WO2022145399A1

WO2022145399A1 - Black matrix sheet, self-luminous display body, and method for manufacturing self-luminous display body

Info

Publication number: WO2022145399A1
Application number: PCT/JP2021/048431
Authority: WO
Inventors: 佳世下川; 明日香遠藤; 涼平大幡; 王彦吉松
Original assignee: 日東電工株式会社
Priority date: 2020-12-28
Filing date: 2021-12-24
Publication date: 2022-07-07
Also published as: TW202242455A

Abstract

The present invention relates to a black matrix sheet comprising a release sheet, and a black matrix layer containing a polymer component and a coloring agent, wherein the storage elastic modulus at 150°C of the black matrix layer is 1×103 to 1×106 Pa.

Description

A method for manufacturing a black matrix sheet, a self-luminous display body, and a self-luminous display body.

The present invention relates to a black matrix sheet, a self-luminous display body, and a method for manufacturing a self-luminous display body.

In recent years, a display using a light emitting diode (LED) as a self-luminous display has attracted attention. Among them, the micro LED display in which each pixel is composed of fine micro LED chips is a self-luminous display in which the micro LED chips are densely spread on the surface of the display substrate at intervals, and the manufacturing method is It has not been established and is under development.
Further, from the viewpoint of improving the optical performance such as the image quality of the self-luminous display, it is necessary to arrange a black matrix for shading that suppresses light leakage from between the micro LED chips on the display substrate.

For example, in Patent Document 1, a technique is studied in which a black matrix is formed at intervals between LED chips by using a thermosetting black ink between the LED chips after crimping the LED chips onto a substrate. Patent Document 1 describes an active energy ray-curable inkjet ink for a black matrix containing a black colorant, a polymerizable compound, and a photopolymerization initiator, wherein the polymerizable compound is an active energy ray-curable ink containing an amide monomer. Ink composition is described.
Further, Patent Document 2 describes a technique for transferring a sheet-like material onto a substrate.

On the other hand, Patent Document 3 describes a technique for transferring a functional layer to a target material by thermal transfer.

Japanese Patent Application Laid-Open No. 2019-2146697 Japanese Patent Application Laid-Open No. 2019-204905 Japanese Patent Application Laid-Open No. 2019-194016

However, in Patent Document 1, it takes a lot of man-hours, it is difficult to perform fine processing, and the yield is low, and a black matrix cannot be applied or formed on the pad portion on which the micro LED is mounted, which causes a problem in terms of optical characteristics. there were.
Further, in the technique described in Patent Document 2, an olefin-based resin type is used, and there is a problem in adhesion to a substrate. In the technique described in Patent Document 3, the light-shielding property and coloring required for black matrix applications have not been studied.

As described above, the conventional technique has a problem in terms of cost due to an increase in processes and a decrease in yield, and further improvement in productivity and optical characteristics has been required.

The present invention has been made in view of the above, and is a highly productive black matrix that has excellent light-shielding properties, improves optical characteristics, can reduce man-hours to form a black matrix layer, and can improve yield. The purpose is to provide a sheet. Another object of the present invention is to provide a self-luminous display body and a method for manufacturing a self-luminous display body using this black matrix sheet.

The present inventors have conducted diligent studies to solve the above problems. As a result, by providing a release sheet and a black matrix layer and making a black matrix sheet having a specific storage elastic modulus of the black matrix layer, excellent light-shielding property is improved, optical characteristics are improved, and man-hours are reduced. We have found that a highly productive black matrix sheet that can form a black matrix layer on the surface of a thermocompression bonding object and can improve the yield can be obtained, and has completed the present invention.

That is, the present invention is as follows.
[1]
A mold release sheet and a black matrix layer containing a polymer component and a colorant are provided.
A black matrix sheet having a storage elastic modulus of the black matrix layer at 150 ° C. of 1 × 10 ³ to 1 × 10 ⁶ Pa.
[2]
The black matrix sheet according to [1], wherein the release elastic modulus of the release sheet at 150 ° C. is 7 × 10 ⁶ to 2 × 10 ⁸ Pa.
[3]
The black matrix sheet according to [1] or [2], wherein the polymer component has a polar unit and a non-polar unit.
[4]
The black matrix sheet according to any one of [1] to [3], wherein the polymer component contains a polyamide resin.
[5]
The black matrix sheet according to any one of [1] to [4], wherein the colorant contains at least one selected from dyes and pigments.
[6]
The black matrix sheet according to any one of [1] to [5], wherein the colorant contains carbon black.
[7]
The black matrix sheet according to any one of [1] to [6], wherein the content of the colorant is 10 to 200 parts by mass with respect to 100 parts by mass of the polymer component.
[8]
The black matrix sheet according to any one of [1] to [6], wherein the thickness of the black matrix layer is 0.1 to 10 μm.
[9]
The black matrix sheet according to any one of [1] to [8], wherein the release sheet has a thickness of 10 to 200 μm.
[10]
The black matrix sheet according to any one of [1] to [9], wherein the total light transmittance is 0.01 or more and less than 5%.
[11]
A self-luminous display body including a black matrix layer and a self-luminous body.
The black matrix layer contains a polymer component and a colorant.
The storage elastic modulus of the black matrix layer at 150 ° C. is 1 × 10 ³ to 1 × 10 ⁶ Pa.
The polymer component has a polar unit and a non-polar unit.
Self-luminous display.
[12]
A self-luminous display body including a black matrix layer and a self-luminous body.
A self-luminous display body in which the black matrix layer does not exist on the surface of the self-luminous body and the black matrix layer is provided only around the self-luminous body.
[13]
The self-luminous display according to [11] or [12], wherein the self-luminous body is a micro LED chip.
[14]
[1] A method for manufacturing a self-luminous display body using the black matrix sheet according to any one of [10].
[15]
A method for manufacturing a self-luminous display using a black matrix sheet including a release sheet and a black matrix layer containing a polymer component and a colorant.
A method for manufacturing a self-luminous display body, which comprises the following steps (I) and (II).
(I) A step of transferring the black matrix layer by thermocompression bonding using the black matrix sheet to manufacture a self-luminous display body (II) A step of peeling off the release sheet.

