WO2022145730A1 - Light-emitting diode reflector - Google Patents

Abstract

A light-emitting diode reflector of the present invention is formed from a thermoplastic resin composition comprising: about 100 parts by weight of a polyester resin including a repeating unit represented by chemical formula 1; about 5-40 parts by weight of a white pigment; about 5-30 parts by weight of glass fiber; about 0.1-3 parts by weight of a pentaerythritol diphosphite compound represented by chemical formula 2; and about 0.1-3 parts by weight of DOPO, wherein the weight ratio of the pentaerythritol diphosphite compound and the DOPO is about 1:0.2-1:5. The light-emitting diode reflector has excellent reflectivity, reflectivity retention rate, thin film formability, impact resistance, heat resistance, and property balances thereof.

Description

light emitting diode reflector

The present invention relates to a light emitting diode reflector. More specifically, the present invention relates to a light emitting diode reflector excellent in reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of these properties.

BACKGROUND ART Light emitting diodes (LEDs) and organic light emitting diodes (OLEDs) are rapidly replacing conventional light sources due to their excellent energy efficiency and long lifespan, and are in the spotlight. In general, the light emitting diode package (package) of the light emitting diode together with component materials such as a reflector, a reflector cup, a scrambler, and a housing to maximize light efficiency through high reflectivity. to form These component materials must be able to withstand high temperatures and minimize the decrease in whiteness due to reduced reflectance and yellowing.

As engineering plastics, polyester resins, copolymers thereof, blends thereof, etc. each exhibit useful properties and are applied to various fields including interior and exterior materials of products, and are also used as materials for light emitting diode reflectors and the like. The polyester resin mainly used for the light emitting diode reflector material is a high heat-resistant polyester resin such as an aromatic polyester resin. The high heat-resistant polyester resin does not deform at high temperatures and has excellent discoloration resistance, but has problems in that the crystallization rate is slow, mechanical strength is low, and impact resistance is poor.

In order to solve this problem, conventionally, an additive such as an inorganic filler is mixed with a polyester resin to improve impact resistance, rigidity, and the like. However, when an additive such as an inorganic filler is used in excess, there is a concern that a problem of lowering of moldability such as bleed-out may occur. In addition, in order to obtain a thermoplastic resin composition capable of realizing high reflectance, the content of white pigment, etc. must be increased. In this case, as white pigment and inorganic filler are added in excess, the impact resistance of the thermoplastic resin composition may be reduced There are concerns.

Therefore, it is necessary to develop a light emitting diode reflector (material) excellent in reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of these properties, which does not cause the above problems.

Background art of the present invention is disclosed in Korean Patent Laid-Open No. 10-2013-0076733 and the like.

An object of the present invention is to provide a light emitting diode reflector excellent in reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of physical properties thereof.

Another object of the present invention is to provide a semiconductor device including the light emitting diode reflector.

The above and other objects of the present invention can all be achieved by the present invention described below.

1. One aspect of the present invention relates to a light emitting diode reflector. The light emitting diode reflector may include: about 100 parts by weight of a polyester resin including a repeating unit represented by the following Chemical Formula 1; about 5 to about 40 parts by weight of a white pigment; about 5 to about 30 parts by weight of glass fiber; About 0.1 to about 3 parts by weight of a pentaerythritol diphosphite compound represented by the following formula (2); and DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) about 0.1 to about 3 parts by weight; formed from a thermoplastic resin composition comprising the pentaerythritol diphosphite compound and a weight ratio of the DOPO (pentaerythritol diphosphite compound:DOPO) of about 1:0.2 to about 1:5:

[Formula 1]

In Formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R ₁ and R ₃ are each independently a linear alkylene group having 1 to 10 carbon atoms, and R ₂ is a cyclic alkylene group having 5 to 12 carbon atoms;

[Formula 2]

In Formula 2, R ₄ and R ₅ are each independently a substituted or unsubstituted C 1 to C 10 alkyl group or a substituted or unsubstituted C 6 to C 20 aryl group.

2. In the first embodiment, the polyester resin may include a repeating unit represented by the following Chemical Formula 1a.

[Formula 1a]

3. In embodiment 1 or 2, the white pigment may include at least one of titanium oxide, zinc oxide, zinc sulfide, zinc sulfate, barium sulfate, calcium carbonate, and alumina.

