WO2022149366A1 - Electric power converting device - Google Patents

Abstract

An electric power converting device (400) includes a capacitor housing (470) accommodating a smoothing capacitor (430), a switching unit (440) provided with a switch element, and an input connector (406) connected to a battery. The electric power converting device includes: a P bus bar (401) and an N bus bar (402) electrically connecting each of the smoothing capacitor and the switch element to the input connector; and a casing (491) provided with an accommodating space accommodating the electrical components and the bus bars, and a refrigerant passage (493e) through which a refrigerant flows. Parts of the P bus bar and the N bus bar positioned outside the accommodating space are provided in a bottom wall (493) of the casing through which the refrigerant passage is formed.

Description

Power converter Cross-reference of related applications

This application is based on Patent Application No. 2021-002302 filed in Japan on January 8, 2021, and the contents of the basic application are incorporated by reference as a whole.

The disclosure described in this specification relates to a power conversion device.

As shown in Patent Document 1, a power conversion device including a capacitor module is known.

Japanese Unexamined Patent Publication No. 2013-115903

The capacitor module of the power conversion device described in Patent Document 1 has a power supply terminal connected to the battery via a DC connector. As the amount of current supplied from the battery increases, the temperature of these power supply terminals and the DC connector rises. As a result, the temperature of the capacitor cell (passive element) included in the capacitor module may rise.

An object of the present specification is to provide a power conversion device in which the temperature rise of a passive element is suppressed.

The power conversion device according to one aspect of the present disclosure includes a first electric component in which a passive element is housed and a first electric component.
A second electrical component with an active element,
The input connector connected to the external power supply and
An input bus bar that electrically connects each of the passive and active elements to the input connector,
It has a part of the input bus bar, a storage space for accommodating each of the first electric component and the second electric component, and a housing provided with a cooling passage.
A portion located outside the storage space in the input bus bar is provided in the portion where the cooling passage is formed in the housing.

According to this, the temperature rise of the input bus bar is suppressed. As a result, the temperature rise of the passive element is suppressed.

Note that the reference numbers in the parentheses of the attached claims merely indicate the correspondence with the configurations described in the embodiments described later, and do not limit the technical scope at all.

It is a circuit diagram for demonstrating an in-vehicle system. It is sectional drawing for demonstrating the power conversion apparatus. It is a top view for demonstrating a distribution channel. It is a schematic diagram for demonstrating the mechanical / electrical integrated unit. It is sectional drawing for demonstrating the power conversion apparatus. It is sectional drawing for demonstrating the power conversion apparatus. It is sectional drawing for demonstrating the power conversion apparatus. It is sectional drawing for demonstrating the power conversion apparatus. It is sectional drawing for demonstrating the power conversion apparatus.

Hereinafter, a plurality of forms for carrying out the present disclosure will be described with reference to the drawings. In each form, the same reference numerals may be given to the parts corresponding to the matters described in the preceding forms, and duplicate explanations may be omitted. When only a part of the configuration is described in each form, other forms described above can be applied to the other parts of the configuration.

It is possible to combine parts that clearly indicate that they can be specifically combined in each embodiment. Further, if there is no particular problem in the combination, it is possible to partially combine the embodiments, the embodiments and the modified examples, and the modified examples with each other even if it is not clearly stated that the combination is possible. be.

(First Embodiment)
<In-vehicle system>
First, the in-vehicle system 100 will be described with reference to FIGS. 1 to 4. The in-vehicle system 100 constitutes a system for an electric vehicle. The in-vehicle system 100 includes a battery 200 and a mechanical / electrical integrated unit 300. The mechanical / electrical integrated unit 300 has a power conversion device 400 and a motor 500. The battery 200 corresponds to an external power source. The motor 500 corresponds to an electric motor.

Further, the in-vehicle system 100 has a plurality of ECUs (not shown). These plurality of ECUs send and receive signals to and from each other via bus wiring. A plurality of ECUs cooperate to control an electric vehicle. By controlling the plurality of ECUs, the power running and regeneration of the motor 500 according to the SOC of the battery 200 are controlled. SOC is an abbreviation for state of charge. ECU is an abbreviation for electronic control unit.

The ECU has at least one arithmetic processing unit (CPU) and at least one memory device (MMR) as a storage medium for storing programs and data. The ECU is provided by a microcomputer having a storage medium that can be read by a computer or a processor. A storage medium is a non-transitional substantive storage medium that non-temporarily stores a program that can be read by a computer or processor. The storage medium may be provided by a semiconductor memory, a magnetic disk, or the like. Hereinafter, the components of the in-vehicle system 100 will be outlined individually.

Battery 200 has a plurality of secondary batteries. These plurality of secondary batteries form a battery stack connected in series. The SOC of this battery stack corresponds to the SOC of the battery 200. As the secondary battery, a lithium ion secondary battery, a nickel hydrogen secondary battery, an organic radical battery and the like can be adopted.

The power conversion device 400 performs power conversion between the battery 200 and the motor 500. The power conversion device 400 converts the DC power of the battery 200 into AC power. The power conversion device 400 converts the AC power generated by the power generation (regeneration) of the motor 500 into DC power.

The motor 500 is connected to the output shaft of an electric vehicle (not shown). The rotational energy of the motor 500 is transmitted to the traveling wheels of the electric vehicle via the output shaft. On the contrary, the rotational energy of the traveling wheel is transmitted to the motor 500 via the output shaft.

The motor 500 is powered by AC power supplied from the power converter 400. As a result, propulsive force is applied to the traveling wheels. The motor 500 is regenerated by the rotational energy transmitted from the traveling wheels. The AC power generated by this regeneration is converted into DC power by the power conversion device 400. This DC power is supplied to the battery 200. DC power is also supplied to various electric loads mounted on electric vehicles.

<Power converter>
Next, the power conversion device 400 will be described. The power conversion device 400 of the present embodiment includes components of an inverter. Of course, the power converter 400 may include converter components in addition to the inverter components.

As shown in FIG. 1, the power conversion device 400 includes a P bus bar 401 and an N bus bar 402. The P bus bar 401 is electrically connected to the positive electrode of the battery 200. The N bus bar 402 is electrically connected to the negative electrode of the battery 200. The P bus bar 401 and the N bus bar 402 correspond to the input bus bar.

The power conversion device 400 includes a U-phase bus bar 403, a V-phase bus bar 404, and a W-phase bus bar 405. The U-phase bus bar 403 is electrically connected to the U-phase stator coil of the motor 500. The V-phase bus bar 404 is electrically connected to the V-phase stator coil. The W-phase bus bar 405 is electrically connected to the W-phase stator coil. The U-phase bus bar 403 to the W-phase bus bar 405 correspond to the output bus bar.

The power conversion device 400 includes a first current sensor 410, a noise filter 420, a smoothing capacitor 430, a switching unit 440, a second current sensor 450, and a control board 460.

The first current sensor 410 and the noise filter 420 are provided on the connection point side of each of the P bus bar 401 and the N bus bar 402 with the battery 200. The first current sensor 410 detects the current flowing through the P bus bar 401 and the N bus bar 402. The noise filter 420 removes noise input / output from the P bus bar 401 and the N bus bar 402. The first current sensor 410 may be provided on at least one of the P bus bar 401 and the N bus bar 402.

The smoothing capacitor 430 and the switching unit 440 are connected to the side separated from the connection points of the batteries 200 of the P bus bar 401 and the N bus bar 402, respectively. In the extension directions of the P bus bar 401 and the N bus bar 402, the points connected to the bus bar of the noise filter 420 and the points connected to the bus bars of the smoothing capacitor 430 and the switching unit 440 are separated from each other.

