JP7409271B2 - power converter - Google Patents

Description

The disclosure in this specification relates to a power conversion device.

Patent Document 1 discloses a power conversion device that performs power conversion using a plurality of electronic components. In this power conversion device, a board on which components among a plurality of electronic components are mounted is housed in a case. This case has a rectangular cylindrical case body and a pair of lids that cover each opening of the case body. The board is installed inside the case, facing the lower lid of the pair of lids.

Japanese Patent Application Publication No. 2016-77043

However, in Patent Document 1, in which the board is housed in a case, there is a concern that, for example, the lower cover may deform and come into contact with components mounted on the board. Therefore, a configuration may be considered in which the distance between the lower cover and the mounted component is increased to such an extent that even if the lower cover is deformed, the lower cover does not come into contact with the mounted component. However, with this configuration, the case becomes larger due to the increased distance between the lower cover and the mounted components.

A main objective of the present disclosure is to provide a power conversion device that can realize a smaller case.

The multiple embodiments disclosed in this specification employ different technical means to achieve their respective objectives. Furthermore, the claims and the reference numerals in parentheses described in this section are examples of correspondences with specific means described in the embodiments described later as one aspect, and are intended to limit the technical scope. isn't it.

In order to achieve the above object, one aspect disclosed is:
A power conversion device (10) that performs power conversion,
a plate-shaped substrate (30);
A plurality of mounted components (31a, 31aX) mounted on a mounting surface (30a) that is one board surface of the board,
a case (40) having a case body (45) in which an opening (45a) is formed, and a cover body (48) attached to the case body so as to cover the opening, and housing a board;
a fixing member (35, 35A, 38) fixing the board to the case body with the mounting surface facing the cover body;
Equipped with
The fixing member has a fixing protrusion (36) protruding from the mounting surface toward the cover body,
The protrusion dimension (H1) of the fixed protrusion from the mounting surface is larger than the protrusion dimension (H2) of any of the plurality of mounted components from the mounting surface,
The case body is
a main body outer wall portion (51) forming an outer wall surface (43) of the case;
a main body support part (52) extending from the main body outer wall and supporting the board;
a fixed part (55) provided in the main body support part at a position spaced from the main body outer wall part to the inside of the case, and to which a fixing member is fixed;
It has
Multiple fixing members are provided,
This is a power conversion device in which the plurality of fixing members include a fixing member (35A) provided at a position farther away from the outer wall of the main body than one mounted component (31aX) .
One aspect disclosed is:
A power conversion device (10) that performs power conversion,
a plate-shaped substrate (30);
A plurality of mounted components (31a, 31aX) mounted on a mounting surface (30a) that is one board surface of the board,
a case (40) having a case body (45) in which an opening (45a) is formed, and a cover body (48) attached to the case body so as to cover the opening, and housing a board;
a fixing member (35, 35A, 38) fixing the board to the case body with the mounting surface facing the cover body;
Equipped with
The fixing member has a fixing protrusion (36) protruding from the mounting surface toward the cover body,
The protrusion dimension (H1) of the fixed protrusion from the mounting surface is larger than the protrusion dimension (H2) of any of the plurality of mounted components from the mounting surface,
When the mounted component is the first mounted component (31a) and the mounting surface is the first mounting surface (30a),
A second mounting surface (30b) on the opposite side of the first mounting surface of the board includes second mounting components (32b, 32bY),
has been implemented,
The protrusion dimension (H3b) of the second mounted component from the second mounting surface is larger than the protrusion dimension (H1) of the fixed protrusion from the first mounting surface,
The case body has a partition part (53) that partitions the internal space of the case into a first space (40a) on the side of the cover body and a second space (40b) on the opposite side of the cover body via the first space. and
A substrate is housed in the first space,
The second space is provided with a heat exchange part (21) that exchanges heat between the refrigerant flowing inside the second space and the outside of the second space,
The second mounted component is a power conversion device that enters the second space through a partition hole (56) provided in the partition section.

According to the above aspect, the protrusion dimension of the fixing protrusion from the mounting surface of the board is larger than the protrusion dimension of any of the plurality of mounted components from the mounting surface. With this configuration, for example, when the cover body approaches the board due to deformation of the cover body, the cover body comes into contact with the fixing protrusion more easily than with the mounted components of the board. Therefore, even if the cover body is placed as close as possible to the board, the fixing protrusion can prevent the cover body from coming into contact with the mounted components. In this way, the case can be made smaller by realizing a configuration in which the cover body is less likely to come into contact with the mounted components.

Moreover, the fixing member is used as a member for restricting the contact of the cover body to the mounted components. This allows the strength of the case body required to support the board and the strength of the fixing member required to fix the board to be used as the strength to support the cover body when the cover body approaches the board. Therefore, the case body and the fixing member can prevent the cover body from coming into contact with the mounted components due to insufficient strength to support the cover body.

FIG. 2 is a top view of the power conversion device in the first embodiment. FIG. 2 is a sectional view taken along line II-II in FIG. 1. A top view of the power conversion device with the top cover removed. A diagram of the power conversion device viewed from below with the bottom cover removed. A view of the case body viewed from above. A perspective view of the case body. FIG. 3 is a schematic cross-sectional view showing the configuration around the fastening screw. FIG. 3 is a schematic plan view showing the configuration around the fastening screw. FIG. 7 is a schematic cross-sectional view showing the configuration around the fastening screw in the second embodiment.

Hereinafter, a plurality of embodiments for carrying out the present disclosure will be described with reference to the drawings. In each form, parts corresponding to matters explained in the preceding form may be given the same reference numerals and redundant explanation may be omitted. When only a part of the configuration is described in each form, the other forms previously described can be applied to other parts of the structure. Not only combinations of parts that specifically indicate that combinations are possible in each embodiment, but also partial combinations of embodiments even if it is not explicitly stated, as long as there is no particular problem with the combination. It is also possible.

