WO2022163444A1 - Heating device - Google Patents
Heating device Download PDFInfo
- Publication number
- WO2022163444A1 WO2022163444A1 PCT/JP2022/001671 JP2022001671W WO2022163444A1 WO 2022163444 A1 WO2022163444 A1 WO 2022163444A1 JP 2022001671 W JP2022001671 W JP 2022001671W WO 2022163444 A1 WO2022163444 A1 WO 2022163444A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heating
- plate
- hole
- fixing
- heating device
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 172
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000001816 cooling Methods 0.000 claims description 18
- 125000006850 spacer group Chemical group 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000002826 coolant Substances 0.000 claims description 9
- 230000004048 modification Effects 0.000 description 22
- 238000012986 modification Methods 0.000 description 22
- 230000006866 deterioration Effects 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000112 cooling gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000011224 oxide ceramic Substances 0.000 description 2
- 229910052574 oxide ceramic Inorganic materials 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
Definitions
- the disclosed embodiments relate to heating devices.
- Patent Document 1 discloses a heating device in which a heater is inserted and fixed in a hole formed in the side surface of a mold.
- a heating device includes a heating plate, a fixed plate, and a heater.
- the heating plate has a heating surface, and a concave portion is formed on the back surface opposite to the heating surface.
- the fixing plate is spaced apart from the heating plate and has fixing holes at positions corresponding to the recesses.
- the heater has a columnar heater main body and a fixing member. The heater main body passes through the fixing hole, the tip end is inserted into the recess, and the base end is provided with a terminal for power supply.
- the fixing member is formed in a cylindrical shape surrounding the outer peripheral surface of the heater main body, and fixes the heater main body to the fixing hole with a gap between it and the inner wall of the fixing hole.
- FIG. 1 is a side view of the heating device according to the embodiment.
- FIG. 2 is a top view of the heating device according to the embodiment.
- FIG. 3 is a cross-sectional view taken along line III-III of FIG.
- FIG. 4 is a cross-sectional view taken along line IV-IV of FIG.
- FIG. 5 is a cross-sectional view of a heating device according to Modification 1 of the embodiment.
- FIG. 6 is a cross-sectional view of a heating device according to Modification 2 of the embodiment.
- FIG. 7 is a cross-sectional view of a heating device according to Modification 3 of the embodiment.
- FIG. 8 is a cross-sectional view of a heating device according to Modification 4 of the embodiment.
- FIG. 9 is a side view of a heating device according to Modification 5 of the embodiment.
- FIG. 10 is a cross-sectional view of a heating device according to Modification 5 of the embodiment.
- FIG. 1 is a side view of a heating device 100 according to an embodiment.
- FIG. 2 is a top view of the heating device 100 according to the embodiment.
- the surface positioned on the heating object side when the heating device 100 is brought into contact with the heating object is the “upper surface”, and the surface positioned on the opposite side of the heating object is the “lower surface”. and
- the heating device 100 may be used upside down, for example, or may be used in any posture.
- the heating device 100 shown in FIG. 1 has a heating plate 110, a fixed plate 120, a plurality of heaters 130, and a support plate 150.
- the heating plate 110 is, for example, a plate-like member made of metal, and has an upper surface 110a that can come into contact with an object to be heated. That is, the upper surface 110a of the heating plate 110 serves as a heating surface for heating the object to be heated.
- the upper surface 110a is used, for example, for heating a mold as an example of an object to be heated.
- a plurality of recesses 113 (see FIG. 3) into which a plurality of heaters 130 are respectively inserted are formed in the lower surface 110b of the heating plate 110 opposite to the heating surface.
- the plurality of heaters 130 are arranged so as to be perpendicular to the upper surface 110a of the heating plate 110, which is the heating surface, by being inserted into the plurality of recesses 113 respectively.
- the plurality of heaters 130 perpendicularly to the heating surface of the heating plate 110, variations in the distance between the plurality of heaters 130 and the heating surface are suppressed. Thermal properties can be improved.
- a plurality of recesses 113 into which a plurality of heaters 130 are respectively inserted are formed on the lower surface 110b of the heating plate 110 opposite to the heating surface with uneven density.
- the upper surface 110a of the heating plate 110 which is the heating surface, is shown in the shape of a rectangular plate, and the formation positions of the plurality of recesses 113 are shown. That is, the recesses 113 are formed sparsely in the central portion of the lower surface 110b, and the recesses 113 are densely formed in the peripheral portion of the lower surface 110b.