According to the present invention, it is possible to provide a highly productive black matrix sheet which is excellent in light-shielding property, improves optical characteristics, can reduce man-hours to form a black matrix layer, and can realize an improvement in yield.

FIG. 1 is a schematic cross-sectional view showing an example of a black matrix sheet. FIG. 2 is a diagram illustrating a method for manufacturing a self-luminous display body according to an embodiment of the present invention, on a laminate including (a) a substrate, a TFT, an anisotropic conductive layer, and a pad. A state in which a black matrix sheet is arranged between the arranged micro LED chip and a heat pressurizing head, (b) a pad arranged on a laminate including a substrate, a TFT, an anisotropic conductive layer, and a pad. A state in which the micro LED chip is heat-bonded to, (c) a state in which the micro LED chip is mounted on the laminate by heat-bonding, and a black matrix layer is formed on the anisotropic conductive layer, (d) mold release. It is a figure for demonstrating the state which the sheet is peeled off, and the self-luminous surface type display body is formed. FIG. 3 is a diagram illustrating a method for manufacturing a self-luminous display body according to an embodiment of the present invention, on a laminate including (a) a substrate, a TFT, an anisotropic conductive layer, and a pad. A state in which a black matrix sheet is arranged between the arranged micro LED chip and the heat pressurizing head, (b) the substrate, the TFT, the anisotropic conductive layer, and the pad are included using the heat pressurizing head. In a state where the micro LED chip is heat-bonded to the pad arranged on the laminate, (c) the micro LED chip is mounted on the laminate by heat-bonding, and a black matrix layer is formed on the anisotropic conductive layer. It is a figure for demonstrating the state, (d) the state which the release sheet was peeled off, and the self-luminous table type display body was formed. FIG. 4 is a schematic cross-sectional view showing an example of a self-luminous display body according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail. In the following, for convenience of explanation, only preferred embodiments of the present invention are shown, but of course, this is not intended to limit the present invention.
In the following description, the black matrix layer transferred from the black matrix sheet onto the surface of the thermocompression bonding object may be referred to as a “transfer black matrix layer”.

The black matrix sheet according to the embodiment of the present invention includes a release sheet and a black matrix layer containing a polymer component and a colorant.
The storage elastic modulus of the black matrix layer at 150 ° C. is 1 × 10 ³ to 1 × 10 ⁶ Pa.

As shown in FIG. 1, the black matrix sheet 10 according to the embodiment of the present invention is a laminate of the release sheet 11 and the black matrix layer 12.

The black matrix sheet according to the embodiment of the present invention has excellent mold releasability because it is provided with a mold releasable sheet. It can be used as a heat-resistant release sheet that is placed between the pressure head and the thermocompression bonding object to prevent them from sticking together. Since the black matrix layer having a storage elastic modulus at 150 ° C. of 1 × 10 ³ to 1 × 10 ⁶ Pa is provided, the black matrix layer is melted during thermocompression bonding and transferred to the surface of the thermocompression bonding object to transfer black. A matrix layer can be formed.

The thermocompression bonding object is, for example, an electronic component such as a substrate, a semiconductor chip, or a self-luminous body. The black matrix sheet can be used, for example, for manufacturing semiconductor chips by thermocompression bonding, mounting flip chips, connecting electronic components such as self-luminous bodies, and the like.
Among them, it can be preferably used for forming a black matrix layer in a self-luminous display body including a self-luminous body.

When the object to be thermocompression bonded is a substrate and fine chip parts such as a self-luminous body, a black matrix sheet is placed between the heat-pressurized head and the chip component when the chip component is thermocompression bonded to the substrate or substrate mask. By thermocompression bonding, chip components can be mounted and a black matrix layer can be formed on the substrate and the substrate mask. For example, when a thermocompression bonding head is used for thermocompression bonding, the black matrix layer between the thermocompression bonding head and the chip component melts during thermocompression bonding and flows onto the substrate and the substrate mask to solidify. Therefore, the residue of the transfer black matrix layer is unlikely to remain on the chip component.
Since the black matrix layer can be formed at the time of thermocompression bonding between the substrate and the chip component instead of applying ink or the like on the surface of the substrate, there is no need to separately provide a process for forming the black matrix layer. It is possible to form a black matrix layer even in a fine place such as an interval between chip parts, which was difficult to apply. Therefore, it is possible to suppress a decrease in yield and form a black matrix layer having high productivity and excellent optical characteristics.

[Black matrix layer]
In the black matrix sheet according to the embodiment of the present invention, the storage elastic modulus of the black matrix layer at 150 ° C. is 1 × 10 ³ to 1 × 10 ⁶ Pa.
By setting the storage elastic modulus of the black matrix layer at 150 ° C. to 1 × 10 ³ Pa or more, the thickness uniformity of the transferred black matrix layer was improved. Further, by setting the storage elastic modulus of the black matrix layer at 150 ° C. to 1 × 10 ⁶ Pa or less, the residue of the transferred black matrix layer on the chip component is reduced, and it is possible to improve the productivity and the optical characteristics. became.
The storage elastic modulus of the black matrix layer at 150 ° C. is preferably 1 × 10 ⁶ Pa or less, more preferably 5 × 10 ⁵ Pa or less, and further preferably 1 × 10 ⁵ Pa or less. Further, it is preferably 1 × 10 ³ Pa or more, more preferably 3 × 10 ³ Pa or more, and further preferably 5 × 10 ³ Pa or more.
When the storage elastic modulus of the black matrix layer at 150 ° C. exceeds 1 × 10 ⁶ Pa, the residue generation rate of the transferred black matrix layer on the chip component increases and the productivity decreases. Further, if the storage elastic modulus at 150 ° C. is less than 1 × 10 ³ Pa, the uniformity of the thickness of the transfer black matrix layer of the substrate mask portion is impaired, and when applied to a self-luminous display or the like, the optical characteristics are improved. Inferior visibility is reduced.