<First embodiment>
The power conversion device 10 shown in FIG. 1 is installed in a vehicle such as an electric vehicle (EV), a hybrid vehicle (HV), or a fuel cell vehicle, for example. This vehicle is equipped with a drive system that drives the drive wheels of the vehicle. This drive system includes a power conversion device 10, a DC power source such as a battery, and an electric motor such as a three-phase AC motor. The power conversion device 10 converts DC power supplied from a DC power source into AC power and outputs the AC power to an electric motor. The power converter 10 also has a function of converting AC power generated by the electric motor into DC power.

The power conversion device 10 includes an inverter circuit as a power conversion circuit that performs bidirectional power conversion between a DC power source and an electric motor. The inverter circuit includes a plurality of semiconductor switches and a capacitor. In the inverter circuit, an upper arm circuit and a lower arm circuit are provided for each of the U phase, V phase, and W phase, and each of these arm circuits includes a semiconductor switch.

The semiconductor switch is, for example, an insulated gate bipolar transistor (IGBT). A P terminal, an N terminal, an O terminal, and a signal terminal are connected to the semiconductor switch. The collector electrode of the IGBT on the upper arm is connected to the P terminal. The emitter electrode of the IGBT on the lower arm is connected to the N terminal. The emitter electrode of the IGBT on the upper arm and the collector electrode of the IGBT on the lower arm are connected to the O terminal. In the inverter circuit, the P terminal is provided on the power line on the high potential side, and the N terminal is provided on the power line on the low potential side. The power line on the high potential side is connected to the positive pole of the DC power supply, and the power line on the low potential side is connected to the negative pole of the DC power supply.

The capacitor included in the inverter circuit is, for example, a smoothing capacitor. The smoothing capacitor smoothes the DC voltage supplied from the DC power source in the inverter circuit. The smoothing capacitor is connected in parallel to the DC power supply. The positive electrode of the smoothing capacitor is connected to a power line on the high potential side between the DC power supply and the arm circuit. On the other hand, the negative electrode of the smoothing capacitor is connected to a power line on the low potential side between the DC power supply and the power converter.

In addition to the inverter circuit, the power conversion device 10 includes a control circuit as a control section and a drive circuit as a drive section. The control circuit generates a drive command for operating the IGBT and outputs it to the drive circuit. The control circuit generates a drive command based on, for example, a torque request input from a host ECU and signals detected by various sensors. Various sensors include current sensors, rotation angle sensors, and voltage sensors. As a current sensor, there is a current sensor that detects a current flowing between an inverter circuit and an electric motor. This current sensor is provided for each of the U phase, V phase, and W phase. The control circuit outputs, for example, a PWM signal as a drive command. The control circuit includes a microcomputer.

The drive circuit is a driver that supplies a drive voltage to the gate of the IGBT based on a drive signal from the control circuit. The drive circuit drives the IGBT by applying a drive voltage. The power conversion device 10 has, for example, one drive circuit for one arm.

As shown in FIGS. 2 to 4, the power conversion device 10 includes a semiconductor module 15, a capacitor unit 16, a current sensor unit 17, a cooler 20, a control board 30, and a case 40. The semiconductor module 15, capacitor unit 16, current sensor unit 17, and control board 30 can be referred to as electrical components.

The semiconductor module 15 is configured to include a semiconductor element as a switching element forming a semiconductor switch. The semiconductor module 15 is formed into a flat shape as a whole, and the semiconductor module 15 can also be called a power module or a power card. The semiconductor module 15 has a module body that protects a semiconductor element, and a plurality of terminals protruding from the module body. The module body is made of resin or the like. The plurality of terminals of the semiconductor module 15 include a power terminal and a signal terminal. The power terminals include an input terminal electrically connected to a DC power source and an output terminal electrically connected to an electric motor. The signal terminal is electrically connected to the control circuit.

The capacitor unit 16 is configured to include a capacitor element forming a smoothing capacitor or the like. The capacitor unit 16 includes a unit body that protects a capacitor element, and a plurality of terminals protruding from the unit body. The unit main body has a sealing part in which the capacitor element is sealed with resin, and this sealing part is formed of, for example, a thermosetting resin such as epoxy resin.

The current sensor unit 17 includes a sensor element forming a current sensor. The current sensor unit 17 includes a unit body that protects a sensor element, and a plurality of terminals protruding from the unit body.

The cooler 20 cools the semiconductor module 15 using a coolant such as water. As shown in FIGS. 2 and 4, the cooler 20 has a heat exchange section 21, an introduction pipe section 22, and an exhaust pipe section 23. The heat exchange section 21, the introduction pipe section 22, and the discharge pipe section 23 are made of a metal material such as an aluminum material with excellent thermal conductivity. The cooler 20 has a flow path through which a refrigerant flows, and this flow path is provided in each of the heat exchange section 21, the introduction pipe section 22, and the discharge pipe section 23. In the cooler 20, the refrigerant introduced into the heat exchange section 21 through the introduction pipe section 22 is discharged from the heat exchange section 21 through the discharge pipe section 23.

The heat exchange section 21 performs heat exchange between the refrigerant and the semiconductor module 15. The refrigerant flowing through the flow path of the heat exchange section 21 cools the semiconductor module 15 via the heat exchange section 21 by absorbing the heat generated in the semiconductor module 15 via the heat exchange section 21 . The heat exchange section 21 exchanges heat between the refrigerant flowing inside itself and the outside of itself.

A plurality of heat exchange units 21 and semiconductor modules 15 are provided, and are arranged alternately. The heat exchange section 21 is formed in a flat shape similarly to the semiconductor module 15, and the heat exchange section 21 and the semiconductor module 15 are stacked in the thickness direction of each. Regarding each of the heat exchange section 21 and the semiconductor module 15, if a surface extending in a direction perpendicular to the thickness direction is referred to as a flat surface, the heat exchange section 21 and the semiconductor module 15 have their flat surfaces facing each other. are arranged in layers. The heat exchange units 21 adjacent to each other with the semiconductor module 15 in between achieve double-sided cooling in which both of the pair of flat surfaces of the semiconductor module 15 located between these heat exchange units 21 are cooled.