4. In the above 1 to 3 embodiments, the weight ratio of the white pigment to the pentaerythritol diphosphite compound (white pigment: pentaerythritol diphosphite compound) may be about 15:1 to about 150:1.

5. In the above 1 to 4 embodiments, the light emitting diode reflector may have a reflectance of about 92 to about 99% with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm specimen measured according to ASTM E1331. .

6. In the above 1 to 5 embodiments, the light emitting diode reflector may have a reflectance retention calculated according to Equation 1 below about 99% or more:

[Equation 1]

Reflectance Retention (%) = 100 - {[(Rf ₀ - Rf ₁ ) / Rf ₀ ] × 100}

In Equation 1, Rf ₀ is the initial reflectance with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm size specimen measured according to ASTM E1331, and Rf ₁ is the specimen at 105° C., left for 500 hours. Then, it is the reflectance with respect to 450 nm wavelength light measured according to ASTM E1331.

7. In the above 1 to 6 embodiments, the thermoplastic resin composition is a spiral having a width of 15 mm and a thickness of 0.5 mm under the conditions of a molding temperature of 300° C., a mold temperature of 60° C., an injection pressure of 100 MPa and an injection speed of 100 mm/s. ), the length of the spiral flow of the specimen measured after injection molding in the mold may be about 85 to about 150 mm.

8. In the above embodiments 1 to 7, the light emitting diode reflector may have an unnotched Izod impact strength of about 20 to about 40 kgf·cm/cm of a 1/8″ thick specimen measured according to ASTM D4812.

9. In the above 1 to 8 embodiments, the light emitting diode reflector has a heat deflection temperature (HDT) of about 190 to about 270° C., measured under the conditions of a stress of 1.82 MPa and a temperature increase rate of 120° C./hr, according to ASTM D648. can

10. Another aspect of the present invention relates to a semiconductor device. The semiconductor device includes the light emitting diode reflectors according to the 1 to 9 embodiments.

The present invention has the effect of providing a light emitting diode reflector excellent in reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of physical properties thereof and a semiconductor device including the same.

1 is a cross-sectional view of a semiconductor device including a light emitting diode reflector according to an embodiment of the present invention.

Hereinafter, the present invention will be described in detail as follows.

A light emitting diode reflector according to the present invention is (A) a polyester resin; (B) white pigment; (C) fiberglass; (D) a pentaerythritol diphosphite compound; and (E) DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide);

In the present specification, "a to b" representing a numerical range is defined as "≥a and ≤b".

(A) polyester resin

The polyester resin according to an embodiment of the present invention is capable of improving the mechanical strength such as heat resistance, impact resistance, and rigidity of the thermoplastic resin composition even at high temperatures, and may include a repeating unit represented by the following formula (1).

[Formula 1]

In Formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R ₁ and R ₃ are each independently a linear alkylene group having 1 to 10 carbon atoms, and R ₂ is a cyclic alkylene group having 5 to 12 carbon atoms. Here, -R ₁ -R ₂ -R ₃ - is derived from an alicyclic diol, and may have 7 to 22 carbon atoms in total. The polyester resin includes a ring-shaped structure in the main chain and has a high melting temperature, and may be, for example, about 200° C. or higher, but is not limited thereto.

In an embodiment, the polyester resin may be prepared by a known polycondensation method of a dicarboxylic acid component including an aromatic dicarboxylic acid and derivatives thereof and a diol component including an alicyclic diol.

In an embodiment, the dicarboxylic acid component includes terephthalic acid, isophthalic acid, 1,2-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6 -naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7 -Naphthalenedicarboxylic acid and the like may be used, but is not limited thereto. These can be used individually or in mixture of 2 or more types.

In an embodiment, the alicyclic diol may include an alicyclic diol having 7 to 22 carbon atoms, for example, 1,4-cyclohexanedimethanol (CHDM), but is not limited thereto.

In an embodiment, the polyester resin may be a polycyclohexanedimethylene terephthalate (PCT) resin including a repeating unit represented by the following Chemical Formula 1a.