The storage elastic modulus of the black matrix layer refers to the storage elastic modulus measured by the following method using a laminated product in which a resin material (black matrix layer) constituting a measurement target portion is laminated to 500 μm as a measurement sample. Specifically, the laminated product is cut to a diameter of 25 mm to prepare a test piece. Using a jig with a diameter of 25 mm, temperature dispersion at 25 to 200 ° C. is carried out with a viscoelastic device ARES-G2 manufactured by TA Instruments. At that time, the rate of temperature rise is 5 ° C./min, the frequency is 1 Hz, and the elastic modulus at 150 ° C. at this time is defined as the storage elastic modulus.

The black matrix layer according to the embodiment of the present invention contains a polymer component and a colorant.

The polymer component contained in the black matrix layer (which may be the material of the black matrix layer) preferably has a non-polar unit and a polar unit. The polar unit comprises a polar group.
Due to the polymer component having polar and non-polar units, the transferred black matrix layer exhibits excellent adhesion to the surface of the thermocompression bonding object.
The content of the polymer component in the black matrix layer is preferably 20% by mass to 99% by mass, more preferably 30% by mass to 95% by mass, and further preferably 40% by mass to 93% by mass. Particularly preferably, it is 50% by mass to 90% by mass, and most preferably 60% by mass to 88% by mass.

Examples of the non-polar unit in the polymer component include a polyethylene unit, a polypropylene unit, a polystyrene unit and the like. The non-polar unit may be only one type or two or more types.

Examples of the polar group included in the polar unit in the polymer component include an epoxy group, a carboxyl group, a nitrile group, an amide group, an ester group, a hydroxyl group, an acid anhydride and a silanol group. Examples of the polar unit having such a polar group include a glycidyl methacrylate unit, a vinyl acetate unit, an acrylonitrile unit, an amide unit, a (meth) acrylic acid ester unit, a hydroxyethyl (meth) acrylate unit, and a maleic anhydride unit. Can be mentioned. The polar unit may be of only one type or may be two or more types.

The polymer component that can be contained in the black matrix layer (which may be the material of the black matrix layer) is selected from at least an amide group-containing polymer, a methoxymethyl group-containing polymer, a hydroxyl group-containing polymer, a carboxyl group-containing polymer, and an amino group-containing polymer. It may be one kind.

Such a polymer component, which may be contained in the black matrix layer (which may be the material of the black matrix layer), is preferably an addition-type curing agent, and more preferably an addition-type curing agent that reacts with an epoxy group. ..

Examples of the amide group-containing polymer include polyamide resins. The polymer component preferably contains a polyamide resin.
As the amide group-containing polymer, a commercially available product may be adopted. Examples of such commercially available products include the "Amiran" series (Toray Industries, Inc.).
The amide group-containing polymer may be one kind or two or more kinds.

The weight average molecular weight (Mw) of the amide group-containing polymer is preferably 10,000 to 200,000, more preferably 20,000 to 100,000 in that the effect of the present invention can be more exhibited.

Examples of the methoxymethyl group-containing polymer include methoxymethylated polyamide resin and the like.
As the methoxymethyl group-containing polymer, a commercially available product may be adopted. Examples of such commercially available products include the "Fine Resin" (registered trademark) series (manufactured by Namariichi Co., Ltd.).
The methoxymethyl group-containing polymer may be one kind or two or more kinds.

The weight average molecular weight (Mw) of the methoxymethyl group-containing polymer is preferably 10,000 to 200,000, more preferably 20,000 to 150,000, and further preferably 30,000 to 30,000 in that the effects of the present invention can be more exhibited. It is 100,000.

Examples of the hydroxyl group-containing polymer include hydroxyl group-containing acrylic polymers.
As the hydroxyl group-containing polymer, a commercially available product may be adopted. Examples of such commercially available products include "ARUFON (registered trademark) UH-2000 series" (manufactured by Toagosei Corporation).
The hydroxyl group-containing polymer may be one kind or two or more kinds.

The hydroxyl group-containing polymer has a weight average molecular weight (Mw) of preferably 500 to 1,000,000, more preferably 700 to 500,000, still more preferably 1,000 to 100,000 in that the effect of the present invention can be more exhibited. It is particularly preferably 1500 to 70,000, and most preferably 2000 to 50,000.

Examples of the carboxyl group-containing polymer include a carboxyl group-containing acrylic polymer.
As the carboxyl group-containing polymer, a commercially available product may be adopted. Examples of such a commercially available product include "ARUFON (registered trademark) UC-3000 series" (manufactured by Toagosei Co., Ltd.).
The carboxyl group-containing polymer may be one kind or two or more kinds.

The weight average molecular weight (Mw) of the carboxyl group-containing polymer is preferably 500 to 1,000,000, more preferably 700 to 500,000, still more preferably 1,000 to 100,000 in that the effect of the present invention can be more exhibited. It is particularly preferably 1500 to 70,000, and most preferably 2000 to 50,000. As the weight average molecular weight (Mw), the polystyrene-equivalent molecular weight in the GPC measurement can be used.

As the amino group-containing polymer, any suitable polymer can be adopted as long as it is a polymer containing an amino group (-NH ₂ ), as long as the effect of the present invention is not impaired.
As the amino group-containing polymer, a commercially available product may be adopted.
The amino group-containing polymer may be one kind or two or more kinds.
The black matrix layer (which may be the material of the black matrix layer) may contain at least one selected from a tertiary amine-containing compound and a strong acid.

Such a tertiary amine-containing compound or strong acid that can be contained in the black matrix layer (which may be the material of the black matrix layer) is preferably a catalytic curing agent, and more preferably a catalyst that reacts with an epoxy group. It is a mold curing agent.