In the stacking direction in which the heat exchange parts 21 and the semiconductor modules 15 are arranged, the introduction pipe part 22 and the discharge pipe part 23 are both extended over the plurality of heat exchange parts 21 . The introduction pipe section 22 introduces the refrigerant into each heat exchange section 21 , and the discharge pipe section 23 discharges the refrigerant from each heat exchange section 21 . The introduction pipe section 22 has a connecting tube that connects adjacent heat exchange sections 21, and a plurality of these connecting tubes are arranged alternately with a plurality of heat exchange sections 21 in the stacking direction, so that the overall stacking is achieved. It is extended in the direction. Similarly, the discharge pipe section 23 has a connecting tube that connects adjacent heat exchange sections 21, and a plurality of these connecting tubes are arranged alternately with a plurality of heat exchange sections 21 in the stacking direction. The entire structure extends in the stacking direction.

In FIG. 3, the control board 30 is a circuit board such as a printed circuit board, and is formed into a rectangular plate shape. The control board 30 includes an insulating base material such as a glass epoxy board, and board wiring such as a wiring pattern provided on the insulating base material. A control circuit is mounted on the control board 30.

As shown in FIGS. 1 and 2, the case 40 has an overall cubic shape. The case 40 has an internal space, and electrical components such as the control board 30 are housed in this internal space. The case 40 has a flat and low profile so that its height is small. In this embodiment, the height direction of the case 40 is the Z direction, and the vertical and horizontal directions are the X direction and the Y direction. These X direction, Y direction, and Z direction are orthogonal to each other. In this case, the upper surface 41 and lower surface 42 of the case 40 extend in a direction perpendicular to the Z direction, and the outer wall surface 43 of the case 40 extends in a direction perpendicular to the X direction and the Y direction.

The case 40 includes a case body 45, an upper cover 48, and a lower cover 49. Both the case body 45 and the covers 48 and 49 are made of metal material. For example, the case body 45 and the covers 48 and 49 include parts molded by aluminum die casting. The case body 45 and the covers 48 and 49 are conductive and serve as ground members that are electrically grounded to the vehicle body or the like.

The case body 45 is formed into a flat rectangular tube shape as a whole. The case body 45 has a pair of openings, an upper opening 45a and a lower opening 45b. These openings 45a and 45b are arranged in the Z direction, and each opens the internal space of the case body 45 in the Z direction. The upper opening 45a is provided at the upper end of the case body 45 in the Z direction, and the lower opening 45b is provided at the lower end of the case body 45. Note that the upper opening 45a corresponds to the opening.

The covers 48 and 49 are formed into a plate shape as a whole, and are attached to the case body 45 so as to extend in a direction perpendicular to the Z direction. The upper cover 48 forms the upper surface 41 of the case 40, and the lower cover 49 forms the lower surface 42 of the case 40. The upper cover 48 covers the upper opening 45a, and the lower cover 49 covers the lower opening 45b. Both the upper cover 48 and the lower cover 49 form the inner surface of the case 40. In the case 40, the portion formed by the upper cover 48 can be referred to as an upper surface portion or a ceiling portion, and the portion formed by the lower cover 49 can be referred to as a lower surface portion or a floor portion. Note that the upper cover 48 corresponds to a cover body.

The case 40 has an upper screw 48a that fixes the upper cover 48 to the case body 45, and a lower screw 49a that fixes the lower cover 49 to the case body 45. The upper screws 48a are screwed onto the case body 45 while passing through the upper cover 48, and a plurality of upper screws 48a are arranged along the outer peripheral edge of the upper cover 48. The lower screws 49a pass through the lower cover 49 and are screwed onto the case body 45, and are arranged in plural along the outer peripheral edge of the lower cover 49.

A position near the outer peripheral end of the upper cover 48 is fixed to the case body 45 by an upper screw 48a, making it difficult to deform. On the other hand, in the upper cover 48, the central portion and the central portion are not fixed by the upper screws 48a. On the other hand, the upper cover 48 has a shape in which a central portion or a portion near the center bulges toward the side opposite to the lower cover 49. This makes it difficult for the upper cover 48 to deform in such a way that the central portion or central portion is concave or bulging in the Z direction.

As shown in FIGS. 5 and 6, the case main body 45 has a main body outer wall portion 51 and a main body support portion 52. As shown in FIGS. The main body outer wall portion 51 surrounds the internal space of the case 40 on all sides, and forms an outer wall surface 43 of the case 40 . The upper end of the main body outer wall 51 forms an upper opening 45a, and the lower end of the main body outer wall 51 forms a lower opening 45b. In the case 40, the portion formed by the main body outer wall portion 51 is an outer wall portion. In this embodiment, the main body outer wall portion 51 corresponds to the outer wall portion of the case 40.

As shown in FIG. 2, the main body support part 52 supports the control board 30 in the internal space of the case 40. The main body support part 52 is provided on the main body outer wall part 51. The main body support portion 52 extends from the inner wall surface of the main body outer wall portion 51 toward the inside of the case in a direction perpendicular to the Z direction. The main body support portion 52 partitions the internal space of the case 40 into sections in the Z direction. In the internal space of the case 40, the space between the main body support part 52 and the upper cover 48 is an upper space 40a, and the space between the main body support part 52 and the lower cover 49 is a lower space 40b. These spaces 40a and 40b are both flat spaces extending in a direction perpendicular to the Z direction. Note that the upper space 40a corresponds to a first space, and the lower space 40b corresponds to a second space.

As shown in FIGS. 2 and 4, the semiconductor module 15, the capacitor unit 16, the current sensor unit 17, and the heat exchange section 21 are housed in the lower space 40b of the case 40. These semiconductor module 15, capacitor unit 16, current sensor unit 17, and heat exchange section 21 are arranged side by side in a direction perpendicular to the Z direction. For example, the semiconductor module 15 and the heat exchange section 21 are arranged along the lower surface of the main body support section 52 with the X direction being the stacking direction. The introduction tube section 22 and the discharge tube section 23 both extend in the X direction along the lower surface of the main body support section 52 in the lower space 40b, and extend to the outside of the case by penetrating the main body outer wall section 51. In each of the introduction pipe part 22 and the discharge pipe part 23, the heat exchange parts 21 and the connection pipes arranged alternately are housed together with the heat exchange part 21 in the lower space 40b. Since the heat exchange section 21 is provided in the lower space 40b, it exchanges heat between the refrigerant flowing inside itself and the air in the lower space 40b outside the heat exchange section 21.