As will be described later, the location where the noise filter 420 is connected in the P bus bar 401 and the N bus bar 402 is located outside the storage space of the inverter housing 490. The points where the smoothing capacitor 430 and the switching unit 440 of the P bus bar 401 and the N bus bar 402 are connected are located in the storage space of the inverter housing 490. The portions of the P bus bar 401 and the N bus bar 402 located outside the storage space of the inverter housing 490 are shown surrounded by a two-dot chain line in FIG.

<Semiconductor module>
The switching unit 440 includes a U-phase semiconductor module 441, a V-phase semiconductor module 442, and a W-phase semiconductor module 443. Each of these three semiconductor modules has a high-side switch 444 and a low-side switch 445, and a high-side diode 444a and a low-side diode 445a. The switching unit 440 corresponds to the second electric component. The high side switch 444 and the low side switch 445 correspond to active elements.

In this embodiment, an n-channel type IGBT is adopted as the high side switch 444 and the low side switch 445. The emitter electrode of the high side switch 444 and the collector electrode of the low side switch 445 are electrically connected. As a result, the high-side switch 444 and the low-side switch 445 are electrically connected in series.

The cathode electrode of the high side diode 444a is connected to the collector electrode of the high side switch 444. The anode electrode of the high side diode 444a is connected to the emitter electrode of the high side switch 444. As a result, the high-side diode 444a is connected in anti-parallel to the high-side switch 444.

Similarly, the cathode electrode of the low side diode 445a is connected to the collector electrode of the low side switch 445. The anode electrode of the low-side diode 445a is connected to the emitter electrode of the low-side switch 445. As a result, the low-side diode 445a is connected in anti-parallel to the low-side switch 445.

As these high-side switches 444 and low-side switches 445, MOSFETs can be adopted instead of IGBTs. A body diode is formed on the MOSFET. Therefore, when a MOSFET is adopted as the switch element, a configuration without a diode separate from the above-mentioned switch element can also be adopted.

The material for forming the semiconductor element such as the switch element and the diode provided in each of the three semiconductor modules is not particularly limited. For example, these semiconductor elements can be manufactured by a semiconductor such as Si and a wide-gap semiconductor such as SiC.

<Terminal>
Each of the U-phase semiconductor module 441 to the W-phase semiconductor module 443 has a collector terminal 440a, an emitter terminal 440b, a midpoint terminal 440c, and a gate terminal 440d.

The end of the collector terminal 440a is connected to the collector electrode of the high side switch 444. The end of the emitter terminal 440b is connected to the emitter electrode of the low side switch 445. The end of the midpoint terminal 440c is connected to the midpoint between the high side switch 444 and the low side switch 445. The ends of the gate terminal 440d are individually connected to the gate electrodes of the high side switch 444 and the low side switch 445.

As shown in FIG. 1, the tip of the collector terminal 440a is connected to the P bus bar 401. The tip of the emitter terminal 440b is connected to the N bus bar 402. As a result, the high-side switch 444 and the low-side switch 445 are sequentially connected in series from the P bus bar 401 to the N bus bar 402.

The tip of the midpoint terminal 440c of the U-phase semiconductor module 441 is connected to the U-phase bus bar 403. The tip of the midpoint terminal 440c of the V-phase semiconductor module 442 is connected to the V-phase bus bar 404. The tip of the midpoint terminal 440c of the W-phase semiconductor module 443 is connected to the W-phase bus bar 405.

The motor 500 has a U-phase stator coil to a W-phase stator coil. Further, the motor 500 has U-phase stator bus bars 501 to W-phase stator bus bars 503 individually connected to each of these three phase stator coils.

The U-phase bus bar 403 is connected to the U-phase stator bus bar 501. The V-phase bus bar 404 is connected to the V-phase stator bus bar 502. The W-phase bus bar 405 is connected to the W-phase stator bus bar 503. As a result, the power converter 400 and the motor 500 are electrically connected.

<Second current sensor>
The second current sensor 450 is provided in the U-phase bus bar 403 to the W-phase bus bar 405. The second current sensor 450 detects the current flowing through these three phase buses. The second current sensor 450 may detect the current flowing through at least two of the three phase bus bars.

<Control board>
The gate terminals 440d of each of the U-phase semiconductor modules 441 to W-phase semiconductor modules 443 are connected to the control board 460. A gate driver is mounted on the control board 460. The gate driver amplifies the control signal output from the ECU and outputs it to the gate electrode. The ECU that outputs this control signal may be mounted on the control board 460, or may be mounted on another board.

When powering the motor 500, the switch elements provided in each of the three semiconductor modules are PWM controlled by the output of the control signal from the ECU. As a result, the power converter 400 generates a three-phase alternating current. When the motor 500 generates (regenerates) power, the ECU stops, for example, the output of a control signal. As a result, the AC power generated by the power generation of the motor 500 passes through the diodes provided in each of the three semiconductor modules. As a result, AC power is converted to DC power.

<Mechanical configuration of power converter>
Next, the mechanical configuration of the power converter 400 will be described. In this regard, in the following, the three directions orthogonal to each other will be referred to as the x direction, the y direction, and the z direction. The x direction corresponds to the vertical direction. The y direction corresponds to the lateral direction. The z direction corresponds to the alignment direction.

The power conversion device 400 has a capacitor housing 470, a cooler 480, and an inverter housing 490 in addition to the electrical components described so far.

The capacitor housing 470 fulfills the function of accommodating the smoothing capacitor 430. The cooler 480 has a function of accommodating and cooling each of the U-phase semiconductor module 441 to the W-phase semiconductor module 443. The inverter housing 490 functions to house the first current sensor 410, the noise filter 420, the second current sensor 450, the control board 460, the capacitor housing 470, and the cooler 480, respectively. The smoothing capacitor 430 corresponds to a passive element. The capacitor housing 470 corresponds to the first electrical component.

<Condenser housing>
The appearance of the capacitor housing 470 has a rectangular cuboid shape. The capacitor housing 470 is fixed to the inverter housing 490 with bolts or the like.

The smoothing capacitor 430 is housed in the capacitor housing 470. The smoothing capacitor 430 has a first electrode 431, a second electrode 432, and a storage element 433.

The first electrode 431 and the second electrode 432 are arranged in the z direction via a storage element 433 such as a separator that functions as a dielectric. A part of each of the first electrode 431 and the second electrode 432 and all of the power storage elements 433 are housed in the capacitor housing 470. The P bus bar 401 is connected to the exposed portion of the first electrode 431 from the capacitor housing 470. The N bus bar 402 is connected to the exposed portion of the second electrode 432 from the capacitor housing 470.

<Encapsulating resin>
Each of the U-phase semiconductor modules 441 to the W-phase semiconductor module 443 is a sealing resin 446 that covers all of the semiconductor elements such as switch elements and diodes described above and a part of each of various terminals connected to them. To prepare for.

As shown in FIGS. 2 and 3, the sealing resin 446 has a thin flat shape with a thickness in the x direction. The sealing resin 446 has two main surfaces facing in the x direction. These two main surfaces have a larger area than the other surfaces.

The sealing resin 446 has two end faces arranged in the z direction. The tip of the gate terminal 440d protrudes from one of these two end faces. The tips of the collector terminal 440a, the emitter terminal 440b, and the midpoint terminal 440c project from the other of these two end faces.

<Cooler>
As shown in FIGS. 2 and 3, the cooler 480 has a supply pipe 481, a discharge pipe 482, and a plurality of relay pipes 483. The supply pipe 481 and the discharge pipe 482 are connected to each other via a plurality of relay pipes 483. Refrigerant is supplied to the supply pipe 481. This refrigerant flows from the supply pipe 481 to the discharge pipe 482 via a plurality of relay pipes 483.

