and releases the pin; wherein , the gripper housing 200 is used to push the pins into the circuit board.

In the technical solution of the present application, the pin is first clamped by the accommodating cavity of the clamping cylinder 110 and the circumferentially distributed clamping plates 130 , then the pin is displaced to a specific position, and finally, the pin is clamped by the gripper shell 200 Press into the work table. Wherein, because the grabbing power rod 120 is threadedly connected to one end of the clamping cylinder 110 , the opening and closing of the clamping plate 130 is controlled by the rotation of the grabbing power rod 120 and the clamping cylinder 110 . As a result, full automation of circuit board manufacturing is achieved.

It should be understood that the circuit board in this embodiment includes a finished circuit board, a semi-finished circuit board, and various boards for manufacturing circuit boards.

Please refer to FIG. 5 and FIG. 6 , FIG. 5 is a three-dimensional schematic diagram of the clamping plate in the second embodiment of the present invention; FIG. 6 is a three-dimensional schematic diagram of the elastic structure in the second embodiment of the present invention.

The above circuit board manufacturing system further includes an elastic structure 131 close to the clamping cylinder 110 , one end of the elastic structure 131 is fixed to the clamping plate 130 , and the other end of the elastic structure 131 protrudes from the clamping plate 130;

Wherein, if the diameter of the pin is smaller than or equal to the preset diameter, the elastic structure 131 clamps the pin; if the diameter of the pin is larger than the preset diameter, the clamping cylinder 110 and the The clamping plate 130 clamps the pins.

It should be understood that in the processing of different circuit boards, pins of different sizes need to be used; if a pin of one size is used, a clamping cylinder 110 is replaced, which will consume a lot of labor costs and time costs, and will also lead to The connection location of the gripper structure 100 is compromised. Based on this, after research, the elastic structure 131 can be used to grab the pins, so that the same gripper structure 100 can be used to grab pins of different sizes.

In a specific embodiment, the end of the elastic structure 131 protruding from the clamping plate 130 is provided with a marble, so as to facilitate the pin to slide into it. In a specific embodiment, each clamping plate 130 is provided with a plurality of elastic structures 131 to enhance the clamping accuracy; in a specific embodiment, both the clamping cylinder 110 and the clamping plate 130 are provided with Elastic structure 131 to enhance the precision of clamping. It should be understood that, in this technical field, a very high degree of precision is required for grasping the pins in order to correctly drive the pins into the circuit board.

In a further embodiment, the pin is modified for more accurate grasping of the pin. The above-mentioned pin is provided with a grab portion and a force-receiving portion, and the grab portion and the force-receiving portion have different diameters. Therefore, within a certain range, pins of different specifications have gripping parts of the same size, so as to more accurately grip the pins; and the gripper shell 200 exerts pressure on the force-receiving parts of the pins, which can also ensure that the pins and the circuit board are connected with each other. stable binding.

It should be understood that the diameter of the accommodating cavity is 1 mm or 2 mm; the number of the clamping plates 130 is three or four, and the inner arc length of the clamping plates 130 is 0.7 mm to 2.52 mm.

In an optional embodiment, the diameter of the pin gripping portion is 1 mm, and the diameter of the pin force receiving portion is less than or equal to 2 mm; correspondingly, the diameter of the accommodating cavity is 1 mm, and the number of clamping plates 130 is three. The inner arc length of the clamping plate 130 is 0.7 mm or 0.8 mm or 0.88 mm. When the clamping plate 130 does not clamp the pin, the gap length of the clamping plate 130 is 0.22 mm.

In another optional embodiment, the diameter of the pin gripping portion is 2 mm, and the diameter of the pin force receiving portion is greater than or equal to 2 mm and less than or equal to 5 mm; correspondingly, the diameter of the accommodating cavity is 2 mm, and the clamp There are four holding plates 130 , and the inner arc length of the holding plates 130 is 1.35 mm. When the holding plates 130 do not hold the pins, the length of the gap between the holding plates 130 is 1.3 mm.

In another optional embodiment, the diameter of the pin gripping portion is 2 mm, and the diameter of the pin force receiving portion is greater than or equal to 5 mm; correspondingly, the diameter of the accommodating cavity is 2 mm, and the number of clamping plates 130 is four , the inner arc length of the clamping plate 130 is 2.51 mm or 2.52 mm, when the clamping plate 130 does not clamp the pin, the gap length of the clamping plate 130 is 1.3 mm.

Using the embodiments of the above specifications, the pin can be grasped accurately, and the accuracy of the pin entering the circuit board can be ensured. It can be understood that the above-mentioned embodiments are not exhaustive, and there are infinitely many parameters, which can achieve the above-mentioned technical effects.

Optionally, the clamping plate 130 is provided with an arc-shaped end surface, and the arc-shaped end surface is far away from the clamping cylinder 110 . Correspondingly, the top end of the pin grasping portion is also arc-shaped. As a result, it is easier to grasp the pins, and the wear of the clamping plate 130 due to errors in grasping the pins is also reduced.