As shown in FIGS. 2 and 3, the control board 30 is housed in the upper space 40a of the case 40. The control board 30 extends in a direction perpendicular to the Z direction, like the upper cover 48 and the main body support part 52, and is fixed to the case main body 45. The control board 30 is smaller than the upper opening 45a in plan view, and is arranged at a position spaced from the main body outer wall 51 to the inside of the case. The control board 30 is located inside the case body 45 through the upper opening 45a. Specifically, the control board 30 is located between the upper opening 45a and the lower opening 45b of the case body 45 in the Z direction.

The control board 30 has a front surface 30a and a back surface 30b. The front surface 30a and the back surface 30b are a pair of plate surfaces, and extend in a direction perpendicular to the X direction. The front surface 30a faces the upper cover 48, and the back surface 30b faces the main body support part 52.

The control board 30 is placed on the main body support part 52 and is fixed to the main body support part 52 with a plurality of fastening screws 35 . The fastening screw 35 is a screw member that screws the control board 30 to the case body 45. The fastening screw 35 is one of the components constituting the power converter 10, and is made of a metal material. The fastening screws 35 pass through the control board 30 from the upper cover 48 side and are screwed to the main body support part 52, thereby fixing the control board 30 to the main body support part 52 of the case main body 45. The fastening screw 35 has conductivity, and is electrically grounded to the case body 45 by being in contact with the case body 45 by screwing. Since the fastening screw 35 is grounded in this way, noise from the control circuit and the like is easily emitted from the fastening screw 35, so that the noise resistance of the power converter 10 can be improved.

The fastening screws 35 are arranged near the outer peripheral edge of the control board 30 or near the center of the control board 30. For this reason, the control board 30 is less likely to be deformed in such a way that a portion near the outer peripheral edge or a portion near the center of the control board 30 is recessed or bulged in the Z direction. As described above, since the main body support part 52 and the control board 30 are arranged in the Z direction in a state where they face each other, the degree of freedom regarding the installation position of the fastening screw 35 is increased. Therefore, it is possible to arrange the fastening screws 35 at positions where deformation of the control board 30 is less likely to occur.

As shown in FIG. 7, the fastening screw 35 has a screw head 36 and a screw shaft portion 37. The screw head 36 is hooked onto the surface 30a of the control board 30, and protrudes from the surface 30a of the control board 30 toward the upper cover 48. The screw shaft portion 37 extends from the screw head 36 and passes through the control board 30. The threaded shaft portion 37 has a male threaded portion formed therein. The male screw portion extends from the tip of the screw shaft portion 37 toward the screw head 36.

A washer 38 is provided between the screw head 36 and the surface 30a. The washer 38 is a washer and is sandwiched between the screw head 36 and the control board 30. The washer 38 and the screw head 36 protrude from the surface 30a toward the upper cover 48. In the Z direction, the protrusion dimension H1 of the screw head 36 from the surface 30a is the distance between the top of the screw head 36 and the surface 30a. This protrusion dimension H1 is the sum of the thickness dimension of the screw head 36 and the thickness dimension of the washer 38 in the Z direction. Note that the fastening screw 35 and washer 38 constitute a fixing member, and the screw head 36 and washer 38 constitute a fixing protrusion.

The screw head 36 is spaced apart from the upper cover 48 toward the control board 30 side. At the position where the fastening screw 35 is installed, the protrusion dimension H1 of the screw head 36 is smaller than the distance between the control board 30 and the upper cover 48 in the Z direction.

The main body support portion 52 has a base portion 53, a receiving portion 54, a screw hole 55, and a base opening 56. The base portion 53 is formed into a plate shape as a whole, and partitions the upper space 40a and the lower space 40b while extending in a direction perpendicular to the Z direction. The outer peripheral end of the base portion 53 is connected to the inner wall surface of the main body outer wall portion 51 between the upper opening 45a and the lower opening 45b in the Z direction. The connecting portion between the base portion 53 and the main body outer wall portion 51 is located closer to the upper opening 45a than the lower opening 45b in the Z direction. Note that the base portion 53 corresponds to a partition portion.

A control board 30 is installed between the base portion 53 and the upper cover 48. In the control board 30, the front surface 30a faces the upper cover 48, and the back surface 30b faces the base portion 53. The control board 30 extends along each of the upper cover 48 and the base portion 53.

The receiving portion 54 is a protruding portion that protrudes from the base portion 53 toward the upper cover 48 . A plurality of receiving portions 54 are provided. The plurality of receiving parts 54 are arranged in a plurality in a direction perpendicular to the Z direction, which is the thickness direction of the base part 53. The receiving portion 54 supports the control board 30 from the back surface 30b side. The control board 30 is placed on the tip of the receiving portion 54 and is spaced apart from the base portion 53 toward the upper cover 48 side. The separation distance H4 between the control board 30 and the base portion 53 in the Z direction is the length of the protrusion of the receiving portion 54 from the base portion 53.

The screw shaft portion 37 of the fastening screw 35 is screwed into the screw hole 55 . The screw hole 55 is provided in the receiving part 54 and extends from the distal end surface of the receiving part 54 toward the base part 53. The screw hole 55 is a fixed portion to which the fastening screw 35 is fixed. In this embodiment, one screw hole 55 is provided in one receiving portion 54. However, a plurality of screw holes 55 may be provided in one receiving portion 54. Further, in this embodiment, the screw hole 55 does not penetrate the receiving portion 54 in the Z direction and does not reach the base portion 53. However, the screw hole 55 may penetrate the receiving portion 54 in the Z direction and reach the base portion 53.

The base opening 56 is a through hole or an opening provided in the base portion 53, and passes through the base portion 53 in the Z direction. A plurality of base openings 56 are provided in the base portion 53. Note that the base opening 56 corresponds to a partition hole.