Examples of the tertiary amine-containing compound include imidazole derivatives and polyethyleneimine.
As the tertiary amine-containing compound, a commercially available product may be adopted. Examples of such commercially available products include the "Curesol" series (imidazole-based epoxy resin curing agent, manufactured by Shikoku Chemicals Corporation) as an imidazole derivative, and the "Epomin" (registered trademark) series as a polyethyleneimine. (Manufactured by Nippon Shokubai Co., Ltd.) and the like.
The tertiary amine-containing compound may be one kind or two or more kinds.

Examples of the strong acid include trifluoroborane, ionic liquid, naphthion and the like.
Examples of the ionic liquid include BF ₃ -C ₂ H ₅ NH ₂ , HMI (1-hexyl-3 methylimidazolium) -PF ₆ .
As the strong acid, a commercially available product may be adopted.
The strong acid may be one kind or two or more kinds.

Examples of the colorant include coloring materials such as dyes and pigments, and it is preferable that the colorant contains at least one selected from dyes and pigments.

Examples of the dyes include azo dyes, anthraquinone dyes, quinonephthalone dyes, styryl dyes, diphenylmethane dyes, triphenylmethane dyes, oxazine dyes, triazine dyes, xanthane dyes, methane dyes, and azomethine dyes. Examples thereof include dyes, acridin-based dyes, diazine-based dyes, phthalocyanine-based dyes, and preferably azo-based dyes and phthalocyanine-based dyes.

Further, as the dye, a commercially available product can be used, and specific examples thereof include the Varifast series (manufactured by Orient Chemical Industry Co., Ltd.).

Pigments include, for example, zinc carbonate, zinc oxide, zinc sulfide, talc, kaolin, calcium carbonate, titanium oxide, silica, lithium fluoride, calcium fluoride, barium sulfate, alumina, zirconia, iron oxide, iron hydroxide, etc. Inorganic pigments such as chromium oxide, calcium phosphate, bone black, graphite and iron black, for example, organic pigments such as carbon black, acetylene black, lamp black, aniline black and cyanine black can be mentioned.

Further, as the pigment, a commercially available product can be used. Specifically, the carbon black dispersion liquid No. 1 manufactured by Mikuni Color Co., Ltd. 3684, No. 3685, MHI Black # 217 and the like can be mentioned.

As the colorant, a color material that exhibits black color by itself may be used, or a color material that exhibits black color by mixing a plurality of color materials such as red, green, and blue may be used.

The colorants can be used alone or in combination of two or more.
Examples of the colorant that can be used alone include carbon black, acetylene black, lamp black, bone black, graphite, iron black, aniline black, cyanine black and the like.

The colorant according to the embodiment of the present invention preferably contains carbon black.

The average particle size of the colorant is preferably 1000 nm or less, more preferably 500 nm or less, still more preferably 300 nm or less from the viewpoint of surface smoothness of the transferred black matrix layer, and preferably 10 nm from the viewpoint of light shielding property. As mentioned above, it is more preferably 30 nm or more, still more preferably 50 nm or more.

The blending ratio of the colorant is appropriately selected in consideration of dispersion uniformity, and specifically, from the viewpoint of transmittance, it is preferably 200 parts by mass or less, more preferably 100 parts by mass with respect to 100 parts by mass of the polymer component. Hereinafter, it is more preferably 80 parts by mass or less, preferably 5 parts by mass or more, more preferably 10 parts by mass or more, still more preferably 15 parts by mass or more.

In the black matrix sheet according to the embodiment of the present invention, the black matrix layer preferably has an average thickness of 0.1 to 10 μm.
The average thickness of the black matrix layer is more preferably 0.1 μm or more, still more preferably 0.5 μm or more, from the viewpoint of improving the light-shielding property. Further, from the viewpoint of improving the visibility after transfer, it is more preferably 10 μm or less, still more preferably 5 μm or less.
For the thickness of the black matrix layer, measure the thickness of the black matrix sheet with a dial thickness gauge (for example, Peacock GC-9), measure the thickness of the release sheet from which the black matrix layer has been removed, and measure the difference in black. It can be measured as the thickness of the matrix layer.
The average thickness of the black matrix layer is an average value measured at 10 points.

In the black matrix sheet according to the embodiment of the present invention, the total light transmittance of the black matrix layer is preferably 0.01 or more and less than 5%.
Further, in the black matrix sheet according to the embodiment of the present invention, the black matrix layer has a thickness of 0.1 to 10 μm, and the total light transmittance of the black matrix sheet is 0.01 or more 5 from the viewpoint of improving the light shielding property. It is preferably less than%. In the embodiment of the present invention, the total light transmittance of the black matrix sheet when the thickness of the black matrix layer is 10 μm or less is preferably less than 5%, more preferably 3% or less, still more preferably 1% or less, still more. It is preferably 0.5% or less, and particularly preferably 0.3% or less.

[Release sheet]
The black matrix sheet according to the embodiment of the present invention includes a release sheet and the black matrix layer.
By including the release sheet, the black matrix sheet is used to thermocompression-bond the chip component to the substrate and transfer black matrix in the same manner as the release sheet is used when the chip component is thermocompression-bonded to the substrate. Layers can be formed.

The release sheet preferably has a melting point of 150 ° C. or higher, and a storage elastic modulus at 150 ° C. of 1 GPa or less.
The storage elastic modulus of the release sheet at 150 ° C. is preferably 7 × 10 ⁶ to 2 × 10 ⁸ Pa. The storage elastic modulus of the release sheet at 150 ° C. is preferably 1.5 × 10 ⁸ Pa or less, more preferably 1.2 × 10 ⁸ Pa or less, and further preferably 1 × 10 ⁸ Pa or less. .. Further, it is preferably 8 × 10 ⁶ Pa or more, more preferably 9 × 10 ⁶ Pa or more, and further preferably 1 × 10 ⁷ Pa or more.