[Formula 1a]

In an embodiment, the polyester resin has a weight average molecular weight of about 3,000 to about 200,000 g/mol, for example, about 5,000, measured in a hexafluoroisopropanol (HFIP) solvent by gel permeation chromatography (GPC). to about 150,000 g/mol. In the above range, the thin film formability, impact resistance, and rigidity of the light emitting diode reflector may be excellent.

(B) white pigment

The white pigment according to an embodiment of the present invention is applied to the polyester resin together with glass fiber, pentaerythritol diphosphite compound, DOPO, etc. , a white pigment applied to a conventional light emitting diode reflector can be used without limitation as it can improve the balance of their physical properties. For example, titanium oxide, zinc oxide, zinc sulfide, zinc sulfate, barium sulfate, calcium carbonate, alumina, white lead (2PbCO ₃ ·Pb(OH) ₂ ), etc. are used alone or by mixing two or more types. can be used Specifically, titanium oxide (TiO ₂ ) having a crystal structure of a rutile type or a tetragonal system may be used.

In an embodiment, the average particle diameter (D50) of the white pigment may be about 0.01 to about 2 μm, for example, about 0.05 to about 0.7 μm. In the above range, the whiteness, reflectance, etc. of the thermoplastic resin composition for a light emitting diode reflector may be excellent. Here, the average particle diameter (D50) is the number average particle diameter measured with a particle size analyzer (Beckman Coulter, LS 13 320), and is a value specified by D50 (the particle diameter at the point where the distribution ratio is 50%).

In an embodiment, the white pigment may be surface-treated with an organic surface treatment agent or an inorganic surface treatment agent. The organic surface treatment agent may include, but is not limited to, a silane coupling agent, polydimethylsiloxane, trimethylolpropane (TMP), pentaerythritol, and combinations thereof. For example, as the silane coupling agent, vinyltriethoxysilane, 2-aminopropyltriethoxysilane, 2-glycidoxypropyltriethoxysilane, or the like may be used. In addition, as the inorganic surface treatment agent, aluminum oxide (alumina, Al ₂ O ₃ ), silicon dioxide (silica, SiO ₂ ), zirconia (zircon dioxide, ZrO ₂ ), sodium silicate, sodium aluminate, sodium aluminum silicate, zinc oxide , mica, etc. may be used, and two or more of them may be mixed and used. The organic surface treatment agent or inorganic surface treatment agent may be included in an amount of about 5 parts by weight or less based on about 100 parts by weight of the white pigment during the surface treatment. In the above range, the whiteness and reflectance of the light emitting diode reflector may be more excellent.

In an embodiment, the white pigment may be included in an amount of about 5 to about 40 parts by weight, for example, about 15 to about 40 parts by weight based on about 100 parts by weight of the polyester resin. When the content of the white pigment is less than about 5 parts by weight based on about 100 parts by weight of the polyester resin, there is a fear that the whiteness, reflectance, impact resistance, heat resistance, etc. of the light emitting diode reflector may decrease, and when it exceeds about 40 parts by weight , there is a possibility that the reflectance retention rate, thin film formability, etc. of the light emitting diode reflector may be deteriorated.

(C) Glass fiber

The glass fiber of the present invention is applied to the polyester resin together with a white pigment, pentaerythritol diphosphite compound, DOPO, etc. to balance the rigidity, reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and physical properties of the light emitting diode reflector. and the like, may include circular cross-sectional glass fibers, flat-shaped glass fibers, combinations thereof, and the like.

In an embodiment, the circular cross-section glass fiber may be a glass fiber having an average diameter of a circular cross-section measured with an optical microscope of about 5 to about 15 μm, for example, about 6 to about 12 μm. In the above range, the rigidity, reflectance, impact resistance, etc. of the thermoplastic resin composition for a light emitting diode reflector may be excellent.

In an embodiment, the flat glass fiber may have an aspect ratio of a cross section of about 1.5 to about 4, for example, about 2 to about 4, as measured by an optical microscope, and a minor diameter of about 6 to about 10 μm, for example, about 6 to about 9 μm. Within the above range, the thermoplastic resin composition for a light emitting diode reflector may have excellent impact resistance, reflectance, and the like.

In an embodiment, the glass fiber may have an average length of about 1 to about 5 mm before extrusion, and an average length of about 100 to about 700 μm after extrusion (processing), for example, about 110 to about 690 μm. . In the above range, the thermoplastic resin composition for a light emitting diode reflector may have excellent impact resistance, rigidity, appearance characteristics, and the like.