- the plurality of recesses 113 are formed such that the density of the recesses 113 decreases closer to the center of the lower surface 110b, and the density of the recesses 113 increases closer to the periphery.
- the density of the plurality of recesses 113 on the lower surface 110b of the heating plate 110 opposite to the heating surface can be adjusted. can.
- the peripheral edge portions of the upper surface 110a and the lower surface 110b of the heating plate 110 are more likely to lose heat to the atmosphere around the heating plate 110 than the central portion. For this reason, the peripheral edge portions of the upper surface 110a and the lower surface 110b of the heating plate 110 may have a lower temperature than the central portion.
- the density of the heaters 130 can be increased by increasing the density of the recesses 113 in the peripheral portion of the lower surface 110b, the amount of heat generated in the peripheral portion of the upper surface 110a can be relatively increased. As a result, the amount of heat generated lost by the ambient atmosphere is compensated for, so that the heat uniformity can be further improved.
- the arrangement of the recesses 113 is not limited to that shown in FIG.
- a heat spot with a higher temperature than other regions occurs on the upper surface 110a of the heating plate 110, which is a heating surface
- a plurality of heat spots are formed so that the density of the recesses 113 is low in the region corresponding to the heat spot on the lower surface 110b.
- a recess 113 may be formed.
- the fixed plate 120 is, for example, a plate-like member made of metal, and is arranged apart from the heating plate 110 .
- a plurality of heaters 130 that are respectively inserted into the plurality of recesses 113 are fixed to the fixed plate 120 . How the heater 130 is fixed to the fixing plate 120 will be described later.
- the support plate 150 is fixed to the fixed plate 120 by a plurality of columnar members 151 while being separated from the fixed plate 120 .
- By positioning the support plate 150 away from the fixed plate 120 it is possible to secure a space between the support plate 150 and the fixed plate 120 for arranging terminals 133 and 134 of each heater 130, which will be described later. .
- the support plate 150 and the plurality of columnar members 151 may be omitted as necessary.
- FIG. 3 is a cross-sectional view taken along line III-III in FIG.
- FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. 3 and 4, illustration of the support plate 150 and the plurality of columnar members 151 is omitted.
- the heating device 100 is configured such that a plurality of heaters 130 are fixed to a fixed plate 120 and inserted into a plurality of recesses 113 of a heating plate 110, respectively.
- the heating plate 110 has a first plate member 111 and a second plate member 112 .
- the first plate member 111 is a plate member having an upper surface 110a of the heating plate 110, which is a heating surface.
- the first plate member 111 is joined to the second plate member 112 by a joining member 114 such as a bolt. That is, the lower surface 111a of the first plate member 111 opposite to the upper surface 110a is a joint surface to which the second plate member 112 is joined.
- the second plate member 112 is a plate-shaped member having an upper surface 112a that serves as a surface to be joined that is joined to the joint surface of the first plate member 111, and a lower surface 110b located on the opposite side of the upper surface 112a.
- a plurality of through holes 112b are formed in the lower surface 110b, and the lower surface 111a of the first plate member 111 is exposed from each of the plurality of through holes 112b.
- Each of the plurality of recesses 113 is formed by each of the plurality of through holes 112b and the lower surface 111a of the first plate member 111 exposed from each of the plurality of through holes 112b. That is, the inner wall surface of each through hole 112 b forms the inner side surface of each recess 113 , and the bottom surface 111 a of the first plate member 111 forms the bottom surface of each recess 113 .
- the fixing plate 120 is separated from the heating plate 110 by being connected to the heating plate 110 by a connecting member 121 such as a bolt with a gap formed between the fixing plate 120 and the heating plate 110 . It is By arranging the fixed plate 120 apart from the heating plate 110, it is possible to suppress the temperature rise of the fixing portions (for example, fixing holes 120a described later) of the plurality of heaters 130 with respect to the fixed plate 120. FIG. On the other hand, since the heat taken from the heating plate 110 by the fixing plate 120 is reduced, the temperature rise of the heating plate 110 can be accelerated.
- the fixing plate 120 has a plurality of fixing holes 120 a at positions corresponding to the plurality of recesses 113 .
- a plurality of heaters 130 are respectively inserted and fixed to the plurality of fixing holes 120a.