Please refer to FIG. 7 and FIG. 8 , FIG. 7 is a schematic perspective view of a grabbing power rod in a third embodiment of the present invention; FIG. 8 is a schematic perspective view of a grab handle structure in the third embodiment of the present invention.

In a further embodiment, the circuit board manufacturing system further includes a grab driving device 301 and a pin displacement device 302;

The grabbing driving device 301 is used to drive the grabbing power rod 120 to control the clamping cylinder 110 and the clamping plate 130 to clamp the pin;

The pin displacement device 302 is used to drive the pin and the circuit board to generate relative displacement along the z-axis direction, and drive the pin to enter the circuit board.

Thereby, the power source for grasping the pin and moving the pin is separated, and the pinning operation is performed more precisely. It should be understood that, when the grabbing power rod 120 is displaced in a specific direction, the clamping plate 130 acts on the gripper housing 200 , and the gripping plate 130 enters the gripper housing 200 .

Wherein, the grasping driving device 301 can control the clamping force of the clamping plate 130 by moving the grasping power rod 120 up and down, and other technical means can also be used to achieve this purpose. Specifically, the middle position of the grabbing power rod 120 is provided with a thread; the grabbing power rod 120 is threadedly connected to the clamping cylinder 110 through the thread. As a result, the pin-catching process can be controlled more precisely, so that the pin-driving operation can be performed more accurately.

Please refer to FIG. 9 , which is an overall system diagram of a circuit board manufacturing system in a fourth embodiment of the present invention.

The above circuit board manufacturing system further includes a first displacement device 303 of the system and/or a second displacement device 304 of the system;

The first displacement device 303 of the system is used to control the movement of the pin along the x-axis, and/or control the movement direction of the pin along the z-axis to generate displacement with the circuit board;

The second displacement device 304 of the system is used to control the movement of the circuit board along the y-axis.

In a specific embodiment, the circuit board manufacturing system includes the first displacement device 303 and does not include the second displacement device 304 . In an optional embodiment, the first displacement device 303 can only move along the x-axis, and the pin displacement device 302 is used to realize the operation of pinning; at this time, the first displacement device 303 has more connection points, and the z-axis direction Can withstand greater force. In another optional embodiment, the first displacement device 303 can move along both the x-axis and the z-axis; at this time, the first displacement device 303 can be used to cooperate with the pin displacement device 302 to realize the pinning operation, In this way, the driving force of the pin displacement device 302 is reduced.

In another specific embodiment, the circuit board manufacturing system includes the second displacement device 304 and does not include the first displacement device 303 . As a result, the displacement of the circuit board is facilitated, and it is more convenient to realize processing automation.

In a specific embodiment, the first displacement device 303 of the circuit board manufacturing system includes a connecting plate, a sliding structure and a motor standing on a horizontal plane. One side of the connecting plate is fixed with the above-mentioned pin displacement device 302, and the other side of the connecting plate is fixed. A sliding structure is provided, and the connecting plate is controlled to move along the x-axis and/or the z-axis through the corresponding motor. Correspondingly, the second displacement device 304 of the circuit board manufacturing system is parallel to the horizontal plane, and controls the circuit board to run on the y-axis. Therefore, through the cooperation of the first displacement device 303 and the second displacement device 304 of the system, a more flexible pinning operation is realized.

Further, the above circuit board manufacturing system further includes a rotating hole spindle 305, the rotating hole spindle 305 is located in the y-axis direction of the gripper housing 200, and is respectively connected with the first displacement device 303 of the system; wherein, The hole-rotating spindle 305 is provided with a hole-rotating mechanism along the z-axis direction for drilling holes on the circuit board. In this embodiment, the hole-turning spindle 305 is used to punch holes first, and then the gripper structure 100 and the gripper shell 200 are used to drive the pins into the holes. Among them, the hole turning mechanism is a drill bit or a gong knife.

It is worth noting that since the processing equipment has a frame, its total area is limited. However, after the rotation hole spindle 305 is arranged in the y-axis direction of the gripper housing 200, when the circuit board is moved by the first displacement device 303 and the second displacement device 304, neither the rotation hole spindle 305 nor the gripper housing 200 can easily touch the frame , easier to process to the entire board.

It should also be understood that the movements of the above structures are all operated by the control device 400 . In addition, the control device 400 can control the above-mentioned displacement device and driving device through any connection method.

A second aspect of the present application provides a circuit board manufacturing method, which is applied to a circuit board manufacturing system. The circuit board manufacturing system includes a gripper structure 100 and a gripper housing 200 . The gripper structure 100 is provided with a clamping cylinder 110 . and clamping plate 130, the method includes the following steps:

Control the clamping plate 130 to retract into the gripper housing 200, and use the clamping cylinder 110 and the clamping plate 130 to clamp the pins;

controlling the pin to move to the corresponding position;

The pins are forced into the circuit board by the gripper housing 200 .