In an embodiment, the glass fiber coated with a surface treatment agent may be used in order to increase bonding strength with a polyester resin or the like. As the surface treatment agent, a silane-based compound, a urethane-based compound, or an epoxy-based compound may be used, but is not limited thereto.

In an embodiment, the glass fiber may be included in an amount of about 5 to about 30 parts by weight, for example, about 5 to about 25 parts by weight based on about 100 parts by weight of the polyester resin. When the content of the glass fiber is less than about 5 parts by weight based on about 100 parts by weight of the polyester resin, there is a risk that the impact resistance, heat resistance, rigidity, etc. of the light emitting diode reflector may decrease, and when it exceeds about 30 parts by weight, light emission There is a possibility that the reflectance retention of the diode reflector, thin film formability, and the like may decrease.

(D) Pentaerythritol diphosphite compound

The pentaerythritol diphosphite compound according to an embodiment of the present invention is applied to the polyester resin together with a white pigment, glass fiber, DOPO, etc. , heat resistance, balance of these physical properties, etc. can be improved, the pentaerythritol diphosphite compound represented by the following formula (2) can be used.

[Formula 2]

In Formula 2, R ₄ and R ₅ are each independently a substituted or unsubstituted C 1 to C 20 alkyl group or a substituted or unsubstituted C 6 to C 20 aryl group.

Here, the "substitution" means that a hydrogen atom is halogen, C ₁ to C ₂₀ alkyl, C ₁ to C ₂₀ haloalkyl, C ₆ to C ₂₀ aryl, C ₂ to C ₂₀ heteroaryl, combinations thereof, etc. It means substituted with a substituent.

In an embodiment, the pentaerythritol diphosphite compound is bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, tri(2,4-di-tert-butylphenyl)pentaerythritol phosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, combinations thereof, and the like.

In an embodiment, the pentaerythritol diphosphite compound may be included in an amount of about 0.1 to about 3 parts by weight, for example, about 0.2 to about 1 part by weight, based on about 100 parts by weight of the polyester resin. When the content of the pentaerythritol diphosphite compound is less than about 0.1 parts by weight based on about 100 parts by weight of the polyester resin, there is a fear that the reflectance retention rate and heat resistance of the light emitting diode reflector may decrease, and when it exceeds about 3 parts by weight, The reflectance, thin film formability, impact resistance, etc. of the light emitting diode reflector may be deteriorated.

In an embodiment, the weight ratio (B:D) of the white pigment (B) and the pentaerythritol diphosphite compound (D) is from about 15:1 to about 150:1, for example from about 25:1 to about 125:1 can be In the above range, the reflectance of the light emitting diode reflector, the reflectance retention rate, etc. may be more excellent.

(E) DOPO

DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) according to an embodiment of the present invention ) is applied to the polyester resin together with a white pigment, glass fiber, pentaerythritol diphosphite compound, etc. to improve the reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of these properties of the light emitting diode reflector. As such, it is possible to apply DOPO used in conventional thermoplastic resin compositions.

In an embodiment, the DOPO may be included in an amount of about 0.1 to about 3 parts by weight, for example, about 0.2 to about 1 part by weight, based on 100 parts by weight of the polyester resin. When the content of DOPO is less than about 0.1 parts by weight based on about 100 parts by weight of the polyester resin, there is a risk that the reflectance retention rate and thin film formability of the light emitting diode reflector may be deteriorated, and when it exceeds about 3 parts by weight, the light emitting diode There exists a possibility that the heat resistance of a reflector, etc. may fall.

In an embodiment, the weight ratio (D:E) of the pentaerythritol diphosphite compound (D) and the DOPO (E) is from about 1: 0.2 to about 1: 5, for example from about 1: 0.3 to about 1: 3 days. can When the weight ratio (D:E) is less than about 1: 0.2, there is a fear that the reflectance and reflectance retention of the light emitting diode reflector may be lowered, and when it exceeds about 1: 5, the reflectance retention of the light emitting diode reflector, heat resistance, etc. There is a risk of deterioration.