- the plurality of recesses 113, the plurality of fixing holes 120a, and the plurality of heaters 130 will be simply referred to as “recesses 113,” “fixing holes 120a,” and “heaters 130,” respectively, when there is no particular need to distinguish them. call.
- the heater 130 has a heater body 131 and a fixing member 132 .
- the heater main body 131 is, for example, a cylindrical member.
- the heater main body 131 penetrates through the fixing hole 120 a , and the tip 131 a thereof is inserted into the recess 113 .
- a base end 131b of the heater main body 131 protrudes in a direction away from the upper surface 110a of the heating plate 110, which is the heating surface, rather than the lower surface of the fixed plate 120.
- Terminals 133 and 134 for supplying electric power to the main body 131 of the heater are provided at the proximal end 131b.
- the terminals 133 and 134 can be kept away from the heating surface by providing the terminals 133 and 134 at the proximal end 131b projecting away from the upper surface 110a of the heating plate 110 which is the heating surface. Transmission can be suppressed.
- the heater main body 131 is a ceramic heater having a ceramic body and a heating resistor located inside the ceramic body.
- seizure between the heating plate 110 and the heater main body 131, which are made of metal, can be suppressed.
- the length of the heater main body 131 that is, the length of the ceramic body can be, for example, about 1 mm to 200 mm.
- the outer dimensions of the ceramic body can be, for example, about 0.5 mm to 100 mm.
- the shape of the heater main body 131, that is, the shape of the ceramic body is not limited to a cylindrical shape, and may be, for example, an elliptical columnar shape or a prismatic shape.
- the material of the ceramic body is, for example, ceramic having insulating properties.
- As the material of the ceramic body for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used.
- a heating resistor is a member that generates heat when an electric current flows. Heating resistors may include high resistance conductors including, for example, tungsten, molybdenum, and the like.
- the dimensions of the heating resistor can be, for example, a width of 0.1 mm to 5 mm, a thickness of 0.05 mm to 0.3 mm, and a total length of 1 mm to 500 mm.
- the heating resistor may be a conductive ceramic containing, for example, tungsten carbide. In this case, the difference in thermal expansion between the ceramic body and the heat generating resistor can be reduced. Thereby, the thermal stress between the ceramic body and the heating resistor can be reduced. As a result, durability of the heater body 131 can be enhanced.
- the fixing member 132 is formed in a tubular shape surrounding the outer peripheral surface of the heater main body 131 .
- the fixing member 132 fixes the heater main body 131 to the fixing hole 120a with a gap between it and the inner wall of the fixing hole 120a.
- a female screw is formed in a portion of the inner wall of the fixing hole 120a located on the side opposite to the heating plate 110 .
- the fixing member 132 has an external thread 132a on part of its outer peripheral surface.
- the fixing plate 120 Since the heater main body 131 is thus fixed to the fixing hole 120a with a gap between it and the inner wall of the fixing hole 120a, the fixing plate 120 is less likely to receive heat from the heater main body 131. As a result, the temperature rise of the fixing plate 120 is suppressed, so that heat radiated from the fixing plate 120 toward the base end 131b of the heater main body 131 where the terminals 133 and 134 for power supply are provided is suppressed. Therefore, according to the heating device 100 according to the embodiment, deterioration of the terminals 133 and 134 for power supply in the heater 130 can be reduced.
- the gap between the inner wall of the fixing hole 120a and the portion of the heater main body 131 facing the inner wall of the fixing hole 120a is equal to the inner wall of the recess 113 and the heater main body 131. is larger than the interval between the inner wall of the recess 113 and the portion facing the recess 113 .
- the diameter of the fixing hole 120a is larger than the diameter of the recess 113. Since the temperature of the concave portion 113 is likely to rise due to the heating of the heater main body 131, increasing the diameter of the fixing hole 120a located at the position corresponding to the concave portion 113 suppresses the heat received by the fixing plate 120 due to the temperature rise of the concave portion 113. be able to.
- a spacer member 140 is arranged between the heating plate 110 and the fixed plate 120 .
- the spacer member 140 has a tubular shape, and the connecting member 121 is inserted therethrough.
- the material of the spacer member 140 is preferably heat-resistant ceramic, for example.
- a material of the spacer member 140 for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used. As a result, thermal expansion and thermal contraction of the spacer member 140 can be reduced, and wear of the spacer member 140 can be reduced.
- FIG. 5 is a cross-sectional view of the heating device 100 according to Modification 1 of the embodiment.