On the control board 30, a front component 31a and back components 32a, 32b are mounted. These components 31a, 32a, and 32b are electronic and electrical components that constitute a control circuit together with board wiring and the like.

A plurality of front components 31a are mounted on the front surface 30a of the control board 30. Examples of the surface component 31a include electronic components such as a magnetic coupler and an ASIC (Application-Specific Integrated Circuit). The front component 31a is a low-profile component that is shorter than the screw head 36, and can also be referred to as a low-profile component. In the Z direction, the protrusion dimension H2 of the front part 31a from the surface 30a is smaller than the protrusion dimension H1 of the screw head 36. Although the respective protruding dimensions H2 of the plurality of front parts 31a are not necessarily the same, the protruding dimension H1 of the screw head 36 is larger than any of the protruding dimensions H2 of the plurality of front parts 31a. On the surface 30a, the screw head 36 protrudes more toward the upper cover 48 than any of the plurality of surface components 31a.

A plurality of back components 32a and 32b are mounted on the back surface 30b of the control board 30. Among the back components 32a and 32b, the low back component 32a is a low profile component that is shorter than the screw head 36. In the Z direction, a protrusion dimension H3a of the low-profile back component 32a from the back surface 30b is smaller than a protrusion dimension H1 of the screw head 36. Examples of the low-profile back component 32a include electronic components such as switching elements. Although the protruding dimensions H3a of the plurality of low-profile back components 32a are not necessarily the same, the protrusion dimension H1 of the screw head 36 is larger than any of the protruding dimensions H3a of the plurality of low-profile back components 32a. .

Among the back components 32a and 32b, the tall back component 32b is taller than the screw head 36. In the Z direction, the protrusion dimension H3b of the tall back part 32b from the back surface 30b is larger than the protrusion dimension H1 of the screw head 36. Examples of the high back component 32b include electronic components such as transformers, capacitors, and reactors, and electrical components such as connectors. The connector includes, for example, a connection terminal for connecting a control circuit to the semiconductor module 15, and a connection cable such as a harness is connected to the connector. Although the protruding dimensions H3b of the plurality of high-back back parts 32b are not necessarily the same, the protrusion dimension H1 of the screw head 36 is smaller than the protrusion dimension H3b of any of the plurality of high-back back parts 32b. . In this embodiment, a component having the same height as the screw head 36 is treated as a tall component.

When the protrusion dimension H3b of the tall back component 32b is larger than the separation distance H4 between the control board 30 and the base portion 53, the tall back component 32b is arranged at a position overlapping the base opening 56 in the Z direction. In this configuration, the tall back part 32b is in a state of being inserted into the base opening 56, so that the tall back part 32b and the base part 53 do not come into contact with each other.

Regarding the control board 30, the front surface 30a corresponds to the first mounting surface, and the back surface 30b corresponds to the second mounting surface. The front component 31a mounted on the front surface 30a corresponds to the first mounted component, and the tall back component 32b mounted on the back surface 30b corresponds to the second mounted component. Further, the control board 30 corresponds to a board.

Note that among the components mounted on the control board 30, components that have both a portion protruding from the front surface 30a and a portion protruding from the back surface 30b are treated as the front component 31a and the rear components 32a and 32b, respectively. . For example, when this component is handled as the front component 31a, the mounting surface of this component is the front surface 30a, and when this component is handled as the back components 32a and 32b, the mounting surface of this component is the back surface 30b. shall be.

Regarding the surface 30a, the plurality of fastening screws 35 include a fastening screw 35 provided around one surface component 31a. Moreover, this fastening screw 35 is provided inside the case rather than one front component 31a.

For example, as shown in FIG. 8, a fastening screw 35A shown as an example of the fastening screw 35 is provided around a front part 31aX shown as an example of the front part 31a. If the part of the main body outer wall 51 that is closest to the front component 31aX is referred to as a peripheral wall 51X, the front component 31aX is provided at a position closer to the fastening screw 35A between the peripheral wall 51X and the fastening screw 35A. . In this case, the distance L1 between the fastening screw 35A and the front component 31aX is smaller than the distance L2 between the front component 31aX and the peripheral wall 51X.

Further, the fastening screw 35A is provided on the inner side of the case than the front part 31aX. In this case, the fastening screw 35A is located further away from the main body outer wall portion 51 than the front component 31aX. For example, the separation distance L3 between the portion of the main body outer wall portion 51 closest to the fastening screw 35A and the fastening screw 35A is larger than the separation distance L2 between the peripheral wall portion 51X and the front component 31aX.

Regarding the back surface 30b, the plurality of fastening screws 35 include a fastening screw 35 provided around one tall back component 32b. For example, as shown in FIG. 8, a fastening screw 35A shown as an example of the fastening screw 35 is provided around a tall back part 32bY shown as an example of the tall back part 32b. If the part of the main body outer wall 51 that is closest to the high back component 32bY is referred to as the peripheral wall 51Y, the high back component 32bY is provided at a position closer to the fastening screw 35A between the peripheral wall 51Y and the fastening screw 35A. It is being In this case, the distance L4 between the fastening screw 35A and the high back component 32bY is smaller than the distance L5 between the high back component 32bY and the peripheral wall 51Y.

Note that FIG. 8 shows an example in which the fastening screws 35 provided around the front part 31aX and the fastening screws 35 provided around the tall back part 32bY are one fastening screw 35A. Note that the fastening screws 35 provided around the front component 31aX and the fastening screws 35 provided around the tall back component 32bY may be different.

Next, a method for manufacturing the power conversion device 10 will be described.