The supply pipe 481 and the discharge pipe 482 extend in the x direction. The supply pipe 481 and the discharge pipe 482 are separated from each other in the y direction. Each of the plurality of relay pipes 483 extends in the y direction from the supply pipe 481 toward the discharge pipe 482. The supply port for supplying the refrigerant from the outside in the supply pipe 481 and the discharge port for discharging the refrigerant supplied from the relay pipe 483 in the discharge pipe 482 to the outside are arranged so as to be separated from each other in the y direction.

A plurality of relay tubes 483 are lined up apart from each other in the x direction. A gap is formed between two adjacent relay tubes 483. The cooler 480 is configured with a total of three voids. A U-phase semiconductor module 441 to a W-phase semiconductor module 443 are individually provided in each of these three voids.

With each of the three semiconductor modules individually provided in each of the three voids, an urging force that narrows the width of the voids in the x direction is applied to the cooler 480 from a spring body (not shown). As a result, the thermal resistance between the sealing resin 446 of the semiconductor module and the relay tube 483 is reduced. The heat generated in the semiconductor module is positively conducted to the relay tube 483. A heat transfer member such as grease is interposed between the sealing resin 446 and the relay tube 483.

The control board 460 has a thin flat shape with a thickness in the z direction. The control board 460 has an insulating board, a wiring pattern formed on the insulating board, and various electric elements electrically connected to the wiring pattern. A gate driver is composed of these wiring patterns and various electric elements. When the ECU is mounted on a board different from the control board 460, a connector for electrically connecting the two is mounted on each of the board and the control board 460. The gate driver and the ECU transmit and receive electrical signals via an insulation circuit or the like.

A plurality of through holes are formed on the control board 460. As shown in FIG. 2, the control board 460 is arranged to face the cooler 480 in which the semiconductor module is housed in the z direction. The gate terminal 440d of the semiconductor module is passed through the through hole of the control board 460. Then, the wiring pattern of the control board 460 and the gate terminal 440d are electrically connected via solder.

<Inverter housing>
The inverter housing 490 has a housing 491 and an outer cover 492. Each of the housing 491 and the outer cover 492 is manufactured by, for example, aluminum die casting.

The first current sensor 410, the second current sensor 450, the control board 460, the condenser housing 470, and the cooler 480 are each housed in the storage space of the housing 491. The noise filter 420 is housed in the covering space partitioned between the housing 491 and the outer cover 492. In addition, various bus bars described above will be provided in each of the storage space and the covering space. The outer cover 492 corresponds to the electromagnetic shielding cover.

<Case>
The housing 491 has a bottom wall 493, a side wall 494, and a lid wall 495. The bottom wall 493 has a flat shape with a thin thickness in the z direction. The bottom wall 493 has an inner bottom surface 493a and an outer bottom surface 493b arranged in the z direction.

The side wall 494 stands upright in the z direction from the inner bottom surface 493a. At the same time, the side wall 494 forms an annular shape in the circumferential direction around the z direction. The area where the space surrounded by the inner peripheral surface 494a of the side wall 494 and the projection area of the inner bottom surface 493a of the bottom wall 493 in the z direction overlap is the storage space of the inverter housing 490. The side wall 494 and the bottom wall 493 may be integrated or separate.

The opening is partitioned on the tip side of the side wall 494. Through this opening, the storage space and the space outside the storage space can communicate with each other. This opening is closed by a lid wall 495. The lid wall 495 is connected to the side wall 494 by bolts or the like.

The side wall 494 is formed with a connection hole 494c that opens in the inner peripheral surface 494a and the outer peripheral surface 494b on the back side thereof. The connection hole 494c is used for electrical connection between the electric component housed in the storage space of the inverter housing 490 and the electric component located outside the electric component.

The connection hole 494c shown in FIG. 2 is used for electrical connection between the P bus bar 401 and the N bus bar 402 and the battery 200, respectively. One end of each of the P bus bar 401 and the N bus bar 402 is provided in the connection hole 494c. The connection hole 494c is provided with an input connector 406 having a terminal electrically connected to the tips of the P bus bar 401 and the N bus bar 402 while closing the connection hole 494c. The terminal of the wire harness extended from the battery 200 is connected to the input connector 406. As a result, the P bus bar 401 and the N bus bar 402 are electrically connected to the battery 200, respectively.

<Support wall>
A support wall 496 is connected to the inner peripheral surface 494a side of the side wall 494. The support wall 496 has a flat shape with a thin thickness in the z direction. The storage space of the inverter housing 490 is divided into a bottom wall 493 side and a lid wall 495 side by the support wall 496. The support wall 496 and the side wall 494 may be separate or integrated.

As shown in FIG. 2, a part of the various bus bars described so far, the first current sensor 410, the capacitor housing 470, the cooler 480, and the second current sensor 450 are each the bottom wall of the storage space of the inverter housing 490. It is stored on the 493 side. The control board 460 is housed on the lid wall 495 side of the storage space of the inverter housing 490.

The support wall 496 has a lower surface 496a on the bottom wall 493 side and an upper surface 496b on the lid wall 495 side. The support wall 496 is formed with an opening window 496c that opens to the lower surface 496a and the upper surface 496b. The bottom wall 493 side and the lid wall 495 side of the storage space of the inverter housing 490 communicate with each other through the opening window 496c.

<Arrangement of capacitor housing>
The capacitor housing 470 is located between the lower surface 496a and the inner bottom surface 493a. The first electrode 431 housed in the capacitor housing 470 is located on the lower surface 496a side. The second electrode 432 is located on the inner bottom surface 493a side.

Air is interposed between the capacitor housing 470 and the lower surface 496a. The first electrode 431 facilitates heat exchange with the support wall 496 by heat transfer or heat radiation.

An insulating first heat transfer sheet 471 is interposed between the capacitor housing 470 and the inner bottom surface 493a. The capacitor housing 470 is fixed to the bottom wall 493 by bolts (not shown). By fastening the bolts, the first heat transfer sheet 471 is sandwiched between the capacitor housing 470 and the bottom wall 493. The second electrode 432 facilitates heat exchange with the bottom wall 493 by heat conduction.

<Arrangement of coolers>
The cooler 480 is located between the lower surface 496a and the inner bottom surface 493a. The cooler 480 is located on the lower surface 496a side of the inner bottom surface 493a. The cooler 480 and the support wall 496 are easy to positively transfer heat. It is suppressed that the temperature difference between the support wall 496 and the cooler 480 becomes large. It is suppressed that the temperature difference between the support wall 496 and the refrigerant flowing inside the cooler 480 becomes large.

The cooler 480 faces the control board 460 in the z direction via the opening window 496c of the support wall 496. The gate terminal 440d of the semiconductor module housed in the cooler 480 extends to the control board 460 via the opening window 496c. The tip of the gate terminal 440d is connected to the control board 460.

<Cooling passage>
The bottom wall 493 has a first base portion 497 and a second base portion 498. The first base portion 497 includes the above-mentioned inner bottom surface 493a. The second base portion 498 includes the above-mentioned outer bottom surface 493b. The first facing surface 493c on the back side of the inner bottom surface 493a and the second facing surface 493d on the back side of the outer bottom surface 493b face each other in the z direction. In this facing state, the first base portion 497 and the second base portion 498 are connected.

As shown in FIG. 2, a part of each of the first facing surface 493c and the second facing surface 493d is selectively in contact with each other. In other words, a part of each of the first facing surface 493c and the second facing surface 493d is selectively separated from each other. The gap formed between the first facing surface 493c and the second facing surface 493d functions as a passage for flowing the refrigerant. In the following, this void is referred to as a cooling passage 493e. The bottom wall 493 corresponds to the formation site.

Although not particularly shown, a sealing material for suppressing leakage of the refrigerant from the cooling passage 493e is interposed between the first facing surface 493c and the second facing surface 493d. The sealing material is compressed between the first facing surface 493c and the second facing surface 493d. The sealing material is provided around the cooling passage 493e. The sealing material is provided between the cooling passage 493e and various holes formed in the bottom wall 493, which will be described later.