- the heating device 100 shown in FIG. 5 is mainly different from the heating device 100 shown in FIGS. 1 to 4 in that a cooling passage for passing a cooling medium is provided inside the stationary plate.
- the fixed plate 120 has therein a flow path 160 through which a cooling medium flows as a cooling passage.
- a flow path 160 through which a cooling medium flows is provided inside the fixed plate 120 to cool the fixed plate 120, thereby cooling the fixed plate 120 from the fixed plate 120 toward the base end 131b of the heater main body 131 provided with the terminals 133 and 134 for power supply. Radiated heat is further suppressed. Therefore, according to the heating device 100 according to the present modification, deterioration of the terminals 133 and 134 for power supply in the heater 130 can be further reduced.
- the channel 160 extends in the direction along the upper surface 120b of the fixed plate 120 facing the heating plate 110 (for example, the direction toward the back in FIG. 5). Since the upper surface 120b is more likely to receive heat radiated from the heating plate 110 than other parts, the cooling efficiency of the fixed plate 120 can be improved by extending the flow path 160 in the direction along the upper surface 120b. can.
- the flow path 160 is positioned between adjacent fixing holes 120a among the plurality of fixing holes 120a. Since the fixing holes 120a are more likely to receive heat radiated from the heater main body 131 than other parts, the cooling efficiency of the fixing plate 120 is improved by positioning the flow paths 160 between the adjacent fixing holes 120a. can be made
- cooling water can be used as the cooling medium that flows through the flow path 160 .
- cooling gas such as air may be used instead of cooling water.
- FIG. 6 is a cross-sectional view of a heating device 100 according to Modification 2 of the embodiment.
- the heating device 100 shown in FIG. 6 differs from the heating device 100 shown in FIG. 5 in the structure of the cooling passage provided inside the fixing plate.
- the fixed plate 120 has inside a pipe 170 through which a cooling medium flows as a cooling passage.
- the heat is radiated from the fixed plate 120 toward the base end 131b of the heater main body 131 provided with terminals 133 and 134 for power supply.
- the heat generated is further suppressed. Therefore, according to the heating device 100 according to the present modification, deterioration of the terminals 133 and 134 for power supply in the heater 130 can be further reduced.
- the pipe 170 extends in a direction along the upper surface 120b of the fixed plate 120 facing the heating plate 110 (for example, in the direction toward the back in FIG. 6). Since the upper surface 120b is more likely to receive heat radiated from the heating plate 110 than other parts, the cooling efficiency of the fixed plate 120 can be improved by extending the pipe 170 in the direction along the upper surface 120b. .
- the pipe 170 is positioned between adjacent fixing holes 120a among the plurality of fixing holes 120a. Since the fixing holes 120a are more likely to receive heat radiated from the heater body 131 than other parts, the piping 170 is positioned between the adjacent fixing holes 120a, thereby improving the cooling efficiency of the fixing plate 120. be able to.
- cooling water can be used as the cooling medium that flows through the pipe 170 .
- cooling gas such as air may be used instead of cooling water.
- FIG. 7 is a cross-sectional view of a heating device 100 according to Modification 3 of the embodiment.
- the heating device 100 shown in FIG. 7 differs from the heating device 100 shown in FIG. 6 in the structure of the fixing plate and the installation mode of the piping.
- the fixing plate 120 is divided into two members, a lid member 121 located on the heating plate 110 side and a base member 122 located on the opposite side of the heating plate 110. It is constructed by joining a lid member 121 to a base member 122 .
- the joint surface of the base member 122 with the lid member 121 is formed with a groove portion 122a extending in the direction along the upper surface 120b (for example, the direction toward the back side in FIG. 7).
- the pipe 170 is arranged in a groove portion 122b extending in a direction along the upper surface 120b. Since the upper surface 120b is more likely to receive heat radiated from the heating plate 110 than other parts, the cooling efficiency of the fixed plate 120 is improved by installing the piping 170 in the groove 122b extending in the direction along the upper surface 120b. be able to. Further, by removing the cover member 121 from the base member 122 and opening the groove portion 122b upward, the pipe 170 can be easily taken out from the groove portion 122b.
- FIG. 8 is a cross-sectional view of a heating device 100 according to Modification 4 of the embodiment.
- the heating device 100 shown in FIG. 8 differs from the heating device 100 shown in FIGS. 1 to 4 in the shape of the fixing holes.