After manufacturing the case body 45 and the covers 48 and 49, the control board 30 with the front part 31a and the back parts 32a and 32b mounted thereon is installed inside the case body 45. Here, the control board 30 is placed on the main body support part 52 inside the case main body 45, and the control board 30 is fixed to the main body support part 52 with the fastening screws 35. Then, after the work of electrically connecting the semiconductor module 15 and the like installed inside the case body 45 and the control board 30 is completed, the work of attaching the upper cover 48 to the case body 45 is performed. When performing this work, inside the case body 45, the screw head 36 of the fastening screw 35 protrudes from the surface 30a of the control board 30 more than any of the front parts 31a. Therefore, even if the operator were to insert the upper cover 48 into the case body 45 through the upper opening 45a, the upper cover 48 would come into contact with the screw head 36 more easily than the front part 31a. There is. Therefore, the screw heads 36 prevent the upper cover 48 from coming into contact with the front component 31a when the upper cover 48 is attached.

Further, before the upper cover 48 is attached to the case body 45, there is a concern that tools may fall and enter the inside of the case body 45. Even in this case, since the screw head 36 protrudes beyond the front part 31a, a tool that has entered the inside of the case body 45 comes into contact with the screw head 36 more easily than the front part 31a. Therefore, the screw head 36 prevents the tool from coming into contact with the front part 31a.

According to this embodiment described so far, the protrusion dimension H1 of the screw head 36 is larger than the protrusion dimension H2 of any of the plurality of front components 31a. With this configuration, for example, when the upper cover 48 approaches the control board 30, the upper cover 48 comes into contact with the screw head 36 more easily than the front part 31a. For this reason, even if the shape and position of the top cover 48 are set so that the top cover 48 is placed as close as possible to the control board 30 in the Z direction, it is difficult to prevent the top cover 48 from coming into contact with the front component 31a. It can be regulated by Section 36. In this way, by realizing a configuration in which the upper cover 48 is unlikely to come into contact with the front component 31a, it becomes possible to make the upper space 40a and the case 40 thinner in the Z direction, and as a result, the case 40 can be made smaller. realizable.

A conceivable configuration for making the case 40 thinner in the Z direction is a configuration in which the thickness of the upper cover 48 is reduced in the Z direction. Examples of configurations in which the thickness of the upper cover 48 is reduced include a configuration in which the bulge of the upper cover 48 is reduced in the Z direction, a configuration in which ribs for reinforcing the upper cover 48 are made smaller in the Z direction, and a configuration in which the upper cover 48 is reduced in thickness in the Z direction. There is a configuration in which the thickness dimension of the plate material itself to be formed is reduced.

If a situation arises in which the upper cover 48 approaches the control board 30 after the power conversion device 10 is completed, the upper cover 48 should be moved so that the central part or the central part of the upper cover 48 is recessed toward the control board 30 due to its own weight. 48 may be deformed. Further, when a member such as a tool falls onto the upper cover 48, a part of the upper cover 48 may approach the control board 30 due to external force from this member. Further, when the vehicle collides with another vehicle while traveling, a portion of the upper cover 48 may approach the control board 30 as the vehicle deforms due to the collision.

Moreover, the fastening screws 35 are used to restrict contact of the upper cover 48 with the front part 31a. This increases the strength of the case body 45 necessary to support the control board 30 and the strength of the fastening screws 35 necessary to fix the control board 30 when the upper cover 48 approaches the control board 30. It can be used as strength to support the cover 48. Therefore, the case body 45 and the fastening screws 35 can prevent the upper cover 48 from becoming the front part 31a due to insufficient strength to support the upper cover 48. For example, in a configuration in which a dedicated component is provided to support the top cover 48 as it approaches the control board 30, due to insufficient strength of the dedicated component, the dedicated component cannot support the top cover 48 and deforms, causing the top cover 48 to become a front part. There is a concern that it may come into contact with 31a.

In the structure in which the upper cover 48 covers the upper opening 45a of the case main body 45, the upper screws 48a are arranged along the outer circumferential edge of the upper cover 48. It is thought that the closer part is easily deformed. In contrast, according to the present embodiment, the screw hole 55 into which the fastening screw 35 is screwed in the main body support portion 52 is arranged at a position spaced apart from the main body outer wall portion 51. For this reason, it becomes possible to arrange the fastening screw 35 at a position overlapping in the Z direction the central portion or central portion of the upper cover 48 that is easily deformed. Thereby, it is possible to enhance the effect of restricting the screw head 36 from contacting the center portion or the center-side portion of the upper cover 48 with the front component 31a.

Furthermore, the fact that the central portion or the central portion of the upper cover 48 is easily deformed means that the portion of the upper cover 48 that is farther from the main body outer wall portion 51 in the direction orthogonal to the Z direction is more likely to deform. On the other hand, according to this embodiment, as shown in FIG. 8, one fastening screw 35A is provided at a position farther from the main body outer wall portion 51 than one front component 31aX. Therefore, it is possible to arrange the fastening screw 35A at a position overlapping a portion of the upper cover 48 that is far from the main body outer wall portion 51. Therefore, the effect of restricting the portion of the upper cover 48 far from the main body outer wall portion 51 from contacting the front component 31aX by the fastening screw 35A can be enhanced.

According to this embodiment, a tall component that is taller than the screw head 36 is mounted on the back surface 30b of the control board 30 as a tall back component 32b. For this reason, for example, the control board 30 may be attached to the case body 45 by providing a dedicated component that is taller than the taller component on the surface 30a, or by using a dedicated screw member that has a screw head that is taller than the taller component. There is no need to fix it. In this case, even if a general-purpose screw member is used as the fastening screw 35, it is only necessary to arrange a tall component on the back surface 30b according to the size of the general-purpose screw member, so the upper cover 48 can be replaced with a general-purpose screw member. It can be placed as close as possible to the control board 30 depending on the size of the control board 30.

For example, when the vehicle is running, high-profile components that are taller than the screw head 36 are considered to be more susceptible to vibration than low-profile components that are shorter than the screw head 36. On the other hand, according to this embodiment, as shown in FIG. 8, one fastening screw 35A is provided at a position closer to one tall back component 32bY than to the main body outer wall portion 51. In this way, by arranging the fastening screw 35A as close as possible to the tall back part 32b, vibrations in the tall back part 32b can be suppressed by the fixing strength of the fastening screw 35A. In other words, the vibration resistance of the tall back component 32b can be improved. As a result, the fastening screw 35 can realize a configuration in which abnormalities in the high back part 32b and deterioration in operating accuracy due to vibrations are unlikely to occur.