The storage elastic modulus of the release sheet refers to the storage elastic modulus measured by the following method using the release sheet as a measurement sample. Specifically, the release sheet is cut into strips having a length of 10 mm (measurement length) x width of 5 mm with a cutter knife, and a solid viscoelasticity measuring device (RSAIII, manufactured by TA Instruments Co., Ltd.) is used at 25 ° C. The storage elastic modulus at ~ 500 ° C. is measured. The measurement conditions were a frequency of 1 Hz and a heating rate of 5 ° C./min. At this time, the elastic modulus at 150 ° C. is defined as the storage elastic modulus (Pa) of the release sheet.

By setting the storage elastic modulus of the release sheet at 150 ° C. within the above range, it is possible to suppress the generation of air bubbles in the black matrix layer caused by air being caught in the step between the chip and the substrate, and it is possible to follow the step. A black matrix sheet having excellent properties can be obtained.
From the viewpoint of heat resistance, the melting point of the release sheet is more preferably 180 ° C. or higher, still more preferably 200 ° C. or higher. Further, since it is sufficient to have heat resistance at a temperature corresponding to the molding processing temperature, it is preferably 500 ° C. or lower, more preferably 450 ° C. or lower, and further preferably 430 ° C. or lower.

As the above-mentioned release sheet, a commercially available product may be adopted, for example, a fluororesin sheet film (manufactured by Nitto Denko, Nitoflon), a polyester resin sheet, a polymethylpentene resin sheet (manufactured by Mitsui Chemicals Tosero, Opulan (registered trademark)). )), Polystyrene resin sheet (manufactured by Kurabo, Oydis (registered trademark)) and the like.
From the viewpoint of handleability and processability, the thickness of the release sheet is preferably 10 μm or more, more preferably 15 μm or more, further preferably 20 μm or more, and particularly preferably 30 μm or more. Further, it is preferably 200 μm or less, more preferably 100 μm or less, in order to obtain a black matrix sheet that easily develops curved surface followability and step followability and can be applied to a member having a complicated three-dimensional curved surface shape. It is more preferably 80 μm or less, and even more preferably 70 μm or less.

[Manufacturing of black matrix sheet]
The black matrix sheet can be manufactured by any suitable method. For example, a method of dipping the release sheet into a solution containing the material and solvent of the black matrix layer and then drying as necessary, the material and solvent of the black matrix layer on the surface of the release sheet. A method of brushing the containing solution and then drying as needed, a method of applying the black matrix layer material to the surface of the release sheet with various coaters of the solution containing the solvent and then drying as needed, the release sheet. Examples thereof include a method of spray-applying a solution containing the material of the black matrix layer and a solvent to the surface of the surface and then drying as necessary.

Examples of the black matrix composition include a solution in which the material of the black matrix layer is dissolved in a solvent.
Solvents include, for example, alcohols such as water, methanol, ethanol and isopropyl alcohol; ketones such as methyl ethyl ketone; esters; aliphatic, alicyclic and aromatic hydrocarbons; halogenated hydrocarbons; amides such as dimethylformamide. Classes; sulfoxides such as dimethyl sulfoxide; ethers such as dimethyl ether and tetrahydrofuran; and the like; in order to suppress the formation of gelled products, ethanol or a mixed solvent of ethanol and water is preferable. The solvent may be only one kind or two or more kinds.

The solid content concentration in the black matrix composition can be appropriately set according to the purpose. From the viewpoint of the thickness accuracy of the black matrix layer, the mass ratio is preferably 1% by mass to 50% by mass, more preferably 5% by mass to 30% by mass, and further preferably 10% by mass to 25% by mass. be.

Black matrix compositions may include pH regulators, cross-linking agents, viscosity regulators (thickeners, etc.), leveling agents, release regulators, plasticizers, softeners, fillers, colorants (pigments, etc.), as required. It may contain various additives such as dyes), surfactants, antistatic agents, preservatives, antiaging agents, ultraviolet absorbers, antioxidants, light stabilizers and the like.

The black matrix sheet according to the embodiment of the present invention can be used when a chip component such as a self-luminous body is mounted on a substrate by thermocompression bonding using, for example, a conductive adhesive.
The substrate on which the black matrix layer can be formed is not particularly limited, and is, for example, a silicon substrate for semiconductor wafers, a sapphire substrate for LEDs, a SiC substrate and a metal base substrate, and a TFT (Thin Film Transistor) substrate for displays. And a color filter substrate, and a base substrate for an organic EL panel.

[Self-luminous display]
The self-luminous display body according to the embodiment of the present invention is a self-luminous display body including a black matrix layer and a self-luminous display body, and the black matrix layer contains a polymer component and a colorant and is a black matrix layer. The storage elastic modulus at 150 ° C. is 1 × 10 ³ to 1 × 10 ⁶ Pa. The polymer component preferably has a polar unit and a non-polar unit.

The self-luminous display body according to another embodiment of the present invention is a self-luminous display body including a black matrix layer and a self-luminous body.
The black matrix layer is not present on the surface of the self-luminous body, and the black matrix layer is provided only around the self-luminous body.

The black matrix layer included in the self-luminous display according to the embodiment of the present invention is preferably a transferred black matrix layer transferred using the above black matrix sheet.
Since the self-luminous display body according to the embodiment of the present invention contains a black matrix layer having excellent light-shielding properties, it has excellent optical characteristics. Further, the transferred black matrix layer has an advantage of improving productivity by being formed by the above-mentioned black matrix layer.

The self-luminous display body according to the embodiment of the present invention preferably includes a transfer black matrix layer formed by the above-mentioned black matrix layer.
The transfer black matrix layer can be formed, for example, on a substrate in a self-luminous display.

Chip components such as self-luminous bodies can be mounted on the substrate by thermocompression bonding using, for example, a conductive adhesive. Examples of the conductive adhesive include a conductive adhesive paste, a conductive adhesive film, an anisotropic conductive material and the like.
The anisotropic conductive material is a material in which conductive particles are mixed with a binder resin such as epoxy, and is, for example, an anisotropic conductive paste (ACP), an anisotropic conductive film (ACF), an anisotropic conductive ink, or a different material. An anisotropic conductive sheet and the like can be mentioned.