The thermoplastic resin composition according to one embodiment of the present invention may further include conventional additives according to the use within the range that does not impair the desired effect. Examples of the additive include antioxidants, flame retardants, flame retardant auxiliary agents, anti-drip agents, nucleating agents, mold release agents, antibacterial agents, surfactants, coupling agents, plasticizers, compatibilizers, lubricants, antistatic agents, combinations thereof, and the like, but are not limited thereto. does not

In an embodiment, when the additive is used, its content may be about 20 parts by weight or less, for example, about 0.1 to about 15 parts by weight based on about 100 parts by weight of the polyester resin, but is not limited thereto.

The thermoplastic resin composition according to an embodiment of the present invention may be prepared through a known method. For example, each component and, if necessary, additives are mixed with a Henschel mixer, V blender, tumbler blender, ribbon blender, etc., and melt-extruded at a temperature of about 250 to about 350° C. using a single screw extruder or twin screw extruder. It can be prepared in the form of pellets.

The light emitting diode reflector according to the present invention is formed from the thermoplastic resin composition. For example, by using the thermoplastic resin composition, a molded article may be manufactured by a known molding method such as injection molding, double injection molding, blow molding, extrusion molding, or thermoforming.

In an embodiment, the light emitting diode reflector has a reflectance of about 92 to about 99%, for example, about 94 to about 98, with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm specimen measured according to ASTM E1331. It can be %.

In an embodiment, the light emitting diode reflector may have a reflectance retention calculated according to Equation 1 below about 99% or more.

[Equation 1]

Reflectance Retention (%) = 100 - {[(Rf ₀ - Rf ₁ ) / Rf ₀ ] × 100}

In Equation 1, Rf ₀ is the initial reflectance with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm size specimen measured according to ASTM E1331, and Rf ₁ is the specimen at 105° C., left for 500 hours. Then, it is the reflectance with respect to 450 nm wavelength light measured according to ASTM E1331.

In an embodiment, the thermoplastic resin composition is injected in a spiral mold having a width of 15 mm and a thickness of 0.5 mm under the conditions of a molding temperature of 300° C., a mold temperature of 60° C., an injection pressure of 100 MPa and an injection speed of 100 mm/s. A spiral flow length of the specimen measured after molding may be about 85 to about 150 mm, for example, about 87 to about 120 mm.

In an embodiment, the light emitting diode reflector has an unnotched Izod impact strength of about 20 to about 40 kgf·cm/cm, for example, about 20 to about 35 kgf·· cm/cm.

In an embodiment, the light emitting diode reflector has a heat deflection temperature (HDT) of about 190 to about 270° C., for example 191 to 240, measured under the conditions of a stress of 1.82 MPa and a temperature increase rate of 120° C./hr according to ASTM D648 °C.

In a specific embodiment, the light emitting diode reflector is excellent in reflectance, reflectance retention, thin film moldability, impact resistance, heat resistance, balance of these properties, etc., so long as it is used for reflecting light, it can be applied without limitation. For example, it is useful as a reflection plate for light emitting devices such as parts of various electric and electronic products, indoor and outdoor lighting, automobile lighting, and display devices.

1 is a cross-sectional view of a semiconductor device including a light emitting diode reflector according to an embodiment of the present invention. 1, the light emitting diode reflector of the present invention may be formed into a cup-shaped reflector, and may be formed in various other forms. In the semiconductor device, an electrode 2 is formed on a substrate 3 , and a light emitting diode (LED) 6 is mounted on the electrode 2 . The light emitting diode LED 6 is connected to the electrode 2 via a wire 5 . The reflector 1 has a cup shape and has a recess so that the light emitting diodes LED 6 can be mounted thereon. The concave portion is sealed with a sealing resin (4) so that the light emitting diode (LED, 6) can be protected from the outside. The configuration is capable of various modifications and variations from these descriptions by those of ordinary skill in the art to which the present invention pertains.

Hereinafter, the present invention will be described in more detail through examples, but these examples are for illustrative purposes only and should not be construed as limiting the present invention.

Example

The specifications of each component used in the following Examples and Comparative Examples are as follows.

(A) polyester resin

Polycyclohexanedimethylene terephthalate resin (manufacturer: SK Chemicals, product name: Skypura 0502) was used.

(B) white pigment

Titanium oxide (TiO ₂ , manufacturer: Chemours, product name: R-103) was used.