- the fixing hole 120a is connected to the first hole portion 120a-1 positioned opposite the recess 113 and the first hole portion 120a-1. and a second hole 120a-2 having a diameter smaller than that of the hole 120a-1.
- the distance between the inner wall of the first hole portion 120a-1 and the portion of the heater body 131 facing the inner wall of the first hole portion 120a-1 is the same as the inner wall of the second hole portion 120a-2 and the heater body 131.
- FIG. 9 is a side view of a heating device 100 according to modification 5 of the embodiment.
- FIG. 10 is a cross-sectional view of a heating device 100 according to modification 5 of the embodiment.
- the heating device 100 shown in FIGS. 9 and 10 basically has the same structure as the heating device 100 shown in FIGS. 1-4.
- the heating apparatus 100 shown in FIGS. 9 and 10 has the heating plate 110 not divided into two members, the first plate member 111 and the second plate member 112. It differs from device 100 .
- portions corresponding to the first plate member 111 and the second plate member 112 are formed integrally with a metal plate member. It is As a result, according to the heating device 100 according to Modification 5, the manufacturing process of the heating device 100 can be simplified.
- the heating device (eg, heating device 100) according to the embodiment includes a heating plate (eg, heating plate 110), a fixing plate (eg, fixing plate 120), and a heater (eg, heater 130).
- the heating plate has a heating surface (eg, top surface 110a), and a recess (eg, recess 113) is formed on the back surface (eg, bottom surface 110b) opposite to the heating surface.
- the fixing plate is spaced apart from the heating plate and has fixing holes (for example, fixing holes 120a) at positions corresponding to the recesses.
- the heater has a columnar heater main body (for example, heater main body 131) and a fixing member (for example, fixing member 132).
- the heater main body passes through the fixing hole, the tip (eg, tip 131a) is inserted into the recess, and the base end (eg, base end 131b) is provided with terminals for power supply (eg, terminals 133 and 134).
- the fixing member is formed in a cylindrical shape surrounding the outer peripheral surface of the heater main body, and fixes the heater main body to the fixing hole with a gap between it and the inner wall of the fixing hole.
- the distance between the inner wall of the fixing hole and the portion of the heater body facing the inner wall of the fixing hole is the distance between the inner wall of the recess and the portion of the heater body facing the inner wall of the recess. may be greater than As a result, according to the heating device of the embodiment, it is possible to reduce the deterioration of the power supply terminal of the heater while maintaining the heating performance of the heating plate.
- the diameter of the fixing hole may be larger than the diameter of the recess.
- the fixing hole is connected to the first hole (for example, the first hole 120a-1) located at a position facing the recess, and the first hole,
- a second hole (for example, the second hole 120a-2) having a smaller diameter than the first hole may be formed.
- the distance between the inner wall of the first hole and the portion of the heater main body facing the inner wall of the first hole is the distance between the inner wall of the second hole and the portion of the heater main body facing the inner wall of the second hole. may be larger than the interval of
- the heating device according to the embodiment may further have a spacer member (for example, spacer member 140) provided between the heating plate and the fixed plate.
- a spacer member for example, spacer member 140
- the spacer member may be made of ceramic. As a result, the heating device according to the embodiment can reduce wear of the spacer member.
- the fixed plate may have therein a cooling passage (for example, the flow path 160 or the pipe 170) through which the cooling medium passes.
- a cooling passage for example, the flow path 160 or the pipe 170
- the cooling passage may extend in the direction along the surface of the fixed plate facing the heating plate (for example, the upper surface 120b).
- the heating plate may have a plurality of recesses.
- the fixing plate may have a plurality of fixing holes at positions corresponding to the plurality of recesses.
- the cooling passages may be located between adjacent fixation holes.
- heating device 110 heating plate 110a upper surface 110b lower surface 111 first plate member 111a lower surface 112 second plate member 112a upper surface 112b through hole 113 recess 120 fixing plate 120a fixing hole 120a-1 first hole 120a-2 second hole 120b upper surface 130 heater 131 heater main body 131a tip 131b base end 132 fixing member 132a male screws 133, 134 terminal 140 spacer member
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Resistance Heating (AREA)
Abstract
Description
図1は、実施形態に係る加熱装置100の側面図である。図2は、実施形態に係る加熱装置100の上面図である。以下の説明において、加熱装置100を加熱対象物に接触させる際に加熱対象物側に位置する面が「上面」であり、加熱対象物とは反対側に位置する面が「下面」であるものとする。しかしながら、加熱装置100は、例えば上下反転して使用されてもよく、任意の姿勢で使用されてよい。 <Embodiment>
FIG. 1 is a side view of a
次に、実施形態の種々の変形例について、図5~図10を参照しながら説明する。なお、以下の説明においては、上述の実施形態と共通の構成については同一の符号を付して、詳細な説明は省略する。 <
Next, various modifications of the embodiment will be described with reference to FIGS. 5 to 10. FIG. In addition, in the following description, the same reference numerals are assigned to the configurations common to those of the above-described embodiment, and detailed description thereof will be omitted.