Examples of the self-luminous body include an LED chip, a micro LED chip, and the like.
Examples of the substrate include transparent substrates such as glass and transparent films.

For example, as shown in FIG. 4, the self-luminous display body according to the embodiment of the present invention includes a substrate 21, a TFT (Thin Film Transistor) 22, and an anisotropic conductive layer 23 formed of an anisotropic conductive material. , The micro LED chip 31, and the black matrix layer 12, and may include a portion having the black matrix layer 12 on the anisotropic conductive layer 23.
The polymer component in the black matrix layer preferably has a polar unit and a non-polar unit, and the transferred black matrix layer 12 and the anisotropic conductive layer 23 show excellent adhesion.

In FIG. 4, the TFT 22 is provided on the substrate 21, and the TFT 22, the pad 30, and the micro LED chip 31 are physically and electrically connected via the anisotropic conductive layer 23 provided in the peripheral portion, and are connected on the TFT 22. The micro LED chip 31 is mounted on the pad 30 of the above.

From the viewpoint of optical characteristics in the self-luminous display, it is preferable that there is no residue of the black matrix layer 12 on the micro LED chip 31. Since the black matrix layer has a storage elastic modulus at 150 ° C. of 1 × 10 ³ to 1 × 10 ⁶ Pa, it melts during thermocompression bonding and flows onto the anisotropic conductive layer 23 to solidify. Therefore, the residue of the black matrix layer 12 is unlikely to be generated on the micro LED chip 31.

In the self-luminous display body according to the embodiment of the present invention, the self-luminous body may be a micro LED chip or a micro LED display.

As the black matrix layer and the transfer black matrix layer, the above description can be used as they are.

<Manufacturing method of self-luminous display>
The black matrix sheet is used as a method for manufacturing a self-luminous display body according to an embodiment of the present invention.
A method for producing a self-luminous display according to another embodiment of the present invention is a self-luminous display using a release sheet and a black matrix sheet including a black matrix layer containing a polymer component and a colorant. The production method of is included in the following steps (I) and (II).
(I) A step of transferring the black matrix layer by thermocompression bonding using a black matrix sheet to manufacture a self-luminous display body (II) A step of peeling off the release sheet.

(I) The process of transferring the black matrix layer by thermocompression bonding using the black matrix sheet to manufacture a self-luminous display body will be described.

FIG. 2 is a diagram illustrating a method for manufacturing a self-luminous display body according to an embodiment of the present invention.
FIG. 2A shows a state in which the substrate 21, the TFT 22, the micro LED chip 31 arranged on the laminate including the anisotropic conductive layer 23, the pad 30, and the black matrix sheet 10 are arranged. show.
FIG. 2B shows a state in which the micro LED chip 31 is thermocompression bonded to a pad 30 arranged on a laminate including a substrate 21, a TFT 22, an anisotropic conductive layer 23, and a pad 30. Is shown.
FIG. 2C shows a state in which the micro LED chip 31 is mounted on the laminate by thermocompression bonding and the black matrix layer 12 (transfer black matrix layer) is formed on the anisotropic conductive layer 23.
FIG. 2D shows a state in which the release sheet 11 is peeled off and a self-luminous display body is manufactured.

(I) In the step of transferring the black matrix layer by thermocompression bonding using a black matrix sheet to manufacture a self-luminous display body, the heating and the pressure bonding in the thermocompression bonding may or may not be simultaneous. .. Further, heating and crimping may be performed a plurality of times each. The crimping may be reduced pressure or pressurized. For example, it may be crimped after heating, may be heated after crimping, may be crimped after heating, and may be further heated.
Examples of the crimping by reducing the pressure include crimping by creating a vacuum in the space between the laminate and the micro LED chip 31 and the black matrix sheet 10.
Examples of the crimping by pressurization include crimping by pressurizing the black matrix sheet 10 with compressed air, a heat pressurizing head, a press machine, or the like.

When a heat-pressurizing head is used for heat-pressing, for example, a black matrix layer is subjected to heat-pressing in a state where a black matrix sheet is placed between the heat-pressing head and a self-luminous body and a laminated body which are objects of heat-pressing. Can be melted and transferred to the surface of the laminate to produce a self-luminous display body provided with a transfer black matrix layer.

FIG. 3 is a diagram illustrating a method for manufacturing a self-luminous display body according to an embodiment of the present invention.
In FIG. 3A, black is shown between the substrate 21, the TFT 22, the micro LED chip 31 arranged on the laminate including the anisotropic conductive layer 23, and the pad 30, and the heat pressurizing head 40. The state in which the matrix sheet 10 is arranged is shown.
FIG. 3B shows the micro LED chip on a pad 30 arranged on a laminate including a substrate 21, a TFT 22, an anisotropic conductive layer 23, and a pad 30 using a heat-pressurized head 40. The state where the thermocompression bonding of 31 is performed is shown.
FIG. 3C shows a state in which the micro LED chip 31 is mounted on the laminate by thermocompression bonding and the black matrix layer 12 (transfer black matrix layer) is formed on the anisotropic conductive layer 23.
FIG. 3D shows a state in which the release sheet 11 is peeled off and a self-luminous display body is manufactured.

(I) In the step of transferring the black matrix layer by thermal pressure bonding using the black matrix sheet to manufacture a self-luminous display body, for example, as shown in FIG. 3, the heat pressurizing head 40 and the micro LED chip 31 are used. The micro LED chip 31 is placed on a pad 30 arranged on a laminate including a substrate 21, a TFT 22, and an anisotropic conductive layer 23 using the heat pressurizing head with a black matrix sheet arranged between the two. May be thermally pressure-bonded to form a black matrix layer 12 (transfer black matrix layer) on the anisotropic conductive layer 23.