As shown in FIG. 3, the bottom wall 493 is formed with two inlet / outlet holes 493f for inflowing and discharging the refrigerant into the cooling passage 493e. One of these two inlet / outlet holes 493f and the cooler 480 are connected via the connecting pipe 499. As a result, the cooler 480 and the cooling passage 493e communicate with each other. The cross-sectional view shown in FIG. 2 corresponds to the drawing cut along the II-II cross-sectional line shown in FIG.

In this embodiment, one of the two inlet / outlet holes 493f is connected to the discharge pipe 482 of the cooler 480. Due to such a configuration, the refrigerant flowing through the cooler 480 is supplied to the cooling passage 493e. The refrigerant that has exchanged heat with the semiconductor module in the cooler 480 is supplied to the cooling passage 493e. The solid arrow shown in FIG. 3 indicates the flow direction of the refrigerant.

Contrary to this, it is also possible to adopt a configuration in which one of the two inlet / outlet holes 493f is connected to the supply pipe 481 of the cooler 480. In the case of such a configuration, the refrigerant flowing through the cooling passage 493e is supplied to the cooler 480. The refrigerant that has exchanged heat with the smoothing capacitor 430 housed in the housing 491 is supplied to the cooler 480. The flow direction of the refrigerant is opposite to the solid arrow shown in FIG.

In FIG. 3, as shown by overlapping the cooling passage 493e and the condenser housing 470, the cooling passage 493e and the condenser housing 470 are arranged in the z direction. And, as a matter of course, the outer bottom surface 493b of the bottom wall 493 and the capacitor housing 470 are arranged in the z direction. A part of each of the cooling passage 493e and the outer bottom surface 493b is located in the region where the condenser housing 470 is projected along the z direction. In the following, for the sake of simplicity, the region where the capacitor housing 470 on the outer bottom surface 493b is projected along the z direction is referred to as a projection region.

<Through hole>
As shown in FIGS. 2 and 3, the bottom wall 493 is formed with first through holes 493 g to fourth through holes 493j that open into the inner bottom surface 493a and the outer bottom surface 493b. The first through hole 493g and the second through hole 493h are formed on the input connector 406 side of the bottom wall 493. The third through hole 493i and the fourth through hole 493j are formed on the central side of the bottom wall 493.

The projection area is located between the first through hole 493g and the third through hole 493i. The projection area is located between the second through hole 493h and the fourth through hole 493j. The first through hole 493g and the second through hole 493h correspond to the first through hole. The third through hole 493i and the fourth through hole 493j correspond to the second through hole.

<Arrangement of P bus bar and N bus bar>
As shown in FIG. 2, each of the P bus bar 401 and the N bus bar 402 is extended in the storage space of the inverter housing 490, then extended outside the storage space, and then extended again in the storage space. In order to realize such an extension, the P bus bar 401 is passed through the first through hole 493 g and the third through hole 493i. The N bus bar 402 is passed through the second through hole 493h and the fourth through hole 493j.

To explain in detail, each of the P bus bar 401 and the N bus bar 402 has a first internal bus bar 407, an external bus bar 408, and a second internal bus bar 409. The first internal bus bar 407 and the second internal bus bar 409 are each extended in the storage space. These two internal bus bars are connected via an external bus bar 408 that extends outside the storage space.

<1st internal bus bar>
One end of the first internal bus bar 407 is connected to the input connector 406. The first internal bus bar 407 extends in the z direction from the input connector 406 toward the bottom wall 493 side. The other end side of the first internal bus bar 407 of the P bus bar 401 is inserted into the first through hole 493 g. The other end side of the first internal bus bar 407 of the N bus bar 402 is inserted into the second through hole 493h.

The other end of the first internal bus bar 407 is separated from the wall surface that divides the through hole in order to secure an insulating distance. Air is interposed between the other end side of the first internal bus bar 407 and the wall surface that partitions the through hole. The through holes may be filled with an insulating resin material so as to insulate the first internal bus bar 407 and the bottom wall 493 and to conduct heat between them.

<External bus bar>
One end of the external bus bar 408 is connected to the other end of the first internal bus bar 407. The external bus bar 408 extends along the outer bottom surface 493b. The external bus bar 408 of the P bus bar 401 extends from the first through hole 493 g toward the third through hole 493i. The external bus bar 408 of the N bus bar 402 extends from the second through hole 493h toward the fourth through hole 493j.

The external bus bar 408 faces the outer bottom surface 493b in the z direction. The external bus bar 408 is arranged near the outer bottom surface 493b. The separation distance between the external bus bar 408 and the outer bottom surface 493b is such that the insulation distance is secured. The external bus bar 408 is aligned with the projection area in the z direction. The external bus bar 408 is aligned with the capacitor housing 470 in the z direction.

<Second internal bus bar>
One end of the second internal bus bar 409 is connected to the other end of the external bus bar 408. The second internal bus bar 409 of the P bus bar 401 extends from the third through hole 493i to the storage space of the inverter housing 490. The second internal bus bar 409 of the N bus bar 402 extends from the fourth through hole 493j to the storage space.

The other end of the second internal bus bar 409 is separated from the wall surface that divides the through hole in order to secure an insulating distance. Air is interposed between the other end side of the second internal bus bar 409 and the wall surface that partitions the through hole. The through holes may be filled with an insulating resin material so as to insulate the second inner bus bar 409 and the bottom wall 493 and to conduct heat between them.

The position in the y direction on the other end side of each of the two second internal bus bars 409 is between the condenser housing 470 and the cooler 480. The other end side of each of the two second internal bus bars 409 is branched into a condenser housing 470 side and a cooler 480 side, and extends in the y direction. The extension direction of these branch portions is opposite in the y direction.

The second internal bus bar 409 of the P bus bar 401 is connected to the first electrode 431 of the smoothing capacitor 430. At the same time, the second internal bus bar 409 of the P bus bar 401 is connected to the collector terminals 440a of the three semiconductor modules.

The second internal bus bar 409 of the N bus bar 402 is connected to the second electrode 432 of the smoothing capacitor 430. At the same time, the second internal bus bar 409 of the N bus bar 402 is connected to the emitter terminals 440b of the three semiconductor modules.

<Noise filter>
The noise filter 420 is provided on the external bus bar 408. The noise filter 420 is provided on the bottom wall 493. The noise filter 420 faces the outer bottom surface 493b. The noise filter 420 is aligned with the projection region in the z direction. The noise filter 420 is aligned with the capacitor housing 470 in the z direction.

The noise filter 420 contains at least one of a capacitor and a ferrite core. The capacitor removes the current noise flowing through the external bus bar 408. The ferrite core suppresses the input of electromagnetic noise to the external bus bar 408. Further, the ferrite core absorbs electromagnetic noise output from the external bus bar 408.

The following form can be adopted as the capacitor included in the noise filter 420. This capacitor has less capacitance than the smoothing capacitor 430. One capacitor is connected between the two external buses 408. Two capacitors are connected in series between two external buses 408. The midpoint between these two capacitors is connected to ground.

The following form can be adopted as the ferrite core included in the noise filter 420. One ferrite core surrounds each of the two external bus bars 408. Two ferrite cores individually surround each of the two external bus bars 408.

The noise filter 420 may include a resin body that covers these in addition to the above-mentioned capacitor and ferrite core for removing noise. Then, this resin body may be fixed to the bottom wall 493 with bolts or the like. The resin body may come into contact with the outer bottom surface 493b.

<Output hole>
As shown in FIGS. 2 and 3, the bottom wall 493 is formed with a first output hole 493k, a second output hole 493l, and a third output hole 493m that open into the inner bottom surface 493a and the outer bottom surface 493b. There is. These three output holes are formed on the bottom wall 493 on the side separated from the input connector 406.