The advantage of this method is that the pin is first clamped, then the pin is aligned with the position of the punched hole through the displacement of the pin and the circuit board, and finally the pin is pressed into the circuit board through the gripper housing 200 . Thus, the full automation of circuit board manufacturing is realized; the blank part in the prior art is filled. It is also necessary to understand that in the process of pinning, the most important requirement is accuracy, and using the above method can not only ensure accuracy, but also have high efficiency.

Wherein, the clamping plate 130 is connected with an elastic structure 131; the clamping cylinder 110 and the clamping plate 130 are used to clamp the pin, which specifically includes:

If the diameter of the pin is less than or equal to the preset diameter, part of the elastic structure 131 is retracted into the clamping plate 130, and the elastic structure 131 is used to clamp the pin;

If the diameter of the pin is larger than the predetermined diameter, the elastic structure 131 is fully retracted into the clamping plate 130 , and the clamping cylinder 110 and the clamping plate 130 are used to clamp the pin.

Therefore, when clamping pins of different specifications, the elastic structure 131 will produce different degrees of elastic deformation, and one gripper structure 100 can clamp pins of various specifications. More importantly, when grabbing pins of any size, the accuracy can be guaranteed, and the effect is shown in Figure 10.

The above descriptions are only the embodiments of the present invention, and are not intended to limit the scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present invention, or directly or indirectly applied to other related technologies Fields are similarly included in the scope of patent protection of the present invention.

Claims

A circuit board manufacturing system is characterized in that it includes: a gripper structure and a gripper housing, the gripper structure includes a clamping cylinder provided with a accommodating cavity and a gripping power rod, the gripping power rod extending into the accommodating cavity, and the grabbing power rod is threadedly connected to one end of the clamping cylinder, the other end of the clamping cylinder is connected with at least three clamping plates, and the clamping plates circumferentially surround the accommodating cavity;

Wherein, if the grabbing power rod controls the clamping plate to retract into the grabber shell, the grabber structure grabs the pin; if the grabbing power rod controls the clamping plate to extend out of the grabber gripper housing, the clamping plate opens and releases the pin;

Wherein, the gripper shell is used to push the pin into the circuit board.
The circuit board manufacturing system of claim 1, further comprising: an elastic structure adjacent to the clamping cylinder, one end of the elastic structure is fixed to the clamping plate, and the other end of the elastic structure extend the clamping plate;

Wherein, if the diameter of the pin is less than or equal to a preset diameter, the elastic structure clamps the pin;

If the diameter of the pin is larger than the predetermined diameter, the clamping cylinder and the clamping plate clamp the pin.
The circuit board manufacturing system according to claim 2, further comprising: a grab driving device and a pin displacement device;

the grabbing driving device is used to drive the grabbing power rod to control the clamping cylinder and the clamping plate to clamp the pin;

The pin displacement device is used to drive the pin and the circuit board to generate relative displacement along the z-axis direction, and drive the pin to enter the circuit board.
The circuit board manufacturing system of claim 3, further comprising a first displacement device of the system and/or a second displacement device of the system;

a first displacement device of the system, configured to control the movement of the pin along the x-axis, and/or control the movement direction of the pin along the z-axis to generate displacement with the circuit board;

The second displacement device of the system is used to control the movement of the circuit board along the y-axis.
The circuit board manufacturing system according to claim 4, characterized in that it further comprises a turning hole spindle, the turning hole spindle is located in the y-axis direction of the gripper shell, and is respectively connected with the first displacement device of the system ;

Wherein, the rotating hole main shaft is provided with a rotating hole mechanism along the z-axis direction, which is used for drilling holes on the circuit board.
The circuit board manufacturing system according to claim 1, wherein: the diameter of the accommodating cavity is 1 mm or 2 mm; the number of the clamping plates is three or four, and the inner wall arc length of the clamping plates is 0.7mm~2.52mm.
The circuit board manufacturing system according to claim 1, wherein the pin is provided with a grab portion and a force-receiving portion, and the grab portion and the force-receiving portion have different diameters.
The circuit board manufacturing system according to any one of claims 1 to 7, wherein a thread is provided at a middle position of the grabbing power rod; the grabbing power rod is connected to the clamping cylinder through the thread Threaded connection.
A circuit board manufacturing method is characterized in that it is applied to a circuit board manufacturing system, the circuit board manufacturing system comprises a gripper structure and a gripper shell, the gripper structure is provided with a clamping cylinder and a clamping plate clamp, The method includes the following steps:

Control the clamping plate to retract into the gripper shell, and use the clamping cylinder and the clamping plate to clamp the pin;

controlling the pin to move to the corresponding position;

The pins are forced into the circuit board by the gripper housing.
The circuit board manufacturing method according to claim 9, wherein the clamping plate is connected with an elastic structure; and the clamping cylinder and the clamping plate are used to clamp the pin, which specifically includes:

If the diameter of the pin is less than or equal to the preset diameter, part of the elastic structure is retracted into the clamping plate, and the elastic structure is used to clamp the pin;

If the diameter of the pin is larger than the preset diameter, the elastic structure is fully retracted into the clamping plate, and the clamping cylinder and the clamping plate are used to clamp the pin.