According to this embodiment, a base opening 56 is provided in the base portion 53 of the main body support portion 52 . Therefore, even if the protrusion dimension H3b of the high-back back component 32b is larger than the separation distance H4 between the control board 30 and the base portion 53, by arranging the high-back back component 32b at a position where it enters the base opening 56, the height can be increased. The back part 32b can be mounted on the back surface 30b. In other words, the smaller the separation distance H4 between the control board 30 and the base part 53 is than the protrusion dimension H3b of the tall back component 32b, the closer the control board 30 can be placed to the base part 53 in the Z direction. . In this way, by arranging the control board 30 as close as possible to the base portion 53, the upper space 40a can be made thinner, and as a result, the case 40 can be made thinner.

Moreover, a heat exchange section 21 is provided in the lower space 40b. In this configuration, the tall back part 32b enters the lower space 40b through the base opening 56, so that the cooling effect of the heat exchange section 21 is easily applied to the tall back part 32b. In other words, the high back part 32b can be cooled by the heat exchange section 21. Therefore, even if the tall back component 32b is a heat generating component that generates heat as it is driven, the heat exchanger 21 can suppress the temperature of the tall back component 32b from increasing.

According to this embodiment, the screw head 36 of the fastening screw 35 is used as a component that protrudes more than any of the plurality of front components 31a on the front surface 30a of the control board 30. With this configuration, the protrusion dimension H1 of the screw head 36 from the surface 30a is less likely to vary from one fastening screw 35 to another. In particular, by using a general-purpose screw member as the fastening screw 35, it becomes easier to make the protrusion dimension H1 of the screw head 36 uniform. Therefore, it is possible to realize a configuration in which a situation in which a component mounted on the surface 30a unintentionally protrudes beyond the screw head 36 is unlikely to occur.

<Second embodiment>
In the first embodiment, the control board 30 is provided inside the case body 45, but in the second embodiment, the control board 30 is provided outside the case body 45. Configurations, operations, and effects not particularly described in this embodiment are the same as those in the first embodiment. This embodiment will be mainly described with respect to points that are different from the first embodiment.

As shown in FIG. 9, the upper cover 48 has a shape that bulges away from the case body 45. As shown in FIG. The upper space 40a of the case 40 is formed by the inner space of the upper cover 48 and the inner space of the case body 45. In this embodiment, the control board 30 is housed in the upper space 40a, which is the same as in the first embodiment, but unlike the first embodiment, the control board 30 is housed in the upper opening of the case body 45. It is provided outside of 45a. In this configuration, the receiving portion 54 of the main body support portion 52 protrudes outward from the upper opening 45a, and the control board 30 is placed on this receiving portion 54. Even with this configuration, when the upper cover 48 approaches the control board 30 in the Z direction, the screw heads 36 can prevent the upper cover 48 from coming into contact with the front component 31a.

Note that the case 40 may be formed by assembling the case body 45 and the upper cover 48. For example, the height of the case body 45 may or may not be larger than the height of the upper cover 48 in the Z direction. Further, the case 40 does not need to have the lower cover 49. For example, the case body 45 may have a lower surface portion that forms the lower surface 42 of the case 40.

<Other embodiments>
The disclosure in this specification is not limited to the illustrated embodiments. The disclosure includes the illustrated embodiments and variations thereon by those skilled in the art. For example, the disclosure is not limited to the combinations of parts and elements shown in the embodiments, and can be implemented with various modifications. The disclosure can be implemented in various combinations. The disclosure may have additional parts that can be added to the embodiments. The disclosure includes embodiments in which parts and elements of the embodiments are omitted. The disclosure encompasses any substitutions, or combinations of parts, elements between one embodiment and another. The disclosed technical scope is not limited to the description of the embodiments. The disclosed technical scope is indicated by the claims, and should be understood to include all changes within the meaning and scope equivalent to the claims.

In the control board 30, the low back component 32a and the high back component 32b may not be mounted on the back surface 30b. Of the front surface 30a and the back surface 30b, it is sufficient that the front part 31a is provided on at least the front surface 30a.

As long as the main body support part 52 extends from the main body outer wall part 51, the main body support part 52 does not need to have a shape that partitions the internal space of the case 40 into the upper space 40a and the lower space 40b. For example, the main body support portion 52 may be cantilevered by the main body outer wall portion 51. Further, the main body support portion 52 may not be supported on all four sides by the main body outer wall portion 51, but may be supported on two adjacent sides or two sides facing each other by the main body outer wall portion 51.

In the main body support part 52, the receiving part 54 does not need to protrude from the base part 53 toward the upper cover 48. For example, the control board 30 may be installed to overlap the base portion 53. Even in this configuration, if the base opening 56 is formed in the base portion 53, the back components 32a and 32b can be mounted on the back surface 30b of the control board 30.

The washer 38 may not be provided for the fastening screw 35. In this case, the fastening screw 35 corresponds to the fixing member, and the screw head 36 corresponds to the fixing protrusion. Further, the protrusion dimension H2 of the screw head 36 from the surface 30a is the same as the thickness dimension of the screw head 36.

The fixing member does not need to be a screw member such as the fastening screw 35. For example, the fixing member may be constituted by a bolt member. In this configuration, the fixing protrusion may be formed by a nut or a bolt shaft instead of the bolt head. Further, for example, the fixing member may be constituted by a member that does not have a threaded portion. In this configuration, the fixed part provided on the main body support part 52 is a recess, and a part of the fixing member passes through the control board 30 and fits into the recess.

The cooler 20 may be configured to cool the semiconductor module 15 on one side. The cooler 20 may not only have a structure in which it contacts the semiconductor module 15, but may also have a structure in which it thermally contacts the semiconductor module 15 via another member.

The cooler 20 may have any configuration as long as it cools the inside of the case 40. For example, the heat exchange section 21 may be provided at a position closer to the capacitor unit 16 and the tall back component 32b than to the semiconductor module 15.