As described above, the side wall 494 forms an annular shape in the circumferential direction around the z direction. Therefore, a part of the inner peripheral surface 494a of the side wall 494 is arranged in the y direction. The input connector 406 is provided in one of the two regions arranged in the y direction on the inner peripheral surface 494a. The first output hole 493k to the third output hole 493m are located on the other side of the two regions.

As shown in FIG. 2, each of the U-phase bus bar 403 to the W-phase bus bar 405 extends in the storage space of the inverter housing 490, and a part thereof extends outside the storage space. In order to realize such an extension, each of the U-phase bus bar 403 to the W-phase bus bar 405 is individually passed through the first output hole 493 k to the third output hole 493 m. A cooler 480 and a condenser housing 470 are located between each of the U-phase bus bars 403 to W-phase bus bars 405 and the input connector 406. The first output hole 493k to the third output hole 493m correspond to the third through hole.

One end of each of the U-phase bus bar 403 to the W-phase bus bar 405 is individually connected to the midpoint terminal 440c of the three semiconductor modules in the storage space. A second current sensor 450 is provided in each of the U-phase bus bar 403 to the W-phase bus bar 405. The other ends of the U-phase bus bars 403 to W-phase bus bars 405 are individually connected to the U-phase stator bus bars 501 to W-phase stator bus bars 503, respectively, outside the storage space. The bottom wall 493 is located between the second current sensor 450 and the other ends of each of the U-phase bus bar 403 to the W-phase bus bar 405.

A part of each of the U-phase bus bar 403 to the W-phase bus bar 405 of the present embodiment is extended in the z direction in the storage space, and is bent and extended along the inner bottom surface 493a. A second heat transfer sheet 472 is interposed between a portion extending along the inner bottom surface 493a of the phase bus bar and the inner bottom surface 493a. The second heat transfer sheet 472 is sandwiched between the phase bus bar and the bottom wall 493. This facilitates the positive heat conduction of the phase bather with the bottom wall 493 formed by the cooling passage 493e via the second heat transfer sheet 472.

<Outer cover>
The outer cover 492 is connected to the bottom wall 493. The outer cover 492 has an facing surface 492a that faces the outer bottom surface 493b at a distance in the z direction. A covering space is partitioned between the outer bottom surface 493b and the facing surface 492a. An external bus bar 408, a noise filter 420, and a U-phase bus bar 403 to a W-phase bus bar 405 are housed in this covering space.

To explain in detail, the covering space is roughly divided into a first space, a second space, and a third space. An external bus bar 408 and a noise filter 420 are housed in the first space. The first space and the third space communicate with each other through the second space. The U-phase bus bar 403 to the W-phase bus bar 405 are stored in the third space.

The length of the connection location with the second space in the first space is shorter in the z direction than the storage location of the external bus bar 408 and the noise filter 420 in the first space. From the first space to the second space, the covering space has a narrowed shape.

The length of the connection location with the second space in the third space is shorter in the z direction than the storage location of the U-phase bus bar 403 to the W-phase bus bar 405 in the third space. From the third space to the second space, the covering space has a narrowed shape.

Due to the configuration shown above, a part of the metal outer cover 492 is on the line connecting the noise filter 420 housed in the first space and the U-phase bus bar 403 to the W-phase bus bar 405 housed in the third storage space. Is located.

As explained so far, the configuration in which the first space and the third space communicate with each other via the second space is shown. However, the second space does not have to be. The covering space may be divided into a space in which the external bus bar 408 and the noise filter 420 are housed, and a space in which the U-phase bus bar 403 to the W-phase bus bar 405 are housed. These two spaces may be separated.

The outer cover 492 has a facing surface 492a and a back surface 492b on the back side thereof. The outer cover 492 is formed with a connection hole 492c and a connection hole 492d that open on the facing surface 492a and the back surface 492b, respectively.

The connection hole 492c is open in the z direction. The tip end side of each of the U-phase stator bus bar 501 to the W-phase stator bus bar 503 is inserted into the third space through the connection hole 492c.

The connecting hole 492d is open in the y direction. In the overlapping region where the projection region of the connecting hole 492d in the y direction and the projection region of the connecting hole 492c in the z direction overlap, the other ends of the U-phase bus 403 to the W-phase bus 405 and the U-phase stator bus 501 to W The tips of each of the phase stator baths 503 are provided.

The other ends of the three phase bus bars and the tips of the three phase stator bus bars are aligned in the x direction in the overlapping region. The other ends of these three phase bus bars and the tips of the three phase stator bus bars face each other in the y direction. A through hole for bolting both of the phase bus bar and the phase stator bus bar is formed in the facing region of each of the phase bus bar and the phase stator bus bar. The through hole extends in the y direction.

A bolt 504 for connecting the phase bus bar and the phase stator bus bar is inserted into the overlapping region via the connection hole 492c that opens in the y direction. After the phase stator bus bar and the phase bus bar are bolted together, the connecting hole 492d is closed by the connecting cover 492e. The shaft portion of the bolt 504 is fastened to a screw hole of a terminal block or a screw groove of a nut (not shown). A phase bus bar and a phase stator bus bar are sandwiched between the head of the bolt 504 and the terminal block.

<Motor>
Next, the motor 500 will be outlined. The motor 500 includes a metal motor housing 510 in addition to the U-phase stator bus bars 501 to the W-phase stator bus bar 503. The motor shaft, rotor, and stator are housed in the hollow of the motor housing 510. The motor housing 510 corresponds to an electromagnetically shielded housing.

The motor housing 510 has a cylindrical shape. The axial direction of the motor housing 510 is the x direction. Therefore, the motor housing 510 has a cylindrical surface 510a that forms a circle in a plane facing the x direction. The motor housing 510 has two bottom surfaces 510b facing in the x direction.

The bottom surface 510b of the motor housing 510 is formed with a through hole for providing the tip of the motor shaft extending in the y direction outside the hollow of the motor housing 510. The tip of this motor shaft is connected to the output shaft of the electric vehicle.

The rotor has a permanent magnet and a fixing portion for fixing the permanent magnet to the motor shaft. The fixed portion has a cylindrical shape. The motor shaft is inserted and fixed in the hollow of the fixed portion. As a result, the permanent magnet is provided around the axis of the motor shaft.

The stator has a stator core and a stator coil provided on the stator core. The stator core has a cylindrical shape. A rotor is provided together with a motor shaft in the hollow of the stator core. As a result, the rotor and the stator face each other in the radial direction orthogonal to the extension direction of the motor shaft.

The stator coil has the above-mentioned U-phase stator coil to W-phase stator coil. Each of these three-phase stator coils has an insulated wire whose conductor is covered with an insulating material such as an enamel coating. These three-phase insulated wires are wound around the stator core. As a result, the stator coil is provided on the stator core.

The three-phase stator coil is electrically connected to the power conversion device 400 via the U-phase stator bus bar 501 to the W-phase stator bus bar 503. Three-phase alternating current is supplied from the power conversion device 400 to the three-phase stator coil. As a result, a three-phase rotating magnetic field is generated from the stator coil.

As mentioned above, the rotor has a permanent magnet. A magnetic field is generated from a permanent magnet. Then, a three-phase rotating magnetic field is generated from the stator coil. Rotational torque is generated in the rotor by the interaction of these two magnetic fields. The direction in which the rotational torque is generated sequentially changes with time in the circumferential direction around the extension direction of the motor shaft according to the phase change of the rotating magnetic field. As a result, the motor shaft provided with the rotor rotates.