図6は、実施形態の変形例2に係る加熱装置100の断面図である。図6に示す加熱装置100は、固定プレートの内部に設けられる冷却通路の構造が、図5に示す加熱装置100とは相違する。具体的には、図6に示すように、固定プレート120は、冷却媒体が流れる配管170を冷却通路として内部に有する。固定プレート120の内部に冷却媒体が流れる配管170を設けて固定プレート120を冷却することにより、固定プレート120から、給電用の端子133、134が設けられるヒータ本体131の基端131bへ向けて放射される熱がさらに抑制される。このため、本変形例に係る加熱装置100によれば、ヒータ130における給電用の端子133、134の劣化をさらに低減することができる。 <
FIG. 6 is a cross-sectional view of a
図7は、実施形態の変形例3に係る加熱装置100の断面図である。図7に示す加熱装置100は、固定プレートの構造、及び配管の設置態様が、図6に示す加熱装置100とは相違する。具体的には、図7に示すように、固定プレート120は、加熱プレート110側に位置する蓋部材121と、加熱プレート110とは反対側に位置するベース部材122との2つの部材に分割されており、ベース部材122に蓋部材121を接合して構成されている。ベース部材122の蓋部材121との接合面には、上面120bに沿う方向(例えば、図7の奥側に向かう方向)に延びる溝部122aが形成されている。配管170は、上面120bに沿う方向に延びる溝部122bに配置されている。上面120bは、他の部位よりも加熱プレート110から放射される熱を受け易いため、かかる上面120bに沿う方向に延びる溝部122bに配管170を設置することにより、固定プレート120の冷却効率を向上させることができる。また、ベース部材122から蓋部材121を脱離して溝部122bを上方に開放させることにより、配管170を溝部122bから容易に取り出すことができることから、加熱装置100のメンテナンス性が向上する。 <Modification 3>
FIG. 7 is a cross-sectional view of a
図8は、実施形態の変形例4に係る加熱装置100の断面図である。図8に示す加熱装置100は、固定孔の形状が、図1~図4に示す加熱装置100とは相違する。具体的には、図8に示すように、固定孔120aは、凹部113と対向する位置に位置する第1の孔部120a-1と、第1の孔部120a-1に連続し、第1の孔部120a-1よりも径が小さい第2の孔部120a-2とにより形成されている。第1の孔部120a-1の内壁とヒータ本体131の第1の孔部120a-1の内壁と対向する部分との間隔は、第2の孔部120a-2の内壁とヒータ本体131の第2の孔部120a-2の内壁と対向する部分との間隔よりも大きい。凹部113は、ヒータ本体131の加熱により温度が上昇し易いため、かかる凹部113と対向する位置に位置する第1の孔部120a-1の径を大きくすると、凹部113の温度上昇に伴う固定プレート120の受熱を抑えることができる。また、第2の孔部120a-2の内壁にヒータ本体131を近付けて位置させることにより、ヒータ本体131を固定孔120aに固定するための領域(例えば、固定部材132のおねじ132aに対応するめねじの形成領域)を確保することができる。 <Modification 4>
FIG. 8 is a cross-sectional view of a
図9は、実施形態の変形例5に係る加熱装置100の側面図である。図10は、実施形態の変形例5に係る加熱装置100の断面図である。図9及び図10に示す加熱装置100は、基本的には図1~図4に示す加熱装置100と同様の構造を有する。しかし、図9及び図10に示す加熱装置100は、加熱プレート110が第1のプレート部材111及び第2のプレート部材112の2つの部材に分かれていない点で、図1~図4に示す加熱装置100と相違する。具体的には、図9及び図10に示すように、加熱プレート110は、第1のプレート部材111及び第2のプレート部材112に相当する部分が、金属製の板状部材で一体的に形成されている。その結果、変形例5に係る加熱装置100によれば、加熱装置100の製造工程を簡素化することができる。 <Modification 5>
FIG. 9 is a side view of a
110 加熱プレート
110a 上面
110b 下面
111 第1のプレート部材
111a 下面
112 第2のプレート部材
112a 上面
112b 貫通孔
113 凹部
120 固定プレート
120a 固定孔
120a-1 第1の孔部
120a-2 第2の孔部
120b 上面
130 ヒータ
131 ヒータ本体
131a 先端
131b 基端
132 固定部材
132a おねじ
133、134 端子
140 スペーサ部材 100
Claims (9)
- 加熱面を有し、前記加熱面とは反対側の裏面に凹部が形成された加熱プレートと、
前記加熱プレートから離隔して配置され、前記凹部に対応する位置に固定孔を有する固定プレートと、
前記固定孔を貫通し、先端が前記凹部に挿入され、基端に給電用の端子が設けられた柱状のヒータ本体と、前記ヒータ本体の外周面を囲む筒状に形成され、前記固定孔の内壁との間に隙間を空けて前記ヒータ本体を前記固定孔に固定する固定部材とを有するヒータと
を有する、加熱装置。 a heating plate having a heating surface and a concave portion formed on the back surface opposite to the heating surface;