(C) Glass fiber

A circular cross-section glass fiber (manufacturer: CPIC, product name: ECS303W) was used.

(D) phosphorus compounds

(D1) As the pentaerythritol diphosphite compound, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite (manufacturer: Adeka, product name: ADK STAB PEP-36) was used.

(D2) Triphenyl phosphate (manufacturer: ICL, product name: PHOSFLEX 31L) was used.

(E) DOPO compounds

(E1) DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, manufacturer: Pharmicell, product name: IDB-DPP) was used.

(E2) A DOPO derivative (3-hydroxyphenylphosphinyl propanoic acid, manufacturer: Pharmicell, product name: IDB-3-HPP) was used.

Examples 1 to 9 and Comparative Examples 1 to 12

After adding each of the components in the amounts as shown in Tables 1, 2 and 3 below, extrusion was performed at about 300° C. to prepare pellets (thermoplastic resin composition). For extrusion, a twin-screw extruder with L/D=36 and a diameter of 45 mm was used, and the prepared pellets were dried at about 100° C. for about 4 hours, and then a 6 oz injection machine (molding temperature: about 300° C., mold temperature: about 130° C.) ) to prepare a light emitting diode reflector specimen by injection. With respect to the prepared specimen, the physical properties were measured by the following method, and the results are shown in Tables 1, 2 and 3.

How to measure physical properties

(1) Reflectance (unit: %): According to ASTM E1331, measure the reflectance (using the SCI (specular component included) mode) of a 90 mm × 50 mm × 2.5 mm size specimen for 450 nm wavelength light (LED light source) did CM-3600d from Konica Minolta was used as a reflectance meter.

(2) Reflectance retention (unit: %): According to the following formula 1, the reflectance retention was calculated.

[Equation 1]

Reflectance Retention (%) = 100 - {[(Rf ₀ - Rf ₁ ) / Rf ₀ ] × 100}

In Equation 1, Rf ₀ is the initial reflectance with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm size specimen measured according to ASTM E1331, and Rf ₁ is the specimen at 105° C., left for 500 hours. Then, it is the reflectance with respect to 450 nm wavelength light measured according to ASTM E1331.

(3) Spiral flow length (unit: mm): The thermoplastic resin composition was subjected to a molding temperature of 320° C., a mold temperature of 60° C., an injection pressure of 100 MPa, and an injection speed of 100 mm/s, with a width of 15 mm and a thickness of 100 mm/s. Thin film moldability was evaluated by measuring the length of the spiral flow of the specimen measured after injection molding in a 0.5 mm spiral mold.

(4) Unnotched Izod impact strength (unit: kgf·cm/cm): According to ASTM D4812, the unnotched Izod impact strength of a 1/8″ thick specimen was measured.

(5) Heat deflection temperature (unit: °C): According to ASTM D648, the heat deflection temperature (HDT) was measured under the conditions of a stress of 1.82 MPa and a temperature increase rate of 120 °C/hr.

	Example
	One	2	3	4	5	6	7	8	9
(A) (parts by weight)	100	100	100	100	100	100	100	100	100
(B) (parts by weight)	15	25	40	25	25	25	25	25	25
(C) (parts by weight)	15	15	15	5	25	15	15	15	15
(D1) (parts by weight)	0.6	0.6	0.6	0.6	0.6	0.2	1.0	0.6	0.6
(D2) (parts by weight)	-	-	-	-	-	-	-	-	-
(E1) (parts by weight)	0.6	0.6	0.6	0.6	0.6	0.6	0.6	0.2	1.0
(E2) (parts by weight)	-	-	-	-	-	-	-	-	-
(initial) reflectance (%)	94.6	95.6	96.0	95.8	95.0	95.6	95.5	95.6	95.7
Reflectance Retention (%)	99.3	99.2	99.1	99.2	99.2	99.1	99.2	99.3	99.5
Spiral flow length (mm)	109	103	90	108	87	105	97	100	109
Unnotched Izod impact strength (kgf cm/cm)	25	27	30	21	34	26	26	27	28
Heat Deflection Temperature (℃)	200	210	218	200	235	206	221	214	192