<Mechanical and electrical integrated unit>
As schematically shown in FIG. 4, the inverter housing 490 of the power conversion device 400 is connected to the motor housing 510 of the motor 500. As a result, the mechanical / electrical integrated unit 300 is configured. By such connection, the opening of the connection hole 492c of the inverter housing 490 described above is closed by the motor housing 510.

The mechanical / electrical integrated unit 300 is provided in the mounting space behind the hood of the electric vehicle. In the configuration shown in FIG. 4, the x direction is the left-right direction of the electric vehicle, the y direction is the front-rear direction of the electric vehicle, and the z direction is along the top-bottom direction of the electric vehicle.

The motor housing 510 is provided on the bottom side of the vehicle in the z direction with the mechanical / electrical integrated unit 300 provided in the mounting space. The inverter housing 490 is provided on the bonnet side.

Further, the mechanical / electrical integrated unit 300 is separated from the passenger compartment in which the user is boarding in the y direction. The mechanical / electrical integrated unit 300 is separated from vehicle accessories such as a radio and a car navigation system provided in the vehicle interior in the y direction. In FIG. 4, the mounting space is referred to as PS and the passenger compartment is referred to as CR. The boundary between the two is shown by a two-dot chain line.

As described above, the motor housing 510 has a cylindrical surface 510a whose axial direction is the x direction. The cylindrical surface 510a is a plane orthogonal to the x direction and has an arc shape. The cylindrical surface 510a and the outer bottom surface 493b of the inverter housing 490 are aligned in the z direction. Due to this arrangement configuration, the separation distance between the cylindrical surface 510a and the outer bottom surface 493b in the z direction changes when the position in the y direction deviates.

FIG. 4 shows the center line CL penetrating the center of the cylindrical surface 510a in the z direction as a alternate long and short dash line. The distance between the cylindrical surface 510a and the outer bottom surface 493b in the z direction is the shortest on the center line CL. The distance between the cylindrical surface 510a and the outer bottom surface 493b in the z direction becomes longer as the distance from the center line CL increases in the y direction. The gap between the cylindrical surface 510a and the outer bottom surface 493b is a so-called dead space.

There are two dead spaces between the cylindrical surface 510a and the outer bottom surface 493b. The two dead spaces are lined up in the y direction via the center line CL. One of the two dead spaces is located on the passenger compartment side. The other of the two dead spaces is separated from the passenger compartment. In FIG. 4, the dead space separated from the passenger compartment is hatched.

FIG. 4 shows only the portion of the outer cover 492 that partitions the first space in which the external bus bar 408 and the noise filter 420 are housed. A portion of the outer cover 492 in which the external bus bar 408 and the noise filter 420 are housed is provided in the hatched dead space.

Due to this arrangement configuration, the inverter housing 490 is located between the external bus bar 408 and noise filter 420 provided outside the storage space of the housing 491 and the vehicle interior provided with vehicle accessories such as a radio and a car navigation system. Housing 491 and motor housing 510 are located. The external bus bar 408 and the noise filter 420 are aligned with the motor housing 510 in the y direction.

<Action effect>
Each of the P bus bar 401 and the N bus bar 402 has a first internal bus bar 407 and a second internal bus bar 409 extending in the storage space, and an external bus bar 408 extending outside the storage space.

The external bus bar 408 faces the outer bottom surface 493b formed by the cooling passage 493e in the z direction. The separation distance between the external bus bar 408 and the outer bottom surface 493b is such that the insulation distance is secured.

According to this, the temperature rise of the external bus bars 408 of each of the P bus bar 401 and the N bus bar 402 is suppressed. As a result, the temperature rise of the smoothing capacitor 430 electrically connected to the external bus bar 408 is suppressed. Changes in electrical characteristics such as the capacitance of the smoothing capacitor 430 are suppressed.

In the external bus bar 408, the capacitor housing 470 faces the projection region projected on the outer bottom surface 493b along the z direction in the z direction. Further, the noise filter 420 connected to the external bus bar 408 also faces the projection region in the z direction.

According to this, the increase in the physique of the power converter 400 in the direction orthogonal to the z direction is suppressed.

The noise filter 420 is provided on the bottom wall 493.

According to this, the noise filter 420 and the bottom wall 493 can easily transfer heat. Therefore, the temperature rise of the external bus bar 408 connected to the noise filter 420 is suppressed. The temperature rise of the smoothing capacitor 430 electrically connected to the external bus bar 408 is suppressed.

The external bus bar 408 of the P bus bar 401 extends from the first through hole 493 g to the third through hole 493i via the projection region. The external bus bar 408 of the N bus bar 402 extends from the second through hole 493h to the fourth through hole 493j via the projection region.

According to this, the extension of the external bus bar 408 is suppressed. Therefore, the generation of electromagnetic noise from the external bus bar 408 is suppressed.

The condenser housing 470 and the cooler 480 are separated in the y direction. The other end side of the second internal bus bar 409 extends between the condenser housing 470 and the cooler 480, and then branches into the condenser housing 470 side and the cooler 480 side. One of the branched portions of the second internal bus bar 409 is connected to the smoothing capacitor 430, and the other branched portion is connected to the switching unit 440.

According to this, it is suppressed that the power supply power input from the battery 200 flows to the switching unit 440 via the smoothing capacitor 430. The temperature rise of the smoothing capacitor 430 due to energization is suppressed.

The first internal bus bar 407 of the P bus bar 401 is inserted into the first through hole 493 g. The first internal bus bar 407 of the N bus bar 402 is inserted into the second through hole 493h.

As a result, the temperature rise of the first internal bus bar 407 is suppressed. The temperature rise of the smoothing capacitor 430 electrically connected to the first internal bus bar 407 is suppressed. The temperature rise of the first current sensor 410 provided in the first internal bus bar 407 is suppressed.

The second internal bus bar 409 of the P bus bar 401 is inserted into the third through hole 493i. The second internal bus bar 409 of the N bus bar 402 is inserted into the fourth through hole 493j.

As a result, the temperature rise of the second internal bus bar 409 is suppressed. The temperature rise of the smoothing capacitor 430 electrically connected to the second internal bus bar 409 is suppressed.

The external bus bar 408 is stored in the covering space partitioned between the bottom wall 493 and the outer cover 492.

According to this, electromagnetic noise generated from the current flowing through the external bus bar 408 is suppressed from leaking to the outside of the power conversion device 400.

A part of the outer cover 492 is located on the line connecting the external bus bar 408 and the U-phase bus bar 403 to the W-phase bus bar 405.

According to this, the input of electromagnetic noise from one of the external bus bar 408 and the U-phase bus bar 403 to the W-phase bus bar 405 to the other is suppressed.

In the present embodiment, the configuration in which the covering space is divided into a space in which the external bus bar 408 and the noise filter 420 are housed and a space in which the U-phase bus bar 403 to the W-phase bus bar 405 are housed is shown as an example.

In the case of such a configuration, the input of electromagnetic noise from one of the external bus bar 408 and the U-phase bus bar 403 to the W-phase bus bar 405 to the other is effectively suppressed.

The U-phase bus bar 403 to the W-phase bus bar 405 extend in the z direction and bend along the inner bottom surface 493a in the storage space.

Due to this configuration, the vibration of the motor 500 suppresses the action of stress on the midpoint terminals 440c of the U-phase semiconductor modules 441 to W-phase semiconductor modules 443, respectively, of the U-phase bus bars 403 to W-phase bus bars 405. It is possible to suppress the occurrence of electrical connection failure between the phase bus bar and the semiconductor module.

U-phase bus bars 403 to W-phase bus bars 405 are inserted into the first output holes 493k to the third output holes 493m.

As a result, the temperature rise of the U-phase bus bar 403 to the W-phase bus bar 405 is suppressed. The temperature rise of the second current sensor 450 provided in the U-phase bus bar 403 to the W-phase bus bar 405 is suppressed.