a fixing plate spaced apart from the heating plate and having a fixing hole at a position corresponding to the recess;
A columnar heater body that passes through the fixing hole, has a tip end inserted into the recess, and has a base end provided with a terminal for power supply, and a cylindrical heater body surrounding the outer peripheral surface of the heater body, a heater having a fixing member that fixes the heater main body to the fixing hole with a gap from the inner wall. - 前記固定孔の内壁と前記ヒータ本体の前記固定孔の内壁と対向する部分との間隔は、前記凹部の内側壁と前記ヒータ本体の前記凹部の内側壁と対向する部分との間隔よりも大きい、請求項1に記載の加熱装置。 The distance between the inner wall of the fixing hole and the portion of the heater body facing the inner wall of the fixing hole is greater than the distance between the inner wall of the recess and the portion of the heater body facing the inner wall of the recess. The heating device according to claim 1.
- 前記固定孔の径は、前記凹部の径よりも大きい、請求項1又は2に記載の加熱装置。 The heating device according to claim 1 or 2, wherein the diameter of the fixing hole is larger than the diameter of the recess.
- 前記固定孔は、前記凹部と対向する位置に位置する第1の孔部と、前記第1の孔部に連続し、前記第1の孔部よりも径が小さい第2の孔部とにより形成され、
前記第1の孔部の内壁と前記ヒータ本体の前記第1の孔部の内壁と対向する部分との間隔は、前記第2の孔部の内壁と前記ヒータ本体の前記第2の孔部の内壁と対向する部分との間隔よりも大きい、請求項1~3のいずれか一つに記載の加熱装置。 The fixing hole is formed by a first hole located at a position facing the recess and a second hole that is continuous with the first hole and has a smaller diameter than the first hole. is,
The distance between the inner wall of the first hole and the portion of the heater body facing the inner wall of the first hole is the distance between the inner wall of the second hole and the second hole of the heater body. 4. The heating device according to any one of claims 1 to 3, wherein the space between the inner wall and the facing portion is larger. - 前記加熱プレートと前記固定プレートとの間に設けられたスペーサ部材をさらに有する、請求項1~4のいずれか一つに記載の加熱装置。 The heating device according to any one of claims 1 to 4, further comprising a spacer member provided between said heating plate and said fixed plate.
- 前記スペーサ部材は、セラミックにより形成される、請求項5に記載の加熱装置。 The heating device according to claim 5, wherein the spacer member is made of ceramic.
- 前記固定プレートは、冷却媒体を通過させる冷却通路を内部に有する、請求項1~4のいずれか一つに記載の加熱装置。 The heating device according to any one of claims 1 to 4, wherein the fixed plate has therein a cooling passage through which a cooling medium passes.
- 前記冷却通路は、前記固定プレートの前記加熱プレートと対向する面に沿う方向に延びている、請求項7に記載の加熱装置。 The heating device according to claim 7, wherein the cooling passage extends in a direction along the surface of the fixed plate facing the heating plate.