	comparative example
	One	2	3	4	5	6
(A) (parts by weight)	100	100	100	100	100	100
(B) (parts by weight)	0.01	45	25	25	25	25
(C) (parts by weight)	15	15	0.01	33	15	15
(D1) (parts by weight)	0.6	0.6	0.6	0.6	0.07	6
(D2) (parts by weight)	-	-	-	-	-	-
(E1) (parts by weight)	0.6	0.6	0.6	0.6	0.6	0.6
(E2) (parts by weight)	-	-	-	-	-	-
(initial) reflectance (%)	65.1	96.3	96.0	94.6	95.5	92.4
Reflectance Retention (%)	99.4	98.7	98.9	98.9	98.5	99.5
Spiral flow length (mm)	130	79	112	76	104	84
Unnotched Izod impact strength (kgf cm/cm)	18	36	12	44	27	18
Heat Deflection Temperature (℃)	170	234	169	237	192	228

	comparative example
	7	8	9	10	11	12
(A) (parts by weight)	100	100	100	100	100	100
(B) (parts by weight)	25	25	25	25	25	25
(C) (parts by weight)	15	15	15	15	15	15
(D1) (parts by weight)	-	0.6	0.6	0.6	2.1	0.1
(D2) (parts by weight)	0.6	-	-	-	-	-
(E1) (parts by weight)	0.6	0.07	6	-	0.1	1.5
(E2) (parts by weight)	-	-	-	0.6	-	-
Weight ratio (D:E)	1:1	1:0.1	1:10	1:1	1:0.05	1:15
(initial) reflectance (%)	95.3	95.5	95.9	95.9	94.5	95.6
Reflectance Retention (%)	98.5	98.8	99.5	98.7	98.6	98.6
Spiral flow length (mm)	99	94	112	84	105	117
Unnotched Izod impact strength (kgf cm/cm)	30	25	26	26	28	27
Heat Deflection Temperature (℃)	182	215	181	200	240	176

From the above results, it can be seen that the light emitting diode reflector (thermoplastic resin composition) according to the present invention has excellent reflectance, reflectance retention, thin film formability, impact resistance, heat resistance, and balance of physical properties thereof.

On the other hand, when the white pigment is applied below the content range of the present invention (Comparative Example 1), it can be seen that the reflectance, impact resistance, heat resistance, etc. of the light emitting diode reflector are lowered, and the white pigment exceeds the content range of the present invention. When applied (Comparative Example 2), it can be seen that the reflectance retention rate and thin film formability of the light emitting diode reflector are deteriorated. When the glass fiber is applied below the content range of the present invention (Comparative Example 3), it can be seen that the impact resistance and heat resistance of the light emitting diode reflector are lowered, and when the glass fiber is applied in excess of the content range of the present invention ( In Comparative Example 4), it can be seen that the reflectance retention rate and thin film formability of the light emitting diode reflector are deteriorated. When the pentaerythritol diphosphite compound is applied below the content range of the present invention (Comparative Example 5), it can be seen that the reflectance retention of the light emitting diode reflector is lowered, and the pentaerythritol diphosphite compound is applied in excess of the content range of the present invention (Comparative Example 6), it can be seen that the thin film formability, impact resistance, etc. of the light emitting diode reflector are lowered, and when triphenyl phosphate (D2) is applied instead of the pentaerythritol diphosphite compound (Comparative Example 7), It can be seen that the reflectance retention rate and heat resistance of the light emitting diode reflector are lowered. When DOPO is applied below the content range of the present invention (Comparative Example 8), it can be seen that the reflectance retention of the light emitting diode reflector is lowered, and when DOPO is applied in excess of the content range of the present invention (Comparative Example 9), It can be seen that the heat resistance of the light emitting diode reflector is lowered, and when the DOPO derivative (E2) is used instead of DOPO (Comparative Example 10), it can be seen that the thin film formability of the light emitting diode reflector is lowered.

In addition, even if the contents of the pentaerythritol diphosphite compound and DOPO are within the scope of the present invention, the weight ratio (D1:E1) of the pentaerythritol diphosphite compound and DOPO is less than 1: 0.2 (1: 0.05) (Comparative Example 11) ), it can be seen that the reflectance retention rate of the light emitting diode reflector is lowered, and when it exceeds 1: 5 (1: 15) (Comparative Example 12), it can be seen that the reflectance retention rate, heat resistance, etc. of the light emitting diode reflector are lowered.