The case 40 may be made of a material other than a metal material, such as a resin material. In a configuration where the case 40 is not made of metal, it is preferable that the case 40 has a metal shield layer that has a magnetic shielding function.

When the power conversion device 10 is mounted on a vehicle, the top surface 41 of the power conversion device 10 does not necessarily have to face upward. For example, the power converter 10 may be mounted on a vehicle with a portion of the outer wall surface 43 or the lower surface 42 facing upward.

Examples of vehicles equipped with the power converter 10 include passenger cars, buses, construction vehicles, and agricultural machinery vehicles. Further, the power conversion device 10 may be mounted on a train, an airplane, or the like. Examples of the power conversion device 10 include an inverter device and a converter device. Examples of this converter device include an AC input/DC output power supply device, a DC input/DC output power supply device, and an AC input/AC output power supply device.

DESCRIPTION OF SYMBOLS 10... Power conversion device, 21... Heat exchange part, 30... Control board as a board|substrate, 30a... Surface as a mounting surface and a 1st mounting surface, 30b... Back surface as a 2nd mounting surface, 31a, 31aX... Mounted components, and Front part as the first mounted part, 32b, 32bY... Back part as the second mounted part, 35, 35A... Fastening screw forming the fixing member, 36... Screw head forming the fixing protrusion, 38... Fixing member and a washer constituting a fixed protrusion, 40...case, 40a...upper space as a first space, 40b...lower space as a second space, 43...outer wall surface, 45...case body, 45a...as an opening Upper opening, 48... Upper cover as a cover body, 51... Main body outer wall part as an outer wall part, 52... Main body support part, 53... Base part as a partition part, 55... Screw hole as a fixed part, 56... Base opening as a partition hole, H1, H2, H3b...projection dimensions.

Claims (7)

A power conversion device (10) that performs power conversion,
a plate-shaped substrate (30);
a plurality of mounted components (31a, 31aX) mounted on a mounting surface (30a) that is one plate surface of the board;
A case (40) having a case body (45) in which an opening (45a) is formed, and a cover body (48) attached to the case body so as to cover the opening, and housing the substrate; ,
a fixing member (35, 35A, 38) fixing the board to the case body with the mounting surface facing the cover body;
Equipped with
The fixing member has a fixing protrusion (36) protruding from the mounting surface toward the cover body,
A protrusion dimension (H1) of the fixed protrusion from the mounting surface is larger than a protrusion dimension (H2) of any of the plurality of mounted components from the mounting surface,
The case body is
a main body outer wall portion (51) forming an outer wall surface (43) of the case;
a main body support part (52) extending from the main body outer wall and supporting the substrate;
a fixed part (55) provided in the main body support part at a position spaced from the main body outer wall part to the inside of the case, and to which the fixing member is fixed;
It has
A plurality of the fixing members are provided,
In the power conversion device, the plurality of fixing members include a fixing member (35A) provided at a position farther away from the main body outer wall than one of the mounting components (31aX). When the mounting component is a first mounting component (31a) and the mounting surface is a first mounting surface (30a),
A second mounting surface (30b) on the opposite side of the first mounting surface of the board includes second mounting components (32b, 32bY);
has been implemented,
The power converter according to claim 1 , wherein a protrusion dimension (H3b) of the second mounting component from the second mounting surface is larger than the protrusion dimension (H1) of the fixed protrusion from the first mounting surface. Device. The case body includes a partition portion (40b) that partitions the internal space of the case into a first space (40a) on the side of the cover body and a second space (40b) on the opposite side of the cover body via the first space. 53),
The first space accommodates the substrate,
The second space is provided with a heat exchange part (21) that exchanges heat between the refrigerant flowing inside the second space and the outside of the second space,
The power conversion device according to claim 2 , wherein the second mounted component enters the second space through a partition hole (56) provided in the partition section. A power conversion device (10) that performs power conversion,
a plate-shaped substrate (30);
a plurality of mounted components (31a, 31aX) mounted on a mounting surface (30a) that is one plate surface of the board;
A case (40) having a case body (45) in which an opening (45a) is formed, and a cover body (48) attached to the case body so as to cover the opening, and housing the substrate; ,
a fixing member (35, 35A, 38) fixing the board to the case body with the mounting surface facing the cover body;
Equipped with
The fixing member has a fixing protrusion (36) protruding from the mounting surface toward the cover body,
A protrusion dimension (H1) of the fixed protrusion from the mounting surface is larger than a protrusion dimension (H2) of any of the plurality of mounted components from the mounting surface,
When the mounting component is a first mounting component (31a) and the mounting surface is a first mounting surface (30a),
A second mounting surface (30b) on the opposite side of the first mounting surface of the board includes second mounting components (32b, 32bY);
has been implemented,
The protrusion dimension (H3b) of the second mounting component from the second mounting surface is larger than the protrusion dimension (H1) of the fixed protrusion from the first mounting surface,
The case body includes a partition portion (40b) that partitions the internal space of the case into a first space (40a) on the side of the cover body and a second space (40b) on the opposite side of the cover body via the first space. 53),
The first space accommodates the substrate,
The second space is provided with a heat exchange part (21) that exchanges heat between the refrigerant flowing inside the second space and the outside of the second space,
In the power conversion device, the second mounted component enters the second space through a partition hole (56) provided in the partition part . The case body is
a main body outer wall portion (51) forming an outer wall surface (43) of the case;
a main body support part (52) extending from the main body outer wall and supporting the substrate;
a fixed part (55) provided in the main body support part at a position spaced from the main body outer wall part to the inside of the case, and to which the fixing member is fixed;
The power conversion device according to claim 4 , comprising: The power converter according to any one of claims 2 to 5 , wherein the second mounting component (32bY) is provided at a position closer to the fixing member (35A) than the outer wall (51) of the case. Device. The fixing member is a screw member having a screw head (36) forming the fixing protrusion,
The power conversion device according to any one of claims 1 to 6 , wherein the protrusion dimension of the fixing protrusion from the mounting surface is the protrusion dimension of the screw head from the mounting surface.

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