- 前記加熱プレートは、複数の前記凹部を有し、
前記固定プレートは、複数の前記凹部に対応する位置に複数の前記固定孔を有し、
前記冷却通路は、隣り合う前記固定孔の間に位置する、請求項7又は8に記載の加熱装置。 The heating plate has a plurality of recesses,
the fixing plate has a plurality of fixing holes at positions corresponding to the plurality of recesses;
9. The heating device according to claim 7 or 8, wherein said cooling passage is positioned between said adjacent fixing holes.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022578272A JP7483951B2 (en) | 2021-01-26 | 2022-01-18 | Heating device |
CN202280010642.2A CN116724664A (en) | 2021-01-26 | 2022-01-18 | Heating device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021010679 | 2021-01-26 | ||
JP2021-010679 | 2021-01-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022163444A1 true WO2022163444A1 (en) | 2022-08-04 |
Family
ID=82653408
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2022/001671 WO2022163444A1 (en) | 2021-01-26 | 2022-01-18 | Heating device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7483951B2 (en) |
CN (1) | CN116724664A (en) |
WO (1) | WO2022163444A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184557A (en) * | 2000-12-12 | 2002-06-28 | Ibiden Co Ltd | Heater for semiconductor manufacturing and inspecting device |
JP2003151732A (en) * | 2001-11-12 | 2003-05-23 | Sakaguchi Dennetsu Kk | Hot plate |
JP2005032842A (en) * | 2003-07-08 | 2005-02-03 | Ibiden Co Ltd | Electrode structure and ceramic joint |
JP2016207595A (en) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | Heating apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3821075B2 (en) | 2002-09-20 | 2006-09-13 | 住友電気工業株式会社 | Ceramic heater and manufacturing method thereof |
-
2022
- 2022-01-18 CN CN202280010642.2A patent/CN116724664A/en active Pending
- 2022-01-18 WO PCT/JP2022/001671 patent/WO2022163444A1/en active Application Filing
- 2022-01-18 JP JP2022578272A patent/JP7483951B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184557A (en) * | 2000-12-12 | 2002-06-28 | Ibiden Co Ltd | Heater for semiconductor manufacturing and inspecting device |
JP2003151732A (en) * | 2001-11-12 | 2003-05-23 | Sakaguchi Dennetsu Kk | Hot plate |
JP2005032842A (en) * | 2003-07-08 | 2005-02-03 | Ibiden Co Ltd | Electrode structure and ceramic joint |
JP2016207595A (en) * | 2015-04-28 | 2016-12-08 | 日本特殊陶業株式会社 | Heating apparatus |
Also Published As
Publication number | Publication date |
---|---|
JP7483951B2 (en) | 2024-05-15 |
CN116724664A (en) | 2023-09-08 |
JPWO2022163444A1 (en) | 2022-08-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6195029B1 (en) | Electrostatic chuck | |
KR20030035878A (en) | A heating apparatus | |
JP2018170508A (en) | Electrostatic chuck | |
JP2002299432A (en) | Ceramic susceptor supporting structure | |
TW201638590A (en) | Thermally insulating electrical contact probe and heated platen assembly | |
TW202137374A (en) | Substrate support assembly with arc resistant coolant conduit | |
TW202129830A (en) | Detachable biasable electrostatic chuck for high temperature applications | |
WO2022163444A1 (en) | Heating device | |
CN110484897B (en) | Temperature adjusting device for wafer and semiconductor device | |
US20210036491A1 (en) | Spark plug | |
US20080227323A1 (en) | High Power Electrical Connector for a Laminated Heater | |
TWI693363B (en) | Adapter for use in process chambers, and lamp assembly comprising such adapter | |
US20220124874A1 (en) | Wafer placement table | |
WO2022004211A1 (en) | Electrostatic chuck device | |
JP2002184844A (en) | Mounting structure of susceptor to chamber and support member of the susceptor to the chamber | |
JP7074946B1 (en) | Heating device | |
WO2023032755A1 (en) | Heating device | |
WO2022137769A1 (en) | Heating device | |
US10032601B2 (en) | Platen support structure | |
US20210212172A1 (en) | Ceramic heater | |
WO2023210434A1 (en) | Heating device | |
JP4436239B2 (en) | Plasma processing equipment | |
CN217933703U (en) | Ion source filament structure, ion source device and ion implantation equipment | |
US9979161B2 (en) | Spark plug having reduced wear of the center electrode and method of making such a spark plug | |
WO2023002861A1 (en) | Heating device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 22745667 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2022578272 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 202280010642.2 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 22745667 Country of ref document: EP Kind code of ref document: A1 |