Up to now, the present invention has been mainly examined in the examples. Those of ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in modified forms without departing from the essential characteristics of the present invention. Therefore, the disclosed embodiments are to be considered in an illustrative rather than a restrictive sense. The scope of the present invention is indicated in the claims rather than the foregoing description, and all differences within the scope equivalent thereto should be construed as being included in the present invention.

Claims (10)

1. About 100 parts by weight of a polyester resin including a repeating unit represented by the following Chemical Formula 1;

   about 5 to about 40 parts by weight of a white pigment;

   about 5 to about 30 parts by weight of glass fiber;

   About 0.1 to about 3 parts by weight of a pentaerythritol diphosphite compound represented by the following Chemical Formula 2; and

   It is formed from a thermoplastic resin composition comprising; about 0.1 to about 3 parts by weight of DOPO (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide),

   A light emitting diode reflector, characterized in that the weight ratio of the pentaerythritol diphosphite compound and the DOPO (pentaerythritol diphosphite compound:DOPO) is from about 1:0.2 to about 1:5:

   [Formula 1]

   

   In Formula 1, Ar is an arylene group having 6 to 18 carbon atoms, R ₁ and R ₃ are each independently a linear alkylene group having 1 to 10 carbon atoms, and R ₂ is a cyclic alkylene group having 5 to 12 carbon atoms;

   [Formula 2]

   

   In Formula 2, R ₄ and R ₅ are each independently a substituted or unsubstituted C 1 to C 10 alkyl group or a substituted or unsubstituted C 6 to C 20 aryl group.
2. The light emitting diode reflector according to claim 1, wherein the polyester resin comprises a repeating unit represented by the following Chemical Formula 1a.

   [Formula 1a]

   
3. The light emitting diode reflector according to claim 1 or 2, wherein the white pigment comprises at least one of titanium oxide, zinc oxide, zinc sulfide, zinc sulfate, barium sulfate, calcium carbonate, and alumina.
4. 4. The method according to any one of claims 1 to 3, characterized in that the weight ratio of the white pigment and the pentaerythritol diphosphite compound (white pigment: pentaerythritol diphosphite compound) is from about 15:1 to about 150:1. light emitting diode reflector.
5. The light emitting diode reflector according to any one of claims 1 to 4, wherein the light emitting diode reflector has a reflectance of about 92 to about 99 with respect to a 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm specimen measured according to ASTM E1331. Light-emitting diode reflector, characterized in that %.
6. [Claim 6] The light emitting diode reflector according to any one of claims 1 to 5, wherein the light emitting diode reflector has a reflectance retention calculated according to Equation 1 below about 99%:

   [Equation 1]

   Reflectance Retention (%) = 100 - {[(Rf ₀ - Rf ₁ ) / Rf ₀ ] × 100}

   In Equation 1, Rf ₀ is the initial reflectance with respect to 450 nm wavelength light of a 90 mm × 50 mm × 2.5 mm size specimen measured according to ASTM E1331, and Rf ₁ is the specimen at 105° C., left for 500 hours. Then, it is the reflectance with respect to 450 nm wavelength light measured according to ASTM E1331.
7. The method according to any one of claims 1 to 6, wherein the thermoplastic resin composition has a width of 15 mm and a thickness of 0.5 mm under the conditions of a molding temperature of 300°C, a mold temperature of 60°C, an injection pressure of 100 MPa, and an injection speed of 100 mm/s. A light emitting diode reflector, characterized in that the length of the spiral flow of the specimen measured after injection molding in an in-spiral mold is about 85 to about 150 mm.
8. The method according to any one of claims 1 to 7, wherein the light emitting diode reflector has an unnotched Izod impact strength of about 20 to about 40 kgf·cm/cm of a 1/8″ thick specimen measured according to ASTM D4812. Light emitting diode reflector, characterized in that.
9. The method according to any one of claims 1 to 8, wherein the light emitting diode reflector has a heat deflection temperature (HDT) of about 190 to about 190 according to ASTM D648, measured under the conditions of a stress of 1.82 MPa and a temperature increase rate of 120°C/hr Light emitting diode reflector, characterized in that about 270 ℃.
10. A semiconductor device comprising the light emitting diode reflector according to any one of claims 1 to 9.

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