As described above, the black matrix sheet according to the embodiment of the present invention has excellent mold releasability because it includes a mold releasable sheet. It can be used as a heat-resistant release sheet that is placed between the object to be crimped and prevents the two from sticking. Then, at the time of thermocompression bonding, the black matrix layer is melted and transferred to the surface of the thermocompression bonding object to form a transfer black matrix layer.

The black matrix sheet according to the embodiment of the present invention may be supplied and arranged by transport between the heat pressurizing head 40 and the micro LED chip which is a thermocompression bonding object. The black matrix sheet supplied and arranged by transport is, for example, strip-shaped.

The thermocompression bonding is preferably performed at a temperature of, for example, 100 ° C to 200 ° C.
That is, the heating set temperature of the thermocompression bonding head 40 at the time of thermocompression bonding, in other words, the operating temperature of the black matrix sheet 10 is preferably 100 ° C to 200 ° C. However, the operating temperature of the black matrix sheet 10 is not limited to these ranges. It is also possible to use the black matrix sheet 10 at a lower operating temperature than the above example.

(II) In the step of peeling the release sheet, for example, as shown in FIG. 3D, the black matrix layer 12 is formed on the anisotropic conductive layer 23 by peeling the release sheet 11. A self-luminous display body provided can be obtained. The release of the release sheet 11 is not particularly limited, such as peeling by hand or using a dedicated peeling facility.

By removing the release sheet in this way, the black matrix layer 12 (transferred black matrix layer) is formed on the surface of the anisotropic conductive layer 23 on the laminated body by the black matrix layer provided in the black matrix sheet. , A self-luminous display can be obtained.
As described above, from the viewpoint of optical characteristics, it is preferable that there is no residue of the black matrix layer 12 on the micro LED chip 31. Since the black matrix layer is thermoplastic, it is melted by thermocompression bonding using the thermocompression bonding head 40, flows onto the anisotropic conductive layer 23, and solidifies. Therefore, the residue of the black matrix layer 12 is unlikely to be generated on the micro LED chip 31.

Since the black matrix layer 12 (transfer black matrix layer) is formed by the black matrix layer using a sheet-shaped black matrix sheet instead of being coated on the anisotropic conductive layer 23, it is possible to prevent coating unevenness. .. Therefore, productivity can be improved. In addition, no organic solvent or monomer is required, and the workability is excellent, and the environmental load and work load can be reduced.

Hereinafter, the present invention will be specifically described with reference to Examples, but the present invention is not limited to these Examples.

<Total light transmittance>
The black matrix sheet produced in Examples and Comparative Examples was cut into a size of width: 50 mm and length: 50 mm, and using a DOT-3 UV-VIS type manufactured by Murakami Color Science Institute, all light rays based on JIS K 7361. The transmittance was measured.

<Store modulus of black matrix layer>
Using the black matrix sheets prepared in Examples and Comparative Examples, the storage elastic modulus was measured by the following operation.
The black matrix layer from which the release sheet was peeled off was laminated, and the laminated product laminated to about 500 μm was used as a measurement sample. The laminated product was cut to a diameter of 25 mm to prepare a test piece. Using a jig having a diameter of 25 mm, temperature dispersion at 25 to 200 ° C. was carried out with a viscoelastic device ARES-G2 manufactured by TA Instruments. At that time, the temperature rising rate was 5 ° C./min and the frequency was 1 Hz. At this time, the elastic modulus at 150 ° C. was defined as the storage elastic modulus (Pa) of the black matrix layer.

<Retractable elastic modulus of mold release sheet>
Cut the release sheet into strips with a length of 10 mm (measurement length) x width of 5 mm with a cutter knife, and store them at 25 ° C to 500 ° C using a solid viscoelasticity measuring device (RSAIII, manufactured by TA Instruments Co., Ltd.). The elastic modulus was measured. The measurement conditions were a frequency of 1 Hz and a heating rate of 5 ° C./min. At this time, the elastic modulus at 150 ° C. was defined as the storage elastic modulus (Pa) of the release sheet.

<Preparation of sample for evaluation>
An epoxy resin sheet was laminated on a non-alkali glass substrate, and a metal piece (chip) having a height of about 5 μm was placed on the epoxy resin sheet to prepare a laminated body containing a convex portion.
A black matrix sheet was placed on the laminate so that the black matrix layer was on the laminate side, and thermocompression bonding was performed at 180 ° C. for 5 minutes at 0.5 MPa with a heat sealer. After allowing to cool for 5 minutes, the release sheet was peeled off to prepare a sample for evaluation.

<Residue on chip>
The evaluation sample prepared above was observed with a digital microscope (VHX-100F manufactured by KEYENCE CORPORATION). The results of observing the residue on the chip surface with a digital microscope were evaluated according to the following evaluation criteria.
〇: No black matrix layer residue on the chip surface Δ: Residue is more than 0% and 50% or less of the total chip surface area ×: Residue is more than 50% of the total chip surface area

<Step followability>
The evaluation sample prepared above was observed with a digital microscope (VHX-100F manufactured by KEYENCE CORPORATION). The results of observing with a digital microscope the presence or absence of bubbles generated in the black matrix layer around the chip due to the step between the chip and the substrate (epoxy resin sheet) were evaluated according to the following evaluation criteria.
〇: No bubbles around the chip (not observable)
Δ: Bubble generation width around the chip is more than 0 μm and less than 0.5 μm ×: Bubble generation width around the chip is 0.5 μm or more

<Adhesion>
The part where the chip of the evaluation sample produced above is not mounted is cut out to a width of about 20 mm and a length of about 20 mm, and cross-cut evaluation is performed by the cross-cut method described in JIS K5600-5-6 to obtain adhesion. evaluated.
・ Cut interval: 2 mm
・ Number of cross-cuts: 100 squares ・ Peeling tape: (Nichiban) Cellophane tape (registered trademark) 24 mm width 〇: Number of peeled squares is 0 to 10 △: Number of peeled squares is 11 to 50 ×: Number of peeled squares 51-100 pieces

<Film thickness>
The film thickness of the black matrix layer in the black matrix sheet was measured with a dial gauge (GC-9 manufactured by Peacock). The thickness of the black matrix sheet was measured, the thickness (μm) of the release sheet from which the black matrix layer was removed at that location was measured, and the difference was taken as the thickness (μm) of the black matrix layer. The average thickness (μm) is an average value measured at 10 points.