The bottom wall 493 is located between the other end connected to each of the U-phase stator bus bars 501 to W-phase stator bus bar 503 of each of the U-phase bus bars 403 to W-phase bus bar 405 and the second current sensor 450.

According to this, heat transfer from the motor 500 to the second current sensor 450 is suppressed.

A second heat transfer sheet 472 is interposed between the U-phase bus bar 403 to the W-phase bus bar 405 and the bottom wall 493.

According to this, the temperature rise of the U-phase bus bar 403 to the W-phase bus bar 405 is suppressed. Along with this, the temperature rise of the second current sensor 450 is suppressed.

The external bus bar 408 and the noise filter 420 are provided in a dead space formed between the bottom wall 493 of the housing 491 of the inverter housing 490 and the cylindrical surface 510a of the motor housing 510.

According to this, the increase in the physique of the mechanical / electrical integrated unit 300 is suppressed.

The external bus bar 408 and the noise filter 420 are provided in the dead space separated from the vehicle interior among the two dead spaces configured between the inverter housing 490 and the motor housing 510.

According to this, electromagnetic noise generated from the current flowing through the external bus bar 408 provided outside the storage space of the housing 491 is suppressed from passing through vehicle accessories such as a radio and a car navigation system provided in the passenger compartment. Will be done.

The inverter housing 490 and the motor housing 510 are located between the external bus bar 408 provided outside the storage space of the housing 491 and the passenger compartment.

According to this, the electromagnetic noise generated from the external bus bar 408 is effectively suppressed from passing through the vehicle accessories provided in the passenger compartment.

A cooler 480 is provided on the support wall 496. The support wall 496 and the capacitor housing 470 face each other in the z direction.

According to this, it becomes difficult for the support wall 496 to be heated. The support wall 496 and the capacitor housing 470 facilitate heat exchange. Therefore, the temperature rise of the smoothing capacitor 430 housed in the capacitor housing 470 is suppressed.

The first electrode 431 provided in the smoothing capacitor 430 is located on the support wall 496 side, and the second electrode 432 is located on the bottom wall 493 side.

According to this, the first electrode 431 easily exchanges heat with the support wall 496 provided with the cooler 480. At the same time, the second electrode 432 facilitates heat exchange with the bottom wall 493 in which the cooling passage 493e is formed. Therefore, the temperature rise of the smoothing capacitor 430 is effectively suppressed.

In the present embodiment, the configuration in which the refrigerant flowing through the cooling passage 493e is supplied to the cooler 480 is shown as an example. As shown in FIGS. 2 and 4, the cooling passage 493e is located on the bottom side of the vehicle in the vertical direction of the vehicle with respect to the cooler 480.

In the case of such a configuration, the refrigerant flowing from the cooling passage 493e to the cooler 480 flows in the z direction in the direction opposite to the vertical direction. Therefore, even if air bubbles are generated in the cooling passage 493e, the air bubbles easily flow to the cooler 480. The bubbles are easily discharged to the outside through the discharge pipe 482 of the cooler 480. Therefore, it is suppressed that the cooling performance of the cooling passage 493e and the cooler 480 is deteriorated due to the air bubbles.

(Second Embodiment)
Next, the second embodiment will be described with reference to FIG.

As shown in FIG. 5, the U-phase bus bar 403 to the W-phase bus bar 405 of the present embodiment have a conductive bus bar 400a and a heat conductive bus bar 400b. The conductive bus bar 400a is responsible for energization between the switching unit 440 and the U-phase stator bus bar 501 to the W-phase stator bus bar 503. The heat conductive bus bar 400b is responsible for heat conduction between the conductive bus bar 400a and the bottom wall 493.

The forming materials of the conductive bus bar 400a and the heat conductive bus bar 400b may be the same or different. When the forming materials are different, the conductive bus bar 400a may be formed of a material having a higher electric conductivity than the heat conductive bus bar 400b. The heat conductive bus bar 400b is preferably made of a material having a higher thermal conductivity than the conductive bus bar 400a.

The conductive bus bar 400a and the heat conductive bus bar 400b are connected by, for example, bolts. The heat conductive bus bar 400b extends along the inner bottom surface 493a. A second heat transfer sheet 472 is interposed between the heat conduction bus bar 400b and the inner bottom surface 493a.

With such a configuration, the temperature rise of the conductive bus bar 400a is suppressed. The temperature rise of the second current sensor 450 provided in the conductive bus bar 400a is suppressed.

The mechanical / electrical integrated unit 300 described in the present embodiment includes components equivalent to those of the mechanical / electrical integrated unit 300 described in the first embodiment. Therefore, it goes without saying that the mechanical / electrical integrated unit 300 described in the present embodiment has the same function and effect as the mechanical / electrical integrated unit 300 described in the first embodiment. Therefore, the description is omitted. The description of overlapping actions and effects will be omitted in the other embodiments and modifications shown below.

(Third Embodiment)
Next, the third embodiment will be described with reference to FIG.

In the first embodiment, an example is shown in which a connecting hole 492d for bolting each of the U-phase bus bar 403 to the W-phase bus bar 405 and the U-phase stator bus bar 501 to the W-phase stator bus bar 503 is formed on the outer cover 492.

On the other hand, in the present embodiment, as shown in FIG. 6, a connecting hole 492d is formed in the side wall 494 of the housing 491. The connecting hole 492d is open to the inner peripheral surface 494a and the outer peripheral surface 494b.

In order to realize such a configuration, each of the U-phase stator bus bar 501 to the W-phase stator bus bar 503 is inserted into the first output hole 493k to the third output hole 493m. The tips of the U-phase stator bus bars 501 to the W-phase stator bus bars 503 are provided in the storage space of the housing 491.

The bolting points of each of the U-phase bus bars 403 to W-phase bus bar 405 and each of the U-phase stator bus bars 501 to W-phase stator bus bar 503 are on the inner bottom surface 493a side of the outer bottom surface 493b in the z direction.

According to this, the extension of each of the U-phase bus bar 403 to the W-phase bus bar 405 in the z direction is suppressed. As a result, the increase in the physique of the power converter 400 in the z direction is suppressed.

(Fourth Embodiment)
Next, the fourth embodiment will be described with reference to FIG. 7.

In the first embodiment, an example is shown in which the first output hole 493k to the third output hole 493m are formed on the bottom wall 493.

On the other hand, in the present embodiment, as shown in FIG. 7, the first output hole 493k to the third output hole 493m are formed on the side wall 494. These first output holes 493k to third output holes 493m are open to the inner peripheral surface 494a and the outer peripheral surface 494b. The outer cover 492 is divided into a first outer cover 492f for partitioning the first space and a second outer cover 492g for partitioning the third space.

The first outer cover 492f is connected to the bottom wall 493. The first space is partitioned between the first outer cover 492f and the outer bottom surface 493b.

The second outer cover 492 g is provided on the side wall 494. The third space is partitioned between the second outer cover 492g and the outer peripheral surface 494b. A connecting hole 492d is formed in the second outer cover 492g.

According to this configuration, the extension of the connecting hole 492d in the z-direction suppresses the increase in the body shape of the power conversion device 400 in the z-direction.

Further, the tip side of each of the U-phase bus bar 403 to the W-phase bus bar 405 is located closer to the inner bottom surface 493a than the outer bottom surface 493b in the z direction. The tip side of each of the U-phase bus bar 403 to the W-phase bus bar 405 is separated from the motor 500 in the z direction. Therefore, it is suppressed that the temperature of each of the U-phase bus bar 403 to the W-phase bus bar 405 rises due to heat transfer from the motor 500.

(Fifth Embodiment)
Next, the fifth embodiment will be described with reference to FIG.

In the first embodiment, an example is shown in which the U-phase bus bars 403 to W-phase bus bars 405 and the U-phase stator bus bars 501 to W-phase stator bus bars 503 are bolted to each other.

On the other hand, in the present embodiment, as shown in FIG. 8, an output connector 400c having a terminal electrically connected to the tip of each of the U-phase bus bar 403 to the W-phase bus bar 405 is provided on the outer cover 492. The terminal of the wire harness extended from the motor 500 is connected to the output connector 400c. As a result, each of the U-phase bus bar 403 to the W-phase bus bar 405 is electrically connected to the motor 500.

(Sixth Embodiment)
Next, the sixth embodiment will be described with reference to FIG.

In the first embodiment, an example is shown in which the condenser housing 470 and the cooler 480 are separated in the y direction.

On the other hand, in the present embodiment, as shown in FIG. 9, the condenser housing 470 and the cooler 480 are arranged in the z direction.

According to this configuration, the increase in the physique of the power converter 400 in the direction orthogonal to the z direction is suppressed.

(First modification)
In each embodiment, an example is shown in which the inverter housing 490 is fixed to the motor housing 510. However, the inverter housing 490 may be fixed to the body chassis of the electric vehicle.

(Second modification)
In each embodiment, an example is shown in which the mechanical / electrical integrated unit 300 is applied to an in-vehicle system 100 for an electric vehicle. However, the application of the mechanical / electrical integrated unit 300 is not particularly limited to the above example. For example, it is possible to adopt a configuration in which the mechanical / electrical integrated unit 300 is applied to the in-vehicle system of a hybrid vehicle.

(Third modification example)
In each embodiment, an example in which the power conversion device 400 is provided in the motor 500 is shown. However, the power conversion device 400 can also adopt a configuration provided in the housing of the power transmission mechanism having a function of transmitting the power of the motor 500 to the axle. This housing has the same external shape as the motor housing 510.

Briefly explaining the power transmission mechanism, the power transmission mechanism has a plurality of shafts extending in the x direction and a gear connected to the plurality of shafts. The teeth formed in these plurality of gears mesh with each other so that the shafts can rotate with each other.

One of the plurality of shafts of the power transmission mechanism is connected to the other end of the motor shaft of the motor 500. Further, one of the remaining plurality of shafts is connected to the drive shaft via a differential gear. As a result, the plurality of shafts and gears of the power transmission mechanism can be rotated by the rotation of the motor 500 or the rotation of the traveling wheel.

Although the present disclosure has been described in accordance with the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various variations and variations within a uniform range. In addition, although various combinations and forms are shown in this disclosure, other combinations and forms, including only one element, more, or less, are also within the scope and scope of this disclosure. It is something to enter.

Claims (18)

1. The first electrical component (470) in which the passive element (430) is housed,
   A second electrical component (440) with an active element (444,445) and
   The input connector (406) connected to the external power supply (200) and
   An input bus bar (401, 402) that electrically connects the passive element, each of the active elements, and the input connector, and
   It has a part of the input bus bar, a storage space for accommodating each of the first electric component and the second electric component, and a housing (491) provided with a cooling passage (493e).
   A power conversion device in which a portion of the input bus bar located outside the storage space is provided at a portion of the housing where the cooling passage is formed.
2. The input bus bar
   In the storage space, the input connector extends toward the bottom wall (493) in which the cooling passage is formed in the housing, and the inner bottom surface (493a) of the bottom wall on the storage space side and the outer bottom surface on the back side thereof. (493b) A first internal bus bar (407) extending out of the storage space through a first through hole (493g, 493h) opened in each of the storage spaces.
   Along the line-up direction of the first electric component and the bottom wall, the first electric component faces the projection region projected on the outer bottom surface in the line-up direction with an external bus bar (408).
   A second internal bus bar (493i, 493j) extending into the storage space through the second through holes (493i, 493j) opened in the outer bottom surface and the inner bottom surface, and connected to the first electric component and the second electric component, respectively. 409) The power conversion device according to claim 1.
3. A filter (420) electrically connected to the external bus bar is provided.
   The power conversion device according to claim 2, wherein the filter faces the projection region in the alignment direction.
4. The power conversion device according to claim 3, wherein the filter is provided on the bottom wall.
5. It has an electromagnetic shielding cover (492) that covers the outer bottom surface of the bottom wall, and has.
   The power conversion device according to any one of claims 2 to 4, wherein the external bus bar is housed in a covering space partitioned between the bottom wall and the electromagnetic shielding cover.
6. It has an output bus bar (403 to 405) that connects the second electric component and the motor.
   The power conversion device according to claim 5, wherein a part of the electromagnetic shielding cover is provided between the output bus bar and the external bus bar.
7. The output bus bar is housed in the covering space together with the external bus bar.
   The power conversion device according to claim 6, wherein the covering space is divided into the external bus bar side and the output bus bar side.
8. A third through hole (493k to 493m) that opens in each of the inner bottom surface and the outer bottom surface is formed in the bottom wall.
   The power conversion device according to claim 6 or 7, wherein a part of the output bus bar is provided in the third through hole.
9. It has a current sensor (450) provided in a portion of the output bus bar housed in the storage space.
   The power conversion device according to any one of claims 6 to 8, wherein a part of the bottom wall is located between the current sensor and the connection point of the output bus bar with the electric motor.
10. The power conversion device according to claim 6, wherein the connection point of the output bus bar with the electric motor is located on the inner bottom surface side of the outer bottom surface in the arrangement direction.
11. The power conversion device according to any one of claims 6 to 10, further comprising a heat transfer sheet (472) interposed between the output bus bar and the bottom wall.
12. The output bus bar includes a conductive bus bar (400a) that is responsible for energizing between the second electric component and the motor, and a heat conductive bus bar (400b) that is responsible for heat conduction between the conductive bus bar and the bottom wall. Have,
    The power conversion device according to claim 11, wherein the heat transfer sheet is interposed between the heat transfer bus bar and the bottom wall.
13. The first electrical component and the second electrical component are spaced apart from each other in the lateral direction orthogonal to the alignment direction.
    The second internal bus bar extends to a region between the first electric component and the second electric component in the storage space, and the tip end side thereof branches into the first electric component side and the second electric component side. The power conversion device according to any one of claims 2 to 12, which is extended.
14. The housing stands up from the inner bottom surface of the bottom wall in the alignment direction, and has a side wall (494) forming an annular shape in the circumferential direction around the alignment direction.
    The power conversion device according to claim 13, wherein the external bus bar is located on one side of two regions of the side wall that are laterally spaced apart from each other.
15. An electromagnetic shielding housing (510) is connected to the other side of the two regions of the side wall of the bottom wall of the housing.
    The power conversion device according to claim 14, wherein the external bus bar is aligned with the electromagnetic shielding housing in the lateral direction.
16. The electromagnetically shielded housing has a cylindrical shape whose axial direction is the vertical direction orthogonal to each of the arrangement direction and the horizontal direction.
    The outer bottom surface is aligned with the cylindrical surface (510a) of the electromagnetic shielding housing in the alignment direction.
    The distance between the outer bottom surface and the cylindrical surface in the alignment direction extends from the position closest to the outer bottom surface of the cylindrical surface toward one side of the two regions provided by the side wall. The power conversion device according to claim 15, wherein the external bus bar is provided in the gap.
17. A cooler (480) that stores and cools the second electrical component, and
    A support wall (496) connected to the housing in the storage space and provided with the cooler is provided.
    The power conversion device according to any one of claims 2 to 16, wherein the first electric component faces the support wall in the arrangement direction.
18. The passive element is a capacitor
    The capacitor has a first electrode (431) and a second electrode (432).
    The 17th aspect of the present invention, wherein the first electrode is located closer to the support wall than the second electrode, and the second electrode is located closer to the bottom wall than the first electrode in the alignment direction. Power converter.

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