[Example 1]
(Black matrix sheet (1))
100 parts by mass of Fine Resin 105 (FR105 methoxymethylated polyamide resin (PA6)) manufactured by Namariichi Co., Ltd. in a mixed solvent of industrial ethanol (Solmix AP-1) at 60 ° C./water = 80% by mass / 20% by mass. As a colorant, it dissolves and is manufactured by Mikuni Color Co., Ltd. Carbon black (CB average particle size 105 nm) No. 50 parts by mass of 3648 was added and stirred at room temperature to prepare a solution (1) having a solid content concentration of 15% by mass.

The prepared solution (1) is filtered through a nylon mesh with an opening of 188 μm, and then placed on a release sheet (Nitto Denko Corporation, Nitto Flon No. 900UL (thickness 0.05 mm, dimensions: width 250 mm × length 450 mm)). After coating with an applicator and air-drying, the mixture was further dried at 80 ° C. for 3 minutes in a constant temperature dryer to prepare a black matrix sheet (1) having a thickness of 2.1 μm and a black matrix layer and a release sheet.

[Examples 2 to 13, 101 to 103, Comparative Examples 1 and 2]
A black matrix sheet was produced in the same manner as in Example 1 except that the black matrix layer and the release sheet were changed as shown in Tables 1 to 3.

The evaluation results of the prepared black matrix sheet are shown in Tables 1 to 3 below. The amount of CB added in the table is the amount with respect to 100 parts by mass of the polymer.

The materials listed in Tables 1 to 3 are as follows.
[Black matrix layer]
(Main agent)
FR105: Methoxymethylated polyamide resin (Fine Resin 105 manufactured by Lead City Co., Ltd.)
CM8000: Polyamide copolymer resin (Amilan manufactured by Toray Industries, Inc.)
Uniamide: Polyamide resin (manufactured by Unitika Ltd.)
V01: Polyamide resin (bagging film manufactured by Motoki Corporation)

(Colorant)
No. 3648: Carbon black dispersion (manufactured by Mikuni Color Co., Ltd.)
No. 3685: Carbon black dispersion (manufactured by Mikuni Color Co., Ltd.)
# 217: Carbon black dispersion (MHI Black # 217 manufactured by Mikuni Color Co., Ltd.)

[Release sheet]
900UL: Fluororesin sheet film (Polytetrafluoroethylene (PTFE) Niftron 900UL manufactured by Nitto Denko Corporation)
FMN50WD: PET film (manufactured by Fujiko Co., Ltd.)
TPX X-88BMT4: Special polyolefin film (manufactured by Mitsui Chemicals Tocello Co., Ltd.)
E930H50: Easy-to-mold PET film (manufactured by Mitsubishi Chemical Corporation)

Although the present invention has been described in detail and with reference to specific embodiments, it will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention.
This application is based on a Japanese patent application filed on December 28, 2020 (Japanese Patent Application No. 2020-219257), the contents of which are incorporated herein by reference.

10 Black Matrix Sheet 11 Release Sheet 12 Black Matrix Layer 21 Substrate 22 TFT
23 Anisotropic conductive layer 30 Pad 31 Micro LED chip 40 Thermal pressurization head

Claims

A mold release sheet and a black matrix layer containing a polymer component and a colorant are provided.
A black matrix sheet having a storage elastic modulus of the black matrix layer at 150 ° C. of 1 × 10 3 to 1 × 10 6 Pa.
The black matrix sheet according to claim 1, wherein the release elastic modulus of the release sheet at 150 ° C. is 7 × 10 6 to 2 × 10 8 Pa.
The black matrix sheet according to claim 1 or 2, wherein the polymer component has a polar unit and a non-polar unit.
The black matrix sheet according to any one of claims 1 to 3, wherein the polymer component contains a polyamide resin.
The black matrix sheet according to any one of claims 1 to 4, wherein the colorant contains at least one selected from a dye or a pigment.
The black matrix sheet according to any one of claims 1 to 5, wherein the colorant contains carbon black.
The black matrix sheet according to any one of claims 1 to 6, wherein the content of the colorant is 10 to 200 parts by mass with respect to 100 parts by mass of the polymer component.
The black matrix sheet according to any one of claims 1 to 7, wherein the thickness of the black matrix layer is 0.1 to 10 μm.
The black matrix sheet according to any one of claims 1 to 8, wherein the release sheet has a thickness of 10 to 200 μm.
The black matrix sheet according to any one of claims 1 to 9, wherein the total light transmittance is 0.01 or more and less than 5%.
A self-luminous display body including a black matrix layer and a self-luminous body.
The black matrix layer contains a polymer component and a colorant.
The storage elastic modulus of the black matrix layer at 150 ° C. is 1 × 10 3 to 1 × 10 6 Pa.
The polymer component has a polar unit and a non-polar unit.
Self-luminous display.
A self-luminous display body including a black matrix layer and a self-luminous body.
A self-luminous display body in which the black matrix layer is not present on the surface of the self-luminous body and the black matrix layer is provided only around the self-luminous body.
The self-luminous display according to claim 11 or 12, wherein the self-luminous body is a micro LED chip.
A method for manufacturing a self-luminous display using the black matrix sheet according to any one of claims 1 to 10.
A method for manufacturing a self-luminous display using a black matrix sheet including a release sheet and a black matrix layer containing a polymer component and a colorant.
A method for manufacturing a self-luminous display body, which comprises the following steps (I) and (II).
(I) A step of transferring the black matrix layer by thermocompression bonding using the black matrix sheet to manufacture a self-luminous display body (II) A step of peeling off the release sheet.